| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 310341000 | With temperature modifier and/or gas or vapor atmosphere control | 89 |
| 20120181902 | ULTRASOUND TRANSDUCER ELEMENT AND METHOD FOR PROVIDING AN ULTRASOUND TRANSDUCER ELEMENT - An ultrasound transducer element includes a piezoelectric layer, a front end body, and a backing layer assembly. The piezoelectric layer extends between opposite front and back sides and is configured to transmit acoustic waves from the front side. The front end is body disposed proximate to the front side of the piezoelectric layer and is configured to emit the acoustic waves out of a housing. The backing layer assembly is disposed proximate to the back side of the piezoelectric layer. The backing layer assembly includes a first thermally conductive mesh disposed in a matrix enclosure. The first thermally conductive mesh is positioned to conduct thermal energy away from the piezoelectric layer. In one aspect, the first thermally conductive mesh is a grid of elongated strands of a metal or metal alloy material oriented in at least one of transverse or oblique directions. | 07-19-2012 |
| 20120326567 | PIEZOELECTRIC VIBRATING DEVICE CAPABLE OF HEAT DISSIPATION AND CONDUCTION - A piezoelectric vibrating device comprises a metallic containing member, a piezoelectric member and a heat dissipating and conducting member. The piezoelectric member is provided within the metallic containing member, and the heat dissipating and conducting member includes a plurality of the heat dissipating and conducting fins. Each the heat dissipating and conducting fin has a first heat conduction connecting end and a second heat conduction connecting end, wherein the first heat conduction connecting end is provided on an external surface of the piezoelectric member, and the second heat conduction connecting end is connected with an inner wall surface of the metallic containing member. The piezoelectric member generates vibrations with specific polarization directions based on a piezoelectric controlling signal, and the heat energy generated from the vibration of the piezoelectric member is conducted to the external wall surface of the metallic containing member through the heat dissipating and conducting member. | 12-27-2012 |
| 20080224570 | Transformer Arrangement Having a Piezoelectric Transformer - A transformer arrangement is specified which includes a piezoelectric transformer with a main body ( | 09-18-2008 |
| 20130134834 | BACKING MEMBER, ULTRASONIC PROBE, AND ULTRASONIC IMAGE DISPLAY APPARATUS - A backing member is provided in an ultrasonic probe on a side of the ultrasonic probe opposite from a transmission direction of an ultrasonic wave to a subject with respect to an ultrasonic vibrator that transmits the ultrasonic wave to the subject. The backing member includes a plate-like backing material, a thermal conductor, and a thermal conductive plate, wherein the thermal conductor and the thermal conductive plate are made of a material having a thermal conductivity higher than a thermal conductivity of the backing material, wherein the thermal conductor is buried in the backing material, and formed to have a columnar shape so as to reach both of two plate surfaces of the backing material, and wherein the thermal conductive plate is provided on at least the plate surface of the backing material that is near the ultrasonic vibrator. | 05-30-2013 |
| 20130113340 | VIBRATION WAVE MOTOR - Provided is a vibration wave motor including: a vibration member having an elastic body joined with a electric-mechanical energy converter; and a moving member contacting the vibration member, the vibration member and the moving member being annularly formed, the vibration wave motor frictionally driving the moving member by a motion generated at a contacting portion with the moving member of the vibration member upon application of an AC signal to the electric-mechanical energy converter. The vibration wave motor includes a centrifugal fan provided at an outer peripheral portion and/or an inner peripheral portion of a circular ring formed of the vibration member and the moving member, and the centrifugal fan rotates integrally with the moving member. | 05-09-2013 |
| 310342000 | For plural piezoelectric elements | 1 |
| 20100327700 | VIBRATING ELEMENT APPARATUS - The invention describes a vibrating element apparatus, preferably a tuning fork liquid level transducer, and a method of forming the same, which is particularly suitable form operation in environments subject to prolonged operation at markedly different temperatures. A piezoelectric stack, which generates vibration of the tines, is located within a hollow body defined by a diaphragm, from which the tines extend, and a wall section. Associated with the stack are a pair of thermal compensating elements which expand or contract as the apparatus is subjected to differing temperatures. The thermal compensating elements are selected and sized, having regard to the stack components, so that the stack and thermal compensating elements expand and contract to substantially the same amount as the structure in which the stack is supported. | 12-30-2010 |
| 310343000 | With heating element | 1 |
| 20110175492 | Temperature Compensation Device and Method for MEMS Resonator - The present disclosure provides a device including a MEMS resonating element, provided for resonating at a predetermined resonance frequency, the MEMS resonating element having at least one temperature dependent characteristic, a heating circuit arranged for heating the MEMS resonating element to an offset temperature (T | 07-21-2011 |
| 310344000 | Sealed unit | 82 |
| 20100117489 | PACKAGE-TYPE PIEZOELECTRIC RESONATOR AND METHOD OF MANUFACTURING PACKAGE-TYPE PIEZOELECTRIC RESONATOR - It is an object of the present invention to provide a package-type piezoelectric resonator which can be packaged at a wafer stage and is suitable for mass production. | 05-13-2010 |
| 20100117490 | Method of manufacturing piezoelectric resonator, piezoelectric resonator, and electronic component - To provide a piezoelectric resonator in which a casing houses a tuning-fork piezoelectric resonator element and whose failure occurrence caused when shavings of adjustment films scatter and adhere to excitation electrodes is prevented. In a method of manufacturing a quartz-crystal resonator in which a casing | 05-13-2010 |
| 20130043770 | PIEZOELECTRIC VIBRATING PIECE AND PIEZOELECTRIC DEVICE - A piezoelectric vibrating piece includes a vibrator in a rectangular shape, a framing portion, and one connecting portion. The vibrator includes a first side and a pair of second sides. The first side extends in a first direction. The second sides extend in a second direction perpendicular to the first direction. The framing portion surrounds the vibrator across a void. The one connecting portion connects the first side of the vibrator and the framing portion together. The one connecting portion has a predetermined width in the first direction. The one connecting portion extends in the second direction. | 02-21-2013 |
| 20130043771 | MESA-TYPE QUARTZ-CRYSTAL VIBRATING PIECE AND QUARTZ CRYSTAL DEVICE - A mesa-type quartz-crystal vibrating piece includes a vibrator in a quadrangular shape with both main surfaces, a pair of excitation electrodes on both the main surfaces, a thin portion outside of the quadrangular shape, and a pair of extraction electrodes. The thin portion has a thickness thinner than a thickness of the vibrator. The pair of extraction electrodes are extracted from the excitation electrodes to a predetermined direction. A center of a first length in the predetermined direction of the excitation electrode is decentered from a center of a second length in the predetermined direction. The second length includes a length of the vibrator and a length of the thin portion. The center of the first length is decentered toward an opposite side of the extraction electrode by 25 μm to 65 μm. | 02-21-2013 |
| 20100109483 | Piezoelectric Component and Method for Manufacturing Same - Disclosed is a piezoelectric component ( | 05-06-2010 |
| 20130049542 | OSCILLATION DEVICE AND METHOD FOR MANUFACTURING OSCILLATION DEVICE - An oscillation device which contributes to the demand for downsizing/miniaturization and commercial production, and provides highly reliable oscillation frequency is provided. The oscillation device includes a base substrate provided with an oscillation member, a lid member that contains the oscillation member in a cavity, an adhesion layer that has a first melting point and connects the base substrate with the lid member, and a metal layer that has a second melting point higher than the first melting point and covers the base substrate, the adhesion layer and the lid member. | 02-28-2013 |
| 20120223622 | VIBRATING DEVICE, METHOD FOR MANUFACTURING VIBRATING DEVICE, AND ELECTRONIC APPARATUS - A sensor device includes a substrate, an IC chip, a sensor element, bonding wires, and a lid. The substrate includes a plurality of metal posts which are disposed so as to be electrically independent of each other and an insulator which is filled in a gap between faces different from first faces and second faces of the plurality of metal posts and integrally fixes the plurality of metal posts. The IC chip has electrode pads on an active face and is fixed to a first metal post. The sensor element has vibrating portions and is supported by the IC chip by bonding a supporting portion to the active face of the IC chip. The bonding wires electrically connect the electrode pads with second metal posts. The lid is disposed so as to cover the IC chip and the sensor element. | 09-06-2012 |
| 20130063001 | PIEZOELECTRIC DEVICE AND METHOD OF MANUFACTURING PIEZOELECTRIC DEVICE - A piezoelectric device includes: a rectangular piezoelectric element formed of a piezoelectric material, the piezoelectric element having a rectangular excitation portion having an excitation electrode, a frame surrounding a circumference of the excitation portion, a connecting portion connecting one side of the rectangular excitation portion and the frame with a predetermined width; a base plate having a mounting face where a pair of external electrodes electrically connected to the excitation electrode are formed and a base bonding face bonded to one of principal faces of the frame; a lid plate bonded to the other principal face of the frame; and a bonding material for bonding the base plate, the frame, and the lid plate, wherein a trench having a length equal to or more than the predetermined width of the connecting portion is formed in at least one of the frame, the base plate, and the lid plate. | 03-14-2013 |
| 20120235542 | PIEZOELECTRIC DEVICE - To facilitate positioning of an external terminal and ensure sufficient solder joint strength at the time of mounting a piezoelectric device on a mounting board by soldering. In a crystal device of the present invention, an external terminal is formed, for example, at four corners on an external bottom surface of a base having a rectangular shape as seen in a plan view, and the external terminals include two active terminals arranged opposite to each other on a diagonal line, and two ground terminals arranged opposite to each other on another diagonal line crossing the diagonal line. An arbitrary sign, character, or figure is marked on a mounting surface of at least one ground terminal of external terminals to determine the direction of the active terminal. | 09-20-2012 |
| 20120229002 | PIEZOELECTRIC VIBRATING PIECE AND PIEZOELECTRIC DEVICE - A piezoelectric vibrating piece and a piezoelectric device are provided, in which the deterioration of the vibrating characteristics of a vibrating portion is prevented. The piezoelectric vibrating piece comprises a rectangular-shaped first surface having a long side and a short side; a second surface opposing the first surface; and side surfaces, connecting the first surface and the second surface. The piezoelectric vibrating piece further comprises a first excitation electrode formed on a central part of the first surface; a first extraction electrode extracted from the first excitation electrode to an outer peripheral portion of the second surface via only the side surface at the short side; a second excitation electrode formed on the second surface opposite to the first excitation electrode; and a second extraction electrode extracted from the second excitation electrode to the outer peripheral portion of the second surface. | 09-13-2012 |
| 20110278992 | FLEXURAL RESONATOR ELEMENT AND FLEXURAL RESONATOR FOR REDUCING ENERGY LOSS DUE TO HEAT DISSIPATION - A flexural resonator element includes a base body and a beam with a groove and a through-hole, the beam being extended in a Y direction from the base body and flexurally vibrating in an X direction orthogonal to the Y direction, the groove being formed on a surfaces of the beam perpendicular to a Z direction orthogonal to the X direction and the Y direction, and the through-hole having a smaller width in the X direction than a width of an opening of the groove in the X direction and penetrating from an inner surface of the groove formed on the surface of the beam to a surface of the beam opposite to the surface of the beam having the groove. | 11-17-2011 |
| 20110285250 | PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR MOUNTING BODY, AND PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD - This piezoelectric vibrator is provided with a package that is structured to include a first substrate and a second substrate that are bonded to each other such that a cavity is formed therebetween, an internal electrode portion that is formed on the first substrate and housed in the cavity, a piezoelectric vibrating reed that is sealed in the cavity and also is electrically connected to the internal electrode portion in the cavity, an external electrode portion that is formed on an external surface of the first substrate, a through electrode portion that is disposed so as not to be overlapped by the external electrode portion in a thickness direction of the first substrate, while one end of the through electrode portion is electrically connected to the internal electrode portion and another end of the through electrode portion is formed on the external surface of the first substrate while penetrating through the first substrate, and a routing wiring portion that electrically connects the through electrode portion and the external electrode portion. | 11-24-2011 |
| 20110316391 | TUNING-FORK-TYPE PIEZOELECTRIC VIBRATING PLATE AND PIEZOELECTRIC DEVICE - A tuning-fork-type piezoelectric vibrating plate with a suppressed CI value and a piezoelectric device using thereof are provided. The tuning-fork-type piezoelectric vibrating plate includes: a base section formed by a piezoelectric material; and a pair of vibrating arms extended from the base section along a predetermined direction. On a front surface and a back surface of the vibrating arms, a first excitation groove is formed at the base section side, a second excitation groove is formed at a tip side of the vibrating arms, and a partition section is formed to separate the first excitation groove from the second excitation groove. A length from the base section side of the first excitation groove to the tip side of the second excitation groove in the predetermined direction is L | 12-29-2011 |
| 20110316390 | PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME - An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized. A first package plate has a main recess in which the piezoelectric vibrating piece is placed, and a peripheral surface surrounding the recess. A second package plate is bonded to the peripheral surface of the first package plate in airtight manner. A band of adhesive bonds the first package plate to the second package plate. The adhesive band surrounds the peripheral surface. Between the adhesive and the main recess is a band of metal film. The band of metal film prevents gas, generated from the adhesive, from flowing into the recess. The band of metal film surrounds the peripheral surface and is disposed inboard of the band of adhesive. | 12-29-2011 |
| 20110291528 | PIEZOELECTRIC DEVICES EXHIBITING ENHANCED RESISTANCE TO PHYSICAL IMPACTS AND MOISTURE INCURSION - An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized, a first package plate, and a second package plate. The first package plate has a respective inner main surface defining a recess. The recess has volume and dimensions sufficient to contain at least a portion of the piezoelectric vibrating piece. The inner main surface includes a peripheral main surface that peripherally extends around the recess. The second package plate has respective inner and outer main surfaces. The inner main surface is bonded to the peripheral main surface of the first package plate using a sealing material that thus seals the piezoelectric vibrating piece inside a package formed of the first and second package plates. The sealing material includes multiple concentric bands of sealing glass and multiple concentric bands of adhesive. The sealing-glass bands and the adhesive bands circumscribe the recess and desirably are in alternating order from in to out to provide durable seals. | 12-01-2011 |
| 20100033061 | PIEZOELECTRIC DEVICES - In the disclosed piezoelectric devices a piezoelectric frame includes a vibrating piece. An excitation electrode is formed on the vibrating piece. An outer frame portion surrounds the vibrating piece and includes an extraction electrode connected to the excitation electrode. A package base is bonded to one surface of the outer frame portion and includes a connection electrode connected to the extraction electrode. The package base includes an external terminal formed on a surface thereof opposite the surface on which the connection electrodes are formed. Through-hole conductors connected the connection electrodes with respective external terminals. A lid is bonded to an opposing surface of the piezoelectric frame. An exhaust channel is in communication with the extraction electrode adjacent the through-hole conductors. | 02-11-2010 |
| 20110266924 | CRYSTAL MICROBALANCE HOLDER - A piezoelectric element holder allows a piezoelectric crystal to be mounted with a single exposed surface. This permits more accurate estimates of applied coating weights and thicknesses to be obtained. The piezoelectric element is mounted via a removable cap and malleable seal that permit the element to be removed and replaced easily. | 11-03-2011 |
| 20090152992 | AIRTIGHT TERMINAL - To provide an airtight terminal and a piezoelectric vibrator having a strong rigidity of a lead despite a small-sized constitution, and provide a method of fabricating an airtight terminal constituting a lead penetrating inside of a stem by one piece and a piezoelectric vibrator with an excellent yield. A stem | 06-18-2009 |
| 20090152991 | Ferroelectric Durability - A piezoelectric actuator for use in a fuel injection system of an internal combustion engine, the actuator comprising a stack of ferroelectric layers; an encapsulation for protecting the stack from the ingress of liquid; and oxygenation means for providing oxygen to the ferroelectric layers, the means positioned between the encapsulation and stack. The oxygenation means is preferably impregnated in a fabric which forms a layer between the encapsulation and the stack. | 06-18-2009 |
| 20120293048 | PIEZOELECTRIC DEVICE - A piezoelectric device including a tuning-fork piezoelectric vibrating element having a base and a pair of vibrating arms positioned parallel to each other and extending from the base at right angles. The piezoelectric device further including a pair of support arms extending from the base positioned parallel to each other and in the same direction as the vibrating arms. A package is included having a lid and a housing recess sealed by the lid wherein the tuning-fork piezoelectric vibrating element is housed. A pair of supports are provided on a bottom face of the housing recess for fixing the tuning-fork piezoelectric vibrating element by the support arms. A clearance groove is formed in the bottom face of the housing access to prevent the tuning-fork piezoelectric vibrating element from colliding against the bottom face of the housing recess. | 11-22-2012 |
| 20100102678 | PACKAGE FOR ELECTRONIC COMPONENT, PIEZOELECTRIC DEVICE AND MANUFACTURING METHOD THEREOF - A package for an electronic component includes a first substrate and a second substrate. In the package, an interior space capable of housing the electronic component is formed between the first substrate and the second substrate, a sealing hole communicating with the interior space and an exterior is formed in at least one of the first substrate and the second substrate, the interior space can be airtightly sealed by melting a solid sealant provided in the sealing hole, and an interior wall of the sealing hole has a curved surface extending in directions of penetration and inner periphery of the sealing hole. | 04-29-2010 |
| 20110221310 | METHOD OF MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - Provided are a method of manufacturing a package capable of forming a penetration electrode without conduction defects while maintaining the airtightness of a cavity, a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. A penetration electrode forming step includes: a penetration hole forming step of forming a penetration hole in a base substrate wafer (first substrate); a first paste material filling step of filling a first paste material in the penetration hole and temporarily drying the first paste material; and a second paste material filling step of filling a second paste material in the penetration hole so as to be overlapped on the first paste material. The first paste material has a viscosity lower than the second paste material. | 09-15-2011 |
| 20110221309 | Piezoelectric resonator and method of manufacturing piezoelectric resonator - To provide a piezoelectric resonator that suppresses spread of a conductive adhesive and is low in cost and a method of manufacturing a piezoelectric resonator. At positions, of a base | 09-15-2011 |
| 20110227457 | PIEZOELECTRIC VIBRATING PIECES AND DEVICES, AND METHODS FOR MANUFACTURING SAME - Piezoelectric vibrating pieces are disclosed having selectively roughened surfaces. An exemplary piece is made of a piezoelectric material configured as a piezoelectric substrate. The piece also includes at least one excitation electrode and at least one extraction electrode. The substrate has opposing main surfaces initially having low surface roughness. At least one main surface is formed in a mesa or reverse mesa manner, wherein the central region has a different thickness than the peripheral region. The central region has relatively low surface roughness (irregular unevenness), while the peripheral region has relatively high surface roughness. The excitation electrode is formed on the central region (mesa or reverse mesa) while the extraction electrode (connected to the excitation electrode) is formed on the peripheral region. | 09-22-2011 |
| 20090015106 | Piezoelectric device - [Object] To provide a piezoelectric device having excellent drive level characteristics in terms of downsizing, having no remaining stress at the bonding portion of the container and leaving no characteristics deteriorating factors. | 01-15-2009 |
| 20110227458 | PIEZOELECTRIC RESONATOR ELEMENT, PIEZOELECTRIC DEVICE, AND ELECTRONIC APPARATUS - A piezoelectric resonator element and a piezoelectric device, which prevent the vibration of the resonating arm section from leaking to the side of the base portion and stabilize the vibration of the resonating arm section, and an electronic apparatus using these devices are obtained. The quartz crystal resonator element as the piezoelectric resonator element is provided with a base portion formed of a piezoelectric material, a plurality of resonating arm sections each extending from the base portion via an arm base section, and an elongated groove section formed along a longitudinal direction of the resonating arm section, and the arm base section has an arm width, which is larger than an arm width of the resonating arm section and smaller than a distance between imaginary centerlines of the respective resonating arm sections in a width direction of the resonating arm section. | 09-22-2011 |
| 20090140611 | QUARTZ CRYSTAL VIBRATOR, OSCILLATOR AND ELECTRONIC APPARATUS - To provide a quartz crystal vibrator, an oscillator and an electronic apparatus capable of preventing a bonding electrode from being corroded and easily maintaining soundness of the bonding electrode over a long period of time, a quartz crystal vibrator is provided with a quartz crystal vibrating plate formed by surrounding a quartz crystal vibrating piece by a frame-like portion, a hermetically closed vessel including a lid member and a base member in a plate-like shape for interposing the quartz crystal vibrating plate in a thickness direction, bonding electrodes provided between the lid member and the quartz crystal vibrating plate and between the base member and the quartz crystal vibrating plate and electrically connected to an inner electrode, and a protecting film for protecting the bonding electrode, provided with a recess portion recessed to an inner side of the hermetically closed vessel from an outer edge portion between the lid member and the quartz crystal vibrating plate and an outer edge portion between the base member and the quartz crystal vibrating plate, the protecting film is provided at the recess portion and the bonding electrode is disposed on the inner side of the recess portion. | 06-04-2009 |
| 20100156246 | Piezoelectric frames and piezoelectric devices comprising same - Piezoelectric frames are disclosed that include a tuning-fork type piezoelectric vibrating portion having a pair of vibrating arms extending from a base portion in a first direction (Y-direction). The vibrating arms have a first width W | 06-24-2010 |
| 20120032563 | Mesa-Type At-Cut Quartz-Crystal Vibrating Piece and the Quartz-Crystal Device - The present disclosure provides a mesa-type AT-cut quartz-crystal vibrating piece, in which amount of the vibrating unit is adjusted to appropriate amount, in order to inhibit unnecessary vibration and to prevent degradation. The mesa-type AT-cut quartz-crystal vibrating piece ( | 02-09-2012 |
| 20110057549 | FLEXURAL VIBRATION PIECE, FLEXURAL VIBRATOR, AND ELECTRONIC DEVICE - A flexural vibration piece includes a base, and a vibrating arms extending therefrom, each pair of vibrating arms has a first groove formed in the extension direction of the vibrating arm in one main surface following the direction in which the pair of vibrating arms are aligned, and a second groove formed side by side to the first groove in another main surface, the sum of the depths of the first and second groove portions is greater than the interval between the one main surface and the other main surface, and a mass portion is provided on each of the pair of vibrating arms, on the one main surface which is the opening side of the first grooves formed toward the outer sides opposite the inner sides on which the vibrating arms face each other. | 03-10-2011 |
| 20110234052 | QUARTZ-CRYSTAL DEVICES AND METHODS FOR MANUFACTURING SAME - Methods are disclosed for manufacturing quartz-crystal devices. In an exemplary method three wafers are prepared. One is a quartz-crystal wafer defining multiple quartz-crystal pieces; a second is a wafer defining multiple package bases; and a third is a wafer defining multiple lids for the package bases. Each quartz-crystal piece has a respective excitation portion that vibrates when electrically energized and a respective frame portion surrounding the excitation portion. The quartz-crystal wafer has main surfaces that are lapped and polished to mirror-finish them. The base wafer defines multiple package bases each having a floor surface, a bonding surface surrounding the floor surface, and a lower main surface. The lid wafer defines multiple lids each having a ceiling surface, a bonding surface surrounding the ceiling surface, and a upper main surface. The quartz-crystal wafer is sandwiched between the base and lid wafers. The wafers are bonded together by bonding respective main surfaces of the frame portion to respective bonding surfaces. At least two of the upper main surface, lower main surface, floor surface, and ceiling surface are rougher than the surfaces of the excitation portion. | 09-29-2011 |
| 20100308696 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO CLOCK - There is provided a piezoelectric vibrator | 12-09-2010 |
| 20100308695 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CLOCK - There is provided a piezoelectric vibrator | 12-09-2010 |
| 20110241491 | SURFACE-MOUNTABLE QUARTZ-CRYSTAL DEVICES AND METHODS FOR MANUFACTURING SAME - In an exemplary method for making crystal vibrating devices, four wafers are provided: a crystal wafer, a base wafer, a first-lid wafer, and a second-lid wafer. The crystal wafer defines multiple crystal vibrating pieces including respective frames and respective electrodes formed on both main surfaces thereof. The base wafer defines multiple base plates bondable to one main surface of respective frames. The first-lid wafer defines multiple first lids bondable to the other main surface of the respective frames. Each first lid defines a void registrable with respective electrodes. The second-lid wafer is sized similarly to and bondable to the first-lid wafer so as to sealably close the voids. In a first bonding step the crystal wafer is bonded to the base wafer and first-lid wafer. In a subsequent adjustment step the thickness of at least one electrode per each crystal vibrating piece is adjusted to adjust the vibrational frequency of the respective vibrating portion. Thickness adjustment occurs through the respective voids. In a second bonding step, the second-lid wafer is bonded to the first-lid wafer. The resulting wafer sandwich is cut up into individual quartz crystal devices. | 10-06-2011 |
| 20120032562 | At-Cut Quartz-Crystal Device and Methods for Manufacturing Same - The present disclosure provides a manufacturing method of a quartz-crystal device, in which its lid and base is manufactured with smaller thermal expansion coefficient between AT-cut quartz-crystal wafer. The method for manufacturing a quartz-crystal device comprises the steps of: preparing an AT-cut quartz-crystal wafer ( | 02-09-2012 |
| 20110210649 | CRYSTAL RESONATOR FOR SURFACE MOUNTING - The crystal resonator for surface mounting includes: a single-layer base substrate, including a pair of crystal holding terminals on a major face; a crystal piece, including an excitation electrode on two major faces, and electrically and mechanically connected to the crystal holding terminals; and a concave metal cover, including an opening end face bonded to an outer peripheral surface of the base substrate through curing of a liquid resin. The end face electrode is electrically connected through an electrically conducting path of the outer peripheral surface extended from the crystal holding terminals, and the crystal resonator for surface mounting is disposed as a structure that includes an end face region of two positions at least being opposite to the electrically conducting path in the opening end face of the metal cover spaced from a front end of a protruding portion through the protruding portion disposed on the opening end face. | 09-01-2011 |
| 20110133605 | PIEZOELECTRIC DEVICE - A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view. | 06-09-2011 |
| 20100181872 | PIEZOELECTRIC VIBRATOR - A piezoelectric oscillator is provided, which has a through electrode providing reliable conduction between a piezoelectric vibrating piece and an external electrode with rare occurrence of a large stress caused by temperature variation in processing or deformation of a mounted base substrate, while the hermeticity of a cavity is maintained. A piezoelectric oscillator having a piezoelectric vibrating piece sealed in a cavity defined between a base substrate and a lid substrate includes a through electrode disposed in a through hole penetrating through the base substrate, and the through electrode has a glass frit filled in the through hole and fired and a core formed of a material containing only iron and nickel and disposed in the through hole together with the glass frit. The values of the thermal expansion coefficients of the base substrate, the glass frit, and the core are set as: base substrate glass≧frit>core. | 07-22-2010 |
| 20110068659 | PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME - Methods are disclosed for manufacturing piezoelectric vibrating devices. An exemplary method includes preparing a base wafer defining multiple bases each including stripes of a first bonding film extending along respective edges of the bases and first indents adjacent to and contacting respective stripes of the first bonding film. Also prepared is a lid wafer defining multiple lids each including stripes of a second bonding film extending along respective edges of the lids and second indents adjacent to and contacting respective stripes of the second bonding film. A unit of bonding material (e.g., a bonding “ball”) is applied to each of the first indents or to each of the second indents. Bonding together the base wafer and lid wafer is completed by melting the bonding material to flow the bonding material along the stripes, followed by solidifying the bonding material. | 03-24-2011 |
| 20110062825 | PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME - An exemplary piezoelectric device includes a piezoelectric vibrating piece, on which excitation electrodes are formed, and a piezoelectric frame having a frame portion surrounding the piezoelectric vibrating piece. A plate (e.g., lid or base) is bonded to one surface of the frame portion. Fitting members are provided on both the frame and the plate. When the piezoelectric frame and plate are brought together for assembly, the fitting members fit together (e.g., interdigitate) to provide quick and error-free alignment. Then, the fitting members are bonded together by a bonding material. | 03-17-2011 |
| 20110050044 | METHOD FOR MANUFACTURING PACKAGE, METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Providing a method for manufacturing a package capable of improving production efficiency. Providing a method for manufacturing a package including: a base board and a lid board which are bonded to each other; an accommodated article which is sealed in a cavity formed between the base board and the lid board; and a penetration electrode which is disposed in a penetration hole penetrating through the base board so as to electrically connect the accommodated article to the outside, the method including: a penetration hole forming step of forming a penetration hole for the penetration electrodes | 03-03-2011 |
| 20110050047 | GLASS ASSEMBLY CUTTING METHOD, PACKAGE MANUFACTURING METHOD, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Providing a glass assembly cutting method capable of improving yield by cutting a glass assembly into a predetermined size, providing a package manufacturing method, a package and a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic device, and a radio-controlled timepiece. Providing a wafer assembly cutting method of cutting a wafer assembly | 03-03-2011 |
| 20100270891 | SEALING MEMBER OF PIEZOELECTRIC RESONATOR DEVICE AND MANUFACTURING METHOD THEREFOR - A sealing member of a piezoelectric resonator device is configured to hermetically seal a driving electrode formed on a piezoelectric resonator plate. In the sealing member, a through hole is formed so that an electrode pattern formed on both major surfaces of the substrate is brought into conduction; and a conductive member fills in the through hole. The through hole has a smaller diameter at a portion thereof inside the substrate than at both end portions thereof at the major surfaces of the sealing member. Both end faces of the conductive member have a concave shape with respect to the major surfaces of the substrate of the sealing member. | 10-28-2010 |
| 20120032561 | Piezoelectric Device With Tuning-Fork Type Piezoelectric Vibrating Piece - To provide the piezoelectric device and the manufacturing method thereof, in which the quartz-crystal side surface electrodes and the base side surface electrodes are ensured to be electrically connected without disconnection. The piezoelectric device ( | 02-09-2012 |
| 20100320872 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED WATCH - The piezoelectric vibrator of the invention comprises a base substrate, a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate, a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate, an external electrode formed on the lower face of the base substrate, a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity, and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed through hardening of a paste containing a plurality of metal fine particles and a plurality of glass beads. | 12-23-2010 |
| 20110050045 | PACKAGE, METHOD FOR MANUFACTURING THE SAME, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Providing a package and a method for manufacturing the package capable of achieving improvement in the degree of vacuum in the cavity, and to provide a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. There is provided a package which includes a plurality of kinds of gettering materials | 03-03-2011 |
| 20110050043 | METHOD FOR MANUFACTURING PACKAGE, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Providing a method for manufacturing a package capable of achieving reliable anodic bonding between the bonding material | 03-03-2011 |
| 20100308694 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, FIXING JIG, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED WATCH - The piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed of a cylindrical body, which is formed of a glass material to have two flat ends and a thickness substantially equal to that of the base substrate, and is implanted in the through-hole running through the base substrate; and an electroconductive core member which is formed to have two flat ends and a thickness substantially equal to that of the base substrate and is inserted into the center hole of the cylindrical body; and the through-hole, the cylindrical body and the core member are integrally fixed to each other by firing. | 12-09-2010 |
| 20110018398 | PIEZOELECTRIC VIBRATOR, MANUFACTURING METHOD OF PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED CLOCK - Providing a piezoelectric vibrator which is capable of securing the degree of vacuum in a cavity and can be manufactured with high efficiency and to provide a manufacturing method thereof. A piezoelectric vibrator | 01-27-2011 |
| 20110260585 | SURFACE-MOUNTABLE PIEZOELECTRIC DEVICES INCLUDING EUTECTIC-BONDED PACKAGES - Piezoelectric devices are disclosed that are mountable on the surface of a printed circuit board or the like. An exemplary device comprises a piezoelectric vibrating piece enclosed and sealed within a package including at least a cover and a base-substrate formed of glass or piezoelectric material. The package includes frame-shaped metallic films formed in peripheral regions of inner main surfaces of the cover and/or the base substrate. The frame-shaped metallic films are used for sealing the package using a eutectic material (e.g., solder). At least one mounting terminal is provided on the outer (bottom) main surface of the base-substrate. At least one of the frame-shaped metallic films and mounting terminals includes a chromium foundation layer formed on the surface of the glass or piezoelectric material, a middle layer of NiW alloy formed on the surface of the chromium layer, and a gold layer formed on the surface of the middle layer. | 10-27-2011 |
| 20110050046 | PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, RADIO-CONTROLLED TIMEPIECE - Providing a piezoelectric vibrator and a manufacturing method thereof which is capable of achieving gettering in a state where the frequency change of the piezoelectric vibrating reed is suppressed. Providing a piezoelectric vibrator | 03-03-2011 |
| 20110062826 | PIEZOELECTRIC DEVICES EXHIBITING REDUCED CI DEGRADATION - Surface-mounted piezoelectric devices are disclosed that include a package having a base and a lid made of a piezoelectric material or of glass. The package defines an internal cavity containing a tuning-fork type crystal vibrating piece having a pair of vibrating arms. The volume of the cavity is at least twelve times the volume of the pair of vibrating arms. Piezoelectric devices having these characteristics exhibit reduced CI degradation. | 03-17-2011 |
| 20110215678 | PIEZOELECTRIC RESONATOR DEVICE, MANUFACTURING METHOD FOR PIEZOELECTRIC... - A piezoelectric vibration device includes a piezoelectric vibration plate where an excitation electrode is formed, and an upper lid member and a lower lid member that hermetically seal the excitation electrode, the piezoelectric vibration plate having a region where the upper lid member is joined and a region where the lower lid member is joined, on front and back main surfaces, the upper lid member having a region on one main surface where the piezoelectric vibration plate is joined, and the lower lid member having a region on one main surface where the piezoelectric vibration plate is joined. At least one of a substrate of the joining region of the piezoelectric vibration plate, a substrate of the joining region of the upper lid member, and a substrate of the joining region of the lower lid member has a roughened surface. | 09-08-2011 |
| 20090174291 | PACKAGE FOR ELECTRONIC COMPONENT AND PIEZOELECTRIC RESONATOR - A package for electronic component includes: a rectangular package body, a lid hermetically sealing the package body, an electrode pad provided in the package body, a mounting terminal provided at least near four corners of a bottom surface of the package body and having a bump on a mounting surface, and a plurality of coupling electrodes electrically coupling the pad to the mounting terminal. | 07-09-2009 |
| 20090174290 | Gas pressurized encapsulation for an actuator - A piezoelectric actuator for use in a diesel engine. The actuator comprises a piezoelectric element which is encapsulated such that a layer of gas at a pressure above atmospheric pressure surrounds the piezoelectric element. The presence of the gas within the encapsulation around the element avoids the need to passivate electrodes exposed on the surface of the element. | 07-09-2009 |
| 20120306320 | PIEZOELECTRIC DEVICE AND MANUFACTURING METHOD THEREOF - The present disclosure provides the piezoelectric devices in which the bonding condition of devices can be easily observed. The piezoelectric device ( | 12-06-2012 |
| 20120043859 | Method of Manufacturing the Piezoelectric Device and the Same - To provide a piezoelectric device prevented from overflowing of sealing materials. The piezoelectric device ( | 02-23-2012 |
| 20120043860 | PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME - Piezoelectric vibrating devices are disclosed that lack base through-holes and that can be manufactured on a wafer scale. Also disclosed are methods for making same. An exemplary piezoelectric device has a package base having first and second opposing main surfaces. On the second (outer) first main surface is formed a pair of external electrodes. The first (inner) main surface defines a first recess and a peripheral first bonding surface. A pair of connecting electrodes are provided for connecting to the respective external electrodes via respective edge surfaces of the package base that extend between the first and second main surfaces. A piezoelectric vibrating piece is mounted in and contained within the package base. The vibrating piece includes a pair of excitation electrodes electrically connected to respective connecting electrodes. A package lid comprises first and second main surfaces, of which the second (inner) main surface defines a second recess that is larger than the first recess. The second main surface also defines a second bonding surface that peripherally surrounds the second recess. A sealing material is applied, over the width of the second bonding surface, circumferentially between the first bonding surface and the second bonding surface. | 02-23-2012 |
| 20110163637 | PIEZOELECTRIC DEVICE AND PIEZOELECTRIC DEVICE MANUFACTURING METHOD - A piezoelectric device includes: a first substrate; a second substrate disposed opposed to the first substrate; a third substrate disposed between the first substrate and the second substrate, a part of the third substrate forming a piezoelectric oscillating piece, and another part of the third substrate forming a frame which surrounds the piezoelectric oscillating piece; a first metal film which joins the first substrate and the frame; a second metal film which joins the second substrate and the frame; and a resin portion provided at least at any one of positions between the first substrate and the first metal film, between the frame and the first metal film, between the second substrate and the second metal film, and between the frame and the second metal film. | 07-07-2011 |
| 20100033062 | LOW FREQUENCY QUARTZ BASED MEMS RESONATORS AND METHOD OF FABRICATING THE SAME - A method for fabricating a low frequency quartz resonator includes metalizing a top-side of a quartz wafer with a metal etch stop, depositing a first metal layer over the metal etch stop, patterning the first metal layer to form a top electrode, bonding the quartz wafer to a silicon handle, thinning the quartz wafer to a desired thickness, depositing on a bottom-side of the quartz wafer a hard etch mask, etching the quartz wafer to form a quartz area for the resonator and to form a via through the quartz wafer, removing the hard etch mask without removing the metal etch stop, forming on the bottom side of the quartz wafer a bottom electrode for the low frequency quartz resonator, depositing metal for a substrate bond pad onto a host substrate wafer, bonding the quartz resonator to the substrate bond pad, and removing the silicon handle. | 02-11-2010 |
| 20120206018 | RESONATOR AND OSCILLATOR - A resonator according to the embodiment includes: a substrate; a flat layered body which is formed above the substrate and is formed with at least a lower electrode, a piezoelectric film and an upper electrode; an anchor portion which fixes the layered body above the substrate; a cut-out portion inside the layered body; a tuning fork vibrator which is formed in the cut-out portion, has both ends supported by the layered body and is formed with at least a lower electrode, a piezoelectric film and an upper electrode; and an envelope which envelopes the layered body and the tuning fork vibrator in a noncontact fashion, and prevents an external force from being applied to the layered body and the tuning fork vibrator. | 08-16-2012 |
| 20120056514 | Mesa-Type At-Cut Quartz-Crystal Vibrating Piece and Quartz-Crystal Device - To provide an AT-cut quartz-crystal vibrating piece in which size of the vibrating unit is adjusted to appropriate value, so that the unnecessary vibration is inhibited and degradation of its characteristics is prevented. A mesa-type AT-cut quartz-crystal vibrating piece for vibrating at 38.400 MHz comprising a rectangular excitation unit ( | 03-08-2012 |
| 20120056513 | TUNING-FORK TYPE QUARTZ-CRYSTAL VIBRATING PIECES AND QUARTZ-CRYSTAL DEVICES COMPRISING SAME - Tuning-fork type quartz-crystal vibrating pieces are disclosed that exhibit low CI and low interconnection resistance. An exemplary vibrating piece includes vibrating arms extending in a predetermined direction from a base, respective excitation electrodes, a base connected to the vibrating arms, respective supporting arms disposed outboard of respective vibrating arms and extending from the base in the predetermined direction, and respective extraction electrodes connected to respective excitation electrodes. Each excitation electrode comprises two metal layers, including a first metal layer comprising at least one metal selected from Cr, Ni, Ti, Al and W, and a second metal layer overlying the first metal layer and comprising Au or Ag. Each extraction electrode comprises four metal layers, namely the first and second metal layers, a third metal layer overlying the second metal layer and comprising at least one metal selected from Cr, Ni, Ti, Al and W, and a fourth metal layer overlying the third metal layer and comprising Au or Ag. | 03-08-2012 |
| 20120013224 | PROTECTED RESONATOR - A bulk acoustic wave resonator structure that isolates the core resonator from both environmental effects and aging effects. The structure has a piezoelectric layer at least partially disposed between two electrodes. The structure is protected against contamination, package leaks, and changes to the piezoelectric material due to external effects while still providing inertial resistance. The structure has one or more protective elements that limit aging effects to at or below a specified threshold. The resonator behavior is stabilized across the entire bandwidth of the resonance, not just at the series resonance. Examples of protective elements include a collar of material around the core resonator so that perimeter and edge-related environmental and aging phenomena are kept away from the core resonator, a Bragg reflector formed above or below the piezoelectric layer and a cap formed over the piezoelectric layer. | 01-19-2012 |
| 20120153779 | ELECTRONIC COMPONENT - An electronic component includes a glass substrate, a lid that is bonded to the glass substrate, an internal electrode, an external electrode, and a through electrode that is disposed in a through hole passing through the glass substrate and electrically connects the internal electrode to the external electrode. A sputtered metal layer is formed on the end face of a core member of the through electrode, which is made of a metal, by sputtering. | 06-21-2012 |
| 20120025673 | QUARTZ CRYSTAL DEVICE AND METHOD FOR SEALING THE SAME - A quartz crystal device includes a crystal resonator element and a package including a plurality of components. The plurality of components are bonded using a metal paste sealing material containing a metallic particle having an average particle size from 0.1 to 1.0 μm, an organic solvent, and a resin material in proportions of from 88 to 93 percent by weight, from 5 to 15 percent by weight, and from 0.01 to 4.0 percent by weight, respectively, to hermetically seal the crystal resonator element in the package. | 02-02-2012 |
| 20120025672 | PIEZOELECTRIC VIBRATING DEVICES HAVING CONTROLLED INTERNAL ENVIRONMENT, AND METHODS FOR MANUFACTURING SAME - Methods are disclosed for manufacturing piezoelectric vibrating devices that do not acquire unwanted gas or water vapor inside their respective packages during manufacture and that attain such end by methods suitable for mass-production. An exemplary manufacturing method includes preparing a piezoelectric wafer having multiple piezoelectric frames; on the piezoelectric wafer defining at least one first through-hole per frame; preparing a base wafer having multiple package bases alignable with the frames; on the base wafer defining at least one second through-hole; preparing a lid wafer having multiple package lids alignable with the frames; applying a sealing material between a first main surface of each frame and an inner main surface of the base wafer, and between a second main surface of each frame and an inner main surface of the lid wafer; and thereby bonding the three wafers together to form multiple packaged piezoelectric devices. To facilitate ventilation of gas from inside each package during bonding, each package includes at least one communicating groove extending from inside the package to the first or second through-hole. After venting, the communicating groove is sealed automatically with sealing material. | 02-02-2012 |
| 20120068578 | Piezoelectric Device - A piezoelectric device ( | 03-22-2012 |
| 20120248938 | TUNING-FORK TYPE QUARTZ-CRYSTAL VIBRATING PIECES AND PIEZOELECTRIC DEVICES HAVING LOW CRYSTAL IMPEDANCE - Tuning-fork type quartz-crystal vibrating pieces are disclosed, of which the vibration frequency can be adjusted without increasing CI. An exemplary piezoelectric device has a pair of vibrating arms extending in a predetermined direction from a first edge of a base. Respective first grooves are defined in a first principal surface of the vibrating arms. The first grooves extend in the predetermined direction, and have first excitation electrodes extending from a back-edge surface but not completely to a front-edge surface of the grooves. Respective second grooves are defined in a second principal surface, opposite the first principal surface, of the vibrating arms. The second grooves extend in the predetermined direction, and have second excitation electrodes extending from a back-edge surface completely to a front-edge surface of the second grooves. | 10-04-2012 |
| 20120212105 | PIEOZELECTRIC DEVICES AND METHODS FOR MANUFACTURING THE SAME - The purpose of the present disclosure is to provide a piezoelectric device that is less likely to be damaged during the cutting process from a wafer into individual pieces, and can be measured at the wafer without being affected by adjacent piezoelectric devices. The piezoelectric device includes: a first plate which constitutes a part of the package for storing the vibrating portion, having a pair of first edges and second edges situated vertically to the first edges; a second plate bonded to the first plate and constitutes another part of the package for storing the vibrating portion; and an adhesive for bonding the first plate and the second plate together. A pair of castellations is formed on each first edge, situated symmetrical to a straight line that passes through a centerline of the first plate and is parallel to the second edge. The present disclosure also provides methods for manufacturing. | 08-23-2012 |
| 20120074816 | Piezoelectric Device - The piezoelectric device ( | 03-29-2012 |
| 20100301708 | Piezoelectric component and manufacturing method therof - An object of the present invention is to manufacture, at a low cost, a piezoelectric component that has a superior level of molding pressure resistance and has its height reduced. The present invention relates to a piezoelectric component and a manufacturing method thereof comprising: a piezoelectric substrate; piezoelectric devices formed on a principle surface of the piezoelectric substrate; a device wiring section formed on the principle surface of the piezoelectric substrate; a protective film that has a terminal electrode connected to the wiring section and is formed on an upper surface of the wiring section; a rewiring layer that is formed on an upper surface of the protective film and that is connected to a wiring section of an electrode, which is different from the above electrode; a buffer layer that is composed of an inorganic material and that covers an entire upper surface of the rewiring layer excluding the piezoelectric devices; an outer periphery wall that is composed of a photosensitive resin film and is formed on an upper surface of the buffer layer; a first ceiling layer that is composed of a photosensitive resin film having a mica filler added thereto and is formed on an upper surface of the outer periphery wall; a mesh-shaped member that is composed of an insulating material and is installed on an upper surface of the first ceiling layer; a second ceiling layer that is composed of a photosensitive resin film having a mica filler added thereto and is formed so as to cover an upper surface of the mesh-shaped member; and through electrodes that are formed so as to pass through the first and second ceiling layers, the outer periphery wall, and the mesh-shaped member, thus between the outer periphery wall, the first ceiling layer, and the principle surface of the piezoelectric substrate, there is formed a hollow section that accommodates the piezoelectric devices. | 12-02-2010 |
| 20100301709 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO CLOCK - There is provided a piezoelectric vibrator | 12-02-2010 |
| 20100314971 | Piezoelectric Oscillator Part - A piezoelectric oscillator part capable of suppressing oscillation that leaks from a piezoelectric oscillator to a substrate side is obtained. The piezoelectric oscillator part has a piezoelectric oscillator held on a substrate by first and second conductive holding members. The first conductive holding member is arranged proximal to a first end of the substrate. A terminal electrode connected to the first conductive holding member is arranged proximal to a second end of the substrate opposite the first end. The first conductive holding member and the terminal electrode are electrically connected by a wiring electrode. | 12-16-2010 |
| 20100231094 | PIEZOELECTRIC VIBRATION COMPONENT - To obtain an inexpensive piezoelectric vibration component having vibration characteristics whose degradation resulting from deposition of moisture due to a temperature change is less likely to occur without increasing the cost of a sealing structure and the number of parts, a piezoelectric vibration component includes a piezoelectric vibrating element accommodated in a package being sealed, and when the volume of the piezoelectric vibrating element is Ve and the volume within the package obtained by subtraction of the volume Ve of the piezoelectric vibrator from the volume of the space of the package is Vp | 09-16-2010 |
| 20120280597 | PIEZOELECTRIC RESONATOR DEVICE AND MANUFACTURING METHOD THEREFOR - A piezoelectric resonator device in which excitation electrodes of a piezoelectric resonator plate are hermetically sealed, includes a plurality of sealing members that hermetically seal the excitation electrodes of the piezoelectric resonator plate. The plurality of sealing members each have a bonding layer, and at least one of the plurality of sealing members is provided with a bank portion and having the bonding layer formed on a top face of the bank portion. The plurality of sealing members are bonded together with the bonding layers of the sealing members, and a bonding material that contains an intermetallic compound is formed. | 11-08-2012 |
| 20120091860 | ELECTRONIC COMPONENT, MOUNTING STRUCTURE THEREOF, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT - An electronic component includes: a functional piece having a predetermined function; a bump electrode formed on the functional piece, the bump electrode including a core with elastic property and a conductive film provided on a surface of the core; and a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit. The electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode. | 04-19-2012 |
| 20120139391 | PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING THE SAME - Piezoelectric vibrating devices have piezoelectric vibrating pieces of which the vibration frequency is measurable individually on a wafer scale, without being affected by adjacent piezoelectric devices on the wafer. An exemplary piezoelectric device includes a piezoelectric vibrating piece having excitation electrodes and respective extraction electrodes. The device includes a package base with two connecting electrodes facing the vibrating piece and connected to respective extraction electrodes. Two pairs of mounting terminals are situated on the outer surface of the package base. Also on the outer surface of the package base are two pairs of opposing castellations that are recessed toward the center of the package base. Edge-surface electrodes connect the first and second main surfaces of the base; one pair is connected to the connecting electrodes and the other pair is connected to respective mounting terminals. | 06-07-2012 |
| 20130020912 | PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC DEVICE, AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - A piezoelectric vibrating piece is to be bonded to and sandwiched between a lid plate and a base plate with an external electrode. The piezoelectric vibrating piece has a first main surface at the lid plate side and a second main surface at the base plate side. The piezoelectric vibrating piece includes an excitation unit, a first excitation electrode, a second excitation electrode, a framing portion, one connecting portion, a first extraction electrode, and a second extraction electrode. The connecting portion includes a planar surface parallel to both the main surfaces and a side face intersecting with the planar surface. The first extraction electrode is extracted via the connecting portion. The second extraction electrode is extracted via the connecting portion. The first extraction electrode is disposed on at least a part of the side face of the connecting portion to be extracted to the framing portion. | 01-24-2013 |
| 20130020911 | PIEZOELECTRIC VIBRATING PIECE AND PIEZOELECTRIC DEVICE - A piezoelectric vibrating device and a piezoelectric vibrating piece including an excitation unit, a framing portion and a connecting portion are provided. The excitation unit includes a first side extending in a first direction and a second side extending in a second direction. The connecting portion has a thickness of a first thickness in a third direction perpendicular to the first direction and the second direction. The excitation unit includes a first region, a second region and a third region. The pair of excitation electrodes are disposed on the first region. The second region with the first thickness is directly connected to the connecting portion. The third region is disposed between the first region and the second region. The third region has a thickness in the third direction of a second thickness. The second region has a thickness in the third direction that is thicker than the second thickness. | 01-24-2013 |
| 20080231145 | QUARTZ CRYSTAL DEVICE AND METHOD FOR SEALING THE SAME - A quartz crystal device includes a crystal resonator element and a package including a plurality of components. The plurality of components are bonded using a metal paste sealing material containing a metallic particle having an average particle size from 0.1 to 1.0 μm, an organic solvent, and a resin material in proportions of from 88 to 93 percent by weight from 5 to 15 percent by weight, and from 0.01 to 4.0 percent by weight, respectively, to hermetically seal the crystal resonator element in the package. | 09-25-2008 |
| 20130140958 | MICROELECTROMECHANICAL SYSTEMS (MEMS) RESONATORS AND RELATED APPARATUS AND METHODS - Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer. | 06-06-2013 |
