Class / Patent application number | Description | Number of patent applications / Date published |
324750000 | System sensing fields adjacent device under test (DUT) | 31 |
20080204055 | CROSSTALK SUPPRESSION IN WIRELESS TESTING OF SEMICONDUCTOR DEVICES - An integrated circuit integrated on a semiconductor material die and adapted to be at least partly tested wirelessly, wherein circuitry for setting a selected radio communication frequencies to be used for the wireless test of the integrated circuit are integrated on the semiconductor material die. | 08-28-2008 |
20080204056 | DEVICE AND METHOD FOR PERFORMING A TEST OF SEMICONDUCTOR DEVICES WITH AN OPTICAL INTERFACE - A device and method for performing a test of semiconductor devices with an optical interface. In one embodiment, the device performs a test at a semiconductor device with an integrated self test function and with an optical interface. An optical transmitter and an optical receiver provide a system configured for returning an optical emission of the semiconductor device from the optical transmitter to the optical receiver of the semiconductor device. | 08-28-2008 |
20080252309 | Method and apparatus for generating an EMI fingerprint for a computer system - A system that generates an electromagnetic interference (EMI) fingerprint for a computer system is presented. During operation, the system executes a load script on the computer system, wherein the load script includes a specified sequence of operations. Next, the system receives EMI signals generated by the computer system while executing the load script. The system then generates the EMI fingerprint from the received EMI signals. | 10-16-2008 |
20080258744 | Electronic Circuit Testing Apparatus - The present invention has an object to provide an electronic circuit testing apparatus that is preferable for testing an electronic circuit which carries out communications between substrates based on inductive coupling and is capable of testing the electronic circuit without using test pads, wherein a probe | 10-23-2008 |
20090015274 | METHOD FOR AUTOMATED STRESS TESTING OF FLIP-CHIP PACKAGES - Methods for testing flip-chip packages includes aligning a microscope and a test engine. The package under test is placed between the microscope and the test engine, and an acoustic transducer is attached to the package under test. The test engine delivers an impact to the package under test on the side of the package opposite its ball-grid array. Acoustic information and image information from the package under test is recorded. In alternate embodiments, a sequence of packages may be automatically tested. | 01-15-2009 |
20090072843 | METHOD AND APPARATUS FOR INTERROGATING AN ELECTRONIC COMPONENT - A method and apparatus for interrogating an electronic component ( | 03-19-2009 |
20090079447 | TESTING SYSTEM FOR A RADIO FREQUENCY MODULE - A testing system for a RF module includes a metal casing formed a testing space therein, a RF testing socket disposed inside the testing module, and a pressing manipulator penetrating through the metal casing. A shielding material layer is disposed on the internal surface of the metal casing so that the RF signal is isolated inside the metal casing. An end of the pressing manipulator extends into the testing space. The pressing manipulator is controlled automatically and provides for a pressure on a RF module disposed on the testing module so as to execute a testing process. As mentioned above, the testing set for a RF module can prevent from RF testing interference and the testing manufacture efficiency is improved. | 03-26-2009 |
20090085589 | WAFER LEVEL TESTING METHOD FOR RFID TAGS - A wafer level testing method for RFID tags is disclosed. The method comprises: providing a semiconductor wafer having a plurality of RFID tag chips, wherein each of the RFID tag chips includes at least one detachable inductance and an embedded capacitance to form a resonant circuit; exposing the RFID tag chips to microwave energy, wherein the RFID tag chips send a plurality of wireless signals after a wireless power conversion; receiving the wireless signals and calculating a power level thereof; and comparing the power level to a predetermined power level to obtain the wafer yield. | 04-02-2009 |
20090102494 | CONTACTLESS INTERFACING OF TEST SIGNALS WITH A DEVICE UNDER TEST - An interface device receives test data from a tester. A signal representing the test data is transmitted to a device under test through electromagnetically coupled structures on the interface device and the device under test. The device under test processes the test data and generates response data. A signal representing the response data is transmitted to the interface device through electromagnetically coupled structures on the device under test and the interface device. | 04-23-2009 |
20090140755 | Circuit board testing system - System including backplane, and first and second circuit boards. First circuit board is attached to backplane and has first optical signal transmitter. Second circuit board is attached to backplane and has first optical signal receiver. First optical signal transmitter and first optical signal receiver are mutually configured and mutually aligned for circuit board test signal communication from first circuit board to second circuit board across free space. Method includes providing backplane and first and second circuit boards, where first circuit board has first optical signal transmitter and second circuit board has first optical signal receiver. Method further includes attaching first and second circuit boards to backplane, and mutually configuring and mutually aligning first optical signal transmitter and first optical signal receiver for circuit board test signal communication from first circuit board to second circuit board across free space. | 06-04-2009 |
20090153158 | RF INTEGRATED CIRCUIT TEST METHODOLOGY AND SYSTEM - Over the air or radiated testing of an RF microelectronic or integrated circuit device under test (DUT) that has an integrated millimeter wave (mmw) antenna structure, is described. The antenna structure may have multiple elements in an array design that may be driven and/or sensed by integrated RF transmitter and/or receiver circuitry. An interface printed wiring board (e.g., a tester load board or a wafer probe card assembly) has formed in it a mmw radiation passage that is positioned to pass mmw radiation to and/or from the integrated antenna of the DUT. Test equipment may be conductively coupled to contact points of the interface board, to transmit and/or receive signals for testing of the DUT and/or provide dc power to the DUT. A test antenna is designed and positioned to receive and/or transmit mmw radiation through the passage, from and/or to the integrated DUT antenna. Other embodiments are also described and claimed. | 06-18-2009 |
20090167331 | Testing apparatus and method for detecting a contact deficiency of an electrically conductive connection - A testing apparatus and a method for detecting a contact deficiency of an electrically conductive connection. The testing apparatus comprises a measuring chamber, in which several system elements of the connection that are connected in an electrically conductive fashion are positioned, a heat radiator that is supplied with energy and the transferred thermal radiation of which is emitted into the measuring chamber and directed toward the region of the system elements that, after having been heated, generate a thermal field of the insulated and the metallic system components of these connected system elements, a thermal (image) acquisition unit for optically capturing the generated thermal field and for realizing a signal conversion into a thermal image of the connected system elements, and a thermal (image) reproduction unit for the visual reproduction of the converted thermal image. | 07-02-2009 |
20090212792 | Inspection Method and Inspection Apparatus - There is established an easier inspection method with which it is not required to set up probes on wires. Also, there is provided an inspection apparatus using this inspection method. With the inspection apparatus or inspection method, primary coils of an inspection substrate and secondary coils of a device substrate are superimposed on each other so that a certain space is maintained therebetween. An AC signal is inputted into the primary coils, thereby generating an electromotive force in each secondary coil by electromagnetic induction. Then, each circuit provided on the device substrate is driven using the electromotive force and information possessed by an electromagnetic wave or electric field generated in this circuit is monitored, thereby detecting each defective spot. | 08-27-2009 |
20090243638 | Receiver for recovering and retiming electromagnetically coupled data - In one embodiment, the present invention includes a system having an electromagnetic coupler probe to electromagnetically sample signals from a device under test or a link under test and a receiver, e.g., configured as an integrated circuit that is to receive the sampled electromagnetic signals from the probe and output digital signals corresponding thereto. Other embodiments are described and claimed. | 10-01-2009 |
20100097083 | TEST HANDLER INCLUDING GRIPPER-TYPE TEST CONTACTOR - A test handler is provided for testing electronic devices having light-emitting elements. Electronic devices are mounted at a loading position, optical measurements are conducted at a test contact position where a testing device is located for optical communication with the light-emitting elements and then tested electronic devices are removed at an unloading position. Multiple test contactors hold the electronic devices and move them to and through the loading position, test contact position and unloading position in sequence. Each test contactor comprises a device contact point including electrical conductors which are connected to electrical contacts of the electronic device when the electronic device is mounted at the device contact point, and a retaining mechanism grips the electronic device at the device contact point such that the retaining mechanism does not obstruct the optical communication between the testing device and the light-emitting element at the test contact position. | 04-22-2010 |
20100097084 | METHOD FOR SELF-MONITORING OF BREAKDOWN IN SEMICONDUCTOR COMPONENTS AND SEMICONDUCTOR COMPONENT CONSTRUCTED THEREOF - The invention relates to a method for monitoring the breakdown of a pn junction in a semiconductor component and to a semiconductor component adapted to carrying out said method. According to the method, optical radiation which is emitted if a breakdown occurs on a pn junction is detected by a photosensitive electronic component ( | 04-22-2010 |
20100271056 | CONTAINER, A METHOD FOR DISPOSING THE SAME, AND A MEASUREMENT METHOD - The present invention restrains adverse effects caused by refraction of a terahertz wave by a device under test when the terahertz wave is fed to the device under test for measurement. A container | 10-28-2010 |
324751000 | Using electron beam probe | 6 |
20080246497 | SEMICONDUCTOR WAFER INSPECTION APPARATUS - Efficiency of a charging processing of an insulator sample is improved. And, an electron optical system is adjusted according to a contact resistance value of the insulator sample. Breakdown of a sample is performed before the charging processing, and then, the charging processing is performed. A control parameter of the electron optical system is selected using a result of a resistance value of the sample for checking the breakdown. | 10-09-2008 |
20090058437 | Method and apparatus for reviewing defects by detecting images having voltage contrast - A method and apparatus for detecting defects includes irradiating and scanning an electron beam focused on an area of a sample, detecting charged particles generated from the sample by the irradiating and scanning of the electron beam with a first detector which detects charged particles having relatively low energy to obtain a first image of the area and with a second detector which detects charged particles having relatively high energy to obtain a second image of the area, comparing the first inspection image of the area with a first reference image to generate a first difference image, and comparing obtained second image of the area with a second reference image to generate a second difference image, and detecting an open defect or a short defect from at least one of the generated first difference image and the second difference image. | 03-05-2009 |
20090179656 | LIGHT-ASSISTED TESTING OF AN OPTOELECTRONIC MODULE - The present invention relates to a device for testing an optoelectronic module, comprising a first source for generating an electromagnetic beam or particle beam, a second source for illuminating the optoelectronic module; and a detector. In addition, a method for testing an optoelectronic module is provided comprising illuminating the optoelectronic module, directing an electromagnetic beam or particle beam and detecting defects in the optoelectronic module. The illumination additional to the electromagnetic beam or particle beam makes defects visible which otherwise would not be detected. | 07-16-2009 |
20090195262 | IN-LINE ELECTRON BEAM TEST SYSTEM - A method and apparatus for testing a plurality of electronic devices formed on a large area substrate is described. In one embodiment, the apparatus performs a test on the substrate in one linear axis in at least one chamber that is slightly wider than a dimension of the substrate to be tested. Clean room space and process time is minimized due to the smaller dimensions and volume of the system. | 08-06-2009 |
20090212793 | STRUCTURES FOR TESTING AND LOCATING DEFECTS IN INTEGRATED CIRCUITS - A method for detecting defects during semiconductor device processing can include providing a substrate having a semiconductor comprising layer with electrically isolated application and test circuits are formed thereon, directing an electron current inducing beam to the test circuit; measuring a current between the first and the second contact pads in the test circuit; determining an electron beam induced current (EBIC); and identifying one or more defect locations in the test circuit based on the EBIC and a location of the electron beam corresponding to the EBIC. A test circuit can include a plurality of semiconductor devices connected in parallel, a first contact pad coupled to a first terminal of the semiconductor devices, and at least a second contact pad coupled to a substrate terminal associated with the semiconductor devices. | 08-27-2009 |
20090212794 | TEST KEY FOR SEMICONDUCTOR STRUCTURE - A test key for a semiconductor structure is provided for in-line defecting defects of the contact. The test key is disposed on a scribe line of a wafer substrate, and includes conductive structures and contacts under test. The conductive structures are electrically connected with the substrate and the contacts under test are not electrically connected with the substrate. The conductive structures and the contacts under test are regularly arranged in array. When an electronic beam is utilized to perform in-line monitoring, the normal contacts under test will be shown as bright dots and the bright dots are regularly arranged in the array; any contact under test with defect will be shown as a dark dot which results in an irregular arrangement of the bright dots. | 08-27-2009 |
324752000 | Using light probe | 5 |
20080204057 | SYSTEM AND METHOD FOR ESTIMATION OF INTEGRATED CIRCUIT SIGNAL CHARACTERISTICS USING OPTICAL MEASUREMENTS - Systems and methods for making electrical measurements using optical emissions include positioning a sensor/photodetector to measure radiation emissions from devices to be tested. Radiation emission information is collected from the device to be tested during electrical operation. Characteristic features of the radiation emission information are determined, and differences between the characteristic features are deciphered. Based on the differences, models are employed to determine electrical properties of the device, especially operational characteristics. | 08-28-2008 |
20080284453 | IC TEST VECTOR GENERATOR FOR SYNCHRONIZED PHYSICAL PROBING - Systems, methods, and computer readable media storing instructions for such methods relate to generating test vectors that can be used for exercising a particular area of interest in an integrated circuit. The test vectors generally include a non-overlapping repeating and/or predictable sequence of care bits (a care bit pattern) that can be used by a tester to cause the exercise of the area and collect emissions caused by exercising the area. Such emissions can be used for analysis and debugging of the circuit and/or a portion of it. Aspects can include providing a synchronization signal that can be used by a tester to allow sensor activation at appropriate times. | 11-20-2008 |
20090002000 | FAILURE ANALYSIS METHOD AND FAILURE ANALYSIS APPARATUS - Failure analysis method includes performing fixed radiation of semiconductor chip (wafer) by photocurrent generation laser beam, scanning and radiating a region to be observed on semiconductor chip by heating laser beam, detecting, by a SQUID fluxmeter, current change generated in the semiconductor chip by radiating the photocurrent generation laser beam and the heating laser beam, and analyzing failure of the semiconductor chip based on current change detected by the SQUID fluxmeter. Radiation of photocurrent generation laser beam and heating laser beam are performed from a back surface side of the LSI chip, and detection by the SQUID fluxmeter is performed on a front surface side of the LSI chip. In analysis of failure of the LSI chip, image processing is performed in which a signal outputted from the SQUID fluxmeter is made to correspond to a scanning point. Visualization of defects is possible. | 01-01-2009 |
20090295414 | TRANSIENT EMISSION SCANNING MICROSCOPY - An apparatus for analyzing an integrated circuit to which one or more test signals are applied. An example apparatus includes an objective lens that views reflections from the integrated circuit, a device that houses at least two optical fibers, a component that receives reflections from the objective lens and directs the received reflections to the device, and a photo-diode that receives a reflection received by the device. The apparatus includes a beam splitter that directs reflections from the integrated circuit to a detector. A processing device generates an image signal based on a signal received from the detector and a display outputs an image based on the image signal. The component includes a scan mirror that reflects the collimated reflections to a collimating lens that focuses the reflections from the scan mirror toward the device. | 12-03-2009 |
20100156445 | Apparatus and Method for Electrical Characterization by Selecting and Adjusting the Light for a Target Depth of a Semiconductor - The present disclosure provides methods and apparatus that enable characterization of an electrical property of a semiconductor specimen, e.g., dopant concentration of a near-surface region of the specimen. In exemplary method, a target depth for measurement is selected. This thickness may, for example, correspond to a nominal production thickness of a thin active device region of the specimen. A light is adjusted to an intensity selected to characterize a target region of the specimen having a thickness no greater than the target depth and a surface of the specimen is illuminated with the light. An AC voltage signal induced in the specimen by the light is measured and this AC voltage may be used to quantify an aspect of the electrical property, e.g., to determine dopant concentration, of the target region. | 06-24-2010 |
324753000 | Using electro-optic device | 3 |
20080218185 | PROBE NAVIGATION METHOD AND DEVICE AND DEFECT INSPECTION DEVICE - A probe navigation method, a navigation device, and a defect inspection device wherein in a charged particle beam system provided with probes for electrical characteristics evaluation, probing can be easily carried out regardless of the equipment user's level of skill are provided. To attain this object, probes and a test piece stage on which a test piece is placed are driven by independent driving means. Further, a large stage driving means which integrally drives the probes and the test piece stage is provided. In addition, CAD navigation is adopted. This enhances the equipment users' convenience during probing. | 09-11-2008 |
20100141284 | METHOD AND DEVICE FOR CHARACTERISING AN ELECTRIC SIGNAL PROPAGATING THROUGH A SAMPLE - A method for characterising an electric signal ( | 06-10-2010 |
20100194414 | ELECTRO OPTICAL DETECTOR - An electro-optical detecting device is disclosed. The electro-optical detecting device includes: an upper substrate and a lower substrate; a nematic liquid crystal layer interposed between the upper substrate and the lower substrate; a transparent electrode interposed between the nematic liquid crystal layer and the upper substrate, the transparent electrode connected to a device under test (DUT) via a power supply; a polarizing plate located over the nematic liquid crystal layer; and a reflecting plate located under the nematic liquid crystal layer. A method using the electro-optical detecting device includes applying a voltage between the transparent electrode and the BUT to generate an electric field across the liquid crystal layer; illuminating the detector and capturing an image of the detector using the light reflected from the detector: and determining the DUT has some defects from the image of the detector by an abnormal electric field generated between the transparent electrode and the DUT. | 08-05-2010 |