Class / Patent application number | Description | Number of patent applications / Date published |
264272150 | With component positioning procedure or incorporation of article positioning means | 21 |
20080251968 | RFID HARD CASE DEVICE AND METHOD OF MANUFACTURE - An RFID enabled waste/recycling container includes a molded plastic body; and a case containing an RFID device. The case includes a front surface and a rear surface defining a wedge-shape. The case is in-molded with the plastic body such that a substantial portion of the front surface and the rear surface are exposed. In another embodiment, the case is also designed to snap-fit to a waste/recycling container. | 10-16-2008 |
20080265461 | Method and Apparatus for Blow-Molding Containers with In-Mold Film Having RFID Tag Fused Thereto - An apparatus and method for manufacturing plastic containers having RFID tags embedded therein is disclosed. The bottles are manufactured using a blow-molding technique wherein an in-mold film having an RFID tag embedded therein is positioned or placed against the parison immediately prior to the blow mold being closed and the pressurized air being used to inflate the parison. The resulting container thus has an RFID tag fused thereto to allow for tracking and tracing of the container after manufacture, as well as providing a mechanism by which the authenticity of the bottle can be verified. | 10-30-2008 |
20080308969 | Mold Apparatus for Resin Encapsulation and Resin Encapsulation Method - To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar | 12-18-2008 |
20090014910 | METHOD AND ARRANGEMENT FOR FORMING ELECTRONIC DEVICE - An insert ( | 01-15-2009 |
20090045548 | Press with plate-like frame parts, and method for operating such a plate press - The present invention relates to a press for encapsulating electronic components, comprising: two displaceable mould parts ( | 02-19-2009 |
20090250836 | Production Method for Molded Coil - Disclosed is a method oft by using a plastic molding process, encapsulating an air-core coil with a moldable magnetic resin material prepared by kneading a mixture of a magnetic powder and a resin. The method comprises the steps of (a) preparing a molding die assembly which includes a plurality of dies adapted to define a cavity therewithin, and a positioning pin adapted to be movable in a vertical or horizontal direction within the cavity, (b) arranging the air-core coil at a given position within the cavity by the positioning pin, (c) charging the moldable magnetic resin material into the cavity and moving the positioning pin to a given retracted position in a course of the charging. | 10-08-2009 |
20110169191 | SEALING FRAME AND METHOD FOR COVERING A COMPONENT - A sealing frame for delimiting a surface of a component which is to be covered with a molding compound includes an upper frame part and a lower frame part which may be detachably joined together. The component to be covered with the molding compound is enclosable by the upper frame part and the lower frame part in such a way that a cavity is formed by the sealing frame and the component. The component is inserted into the upper frame par and lower frame part, and the upper and lower frame part are joined to form the sealing frame, so that the cavity is formed which is enclosed by the component and the upper frame part, and a molding compound is introduced into the cavity and cured to form a cover. | 07-14-2011 |
20110210477 | APPARATUS FOR MOLDING ELECTRONIC COMPONENTS - A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin. | 09-01-2011 |
20110210478 | METHOD AND EQUIPMENT FOR PROVIDING THE EDGE OF A STARTING SHEET WITH A DIELECTRIC STRIP - A device for providing the edge of a starting sheet of an electrode used in the electrolytic refining or recovery of metals with a dielectric part comprises a die space, in which the edge of the starting sheet of the electrode can at least partly be fitted, and a feeding device of the dielectric material for feeding the dielectric material into the die space. The device comprises changing members of the volume of the die space for pressing the dielectric material in the die space to that edge of the starting sheet of the electrode, which is at least partly fitted in the die space. | 09-01-2011 |
20120013040 | SUBSTRATE CARRIER FOR MOLDING ELECTRONIC DEVICES - A method of molding a substrate containing a plurality of electronic devices by providing a carrier comprising a frame which includes an adhesive film. The substrate is mounted onto the adhesive film of the carrier such that the frame surrounds the substrate. The carrier is placed in a mold such that the frame is located at a clamping area of the mold and the substrate is located at a molding area of the mold where molding cavities are located. The frame is clamped at the clamping area while the electronic devices are located in the molding cavities for molding with an encapsulant. | 01-19-2012 |
20120038083 | Continuous Injection Molding Processes and Systems with Retractable Core - Injection-molding processes and systems are described herein. An exemplary method involves: (a) holding one or more inserts in a desired position within a mold cavity by contacting a retractable core to at least a portion of each insert, wherein the retractable core is a feature of a mold plate; (b) while the one or more inserts are being held in the desired position by the retractable core, initiating an injection of molten plastic into the mold cavity; (c) retracting the retractable core from the one or more inserts while continuing the injection of molten plastic into the mold cavity, wherein retracting the retractable core creates additional cavity space within the mold cavity between the retractable core and the one or more inserts; and (d) continuing the injection of molten plastic into the mold cavity until the mold cavity, including the additional cavity space, is filled. The retractable core is preferably retracted at a point when molten plastic filling cavity space further from the retractable core has substantially cooled and hardened, while molten plastic filling cavity space in close proximity to the retractable core remains substantially heated. | 02-16-2012 |
20120104652 | ANTENNA FORMED WITH CASE AND METHOD OF MANUFACTURING THE SAME - There is provided an antenna integrally formed with a case and a method of manufacturing the same. An antenna integrally formed with a case according to an aspect of the invention includes: a case unit formed of a dielectric material; a radiator including a radiation unit tightly fixed to an outer surface of the case unit and terminal units each extending from an end portion of the radiation unit, passing through the case unit, and exposed on the inside of the case unit; and contact pins provided on a board disposed adjacent to the case unit and electrically connected to the individual terminal units. | 05-03-2012 |
20120187598 | METHOD AND APPARATUS OF COMPRESSION MOLDING TO REDUCE VOIDS IN MOLDING COMPOUNDS OF SEMICONDUCTOR PACKAGES - Disclosed are a method and an apparatus of compression molding to reduce voids in molding compounds of semiconductor packages. A compression mold jig set including a top mold and a bottom mold is provided and disposed inside a pressure chamber. A substrate disposed with chips is loaded on the top mold. An encapsulating material is filled in the cavity of the bottom mold. When heating the bottom mold to melt the encapsulating material, a positive air pressure more than 1 atm is provided in the pressure chamber in order to expel or reduce any bubbles trapped inside the encapsulating material. Then, the top mold is pressed downward to clamp with the bottom mold under the heating and high-pressure condition until the encapsulating material is pre-cured to transform a molding compound adhered to the substrate. Therefore, potential bubble trapped inside the molding compound can be eliminated or reduced to improve production yield, reliability and life time. | 07-26-2012 |
20130087944 | METHOD FOR PRODUCING RESIN MOLDED ARTICLE BY INJECTION MOLDING, AND INJECTION MOLDING DEVICE - Provided is a technology with which, when producing a resin molded article, the inside of which is provided with an insert component such as a terminal fitting, it is possible to prevent the insert component from being exposed at an inappropriate position, and to ensure the desired positional accuracy. In an injection molding device, the accuracy of the position of a terminal is improved by allowing a core-back mold to move after a terminal, which is an insert component, has been inserted in a terminal tip holding section of a slide mold. By allowing the core-back mold to move by only a prescribed amount prior to injection molding, a resin wall is formed between the core-back mold and the terminal. The inappropriate exposure and shorting of and the adhesion of foreign substances to, and the like, the terminal can thus be prevented. | 04-11-2013 |
20130140737 | STACKED SUBSTRATE MOLDING - A transfer mold assembly including a first mold chase; a second mold chase; a first lead frame; at least one first lead frame die mounted on the first lead frame; a second lead frame substantially identical to the first lead frame; at least one second lead frame die mounted on the second lead frame; and wherein the first and second mold chases define a transfer mold cavity and wherein the first and second lead frames are positioned in stacked relationship inside the transfer mold cavity. Also disclosed is a method of integrated circuit packaging. | 06-06-2013 |
20130175733 | SENSOR ELEMENT AND CARRIER ELEMENT FOR MANUFACTURING A SENSOR - A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing. | 07-11-2013 |
20140035197 | PROCESS FOR MANUFACTURING AN ORNAMENTAL DESIGN MOLDED ONTO AN EARPHONE/HEADPHONE CORD - A process can manufacture an ornamental design molded onto an earphone cord. The process involves the following steps. First, designing a top and bottom mold with mold earphone channels immediately adjacent to mold ornament channels. Then, boring a mold injection port into the top mold. After that, boring a material, injection channel into the bottom mold. Subsequently, inserting the earphone cord into the bottom mold earphone channel and the top mold earphone channel, Then, allowing melted material to flow from the top mold into the bottom mold and through the mold earphone channels and the mold ornament channels covering the earphone cord with material without damaging the earphone cord. Next, permitting the material to harden around the earphone cord forming a molded decorative symbol around the earphone cord. Then, removing the molded decorative symbol from the top mold and the bottom mold. | 02-06-2014 |
20140191440 | POTTING METHOD FOR LAMP CHAIN - A potting method for a lamp chain includes a) providing a mold having a potting groove; b) providing a fixing support which is fixedly kept in the potting groove; c) fixedly keeping a printed circuit board provided with a light emitting assembly in the fixed support; d) potting a potting material into the potting groove and curing the potting material; and e) removing the mold. | 07-10-2014 |
20150310968 | WIRING HARNESS MANUFACTURING METHOD - A wire harness manufacturing method includes a first step of covering a periphery of the wire with a molded body ( | 10-29-2015 |
20150340851 | Manufacturing Process of Molding Stress Control Module for Cross-Linked Polyethylene Insulation Cable Body Terminal - The present invention discloses a manufacturing process for a termination injection molding stress control module for cross-linked polyethylene insulated cable body, which comprises the steps of melting and cross-linking a cable factory insulation layer and a filling insulation; melting and cross-linking the cable factory semiconducting layer and a filling semiconducting layer; and melting and cross-linking the filling insulation and the filling semiconducting layer. | 11-26-2015 |
20180021993 | MOLDING SYSTEM FOR APPLYING A UNIFORM CLAMPING PRESSURE ONTO A SUBSTRATE | 01-25-2018 |