Class / Patent application number | Description | Number of patent applications / Date published |
324501000 | Using radiant energy | 62 |
20080238435 | INTEGRATED CIRCUIT TESTING WITH LASER STIMULATION AND EMISSION ANALYSIS - A diagnostic tool for testing an integrated circuit device directs a beam of laser energy to stimulate at least a portion of the device. In one mode, electromagnetic waves from said device may be detected at the same time in response to the stimulation. A processor collects image data and determines as a function of the collected image data whether the device has a defect. Other embodiments are described and claimed. | 10-02-2008 |
20090072837 | METHOD OF TESTING DURABILITY OF CIS BASED THIN-FILM SOLAR CELL MODULE - The property of CIS based thin-film solar cell modules that the modules recover their conversion efficiency, etc. upon irradiation with a weak light is correctly evaluated. A CIS based thin-film solar cell module is subjected to a conventional damp heat test with a constant-light solar simulator (solar simulator) | 03-19-2009 |
20090096461 | TEST STRUCTURE AND METHOD FOR RESISTIVE OPEN DETECTION USING VOLTAGE CONTRAST INSPECTION - A test structure for resistive open detection using voltage contrast (VC) inspection and method for using such structure are disclosed. The test structure may include a comparator within the IC chip for comparing a resistance value of a resistive element under test to a reference resistance and outputting a result of the comparing that indicates whether the resistive open exists in the resistive element under test, wherein the result is detectable by the voltage contrast inspection. | 04-16-2009 |
20090096462 | Wafer testing method - A wafer testing method for wafer testing system comprises the steps: loading a wafer and then positioning the wafer relatively to a map file image stored in a map file. The map file is of a first file type. The next step is inspecting the appearance of the wafer. When the user detects defects on the wafer, the positions of the defects are directly recorded in the map file and then the modified map file is saved. The map file can be directly modified when the wafer is in the testing procedure so that the testing time is reduced. Furthermore, the precision of the testing is improved. | 04-16-2009 |
20090102487 | Method for Validating Printed Circuit Board Materials for High Speed Applications - A method for testing a printed circuit board to determining the dielectric loss associated with the circuit board material relative to a standard. Dielectric losses in the material generate heat when a high frequency electronic signal, such as a microwave frequency signal, is communicated through a microstrip that is embedded within the printed circuit board. The temperature or spectrum at the surface of printed circuit board is measured and compared against the temperature or spectrum of the standard to determine whether the material under test is acceptable. While various temperature measurement devices may be used, the temperature is preferably measured without contacting the surface, such as using an infrared radiation probe. | 04-23-2009 |
20090212783 | BGA Package Holder Device and Method for Testing of BGA Packages - An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each of the contact pads being spatially disposed around a peripheral region of the substrate. The apparatus further includes a plurality of contact regions spatially configured on a portion of the substrate member. Each of the plurality of contact regions is numbered from 1 through N being electrically connected to respective contact pads numbered from 1 through N. The plurality of contact regions is configured to provide electrical contact to respective plurality of balls provided on a BGA package. The apparatus additionally includes a holder device coupled to the substrate member. The holder device is adapted to mechanically hold the BGA package in place to provide mechanical contact between the plurality of balls and respective plurality of contact regions. | 08-27-2009 |
20090261840 | TIME RESOLVED RADIATION ASSISTED DEVICE ALTERATION - A method of time resolved radiation assisted device alteration testing of a semiconductor circuit which includes performing spatially resolved radiation assisted circuit testing on the semiconductor circuit while applying a test pattern to determine a pass-fail modulation location, asynchronously scanning the semiconductor circuit with radiation while repeatedly applying the test pattern and providing pass-fail results, combining corresponding pass-fail results provided during the asynchronously scanning to determine a shifted pass-fail modulation indication, determining time shift information between the pass-fail modulation location and the shifted pass-fail modulation indication, and identifying at least one of the test vectors based on the time shift information. The radiation may be a continuous wave laser beam. The time shift information may be determined by scanning an image, incorporating graphics into the image indicating the pass-fail modulation location and the shifted pass-fail modulation indication, and measuring a pixel shift on the scanned image. | 10-22-2009 |
20090278546 | SOLAR CELL TESTING APPARATUS - A solar cell testing apparatus including a stage, a movable chuck, a light source and a plurality of probes is provided. The movable chuck is disposed on the stage and capable of carrying a sample sheet to move. The sample sheet has a light incident side, a rear side opposite to the light incident side, and a plurality of electrodes disposed on the rear side. The light source is disposed above the stage and capable of providing testing light to the light incident side of the sample sheet. The probes are located on the rear side of the sample sheet and capable of contacting the electrodes of the sample sheet. The present invention not only can be used to test a substrate type solar cell, but also can be used to test a superstrate type solar cell. | 11-12-2009 |
20090309606 | SYSTEM AND METHOD FOR TESTING LIGHT-EMITTING DEVICES - A method for testing light-emitting devices in a batch-wise, associated with a system for the same purpose, comprises the steps of: preparing the light-emitting devices on a moving carrier unit in a manner of aligning a predetermined longitudinal direction of the light-emitting devices with a predetermined transportation direction of the moving carrier unit, each of the light-emitting devices further having plural light-emitting elements; transporting orderly the light-emitting devices to pass a test area on a base of the system, in which the base energizes only the light-emitting elements within the test area; and, a solar cell module detecting continuously the energized light-emitting elements within the test area and further forming signals with respect to photo energy received in the test area. | 12-17-2009 |
20090322343 | 3-D Mapping Focused Beam Failure Analysis - A reflector tool and a method are provided for three-dimensional integrated circuit (IC) failure analysis. An IC (die) has top and bottom surfaces, a perimeter, and a first side. The IC is electrically connected to a current sensing amplifier. The first side of the IC is scanned in the X plane with an infrared laser beam while changes in IC current flow are sensed. The sensed current changes are cross-referenced to the location of the infrared laser beam in the X plane. In one aspect, a plurality of scans are performed on the first side in the X plane, with at a corresponding plurality of steps in the Y plane, so that current changes can be cross-referenced to locations in the X and Y planes. Using this 2-D analysis through the IC side, a human operator or software program can determine defects in the IC. | 12-31-2009 |
20100001738 | System and Method for Conducting Accelerated Soft Error Rate Testing - An apparatus for a user to conduct an accelerated soft error test (ASER) on a semiconductor sample is provided. The apparatus comprises a first component for holding the radiation source, where the radiation source may be either an alpha-particle or neutron-particle source. The apparatus comprises a second component for holding the semiconductor sample, where the semiconductor sample may be either a silicon wafer or semiconductor chip. The apparatus comprises a connecting assembly for placing the first component and the second component relative to each other at a plurality of positions that subject the semiconductor sample to a radiation stress from the radiation source at a plurality of stress efficiencies. Among the benefits provided are improved repeatability and credibility of ASER tests and reduced radiation exposures to operators of ASER tests. | 01-07-2010 |
20100007352 | Fiber Optic Fault Detection System and Method for Underground Power Lines - Embodiments of the present invention are directed to a method and fault detection system for detecting and identifying the location of faults in underground power lines that can effectively and quickly identify faults in underground power lines. Embodiments can provide a method and fault detection system that quickly identify faults in a power grid that result from open circuits or short circuits in underground conduits. A specific system for fault detection of power lines in a network having one or more substations and corresponding one or more manholes for access to underground lines, includes: a sensor device for each manhole, wherein the sensor device is capable of detecting a magnetic field generated by a power line and can send a signal through a fiber optic cable, the signal including a unique wavelength identifier; and a communication device for each substation for transmitting the signal from the sensor device to an operator. | 01-14-2010 |
20100066382 | TEST DEVICE AND TEST METHOD FOR A PV CONCENTRATOR MODULE - The invention relates to a test device for a PV concentrator module, comprising a first light source for generating a light that simulates solar irradiation, a lens system which concentrates the light beams emitted by the first light source to a pencil of rays whose individual light beams diverge by less than 2° while being suited to direct said pencil of rays to an incident light surface of the PV concentrator module, and an instrument for measuring an output signal of the PV concentrator module irradiated by the pencil of rays. | 03-18-2010 |
20100079147 | INLINE INSPECTION OF PHOTOVOLTAICS FOR ELECTRICAL DEFECTS - A method of inline inspection of photovoltaic material for electrical anomalies. A first electrical connection is formed to a first surface of the photovoltaic material, and a second electrical connection is formed to an opposing second surface of the photovoltaic material. A localized current is induced in the photovoltaic material and properties of the localized current in the photovoltaic material are sensed using the first and second electrical connections. The properties of the sensed localized current are analyzed to detect the electrical anomalies in the photovoltaic material. | 04-01-2010 |
20100109673 | HEAT-RESISTANT LENS KIT - A heat-resistant lens kit configured within the pogo tower of the wafer tester is disclosed. The heat-resistant lens kit has two parallel lenses and a main body with a through hole. The main body and two parallel lenses enclose a vacuum room within the through hole. | 05-06-2010 |
20100141263 | SYSTEM AND METHOD FOR TESTING AN IMAGE SENSOR USING GRADATION IMAGE CAPTURE - A gradation image capture is used to test one or more image sensors. The integration periods for the rows of pixels in the array, or for groups of rows of pixels, are varied during each single still frame image capture. The S rows of pixels are reset either simultaneously or successively to a predetermined level, and then begin accumulating charges. The rows of pixels, or groups of rows of pixels, are read out at different times to vary the integration periods of the pixels. Some or all of the signals are analyzed or measured to detect any design or manufacturing problems. | 06-10-2010 |
20100148790 | METHOD AND DEVICE FOR CHARACTERISING SENSITIVITY TO ENERGY INTERACTIONS IN AN ELECTRONIC COMPONENT - To analyse an electric component in depth, provision is made to submit said component to focused laser radiation. It is shown that by modifying the altitude of the focus in the component, some internal parts of said component can be characterized more easily. | 06-17-2010 |
20100156430 | Measuring instrument for photovoltaic systems - The present invention relates to a measuring instrument for a photovoltaic system; the system is of the type comprising at least one photovoltaic module (FM | 06-24-2010 |
20100182011 | PHOTODIODE SELF-TEST - A photodetector array ( | 07-22-2010 |
20100188094 | METHOD AND APPARATUS FOR MEASURING A LIFETIME OF CHARGE CARRIERS - An apparatus for measuring a lifetime of charge carriers that has a measuring probe and a component for directing ultraviolet radiation to a measuring position. The measuring probe also includes at least one electrode provided at a predetermined spatial relationship to the measuring position. A microwave source is adapted to direct microwave radiation to the measuring position, a microwave detector is adapted to measure an alteration of an intensity of microwave radiation reflected at the measuring position in response to the ultraviolet radiation and a semiconductor structure holder is adapted to receive a semiconductor structure and to provide an electric contact to a portion of the semiconductor structure. Additionally, a device for moving the substrate holder relative to the measuring probe is provided for positioning at least one portion of the semiconductor structure at the measuring position. The apparatus includes a power source adapted to apply a bias voltage between the semiconductor structure holder and the electrode. | 07-29-2010 |
20100194399 | MEMORY SYSTEM, MEMORY TEST SYSTEM AND METHOD OF TESTING MEMORY SYSTEM AND MEMORY TEST SYSTEM - A memory test system is disclosed. The memory system includes a memory device, a tester generating a clock signal and a test signal for testing the memory device, and an optical splitting module. The optical splitting module comprises an electrical-optical signal converting unit which converts each of the clock signal and the test signal into an optical signal to output the clock signal and the test signal as an optical clock signal and an optical test signal. The optical splitting unit further comprises an optical signal splitting unit which splits each of the optical clock signal and the optical test signal into n signals (n being at least two), and an optical-electrical signal converting unit which receives the split optical clock signal and the split optical test signal to convert the split optical clock signal and the split optical test signal into electrical signals used in the memory device. | 08-05-2010 |
20100283474 | TEST CIRCUIT AND OPTICAL PICKUP DEVICE - A test circuit for testing not only characteristics of a current-voltage conversion circuit in which a light-receiving element is used but also characteristics of the light-receiving element includes: a current-mirror circuit | 11-11-2010 |
20100327875 | Integrated Circuit Thermally Induced Noise Analysis - A system and method are provided for testing an integrated circuit (IC) using thermally induced noise analysis. The method provides an IC die and supplies electrical power to the IC die. The IC die surface is scanned with a laser, and the laser beam irradiated locations on the IC die surface are tracked. The laser scanning heats active electrical elements underlying the scanned IC die surface. A frequency response of an IC die electrical interface is measured and correlated to irradiated locations. IC die defect regions are determined in response to identifying location-correlated frequency measurements exceeding a noise threshold. For example, a frequency measurement may be correlated to a die surface location, and if frequency measurement exceeds the noise threshold, then circuitry underlying that surface area may be identified as defective. Typically, die defect regions are associated with measurements in the frequency range between about 1 Hertz and 10 kilohertz. | 12-30-2010 |
20110025340 | SEMICONDUCTOR DEVICE ANALYZER AND SEMICONDUCTOR DEVICE ANALYSIS METHOD - A semiconductor device analyzer comprises a function of radiating a charged particle beam on a sample and displaying a detected secondary electron image according to detected secondary electron intensity. A charged particle beam is radiated according to a first radiation pattern onto a semiconductor device that is to be analyzed, and a charge is injected. Next, a charge accumulation state of the semiconductor device that is to be analyzed is observed. A location where the charge accumulation state is abnormal can be detected as a defect location in the semiconductor device. A defect location is identified easily. | 02-03-2011 |
20110128011 | APPARATUS AND METHOD FOR INSPECTING DEFECTS IN CIRCUIT PATTERN - Disclosed herein is an apparatus and method for inspecting defects in a circuit pattern. In the inspection apparatus and method, a laser beam is radiated by a laser unit onto a first end of a circuit pattern, and variation in impedance of a capacitor sensor disposed at a second end of the circuit pattern is measured, thus measuring the open/short circuits of the circuit pattern. | 06-02-2011 |
20110156716 | System and method for localizing and passivating defects in a photovoltaic element - The present invention relates to a system and method for localizing defects causing leakage currents in a photovoltaic element ( | 06-30-2011 |
20110175618 | INSPECTION APPARATUS FOR PHOTOVOLTAIC DEVICES AND TRANSPORTATION APPARATUS FOR INSPECTION APPARATUS - The present invention provides an inspection apparatus for a photovoltaic devices which electrifies the photovoltaic devices in a forward direction thereof to make the photovoltaic devices emit electro-luminescence light and which has a simple-structured and cheap darkroom. Also the present invention provides a transport apparatus, which transports the stacked constituent members of the photovoltaic devices in the pre-laminated state to the inspection apparatus without the positional deviation among the constituent members of the photovoltaic devices. | 07-21-2011 |
20110193561 | CHUCKS FOR SUPPORTING SOLAR CELL IN HOT SPOT TESTING - In an embodiment, a chuck to support a solar cell in hot spot testing is provided. This embodiment of the chuck comprises a base portion and a support portion disposed above the base portion. The support portion is configured to support the solar cell above the base portion and to define a space between a bottom surface of the solar cell and the base portion that thermally separates a portion of the bottom surface of the solar cell from the base portion. | 08-11-2011 |
20110260733 | FABRICATION PROCESS FOR PHOTOVOLTAIC CELL - A photovoltaic strip is physically separated from a semiconductor wafer utilizing physical sawing or other techniques. In accordance with one embodiment, a type of semiconductor wafer is first determined by interrogating the wafer to identify one or more of its optical, thermal, or electrical characteristics. This information regarding substrate type is then communicated to a separation apparatus, which then accomplishes precise physical separation of the substrate into discrete strips. Electrical performance of the strips may be tested prior to their incorporation into an assembled solar cell, where they are coupled to a concentrating element utilizing an elastomer encapsulant. | 10-27-2011 |
20110309842 | Identifying Defective Semiconductor Components on a Wafer Using Thermal Imaging - Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation. | 12-22-2011 |
20120025837 | METHOD TO DICE BACK-CONTACT SOLAR CELLS - A method of processing of solar cells includes determining that a back-contact solar cell is defective. The back-contact solar cell includes a first plurality of interconnect pads at a first edge thereof, and a second plurality of interconnect pads at a second, opposed thereof, the first and second pluralities of interconnect pads having opposite operational charges. The back-contact solar cell is then diced to define at least first and second back-contact solar cell sections. The first back-contact solar cell section has at least two interconnect pads, of the plurality of interconnect pads, at respective opposed edges thereof. | 02-02-2012 |
20120025838 | SUNLIGHT SIMULATOR - A sunlight simulator and solar cell measuring device consisting of detecting device is disclosed, in which the housing is a closed space consisting of an opening gate, the closed space is internally installed with a light source which is used to emit a light toward the opening gate, and a splitting unit is installed on the travelling path of the light for dividing the light into a first light-beam and a second light-beam, herein the first light-beam is projected onto the solar cell under measurement located at the opening gate as a solar cell measuring device; in addition, a detecting device is installed on the travelling path of the second light-beam for receiving the second light-beam, and then a signal can be outputted by the detecting device in order to monitor the irradiation variation of the light emitted by the light source, thus ensuring the precision of the solar cell measurement. | 02-02-2012 |
20120025839 | APPARATUS FOR MEASURING CONDUCTIVE PATTERN ON SUBSTRATE - An embodiment of the invention provides an apparatus for measuring a conductive pattern on a substrate, which includes: a first electro-optical modulator surrounding at least one first detecting roller; transmission rollers for transferring the substrate and allowing direct contact of the substrate and the first electro-optical modulator; a voltage supplier for providing a bias between the first electro-optical modulator and the substrate; and a first image detecting system for receiving a first detecting light reflected from a first surface of the substrate. | 02-02-2012 |
20120056626 | LASER ASSISTED DEVICE ALTERATION USING TWO-PHOTON ABSORPTION - A Two-Photon Laser Assisted Device Alteration technique is presented. Fault localization is investigated by exploiting the non-linear two-photon absorption mechanism to induce LADA effects. Femtosecond laser pulses of wavelength having photon energy lower than the silicon bandgap are directed at the area of interest, while the DUT is stimulated with test vectors. The laser pulses are synchronized to the DUT stimulation, so that switching timing can be altered using the two-photon absorption effect. | 03-08-2012 |
20120112756 | OPTOELECTRONIC MEMORY DEVICE AND METHOD FOR MANUFACTURING AND MEASURING THE SAME - The present invention provides an optoelectronic memory device, the method for manufacturing and evaluating the same. The optoelectronic memory device according to the present invention includes a substrate, an insulation layer, an active layer, source electrode and drain electrode. The substrate includes a gate, and the insulation layer is formed on the substrate. The active layer is formed on the insulation layer, and more particularly, the active layer is formed of a composite material comprising conjugated conductive polymers and quantum dots. Moreover, both of the source and the drain are formed on the insulation layer, and electrically connected to the active layer. | 05-10-2012 |
20120133372 | Solar Photovoltaic Panel Test Platform - A solar photovoltaic panel test platform includes a test section and a signal processing section. The test section has a frame, a light-emitting unit disposed on the frame, a first angle adjustment unit and a second angle adjustment unit arranged on the frame, an air-cooling unit mounted on the first angle adjustment unit for connecting with a first solar photovoltaic panel, and a water-cooling unit mounted on the second angle adjustment unit for connecting with a second solar photovoltaic panel. The signal processing section is connected to the first and second angle adjustment units, the light-emitting unit, the air-cooling unit, the water-cooling unit, and the first and second solar photovoltaic panels. The signal processing section serves to receive sensing signals and transmit control signals. The solar photovoltaic panel test platform can provide different illuminations, angles of incidence and heat dissipation modes to test the efficiency of the solar photovoltaic panels. | 05-31-2012 |
20120139550 | ARC FAULT DETECTION METHOD AND SYSTEM - An example arc fault detection system includes an electrical system, an electrical controller, a sensor, and a master controller. The electrical controller detects a voltage of the electrical system, a current of the electrical system, or both. The sensor detects an ultraviolet light level of the electrical system. The master controller is configured to communicate with the electrical controller and the sensor. The master controller isolates the electrical system in response to receiving a signal from the electrical controller and the sensor. An example method of isolating an arc fault in an electrical system includes detecting a voltage level, a current level, and an ultraviolet light level of the electrical system. The method isolates an arc fault based on the voltage level or the current level, and the ultraviolet light level from the detecting. | 06-07-2012 |
20120139551 | Electrical and opto-electrical characterization of large-area semiconductor devices - The present invention relates to an electrical and/or opto-electrical characterisation method for testing large-area semiconductor devices in production, the method comprising the steps of providing a first electrode and placing it into electrical contact with a contact area of a conducting layer of a semiconductor device; providing a movable electrode assembly, comprising a container holding an electrolyte solution and at least a second electrode; immersing the second electrode into the electrolyte solution; positioning the electrode assembly such that the electrolyte solution places the second electrode into electrical contact with a top surface of the semiconductor device; and scanning the movable electrode assembly relative to the top surface of the semiconductor device while performing electrical measurements. It also relates to a corresponding electrical and/or opto-electrical characterisation device comprising a first electrode, a movable electrode assembly with a container holding an electrolyte solution and a second electrode immersed into it and scanning means. | 06-07-2012 |
20120182023 | METHOD FOR LOCATING FAULT OF SUBMARINE CABLE, REPEATER, AND COMMUNICATION SYSTEM - A method for locating a fault of a submarine cable, a device, and a communication system are provided. A light pulse output by a Repeater (RPT) is incident to a location of a fault as a probe light pulse. The RPT obtains a time difference between the probe light pulse and the reflected probe light pulse, and sends the time difference to a terrestrial Submarine Line Terminal Equipment (SLTE) so that the SLTE may easily locate the fault according to principles of an Optical Time Domain Reflector (OTDR). Compared with the prior art, the method may locate the fault of the submarine cable more quickly and accurately, so that maintainers may maintain the submarine cable in time. | 07-19-2012 |
20120217973 | System and Method for Flash Bypass - A solar photovoltaic panel is disclosed that includes a photovoltaic cell, a local management unit connected between the cell and a string bus, and a bypass device connected to the cell that is operable to bypass the local management unit when conducting a flash test. The panel preferably further includes a transient detector connected to the cell that is operable to sense an output from the cell having a predetermined transient rise time. The transient detector and the bypass device may be contained within a junction box integrated into the panel and may include the local management unit within the junction box. The transient detector may include a switch connected to a circuit that electrically bypasses the local management unit when the switch is turned on as a result of an output transient rise time less than the predetermined time, thus facilitating a flash test of the photovoltaic panel. | 08-30-2012 |
20120217974 | METHOD AND APPARATUS FOR PROBING A WAFER - A semiconductor wafer resting on a contact element has a spatially distributed force applied to its frontside and an equal and opposing force applied to its backside. The contact element comprises a solid immersion lens (SIL), and has an area less than the area of the wafer, but no less than the larger of the area of an optical collection area and an electrical probe assembly. The equal and opposing forces cause the wafer to conform to the shape of the contact element. Measurements, including electrical testing, optical probing and wafer characterization are performed on the wafer. | 08-30-2012 |
20120286795 | METHODS, SYSTEMS, AND APPARATUS FOR DETECTING LIGHT AND ACOUSTIC WAVES - A sensor includes a sensor head including an acoustic detector configured to receive light from a first light source and to reflect the light upon incidence of acoustic waves. The sensor also includes at least one optical fiber and at least one fluorescent material within at least one of the sensor head and the at least one optical fiber. The at least one fluorescent material is configured to receive light from a second light source external to the sensor and emit visible light in response to the light received from the second light source. | 11-15-2012 |
20130027050 | SYSTEM AND METHOD FOR INSPECTION OF ELECTRICAL CIRCUITS - A system for inspection of electrical circuits including a calibration subsystem operative to apply a time varying voltage to an electrical circuit being inspected during calibration and to sense differences in an electrical state at various different locations in the electrical circuit being inspected, thereby providing an indication of location of defects therein. | 01-31-2013 |
20130027051 | NONCONTACT ELECTRICAL TESTING WITH OPTICAL TECHNIQUES - An on-chip technique for noncontact electrical testing of a test structure on a chip is provided. On-chip photodiodes receives pump light from a pump light source, where the on-chip photodiodes are electrically connected to the test structure and are configured to generate power for the test structure. An on-chip coupling unit receives probe light from a probe light source, where the on-chip coupling unit is optically connected to on-chip waveguides through which the probe light is transferred. On-chip switches open in response to receiving voltage output from the test structure, and the on-chip switches remain closed when the voltage output is not received from the test structure. The on-chip switches pass the probe light when opened by the voltage output from the test structure. The on-chip switches block the probe light by remaining closed, when the voltage output is not received from the test structure. | 01-31-2013 |
20130033267 | OPTICAL SENSOR ASSEMBLY FOR INSTALLATION ON A CURRENT CARRYING CABLE - An optical sensor assembly, for installation on a current carrying cable, senses the current in the cable and provides an electrical output indicating the current. To sense the current, a magnetic concentrator is placed in close proximity to the cable and creates a magnetic field representing current in the cable. An optical current sensor, within the created magnetic field, exposes a beam of polarized light to the magnetic field. The beam of polarized light is rotated thereby, by Faraday effect, according to the current in the cable. The amount of rotation is analyzed and converted to electrical signals to portray the current in the cable. The electrical signals may be processed, evaluated and analyzed to provide one or more of several elements of quality of the current in the cable. | 02-07-2013 |
20130076367 | SYSTEM AND METHOD FOR ESTIMATING THE SHORT CIRCUIT CURRENT OF A SOLAR DEVICE - Described herein is a method and system for determining a short-circuit current of a solar device before the solar device is tested in a solar simulator. A solar device includes a substrate layer, a front contact layer, a window/emitter layer, an absorber layer and a back contact. A thickness of the window/emitter layer and an absorption wavelength of the absorber layer are determined. The window/emitter layer thickness and absorber layer absorption wavelength are used with a fitting parameter that corresponds to transmission properties of the substrate and first contact layers in order to determine the solar device's short-circuit current. | 03-28-2013 |
20130119999 | Specimen Testing Device and Method for Creating Absorbed Current Image - Proposed is a technique of emphasizing a change in absorbed current obtained from a faulty part in a wiring section as a testing target more than in other parts of the wiring section. A specimen testing device is configured to output an image of absorbed current output from two probes during scanning of an electron beam so as to be operatively associated with the scanning of the electron beam and includes the following mechanism. When a faulty part of a wiring section on the specimen side with which two probes are in contact is irradiated with an electron beam, the resistance value at the faulty part changes more than that of irradiation of a normal wiring section with the electron beam. Such a change in resistance value is detected as a change in ratio between a resistance value of the wiring section specified by the two probes and a known resistance value. With this method, an absorbed current image corresponding to the faulty part can be made easily distinguishable from an absorbed current image of other parts of the wiring section. | 05-16-2013 |
20130169283 | ACCURATE MEASUREMENT OF EXCESS CARRIER LIFETIME USING CARRIER DECAY METHOD - A method is described for accurate measuring of the excess carrier lifetime on a semiconductor sample from the carrier decay after termination of the excitation pulse imposed on the steady-state carrier excitation. The method includes determining a quality of decay parameter using progressing segments in each carrier decay; establishing an accurate lifetime measurement multiparameter domain for experimental variables whereby the quality of decay parameter falls within prescribed limits from the ideal exponential decay value of QD=1; and determining an excess carrier lifetime for the semiconductor sample based on experimental measurement conditions within the domain and the quality of decay value within the predetermined range indicative of an accurate excess carrier lifetime measurement. | 07-04-2013 |
20130181722 | METHODS AND PROCESSES FOR OPTICAL INTERFEROMETRIC OR HOLOGRAPHIC TEST IN THE DEVELOPMENT, EVALUATION, AND MANUFACTURE OF SEMICONDUCTOR AND FREE-METAL DEVICES UTILIZING ANISOTROPIC AND ISOTROPIC MATERIALS - Analysis and characterization of semiconductor and free-metal devices using a plurality of “live” and stored interference patterns or data detected to determine or generate two-dimensional or three-dimensional information of at least one internal stress or signal, or determining the effects thereof of internal or external stresses acting upon or within the electrical signals applied to a device under test or evaluation having exterior surfaces, interior structures, electronic features as well as determining the effects thereof of chemicals, bioelectric materials, or substances, placed adjacent to the surface of the devices under test. | 07-18-2013 |
20130221973 | ELECTRICAL TEST DEVICE AND METHOD - An electrical test device may include a power supply, a conductive probe element, and a spectral analysis block. The conductive probe element may be energized by a power supply. The probe element may be placed in contact with an electrical system under test and apply an input signal containing current for measuring at least one parameter of the electrical system. The spectral analysis block may be connected to the probe element and may receive an output signal from the electrical system in response to the application of the current to the electrical system. The spectral analysis block may analyze frequency spectra of the output signal and detect a broadband increase in energy of the frequency spectra above a predetermined energy threshold. The broadband increase in energy may be representative of the occurrence of arcing in the electrical system. | 08-29-2013 |
20130229188 | SYSTEM AND METHOD FOR TESTING ELECTRICAL CIRCUITS USING A PHOTOELECTROCHEMICAL EFFECT - A test system for medical devices that does not require physical contact with an electrical site along a conductive path is described. Not having to physical contact an electrical site while performing an electrical continuity test avoids potential damage to the site. The test system includes a fluidic channel that dispenses an electrolytic solution onto a first electrical site on the conductive path. A light source irradiates the first site to thereby induce a photoelectrochemical (PEC) effect at an interface thereof. The PEC effect produces a change in both the potential (i.e., voltage) and current carrying ability in the conductive path. That voltage or current is measured at a second site to determine whether there is electrical continuity or discontinuity between the sites on the conductive path. | 09-05-2013 |
20130241569 | ARC RESISTANCE PERFORMANCE EVALUATION DEVICE, ARC RESISTANCE PERFORMANCE EVALUATION SYSTEM, AND ARC RESISTANCE PERFORMANCE EVALUATION METHOD - The present device includes a high frequency induction thermal plasma generation unit | 09-19-2013 |
20140043033 | APPARATUS AND METHOD FOR INSPECTING PCB-MOUNTED INTEGRATED CIRCUITS - A method and apparatus for testing the mounting of an integrated circuit on a printed circuit board using a ball grid array comprises directing an inclined laser beam from a line scan laser sensor at the integrated circuit, detecting the position of the lower edge of the integrated circuit from laser light backscattered from the integrated circuit and printed circuit board, determining through a trigonometric calculation the height of the integrated circuit above the printed circuit board following soldering of the ball grid array and comparing the height with reference data. The integrated circuit is deemed to have been successfully mounted to the printed circuit board if the height falls within a predetermined range. | 02-13-2014 |
20140062496 | TEST APPARATUS FOR SEMICONDUCTOR PACKAGE - A test apparatus for a semiconductor package comprising an X-ray analyzer acquiring an X-ray image of the semiconductor package and detecting a thickness of the semiconductor package from the X-ray image, and a thermal reaction analyzer applying a voltage to the semiconductor package and detecting a failure position of the semiconductor package using a surface temperature of the semiconductor package and the thickness of the semiconductor package may be provided. | 03-06-2014 |
20140103935 | OPTICAL TO OPTICAL TIME AND SPATIAL RESOLUTION ENHANCEMENTS FOR IMPROVING CHARACTERIZATION OF SECONDARY ELECTRON EMISSION AND CONTROL FOR ETCH-, ELECTRON-, AND ION-BEAM DEVICES - In decreasing the electron beam duration required for increased time resolution, the average beam current decreases, degrading measurement sensitivity and limiting practical systems to a time resolution of several hundred picoseconds. Optical non-invasive or non-destructive enhancements permits femto-second measurements and a new regime of internal device and process evaluation and quality control in integrated circuit (IC) manufacture, at every stage from the initial wafer to the point at which the wafer is diced into individual ICs. | 04-17-2014 |
20140203814 | METHOD AND APPARATUS FOR MEASURING ALPHA PARTICLE INDUCED SOFT ERRORS IN SEMICONDUCTOR DEVICES - An apparatus includes a probe card, an alpha particle source and a shutter. The probe card includes a plurality of contact elements. The contact elements define a measuring position. The shutter is arranged between the alpha particle source and the measuring position. The shutter is movable between a closed position and an open position. When the shutter is in the open position, alpha particles from the alpha particle source reach the measuring position. When the shutter is in the closed position, the alpha particles are blocked from reaching the measuring position. | 07-24-2014 |
20140203815 | WIRING FAULT DETECTION METHOD AND WIRING FAULT DETECTION APPARATUS - A wiring fault detection method and apparatus capable of appropriately detecting a fault in the case of capturing an image of a panel a plurality of times using an infrared camera are provided. | 07-24-2014 |
20140253137 | TEST PATTERN DESIGN FOR SEMICONDUCTOR DEVICES AND METHOD OF UTILIZING THEREOF - Methods and systems for the detection of defects in semiconductors, semiconductor devices, or substrates are provided. Semiconductors, semiconductor devices or substrates having novel test patterns and or designs are also provided. The semiconductors, semiconductor devices or substrates have a plurality of line patterns, which, in response to a responsive stimulus such as electron beam irradiation, produces a response. The responsive stimulus may include an electron beam irradiation, and the image data can be collected and processed to produce an image or images that indicate the presence or absence of surface and/or internal defects. | 09-11-2014 |
20140333319 | CHARACTERIZATION OF SUBSTRATE DOPING AND SERIES RESISTANCE DURING SOLAR CELL EFFICIENCY MEASUREMENT - Short-circuit current, maximum power, and open circuit voltage during a single flash are determined by varying intensity, voltage, and current. An apparatus determines the substrate doping and the series resistance of the solar cell. The series resistance of the cell is determined from a voltage step from the maximum power voltage operating point to the open-circuit condition. Methods are described for determining the substrate doping from stepping or sweeping the voltage. The first uses a voltage step and finds the change in charge that results. This determines a unique doping if the series resistance is known. The second uses data for a case of varying current, voltage, and light intensity, and compares this data to the case of varying voltage and intensity with no current. By transposing both cases into the steady state, agreement between the two data sets is found for unique doping and series resistance values. | 11-13-2014 |
20140361782 | ELECTRONIC COMPONENT INSPECTION APPARATUS AND METHOD - An electronic component inspection apparatus includes a light source arranged in a mounting area where at least one electronic component is mounted to a board and a light-receiving sensor arranged outside the mounting area to detect an intensity of a light received from the light source. A computer executes a program to perform a process of determining a state of joining parts in the mounting area based on a result of comparison of the intensity of the light received by the light-receiving sensor with an intensity of distribution previously acquired. | 12-11-2014 |
20150130474 | APPARATUS FOR FREQUENCY ANALYZING A MEASUREMENT TARGET AND METHOD OF FREQUENCY ANALYZING A MEASUREMENT TARGET - A semiconductor device testing apparatus | 05-14-2015 |
20160169958 | DISCHARGE OCCURRENCE STATUS EVALUATION DEVICE AND EVALUATION METHOD | 06-16-2016 |