Class / Patent application number | Description | Number of patent applications / Date published |
257391000 | Selected groups of complete field effect devices having different threshold voltages (e.g., different channel dopant concentrations) | 15 |
20080230849 | DEVICE COMPRISING DOPED NANO-COMPONENT AND METHOD OF FORMING THE DEVICE - A device comprising a doped semiconductor nano-component and a method of forming the device are disclosed. The nano-component is one of a nanotube, nanowire or a nanocrystal film, which may be doped by exposure to an organic amine-containing dopant. Illustrative examples are given for field effect transistors with channels comprising a lead selenide nanowire or nanocrystal film and methods of forming these devices. | 09-25-2008 |
20080237740 | SEMICONDUCTOR DEVICE AND THE MANUFACTURING METHOD THEREOF - A method of manufacturing a semiconductor device is provided. First, a substrate is provided. The substrate includes a high-voltage device region and a low-voltage device region. The high-voltage device region has a source/drain predetermined region, a pick-up predetermined region and a channel predetermined region. A first dielectric layer is formed on the substrate. Then, the first dielectric layer in the low-voltage device region is removed along with the first dielectric layer in the source/drain predetermined region and the pick-up predetermined region. Afterwards, a second dielectric layer is formed in the low-voltage device region. The thickness of the second dielectric layer is smaller than the thickness of the first dielectric layer. Then, gates are formed in the channel predetermined region and the low-voltage device region respectively. Next, a source/drain region is formed in the substrate of the source/drain predetermined region. | 10-02-2008 |
20100200930 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - An improvement is provided in a manufacturing yield of a semiconductor device including transistors in which gate insulating films have different thicknesses. After a high-breakdown-voltage insulating film is formed over a silicon substrate, a surface of the high-breakdown-voltage insulating film is abraded for a reduction in the thickness thereof so that a middle-breakdown-voltage insulating film is formed to be adjacent to the high-breakdown-voltage insulating film. The high-breakdown-voltage insulating film is formed by a thermal oxidation method so as to extend from an inside of the main surface of the silicon substrate to an outside thereof. The middle-breakdown-voltage insulating film is formed so as to be thinner than the high-breakdown-voltage insulating film. The high-breakdown-voltage insulating film is formed as the gate insulating film of a high-breakdown-voltage MIS transistor, while the middle-breakdown-voltage insulating film is formed as the gate insulating film of a middle-breakdown-voltage MIS transistor. | 08-12-2010 |
20100301426 | DEPLETION MOS TRANSISTOR AND ENHANCEMENT MOS TRANSISTOR - A semiconductor memory device includes a first transistor. The first transistor includes a gate electrode, a channel region, a source region, a source region, an overlapping region, a contact region, and an impurity diffusion region. The channel region has a first impurity concentration. The source and drain regions have a second impurity concentration. The overlapping region is formed in the semiconductor layer where the channel region overlaps the source region and the drain region, and has a third impurity concentration. The contact region has a fourth impurity concentration. The impurity diffusion region has a fifth impurity concentration higher than the second impurity concentration and lower than the fourth impurity concentration. The impurity diffusion region is in contact with the contact region and away from the overlapping region and positioned at least in a region between the contact region and the overlapping region. | 12-02-2010 |
20110175175 | SEMICONDUCTOR DEVICE FOR APPLYING COMMON SOURCE LINES WITH INDIVIDUAL BIAS VOLTAGES - Provided is a semiconductor device for applying common source lines with individual bias voltages. The device includes a substrate, cell transistors arrayed in a cell matrix shape on the substrate and configured to have gate insulating patterns, gate electrodes, common source regions, drain regions and channel regions. Word lines are configured to electrically interconnect the gate electrodes with each other. Common source lines are shared between only a pair of the neighboring word lines and are configured to electrically interconnect the common source regions with each other. Drain metal contacts and source metal contacts are arranged in a straight line on the drain regions. Bit lines are electrically connected to the drain metal contacts. And impurity regions are configured to control the threshold voltage of the channel regions. | 07-21-2011 |
20110221008 | Semiconductor Packaging and Fabrication Method Using Connecting Plate for Internal Connection - A semiconductor package with connecting plate for internal connection comprise: a plurality of chips each having a plurality of contact areas on a top surface; one or more connecting plates having a plurality of electrically isolated connecting plate portions each connecting a contact area of the semiconductor chips. The method of making the semiconductor package includes the steps of connecting one or more connecting plates to a plurality of semiconductor chips, applying a molding material to encapsulate the chips and the connecting plates, separating a plurality of connecting plate portions of the connecting plates by shallow cutting through or by grinding. | 09-15-2011 |
20110316092 | Mask Rom - A mask read-only memory (ROM) includes parallel doping lines of a second conductivity type formed in a substrate of a first conductivity type, a first insulation film formed on the doping lines and the substrate, conductive pads fainted on the first insulation film, a second insulation film formed on the first insulation film and the conductive pads, parallel wires formed on the second insulation film extending perpendicular to the doping lines, contact plugs formed in the first insulation film that connect the doping lines to the conductive pads, and vias formed in the second insulation film that connect the conductive pads to the wires, wherein crossings of the doping lines and the wires define memory cells, contact plugs and vias are formed in memory cells of a first type, and at least one of the contact plug and via are missing from memory cells of a second type. | 12-29-2011 |
20120043620 | Multiple Threshold Voltages in Field Effect Transistor Devices - A method for fabricating a field effect transistor device includes forming a first conducting channel and a second conducting channel, forming a first gate stack on the first conducting channel to partially define a first device, forming second gate stack on the second conducting channel to partially define a second device, implanting ions to form a source region and a drain region connected to the first conducting channel and the second conducting channel, forming a masking layer over second device, a portion of the source region and a portion of the drain region, performing a first annealing process operative to change a threshold voltage of the first device, removing a portion of the masking layer to expose the second device, and performing a second annealing process operative to change the threshold voltage of the first device and a threshold voltage of the second device. | 02-23-2012 |
20140217516 | CMOS Image Sensor - A CMOS image sensor includes a photodiode, a plurality of transistors for transferring charges accumulated at the photodiode to one column line, and a voltage dropping element connected to a gate electrode of at least one transistor among the plurality of transistors for expanding a saturation region of the transistor by dropping down a gate voltage inputted to the gate electrode of the at least one transistor. | 08-07-2014 |
20140306292 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A first transistor includes a first impurity layer of a first conduction type formed in a first region of a semiconductor substrate, a first epitaxial semiconductor layer formed above the first impurity layer, a first gate insulating film formed above the first epitaxial semiconductor layer, a first gate electrode formed above the first gate insulating film, and first source/drain regions of a second conduction type formed in the first epitaxial semiconductor layer and in the semiconductor substrate in the first region. A second transistor includes a second impurity layer of the first conduction type formed in a second region of the semiconductor substrate, a second epitaxial semiconductor layer formed above the second impurity layer and being thinner than the first epitaxial semiconductor layer, a second gate insulating film formed above the second epitaxial semiconductor layer, a second gate electrode formed above the second gate insulating film, and second source/drain regions of the second conduction type formed in the second epitaxial semiconductor layer and in the semiconductor substrate in the second region. | 10-16-2014 |
20140353765 | DOUBLE SIDEWALL IMAGE TRANSFER PROCESS - Methodology enabling a generation of fins having a variable fin pitch less than 40 nm, and the resulting device are disclosed. Embodiments include: forming a hardmask on a substrate; providing first and second mandrels on the hardmask; providing a first spacer on each side of each of the first and second mandrels; removing the first and second mandrels; providing, after removal of the first and second mandrels, a second spacer on each side of each of the first spacers; and removing the first spacers. | 12-04-2014 |
20150380408 | Method of Forming Different Voltage Devices with High-K Metal Gate - A method and apparatus are described for integrating high voltage (HV) transistor devices and medium voltage or dual gate oxide (DGO) transistor devices with low voltage (LV) core transistor devices on a single substrate, where each high voltage transistor device ( | 12-31-2015 |
20160049416 | INTEGRATION OF SEMICONDUCTOR MEMORY CELLS AND LOGIC CELLS - A polysilicon gate electrode is formed in a memory cell area, and a dummy polysilicon gate electrode is formed in a logic cell area of a silicon substrate. The dummy polysilicon gate electrode is removed and a gate insulation film and a metal gate electrode having a recess portion are formed. Further, contact holes are formed on source regions and drain regions of the memory cell area and the logic cell area. The recess portion of the metal gate electrode and the contact holes are filled with a wiring metal, substantially simultaneously, and thereafter the wiring metal is planarized by polishing. | 02-18-2016 |
20160064388 | NONVOLATILE MEMORY DEVICE - The nonvolatile memory device includes a plurality of memory cells being stacked in a direction perpendicular to a substrate. A string select transistor is connected between the memory cells and a bit line. A string select line is connected to the string select transistor. A one directional device is connected between the substrate and the string select line and configured to transmit a bias voltage from the substrate toward the string select line in an erase operation. | 03-03-2016 |
20160197087 | MASK READ-ONLY MEMORY DEVICE AND FABRICATION METHOD THEREOF | 07-07-2016 |