Class / Patent application number | Description | Number of patent applications / Date published |
279128000 | WITH MAGNETIC OR ELECTROSTATIC MEANS | 47 |
20080258411 | POWER SUPPLY APPARATUS AND DEPOSITION METHOD USING THE POWER SUPPLY APPARATUS - A power supply apparatus includes a power supply mechanism which supplies, from an external power supply, electric power to be supplied to an electrostatic chuck. The power supply mechanism includes a first conductive annular member fixed to the end portion of a strut, and capable of rotating together with the strut, a second conductive annular member fixed to a housing, and brought into surface contact with the first conductive annular member, and a first power supply member which supplies a supplied first voltage to an electrode of the electrostatic chuck via the second conductive annular member and the first conductive annular member. | 10-23-2008 |
20080315536 | ELECTROSTATIC CHUCK AND METHOD OF MANUFACTURING THE SAME - There is provided an electrostatic chuck. The electrostatic chuck includes: a ceramic base containing alumina and first flux; an electrostatic electrode built in the ceramic base; and a ceramic material containing second flux and provided between the ceramic base and the electrostatic electrode, the ceramic material contacting the ceramic base and the electrostatic electrode. A content rate of the second flux is higher than that of the first flux. | 12-25-2008 |
20090230636 | ELECTROSTATIC CHUCK - An electrostatic chuck includes (a) a cooling device serving as an RF electrode, including a gas supply port penetrating through the cooling device, the gas supply port extending from one main surface to the other main surface, and a main counter bore portion having a diameter larger than that of the gas supply port, the main counter bore portion provided in an opening of the gas supply port; (b) an arc prevention member buried in the main counter bore portion and made of an insulating member, wherein a gas path is provided, the gas path is configured to communicate with the gas supply port; and (c) an electrostatic chuck body arranged on the cooling device, defining a work mounting surface on a top surface of the electrostatic chuck body, provided with a pore in communication with the gas supply port via the gas path. | 09-17-2009 |
20090243235 | ELECTROSTATIC CHUCK AND METHOD FOR MANUFACTURING THE SAME - The electrostatic chuck includes a base including an aluminum nitride-containing member; a dielectric layer formed on the base including a member having a volume resistivity of at least 1×10 | 10-01-2009 |
20090243236 | ELECTROSTATIC CHUCK AND MANUFACTURING METHOD THEREOF - An electrostatic chuck of a stack structure includes a metal layer interposed between insulating layers and a groove formed at a peripheral portion of the electrostatic chuck to have a width gradually increasing toward an outside, the groove being covered with a thermally sprayed insulating film. The thermally sprayed film covers at least a portion of the metal layer exposed at an inside of the groove such that the thermally sprayed film does not protrude from the groove. | 10-01-2009 |
20090256320 | RELEASABLE GUIDE AND METHODS FOR USING SAME - Apparatus and methods for guiding one or more tools are provided. In at least one specific embodiment, the apparatus for guiding one or more tools can include an elongated member. The elongated member can have one or more switchable magnets disposed thereon. | 10-15-2009 |
20090283976 | SUBSTRATE HOLDING APPARATUS - A substrate holding apparatus comprises a substrate holding mechanism configured to hold a substrate; a heating mechanism; and a heat-conductive member which is interposed between the substrate holding mechanism and the heating mechanism to be in contact therewith and conducts heat generated by the heating mechanism to the substrate holding mechanism, wherein the heat-conductive member has a recessed section that opens to the substrate. | 11-19-2009 |
20100019462 | APPARATUS FOR INCREASING ELECTRIC CONDUCTIVITY TO A SEMICONDUCTOR WAFER SUBSTRATE WHEN EXPOSURE TO ELECTRON BEAM - An apparatus for increasing electric conductivity to a wafer substrate when exposures to electron beam irradiation is disclosed. More specifically, a more free mechanical contact between a wafer and electric contact pins (within an electrostatic chuck) is provided to significantly reduce the scratch and damage on the wafer backside. | 01-28-2010 |
20100044974 | EDGE RINGS FOR ELECTROSTATIC CHUCKS - A disclosed device for use with an electrostatic chuck configured to hold a substrate in a plasma environment comprises an edge ring configured to be placed either in contact with portions of only a ceramic top piece, a base plate, or coupled to the base plate through a plurality of pins and pin slots. The edge ring is further configured to be concentric with the ceramic top piece. In one embodiment, the edge ring includes an inner edge having an edge step arranged to provide mechanical coupling between the edge ring and the outer periphery of the ceramic top piece. The edge ring further includes an outer edge and a flat portion located between the inner edge and the outer edge. The flat portion is arranged to be both horizontal when the edge ring is placed around the outer periphery of the ceramic top piece and parallel to the substrate. | 02-25-2010 |
20100078899 | ADJUSTABLE THERMAL CONTACT BETWEEN AN ELECTROSTATIC CHUCK AND A HOT EDGE RING BY CLOCKING A COUPLING RING - A clockable device for use with an electrostatic chuck configured to hold a substrate in a plasma environment is disclosed. The clockable device comprises a first portion of the electrostatic chuck having at least one face with variable thermal contact areas located thereon. A second portion of the electrostatic chuck has at least one face with variable thermal contact areas located thereon. The at least one face of the second portion is configured to be placed in thermal contact with the at least one face of the first portion to control a thermal gradient across a face of the substrate. | 04-01-2010 |
20100109263 | ELECTROSTATIC CHUCK HAVING REDUCED ARCING - Electrostatic chucks and methods of manufacturing the same are provided herein. In some embodiments, an electrostatic chuck comprises an electrically conductive body having one or more channels formed in an upper surface thereof; a plate positioned within the one or more channels to define one or more plenums between the body and the plate, wherein the surfaces of the plenum are anodized; one or more fluid passages disposed in the plate and fluidly coupling the one or more plenums to the upper surface of the body, wherein the surfaces of the fluid passages are electrically insulated; and a dielectric layer disposed over the upper surface of the body and the plate, wherein the dielectric layer forms a support surface for a substrate to be disposed thereon. | 05-06-2010 |
20100156054 | HIGH TEMPERATURE ELECTROSTATIC CHUCK BONDING ADHESIVE - Methods and apparatus for bonding an electrostatic chuck to a component of a substrate support are provided herein. In some embodiments, an adhesive for bonding components of a substrate support may include a matrix of silicon-based polymeric material having a filler dispersed therein. The silicon based polymeric material may be a polydimethylsiloxane (PDMS) structure having a molecular weight with a low molecular weight (LMW) content Σ D3-D10 of less than about 500 ppm. In some embodiments, the filler may comprise between about 50 to about 70 percent by volume of the adhesive layer. In some embodiments, the filler may comprise particles of aluminum oxide (Al | 06-24-2010 |
20100156055 | SUBSTRATE TEMPERATURE CONTROL FIXING APPARATUS - A substrate temperature control fixing apparatus comprises an electrostatic chuck which includes a base body and adsorbs and holds an adsorbing target mounted on one of surfaces of the base body, a base plate which supports the electrostatic chuck, and a bank portion provided on an outer periphery of one of surfaces of the base plate which is opposed to the other of the surfaces of the base body. | 06-24-2010 |
20100225075 | HAND POWER TOOL WITH A TOOL HOLDER - The invention describes a hand power tool with a drive spindle and an integrated tool holder. The drive spindle can be connected to the tool holder in a rotationally fixed and undetachable manner, and the tool holder has at least one magnet. The drive spindle is connected to the tool holder such that at least one first section of the drive spindle is permanently connected to the tool holder and at least one second section of the drive spindle is present which is at least as long as the first section. | 09-09-2010 |
20110221145 | ELECTROSTATIC CHUCK - An electrostatic chuck featuring a chuck support structure, and a plurality of discrete electrostatic components. Each of the electrostatic components features at least one termination attached to an electrode on an electrically insulating material. At least some of the discrete electrostatic components are removably attached to the chuck support structure or to a substrate that is interposed between said chuck support structure and the electrostatic components. | 09-15-2011 |
20110272899 | WAFER MOUNT DEVICE AND MANUFACTURING METHOD THEREOF - An adhesive layer | 11-10-2011 |
20120074657 | HAND-HELD POWER TOOL WITH A QUICK-CLAMPING DEVICE FOR A WORKING ELEMENT - A hand-held power tool with a quick-clamping device for a working element includes a working mandrel for driving the working element, a fastening member for fastening the working element onto the end of the working mandrel, and a locking assembly. The fastening member includes a clamping shaft insertable into the working mandrel and a moving assembly for making the fastening member moveable between a releasing position and a clamping position. The locking assembly includes a floatable clamping component and the clamping component and the clamping shaft are provided with corresponding toothed portions such that engagement and disengagement therebetween is selectively achieved by the relative rotation of the toothed portions. | 03-29-2012 |
20120104702 | Quick-Release Bit Adapter - A quick-release bit adapter includes a body having first and second ends spaced along a longitudinal axis. The body includes a driving hole extending from the first end towards the second end along the longitudinal axis. The body further includes a sliding groove in communication with the driving hole and intermediate the driving hole and the second end along the longitudinal axis. A through-hole extends from an outer periphery of the first end through the sliding groove. A bit received in the driving hole abuts and is stopped by at least one protrusion extending inward from an inner periphery of the driving hole towards the longitudinal axis. A magnetic device is slideably received in the sliding groove and controllable by a user through the through-hole to slide along the longitudinal axis between two positions to engage with or disengage from the bit. | 05-03-2012 |
20120104703 | ELECTROSTATIC CHUCK AND SHOWERHEAD WITH ENHANCED THERMAL PROPERTIES AND METHODS OF MAKING THEREOF - Embodiments of the present invention generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present invention provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components. | 05-03-2012 |
20120200051 | METHOD FOR COATING INTERNAL MEMBER HAVING HOLES IN VACUUM PROCESSING APPARATUS AND THE INTERNAL MEMBER HAVING HOLES COATED BY USING THE COATING METHOD - A coating method for an internal member of a vacuum processing apparatus is provided. The method includes a process (A) of filling small holes | 08-09-2012 |
20120242049 | MOIL GUIDE - A moil guide having a sleeve that has an opening adapted to receive at least a portion of a linerbolt. The moil guide also has a magnetic attachment device attached to the sleeve. The magnetic attachment device is operable to selectively generate a magnetic field. The magnetic attachment device is operable to selectively generate the magnetic field to removably attach the moil guide to a metal surface. | 09-27-2012 |
20120248715 | ELECTROSTATIC CHUCK - According to one embodiment, an electrostatic chuck includes: a ceramic dielectric substrate, an electrode, and a conductive member. The ceramic dielectric substrate has a first major surface on which a material to be adsorbed is to be mounted and a second major surface on a side opposite the first major surface. The electrode is interposed between the first major surface and the second major surface of the ceramic dielectric substrate. The conductive member is provided in a recess formed in the second major surface of the ceramic dielectric substrate. A tip end of the recess has a curved surface. | 10-04-2012 |
20120248716 | METHOD FOR PRODUCING ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUCK - A method for producing an electrostatic chuck includes the steps of (a) placing a ceramic slurry in a molding die, the ceramic slurry containing a ceramic powder, a solvent, a dispersing agent, and a gelling agent, gelatinizing the ceramic slurry in the molding die, and removing the molding die to obtain first and second ceramic molded bodies; (b) drying, debinding, and calcining the first and second molded bodies to obtain first and second ceramic calcined bodies; (c) printing an electrostatic electrode paste on a surface of one of the first and second ceramic calcined bodies to form an electrostatic electrode while assuming the first ceramic calcined body is to form a dielectric layer of an electrostatic chuck; and (d) superposing the first and second ceramic calcined bodies on each other to sandwich the electrostatic electrode and subjecting the first and second calcined bodies to hot-press firing. | 10-04-2012 |
20120299253 | ELECTROSTATIC CHUCK APPARATUS - The present invention provides an electrostatic chuck apparatus including:
| 11-29-2012 |
20130001899 | ELECTROSTATIC CHUCK ASSEMBLY - Embodiments of electrostatic chucks for substrate processing are provided herein. In some embodiments, an electrostatic chuck may include a puck for supporting a substrate, the puck formed from a dielectric material and having a chucking electrode disposed within the puck proximate a support surface of the puck to electrostatically retain the substrate when disposed on the puck; a base having a ring extending from the base to support the puck; and a spacer disposed between the base and the puck to support the puck above the base such that a gap is formed between the puck and the base, wherein the spacer supports the puck proximate a peripheral edge of the puck. | 01-03-2013 |
20130026720 | ELECTROSTATIC CHUCK - An electrostatic chuck comprises: a ceramic plate provided with recesses on a major surface and provided with an electrode in an inner part of the ceramic plate; a temperature regulating plate bonded to the major surface of the ceramic plate; a first bonding agent provided between the ceramic plate and the temperature regulating plate; and a heater provided in the each of the recesses of the ceramic plate. The first bonding agent has a first major agent including an organic material, a first amorphous filler including an inorganic material, and a first spherical filler including an inorganic material. The first amorphous filler and the first spherical filler are dispersion-compounded into the first major agent. The first major agent, the first amorphous filler, and the first spherical filler are made of an electrically insulating material. An average diameter of the first spherical filler is greater than a maximum value of a minor axis of the first amorphous filler. A thickness of the first bonding agent is greater than or equal to the average diameter of the first spherical filler. A width of the each of the recesses is greater than a width of the heater, and a depth of the each of the recesses is greater than a thickness of the heater. The heater is adhered within the each of the recesses by a second bonding agent. A first distance between a major surface of the heater on the side of the temperature regulating plate and a major surface of the temperature regulating plate is greater than a second distance between the major surface between the recesses of the ceramic plate and the major surface of the temperature regulating plate. | 01-31-2013 |
20130093145 | ELECTROSTATIC CHUCK - An electrostatic chuck comprises a ceramic dielectric body having an electrode formed on a surface of the ceramic dielectric body; a ceramic substrate supporting the ceramic dielectric body; and a first bonding agent bonding the ceramic dielectric body to the ceramic substrate. The first bonding agent has a first major agent including an organic material, a first amorphous filler including an inorganic material, and a first spherical filler including an inorganic material. The first amorphous filler and the first spherical filler are dispersion-compounded in the first major agent. The first major agent, the first amorphous filler, and the first spherical filler are made of an electrically insulating material. An average diameter of the first spherical filler is greater than a maximum value of a minor axis of all of the first amorphous filler. A thickness of the first bonding agent is equal to or greater than the average diameter of the first spherical filler. | 04-18-2013 |
20130093146 | CERAMIC-METAL BONDED BODY - To form an electrostatic chuck, a bonding sheet is applied onto the upper surface of a cooling plate and then the cooling plate is placed in a vacuum dryer at a pressure of 2,000 Pa or less for a pre-bake treatment at 120° C. to 130° C. for 15 to 40 hours, followed by natural cooling. A plate is then stacked on the bonding sheet so that the lower surface of the plate is aligned with the upper surface of the bonding sheet, which is applied onto the cooling plate. The resulting stacked body is placed in a heat-resistant resin bag, and is then placed in an autoclave and treated together for several hours under pressure and heat. | 04-18-2013 |
20130113169 | POWER INPUT DEVICE AND VACUUM PROCESSING APPARATUS USING THE SAME - A power input mechanism includes a first stationary conductive member, a second stationary conductive member, a stationary insulating member which is fixed to a housing and insulates the first stationary conductive member and the second stationary conductive member from each other, a first rotary conductive member, a second rotary conductive member, a rotary insulating member which is fixed to a support column and insulates the first rotary conductive member and the second rotary conductive member from each other, a first power input member which supplies a first voltage to a substrate holder via the first rotary conductive member and the first stationary conductive member, and a second power input member which supplies a second voltage to the substrate holder via the second rotary conductive member and the second stationary conductive member. | 05-09-2013 |
20130127124 | PERIPHERAL RF FEED AND SYMMETRIC RF RETURN WITH RF STRAP INPUT - Systems and methods are presented for a peripheral RF feed and symmetric RF return for symmetric RF delivery. According to one embodiment, a chuck assembly for plasma processing is provided. The chuck assembly includes an electrostatic chuck having a substrate support surface on a first side, a facility plate coupled to the electrostatic chuck on a second side that is opposite the substrate support surface, a peripheral RF feed configured to deliver RF power, the peripheral RF feed having a first portion contacting a periphery of the facility plate and an RF strap coupling the peripheral RF feed to an RF source. | 05-23-2013 |
20130154205 | Right Angle Attachment For Power Tools - A right angle attachment for use with a power tool that includes a housing having a handle portion and a gear case attached to the handle portion and supporting first and second right angle gears wherein the first right angle gear is driven by an input shaft that is connected to the drill and the second right angle gear has an opening therein for receiving a hex bit directly therein. A floating magnet head can surround the hex bit to aid in fastener retention and can be movable out of proximity of the hex bit to facilitate easy removal of the hex bit for replacement. An additional magnet can be disposed within the gear case at the base of the hex bit in order to magnetize the hex bit and further enhance the retention of the fastener therein. | 06-20-2013 |
20130187349 | SCAN HEAD AND SCAN ARM USING THE SAME - A scan head assembled to a scan arm for an ion implanter and a scan arm using the same are provided, wherein the scan head is capable of micro tilting a work piece and comprises a case, a shaft assembly, an electrostatic chuck, a first driving mechanism and a micro-tilt mechanism. The shaft assembly passes through a first side of the case and has a twist axis. The electrostatic chuck is fastened on a first end of the shaft assembly outside the case for holding the work piece. The first driving mechanism is disposed within the case and capable of driving the shaft assembly and the ESC to rotate about the twist axis. The micro-tilt mechanism is disposed within the case and capable of driving the shaft assembly and the ESC to tilt relative to the case. | 07-25-2013 |
20130285336 | ALUMINA SINTERED BODY, MEMBER INCLUDING THE SAME, AND SEMICONDUCTOR MANUFACTURING APPARATUS - An alumina sintered body contains alumina as a main component and titanium. The alumina sintered body further contains at least one element selected from the group consisting of lanthanum, neodymium, and cerium. Aluminum is contained in the alumina sintered body in an amount such that a ratio of aluminum oxide to total oxides in the alumina sintered body becomes 93.00 to 99.85% by weight where the total oxides are defined as a total amount of all oxides contained in the alumina sintered body. Titanium is contained in an amount such that a ratio of titanium oxide to the total oxides becomes 0.10 to 2.00% by weight. Lanthanum, neodymium, and cerium are contained in a combined amount such that a ratio of the combined amount to the total oxides becomes 0.05 to 5.00% by weight. Volume resistivity is 1×10 | 10-31-2013 |
20140042716 | ELECTROSTATIC CHUCK DEVICE - An electrostatic chuck device includes an electrostatic chuck section ( | 02-13-2014 |
20140103612 | DIELECTRIC LAYER FOR ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUCK - A dielectric layer for an electrostatic chuck is formed of a ceramic material having a first phase including aluminum oxide and a second phase including composite carbonitride (Ti, Me)(C, N) that contains titanium as fine grains. The Me represents a transition element and metals of Group 4 to Group 6 such as Mo and W. The ceramic material that includes the second phase by 0.05 vol % to 2.5 vol % has a volume resistivity value of about 10 | 04-17-2014 |
20140159324 | COMPLIANT MICRO DEVICE TRANSFER HEAD ARRAY WITH METAL ELECTRODES - Compliant monopolar and bipolar micro device transfer head arrays and methods of formation from SOI substrates are described. In an embodiment, an array of compliant transfer heads are formed over a base substrate and deflectable toward the base substrate, and a patterned metal layer includes a metal interconnect layer electrically connected with an array of the metal electrodes in the array of compliant transfer heads. | 06-12-2014 |
20140159325 | SUBSTRATE SUPPORT ASSEMBLY HAVING METAL BONDED PROTECTIVE LAYER - A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective layer metal bonded to an upper surface of the ceramic body, wherein the protective layer is a bulk sintered ceramic article. | 06-12-2014 |
20140203526 | TEMPERATURE MANAGEMENT OF ALUMINIUM NITRIDE ELECTROSTATIC CHUCK - An unseasoned substrate support assembly includes a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further includes an upper surface of the ceramic body having a first portion proximate to a center of the upper surface of the ceramic body and having a first roughness profile and a second portion distal from the center of the upper surface of the ceramic body and having a second roughness profile with a lower roughness than the first roughness profile, wherein areas of the first and second portions are based on radial distances from the center of the ceramic body. | 07-24-2014 |
20140300064 | MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE - Provided is a member for semiconductor manufacturing device which hardly causes component contamination and is capable of sufficiently reducing generation of particles in a semiconductor manufacturing device. A spray coating is formed by spraying a ceramic onto a mounting member of a transfer arm, and laser beam is irradiated to the spray coating to remelt and resolidify the ceramic composition for modification to thereby form a high-strength ceramic layer made from a ceramic recrystallized material and having a net-like crack, whereby particles dropped out from the mounting member due to external factors in a semiconductor manufacturing device are reduced to an extent not affecting a semiconductor manufacturing process. | 10-09-2014 |
20140346743 | MULTI-ZONED PLASMA PROCESSING ELECTROSTATIC CHUCK WITH IMPROVED TEMPERATURE UNIFORMITY - An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance. | 11-27-2014 |
20150061237 | ELECTROSTATIC CHUCK AND SHOWERHEAD WITH ENHANCED THERMAL PROPERTIES AND METHODS OF MAKING THEREOF - Embodiments of the present disclosure generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present disclosure provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components. | 03-05-2015 |
20150115552 | MAGNETIC CHUCK - A magnetic chuck comprising: a lower plate to which a conductive magnetic body for fixing one side of a warped workpiece by magnetic force is coupled; a main body made of a magnetic material and an open side of which has an accommodation groove for insertion of insulating means, the main body being fixed at the lower plate; insulating means inserted into the accommodation groove of the main body and embedded with an insulating coil and an Alnico magnet on the interior thereof, the insulating means being configured to induce a magnetic line of force to flow only through the Alnico magnet to thus provide strong fixing force for the workpiece through the magnetic chuck; and a support member arranged on an upper portion of the main body to be attached to the other side of the workpiece through the magnetic field of the Alnico magnet. The magnetic line of force flowing from the magnetic chuck is permitted to flow only at both ends of the workpiece so that a grinding and cutting process for maintaining the flatness of the workpiece is enabled while maintaining the shape of the warped workpiece, thus enabling surface processing even at the state where the warped surface of the workpiece is maintained. | 04-30-2015 |
20150343582 | TOOL GRIPPING MECHANISM - A tool gripping mechanism includes a tool holder and a shaft to which the tool holder is attached. The shaft is fixed to a rotary shaft of a spindle device. A plurality of magnets are disposed in pairs on concentric circles on surfaces of the tool holder and the shaft which face each other. When the tool holder is in a specific phase with respect to the shaft, the magnets of the tool holder and the magnets of the shaft attract each other, and the tool holder is aligned with respect to the shaft in that phase. | 12-03-2015 |
20150360336 | CUTTER HOLDING DEVICE OF CUTTING MACHINE - The present invention provides a cutter holding device of a cutting machine, which includes: a mounting base and a holding member mounted in the mounting base. The mounting base includes a mounting section, iron cores mounted in the mounting section, and a winding wound around an outer circumference of the mounting section. The mounting section includes a mounting trough formed therein. The holding member is mounted in the mounting trough, wherein the iron cores and the winding collectively form first electromagnets, which upon application of electricity thereto, attract and fix the holding member in the mounting trough of the mounting base. The cutter holding device of the cutting machine of the present invention uses magnetic forces applied between the mounting base and the holding member for attraction and fixing so that it is easy to control the fixing and removal of the holding member and the operation is easy without any need of mechanical retention. A gap between the first and second bearings of the holding member and an inside surface of the mounting trough is made slightly large to prevent the holding member from being stuck in the mounting trough by glass chips and particles falling into the gap between the first and second bearings of the holding member and the inside surface of the mounting trough, and thus being hard to remove. | 12-17-2015 |
20160027678 | TUNABLE TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY - Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters. | 01-28-2016 |
20160039012 | Magnetic Coupling Spindle For Automatic Screwdrivers - A magnetic coupling spindle for automatic screwdrivers. The magnetic coupling spindle comprises: an axle shaft, configured with a bearing on its middle section; an axle cap, sleeved on one end of the axle shaft and covering the bearing; a sliding sleeve, sleeved on the end of the axle shaft far away from the axle cap. The sliding sleeve can slide along the axial direction and on the end toward the direction of the axle cap, a magnet is configured. The part of the periphery of the axle shaft sleeved by the sliding sleeve is formed with a slightly raised stage section extending from the toe, so that the sliding sleeve will not fall apart due to the sliding. | 02-11-2016 |
20160126124 | ELECTROSTATIC CHUCK - An electrostatic chuck is disclosed. In one aspect, the electrostatic chuck includes a top plate, wherein first and second regions adjacent to each other are formed at a surface of the top plate. The electrostatic chuck also includes a first absorption plate positioned at the first region and a second absorption plate positioned at the second region to be separated from the first absorption plate. The first and second absorption plates are configured to support the absorption target. | 05-05-2016 |