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With mounting or support means

Subclass of:

310 - Electrical generator or motor structure

310300000 - NON-DYNAMOELECTRIC

310311000 - Piezoelectric elements and devices

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Class / Patent application numberDescriptionNumber of patent applications / Date published
310351000 Suspended by thin member 13
310354000 Clamped 8
310349000 Air gap 1
20130140959BULK ACOUSTIC WAVE RESONATOR - Disclosed is a bulk acoustic wave resonator (BAWR). The BAWR includes a bulk acoustic wave resonance unit with a first electrode, a second electrode, and a piezoelectric layer. The piezoelectric layer is disposed between the first electrode and the second electrode. An air edge is formed at a distance from a center of the bulk acoustic wave resonance unit.06-06-2013
Entries
DocumentTitleDate
20090195125PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A piezoelectric device includes: a piezoelectric resonator element; a package storing the piezoelectric resonator element therein in a manner to mount the piezoelectric resonator element on a base portion thereof composed of at least three layers that are layered; and a through hole penetrating through the base portion. In the device, the through hole includes a first hole formed on a first layer which is positioned to face the piezoelectric resonator element among the three layers; a second hole formed on a second layer contacting with the first layer; a third hole formed larger than the second hole on a third layer contacting with the second layer; and a metal coat formed on an inner wall surface of the second hole, and a sealing part for sealing the package is formed with a sealant in at least the second hole.08-06-2009
20080258581Energy converter arranged on rotating elements and used to convert mechanical energy into electric energy - An energy converter arranged on a rotating element and used for converting mechanical energy into electrical energy, having a converter element (10-23-2008
20130033153PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A piezoelectric device includes a piezoelectric vibrating piece with a pair of excitation electrodes, a base plate, and a non-conductive bonding material. The base includes a pair of castellations that are hollowed into a side face from the mounting surface to the bonding surface. The pair of castellations include a first surface and a second surface. The first surface extends outward from the mounting surface toward the bonding surface side. The second surface extends outward from the bonding surface toward the mounting surface side. The second surface has a smaller area than an area of the first surface. A wiring electrode is disposed on the first surface, the second surface, and a side face of the bonding material. The wiring electrode is of a same electrode layer as the external electrode. The wiring electrode extends from the external electrode to the extraction electrodes.02-07-2013
20120206020PIEZOELECTRIC DEVICE - A piezoelectric device capable of adjusting shape/position of connection electrodes is provided to accommodate a first or second oscillating plate (piezoelectric). The second oscillating plate is shorter than the first oscillating plate, each oscillating plate includes an excitation and an extraction electrodes. The extraction electrode is electrically connected with a connection electrode via conductive adhesive agent in a package. The package includes a carrier section, carrying the first or the second oscillating plate thereon. The connection electrode is disposed on at least a portion of a surface of the carrier section. When the extraction electrode of the first oscillating plate is electrically connected with the connection electrode, the excitation electrode on one side of the first oscillating plate is not electrically connected with the connection electrode on the other side. The extraction electrodes of the second oscillating plate can be electrically connected with the connection electrodes.08-16-2012
20130043772CASE FOR ULTRASONIC SENSOR AND ULTRASONIC SENSOR USING THE SAME - Disclosed herein are a case for an ultrasonic sensor and an ultrasonic sensor using the same. The case for an ultrasonic sensor has a cylindrical shape and includes a disposition area of a piezoelectric element and a first groove formed in an inner side bottom surface thereof, wherein the first groove is formed along an edge of the disposition area of the piezoelectric element.02-21-2013
20130082573CRYSTAL UNIT AND METHOD FOR FABRICATING THE SAME - A method for fabricating a crystal unit, including a preparing step, a bonding step, and a separating step, is provided. The preparing step prepares a quartz plate and a supporting substrate with a recess that is larger than the vibrating region on a surface of the supporting substrate. The recess corresponds to a vibrating region in the crystal unit. The bonding step bonds the quartz plate to the surface of the supporting substrate such that the quartz plate is separated from the supporting substrate in the recess. The separating step separates the quartz plate into the vibrating region and the framing portion by performing dry etching on the quartz plate such that the quartz plate has a shape that connects the vibrating region to the framing portion via a supporting beam. The framing portion surrounds the vibrating region.04-04-2013
20090045699Precise Positioning Apparatus - A precision positioning device 02-19-2009
20130069488PIEZOELECTRIC PRESSURE SENSITIVE TRANSDUCER APPARATUS AND METHOD - A sensor includes a first plate, a second plate, and a piezoelectric material portions. The piezoelectric material portions are positioned between the first plate and the second plate. The area of the piezoelectric material portions is less than the area of the plates. The plates can be supported with a center support structure. The width of the sensor is significantly greater than its height. The interstitial space is filled with a flexible material. An outside wall isolates the inside from the outside03-21-2013
20130069489PIEZOELECTRIC DEVICE - Disclosed is a piezoelectric device mounted on a mount board, including: a piezoelectric vibrating piece having an excitation electrode and an extraction electrode extracted from the excitation electrode; and a base plate made of an insulative material, the base plate having a first face where the piezoelectric vibrating piece is placed and a second face opposite to the first face, where an external electrode is provided, wherein at least a part of an area other than the external electrode of the second face is hollowed to the first face side to form a cavity in the second face side for the mount board when the piezoelectric device is mounted on the mount board.03-21-2013
20120306321PIEZOELECTRIC VIBRATION ELEMENT, MANUFACTURING METHOD FOR PIEZOELECTRIC VIBRATION ELEMENT, PIEZOELECTRIC RESONATOR, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS - A piezoelectric vibration element includes a piezoelectric substrate including a thin vibration region and a thick section integrated along three sides excluding one side of the vibration region, excitation electrodes respectively arranged on the front and rear surfaces of the vibration region, and lead electrodes. The thick section includes a first thick section and a second thick section arranged to be opposed to each other across the vibration region and a third thick section connected between proximal ends of the first and second thick sections. The second thick section includes an inclined section connected to the one side of the vibration region, a second thick section main body connected to the other side of the inclined section, and at least one slit for stress relaxation.12-06-2012
20090236942Device with electroceramic/and variant/ and way of using the device with electroceramic/and variant/ - The device with electroceramic/and variant/ and way of using the device with electroceramic/and variant/.09-24-2009
20090309459METAL PASTE FOR SEALING, HERMETIC SEALING METHOD FOR PIEZOELECTRIC ELEMENT, AND PIEZOELECTRIC DEVICE - The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 μm to 1.0 μm and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. This metal paste preferably contains an additive such as a surfactant in accordance with the application method. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.12-17-2009
20120032564POLYMER ACTUATOR DEVICE - A polymer actuator device includes an electrolyte layer, a pair of electrode layers that are provided on both surfaces of the electrolyte layer in a thickness direction of the electrolyte layer, a polymer actuator that is bent when a voltage is applied between the pair of electrode layers, and terminal parts that apply a voltage to the polymer actuator. The polymer actuator includes a deformable portion and a supported portion. A conductive porous member is interposed between a first electrode layer, which is positioned on the side of the supported portion of the polymer actuator corresponding to a negative electrode, and the terminal part.02-09-2012
20120112606PIEZOELECTRIC ACTUATOR DEVICE - A piezoelectric actuator device includes a substrate anchor region; a support beam arrangement having first and second ends, wherein the first end is fixed to the anchor region and the second end is freely suspended; first and second beams having first and second ends, wherein the first end of each beam is mechanically fixed to at least a part of the second end of the support beam arrangement and the second end of each beam is freely suspended; a coupling beam mechanically coupling the second end of the first and second beams; wherein the first and second beams are arranged such that the first end of the support beam arrangement is located between the coupling beam and the second end of the support beam arrangement.05-10-2012
20100090566SURFACE ACOUSTIC WAVE LINEAR MOTOR, SURFACE ACOUSTIC WAVE LINEAR MOTOR PACKAGE, AND LENS ACTUATOR ADOPTING THE SURFACE ACOUSTIC WAVE LINEAR MOTOR PACKAGE - Disclosed herein are a surface acoustic wave linear motor that can be driven in opposite directions along a predetermined path, a package including the surface acoustic wave linear motor, and a lens actuator that is capable of performing an optical zoom function by adopting the surface acoustic wave linear motor package. The surface acoustic wave linear motor includes a substrate, through which a surface acoustic wave progresses, a movable part constructed such that the movable part can perform a translating movement in the opposite direction to the progressing direction of the surface acoustic wave, and electrodes for supplying the substrate with power to generate the surface acoustic wave in the substrate. According to the present invention, the surface acoustic wave linear motor is capable of performing a translating movement without the provision of an additional mechanism, unlike the conventional actuator using the rotary motor, the gear, and the lead screw. Furthermore, the surface acoustic wave linear motor is suitable for miniaturization and weight reduction, and therefore, various applications of the surface acoustic wave linear motor are possible.04-15-2010
20090152994PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, WAVE CLOCK, AND MANUFACTURING METHOD OF PIEZOELECTRIC VIBRATING REED - A piezoelectric vibrating reed includes a piezoelectric plate made of a piezoelectric material, a pair of exciter electrodes formed on outer surfaces of the piezoelectric plate and configured to vibrate the piezoelectric plate when a predetermined voltage is applied thereon, and a pair of mount electrodes electrically connected to the pair of exciter electrodes, respectively. One mount electrode in the pair of mount electrodes is formed on one surface (under surface) of the piezoelectric plate and the other mount electrode is formed on the other surface (top surface) of the piezoelectric plate in a state not to oppose the one mount electrode with the piezoelectric plate in between. Accordingly, not only can power be saved, but also higher performance can be achieved by lowering the R1 characteristic and thereby enhancing the vibration characteristic.06-18-2009
20120229003PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - In a piezoelectric device and a method of manufacturing thereof, after an ion implanted portion is formed in a piezoelectric single crystal substrate by implantation of hydrogen ions, an interlayer of a metal is formed on a rear surface of the piezoelectric single crystal substrate. In addition, a support member is bonded to the piezoelectric single crystal substrate with the interlayer interposed therebetween. A composite piezoelectric body in which the ion implanted portion is formed is heated at about 450° C. to about 700° C. to oxidize the metal of the interlayer so as to decrease the conductivity thereof. Accordingly, the conductivity of the interlayer is decreased, so that a piezoelectric device having excellent resonance characteristics is provided.09-13-2012
20110169377PIEZOELECTRIC OSCILLATOR - A piezoelectric crystal unit includes a package including a concave portion; a piezoelectric element having a protruding electrode and disposed within the package; and an electrically conductive adhesive contained in the concave portion. The piezoelectric element is fixed to the package with the protruding electrode embedded in the concave portion of the package.07-14-2011
20090152995ELECTROACTIVE POLYMER TRANSDUCERS BIASED FOR INCREASED OUTPUT - Electroactive polymer transducers are disclosed. They are biased in a manner that provides for increased force and/or stroke output, thereby offering improved work potential and power output capacity. The biasing may offer additional or alternate functional advantage in terms of matching transducer performance with a given application such as a normally-closed valve. The improved biasing (including increased output biasing) may utilize negative spring rate biasing and/or a combination of negative or zero-rate biasing with positive rate biasing to achieve the desired ends.06-18-2009
20080309202Electronic Component Having a Resonator Element Arranged in an Hermetically Closed Housing and Method for Manufacturing Such an Electronic Component - The electronic component includes at least one resonator element arranged in a housing of a case. The case includes a main part with a base and at least one lateral wall of annular shape, and a cover fixed onto the main part to hermetically seal the housing of the case. One portion of the cover is transparent to a determined wavelength of a light beam to allow the resonator element to be optically adjusted once the case is sealed. The cover is fixed onto a rim of the lateral wall of the main part, which is preferably made of a ceramic material, such that one part of the rim preferably surrounds the entire lateral surface of the cover to ensure protection of the electronic component against lateral shocks.12-18-2008
20110062828PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME - In an exemplary method a piezoelectric wafer is prepared on which multiple piezoelectric frames are formed. Each frame has a piezoelectric vibrating piece including excitation electrodes, and a frame portion surrounds the vibrating piece. A lid wafer is prepared on which multiple respective lids are formed, each sized substantially similarly to the respective frames. A base wafer is prepared on which multiple of bases are formed, each sized substantially similarly to the respective frames. Each base has through-holes. Stripes of a first bonding film are formed on both major surfaces of the piezoelectric wafer around the periphery of each frame. Stripes of a second bonding film are formed on the inner major surface of the lid wafer, corresponding to respective stripes of the first bonding film. Stripes of a third bonding film are formed on the inner major surface of the base wafer, corresponding to respective stripes of the first bonding film. A bonding material is placed between the stripes of first bonding film and respective stripes of second bonding film, and between stripes of first bonding film and respective stripes of third bonding film, by which the three wafers are bonded together after being aligned with each other in a sandwich manner.03-17-2011
20110062827PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING SAME - Methods are disclosed for manufacturing piezoelectric devices. In an exemplary method a base substrate is prepared that defines multiple device bases. Multiple cutting grooves are defined on a surface of the base substrate in a grid pattern to define therebetween the size of the devices. A frame substrate is also prepared from a piezoelectric material. The frame substrate defines multiple frames surrounding respective vibrating pieces and being alignable with respective bases in the base substrate. Also prepared is a lid substrate defining multiple lids being alignable with respective frames and bases. The three substrates are aligned and bonded together such that the frame substrate is between the lid and base substrates and the surface defining the cutting grooves faces outward. The base substrate is mounted on a dicing sheet such that cutting grooves face the dicing sheet. Cutting is performed, using a dicing blade, through the sandwich from the lid substrate to the cutting grooves.03-17-2011
20100079037ELECTROACTIVE POLYMER TRANSDUCER - An electroactive polymer transducer comprising a membrane formed of an approximately rectangular electroactive polymer portion surrounded by two electrodes, at least two points of the membrane being connected to rigid supports, and comprising at least one deformable element for limiting the deformations that the membrane may undergo, the limiting element having a meandering form and being connected to the membrane in several approximately distributed points.04-01-2010
20100079036PIEZOELECTRIC VIBRATING PIECES AND PIEZOELECTRIC DEVICES COMPRISING SAME - An exemplary tuning-fork type piezoelectric vibrating piece has at least a pair of vibrating arms extending from one end of a base portion in a certain longitudinal direction (e.g., Y-direction). Supporting arms extend from respective side edges of the base, outboard of the vibrating arms in the certain direction. The supporting arms have respective mounting regions near their distal tips. Each supporting arm progressively narrows from its proximal end, coupled to the respective side edge of the base, to its respective mounting region. The progressive narrowing can be via one or more constrictions along the length of the supporting arm.04-01-2010
20130082574Piezoelectric Vibrator, Oscillator, Electronic Instrument, and Radio Timepiece - There is provided a piezoelectric vibrator including a piezoelectric vibration reed having a pair of vibrating arm portions and a base portion configured to integrally fix proximal end sides of the pair of vibrating arm portions, a base substrate on which the piezoelectric vibration reed is mounted, and a lid substrate joined to the base substrate and configured to accommodate the piezoelectric vibration reed in a cavity defined between the lid substrate and the base substrate, wherein the base substrate is formed with a first engaging portion, and a second engaging portion configured to engage the first engaging portion and guide the piezoelectric vibration reed to a predetermined mount position of the base substrate and position the same is formed on the base portion of the piezoelectric vibration reed.04-04-2013
20100123369Piezoelectric devices and methods for manufacturing same - Piezoelectric devices and method for making them are disclosed. An exemplary piezoelectric device has a package base defining a cavity on a first surface thereof. An opposing second surface of the package base has at least one through-hole, a mounting electrode on which a piezoelectric vibrating piece is attached, and a respective sealing electrode sealing each through-hole. At least one external electrode is on the second surface, and a lid is bonded to the package base to enclose the piezoelectric vibrating piece. The mounting electrode, sealing electrodes, and external electrodes are formed integrally.05-20-2010
20090167116METAL BASE FOR CRYSTAL UNIT AND CRYSTAL UNIT USING THE SAME - The metal base for a crystal unit includes: a base body in which at least a pair of through-holes are formed; a pair of leads provided with a supporter for supporting a crystal blank at the head thereof; and glass charged into the respective through-holes to electrically insulate the leads from the base body and hermetically seal the through-holes. A step is formed in a region of the lead corresponding to the outer bottom surface of the base body, the lead is made up of at least a first lead portion on the through-hole side from the step and a second lead portion in a direction in which the lead extends out from the step. The diameter of the lead of the second lead portion is smaller than the diameter of the lead of the first lead portion.07-02-2009
20090001856PIEZOELECTRIC RESONATOR AND MANUFACTURING METHOD THEREFOR - A piezoelectric resonator includes a piezoelectric resonator element having a base portion and a resonating arm extending from the base portion, a package including a bottom to which the piezoelectric resonator element is fixed and a frame wall that surrounds the bottom and having an opening above the bottom, and a lid for closing the opening of the package. In this piezoelectric resonator, the lid includes a main body having a through-hole formed therein, a flange formed to surround a periphery of the main body and to be thinner than the main body, and an optically transparent member located in the through-hole. The flange has a joining portion with an upper end surface of the frame wall, and the main body projects in a direction from the flange to the bottom in a thickness direction. Also, the through-hole is at a position displaced in a first direction approaching a first end of the main body from a center of the main body. Also, the flange is joined with the frame wall such that a clearance between the first end and the joining portion of the flange nearest to the first end is larger than a clearance between a second end in a second direction opposite to the first direction of the main body and the joining portion of the flange nearest to the second end.01-01-2009
20090009036PRESSURE TRANSDUCER - A pressure transducer for high-pressure measurements comprising a housing and a piezoelectric resonator located in the housing, wherein the resonator comprises double rotation cut piezoelectric material configured or designed for vibrating in the fundamental tone of dual modes of the fast and slow thickness-shear vibrations.01-08-2009
20090322186THIN FILM PIEZOELECTRIC RESONATOR AND METHOD FOR MANUFACTURING THE SAME - A thin film piezoelectric resonator suppresses deterioration of impedance at antiresonant frequency and has a high Q value. The thin film piezoelectric resonator is provided with a semiconductor substrate (12-31-2009
20090015107Packaging for piezoelectric resonator - The invention concerns a package comprising a case (01-15-2009
20080265717Piezoelectric Resonator Plate and Piezoelectric Resonator Device - An electrode forming region for providing lead electrodes (10-30-2008
20090051252Piezoelectric Resonator Plate And Piezolectric Resonator Device - A piezoelectric resonator plate includes a base portion and a vibrating portion having a plurality of leg portions. Each of the leg portions is provided with an excitation electrode and a lead electrode. At least two conductive bonding member forming regions for bonding a part of the lead electrode to an external electrode via a conductive bonding member are defined in the base portion. The base portion is formed wider than the vibrating portion and has a base portion central region and base portion wider regions, the base portion central region having the same width as the vibrating portion, the vibrating portion extending from the base portion central region, and the base portion wider regions extending beyond lateral edges of the vibrating portion, the conductive bonding member forming regions being defined in the base portion wider regions. Elongated thin-walled portions starting at boundary corner portions of the base portion between the base portion central region and the base portion wider regions are formed in this base portion. Alternatively, elongated thin-walled portions starting at corner portions on a side of the base portion wider regions from which the leg portions extend are formed in the base portion.02-26-2009
20090026890Reducing stress gradients within piezoelectric actuators - Piezoelectric actuators of the type comprising a stack of layers of ferroelectric material and intervening electrodes which extend only part-way across the adjacent ferroelectric layers suffer differential remanent stress when electric fields are applied across the layers. To overcome this, a tensile stress is applied to the actuator along an axis substantially perpendicular to the layers of piezoelectric material in the actuator, which tensile stress is sufficient to mechanically align the dipoles, thus giving rise to a remanent strain which is uniform throughout the actuator. The actuator is advantageously heated while the tensile stress is applied, so as to increase the difference between the tensile strength of the material and the applied tensile stress. An alternative arrangement involves subjecting the actuator to a multidirectional stress and reducing the stress along the axis substantially perpendicular to the layers of piezoelectric material in the actuator. The entire process is performed on completed actuators. Under suitable temperature and load conditions no tensile margin fractures form and electrode tip discontinuity is reduced.01-29-2009
20090179524CRYSTAL DEVICES AND METHODS FOR MANUFACTURING SAME - Crystal devices are disclosed that include a crystal frame having a crystal vibrating piece and an outer frame. The crystal vibrating piece includes excitation electrodes, and the outer frame supports the crystal vibrating piece. Each device has a base including connection electrodes on a first surface thereof and respective external electrodes on a second surface thereof, wherein the connection electrodes are electrically connected via respective through-holes to respective excitation electrodes and to respective external electrodes. The first surface of the base is bonded to the under-surface of the outer frame, and an upper surface of the outer frame is bonded to a crystal lid. The through-holes have non-circular transverse profiles and are filled with a sealing material such as a metal.07-16-2009
20110204753PIEZOELECTRIC DEVICE AND MANUFACTURING METHOD THEREOF - A piezoelectric device and a manufacturing method thereof are provided. The piezoelectric device having a piezoelectric vibration sheet (08-25-2011
20090140612Vibration-Wave Detector - A sensor body 06-04-2009
20090256449PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME - An exemplary piezoelectric device includes a base having a first connection electrode electrically connected to an external electrode. A second connection electrode is connected to the first connection electrode on a first main surface of a supporting member affixed to the base. A third connection electrode, formed on a second main surface of the supporting member, is electrically connected to the second connection electrode. A piezoelectric vibrating piece is affixed to the supporting member by application of an adhesive applied to the third connection electrode. The piezoelectric vibrating piece and includes excitation electrodes. A convexity is located and extends in a designated direction relative to the third connection electrode to prevent applied adhesive from spreading beyond a designated area of the piezoelectric vibrating piece.10-15-2009
20090256448Bracing Element and Piezoelectric Actuator with the Bracing Element - A bracing element for bracing a piezoelectric multiple layer component includes a tubular body that is at least partially corrugated. A piezoelectric actuator with the bracing element is also disclosed.10-15-2009
20100148634Impact-resistant piezoelectric devices - Piezoelectric devices are disclosed that include a chip plate sandwiched between a lid plate and a base plate. The chip plate includes a tuning-fork type piezoelectric vibrating piece surrounded by an outer frame. The lid plate includes a concavity on its inner major surface, and the base plate includes a concavity on its inner major surface. The lid plate, chip plate, and base plate are bonded together to form a package containing the piezoelectric vibrating piece. The tuning-fork type piezoelectric vibrating piece includes a base having an X-direction width and at least pair of vibrating arms extending from the base in a Y-direction. The tuning-fork type piezoelectric vibrating piece is coupled to the outer frame by supporting arms extending in the Y-direction outboard of the vibrating arms. The concavity of the lid plate includes at least one base-movement “buffer” extending in the X-direction at a location corresponding to the base of the vibrating piece. The concavity of the base plate includes at least one base-movement buffer extending in the X-direction at a location corresponding to the base.06-17-2010
20090096329PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING SAME - Piezoelectric devices and associated fabrication methods are disclosed. An exemplary piezoelectric device includes a piezoelectric vibrating piece having first and second electrodes and first and second surfaces, a glass base having first and second surfaces, and a lid. These three parts also form the device package. The first surface of the piezoelectric vibrating piece is mounted to the base, and the lid is mounted to the second surface of the piezoelectric vibrating piece to seal the package. The glass base includes first and second metal wires having ends that protrude from the surfaces of the base. The side surfaces of the protruding wire ends are connected to the first and the second electrodes, respectively. Manufacture is performed using whole wafers that are processed, sandwiched, bonded, and then cut to produce individual devices.04-16-2009
20090045700PIEZOELECTRIC ACTUATOR AND ELECTRONIC DEVICE - There is provided a piezoelectric actuator and the like capable of efficiently transmitting vibration between an object (e.g., a housing of an electronic device) and a piezoelectric ceramic vibrator. The piezoelectric actuator 02-19-2009
20100219723PIEZOELECTRIC DEVICE, ELECTRONIC DEVICE USING THE SAME, AND AUTOMOBILE - A piezoelectric device according to the present invention includes lead wires (09-02-2010
20100219722PIEZO-ELECTRIC ACTUATOR AND ELECTRONIC DEVICE - Piezo-electric actuator 09-02-2010
20120242193QUARTZ-CRYSTAL DEVICES EXHIBITING REDUCED CRYSTAL IMPEDANCE - Quartz-crystal devices are disclosed, of which the CI value is reduced by adjusting the shortest distance between an edge of electrically conductive adhesive and an edge of the excitation electrode. The device has a quartz-crystal plate having long-edges and short-edges. Excitation electrodes are on first and second surfaces of the plate. Conductive pads are electrically connected to respective excitation electrodes and extend to the short-edge of the quartz-crystal plate. A package having a pair of external mounting terminals and respective connecting electrodes are situated on opposing sides of the mounting terminals for making electrical connections to the mounting terminals. An electrically conductive adhesive bonds the connecting terminals and respective conductive pads together, and the quartz-crystal plate onto the package. The shortest distance between an edge of the adhesive and an edge of the excitation electrode is 10%-15% the length of the quartz-crystal plate in the long-edge direction.09-27-2012
20110241492Quartz Crystal Device Using At-Cut Quartz Substrate and Manufacturing the Same - The quartz crystal device of a first aspect comprises a quartz crystal element having an vibrating portion which vibrates when a voltage is applied and a frame portion which surrounds the periphery of the vibrating portion, the quartz crystal element being formed of an AT-cut quartz crystal material specified by the X-axis, the Y′-axis and the Z′-axis; a base which is bonded to one main surface of the frame portion, the base being formed of a Z-cut quartz crystal material specified by the X-axis, the Y-axis and the Z-axis; and a lid which is bonded to other main surface of the frame portion, the frame portion being formed of the Z-cut quartz crystal material. The Z′-axis of the quartz crystal element is coincident with the X-axis or the Y-axis of the base and the lid.10-06-2011
20090066190QUARTZ CRYSTAL DEVICE - A quartz crystal device includes: a quartz crystal blank having an outer perimeter part and a vibration region partially separated mechanically from the outer perimeter part by a cut-out groove; a first container joined to a first principal surface of the crystal blank by being joined to an entire perimeter of the perimeter part of the crystal blank via a brazing material layer in the first principal surface; and a second container joined to a second principal surface of the crystal blank by being joined to an entire perimeter of the outer perimeter part of the crystal blank via a brazing material layer in the second principal surface. The vibration region of the crystal blank is hermetically encapsulated in a space formed by the first container, the second container and the outer perimeter part of the crystal blank.03-12-2009
20110115340TOUCH PANEL DEVICE - A touch panel device in which a support portion is provided to include an actuator for generating vibration giving an excellent sense of touch without the need for a separate mounting space. To this end, the touch panel device having a front cover portion, a touch sensor unit divided into an upper transparent electrode layer and a lower transparent electrode layer, and a substrate provided under the touch sensor portion includes an actuator for delivering vibration to the front cover portion, a reinforcing portion having the actuator attached thereto to attach the actuator to the touch sensor unit, and a support portion formed on the substrate to provide an opening in a first side thereof and a closed second side, such that the actuator is inserted into and coupled to the opening and the support portion supports the actuator to deliver the vibration of the actuator to the front cover portion.05-19-2011
20100164328Piezoelectric frames and piezoelectric devices comprising same - Piezoelectric frames are disclosed that include a tuning-fork type piezoelectric vibrating piece. The vibrating piece has at least a pair of vibrating arms that extend in a longitudinal direction (e.g., Y-direction) from a first end edge of a piezoelectric base, and at least one excitation electrode on the pair of vibrating arms. Respective supporting arms extend in the longitudinal direction, outboard of each vibrating arm. The vibrating piece is surrounded by and attached to a frame portion also made of piezoelectric material. A pair of connecting portions connects the supporting arms to the frame portion. The connecting portions extend from respective supporting arms to the frame portion in a direction that intersects the longitudinal direction. The connecting portions are connected to the frame portion at designated locations that are more than 50% of the designated length of the vibrating piece from the second end edge of the base.07-01-2010
20100237749ELECTRONIC COMPONENT, MOUNTING STRUCTURE THEREOF, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT - An electronic component includes: a functional piece having a predetermined function; a bump electrode formed on the functional piece, the bump electrode including a core with elastic property and a conductive film provided on a surface of the core; and a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit. The electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode.09-23-2010
20090102322QUARTZ CRYSTAL DEVICE FOR SURFACE MOUNTING - The quartz crystal device includes a container body having: a recess; a pair of holding terminals formed on an inner bottom surface of the recess; and a crystal blank, both principal surfaces of which are provided with excitation electrodes with lead-out electrodes extending from the pair of excitation electrodes toward both sides of one end of the crystal blank. Both sides of one end of the crystal blank are fixed to the holding terminals using a conductive adhesive. Pillow members are provided on the inner bottom surface of the recess at positions corresponding to corners on both sides of the other end of the crystal blank, and the two pillow members are independent of each other. Alternatively, each holding terminal includes a first region formed near the facing holding terminal and a second region having a greater thickness than the first region formed far from the facing holding terminal.04-23-2009
20090261691MICROELECTROMECHANICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a microelectromechanical device having a simple structure in which strains of the semiconductor substrate can be reduced. Both a semiconductor substrate 10-22-2009
20100013358ULTRASONIC PROBE WITH ADHESIVE PROTRUSION PREVENTIVE STRUCTURE - An ultrasonic probe, in which a thick adhesive layer is not formed directly under the piezoelectric element and the adhesive is prevented from covering an electrode portion of a side face of the piezoelectric element. The ultrasonic probe includes: a main backing material having a curved surface; a flexible auxiliary member having a first surface bonded onto the curved surface of the main backing material by using an adhesive; and an array of piezoelectric elements arranged on a second surface of the flexible auxiliary member, wherein at least one of side edges of a bonding surface between the flexible auxiliary member and the main backing material is formed with a recessed area for allowing the adhesive, which has protruded when bonding the flexible auxiliary member onto the main backing material by using the adhesive, to escape thereinto.01-21-2010
20110101828PIEZOELECTRIC ELEMENT AND METHOD FOR MANUFACTURING THE SAME - A piezoelectric element includes a substrate, and a lower electrode layer, a piezoelectric layer, and an upper electrode layer sequentially formed on the substrate. The substrate has a linear thermal expansion coefficient higher than that of the piezoelectric layer, and the piezoelectric layer includes a polycrystalline body having an in-plane stress in a compressive direction. Thus, the piezoelectric element realizes the piezoelectric layer having a high orientation in a polarization axis direction, high proportionality of a displacement amount with respect to an applied voltage, and a large absolute value of the displacement amount.05-05-2011
20100066210SURFACE-MOUNT TYPE CRYSTAL UNIT - In a crystal unit, a crystal blank is accommodated in a container body composed of a bottom wall layer and a frame wall layer, and a metal cover is bonded to the container body by a eutectic alloy. The crystal blank is held by a pair of crystal connecting terminals formed at a position to be an inner bottom surface of a container body on one end portion side of the container body. A grounding external terminal is arranged at one corner of the outer bottom surface of the container body at the other end portion side of the container body. To connect the metal cover to the grounding external terminal, a first conduction metal film electrically connected to the metal cover through an end face metal film on an inner side surface of the frame wall layer is formed on a lower surface of the frame wall layer, and a second conduction metal film electrically connected to the grounding external terminal through an end face metal film on a container body outer side surface is formed on an upper surface of the bottom wall layer, corresponding to the positions where the grounding external terminals are formed.03-18-2010
20100052480METHOD FOR PRODUCING A HOLDING FRAME OR A TRANSMISSION FRAME FOR A STACKED PIEZOACTUATOR AND ELECTROSTRICTIVE DRIVE WITH A FRAME OF SAID TYPE - The invention relates to a method for producing a holding or transmission frame (03-04-2010
20090140613CRYSTAL UNIT FOR SURFACE MOUNTING - The crystal unit for surface mounting includes a container body having a recess, a pair of holding terminals formed on an inner bottom surface of the recess and a crystal blank provided with excitation electrodes on both principal surfaces thereof, having a first end and a second end with lead-out electrodes extending from the excitation electrodes toward both sides of the first end. Both sides of the first end are fixed to the holding terminals using a conductive adhesive. Pillow members protruding from the inner bottom surface are provided on the inner bottom surface of the recess at positions corresponding to corners on both sides of the second end. A bank having a height lower than a height of the pillow members is provided on the inner bottom surface of the recess at an intermediate position between the pair of pillow members.06-04-2009
20120200199PIEZOELECTRIC THIN-FILM RESONATOR - A piezoelectric thin-film resonator includes a substrate, a lower electrode provided on the substrate, a piezoelectric film provided on the substrate and the lower electrode, an upper electrode provided on the piezoelectric film, and an additional pattern, a cavity being formed between the lower electrode and the substrate in a resonance portion in which the lower electrode and the upper electrode face each other through the piezoelectric film, the additional pattern being provided in a position that is on the lower electrode and includes an interface between the resonance portion and a non-resonance portion.08-09-2012
20100320873SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE - There are disclosed a semiconductor device in which a short circuit between an oscillator and a semiconductor substrate is prevented, the semiconductor device being capable of suppressing an increase of fabrication steps, and a method of fabricating the semiconductor device. The semiconductor device includes: a semiconductor substrate, in which a recessed portion is formed on an upper surface, and a semiconductor layer is exposed to a bottom surface of the recessed portion; an oscillator that has a beam-type movable electrode arranged in the recessed portion, the movable electrode having insulating films arranged on side surfaces and lower surface thereof, and is fixed to the semiconductor substrate at a position apart from the movable electrode; and a beam-type fixed electrode that is arranged in the recessed portion so as to be opposed to the movable electrode, and is fixed to the semiconductor substrate so as to be electrically isolated from the movable electrode.12-23-2010
20110163638PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, AND OSCILLATOR - A package manufacturing method capable of easily manufacturing a penetration electrode-attached base board having excellent shape accuracy with a high degree of flatness without forming cracks or the like is provided. The package manufacturing method includes an insertion hole forming step of forming insertion holes in one surface of a base board wafer so as not to penetrate through the base board wafer; a core portion insertion step of inserting conductive core portions made of a metal material into the insertion holes; a welding step of heating the base board wafer to a temperature higher than the softening point of the glass material so as to weld the base board wafer to the core portions while holding the one surface side of the base board wafer with a receiving mold and pressing the other surface of the base board wafer with a flat pressurizing mold; a cooling step of cooling the base board wafer; and a polishing step of polishing both surfaces of the base board wafer.07-07-2011
20120200198Surface-Mount Piezoelectric Device - The present invention provides piezoelectric surface mount devices in which the area of the mounting terminals is reduced, leading to reduction of manufacturing cost. A piezoelectric device comprises a package base (08-09-2012
20100117491PACKAGING FOR PIEZOELECTRIC RESONATOR - The invention concerns an assembly comprising a piezoelectric resonator (05-13-2010
20110095656PIEZOELECTRIC OSCILLATOR AND MANUFACTURING METHOD THEREOF - A piezoelectric oscillator includes: a package including a floor surface and a step portion thereinside; a conductive adhesive applied on the step portion; and a piezoelectric vibrator including one end placed on the step portion via the conductive adhesive. The floor surface is provided with a recess filled with a resin material having a thermal deformation property. The package includes a sidewall having transparency.04-28-2011
20100213794Piezoelectric Resonator Device and Method for Manufacturing the Same - With a crystal vibrator, a package (housing) is produced by joining a base to a lid, and an internal space is formed within this package. A crystal resonator plate is held on the base in this internal space, and the internal space of the package is sealed airtight. In placing the crystal resonator plate on the base, the +X axial direction of the crystal resonator plate within the internal space is set.08-26-2010
20100060108ELECTRONIC COMPONENT FOR SURFACE MOUNTING - An electronic component, which is surface-mounted on a wiring board by soldering, and in which the occurrence of cracks in the solder after surface-mounting is suppressed, may include: a member constituting at least part of a container and made of ceramic; and an external terminal provided on the outer surface of the member and used in surface-mounting the electronic component on the wiring board by solder. The film thickness of a layer constituting the external terminal is designed so that when the thermal expansion coefficient of the ceramic constituting the member is α03-11-2010
20110187236PIEZOELECTRIC RESONATOR PLATE, AND PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves. Also, the piezoelectric resonator plate is electrically and mechanically bonded with the support member via the piezoelectric resonator plate bonding member in an area of the piezoelectric resonator plate using ultrasonic waves.08-04-2011
20110187235PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING SAME - Methods are disclosed for manufacturing piezoelectric devices. In an exemplary method, a base wafer is prepared that defines an array of multiple bases. Between each base on the wafer is a through-hole defined in respective parts by the respective edge surfaces of adjacent bases. A piezoelectric wafer is prepared that defines an array of multiple piezoelectric frames each having a piezoelectric vibrating piece and a surrounding frame portion. The vibrating piece includes an excitation electrode and extraction electrode. The extraction electrode extends to the through-hole. An adhesive is applied to a surface of the frame portion including a surface of the extraction electrode. The adhesive bonds the piezoelectric wafer to the base wafer. Excess adhesive is removed from the through-hole to expose a portion of the extraction electrode in the through-hole. An external electrode is formed on the outer surface of the base and extends to the through-hole in which the external electrode covers the edge surface of the through-hole, an edge surface of the adhesive, and the exposed portion of the extraction electrode.08-04-2011
20100019623MICRO-ELECTROMECHANICAL DEVICES AND METHODS OF FABRICATING THEREOF - An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity between the second and third layers. An electromechanical active element is provided on an outer surface of at least one of the second or third layers.01-28-2010
20090174292VIBRATING GYROSENSOR - A vibrating gyrosensor includes a support substrate on which a wiring pattern having lands is formed. A vibrating element is mounted on a surface of the support substrate. The vibrating element includes a base part having a mounting surface on which a number of terminals connectable to the lands is formed. A vibrator part integrally projects from a side of the base part and has a substrate-facing surface coplanar with the mounting surface of the base part. The vibrator part has a first electrode layer, a piezoelectric layer, and a second electrode layer which are laminated on the substrate-facing surface. The vibrator part vibrates when an AC signal is applied between the first and second electrode layers. The central electric field strength of the AC signal is set at a position shifting to the positive direction from the center of a hysteresis loop of the piezoelectric layer.07-09-2009
20080203854Ground Insulated Piezoelectric Sensor for the Measurement of Acceleration of Pressure - The invention describes a sensor comprising an element package 08-28-2008
20120098390PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING PIEZOELECTRIC SUBSTRATES USED IN SUCH DEVICES - In a piezoelectric device, a piezoelectric substrate includes a vibrating piece with respective excitation electrodes on each principal surface thereof. The piezoelectric substrate is surrounded by an outer frame separated therefrom by a through-void except for a supporting portion connecting the vibrating piece to the frame. Extraction electrodes extend from the excitation electrodes across the supporting portion to the frame, and on edge surfaces of the supporting portion. The piezoelectric substrate is sandwiched between a lid and a package base to form a piezoelectric device. The outer surface of the package base is a mounting surface to which the extraction electrodes extend via an edge surface of the through-void in a region that does not overlap the excitation electrode.04-26-2012
20120098389METHOD FOR MOUNTING A PIEZOELECTRIC RESONATOR IN A CASE AND PACKAGED PIEZOELECTRIC RESONATOR - The invention concerns a method for mounting a piezoelectric resonator (04-26-2012
20110109204Piezoelectric Element and Audio Device - A piezoelectric element including a plurality of stacked piezoelectric sheets, wherein the stretching axis of a first piezoelectric sheet and the stretching axis of a second piezoelectric sheet of the plurality of piezoelectric sheets are oriented in different directions from each other. Preferably, the stretching axis of the first piezoelectric sheet and the stretching axis of the second piezoelectric sheet are intersected at an angle of 90 degrees.05-12-2011
20120062072Method of fabricating crystal unit, crystal unit fabrication mask, and crystal unit package - A method of fabricating a crystal unit fills an adhesive from a first opening in a front surface of a mask of each of penetration holes in the mask in a state in which the mask is set on a base, into each penetration hole, and heats, by a heating element, a sidewall region defining a second opening in a back surface of the mask, in order to cure a sidewall part of the adhesive in the sidewall region defining each penetration hole in contact with the adhesive filling each penetration hole. A crystal blank is bonded on the base using the adhesive in order to form the crystal unit, after removing the mask from the base.03-15-2012
20130009519PIEZOELECTRIC THIN-FILM ELEMENT AND PIEZOELECTRIC THIN-FILM DEVICE - There is provided a piezoelectric thin film element, comprising: a substrate 01-10-2013
20110089787POLYMER ACTUATOR AND DEVICE EQUIPPED WITH POLYMER ACTUATOR - Provided is a polymer actuator including: an electrolyte layer; and a pair of electrodes provided on both surfaces of the electrolyte layer in the thickness direction, wherein the polymer actuator is deformed when a voltage is applied across the pair of electrodes, and wherein the polymer actuator includes a support portion and a deformation portion, and the gap between the electrodes in the support portion is larger than the gap between the electrodes in the deformation portion.04-21-2011
20120248940PIEZOELECTRIC DEVICE AND MANUFACTURING METHOD OF PIEZOELECTRIC DEVICE - A piezoelectric device, in which one of a first plate, a second plate, and an adhesive agent is colored for confirming a bonding status of the adhesive agent, and a manufacturing method thereof, are provided. A piezoelectric device includes a piezoelectric vibrating piece that vibrates by applying a voltage; a first plate and a second plate formed of glass and seal the piezoelectric vibrating piece; and an adhesive agent which bonds the first plate with the second plate, wherein one of the first plate, the second plate, and the adhesive agent is colored.10-04-2012
20120161585COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING THE COMPOSITE SUBSTRATE - In a composite substrate, a back surface of a piezoelectric substrate and a front surface of a support substrate are bonded to each other with an adhesive layer. The adhesive layer includes a swelling portion at an outer peripheral area thereof, and the piezoelectric substrate is bonded to the support substrate in an area excluding the swelling portion 06-28-2012
20110181153PIEZO-RESISTIVE MEMS RESONATOR - A piezo-resistive MEMS resonator comprising an anchor, a resonator mounted on the anchor, an actuator mounted to apply an electrostatic force on the resonator and a piezo-resistive read-out means comprising a nanowire coupled to the resonator.07-28-2011
20120169182AT-CUT QUARTZ-CRYSTAL VIBRATING PIECES AND DEVICES, AND METHODS FOR MANUFACTURING SAME - AT-cut quartz-crystal vibrating pieces and corresponding quartz-crystal devices are disclosed each having a vibrating portion surrounded by a frame portion across a through-slot configured to provide a wide vibrating portion. An exemplary vibrating piece has a quartz-crystal vibrating portion that vibrates when electrically energized, a frame portion surrounding the vibrating portion, and a through-slot defined between the vibrating portion and the frame portion. The through-slot includes a first through-slot extending in the X-axis direction along +Z′-edge of the vibrating portion, and a second through-slot extending in the X-axis direction along the −Z′-edge of the vibrating portion. The first through-slot has a different width than the second through-slot.07-05-2012
20080315726Receiving Sleeve for an Actuator Body - The invention relates to a receiving sleeve (12-25-2008
20120212106METAL PASTE FOR SEALING, HERMETIC SEALING METHOD FOR PIEZOELECTRIC ELEMENT, AND PIEZOELECTRIC DEVICE - The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 μm to 1.0 μm and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.08-23-2012
20120176004QUARTZ-CRYSTAL DEVICES EXHIBITING REDUCED ELECTRICAL IMPEDANCE - Quartz-crystal vibrating devices are disclosed, including vibrating and frame portions separated by a through-slot. An edge surface of the slot has a protrusion preventing unwanted formation of artifact “electrodes.” The vibrating portion and frame are made of AT-cut quartz as a unit. A joining portion couples the frame and vibrating portion together across the through-slot. A package base has two external electrodes. A third frame region has first and second plane surfaces. The protrusion projects toward the vibrating portion and has first and/or second sloped surfaces. First and second extraction electrodes extend from respective excitation electrodes via respective joining portions to respective external electrodes. The extraction electrodes pass across the first plane surface and first sloped surface or across the second plane surface and second slanted surface.07-12-2012
20120074818SYSTEMS HAVING INTEGRATED MECHANICAL RESONATING STRUCTURES AND RELATED METHODS - Devices including integrated components are described. The components may be integrated by being formed on a single substrate. The components may be integrated by being formed on separate chips within a multi-chip module. The components being integrated may include mechanical resonating structures, which in some instances may be piezoelectric mechanical resonating structures.03-29-2012
20120262030SEALING MEMBER FOR PIEZOELECTRIC RESONATOR DEVICE, AND PIEZOELECTRIC RESONATOR DEVICE - A sealing member is for a piezoelectric resonator device that includes a piezoelectric resonator piece and a plurality of sealing members hermetically sealing a resonance region of the piezoelectric resonator piece. The sealing member includes a base material having one principal surface and includes a protruding portion on the one principal surface. The base material has another principal surface having a flat surface and a curved surface. The flat surface is a region corresponding to the protruding portion. The curved surface is a region other than the region of the flat surface. The sealing member includes a plurality of external terminals on the flat surface. The plurality of external terminals are to be connected to an external circuit board. The sealing member includes a plurality of inspection terminals on the curved surface. The plurality of inspection terminals is configured to inspect the piezoelectric resonator piece.10-18-2012
20120299448APPARATUS FOR PROVIDING HAPTIC FEEDBACK - Disclosed is an apparatus used in an electronic device for providing haptic feedback. The apparatus includes a main board defining a mounting surface, a vibration unit mounted on the mounting surface of the main board, the vibration unit being capable of vibrating along a direction parallel to the mounting surface and defining at least two fastening portions at two distal ends thereof. At least two screws are provided to fix the vibration unit on the main board through the fastening portions along a direction perpendicular to the mounting surface.11-29-2012
20110037350PIEZOELECTRIC ACTUATOR MODULE HAVING CABLE BUSHINGS, AND METHOD FOR THE PRODUCTION THEREOF - The invention relates to a piezoelectric actuator module having cable bushings for a piezoelectric actuator, and a piezoelectric actuator module produced in such a manner. Piezoelectric elements are disposed between an actuator head and an actuator base. Insulated extending conductors and feed cables are present in the ceramic actuator base for the electric contacting of the piezoelectric elements via exterior electrodes. During a sintering process for the ceramic actuator base, the electrically conductive inserts are sintered into the actuator base as conductors in an electrically insulating manner. The conductors are electrically connected to contact points on the piezoelectric elements having the exterior electrodes, and via further contact points to feed cables for the piezoelectric actuator module.02-17-2011
20120267986DUAL-FREQUENCY ULTRASOUND TRANSDUCER - A dual-frequency ultrasound transducer, comprising a piezo-electric element bonded to a substrate, has two resonant vibration modes: a low frequency mechanical bending resonance mode and a relatively high frequency thickness resonance mode. The low frequency bending resonance mode occurs when the piezo-electric element is excited, in use, by a voltage which includes a low frequency oscillating component. The high frequency thickness resonance mode occurs when the piezo-electric element is excited, in use, by a voltage which includes a relatively high frequency oscillating component. The transducer may include a mounting arrangement, such as a support ring securing the periphery of the substrate to an underlying base layer that enhances the depth of penetration and focus of the ultrasound.10-25-2012
20120326568Apparatus for Providing Haptic Feedback - Disclosed is an apparatus used in an electronic device for providing haptic feedback. The apparatus includes a holder having a pair fastening holes, a piezoelectric vibrator having a first though holes, a terminal with a second though hole mounted on the piezoelectric vibrator and electrically connected to the piezoelectric vibrator, and a pair of fixing portions fixing the terminal and the piezoelectric vibrator on the holder though the second though hole of the terminal, a first though holes of the piezoelectric vibrator and the fastening holes of the holder. The fixing portions fix the terminal and piezoelectric vibrator on the holder, which makes the assembling process much easier.12-27-2012
20120133248PIEZOELECTRIC VIBRATOR ELEMENT, PIEZOELECTRIC MODULE, AND ELECTRONIC DEVICE - A piezoelectric vibrator element includes a vibrating portion that excites thickness-shear vibration, and a peripheral portion that is disposed on the periphery of the vibrating portion and has a thickness thinner than the vibrating portion, the vibrating portion and the peripheral portion being formed in a piezoelectric substrate. A buffering portion and a mount portion are sequentially connected to the peripheral portion. The buffering portion includes a slit formed between the mount portion and the peripheral portion. The mount portion has notches which are formed at both end portions in a direction orthogonal to an arrangement direction of the mount portion, the buffering portion, and the peripheral portion.05-31-2012
20120242194PIEZOELECTRIC RESONATOR ELEMENT, PIEZOELECTRIC RESONATOR, AND ACCELERATION SENSOR - A piezoelectric resonator element includes: a resonating arm extending in a first direction and cantilever-supported; a base portion cantilever-supporting the resonating arm; and an excitation electrode allowing the resonating arm to perform flexural vibration in a second direction that is orthogonal to the first direction. In the piezoelectric resonator element, the resonating arm includes an adjusting part adjusting rigidity with respect to a bend in a third direction that is orthogonal to the first and second directions.09-27-2012
20130181580PIEZOELECTRIC RESONATOR ELEMENT, PIEZOELECTRIC RESONATOR, AND ACCELERATION SENSOR - A piezoelectric resonator element includes: a resonating arm extending in a first direction and cantilever-supported; a base portion cantilever-supporting the resonating arm; and an excitation electrode allowing the resonating arm to perform flexural vibration in a second direction that is orthogonal to the first direction. In the piezoelectric resonator element, the resonating arm includes an adjusting part adjusting rigidity with respect to a bend in a third direction that is orthogonal to the first and second directions.07-18-2013
20120248939METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO WATCH - The present invention reduces the value of a bonding width L of a base substrate and a lid substrate in each piezoelectric vibrator. A plurality of lid substrates 10-04-2012
20130093288THERMALLY OXIDIZED SEED LAYERS FOR THE PRODUCTION OF TEXTURED ELECTRODES AND PZT DEVICES AND METHOD OF MAKING - A method for forming an electrical device having a {100}-textured platinum electrode comprising: depositing a textured metal thin film onto a substrate; thermally oxidizing the metal thin film by annealing to convert it to a rocksalt structure oxide with a {100}-texture; depositing a platinum film layer; depositing a ferroelectric film. An electrical device comprising a substrate; a textured layer formed on the substrate comprising metal oxide having a rocksalt structure; a first electrode film layer having a crystallographic texture acting as a template; and at least one ferroelectric material layer exhibiting spontaneous polarization epitaxially deposited on the first electrode film layer whereby the rocksalt structure of the textured layer facilitates the growth of the first electrode film layer with a {100} orientation which forms a template for the epitaxial deposition of the ferroelectric layer such that the ferroelectric layer is formed with an {001} orientation.04-18-2013
20130093289SIZE-CONTROLLABLE OPENING AND METHOD OF MAKING SAME - A support structure includes an internal cavity. An elastic membrane extends to divide the internal cavity into a first chamber and a second chamber. The elastic membrane includes a nanometric-sized pin hole extending there through to interconnect the first chamber to the second chamber. The elastic membrane is formed of a first electrode film and a second electrode film separated by a piezo insulating film. Electrical connection leads are provided to support application of a bias current to the first and second electrode films of the elastic membrane. In response to an applied bias current, the elastic membrane deforms by bending in a direction towards one of the first and second chambers so as to produce an increase in a diameter of the pin hole.04-18-2013
20130113341ULTRASONIC OSCILLATING DEVICE WITH A DETACHABLE ULTRASONIC OSCILLATING ASSEMBLY - An ultrasonic oscillating device with a detachable ultrasonic oscillating assembly is mounted inside a case having a detachable lid and applied in a humidifier. The ultrasonic oscillating device has a circuit board, a supporting board, a connecting structure and the ultrasonic oscillating assembly. The detachable ultrasonic oscillating assembly is placed between the supporting board and the lid. The connecting structure is mounted on a bottom of the lid and electrically connected to the ultrasonic oscillating assembly and the circuit board. When the ultrasonic oscillating assembly is broken, users easily replace the broken ultrasonic oscillating assembly by the detachable ultrasonic oscillating assembly and the detachable lid of the case, so other unbroken parts remain useful.05-09-2013
20100308697METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO CLOCK - A piezoelectric vibrator includes a base substrate, a lid substrate, a piezoelectric vibrating reed, a pair of external electrodes, a pair of through electrodes, and routing electrodes. The base substrate is made of a glass material and a bonding film is formed on the upper surface of the base substrate. The lid substrate is made of a glass material, includes a recess for a cavity, and is bonded to the base substrate with the bonding film interposed therebetween so that the recess faces the base substrate. The piezoelectric vibrating reed is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between the base substrate and the lid substrate by the recess. The pair of external electrodes is formed on the lower surface of the base substrate. The pair of through electrodes is formed so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively. The routing electrodes are formed on the upper surface of the base substrate, and are electrically connected to the piezoelectric vibrating reed bonded to the pair of through electrodes.12-09-2010
20110234053ELECTROSTRICTIVE STRUCTURE INCORPORATING CARBON NANOTUBES AND ELECTROSTRICTIVE ACTUATOR USING THE SAME - An electrostrictive structure includes a flexible polymer matrix and a carbon nanotube film structure at least partly embedded into the flexible polymer matrix. The carbon nanotube film structure includes a number of carbon nanotubes combined by van der Waals attractive force therebetween. The carbon nanotube film structure extends in a curve in the flexible polymer matrix.09-29-2011
20110234054PIEZOELECTRIC DEVICES INCLUDING ELECTRODE-LESS VIBRATING PORTIONS - An exemplary piezoelectric device has a piezoelectric vibrating board including a portion that exhibits thickness-shear vibration, and a frame portion extending around and supporting the vibrating portion. A first cover board, bonded to the first main surface of the frame portion, has a first excitation electrode. A second cover board, bonded to the second main surface of the frame portion, has a second excitation electrode. Thus, the vibrating portion is sealed in a package formed by the frame portion and cover boards. A first convexity, defined either on the bonded main surface of the first cover board or on the first main surface of the frame portion, surrounds the excitation electrode and establishes a predetermined gap between the vibrating portion and excitation electrode. The first cover board and frame portion are bonded by adhesive applied, adjacent the first convexity but not on the first convexity, continuously around the vibrating portion.09-29-2011
20110291529BONDED GLASS CUTTING METHOD, PACKAGE MANUFACTURING METHOD, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided is a bonded glass cutting method of cutting a bonded glass, in which a plurality of glass substrates is bonded together on bonding surfaces thereof through a bonding material, along an intended cutting line, the method including: a first laser irradiation step of emitting a first laser to irradiate a beam having the absorption wavelength of the bonding material along the intended cutting line to thereby delaminate the bonding material on the intended cutting line from the bonding surfaces; a second laser irradiation step of emitting a second laser to irradiate a beam having the absorption wavelength of the bonded glass along the intended cutting line to thereby form a groove on one surface of the bonded glass; and a cutting step of cutting the bonded glass along the intended cutting line by applying a breaking stress to the intended cutting line of the bonded glass.12-01-2011
20120019106ULTRASONIC ARRAY TRANSDUCER, ASSOCIATED CIRCUIT AND METHOD OF MAKING THE SAME - A transducer system includes a multi-layer flexible circuit. The flexible circuit includes a first layer, a second layer and a third layer. The circuit engages a piezoelectric material/electrode subassembly. Vias are used to operatively connect ground electrodes of individual transducer elements to grounds in the third layer of the circuit. The vias extend through the first and second layers to the third layer of the circuit. When the flexible circuit is diced during the assembly of the transducer system, no cuts are made in the third layer of the circuit. As a result, a common ground connection is maintained by way of the grounds in the third layer of the circuit. Thus, no subsequent operation of reconnecting the common ground electrode is required.01-26-2012
20120086312COMPOSITE SUBSTRATE MANUFACTURING METHOD AND COMPOSITE SUBSTRATE - According to a composite substrate manufacturing method of the present invention, (a) a piezoelectric substrate having minute asperities formed in a rear surface thereof, and a support substrate having a smaller thermal expansion coefficient than the piezoelectric substrate are prepared, (b) a filler is applied to the rear surface 04-12-2012
20130207523PIEZOELECTRIC DEVICE - A piezoelectric device includes a piezoelectric vibrating piece and a base portion in a square shape. The piezoelectric vibrating piece includes a piezoelectric piece, a pair of excitation electrodes, and a pair of extraction electrodes. The base portion includes a pair of connecting electrodes on a first surface at a side of the piezoelectric vibrating piece and a pair of mounting terminals on a second surface. The base portion has short sides facing one another. The short sides include two pairs of castellations depressed toward a center side of the base portion and two pairs of side surface electrodes on the two pairs of castellations. The two pairs of side surface electrodes connect the first surface and the second surface. One pair of the two pairs of side surface electrodes each connect to the pair of connecting electrodes and the pair of mounting terminals.08-15-2013
20130207524MOUNTING STRUCTURE FOR POLYMER ACTUATOR - A movable side mounting portion transmits extension and contraction of a polymer actuator to an electric prosthetic hand. The polymer actuator deforms elastically in accordance with voltage application and returns to its original shape in accordance with stoppage of voltage application. A rear end of the polymer actuator is fixed and a front end of the polymer actuator is movable. When one of a pair of electrodes of the polymer actuator is electrically connected to the fixed side mounting portion, the fixed end is fastened by a bolt to the fixed side mounting portion. Also, when the other electrode is electrically connected to the movable side mounting portion, the movable end is fastened by a bolt to the movable side mounting portion.08-15-2013

Patent applications in class With mounting or support means

Patent applications in all subclasses With mounting or support means