Class / Patent application number | Description | Number of patent applications / Date published |
264272130 | With curing procedure, or procedure or treatment to compensate for differential expansion | 9 |
20090115098 | Mould Part and Method for Encapsulating Electronic Components - The invention relates to a mould part for applying in a device for encapsulating electronic components mounted on a carrier, comprising: at least one mould cavity recessed into a contact side, a contact surface at least partially enclosing the mould cavity for medium-tight connection to the carrier of the electronic component, a feed channel for encapsulating material recessed into the contact surface and connecting to the mould cavity, a first outlet channel for gas, and an extraction space recessed into the contact surface. The invention also relates to a device for encapsulating electronic components mounted on a carrier and to a method for encapsulating electronic components mounted on a carrier. | 05-07-2009 |
20100052213 | Structure of Parts Made From Plural Composite Pieces and Method of Building Those Parts - A pre-mold part is formed by pre-molding the insert with the pre-molded part, and then the pre-molded part is inserted into the over-molded part composed of thermo plastic resin. After applying a heat treatment with the temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert formed as the composite mold part surrounding the pre-mold part, a firm contact between the insert and the resin surrounding the insert part without no gap at the interface between those parts is obtained. | 03-04-2010 |
20100289181 | Process for Producing Conductor Built-In Ceramic - [Problems] To provide a process for producing a conductor built-in ceramic which can eliminate the need to conduct metallic lead wire processing, can suppress the entry of a foreign matter, dust and the like from gaps between bases formed in dewaxing and firing and can reduce a dielectric breakdown failure, and a conductor built-in ceramic produced by the production process. | 11-18-2010 |
20110127694 | METHOD OF MANUFACTURING RESIN MOLDED ELECTRONIC COMPONENT (AS AMENDED) - A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold. | 06-02-2011 |
20120161361 | METHOD FOR POURING RESIN IN A STATOR OF AN ELECTRIC MACHINE, IN PARTICULAR AN AXIAL FLUX ELECTRIC MACHINE - A method for pouring resin in a stator ( | 06-28-2012 |
20120175812 | METHOD OF RESIN MOLDING, RESIN MOLDING APPARATUS AND FEEDING HANDLER - The resin molding method comprises the steps of: feeding a first resin to a cavity concave portion of a molding die set, which is opened, and a second resin to a pot thereof; feeding a work to a prescribed position of the molding die set, which corresponds to the cavity concave portion; closing the molding die set so as to clamp the work; and pressurizing and sending the molten second resin, which has been molten in the pot, to the cavity concave portion, by a manner of transfer-molding, so as to mix the molten first resin, which has been molten in the cavity concave portion, and the molten second resin and cure the mixed resin with maintaining a prescribed resin pressure. | 07-12-2012 |
20130207306 | Methods for Molding Integrated Circuits - A method includes molding a polymer onto a package component. The step of molding includes a first molding stage performed at a first temperature, and a second molding stage performed at a second temperature different from the first temperature. | 08-15-2013 |
20140333006 | APPARATUS FOR MOLDING A SEMICONDUCTOR WAFER AND PROCESS THEREFOR - Mold pieces ( | 11-13-2014 |
20160075058 | MANUFACTURING METHOD OF COIL COMPONENT AND COIL COMPONENT - A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body. | 03-17-2016 |