Class / Patent application number | Description | Number of patent applications / Date published |
257792000 | Including polyimide | 16 |
20090289376 | LIGHT-PROOF CHIP PACKAGING STRUCTURE AND METHOD FOR ITS MANUFACTURE - The present invention discloses a light-proof chip packaging structure, which comprises an electronic substrate, at least one semiconductor chip installed on the electronic substrate, and a light-proof film. The light-proof film comprises a main portion, which is substantially conformable to cover all the non-concealed faces of the semiconductor chip. The light-proof film also has an extension portion, which extends from the main portion and covers the areas neighboring the semiconductor chip. The light-proof film comprises a metallic layer capable of blocking light and an insulating layer interposing between the metallic layer and the semiconductor chip. The present invention can effectively reduce the gaps between the semiconductor chip and the light-proof film, whereby no bubble is formed in encapsulating the electronic substrate, thus reducing the possibility of damaging the packing structure. | 11-26-2009 |
20100007035 | Semiconductor device and method of manufacturing the same - A semiconductor device includes a substrate; an alignment mark formed on the substrate and composed of a metal film; a cover insulating film formed on the alignment mark and covering an entire surface of the alignment mark; and a polyimide film formed on the cover insulating film, and having an opening, which is opened on the alignment mark and has an end face aligning with an end face of the alignment mark, in plan view. | 01-14-2010 |
20100207282 | PRIMER RESIN FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): | 08-19-2010 |
20100252940 | POLYIMIDE SHIELD AND INTEGRATED CIRCUIT STRUCTURE HAVING THE SAME - A polyimide shield includes a base film layer that is made from polyimide, and a colored film layer that overlies the base film layer and that contains a coloring agent dispersed in a polymer. A method of making the polyimide shield includes forming the base film layer from polyimide and applying a liquid composition onto the base film layer. The liquid composition contains a polymer and the coloring agent that is dispersed in the polymer. An integrated circuit structure includes a circuitry substrate and the polyimide shield that covers the circuitry substrate. | 10-07-2010 |
20100308476 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a film thickness 0.5 to 2 times the thickness of the semiconductor chip. The sealing resin film is arranged on the semiconductor chip so that the thermosetting sealing resin layer faces the semiconductor chip. Heat is applied to the side of the circuit board, while applying pressure to the sealing resin film from the side of the mold release film by using a rubber head having a rubber hardness of 5-100 to bond the semiconductor chip on the circuit board. After sealing the semiconductor chip with the resin, the mold release film is peeled. | 12-09-2010 |
20110049731 | MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS - The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. | 03-03-2011 |
20110062604 | SCRATCH-RESISTANT COATINGS FOR PROTECTING FRONT-SIDE CIRCUITRY DURING BACKSIDE PROCESSING - Scratch-resistant coatings for protecting front-side microelectromechanical and semiconductor device features during backside processing are provided, along with methods of using the same. The coatings are non-photosensitive, removable, and tolerate high processing temperatures. These coatings also eliminate the need for a separate etch stop layer in the device design. The coatings are formed from a composition comprising a component dissolved or dispersed in a solvent system. The component is selected from the group consisting of styrene-acrylonitrile copolymers and aromatic sulfone polymers. | 03-17-2011 |
20110084411 | SEMICONDUCTOR DIE - A semiconductor die has a polyimide layer disposed on its top surface. At the corners of the die top, the polyimide layer is roughened or patterned, but not enough such that the die top is exposed. The patterned corners enhance adhesion of a mold compound later disposed on the die top by allowing for enhanced hydrogen bonding between the polyimide layer and the mold compound. | 04-14-2011 |
20110260343 | POLYMERIC COMPOSITIONS COMPRISING PER(PHENYLETHYNYL) ARENE DERIVATIVES - A polymeric composition comprising a first polymer chosen from a poly(arylene ether) polymer including polymer repeat units of the following structure: —(O—Ar | 10-27-2011 |
20120038067 | ENCAPSULATION METHODS FOR ORGANIC ELECTRICAL DEVICES - The disclosure provides methods and materials suitable for use as encapsulation barriers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device encapsulated by alternating layers of a silicon-containing bonding material and a ceramic material. The encapsulation methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices. | 02-16-2012 |
20120228784 | SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device configured by encapsulating a semiconductor element, partially or entirely covered with a polyimide, using an epoxy resin composition for encapsulating semiconductor device which contains an epoxy resin (A), a phenol resin (B), a curing accelerator (C), an inorganic filler (D), and a silane coupling agent (E) represented by the formula (1): | 09-13-2012 |
20120299203 | POLYMER HAVING SILPHENYLENE AND SILOXANE STRUCTURES, A METHOD OF PREPARING THE SAME, AN ADHESIVE COMPOSITION, AN ADHESIVE SHEET, A PROTECTIVE MATERIAL FOR A SEMICONDUCTOR DEVICE, AND A SEMICONDUCTOR DEVICE - One aspect of the present invention provides a polymer having repeating units represented by the formulas (1-1), (1-2) and (1-3) and weight-average molecular weight of from 3,000 to 500,000, as determined by GPC using tetrahydrofuran as a solvent, reduced to polystyrene. Another aspect of the present invention provides an adhesive composition comprising (A) the polymer, (B) a thermosetting resin, and (C) a compound having flux activity. Further, the present invention provides an adhesive sheet having an adhesive layer made of the adhesive composition, a protective material for a semiconductor device, which has the adhesive layer, and a semiconductor device having a cured product obtained from the adhesive composition. | 11-29-2012 |
20140015149 | SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENCAPSULATION FILM-LIKE ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant. | 01-16-2014 |
20140284821 | Method of curing thermoplastics with microwave energy - A method for densifying thermoplastics, particularly polyimides, for use in conjunction with electronic circuits while producing improved physical properties and a high degree of crystallinity, involves variable frequency microwave (VFM) processing at temperatures typically 100° C. below the glass transition temperature or lower, for times of about 50 to 100 minutes. It is particularly applicable to polymers based on BPDA-PPD, but may also be generally applied to other intentionally designed polyimide structures with the same features. The invention enables the creation of layered structures involving integrated circuits with small feature sizes and overcoatings of polymers with high T | 09-25-2014 |
20160111353 | EMBEDDING THIN CHIPS IN POLYMER - Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can he generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region. | 04-21-2016 |
20190148252 | METHOD OF CURING THERMOPLASTICS WITH MICROWAVE ENERGY | 05-16-2019 |