Entries |
Document | Title | Date |
20080251859 | Semiconductor Module - A component includes a first semiconductor chip attached to a first carrier and second semiconductor chip attached to a second carrier. The first carrier has a first extension, which forms a first external contact element. The second carrier has a second extension, which forms a second external contact element. The first and the second carriers are arranged in such a way that the first and the second extension point in different directions. | 10-16-2008 |
20080265335 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING GATE AND METAL LINE THEREOF - A gate in a semiconductor device is formed to have a dummy gate pattern that protects a gate. Metal lines are formed to supply power for a semiconductor device and transfer a signal. A semiconductor device includes a quad coupled receiver type input/output buffer. The semiconductor device is formed with a gate line that extends over an active region, and a gate pad located outside of the active region. The gate line and the gate pad are adjoined such that the gate line and a side of the gate pad form a line. Dummy gates may also be applied. The semiconductor device includes a first metal line patterns supplying power to a block having a plurality of cells, a second metal line pattern transferring a signal to the cells, and dummy metal line patterns divided into in a longitudinal direction. | 10-30-2008 |
20080277738 | MEMORY CELLS, MEMORY BANKS, MEMORY ARRAYS, AND ELECTRONIC SYSTEMS - Some embodiments include memory cells containing vertical floating bodies, and containing gates which entirely laterally surround the floating bodies. Some embodiments include memory banks which contain multiple memory cells extending from a conductively-doped diffusion region. Some embodiments include memory arrays in which electrically insulative partitions extend through a conductively-doped diffusion region to divide the diffusion region into a plurality of lines, and in which multiple memory cells extend vertically upward from each of such lines. Some embodiments include electronic systems containing processors in data communication with memory, and in which the memory includes an array of zero capacitor one transistor memory cells. Some embodiments include methods of forming vertically-extending memory cells. Some embodiments include methods of forming of banks of memory cells in which all of the memory cells extend to a conductively-doped region. Some embodiments include methods of forming memory arrays. | 11-13-2008 |
20080283935 | TRENCH ISOLATION STRUCTURE AND METHOD OF MANUFACTURE THEREFOR - The disclosure provides a trench isolation structure, a semiconductor device, and a method for manufacturing a semiconductor device. The semiconductor device, in one embodiment, includes a substrate having a first device region and a second device region, wherein the first device region includes a first gate structure and first source/drain regions and the second device region includes a second gate structure and second source/drain regions. The semiconductor device further includes a trench isolation structure configured to isolate the first device region from the second device region, the trench isolation structure comprising: 1) an isolation trench located within the substrate, wherein the isolation trench includes an opening portion and a bulbous portion, and further wherein a maximum width of the opening portion is less than a maximum width of the bulbous portion, and 2) dielectric material substantially filling the isolation trench. | 11-20-2008 |
20080296698 | METHOD FOR SUPPRESSING LAYOUT SENSITIVITY OF THRESHOLD VOLTAGE IN A TRANSISTOR ARRAY - A method for smoothing variations in threshold voltage in an integrated circuit layout. The method begins by identifying recombination surfaces associated with transistors in the layout. Such recombination surfaces are treated to affect the recombination of interstitial atoms adjacent such surfaces, thus minimizing variations in threshold voltage of transistors within the layout | 12-04-2008 |
20080296699 | SEMICONDUCTOR DEVICE IN PERIPHERAL CIRCUIT REGION USING A DUMMY GATE - A semiconductor device in a peripheral circuit region includes a semiconductor substrate having a plurality of active areas which are disposed distantly from each other; a gate pattern including at least one gate disposed on the active area; a dummy gate disposed between the active areas and first and second pads; first and second pads connected to both sides of the gate and the dummy gate, respectively; and a first wiring formed so as to be in contact with at least one of the first and second pads. | 12-04-2008 |
20080296700 | METHOD OF FORMING GATE PATTERNS FOR PERIPHERAL CIRCUITRY AND SEMICONDUCTOR DEVICE MANUFACTURED THROUGH THE SAME METHOD - A method for forming gate patterns for a semiconductor device includes defining a cell array region and a peripheral region on a substrate. A layout is defined in a peripheral region. The layout comprises patterns having a plurality of fingers that extend along a first direction, wherein the fingers are spaced apart from adjacent fingers in a second direction at substantially the same interval, the patterns including gate patterns. | 12-04-2008 |
20080315323 | METHOD FOR FORMING LINE PATTERN ARRAY, PHOTOMASK HAVING THE SAME AND SEMICONDUCTOR DEVICE FABRICATED THEREBY - A method of forming a line pattern array comprises the steps of setting a layout which includes first continuous line patterns arranged to have a first line width and a second continuous line pattern arranged to have a second line width larger than the first line width and positioned outside the first continuous line patterns; transferring the layout on a wafer; and inducing light scattering by changing an outermost pattern of the first continuous line patterns, which is most closely adjacent to the second continuous line patterns, into a plurality of dotted line patterns, wherein the plurality of the dotted patterns are arranged in a line form in order that a line pattern, which is different from the first continuous line patterns in line width, is formed based on a size of the dotted patterns. | 12-25-2008 |
20090001481 | DIGITAL CIRCUITS HAVING ADDITIONAL CAPACITORS FOR ADDITIONAL STABILITY - A semiconductor structure and a method for forming the same. The semiconductor structure includes (a) a semiconductor substrate, (b) a shallow trench isolation (STI) region on the semiconductor substrate, and (c) a first semiconductor transistor on the semiconductor substrate. The first semiconductor transistor includes (I) a first source/drain region, (ii) a second source/drain region, and (iii) a first gate electrode region. The first and second source/drain regions are doped with a same doping polarity. The semiconductor structure further includes a first doped region in the semiconductor substrate. The first doped region is on a first side wall and a bottom wall of the STI region. The first doped region is in direct physical contact with the second source/drain region. The first doped region and the second source/drain region are doped with a same doping polarity. | 01-01-2009 |
20090001482 | Transistor of Semiconductor Device and Method for Fabricating the Same - Provided is a transistor of a semiconductor device and a method for fabricating the same. A transistor of a semiconductor device may include: a semiconductor substrate having an active region defined by an isolation layer; a recess trench formed in the active region and disposed to cross the semiconductor substrate in one direction; and a gate line formed in a straight line pattern, overlapping the recess trench and disposed to cross the recess trench at approximately right angles. | 01-01-2009 |
20090008722 | Three-Dimensional Memory Cells - The present invention discloses a three-dimensional memory (3D-M) with polarized 3D-ROM (three-dimensional read-only memory) cells. Polarized 3D-ROM can ensure a larger unit array and therefore, a better integratibility. | 01-08-2009 |
20090014811 | Dynamic Array Architecture - A semiconductor device includes a substrate portion and a number of diffusion regions defined within the substrate portion. The diffusion regions are separated from each other by a non-active region of the substrate portion. The semiconductor device includes a number of linear gate electrode segments defined to extend over the substrate portion in a single common direction. In one embodiment, the diffusion regions are defined in a non-symmetrical manner relative to a centerline of the substrate portion. In another embodiment, the substrate portion corresponds to a region of the semiconductor device in which first and second cells are defined, and respectively include diffusion shapes of different size. In another embodiment, one or more of the diffusion regions is defined to have a periphery formed by more than four orthogonally related sides. | 01-15-2009 |
20090072322 | SEMICONDUCTOR DEVICES INCLUDING LINE PATTERNS SEPARATED BY CUTTING REGIONS - Semiconductor devices are provided. A semiconductor device can include a substrate and a plurality of dummy line patterns on the substrate that extend in a first direction parallel with one another. Each of the dummy line patterns can include a plurality of sub-line patterns aligned along the first direction and which are separated from each other by at least one cutting region therebetween. The dummy line patterns can include first and second dummy line patterns which are adjacent to each other in a second direction that is perpendicular to the first direction. At least one of the cutting regions between a pair of sub-line patterns of the first dummy line pattern is aligned with and bounded by one of the sub-line patterns of the second dummy line pattern in the second direction. | 03-19-2009 |
20090079011 | METHOD AND STRUCTURE FOR IMPROVING DEVICE PERFORMANCE VARIATION IN DUAL STRESS LINER TECHNOLOGY - A method and semiconductor structure that overcome the dual stress liner boundary problem, without significantly increasing the overall size of the integrated circuit, are provided. In accordance with the present invention, the dual stress liner boundary or gap therebetween is forced to land on a neighboring dummy gate region. By forcing the dual stress liner boundary or gap between the liners to land on the dummy gate region, the large stresses associated with the dual stress liner boundary or gap are transferred to the dummy gate region, not the semiconductor substrate. Thus, the impact of the dual stress liner boundary on the nearest neighboring FET is reduced. Additionally, benefits of device variability and packing density are achieved utilizing the present invention. | 03-26-2009 |
20090096035 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE - A method for manufacturing a semiconductor device has forming a first insulating film on a semiconductor substrate, forming an electrode layer on said first insulating film, etching said electrode layer, said first insulating film and said semiconductor substrate of a first predetermined region to form a trench, burying an element-isolating insulating film in said trench, forming a second insulating film on said element-isolating insulating film and above said electrode layer, etching said second insulating film, said electrode layer and said element-isolating insulating film of a second predetermined region to form a gate pattern and a dummy pattern, forming a third insulating film for covering said gate pattern and said dummy pattern, and planarizing said third insulating film using said second insulating film as a stopper. | 04-16-2009 |
20090121296 | Semiconductor device including dummy gate part and method of fabricating the same - In a reliable semiconductor device and a method of fabricating the semiconductor device, a difference in height between upper surfaces of a cell region and a peripheral region (also referred to as a level difference) is minimized by optimizing dummy gate parts. The semiconductor device includes a semiconductor substrate including a cell region and a peripheral region surrounding the cell region, a plurality of dummy active regions surrounded by a device isolating region and formed apart from each other, and a plurality of dummy gate parts formed on the dummy active regions and on the device isolating regions located between the dummy active regions, wherein each of the dummy gate parts covers two or more of the dummy active regions. | 05-14-2009 |
20090127633 | NON-VOLATILE MEMORY DEVICES AND METHODS OF FORMING THE SAME - In one embodiment, a semiconductor memory device includes a substrate having first and second active regions. The first active region includes a first source and drain regions and the second active region includes a second source and drain regions. A first interlayer dielectric is located over the substrate. A first conductive structure extends through the first interlayer dielectric. A first bit line is on the first interlayer dielectric. A second interlayer dielectric is on the first interlayer dielectric. A contact hole extends through the second and first interlayer dielectrics. The device includes a second conductive structure within the contact hole and extending through the first and second interlayer dielectrics. A second bit line is on the second interlayer dielectric. A width of the contact hole at a bottom of the second interlayer dielectric is less than or substantially equal to a width at a top of the second interlayer dielectric. | 05-21-2009 |
20090127634 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a semiconductor substrate having an active region, a plurality of gate electrodes formed on the active region with a gate insulating film therebetween, and a dummy pattern formed on the active region in at least a part thereof between the gate electrodes. The dummy pattern is formed so that a spacing between gate electrodes adjacent to each other, and a spacing between the dummy pattern and the gate electrodes adjacent to the dummy pattern, are within predetermined ranges. | 05-21-2009 |
20090134472 | SEMICONDUCTOR DEVICE - A semiconductor device according to an embodiment of the invention includes: a semiconductor substrate; device regions formed on the semiconductor substrate, the device regions having a length direction in a predetermined direction; a plurality of transistors having gate electrodes, respectively, the gate electrodes extending in a direction approximately perpendicular to the predetermined direction, the plurality of transistors having a source/drain region and a channel region having a channel direction approximately parallel to the predetermined direction in the device region; a plurality of SRAM cells disposed in an array, each of the plurality of SRAM cells including the plurality of transistors; and a dummy region made of the substantially same material as that of the device regions, the dummy region being formed between the outermost device regions of the SRAM cells adjacent to each other in the direction approximately perpendicular to the predetermined direction, the dummy region having a length direction approximately parallel to the predetermined direction. | 05-28-2009 |
20090140349 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PROCESS FOR MANUFACTURING THE SAME - A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines. | 06-04-2009 |
20090146219 | Integrated circuit having memory cell array, and method of manufacturing same - An integrated circuit device (e.g., a logic device or a memory device) having (i) a memory cell array which includes a plurality of memory cells (for example, memory cells having electrically floating body transistors) arranged in a matrix of rows and columns, wherein each memory cell includes at least one transistor having a gate, gate dielectric and first, second and body regions, wherein: (i) the gate and gate dielectric are disposed on or above the first semiconductor layer that is disposed on or above an insulating layer or region, (ii) the body region of each transistor is electrically floating, (iii) the transistors of adjacent memory cells include a layout that provides a common first region, and (iv) the first regions of the transistors are comprised of a semiconductor material which is different from the material of the first semiconductor layer. Also disclosed are inventive methods of manufacturing, for example, such integrated circuit devices. | 06-11-2009 |
20090166755 | GROWTH OF UNFACETED SIGE ALONG A SEMICONDUCTOR DEVICE WIDTH - Semiconductor devices and fabrication methods are provided in which disposable gates are formed over isolation regions. Sidewall structures, including disposable sidewall structures, are formed on sidewalls of the disposable gates. An epitaxially grown silicon germanium is formed in recesses defined by the sidewalls. The process provides a compressive strained channel in the device without faceting of the epitaxially grown silicon germanium. | 07-02-2009 |
20090166756 | MOS Transistor and Semiconductor Integrated Circuit - A MOS transistor includes plural transistor cell blocks arranged adjacently in parallel to one another, wherein the plural transistor cell blocks are configured to have plural transistor cells, plural boundaries that are parallel to the plural transistor cells, and plural back gates arranged at the plural boundaries, each of the plural transistor cell blocks has two boundaries of the plural boundaries, wherein the plural transistor cells have a substantially striped shape, and each of the plural transistor cell blocks includes: at least one drain; plural sources; and plural extended gates, wherein each of the plural transistor cells is formed from one of the plural extended gates sandwiched by one of at least one drain and one of the plural sources, one of the plural sources is adjacent to one of two boundaries, and another one of the plural sources is adjacent to another one of two boundaries. | 07-02-2009 |
20090174008 | METHOD AND STRUCTURE TO PROTECT FETs FROM PLASMA DAMAGE DURING FEOL PROCESSING - Protecting a FET from plasma damage during FEOL processing by forming a FET-like structure in conjunction with and adjacent to an FET, in a same well as the FET, but having a body doped opposite to the well polarity. The FET-like structure is formed with thinner oxide than the gate oxide of the FET, has a gate structure (poly) connected with the gate of the FET, and may be shorted out by the first metal layer (M | 07-09-2009 |
20090206420 | SEMICONDUCTOR DEVICE AND METHOD - A semiconductor device and method is disclosed. One embodiment provides an active region in a semiconductor substrate, including a first terminal region and a second terminal region. wherein the active region is interrupted by an inactive region, wherein an electrical power dissipation in the inactive region is zero or smaller than an electrical power dissipation in the active region; and a metallization layer arranged with respect to the active region on a surface of the semiconductor device and at least partly overlapping the active area, wherein the metallization layer is divided into a first part, in electrical contact to the first terminal region, and a second part, in electrical contact to the second terminal region, wherein the first and the second part are separated by a gap; and wherein the gap and the inactive region are mutually arranged so that an electrical power dissipation below the gap is reduced compared to an electrical power dissipation below the first part and the second part of the metallization layer. | 08-20-2009 |
20090236672 | SEMICONDUCTOR DEVICE - A semiconductor device includes a plurality of metal-insulator-semiconductor (MIS) transistors formed on a surface portion of a semiconductor substrate; and an isolation region isolating each of element regions of the MIS transistors, the isolation region including a first isolation region formed with a coating type insulating film embedded in a first trench, the first trench surrounding each of the element regions of the MIS transistors, and a second isolation region formed with a coating type insulating film embedded in a second trench, the second trench surrounding at least one of the first isolation regions with a predetermined distance from each of the first isolation regions, wherein the semiconductor substrate exists between the first isolation region and the second isolation region. | 09-24-2009 |
20090236673 | METHOD FOR SUPPRESSING LAYOUT SENSITIVITY OF THRESHOLD VOLTAGE IN A TRANSISTOR ARRAY - A method for smoothing variations in threshold voltage in an integrated circuit layout. The method begins by identifying recombination surfaces associated with transistors in the layout. Such recombination surfaces are treated to affect the recombination of interstitial atoms adjacent such surfaces, thus minimizing variations in threshold voltage of transistors within the layout | 09-24-2009 |
20090261422 | CELL STRUCTURE OF SEMICONDUCTOR DEVICE - A cell structure of a semiconductor device includes an active region, having a concave portion, and an inactive region that defines the active region. A gate pattern in the active region is arranged perpendicular to the active region. A landing pad on the active region and the inactive region contacts the active region. A bit line pattern on the inactive region intersects the gate pattern perpendicularly, the bit line pattern being electrically connected to the landing pad and having a first protrusion corresponding to the concave portion of the active region. | 10-22-2009 |
20090273038 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - A technique is provided which permits formation within a single chip both a field effect transistor of high reliability capable of suppressing the occurrence of a crystal defect and a field effect transistor of a high integration degree. In a mask ROM section having an element isolation region with an isolation width of smaller than 0.3 μm, a planar shape of each active region ACT is made polygonal by cutting off the corners of a quadrangle, thereby suppressing the occurrence of a crystal defect in the active region ACT and diminishing a leakage current flowing between the source and drain of a field effect transistor. In a sense amplifier data latch section which is required to have a layout of a small margin in the alignment between a gate G of a field effect transistor and the active region ACT, the field effect transistor is disposed at a narrow pitch by making the active region ACT quadrangular. | 11-05-2009 |
20090273039 | SEMICONDUCTOR DEVICE - A semiconductor device in which potential is uniformly controlled and in which the influence of noise is reduced. A p-type well region is formed beneath a surface of a p-type Si substrate. n-type MOS transistors are formed on the p-type well region. An n-type well region is formed in the p-type Si substrate so that it surrounds the p-type well region. A plurality of conductive regions which pierce through the n-type well region are formed at regular intervals. By doing so, parasitic resistance from the p-type Si substrate, through the plurality of conductive regions, to the n-type MOS transistors becomes low. Accordingly, when back bias is applied to a contact region, the back bias potential of the n-type MOS transistors can be controlled uniformly. As a result, the influence of noise from the p-type Si substrate or the p-type well region can be reduced. | 11-05-2009 |
20090309169 | Structure for Preventing Leakage of a Semiconductor Device - A structure for preventing leakage of a semiconductor device is provided. The structure comprises a shielding line, for shielding the features beneath thereof, located under a conductive line which crosses over a region having high voltage device. The shielding line is wider than the conductive line. | 12-17-2009 |
20100006951 | Semiconductor Device Portion Having Sub-193 Nanometers -Sized Gate Electrode Conductive Structures Formed from Rectangular Shaped Gate Electrode Layout Features and Having Equal Number of PMOS and NMOS Transistors - A semiconductor device is disclosed as having a substrate portion that includes a plurality of diffusion regions that include at least one p-type diffusion region and at least one n-type diffusion region. A gate electrode level region is formed above the substrate portion to include a number of conductive features defined to extend in only a first parallel direction. Each of the conductive features within the gate electrode level region is fabricated from a respective originating rectangular-shaped layout feature. Within a five wavelength photolithographic interaction radius within the gate electrode level region, a width size of the conductive features is less than 193 nanometers, which is the wavelength of light used in a photolithography process to fabricate the conductive features. The conductive features within the gate electrode level region form an equal number of PMOS and NMOS transistor devices. | 01-14-2010 |
20100019329 | Method and apparatus to reduce thermal variations within an integrated circuit die using thermal proximity correction - A method (and semiconductor device) of fabricating a semiconductor device utilizes a thermal proximity correction (TPC) technique to reduce the impact of thermal variations during anneal. Prior to actual fabrication, a location of interest (e.g., a transistor) within an integrated circuit design is determined and an effective thermal area around the location is defined. Thermal properties of structures intended to be fabricated within this area are used to calculate an estimated temperature that would be achieved at the location of interest from a given anneal process. If the estimated temperature is below or above a predetermined target temperature (or range), TPC is performed. Various TPC techniques may be performed, such as the addition of dummy cells and/or changing dimensions of the structure to be fabricated at the location of interest (resulting in an modified thermally corrected design, to suppress local variations in device performance caused by thermal variations during anneal. | 01-28-2010 |
20100084715 | PHOTO ALIGNMENT MARK FOR A GATE LAST PROCESS - A semiconductor device is provided which includes a semiconductor substrate having a first region and a second region, the first and second regions being isolated from each other, a plurality of transistors formed in the first region, an alignment mark formed in the second region, the alignment mark having a plurality of active regions in a first direction, and a dummy gate structure formed over the alignment mark, the dummy gate structure having a plurality of lines in a second direction different from the first direction. | 04-08-2010 |
20100096703 | Semiconductor device and manufacturing method thereof - Flexibility for the design of the pattern layout of the gate lead-out electrode and the source electrode is enhanced without increasing the chip thickness of the semiconductor device. A semiconductor device includes a cell region where plural transistor cells are arranged and a gate finger region different from a region where the cell region is formed. In the cell region, a gate electrode formed of a polysilicon (first conductive material) is formed. A polysilicon layer formed indivisibly with the gate electrode is formed in the gate finger region. An adhesion metal layer and a wiring metal layer are formed above the polysilicon layer by a lift-off method. The gate lead-out electrode is formed of a laminate structure including the polysilicon layer, the adhesion metal layer, and the wiring metal layer. A single layer of interlayer insulation film covering them is formed, on which a source electrode is formed. | 04-22-2010 |
20100155852 | Integrating Diverse Transistors On The Same Wafer - Different types of transistors, such as memory cells, higher voltage, and higher performance transistors, may be formed on the same substrate. A transistor may be formed with a first polysilicon layer covered by a dielectric. A second polysilicon layer over the dielectric may be etched to form a sidewall spacer on the gate of the transistor. The sidewall spacer may be used to form sources and drains and to define sub-lithographic lightly doped drains. After removing the spacer, the underlying dielectric may protect the lightly doped drains. | 06-24-2010 |
20100155853 | MULTIPLEXER AND METHOD OF MANUFACTURING THE SAME - A multiplexer can include a signal line arranged on a substrate and including a plurality of data wires extending in a first direction and electrically insulated from one another, where each of the data wires has at least one recess to provide at least two data wiring pieces. An address line is arranged on the signal line and includes a plurality of coding lines extending in a second direction different from the first direction and electrically insulated from the data wires. A plurality of switching elements are positioned in the recesses of the data wires and make electrical contact with the coding lines, where the switching element is configured to switch a data signal applied to the data wiring on and off in accordance with a coding signal applied to the coding lines, so that one of the data wires is selected according to a binary code of the address line corresponding to combinations of the coding lines to which coding signal is applied. | 06-24-2010 |
20100164013 | RANDOM PERSONALIZATION OF CHIPS DURING FABRICATION - Disclosed are embodiments of a method for randomly personalizing chips during fabrication, a personalized chip structure and a design structure for such a personalized chip structure. The embodiments use electronic device design and manufacturing processes to randomly or pseudo-randomly create a specific variation in one or more instances of a particular electronic device formed on each chip. The device design and manufacturing processes are tuned so that the specific variation occurs with some predetermined probability, resulting in a desired hardware distribution and personalizing each chip. The resulting personalized chips can be used for modal distribution of chips. For example, chips can be personalized to allow sorting when a single chip design can be used to support multiple applications. The resulting personalized chips can also be used for random number generation for creating unique on-chip identifiers, private keys, etc. | 07-01-2010 |
20100193877 | Memory Array Structure With Strapping Cells - A memory array with a row of strapping cells is provided. In accordance with embodiments of the present invention, strapping cells are positioned between two rows of a memory array. The strapping cells provide a P+ strap between N+ active areas of two memory cells in a column and provide an N+ strap between P+ active areas of two memory cells in a column of the memory array. The strapping cells provide an insulating structure between the two rows of the memory array and create a more uniform operation of the memory cells regardless of the positions of the memory cells within the memory array. In an embodiment, a dummy N-well may be formed along the outer edge of the memory array in a direction perpendicular to the row of strapping cells. Furthermore, transistors may be formed in the strapping cells to provide additional insulation between the strapped memory cells. | 08-05-2010 |
20100213552 | Cell Structure for Dual Port SRAM - An integrated circuit and methods for laying out the integrated circuit are provided. The integrated circuit includes a first and a second transistor. The first transistor includes a first active region comprising a first source and a first drain; and a first gate electrode over the first active region. The second transistor includes a second active region comprising a second source and a second drain; and a second gate electrode over the second active region and connected to the first gate electrode, wherein the first source and the second source are electrically connected, and the first drain and the second drain are electrically connected. | 08-26-2010 |
20100224943 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHODS WITH USING NON-PLANAR TYPE OF TRANSISTORS - Static random access memory cells and methods of making static random access memory cells are provided. The static random access memory cells contain two non-planar pass-gate transistors, two non-planar pull-up transistors, two non-planar pull-down transistors. A portion of a fin of the non-planar pull-up transistor is electrically connected to a portion of a fin of the non-planar pull-down transistor by an assist-bar. The methods involve forming an assist-fin between fins of a non-planar pull-up transistor and a non-planar pull-down transistor and between gate electrodes, and widening a width of the assist-fin to form the assist-bar so that a portion of the fin of non-planar pull-up transistor is electrically connected to a portion of the fin of non-planar pull-down transistor via the assist-bar. | 09-09-2010 |
20100230763 | ACTIVE DEVICE ARRAY SUBSTRATE AND METHOD FOR FABRICATING THE SAME - A method for fabricating an active device array substrate is provided. A first patterned semiconductor layer, a gate insulator, a first patterned conductive layer and a first dielectric layer is sequentially formed on a substrate. First contact holes exposing the first patterned semiconductor layer are formed in the first dielectric layer and the gate insulator. A second patterned conductive layer and a second patterned semiconductor layer disposed thereon are simultaneously formed on the first dielectric layer. The second conductive layer includes contact conductors and a bottom electrode. The second patterned semiconductor layer includes an active layer. A second dielectric layer having second contact holes is formed on the first dielectric layer, wherein a portion of the second contact holes exposes the active layer. A third patterned conductive layer electrically connected to the active layer through a portion of the second contact holes is formed on the second dielectric layer. | 09-16-2010 |
20100295134 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor memory device according to one embodiment includes: a semiconductor substrate having an active region divided by an element isolation region; a plurality of stacked-gate type memory cell transistors connected in series on the active region; select transistors connected to both ends of the plurality of memory cell transistors on the active region; and a bit line contact connected to a drain region belonging to the select transistor in the active region, a vertical cross sectional shape of a lower portion of the bit line contact in a channel width direction of the plurality of memory cell transistors being in a skirt shape. | 11-25-2010 |
20100295135 | SEMICONDUCTOR MEMORY DEVICE AND PRODUCTION METHOD THEREFOR - In a static memory cell comprising six MOS transistors, the MOS transistors have a structure in which the drain, gate and source formed on the substrate are arranged in the vertical direction and the gate surrounds the columnar semiconductor layer, the substrate comprises a first active region having a first conductive type and a second active region having a second conductive type, and diffusion layers constructing the active regions are mutually connected via a silicide layer formed on the substrate surface, thereby realizing an SRAM cell with small surface area. In addition, drain diffusion layers having the same conductive type as a first well positioned on the substrate are surrounded by a first anti-leak diffusion layer and a second anti-leak diffusion layer having a conductive type different from the first well and being shallower than the first well, and thereby controlling leakage to the substrate. | 11-25-2010 |
20100295136 | METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A method for fabrication of 3D semiconductor devices utilizing a layer transfer and steps for forming transistors on top of a pre-fabricated semiconductor device comprising transistors formed on crystallized semiconductor base layer and metal layer for the transistors interconnections and insulation layer. The advantage of this approach is reduction of the over all metal length used to interconnect the various transistors. | 11-25-2010 |
20100308417 | SEMICONDUCTOR MEMORY DEVICE - In a full CMOS SRAM having a lateral type cell (memory cell having three partitioned wells arranged side by side in a word line extending direction and longer in the word line direction than in the bit line direction) including first and second driver MOS transistors, first and second load MOS transistors and first and second access MOS transistors, two capacitors are arranged spaced apart from each other on embedded interconnections to be storage nodes, with lower and upper cell plates cross-coupled to each other. | 12-09-2010 |
20100327371 | Memory device and method of fabricating the same - A nonvolatile memory including a plurality of memory transistors in series, wherein source/drain and channel regions therebetween are of a first type and a select transistor, at each end of the plurality of memory transistors in series, wherein channels regions of each of the select transistors is of the first type. The first type may be n-type or p-type. The nonvolatile memory may further include a first dummy select transistor at one end of the plurality of memory transistors in series between one of the select transistors and the plurality of memory transistors in series and a second dummy select transistor at the other end of the plurality of memory transistors in series between the other select transistor and the plurality of memory transistors in series. | 12-30-2010 |
20110031560 | READ-ONLY MEMORY AND METHOD OF MANUFACTURE THEREOF - A mask-defined read-only memory array is formed on a substrate, and includes a first ROM bit and a second ROM bit of opposite polarities. The first ROM bit has a first MOS transistor and a first block layer formed over a first region of the substrate. A second source/drain region of the first MOS transistor and a first diffusion region are formed in a first region of the substrate on opposite sides of the first block layer. The second ROM bit includes a second MOS transistor. | 02-10-2011 |
20110042755 | MEMORY DEVICE COMPRISING AN ARRAY PORTION AND A LOGIC PORTION - In an embodiment of the present invention, a method comprises patterning a first plurality of semiconductor structures in an array portion of a semiconductor substrate using a first photolithographic mask. The method further comprises patterning a second plurality of semiconductor structures over a logic portion of a semiconductor substrate using a second photolithographic mask. The method further comprises patterning a sacrificial layer over the first plurality of semiconductor structures using the second photolithographic mask. The sacrificial layer is patterned simultaneously with the second plurality of semiconductor structures. | 02-24-2011 |
20110073958 | ASYMMETRIC SILICON-ON-INSULATOR SRAM CELL - A memory cell having N transistors including at least one pair of access transistors, one pair of pull-down transistors, and one pair of pull-up transistors to form a memory cell, wherein N is an integer at least equal to six, wherein each of the access transistors and each of the pull-down transistors is a same one of an n-type or a p-type transistor, and each of the pull-up transistors is the other of an n-type or a p-type transistor, wherein at least one of the pair of the pull down transistors and the pair of the pull up transistors are asymmetric. | 03-31-2011 |
20110095377 | SEMICONDUCTOR MEMORY DEVICES - In some embodiments, a semiconductor memory device includes a substrate that includes a cell array region and a peripheral circuit region. The semiconductor memory device further includes a device isolation pattern on the substrate. The device isolation pattern defines a first active region and a second active region within the cell array region and a third active region in the peripheral circuit region. The semiconductor memory device further includes a first common source region, a plurality of first source/drain regions, and a first drain region in the first active region. The semiconductor memory device further includes a second common source region, a plurality of second source/drain regions, and a second drain region in the second active region. The semiconductor memory device further includes a third source/drain region in the third active region. The semiconductor memory device further includes a common source line contacting the first and second common source regions. | 04-28-2011 |
20110121403 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device has a substrate that includes a cell array region and a dummy pattern region surrounding the cell array region. The cell array region includes a cell structure having a plurality of cell active pillars extending in a vertical direction from the cell array region of the substrate and includes cell gate patterns and cell gate interlayer insulating patterns alternately stacked on the substrate. The cell gate patterns and cell gate interlayer insulating patterns have sides facing the cell active pillars. The dummy pattern region includes a damp-proof structure. | 05-26-2011 |
20110180882 | Semiconductor Device and Method of Fabricating the Same - According to an aspect of the invention, there is provided a semiconductor device including a first semiconductor element formed on a semiconductor substrate and using electrons as carriers, and a second semiconductor element formed on the semiconductor substrate and using holes as carriers, a first insulating film and a second insulating film formed on source/drain regions and gate electrodes of the first element and the second element, the first insulating film having tensile stress with respect to the first element, and the second insulating film having compression stress with respect to the second element, and sidewall spacers of the gate electrodes of the first element and the second element, at least portions of the sidewall spacers being removed, wherein at least one of the first insulating film and the second insulating film does not close a spacing between the gate electrodes of the first element and the second element. | 07-28-2011 |
20110186935 | SEMICONDUCTOR DEVICE - A MOS transistor includes a gate electrode formed in a grid pattern, source regions and drain regions each surrounded by the gate electrode, and a source metal wiring connected to the source regions via source contacts and a drain metal wiring connected to the drain regions via drain contacts. The source metal wiring and the drain metal wiring are disposed along one direction of the grid of the gate electrode. Each of the source regions and the drain regions is a rectangular form having its long side along the length direction of each metal wiring. The source metal wiring and the drain metal wiring are each formed in a zigzag manner in the length direction and are respectively connected to the source contacts and the drain contacts. | 08-04-2011 |
20110215419 | SYSTEM AND METHOD FOR IMPROVING CMOS COMPATIBLE NON VOLATILE MEMORY RETENTION RELIABILITY - A system and method is disclosed for improving complementary metal oxide semiconductor (CMOS) compatible non volatile memory (NVM) retention reliability in memory cells. A memory cell of the invention comprises a backend layer that reduces charge leakage from a floating gate of the memory cell. A first bottom portion of the backend layer is formed from a first layer of silicon oxynitride having a low value of defect/trap density. A second top portion of the backend layer is formed from a second layer of silicon oxynitride having a high value of defect/trap density. The first layer of silicon oxynitride inhibits electron transport and the second layer of silicon oxynitride protects CMOS devices from plasma induced damage. | 09-08-2011 |
20110221006 | NAND ARRAY SOURCE/DRAIN DOPING SCHEME - An electronic device includes a substrate having isolation features defining active regions coextending over a surface of the substrate. The device also includes coextending line patterns crossing over the active regions, including string and ground selection lines and word lines between the string and ground selection lines. The device further includes first implant regions of a first conductivity type in the active regions between the word lines and having a first carrier concentration. The device further includes second implant regions of the first conductivity type in the active regions between edge ones of the word lines and an adjacent one of the string selection line and the ground selection line. In the device, the second implant region includes a low doping portion abutting the edge word lines and a high doping portion spaced from the edge word line by the low doping portion and having a second carrier concentration greater than the first carrier concentration. | 09-15-2011 |
20110221007 | SEMICONDUCTOR MEMORY DEVICE - In a multipart SRAM memory cell of the present invention, an access transistor of a first port is disposed in a p-type well, and an access transistor of a second port is disposed in a p-type well. The gates of all of transistors disposed in a memory cell extend in the same direction. With the configuration, a semiconductor memory device having a low-power consumption type SRAM memory cell with an increased margin of variations in manufacturing, by which a bit line can be shortened in a multiport SRAM memory cell or an associative memory, can be obtained. | 09-15-2011 |
20110233685 | SEMICONDUCTOR INTEGRATED CIRCUIT - According to embodiments, there is provided a semiconductor device, including: a first area including plural transistors formed therein; and a second area including plural dummy transistors formed therein, the second area surrounding the first area, wherein a pitch of the dummy transistors is equal to or less than a central wavelength of a light used to form the transistors. | 09-29-2011 |
20110248356 | Integrated one-time programmable semiconductor device pair - According to one disclosed embodiment, an integrated one-time programmable (OTP) semiconductor device pair includes a split-thickness dielectric under an electrode and over an isolation region formed in a doped semiconductor substrate, where a reduced-thickness center portion of the dielectric forms, in conjunction with the isolation region, programming regions of the OTP semiconductor device pair, and where the thicker, outer portions of the dielectric form dielectrics for transistor structures. In one embodiment, the split-thickness dielectric comprises a gate dielectric. In one embodiment, multiple OTP semiconductor device pairs are formed in an array that minimizes the number of connections required to program and sense states of specific OTP cells. | 10-13-2011 |
20110260262 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device includes a semiconductor substrate; gates, spacers on both sides of the respective gates, and source and gain regions on both sides of the respective spacers, which are formed on the semiconductor substrate; lower contacts located on the respective source and gain regions and abutting outer-sidewalls of the spacers, with bottoms covering at least a portion of the respective source and gain regions; an inter-layer dielectric layer formed on the gates, the spacers, the source and gain regions, and the lower contacts, wherein the respective source and gain regions of each of the transistor structures are isolated from each other by the inter-layer dielectric layer; and upper contacts formed in the inter-layer dielectric layer and corresponding to the lower contacts. Methods for fabricating such a semiconductor device and for manufacturing contacts for semiconductor devices. | 10-27-2011 |
20110278679 | SEMICONDUCTOR DEVICE, MASK FOR FABRICATION OF SEMICONDUCTOR DEVICE, AND OPTICAL PROXIMITY CORRECTION METHOD - A semiconductor device includes a circuit portion including at least one real feature, and a plurality of dummy feature groups each including a plurality of dummy features spaced apart from each other by a first distance. The plurality of dummy feature groups are spaced apart from each other by a second distance larger than the first distance, and the circuit portion and the plurality of dummy feature groups are spaced apart from each other by the second distance. | 11-17-2011 |
20110316091 | Semiconductor Devices, Assemblies And Constructions - Embodiments disclosed herein include methods in which a pair of openings are formed into semiconductor material, with the openings being spaced from one another by a segment of the semiconductor material. Liners are formed along sidewalls of the openings, and then semiconductor material is isotropically etched from bottoms of the openings to merge the openings and thereby completely undercut the segment of semiconductor material. Embodiments disclosed herein may be utilized in forming SOI constructions, and in forming field effect transistors having transistor gates entirely surrounding channel regions. Embodiments disclosed herein also include semiconductor constructions having transistor gates surrounding channel regions, as well as constructions in which insulative material entirely separates an upper semiconductor material from a lower semiconductor material. | 12-29-2011 |
20120012944 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a memory block including a transistor region and a memory region. A variable resistance layer of the memory region acts as a gate insulating layer in the transistor region. | 01-19-2012 |
20120025324 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME AS WELL AS DATA PROCESSING SYSTEM INCLUDING THE SEMICONDUCTOR DEVICE - A semiconductor device includes low voltage and high voltage transistors over a substrate. The low voltage transistor is configured by at least one unit transistor. The high voltage transistor is configured by a greater number of the unit transistors than the at least one unit transistor that configures the low voltage transistor. Each of the unit transistors may include a vertically extending portion of semiconductor providing a channel region and having a uniform height, a gate insulating film extending along a side surface of the vertically extending portion of semiconductor, a gate electrode separated by the gate insulating film from the vertically extending portion of semiconductor, and upper and lower diffusion regions being respectively disposed near the top and bottom of the vertically extending portion of semiconductor. The greater number of the unit transistors are connected in series to each other and have gate electrodes eclectically connected to each other. | 02-02-2012 |
20120119304 | SEMICONDUCTOR MEMORY - A semiconductor memory includes: a plurality of active regions AA | 05-17-2012 |
20120153400 | TUNNELING TRANSISTORS - A transistor including a source; a drain; a gate region, the gate region including a gate; an island; and a gate oxide, wherein the gate oxide is positioned between the gate and the island; and the gate and island are coactively coupled to each other; and a source barrier and a drain barrier, wherein the source barrier separates the source from the gate region and the drain barrier separates the drain from the gate region. | 06-21-2012 |
20120168875 | SEMICONDUCTOR DEVICE - A well potential supply region is provided in an N-type well region of a cell array. Adjacent gates disposed in both sides of the well potential supply region in the horizontal direction and adjacent gates disposed in further both sides thereof are disposed at the same pitch. In addition, an adjacent cell array includes four gates each of which is opposed to the adjacent gates in the vertical direction. In other words, regularity in the shape of the gate patterns in the periphery of the well potential supply region is maintained. | 07-05-2012 |
20120187504 | Semiconductor Device Having Shared Contact Hole and a Manufacturing Method Thereof - A semiconductor device has a high-speed circuit and a high-density circuit, each having at least two field effect transistors and two gate electrodes. In the high-speed circuit, a first gate electrode of a first field effect transistor and a second gate electrode of a second field effect transistor are separated by a first pitch. In the high-density circuit, a third gate electrode of a third field effect transistor and a fourth gate electrode of a fourth field effect transistor are separated by a second pitch. The first pitch is larger than the second pitch. Provision of a notch in the third gate electrode of the third field effect transistor in the high-density circuit, at a portion reached by a shared contact hole shared by the third gate electrode and the fourth transistor, increases the contact area between the shared contact hole and an impurity region source/drain of the fourth transistor. | 07-26-2012 |
20120223395 | ROM CELL CIRCUIT FOR FINFET DEVICES - The present disclosure provides a read only memory (ROM) cell array. The ROM cell array includes a plurality of fin active regions oriented in a first direction and formed on a semiconductor substrate; a plurality of gates formed on the plurality of fin active regions and oriented in a second direction perpendicular to the first direction; and a plurality of ROM cells formed by the plurality of fin active regions and the plurality of gates, the plurality of ROM cells being coded such that each cell of a first subset of ROM cells has a source electrically connected to a power line, and each cell of a second subset of ROM cells has a source electrically isolated. | 09-06-2012 |
20120228720 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES HAVING DIFFERENT THICKNESS SILICON-GERMANIUM LAYERS - Methods of fabricating semiconductor integrated circuit devices are provided. A substrate is provided with gate patterns formed on first and second regions. Spaces between gate patterns on the first region are narrower than spaces between gate patterns on the second region. Source/drain trenches are formed in the substrate on opposite sides of the gate patterns on the first and second regions. A first silicon-germanium (SiGe) epitaxial layer is formed that partially fills the source/drain trenches using a first silicon source gas. A second SiGe epitaxial layer is formed directly on the first SiGe epitaxial layer to further fill the source/drain trenches using a second silicon source gas that is different from the first silicon source gas. | 09-13-2012 |
20120235246 | SEMICONDUCTOR DEVICE - One embodiment of a semiconductor device provided with a semiconductor substrate, a device region formed on the semiconductor substrate, a device isolation region, which encloses the device region, a plurality of first gate electrodes arranged so as to be parallel to each other on the device region and electrically connected to each other, and a plurality of second gate electrodes arranged so as to be parallel to a plurality of first gate electrodes on the device region and electrically connected to each other, wherein the first gate electrode is arranged so as to be interposed between the second gate electrodes, a gate width of the first gate electrode is smaller than the gate width of the second gate electrode, and a DC bias voltage higher than that of the second gate electrode is applied to the first gate electrode. | 09-20-2012 |
20120248547 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME - Certain embodiments provide a semiconductor device comprising a plurality of memory cell arrays each of which includes a plurality of memory cell transistors and select transistors each of which is disposed at either end of the memory cell transistors, a diffused layer formed between a first and a second select transistors adjacent to each other, a first sidewall film formed on each of the opposed sidewalls of said first and second select transistors, a second sidewall film formed on said first sidewall film, and a conducting layer which contacts with said diffused layer. The second sidewall film covers at least part of the top surface and the side surface of said first sidewall film. The edge of said contact portion is positioned at a distance no less than the total thickness of said first and second sidewall films from the sidewalls of said first and second select transistors. | 10-04-2012 |
20120256272 | MEMORY DEVICE COMPRISING AN ARRAY PORTION AND A LOGIC PORTION - In an embodiment of the present invention, a method comprises patterning a first plurality of semiconductor structures in an array portion of a semiconductor substrate using a first photolithographic mask. The method further comprises patterning a second plurality of semiconductor structures over a logic portion of a semiconductor substrate using a second photolithographic mask. The method further comprises patterning a sacrificial layer over the first plurality of semiconductor structures using the second photolithographic mask. The sacrificial layer is patterned simultaneously with the second plurality of semiconductor structures. | 10-11-2012 |
20120273898 | SEMICONDUCTOR MEMORY DEVICE HAVING VERTICAL CHANNEL TRANSISTOR AND METHOD FOR FABRICATING THE SAME - Channels of two transistors are vertically formed on portions of two opposite side surfaces of one active region, and gate electrodes are vertically formed on a device isolation layer contacting the channels of the active region. A common bit line contact plug is formed in the central portions of the active region, two storage node contact plugs are formed on both sides of the bit line contact plug, and an insulating spacer is formed on a side surface of the bit line contact plug. A word line, a bit line, and a capacitor are sequentially stacked on the semiconductor substrate, like a conventional semiconductor memory device. Thus, effective space arrangement of a memory cell is possible such that a 4F | 11-01-2012 |
20120286367 | One-Time Programmable Semiconductor Device - According to one disclosed embodiment, an integrated one-time programmable (OTP) semiconductor device pair includes a split-thickness dielectric under an electrode and over an isolation region formed in a doped semiconductor substrate, where a reduced-thickness center portion of the dielectric forms, in conjunction with the isolation region, programming regions of the OTP semiconductor device pair, and where the thicker, outer portions of the dielectric form dielectrics for transistor structures. In one embodiment, the split-thickness dielectric comprises a gate dielectric. In one embodiment, multiple OTP semiconductor device pairs are formed in an array that minimizes the number of connections required to program and sense states of specific OTP cells. | 11-15-2012 |
20120286368 | Layout Methods of Integrated Circuits Having Unit MOS Devices - A semiconductor structure includes an array of unit metal-oxide-semiconductor (MOS) devices arranged in a plurality of rows and a plurality of columns is provided. Each of the unit MOS devices includes an active region laid out in a row direction and a gate electrode laid out in a column direction. The semiconductor structure further includes a first unit MOS device in the array and a second unit MOS device in the array, wherein active regions of the first and the second unit MOS devices have different conductivity types. | 11-15-2012 |
20120299116 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - A display panel, in which a plurality of drive units in a transistor array substrate include a faulty drive unit, and a plurality of pixel electrodes include a first pixel electrode corresponding to the faulty drive unit and a second drive unit corresponding to a non-faulty drive unit. A portion of the second pixel electrode is embedded in the corresponding contact hole, and is in contact with a power supply pad of the non-faulty drive unit, so that the second pixel electrode is electrically connected to the non-faulty drive unit. An insulator is inserted between the first pixel electrode and a power supply pad of the faulty drive unit, so that the first pixel electrode is electrically insulated from the faulty drive unit. | 11-29-2012 |
20120299117 | 3-DIMENSIONAL NON-VOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A 3-dimensional (3-D) non-volatile memory device includes a first channel protruding from a substrate, a selection gate formed on sidewalls of the first channel and in an L shape, and a gate insulating layer interposed between the first channel and the selection gate and surrounding the first channel. A method of manufacturing a 3-D non-volatile memory device includes forming first channels protruding from a substrate, forming a first gate insulating layer surrounding the first channels, and forming first selection gates having an L shape on sidewalls of the first channels on which the first gate insulating layers are formed. | 11-29-2012 |
20120306022 | Metal oxide semiconductor transistor layout with higher effective channel width and higher component density - The disclosure is a metal oxide semiconductor transistor layout with higher effective channel width and higher component density. The layout discloses a common drain region with straight cross pattern, a plurality of common drain regions with lattice pattern, a common source region with straight cross pattern, a plurality of common source regions with lattice pattern, a hybrid grating with common drain region with straight cross pattern and common source region with straight cross pattern. The layout can increase the component density and the effective channel width as compared to conventional layout. The invention is further with the advantages of lower cost and can be operated in higher power. | 12-06-2012 |
20120313185 | SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING MEMORY CELLS - A semiconductor integrated circuit includes a plurality of memory cells arranged in a cell-placement row extending in a first direction, a first N well and a first P well arranged in a second direction perpendicular to the first direction in each area of the memory cells, and a second N well and a second P well each having the same length as a width of the cell-placement row and situated between at least two adjacent memory cells of the plurality of memory cells, wherein the first N well and the second N well are integrated, and the first P well and the second P well are integrated. | 12-13-2012 |
20130015533 | EPITAXIAL PROCESS FOR FORMING SEMICONDUCTOR DEVICESAANM WANG; Shiang-BauAACI Pingzchen CityAACO TWAAGP WANG; Shiang-Bau Pingzchen City TW - A method for forming a semiconductor device such as a MOSFET. The method includes forming gate electrode pillars on a silicon substrate via material deposition and etching. Following the etching step to define the pillars, an epitaxial silicon film is grown on the substrate between the pillars prior to forming recesses in the substrate for the source/drain regions of the transistor. The epitaxial silicon film compensates for substrate material that may be lost during formation of the gate electrode pillars, thereby producing source/drain recesses having a configuration amenable to be filled uniformly with silicon for later forming the source/drain regions in the substrate. | 01-17-2013 |
20130049133 | SEMICONDUCTOR DEVICE - A semiconductor device that includes transistors having the same polarity consumes less power and can prevent a decrease in amplitude of a potential output. The semiconductor device includes a first wiring having a first potential, a second wiring having a second potential, a third wiring having a third potential, a first transistor and a second transistor having the same polarity, and a plurality of third transistors for selecting supply of the first potential to gates of the first transistor and the second transistor or supply of the third potential to the gates of the first transistor and the second transistor and for selecting whether to supply one potential to drain terminals of the first transistor and the second transistor. A source terminal of the first transistor is connected to the second wiring, and a source terminal of the second transistor is connected to the third wiring. | 02-28-2013 |
20130093025 | PULSE OUTPUT CIRCUIT, DISPLAY DEVICE, AND ELECTRONIC DEVICE - An object of the present invention is to suppress deterioration in the thin film transistor. A plurality of pulse output circuits each include first to eleventh thin film transistors is formed. The pulse output circuit is operated on the basis of a plurality of clock signals which control each transistor, the previous stage signal input from a pulse output circuit in the previous stage, the next stage signal input from a pulse output circuit in the next stage, and a reset signal. In addition, a microcrystalline semiconductor is used for a semiconductor layer serving as a channel region of each transistor. Therefore, degradation of characteristics of the transistor can be suppressed. | 04-18-2013 |
20130126981 | MULTI-GATE SEMICONDUCTOR DEVICES - A multi-gate semiconductor device is formed including a semiconductor substrate. The multi-gate semiconductor device also includes a first transistor including a first fin portion extending above the semiconductor substrate. The first transistor has a first channel region formed therein. The first channel region includes a first channel region portion doped at a first concentration of a first dopant type and a second channel region portion doped at a second concentration of the first dopant type. The second concentration is higher than the first concentration. The first transistor further includes a first gate electrode layer formed over the first channel region. The first gate electrode layer may be of a second dopant type. The first dopant type may be N-type and the second dopant type may be P-type. The second channel region portion may be formed over the first channel region portion. | 05-23-2013 |
20130146990 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND RELATED METHOD - Embodiments of the invention provide a semiconductor integrated circuit device and a method for fabricating the device. In one embodiment, the method comprises forming a plurality of preliminary gate electrode structures in a cell array region and a peripheral circuit region of a semiconductor substrate; forming selective epitaxial films on the semiconductor substrate in the cell array region and the peripheral region; implanting impurities into at least some of the selective epitaxial films to form elevated source/drain regions in the cell array region and the peripheral circuit region; forming a first interlayer insulating film; and patterning the first interlayer insulating film to form a plurality of first openings exposing the elevated source/drain regions. The method further comprises forming a first ohmic film, a first barrier film, and a metal film; and removing portions of each of the metal film, the first barrier film, and the first ohmic film. | 06-13-2013 |
20130154027 | Memory Cell - A memory cell and array and a method of forming a memory cell and array are disclosed. An embodiment is a memory cell comprising first and second pull-up transistors, first and second pull-down transistors, first and second pass-gate transistors, and first and second isolation transistors. Drains of the first pull-up and first pull-down transistors are electrically coupled together at a first node. Drains of the second pull-up and second pull-down transistors are electrically coupled together at a second node. Gates of the second pull-up and second pull-down transistors are electrically coupled to the first node, and gates of the first pull-up and first pull-down transistors are electrically coupled to the second node. The first and second pass-gate transistors are electrically coupled to the first and second nodes, respectively. The first and second isolation transistors are electrically coupled to the first and second nodes, respectively. | 06-20-2013 |
20130181297 | SRAM Cells and Arrays - Static random access memory (SRAM) cells and SRAM cell arrays are disclosed. In one embodiment, an SRAM cell includes a pull-up transistor. The pull-up transistor includes a Fin field effect transistor (FinFET) that has a fin of semiconductive material. An active region is disposed within the fin. A contact is disposed over the active region of the pull-up transistor. The contact is a slot contact that is disposed in a first direction. The active region of the pull-up transistor is disposed in a second direction. The second direction is non-perpendicular to the first direction. | 07-18-2013 |
20130228874 | Memory Arrays and Methods of Forming Electrical Contacts - Some embodiments include methods of forming electrical contacts. A row of semiconductor material projections may be formed, with the semiconductor material projections containing repeating components of an array, and with a terminal semiconductor projection of the row comprising a contact location. An electrically conductive line may be along said row, with the line wrapping around an end of said terminal semiconductor projection and bifurcating into two branches that are along opposing sides of the semiconductor material projections. Some of the semiconductor material of the terminal semiconductor projection may be replaced with dielectric material, and then an opening may be extended into the dielectric material. An electrical contact may be formed within the opening and directly against at least one of the branches. Some embodiments include memory arrays. | 09-05-2013 |
20130277758 | Method for Keyhole Repair in Replacement Metal Gate Integration Through the Use of a Printable Dielectric - A method of fabricating a FET device is provided that includes the following steps. A wafer is provided. At least one active area is formed in the wafer. A plurality of dummy gates is formed over the active area. Spaces between the dummy gates are filled with a dielectric gap fill material such that one or more keyholes are formed in the dielectric gap fill material between the dummy gates. The dummy gates are removed to reveal a plurality of gate canyons in the dielectric gap fill material. A mask is formed that divides at least one of the gate canyons, blocks off one or more of the keyholes and leaves one or more of the keyholes un-blocked. At least one gate stack material is deposited onto the wafer filling the gate canyons and the un-blocked keyholes. A FET device is also provided. | 10-24-2013 |
20130307085 | ACTIVE MATRIX SUBSTRATE, X-RAY SENSOR DEVICE, DISPLAY DEVICE - An active matrix substrate of the present invention includes: a first signal line and a second signal line which are aligned in a column direction in which the first signal line and the second signal line extend; a first transistor and a second transistor; and a first electrode and a second electrode, the first signal line being connected via the first transistor to the first electrode, and the second signal line being connected via the second transistor to the second electrode, and the first signal line having a first end which is one of both ends of the first signal line and faces the second signal line, the first end including a tapered part which is tapered toward the second signal line. This makes it possible to prevent a leakage defect from occurring between two signal lines which are aligned in a direction in which the two signal lines extend. | 11-21-2013 |
20130320458 | Static Random-Access Memory Cell Array with Deep Well Regions - An integrated circuit including a complementary metal-oxide-semiconductor (CMOS) static random access memory (SRAM) with periodic deep well structures within the memory cell array. The deep well structures are contacted by surface well regions of the same conductivity type (e.g., n-type) in the memory cell array, forming two-dimensional grids of both n-type and p-type semiconductor material in the memory cell array area. Bias conductors may contact the grids to apply the desired well bias voltages, for example in well-tie regions or peripheral circuitry adjacent to the memory cell array. | 12-05-2013 |
20140008731 | FIELD-EFFECT-TRANSISTOR WITH SELF-ALIGNED DIFFUSION CONTACT - Embodiments of the present invention provide a method of forming fin-type transistors having replace-gate electrodes with self-aligned diffusion contacts. The method includes forming one or more silicon fins on top of an oxide layer, the oxide layer being situated on top of a silicon donor wafer; forming one or more dummy gate electrodes crossing the one or more silicon fins; forming sidewall spacers next to sidewalls of the one or more dummy gate electrodes; removing one or more areas of the oxide layer thereby creating openings therein, the openings being self-aligned to edges of the one or more fins and edges of the sidewall spacers; forming an epitaxial silicon layer in the openings; removing the donor wafer; and siliciding at least a bottom portion of the epitaxial silicon layer. A semiconductor structure formed thereby is also provided. | 01-09-2014 |
20140042551 | SRAM INTEGRATED CIRCUITS WITH BURIED SADDLE-SHAPED FINFET AND METHODS FOR THEIR FABRICATION - SRAM ICs and methods for their fabrication are provided. One method includes depositing photoresist on a first oxide layer overlying a silicon substrate, forming a pattern of locations, using said photoresist, for the formation of two inverters, each having a pull up transistor, a pull down transistor, and a pass gate transistor on said oxide layer. The method involves anisotropically etching U-shaped channels in the oxide layer corresponding to pattern, and thereafter isotropically etching U-shaped channels in the silicon layer to form saddle-shaped fins in the silicon. A second oxide layer is deposited over the saddle-shaped fins, and a first metal layer is deposited over the second oxide layer. A contact metal layer is formed over the first metal layer and planarized to form local interconnections coupling the gate electrodes of one inverter to a node between the pull up and pull down transistors of the other inverter and to a source/drain of one of the pass gate transistors. | 02-13-2014 |
20140061818 | TFT ARRAY SUBSRATE, FABRICATION METHOD, AND DISPLAY DEVICE THEREOF - A TFT array substrate, a fabrication method thereof and a display device. The TFT array substrate, comprising: gate lines ( | 03-06-2014 |
20140117458 | HIGH-VOLTAGE TRANSISTOR HAVING SHIELDING GATE - A semiconductor device includes a plurality of high-voltage insulated-gate field-effect transistors arranged in a matrix form on the main surface of a semiconductor substrate and each having a gate electrode, a gate electrode contact formed on the gate electrode, and a wiring layer which is formed on the gate electrode contacts adjacent in a gate-width direction to electrically connect the gate electrodes arranged in the gate-width direction. And the device includes shielding gates provided on portions of an element isolation region which lie between the transistors adjacent in the gate-width direction and gate-length direction and used to apply reference potential or potential of a polarity different from that of potential applied to the gate of the transistor to turn on the current path of the transistor to the element isolation region. | 05-01-2014 |
20140138778 | Semiconductor Device - An object is to provide a semiconductor device with a novel structure in which stored data can be held even when power is not supplied and there is no limit on the number of write operations. The semiconductor device includes a first memory cell including a first transistor and a second transistor, a second memory cell including a third transistor and a fourth transistor, and a driver circuit. The first transistor and the second transistor overlap at least partly with each other. The third transistor and the fourth transistor overlap at least partly with each other. The second memory cell is provided over the first memory cell. The first transistor includes a first semiconductor material. The second transistor, the third transistor, and the fourth transistor include a second semiconductor material. | 05-22-2014 |
20140159161 | MEASUREMENT OF CMOS DEVICE CHANNEL STRAIN BY X-RAY DIFFRACTION - A direct measurement of lattice spacing by X-ray diffraction is performed on a periodic array of unit structures provided on a substrate including semiconductor devices. Each unit structure includes a single crystalline strained material region and at least one stress-generating material region. For example, the single crystalline strained material region may be a structure simulating a channel of a field effect transistor, and the at least one stress-generating material region may be a single crystalline semiconductor region in epitaxial alignment with the single crystalline strained material region. The direct measurement can be performed in-situ at various processing states to provide in-line monitoring of the strain in field effect transistors in actual semiconductor devices. | 06-12-2014 |
20140167183 | Coarse Grid Design Methods and Structures - A layer of a mask material is deposited on a substrate. A beam of energy is scanned across the mask material in a rasterized linear pattern and in accordance with a scan pitch that is based on a pitch of conductive structure segments to be formed on the substrate. The beam of energy is defined to transform the mask material upon which the beam of energy is incident into a removable state. During scanning the beam of energy across the mask material, the beam of energy is turned on at locations where a conductive structure is to be formed on the substrate, and the beam of energy is turned off at locations where a conductive structure is not to be formed on the substrate. | 06-19-2014 |
20140175559 | INTEGRATED DEVICE HAVING MOSFET CELL ARRAY EMBEDDED WITH BARRIER SCHOTTKY DIODE - Provided is an integrated device having a MOSFET cell array embedded with a junction barrier Schottky (JBS) diode. The integrated device comprises a plurality of areas, each of which includes a plurality of MOS transistor cells and at least one JBS diode. Any two adjacent MOS transistor cells are separated by a separating line. A first MOS transistor cell and a second MOS transistor cell are adjacent in a first direction and separated by a first separating line, and the first transistor cell and a third MOS transistor cell are adjacent in a second direction and separated by a second separating line. The JBS diode is disposed at an intersection region between the first separating line and the second separating line. The JBS diode is connected in anti-parallel to the first, second and third MOS transistor cells. | 06-26-2014 |
20140191330 | FINFET AND METHOD OF FABRICATION - An improved finFET and method of fabrication is disclosed. Embodiments of the present invention take advantage of the different epitaxial growth rates of {110} and {100} silicon. Fins are formed that have {110} silicon on the fin tops and {100} silicon on the long fin sides (sidewalls). The lateral epitaxial growth rate is faster than the vertical epitaxial growth rate. The resulting merged fins have a reduced merged region in the vertical dimension, which reduces parasitic capacitance. Other fins are formed with {110} silicon on the fin tops and also {110} silicon on the long fin sides. These fins have a slower epitaxial growth rate than the {100} side fins, and remain unmerged in a semiconductor integrated circuit, such as an SRAM circuit. | 07-10-2014 |
20140191331 | Transistor and Its Method of Manufacture - A method of manufacturing a transistor comprising: providing a substrate, a region of semiconductive material supported by the substrate, and a region of electrically conductive material supported by the region of semiconductive material; forming at least one layer of resist material over said regions to form a covering of resist material over said regions; forming a depression in a surface of the covering of resist material, said depression extending over a first portion of said region of conductive material, said first portion separating a second portion of the conductive region from a third portion of the conductive region; removing resist material located under said depression so as to form a window, through said covering, exposing said first portion of the electrically conductive region; removing said first portion to expose a connecting portion of the region of semiconductive material, said connecting portion connecting the second portion to the third portion of the conductive region; forming a layer of dielectric material over the exposed portion of the region of semiconductive material; and depositing electrically conductive material to form a layer of electrically conductive material over said layer of dielectric material, the layer of dielectric material electrically isolating the layer of electrically conductive material from the second and third portions of the conductive region. | 07-10-2014 |
20140217515 | SEMICONDUCTOR INTEGRATED CIRCUIT - According to embodiments, there is provided a semiconductor device, including: a first area including plural transistors formed therein; and a second area including plural dummy transistors formed therein, the second area surrounding the first area, wherein a pitch of the dummy transistors is equal to or less than a central wavelength of a light used to form the transistors. | 08-07-2014 |
20140239410 | Integrated Circuit with Standard Cells - A die includes a plurality of rows of standard cells. Each of all standard cells in the plurality of rows of standard cells includes a transistor and a source edge, wherein a source region of the transistor is adjacent to the source edge. No drain region of any transistor in the each of all standard cells is adjacent to the source region. | 08-28-2014 |
20140319621 | SEMICONDUCTOR MEMORY DEVICE HAVING AN ELECTRICALLY FLOATING BODY TRANSISTOR - A method for performing a holding operation to a semiconductor memory array having rows and columns of memory cells, includes: applying an electrical signal to buried regions of the memory cells, wherein each of the memory cells comprises a floating body region defining at least a portion of a surface of the memory cell, the floating body region having a first conductivity type; and wherein the buried region of each memory cell is located within the memory cell and located adjacent to the floating body region, the buried region having a second conductivity type. | 10-30-2014 |
20140332899 | Method of Operating Semiconductor Memory Device with Floating Body Transistor Using Silicon Controlled Rectifier Principle - Methods of operating semiconductor memory devices with floating body transistors, using a silicon controlled rectifier principle are provided, as are semiconductor memory devices for performing such operations. A method of maintaining the data state of a semiconductor dynamic random access memory cell is provided, wherein the memory cell comprises a substrate being made of a material having a first conductivity type selected from p-type conductivity type and n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type; a second region having the second conductivity type, the second region being spaced apart from the first region; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer, the body region having the first conductivity type; and a gate positioned between the first and second regions and adjacent the body region. The memory cell is configured to store a first data state which corresponds to a first charge in the body region in a first configuration, and a second data state which corresponds to a second charge in the body region in a second configuration. The method includes: providing the memory cell storing one of the first and second data states; and applying a positive voltage to a substrate terminal connected to the substrate beneath the buried layer, wherein when the body region is in the first state, the body region turns on a silicon controlled rectifier device of the cell and current flows through the device to maintain configuration of the memory cell in the first memory state, and wherein when the memory cell is in the second state, the body region does not turn on the silicon controlled rectifier device, current does not flow, and a blocking operation results, causing the body to maintain the second memory state. | 11-13-2014 |
20140353761 | MULTI-ORIENTATION SEMICONDUCTOR DEVICES EMPLOYING DIRECTED SELF-ASSEMBLY - A template material layer is deposited over a substrate, and is patterned with at least two trenches having different lengthwise directions. An array of polymer lines are formed by directed self-assembly of a copolymer material and a selective removal of one type of polymer material relative to another type within each trench such that the lengthwise direction of the polymer lines are parallel to the lengthwise sidewalls of the trench. The patterns in the arrays of polymer lines are transferred into an underlying material layer to form arrays of patterned material structures. The arrays of patterned material structures may be arrays of semiconductor material portion, or may be arrays of gate electrodes. An array of patterned material structures may be at a non-orthogonal angle with respect to an array of underlying material portions or with respect to an array of overlying material portions to be subsequently formed. | 12-04-2014 |
20140353762 | MULTI-ORIENTATION SEMICONDUCTOR DEVICES EMPLOYING DIRECTED SELF-ASSEMBLY - A template material layer is deposited over a substrate, and is patterned with at least two trenches having different lengthwise directions. An array of polymer lines are formed by directed self-assembly of a copolymer material and a selective removal of one type of polymer material relative to another type within each trench such that the lengthwise direction of the polymer lines are parallel to the lengthwise sidewalls of the trench. The patterns in the arrays of polymer lines are transferred into an underlying material layer to form arrays of patterned material structures. The arrays of patterned material structures may be arrays of semiconductor material portion, or may be arrays of gate electrodes. An array of patterned material structures may be at a non-orthogonal angle with respect to an array of underlying material portions or with respect to an array of overlying material portions to be subsequently formed. | 12-04-2014 |
20140353763 | SEMICONDUCTOR DEVICES INCLUDING FIN-FETS AND METHODS OF FABRICATING THE SAME - Semiconductor devices including fin-FETs and methods of forming the semiconductor devices are provided. The semiconductor devices may include a fin structure including a long side and a short side on a substrate, a first trench including a sidewall defined by the long side of the fin structure and a first field insulating layer in the first trench. The semiconductor devices may also include a second trench including a sidewall defined by the short side of the fin structure and a second field insulating layer in the second trench. A first distance between an uppermost surface of the fin structure and a lowermost surface of the first trench may be different from a second distance between the uppermost surface of the fin structure and a lowermost surface of the second trench. | 12-04-2014 |
20140353764 | LAYOUT TO MINIMIZE FET VARIATION IN SMALL DIMENSION PHOTOLITHOGRAPHY - A semiconductor chip has shapes on a particular level that are small enough to require a first mask and a second mask, the first mask and the second mask used in separate exposures during processing. A circuit on the semiconductor chip requires close tracking between a first and a second FET (field effect transistor). For example, the particular level may be a gate shape level. Separate exposures of gate shapes using the first mask and the second mask will result in poorer FET tracking (e.g., gate length, threshold voltage) than for FETs having gate shapes defined by only the first mask. FET tracking is selectively improved by laying out a circuit such that selective FETs are defined by the first mask. In particular, static random access memory (SRAM) design benefits from close tracking of six or more FETs in an SRAM cell. | 12-04-2014 |
20140367794 | DEVICE INCLUDING AN ARRAY OF MEMORY CELLS AND WELL CONTACT AREAS, AND METHOD FOR THE FORMATION THEREOF - A device includes an array of a plurality of memory cells, at least one N-well contact area and at least one P-well contact area. The memory cells are arranged in a plurality of rows and a plurality of columns. Each column includes an N-well region and at least one P-well region. The N-well and P-well regions extend between a first end of the column and a second end of the column. Each N-well contact area electrically contacts at least one of the N-well regions, wherein the N-well region of at least one of the columns is electrically contacted at only one of the first and second ends of the column. Each P-well contact area electrically contacts at least one of the P-well regions, wherein the P-well region of at least one of the columns is electrically contacted at only one of the first and second ends of the column. | 12-18-2014 |
20150021708 | PIXEL STRUCTURE - A pixel structure includes a substrate, a scan line on the substrate, a data line set, an active device, and a pixel electrode. The substrate has a display region and a peripheral region around the display region. The display region includes at least one sub-pixel region. The data line set is disposed on the substrate, located at one side of the sub-pixel region, and intersected with the scan line to form at least one first intersecting region. The data line set includes a first and a second data lines that are intersected to form at least one second intersecting region. The first and the second data lines are electrically insulated. The active device electrically connects the scan line and to the first data line or the second data line in the data line set. The pixel electrode is located in the sub-pixel region and electrically connects the active device. | 01-22-2015 |
20150035079 | METHOD FOR CORE AND IN/OUT-PUT DEVICE RELIABILITY IMPROVE AT HIGH-K LAST PROCESS - A method for fabricating a semiconductor device includes providing a semiconductor substrate, forming on the semiconductor substrate a dummy gate interface layer and a dummy gate of a core device and a gate interface layer and a dummy gate of an IO device, removing the dummy gates of the core and IO devices, removing the dummy gate interface layer of the core device, forming a gate interface layer in the original location of the removed dummy gate interface layer, forming a high-k dielectric layer each on the gate interface layer of the core and IO devices, and submitting the semiconductor substrate to a high-pressure fluorine annealing. The high-pressure fluorine annealing causes the gate interface layer and the high-k dielectric layer of the core and IO devices to be doped with fluoride ions. | 02-05-2015 |
20150035080 | Semiconductor Device - Disclosed is a semiconductor device in which a resistance component resulting from wiring is reduced. A plurality of transistor units are arranged side by side in a first direction (Y direction in the view), each of which has a plurality of transistors. The gate electrodes of the transistors extend in the first direction. First source wiring extends between first transistor unit and second transistor unit, and first drain wiring extends between the second transistor unit and third transistor unit. Second drain wiring extends on the side of the first transistor unit opposite to the side where the first source wiring extends, and second source wiring extends on the side of the third transistor unit opposite to the side where the second drain wiring extends. | 02-05-2015 |
20150061036 | NOVEL 3D SEMICONDUCTOR DEVICE AND STRUCTURE - A semiconductor device, including: a first layer including monocrystalline material and first transistors, the first transistors overlaid by a first isolation layer; a second layer including second transistors and overlaying the first isolation layer, the second transistors including a monocrystalline material; at least one contact to the second transistors, where the at least one contact has a diameter of less than 200 nm; a first set of external connections underlying the first layer to connect the device to external devices; a second set of external connections overlying the second layer to connect the device to external devices; and an interconnection layer in-between the first layer and the second layer, where the interconnection layer includes copper or aluminum. | 03-05-2015 |
20150069523 | NOVEL SEMICONDUCTOR DEVICE AND STRUCTURE - An Integrated Circuit device, including: a base wafer including single crystal, the base wafer including a plurality of first transistors; at least one metal layer providing interconnection between the plurality of first transistors; a second layer of less than 2 micron thickness, the second layer including a plurality of second single crystal transistors, the second layer overlying the at least one metal layer; and at least one conductive structure underneath at least one of the second single crystal transistors, the at least one conductive structure is constructed to provide a back-bias to at least one of the second single crystal transistors. | 03-12-2015 |
20150091095 | SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate and a plurality of transistors arranged on the substrate in an array. The transistor includes a first electrode, a plurality of second electrodes, and a gate electrode. The second electrodes are arranged around the first electrode. The gate electrode is located between the first electrode and the second electrodes. The first electrode is a circle or polygon. The gate electrode is around the first electrode, and an edge of the gate electrode facing the first electrode has a shape corresponding to that of the first electrode. | 04-02-2015 |
20150091096 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a pipe channel layer formed on a semiconductor substrate, a first channel layer, a second channel layer and a third channel layer, connected with the pipe channel layer, first conductive layers stacked while surrounding the first channel layer, second conductive layers stacked while surrounding the second channel layer, and third conductive layers stacked while surrounding the third channel layer, wherein the first to third conductive layers are separately controlled. | 04-02-2015 |
20150102423 | METHOD FOR FINFET SRAM RATIO TUNING - A semiconductor device and method of forming the same include a substrate having a plurality of memory cells formed thereon. A memory cell includes pass-gate transistors, pull-up transistors, and pull-down transistors. The pass-gate transistors and a portion of the pull-down transistors have different doping concentrations. | 04-16-2015 |
20150129977 | SEMICONDUCTOR ELECTROSTATIC DISCHARGE PROTECTION APPARATUS - A semiconductor electrostatic discharge (ESD) protection apparatus comprises at least one elementary transistor with a first conductivity type, a well region with a second conductivity type, a guard ring with the second conductivity type and a semiconductor interval region. The elementary transistor is formed in the well region. The guard ring surrounds the at least one elementary transistor. The semiconductor interval region is disposed between the elementary transistor and the guard ring in order to surrounds the elementary transistor, wherein the semiconductor interval region is an undoped region, a doped region with the first conductivity type or a doped region with the second conductivity type that has a doping concentration substantially less than that of the well region. | 05-14-2015 |
20150137260 | SEMICONDUCTOR DEVICE - A plurality of unit MISFET elements connected in parallel with each other to make up a power MISFET are formed in an LDMOSFET forming region on a main surface of a semiconductor substrate. A control circuit that controls a gate voltage of the power MISFET is formed in a driver circuit region on the main surface of the semiconductor substrate. A wiring structure having a plurality of wiring layers made of the same metal material is formed on the semiconductor substrate. The gate electrodes of the plurality of unit MISFET elements formed in the LDMOSFET forming region are electrically connected to each other via gate wirings formed in all of the plurality of wiring layers made of the same metal material. | 05-21-2015 |
20150145061 | NOVEL CONTACT STRUCTURE FOR A SEMICONDUCTOR DEVICE AND METHODS OF MAKING SAME - A device includes first and second spaced-apart active regions positioned in a semiconducting substrate, an isolation region positioned between and separating the first and second spaced-apart active regions, and a layer of gate insulation material positioned on the first active region. A first conductive line feature extends continuously from the first active region and across the isolation region to the second active region, wherein the first conductive line feature includes a first portion that is positioned directly above the layer of gate insulation material positioned on the first active region and a second portion that conductively contacts the second active region. | 05-28-2015 |
20150294995 | DISPLAY DEVICE - A display device includes an array substrate and a color filter substrate. The array substrate including data lines in a periphery circuit area, and the color filter substrate including a common electrode. A portion of the common electrode of the color filter substrate corresponding to the periphery circuit area of the array substrate includes a plurality of stripe electrodes separated from each other, extending in a length direction of the data lines and overlapped with the data lines. For each data line, two adjacent stripe electrodes among the plurality of stripe electrodes overlapped with the data line are connected through a bypass electrode which is substantially not overlapped with the data line. In case of the data lines being broken or shorted with the common electrode, the data line can be repaired by using a separate stripe electrode, thereby enabling normal operation of the circuitry. | 10-15-2015 |
20150325564 | ACTIVE DEVICE ARRAY SUBSTRATE AND REPAIRING METHOD THEREOF - An active device array substrate includes a substrate, a first gate driving circuit, a second gate driving circuit, active devices, scan line structures and data lines. The substrate has an active region, a first peripheral region and a second peripheral region. The first and the second gate driving circuits are respectively located at the first and the second peripheral regions. Active device are arranged in an array at the active region. Each scan line structure includes a first scan line, a second scan line and an auxiliary pattern. The first scan line having a first terminal end and the second scan line having a second end are connected to a same row of the active devices respectively. A gap is between the first terminal end and the second terminal end. The auxiliary pattern is disposed on the gap and overlaps the first terminal end and the second terminal end. | 11-12-2015 |
20150325574 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND DEVICE MANUFACTURED BY THE SAME - A method for manufacturing a semiconductor device and a device manufactured by the same are provided. According to the embodiment, a substrate having at least a first area with a plurality of first gates and a second area with a plurality of second gates is provided, wherein the adjacent first gates and the adjacent second gates separated by an insulation, and a top surface of the insulation has a plurality of recesses. Then, a capping layer is formed over the first gate, the second gates and the insulation, and filling the recesses. The capping layer is removed until reaching the top surface of the insulation, thereby forming the insulating depositions filling up the recesses, wherein the upper surfaces of the insulating deposition are substantially aligned with the top surface of the insulation. | 11-12-2015 |
20150325601 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - An array substrate and a manufacturing method thereof are provided. The array substrate includes a substrate ( | 11-12-2015 |
20150333131 | HIGH DENSITY STATIC RANDOM ACCESS MEMORY ARRAY HAVING ADVANCED METAL PATTERNING - Methods and apparatus directed toward a high density static random access memory (SRAM) array having advanced metal patterning are provided. In an example, provided is a method for fabricating an SRAM. The method includes forming, using a self-aligning double patterning (SADP) technique, a plurality of substantially parallel first metal lines oriented in a first direction in a first layer. The method also includes etching the substantially parallel first metal lines, using a cut mask, in a second direction substantially perpendicular to the first direction, to separate the substantially parallel first metal lines into a plurality of islands having first respective sides that are aligned in the first direction and second respective sides that are aligned the second direction. The method also includes forming, in a second layer, a plurality of second metal lines oriented in the first direction. | 11-19-2015 |
20150340321 | SEMICONDUCTOR INTEGRATED CIRCUIT - Disclosed herein is a semiconductor integrated circuit including: a cell layout region including circuit cells subject to power control the supply and interruption of power to which is controlled by a power switch, and always-on circuit cell groups which are always powered after the activation; a main line laid out in the cell layout region and applied with a source or reference voltage; and first and second branch lines which branch from the main line in the cell layout region. | 11-26-2015 |
20150340451 | METHOD FOR CMP OF HIGH-K METAL GATE STRUCTURES - A method for manufacturing a semiconductor device includes providing a substrate containing a front-end device and forming a dielectric layer on the substrate. The front-end device includes a first dummy gate in a first type metal gate transistor region, a second dummy gate in a second type metal gate transistor region, and a polysilicon gate in a polysilicon gate region. The method also includes removing a thickness of the first, second, and polysilicon gates and forming a protective layer on the polysilicon layer to protect the polysilicon layer during a CMP process, thereby improving the performance and yield of the semiconductor device. | 11-26-2015 |
20150357327 | ROM Chip Manufacturing Structures - An integrated circuit (IC) chip embodiment includes first and second ROM cells arranged in a same row of a ROM array. The first and second ROM cells include first portions of first and second gate structures, respectively. The IC chip further includes a strap cell disposed between the first and second ROM cells. The strap cell includes second portions of the first and second gate structures. The first gate structure is physically separated from the second gate structure. | 12-10-2015 |
20150371944 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a plurality of transistors formed over a substrate, a support body including a horizontal portion and protrusions, wherein the horizontal portion covers at least one of the transistors, and the protrusions are formed over the horizontal portion and located between the transistors, and conductive layers and insulating layers alternately stacked over the support body and protruding upwardly along the sidewalls of the protrusions. | 12-24-2015 |
20150371992 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In one embodiment, a semiconductor device includes one or more gate conductors provided above a substrate, and including a pair of first portions adjacent to each other and a pair of second portions adjacent to each other. The device further includes a first diffusion region which is provided in a first region located between the pair of first portions, and corresponds to one of a drain region of a first conductivity type and a source region of a second conductivity type for a first transistor of the first conductivity type. The device further includes a second diffusion region which is provided in a second region located between the pair of second portions, and corresponds to the other of the drain and source regions for the first transistor. A first distance between the pair of first portions is shorter than a second distance between the pair of second portions. | 12-24-2015 |
20150380487 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device having improved performance. A semiconductor substrate is formed with unit LDMOSFET elements. The unit LDMOSFET elements have respective source regions electrically coupled to each other via a first source interconnect line and a second source interconnect line. The unit LDMOSFET elements have respective gate electrodes electrically coupled to each other via a first gate interconnect line and also electrically coupled to a second gate interconnect line in the same layer as that of the second source interconnect line via the first gate interconnect line. The unit LDMOSFET elements have respective drain regions electrically coupled to a back surface electrode via a conductive plug embedded in a trench of the semiconductor substrate. Each of the first source interconnect line and the first gate interconnect line has a thickness smaller than that of the second source interconnect line. Over the plug, the first gate interconnect line extends. | 12-31-2015 |
20160013190 | Memory Cell | 01-14-2016 |
20160056153 | SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME - A semiconductor device includes first and second gate structures extending in a first direction and spaced apart from each other in a second direction intersecting the first direction, a third gate structure extending in the first direction and provided between the first and second gate structures, a first contact connected to the first gate structure and having a first width in the second direction, a second contact connected to the second gate structure and having a second width in the second direction, and a third contact connected to the third gate structure and having a third width in the second direction. The first, second, and third contacts may be aligned with each other in the second direction to constitute one row. The first and second widths may be greater than the third width. | 02-25-2016 |
20160071842 | TRANSISTORS HAVING ONE OR MORE DUMMY LINES WITH DIFFERENT COLLECTIVE WIDTHS COUPLED THERETO - In an embodiment, an array of transistors has a first line coupled to a first transistor. The first line extends over a second transistor that is successively adjacent to the first transistor and over a third transistor that is successively adjacent to the second transistor. A second line is coupled to the second transistor and extends over the third transistor. One or more first dummy lines are coupled to the first line and extend from the first transistor to the second transistor. One or more second dummy lines are coupled to the second line and extend from the second transistor to the third transistor. A collective width of the one or more first dummy lines is greater than a collective width of the one or more second dummy lines. | 03-10-2016 |
20160079167 | TIE-OFF STRUCTURES FOR MIDDLE-OF-LINE (MOL) MANUFACTURED INTEGRATED CIRCUITS, AND RELATED METHODS - Tie-off structures for middle-of-line (MOL) manufactured integrated circuits, and related methods are disclosed. As a non-limiting example, the tie-off structure may be used to tie-off a drain or source of a transistor to the gate of the transistor, such as provided in a dummy gate used for isolation purposes. In this regard in one aspect, a MOL stack is provided that includes a metal gate connection that is coupled to a metal layer through metal structure disposed in and above a dielectric layer above a gate associated with the metal gate connection. By coupling the metal gate connection to the metal layer, the gate of a transistor may be coupled or “tied-off” to a source or drain element of the transistor. This may avoid the need to etch the metal gate connection provided below the dielectric layer to provide sufficient connectivity between the metal layer and the metal gate connection. | 03-17-2016 |
20160079242 | PATTERNING MULTIPLE, DENSE FEATURES IN A SEMICONDUCTOR DEVICE USING A MEMORIZATION LAYER - Provided are approaches for patterning multiple, dense features in a semiconductor device using a memorization layer. Specifically, an approach includes: patterning a plurality of openings in a memorization layer; forming a gap-fill material within each of the plurality of openings; removing the memorization layer; removing an etch stop layer adjacent the gap-fill material, wherein a portion of the etch stop layer remains beneath the gap-fill material; etching a hardmask to form a set of openings above the set of gate structures, wherein the etch to the hardmask also removes the gap-fill material from atop the remaining portion of the etch stop layer; and etching the semiconductor device to remove the hardmask within each of the set of openings. In one embodiment, a set of dummy S/D contact pillars is then formed over a set of fins of the semiconductor device by etching a dielectric layer selective to the gate structures. | 03-17-2016 |
20160087034 | TERMINATION OF SUPER JUNCTION POWER MOSFET - The present disclosure relates to an integrated circuit with a termination region, and an associated method of formation. In some embodiments, the integrated circuit comprises a cell region and a termination region. The termination region is disposed at an outer periphery of the cell region. The cell region comprises an array of device cells. The termination region comprises a plurality of termination rings encompassing the cell region. The plurality of termination rings have different depths. | 03-24-2016 |
20160099184 | SEMICONDUCTOR CHIP AND METHOD OF ESTIMATING CAPABILITY OF SEMICONDUCTOR MANUFACTURING SYSTEM - A method of estimating the capability of a semiconductor manufacturing system is provided. Plural first transistors are formed and a first VtMM value and a first scale value are obtained. Plural second transistors are formed and a second VtMM value and a second scale value are obtained. Plural third transistors are formed and a third VtMM value and a third scale value are obtained. A first channel length of the first transistor is smaller than a second channel length of the second transistor and is equal to a third channel length of the third transistor. A VtMM v.s. scale figure is established. A line is formed by linking the first dot and the third dot and a vertical Gap between the line and the second dot is measured. The capability of the semiconductor system is determined based on the vertical Gap. The invention further provides a chip. | 04-07-2016 |
20160111361 | 3D NONVOLATILE MEMORY DEVICE - A 3D nonvolatile memory device including memory cells vertically stacked is disclosed. Word lines are integrally formed to be elongated over adjacent cell regions spaced apart from each other, and portions of the word lines between the cell regions are partially etched in a stepped shape to form word line contact regions. | 04-21-2016 |
20160148952 | ARRAY SUBSTRATE, ITS MANUFACTURING METHOD AND DISPLAY DEVICE - The present disclosure relates to the field of display technology, and provides an array substrate, its manufacturing method and a display device. A signal line on the array substrate includes at least two conductive layers electrically connected to each other. When one of the conductive layers is broken, a signal may be transmitted through the other conductive layer(s). As a result, it is able to improve the reliability of the electrical connection of the signal line, thereby to improve the yield of the display device. Further, the plurality of conductive layers of the signal line is formed simultaneously in an existing process for manufacturing the conductive layer patterns for the array substrate, so it is unnecessary to form the signal line separately, and thereby the manufacturing process is simplified. | 05-26-2016 |
20160178980 | ARRAY SUBSTRATE AND DISPLAY PANEL | 06-23-2016 |
20160190141 | DUAL-PORT SRAM DEVICES AND METHODS OF MANUFACTURING THE SAME - A dual-port SRAM device includes a substrate having a field region and first to fourth active fins extending in a first direction, and a unit cell having first to eighth gate structures. The first and second gate structures are on the first, second and fourth active fins, and extend in a second direction crossing the first direction. The third and fourth gate structures are on the first, second and third active fins, and extend in the second direction. The fifth and sixth gate structures are on the third active fin, and extend in the second direction. The seventh and eighth gate structures are on the fourth active fin, and extend in the second direction. The sixth gate structure is electrically connected to the third gate structure through the first contact plug, and the seventh gate structure is electrically connected to the second gate structure through a second contact plug. | 06-30-2016 |
20180026042 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION | 01-25-2018 |
20190148357 | FinFET-Based ESD Devices and Methods for Forming the Same | 05-16-2019 |