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Encapsulated

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257 - Active solid-state devices (e.g., transistors, solid-state diodes)

257079000 - INCOHERENT LIGHT EMITTER STRUCTURE

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DocumentTitleDate
20090230425WATER-BARRIER ENCAPSULATION METHOD - The present invention generally relates to organic light emitting diode (OLED) structures and methods for their manufacture. To increase the lifetime of an OLED structure, an encapsulating layer may be deposited over the OLED structure. The encapsulating layer may fully enclose or “encapsulate” the OLED structure. The encapsulating layer may have a substantially planar surface opposite to the interface between the OLED structure and the encapsulating layer. The planar surface permits successive layers to be evenly deposited over the OLED structure. The encapsulating layer reduces any oxygen penetration into the OLED structure and may increase the lifetime of the OLED structure.09-17-2009
20130026533ORGANIC LIGHT-EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic light emitting diode display includes a substrate, an organic light emitting diode on the substrate, an organic film configured to cover the organic light emitting diode on the substrate in an organic film deposition area having a first diameter, and an inorganic film configured to cover the organic film on the substrate in an inorganic film deposition area having a second diameter, wherein L01-31-2013
20080258171SEMICONDUCTOR LIGHT EMITTING DEVICE EXCELLENT IN HEAT RADIATION - A semiconductor light emitting device is provided which comprises: a semiconductor light emitting chip 10-23-2008
20110193130ORGANIC LIGHT EMITTING DIODE DEVICE - An organic light emitting diode device is disclosed. The organic light emitting diode device includes: a first electrode, a light emitting section disposed over the first electrode and including at least two light emitters displaying the same or different colors, a second electrode disposed over the light emitting section, and a filler layer for encapsulation disposed over the second electrode and including a light emitter displaying at least one color.08-11-2011
20130037850SEMICONDUCTOR LIGHT-EMITTING ELEMENT, PROTECTIVE FILM OF SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND METHOD FOR FABRICATING SAME - Disclosed are: a semiconductor light-emitting element that fulfills all of having high migration prevention, high transmittance, and low film-production cost; the protective film of the semiconductor light-emitting element; and a method for fabricating same. To this end, in the semiconductor light-emitting element-which has: a plurality of semiconductor layers (02-14-2013
20090065800OPTOELECTRONIC COMPONENT, DEVICE COMPRISING A PLURALITY OF OPTOELECTRONIC COMPONENTS, AND METHOD FOR THE PRODUCTION OF AN OPTOELECTRONIC COMPONENT - Disclosed is an optoelectronic component (03-12-2009
20130032853Silver Anti-Tarnishing Agent, Silver Anti-Tarnishing Resin Composition, Silver Anti-Tarnishing Method, And Light-Emitting Diode Using Same - The present invention relates to a silver anti-tarnish agent having, as an effective component, a zinc salt and/or a zinc complex, preferably at least one kind selected from the group consisting of a carboxylic acid zinc salt having a carbon atom number of 3 to 20, a phosphoric acid zinc salt, a phosphate ester zinc salt and a carbonyl compound zinc complex; a silver anti-tarnish method for preventing tarnish of a silver part by applying said silver anti-tarnish agent to the silver part. According to the present invention, tarnish of a silver part such as a silver-plated part due to a sulfur-based gas can be prevented. The present invention is useful particularly as a silver anti-tarnish agent for a light-emitting diode and allows preventing tarnish of a silver part of a light-emitting diode and reduction in illuminance by applying the silver anti-tarnish agent of the present invention to a silver part such as a silver-plated part of a light-emitting diode for covering the silver part.02-07-2013
20130032852SILICONE RESIN COMPOSITION, ENCAPSULATING MATERIAL, AND LIGHT EMITTING DIODE DEVICE - A silicone resin composition contains a silicon-containing component including a silicon atom to which a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group is bonded and a silicon atom to which an alkenyl group is bonded. The number of moles of alkenyl group per 1 g of the silicon-containing component is 200 to 2000 μmol/g.02-07-2013
20100096663PHOTOSENSITIVE RESIN AND PROCESS FOR PRODUCING MICROLENS - A material for a microlens having heat resistance, high resolution and high light-extraction efficiency is provided. A positive resist composition comprises an alkali-soluble polymer (A) containing a unit structure having an aromatic fused ring or a derivative thereof, and a compound (B) having an organic group which undergoes photodecomposition to yield an alkali-soluble group. The positive resist composition has coating film properties of a refractive index at a wavelength of 633 nm of 1.6 or more and a transmittance at wavelengths of 400 to 730 nm of 80% or more. A pattern forming method comprises applying the positive resist composition, drying the composition, exposing the composition to light, and developing the composition.04-22-2010
20090146176LIGHT EMITTING DIODE - The outer peripheral portion of a substrate is provided with a first peripheral edge and a second peripheral edge. The first peripheral edge is provided on the edge portion of a first upper surface of the substrate on which a light-emitting diode element is mounted. The second peripheral edge is formed either on an extension of an imaginary line connecting an edge of the light-emitting facet of the light-emitting diode element and the first peripheral edge or inwardly of the extension. The second peripheral edge is located at a position where the first peripheral edge blocks direct light from the light-emitting diode element. This configuration prevents the second upper surface of the substrate provided between the first peripheral edge and the second peripheral edge from becoming deteriorated due to the direct light.06-11-2009
20100006887RESIN COMPOSITION FOR SEALING LIGHT-EMITTING DEVICE AND LAMP - A resin composition for sealing a light-emitting device of the present invention includes a silsesquioxane resin including two or more oxetanyl groups, an aliphatic hydrocarbon including one or more epoxy groups and a cationic polymerization initiator. Furthermore, a lamp of the present invention includes a package equipped with a cup-shaped sealing member, an electrode exposed in the bottom portion of the sealing member, and a light-emitting device arranged on the bottom portion and electrically connected with the electrode, wherein the light-emitting device is sealed with the above-described resin composition for sealing a light-emitting device filled in the sealing member.01-14-2010
20130082300OPTICAL SEMICONDUCTOR SEALING CURABLE COMPOSITION AND OPTICAL SEMICONDUCTOR APPARATUS USING THIS - There are provided an optical semiconductor sealing curable composition that provides a cured material having excellent transparency, and an optical semiconductor apparatus having an optical semiconductor device sealed using the cured material obtained by curing the optical semiconductor sealing curable composition. There is provided an optical semiconductor sealing curable composition containing: (A) a linear polyfluoro compound; (B) cyclic organosiloxane having an SiH group and a fluorine-containing organic group; (C) a platinum group metal catalyst; (D) cyclic organosiloxane having an SiH group, fluorine-containing organic group, and an epoxy group; and (E) cyclic organosiloxane having an SiH group, a fluorine-containing organic group, and a cyclic carboxylic acid anhydride residue.04-04-2013
20130087827ORGANIC LIGHT-EMITTING DIODE AND METHOD OF MAKING SAME - An organic light-emitting diode includes a substrate layer, a cathode layer spread on the substrate layer, an organic film spread on the cathode layer and an anode layer spread on the organic film. The substrate layer is made of electrically insulative and transparent material. The cathode layer is made of transparent and electrically conductive material. The organic film includes an organic luminescent layer. Molecules of the organic film orient toward a uniform direction and the organic film radiates polarization light.04-11-2013
20100001310LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF - An exemplary light emitting diode (LED) includes a substrate, a LED chip and an encapsulation unit. The encapsulation unit includes a first encapsulation material located over the LED chip and a second encapsulation material located around the first encapsulation material. A plurality of first particles with a first distributing density is distributed in the first encapsulation material. A plurality of second particles with a second distributing density is distributed in the second encapsulation material. The first distributing density is larger than the second distributing density, a central portion of light from the light emitting diode chip transmits through the first encapsulation material and exits the encapsulation unit from a top surface thereof, and a periphery portion of light from the light emitting diode chip transmits through the second encapsulation material and exits the encapsulation unit from the top surface thereof.01-07-2010
20120305982OPTICAL SEMICONDUCTOR SEALING MATERIAL - The present invention provides an optical semiconductor sealing material comprising a radically polymerized polymer of a methacrylate ester having an alicyclic hydrocarbon group containing 7 or more carbon atoms, e.g. an adamantyl group, a norbornyl group, or a dicyclopentanyl group; and an optical semiconductor sealing material comprising a radically polymerized polymer of 50 to 97 mass % of the methacrylate ester and 3 to 50 mass % of acrylate ester having a hydroxyl group. The optical semiconductor sealing material of the present invention is highly transparent and stable to UV light and thus does not undergo yellowing. In addition, the material exhibits excellent compatibility between heat resistance and refractive index, does not undergo deformation or cracking during heating processes such as reflow soldering, and shows high processability. The material can be preferably used as a sealing material for light-emitting elements and light-receiving elements of optical semiconductor devices (semiconductor light-emitting devices).12-06-2012
20090078960LIGHT EMITTING DIODE WITH AUXILIARY ELECTRIC COMPONENT - An exemplary LED includes a substrate, an LED chip, a light pervious encapsulation, and an auxiliary electric component. The substrate includes a first surface, an opposite second surface, and an accommodating space defined therein between the first surface and the second surface. The LED chip is mounted on the first surface of the substrate. The light pervious encapsulation is formed on the substrate and covers the LED chip. The auxiliary electric component is received in the accommodating space between the first and second surfaces of the substrate.03-26-2009
20130161686Curable Organopolysiloxane Composition And Optical Semiconductor Device - A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively low hardness.06-27-2013
20130161685METHOD FOR MANUFACTURING NANO-IMPRINT MOULD, METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE USING THE NANO IMPRINT MOULD MANUFACTURED THEREBY, AND LIGHT-EMITTING DIODE MANUFACTURED THEREBY - A method of manufacturing a light emitting diode, includes a process of forming an n-type nitride semiconductor layer, a light emitting layer, and a p-type nitride semiconductor layer on a temporary substrate, a process of forming a p-type electrode on the p-type nitride semiconductor layer, a process of forming a conductive substrate on the p-type electrode, a process of removing the temporary substrate to expose the n-type nitride semiconductor layer, a process of forming a nanoimprint resist layer on the n-type nitride semiconductor layer, a process of pressing the nanoimprint mold on the nanoimprint resist layer to transfer the nano-pattern onto the nanoimprint resist layer, and a process of separating the nanoimprint mold from the nanoimprint resist layer having the nano-pattern and etching a portion of the nanoimprint resist layer having the nano-pattern to form an n-type electrode.06-27-2013
20130069106SILICONE RESIN SHEET, PRODUCING METHOD THEREOF, ENCAPSULATING SHEET, AND LIGHT EMITTING DIODE DEVICE - A method for producing a silicone resin sheet includes the steps of forming a first coating layer by applying a first silicone resin composition which contains a first organopolysiloxane and a second organopolysiloxane; forming a precursor layer from the first coating layer by reacting the first organopolysiloxane with the second organopolysiloxane so as to have a conversion ratio of 5 to 40%; and forming a second layer on at least one surface in a thickness direction of the precursor layer by applying a second silicone resin composition which contains a third organopolysiloxane, a fourth organopolysiloxane, a hydrosilylation catalyst, and a curing retardant containing tetraalkylammonium hydroxide.03-21-2013
20130069105METHOD FOR ENCAPSULATION OF ORGANIC ELECTRONIC DEVICES - The disclosure provides methods and materials for efficiently encapsulating electronic devices such as organic electroluminescent devices. The disclosure also provides electronic devices prepared by such methods. In one embodiment, for example, there is provided a method for preparing an electroluminescent device comprising forming a groove in a substrate and/or forming a groove in an encapsulation layer, depositing a desiccant in the groove or grooves, and bonding the substrate to the encapsulation layer.03-21-2013
20120235207ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display includes: a substrate; a display area including an organic light emitting element on the substrate; an organic encapsulation layer covering the organic light emitting element and having a second boundary spaced from a first boundary of the display area by a first distance; and an inorganic encapsulation layer having a peripheral area contacting the substrate and covering the organic encapsulation layer.09-20-2012
20130161683CURABLE SILICONE RESIN COMPOSITION WITH HIGH RELIABILITY AND OPTICAL SEMICONDUCTOR DEVICE USING SAME - An optical semiconductor device that combines low gas permeability and high reliability. A curable silicone resin composition comprising: (A) an alkenyl group-containing organopolysiloxane comprising an organopolysiloxane represented by an average composition formula (1) and containing at least two alkenyl groups per molecule:06-27-2013
20110031527Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate - The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.02-10-2011
20090218592Method of producing encapsulation resins - A process is provided for producing curable polyorganosiloxanes where noble metal oxides are used as hydrosilylation catalysts. The noble metals can be used in solid granular form or as part of a fixed bed, and do not form part of the final curable composition or cured product. The cured polyorganosiloxanes have increased stability and can be used as encapsulation resins at a temperature far lower than 300° C., have excellent light transmission properties (colorless transparency) in a wavelength region of from ultraviolet light to visible light, light resistance, heat resistance, resistance to moist heat and UV resistance, and do not generate cracks and peeling even in use over a long period of time.09-03-2009
20120098027SEALED THIN-FILM DEVICE, METHOD OF AND SYSTEM FOR REPAIRING A SEALING LAYER APPLIED TO A THIN-FILM DEVICE - The invention relates to a sealed thin-film device (04-26-2012
20130161684LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light-emitting device having a curved light-emitting surface is provided. Further, a highly-reliable light-emitting device is provided. A substrate with plasticity is used. A light-emitting element is formed over the substrate in a flat state. The substrate provided with the light-emitting element is curved and put on a surface of a support having a curved surface. Then, a protective layer for protecting the light-emitting element is formed in the same state. Thus, a light-emitting device having a curved light-emitting surface, such as a lighting device or a display device can be manufactured.06-27-2013
20110140163ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light emitting diode (OLED) display device and a method of manufacturing the same is disclosed. In one embodiment, the OLED device includes a substrate; a display unit formed on a display area of the substrate; and an encapsulating film covering i) the display unit and ii) a non-display area surrounding the display area, wherein the density and thickness of the encapsulating film increase in a direction from a center portion of the encapsulating film to an edge portion of the encapsulating film.06-16-2011
20110298004ENCAPSULATING SHEET FOR OPTICAL SEMICONDUCTOR - The present invention relates to an encapsulating sheet for an optical semiconductor, including: a phosphor-containing layer containing a phosphor; and an encapsulating resin layer containing an encapsulating resin and being laminated on the phosphor-containing layer, in which, on the laminated surface therebetween, an edge of the phosphor-containing layer protrudes from an edge of the encapsulating resin layer, and a protruded length of the phosphor-containing layer is from 1 to 10 times a thickness of the encapsulating resin layer.12-08-2011
20110298003EPOXY RESIN COMPOSITION FOR OPTICAL USE, OPTICAL COMPONENT USING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED USING THE SAME - The present invention relates to an epoxy resin composition for optical use including the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) an inorganic filler including (c1) an inorganic filler having a refractive index larger than a refractive index of a cured product obtained from the ingredients of the epoxy resin composition excluding the (C) inorganic filler and (c2) an inorganic filler having a refractive index smaller than the refractive index of the cured product obtained from the ingredients of the epoxy resin composition excluding the (C) inorganic filler.12-08-2011
20100171146OPTICAL SEMICONDUCTOR-SEALING COMPOSITION - The present invention provides an optical semiconductor encapsulating composition comprising (A) an epoxy compound, (B) a carboxylic anhydride curing agent, (C) a curing accelerator, and (D) surface-coated silica particles having an average particle diameter of 5 to 50 nm in which 0.2 to 3 mmol of a silane coupling agent (D2) that contains an epoxy group-containing silane coupling agent (d1) is reacted with 1 g of silica particles (D1) to surface-coat the silica particles, the epoxy group being converted into a hydroxyl group through ring opening; and an optical semiconductor device in which an optical semiconductor is encapsulated with the composition.07-08-2010
20110284916DEVICES INCLUDING, METHODS USING, AND COMPOSITIONS OF REFLOWABLE GETTERS - Methods for protecting circuit device materials, optoelectronic devices, and caps using a reflowable getter are described. The methods, devices and caps provide advantages because they enable modification of the shape and activity of the getter after sealing of the device. Some embodiments of the invention provide a solid composition comprising a reactive material and a phase changing material. The combination of the reactive material and phase changing material is placed in the cavity of an electronic device. After sealing the device by conventional means (epoxy seal for example), the device is subjected to thermal or electromagnetic energy so that the phase changing material becomes liquid, and consequently: exposes the reactive material to the atmosphere of the cavity, distributes the getter more equally within the cavity, and provides enhanced protection of sensitive parts of the device by flowing onto and covering these parts, with a thin layer of material.11-24-2011
20120007137ORGANIC LIGHT-EMITTING APPARATUS AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting apparatus and a method of manufacturing the same are provided.01-12-2012
20120098026Organic Light Emitting Diode Display and Method for Manufacturing Organic Light Emitting Diode Display - An organic light emitting diode (OLED) display comprises: a substrate; an organic light emitting element positioned on the substrate; an organic layer covering the organic light emitting element; and an inorganic layer including an outer portion in contact with the substrate and covering the organic layer, and an end positioned on the same line as an end of the substrate.04-26-2012
20100059787SEMICONDUCTOR LIGHT-EMITTING APPARATUS - An object of the present invention is to provide a light-emitting apparatus reduced in the optical self-absorption of the light-emitting device and assured of excellent light extraction efficiency. The inventive light-emitting apparatus comprises a substrate, a semiconductor light-emitting device provided on the substrate with or without intervention of a submount, and an encapsulating structure for encapsulating the semiconductor light-emitting device, wherein the encapsulating structure has a bottom parallel to the bottom of the semiconductor light-emitting device and the side surface of the encapsulating structure is tilted with respect to the bottom.03-11-2010
20090189180SILICONE RESIN COMPOSITION - A silicone resin composition is provided, which includes polysiloxane including (PSA1), (PSA2), (PSB) and (PSC), and a hydrosilylating catalyst, wherein a weight ratio between (PSA2) and (PSA1) (w2/w1) is 0.03-0.2:07-30-2009
20090189179METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing flip-chip light emitting diode (LED) package. A recess array is formed at the top surface of a silicon wafer. Two through-wafer via holes are formed in the recess. A plurality of LED chips are flip-chip mounted in each of the recesses, respectively. Two electrodes of each LED chip are respectively covered the two via holes. An encapsulator for encapsulating each LED chip is arranged in the recess to provide a flat top surface. A metal layer is deposited on the bottom surface of the silicon wafer to electrically connecting with the electrodes through the two via holes. Metal lines which electrically connecting the electrodes are formed by patterning the metal layer. A plurality of silicon submounts, each including at least one recess, are cut off from the silicon wafer. A fluorescent layer is arranged on the top surface of the encapsulator.07-30-2009
20100025724Resin Composition for LED Encapsulation - Disclosed is a resin composition for LED encapsulation including an organic oligosiloxane hybrid prepared by non-hydrolytic condensation of organoalkoxysilane. More particularly, the resin composition for LED encapsulation includes an organic oligosiloxane hybrid prepared by non-hydrolytic condensation of organoalkoxysilane with organosilanediol or non-hydrolytic condensation of a mixture containing organoalkoxysilane and metal alkoxide with organosilanediol. The prepared organic oligosilane hybrid has an inorganic network structure with a high degree of condensation and contains at least one organic group or organic functional group. In addition, an encapsulated LED fabricated using the above resin composition for LED encapsulation is provided.02-04-2010
20090121255RESIN FOR OPTICAL-SEMICONDUCTOR-ELEMENT ENCAPSULATION CONTAINING POLYIMIDE AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED WITH THE SAME - The present invention relates to a resin for optical-semiconductor-element encapsulation containing a polyimide which is produced by imidizing a polyimide precursor obtained by subjecting 5-norbornene-2,3-dicarboxylic anhydride or maleic anhydride, an aliphatic tetracarboxylic dianhydride, and an aliphatic diamine compound to a condensation polymerization reaction. The resin of the invention has excellent heat resistance and excellent light-transmitting properties. In addition, the present invention also relates to an optical semiconductor device containing an optical semiconductor element encapsulated with the resin.05-14-2009
20090121254Method for Modification of Built In Potential of Diodes - In broad terms the present invention is a semiconductor junction comprising a first material (05-14-2009
20110198665LIGHT EMITTING ELEMENT, METHOD FOR MANUFACTURING SAME, AND LIGHT EMITTING DEVICE - According to one embodiment, a light emitting element includes a semiconductor stacked body and a translucent substrate. The semiconductor stacked body includes a light emitting layer. The translucent substrate has one surface and a side surface. The semiconductor stacked body is provided on the upper surface. An unevenness uniformly distributing with average height and average pitch is provided on the side surface.08-18-2011
20110198664LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE INCLUDING THE SAME - Provided are a light emitting device and a light emitting device package comprising the same. The light emitting device comprises a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer. The active layer is formed between the first conductive type semiconductor layer and the second conductive type semiconductor layer. Here, at least one of the first conductive type semiconductor layer and the second conductive type semiconductor layer has current spreading structures comprising a pair of a first conductive layer and a second conductive layer and is disposed in a sequence of the second conductive layer and the first conductive layer from the active layer.08-18-2011
20090294796Adhesive-Promoting Agent, Curable Organopolysiloxane Composition, and Semiconductor Device - An adhesion-promoting agent represented by the following average formula: R12-03-2009
20090008673Semiconductor Light Emitting Device Member, Method for Manufacturing Such Semiconductor Light Emitting Device Member and Semiconductor Light Emitting Device Using Such Semiconductor Light Emitting Device Member - A semiconductor light-emitting device member excellent in transparency, light resistance, and heat resistance and capable of sealing a semiconductor light-emitting device without causing cracks and peeling even after a long-time use is provided. Therefore, a semiconductor light-emitting device member that comprises (1) in a solid Si-nuclear magnetic resonance spectrum, at least one peak selected from a group consisting of (i) peaks whose peak top position is in an area of a chemical shift of −40 ppm to 0 ppm inclusive, and whose full width at half maximum is 0.3 ppm to 3.0 ppm inclusive, and (ii) peaks whose peak top position is in an area of the chemical shift of −80 ppm or more and less than −40 ppm, and whose full width at half maximum is 0.3 ppm to 5.0 ppm inclusive, wherein (2) silicon content is 20 weight % or more and (3) silanol content is 0.1 weight % to 10 weight % inclusive is used.01-08-2009
20090283794CURABLE RESIN MATERIAL COMPOSITION, OPTICAL MATERIAL, LIGHT-EMITTING DEVICE, METHOD FOR PRODUCING LIGHT-EMITTING DEVICE, AND ELECTRONIC DEVICE - A curable resin material composition includes an addition-polymerization-curable silicone resin material that gives a silicone resin having a glass transition temperature of 50° C. or less when cured, the addition-polymerization-curable silicone resin material including, a SiH-group-containing siloxane-based compound containing a SiH group where a silicon atom is bonded to a hydrogen atom, a C═C-bond-containing siloxane-based compound containing a carbon-carbon double bond capable of effecting addition reaction with the SiH group, and a hydrosilylation addition reaction catalyst; and a non-reactive siloxane-based compound that does not react with the SiH-group-containing siloxane-based compound or the C═C-bond-containing siloxane-based compound, that is compatible with the addition-polymerization-curable silicone resin material, and that has a pour point of 0° C. or less.11-19-2009
20120292661FLUORINATED CURABLE RESIN COMPOSITION - To provide a fluorinated curable resin composition which is excellent in thermal stability and thermal adhesive property. A fluorinated curable resin composition comprising a fluoropolymer (P) having a polymerizable double bond and a thiol compound (S), wherein the fluoropolymer (P) is a copolymer having repeating units derived from a fluoromonoene (a) and a fluorodiene (b) having a residual unsaturated side chain, and the content of the thiol compound (S) is from 0.01 to 1 part by mass per 100 parts by mass of the fluoropolymer (P).11-22-2012
20080296608Light-emitting device - A light-emitting element 12-04-2008
20090014750RESIN FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION CONTAINING POLYBOROSILOXANE - The present invention relates to a resin for optical semiconductor element encapsulation containing a polyborosiloxane obtained by reacting a silicon compound with a boron compound; and an optical semiconductor device containing the resin and an optical semiconductor element encapsulated with the resin. The resin for optical semiconductor element encapsulation according to the invention exhibits an excellent advantage that it is excellent in all of heat resistance, transparency, and light resistance.01-15-2009
20080265274Light emitting diode element having a voltage regulating capability - An LED element having a voltage regulating capability has a body, two pins, a resistor and a conductive sleeve. The resistor is connected to a shorter pin through the conductive sleeve, so an operator can easily use the conductive sleeve to cover the shorter pin and one of two terminals of the resistor. Further, to increase connecting strength among the conductive sleeve, the shorter pin and the terminal of the resistor, an operator further uses a tongs to deform the conductive sleeve to tight the pin and the terminal.10-30-2008
20110266590Encapsulated Optoelectronic Component and Method for the Production Thereof - A method for encapsulating an optoelectronic component by depositing a diffusion barrier for protection against environmental influences by means of an atmospheric pressure plasma on at least one subarea of the surface of the optoelectronic component.11-03-2011
20100200891LED STRUCTURE - The present invention discloses an improved LED structure and comprises: a LED chip; a wire; a packing mask; and a photocatalytic agent. The volume of an LED is smaller so as to be convenient for installation. Compared to a conventional LED with same power, the present invention increases the total contact surface area that contacts air, so that the functions of disinfection, deodorization, and mildewproofing can be effectively achieved.08-12-2010
20100200890CURABLE RESIN COMPOSITION, LED PACKAGE, AND METHOD FOR PRODUCTION OF THE LED PACKAGE, AND OPTICAL SEMICONDUCTOR - The curable resin composition of the present invention comprises a polyol component containing tri- or higher functional polycaprolactone polyol; and a polyisocyanate component containing bifunctional or trifunctional alicyclic isocyanate having one or more chemical structures in which an isocyanate group is bonded to a secondary carbon atom.08-12-2010
20100200889METHOD FOR FORMING A LIGHT-EMITTING CASE AND RELATED LIGHT-EMITTING MODULE - A method for manufacturing a light-emitting case includes forming a PLED (Polymer Light Emitting Diode) device, disposing the PLED device into a mold, and utilizing the mold to sheathe the PLED device with transparent plastic material in an injection-molding manner. Since the mold has a cavity corresponding to a predetermined shape, the formed transparent plastic material has a geometric appearance corresponding to the predetermined shape.08-12-2010
20120068219MICROENCAPSULATED PARTICLES AND PROCESS FOR MANUFACTURING SAME - Microencapsulated particles having improved resistance to moisture and extended release capabilities are produced by microencapsulating the particles in a film-forming, cross-linked, hydrolyzed polymer.03-22-2012
20090050926Light emitting device - A light emitting device includes a light emitting element, an element mounting board including a wiring layer on an element mounting surface thereof, and a sealing portion that seals the light emitting element. The light emitting element includes a contact electrode including a transparent conductive film, a transparent dielectric layer formed on a surface of the contact electrode and including a refractive index lower than the contact electrode, and a pad electrode electrically connected to the contact electrode. The light emitting element is flip-chip mounted on the wiring layer. A part of the transparent dielectric layer is formed between the contact electrode and the pad electrode.02-26-2009
20120104454OPTICAL DEVICE, PROCESS FOR FABRICATING IT AND AN ELECTRONIC PACKAGE COMPRISING THIS OPTICAL DEVICE - An optical device includes at least one optical die (05-03-2012
20110140164ORGANIC LIGHT EMITTING APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING APPARATUS - An organic light emitting apparatus and a method of manufacturing the organic light emitting apparatus. According to the organic light emitting apparatus and the method of manufacturing the organic light emitting apparatus, the characteristics of a barrier layer are maintained and a stress of a substrate is reduced, even at a high temperature, thereby increasing the manufacturing stability of the organic light emitting apparatus.06-16-2011
20090200572Lighting device and production method of the same - Bonding between a light-emitting element and electrodes of a substrate is ensured to enhance reliability of a lighting device. In the lighting device of the present invention, a material made of metal alkoxide or polymetalloxane generated from metal alkoxide is used as a coating material covering the light-emitting element. This may enhance reliability of the bonding between the substrate and the light-emitting element while keeping a high light-emission efficiency. Further, when a liquid material made of metal alkoxide is heat-cured by a sol-gel method, the liquid material changes from a liquid, a sol, a gel, to a solid successively to shrink, thereby generating glass being a solid material. With the use of a shrinking force obtained when the gel changes to the solid in the production method, the bonding between the light-emitting element and the electrodes of the substrate can be performed simultaneously with the curing of the coating material.08-13-2009
20090242928RESIN SHEET FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE - The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.10-01-2009
20080315242System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack - Exemplary embodiments of the selective laser repair apparatus and method may allow the repair of metal bumps in a semiconductor device stack by applying a laser beam to a damaged and/or defective bump. Metal bumps may be repaired and individual chips and/or packages forming a device stack need not be separated. The operation of a control unit and a driving unit may position a laser unit such that a laser beam may be irradiated at the damaged and/or defective metal bump. An X-ray inspection unit may obtain information about the damaged and/or defective metal bump.12-25-2008
20090250718LIGHT EMITTING DIODE AND METHOD FOR PRODUCING THE SAME - A method for producing an LED includes steps of: providing a base (10-08-2009
20090256171RESIN COMPOSITION FOR SEALING LIGHT-EMITTING DEVICE AND LAMP - A resin composition for sealing a light-emitting device of the present invention includes a silsesquioxane resin including two or more oxetanyl groups, a cationic polymerization initiator and a metal oxide fine particle. Furthermore, a lamp of the present invention includes a package equipped with a sealing member, an electrode exposed in the bottom portion of the sealing member, and a light-emitting device arranged on the bottom portion and electrically connected with the electrode, wherein the light-emitting device is sealed with the resin composition for sealing a light-emitting device filled in the sealing member.10-15-2009
20090050925RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS FOR MANUFACTURING THE SAME - The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus.02-26-2009
20100019271EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C):01-28-2010
20130214324SEMICONDUCTOR DEVICE AND PEELING OFF METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The present invention provides a peeling off method without giving damage to the peeled off layer, and aims at being capable of peeling off not only a peeled off layer having a small area but also a peeled off layer having a large area over the entire surface at excellent yield ratio. The metal layer or nitride layer 08-22-2013
20100258839ORGANIC ELECTROLUMINESCENCE DEVICE AND METHOD FOR MANUFACTURING THE SAME - An organic electroluminescent device comprising a supporting substrate, a sealing substrate and an organic electroluminescent element, comprising: the organic electroluminescent element mounted on the supporting substrate, and enclosed between the supporting substrate and the sealing substrate, and an insulating layer that covers the organic electroluminescent element, wherein the supporting substrate and/or the sealing substrate adhered to the insulating layer is formed of a material having thermal conductivity of 2 W/m·K or more, and wherein one surface of the supporting substrate and/or the sealing substrate formed of the material having the thermal conductivity, which is the surface constituting an exterior of the organic electroluminescent device, has surface roughness (Ra value) of 10 nm or more and 1 mm or less.10-14-2010
20100224906COMPOSITION ENCAPSULATING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE USING SAME - A composition for encapsulating optical semiconductors. The composition comprises (A) a mixture of a linear alkenyl group-containing organopolysiloxane and an alkenyl group-containing organopolysiloxane resin containing at least one SiO09-09-2010
20110175138SEMICONDUCTOR LIGHT EMITTING DEVICE WITH INTEGRATED ELECTRONIC COMPONENTS - One or more circuit elements such as silicon diodes, resistors, capacitors, and inductors are disposed between the semiconductor structure of a semiconductor light emitting device and the connection layers used to connect the device to an external structure. In some embodiments, the n-contacts to the semiconductor structure are distributed across multiple vias, which are isolated from the p-contacts by one or more dielectric layers. The circuit elements are formed in the contacts-dielectric layers-connection layers stack.07-21-2011
20100213502OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATED WITH SILICONE RESIN - An optical semiconductor device encapsulated with a silicone resin that suffers no discoloration of the lead and exhibits excellent thermal shock resistance. The optical semiconductor device includes an optical semiconductor element and a cured product of a silicone resin composition that encapsulates the optical semiconductor element, wherein the amount of (ΦSiO08-26-2010
20100001311HEAT-CURABLE SILICONE RESIN-EPOXY RESIN COMPOSITION, AND PREMOLDED PACKAGE MOLDED FROM SAME - A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing.01-07-2010
20100252858GLASS, COATING MATERIAL FOR LIGHT-EMITTING DEVICES AND LIGHT-EMITTING DEVICE - To provide glass with which a sealing treatment can be carried out at a temperature of at most 400° C. and which does not deteriorate or change in quality for a long time.10-07-2010
20110108880ORGANIC EL ELEMENT, METHOD FOR MANUFACTURING ORGANIC EL ELEMENT, ORGANIC EL DEVICE, AND ELECTRONIC APPARATUS - An organic EL element includes a functional layer disposed between an anode and a cathode on a substrate and including laminated different organic thin films including a light-emitting layer, and a partition wall which defines the functional layer. Each of the organic thin films is formed by applying a liquid containing a functional layer-forming material on a film-forming region defined by the partition wall and then drying the liquid. The partition wall has at least one step portion provided in the side wall thereof in the thickness direction, and liquid repellency is imparted to the uppermost surface of the partition wall and the upper surface of the step portion. The surface of the side wall excluding the step portion has lyophilicity in comparison with the upper surface of the step portion.05-12-2011
20090020779Method of preparing a sealed light-emitting diode chip - A method for producing a light emitting diode chip encapsulation product, the method comprising covering a light emitting diode chip connected onto a substrate with a thermosetting film, and thermally curing the thermosetting film.01-22-2009
20090146175THERMAL STABLE TRANSPARENT SILICONE RESIN COMPOSITIONS AND METHODS FOR THEIR PREPARATION AND USE - A curable silicone composition includes (A) a polydiorganosiloxane having an average, per molecule, of at least two aliphatically unsaturated organic groups and at least one aromatic group; (B) a branched polyorganosiloxane having an average, per molecule, of at least one aliphatically unsaturated organic group and at least one aromatic group; (C) a polyorganohydrogensiloxane having an average per molecule of at least two silicon-bonded hydrogen atoms and at least one aromatic group, (D) a hydrosilylation catalyst, and (E) a silylated acetylenic inhibitor. The curable silicone composition cures to form a cured silicone resin having a refractive index >1.40. The curable silicone composition cures by heating to form a cured silicone resin with an optical transparency >95% at a thickness of 2.0 mm or less at 400 nm wavelength after thermal aging by heating at 200° C. for 14 days.06-11-2009
20090140285LIGHT EMITTING DEVICE HAVING FUNCTION OF HEAT-DISSIPATION AND MANUFACTURING PROCESS FOR SUCH DEVICE - A light-emitting device of a light-emitting diode (LED) and a manufacture method thereof are provided. The light-emitting device includes a post-like metal material, a printed circuit board, conductors, insulators, light-emitting diodes, wires, and an encapsulating material. The light-emitting device has through holes, in which conductors are disposed and surrounded with the insulators. One end of each conductor is connected to the printed circuit board to form a composite structure heat-dissipation substrate. The light-emitting diodes are disposed on the post-like metal material, connected to the conductors via the wires, and encapsulated by the encapsulating material. Furthermore, the light-emitting diodes, the wires, and the encapsulating material can be combined into a light-emitting unit. Moreover, red, blue, and green light-emitting diodes can be combined and the color of output light thereof can be adjusted by controlling the input signal.06-04-2009
20090072265PROCESS FOR PRODUCING LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE - The present invention provides a process for producing a light-emitting device capable of achieving high directivity without a cavity, which minimizes occurrence of short circuit at a time of covering a light-emitting element with glass. The present invention further provides a light-emitting device capable of achieving high directivity without a cavity.03-19-2009
20100295091ENCAPSULANT COMPOSITIONS, METHODS OF MANUFACTURE AND USES THEREOF - An encapsulant composition containing about 15 to about 50 wt % of an ethylene/ethyl acrylate/maleic anhydride copolymer containing about 20 to about 40 wt % of an ethylene/glycidyl (meth)acrylate copolymer; about 2 to about 30 wt % of an ethylene/butyl acrylate/maleic anhydride copolymer; about 5 to about 50 wt % of polyethylene, about 0.05 to about 5 wt % of an adhesion promoter; and optionally about 0.01 to about 2 wt % of at least one additive. The composition is useful for encapsulating thin film devices. The disclosure also relates to a method of encapsulating thin film devices with the composition and to devices produced by the method.11-25-2010
20110248313Display Device and Method for Manufacturing the Same - An object of the present invention is to provide such a sealing structure that a material to be a deterioration factor such as water or oxygen is prevented from entering from external and sufficient reliability is obtained in a display using an organic or inorganic electroluminescent element. In view of the above object, focusing on permeability of an interlayer insulating film, deterioration of an electroluminescent element is suppressed and sufficient reliability is obtained by preventing water entry from an interlayer insulating film according to the present invention.10-13-2011
20100301378ILLUMINATION DEVICE AND METHOD FOR THE PRODUCTION THEREOF - A method for producing an illumination device is provided. The method may include providing a carrier, on which illumination means are applied, with filler material; applying an upper exterior layer on the filler material; reducing the arrangement formed by the carrier, filler material and upper exterior layer to a predetermined thickness; wherein the carrier is a flex-board, which is equipped with the illumination means.12-02-2010
20100252857ORGANIC EL DEVICE, EL DISPLAY PANEL, METHOD FOR MANUFACTURING THE ORGANIC EL DEVICE AND METHOD FOR MANUFACTURING THE EL DISPLAY PANEL - Disclosed is a method for manufacturing an organic EL device which comprises a hole injection layer having a flat surface that is not contaminated. Specifically disclosed method for manufacturing an organic EL device, which comprises a step of forming an anode on a substrate; a step of forming a hole injection layer on the anode; a step of forming an inorganic film on the substrate and the hole injection layer; a step of forming a bank on the inorganic film in such a manner that at least a part of the inorganic film formed on the hole injection layer is exposed; a step of etching the exposed inorganic film by using the bank as a mask so that the hole injection layer is exposed therefrom; and a step of forming an organic light-emitting layer by applying an organic light-emitting material onto the exposed hole injection layer. The hole injection layer contains tungsten oxide or molybdenum oxide.10-07-2010
20110018026LIGHT EMITTING DEVICE, AND METHOD AND APPARATUS FOR MANUFACTURING SAME - A method for manufacturing a light emitting device includes: measuring at least one of each wavelength of the emitted light of the light emitting element, each optical output of the emitted light of the light emitting element, and each chromaticity of the mixed light emitted through the mixed resin in a manufacturing process of the light emitting device; and adjusting chromaticity for each light emitting device by performing a prescribed chromaticity adjustment with regard to the mixed resin, on basis of a result obtained in the measuring, so that the chromaticity of the mixed light falls within a preset prescribed range.01-27-2011
20080296607ENVIRONMENTALLY ROBUST LIGHTING DEVICES AND METHODS OF MANUFACTURING SAME - An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly including at least the silicone encapsulant and the light emitting chip. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip by disposing a light transmissive plastic layer as a unit over the assembly.12-04-2008
20110114994HYBRID LAYERS FOR USE IN COATINGS ON ELECTRONIC DEVICES OR OTHER ARTICLES - A method for protecting an electronic device comprising an organic device body. The method involves the use of a hybrid layer deposited by chemical vapor deposition. The hybrid layer comprises a mixture of a polymeric material and a non-polymeric material, wherein the weight ratio of polymeric to non-polymeric material is in the range of 95:5 to 5:95, and wherein the polymeric material and the non-polymeric material are created from the same source of precursor material. Also disclosed are techniques for impeding the lateral diffusion of environmental contaminants.05-19-2011
20110114993ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME - An organic light emitting diode display includes a flexible substrate, an organic light emitting diode disposed over the flexible substrate, and an encapsulation film disposed over the flexible substrate to encapsulate the organic light emitting diode, with the organic light emitting diode interposed between the encapsulation film and the flexible substrate. A thermal conduction layer contacts the flexible substrate, wherein the thermal conduction layer faces the organic light emitting diode and the flexible substrate is interposed between the thermal conduction layer and the organic light emitting diode. A first film is disposed over the encapsulation film, and a second film is disposed over the thermal conduction layer.05-19-2011
20110114992Method for Producing an Electronic Component and Electronic Component - A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate (05-19-2011
20110079816OPTICAL-SEMICONDUCTOR ENCAPSULATING MATERIAL - The present invention relates to a sheet-shaped optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor.04-07-2011
20090218591Method for Connecting Layers, Corresponding Component and Organic Light-Emitting Diode - A method for bonding several layers, which comprise at least one thermally bondable material, by means of a joint layer produced with the aid of thermocompression at least one of the layers comprising a semiconductor material, as well as to a correspondingly manufactured device. Also disclosed is a method for manufacturing an organic light-emitting diode and an organic light-emitting diode that is encapsulated between two cover layers with the aid of thermocompression.09-03-2009
20110248312SILICONE RESIN SHEET - The present invention relates to a silicone resin sheet obtained by semi-curing a composition for a silicone resin, the composition including: (1) an organopolysiloxane having at least two alkenylsilyl groups in one molecule thereof; (2) an organopolysiloxane having at least two hydrosilyl groups in one molecule thereof; (3) a hydrosilylation catalyst; and (4) a curing retardant.10-13-2011
20110068363LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a light emitting device, including the steps of: (A) sequentially forming a first compound semiconductor layer of a first conduction type, an active layer, and a second compound semiconductor layer of a second conduction type different from said first conduction type, over a substrate; and (B) exposing a part of said first compound semiconductor layer, forming a first electrode over said exposed part of said first compound semiconductor layer and forming a second electrode over said second compound semiconductor layer, wherein said method further includes, subsequent to said step (B), the step of: (C) covering at least said exposed part of said first compound semiconductor layer, an exposed part of said active layer, an exposed part of said second compound semiconductor layer, and a part of said second electrode with an SOG layer.03-24-2011
20120175671Glued light core for light-emitting diode - The present invention relates to an improved glued light core for a light-emitting diode (LED), which provides an optical lamp body integrally formed on an upper end of an LED lead frame. In particular, the optical lamp body is designed as a glued structure with minimal epoxy, to simplify a complicated packaging operation in a conventional manufacturing process, to directly fasten a crystal cup, a crystal cell and a conductive gold wire to the upper end of the lead frame by the epoxy, and to provide illumination comparable to that of general light core. Additionally, a light-emitting housing is made of polychloroprene or plastic resin which is able to be applied or injected outside the glued light core, such that a light source inside the glued light core emits light beams through the light-emitting housing to form collection or stray lights of a special light source with multiple variations. Thus, the manufacturing process and multiple applications of the LED can be greatly simplified.07-12-2012
20110163350METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR LAYER, METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND GROUP III NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND LAMP - A method for manufacturing a Group III nitride semiconductor layer according to the present invention includes a sputtering step of disposing a substrate and a target containing a Group III element in a chamber, introducing a gas for formation of a plasma in the chamber and forming a Group III nitride semiconductor layer added with Si as a dopant on the substrate by a reactive sputtering method, wherein a Si hydride is added in the gas for formation of a plasma.07-07-2011
20110175137ORGANIC EL DEVICE AND METHOD FOR MANUFACTURING THE SAME - An organic EL device is provided and, in particular, a top-emission-type organic EL device, which can maintain excellent light emission efficiency over a prolonged period of time. The organic EL device includes a substrate; and an organic EL element that is formed on the substrate and that includes a lower electrode, an organic EL layer, an upper electrode, and a protective layer. The protective layer includes at least one inorganic film provided that at least one film thereof is a SiN:H film having a stretching-mode peak area ratio, as determined by infrared absorption spectrum measurements, of N—H bonds to Si—N bonds that is greater than 0.06 but does not exceed 0.1, and having a stretching-mode peak area ratio, as determined by infrared absorption spectrum measurements, of Si—H bonds to Si—N bonds that is greater than 0.12 but does not exceed 0.17.07-21-2011
20120199872METHOD FOR HYBRID ENCAPSULATION OF AN ORGANIC LIGHT EMITTING DIODE - Methods and apparatus for encapsulating organic light emitting diode (OLED) structures disposed on a substrate using a hybrid layer of material are provided. The processing parameters used during deposition of the hybrid layer of material allow control of the characteristics of the deposited hybrid layer. The hybrid layer may be deposited such that the layer has characteristics of an inorganic material in some sublayers of the hybrid layer and characteristics of an organic material in other sublayers of the hybrid layer. Use of the hybrid material allows OLED encapsulation using a single hard mask for the complete encapsulating process with low cost and without alignment issues present in conventional processes.08-09-2012
20080203423LIGHT-EMITTING DIODE - A light-emitting diode is provided which includes: a sheet-like substrate; a pair of electrode patterns formed to wrap round and cover substantially entire upper and lower surfaces of the substrate, said pair of electrode patterns comprising an upper electrode portion, a lower electrode portion and a side electrode portion; a light-emitting element mounted on at least one of the electrode patterns; and a translucent sealing resin body that seals the light-emitting element. The pair of electrode patterns are separated by spaces formed therebetween, and substantially the entire surfaces of the substrate, except the spaces, are covered with the electrode patterns.08-28-2008
20110114991Organic Light Emitting Display Device - An organic light emitting display device which prevents deterioration of an organic light emitting diode (OLED), the organic light emitting display device includes a first substrate including a display unit that includes at least one organic light emitting diode (OLED), a second substrate facing the first substrate and bonded to the first substrate, a sealant arranged surrounding the display unit and bonding the first substrate to the second substrate, a dam portion arranged between the display unit and the sealant and surrounding a periphery of the display unit and including a plurality of magnetic particles and a filling material arranged within an inner space of the dam portion and between the first and second substrates and including a plurality of magnetic particles.05-19-2011
20110254047Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, And Optical Semiconductor Device - A hydrosilylation reaction-curable organopolysiloxane composition comprising (A) a methylpheny-lalkenylpolysiloxane that has at least two alkenyl groups wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole % is comprised of phenyl groups, (B) a methylphenylhydrogenpolysiloxane that has at least two Si-bonded hydrogen atoms wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole 1% is comprised of phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor element sealant comprising this composition. An optical semiconductor device sealed with this optical semiconductor element sealant.10-20-2011
20110073901ADHESIVE ENCAPSULATING COMPOSITION AND ELECTRONIC DEVICES MADE THEREWITH - Adhesive encapsulating compositions for use in electronic devices such as organic electroluminescent devices, touch screens, photovoltaic devices, and thin film transistors are disclosed herein. The adhesive encapsulating compositions include pressure sensitive adhesives comprising one or more cyclic olefin copolymers, in combination with multifunctional (meth)acrylate monomers and tackifiers.03-31-2011
20110260209COMPOSITION FOR SILICONE RESIN - The present invention relates to a composition for a silicone resin, including: (1) an organopolysiloxane having a silanol group at an end thereof; (2) an organopolysiloxane having at least one alkenylsilyl group and at least two hydrosilyl groups in one molecule thereof; (3) a condensation catalyst; and (4) a hydrosilylation catalyst.10-27-2011
20100193832LIGHT EMITTING DEVICE - A light emitting device is provided that includes a substrate, a light emitting unit formed on the substrate, and an encapsulation unit. The encapsulation unit may include a first region corresponding to the light emitting unit and a second region coalesced with the substrate. The encapsulation unit of the first region or a part of the encapsulation unit of the first region may have a positive curvature.08-05-2010
20110147789ORGANIC LIGHT EMITTING DIODE DEVICE - Disclosed is an organic light emitting diode device including a substrate, an organic light emitting element disposed on the substrate, a polymer resin layer covering the organic light emitting element, and a getter disposed between the organic light emitting element and the polymer resin. The getter may include a moisture absorbing material and a binder having a volatilization degree of about 400 ppm or less when heated at a temperature ranging from about 60° C. to about 120° C. for about 2 hours.06-23-2011
20120146088ENCAPSULANT FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE USING SAME - The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity.06-14-2012
20090166665Encapsulated optoelectronic device - The invention provides an optoelectronic device (e.g. a LED device) and method thereof. The device includes an optoelectronic component at least partially surrounded by an encapsulant comprising a silicone such as an aliphatic silicone and an adhesion promoter. The optoelectronic device exhibits improved properties such as adhesion and structural integrity, UV and thermal stability, and long term stability under accelerated aging conditions.07-02-2009
20120037950LED WITH LOCAL PASSIVATION LAYERS - A LED with local passivation layers comprises a substrate, a light-emitting stack layer formed on the substrate, an electrode group formed on the light-emitting stack layer, and a first passivation layer formed on a side wall of the light-emitting stack layer. The light-emitting stack layer at least includes an n-type semiconductor layer, an active layer and a p-type semiconductor layer. The electrode group includes an n-type electrode and a p-type electrode. The n-type semiconductor layer has an exposed area where the n-type electrode is formed. The first passivation layer is distributed on a side wall of the light-emitting stack layer, which neighbors the exposed area, to protect the PN junction that is between the n-type semiconductor layer and the p-type semiconductor layer and is on the abovementioned side wall.02-16-2012
20120305981ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DIODE DISPLAY - A method of manufacturing an OLED display includes: forming an organic light emitting element on a first substrate; forming, on the organic light emitting element, a thin film encapsulation layer that seals the organic light emitting element with the first substrate; providing a second substrate; forming a flexible protection layer on the second substrate; attaching the first substrate and the second substrate to each other; and separating the second substrate from the flexible protection layer.12-06-2012
20120205712LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - A light-emitting device includes a light emitting element, a resin package defining a recessed portion serving as a mounting region of the light emitting element, gate marks each formed on an outer side surface of the resin package, and leads disposed on the bottom surface of the recessed portion and electrically connected to the light emitting element. The light emitting element is mounted on the lead. The gate marks include a first gate mark formed on a first outer side surface of the resin package and a second gate mark formed on an outer side surface which is different than the first outer side surface.08-16-2012
20120037951Optical Device And Method Of Producing The Same - An optical device of the present invention comprises a light-emitting element or a light-receiving element mounted on a support and a cured silicone material unified into a single article onto the support by the sealing of the element with a hydrosilylation reaction curable silicone composition, and is characterized in that the surface of the cured silicone material has been treated with an organopolysiloxane that has at least three silicon-bonded hydrogen atoms in one molecule. The optical device is resistant to the adherence of dust and dirt due to an inhibition of the stickiness of the surface of a cured silicone material that seals a light-emitting element or a light-receiving element mounted on a support and has thereby been unified into a single body onto the support.02-16-2012
20100059788THERMOSETTING COMPOSITION - A thermosetting composition containing an aluminosiloxane, a silicone oil containing silanol groups at both ends, and a silicone alkoxy oligomer. The thermosetting composition of the present invention can be used for, for example, encapsulating materials, coating materials, molding materials, surface-protecting materials, adhesive agents, bonding agents, and the like. Especially, in a case where the thermosetting composition of the present invention is used as an encapsulating material, the thermosetting composition is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).03-11-2010
20110156092SMT ENCAPSULATION BODY OF A LIGHT-EMITTING DIODE WITH A WIDE-ANGLE ILLUMINATION LIGHT SHAPE - An SMT encapsulation body of a light-emitting diode with a wide-angle illumination light shape, comprising: a) a substrate; b) an LED die mounted on the substrate by use of SMT; and c) an encapsulation body positioned around the LED die in the shape of a double dome at the top thereof with the center at a lower position such that the illumination light shape of the light-emitting diode becomes to be a wide-angle and elongated body. The encapsulation body may be formed either in the shape of a batwing or in the shape of a double batwing symmetrically positioned in a cross way. In this way, the light-emitting diode achieves a wide-angle illumination light shape fulfilling the requirements of a certain purpose without the use of the double optical effect of the lens. Meanwhile, the drawbacks of the conventional structure are resolved. Moreover, an increased efficiency in using the light source is ensured.06-30-2011
20120056236LOW GAS PERMEABLE SILICONE RESIN COMPOSITION AND OPTOELECTRONIC DEVICE - A silicone resin composition comprising (A) an organopolysiloxane containing silicon-bonded aryl and alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane, and (C) an addition reaction catalyst is low gas permeable. An optoelectronic device encapsulated therewith is highly reliable.03-08-2012
20120012890Organic light emitting diode (OLED) display - An organic light emitting diode (OLED) display device that includes: a first substrate having a first area and a second area adjacent to the first area; an organic light emitting diode (OLED) disposed on the first area of the first substrate; a second substrate facing the first substrate such that the OLED is interposed between the first substrate and the second substrate so as to expose the second area of the first substrate; and a sealant disposed between the first substrate and the second substrate to attach and seal the first substrate to the second substrate, wherein the sealant surrounds the OLED by a predetermined distance and having a first width of one portion closer to the second area that is larger than a second width of an other portion which is farther from the second area.01-19-2012
20120061718Electronic Device - There is provided an electronic device having high reliability and high color reproducibility. A pixel structure is made such that a switching FET (03-15-2012
20120153345OPTICAL SEMICONDUCTOR DEVICE - The present invention relates to an optical semiconductor device including: a substrate having mounted thereon an LED chip; an encapsulation resin layer embedding the LED chip; an inorganic high-heat conductive layer; and a wavelength conversion layer containing an inorganic phosphor powder, in which the encapsulation resin layer, the inorganic high-heat conductive layer and the wavelength conversion layer are laminated in this order on the substrate either directly or indirectly.06-21-2012
20090140284Transparent Inorganic Oxide Dispersion and Iorganic Oxide Particle-Containing Resin Composition, Composition for Sealing Light Emitting Element and Light Emitting element, Hard Coat Film and Optical Functional Film and Optical Component, and Method for Producing Inorganic Oxide Pariticle-Containing Resin - The present invention provides a transparent inorganic oxide dispersion which makes it possible to improve the refractive index and mechanical characteristics and to maintain transparency by modifying the surface of inorganic oxide particles with a surface modifier having one or more reactive functional groups; and an inorganic oxide particle-containing resin composition in which the transparent inorganic oxide dispersion and a resin are compositely integrated by the polymerization reaction, a composition for sealing a light emitting element, a light emitting element, and a method for producing an inorganic oxide particle-containing resin composition; and a hard coat film which has high transparency and makes it possible to improve a refractive index and tenacity, an optical functional film, an optical lens and an optical component. The transparent inorganic oxide dispersion of the present invention comprises inorganic oxide particles which have a surface modified with a surface modifier having one or more reactive functional groups and have a disperse particle diameter of 1 nm or more and 20 nm or less, and a disperse medium, wherein the surface modifier is one or more kinds selected from the group consisting of a silane coupling agent, a modified silicone, and a surfactant.06-04-2009
20090134426RESIN FOR OPTICAL-SEMICONDUCTOR-ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED WITH THE SAME - The present invention relates to a resin for optical-semiconductor-element encapsulation obtained by reacting a silicon compound with a boron compound or an aluminum compound, wherein the silicon compound is represented by the following formula (I):05-28-2009
20110127570ORGANIC LIGHT EMITTING DIODE DISPLAY - Disclosed is an organic light emitting diode (OLED) device, which includes: an organic light emitting diode including a first electrode, a second electrode, and an emission layer interposed between the first electrode and the second electrode; a base substrate supporting the organic light emitting diode; and a sealing member disposed on the base substrate while covering the organic light emitting diode. Herein, the sealing member includes a fluorinated epoxy sealing material including a fluorinated epoxy resin.06-02-2011
20120211797HEAT-CURABLE SILICONE RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTORS, AND A SEALED OPTICAL SEMICONDUCTOR USING THE SAME - A heat-curable silicone resin composition for sealing optical semiconductors including: component (A): 100 parts by mass of a silicon compound expressed by Formula (1) below; and component (B): from 0.001 to 10 parts by mass of a condensation catalyst.08-23-2012
20120126282SEALANT FOR OPTICAL SEMICONDUCTORS AND OPTICAL SEMICONDUCTOR DEVICE - The present invention provides a sealant for an optical semiconductor device which has high gas barrier property against corrosive gas, and is less likely to crack or is less likely to peel off even when used in harsh environments.05-24-2012
20120126281SYSTEM FOR FLASH-FREE OVERMOLDING OF LED ARRAY SUBSTRATES - System for flash-free overmolding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate.05-24-2012
20120161197FLEXIBLE ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A flexible organic light-emitting display device has a thin film encapsulation structure. The flexible organic light-emitting display device can be manufactured by a method including sequentially stacking a glass substrate, a first flexible substrate in which conductive particles are integrally dispersed, a display unit comprising a thin film transistor (TFT) layer and a light-emitting layer, and a second flexible substrate. The glass substrate can then be separated from the first flexible substrate by emitting light.06-28-2012
20120161196Light Emitting, Power Generating or Other Electronic Apparatus - An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. An exemplary apparatus comprises: a plurality of diodes; at least a trace amount of a first solvent; and a polymeric or resin film at least partially surrounding each diode of the plurality of diodes. Various exemplary diodes have a lateral dimension between about 10 to 50 microns and about 5 to 25 microns in height. Other embodiments may also include a plurality of substantially chemically inert particles having a range of sizes between about 10 to about 50 microns.06-28-2012
20120161195Printable Composition of a Liquid or Gel Suspension of Diodes - An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. In other exemplary embodiments a second solvent is also included, and the composition has a viscosity substantially between about 100 cps and about 25,000 cps at about 25° C. In an exemplary embodiment, a composition comprises: a plurality of diodes or other two-terminal integrated circuits; one or more solvents comprising about 15% to 99.9% of any of N-propanol, isopropanol, dipropylene glycol, diethylene glycol, propylene glycol, 1-methoxy-2-propanol, N-octanol, ethanol, tetrahydrofurfuryl alcohol, cyclohexanol, and mixtures thereof; a viscosity modifier comprising about 0.10% to 2.5% methoxy propyl methylcellulose resin or hydroxy propyl methylcellulose resin or mixtures thereof; and about 0.01% to 2.5% of a plurality of substantially optically transparent and chemically inert particles having a range of sizes between about 10 to about 50 microns.06-28-2012
20120132953Thin-Layer Encapsulation for an Optoelectronic Component, Method for the Production Thereof, and Optoelectronic Component - A thin-layer encapsulation (05-31-2012
20120168815ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE PREPARED USING THE SAME - An encapsulation material and an electronic device, the encapsulation material including a resin, the resin including a first polysiloxane including hydrogen bonded with silicon (Si—H) at a terminal end thereof, and a second polysiloxane including an alkenyl group bonded with silicon (Si-Vi) at a terminal end thereof, a phosphor, and a density controlling agent, wherein a weight ratio of the density controlling agent to the phosphor is about 1.5:1 to about 10:1.07-05-2012
20100193831EPOXY RESIN COMPOSITION, CURED OBJECT OBTAINED THEREFROM, AND LIGHT-EMITTING DIODE - Provided are an epoxy resin composition including acid anhydrides (A) and epoxy resins (B), in which: (a) cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride accounts for 50 to 90 mass % of the acid anhydrides (A); (b) an alicyclic epoxy resin compound accounts for 30 to 90 mass % of the epoxy resins (B) and an epoxy resin compound represented by the following general formula (1) accounts for 10 to 50 mass % of the epoxy resins (B); and (c) contents of the acid anhydrides (A) and the epoxy resins (B) are such that a blending equivalent ratio between the acid anhydrides and the epoxy resins ranges from 0.4 to 0.7, a cured product of the composition, and a light-emitting diode. The epoxy resin composition has the following characteristics. That is, (1) the composition has a low viscosity after the mixing, a low degree of viscosity increase in standing at room temperature, and excellent workability, (2) the composition has satisfactory curability even when no curing accelerator is added, and (3) a cured product is colorless and transparent, has crack resistance, and changes its color to a small extent with long-term light irradiation and heating. The composition is suitable for an encapsulant for a photoelectric conversion element such as a blue LED or white LED. (In the formula, R's each independently represent a hydrogen atom or a methyl group, m represents an integer of 1 to 3, and n represents an integer of 2 to 8.)08-05-2010
20120313137ORGANIC LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - An organic light emitting device and a method for manufacturing that same are discussed, which can reduce thickness and weight of the device as well as the manufacturing cost. The organic light emitting device includes according to an embodiment an organic light emitting diode (OLED) formed on a glass substrate; an adhesive layer formed to cover the OLED; and a metal foil formed on the adhesive layer to seal the OLED and bonded to the glass substrate, wherein the metal foil is formed of an alloy having the same or substantially the same thermal expansion coefficient as that of the glass substrate.12-13-2012
20120248497OPTOELECTRONIC DEVICES AND COATINGS THEREFORE, AND METHODS FOR MAKING AND USING THE SAME - An optoelectronic device assembly can comprise: a coated element and an optoelectronic device on the coated element. The coated element can comprise a thermoplastic substrate and a protective weathering layer. The thermoplastic substrate can comprise a bisphenol-A polycarbonate homopolymer and a polycarbonate copolymer, and wherein the polycarbonate copolymer is selected from a copolymer of tetrabromobisphenol A carbonate and BPA carbonate; a copolymer of 2-phenyl-3,3-bis(4-hydroxyphenyl)phthalimidine carbonate and BPA carbonate; a copolymer of 4,4′-(1-phenylethylidene)biphenol carbonate and BPA carbonate; a copolymer of 4,4′-(1-methylethylidene)bis[2,6-dimethyl-phenol]carbonate and BPA carbonate; and combinations comprising at least one of the foregoing. The protective weathering layer can comprise resorcinol polyarylate and polycarbonate.10-04-2012
20120248496OPTOELECTRONIC DEVICES AND COATINGS THEREFORE, AND METHODS FOR MAKING AND USING THE SAME - An optoelectronic device assembly can comprise: a coated element and an electroactive cell on the coated element, wherein the electroactive cell is selected from the group consisting of a light emitting diode and a photovoltaic cell. The coated element can comprise: transparent thermoplastic substrate and a protective weathering layer. The transparent thermoplastic substrate can comprise a material selected from the group consisting of aromatic polycarbonate and polyester, and combinations comprising at least one of the foregoing materials. The protective weathering layer can have a UV absorbance loss rate at 330 nm of less than or equal to 0.15 A/year as estimated from filtered xenon arc exposure and/or having a rate of erosion of less than or equal to 5 μm per year as estimated from filtered xenon arc exposure.10-04-2012
20090057708LED Light Source Having Improved Resistance to Thermal Cycling - A light source and method for making the same are disclosed. The light source includes a substrate, a die, and a cup. The substrate has a plurality of electrical traces thereon and the die includes an LED that is connected to two of the traces. The cup overlies the substrate and is filled with an encapsulant material. The die is located within the cup and is encapsulated by the substrate and the encapsulant material. The cup and encapsulant material have substantially the same coefficient of thermal expansion. The cup can include reflective sidewalls positioned to reflect light leaving the die. The cup, encapsulant and substrate can be constructed from the same material.03-05-2009
20100052006Light emitting semiconductor device - A light emitting semiconductor device includes a base substrate; a light emitting semiconductor element including a crystal growth basis and provided on the base substrate so that the crystal growth basis faces in opposite direction to the base substrate; a first transparent sealing medium which seals the light emitting semiconductor on the base substrate; and a second transparent sealing medium which seals the light emitting semiconductor over the first transparent sealing medium and contains phosphor. A thickness of the second sealing medium in a portion with high emission intensity is larger than that of the other portion of the first sealing medium; and the portion with high emission intensity is defined as a portion where light emission intensity from the light emitting semiconductor element is maximum.03-04-2010
20120313136ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - In one aspect, an organic light emitting diode (OLED) display that includes: a substrate; an organic light emitting element on the substrate; a thin film encapsulation layer on the substrate and covering the organic light emitting element; a polymer carpet layer directly on the thin film encapsulation layer; and a cover film directly on the polymer carpet layer is provided.12-13-2012
20100270582Coated light-emitting diode - The present invention relates to a coated light-emitting diode and the method for making the coated light-emitting diode.10-28-2010
20100270581OPTICAL SEMICONDUCTOR PACKAGE SEALING RESIN MATERIAL - An optical semiconductor package sealing resin material used to seal an optical semiconductor chip in a semiconductor package includes a thermosetting epoxy composition and a hydrophobic smectite clay mineral. The hydrophobic smectite clay mineral is hydrophobized by subjecting a hydrophilic smectite clay mineral to an intercalation reaction with an alkylammonium halide. The smectite clay mineral is bentonite, saponite, hectorite, vermiculite, stevensite, tainiolite, montmorillonite, or nontronite.10-28-2010
20100270580SUBSTRATE BASED LIGHT SOURCE PACKAGE WITH ELECTRICAL LEADS - A light source and method for making the same are disclosed. The light source includes a base member and a lead structure. The lead structure is attached to the base member such that the lead structure extends beyond the base member and has an opening for accessing a surface of the base member. A die containing a light emitting semiconductor device is bonded to the surface of the base member. The die is electrically connected to the lead structure and overlaid with a transparent material. An electrically insulating layer is bonded between the lead structure and the base member, the electrically insulating layer having an opening for accessing the surface of the base member. The electrically insulating layer can be an adhesive for bonding the lead structure to the base member.10-28-2010
20120217535 Method of Encapsulating a Flexible Optoelectronic Multi-Layered Structure - The invention relates to a method of encapsulating a flexible optoelectronic multi-layered structure (08-30-2012
20100006888METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE, OPTICAL SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR APPARATUS - Provided is a method of manufacturing an optical semiconductor device, the method including: providing a resin layer on a light-emitting substrate to cover a principle surface of the light-emitting substrate, the light-emitting substrate including a pair of electrodes in each section of the principle surface, the resin layer including multiple holes each exposing two of the electrodes located adjacent to each other but in the different sections; providing post electrodes respectively on all the paired electrodes formed in all the sections by filling a conductive material in the holes of the resin layer on the principal surface; and forming multiple optical semiconductor devices by cutting the light-emitting substrate into sections, the light-emitting substrate provided with the post electrodes respectively on all the paired electrodes formed in all the sections.01-14-2010
20120187448GLASS, GLASS COVERING MATERIAL FOR LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING DEVICE - Glass is provided which is capable of covering at a covering treatment temperature of at most 400° C. and which has a low thermal expansion coefficient and excellent weather resistance. Glass comprising, as represented by mol % based on oxides, from 29% to 33% of P07-26-2012
20120228668Layered Element for Encapsulating a Sensitive Element - This layered element (09-13-2012
20110121356METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT - Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.05-26-2011
20110121355ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME - An organic light emitting diode (OLED) display and a method of manufacturing the same are provided. The OLED display includes: a substrate main body; an OLED that is formed on the substrate main body; a hydrophilic polymer layer that is formed on the substrate main body to cover the OLED and that includes a hydrophilic surface having an angle of contact within a range of larger than 0° and smaller than or equal to 50°; and an inorganic protective layer that is formed on the hydrophilic surface of the hydrophilic polymer layer.05-26-2011
20110121354Method for Producing an Electronic Component and Electronic Component - A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate (05-26-2011
20080296606Electronic Module and Chip Card With Indicator Light - The invention generally relates to devices comprising semiconductor chips. More specifically, the invention relates to an electronic module (12-04-2008
20120261713ORGANIC LIGHT EMITTING DIODE LIGHTING APPARATUS - An organic light emitting diode (OLED) lighting apparatus is disclosed. In one embodiment, the apparatus includes i) a substrate main body including a light emitting area and a sealing area surrounding the light emitting area, ii) an OLED disposed on the light emitting area of the substrate main body, iii) a sealant disposed on the sealing area of the substrate main body and iv) an encapsulation substrate encapsulating the OLED, wherein the encapsulation substrate comprises first and second surfaces opposing each other. The apparatus may further include a heat dissipating wire configured to dissipate heat generated by the OLED. The heat dissipating wire includes a heat absorption portion disposed on the first surface of the encapsulation substrate and contacting the sealant, a heat dissipating portion disposed on the second surface, and a coupling portion interconnecting the absorption portion and the heat dissipating portion.10-18-2012
20090309125GLASS FOR ENCAPSULATING OPTICAL ELEMENT AND LIGHT-EMITTING DEVICE ENCAPSULATED WITH GLASS - A glass for encapsulating an optical element that can seal the optical element at a temperature in the vicinity of 500° C., and a glass-encapsulated light-emitting device encapsulated with the glass, are provided.12-17-2009
20110037095ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display includes a display substrate assembly including an organic light emitting structure, an encapsulation substrate assembly disposed facing the display substrate assembly, a sealant disposed between the display substrate assembly and the encapsulation substrate assembly to seal the display substrate assembly and the encapsulation substrate assembly with each other, and a substrate deformation protection body disposed between the sealant and the organic light emitting structure.02-17-2011
20120326204ORGANIC LIGHT EMITTING DIODE LIGHTING APPARATUS - An organic light emitting diode lighting apparatus is disclosed. In one embodiment, the apparatus includes: a substrate main body, an organic light emitting element formed on the substrate main body and a sealing cap bonded with the substrate main body and covering and sealing the organic light emitting element. The sealing cap may further include a surface facing the organic light emitting element and the surface is divided into a plurality of thickness parts having different thicknesses.12-27-2012
20130009201CURABLE COMPOSITION - A curable composition is provided. A cured product showing excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after a curing, as well as showing excellent processability and workability is provided. Also, surface stickiness may be prevented in the cured product without causing turbidity etc.01-10-2013
20130009200CURABLE COMPOSITION - The present invention relates to a curable composition. A curable composition may be provided; which shows excellent processability and workability; which shows excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after curing; and which has excellent reliability and long-term reliability under high-temperature and/or high-moisture conditions. Also, turbidity and surface stickiness may be prevented in the cured product.01-10-2013
20100171147Method of Manufacturing Organic Electroluminescent Device and Organic Electroluminescent Device - An organic electroluminescent device, which, on a substrate, has a plurality of first electrodes, and a second electrode opposing the plurality of first electrodes. The organic electroluminescent device also including a light-emitting functional layer between the second electrode and one of the first electrodes and a buffering layer that covers the second electrode. The buffering layer having a side end portion with an angle equal to or less than 30°. The organic electroluminescent device further including a gas barrier layer that covers the buffering layer.07-08-2010
20130020610SILICONE RESIN COMPOSITION, SILICONE RESIN SHEET, METHOD FOR PRODUCING SILICONE RESIN SHEET, AND OPTICAL SEMICONDUCTOR DEVICE - A silicone resin composition includes (1) an organopolysiloxane having at least two alkenylsilyl groups in one molecule, (2) an organopolysiloxane having at least two hydrosilyl groups in one molecule, (3) a hydrosilylation catalyst, and (4) a curing retarder, wherein the curing retarder contains tetraalkylammonium hydroxide.01-24-2013
20120241811Organic Light Emitting Diode Display and Manufacturing Method of Organic Light Emitting Diode Display - An organic light emitting diode (OLED) display includes: a substrate; an organic light emitting diode on the substrate; and a thin film encapsulation layer including a first inorganic layer having a first density on the substrate and a second inorganic layer having a second density on the first inorganic layer, the second density being different from the first density, and the organic light emitting diode being encapsulated between the thin film encapsulation layer and the substrate.09-27-2012
20100090245LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME - The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.04-15-2010
20130168726MOLD FOR LIGHT-EMITTING DEVICE PACKAGE - A light-emitting device package mold and a method of manufacturing a lens of a light-emitting device package. The light-emitting device package mold includes a convex unit, an inner circumference of which has a hemispherical shape; a flat panel unit that forms a flat panel by extending from an edge of the convex unit; a cylindrical unit extending in a vertical direction with respect to an upper surface of the flat panel unit; and an injection hole and a discharge hole that penetrate through the convex unit, wherein the discharge hole is formed in a horizontal direction with respect to the flat panel unit.07-04-2013
20130168727ORGANOSILOXANE BLOCK COPOLYMER - An organosiloxane block copolymer includes 65 to 90 mol % of diorganosiloxane units having the formula R07-04-2013
20130140600SEMICONDUCTOR NANOPARTICLE-CONTAINING MATERIALS AND LIGHT EMITTING DEVICES INCORPORATING THE SAME - In various embodiments, the present invention provides a light emitting device cap configured for location on a light emitting device comprising or consisting essentially of a primary light source. The cap defines a well region within which is received a population of semiconductor nanoparticles such that the semiconductor nanoparticles are in optical communication with the primary light source of the light emitting device when the cap is located on the light emitting device. There is further provided a light emitting device comprising or consisting essentially of a primary light source and such a cap, as well as methods for fabricating such a cap and device.06-06-2013
20120248498CURABLE EPOXY RESIN COMPOSITION - Provided are: a curable epoxy resin composition including an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by following Formula (1) where each of R10-04-2012
20130092972Organic Light Emitting Diode Display and Method for Manufacturing the Same - An organic light emitting diode (OLED) display includes: a substrate; an organic light emitting diode formed on the substrate; a first inorganic layer formed on the substrate and covering the organic light emitting diode; an intermediate layer formed on the first inorganic layer and covering an area relatively smaller than the first inorganic layer; and a second inorganic layer formed on the first inorganic layer and the intermediate layer, and contacting the first inorganic layer at an edge thereof while covering a relatively larger area than the intermediate layer. A third inorganic layer may be formed on the second inorganic layer so as to contact the second inorganic layer at an edge thereof. At least one of the first, second and third inorganic layers is formed by an atomic layer deposition (ALD) method.04-18-2013
20130092975Methods of Fabricating Optoelectronic Devices Using Semiconductor-Particle Monolayers and Devices Made Thereby - Methods of fabricating optoelectronic devices, such as photovoltaic cells and light-emitting devices. In one embodiment, such a method includes providing a substrate, applying a monolayer of semiconductor particles to the substrate, and encasing the monolayer with one or more coatings so as to form an encased-particle layer. At some point during the method, the substrate is removed so as to expose the reverse side of the encased-particle layer and further processing is performed on the reverse side. When a device made using such a method has been completed and installed into an electrical circuit the semiconductor particles actively participate in the photoelectric effect or generation of light, depending on the type of device. 04-18-2013
20130092974SILICONE RESIN SHEET, CURED SHEET, AND LIGHT EMITTING DIODE DEVICE AND PRODUCING METHOD THEREOF - A silicone resin sheet is formed from a resin composition containing a thermosetting silicone resin and microparticles. The complex viscosity thereof at a frequency of 10 Hz is 80 to 1000 Pa·s and the tan δ thereof at a frequency of 10 Hz is 0.3 to 1.6 obtained by a dynamic viscoelastic measurement at a frequency of 0.1 to 50 Hz at 30° C.; a rate of frequency increase of 10 Hz/min; and a distortion of 1% in a shear mode.04-18-2013
20130092973ENCAPSULATING SHEET AND OPTICAL SEMICONDUCTOR ELEMENT DEVICE - An encapsulating sheet is formed from an encapsulating resin composition which contains an encapsulating resin and silicone microparticles, and the mixing ratio of the silicone microparticles with respect to the encapsulating resin composition is 20 to 50 mass %.04-18-2013
20130119431LIGHT EMITTING MODULE, METHOD FOR MANUFACTURING LIGHT EMITTING MODULE, AND VEHICULAR LAMP - Provided is a light emitting module in which an LED device is mounted and power is supplied to the LED device by a gold wire. The light emitting module includes a first resin (sealing material) that seals the gold wire and a second resin (dam wall) that surrounds at least a portion of the outer peripheral of the first resin. The first resin has a lower viscosity and a lower elastic modulus compared to the second resin, and protects the gold wire mechanically and chemically. The second resin suppresses the first resin from being flowed out toward the peripherals, and, as a result, the sealing state of the gold wire by the first resin may be maintained.05-16-2013
20130126939SEALING FILM FORMING METHOD, SEALING FILM FORMING DEVICE, AND LIGHT-EMITTING DEVICE - A sealing film forming method is capable of forming a sealing film having high moisture permeability resistance in a shorter time and at lower cost. The sealing film forming method for forming a sealing film 05-23-2013
20110272733ENCAPSULATION STRUCTURE FOR LIGHT-EMITTING DIODE - The present invention relates to an encapsulation structure for light-emitting diode, primarily assembled from an encapsulation base, light-emitting diode chips and transparent encapsulation material, in which the light-emitting diode chips are mounted on an encapsulation region of the encapsulation base, after which the transparent encapsulation material is used to overlay the predetermined positions of the light-emitting diode chips. Accordingly, the light rays produced by the light-emitting diode chips can be emitted from the side areas, and when the light-emitting diode chips are mounted and joined to the encapsulation bases, then brightness at the connected areas can be maintained, and uneven brightness is prevented from occurring.11-10-2011
20130146938ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - An exemplary embodiment described technology relates generally to an organic light emitting diode (OLED) display and a manufacturing method thereof. The organic light emitting diode (OLED) display according to an exemplary embodiment includes: a substrate; an encapsulation member; an organic light emitting element between the substrate and the encapsulation member; a middle sealing member including one side disposed between the substrate and the encapsulation member and another side extended from the one side to be bent and enclosing an edge of the encapsulation member; a first sealant sealing and combining the one side of the middle sealing member and the substrate to each other; a second sealant sealing and combining the other side of the middle sealing member and the encapsulation member to each other; and a getter at the one side of the middle sealing member and the encapsulation member.06-13-2013
20130146939SILICONE ADHESIVE FOR SEMICONDUCTOR ELEMENT - A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 μm, and (c) a white or colorless and transparent powder having an average particle size of at least 1 μm but less than 10 μm. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.06-13-2013
20110210371COMPOSITION FOR THERMOSETTING SILICONE RESIN - The present invention relates to a composition for a thermosetting silicone resin including: (1) a dual-end silanol type silicone oil; (2) an alkenyl-containing silicon compound; (3) an organohydrogensiloxane; (4) a condensation catalyst; and (5) a hydrosilylation catalyst, in which the (4) condensation catalyst includes a tin complex compound.09-01-2011
20130126940LIGHT EMITTING DIODE ASSEMBLY AND THERMAL CONTROL BLANKET AND METHODS RELATING THERETO - The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous reflective and thermal properties.05-23-2013
20110248314SILANOL CONDENSATION CATALYST, HEAT-CURABLE SILICONE RESIN COMPOSITION FOR SEALING PHOTOSEMICONDUCTORS AND SEALED PHOTOSEMICONDUCTOR USING SAME - A silanol condensation catalyst including at least the zirconium metal salt expressed by Formula (I) below (wherein n is an integer from 1 to 3; each R10-13-2011
20090283793NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE AND PRODUCTION METHOD THEREOF - Disclosed is a semiconductor device which is improved in output power efficiency since reflection by the substrate is reduced. This semiconductor device is also excellent in strength characteristics of a supporting substrate. Also disclosed is a method for producing such a semiconductor device. Specifically disclosed is a nitride semiconductor device wherein at least an n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer, a metal film layer and a plated metal plate are sequentially stacked in this order on a substrate. This nitride semiconductor device is characterized in that the metal film layer and the plated metal plate are partially formed on the p-type semiconductor layer. Also disclosed is a nitride semiconductor device having a structure wherein at least an n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer, a metal film layer and a plated metal plate are sequentially stacked in this order, the device characterized in that the metal film layer and the plated metal plate are partially formed on the p-type semiconductor layer and a light-transmitting material layer is formed on the p-type semiconductor layer in a region where the metal film layer and the plated metal plate are not formed.11-19-2009
20100301377CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE - A curable organopolysiloxane composition comprising at least the following components: (A) a linear diorganopolysiloxane with a mass average molecular weight of at least 3,000, (B) a branched organopolysiloxane, (C) an organopolysiloxane having, on average, at least two silicon-bonded aryl groups and, on average, at least two silicon-bonded hydrogen atoms in one molecule, and (D) a hydrosilylation reaction catalyst; has excellent curability and, when cured, forms a flexible cured product of high refractive index, optical transmissivity, excellent adherence to various substrates, high hardness and slight surface tack.12-02-2010
20100289055SILICONE LEADED CHIP CARRIER - In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant.11-18-2010
20110278640RESIN COMPOSITION AND TRANSPARENT ENCAPSULANT FORMED USING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE ENCAPSULANT - An embodiment is directed to a polysiloxane having a moiety represented by the following Chemical Formula 1:11-17-2011
20110303946THERMAL STORAGE SYSTEM USING ENCAPSULATED PHASE CHANGE MATERIALS IN LED LAMPS - A phase change material (PCM) is used as thermal storage for lighting systems. The PCM is placed in a thermally conductive container in close contact with the lighting system. As the PCM absorbs heat, it changes from a solid to a liquid state, but the temperature of the PCM is clamped at its melting point temperature. For LED-based systems, the PCM is selected to have a melting point such that the junction temperatures of the LEDs in the system are maintained at approximately their optimum operating temperature inside the lighting system housing. Because the thermal conductivity of the molten PCM is poor, a low thermal resistance heat flow path is provided from the PCM to the container.12-15-2011
20110309407CYCLOALKYL GROUP-CONTAINING SILICONE RESIN COMPOSITION AND A METHOD OF USING THE SAME - One object of the present invention is to provide a silicone resin composition having remarkably low gas permeability which is useful for a purpose requiring lower gas permeability. Further, another object of the present invention is to provide an optical semiconductor device provided with a cured product obtained by curing the silicone resin composition which has discoloration resistance, durable reflection efficiency and high reliability. The present invention provides a silicone resin composition comprising (A) an organopolysiloxane having at least two alkenyl groups per molecule, and is represented by the average compositional formula (1), (B) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom, and is represented by the average compositional formula (2), (C) a catalytic amount of a curing catalyst, and (D) 0.001 to 3 parts by mass of an antioxidant, relative to a total 100 parts by mass of components (A) and (B).12-22-2011
20130193477LIGHT EMITTING DIODE DEVICE AND METHOD OF PRODUCING THE SAME - A method of producing a light emitting diode device includes preparing an encapsulating resin layer; embedding a light emitting diode element in the encapsulating resin layer; and heating while pressing with gas the encapsulating resin layer having the light emitting diode element being embedded therein.08-01-2013
20130200425PHOSPHOR-CONTAINING ADHESIVE SILICONE COMPOSITION SHEET, AND METHOD OF PRODUCING LIGHT-EMITTING DEVICE USING SAME - An adhesive silicone composition sheet, in which a phosphor is dispersed uniformly and in which the dispersion state of the phosphor is stable over time, which is a solid or semisolid in an uncured state at room temperature and is therefore easy to handle, and which can easily form a silicone resin layer on the surface of an LED chip using conventional assembly apparatus. The adhesive silicone composition sheet is formed from a heat-curable silicone resin composition, which comprises: (1) an organopolysiloxane in which at least 90% of the organic groups bonded to silicon atoms are methyl groups, (2) a curing agent, and (3) a phosphor, and which exists in a plastic solid or semisolid state at normal temperature.08-08-2013
20130200426HYBRID SILICONE COMPOSITION FOR LIGHT EMITTING DEVICE - A silicon-based curable composition providing improved transparency, mechanical strength and resistance against heat and photo-degradation comprises at least one organopolysiloxane represented by the composition formula (1):08-08-2013

Patent applications in class Encapsulated