Class / Patent application number | Description | Number of patent applications / Date published |
257263000 | Vertical controlled current path | 42 |
20080265289 | Device structure and manufacturing method using HDP deposited source-body implant block - This invention discloses a semiconductor power device. The trenched semiconductor power device includes a trenched gate, opened from a top surface of a semiconductor substrate, surrounded by a source region encompassed in a body region near the top surface above a drain region disposed on a bottom surface of a substrate. The semiconductor power device further includes an implanting-ion block disposed above the top surface on a mesa area next to the body region having a thickness substantially larger than 0.3 micron for blocking body implanting ions and source ions from entering into the substrate under the mesa area whereby masks for manufacturing the semiconductor power device can be reduced. | 10-30-2008 |
20090078971 | SEMICONDUCTOR DEVICE WITH STRUCTURED CURRENT SPREAD REGION AND METHOD - A semiconductor device with structured current spread region and method is disclosed. One embodiment provides a drift portion of a first conductivity type, a current spread portion of the first conductivity type and first portions of the first conductivity type. The current spread portion and the first portions are arranged in a first plane on the drift portion, wherein the current spread portion surrounds at least partially the first portions. The semiconductor body further includes spaced apart body regions of a second conductivity type which are arranged on the current spread portion. Further, the doping concentration of the current spread portion is higher than the doping concentrations of the drift portion and of the first portions. | 03-26-2009 |
20090127593 | MOS device - A semiconductor device includes a drain, an epitaxial layer overlaying the drain, a body disposed in the epitaxial layer, a source embedded in the body, a gate trench extending into the epitaxial layer, a gate disposed in the gate trench, an active region contact trench extending through the source, the active region contact trench having a varying contact trench depth, and an active region contact electrode disposed within the active region contact trench. | 05-21-2009 |
20090194796 | Vertical Gallium Nitride Semiconductor Device and Epitaxial Substrate - Affords epitaxial substrates for vertical gallium nitride semiconductor devices that have a structure in which a gallium nitride film of n-type having a desired low carrier concentration can be provided on a gallium nitride substrate of n type. A gallium nitride epitaxial film ( | 08-06-2009 |
20090212331 | SEMICONDUCTOR COMPONENT WITH SCHOTTKY ZONES IN A DRIFT ZONE - A description is given of a semiconductor component comprising a drift zone of a first conduction type and at least one Schottky metal zone arranged in the drift zone, and of a method for producing a semiconductor component. | 08-27-2009 |
20100148224 | POWER JUNCTION FIELD EFFECT POWER TRANSISTOR WITH HIGHLY VERTICAL CHANNEL AND UNIFORM CHANNEL OPENING - A semiconductor vertical junction field effect power transistor formed by a semiconductor structure having top and bottom surfaces and including a plurality of semiconductor layers with predetermined doping concentrations and thicknesses and comprising at least a bottom layer as drain layer, a middle layer as blocking and channel layer, a top layer as source layer. A plurality of laterally spaced U-shaped trenches with highly vertical side walls defines a plurality of laterally spaced mesas. The mesas are surrounded on the four sides by U-shaped semiconductor regions having conductivity type opposite to that of the mesas forming U-shaped pn junctions and defining a plurality of laterally spaced long and vertical channels with a highly uniform channel opening dimension. A source contact is formed on the top source layer and a drain contact is formed on the bottom drain layer. A gate contact is formed on the bottom of the U-shaped trenches for the purpose of creating and interrupting the vertical channels so as to turn on and turn off the transistor. | 06-17-2010 |
20100163935 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a junction FET of a normally-off type, a technique capable of achieving both of improvement of a blocking voltage and reduction of an ON resistance is provided. In a junction FET using silicon carbide as a substrate material, impurities are doped to a vicinity of a p-n junction between a gate region and a channel-formed region, the impurities having a conductive type which is reverse to that of impurities doped in the gate region and same as that of impurities doped in the channel-formed region. In this manner, an impurity profile of the p-n junction becomes abrupt, and further, an impurity concentration of a junction region forming the p-n junction with the gate region in the channel-formed region is higher than those of a center region in the channel-formed region and of an epitaxial layer. | 07-01-2010 |
20110037104 | VERTICAL SPACER FORMING AND RELATED TRANSISTOR - Methods include, for example, forming a vertically disposed active region on a substrate; forming a first gate over a portion of the vertically disposed active region; forming a dielectric over the portion; exposing an upper surface of the first gate; forming a second gate over the upper surface; and forming a spacer pocket region between the vertically disposed active region, the first gate and the dielectric, wherein the spacer pocket region is self-aligned to a lower surface of the second gate and has a substantially uniform thickness from an upper to a lower extent thereof. | 02-17-2011 |
20110127587 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME - The present invention relates to a semiconductor device, which includes a junction region formed in an active area of a semiconductor substrate; a trench defining a buried gate predetermined area within the semiconductor substrate; a gate electrode buried in an lower portion of the trench; an ion implantation region formed in a sidewall of the trench; and a capping insulation layer formed in an upper portion of the gate electrode. | 06-02-2011 |
20110303955 | Junction Field Effect Transistor Having A Double Gate Structure And Method of Making Same - A junction field effect transistor includes a channel region, a gate region coupled to the channel region, a well tap region coupled to the gate region and the channel region, and a well region coupled to the well tap region and the channel region. A double gate operation is achieved by this structure as a voltage applied to the gate region is also applied to the well region through the well tap region in order to open the channel from both the gate region and the well region. | 12-15-2011 |
20120068231 | VERTICAL DISCRETE DEVICES WITH TRENCH CONTACTS AND ASSOCIATED METHODS OF MANUFACTURING - The present technology is related generally to vertical discrete devices with a trench at the topside of the vertical discrete devices. The trench is filled with a conducting material. In this approach, a drain or cathode of the vertical discrete devices is electrically connected to the topside to result in a small area with low RON*AREA. | 03-22-2012 |
20120211806 | Normally-Off Semiconductor Switches and Normally-Off JFETS - A normally-off JFET is provided. The normally-off JFET includes a channel region of a first conductivity type, a floating semiconductor region of a second conductivity type adjoining the channel region, and a contact region of the first conductivity type adjoining the floating semiconductor region. The floating semiconductor region is arranged between the contact region and the channel region. Further, a normally-off semiconductor switch is provided. | 08-23-2012 |
20120305994 | SELF-ALIGNED TRENCH FIELD EFFECT TRANSISTORS WITH REGROWN GATES AND BIPOLAR JUNCTION TRANSISTORS WITH REGROWN BASE CONTACT REGIONS AND METHODS OF MAKING - Junction field-effect transistors with vertical channels and self-aligned regrown gates and methods of making these devices are described. The methods use techniques to selectively grow and/or selectively remove semiconductor material to form a p-n junction gate along the sides of the channel and on the bottom of trenches separating source fingers. Methods of making bipolar junction transistors with self-aligned regrown base contact regions and methods of making these devices are also described. The semiconductor devices can be made in silicon carbide. | 12-06-2012 |
20130001656 | VERTICALLY PINCHED JUNCTION FIELD EFFECT TRANSISTOR - A vertical junction field-effect transistor in a CMOS base-technology. The vertical junction field-effect transistor includes a semiconductor substrate having a source region and a drain region, a main-channel region formed between the source region and the drain region, a well region formed on the main-channel region between the source region and the drain region, vertical pinch-off regions formed at both source and drain ends or only on the source-end of the well region on the main-channel region in the source region and the drain region respectively, a source contact on the vertical pinch-off region in the source region, a drain contact on the vertical pinch-off region in the drain region, a gate contact on the well region between the source contact and the drain contact and shallow trench isolations formed on the well region. | 01-03-2013 |
20130009215 | VERTICAL DIODE USING SILICON FORMED BY SELECTIVE EPITAXIAL GROWTH - Some embodiments relate to an apparatus that exhibits vertical diode activity to occur between a semiconductive body and an epitaxial film that is disposed over a doping region of the semiconductive body. Some embodiments include an apparatus that causes both vertical and lateral diode activity. Some embodiments include a gated vertical diode for a finned semiconductor apparatus. Process embodiments include the formation of vertical-diode apparatus. | 01-10-2013 |
20130087835 | METHOD AND SYSTEM FOR FLOATING GUARD RINGS IN GAN MATERIALS - A semiconductor structure includes a III-nitride substrate with a first side and a second side opposing the first side. The III-nitride substrate is characterized by a first conductivity type and a first dopant concentration. The semiconductor structure further includes a III-nitride epitaxial layer of the first conductivity type coupled to the first surface of the III-nitride substrate, a first metallic structure electrically coupled to the second surface of the III-nitride substrate, and a III-nitride epitaxial structure of a second conductivity type coupled to the III-nitride epitaxial layer. The III-nitride epitaxial structure comprises at least one edge termination structure. | 04-11-2013 |
20130161705 | METHOD AND SYSTEM FOR A GAN VERTICAL JFET WITH SELF-ALIGNED SOURCE AND GATE - A semiconductor device includes a III-nitride substrate, a first III-nitride epitaxial layer coupled to the III-nitride substrate and having a mesa, and a second III-nitride epitaxial layer coupled to a top surface of the mesa. The semiconductor device further includes a III-nitride gate structure coupled to a side surface of the mesa, and a spacer configured to provide electrical insulation between the second III-nitride epitaxial layer and the III-nitride gate structure. | 06-27-2013 |
20130240955 | VERTICAL TRANSISTOR HAVING EDGE TERMINATION STRUCTURE - Described herein are embodiments of a vertical power transistor having drain and gate terminals located on the same side of a semiconductor body and capable of withstanding high voltages in the off-state, in particular voltages of more than 100V. | 09-19-2013 |
20130299882 | METHOD AND SYSTEM FOR A GAN VERTICAL JFET WITH SELF-ALIGNED SOURCE METALLIZATION - A semiconductor device includes a III-nitride substrate and a channel structure coupled to the III-nitride substrate. The channel structure comprises a first III-nitride epitaxial material and is characterized by one or more channel sidewalls. The semiconductor device also includes a source region coupled to the channel structure. The source region comprises a second III-nitride epitaxial material. The semiconductor device further includes a III-nitride gate structure coupled to the one or more channel sidewalls, a gate metal structure in electrical contact with the III-nitride gate structure, and a dielectric layer overlying at least a portion of the gate metal structure. A top surface of the dielectric layer is substantially co-planar with a top surface of the source region. | 11-14-2013 |
20140264477 | VJFET DEVICES - The present disclosure describes structures and processes to produce high voltage JFETs in wide-bandgap materials, most particularly in Silicon Carbide. The present disclosure also provides for products produced by the methods of the present disclosure and for apparatuses used to perform the methods of the present disclosure. | 09-18-2014 |
20140361349 | TRENCH SHIELD CONNECTED JFET - A shielded junction field effect transistor (JFET) is described having gate trenches and shield trenches, the shield trenches being deeper and narrower than the gate trenches. The gate trenches may be fully aligned, partially aligned, or separated from the shield trenches. | 12-11-2014 |
20150035015 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - To provide a semiconductor device having a vertical JFET excellent in off-state performance without reducing a production yield. A gate region quadrangular in the cross-section along a channel width direction is formed below a source region by impurity ion implantation. By first etching, the source region over the upper surface of the gate region is removed to separate therebetween. Then, the upper surface of the gate region is processed by second etching having an etching rate lower at the side surface than at the center of the gate region. The resulting gate region has a lower surface parallel to the substrate surface and an upper surface below a boundary between the source region and the channel formation region and having, in the cross-section along the channel width direction, a downward slope from the side surface to the center. As a result, a channel length with reduced variations can be obtained. | 02-05-2015 |
20150076568 | Junction Field Effect Transistor with Vertical PN Junction - An embodiment relates to a JFET with a channel region and a gate region forming a pn junction. Between a source region and a drain region in a semiconductor portion, the pn junction extends along a vertical direction perpendicular to a first surface of the semiconductor portion. The source, channel and drain regions have a first conductivity type and are arranged along the vertical direction. The gate region and a shielding region between the gate and drain regions have a second, complementary conductivity type. An auxiliary region separates the gate and shielding regions in the semiconductor portion. | 03-19-2015 |
20150340476 | METHOD AND SYSTEM FOR PLANAR REGROWTH IN GAN ELECTRONIC DEVICES - A vertical JFET includes a III-nitride substrate and a III-nitride epitaxial layer of a first conductivity type coupled to the III-nitride substrate. The first III-nitride epitaxial layer has a first dopant concentration. The vertical JFET also includes a III-nitride epitaxial structure coupled to the first III-nitride epitaxial layer. The III-nitride epitaxial structure includes a set of channels of the first conductivity type and having a second dopant concentration, a set of sources of the first conductivity type, having a third dopant concentration greater than the first dopant concentration, and each characterized by a contact surface, and a set of regrown gates interspersed between the set of channels. An upper surface of the set of regrown gates is substantially coplanar with the contact surfaces of the set of sources. | 11-26-2015 |
20160155861 | Method of Manufacturing a Device by Locally Heating One or More Metalization Layers and by Means of Selective Etching | 06-02-2016 |
257264000 | Enhancement mode or with high resistivity channel (e.g., doping of 10 15 cm -3 or less) | 1 |
20160155809 | SEMICONDUCTOR COMPONENT WITH FIELD ELECTRODE BETWEEN ADJACENT SEMICONDUCTOR FINS AND METHOD FOR PRODUCING SUCH A SEMICONDUCTOR COMPONENT | 06-02-2016 |
257265000 | In integrated circuit | 14 |
20080258184 | Normally-off integrated JFET power switches in wide bandgap semiconductors and methods of making - Wide bandgap semiconductor devices including normally-off VJFET integrated power switches are described. The power switches can be implemented monolithically or hybridly, and may be integrated with a control circuit built in a single- or multi-chip wide bandgap power semiconductor module. The devices can be used in high-power, temperature-tolerant and radiation-resistant electronics components. Methods of making the devices are also described. | 10-23-2008 |
20100295101 | INTEGRATED JFET AND SCHOTTKY DIODE - The present invention discloses an integrated junction field effect transistor (JFET) and Schottky diode, comprising a depletion mode JFET which includes a source, a drain and a gate, wherein the drain is not provided with an ohmic contact such that it forms a Schottky diode. | 11-25-2010 |
20100295102 | NORMALLY-OFF INTEGRATED JFET POWER SWITCHES IN WIDE BANDGAP SEMICONDUCTORS AND METHODS OF MAKING - Wide bandgap semiconductor devices including normally-off VJFET integrated power switches are described. The power switches can be implemented monolithically or hybridly, and may be integrated with a control circuit built in a single- or multi-chip wide bandgap power semiconductor module. The devices can be used in high-power, temperature-tolerant and radiation-resistant electronics components. Methods of making the devices are also described. | 11-25-2010 |
20120012902 | Semiconductor Device Including a Channel Stop Zone - A semiconductor device as described herein includes a body region of a first conductivity type adjoining a channel region of a second conductivity at a first side of the channel region. A gate control region of the first conductivity type adjoins the channel region at a second side of the channel region opposed to the first side, the channel region being configured to be controlled in its conductivity by voltage application between the gate control region and the body region. A source zone of the second conductivity type is arranged within the body region and a channel stop zone of the second conductivity type is arranged at the first side, the channel stop zone being arranged at least partly within at least one of the body region and the channel region. The channel stop zone includes a maximum concentration of dopants lower than a maximum concentration of dopants of the source zone. | 01-19-2012 |
20120068232 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - The present invention relates to a method for manufacturing a semiconductor device, and provides to reduce a contact resistance of a landing plug by forming the landing plug in such a manner that a polysilicon layer is deposited only on the surface of a landing plug contact hole, and a metal layer is buried in the rest of the landing plug contact hole in the process of forming a storage node contact or a bit line contact. | 03-22-2012 |
20120091513 | SEMICONDUCTOR SWITCH DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR SWITCH DEVICE - A semiconductor switch device and a method of manufacturing the semiconductor switch device are provided. The semiconductor switch device includes semiconductor elements on a single semiconductor substrate. At least one of the semiconductor elements constitutes a switch circuit and at least one other of the semiconductor elements constitutes a logic (connection) circuit. Each semiconductor element includes a recess, a gate electrode in the recess, a drain electrode, and a source electrode. In one representative aspect, the gate electrode in the switch circuit can have a rectangular external shape in section, and the gate electrode in the connection circuit has a shape in section other than rectangular. | 04-19-2012 |
20120161208 | Semiconductor Devices with Minimized Current Flow Differences and Methods of Same - A semiconductor device with minimized current flow differences and method of fabricating same are disclosed. The method includes forming a semiconductor stack including a plurality of layers that include a first layer having a first conductivity type and a second layer having a first conductivity type, in which the second layer is on top of the first layer, forming a plurality of mesas in the semiconductor layer stack, and forming a plurality of gates in the semiconductor layer stack having a second conductivity type and situated partially at a periphery of the mesas, in which the plurality of gates are formed to minimize current flow differences between a current flowing from the first layer to the plurality of mesas at a first applied gate bias and a current flowing from the first layer to the plurality of mesas at a second applied gate bias when voltage is applied to the semiconductor device. | 06-28-2012 |
20130119443 | SEMICONDUCTOR STRUCTURE FOR AN ELECTRONIC INTERRUPTOR POWER SWITCH - The invention relates to a structure comprising an n-type substrate ( | 05-16-2013 |
20130285124 | JFET DEVICE STRUCTURES AND METHODS FOR FABRICATING THE SAME - In accordance with the present techniques, there is provided a JFET device structures and methods for fabricating the same. Specifically, there is provided a transistor including a semiconductor substrate having a source and a drain. The transistor also includes a doped channel formed in the semiconductor substrate between the source and the drain, the channel configured to pass current between the source and the drain. Additionally, the transistor has a gate comprising a semiconductor material formed over the channel and dielectric spacers on each side of the gate. The source and the drain are spatially separated from the gate so that the gate is not over the drain and source. | 10-31-2013 |
20140131775 | VERTICAL GaN JFET WITH LOW GATE-DRAIN CAPACITANCE AND HIGH GATE-SOURCE CAPACITANCE - An embodiment of a vertical power device includes a III-nitride substrate, a drift region coupled to the III-nitride substrate and comprising a III-nitride material of a first conductivity type, and a channel region coupled to the drift region and comprising a III-nitride material of the first conductivity type. The vertical power device also includes a source region coupled to the channel region and comprising a III-nitride material of the first conductivity type, and a gate region coupled to the channel region. The gate region includes a III-nitride material of a second conductivity type. The vertical power device further includes a source-coupled region coupled to the drift region and electrically connected with the source region. The source-coupled region includes a III-nitride material of the second conductivity type. | 05-15-2014 |
20140231883 | Vertical JFET with Integrated Body Diode - A vertical junction field effect transistor (JFET) includes a drain, a source, a gate, a drift region, and a body diode. The source, gate, drift region, and body diode are all disposed in the same compound semiconductor epitaxial layer. The drain is vertically spaced apart from the source and the gate by the drift region. The body diode is connected between the drain and the source. | 08-21-2014 |
20140332857 | JUNCTION GATE FIELD-EFFECT TRANSISTOR (JFET), SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING - A junction gate field-effect transistor (JFET) includes a substrate, a source region formed in the substrate, a drain region formed in the substrate, a channel region formed in the substrate, and at least one gate region formed in the substrate. The channel region connects the source and drain regions. The at least one gate region contacts one of the source and drain regions at an interface, and the at least one gate region is isolated from the other of the source and drain regions. A dielectric layer covers the interface while exposing portions of the gate region and the one of the source and drain regions. | 11-13-2014 |
20150008487 | JUNCTION FIELD-EFFECT TRANSISTOR WITH RAISED SOURCE AND DRAIN REGIONS FORMED BY SELECTIVE EPITAXY - Junction field-effect transistors and design structures for a junction field-effect transistor. A source and a drain of the junction field-effect transistor are comprised of a semiconductor material grown by selective epitaxy and in direct contact with a top surface of a semiconductor layer. A gate is formed that is aligned with a channel laterally disposed in the semiconductor layer between the source and the drain. The source, the drain, and the semiconductor layer are each comprised of a second semiconductor material having an opposite conductivity type from a first semiconductor material comprising the gate. | 01-08-2015 |
20160155738 | MONOLITHIC BI-DIRECTIONAL CURRENT CONDUCTING DEVICE AND METHOD OF MAKING THE SAME | 06-02-2016 |
257266000 | With multiple parallel current paths (e.g., grid gate) | 2 |
20120139013 | STATIC INDUCTION TRANSISTOR WITH DIELECTRIC CARRIER SEPARATION LAYER - A static induction transistor comprising: a region of semiconductor material having a first conductivity type; at least two spaced-apart gate regions formed in the region of semiconductor material, the gate regions having a second conductivity type that is opposite to the first conductivity type; at least one source region having the first conductivity type formed in the region of semiconductor material between the spaced-apart gate regions; a drain region having the first conductivity type formed in the region of semiconductor and spaced-apart from the source region to define a channel region therebetween; and a dielectric carrier separation layer formed at the periphery of the gate regions. | 06-07-2012 |
20160079244 | MONOLITHIC BI-DIRECTIONAL CURRENT CONDUCTING DEVICE AND METHOD OF MAKING THE SAME - A monolithic bi-directional device provides bi-directional power flow and bi-directional blocking of high-voltages. The device includes a first transistor having a first drain formed over a first channel layer that overlays a substrate, and a second transistor that includes a second drain formed over a second channel layer that overlays the substrate. The substrate forms a common source for both the first transistor and the second transistor. | 03-17-2016 |