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Multi-color emission

Subclass of:

257 - Active solid-state devices (e.g., transistors, solid-state diodes)

257079000 - INCOHERENT LIGHT EMITTER STRUCTURE

257088000 - Plural light emitting devices (e.g., matrix, 7-segment array)

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Class / Patent application numberDescriptionNumber of patent applications / Date published
257090000 With heterojunction 6
Entries
DocumentTitleDate
20090072251LED surface-mount device and LED display incorporating such device - In one embodiment, a surface-mount device comprises a casing having opposed, first and second main surfaces, side surfaces, and end surfaces. A lead frame partially encased by the casing comprises (1) an electrically conductive LED chip carrier part having a surface carrying a linear array of three LEDs adapted to be energized to produce in combination a substantially full range of colors, each LED having a first electrical terminal and a second electrical terminal, the first terminal of each of the three LEDs being electrically and thermally coupled to the chip carrying surface of the chip carrier part; and (2) three electrically conductive connection parts separate from the chip carrier part, each of the three connection parts having a connection pad, the second terminal of each of the three LEDs being electrically coupled to the connection pad of a corresponding one of the three connection parts with a single wire bond. The linear array of LEDs extends in a first direction, and each of the chip carrier part and three connection parts has a lead. The leads are disposed in parallel relationship with each other and extend through the end surfaces of the casing in a second direction, the second direction being orthogonal to the first direction. An array of the surface-mount devices may be used in an LED display such as an indoor LED screen.03-19-2009
20110175118METHOD OF MANUFACTURING OPTICAL COMPONENT, OPTICAL COMPONENT, METHOD OF MANUFACTURING DISPLAY DEVICE, AND DISPLAY DEVICE - A method and optical component prevent external light reflection and increase light extraction efficiency. In one example embodiment, an optical component is provided on a light extraction side of a light-emitting panel. After a shielding film shaped like a lattice or a mesh is formed on a transparent substrate, a resist film is formed, the resist film is irradiated with ultraviolet light UV from the back side of the substrate by using the shielding film as a mask, and development is carried out, so that an optical functional element is formed. The planar shape of the undersurface of the optical functional element is the same as the planar shape of the lattice or the mesh of the shielding film, and a positioning error between the optical functional element and the shielding film becomes extremely small.07-21-2011
20130043498Organic Light Emitting Diode Display and Manufacturing Method Thereof - An organic light emitting diode (OLED) display includes a red pixel, a green pixel, and a blue pixel. The red pixel, the green pixel and the blue pixel each includes: a pixel electrode; a hole auxiliary layer on the pixel electrode; a blue organic emission layer on the hole auxiliary layer; an electron auxiliary layer on the blue organic emission layer; and a common electrode on the electron auxiliary layer. The red pixel and the green pixel include: a red boundary layer and a green boundary layer, respectively; a red resonance assistance layer and a green resonance assistance layer, respectively; and a red organic emission layer and a green organic emission layer formed between the red resonance assistance layer and the blue organic emission layer, and between the green resonance assistance layer and the blue organic emission layer, respectively.02-21-2013
20100051974Light Source Including a Wavelength-Converted Semiconductor Light Emitting Device and a Filter - A semiconductor light emitting device comprises a light emitting layer disposed between an n-type region and a p-type region. The light emitting layer is adapted to emit first light having a first peak wavelength. A first wavelength converting material is adapted to absorb the first light and emit second light having a second peak wavelength. A second wavelength converting material is adapted to absorb either the first light or the second light and emit third light having a third peak wavelength. A filter is adapted to reflect fourth light having a fourth peak wavelength. The fourth light is either a portion of the second light or a portion of the third light. The filter is configured to transmit light having a peak wavelength longer or shorter than the fourth peak wavelength. The filter is disposed over the light emitting device in the path of at least a portion of the first, second, and third light.03-04-2010
20120168788Backlight Device and Display Device - It is an object to manufacture a highly reliable backlight device with less color unevenness and less luminance unevenness, and a high-performance and highly reliable display device including the backlight device, which can display a high quality image. A light emitting diode (LED) is used as a light source of a backlight device and thermoelectric elements are provided in a chassis for holding the light emitting diode so as to surround the light emitting diode (the thermoelectric elements are provided under the light emitting diode and on the four sides thereof). A temperature in the backlight device is adjusted by cooling and heating by the thermoelectric elements.07-05-2012
20110193111MULTI-LIGHT EMITTING DIODE PACKAGE - A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.08-11-2011
20110193110LIGHT EMITTING DIODE ILLUMINATING APPARATUS WITH SAME-TYPE LIGHT EMITTING DIODES - A light emitting diode illuminating apparatus includes a substrate, a first lighting element and a second lighting element. The first and second lighting elements are juxtaposed at the substrate. The first lighting element includes a first LED chip, and a first filling layer encapsulating the first LED chip. The first filling layer includes red phosphor generally evenly doped therein. The second lighting element includes a second LED chip and a second filling layer encapsulating it. The second filling layer includes two different phosphor materials respectively doped therein. The first LED chip and the second LED chip are the same kind of LED chip selected from the group consisting of GaN LED chips, AlGaN LED chips and InGaN LED chips. Light emitted from the first filling layer and the second filling layer is capable of mixing to produce light of a uniform color.08-11-2011
20110193108LIGHT-MIXING TYPE LED PACKAGE STRUCTURE FOR INCREASING COLOR RENDER INDEX - A light-mixing type LED package structure for increasing color render index includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The light-emitting unit has a first light-emitting module for generating a first color temperature and a second light-emitting module for generating a second color temperature. The frame unit has two annular resin frames surroundingly formed on the top surface of the substrate unit by coating. The two annular resin frames respectively surround the first light-emitting module and the second light-emitting module in order to form two resin position limiting spaces above the substrate unit. The package unit has a first translucent package resin body and a second translucent package resin body both disposed on the substrate unit and respective covering the first light-emitting module and the second light-emitting module.08-11-2011
20100163892LED DEVICE AND METHOD OF PACKAGING THE SAME - A light emitting diode (LED) device including a transparent substrate, a plurality of LED chips, a circuit, and a transparent encapsulant is provided. The LED chips are fixed on the transparent substrate, and utilized for radiating at least a light beam. The circuit is disposed on the transparent substrate and electrically connected to the LED chips. The transparent encapsulant is utilized for packaging the LED chips. The light beam of the LED chips can propagate from two opposite sides of the transparent substrate. Blue LED chips and the circuit of the transparent substrate can be directly soldered, and the phosphors are arranged to convert the wavelength of blue light, so a dual-side white light emitting device can therefore be provided.07-01-2010
20100072495CONTACT STRUCTURE AND SEMICONDUCTOR DEVICE - To improve the reliability of contact with an anisotropic conductive film in a semiconductor device such as a liquid crystal display panel, a terminal portion (03-25-2010
20130075769SELECTION OF PHOSPHORS AND LEDS IN A MULTI-CHIP EMITTER FOR A SINGLE WHITE COLOR BIN - An emitter for an LED-based lighting device has multiple groups of LEDs that are independently addressable, allowing the emitter to be tuned to a desired color bin (e.g., a specific white color) by adjusting the relative current supplied to different groups. The LED dies for the groups and a phosphor chip for each LED die are individually selected such that each LED-die/phosphor-chip combination produces light in a desired source region associated with the group to which the LED belongs. Robotic pick-and-place systems can be used to automate assembly of the emitters by selecting LED dies from a bin based on based on spectral characteristics and phosphor chips from a number of distinct phosphor chip types.03-28-2013
20090121238DOUBLE COLLIMATOR LED COLOR MIXING SYSTEM - The present invention is directed to a lighting apparatus. In one embodiment the lighting apparatus includes a plurality of light emitting diode (LED) chips. A first optic is coupled to the plurality of LED chips. A diffuser is coupled to the first optic. In addition, a second optic is coupled to the diffuser.05-14-2009
20130082288ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME - The present invention relates to an organic light emitting display device which can prevent a light compensation layer from cracking and a method for fabricating the same.04-04-2013
20130082289SEMICONDUCTOR LIGHT-EMITTING DEVICE, SEMICONDUCTOR LIGHT-EMITTING SYSTEM AND ILLUMINATION FIXTURE - The present invention provides a semiconductor light-emitting device that emits light with a specific low correlated color temperature and with a high Ra, and a semiconductor light-emitting system provided with the semiconductor light-emitting device. This object is attained by the semiconductor light-emitting device having the below-described configuration.04-04-2013
20120025225LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, AND ELECTRONIC APPARATUS - A light-emitting element includes a blue light-emitting function layer provided between an anode and a cathode, a red light-emitting function layer provided between the anode and the blue light-emitting function layer, and a carrier selection layer provided between the blue light-emitting function layer and the red light-emitting function layer. The carrier selection layer includes a laminate of a hole transport layer and a first electron injection layer which are laminated in that order from the blue light-emitting function layer side.02-02-2012
20100044728ELECTROLUMINESCENT DEVICE - An electroluminescent device includes, for example, first to third optical output parts respectively corresponding to red, green, and blue colors and each having a light-emitting layer. A visibility spectrum curve has an inclination value corresponding to the first optical output part, an inclination value corresponding to the second optical output part, and an inclination value corresponding to the third optical output part. Each inclination value corresponds to an emission peak wavelength at which an emission spectrum of a light ray emitted from the light-emitting layer of the corresponding optical output part reaches a maximum intensity value. The inclination values have the following relationship: first optical output part>second optical output part>third optical output part. The emission spectra of the optical output parts have widths in the following relationship: first optical output part>second optical output part>third optical output part.02-25-2010
20130026511TRANSFER-BONDING METHOD FOR THE LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE ARRAY - A transfer-bonding method for light emitting devices including following steps is provided. A plurality of light emitting devices is formed over a first substrate and is arranged in array, wherein each of the light emitting devices includes a device layer and a sacrificial pattern sandwiched between the device layer and the first substrate. A protective layer is formed over the first substrate to selectively cover parts of the light emitting devices, and other parts of the light emitting devices are uncovered by the protective layer. The device layers uncovered by the protective layer are bonded with a second substrate. The sacrificial patterns uncovered by the protective layer are removed, so that parts of the device layers uncovered by the protective layer are separated from the first substrate and are transfer-bonded to the second substrate.01-31-2013
20130026510LIGHT EMITTING DIODE DEVICE - A light emitting diode (LED) device includes a substrate, first and second LED chips arranged on the substrate, and a phosphor layer over the first and second LED chips. The phosphor layer includes a plurality of phosphor units, each including a phosphor particle and a silver halide layer encapsulating the phosphor particle. Light emitted from the second LED chip strikes the phosphor particles to generate a first light, which. combines with the light to generate a resultant light. The silver halide layer is reduced by the light from the first LED chip to produce silver particles around the phosphor particles. The silver particles can block the light emitted from the second LED chip from sticking the phosphor particles. By adjusting the current supplied to the first LED chip, the color temperature of the resultant light generated by the LED device can be changed.01-31-2013
20130087817LIGHT EMITTING DEVICE AND LIGHT UNIT HAVING THE SAME - A light emitting device includes a body having a first recess; a barrier section having a second recess and a third recess, protruding upward over a bottom surface of the first recess, and dividing the bottom surface of the first recess into a first region and a second region; a first light emitting diode disposed in the first region; a second light emitting diode disposed in the second region; a first lead electrode disposed in the first region; a second lead electrode disposed in the second region; a first wire electrically connecting the first lead electrode to the second light emitting diode through the second recess; and a second wire electrically connecting the second lead electrode to the first light emitting diode through the third recess.04-11-2013
20130049035LIGHT EMITTING DEVICE - There is provided a light emitting device which enables a color display with good color balance. A triplet compound is used for a light emitting layer of an EL element that emits red color, and a singlet compound is used for a light emitting layer of an EL element that emits green color and a light emitting layer of an EL element that emits blue color. Thus, an operation voltage of the EL element emitting red color may be made the same as the EL element emitting green color and the EL element emitting blue color. Accordingly, the color display with good color balance can be realized.02-28-2013
20090242911ORGANIC LIGHT-EMITTING DISPLAY DEVICE - An object of the present invention is to provide an organic light-emitting display device using a number of organic light-emitting elements that emit lights of different colors, wherein the life of the organic light-emitting elements that emits light of a color having a short life can be prolonged. According to the present invention, a hole injection layer 10-01-2009
20090321756LED Package Structure and Method of Packaging the Same - An LED package structure includes a first LED chip, a second LED chip arranged on the minor light-emitting surface of the first LED chip, a conductive unit connected between the electrode areas for parallel or serially connecting the two LED chips together, and two external electric conduction units for electrically connecting both the first and second electrode areas of the first LED chip with an external circuit.12-31-2009
20100133561LIGHT EMITTING APPARATUS - The present invention provides a light emitting apparatus comprising a three-color light emitting device unit including at least three light emitting diode (LED) chips for respectively emitting red, green and blue light; a white light emitting device unit including at least one blue LED chip with a fluorescent substance formed thereon; and a substrate provided with a first electrode connected in common to ends of the LED chips and second electrodes formed to correspond respectively to the LED chips. Further, the present invention provides a light emitting apparatus comprising a plurality of LED chips; a substrate provided with a first electrode connected in common to ends of the plurality of LED chips and second electrodes formed to correspond respectively to the plurality of LED chips; an upper package formed on the substrate to surround the plurality of LED chips and to have a partition crossing the first electrode at the center of the upper package; and a molding member that encapsulates the plurality of LED chips and is divided by the partition of the upper package.06-03-2010
20090309109Organic light emitting diode display device and method of manufacturing the same - An OLED display device includes a plurality of pixels including sub-pixels arranged along a first direction, the sub-pixels being arranged in an order emitting red, blue, and green lights along the first direction or in a reverse order, wherein an arrangement of colors of light emitted from sub-pixels of one pixel is symmetrical to an arrangement of colors of light emitted from sub-pixels of an adjacent pixel, and wherein a light emitting layer of the sub-pixel emitting red light includes a light emitting layer emitting red light and a light emitting layer emitting blue light, a light emitting layer of the sub-pixel emitting blue light includes a light emitting layer emitting blue light, and a light emitting layer of the sub-pixel emitting green light includes a light emitting layer emitting green light and a light emitting layer emitting blue light.12-17-2009
20090309108Organic light emitting diode display device and method of manufacturing the same - An OLED display device includes a plurality of pixels including sub-pixels arranged along a first direction, the sub-pixels being arranged in an order emitting red, green, and blue lights along the first direction or in a reverse order, wherein an arrangement of colors of light emitted from sub-pixels of one pixel is symmetrical to an arrangement of colors of light emitted from sub-pixels of an adjacent pixel, and wherein a light emitting layer of the sub-pixel emitting red light includes a light emitting layer emitting red light and a light emitting layer emitting green light, a light emitting layer of the sub-pixel emitting green light includes a light emitting layer emitting green light, and a light emitting layer of the sub-pixel emitting blue light includes a light emitting layer emitting blue light and a light emitting layer emitting green light.12-17-2009
20120217521DISPLAY PANEL APPARATUS AND MANUFACTURING METHOD OF DISPLAY PANEL APPARATUS - A display panel apparatus includes pixels, each including an organic luminescent layer between first and second electrodes. A glass substrate is above the second electrode. A lens sheet is between the pixels and the glass substrate and includes a lens corresponding to each of the pixels and a base from which the lens protrudes. A first partition is between the glass substrate and the lens sheet on a first side of the base from which the lens protrudes for partitioning, between the glass substrate and the lens sheet, a gap between the lens of each of the pixels. A second partition is between the organic electro-luminescence unit and the lens sheet on a second side of the base opposite the first side from which the lens protrudes for partitioning, between the organic electro-luminescence unit and the lens sheet, the gap between the lens of each of the pixels.08-30-2012
20110057211LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing LED display is provided. The method provides a sacrificial substrate on which RGB LED device layers are formed, respectively. The method etches and patterns the LED device layer to manufacture RGB LED devices, respectively. The method removes the sacrificial substrate in a lower side of the LED device. The method contacts a stamping processor to the RGB LED devices to separate the RGB LED devices from the sacrificial substrate. The method transfers the LED device, which is attached to the stamping processor, to a receiving substrate.03-10-2011
20130161666DIRECTLY PATTERNED LATERAL HYBRID COLOR OLED ARRAYS SYSTEM AND METHOD - A display situated on a substrate surface is provided. The display includes a first light emitting sub-pixel situated on the substrate surface. The first light-emissive layer includes fluorescent material. The display also includes a second light emitting sub-pixel situated on the substrate surface. The second light-emissive layer includes phosphorescent material. The first light emitting sub-pixel and the second light emitting sub-pixel may be arranged proximate to each other on the substrate surface. The first light emitting sub-pixel and the second light emitting sub-pixel may be arranged laterally adjacent to each other on the substrate surface. A display situated on a substrate is provided first and second light-emissive layers interposed between a first base electrode and a first transparent electrode. The first light emitting sub-pixel further includes a first interlayer interposed between the first and second light-emissive layers.06-27-2013
20120112217ORGANIC EL DISPLAY PANEL - Disclosed is an organic EL display panel provided with a substrate and a plurality of sub-pixels that are disposed in a matrix upon the substrate, wherein: the sub-pixels comprise sub-pixels that emit red light, sub-pixels that emit green light, and sub-pixels that emit blue light; the sub-pixels are each provided with a pixel electrode that is disposed upon the substrate, an organic functional layer that is formed by coating upon the pixel electrode, a counter electrode that is disposed upon the organic functional layer, and a bank that defines the space in which the organic functional layer is formed; the sub-pixels include sub-pixels (X) that are disposed on at least one section of the edge of the substrate, and sub-pixels (Y) that are disposed in the center of the substrate and that emit light with the same color as the sub-pixels (X); the volume of the organic functional layer provided in the sub-pixels (X) is larger than the volume of the organic functional layer provided in the sub-pixels (Y); and the sizes of the space defined by the bank provided in the sub-pixels (X) are the same as the sizes of the space defined by the bank provided in the sub-pixels (Y).05-10-2012
20130056768DISPLAY DEVICE AND ELECTRONIC APPARATUS HAVING A DISPLAY DEVICE - A display device includes a plurality of main pixels. Each main pixel includes a plurality of sub-pixels. At least two of the sub-pixels emit light of different colors. The at least two sub-pixels are different in size.03-07-2013
20130056767LED UNIT - An LED unit includes: a plurality of LED modules each having an LED chip for generating ultraviolet ray provided in a package which has an opening formed on one surface and a lens formed to cover the opening of the package; a substrate-shaped base block where the LED modules are mounted in a first direction; and a heat radiation member where a plurality of the base blocks is provided in a second direction perpendicular to the first direction. The heat radiation member has a plurality of inclined surfaces where each of the base blocks is disposed. Further, one inclined surface and the other inclined surface of the heat radiation member are inclined to face each other in the second direction.03-07-2013
20090078945Light emitting device - A light emitting device is provided that includes a substrate having a thin film transistor, and an insulation film disposed over the substrate and having a via hole to expose the thin film transistor. The light emitting device further includes a first electrode over the insulation film and connecting with the thin film transistor through the via hole, an emitting layer over the first electrode, a first function layer to cover the emitting layer, and a second electrode over the first function layer. A width of the first function layer is approximately 1.0 to 1.2 times a width of the emitting layer.03-26-2009
20130062637APPARATUS, METHOD TO ENHANCE COLOR CONTRAST IN PHOSPHOR-BASED SOLID STATE LIGHTS - The efficiency and color contrast of a lighting device may be improved by using wavelength shifting material, such as a phosphor, to absorb less desired wavelengths and transmit more desired wavelengths. A double-notch reflective filter may pass desired wavelengths such as red and green, while returning or reflecting less desired wavelengths (blue and yellow) away from an optical exit back toward wavelength shifting material and re-emitted as light of more desirable wavelengths.03-14-2013
20130062636LED DEVICE HAVING TWO LED DIES SEPARATED BY A DAM - An LED device comprises a substrate, a circuit, two LED dies, a dam and a reflector. The dam divides the substrate into a first area and a second area, wherein one of the two LED dies is disposed on the first area and the other is disposed on the second area. The dam insulates radiant lights emitted from the two LED dies, whereby interference between the radiant lights can be prevented. Four separate electrodes are provided on the substrate, wherein one LED die is connected to two electrodes and the other LED die is electrically connected to the other two electrodes.03-14-2013
20110012142Method for Producing a Luminous Device and Luminous Device - A method for producing a luminous device is specified. A number of light emitting diodes each have a radiation-transmissive carrier and at least two semiconductor bodies spatially separated from one another. Each semiconductor body is provided for generating electromagnetic radiation. The semiconductor bodies can be driven separately from one another and the semiconductor bodies are arranged at the top side of the radiation-transmissive carrier on the radiation-transmissive carrier. A chip assemblage is composed of CMOS chips each of which has at least two connection locations at its top side. At least one of the light emitting diodes is connected to one of the CMOS chips. The light emitting diode is arranged, at the top side of the radiation-transmissive carrier, at the top side of the CMOS chip and each semiconductor body of the light emitting diode is connected to a connection location of the CMOS chip.01-20-2011
20110012141SINGLE-COLOR WAVELENGTH-CONVERTED LIGHT EMITTING DEVICES - A packaged light emitting device (LED) includes an LED chip configured to emit light within a first wavelength range, and a wavelength conversion material on the LED chip. The wavelength conversion material is configured to receive the light within the first wavelength range and responsively emit light within a second wavelength range different than the first wavelength range such that a light output of the packaged LED does not substantially include the light within the first wavelength range and provides an appearance of substantially monochromatic light of a color of the visible spectrum corresponding to the second wavelength range. The packaged LED may include a color filter on the wavelength conversion material that is configured to prevent passage of the light within the first wavelength range therethrough, and/or may include a thickness of the wavelength conversion material configured to completely absorb the light within the first wavelength range.01-20-2011
20110037081WHITE LIGHT-EMITTING DIODE PACKAGES WITH TUNABLE COLOR TEMPERATURE - A white light-emitting diode package with tunable color temperature is provided, including a package substrate with a first light emitting diode (first LED) disposed over a first portion of the substrate and a second light emitting diode (second LED) disposed over a second portion different from the first portion of the substrate. A phosphor layer is coated around the first and second LED, wherein the phosphor layer is formed by blending at least one colored phosphor grain with a transparent optical resin, and the at least one colored phosphor grain in the transparent optical resin is excited by light from the first and second LED to react and emit white light. In one embodiment, the first and second LED are both blue LEDs for emitting blue light of different wavelengths or ultraviolet (UV) LEDs for emitting UV light of different wavelengths.02-17-2011
20090236620LIGHT EMITTING APPARATUS AND DISPLAY APPARATUS HAVING THE SAME - Disclosed are a light emitting apparatus and a display apparatus having the same. The light emitting apparatus comprises a first light emitting device which emits a light of a target color tinged with a first color, and a second light emitting device which emits a light of the target color tinged with a second color complementary to the first color with respect to the target color.09-24-2009
20090236619Light Emitting Diodes with Light Filters - LED chips including an LED layer or layers capable of emitting light of a first wavelength, a light conversion layer on the LED capable of converting at least a portion of the light of a first wavelength to light of a second wavelength, and a filter layer therebetween that is transmissive to light of a first wavelength and reflective to light of a second wavelength. The filter layer may prevent at least some of the light of a second wavelength from entering the LED layer or layers, where it may be subject to various optical losses, such as internal reflection and absorption. LED chips may also include multiple filter and light conversion layers. Methods of fabrication are also disclosed.09-24-2009
20130069090ORGANIC ELECTROLUMINESCENT DEVICE, DISPLAY AND LIGHTING INSTRUMENT - The organic electroluminescent device according to the embodiment has: anode and cathode electrodes placed apart from each other, a red and green light-emitting layer and a blue light-emitting layer, and a spacer layer having a thickness of 3 nm to 20 nm inclusive. The light-emitting layers are placed apart from each other and positioned between the electrodes. The spacer layer is positioned between the light-emitting layers, and includes a carrier transport material containing molecules capable of being oriented in the in-plane and vertical direction with an orientational order parameter of −0.5 to −0.2 inclusive.03-21-2013
20090008655White Light Source - A white light source (01-08-2009
20120235184SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, a semiconductor light emitting device includes a light emitting section and a wavelength conversion section. The light emitting section is configured to emit light. The wavelength conversion section is provided on one major surface side of the light emitting section. The wavelength conversion section contains a phosphor. The wavelength conversion section has a distribution of amount of the phosphor based on a distribution of wavelength of the light emitted from the light emitting section.09-20-2012
20120235186Color-Temperature-Tunable Device - A color-temperature-tunable device comprises a first light emitting diode (LED) chip group comprising at least one first blue LED chip that emits a first light having a first peak wavelength, a second LED chip group comprising at least one second blue LED chip that emits a second light having a second peak wavelength different from the first peak wavelength, and a wavelength converting layer above at least a portion of the first LED chip group and a portion of the second LED chip group. The first LED chip group and the second LED chip group are driven by a first driving current and a second driving current, respectively.09-20-2012
20120235185DISPLAY - Disclosed herein is a display including an acceptor substrate having thereon a red light-emitting element column, a green light-emitting element column, and a blue light-emitting element column that are arranged along a row direction and are each obtained by arranging rectangular organic light-emitting elements for generating light of one of red, green, and blue along a longitudinal direction of the organic light-emitting elements.09-20-2012
20120235183LIGHT EMITTING DEVICE, ILLUMINATION APPARATUS AND DISPLAY APPARATUS - Disclosed herein is a light emitting device including: an organic layer sandwiched between a first electrode and a second electrode to serve as an organic layer including a light emitting layer for emitting monochromatic light at one location; a first light reflection boundary face provided on a side close to the first electrode to serve as a boundary face for reflecting light emitted from the light emitting layer so as to radiate the reflected light from a side close to the second electrode; and a second light reflection boundary face, a third light reflection boundary face and a fourth light reflection boundary face which are sequentially provided at positions separated away from each other in a direction from the first electrode to the second electrode on the side close to the second electrode.09-20-2012
20120267652WHITE ORGANIC ELECTROLUMINESCENCE DEVICE - A white organic electroluminescence device includes: an anode electrode; a cathode electrode; a hole transport layer arranged between the anode electrode and the cathode electrode; an electron transport layer arranged between the anode electrode and the cathode electrode; and a plurality of light emission layers into which holes and electrons are injected from the hole transport layer and the electron transport layer, the light emission layers arranged between the hole transport layer and the electron transport layer. The light emission layers are configured to have at least one emission peak wavelength for each of blue, green and red. colors, and the emission peak. wavelength of the blue color ranges from about 445 nm to about 455 nm.10-25-2012
20100320487LIGHT-EMITTING DEVICE ARRAY WITH INDIVIDUAL CELLS - A light-emitting device and a method for manufacturing the light-emitting device is disclosed. Such a light-emitting device comprises a substrate, a plurality of cells disposed in the substrate, and a plurality of semiconductor dice, wherein each of the plurality of cells accommodates at least one of the plurality of dice. Each of the plurality of cells may be filled with an encapsulant, phosphor or a mixture of an encapsulant with phosphor to control light characteristics of the light-emitting device. In an alternative aspect, cells may be filled with an encapsulant, and comprise a transparent cover coated with or filled with phosphors to control light characteristics of the light-emitting device.12-23-2010
20120104427MINIATURE SURFACE MOUNT DEVICE WITH LARGE PIN PADS - One embodiment of the surface mount LED package includes a lead frame and a plastic casing at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package is less than about 1.0 mm.05-03-2012
20100264432LIGHT EMITTING DEVICE WITH HIGH COLOR RENDERING INDEX AND HIGH LUMINESCENCE EFFICIENCY - A light emitting device comprises two light-emitting diode (LED) groups, a group of luminophor layers, and an input terminal. The first LED group includes at least one blue LED emitting light having a dominant wavelength in a range between 400 nm and 480 nm, and the second LED group includes at least one red-orange LED emitting light having a dominant wavelength in a range between 610 nm and 630 nm. The group of luminophor layers, which are selected from one of silicates, nitrides, and nitrogen oxides, are positioned above the first LED group and partially converts the light emitted by the first LED group into light having a dominant wavelength in a range between 500 nm and 555 nm. The input terminal is connected to the two LED groups for providing desired electric energy thereto.10-21-2010
20110278606LED LIGHT EMITTING DEVICE - In order to provide an LED light emitting device that can easily control a color temperature of white light, the LED light emitting device is provided with a plurality of types of light emitting parts that: respectively have LED elements that emit ultraviolet radiation or violet color visible light, and phosphors that absorb the ultraviolet radiation or violet color visible light to emit colored light; and emit the colored light, wherein: the colored light emitted by the plurality of types of light emitting parts become white light when all mixed with each other; the LED elements of the plurality of types of light emitting parts are all the same ones, and mounted on a single base material; and two or more light emitting parts overlap with each other in their parts.11-17-2011
20110278605LIGHT EMITTING DEVICE AND ILLUMINATION DEVICE - A light emitting device is a light emitting device using light emitting elements and includes: a substrate; a resin frame provided circularly on the substrate; a resin wall provided on the substrate so as to partition an area surrounded by the resin frame into 2 zones; light-emitting sections (a first light-emitting section: blue LEDs+red fluorescent material, a second light-emitting section: blue LEDs+yellow fluorescent material) provided in the respective zones, each of which light-emitting sections includes at least one light emitting element; and first and second anode electrodes and a cathode electrode provided so that each of the light-emitting sections receives current via a corresponding anode electrode and the cathode electrode, the light-emitting sections emitting respective pieces of light each having at least one color, which respective pieces of light have different colors from each other, the first and second anode electrodes being electrically connected to the first and second light-emitting sections, respectively. With the arrangement, which can increase an integration degree, it is possible to achieve a high color rendering property and an excellent color mixing property, to easily adjust a chromaticity, and to easily generate light with a desired chromaticity.11-17-2011
20120097998White Organic Light Emitting Device - A white organic light emitting device which has high color temperature characteristics and no change in color coordinates according to luminance change, includes a first electrode and a second electrode opposite to each other on a substrate, a charge generation layer formed between the first electrode and the second electrode, a second stack including a second light emitting layer formed between the charge generation layer and the second electrode, and a first stack including a first light emitting layer formed between the first electrode and the charge generation layer, wherein the first emitting layer has low singlet-triplet exchange energy to change triplet excitons into a singlet state by triplet-triplet annihilation and a dopant concentration of the first light emitting layer is adjusted according to a luminance change curve of the second stack.04-26-2012
20120138977ANNUAL PACKAGING STRUCTURE FOR LED LAMPS - An annual packaging structure includes a heat sink having an installation surface; and a plurality of annular isolation walls being formed on the installation surface. Each of two opposite sides of each annular isolation wall has a light reflecting surface. Each installation hole is installed with an insulator material of which is selected from glass or other heat insulation material. Each section is installed with a plurality of LED dies; each LED die being electrically connected to a pin. A heat conduction base has an embedding groove for installing the heat sink. A lower bottom of the embedding groove is formed with a plurality of through holes positioned with respect to the installation holes. The pins are extended through the through holes and are limited by the insulators so that the pin are at a center portion for preventing short-circuit.06-07-2012
20090032827Concave Wide Emitting Lens for LED Useful for Backlighting - Lenses for LEDs are described that efficiently create a substantially uniform light emission across a surface of a backlight box. The backlight may illuminate an LCD. A wide-emitting lens refracts light emitted by an LED die to cause a peak intensity to occur within 35-65 degrees off the die's center axis, normal to the die's top surface, and an intensity along the center axis to be between 40% and 90% of the peak intensity. The lens is concave over the die and has smooth edges that transition into the lens sidewalls. The direct emissions of the lenses from a plurality of LEDs arranged on a base surface in a backlight box combine together to uniformly illuminate a light output surface of the backlight box.02-05-2009
20080303040BACKLIGHT MODULE AND LIGHT EMITTING DIODE PACKAGE STRUCTURE THEREFOR - A LED package structure including a carrier, LED chips, and a package body is provided. The carrier defines a cave with two opposite first side walls, two opposite second side walls and a rectangular bottom surface. An included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface. The LED chips are disposed in a straight-line arrangement on a center line of the bottom surface and electrically connected to the carrier. The center line is parallel to a long side of the bottom surface. The package body is formed on the carrier to cover the LED chips. Since the included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface, light provided by the LED package structure has different spatial radiation patterns in different directions.12-11-2008
20100207132LIGHT EMITTING DEVICE EMPLOYING NON-STOICHIOMETRIC TETRAGONAL ALKALINE EARTH SILICATE PHOSPHORS - Disclosed is a light emitting device employing non-stoichiometric tetragonal Alkaline Earth Silicate phosphors. The light emitting device comprises a light emitting diode emitting light of ultraviolet or visible light, and non-stoichiometric luminescent material disposed around the light emitting diode. The luminescent material adsorbs at least a portion of the light emitted from the light emitting diode and emits light having a different wavelength from the absorbed light. The non-stoichiometric luminescent material has tetragonal crystal structure, and contains more silicon in the crystal lattice than that in the crystal lattice of silicate phosphors having stoichiometric crystal structure. The luminescent material is represented as the formula (Ba08-19-2010
20110297978LIGHT-EMITTING DIODE, METHOD FOR MANUFACTURING THE SAME, AND LIGHT-EMITTING DIODE LAMP - The invention provides a high luminance light-emitting diode capable of reducing the loss of light emitted from LED chips in a package and also capable of improving the light extraction efficiency from the package, wherein12-08-2011
20110297977DISPLAY DEVICE - A display device includes a first organic electroluminescent element and a second organic electroluminescent element. The first and second organic electroluminescent elements have different luminescent colors. The first and second organic electroluminescent elements each include, in series, a first electrode, a first charge transport layer, a second charge transport layer, a light-emitting layer, and a second electrode. The first charge transport layer is common to the first and second organic electroluminescent elements. The second charge transport layer of the first organic electroluminescent element is different in thickness from the second charge transport layer of the second organic electroluminescent element. The concentration of a dopant material contained in the first charge transport layer is less than that of the second charge transport layer.12-08-2011
20110297976Illumination Module - An illumination module including a substrate and a plurality of first and second LED chips is provided. The substrate has a plurality of device bonding areas, and each of device bonding areas has two sub-device bonding areas. Each sub-device bonding area has a first, second, and common route. The first routes surround the outer peripheries of each device bonding area. The second routes are located between the two sub-device bonding areas. The common routes are located between the first and second routes. The first LED chips located at the common routes are electrically connected to each other. The second LED chips located at the first and second routes respectly are electrically connected to each other.12-08-2011
20120286305Light-Emitting Element, Light-Emitting Module, Light-Emitting Panel, and Light-Emitting Device - A light-emitting element, a light-emitting module, a light-emitting panel, or a light-emitting device in which loss due to electrical resistance is reduced is provided. The present invention focuses on a surface of an electrode containing a metal and on a layer containing a light-emitting organic compound. The layer containing a light-emitting organic compound is provided between one electrode including a first metal, whose surface is provided with a conductive inclusion, and the other electrode.11-15-2012
20110291130PHOTONIC STRUCTURES FOR EFFICIENT LIGHT EXTRACTION AND CONVERSION IN MULTI-COLOR LIGHT EMITTING DIODES - A high efficiency light emitting diode (LED) comprised of a substrate, a buffer layer grown on the substrate (if such a layer is needed), a first active region comprising primary emitting species (PES) that are electrically-injected, a second active region comprising secondary emitting species (SES) that are optically-pumped by the light emitted from the PES, and photonic crystals, wherein the photonic crystals act as diffraction gratings to provide high light extraction efficiency, to provide efficient excitation of the SES, and/or to modulate the far-field emission pattern.12-01-2011
20110198629Organic Light Emitting Display Apparatus - An organic light emitting display apparatus has a hybrid structure in which resonance red, green and blue pixels and a non-resonance white pixel are combined. An optical path control layer and a white color filter which selectively absorbs light having a specific wavelength are included in the white pixel. Thus, the organic light emitting display apparatus has a large viewing angle, low power consumption, and long lifetime.08-18-2011
20080308821DIELECTRIC LAYER AND THIN FILM TRANSISTOR - A dielectric layer including a film with silicon compound contain oxygen and a film with silicon compound contain nitrogen is provided. A ratio of Si—N group absorption intensity to a thickness of the film with silicon compound contain nitrogen in an FTIR spectrum is substantially greater than or substantially equal to 0.67/μm. The dielectric layer can be incorporated in switch devices.12-18-2008
20120097997MULTICHIP PACKAGE STRUCTURE USING A CONSTANT VOLTAGE POWER SUPPLY - A multichip package structure includes a substrate unit, a light-emitting unit, a current-limiting unit, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The current-limiting unit includes at least one current-limiting chip electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting chip. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting chip.04-26-2012
20100270566LIGHT EMITTING DEVICE WITH SELECTIVE REFLECTION FUNCTION - A light emitting device with selective reflection function being applied to general light emitting device and AC-type light emitting device is revealed. The light emitting device includes at least one vertical light emitting unit, at least one selective reflection layer and a phosphor layer. The selective reflection layer is disposed over the vertical light emitting unit and the phosphor layer is arranged over the selective reflection layer. Thus first colored light from the vertical light emitting unit passes the selective reflection layer and then to be converted into second colored light by the phosphor layer. The selective reflection layer reflects the second colored light while the first colored light is mixed with the second colored light to form mixing colored light. By the selective reflection layer that prevents the second colored light emitting into the light emitting unit, the lighting efficiency of the light emitting device is enhanced.10-28-2010
20100032695TUNABLE WHITE LIGHT BASED ON POLARIZATION SENSITIVE LIGHT-EMITTING DIODES - A lighting apparatus for emitting polarized white light, which includes at least a first light source for emitting primary light comprised of one or more first wavelengths and having a first polarization direction; and at least a second light source for emitting secondary light in the first polarization direction, comprised of one or more secondary wavelengths, wherein the first light and the secondary light are combined to produce a polarized white light. The lighting apparatus may further comprise a polarizer for controlling the primary light's intensity, wherein a rotation of the polarizer varies an alignment of its polarization axis with respect to the first polarization direction, which varies transmission of the primary light through the polarizer, which controls a color co-ordinate or hue of the white light.02-11-2010
20090230412ELECTRONIC DISPLAYS USING OPTICALLY PUMPED LUMINESCENT SEMICONDUCTOR NANOCRYSTALS - A multicolor electronic display is based on an array of luminescent semiconductor nanocrystals. Nanocrystals which emit light of different colors are grouped into pixels. The nanocrystals are optically pumped to produce a multicolor display. Different sized nanocrystals are used to produce the different colors. A variety of pixel addressing systems can be used.09-17-2009
20130214304ILLUMINATING DEVICE - An illuminating device that may include a substrate; a first light emitting chip which is disposed on the substrate; a second light emitting chip which is spaced apart from the first light emitting chip and is disposed on the substrate; a first lens which includes a first cylindrical side having a height greater than the thickness of the first light emitting chip and includes a first spherical or hemispherical curved surface formed on the first side, and which surrounds the first light emitting chip; and a second lens which includes a second cylindrical side having a height greater than the thickness of the second light emitting chip and includes a second spherical or hemispherical curved surface formed on the second side, and which surrounds the second light emitting chip, wherein at least a portion of the first side contacts with at least a portion of the second side.08-22-2013
20120267653LIGHT EMITTING DIODE MODULE WITH THREE PART COLOR MATCHING - A light emitting diode module is produced using at least one LED and at least two selectable components that form a light mixing chamber. First and second selectable components have first and second types of wavelength converting materials with different wavelength converting characteristics. The first and second wavelength converting characteristics alter the spectral power distribution of the light produced by the LED to produce light with a color point that is a predetermined tolerance from a predetermined color point. Moreover, a set of LED modules may be produced such that each LED module has the same color point within a predetermined tolerance. The LED module may be produced by pre-measuring the wavelength converting characteristics of the different components selecting components with wavelength converting characteristics that convert the spectral power distribution of the LED to a color point that is a predetermined tolerance from a predetermined color point.10-25-2012
20120267651DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - In one aspect, a display device comprising: a lower substrate, a light-emitting element formed on the lower substrate and comprising a plurality of pixels, an upper substrate disposed on the light-emitting element with a gap therebetween sealed with a sealant, a filler filling the gap between the light-emitting element and the upper substrate, and a light-absorbing material formed between the lower substrate and the upper substrate and selectively absorbing light of a certain wavelength range is provided.10-25-2012
20120267650SOLID STATE LIGHTING DEVICES HAVING IMPROVED COLOR UNIFORMITY AND ASSOCIATED METHODS - Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.10-25-2012
20120025228LIGHT-EMITTING DEVICE WITH TEMPERATURE COMPENSATION - The present application provides a light-emitting device comprising a light-emitting diode group, a temperature compensation element electrically connected to the light-emitting diode group. When a junction temperature of the light-emitting diode group is increased from a first temperature to a second temperature during operation, the current flowing through the light-emitting diode group at the second temperature is larger than the current flowing through the light-emitting diode group at the first temperature.02-02-2012
20120025227WATER RESISTANT SURFACE MOUNT DEVICE PACKAGE - The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.02-02-2012
20120025226DISPLAY DEVICE AND ELECTRONIC APPARATUS - A display device includes a first light-emitting element which includes a second layer having the function of flowing carriers and provided between a first anode and a first layer having the function of emitting light of a first color, and a third layer having the function of emitting light of a second color and provided between the first anode and the second layer; and a second light-emitting element which includes a fifth layer having the function of suppressing a flow of carriers and provided between a second anode and a fourth layer having the function of emitting light of the first color, and a first hole injection layer provided between the second anode and the fifth layer.02-02-2012
20120025224ORGANIC EL DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - An organic electroluminescence (EL) display panel and method of manufacturing an organic EL display panel. The display panel includes a substrate on which a thin-film transistor layer is formed, with an interlayer insulating film formed above the thin-film transistor layer. A plurality of strip-shaped barrier ribs are arranged in parallel on the interlayer insulating film. Each electrode of a plurality of first electrode groups has first electrodes arranged in a line and arranged between two adjacent barrier ribs of the plurality of strip-shaped barrier ribs, with each of the first electrodes including a transparent conductive film and a reflective metal film formed of a metal material. A plurality of light-emitting layers are each formed to cover a different electrode of the plurality of first electrode groups, while a second electrode is formed above the plurality of light-emitting layers. Each electrode of the plurality of first electrode groups is formed such that an end portion of the first electrode in a parallel direction with respect to the barrier ribs includes a single-film portion in which the transparent conductive film is not formed, and a portion of the first electrode other than the single-film portion includes a two-film portion in which the transparent conductive film is layered on the reflective metal film. A metal oxide film is formed on an entire surface of the single-film portion of each first electrode by partially oxidizing the metal material.02-02-2012
20100270567LIGHTING DEVICE - A light emission package includes multiple colored solid state emitters each having a different non-white dominant wavelength in the visible range, and at least one lumiphor arranged to receive emissions from at least one other solid state emitter, with each emitter arranged on or adjacent to a common submount. The at least one other emitter and lumiphor may be arranged in combination to emit white light. Each emitter is independently controllable, permitting color and/or color temperature of a lighting device to be varied during operation of the device. At least one white emitter may be combined with red, green, and blue LEDs.10-28-2010
20090152572Array type light-emitting device with high color rendering index - An array type light-emitting device includes a substrate, an array type light-emitting module, a wavelength-converting layer set, and a plurality of transparent layer sets. The array type light-emitting module is composed of a blue, a red, a green, a yellow and an amber light-emitting chip sets. The wavelength-converting layer set is covered on the blue light-emitting chip set. The transparent layer sets are respectively covered on the red, the green, the yellow, the amber light-emitting chip sets. Therefore, a part of visible light emitted by the blue light-emitting chip set is absorbed and converted into visible light with another emission peak wavelength range via the wavelength-converting layer set, and the visible light mixes with projecting light projected from the red, the green, the yellow and the amber light-emitting chip sets to make the array type light-emitting device generate white light with a color rendering index of between 90 and 96.06-18-2009
20090121239DISPLAY DEVICE - A display device includes light emitting elements corresponding to respective colors disposed on a substrate. Each of the light emitting elements corresponding to the respective colors has a cavity structure in which a light emission functioning layer including a light emitting layer is held between a reflecting electrode and a semitransmitting electrode. A cavity order of at least the light emitting element adapted to resonate a light, having the shortest wavelength, of the light emitting elements corresponding to the respective colors is 1, and a cavity order of each of other light emitting elements is 0. The light emission functioning layer except for the light emitting layer is common to the light emitting elements corresponding to the respective colors.05-14-2009
20090001393MULTI-LIGHT EMITTING DIODE PACKAGE - A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.01-01-2009
20100123145LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME - A light emitting device comprises a first conductive semiconductor layer, a plurality of light emitting cells separated on the first conductive semiconductor layer, a phosphor layer on at least one of the light emitting cells, and a plurality of second electrodes electrically connected to the light emitting cells.05-20-2010
20110193109LED LIGHT MODULE - A light emitting module is disclosed. The light emitting module includes a lead frame body, lead frame, a heat spreader, an intermediate heat sink, and at least one light emitting element (LED). The lead frame body defines a cavity which accurately registers the heat spreader and includes optical or reflective walls surrounding the light emitting elements soldered on metallized traces of the heat spreader. The lead frame body encases and supports portions of the lead frame. The lead frame extends from outside the body into the cavity to accurately align with solder pads of the heat spreader. All the pre-aligned mechanical, thermal and electrical contacts are then soldered by solder reflow process under tight environmental control to prevent damage to the light emitting element. A robust, healthy 3-dimensional optical-electro-mechanical assembly having a very low thermal resistance in a thermal path from its light emitting element to its intermediate heatsink is created.08-11-2011
20090283781Mini V SMD - In one embodiment, a surface-mount device comprises a casing having opposed, first and second main surfaces, side surfaces, and end surfaces. A lead frame partially encased by the casing comprises (1) an electrically conductive LED chip carrier part having a surface carrying a linear array of LEDs adapted to be energized to produce in combination a substantially full range of colors, each LED having a first electrical terminal and a second electrical terminal, the first terminal of each of the LEDs being electrically and thermally coupled to the chip carrying surface of the chip carrier part; and (2) electrically conductive connection parts separate from the chip carrier part, each of the connection parts having a connection pad, the second terminal of each of the LEDs being electrically coupled to the connection pad of a corresponding one of the connection parts with a single wire bond. The linear array of LEDs extends in a first direction, and each of the chip carrier part and connection parts has a lead. The leads may be disposed in parallel relationship with each other and extend through the end surfaces of the casing in a second direction, the second direction being orthogonal to the first direction. An array of the surface-mount devices may be used in an LED display such as an indoor LED screen.11-19-2009
20100084668SEMICONDUCTOR COLOR-TUNABLE BROADBAND LIGHT SOURCES AND FULL-COLOR MICRODISPLAYS - Methods and systems are provided that may be used to utilize and manufacture a light sources apparatus. A first light emitting diode emits light having a first wavelength, and a second light emitting diode for emitting light having a second wavelength. Each of the first and second light emitting diodes may comprise angled facets to reflect incident light in a direct toward a top end of the first light emitting diode. The second light emitting diode comprising angled facets may reflect incident light in a direction toward a top end of the second light emitting diode. A first distributed Bragg reflector is disposed between the top end of the first light emitting diode and a bottom end of the second light emitting diode to allow light from the first light emitting diode to pass through and to reflect light from the second light emitting diode.04-08-2010
20090267090COLOR MIXING LIGHT EMITTING DIODE DEVICE - An exemplary color mixing light emitting diode (LED) device includes a substrate, LED dies, an encapsulating body, and a light mixing structure. The substrate has a main surface. The LED dies are arranged adjacent the main surface of the substrate. The light mixing structure is arranged adjacent an outer portion of the main surface of the substrate, around the LED dies. The encapsulating body encapsulates the LED dies and the light mixing structure. The light mixing structure is made of light transmissive material, and the light mixing structure has light scattering particles doped therein.10-29-2009
20100090233SIDE-VIEW SURFACE MOUNT WHITE LED - A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.04-15-2010
20100090232POLYCHROMATIC LED AND METHOD FOR MANUFACTURING THE SAME - A wavelength conversion layer is formed on a surface of a light emitting device for transforming a portion of light emitted from the light emitting device into light of a different wavelength. The transformed light is mixed with the untransformed light, and thus the light emitting device can emit light having preferred CIE coordinates.04-15-2010
20100090230CRYSTAL SILICON ELEMENT AND METHOD FOR FABRICATING SAME - It is an object of the present invention to provide a crystal silicon element emitting a desired visible light at high efficiency, by markedly enhancing the crystallinity of the nano Si. A p-type single crystal silicon substrate 04-15-2010
20110198630ORGANIC EL DEVICE - According to one embodiment, an organic EL device includes an insulating substrate, first and second interlayer insulators, pixel electrodes, an organic layer, and a counter electrode. The first interlayer insulator is positioned above the insulating substrate. The second interlayer insulator is positioned on the first interlayer insulator and provided with slits. The pixel electrodes are arranged on the second interlayer insulator. Two or more of the pixels are adjacent to each other with one of regions corresponding to the slits interposed therebetween. The organic layer is positioned on the pixel electrodes and includes an emitting layer. The counter electrode is positioned above the organic layer.08-18-2011
20110169024Device and Method for Lighting - A method is presented for reducing the light output capacity of light emitting components (C07-14-2011
20110169025SEMICONDUCTOR OPTICAL ELEMENT ARRAY AND METHOD OF MANUFACTURING THE SAME - The present invention provides a semiconductor optical element array including: a semiconductor substrate having a main surface in which a plurality of concave portions is formed; a mask pattern that is formed on the main surface of the semiconductor substrate and includes a plurality of opening portions provided immediately above the plurality of concave portions; a plurality of fine columnar crystals that is made of a group-III nitride semiconductor grown from the plurality of concave portions to the upper side of the mask pattern through the plurality of opening portions; an active layer that is grown on each of the plurality of fine columnar crystals; and a semiconductor layer covering each of the active layers.07-14-2011
20090045417LIGHT EMITTING SEMICONDUCTOR DEVICE - A light emitting semiconductor device is provided, wherein the light emitting semiconductor device comprises a substrate, a plurality of flip chips, a heat conductive board and an insulating board. These flip chips are electrically connected on the substrate. The heat conductive board has a protruding portion used to support the substrate. The insulating board has a plurality of connecting pads and an opening, wherein the protruding portion is sheathed in the opening, so as to expose the substrate. The exposed substrate is then electrically connected to the connecting pads.02-19-2009
20080210958Semiconductor white light emitting device and method for manufacturing the same - A semiconductor white light emitting device including: a semiconductor light emitting element having green and blue light emitting layers containing In; and a phosphor capable of emitting red light.09-04-2008
20090272988Multi-Chip Module Single Package Structure for Semiconductor - The invention is to provide a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts and N semiconductor light-emitting die modules, where N is a positive integer lager than or equal to 2. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.11-05-2009
20090278141Light-emitting devices and displays with improved performance - Light-emitting devices and displays with improved performance are disclosed. A light-emitting device includes an emissive material disposed between a first electrode, and a second electrode. Various embodiments include a device having a peak external quantum efficiency of at least about 2.2%; a device that emits light having a CIE color coordinate of x greater than 0.63; a device having an external quantum efficiency of at least about 2.2 percent when measured at a current density of 5 mA/cm11-12-2009
20090278142LIGHT-EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a light-emitting diode display is provided. The method includes pre-fixing first, second, and third light-emitting diodes on a light emitting unit production substrate to produce light-emitting units each including first, second, and third light-emitting diodes, first electrodes of the first, second, and third light-emitting diodes being connected to a sub-common electrode. The method also includes transferring and fixing the light-emitting units from the light-emitting unit production substrate to a display substrate to produce a light-emitting diode display including the light-emitting units which are arranged in a first direction and a second direction perpendicular to the first direction (i.e., arranged in a two-dimensional matrix).11-12-2009
20090283780ILLUMINATION SYSTEM - An illumination system has a mounting substrate (11-19-2009
20120292647ORGANIC ELECTROLUMINESCENT LIGHT SOURCE - An organic electroluminescent light source including a first organic electroluminescent device and a second organic electroluminescent device is provided. The first organic electroluminescent device is coupled to a first bias voltage to emit a first color light having a color temperature ranging from 2800K to 3500K. The second organic electroluminescent device is coupled to a second bias voltage to emit a second color light. The first color light and the second color light mix to generate a third color light having a color temperature ranging from 3500K to 6500K.11-22-2012
20090261360LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, AND ELECTRONIC APPARATUS - A light-emitting element includes a cathode, an anode, a first light-emitting layer that is disposed between the cathode and the anode and that emits light of a first color, a second light-emitting layer that is disposed between the first light-emitting layer and the cathode and that emits light of a second color different from the first color, a third light-emitting layer that is disposed between the second light-emitting layer and the cathode and that emits light of a third color different from the first color and the second color, a first interlayer that is disposed between the first light-emitting layer and the second light-emitting layer so as to be in contact with the first and second light-emitting layers and that has a function of preventing energy transfer of an exciton between the first light-emitting layer and the second light-emitting layer, and a second interlayer that is disposed between the second light-emitting layer and the third light-emitting layer so as to be in contact with the second and third light-emitting layers and that has a function of preventing energy transfer of an exciton between the second light-emitting layer and the third light-emitting layer, wherein the first interlayer has a hole-transporting property higher than that of the second interlayer, and the second interlayer has an electron-transporting property higher than that of the first interlayer.10-22-2009
20090166648Multi-wavelength light-emitting module with high density electrical connections - A multi-wavelength light-emitting module with high density electrical connections includes a drive IC structure and a multi-wavelength LED array structure. The drive IC structure has a drive IC unit formed on a top surface thereof. The multi-wavelength LED array structure is disposed on the top surface of the drive IC structure, and the multi-wavelength LED array structure has a conductive trace unit formed on an outer surface thereof and electrically connected to the drive IC unit.07-02-2009
20110006316LIGHTING DEVICE, DISPLAY, AND METHOD FOR MANUFACTURING THE SAME - A display, a lighting device and a method for manufacturing the lighting device are provided. The lighting device comprises a substrate, an electrode layer, a plurality of light source units and a light scattering layer, which is covered by a transparent layer and a reflector layer to create a uniform surface light within an ultra thin format. A yellow phosphor layer is disposed above the reflector layer to create white light when a blue LED or UV LED is used. The lighting device also provides a unique electrode layout design which can be applied for local dimming control and can be easily applied for large size product applications.01-13-2011
20100127283ARRAY LAYOUT FOR COLOR MIXING - Solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. One embodiment of an LED component according to the present invention comprises a rectangular submount. A first group of blue shifted yellow (BSY) LED chips, a second group of BSY LED chips and a group of red LED chips are mounted on the submount. A plurality of contacts is arranged along one of the edges of the submount and accessible from one side of the component for applying electrical signals to the groups of LED chips.05-27-2010
20090050911Light emitting device packages using light scattering particles of different size - A radiation emitting device comprising light scattering particles of different sizes that at least partially surround an emitter, improving the spatial color mixing and color uniformity of the device. Multiple sizes of light scattering particles are dispersed in a medium to at least partially surround a single- or multiple-chip polychromatic emitter package. The different sizes of light scattering particles interact with corresponding wavelength ranges of emitted radiation. Thus, radiation emitted over multiple wavelength ranges or sub-ranges can be efficiently scattered to eliminate (or intentionally create) spatially non-uniform color patterns in the output beam.02-26-2009
20130214305RED LIGHT-EMITTING FLUORESCENT SUBSTANCE AND LIGHT-EMITTING DEVICE EMPLOYING THE SAME - The embodiment provides a red light-emitting fluorescent substance represented by the following formula (1):08-22-2013
20130009179COMPACT OPTICALLY EFFICIENT SOLID STATE LIGHT SOURCE WITH INTEGRATED THERMAL MANAGEMENT - A compact and efficient LED array lighting component comprising a circuit board with an array of LED chips mounted on it and electrically interconnected. A plurality of primary lenses is included, each of which is formed directly over each LED chip and/or a sub-group of the LED chips. A heat sink is included with the circuit board mounted to the heat sink so that heat from the LED chips spreads into the heat sink. In some embodiments the circuit board can be thermally conductive and electrically insulating. Method of forming an LED component are also disclosed utilizing chip-on-board mounting techniques for mounting the LED chips on the circuit board, and molding of the primary lenses directly over the LED chips individually or in sub-groups of LED chips.01-10-2013
20080283849LED DEVICE AND METHOD BY WHICH IT IS PRODUCED - A LED device formed of LED chips bonded to an exoergic member by the LED chips being bonded to an Au—Sn alloy layer formed on an upper surface of the exoergic member with columnar crystals being formed within the Au—Sn alloy layer extending in a direction perpendicular to the upper surface of the exoergic member. The method of producing the LED device forms an Sn film directly on the upper surface of the exoergic member, an Au film on a lower surface of the LED chips, mounts the LED chips with the Au film thereon onto the Sn film formed on the upper surface of the exoergic member, and the exoergic member with LED chips mounted thereon is heated in an atmosphere in which a forming gas flows, so that the LED chips are bonded to the exoergic member.11-20-2008
20080290353MICROSCALE OPTOELECTRONIC DEVICE PACKAGES - An optoelectronic device article comprises a substrate containing at least one electrically conductive microvia, at least one emitter diode and at least one ESD diode, optionally formed in situ, disposed in or on the substrate, and an electrically conductive path between the foregoing elements. A reflector cavity may be defined in the substrate for receiving the emitter diode(s), with retention elements on the substrate used to retain a lens material. High flux density and high emitter diode spatial density may be attained. Thermal sensors, radiation sensors, and integral heat spreaders comprising one or more protruding fins may be integrated into the article.11-27-2008
20120032206VARIABLE HEIGHT LIGHT EMITTING DIODE AND METHOD OF MANUFACTURE - In general, embodiments of the present invention provide a variable height LED and method of manufacture. Specifically, under embodiments of the present invention, a buffer layer is applied (e.g., selectively) over a wafer, and a set of LED chips is provided over the buffer layer. One role of the buffer layer is to increase a height of at least a subset of the chips. As such, the buffer layer could be applied using any processing method now known or later developed. For example, the buffer layer could be selectively deposited, etched, etc. Regardless, in a typical embodiment, the buffer layer comprises a mesa structure having a thickness less than approximately 100 μm. In addition, the mesa structure is typically constructed from three RGB wafers.02-09-2012
20080303039Mount for a Semiconductor Light Emitting Device - A mount for a semiconductor device includes a carrier, at least two metal leads disposed on a bottom surface of the carrier, and a cavity extending through a thickness of the carrier to expose a portion of the top surfaces of the metal leads. A semiconductor light emitting device is positioned in the cavity and is electrically and physically connected to the metal leads. The carrier may be, for example, silicon, and the leads may be multilayer structures, for example a thin gold layer connected to a thick copper layer.12-11-2008
20080308819Light-Emitting Diode Arrays and Methods of Manufacture - Light-emitting diode arrays, methods of manufacture and displays devices are provided. A representative display device includes: a single LED element type having a single type of semiconductor stack; wherein color layers are located on a light output side of the semiconductor stack, and each color layer is arranged to convert radiation emitted by the single type semiconductor stack into radiation in either a red, a green or a blue portion of the electromagnetic spectrum in dependence on a position of the LED element within the display device.12-18-2008
20080308820Light-Emitting Diode Arrays and Methods of Manufacture - A representative LED array includes: a base substrate (BS) and a plurality of light emitting diodes, each of the light emitting diodes comprising a stack of a first contact layer, a semiconductor stack and a second contact layer, the semiconductor stack being on top of the first contact layer, the second contact layer being on top of the semiconductor stack; the plurality of light emitting diodes being arranged in pixel matrix on the base substrate as LEDs of at least three types (R, G, B); the LEDs according to their type (R, G, B) being arranged as at least a first, second and third sub-pixel in the pixel matrix for emission of radiation of a respective specific at least first, second and third color; and interconnection circuitry on the substrate, operative to connect to the light emitting diodes of the array for addressing each of the light emitting diodes.12-18-2008
20080251799LIGHT EMITTING DEVICE - A visible light emitting device includes: three types of LED elements stacked one on another; and first and second optical filters. Each of the LED elements has a light emitting layer configured to emit light of one of three primary colors. Each of the first and second optical filters is disposed between two adjacent ones of the LED elements, and each of the first and second optical filters is operable to reflect or absorb a shorter wavelength light of the lights emitted from two adjacent LED elements.10-16-2008
20080246043Light-emitting device - A pair of bonding electrodes of each of light-emitting semiconductor devices of RGB is disposed in a point symmetrical relationship, the devices are mounted on a common electrode of a package, and a bonding wire is suspended from a commonized bonding electrode of the respective devices to the common electrode. Bonding wires are suspended from the other bonding electrodes of the respective devices to first to third electrodes on the package which are independent from one another.10-09-2008
20080290352Package for Light Emitting Device - The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base; an insulating layer sandwiched between the meta base and the electrical circuit layer; an electrode layer provided at an upper side of the electrical circuit layer; and a wire for electrically connecting the electrode layer and the light emitting device. Further, there is provided a light emitting device package which is improved in light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.11-27-2008
20130119415LED PACKAGE STRUCTURE FOR ENHANCING MIXED LIGHT EFFECT - An LED package structure for enhancing mixed light effect comprises: at least one first light emitting chip; at least one second light emitting chip, a frame structure having a first containing portion, a second containing portion, a spacing portion and a light mixing area; a first colloid, doped with a green-light phosphor and filled into the first containing portion; a second colloid, filled into the second containing portion; and an encapsulating colloid, packaged and filled into the light mixing area. This design can enhance the light emission efficiency and achieve a uniform light-mixing dot light source.05-16-2013
20130119416LIGHT-EMITTING DIODE AND DISPLAY APPARATUS USING SAME - To provide a light-emitting diode enabling improvements to color purity as well as to luminous efficiency, a light-emitting diode comprises a reflective electrode and a transparent electrode having functional layers therebetween, the functional layers being a transparent conductive layer, a hole injection layer, and a hole transport layer, and further comprises a light-emitting layer emitting blue light and having an electron transport layer layered thereon, such that a total optical layer thickness of the functional layers sandwiched between the reflective electrode and the light-emitting layer is in a range of 455.4 nm to 475.8 nm, inclusive.05-16-2013
20110006317SINGLE MULTI-CHIP LAMP SOURCES AND RELATED METHODS - Multi-chip sources and related methods are disclosed. A single multi-chip lamp source can include a substrate and at least three light emitting diode (LED) chips operably configured to the substrate to form a single LED package. The LED chips can include at least three different colored LED chips. The LED chips can be configured to be actuatable either individually or together to provide selectable colored light beams. The LED chips can be positioned on the substrate such that an emitted light beam remains concentric without shifting regardless of the chip or chips emitting the light beam.01-13-2011
20090152573Textured encapsulant surface in LED packages - A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.06-18-2009
20090152571Array type light-emitting device with high color rendering index - An array type light-emitting device with high color rendering index includes: a substrate, an array type light-emitting module, a plurality of wavelength-converting layers, and a plurality of transparent layers. The array type light-emitting module is composed of a plurality of light-emitting chip rows, and each light-emitting chip row has a plurality of first light-emitting chips and at least one second light-emitting chip. The wavelength-converting layers are respectively covered on the first light-emitting chips. Therefore, a part of visible light emitted by the first light-emitting chips is absorbed and converted into visible light with another emission peak wavelength range via the wavelength-converting layers, and the visible light with another emission peak wavelength range mixes with projecting light projected from the second light-emitting chips to make the array type light-emitting device generate mixed white light with a color rendering index of between 90 and 95.06-18-2009
20090127570Double Wavelength Semiconductor Light Emitting Device and Method of Manufacturing the Same - Provided are a double wavelength semiconductor light emitting device, having an n electrode and p electrode disposed on the same surface side, in which the area of a chip is reduced to increase the number of chips taken from one single wafer, in which light focusing performance of double wavelength optical beams are improved, and in which an active layer of a light emitting element having a longer wavelength can be prevented from deteriorating in a process of manufacturing; and a method of manufacturing the same.05-21-2009
20100200873HIGH EFFICIENT PHOSPHOR-CONVERTED LIGHT EMITTING DIODE - A light-emitting device and manufacturing method thereof are disclosed. The light-emitting device includes a substrate, a semiconductor light-emitting structure, a filter layer, and a fluorescent conversion layer. The method comprises forming a semiconductor light-emitting structure over a substrate, forming a filter layer over the semiconductor light-emitting structure, and forming a fluorescent conversion layer over the filter layer.08-12-2010
20100200872ILLUMINATION DEVICE HAVING MULTIPLE LED ELEMENTS WITH VARYING COLOR TEMPERATURES - An illumination device is provided with an arrangement for reducing color unevenness. A plurality of light-emitting devices are provided, each of which includes a transparent enclosure sealing a light-emitting element and further including a phosphor excited by light emitted from the light-emitting element. A substrate is provided upon which the plurality of light-emitting devices are mounted. The light-emitting devices are provided with predetermined color temperatures that vary in accordance with their position along the substrate to reduce color unevenness, for example increasing in a phased manner from the center of the substrate toward the outer circumference thereof.08-12-2010
20090140272Solid-state light source - A solid-state light source includes at least one stack of light emitting elements. The elements are an inorganic light emitting diode chip and at least one wavelength conversion chip or the elements are a plurality of light emitting diode chips and one or more optional wavelength conversion chips. The wavelength conversion chip may include an electrical interconnection means. The light emitting diode chip may include at least one GaN-based semiconductor layer that is at least ten microns thick and that is fabricated by hydride vapor phase epitaxy. A method is described for fabricating the solid-state light source.06-04-2009
20090014733LIGHT-EMITTING DIODE MODULE - The present invention relates to a light-emitting diode (LED) module (01-15-2009
20120068205LED LIGHT ENGINE AND METHOD OF MANUFACTURE THEREOF - A light emitting diode (LED) light engine includes a solid transparent dome mounted on one or more LED dies to form a base module, a flexible sheath having embedded therein a phosphor that converts light of a first wavelength range to light of a second wavelength range, the sheath being attached to the base module so that the sheath conforms to a light emitting surface of the dome. The sheath emits light of the second wavelength range when the LED is emitting light of the first wavelength range. Further sheaths may be formed each with different phosphors or phosphor blends, and one of the sheaths may be selected to cover the base module depending on the color of light to be produced by the light engine.03-22-2012
20120068204LED MODULE FOR MODIFIED LAMPS AND MODIFIED LED LAMP - An LED module includes a printed circuit board (PCB) or a surface mount device (SMD) mount, an LED chip mounted on the PCB or the SMD mount, a cover mounted on the LED chip and a surface of the PCB or the SMD mount which surrounds the LED chip. The surface of the PCB or the SMD mount on which the spherical cover is mounted may be covered on its side walls with a white reflective material which is in contact with the LED chip.03-22-2012
20120068203LIGHT EMITTING DEVICE - A light emitting device includes a package body, a light emitting diode, a transparent resin material, and a wire. The package body includes a bottom part and a side part. The bottom part includes a first electrode and a second electrode electrically connecting the upper surface and the bottom surface of the bottom part, respectively. The side part includes an upper surface including a trench and a bottom surface being in contact with the upper surface of the bottom part, wherein the upper surface of the bottom part is lower than the upper surface of the side part such that the package body includes a cavity surrounded by the side part, and the bottom surface of the bottom part includes a second opened portion that divides the first electrode and the second electrode, and wherein a portion of the transparent resin material is disposed inside of the trench.03-22-2012
20110140136LED LIGHTING ASSEMBLIES - A lighting assembly for a light emitting diode (LED) package having an LED chip on the top of a mounting substrate with power leads on the top of the mounting substrate arranged proximate to a first edge of the mounting substrate, which is mounted to a base, includes power contacts defining separable interfaces for contacting the power leads on the mating substrate of the LED package and supplying power to the LED chip. The power contacts have compliant beams extending to the separable interfaces that are deflected when contacting the power leads such that the power contacts are biased against the power leads. The power contacts are terminated to corresponding power conductors opposite the separable interfaces. The lighting assembly also includes a dielectric housing holding the power contacts, with the housing having mounting features for securing the housing to the base independent of the LED package.06-16-2011
20090050910FLAT PANEL BASED LIGHT EMITTING DIODE PACKAGE STRUCTURE - The present invention discloses a flat panel based light emitting diode (LED) package structure. The package structure comprises a substrate, a plurality of first LED chips, a plurality of second LED chips and a protective layer. The first LED chips and the second LED chips are located on the substrate, and the second LED chips surround the first LED chips. The protective layer is for covering the first LED chips and the second LED chips. The protective layer has a first sub-structure and a plurality of second sub-structures, wherein the first sub-structure corresponds to the first LED chips, and the second sub-structures correspond to the plurality of second LED chips.02-26-2009
20090050912LIGHT EMITTING DIODE AND OUTDOOR ILLUMINATION DEVICE HAVING THE SAME - A light emitting diode includes a first electrode, a second electrode, at least a first LED chip, at least a second LED chip, and an encapsulant. The second electrode has an opposite polarity with the first electrode and parallel with the first electrode. The first LED chip is electrically connected to the first electrode and the second electrode, for emitting first light of a first wavelength. The second LED chip is electrically connected to the first electrode and the second electrode, for emitting second light of a second wavelength being in a range from 570 nm to 670 nm. The encapsulant encapsulates the first and second LED chip therein, and has a phosphor material doped therein. The phosphor material is configured for emitting white light by excitation of the first light, and the second light is configured for adjusting a color temperature of the combined white light.02-26-2009
20090085048AC LIGHT EMITTING DIODE - Disclosed is a light emitting diode (LED) operated by being directly connected to an AC power source. An AC LED according to the present invention comprises a plurality of light emitting cells two-dimensionally arranged on a single substrate; and wires electrically connecting the light emitting cells; wherein the light emitting cells are connected in series by the wires to form a serial array, the single substrate is a non-polar substrate, and the light emitting cells have non-polar GaN-based semiconductor layers grown on the non-polar substrate.04-02-2009
20090085047Integrated multi-colored LED light source with heatsink and collimator - A LED light source is integrated with a heatsink and a collimator. Four isolated heatsinks form an optical taper in which a single color LED is mounted. The LEDs are arranged to form a reflective light recycling cavity. Up to four different colors can be combined inside the light recycling cavity to form a uniform and homogenous mixing of the colors at the exit aperture of the light recycling cavity and/or the exit aperture of the collimator/heatsink.04-02-2009
20110140139ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display is disclosed. The display includes a substrate, a first electrode placed on the substrate, an organic emissive layer placed on the first electrode, a second electrode placed on the organic emissive layer, and a refractive layer disposed between the substrate and the first electrode. The refractive layer is greater in refractive index than the first electrode.06-16-2011
20110140138ORGANIC LIGHT EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - An organic light emitting display apparatus and a method of manufacturing the same. The display apparatus includes first, second, and third sub-pixels formed on a substrate. The first sub-pixel includes a first pixel electrode, a first transmissive conductive layer formed on the first pixel electrode, a second transmissive conductive layer formed on the first transmissive conductive layer, a first organic light emitting layer formed on the second transmissive conductive layer, and a counter electrode formed on the first organic light emitting layer. The second sub-pixel includes a second pixel electrode, the first transmissive conductive layer formed on the second pixel electrode, a first protector covering an edge of the first transmissive conductive layer, a second organic light emitting layer electrically connected to the first transmissive conductive layer, and the counter electrode formed on the second organic light emitting layer. The third sub-pixel includes a third pixel electrode, a second protector covering an outer edge of the third pixel electrode, a third protector formed on the second protector, a third organic light emitting layer electrically connected to the third pixel electrode, and the counter electrode formed on the third organic light emitting layer.06-16-2011
20110140137LED DEVICE AND METHOD OF MANUFACTURING THE SAME - An LED device includes a heat conductive base, and a red, a green, and a blue LED chips mounted on the base. The red LED chip includes a first n-type GaN layer, a first p-type GaN layer, and a first active layer sandwiched therebetween. The first active layer of the red LED chip is added with europium to generate red light. The green LED chip includes a second n-type GaN layer, a second p-type GaN layer, and a second active layer sandwiched therebetween. The second active layer of the green LED chip is added with indium to generate green light. The blue LED chip includes a third n-type GaN layer, a third p-type GaN layer, and a third active layer sandwiched therebetween. The third active layer of the blue LED chip is added with of indium to generate blue light.06-16-2011
20120104429ORGANIC EL ELEMENT, METHOD FOR MANUFACTURING THE SAME, AND ORGANIC EL DISPLAY DEVICE - An organic EL element includes a substrate 05-03-2012
20120104428SIDE VIEW SURFACE MOUNT LED - A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.05-03-2012
20120104426WHITE CERAMIC LED PACKAGE - The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes. In some embodiments, the structural integrity of the package can also be attributed to indentations along its sides, which do not enable as much plating material to accumulate at the sides and helps package cutting processes during manufacture. The indentations can also contribute to displays having more tightly and densely packed LED arrays.05-03-2012
20110227104ORGANIC EL DISPLAY AND METHOD FOR MANUFACTURING SAME - Provided is an organic EL display manufacturing method which has: a step wherein an organic EL panel having a substrate and organic EL elements arranged in matrix on the substrate is prepared, and each organic EL element is permitted to have a pixel electrode disposed on the substrate, an organic layer disposed on the pixel electrode, a transparent counter electrode disposed on the organic layer, a sealing layer disposed on the transparent counter electrode, and a color filter disposed on the sealing layer; a step of detecting a defective portion on the organic layer in the organic EL element; and a step of breaking the transparent counter electrode in a region on the defective portion of the transparent counter electrode by irradiating the region on the defective portion with a laser beam. The laser beam is radiated by being tilted with respect to the normal line on the display surface of the organic EL panel.09-22-2011
20090250710SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING MULTIPLE SEMICONDUCTOR LIGHT EMITTING ELEMENTS IN A SUBSTRATE CAVITY - Semiconductor light emitting devices include a substrate having a cavity, multiple light emitting devices in the cavity and remote phosphor layers, scattering layers and/or lenses for the light emitting devices.10-08-2009
20090242912MULTIFUNCTIONAL TAPE - A method comprises forming elongate structures (10-01-2009
20100264431YELLOW LIGHT EMITTING DIODE AND LIGHT EMITTING DEVICE HAVING THE SAME - An exemplary yellow light emitting diode (LED) includes a substrate, a LED die, a phosphor layer and an encapsulant. The LED die is arranged on the substrate and comprises an indium gallium aluminum nitride represented by the formula In10-21-2010
20120193657Radiation-Emitting Semiconductor Component - A radiation-emitting semiconductor component includes a light-emitting diode chip with at least two emission regions that can be operated independently of each other and at least two differently designed conversion elements. During operation of the light-emitting diode chips each of the emission regions is provided for generating electromagnetic primary radiation. Each emission region has an emission surface by which at least part of the primary radiation is decoupled from the light-emitting diode chip. The conversion elements are provided for absorbing at least part of the primary radiation and for re-emitting secondary radiation. The differently designed conversion elements are disposed downstream of different emission surfaces. An electric resistance element is connected in series or parallel to at least one of the emission regions.08-02-2012
20120193658ORGANIC LIGHT-EMITTING PANEL, MANUFACTURING METHOD THEREOF, AND ORGANIC DISPLAY DEVICE - A pixel in the panel includes sub-pixels 08-02-2012
20090272989LIGHT EMITTING DEVICE HAVING STACKED MULTIPLE LEDS - A light emitting device and method of producing the same is disclosed. The light emitting device includes a heterostructure having a plurality of light emitting diodes (LEDs) stacked one on top of another.11-05-2009
20090272990Light Mixing Apparatus for Light Emitting Diode - A light mixing apparatus of a light emitting diode (LED) is installed on a light emitting surface of the LED. The light emitted from the LED is mixed by a light mixing module of the light mixing apparatus uniformly for adjusting the light output angle. After the angle increases, the light is scattered into a fixed base of the light mixing apparatus, reflected to a containing groove of the light mixing apparatus by a reflecting layer of the fixed base, and guided into the total internal reflection lens of the containing groove. After the total internal reflection lens gathers the light, the light is projected onto a projected surface. If the LED is made of a multi-chip package, the light mixing apparatus can be used for improving the luminance of a light emitted by the LED onto the projected surface and the uniform distribution of the luminance.11-05-2009
20100148194LIGHT-EMITTING DIODE ILLUMINATING APPARATUS - The invention provides a light-emitting diode illuminating apparatus. The light-emitting diode illuminating apparatus includes a carrier, a substrate, a light-emitting diode chip, a heat-conducting device, and a thermal phase-change material. The carrier includes a top surface and a bottom surface. A first recess is formed on the top surface of the carrier. A second recess is formed on the bottom surface of the carrier. The first recess communicates with the second recess. The substrate is embedded into the second recess. The light-emitting diode chip is disposed on the substrate. The heat-conducting device includes a flat part. And, the substrate is disposed on the flat part.06-17-2010
20100155748Aligned multiple emitter package - A multiple element emitter package is disclosed for increasing color fidelity and heat dissipation, improving current control, increasing rigidity of the package assembly. In one embodiment, the package comprises a surface-mount device a casing with a cavity extending into the interior of the casing from a first main surface is provided. A lead frame is at least partially encased by the casing, the lead frame comprising a plurality of electrically conductive parts carrying a linear array of light emitting devices (LEDs). Electrically conductive parts, separate from parts carrying the LEDs have a connection pad, wherein the LEDs are electrically coupled to a connection pad, such as by a wire bond. This lead frame arrangement allows for a respective electrical signal can be applied to each of the LEDs. The emitter package may be substantially waterproof, and an array of the emitter packages may be used in an LED display such as an indoor and/or outdoor LED screen.06-24-2010
20100181579ASSEMBLY STRUCTURE OF A LIGHT-EMITTING DIODE LIGHT SOURCE AND A POWER SUPPLY INTERFACE - The present invention discloses an light emitting diode (LED) light source and an interface for providing power to the LED. The LED light source includes an LED unit and a second coupling unit. The LED unit includes a base, one or more LED, and a first coupling unit. The LED are attached to the base. The joining of the first and second coupling units provides a mechanical support and electricity to the LED. The LED, are connected with independent circuit loops and controlled by controller to change the brightness of the LED. This structure allows the second coupling unit to be applied to any luminaries or replacement of a traditional light source, thus making the LED unit a universal LED light source for mass production and cost reduction. With the use of various types of LED and electric current control, modulation of brightness, color, and color temperature may be achieved.07-22-2010
20100155749LIGHT-EMITTING DIODE (LED) DEVICES COMPRISING NANOCRYSTALS - The present invention provides light-emitting diode (LED) devices comprises compositions and containers of hermetically sealed luminescent nanocrystals. The present invention also provides displays comprising the LED devices. Suitably, the LED devices are white light LED devices.06-24-2010
20090294782Light emitting diode lamp package structure and assembly thereof - The present invention provides a light emitting diode (LED) lamp package structure characterized in which a plurality of light emitting diodes, a control integrated circuit, a circuit board and four electric conductivity supports are encapsulated inside a package body where the electric conductivity supports are respectively a Vdd pad, a data input pad, a data output pad, and a Vss pad. The present invention further provides a LED lamp assembly, comprising a LED lamp, a lampshade, a socket, and a mount formed with a socket. After the LED lamp is mounted on the socket with the four electric conductivity supports exposed and the socket is plugged into the socket of the mount, the electric conductivity supports would contact the four electrode contacts in the socket where the four electrode contacts are respectively a positive DC voltage electrode, a data input electrode, a data output electrode and a negative DC voltage electrode.12-03-2009
20120032207ORGANIC LIGHT-EMITTING DISPLAY PANEL, DISPLAY DEVICE, AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY PANEL - An organic light-emitting display panel is provided that improves luminous efficiency and luminescent color by adjusting the difference in film thickness between layers of different luminescent colors, such as intermediate layers, when the intermediate layer and light-emitting layers are formed by a wet method. By varying the film thickness of an interlayer insulation film, which is a lower layer of an organic light-emitting element, the volume of a contact hole is varied by color, thereby adjusting the volume of a concavity in each anode plate. When ink that includes material for the intermediate layer, or like, is sprayed by an inkjet method, the film thickness of the intermediate layer, or like, changes in accordance with the amount of ink filing the concavity. Therefore, by adjusting the difference in volume between concavities of different colors, the difference in film thickness between the intermediate layers, or like, is finely adjusted.02-09-2012
20130214306ORGANIC ELECTROLUMINESCENT DEVICE INCLUDING COVERED LOWER ELECTRODE - An emitting device in an organic electroluminescent device is disclosed, in which a lower electrode pattern is formed on a substrate, an emitting layer pattern is formed on the lower electrode pattern, and a transparent electrode is formed on the emitting layer pattern and an emitting body having a structure in which an organic thin film emits light when an application current is applied to it. The pattern of the transparent electrode completely covers and is larger than that of the lower electrode. The pattern of the transparent electrode is formed over the entire area of the pattern of the lower electrode.08-22-2013
20130214307LIGHT EMITTING DEVICE - Light-emitting elements have a problem that their light-extraction efficiency is low due to scattered light or reflected light inside the light-emitting elements. The light-extraction efficiency of the light-emitting elements needs to be enhanced by a new method. According to the present invention, a light-emitting element includes a first layer generating holes, a second layer including a light-emitting layer for each emission color and a third layer generating electrons between an anode and a cathode, and the thickness of the first layer is different depending on each layer including the light-emitting layer for each emission color. A layer in which an organic compound and a metal oxide are mixed is used as the first layer, and thus, the driving voltage is not increased even when the thickness is increased, which is preferable.08-22-2013
20100258823LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to ah electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.10-14-2010
20100213475LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.08-26-2010
20100276706Method for the Production of a Plurality of Optoelectronic Components, and Optoelectronic Component - A method for producing a plurality of optoelectronic devices is specified, comprising the following steps: providing a connection carrier assemblage having a plurality of device regions, wherein at least one electrical connection region is provided in each of the device regions, providing a semiconductor body carrier, on which a plurality of separate semiconductor bodies connected to the semiconductor body carrier are arranged, wherein the semiconductor bodies each have a semiconductor layer sequence having an active region, arranging the connection carrier assemblage and the semiconductor body carrier relative to one another in such a way that the semiconductor bodies face the device regions, mechanically connecting a plurality of semiconductor bodies to the connection carrier assemblage in a mounting region of a device region assigned to the respective semiconductor body, electrically conductively connecting the respective semiconductor body to the connection region of the device region assigned to the semiconductor body, and separating from the semiconductor body carrier the semiconductor bodies that are to be connected or are connected to the connection carrier assemblage, and dividing the connection carrier assemblage into a plurality of separate optoelectronic devices each having a connection carrier, which has the device region, and a semiconductor body arranged on the connection carrier and electrically conductively connected to the connection region.11-04-2010
20100213474ARRAY-TYPE LIGHT-EMITTING DEVICE AND APPARATUS THEREOF - The application discloses an array-type light-emitting device comprising a substrate, a semiconductor light-emitting array formed on the substrate and emitting a first light with a first spectrum, wherein the semiconductor light-emitting array comprises a first light-emitting unit and a second light-emitting units, a first wavelength conversion layer formed on the first light-emitting unit for converting the first light into a third light with a third spectrum, and a circuit layer connecting the first light-emitting unit and the second light-emitting unit in a connection form to make the first light-emitting and the second light-emitting unit light alternately in accordance with a predetermined clock when driving by a power supply.08-26-2010
20100001299LIGHT EMITTING DIODE ILLUMINATING APPARATUS WITH SAME-TYPE LIGHT EMITTING DIODES - A light emitting diode illuminating apparatus for emitting colorful light includes a substrate, a first lighting element, a second lighting element, a third lighting element. The first, second and third lighting elements are juxtaposed at the substrate. The first lighting element includes a first LED chip, and a first filling layer encapsulating it. The first filling layer includes red phosphor generally evenly doped therein. The second lighting element includes a second LED chip and a second filling layer encapsulating it. The third lighting element includes a third LED chip and a third filling layer encapsulating it. All of the first, the second and the third LED chips are the same kind of LED chip selected from the group consisting of GaN LED chips, AlGaN LED chips and InGaN LED chips. Light emitting from the filling layers are capable of mixing to produce light of a uniform color.01-07-2010
20120138978LIGHT-EMITTING DIODE PACKAGE - A light-emitting diode (LED) package includes a first chip group, a second chip group and an optical wavelength converting substance. The first chip group includes a plurality of red LED chips configured for emitting red light. The second chip group includes a plurality of blue LED chips configured for emitting blue light. The optical wavelength converting substance is arranged on light paths of the blue LED chips. The optical wavelength converting substance is configured for partly absorbing blue light emitted from the blue LED chips and emitting visible lights with different wavelengths. The plurality of blue LED chips has a total light output larger than that of the plurality of red LED chips.06-07-2012
20100252842PACKAGE STRUCTURE OF LIGHT EMITTING DIODE FOR BACKLIGHT - A package structure of a light emitting diode for a backlight comprises a long-wavelength LED die and a short-wavelength LED die. The lights emitted from the two LED dies are mixed with the light emitted from excited fluorescent powders for serving as the backlight of a liquid crystal display. A partition plate is disposed between the two LED dies for separating them from each other. The effective light output of the package structure is increased because each of the two LED dies cannot absorb the light from the other.10-07-2010
20100252841OLED DEVICE HAVING IMPROVED LIFETIME AND RESOLUTION - An organic light-emitting diode device, includes a plurality of first patterned electrodes that define a corresponding plurality of light-emitting areas, and one-or-more organic first light-emitting layer(s) formed over the first patterned electrodes. A plurality of second patterned electrodes are formed over the one-or-more first light-emitting layer(s) corresponding to the first patterned electrodes; and one or more organic second light-emitting layer(s) formed over the second patterned electrodes. A third electrode common to the plurality of light-emitting areas is formed over the one-or-more second light-emitting layer(s). Each of the second patterned electrodes is shared between the first and second light-emitting layers so that the first and second patterned electrodes provide current through the first light-emitting layer(s); and each of the second and third electrodes, within each of the plurality of light-emitting areas, provide current through the second light-emitting layer(s) independent of the current through the first light-emitting layer.10-07-2010
20120241780ORGANIC EL PANEL, DISPLAY DEVICE USING SAME, AND METHOD FOR PRODUCING ORGANIC EL PANEL - An organic EL panel includes reflective electrodes, a transparent electrode, organic light-emitting layers, and functional layers that are each provided between a corresponding one of the reflective electrodes and a corresponding one of the respective organic light-emitting layers. The film thicknesses of the respective functional layers of R, G, and B colors are each 60 nm or less such that a local maximum of light-emitting efficiency for a corresponding color is exhibited, and are substantially equal to each other. The optical distances between the respective organic light-emitting layers of the R, G, and B colors and the respective reflective electrodes are each 100 nm or less, and are substantially equal to each other.09-27-2012
20090114932Light Source and Method of Controlling Light Spectrum of an LED Light Engine - A light emitting diode (LED) light engine includes a substrate for supporting the LED light engine. Conductive traces are formed over the substrate using a thick film screen printing, physical vapor deposition, chemical vapor deposition, electrolytic plating, printed circuit board fabricating, or electroless plating process. The conductive traces include mounting pads. LEDs are mounted to each of the mounting pads for electrical interconnection. The LEDs include red LEDs, green LEDs and blue LEDs. Each of the blue LEDs is at least partially covered with a yellow phosphor coating compound. The concentration of the yellow phosphor coating compound is controlled to allow the emission of blue and yellow spectrum light energy from each blue LED. Emissions of light energy from the red LEDs, green LEDs and blue LEDs are combined to achieve a target correlated color temperature and a target color rendering index for the LED light engine.05-07-2009
20100295067LIGHT EMITTING DEVICE WITH COLLIMATING STRUCTURE - The present invention provides a light collimating structure (11-25-2010
20090152574Multi-wavelength white light-emitting structure - A multi-wavelength white light-emitting structure uses a UV light emitting diode chip and a blue light emitting diode chip to excite a red phosphor and a green phosphor and generates a white light-emitting structure having good color rendering. The multi-wavelength white light-emitting structure uses a UV light emitting diode chip that emits light having a wavelength of between 350˜430 nm to excite a red phosphor to emit red light having a wavelength of between 600˜700 nm. The present invention then uses a blue light emitting diode chip that emits light having a wavelength between of 400˜500 nm to emit blue light and uses the blue light emitting diode chip to excite a green phosphor to emit green light having a wavelength of between 490˜560 nm. Mixing the red light, the blue light and the green light forms a white light.06-18-2009
20090039360SOLID-STATE AREA ILLUMINATION SYSTEM - A solid-state area illumination system includes multiple LED devices, each LED device is formed on a separate substrate and each LED device emits differently colored light at different angles relative to the substrate. The peak frequencies of each color of light differ by at least the smallest of the full width half maximums of the frequency distributions of emitted light. Also included is a support for positioning each of the LED devices at multiple orientations relative to an area of illumination upon a surface, so that any point within the area of illumination will receive multiple colors of light from more than one of the LED devices at different angles. Each LED device includes one or more light-emitting elements, each light-emitting element having multiple sizes of core/shell quantum-dot emitters formed in a common polycrystalline semiconductor matrix.02-12-2009
20090114931Light emitting module and method of forming the same - A method for forming a pixel of an LED light source is provided. The method includes following steps: forming a first layer on a substrate; forming a second layer and a first light-emitting active layer on the first layer; exposing a portion of an upper surface of the first layer; forming a third layer on the substrate; forming a fourth layer and a second light-emitting active layer on the third layer; exposing a portion of an upper surface of the third layer; and forming a first electrode on the exposed upper surface of the first layer, a second electrode on a portion of an upper surface of the second layer, a third electrode on the exposed upper surface of the third layer, and a fourth electrode a portion of an upper surface of the fourth layer. The first light-emitting active layer and the second light-emitting active layer emit different colors of light.05-07-2009
20100219429TOP-EMITTING OLED DEVICE WITH LIGHT-SCATTERING LAYER AND COLOR-CONVERSION - A top-emitting OLED device, comprising: one or more OLEDs formed on a substrate; a light-scattering layer formed over the one or more OLEDs; a transparent cover; one or more color filters formed on the transparent cover; a color-conversion material layer formed over the color filters, or formed over or integral with the light-scattering layer; wherein the substrate is aligned and affixed to the transparent cover so that the locations of the color filters and color conversion material correspond to the location of the OLEDs, and the color-conversion material layer, color filters, and the light-scattering layer are between the cover and substrate, and a low-index gap is formed between the light-scattering layer and the color filters, with no light-scattering layer being positioned between the color conversion material layer and the low-index gap, wherein the color-conversion material layer is formed integrally with the light-scattering layer.09-02-2010
20100295069High Luminous Flux Warm White Solid State Lighting Device - A high luminous flux warm white solid state lighting device with a high color rendering is disclosed. The device comprising two groups of semiconductor light emitting components to emit and excite four narrow-band spectrums of lights at high luminous efficacy, wherein the semiconductor light emitting components are directly mounted on a thermal effective dissipation member; a mixing cavity for blending the multi-spectrum of lights; a back-transferred light recycling member deposited on top of an LED driver and around the semiconductor light emitters; and a diffusive member to diffuse the mixture of output light from the solid state lighting device. The solid state lighting device produces a warm white light with luminous efficacy at least 80 lumens per watt and a color rendering index at least 85 for any lighting application.11-25-2010
20100295068LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS USING THE SAME - In one embodiment, the light emitting device package includes a package body, electrodes attached to the package body, and at least two light emitting devices electrically connected to the electrodes. Each light emitting device emits light of a different color from the other light emitting devices. A protective layer is formed over the at least two light emitting devices, and a phosphor layer formed over the protective layer. Other embodiments include other structures such a individual phosphor layers on each light emitting device. And, a light apparatus including a package may include a single driver driving the light emitting devices of the package.11-25-2010
20100308352CARRIER STRUCTURE FOR MOUNTING LED CHIPS - A carrier structure for mounting at least an LED chip includes at least a lead and a base. The LED chip housed inside the base is coupled parallel with an electronic element. The lead is connected electrically to the LED chip at one end, while another end is exposed to the atmosphere. The base encaving the lead further has a shallow accommodation room to mount the electronic element at a surface not the same with the surface that mounts the LED chip.12-09-2010
20110024773LIGHT EMITTING DIODE PACKAGE STRUCTURE AND LEAD FRAME STRUCTURE THEREOF - An LED package structure includes a frame, at least a first LED, and at least a second LED. The frame includes a base having a first cavity and a second cavity, where the second cavity is disposed under the first cavity and the second cavity is smaller than the first cavity. The first LED is disposed in the bottom of the first cavity, and the second LED is disposed in the bottom of the second cavity.02-03-2011
20100133560LIGHT EMITTING DEVICE PACKAGE - A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.06-03-2010
20120132936NITRIDOSILICATE PHOSPHOR TUNABLE LIGHT-EMITTING DIODES BY USING UV AND BLUE CHIPS - The present disclosure provides a radiation device. The radiation device includes a first light emitting diode (LED) operable to emit light having a first central wavelength; a second LED configured adjacent the first LED and operable to emit light having a second central wavelength substantially less than the first central wavelength; and a luminescent material disposed on the first LED and the second LED. The luminescent material includes a strontium silicon nitride (SrSi05-31-2012
20110018011Solid-state light source - A solid-state light source includes at least one stack of light emitting elements. The elements are an inorganic light emitting diode chip and at least one wavelength conversion chip or the elements are a plurality of light emitting diode chips and one or more optional wavelength conversion chips. The wavelength conversion chip may include an electrical interconnection means. The light emitting diode chip may include at least one GaN-based semiconductor layer that is at least ten microns thick and that is fabricated by hydride vapor phase epitaxy. A method is described for fabricating the solid-state light source.01-27-2011
20120032208LIGHT EMISSION DEVICE - A light emission device includes multiple electrically activated solid state emitters (e.g., LEDs) having differing spectral output from one another; and/or phosphor material including one or more phosphors arranged to receive spectral output from at least one of the solid state emitters and to responsively emit a phosphor output, to provide spectral output. In one arrangement, multiple LEDs and multiple phosphors have different peak wavelengths and provide aggregated light output with less than four light emission peaks. In one arrangement, a plot of aggregated output emissions (light intensity versus wavelength) has a non-negative slope between more than two wavelength peaks. In one arrangement, a light emission device generates a user-perceptible transition in color of light at a predetermined time period as an indicative of a need to perform at least one selected task.02-09-2012
20110031515ORGANIC LIGHT-EMITTING DEVICE - The organic light-emitting device of the present invention includes a plurality of organic light-emitting elements including an organic light-emitting element showing a first emission color and at least one organic light-emitting element showing a different emission color from the first emission color, each of the organic light-emitting elements including: a first electrode having a reflective surface; a second electrode placed on a light extraction side and including a semi-transparent layer; an organic compound layer including a light-emitting layer and formed between the first electrode and the second electrode; and a micro cavity structure for resonating light emitted from the light-emitting layer between the reflective surface and the semi-transparent layer, wherein the semi-transparent layer in the organic light-emitting element showing the first emission color is different in thickness and/or material from the semi-transparent layer in the at least one organic light-emitting element showing the different emission colors.02-10-2011
20110018012LED LIGHTING DEVICE - The LED lighting device in this invention comprises a light source, a first face sheet, and a reflection sheet. The light source comprises a plurality of LED chips which are configured to emit lights having wavelengths which are different from each other. The first face sheet has a rear surface. The rear surface is defined as a diffusing and reflecting surface which is being configured to diffuse and reflect the lights which are emitted from the LED chips. The first face sheet is provided with a plurality of apertures. The reflection sheet has a second reflecting surface. The second reflecting surface is configured to reflect the light which is reflected from the diffusing and reflecting surface of the first face sheet toward the first face sheet. Each the aperture is shaped to pass the light which is reflected from the second reflecting surface. Each the aperture is configured to prevent the light which is directly emitted by the light from being passed through the aperture without being subjected to any reflection.01-27-2011
20110114973ORGANIC ELECTROLUMINESCENCE DEVICE AND MULTI-COLOR DISPLAY APPARATUS USING THE SAME - Provided is an organic electroluminescence device which includes an inorganic protective layer having sufficient device protection performance and high light extraction efficiency and which is excellent in water resistance, acid resistance, and mechanical strength. The organic electroluminescence device satisfies:05-19-2011
20110114975LUMINOUS MEANS - A luminous means includes a first group of semiconductor chips and a second group of semiconductor chips, each group includes at least one semiconductor chip, wherein the first and second groups of semiconductor chips are arranged laterally alongside one another at least in part with respect to a main emission direction of the luminous means, and a third group of semiconductor chips which includes at least one semiconductor chip and is disposed downstream of the first and the second group with respect to the main emission direction, wherein each group of semiconductor chips emits electromagnetic radiation in wavelength ranges that differ from one another in pairs, radiation emitted by the third group of semiconductor chips has the shortest-wave wavelength range, radiation emitted by the first and second group of semiconductor chips at least partly passes into the at least one semiconductor chip of the third group, and mixed radiation is emitted by an emission area of the luminous means.05-19-2011
20110114974Organic light emitting diode display - An organic light emitting diode display includes a first electrode and a second electrode, an organic emissive layer disposed between the first electrode and the second electrode, a first selective reflection layer disposed to receive light from the organic emissive layer, and a third transparent electrode, the first selective reflection layer being between the third transparent electrode and the organic emissive layer.05-19-2011
20110079798Light emitting apparatus - A light emitting apparatus includes a plurality of single crystal semiconductor thin films that emit light. The single crystal semiconductor thin films are secured in intimate contact to the surface of a substrate or a bonding layer formed on the substrate. A first conductive electrode is formed on the single crystal semiconductor thin film and is connected to a first conductive side metal layer. The first conductive side metal layer is closer to the surface of the substrate than a top surface of the single crystal semiconductor thin film. A second conductive electrode is formed on the single crystal semiconductor thin film. A second conductive side metal layer is connected to the second conductive electrode. The second conductive side metal layer is closer to the surface of the substrate than the top surface of the single crystal semiconductor thin film.04-07-2011
20100219427LIGHT-EMITTING APPARATUS - Provided is a light-emitting apparatus in which light extraction efficiency of a light-emitting device is improved and viewing angle dependency of an emission color is reduced. The light-emitting apparatus includes a cavity structure and a periodic structure. When guided-wave light is diffracted by the periodic structure in a direction that forms an angle which is larger than 90° and smaller than 180° relative to a guided-wave direction of an optical waveguide in the cavity structure, a wavelength of the diffracted light becomes longer as the diffraction angle increases.09-02-2010
20110241036LIGHT-EMITTING APPARATUS - Provided is a light-emitting apparatus including a plurality of light-emitting devices arranged on a substrate, the plurality of light-emitting devices each including a pair of electrodes and an organic emission layer which is interposed between the pair of electrodes with one of the pair of electrodes serving as an anode and another one of the pair of electrodes serving as a cathode, wherein one of the pair of electrodes is an electrode common to the plurality of light-emitting devices, and wherein, of the plurality of light-emitting devices, ones that have the common electrode as their anodes and ones that have the common electrode as their cathodes are arranged alternately.10-06-2011
20110084293MULTI-GRAIN LUMINESCENT CERAMICS FOR LIGHT EMITTING DEVICES - A ceramic body is disposed in a path of light emitted by a light source. The light source may include a semiconductor structure comprising a light emitting region disposed between an n-type region and a p-type region. The ceramic body includes a plurality of first grains configured to absorb light emitted by the light source and emit light of a different wavelength, and a plurality of second grains. For example, the first grains may be grains of luminescent material and the second grains may be grains of a luminescent material host matrix without activating dopant.04-14-2011
20110084290ORGANIC EL DISPLAY AND METHOD FOR MANUFACTURING SAME - An object of this invention is to provide a top-emission type organic EL display in which filling defects of a resin filler material are alleviated during bonding of an organic EL emission panel and a color conversion filter panel with the resin filler material, as well as to provide a method for manufacturing such an organic EL display. An organic EL display of this invention is characterized in having stripe-shaped barrier walls for inkjet application placed on a color conversion filter panel, and a filler material guide wall placed between the length-direction end portions of the barrier walls for inkjet application and a peripheral seal member.04-14-2011
20110084289ACTIVE DEVICE ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF - An active device array substrate including a substrate, a plurality of scan lines, a plurality of data lines, a plurality of active devices, a first passivation layer, a transparent pad layer, a plurality of color filter patterns, a second passivation layer, a plurality of pixel electrodes, and a black matrix layer is provided. Each of the active devices is electrically connected to one of the scan lines and one of the data lines, respectively. The transparent pad layer having a plurality of openings for accommodating the color filter patterns is disposed on the first passivation layer located above the scan lines and the data lines. The first passivation layer, the color filter patterns and the second passivation layer have a plurality of contact windows therein. The black matrix layer is disposed above the transparent pad layer to cover a portion of the pixel electrodes.04-14-2011
20110210351SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING MULTI-CELL ARRAY AND METHOD FOR MANUFACTURING THE SAME - A semiconductor light emitting device includes: a substrate; a plurality of light emitting cells arranged on the substrate, each of the light emitting cells including a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer disposed therebetween to emit blue light; an interconnection structure electrically connecting at least one of the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer of the light emitting cell to at least one of the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer of another light emitting cell; and a light conversion part formed in at least a portion of a light emitting region defined by the plurality of light emitting cells, the light conversion part including at least one of a red light conversion part having a red light conversion material and a green light conversion part having a green light conversion material.09-01-2011
20110241037LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Provided are a light emitting device and a light emitting device package having the same. The light emitting device includes a first light emitting structure layer including a plurality of semiconductor layers, a first electrode on the first light emitting structure layer, a first insulation layer under the first light emitting structure layer, a second light emitting structure layer including a plurality of semiconductor layers under a first reflective layer, a second reflective layer under the second light emitting structure layer, a bonding layer between the second light emitting structure layer and the first reflective layer, and a plurality of connection members connecting the first light emitting structure layer to the second light emitting structure layer in parallel.10-06-2011
20090218580STRUCTURE OF AC LIGHT-EMITTING DIODE DIES - A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.09-03-2009
20110248296LIGHT EMTTING DEVICE - Disclosed herein is a light emitting device. The light emitting device includes a light emitting diode disposed on a substrate to emit light of a first wavelength. A transparent molding part encloses the LED, a lower wavelength conversion material layer is disposed on the transparent molding part, and an upper wavelength conversion material layer is disposed on the lower wavelength conversion material layer. The lower wavelength conversion material layer contains a phosphor converting the light of the first wavelength into light of a second wavelength longer than the first wavelength, and the upper wavelength conversion material layer contains a phosphor converting the light of the first wavelength into light of a third wavelength, which is longer than the first wavelength but shorter than the second wavelength. Light produced via wavelength conversion is prevented from being lost by the phosphor. Light emitting devices including a multilayer reflection minor are also disclosed.10-13-2011
20100065864WHITE POINT COMPENSATED LEDS FOR LCD DISPLAYS - A backlight for a color LCD includes white light LEDs formed using a blue LED die with a layer of red and green phosphors over it. The attenuation by the LCD layers of the blue light component of the white light is typically greater as the blue wavelength becomes shorter. In order to achieve a uniform blue color component across the surface of an LCD screen and achieve uniform light output from one LCD to another, the blue light leakage of the phosphor layer is tailored to the dominant or peak wavelength of the blue LED die. Therefore, the white points of the various white light LEDs in a backlight should not match when blue LED dies having different dominant or peak wavelengths are used in the backlight. The different leakage amounts through the tailored phosphor layers offset the attenuation vs. wavelength of the LCD layers.03-18-2010
20110101386DISPLAY APPARATUS AND METHOD OF PRODUCING SAME - To further improve light extraction efficiency, a light-emitting apparatus includes a cavity for resonating light emitted from a emission layer between a first reflective surface and a second reflective surface. The first reflective surface is located on a first electrode side relative to the emission layer. The second reflective surface is located on a second electrode side relative to the emission layer. A periodic structure for extracting, to outside of a light-emitting device, light which is generated from the emission layer and wave-guided in an in-plane direction of the light-emitting device between the first reflective surface and the second reflective surface is formed in the first reflective surface, or in the second reflective surface, or between the first reflective surface and the second reflective surface.05-05-2011
20110101388LIGHT EMITTING DEVICE - It is an object of the present invention to provide a light emitting device which is less affected by a malfunction caused in a light emitting element. It is another object of the invention to provide a light emitting device in which light emitting elements are connected in series. As to a light emitting device of the invention, groups of circuits each having a light emitting element and a limiter are connected in parallel. Here, a light emitting element and a limiter are connected in series. The number of the circuits may be at least two or more. Further, each circuit group includes at least one light emitting element.05-05-2011
20110101387LIGHT EMITTING DEVICE AND IMAGE DISPLAY DEVICE - By a light emitting device including a light emitting element, and a semiconductor phosphor microparticle having a core/shell structure having a shell part absorbing at least a part of the light emitted by the light emitting element, and an image display device including a light emitting element, and a semiconductor phosphor microparticle having a core/shell structure having a shell part that absorbs at least a part of the light emitted by the light emitting element, a light emitting device and an image display device having high luminous efficiency are provided.05-05-2011
20110062462Novel Device Structure - Organic light emitting devices are provided having multiple subpixels. An organic spacer layer is provided in at least one subpixel to protect the emissive layer of the at least one subpixel from overspray due to the deposition of a different emissive layer in a nearby subpixel. More generally, a first device is provided, where the first device comprises a multicolor organic light emitting device. The first device may be the multicolor organic device itself. Or, the first device may be a larger device, such as a consumer device, that includes one or many of the multicolor organic devices. The multicolor organic light emitting, device further comprises multiple subpixels. In the most general case, there are at least a first subpixel and a second subpixel.03-17-2011
20090026469LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - The light-emitting device of the present invention is a light-emitting device having a plurality of pixels that comprises a light-emitting function layer of at least one layer that emits light in accordance with a supplied current, a first electrode layer of a conductive material provided at one surface of the light-emitting function layer, and being transparent to at least part of a wavelength range of light emitted from the light-emitting function layer, a second electrode layer provided facing the first electrode layer on the other surface of the light-emitting function layer, including conductive material, and being transparent to at least part of the wavelength range of light emitted from the light-emitting function layer, and a reflecting layer provided on the second electrode layer, and being reflective to at least part of the wavelength range of light emitted from the light-emitting function layer.01-29-2009
20110248294NOVEL OLED DISPLAY ARCHITECTURE - A device that may be used as a multi-color pixel is provided. The device has a first organic light emitting device, a second organic light emitting device, a third organic light emitting device, and a fourth organic light emitting device. The device may be a pixel of a display having four sub-pixels. The first device may emit red light, the second device may emit green light, the third device may emit light blue light and the fourth device may emit deep blue light. The device includes a first device plane and a second device plane. The first device plane comprises a plurality of the first organic light emitting device and a plurality of the second organic light emitting device. The second device plane comprises a plurality of at least one of the third organic light emitting device and the fourth organic light emitting device. The planes of the first and second device planes are parallel. The second device plane is transposed from the first device plane in a direction perpendicular to the planes of the first and second device planes. The first and second device planes are superposed.10-13-2011
20100264433SYSTEM FOR DISPLAYING IMAGES - A system for displaying images is provided. The system includes a tandem electroluminescent device having a first electrode. N electroluminescent units are disposed on the first electrode in sequence, wherein N is an integral and not less than 10-21-2010
20110248295Lamp - In at least one embodiment of the luminous means (10-13-2011
20110248292LIGHTING DEVICE - A lighting device is provided. The lighting device comprises a first substrate and a plurality of second substrates. The plurality of second substrates are separately and electrically connected to the first substrate and comprise a light emitting device.10-13-2011
20110147770ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display includes: a substrate main body having a plurality of pixel regions, each including an opaque region and a transparent region; and organic light emitting diodes, thin film transistors, and conductive lines that are formed in the opaque region of the substrate main body. The transparent region includes a transparent square space that has an area that is at least 15% of the entire area of the pixel region.06-23-2011
20090001391LIGHT EMITTING PANEL, DISPLAY DEVICE AND LIGHT SOURCE DEVICE - A light emitting panel includes a plurality of light emitting element arrays each of which has a plurality of light emitting elements arranged in a plane. The light emitting element arrays are configured so that an arrangement plane of the light emitting elements of one light emitting element array is overlapped with another arrangement plane of the light emitting elements of another light emitting element array in substantially parallel to each other, and so that the light emitting elements of one light emitting element array and the light emitting elements of another light emitting element array emit lights to the same side.01-01-2009
20090001392LIGHT EMITTING DEVICE - A light emitting device is provided. The light emitting device comprises: a package body comprising a multilayer cavity; a first light emitting part comprising a first light emitting device in a first cavity of a first layer area of the multilayer cavity; and a second light emitting part comprising a second light emitting device in a second cavity of a second layer area higher than the first layer area.01-01-2009
20090001390Matrix material including an embedded dispersion of beads for a light-emitting device - A light-emitting device has a light source disposed on a support. A matrix material including a dispersion of beads is disposed over the light source. The refractive index of the beads is different from the refractive index of the matrix material. The light source may include an LED. The matrix material may include a lens.01-01-2009
20090001389HYBRID VERTICAL CAVITY OF MULTIPLE WAVELENGTH LEDS - A solid state device (01-01-2009
20080246042Pixel structure and method for forming the same - A pixel structure comprising at least one transistor, a first storage capacitor, a first conductive layer, an interlayer dielectric layer, a second conductive layer, a passivation layer, and a third conductive layer is provided. The first storage capacitor is electrically connected to the transistor. The interlayer dielectric layer having at least one first opening covers the first conductive layer. The second conductive layer is formed on a part of the interlayer dielectric layer and is electrically connected to the first conductive layer through the first opening. The passivation layer having at least one second opening covers the transistor and the second conductive layer. The third conductive layer is formed on a part of the passivation layer and is electrically connected to the transistor through the second opening. The first storage capacitor is formed by the third conductive layer, the passivation layer, and the second conductive layer.10-09-2008
20110037084LENS-MOUNTED LIGHT EMITTING UNIT - In a lens-mounted light emitting unit comprising LED elements of multiple light colors, narrow-angle light distribution is enabled, and color mixing properties are improved. The lens-mounted light emitting unit 02-17-2011
20080315219LIGHT EMITTING DIODE LIGHT SOURCE DEVICE - A light emitting diode (LED) light source device includes a plurality of LED modules, a base and a clip. The base has a first base body, a second base body, and a third base body. The second base body and the third base body extend from two sides of the first base body and are corresponding to each other. The LED modules are provided at inside surfaces of the first base body, the second base body and the third base body. The clip holds the LED modules and fastens the second base body and the third base body to enable the LED modules to be tightly assembled at the base.12-25-2008
20090146158Package for Light Emitting Device and Method for Packaging the Same - There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increased.06-11-2009
20090101923SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE USING THE SAME - There is provided a semiconductor light emitting device, a method of manufacturing the same, and a semiconductor light emitting device package using the same. A semiconductor light emitting device having a first conductivity type semiconductor layer, an active layer, a second conductivity type semiconductor layer, a second electrode layer, and insulating layer, a first electrode layer, and a conductive substrate sequentially laminated, wherein the second electrode layer has an exposed area at the interface between the second electrode layer and the second conductivity type semiconductor layer, and the first electrode layer comprises at least one contact hole electrically connected to the first conductivity type semiconductor layer, electrically insulated from the second conductivity type semiconductor layer and the active layer, and extending from one surface of the first electrode layer to at least part of the first conductivity type semiconductor layer.04-23-2009
20080277676Light emitting diode using semiconductor nanowire and method of fabricating the same - Provided are a light emitting diode (LED) using a Si nanowire as an emission device and a method of fabricating the same. The LED includes: a semiconductor substrate; first and second semiconductor protrusions disposed on the semiconductor substrate to face each other; a semiconductor nanowire suspended between the first and second semiconductor protrusions; and first and second electrodes disposed on the first and second protrusions, respectively.11-13-2008
20100283068Colour Optoelectronic Device - An organic light emitting diode microdisplay device comprises a substrate including active circuitry (11-11-2010
20120199857Wafer-Scale Emitter Package Including Thermal Vias - Improved packages for light emitters may be fabricated at the wafer level. The package can be a single device or an array of die. The package includes a thermal via that extends through the thickness of the package substrate. The thermal via may be made of a material possessing a high thermal conductivity. The thermal via may be wider at the package exterior than at the interior to provide heat spreading between the device and its heat sink. The taper angle of the thermal via may be around 45 degrees to match the natural spread of heat in a solid. The thermal via may extend above the package interior, so its height is sufficient to position an emitter placed thereon at one foci of a parabola, where the vertex of the parabola is at the surface of the package substrate from which the thermal via extends.08-09-2012
20120168787ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE - An organic electroluminescent display device which satisfies all of chromatic purity, transmission factor, reduction in reflection, and reflected color in balance at low cost is provided. An organic electroluminescent (EL) display device includes: a main substrate; an organic light-emitting layer formed above the main substrate and including a red light-emitting layer which emits red light, a green light-emitting layer which emits green light, a blue light-emitting layer which emits blue light, and a bank which is a non-light emitting region; a first light-adjusting layer formed above the blue light-emitting layer and the bank, which selectively transmits the blue light and selectively absorbs the green light and the red light; and a second light-adjusting layer formed above the red light-emitting layer and the green light-emitting layer, which selectively absorbs the blue light and selectively transmits the green light and the red light.07-05-2012
20120199856ORGANIC ELECTRO-LUMINESCENCE DISPLAY DEVICE - An organic electro-luminescence (EL) display device according to the present invention includes: a main substrate; a display section provided above the main substrate and including a red light-emitting layer, a green light-emitting layer, a blue light-emitting layer, and a bank; a blue color filter provided above the display section, which selectively transmits blue light and selectively absorbs green light and red light; and a red color filter provided above the display section, which selectively transmits the red light and selectively absorbs the blue light and the green light, wherein the blue color filter has openings each at a position corresponding to the red light-emitting layer or the green light-emitting layer, and the red color filter has openings each at a position corresponding to the green light-emitting layer or the blue light-emitting layer.08-09-2012
20100320486LIGHT-EMITTING DEVICE ARRAY WITH INDIVIDUAL CELLS - A light-emitting device and a method for manufacturing the light-emitting device is disclosed. Such a light-emitting device comprises a substrate, a plurality of cells disposed on the substrate, and a plurality of semiconductor dice, wherein each of the plurality of cells accommodates at least one of the plurality of dice. Each of the plurality of cells may be filled with an encapsulant, phosphor or a mixture of an encapsulant with phosphor to control light characteristics of the light-emitting device. In an alternative aspect, cells may be filled with an encapsulant, and comprise a transparent cover coated with or filled with phosphors to control light characteristics of the light-emitting device.12-23-2010
20130168709LIGHT EMITTING DIODE DEVICE WITH MULTIPLE LIGHT EMITTING DIODES - A light emitting diode (LED) device includes a substrate having a top surface, a first LED and a second LED arranged on the top surface of the substrate, and a lens arranged over the light emitting surface of the first and second LEDs. The first and second LEDs each have a light emitting surface away from the top surface of the substrate. A first wavelength of light emitted from the first LED is shorter than a second wavelength of light emitted from the second LED. The lens includes a convergent part located right above the second LED and a divergent part located right above the first LED.07-04-2013
20130168710SEMICONDUCTOR LIGHT SOURCE DEVICE - A semiconductor light source device is provided. The semiconductor light source device includes a light guide, at least one semiconductor light source set and at least one light transformation coupler. The light transformation coupler is disposed between the semiconductor light source set and the light guide for guiding the light emitted from the semiconductor light source set to the light guide. The light transformation coupler has an inclined surface and a curved surface. The inclined surface is a multi-level inclined surface with several slopes.07-04-2013
20110133226Organic light emitting diode device - An organic light emitting diode device including an anode, a cathode facing the anode, and a light emitting member between the anode and cathode, wherein the light emitting member includes at least two light emitting units displaying the same or different color as one another, and a charge-generation layer between the at least two light emitting units, the charge-generation layer including a first charge-generation layer and a second charge-generation layer that each include an undoped material, and wherein the first charge-generation layer has an ionization energy that is about the same as or less than an electron affinity of the second charge-generation layer.06-09-2011
20110133227ORGANIC LIGHT EMITTING DIODE DEVICE - An organic light emitting diode device is disclosed. The organic light emitting diode device includes a light emitting layer which includes at least two blue light emitting units and at least one orange light emitting unit. Such a device exhibits excellent color characteristic and high luminance and efficiency, as well as a longer life span due to the materials used. In particular, the white light represents color of high color purity after it passes through a color filter.06-09-2011
20110133225LIGHT COLLECTION SYSTEM FOR AN LED LUMINAIRE - A light beam collection engine 06-09-2011
20110084291ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display includes a substrate main body, a plurality of organic light emitting diodes formed on the substrate main body, and a differential capping layer covering the plurality of organic light emitting diodes, the differential capping layer having a plurality of thicknesses. The differential capping layer has first regions with a thickness of 90 nm to 120 nm, and second regions with a thickness smaller than the thickness of the first regions.04-14-2011
20100117102LIGHT EMITTING DIODES AND BACKLIGHT UNIT HAVING THE SAME - The LED assembly has an LED chip, 2 via holes and 2 metal electrodes. The LED chip is attached to a front surface of the substrate. 2 via holes penetrate the front surface and a rear surface of the substrate opposite to the front surface, and 2 metal electrodes extend from the front surface to the rear surface through the via holes, respectively. The LED chip has an N-electrode and a P-electrode. The N-electrode and the P-electrode are electrically connected to the metal electrodes via wires, respectively, and the metal electrodes have exposed portions on the rear surface, respectively.05-13-2010
20110095312Semiconductor Device and Method of Manufacturing the Same - An object of the present invention is to provide a semiconductor device having high operation characteristic and reliability.04-28-2011
20100059767Surface Light-Emitting Device and Display Device Using the Same - A surface light-emitting device is disclosed, in which a plurality of spot light sources are arranged along the side surface of a housing of the device, and the light emitted from the spot light sources located at the end portions of the spot light source sequence emits a lower light flux than the average light flux of the light emitted from the other spot light sources. The spot light source sequence is, for example, an LED array including an alignment of light-emitting diodes (LEDs). The LED array includes two groups of LED elements arranged in a predetermined repetitive pattern from one and the other ends, respectively, of the LED array, and at least an LED emitting low light flux is arranged at a predetermined position in the vicinity of the center of the array. As a result, the requirement for a reduced thickness and a narrower frame can be met, while at the same time producing the white light of uniform chromaticity over the whole light-emitting surface.03-11-2010
20110260181Mounting structure for LEDs, LED assembly, LED assembly socket, method for forming a mounting structure - A mounting structure for at least one LED has a substrate made of silicon and/or another semiconductor, wherein at least one mounting portion formed in a front surface of the substrate for mounting at least one LED chip thereon, and cooling grooves or channels for a cooling fluid are formed in the substrate, preferably in or beneath a rear surface thereof.10-27-2011
20110186879MULTIFUNCTIONAL TAPE - A method comprises forming elongate structures (08-04-2011
20110186875LED PACKAGE - According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.08-04-2011
20110186876Semiconductor light emitting device and image forming apparatus - A semiconductor light emitting device includes laminated semiconductor light emitting elements. A first semiconductor light emitting element is provided on a mounting substrate via a reflection metal layer, and is configured to emit light of first wavelength. A first light-transmissive planarization insulating film is provided covering the first semiconductor light emitting element, and is configured to transmit the light of the first wavelength. A second semiconductor light emitting element is provided on the first semiconductor light emitting element via the first light-transmissive planarization insulating film. The second semiconductor light emitting element is configured to transmit the light of the first wavelength and to emit light of second wavelength. The second semiconductor light emitting element includes a first semiconductor multilayer reflection film facing the first semiconductor light emitting element, which is configured to transmit the light of the first wavelength and to reflect the light of the second wavelength.08-04-2011
20110186878LIGHT-EMITTING DEVICE, ILLUMINATION APPARATUS, AND DISPLAY APPARATUS - A light-emitting device includes: an organic layer which is interposed between a first electrode and a second electrode and in which a first light-emitting layer and a second light-emitting layer emitting light of single colors or two or more different colors in a visible wavelength region are sequentially included at mutually separated positions in that order in a direction from the first electrode to the second electrode; a first reflective interface which is provided on the side of the first electrode so as to reflect light emitted from the first light-emitting layer and the second light-emitting layer to be emitted from the side of the second electrode; and a second reflective interface and a third reflective interface which are sequentially provided on the side of the second electrode at mutually separated positions in that order in a direction from the first electrode to the second electrode.08-04-2011
20110186877LIGHT EMITTING DIODE WITH BONDED SEMICONDUCTOR WAVELENGTH CONVERTER - An electroluminescent device emits light at a pump wavelength. A first photoluminescent element covers first and second regions of the electroluminescent device and converts at least some of the pump light from the first region of the electroluminescent device to light at a first wavelength. A second photoluminescent element covers the second region of the electroluminescent device without covering the first region of the electroluminescent device and converts at least some of the light of the pump wavelength to light at a second wavelength different from the first wavelength. In some embodiments the first and second photoluminescent elements convert substantially all of the pump light incident from the first and second regions of the electroluminescent device respectively. An etch-stop layer may separate the first and second photoluminescent elements.08-04-2011
20100025700WARM WHITE LIGHT EMITTING APPARATUS AND BACK LIGHT MODULE COMPRISING THE SAME - A warm white light emitting apparatus includes a first light emitting diode (LED)-phosphor combination to generatea base light that is white or yellowish white and a second LED-phosphor combination to generate a Color Rendering Index (CRI) adjusting light. The base light the CRI adjusting light together make a warm white light having a color temperature of 2500 to 4500K.02-04-2010
20100025699LIGHT EMITTING DIODE CHIP PACKAGE - A light emitting diode (LED) chip package is provided. The LED chip package comprises a carrier, a first LED chip, a second LED chip and an encapsulant. The first LED chip is disposed on and electrically connected to the carrier, wherein the first LED chip is adapted for emitting a first light. The second LED chip is disposed on and electrically connected to the carrier, wherein the second LED chip is adapted for emitting a second light. The encapsulant has a doped phosphor, and encapsulates the first LED chip and the second LED chip, wherein the first light is adapted for exciting the doped phosphor to emit a third light.02-04-2010
20110215349LIGHT EMITTING DEVICE AND LIGHT UNIT HAVING THE SAME - A light emitting device includes a body having a recess; a barrier section protruding upward over a bottom surface of the recess and dividing the bottom surface of the recess into a plurality of regions; a plurality of light emitting diodes including a first diode disposed in a first region of the bottom surface of the recess and a second diode disposed in a second region of the bottom surface of the recess; a plurality of lead electrodes spaced apart from each other in the recess and selectively connected to the light emitting diodes; wires connecting the lead electrodes to the light emitting diodes; a resin layer in the recess; and at least one concave part in the barrier section. The concave part has a height lower than a top surface of the barrier section and higher than the bottom surface of the recess and the wires are provided in the concave part to connect the lead electrodes to the light emitting diodes disposed in opposition to each other.09-08-2011
20110215348Reflection Mode Package for Optical Devices Using Gallium and Nitrogen Containing Materials - An optical device includes an LED formed on a substrate and a wavelength conversion material, which may be stacked or pixilated, within vicinity of the LED. A wavelength selective surface blocks direct emission of the LED device and transmits selected wavelengths of emission caused by an interaction with the wavelength conversion material.09-08-2011
20100219428WARM WHITE LIGHT EMITTING APPARATUS AND BACK LIGHT MODULE COMPRISING THE SAME - A warm white light emitting apparatus includes a first light emitting diode (LED)-phosphor combination to generate a base light that is white or yellowish white and a second LED-phosphor combination to generate a Color Rendering Index (CRI) adjusting light. The base light and the CRI adjusting light together make a warm white light having a color temperature of 2500 to 4500K.09-02-2010
20090101922LED ARRANGEMENT FOR PRODUCING PURE MONOCHOMATIC LIGHT - In an LED arrangement, two or more LEDs are particularly positioned for the color lights emitted therefrom to be fully mixed to produce a pure monochromatic light. The LEDs may include at least two identical LEDs, and each of the LEDs includes at least two light emitting chips that separately emit a different color light. The LEDs are positioned in a particular manner, so that the light emitting chips located in different LEDs at the same corresponding positions emit different lights. In this manner, the color lights emitted from the LEDs are fully overlapped and mixed to produce a pure monochromatic light having increased illumination intensity and area.04-23-2009
20100127282Light Emitting Diode Module with Three Part Color Matching - A light emitting diode module is produced using at least one light emitting diode (LED) and at least two selectable components that form or are part of a light mixing chamber that surrounds the LEDs and includes an output port. A first selectable component has a first type of wavelength converting material with a first wavelength converting characteristic and a second selectable component has a second type of wavelength converting material with a different wavelength converting characteristic. The first and second wavelength converting characteristics alter the spectral power distribution of the light produced by the LED to produce light through the output port that has a color point that is a predetermined tolerance from a predetermined color point. Moreover, a set of LED modules may be produced such that each LED module has the same color point within a predetermined tolerance. The LED module may be produced by pre-measuring the wavelength converting characteristics of the different components selecting components with wavelength converting characteristics that convert the spectral power distribution of the LED to a color point that is a predetermined tolerance from a predetermined color point.05-27-2010
20120146066HIGH EFFICIENCY LEDS AND LED LAMPS - The present invention relates to a light emitting device comprising a plurality of electrically coupled light emitting elements, wherein each light emitting element has a luminous efficacy vs. current characteristic, wherein said luminous efficacy vs. current characteristic has a maximum luminous efficacy value and wherein at least one of said light emitting devices is operated at a current corresponding to a luminous efficacy value that is within 10% of said maximum luminous efficacy value. The present invention also relates to methods of making said light emitting device, to lamps comprising said light emitting device and to methods of operating said light emitting device.06-14-2012
20090173955WHITE LIGHT EMITTING DEVICE - The invention relates to a monolithic white light emitting device using wafer bonding or metal bonding. In the invention, a conductive submount substrate is provided. A first light emitter is bonded onto the conductive submount substrate by a metal layer. In the first light emitter, a p-type nitride semiconductor layer, a first active layer, an n-type nitride semiconductor layer and a conductive substrate are stacked sequentially from bottom to top. In addition, a second light emitter is formed on a partial area of the conductive substrate. In the second light emitter, a p-type AlGaInP-based semiconductor layer, an active layer and an n-type AlGaInP-based semiconductor layer are stacked sequentially from bottom to top. Further, a p-electrode is formed on an underside of the conductive submount substrate and an n-electrode is formed on a top surface of the n-type AlGaInP-based semiconductor layer.07-09-2009
20090321755NANOCRYSTAL MIXTURE AND LIGHT-EMITTING DIODE USING THE SAME - Disclosed is a light-emitting device. The light-emitting device comprises a blue light-emitting source and a light-emitting source. The light-emitting source includes first semiconductor nanocrystals and second semiconductor nanocrystals. The first and second nanocrystals emit lights of different wavelengths from each other to produce a color complementary to blue. The first and second semiconductor nanocrystals are spatially clustered to form first and second composites respectively.12-31-2009
20110073885ORGANIC ELECTROLUMINESCENT DEVICE - An electroluminescent device includes: first to third pixel regions; a first electrode in each of the first to third pixel regions, wherein the first electrode of the third pixel region has a first thickness, the first electrode of the first pixel region has a second thickness less than the first thickness, and the first electrode of the second pixel region has a third thickness less than the second thickness; a second electrode in each of the first to third pixel regions; at least two electroluminescent units in each of the first and third pixel regions and disposed between the first electrode and second electrode, wherein one of the at least two electroluminescent units includes a blue light emitting layer and the other of the at least two electroluminescent units include a red/green light emitting layer; and a charge generation layer disposed between the at least two electroluminescent units.03-31-2011
20110073884ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display is disclosed. The organic light emitting diode display includes a plurality of subpixels that emit light of at least three colors, the plurality of subpixels each including a first electrode, an organic light emitting layer, and a second electrode. Each of the organic light emitting layers of at least two of the plurality of subpixels includes at least two electron transport layers. The organic light emitting layer of at least one of the plurality of subpixels includes at least one electron transport layer.03-31-2011
20120305953Mixed Light Source - A mixed light source comprising: a first radiation source, which emits radiation in the red spectral range; an excitation source, which contains a III-V semiconductor material; and a conversion substance, which, during the operation of the mixed light source, converts the radiation of the excitation source at least partly into radiation whose color locus in the CIE chromaticity diagram lies within a polygon spanned by the coordinates (0.1609; 0.497), (0.35; 0.6458), (0.558; 0.444) and (0.453; 0.415).12-06-2012
20100308353DOUBLE SIDED ORGANIC LIGHT EMITTING DIODE (OLED) - The invention relates to a double sided light emitting diode device (12-09-2010
20110068354High power LED lighting device using high extraction efficiency photon guiding structure - The present invention discloses a high power light emitting device using a high extraction efficiency photon-guiding structure for producing high-efficiency white light output with large viewing angle and large amount of light emitted from the side surfaces so that they can provide different light patterns for different applications such as street lighting, parking lighting, tunnel lighting, and etc., as they are used with a reflector. The emitter consists of a leadframe package or chip-on-board substrate, plurality of LED chips, silicone encapsulation material containing phosphor materials to convert short wavelength LED-emanated light to longer wavelength of light, a photon-guiding structure that enhances the efficiency of the LED package and provides light output with large viewing angle.03-24-2011
20120205684Light Emitting Element and Light Emitting Device Using the Element - A first light emitting element 08-16-2012
20120043565DISPLAY DEVICE AND METHOD OF PRODUCING THE SAME - A display device includes: a substrate; a plurality of light-emission elements arranged, on the substrate, in a first direction and a second direction intersecting each other, each of the light-emission elements having a first electrode layer, an organic layer including a luminous layer, and a second electrode layer which are laminated in that order; and a separation section disposed, on the substrate, between the light-emission elements adjacent to each other in the first direction, the separation section having two or more pairs of steps. The first electrode layers in the light-emission elements are separated from each other, and the organic layers as well as the second electrode layers in the light-emission elements adjacent to each other in the first direction are separated from each other by the steps included in the separation section.02-23-2012
20100181580LIGHT EMITTING APPARATUS - A light emitting apparatus including a light emitting element of a gallium nitride based semiconductor and a light converter absorbing a part of primary light emitted from the light emitting element to emit secondary light with a longer wavelength than the primary light, the light converter includes, as a red light emitting phosphor, divalent europium activated nitride red light emitting phosphor substantially represented by (MI07-22-2010
20110108864LIGHT EMITTING DEVICE - Light-emitting elements have a problem that their light-extraction efficiency is low due to scattered light or reflected light inside the light-emitting elements. The light-extraction efficiency of the light-emitting elements needs to be enhanced by a new method. According to the present invention, a light-emitting element includes a first layer generating holes, a second layer including a light-emitting layer for each emission color and a third layer generating electrons between an anode and a cathode, and the thickness of the first layer is different depending on each layer including the light-emitting layer for each emission color. A layer in which an organic compound and a metal oxide are mixed is used as the first layer, and thus, the driving voltage is not increased even when the thickness is increased, which is preferable.05-12-2011
20120205688LIGHT EMITTING DEVICE - Light-emitting elements have a problem that their light-extraction efficiency is low due to scattered light or reflected light inside the light-emitting elements. The light-extraction efficiency of the light-emitting elements needs to be enhanced by a new method. According to the present invention, a light-emitting element includes a first layer generating holes, a second layer including a light-emitting layer for each emission color and a third layer generating electrons between an anode and a cathode, and the thickness of the first layer is different depending on each layer including the light-emitting layer for each emission color. A layer in which an organic compound and a metal oxide are mixed is used as the first layer, and thus, the driving voltage is not increased even when the thickness is increased, which is preferable.08-16-2012
20110316015PACKAGE FOR A LIGHT EMITTING ELEMENT - A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material that passes through the membrane. A p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.12-29-2011
20110316014LED MODULE AND LED LIGHTING DEVICE - An LED module includes a substrate including a main surface and a rear surface that are opposed to each other. The LED module also includes a plurality of LED chips arranged on the main surface, a drive circuit chip that is provided on the substrate and that is provided for driving the plurality of LED chips, a first heat dissipator that is provided on the rear surface and that overlaps the plurality of LED chips as viewed in the thickness direction of the substrate, and a second heat dissipator that is provided at a position closer to the drive circuit chip than the first heat dissipator is. The second head dissipator has a thickness greater than that of the first heat dissipator. The LED module emits a uniform amount of light and color.12-29-2011
20120001209LIGHT EMITTING DIODE MODULE FOR LINE LIGHT SOURCE - A light emitting diode module for a line light source includes a circuit board having a wire pattern formed thereon and a plurality of LED chips directly mounted and disposed in a longitudinal direction on the circuit board and electrically connected to the wire pattern. The module also includes a reflecting wall installed on the circuit board to surround the plurality of LED chips, reflecting light from the LED chips. The module further includes a heat sink plate underlying the circuit board to radiate heat generated from the LED chip.01-05-2012
20120001207ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes i) a plurality of pixels comprising a blue light emitting region, a green light emitting region, and a red light emitting region on a substrate and formed by stacking a lower electrode, an organic layer, and an upper electrode. In one embodiment, the blue and green light emitting regions are formed in a microcavity structure, and the red light emitting region is formed in a non-microcavity structure.01-05-2012
20120001208Optoelectronic Semiconductor Component and Display Means - In at least one embodiment, an optoelectronic semiconductor component includes at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation in mutually different wavelength ranges when in operation. The semiconductor chips are mounted on a mounting surface of a common carrier. Furthermore, the optoelectronic semiconductor component contains at least two non-rotationally symmetrical lens bodies, which are designed to shape the radiation into mutually different emission angles in two mutually orthogonal directions parallel to the mounting surface. One of the lens bodies is here associated with or arranged downstream of each of the semiconductor chips in an emission direction.01-05-2012
20120001205LIGHT EMITTING DEVICE HAVING STRONTIUM OXYORTHOSILICATE TYPE PHOSPHORS - Exemplary embodiments of the present invention relate to light emitting devices including strontium oxyorthosilicate-type phosphors. The light emitting device includes a light emitting diode, which emits light in the UV or visible range, and phosphors disposed around the light emitting diode to absorb light emitted from the light emitting diode and emit light having a different wavelength from the absorbed light. The phosphors include an oxyorthosilicate phosphor having a general formula of Sr01-05-2012
20110156066SEMICONDUCTOR LIGHT-EMITTING DEVICE WITH A PROTECTION LAYER - The present application discloses a semiconductor light-emitting device with a protection layer. The structure includes a heat dispersion substrate, a first connecting layer on the heat dispersion substrate, a protection layer on the first connecting layer, a second connecting layer on the protection layer, and a light-emitting unit on the second connecting layer. The protection layer is highly insulative and can avoid the current leakage forming between the light-emitting unit and the heat dispersion substrate.06-30-2011
20120056217LIGHT EMITTING DIODE PACKAGE - Disclosed herein is a light emitting diode package including a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes.03-08-2012
20120056216LIGHT EMITTING DEVICE - A light emitting device according to one embodiment includes: a board; plural first light emitting units each including a first light emitting element and a first fluorescent layer formed on the first light emitting element having a green phosphor; plural second light emitting units each including a second light emitting element and a second fluorescent layer formed on the second light emitting element having a red phosphor; the second fluorescent layers and the first fluorescent layers being separated in a non-contact manner with gas interposed there between; and plural third light emitting units each including a third light emitting element and a resin layer formed on the third light emitting element having neither a green phosphor nor the red phosphor, the third light emitting units being disposed between the first light emitting units and the second light emitting units.03-08-2012
20120205685Light-Emitting Element, Light-Emitting Device, and Display Device - A light-emitting element with which a reduction in power consumption and an improvement in productivity of a display device can be achieved is provided. A technique of manufacturing a display device with high productivity is provided. The light-emitting element includes an electrode having a reflective property, and a first light-emitting layer, a charge generation layer, a second light-emitting layer, and an electrode having a light-transmitting property stacked in this order over the electrode having a reflective property. The optical path length between the electrode having a reflective property and the first light-emitting layer is one-quarter of the peak wavelength of the emission spectrum of the first light-emitting layer. The optical path length between the electrode having a reflective property and the second light-emitting layer is three-quarters of the peak wavelength of the emission spectrum of the second light-emitting layer.08-16-2012
20120205686Light-Emitting Device and Display Device - A technique of manufacturing a display device with high productivity is provided. In addition, a high-definition display device with high color purity is provided. By adjusting the optical path length between an electrode having a reflective property and a light-emitting layer by the central wavelength of a wavelength range of light passing through a color filter layer, the high-definition display device with high color purity is provided without performing selective deposition of light-emitting layers. In a light-emitting element, a plurality of light-emitting layers emitting light of different colors are stacked. The closer the light-emitting layer is positioned to the electrode having a reflective property, the shorter the wavelength of light emitted from the light-emitting layer is.08-16-2012
20120205687LIGHT-EMITTING BODY, LIGHT-EMITTING LAYER, AND LIGHT-EMITTING DEVICE - An organic light-emitting element having high efficiency and long lifetime is provided. An organic light-emitting body is provided which includes a host having a high electron-transport property (n-type host), a host having a high hole-transport property (p-type host), and a guest such as an iridium complex and in which the n-type host and the p-type host are located so as to be adjacent to each other. When an electron and a hole are injected to such a light-emitting body, the electron is trapped by the n-type host and the hole is trapped by the p-type host. Then, both the electron and the hole are injected to the guest, and thus the guest is brought into an excited state. In this process, less thermal deactivation occurs and the working rate of the guest is high; thus, highly efficient light emission can be obtained.08-16-2012
20120012867MULTI-DIMENSIONAL LIGHT-EMITTING DEVICE - The present application provides a multi-dimensional light-emitting device electrically connected to a power supply system. The multi-dimensional light-emitting device comprises a substrate, a blue light-emitting diode array and one or more phosphor layers. The blue light-emitting diode array, disposed on the substrate, comprises a plurality of blue light-emitting diode chips which are electrically connected. The multi-dimensional light-emitting device comprises a central area and a plurality of peripheral areas, which are arranged around the central area. The phosphor layer covers the central area. When the power supply system provides a high voltage, the central area and the peripheral areas of the multi-dimensional light-emitting device provide a first light and a plurality of second lights, respectively. The first light and the second lights are blended into a mixed light.01-19-2012
20120112215LED-Based Light Source Utilizing Asymmetric Conductors - A light source and method for making the same are disclosed. The light source includes a plurality of surface mount LEDs that are bonded to a mounting substrate by a layer of asymmetric conductor. Each LED has surface mount contacts on a first surface thereof and emits light from a second surface thereof that is opposite the first surface. The mounting substrate includes a top surface having a plurality of connection traces. Each connection trace includes an n-trace positioned to underlie a corresponding one of the n-contacts and a p-trace positioned to underlie a corresponding one of the p-contacts, the p-trace having an area greater than the p-contact. The layer of asymmetric conductor is sandwiched between the surface mount contacts and the connection traces, and can optionally extend into the spaces between the LEDs to provide a scattering medium for redirecting light leaving the sides of the LEDs.05-10-2012
20120112216SINGLE COLOR LED CLUSTERS FOR IMAGE GENERATION - A display device for increasing brightness of an image generation, including a color cluster system, is provided. The system includes a first color LED cluster having at least a first LED of a first wavelength within a first color range and a second LED of a second different wavelength within the first color range. The light from the first LED may be combined at least partially with light from the second LED The system further comprises a second color LED cluster having at least a first LED of a first wavelength within a second color range and a second LED of a second different wavelength within the second color range. In the second color LED cluster, the light from the first LED may be combined at least partially with light from the second LED.05-10-2012
20110084292ARRAYS OF LIGHT EMITTING DEVICES - Arrays of light-emitting devices, and related components, processes, systems and methods are disclosed.04-14-2011
20110049539Light-Emitting Diode With High Color-Rendering Index - A light-emitting diode (LED) with high color-rendering index includes a substrate being provided on one face with a plurality of recesses; a plurality of first chips being separately disposed in the recesses and adapted to emit blue light; a plurality of fluorescent glues being separately filled in the recesses; at least one second chip being disposed on the substrate at a predetermined position to electrically connect to the first chips, and adapted to emit red light; and a light-transmittable layer provided on the substrate to protectively cover the first chips, the fluorescent glues, and the second chip. The blue light emitted from the first chips and the yellow or green light from the fluorescent glues are mixed first, and the produced light is then further mixed with the red light emitted from the second chip to produce warm white light, which is then projected through the light-transmittable layer.03-03-2011
20120153320LIGHT EMITTING DEVICE BASED ON OLEDS - The present invention relates to a light emitting device comprising several groups of stripe shaped organic light emitting diodes (06-21-2012
20120025223LED LIGHTING DEVICE WITH HIGH COLOUR RE-PRODUCIBILITY - The invention relates to a light emitting diode (LED) lighting device that is comprised of a plurality of LED components and is characterized by the mixture of; a first group of light source provided by blue LEDs mixed with luminescence conversion element and the blue light has a dominant wavelength in the range from 430 nm to 460 nm and the luminescence conversion element absorbs a portion of this blue light and converts to a secondary light have a peak wavelength in the range of 520 nm to 545 nm; a second group of light source provided by LEDs with dominant wavelength in the range of 600 nm to 610 nm and a third group of light source provided by LEDs with dominant wavelength in the range of 615 nm to 625 nm to produce mixture of light that has good color re-producibility.02-02-2012
20120305952ORGANIC EL DEVICE - An organic EL device includes: a bank provided to surround a first anode (second anode) on a substrate; a red emission layer (green emission layer) provided at an opening portion of the bank; a third anode having the same polarity as that of the first anode provided on the bank; a blue emission layer provided at an entire portion of the substrate including the third anode; and a cathode having a different polarity from those of the first anode and the third anode provided to cover the blue emission layer.12-06-2012
20120153318WHITE LIGHT ELECTROLUMINESCENCE DEVICE - A white light electroluminescence device includes a first light emitting unit, a second light emitting unit and a connecting layer between the first and the second light emitting units. The connecting layer electrically connects the first and the second light emitting units in series. The first light emitting unit includes a first electrode layer and a first light emitting layer on the first electrode layer, wherein the first light emitting layer includes a first blue light emitting layer and a red light emitting layer having a first co-host material and a first dopant material. The second light emitting unit includes a second light emitting layer and a second electrode layer on the second light emitting layer, wherein the second light emitting layer has a second blue light emitting layer and a green light emitting layer having a second co-host material and a second dopant material.06-21-2012
20110042697Organic Light Emitting Diode Display - An organic light emitting diode display includes a display substrate including a plurality of organic light emitting diodes, a plurality of color filters on the plurality of organic light emitting diodes respectively corresponding thereto, and a plurality of light scattering particles dispersed in the plurality of color filters.02-24-2011
20110042696Organic Electroluminescent Device - An organic electroluminescent device cfomprising: a transparent substrate; a first electrode disposed over the substrate for injecting charge of a first polarity; a second electrode disposed over the first electrode for injecting charge of a second polarity opposite to said first polarity; an organic light-emitting layer disposed between the first and the second electrode, wherein the second electrode is reflective, the first electrode is transparent or semi-transparent, and one or more intermediate layers of dielectric material with a refractive index greater than 1.8 or a metal material is disposed between the substrate and the first electrode forming a semi-transparent mirror whereby a microcavity is provided between the reflective second electrode and the semi-transparent mirror, all the intermediate layers disposed between the substrate and the first electrode having a surface nearest the organic light-emitting layer not more than 150 nm from a surface of the first electrode nearest the organic light-emitting layer.02-24-2011
20090309110SELECTIVE AREA EPITAXY GROWTH METHOD AND STRUCTURE FOR MULTI-COLORED DEVICES - A multicolored LED device made of a semipolar material having different indium containing regions provided on different spatial features of GaN material. Other materials such as non-polar materials can also be used.12-17-2009
20120153319SELF-ILLUMINATING DISPLAY AND METHOD FOR MAKING SAME - A self-illuminating display includes a substrate, and a number of light emitting units. The light emitting units are formed on the substrate in an array fashion. Each of the light emitting units includes a first electrode, a second electrode formed on the substrate and a number of light emitting nanowires. The first electrode includes a number of first arms, and the second electrode includes a number of second arms. Each of the first arms opposes a corresponding second arm. Each of light emitting nanowires interconnects the first arm and the corresponding second arm. Each of the light emitting nanowires has a p-n junction.06-21-2012
20120153317LIGHT EMITTING DIODE (LED) DEVICES, SYSTEMS, AND METHODS - Light emitting diode (LED) devices, systems, and methods are disclosed. In one aspect, an illumination panel can be configured to provide backlighting for a liquid crystal display (LCD) panel. The illumination panel can include one or more LEDs arranged in an array. The one or more LEDs can be attached using metal-to-metal die attach methods over an illumination panel, or attached within packages disposed over the illumination panel. In one aspect, the one or more LEDs can be attached using robust metal-to-metal die attach techniques and/or materials disclosed herein.06-21-2012
20120119239ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND FOLDABLE DISPLAY DEVICE INCLUDING THE SAME - An organic light-emitting display device includes a plurality of first and second electrodes which are spaced apart from each other on a substrate, a plurality of light-emitting layers between the first and second electrodes, a flexible thin encapsulation film on the second electrodes, and a color filter on the flexible thin encapsulation film.05-17-2012
20090134409COMPOSITE LED MODULES - The present invention provides a composite multi-color light emitting diode device comprising a first light emitting diode unit and a second light emitting diode unit that is arranged on top of the first light emitting diode unit. Thereby, a composite light emitting diode device, capable of emitting two different wavelengths of electromagnetic radiation is provided. It is furthermore possible to arrange a third light emitting diode unit. The third light emitting diode unit can be arranged on top of the second light emitting diode unit, thereby providing a stack of three light emitting diode units, or it can be arranged on the first light emitting diode unit, thereby providing two light emitting diode units side-by-side on top of the first light emitting diode unit.05-28-2009
20120161170GENERATION OF RADIATION CONDUCIVE TO PLANT GROWTH USING A COMBINATION OF LEDS AND PHOSPHORS - In accordance with one aspect of the present disclosure, a light emitting device for producing radiation optimal for plant growth is provided. The light emitting device comprises at least one LED chip having a peak wavelength disposed on a support, a phosphor material radiationally coupled to the at least one LED chip. The phosphor materials are capable of absorbing at least a portion of the radiation from the at least one LED chip and emitting light of a second wavelength. The light emitting device further includes an optical element at least partially covering the at least one LED chip and support. The light emitting device is capable of uniformly mixing the red and blue radiation to produce pink radiation.06-28-2012
20120161173LIGHT EMITTING DEVICE - A light emitting device includes: a chip-mounting base formed with a plurality of conductive contacts; a reflector mounted on the chip-mounting base and defining a central hole; a first light emitting chip mounted on the chip-mounting base within the central hole and in electrical contact with respective ones of the conductive contacts for generating light with a first primary wavelength; a second light emitting chip stacked on and in electrical contact with the first light emitting chip for generating light with a second primary wavelength different from the first primary wavelength; and an encapsulant filling the central hole and capable of converting the first and second primary wavelengths into first and second secondary wavelengths, respectively.06-28-2012
20120161172DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A display device capable of suppressing a reduction in color purity includes: a first resonator structure having an upper reflective member, a lower reflective member, and a light-emitting functional layer therebetween, the light-emitting functional layer including a red light-emitting layer which emits red light; a second resonator structure having an upper reflective member, a lower reflective member, and a light-emitting functional layer provided therebetween, the light-emitting functional layer including a blue light-emitting layer which emits blue light; and a third resonator structure having an part reflective member, a lower reflective member, and a light-emitting functional layer provided therebetween, the light-emitting functional layer including a green light-emitting layer which emits green light, wherein the red light-emitting layer is a common layer provided in each of the light-emitting functional layers of the first to third resonator structures.06-28-2012
20120161171PIXEL STRUCTURE - A pixel structure including a pair of first sub-pixels, a pair of second sub-pixels and an electrical tunable photonic crystal layer is provided. The pair of first sub-pixels are substantially identical in area, and the pair of second sub-pixels are substantially identical in area. The area of each second sub-pixel is twice the area of each first sub-pixel. In addition, the electrical tunable photonic crystal layer is disposed over the pair of first sub-pixels and the pair of second sub-pixels.06-28-2012
20120211782ORGANIC ELECTROLUMINESCENT ELEMENT AND DISPLAY INCLUDING SAME - An organic electroluminescent element includes a first electrode, an organic compound film including a plurality of layers that include an emissive layer, a second electrode, a protective layer, and a buffer layer formed by an evaporation method between the second electrode and the protective layer, light emitted from the emissive layer emerging from the second electrode side, in which the second electrode is formed of a metal film having a thickness of 5 nm to 20 nm, a distance between a surface of the emissive layer adjacent to the first electrode and a surface of the second electrode adjacent to the organic compound film is in the range of 55 nm to 90 nm, and the protective layer is formed by a sputtering method or a plasma-enhanced chemical vapor deposition method.08-23-2012
20120211781LIGHT EMITTING DEVICE - The present invention provides a light emitting device, comprising a first light emitting diode for emitting light in an ultraviolet wavelength region; at least one phosphor arranged around the first light emitting diode and excited by the light emitted from the first light emitting diode to emit light having a peak wavelength longer than the wavelength of the light emitted from the first light emitting diode; and at least one second light emitting diode for emitting light having a wavelength different from the peak wavelength of the light emitted from the phosphor.08-23-2012
20120211780LED PACKAGE MODULE - An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.08-23-2012
20120211779LIGHT EMITTING DEVICE - A light emitting device includes a white light emitting unit including a first light source emitting a white light; a red light emitting unit including a second light source emitting a white light and a red coating member having a red fluorescent material which converts the white light from the second light source into a red light; and a green light emitting unit including a third light source emitting a white light and a green coating member having a green fluorescent material which converts the white light from the third light source into a green light. The light emitting device further includes a driver for individually driving the white, the red and the green light emitting unit.08-23-2012
20120211778LED PACKAGE FOR UNIFORM COLOR EMISSION - A light emitting diode package for one or more light emitting diodes mounted on a substrate. A frame is disposed on at least a portion of the substrate and substantially surrounds, but does not contact, the light emitting diode. The frame is substantially transparent to light emitted from the light emitting diode and includes one or more first wavelength converting materials. The wavelength converting materials, which may be one or more phosphors, convert at least a portion of light emitted at the emission wavelength to different wavelength. A cover covers the light emitting diode within the frame. The cover layer includes one or more second wavelength converting materials differing from the first one or more wavelength converting materials in wavelength converting material concentration or in converted light wavelength or in combinations of wavelength converting materials.08-23-2012
20100289038DISPLAY APPARATUS - A display apparatus includes a light emitting device emitting red light, a light emitting device emitting green light, and a light emitting device emitting blue light. The display apparatus includes a circular polarizer provided on the light extraction side of the light emitting devices. Each light emitting device includes a periodic structure for extracting light from the light extraction side of the light emitting device, the light being generated in a light emitting layer and guided in the in-plane direction of a substrate. Each period of the periodic structure of the light emitting devices is identical, and the period of the periodic structure is more than 200 nm and 380 nm or less.11-18-2010
20100090231LED PACKAGE MODULE - An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. Accordingly, a reduction in luminous efficiency of an LED caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size.04-15-2010
20100207134LED LIGHTING DEVICE - An LED lighting device comprises a plurality of light emitting units which is configured to emit visible light having different colors which are mixed with each other to produce a white light. Each the light emitting units is composed of an LED chip and a phosphor. The LED chip is configured to generate light. The phosphor has a property of giving off a light of a predetermined color when the phosphor is excited by the light from the LED chip. The LED chip is selected from a group consisting of a blue LED chip, a UV LED chip, ad a violet LED chip. Each the phosphor is selected to give off the light of a predetermined color different from one another.08-19-2010
20100207133SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light emitting device (A) includes an elongated substrate (08-19-2010
20110180826PRINTING METHOD, METHOD FOR FORMING LIGHT EMITTING LAYER, METHOD FOR FORMING ORGANIC LIGHT EMITTING DEVICE, AND ORGANIC LIGHT EMITTING DEVICE - A printing machine includes: a frame; a flat anilox plate that is fixed to and located on the frame and has a plurality of cells on an upper surface of the anilox plate; an ink supplying tool that supplies the ink onto the upper surface of the anilox plate; a surface plate that is fixed to and located on the frame and on which the substrate is placed; and a printing cylinder that is arranged above the frame and is capable of moving above the frame. The printing cylinder has a flexographic plate. The flexographic plate contacts the upper surface of the anilox plate, receives the ink, and transfers the ink onto the substrate. The flexographic plate is made of an elastic material. The viscosity of the ink is in a range of 51 cP to 200 cP (ink temperature: 23° C.) at the shear rate of the ink is 100/second.07-28-2011
20110180825Organic light emitting device display and method of manufacturing the same - An organic light emitting device display, including a first electrode in red, green, and blue sub-pixels on a substrate, a hole injection layer above the substrate so as to cover the first electrode, a hole transport layer above the hole injection layer, an auxiliary layer between the hole injection layer and the hole transport layer in the red sub-pixel, a red light emission layer and a green light emission layer above the hole transport layer in the red sub-pixel and the green sub-pixel, the red light emission layer being between the green light emission layer and the hole transport layer, and a blue light emission layer above the hole transport layer in the blue sub-pixel.07-28-2011
20110180824LIGHT EMITTING DIODE DEVICE - A light emitting diode device which includes at least one light emitting diode, a heat-sink chassis having a surface upon which the at least one light emitting diode is mounted, and a waveguide having one end coupled to the at least one light emitting diode for receiving light therefrom. The waveguide has another end which includes a light extraction and redistribution region, and the waveguide is configured to guide light received from the at least one light emitting diode away from the heat-sink chassis and towards the light extraction and redistribution region. The light extraction and redistribution region is configured to extract and redistribute the light from the waveguide.07-28-2011
20120132939LIGHT EMITTING DEVICE EMPLOYING NON-STOICHIOMETRIC TETRAGONAL ALKALINE EARTH SILICATE PHOSPHORS - Disclosed is a light emitting device employing non-stoichiometric tetragonal Alkaline Earth Silicate phosphors. The light emitting device comprises a light emitting diode emitting light of ultraviolet or visible light, and non-stoichiometric luminescent material disposed around the light emitting diode. The luminescent material adsorbs at least a portion of the light emitted from the light emitting diode and emits light having a different wavelength from the absorbed light. The non-stoichiometric luminescent material has tetragonal crystal structure, and contains more silicon in the crystal lattice than that in the crystal lattice of silicate phosphors having stoichiometric crystal structure. The luminescent material is represented as the formula (Ba05-31-2012
20120132937WATERPROOF SURFACE MOUNT DEVICE PACKAGE AND METHOD - The present invention is directed to LED packages and methods utilizing waterproof and UV resistant packages with improved structural integrity. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, waterproof package. Moreover, in some embodiments the improved structural integrity and waterproofing is further provided by improved adhesion between the encapsulant and the casing. Some embodiments also provide for improved wire bonds, with the length, thickness, and loop height of the wire bonds controlled and optimized for improved adhesion between the wire bonds and the encapsulant as well as improved reliability.05-31-2012
20120313123DISPLAY DEVICE HAVING A SPACER - A display device includes a first substrate having a plurality of pixel regions separated by a non-pixel region; a second substrate facing the first substrate; and a spacer disposed between the first substrate and the second substrate to maintain a gap between the first substrate and the second substrate. The pixel regions include a first pixel region and a second pixel region which neighbor each other, the non-pixel region between the first pixel region and the second pixel region is bisected into a first non-pixel region adjacent to the first pixel region and a second non-pixel region adjacent to the second pixel region, and the spacer is formed on the non-pixel region between the first pixel region and the second pixel region. An area of the first non-pixel region occupied by the spacer is smaller than an area of the second non-pixel region occupied by the spacer.12-13-2012
20090057692SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - Provided is a semiconductor light emitting device and a method for manufacturing the same. The semiconductor light emitting device comprises: a first semiconductor layer; a light emitting structure on one sided portion of the first semiconductor layer; a protection device structure on the other sided portion of the first semiconductor layer; and a first electrode layer on the protection device structure.03-05-2009
20090057691SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor light emitting device and a method of manufacturing the same. The semiconductor light emitting layer comprises a first conductive type semiconductor layer, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the active layer. The active layer comprises a quantum well layer, a quantum barrier layer, and a dual barrier layer.03-05-2009
20120168789High-Transparent LED Display Module - A high-transparency LED display module, which comprises a transparent glass plate, and an LED luminous unit and a main driving unit which are lined linearly; the transparent glass plate is provided with lamp holes which are lined based on pixel pitch, and the lamp holes which are horizontally or vertically lined along the transparent glass plate are provided with wiring ducts which are vertical to the surface of the transparent glass plate; the LED luminous unit comprises a driving PCB board and an LED luminous bodies which are electrically connected with the PCB board; the driving PCB boards are inlaid in the wiring ducts of the transparent glass plate; the surface of the driving PCB board is vertical to the surface of the transparent glass plate; the positions of the LED luminous bodies correspond to the positions of the lamp holes; and the light of the LED luminous bodies is axially vertical to the surface of the transparent glass plate. In the invention, the main PCB board is horizontally installed on an organic glass plate, thus greatly reducing the blockage of the PCB board to the light and improving the transparency of the module.07-05-2012
20120168785DISPLAY DEVICE - The present invention provides a display device using a copper wiring and having high display properties in which without preventing a higher aperture ratio of the pixel, coloring of a screen due to reflected light of external light produced within the display device can be prevented. The display device according to the present invention is a display device including a plurality of pixel regions, wherein each of the pixel regions includes a copper wiring containing copper or an alloy thereof, and a red-colored layer and a colored layer of another color; and an area of the copper wiring is smaller in the pixel region including the red-colored layer than in the pixel region including the colored layer of another color, the area of the copper wiring reflecting incident light entering from the display surface side of the display device.07-05-2012
20120168786Potted Optoelectronic Module Having a Plurality of Semiconductor Components and Method for Producing an Optoelectronic Module - An optoelectronic semiconductor component comprising: a main body (07-05-2012
20120248477HIGH EFFICIENCY LEDS AND LED LAMPS - In various embodiments, lighting systems include an electrically insulating carrier having a plurality of conductive elements disposed thereon, a light-emitting array, and at least one power source. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting strings, each light-emitting string comprising a plurality of unpackaged light-emitting diode (LED) dies electrically connected in series. Each LED die has at least two electrical contacts on one surface thereof, and each electrical contact is electrically connected to a conductive element by a conductive adhesive. The power source provides power to the light-emitting strings.10-04-2012
20100051975Layered semiconductor light emitting device and image forming apparatus - A layered semiconductor light emitting device includes a plurality of semiconductor light emitting elements each of which includes a light emitting region that converts electricity into light and emits the light. The semiconductor light emitting elements are layered in a layering direction perpendicular to the light emitting regions, and are bonded to each other via a planarizing layer having electrical insulation property. The planarizing layer includes a first planarizing region disposed above or below the light emitting regions of the semiconductor light emitting elements in the layering direction and formed of a first planarizing film having higher refractive index than air, and a second planarizing region other than the first planarizing region and formed of a second planarizing film having lower refractive index than the first planarizing film. In the layering direction, the upper semiconductor light emitting element transmits light emitted by the lower semiconductor light emitting element.03-04-2010
20100051976LED LIGHTING ASSEMBLY - Disclosed is a lighting assembly comprising one or more light emitting diodes (LEDs). The assembly comprises a ceramic disc which is coated with a layer of heat conducting material. The assembly provides sufficient galvanic insulation for it to be used safely even when connected to the electric grid as a power source.03-04-2010
20120175650ILLUMINATING DEVICE AND DISPLAY DEVICE - An illuminating device (07-12-2012
20120175649Capacitor Device and Display Apparatus Having the Same - A capacitor device prevents capacitor failure and pixel failure by preventing the capacitor from experiencing a short circuit caused by disconnection of a bridge formed between electrodes of the capacitor and a display apparatus having the capacitor device. A display device comprises a thin film transistor, a light emitting device, and the capacitor device described above.07-12-2012
20120248475DISPLAY UNIT AND METHOD OF MANUFACTURING THE SAME - A display unit includes, on a substrate, a plurality of organic EL devices, and an insulating film provided in an inter-device region between the plurality of organic EL devices, the insulating film including a groove in a position between the organic EL devices adjacent to each other.10-04-2012
20120248474LIGHT EMITTING ELEMENT, ILLUMINATION DEVICE, AND DISPLAY APPARATUS - A light emitting element has an organic layer that sequentially includes a first emission layer and a second emission layer, a first reflection interface, and a second reflection interface, wherein, if the optical distance between the first reflection interface and the emission center of a first emission layer is L10-04-2012
20100006872LIGHT EMITTING DEVICE - Light-emitting elements have a problem that their light-extraction efficiency is low due to scattered light or reflected light inside the light-emitting elements. The light-extraction efficiency of the light-emitting elements needs to be enhanced by a new method. According to the present invention, a light-emitting element includes a first layer generating holes, a second layer including a light-emitting layer for each emission color and a third layer generating electrons between an anode and a cathode, and the thickness of the first layer is different depending on each layer including the light-emitting layer for each emission color. A layer in which an organic compound and a metal oxide are mixed is used as the first layer, and thus, the driving voltage is not increased even when the thickness is increased, which is preferable.01-14-2010
20100006871LIGHT EMITTING DEVICE AND METHOD FOR PRODUCING THE LIGHT EMITTING DEVICE - A light emitting device that has a radiant efficiency that does not decline in use, enables luminous flux to be increased by a high electric current, and produces white light with good color rendering and a method for producing a light emitting device capable of smoothly transmitting heat generated by LED elements to a carrier substrate. The radiation emitting device has first LED elements for emitting UV radiation, second LED elements for emitting visible light, a substrate made of an inorganic material and which carries the first LED elements and the second LED elements, a body made of inorganic material containing the first LED elements, the second LED elements and the substrate, and an SiC fluorescent screen that is doped with at least one of B and Al as well as N and emits visible light when excited by radiation emitted from the first LED elements.01-14-2010
20100244061LED illumination device - An LED illumination device includes: a substrate; one or more red LED chips arranged on the substrate; a plurality of blue LED chips arranged on the substrate; and a plurality of third-color LED chips arranged on the substrate. Respective centers of the red LED chips are arranged on a circumference of a first circle having as its center a point on the substrate, respective centers of the blue LED chips being arranged on the circumference of a second circle concentric with and greater than the first circle, respective centers of the third-color LED chips being arranged in a region between the first circle and the second circle.09-30-2010
20120223345LIGHT EMITTING UNIT AND DISPLAY DEVICE - A light emitting unit including plural kinds of light emitting elements with different light emitting wavelengths, wherein, among the light emitting elements, at least one kind of light emitting element includes a semiconductor layer configured by laminating a first conductive layer, an active layer and a second conductive layer and having a side surface exposed by the first conductive layer, the active layer and the second conductive layer; a first electrode electrically connected to the first conductive layer; a second electrode electrically connected to the second conductive layer; a first insulation layer contacting at least an exposed surface of the active layer in the surface of the semiconductor layer; and a metal layer contacting at least a surface, which is opposite to the exposed surface of the active layer, in the surface of the first insulation layer, and electrically separated from the first electrode and the second electrode.09-06-2012
20120119238LED package structure - An LED package structure includes an insulation substrate, a heat-sink slug, an LED chip assembly, four diodes, and a lead-frame assembly. The heat-sink slug is inserted on the insulation substrate, and includes a loading surface exposed externally, where the LED chip assembly is fixed on the loading surface. The lead-frame assembly includes two externally-extended lead frames and four loading lead frames which are apart from one another, and which are all inserted on the insulation substrate. The four diodes are correspondingly loaded on, and electrically connected with, the four loading lead frames. The LED chip assembly and the four diodes constitute a bridge circuit, wherein the bridge circuit has its positive electrode and negative electrode located at the two externally-extended lead frames, respectively. Therefore, there is no need for the LED package structure to connect externally a rectifier diode module so as to achieve the purpose of convenient use.05-17-2012
20120223346Display Device - To provide a display device with low power consumption. The display device includes a plurality of pixels each having a light-emitting element having a structure in which light emitted from a light-emitting layer is resonated between a reflective electrode and a light-transmitting electrode, wherein no color filter layers are provided or color filter layers with high transmittance are provided in pixels for light with relatively short wavelengths (e.g., pixels for blue and/or green), and a color filter layer is selectively provided in pixels for light with a long wavelength (e.g., pixels for red), and thereby maintaining color reproducibility and consuming less power.09-06-2012
20120256209Organic Light Emitting Element and Display Device Using the Element - A hole transporting region made of a hole transporting material, an electron transporting region made of an electron transporting material, and a mixed region (light emitting region) in which both the hole transporting material and the electron transporting material are mixed and which is doped with a triplet light emitting material for red color are provided in an organic compound film, whereby interfaces between respective layers which exist in a conventional lamination structure are eliminated, and respective functions of hole transportation, electron transportation, and light emission are exhibited. In accordance with the above-mentioned method, the organic light emitting element for red color can be obtained in which power consumption is low and a life thereof is long. Thus, the display device and the electric device are manufactured by using the organic light emitting element.10-11-2012
20120256208Light-Emitting Device, Electronic Appliance, and Lighting Device - A light-emitting device and a lighting device each of which includes a plurality of light-emitting elements exhibiting light with different wavelengths are provided. The light-emitting device and the lighting device each have an element structure in which each of the light-emitting elements emits only light with a desired wavelength, and thus the light-emitting elements have favorable color purity. In the light-emitting element emitting light (λ10-11-2012
20120261682BACKLIGHT MODULE - A backlight module comprises a back plate, a first light source module, and an optical component. The optical component includes a side surface and a bottom surface perpendicularly connected to the side surface. The first light source module comprises a plurality of first LEDs disposed on the back plate and at the side surface of the optical component for emitting light at a first wavelength toward the side surface of the optical component. The light is directed in a specific direction by the optical component and then sent out from an emitting surface. The backlight module further comprises a second light source module. The second light source module comprises a plurality of second LEDs disposed near the bottom surface of the optical component for emitting light at a second wavelength toward the bottom surface of the optical component. Light produced after the light at the first wavelength mixes with the light at the second wavelength becomes white light after passing through the optical component.10-18-2012
20120261683ORGANIC EL DEVICE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS - An organic EL device includes light emitting functional layers as a first layer with a function of emitting light of a first color which are provided between anodes and a cathode, a light emitting functional layer as a second layer with a function of emitting light of a second color, first light emitting elements that include an intermediate layer as a third layer which is provided between the light emitting functional layers and that emits light of the first color, and a second light emitting element that includes the light emitting functional layer that is provided between the anode and the common cathode, wherein the light emitting functional layers and the intermediate layer are formed using a liquid phase process, the light emitting functional layer is formed using a gaseous phase process, and the intermediate layer is composed of an organic material in which an electron injection material is dispersed.10-18-2012
20120261684ORGANIC EL DEVICE AND ELECTRONIC APPARATUS - An organic EL device includes a reflecting layer which has at least light reflectivity, a first electrode which is arranged on the reflecting layer through a first insulating layer, an organic functional layer which is arranged on the first electrode and includes at least a light emitting layer, a second electrode which is arranged on the organic functional layer and has at least light reflectivity, and a holding capacitance. In the organic EL device, an optical resonator which resonates light from the organic functional layer is formed by the reflecting layer and the second electrode, and the holding capacitance is formed using the reflecting layer, the first insulating layer, and the first electrode.10-18-2012
20080308822PACKAGE STRUCTURE OF LIGHT EMITTING DIODE FOR BACKLIGHT - A package structure of a light emitting diode for a backlight comprises a long-wavelength LED die and a short-wavelength LED die. The lights emitted from the two LED dies are mixed with the light emitted from excited fluorescent powders for serving as the backlight of a liquid crystal display. A partition plate is disposed between the two LED dies for separating them from each other. The effective light output of the package structure is increased because each of the two LED dies cannot absorb the light from the other.12-18-2008
20080303041Light emitting element, manufacturing method thereof and light emitting module using the same - A light emitting element, and a manufacturing method thereof, and a light emitting module using the same are provided. The light emitting element includes a first light emitting diode (LED), a second LED, a first electrode and a second electrode. The first LED is disposed on a substrate and has a first P-type semiconductor and a first N-type semiconductor. The second LED is disposed above the first LED and has a second P-type semiconductor and a second N-type semiconductor. The first electrode is electrically connected to the first P-type semiconductor and the second N-type semiconductor. The second electrode is electrically connected to the first N-type semiconductor and the second P-type semiconductor. The first electrode and the second electrode are electrically connected to an alternating current for driving the first LED and the second LED to emit light by turns.12-11-2008
20110121328LED package structure - An LED package structure includes a heatsink slug, a positive-electrode frame, a negative-electrode frame, and an LED module electrically connected with the positive-electrode frame and the negative-electrode frame. The LED module includes a plurality of LED chips. The heatsink slug is provided, at its surface, with a plurality of cup-like recesses. The plural LED chips are each bonded, correspondingly, on a plane in the cup-like recess. Each of the LED chips is covered with a fluorescent colloidal layer having a curved and convex contour. As a result, a specific proportion for the color lights emitted from all the LED chips and from the fluorescent material in every direction of a space can be maintained, and that a better spatial color uniformity can be achieved.05-26-2011
20100327297ORGANIC EL DISPLAY PANEL - An organic EL display panel comprising a substrate and an organic light-emitting element R emitting red light, an organic light-emitting element G emitting green light and an organic light-emitting element B emitting blue light which are arranged on the substrate, wherein each of the organic light-emitting element has a concavely curved pixel electrode which is a reflective electrode, a functional layer formed with coating over the pixel electrode, an organic light emitting layer arranged on the functional layer, a counter electrode which is a transparent electrode arranged over the organic light emitting layer and a bank defining the functional layer formed with coating, the element R, the element G and the element B have different amount of the functional layer and the element R, the element G and the element B have different curvature radius of the concavely curved pixel electrode.12-30-2010
20080296593Silicon Light Emitting Device - Provided is a highly-efficient silicon light emitting device including an improved structure by which more light of the light emitted toward the lateral side of the light emitting device is emitted toward the front side thereof than conventional light emitting devices so as to improve the brightness. The silicon light emitting device includes a substrate, a plurality of light emitting structures formed on the substrate, each of the light emitting structures comprising an active layer, and a metal electrode comprising a lower metal electrode formed below the substrate and an upper metal electrode formed on the light emitting structures. The light emitting structures have column shapes whose vertical cross-sections are inverse trapezoid.12-04-2008
20080296592Semiconductor Light-Emitting Device - A semiconductor light-emitting device includes: a light-emitting semiconductor element arranged on a lead frame; a transparent resin mold covering the light-emitting semiconductor element and the lead frame except a terminal portion of the lead frame; and a reflective surface formed on a bent portion of part of the lead frame. The terminal portion of the lead frame has a terminal structure, which can serve as a combination of a top-view type and a side-view type.12-04-2008
20120319146FINE TUNING OF EMISSION SPECTRA BY COMBINATION OF MULTIPLE EMITTER SPECTRA - A first device is provided. The first device includes an anode, a cathode and an emissive layer disposed between the anode and the cathode. The emissive layer includes a first organic emitting material having a first peak wavelength and a second organic emitting material having a second peak wavelength. The emissive layer has a homogenous composition. The second peak wavelength is between 0 and 40 nm greater than the first peak wavelength.12-20-2012
20120319147ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display includes: a substrate; a first electrode on the substrate; a first emission layer on the first electrode; a second emission layer on the first emission layer; a second electrode on the second emission layer; and a light emitting assistance layer selectively positioned between the first emission layer and the second emission layer.12-20-2012
20120319145Non-Common Capping Layer on an Organic Device - A first method comprises providing a plurality of organic light emitting devices (OLEDs) on a first substrate. Each of the OLEDs includes a transmissive top electrode. The plurality of OLEDs includes a first portion of OLEDs and a second portion of OLEDs that is different from the first portion. The first method further includes depositing a first capping layer over at least the first portion of the plurality of OLEDs such that the first capping layer is optically coupled to at least the first portion of the plurality of OLEDs. A second capping layer is deposited over at least the second portion of the plurality of OLEDs such that the second capping layer is optically coupled to the second portion of the plurality of OLEDs but not the first portion of the plurality of OLEDs.12-20-2012
20120261685DISPLAY DEVICE - A display device including light emitting elements corresponding to respective colors disposed on a substrate. Each of the light emitting elements corresponding to the respective colors has a cavity structure in which a light emission functioning layer including a light emitting layer is held between a reflecting electrode and a semi-transmitting electrode. The light emission functioning layer except for the light emitting layer is common to the light emitting elements corresponding to the respective colors.10-18-2012
20110037083LED PACKAGE WITH CONTRASTING FACE - LED packages and LED displays utilizing the LED packages are disclosed, with the LED packages arranged to provide good contrast between the different pixels in an LED display while not reducing the perceived luminous flux or brightness of the display. One embodiment of an LED package comprises an LED chip and conversion material arranged to convert at least some light emitted from the LED chip. The package emits light from the conversion material or a combination of light from the conversion material and the LED chip. A reflective area is included around the LED chip that substantially reflects the package light and a contrasting area is included outside the reflective area and has a color that contrasts with the package light. LED displays according to the present invention comprise a plurality of LED packages arranged in relation to one another to produce messages or images, with the package providing improved pixel contrast.02-17-2011
20110037082Smart Integrated Semiconductor Light Emitting System Including Light Emitting Diodes And Application Specific Integrated Circuits (ASIC) - A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC) on the substrate, and at least one light emitting diode (LED) on the substrate in electrical communication with the application specific integrated circuit (ASIC). The light emitting diode (LED) system can also include a polymer lens, and a phosphor layer on the lens or light emitting diode (LED) for producing white light. In addition, multiple light emitting diodes (LEDs) can be mounted on the substrate, and can have different colors for smart color control lighting. The substrate and the application specific integrated circuit (ASIC) are configured to provide an integrated system having smart functionality. In addition, the substrate is configured to compliment and expand the functions of the application specific integrated circuit (ASIC), and can also include built in integrated circuits for performing additional electrical functions.02-17-2011
20120299033LIGHT-EMITTING DEVICE - To provide a light-emitting device (11-29-2012
20120299032LIGHT EMITTING DEVICE WITH PHOSPHOR WAVELENGTH CONVERSION - A light emitting device comprises a substantially planar light transmissive substrate having a light emitting surface and an opposite surface. The substrate is configured as a light guiding medium. The light emitting device also comprises at least one phosphor material disposed as a layer on the light emitting surface with a plurality of window areas and at least one source of excitation radiation of a first wavelength positioned adjacent to at least one peripheral edge of the substrate. The source is configured to couple excitation radiation into the substrate such that it is waveguided within the substrate by total internal reflection. Additionally, the light emitted by the device from the light emitting surface comprises first wavelength radiation and second, longer wavelength photoluminescent light emitted by the phosphor layer as a result of excitation by the source.11-29-2012
20120299031LIGHT EMITTING DEVICE, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD OF LIGHT EMITTING DEVICE - D={(2πm+φ11-29-2012
20110227103LED MODULE AND PRODUCTION METHOD - An LED module includes a layer stack of a substrateless LED, an emission area of the layer stack, the emission area being provided for light emission, a substrate having a top side on which the substrateless LED is arranged, contact areas arranged at a side area of the substrate, wherein the side area is perpendicular to the emission area, and/or including a base body which has contact areas at a side area and on which the substrate is mounted in such a way that the side area is perpendicular to the emission area, a first connection line between the LED and one of the contact area, and a second connection line between the LED and another of the contact areas.09-22-2011
20120080694ORGANIC EL DISPLAY - Disclosed is a coated type organic EL display wherein the light extraction efficiencies of all organic light-emitting elements are improved even when the organic light-emitting elements have different organic light-emitting layers for respective emission colors. Specifically disclosed is an organic EL display which comprises a substrate, a red organic light-emitting element (R), a green organic light-emitting element (G), and a blue organic light-emitting element (B), said organic light-emitting elements being arranged on the substrate. Each of the organic light-emitting elements has a pixel electrode that is a reflective electrode, a functional layer that is formed on the pixel electrode by coating, an organic light-emitting layer that is arranged on the functional layer, a counter electrode that is a transparent electrode arranged on the organic light-emitting layer, and a tapered bank that defines the functional layer formed by coating. The amounts of the functional layers formed by coating are different among the element (R), the element (G) and the element (B), and the tapered angles of the banks defining the functional layers are different among the element (R), the element (G) and the element (B).04-05-2012
20110241038DISPLAY UNIT, METHOD OF MANUFACTURING SAME, ORGANIC LIGHT EMITTING UNIT, AND METHOD OF MANUFACTURING SAME - A display unit capable of being simply designed and manufactured by using more simplified light emitting device structure while capable of high definition display and display with superior color reproducibility and a manufacturing method thereof are provided. The display unit is a display unit (10-06-2011
20100230688LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, DISPLAY, AND ELECTRONIC EQUIPMENT - Provided is a light-emitting element including a cathode; an anode; a first light-emitting layer that is disposed between the cathode and the anode and emits in a first color; a second light-emitting layer that is disposed between the first light-emitting layer and the cathode and emits in a second color that is different from the first color; and an intermediate layer that is disposed between the first light-emitting layer and the second light-emitting layer so as to be in contact with these layers and has a function of controlling the migration of holes and electrons between the first light-emitting layer and the second light-emitting layer. The intermediate layer is constituted of a first layer that is in contact with the first light-emitting layer and is constituted of a hole-transporting material serving as a main material and a second layer that is in contact with the first layer and also with the second light-emitting layer and is constituted of a material mixture, serving as a main material, of a material having an acene skeleton and a hole-transporting material.09-16-2010
20120326185LIGHT EMITTING DEVICE - A light emitting device including a carrying element having two electric conductors connectable to a power source, a light emitting element disposed on the carrying element and electrically connected to the two electric conductors, and at least one correction element electrically connected to the light emitting element, wherein the light emitting element is adapted to provide a light source upon connection of the two electric conductors with the power source, and the at least one correction element allows the light emitting element to have functions of temperature compensation, voltage correction, or surge absorption.12-27-2012
20120280259SYSTEM FOR DISPLAYING IMAGES - A system for displaying images is provided. The system includes an emissive display device including a plurality of pixel elements arranged in an array. Each pixel element includes a first substrate and a second substrate disposed thereunder, wherein the first substrate includes at least three subpixel regions. An organic light-emitting device is disposed between the first and second substrates and on the second substrate. At least one patterned polarizer film is disposed between the first and second substrates to be correspondingly located at one of the subpixel regions. At least one retarder film is disposed between the first and second substrates and affixed to the patterned polarizer film.11-08-2012
20110278604DISPLAY APPARATUS - A display apparatus displays a character or a graphic formed by a first light-emitting element group (first group) and a background of the character or the graphic formed by a second light-emitting element group (second group) on a display unit. The ratio of the electric current flowing through the light-emitting elements (elements) in the second group to the elements in the first group with respect to the elements of a same color as the elements whose electric current per unit light-emitting area is the largest among the elements of different colors when the display unit displays white, is closer to 1 than the ratio of the electric current flowing through each of the elements in the second group to the elements in the first group with respect to the elements of different colors from the elements whose electric current per unit light-emitting area is the largest when the display unit displays white.11-17-2011
20120326184LED LIGHTING FIXTURE AND THE MANUFACTURING METHOD THEREOF - A LED (Light-Emitting Diode) lighting fixture and a manufacturing method thereof are disclosed. The LED lighting fixture comprises a LED module generating light at a wavelength range of 300-700 nm, a lamp cover shielding the LED module, and a phosphor layer. The phosphor layer which is coated on an inner surface towards the LED module comprises at least two types of phosphor mixed at a default ratio for transforming the light of 300-700 nm in wavelength to luminary light in the wavelength range of 400-700 nm.12-27-2012
20120091483ORGANIC LIGHT-EMITTING PANEL AND MANUFACTURING METHOD THEREOF, AND ORGANIC DISPLAY DEVICE - A non-light-emitting cell 04-19-2012
20120286304Recipient Luminophoric Mediums Having Narrow Spectrum Luminescent Materials and Related Semiconductor Light Emitting Devices and Methods - Light emitting devices include a light emitting diode (“LED”) and a recipient luminophoric medium that is configured to down-convert at least some of the light emitted by the LED. In some embodiments, the recipient luminophoric medium includes a first broad-spectrum luminescent material and a narrow-spectrum luminescent material. The broad-spectrum luminescent material may down-convert radiation emitted by the LED to radiation having a peak wavelength in the red color range. The narrow-spectrum luminescent material may also down-convert radiation emitted by the LED into the cyan, green or red color range.11-15-2012
20120286306DIFFUSELY RADIATING LED LIGHT SYSTEM - A lighting device (11-15-2012
20130020595LED MODULE AND LED MODULE MOUNTING STRUCTURE - An LED module includes a substrate having a main surface and a rear surface located opposite the main surface, a main surface electrode located on the main surface, a plurality of penetration electrodes connected to the main surface electrode and extending through the substrate, three or more LED chips arranged on the main surface electrode along a first direction, and a case arranged on the main surface to surround the main surface electrode. The LED chips include at least one LED chip that can emit red light, at least one LED chip that can emit green light and at least one LED chip that can emit blue light.01-24-2013
20120132938LED PACKAGE - According to one embodiment, an LED package includes a first, a second, and a third lead frame separated from one another. The LED package includes a first LED chip of a top surface terminal type having one terminal connected to the second lead frame, and having one other terminal connected to the third lead frame, the first LED chip is mounted on the first lead frame. The LED package includes a first protection chip of a top surface terminal type having one terminal connected to the second lead frame, and having one other terminal connected to the third lead frame, the first protection chip is mounted on the first lead frame. And, a resin body covers a part of the first, second and third lead frames, the first LED chip, and the first protection chip, An outer shape of the resin body forms an outer shape of the LED package.05-31-2012
20100187549LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) package includes a substrate, a plurality of LED chips, and a plurality of electrode pairs. The LED chips are disposed on the substrate, and each of the LED chips is electrically isolated from one another. The electrode pairs are disposed on the substrate, and each of the electrode pairs is electrically isolated from one another. The number of the electrode pairs is equal to the number of the LED chips, and each of the electrode pairs electrically connects one of the LED chips corresponding thereto.07-29-2010
20130009181DISPLAY DEVICE - According to one embodiment, a display device includes a first substrate, a second substrate, a display layer, a seal unit, a protrusion and a spacing adjustment layer. The display layer is provided between the first substrate and the second substrate. The seal unit surrounds the display layer between the first substrate and the second substrate. The protrusion is provided along an outer edge of the seal unit at an outside of the seal unit on a first major surface of the first substrate facing the display layer. The spacing adjustment layer is provided along the outer edge at the outside of the seal unit, includes a portion overlaying the protrusion as viewed along a direction from the first substrate toward the second substrate, and is in contact with the protrusion.01-10-2013
20130009180MOBILE TERMINAL - A mobile terminal including a wireless communication unit configured to wirelessly communicate with at least one other terminal; a display panel configured to display information; a plurality of light source parts spaced apart from each other and configured to output light; a light guide plate provided under the display panel and configured to guide the light output by the light source parts to the display panel; and a quantum dot filter part including a light entrance plane to which light is input and a light exit plane from which the light is wavelength-transformed and discharged. Further, at least one of the light entrance plane and the light exit plane of the quantum dot filter part includes a surface having a predetermined shape characteristic configured to increase an amount of the light input on and passed through the light entrance plane and to increase an amount of the light discharged from the light exit plane.01-10-2013
20130015476DISPLAY UNIT - A display unit that secures favorable display performance and has a simple structure is provided. The display unit includes a multilayer structure in which an organic light emitting device group respectively having a plurality of organic light emitting devices that emits cyan light and a plurality of organic light emitting devices that emits magenta light and a color filter group having a plurality of blue filters that transmit blue light and a plurality of yellow filters that transmit yellow light are sequentially layered. In the display unit, the cyan light and the magenta light entering from the organic light emitting device group to the color filter group is converted to blue light by the blue filter, and is respectively converted to green light and red light by the yellow filter. Therefore, compared to a case that the organic light emitting device group emits white light, color separation is more facilitated.01-17-2013
20120241782DISPLAY DEVICE - A display device including light emitting elements corresponding to respective colors disposed on a substrate. Each light emitting has a cavity structure in which a light emission functioning layer including a light emitting layer is held between a reflecting electrode and a semitransmitting electrode. A cavity order of at least the light emitting element adapted to resonate a light, having the shortest wavelength is 1, and a cavity order of each of other light emitting elements is 0. The light emission functioning layer except for the light emitting layer is common to the light emitting elements corresponding to the respective colors.09-27-2012
20120241781SOLID STATE LIGHTING COMPONENT - An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.09-27-2012
20120241779Light-Radiating Semiconductor Component with a Luminescence Conversion Element - The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce.09-27-2012
20080237615LIGHT-EMITTING DEVICE - A light-emitting device including: a substrate; a light-emitting diode; and an optical resonance layer to resonate light emitted from the light-emitting diode. The optical resonance layer includes a first layer, including a polysilsesquioxane-based copolymer. A linking group connecting two different silicon (Si) atoms of the polysilsesquioxane-based copolymer can be —O—, or a substituted or unsubstituted C10-02-2008
20080237614SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device of the present invention includes a first LED chip whose emitted light is wavelength-converted by a fluorescent substance layer formed by applying and curing a fluorescent substance material, and a second LED chip whose emitted light is not wavelength-converted by the fluorescent substance layer, wherein the first LED chip and the second LED chip are arranged on a substrate in such a way that a level of an emission layer of the second LED chip is higher than that of a top face of the first LED chip above the substrate.10-02-2008
20080230790SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device has an outer lead disposed along an outer wall of a mold resin portion perpendicular to a light-emitting plane of a light emitting diode. An outer lead is also disposed at an outer wall of the mold resin portion parallel to and opposite to the light-emitting plane. The outer wall of the resin mold where the outer lead is disposed is taken as a mount face. Each outer wall of the mold resin portion constituting a mount face includes at least one outer lead for an anode and a cathode. According to the present configuration, there is provided a semiconductor light emitting device that allows selection of side-emission mounting or top-emission mounting with the same components on a mount substrate.09-25-2008
20130140589ORGANIC LIGHT EMITTING DEVICE HAVING IMPROVED LIGHT EMITTING QUALITY - An organic light emitting device includes, a base part, patterned first electrodes on the base part, conductive material layers spaced apart from the patterned first electrodes and between the first electrodes, pixel defining layers between the patterned first electrodes, the pixel defining layers overlapping only a portion of upper surfaces of the conductive material layers, light emitting layers on the first electrodes, and a second electrode on the light emitting layers.06-06-2013
20130140590LIGHT-EMITTING DEVICE WITH TEMPERATURE COMPENSATION - The present application provides a light-emitting device comprising a first light-emitting diode group with a first hot/cold factor comprising a plurality of first light-emitting diode units electrically connected to one another; and a temperature compensation element electrically connected to the first light-emitting diode group, and comprising a first resistor and a second resistor; wherein the first resistor has a first temperature coefficient of resistance and the second resistor has a second temperature coefficient of resistance; and the absolute value of the first temperature coefficient of resistance is ten times greater than that of the second temperature coefficient of resistance.06-06-2013
20080224155LIGHT-EMITTING DIODE UNIT - An LED unit including a frame (09-18-2008
20130175559LED MODULE - An LED module 07-11-2013
20080217630Light emission device - The invention relates to a light emission device, comprising at least two light-emitting semiconductor chips and a substrate. At least one first semiconductor chip (09-11-2008
20120248476LIGHT EMITTING DISPLAY - A color light emitting display includes light-emitting devices constituting a plurality of red, green and blue pixels disposed in a matrix form on a substrate, said light-emitting display takes out light from a side of said light-emitting devices opposite to said substrate on which said light-emitting devices are formed, and wherein when a wavelength of the light having an interference intensity of which with respect to the light emitted from an emissive layer constituting said light-emitting device becomes a maximum value at 0 degree of a viewing angle is λimax, and a wavelength of the light becomes a maximum in a light intensity of the light emitted from said emissive layer is λemax, a relationship of λemax−50 nm≦λimax<λemax is satisfied.10-04-2012
20120248473LIGHT EMITTING SEMICONDUCTOR STRUCTURE - The invention provides a light emitting semiconductor structure, which includes a substrate; a first LED chip formed on the substrate; an adhesion layer formed on the first LED chip; and a second light emitting diode chip formed on the adhesion layer, wherein the second LED chip has a first conductive wire which is electrically connected to the substrate.10-04-2012
20130099263FULL SPECTRUM LED LIGHT SOURCE - A LED light source has a red, blue and green LED triad for generating a full spectrum of colored light that appears to be emanating from a point source. The LED triad is mounted in a CPC that is surrounded by a cylindrical reflector.04-25-2013
20130099264SOLID STATE LIGHT SOURCES BASED ON THERMALLY CONDUCTIVE LUMINESCENT ELEMENTS CONTAINING INTERCONNECTS - Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device.04-25-2013
20130113003LUMINESCENT LIGHT SOURCE AND DISPLAY PANEL HAVING THE SAME - A luminescent light source including a blue light emitting diode (LED) chip, a red LED chip, and a wavelength converting material is provided. The blue LED chip and the red LED chip respectively emit a first light and a second light. A ratio of peak intensity of the second light to peak intensity of the first light ranges from 0.36 to 0.56. The wavelength converting material is disposed around the blue LED chip or the red LED chip and emits a third light. A wavelength of the third light ranges from a wavelength of the first light to a wavelength of the second light.05-09-2013
20130126918LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF - A light emitting device and a fabricating method thereof are described, wherein the light emitting device includes a substrate, a wall, a first LED chip and a light conversion filling. The first LED chip is disposed on a surface of the substrate. The wall is disposed on the surface of the substrate, and surrounds the first LED chip. A first angle between a central axis of the wall and an inner surface of the wall is 0 degree or is acute, a second angle between the central axis of the wall and an outer surface of the wall is 0 degree or is acute, and the outer surface of the wall and the substrate has a space therebetween. The light conversion filling is surrounded by the light conversion wall, and is disposed on the first LED chip.05-23-2013
20130134457OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - An optoelectronic device comprising, a substrate and a first transition stack formed on the substrate comprising a first transition layer formed on the substrate having a hollow component formed inside the first transition layer, a second transition layer formed on the first transition layer, and a reflector rod formed inside the second transition layer.05-30-2013
20130134456OPTICAL ARRANGEMENT FOR A SOLID-STATE LIGHTING SYTEM - An optical arrangement and a solid-state lighting system comprise an optical element having at least one lens where the lens has a faceted surface defining a plurality of facets. An LED light source comprises a plurality of LED chips and is arranged relative to the faceted surface such that the plurality of facets are disposed asymmetrically relative to the plurality of chips such that mixing of light from the plurality of LED chips occurs via the surface.05-30-2013
20100276707DISPLAY APPARATUS AND METHOD THEREOF - A display apparatus includes pixel electrodes disposed on a first base substrate, a second base substrate which faces the first base substrate, color pixels disposed on the second base substrate, the color pixels correspond to the pixel electrodes in a one-to-one correspondence, each color pixel partially covers the corresponding pixel electrode, a common electrode disposed on the second base substrate to cover the pixel electrodes and an electrophoretic layer including a plurality of electrophoretic particles, the electrophoretic layer being interposed between the pixel electrodes and the common electrode.11-04-2010
20080210957LIGHT EMITTING DIODE, METHOD FOR MANUFACTURING LIGHT EMITTING DIODE, INTEGRATED LIGHT EMITTING DIODE, METHOD FOR MANUFACTURING INTEGRATED LIGHT EMITTING DIODE, LIGHT EMITTING DIODE BACKLIGHT, LIGHT EMITTING DIODE ILLUMINATION DEVICE, LIGHT EMITTING DIODE DISPLAY, ELECTRONIC APPARATUS, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - Disclosed herein is a light emitting diode includes: a first semiconductor layer of a first conductivity type; an active layer on the first semiconductor layer; a second semiconductor layer of a second conductivity type on the active layer; a first electrode configured to be electrically coupled to the first semiconductor layer; and a second electrode configured to be provided on the second semiconductor layer and be electrically coupled to the second semiconductor layer, the second electrode including a first metal film that has a predetermined shape and is composed mainly of silver and a second metal film that covers the first metal film and is composed mainly of palladium and/or platinum.09-04-2008
20110215347Increasing Contrast In Electronic Color Displays Via Surface Texturing Of LEDs - In an embodiment, the invention provides a light source comprising a plurality of light-emitting semiconductor chips, a plurality of electrical leads and an encapsulant. The plurality of electrical leads is connected to the plurality of light-emitting semiconductor chips. The encapsulant completely encases the plurality of semiconductor chips. The encapsulant partially encases the plurality of electrical leads.09-08-2011
20080197366White light emitting diode module - A white LED module includes a circuit board, a blue LED chip disposed on the circuit board, a green light source of an LED chip or phosphor disposed on the circuit board, and a red light source of an LED chip or phosphor disposed on the circuit board. At least one of the green and red light sources is a phosphor, which is excited by the blue LED chip to radiate. The blue LED chip emits light in a triangular region defined by color coordinates (0.0123, 0.5346), (0.0676, 0.4633) and (0.17319, 0.0048), the green light source emits light in a triangular region defined by color coordinates (0.025, 0.5203), (0.4479, 0.541) and (0.0722, 0.7894), and the red light source emits light in a triangular region defined by color coordinates (0.556, 0.4408), (0.6253, 0.3741) and (0.7346, 0.2654).08-21-2008
20080197365LIGHT EMITTING DEVICE - A light emitting device includes: a chip-mounting base formed with a plurality of conductive contacts; a reflector mounted on the chip-mounting base and defining a central hole; a first light emitting chip mounted on the chip-mounting base within the central hole and in electrical contact with respective ones of the conductive contacts for generating light with a first primary wavelength; a second light emitting chip stacked on and in electrical contact with the first light emitting chip for generating light with a second primary wavelength different from the first primary wavelength; and an encapsulant filling the central hole and capable of converting the first and second primary wavelengths into first and second secondary wavelengths, respectively.08-21-2008
20080197364Light-emitting device - A light-emitting device comprises a support frame and at least one blue light-emitting chip and at least one red light-emitting chip coupled onto the support frame; and a green phosphor covering the at least one blue light-emitting chip and the at least one red light-emitting chip. The green phosphor is mainly an aluminate of the formula: M08-21-2008
20110227102HIGH EFFICACY LED LAMP WITH REMOTE PHOSPHOR AND DIFFUSER CONFIGURATION - Solid state lamps and bulbs comprising different combinations and arrangements of a light source, wavelength conversion elements with one or more distinct phosphor layers or regions which are positioned separately or remotely with respect to the light source, and a diffuser element are provided. These elements may be arranged on or in conjunction with a thermal management device that allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern (even with a light source comprised of a co-planar arrangement of lighting devices such as LEDs). Various embodiments of the invention may be used to address many of the difficulties associated with utilizing efficient solid state light sources such as LEDs in the fabrication of lamps or bulbs suitable for direct replacement of traditional incandescent bulbs. Embodiments of the invention can be arranged to fit recognized standard size profiles such as those ascribed to commonly used lamps such as incandescent light bulbs, while still providing emission patterns that comply with ENERGY STAR® standards.09-22-2011
20110248293SURFACE MOUNT DEVICE THIN PACKAGE - The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.10-13-2011
20110233577LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed are a light emitting device and a method for manufacturing the same. The light emitting device includes a substrate having a lead frame, a light emitting diode mounted on the substrate, a mold member formed on the substrate and the light emitting diode, and a reflecting member having an opening portion at one side thereof and being inclined at an outer portion of the mold member.09-29-2011
20110233576ORGANIC EL DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, an organic EL device includes a first organic EL element, a second organic EL element and a third organic EL element. The first organic EL element has a first electrode, a second electrode, and a first emitting layer. The second organic EL element has a third electrode, a fourth electrode, and a second emitting layer. At least a part of the first emitting layer extends on the second emitting layer. A third organic EL element has a fifth electrode, a sixth electrode, and a third emitting layer. At least a part of the first and the second emitting layers extends on the third emitting layer. A thickness of the first emitting layer between the first and the second electrodes is thicker than a thickness of the first emitting layer extending on the second and the third emitting layers.09-29-2011
20110233575SINGLE PHOSPHOR LAYER PHOTONIC DEVICE FOR GENERATING WHITE LIGHT OR COLOR LIGHTS - A photonic device generates light from a full spectrum of lights including white light. The device includes two or more LEDs grown on a substrate, each generating light of a different wavelength and separately controlled. A light-emitting structure is formed on the substrate and apportioned into the two or more LEDs by etching to separate the light-emitting structure into different portions. At least one of the LEDs is coated with a phosphor material so that different wavelengths of light are generated by the LEDs while the same wavelength of light is emitted from the light-emitting structure.09-29-2011
20100314639LIGHT EMITTING DEVICE AND DISPLAY DEVICE USING THE SAME - The light emitting device (12-16-2010
20100314638DISPLAY DEVICE, DISPLAY APPARATUS AND METHOD OF ADJUSTING A COLOR SHIFT OF WHITE LIGHT IN SAME - A display device includes: an optical cavity portion; and a light emitting layer, wherein a peak wavelength of an internal emission spectrum of the light emitting layer is identical to a peak wavelength of a multiple interference filter spectrum of the optical cavity portion, and wherein a color shift Δ uv of white light in the display device at a viewing angle of 60° is less than or equal to 0.015. A method of adjusting a color shift of white light in a display device includes: setting a peak wavelength of a multiple interference filter spectrum obtained by an optical cavity portion in the display device equal to a peak wavelength of an internal emission spectrum of a light emitting layer in the display device; and adjusting a position of the light emitting layer in a thickness direction thereof.12-16-2010
20110254027METHOD FOR CONTROLLING COLOR ACCURACY IN A LIGHT-EMITTING SEMICONDUCTOR-BASED DEVICE AND PROCESS FOR PRODUCING A LIGHT-EMITTING SEMICONDUCTOR-BASED DEVICE WITH CONTROLLED COLOR ACCURACY - A method for controlling color accuracy of a light-emitting semiconductor-based device, and a process for producing a light-emitting semiconductor-based device with desired color accuracy is disclosed. The color accuracy is controlled by defining a desired color accuracy of a light produced by mixing colors emitted by at least two light sources over a first range of operating conditions; determining characteristics of the light as a function of operating conditions; and establishing desired light characteristics of the at least two light sources over a second range of operating condition in accordance with the step of defining and the step of determining.10-20-2011
20110291129OPTOELECTRONIC DEVICE - An optoelectronic device that emits mixed light includes light in a first and a second wavelength range, including a first semiconductor light source having a first light-emitting diode, which during operation emits light in the first wavelength range with a first intensity; a second semiconductor light source having a second light-emitting diode, which during operation emits light in the second wavelength range with a second intensity, wherein the first and second wavelength ranges are different from one another; and a resistance element having a temperature-dependent electrical resistance, wherein the first wavelength and/or the first intensity of the light emitted by the first semiconductor light source have/has a first temperature dependence, and the second wavelength range and/or the second intensity of the light emitted by the second semiconductor light source have/has a second temperature dependence, which is different from the first temperature dependence, the resistance element and the first semiconductor light source form a series circuit, and the series circuit and the second semiconductor light source form a parallel circuit.12-01-2011
20110309390Lighting Device Comprising Leds With Phosphor Layers - A lighting device comprising LEDs with phosphor layers includes a plurality of LED sets which can emit light with a peak emission wavelength between 360 nm and 490 nm; and a plurality of sets of phosphor layers covering the corresponding LED sets among the plurality of LED sets. At least two of the plurality of LED sets respectively have peak emission wavelength different from each other. The dominant fluorescence wavelength of at least one of the plurality of sets of phosphor layers ranges from 500 nm to 580 nm, and the dominant fluorescence wavelength of at least one of the other sets of phosphor layers ranges from 590 nm to 650 nm.12-22-2011
20110309389FULL-COLOR ACTIVE MATRIX ORGANIC LIGHT EMITTING DISPLAY WITH HYBRID - A full-color AM OLED includes a transparent substrate, a color filter positioned on an upper surface of the substrate, and a metal oxide thin film transistor backpanel positioned in overlying relationship on the color filter and defining an array of pixels. An array of OLEDs is formed on the backpanel and positioned to emit light downwardly through the backpanel, the color filter, and the substrate in a full-color display. Light emitted by each OLED includes a first emission band with wavelengths extending across the range of two of the primary colors and a second emission band with wavelengths extending across the range of the remaining primary color. The color filter includes for each pixel, two zones separating the first emission band into two separate primary colors and a third zone passing the second emission band.12-22-2011
20110309388SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD - A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located over at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, a frame located on the base board, the chip mounted on the base board, a transparent material layer located between the wavelength converting layer and a side surface of the chip so as to extend toward the wavelength converting layer, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the reflective material layer as a reflector, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.12-22-2011
20110309387LIGHT EMITTING DIODE AND LIGHT MODULE HAVING SAME - An LED includes an LED chip, a first package configured for packaging the LED chip, the first package including a flat first surface, and a second package including a second surface opposing the first surface. A micro-structure is defined in the second surface and protruding toward the first surface. A gap is maintained between the first and second surfaces. The gap is filled with a filler, and the refractive index of the filler is smaller than that of the first and second packages. Light generated by the LED chip radiates first through the first package, then the gap and the micro-structure, thereafter the second package to finally reach an outside of the LED. A light module including the LED is also provided.12-22-2011
20090166647Multi-wavelength LED array package module and method for packaging the same - A method for packaging a multi-wavelength LED array package module includes: forming at least one concave groove on a drive IC structure; arranging a multi-wavelength LED array set in the at least one concave groove; solidifying a plurality of liquid conductive materials to form a plurality of conductive elements that is electrically connected between the drive IC structure and the multi-wavelength LED array set by a printing, a coating, a stamping, or a stencil printing process; arranging the drive IC structure on a PCB with at least one input/output pad; and then forming a conductive structure that is electrically connected between the drive IC structure and the at least one input/output pad.07-02-2009
20120001206Organic light emitting diode display and fabricating method thereof - An organic light emitting diode display and a fabrication method thereof, the display including a substrate; a thin film transistor on the substrate; and an organic light emitting diode on the substrate, the organic light emitting diode including a pixel electrode, an organic emission layer, and a common electrode, wherein the organic emission layer includes a red (R) pixel, a green (G) pixel, and a blue (B) pixel, the pixel electrode includes a first pixel electrode, a second pixel electrode, and a third pixel electrode that respectively correspond to the red pixel, the green pixel, and the blue pixel, the first pixel electrode, the second pixel electrode, and the third pixel electrode each have different thicknesses, and the first pixel electrode, the second pixel electrode, and the third pixel electrode each include a first hydrophobic layer.01-05-2012
20120018751LIGHTING DEVICE - A first lighting device comprises at least one plural cavity element and a plurality of solid state light emitters. A second lighting device comprises at least one plural cavity element, a plurality of solid state light emitters and at least one encapsulant region, at least a portion of the plural cavity element being surrounded by the encapsulant region. Each plural cavity element has at least two optical cavities. Each optical cavity comprises a concave region in the plural cavity element. At least one solid state light emitter is present in each of at least two of the optical cavities.01-26-2012
20120018750SEMICONDUCTOR OPTOELECTRONIC DEVICE AND THE METHOD OF MANUFACTURING THE SAME - A semiconductor optoelectronic device comprises an operating substrate; a semiconductor epitaxial stack unit disposed on the operating substrate comprising a first semiconductor material layer having a first electrical conductivity disposed on the operating substrate and a second semiconductor material layer having a second electrical conductivity disposed on the first semiconductor material layer; a transparent conductive layer disposed on the second semiconductor material layer, wherein the transparent conductive layer comprises a first surface, a directly contacting part disposed on the first surface and directly contacting with the second semiconductor material layer, a second surface substantially parallel with the first surface, and a directly contacting corresponding part disposed on the second surface corresponding to the directly contacting part; and a first electrode disposed on the operating substrate and electrically connected with the semiconductor epitaxial stack by the transparent conductive layer, wherein the first electrode is connected with the transparent conductive layer by an area excluding the directly contacting part and the directly contacting corresponding part.01-26-2012
20120018749ORGANIC LIGHT EMITTING DISPLAY APPARATUS AND METHOD FOR MANUFACTURING THE SAME - An organic light emitting display apparatus is manufactured using a simplified manufacturing process and prevents or reduces the formation of dark spots. The organic light emitting display apparatus includes: red, green, and blue sub-pixel regions, each including a first electrode on a substrate; a distributed Bragg reflector (DBR) layer between the substrate and the first electrode; a hole injection layer on the DBR layer and covering the first electrode; a hole transport layer on the hole injection layer; an auxiliary layer between the hole injection layer and the hole transport layer in the green sub-pixel region; a green light-emission layer on the hole transport layer in the blue and green sub-pixel regions; a blue light-emission layer on the green light-emission layer in the blue sub-pixel region; and a red light-emission layer on the hole transport layer in the red sub-pixel region.01-26-2012
20130207136CHIP-ON-BOARD LEDS PACKAGE WITH DIFFERENT WAVELENGTHS - A chip-on-board LEDs package with different wavelengths is provided. The substrate has a conductive layer to connect LEDs with different wavelengths, color temperatures and packages. Therefore, the LEDs could be formed an illuminant matrix with different types connected thereof. Also, a lens is disposed on the illuminant matrix to protect the chip-on-board LEDs structure and enhance luminous efficiency.08-15-2013
20130207137COB-Typed LED Light Board - A COB-typed LED light board for providing mixing light includes a substrate and a plurality of COB light bodies. The COB light bodies, which are provided on a mounting surface of the substrate, emit light with two or more different spectrums. A space distance between the adjacent two LED chips is smaller than 20 mm and is larger than a width of a single LED chip, the outer surface of a glue body which does not contact the mounting surface is provided to contact external atmosphere, and a middle portion of the glue body, formed by cohesion, is higher than a periphery portion thereof, to thus have the COB light bodies with excellent heat dissipation and an even mixing light.08-15-2013
20130207138DISPLAY UNIT, METHOD OF MANUFACTURING SAME, ORGANIC LIGHT EMITTING UNIT, AND METHOD OF MANUFACTURING SAME - A display unit capable of being simply designed and manufactured by using more simplified light emitting device structure while capable of high definition display and display with superior color reproducibility and a manufacturing method thereof are provided. The display unit is a display, wherein a plurality of organic EL devices in which a function layer including a light emitting layer is sandwiched between a lower electrode made of a light reflective material and a semi-transmissive upper electrode, and which has a resonator structure in which light emitted in the light emitting layer is resonated using a space between the lower electrode and the upper electrode as a resonant section and is extracted from the upper electrode side are arranged on a substrate. In the respective organic EL devices, the function layer is made of an identical layer, and an optical distance of the resonant section is set to a value different from each other so that blue, green, or red wavelength region is resonated.08-15-2013

Patent applications in class Multi-color emission

Patent applications in all subclasses Multi-color emission