Class / Patent application number | Description | Number of patent applications / Date published |
310336000 | Nondestructive testing type | 24 |
20080224568 | Backscatter Sensor - A micro mechanical backscatter sensor includes a receiver for receiving a modulated electromagnetic signal, a capacitive element operatively connected to the receiver, the capacitive element being arranged such that a voltage is generated across the capacitor in response to the frequency of the received signal, and a resonator operatively connected to the capacitive element such that electrostatic forces that are induced by the voltage generated cause the resonator to vibrate at a resonance frequency, the resonator being arranged such that an applied external force alters the resonance frequency of vibration. The sensor further includes a demodulator for demodulating the received signal, a modulator for modulating a carrier signal of the received signal by mixing the carrier signal with the resonance frequency of the resonator to produce a modulated electromagnetic transmission signal, and a transmitter, operatively connected to the capacitive element and arranged to transmit the modulated transmission signal. | 09-18-2008 |
20090102321 | Piezoelectric/electrostrictive membrane sensor - Disclosed is a piezoelectric/electrostrictive membrane sensor | 04-23-2009 |
20090115291 | VIBRATOR ARRAY, MANUFACTURING METHOD THEREOF, AND ULTRASONIC PROBE - In an ultrasonic transducer array, a plurality of vibrators arranged in an array is bonded to a base plate by bond material. The bond material bonds the bottom of the each vibrator to the base plate in a manner to surround lower part of the side face of the vibrator. A filling material is filled in between the vibrators. The filling material has a multi-layer structure of different rigidity. In a double layer structure of the filling material, it is preferable that thickness ratio of layer of filling material at the base plate side (lower side) to the other layer of the filling material is 1:1 to 1:3. Preferably, a beam is provided for connecting the side faces of the adjacent vibrators. | 05-07-2009 |
20090160293 | ULTRASONIC TRANSDUCER - An ultrasonic transducer has a rectangular piezo-electric ceramic sheet piece | 06-25-2009 |
20090236940 | ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME - In an ultrasonic probe in which individual wires led out from multilayered piezoelectric elements are arranged in a staggered manner, short-circuit is prevented. Each of the elements includes: a multilayered structure in which piezoelectric material layers and at least one internal electrode are stacked; first and second flat electrodes; first and second side electrodes; an insulating film formed at a second side surface side of the multilayered structure; a wiring member bonded to the first flat electrode on the one end of the multilayered structure by using a conducting adhesive material; and the wiring member is provided at the second side surface side of the multilayered structure and the insulating film electrically separates the second side electrode and the conducting adhesive material in a first element, and the wiring member is provided at a first side surface side of the multilayered structure in a second element. | 09-24-2009 |
20100001620 | MICROSTRUCTURE OF PEROVSKITE-TYPE OXIDE SINGLE CRYSTAL AND METHOD OF MANUFACTURING THE SAME, COMPOSITE PIEZOELECTRIC MATERIAL, PIEZOELECTRIC VIBRATOR, ULTRASONIC PROBE, AND ULTRASONIC DIAGNOSTIC APPARATUS - A method of manufacturing a microstructure of perovskite-type oxide single crystal having a desired composition and exhibiting excellent properties. The method includes the steps of: (a) forming a coating layer on a surface of a seed single crystal substrate, the coating layer containing the same metallic elements as those in a predetermined perovskite-type oxide; (b) forming a joint body having a micro-structured precursor of the predetermined perovskite-type oxide adhered to a surface of the coating layer; and (c) heat-treating the joint body to induce solid phase epitaxy, and thereby, single-crystallizing the precursor. | 01-07-2010 |
20100187951 | Low Frequency Acoustic Transducer for a Probe for Non-Destructive Testing - The present invention provides a low frequency acoustic transducer for non-destructive testing of a test structure. The transducer is arranged for conversion between electrical energy and acoustic energy associated with an acoustic wave propagating through a portion of the test structure. The transducer comprises a bending actuator for generating the acoustic wave by generating a vibration from an electrical signal or for generating an electrical signal from a vibration generated by the received acoustic wave. The bending actuator has a vibration surface and a contact area surrounded by a portion of the vibration surface. The transducer further comprises a mode setting member that has a rigid portion which is in direct mechanical contact with the bending actuator at the contact area such that, within the contact area, an amplitude of the vibration is substantially suppressed. The location and shape of the contact area determine a bending mode associated with a resonance frequency of the bending actuator. | 07-29-2010 |
20100187952 | ARRAY SCANNING TYPE ULTRASOUND PROBE - A technology is disclosed which provides an array scanning type ultrasound probe capable of preventing a diminution of ultrasound of a piezoelectric device at the time of transmission and at the time of reception due to its damage and thereby reducing a sensitivity deterioration of a diagnostic image. According to the technology, included are an electroacoustic conversion unit formed by arranging multiple piezoelectric devices and multiple acoustic matching layers in a predetermined direction, each of the multiple piezoelectric devices being an electroacoustic conversion device, the multiple acoustic matching layers being respectively stacked on the multiple piezoelectric devices; and a signal flexible board transferring electric signals to be transmitted to and received from the multiple piezoelectric devices. An incision passing through the multiple piezoelectric devices in respective thickness directions of the piezoelectric devices and extending into the corresponding acoustic matching layers stacked thereon is provided in parallel to the arrangement direction. | 07-29-2010 |
20100201226 | PIEZOELECTRIC TRANSDUCER DEVICE - The present invention relates to a transducer device ( | 08-12-2010 |
20100207489 | MEMS Ultrasonic Device Having a PZT and CMUT - A MEMS ultrasonic device has an array of PZT transducer elements and a cMUT structure bonded to the array of PZT transducer elements. The MEMS ultrasonic device can be adapted for ultrasonic imaging. The cMUT structure may serve as an active MEMS acoustic filter having at least two acoustic I/O ports to alter an input acoustic signal to an output acoustic signal. The first I/O port is adapted for interfacing with a medium, and the second I/O port for passing an acoustic signal to an acoustic transducer. An array of MEMS acoustic filters may be designed to function as an acoustic lens. Fabrication methods to make the same are also disclosed. | 08-19-2010 |
20110095651 | DEVICE FOR DETECTING INTERACTION WITH AN OBJECT - A device and method for the detection of the interaction between two or more objects is disclosed. The device utilizes electrical impedance spectra measured from a piezoelectric element attached to one such object. Comparison of such spectra along a range of traverse allows precise estimates of distance to be made. One useful application is the topographical mapping of a surface. | 04-28-2011 |
20110133604 | ULTRASONIC DIAGNOSTIC PROBE AND METHOD OF MANUFACTURING THE SAME - An ultrasonic diagnostic probe and a method of manufacturing the same are disclosed. The probe includes a first piezoelectric member having a first thickness, and a second piezoelectric member having a second thickness and stacked on the first piezoelectric member. The method allows the production of several kinds of ultrasonic diagnostic probes, which generate ultrasound waves in different frequency bands, with a single kind of transducer module by changing connection between an external electrode and the electrodes of the probe. | 06-09-2011 |
20110187233 | Nondestructive Testing Apparatus and Method - A laser opto-acoustic apparatus and method is applied for nondestructive testing of defects and residual stresses in solids. A nondestructive testing apparatus may have a piezoelectric transducer for measuring oscillations in a solid. The oscillations or waves may be caused from longitudinal, shear, and/or Raleigh waves in the object to be tested. The nondestructive testing apparatus may also include a laser. The laser is capable of generating the longitudinal, shear, and/or Raleigh waves in the object. One method of performing nondestructive testing of materials may include creating at least one of a longitudinal, shear, and/or Raleigh wave in an object and measuring the speed of the wave in the object. The speed of the waves may be compared with the speed of waves in a material without defects to determine whether the object to be tested has defects. | 08-04-2011 |
20120019105 | DEVICE AND SYSTEM FOR MEASURING MATERIAL THICKNESS - A piezoelectric sensing device is described for measuring material thickness of target such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device comprises a substrate such as a flexible circuit material, a piezoceramic element, and a solder layer disposed therebetween. These features are arranged in manner that provides a low-profile measurement device suitable for high-temperature applications such as those applications in which the temperature exceeds 120° C. Embodiments of the piezoelectric sensing device can be configured for use as stand-alone units separately located on the target or for use as a string of sensing elements coupled together by way of the flexible circuit material. | 01-26-2012 |
20120119622 | DEVICE FOR MEASURING MATERIAL THICKNESS - A piezoelectric sensing device is described for measuring material thickness of targets such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device includes a piezoelectric element mounted to a flexible circuit with glass reinforced polyimide C-stage cover layers surrounding a pure polyimide C-stage core. | 05-17-2012 |
20120153777 | Ultrasonic, Flow Measuring Device - An ultrasonic transducer for an ultrasonic, flow measuring device comprising an electromechanical transducer element and an ultrasound window, wherein an adapting, or matching, layer liquid at operating conditions of the ultrasonic transducer is arranged between the electromechanical transducer element and the ultrasound window, wherein the ultrasonic transducer has holding means, which exert a releasable force toward the ultrasound window on the electromechanical transducer element, in order to hold the electromechanical transducer element in a predetermined position relative to the ultrasound window. | 06-21-2012 |
20120293046 | INTERACTIVE PANEL COMPRISING A SUBSTRATE AND AT LEAST TWO PIEZOELECTRIC TRANSDUCTION DEVICES - An interactive panel including a substrate, wherein a seismic wave is intended to propagate, and at least two piezoelectric transduction devices each including two piezoelectric transducers. Each piezoelectric transducer includes two piezoelectric elements each with two surfaces each covered by an electrode. The four electrodes of each piezoelectric transducer are interconnected to supply, when opposing stresses are applied to the piezoelectric elements of the transducer, an electrical measurement signal that depends on the angle between a main plane and an opposite stress-separation plane. Two piezoelectric transducers of a same device have a same central axis and their respective main planes form a non-zero angle thereinbetween. Each piezoelectric transduction device is attached to the substrate such that movement of the substrate during passage of the seismic wave causes stress on the piezoelectric elements, in opposite directions on either side of the stress-separation plane. | 11-22-2012 |
20130181577 | ULTRASONIC PROBE AND MANUFACTURING METHOD THEREOF - An ultrasonic probe including a matching layer providing conductivity via an electrode formed on a surface contacting a piezoelectric material, and a manufacturing method thereof. The method of manufacturing an ultrasonic probe includes forming kerfs on a surface of the matching layer, forming an electrode on the surface of the matching layer at which the kerfs are formed, or on an opposite surface thereof, and mounting the surface provided with the electrode on the piezoelectric material. | 07-18-2013 |
20130193805 | HIGH FREQUENCY PIEZOCOMPOSITE AND METHODS FOR MANUFACTURING SAME - A transducer with triangular cross-sectional shaped pillars is described for suppressing lateral modes within a composite, and a method for producing the same. According to one aspect of the present application, a plurality of triangular cross-sectional shaped pillars extends outwardly from a substrate and form an array of pillars. The resulting array of pillars is configured to suppress the lateral modes of the transducer at higher operating frequencies, such as, at or above 15 MHz, at or above 20 MHz, or at or above 30 MHz. | 08-01-2013 |
20130200755 | ULTRASONIC PROBE AND MANUFACTURING METHOD THEREOF - An ultrasonic probe is provided and includes a matching layer providing conductivity by forming an electrode in the matching layer. A method of manufacturing the ultrasonic probe is also described. The ultrasonic probe includes a piezoelectric material and at least one matching layer disposed on the front surface of the piezoelectric material and includes an electrode. | 08-08-2013 |
20130241356 | PROBE FOR ULTRASONIC DIAGNOSTIC APPARATUS - Disclosed herein is a probe for an ultrasonic diagnostic apparatus including a transducer module that transmits and receives ultrasonic waves. The transducer module includes a piezoelectric device transmitting and receiving ultrasonic waves, at least one matching layer disposed on the front surface of the piezoelectric device, a backing layer disposed on the rear surface of the piezoelectric device, a backing block disposed on the rear surface of the backing layer, and a gas layer disposed between the backing layer and the backing block. Since acoustic energy proceeding in the backward direction of the piezoelectric device is reflected by the gas layer toward the piezoelectric device, sensitivity of the transducer module is improved. | 09-19-2013 |
20140028154 | Method And Device For Long-Term Monitoring Of Components Using Guided Waves - The present disclosure relates to a system for monitoring a structural component. The system may include an electromechanical device to generate guided waves having a measurement surface and a bonding agent disposed on the measurement surface and configured to engage with the surface of the structural component. The system may also include a heating element for heating the measurement surface, the bonding agent, and capable of heating a portion | 01-30-2014 |
20140070669 | MICROMACHINED ULTRASONIC TRANSDUCER ARRAY - A micromachined ultrasonic transducer (MUT) array includes a printed circuit board, an alignment plate formed on the printed circuit board, the alignment plate having a plurality of cavities formed therein and a plurality of protruding portions respectively formed between neighboring cavities of the plurality of cavities, and a plurality of MUT modules formed on the plurality of the cavities and the plurality of the protruding portions of the alignment plate. In the MUT array, each of the plurality of MUT modules includes an application-specific integrated circuit (ASIC) arranged on the alignment plate and an MUT arranged on the ASIC. | 03-13-2014 |
20140312739 | HIGH TEMPERATURE ULTRASONIC PROBE AND PULSE-ECHO PROBE MOUNTING FIXTURE FOR TESTING AND BLIND ALIGNMENT ON STEAM PIPES - A high temperature ultrasonic probe and a mounting fixture for attaching and aligning the probe to a steam pipe using blind alignment. The high temperature ultrasonic probe includes a piezoelectric transducer having a high temperature. The probe provides both transmitting and receiving functionality. The mounting fixture allows the high temperature ultrasonic probe to be accurately aligned to the bottom external surface of the steam pipe so that the presence of liquid water in the steam pipe can be monitored. The mounting fixture with a mounted high temperature ultrasonic probe are used to conduct health monitoring of steam pipes and to track the height of condensed water through the wall in real-time. | 10-23-2014 |