Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Plural light emitting devices (e.g., matrix, 7-segment array)

Subclass of:

257 - Active solid-state devices (e.g., transistors, solid-state diodes)

257079000 - INCOHERENT LIGHT EMITTER STRUCTURE

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
257089000 Multi-color emission 406
257091000 With shaped contacts or opaque masking 135
257093000 With electrical isolation means in integrated circuit structure 43
Entries
DocumentTitleDate
20110175116LIGHT-EMITTING DEVICE, PRODUCTION METHOD THEREFOR, AND DISPLAY CONTAINING THE SAME - The present invention provides a light-emitting device which includes, in the order mentioned, a light-emitting layer containing a light-emitting portion, an intermediate layer, and a fine concavo-convex pattern, wherein the intermediate layer is disposed over a second surface of the light-emitting layer which surface is opposite to a first surface of the light-emitting layer, wherein the fine concavo-convex pattern has a cross-sectional shape which has portions projected and recessed with respect to the light-emitting layer, and reflects light emitted from the light-emitting layer, and wherein at least part of the intermediate layer has a refractive index of 0.9n to 1.1n, where n denotes a refractive index of the light-emitting portion with respect to light which has a main light-emitting wavelength.07-21-2011
20110175115DEPOSITION MASK, METHOD FOR MANUFACTURING DISPLAY UNIT USING IT, AND DISPLAY UNIT - A deposition mask and a display unit and method of manufacturing same are provided. A red continuous organic layer, a green continuous organic layer, and a blue continuous organic layer are provided over two or more lines of a matrix configuration of organic light emitting devices in common. A film thickness distribution in the extensional direction of the red, green and blue continuous organic layer is dissolved, and an aperture ratio can be improved by just that much.07-21-2011
20110175114FILM-COVERED LED DEVICE - A film-covered LED device includes a high thermal conductive substrate, a reflector, a plurality of LED chips, and a fluorescent film. A pair of electrical contacts is respectively disposed on two ends of the high thermal conductive substrate. A thru opening is formed on the reflector, which is disposed on the high thermal conductive substrate. The LED chips are disposed on the high thermal conductive substrate and connected electrically, within the thru opening. The fluorescent film is disposed on the reflector and casted over the LED chips. Thereby, the LEDs illumination is more evenly distributed, in maintaining illumination efficiency uniformity. The yield rate is also enhanced with savings in labor cost.07-21-2011
20130099260RESIST STRIPPING COMPOSITION AND METHOD OF STRIPPING RESIST USING THE SAME - Disclosed herein is a resist stripping composition, which has an excellent ability of stripping a residual resist remaining after dry or wet etching at the tune of forming patterns in a process of manufacturing a flat panel display substrate.04-25-2013
20130043496LIGHTING DEVICE - A lighting device with front carrier, rear carrier and plurality of light-emitting diode chips, which when in operation emits light and releases waste heat, wherein rear carrier is covered at least in selected locations by front carrier, light-emitting diode chips are arranged between rear carrier and front carrier to form array, light-emitting diodes are contacted electrically by rear and/or front carrier and immobilized mechanically by rear carrier and front carrier, front carrier is coupled thermally conductively to light-emitting diode chips and includes light outcoupling face remote from light-emitting diode chips, which light outcoupling face releases some of waste heat released by light-emitting diode chips into surrounding environment, each light-emitting diode chip is actuated with electrical nominal power of 100 mW or less when lighting device is in operation and has light yield of 100 lm/W or more.02-21-2013
20130043494LIGHT EMITTING DIODE PACKAGE - The present invention relates to a light emitting diode package which can reduce a wire length, and can improve heat and light resistance. The light emitting diode package includes a molded portion having a housing, a plurality of light emitting chips housed in the housing, a plurality of main lead portions having the plurality of light emitting chips mounted thereto respectively, at least one sub-lead portion formed spaced from the main lead portions and electrically connected to at least any one of the plurality of main lead portions and the plurality of light emitting chips with a wire for electrically connecting the plurality of light emitting chips each other.02-21-2013
20110198626SUBSTRATE REMOVAL PROCESS FOR HIGH LIGHT EXTRACTION LEDS - A method for fabricating light emitting diode (LEDs) comprises providing a plurality of LEDs on a substrate wafer, each of which has an n-type and p-type layer of Group-III nitride material formed on a SiC substrate with the n-type layer sandwiched between the substrate and p-type layer. A conductive carrier is provided having a lateral surface to hold the LEDs. The LEDs are flip-chip mounted on the lateral surface of the conductive carrier. The SiC substrate is removed from the LEDs such that the n-type layer is the top-most layer. A respective contact is deposited on the n-type layer of each of the LEDs and the carrier is separated into portions such that each of the LEDs is separated from the others, with each of the LEDs mounted to a respective portion of said carrier.08-18-2011
20110198620BARRIER FILM COMPOSITE AND DISPLAY APPARATUS INCLUDING THE BARRIER FILM COMPOSITE - A barrier film composite includes a decoupling layer and a barrier layer. The barrier layer includes a first region and a second region that is thinner than the first region.08-18-2011
20120199854ACTIVE MATRIX SUBSTRATE AND ORGANIC EL DISPLAY DEVICE - The present invention provides an active matrix substrate driven by an analog gray scale method, and an organic EL display device, in which decrease in response speed of a current emissive element is suppressed. The active matrix substrate of the present invention is driven by an analog gray scale method and is provided with a pixel that has a current emissive element and a transistor that supplies current to the current emissive element. The pixel further has a compensation circuit for compensating variability of threshold voltage in the transistor; the current emissive element has a pixel electrode electrically connected to the transistor; a gate electrode of a transistor that makes up the compensation circuit forms a region covered with the pixel electrode; and a part or the entirety of the gate electrode that is positioned within the region is provided in a wiring layer that is lower than a wiring layer directly below the pixel electrode.08-09-2012
20130043493LIGHT-EMITTING DIODE STRUCTURE - A light-emitting diode (LED) structure includes a substrate, a plurality of LED chips, a first colloid, a second colloid, and a lens. The substrate is provided with at least one retaining section, and the LED chips are mounted on the substrate and covered by the first colloid. The second colloid is located to one side of the first colloid opposite to the substrate. The lens is provided with at least one catching section correspondingly engaged with the at least one retaining section, so that the lens is connected to the substrate to form a unitary body through engagement of the catching section with the retaining section and closes the LED chips, the first colloid and the second colloid in between the lens and the substrate. With these arrangements, the LED structure can have upgraded lighting efficiency and allows quick change of LED color temperature or LED beam angle.02-21-2013
20110180816SEMICONDUCTOR DEVICE, DISPLAY, ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A method is described for manufacturing a semiconductor device that comprises the steps of providing on a substrate a layer of a conducting material in a pattern comprising isolated elements having a first set of edges. The method further includes providing, on the substrate, a series of wall structures for forming one or more cavities there between. The wall structures have a second set of edges cooperating with the first set of edges. The second set of edges is positioned outside the first set of edges by a pre-defined distance. The method furthermore includes depositing a liquid material in the cavities. A display and an electronic apparatus incorporating the above described features is also disclosed.07-28-2011
20130043497Packaging Device for Matrix-Arrayed Semiconductor Light-Emitting Elements of High Power and High Directivity - A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.02-21-2013
20090194774Light source module with wavelength converting structure and the method of forming the same - A light source package module with a wavelength converting structure is provided. The light source package module comprises a frame having a substrate and sidewalls formed on the substrate. A plurality of LED dice is disposed on the substrate, and there is a space between each of the LED dice. A wavelength converting structure is disposed on above the plurality of LED dice and the sidewalls. The light source package can provide a flat light source with a large emitting area can be made in simply as well. Additionally, the present invention further relates to the application of a backlight module.08-06-2009
20100051972Light-Emitting Diode Integration Scheme - A circuit structure includes a carrier substrate, which includes a first through-via and a second through-via. Each of the first through-via and the second through-via extends from a first surface of the carrier substrate to a second surface of the carrier substrate opposite the first surface. The circuit structure further includes a light-emitting diode (LED) chip bonded onto the first surface of the carrier substrate. The LED chip includes a first electrode and a second electrode connected to the first through-via and the second through-via, respectively.03-04-2010
20110284878LIGHT EMITTING DIODE MODULE, AND LIGHT EMITTING DIODE LAMP - A light emitting diode (LED) lamp including a socket, an LED module disposed on the socket, and a lamp housing assembled to the socket is provided. LED module includes a supporting member and a plurality of LED packages, wherein each LED package includes a chip carrier, a reflective member, an LED chip, a lens, and a phosphor layer. Reflective member mounted on the chip carrier has a recess for exposing parts of the chip carrier. LED chip disposed in the recess. Lens encapsulating the LED chip has a light-emitting surface, a first reflection surface bonded with the reflective member and a second reflection surface, wherein the LED chip faces the light-emitting surface of the lens.11-24-2011
20130134454WATER RESISTANT LED DEVICES AND AN LED DISPLAY INCLUDING SAME - The disclosure provides an LED package including a first plastic portion having a mounting surface and a lower surface. In some embodiments, the LED package includes a second portion surrounding the first plastic portion and exposing the mounting surface and the lower surface of the first plastic portion. In other embodiments, the first plastic portion includes at least one of a hole or a protrusion and the second portion includes corresponding structure filing the hole or surrounding the protrusion of the first plastic portion. The first plastic portion and the second portion have different optical properties.05-30-2013
20130134453TRANSISTOR, METHOD OF MANUFACTURING TRANSISTOR, DISPLAY UNIT, AND ELECTRONIC APPARATUS - A transistor includes: a gate electrode; a semiconductor layer facing the gate electrode, with an insulating layer interposed in between; an etching stopper layer on the semiconductor layer; a pair of contact layers provided on the semiconductor layer, at least on both sides of the etching stopper layer; and source-drain electrodes electrically connected to the semiconductor layer through the pair of contact layers, and being in contact with the insulating layer.05-30-2013
20090230409UNDERFILL PROCESS FOR FLIP-CHIP LEDS - An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.09-17-2009
20130043495ACTIVE MATRIX SUBSTRATE AND DISPLAY DEVICE - The present invention provides an active matrix substrate in which a peripheral can be narrowed or a gap between adjacent wirings increased to improve a yield. The present invention is an active matrix substrate in which a peripheral region is provided outside a display region. In the active matrix substrate, a first, a second, and a third transistor, a floating wiring, a switching wiring, a main wiring, and a branch wiring electrically connected with the main wiring are arranged in the peripheral region. The floating wiring and branch wiring each electrically connect the first and second transistors and comprise an intersecting portion intersecting with the switching wiring, with the third transistor being provided at the intersecting portion. A gate electrode of the third transistor includes the switching wiring, one of a source electrode and a drain electrode thereof includes the branch wiring, and the other of the source electrode and the drain electrode includes the floating wiring.02-21-2013
20080258158LIGHT EMISSION DEVICE - A light emission device includes a plurality of semiconductor light emitting elements and a supporting substrate on which the plurality of semiconductor light emitting elements are flip-chip mounted. Each of the plurality of semiconductor light emitting elements has a substantially rectangular shape which has a first side and a second side different from the first side. Light emitted from a first element end face on the first side is stronger than light emitted from a second element end face on the second side. Each first side of each of the plurality of semiconductor light emitting elements faces each other substantially in parallel.10-23-2008
20080258157Packaging Method Of LED Of High Heat-Conducting Efficiency And Structure Thereof - A packaging method of LED of high heat-conducting efficiency and a structure thereof firstly is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein. Meanwhile, a fluorescent glue is attached to the light-emitting chip set, the gold wires and the metallic circuits. Eventually, an epoxy resin is filled into the interior of the ringed object to be dry for forming an epoxy resin layer. Thus, a packaging manufacture of LED is completed.10-23-2008
20080258156Light-emitting diode apparatus - In a light-emitting diode apparatus, light emitted from a principal plane of an emission layer has a plurality of unequal luminous intensities depending on the in-plane azimuth angle of the principal plane of the emission layer, and at least one of a light-emitting diode chip and a package has a structure of reducing difference in the intensity of light emitted from the package according to variation in the in-plane azimuth angle of a chip-arrangement surface.10-23-2008
20110193104LIQUID MATERIAL DISPENSING APPARATUS AND METHOD OF DISPENSING LIGHT EMITTING MATERIALS FOR ORGANIC LIGHT EMITTING DIODE - A liquid dispensing apparatus is disclosed. In one embodiment, the apparatus includes i) a first moving unit configured to move in a first direction that is a movement direction of a patterning target object and ii) a second moving unit configured to move in a second direction crossing the first direction. The apparatus further includes a dispensing unit formed on the second moving unit; and a third moving unit formed between the first moving unit and the second moving unit and configured to rotate the second moving unit and the dispensing unit with respect to the first moving unit on a virtual plane that is substantially parallel to the first and second directions.08-11-2011
20110193103SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING THE SEMICONDUCTOR DEVICE, SUBSTRATE FOR SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCING THE SUBSTRATE - A semiconductor device is provided with a porous structure layer formed by silicone resin between a substrate and a semiconductor element. Alternatively, a porous layer having a density of 0.7 g/cm08-11-2011
20110193107LIGHT-EMITTER, METHOD OF MANUFACTURING THE SAME AND LIGHT EMITTING DEVICE - A light-emitter includes a first electrode and a layered body over the first electrode. The layered body includes a charge injection layer and a light-emitting layer. A bank defines a position of the light-emitting layer of the layered body, and a second electrode is over the layered body. The charge injection layer is formed by oxidation of an upper portion of a metal. The first electrode includes a metal layer that is a lower portion of the metal. An inner portion of the charge injection layer is depressed to define a recess. A portion of the bank is on an outer portion of the charge injection layer.08-11-2011
20110193106Solid State Light Sheet for General Illumination Having Metal Interconnector Through Layer for Connecting Dies in Series - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.08-11-2011
20110193105Solid State Light Sheet for General Illumination Having Substrates for Creating Series Connection of Dies - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.08-11-2011
20130037833Optical Device and Method for Manufacturing Same - The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate.02-14-2013
20130037834LIGHT EMITTING ELEMENT MODULE SUBSTRATE, LIGHT EMITTING ELEMENT MODULE, AND ILLUMINATING DEVICE - According to an aspect of the invention, there is provided a light emitting element module substrate including: a laminated plate; and a metal layer. The laminated plate includes a base metal plate and an insulating layer provided on the base metal plate. The metal layer is provided on the insulating layer. The metal layer includes a mounting section on which a light emitting element is to be mounted, and a bonding section to which a wiring electrically connected to the light emitting element is to be bonded. The metal layer includes a silver layer which is an uppermost layer of at least one of the mounting section and the bonding section and is formed by electrolytic plating. The mounting section and the bonding section are electrically isolated from a periphery of the laminated plate.02-14-2013
20130037832FOLDABLE DISPLAY STRUCTURES - One embodiment provides a structure, comprising: a display; at least one structural component disposed over a portion of the display, wherein the at least on structural component comprises at least one amorphous alloy; and wherein a portion of the display is foldable.02-14-2013
20130037831Opto-Electronic Module and Method for Manufacturing The Same - A method for manufacturing a device that includes an opto-electronic module includes creating a wafer stack including multiple active optical components mounted on a substrate wafer, and an optics wafer including multiple passive optical components. The optics wafer can include a blocking portion, which is substantially non-transparent for at least a specific wavelength range, and a transparent portion, which is substantially non-transparent for the specific wavelength range. Each opto-electronic module includes a substrate member, an optics member, an active optical component mounted on the substrate member, and a passive optical component. The optics member is directly or indirectly fixed to the substrate member. The opto-electronic modules can have excellent manufacturability, small dimensions and high alignment accuracy.02-14-2013
20130037830LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode package includes a heat-dissipating substrate including a reflective groove having a lower bottom surface, an upper opening having a width greater than the lower bottom surface, and an inclined surface formed between the upper opening and the lower bottom surface and mounting grooves, each formed in the reflective groove and having a lower bottom surface, an upper opening having a width greater than the lower bottom surface, and an inclined surface formed between the upper opening and the lower bottom surface; an insulating layer selectively formed on the heat-dissipating substrate; wiring pattern layers formed on the insulating layer and extending to bottom surfaces of the mounting grooves to be selectively formed thereon; a light emitting diode chip mounted in each of the mounting grooves; and a molding layer formed around the light emitting diode chip.02-14-2013
20130037827OLED LIGHT PANEL WITH CONTROLLED BRIGHTNESS VARIATION - Embodiments may provide a light source with a controlled brightness variation. A first device is provided that includes a substrate and a plurality of OLEDs disposed on the substrate. Each of the OLEDs includes a first electrode, a second electrode, and an organic electroluminescent (EL) material disposed between the first and the second electrodes. The plurality of OLEDs comprise a first group and a second group where a first current density is supplied to the first group of the plurality of OLEDs and a second current density that is different from the first current density is supplied to the second group of the plurality of OLEDs. Each of the plurality of OLEDs is commonly addressable and at least one of the OLEDs in the first group of OLEDs has substantially the same device structure as at least one of the OLEDs in the second group of OLEDs.02-14-2013
20130037828ORGANIC LIGHT-EMITTING DISPLAY AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display and a method of manufacturing the organic light-emitting display are disclosed. In one embodiment, the organic light-emitting display includes: i) a pixel electrode disposed on a substrate, ii) an opposite electrode disposed opposite to the pixel electrode, iii) an organic emission layer disposed between the pixel electrode and the opposite electrode; a light-scattering portion disposed between the substrate and the organic emission layer, including a plurality of scattering patterns for scattering light emitted from the organic emission layer in insulating layers having different refractive indexes. The display may further include a plurality of light absorption portions disposed between the light-scattering portion and the organic emission layer to correspond to the scattering patterns.02-14-2013
20130037829DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A display substrate includes a base substrate; a first metal pattern disposed on the base substrate and comprising a first signal line and a first electrode electrically connected to the first signal line; and a buffer pattern disposed at a corner between a sidewall surface of the first metal pattern and the base substrate.02-14-2013
20100163891LIGHT EMITTING DIODE - An LED includes a substrate, two LED dies mounted on the substrate, an encapsulant molded on the substrate and sealing the two LED dies, and two phosphors contained within the encapsulant and surrounding the two LED dies, respectively. The two phosphors are distributed on the two LED dies in same density and different thicknesses, whereby the mixed light from one LED die and one phosphor has a color temperature different from that mixed from another LED die and another phosphor.07-01-2010
20100163890LED LIGHTING DEVICE - An LED lighting device comprising an integral body comprising a dielectric thermally conductive polymer has an electrically conductive material directly attached to, or at least in part is molded within the body and forms a circuit pattern. Two or more LED die each having at least a portion thereof being attached directly either to one of a portion of the first body for direct thermal conduction or a portion of the electrically conductive material for direct electrical and thermal conduction or both. The integral body is optionally molded to have integral cooling surfaces such as fins. The integral body also may take a shape conforming to a mounting structure of a lighting fixture and may also include thereon additional electrical components for assisting the LED die in producing light, in other words drive components. Terminals may be integrally molded or formed in the body upon which a portion of the conductive material resides for electrical connection to another device such as a power source.07-01-2010
20120175647DISPLAY DEVICE AND ELECTRONIC APPARATUS - A display device including: a plurality of sub-pixels arranged in a matrix, each including an electro-optical element having a structure in which a display functional layer is sandwiched between an upper electrode and a lower electrode; and an auxiliary interconnect contact in a pixel area in which the plurality of sub-pixels are arranged in a matrix and electrically connecting the upper electrode to an auxiliary interconnect, wherein m (m is an integer equal to or larger than two) sub-pixels adjacent to each other along an arrangement direction of the sub-pixels are regarded as one group, and n (n is a natural number smaller than m) auxiliary interconnect contacts are formed for each group.07-12-2012
20100117099Multi-chip light emitting diode modules - A multi-chip lighting module is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device comprises a substantially thermally dissipative substrate with a dark insulating layer deposited on a surface of the substrate. A plurality of light emitting devices is also provided. An electrically conductive layer is applied to a surface of the substrate, with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices. Each light emitting device has a first and a second electrical terminal. A reflective layer is also provided that at least partially covers the conductive layer.05-13-2010
20100072494LIGHT EMITTING DIODE HAVING LIGHT EMITTING CELL WITH DIFFERENT SIZE AND LIGHT EMITTING DEVICE THEREOF - There is provided a light emitting diode operating under AC power comprising a substrate; a buffer layer formed on the substrate; and a plurality of light emitting cells formed on the buffer layer to have different sizes and to be electrically isolated from one another, the plurality of light emitting cells being connected in series through metal wires.03-25-2010
20100072493ACTIVE MATRIX SUBSTRATE - In an active matrix substrate (03-25-2010
20100072492Package Substrate and Light Emitting Device Using the Same - A package substrate of the present invention at least comprises a metal substrate and a plurality of light emitting dies. The metal substrate is provided thereon with at least one trench. The trench is recessed into the surface of the metal substrate through an insulating layer. The light emitting dies are secured in the trench and electrically connected to a predetermined wiring layer on the metal substrate by metal wires, thereby obtaining a light emitting die package substrate with good thermal conductivity, high heat dissipation, separate electrical and thermal paths and a simple and firm structure.03-25-2010
20100072491LED chip module - A LED chip module comprises a base board comprising a PCB circuit therein; and a LED chip mounting on the base board comprising a supporting frame comprising a case having a peripheral wall defining an inner room therein, and a plurality of pairs of pins provided at both sides of the case, wherein each pair of pins extending through the peripheral wall of both sides of the case respectively from the inner room of the case to the outside of the case connecting with the PCB circuit; and a LED circuit is disposed in the case, which comprises a plurality of LEDs and a plurality of pairs of conducting wires, wherein each pair of conducting wire have one end connecting to the both sides of a LED respectively, and has another end connecting to a pair of pins in the inner room of the case respectively.03-25-2010
20100072489SEMICONDUCTOR LIGHT EMITTING DEVICES GROWN ON COMPOSITE SUBSTRATES - A plurality of III-nitride semiconductor structures, each comprising a light emitting layer disposed between an n-type region and a p-type region, are grown on a composite substrate. The composite substrate includes a plurality of islands of III-nitride material connected to a host by a bonding layer. The plurality of III-nitride semiconductor structures are grown on the III-nitride islands. The composite substrate may be formed such that each island of III-nitride material is at least partially relaxed. As a result, the light emitting layer of each semiconductor structure has an a-lattice constant greater than 3.19 angstroms.03-25-2010
20100072488LED WITH CONTROLLED ANGULAR NON-UNIFORMITY - A light source that uses a light emitting diode with a wavelength converting element is configured to produce a non-uniform angular color distribution, e.g., Δu′v′>0.015 within an angular distribution from 0° to 90°, that can be used with specific light based device that translate the angular color distribution into a uniform color distribution. The ratio of height and width for the wavelength converting element is selected to produce the desired non-uniform angular color distribution. The use of a controlled angular color non-uniformity in the light source and using it in applications that translate the non-uniformity into a uniform color distribution, e.g., with a uniformity of Δu′v′<0.01, increases the efficiency of the system compared to conventional systems in which a uniform angular light emitting diode is used.03-25-2010
20100072490LOW COST FLEXIBLE DISPLAY SHEET - Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, onto a subsequent flexible surface using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be flexible or rigid. In some embodiments, the release member can be used with an intermediate transfer member. In some embodiments the IC element can be incorporated into a subsequent flexible surface including components for a TV, radiographic detector, sensor array, or any similar product having a requirement to emit, detect, or collect energy. In addition, the IC elements can be RF emitting, or visually emitting.03-25-2010
20130032833LED MODULE AND LED LAMP HAVING THE LED MODULE - An LED module includes a first dielectric layer, and a first patterned conductive layer having first, second, and third die-bonding pads. Each die-bonding pad includes a pad body having a die-bonding area, and an extension extended from the pad body. The extension of the first die-bonding pad extends in proximity to the die-bonding area of the second die-bonding pad. The extension of the second die-bonding pad extends in proximity to the die-bonding area of the third die-bonding cad. A second dielectric layer disposed on the first patterned conductive layer includes three dielectric members corresponding respectively to the die-bonding pads of the first patterned conductive layer. Each dielectric member includes a chip-receiving hole exposing the die-bonding area of a respective die-bonding pad for attachment of an LED chip thereto, and a wire-passage hole spaced apart from the chip-receiving hole to expose partially the first patterned conductive layer for bonding a wire.02-07-2013
20130032829DEPOSITION SOURCE ASSEMBLY, ORGANIC LAYER DEPOSITION APPARATUS, AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS BY USING THE ORGANIC LAYER DEPOSITION APPARATUS - An organic layer deposition apparatus, and a method of manufacturing an organic light-emitting display device by using the organic layer deposition apparatus. Here, the organic layer deposition apparatus includes a deposition source assembly. The deposition source assembly includes a first deposition source for discharging a deposition material, a second deposition material stacked on the first deposition source and discharging a different deposition material than the deposition material discharged from the first deposition source, a second deposition source nozzle unit disposed at a side of the second deposition source to face a deposition target and including a plurality of second deposition source nozzles, and a first deposition source nozzle unit disposed at the side of the second deposition source to face the deposition target and including a plurality of first deposition source nozzles formed to pass through the second deposition source.02-07-2013
20130032831ORGANIC LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING - Aspects of the present disclosure provide for manufacturing an organic light emitting diode (OLED) by forming two terminals of the OLED on two substrates of the display, and then depositing a plurality of layers of the OLED on one or both of the two terminals to form a first portion and a second portion of the OLED on each substrate. The two portions are joined together to form an assembled OLED. The deposition of the two portions can be stopped with each portion having approximately half of a common layer exposed. The two portions can then be aligned to be joined together and an annealing process can be employed to join together the two parts of the common layer and thereby form the OLED.02-07-2013
20130032828LED LIGHT STRIP MODULE STRUCTURE - A LED light strip module structure includes a substrate and LED dies. The substrate has first and second surfaces. Accommodating cavities are formed on the first surface and extend toward the second surface. Each accommodating cavity has a bottom surface. Bonding metal layers are respectively attached to the bottom surfaces of the accommodating cavities. The LED die includes a crystal layer and a combination metal layer combined together. The LED dies are disposed in the accommodating cavities, respectively, so that the combination metal layer and the bonding metal layer form eutectic bonding. In addition, a diamond film layer may be disposed between the crystal layer and the combination metal layer, so that the LED die and the substrate can possess the stable and secure positioning effect and the thermoconductive speed and effect can be enhanced to lengthen the lifetime of the LED die through the diamond film layer.02-07-2013
20130032830ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - Discussed are an organic light emitting display device and a method of manufacturing the same in which organic and inorganic films are formed on a polarization plate, and the polarization plate is attached to an organic light emitting panel so that the organic and inorganic films seal the organic light emitting panel, thereby achieving improved polarization and a simple sealing structure.02-07-2013
20130032832DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE - A display device includes an electrode layer formed at a predetermined position on a substrate, an insulating film having a through-hole formed on the top of the electrode layer, and a wiring film connected to the electrode layer via the through-hole formed in the insulating film. Based on a surface of the substrate, the through-hole includes a first taper portion having a first taper angle, a second taper portion formed higher than the first taper portion and having a second taper angle different from the first taper angle, and a third taper portion formed higher than the second taper portion and having a third taper angle different from the second taper angle.02-07-2013
20130032827DISPLAY SUBSTRATE, METHOD OF MANUFACTURING A DISPLAY SUBSTRATE AND LIQUID CRYSTAL DISPLAY DEVICE HAVING A DISPLAY SUBSTRATE - A display substrate for a display device includes a substrate, a switching device, a gate line, a data line, a pixel electrode, a plurality of common electrodes. The switching device includes an active pattern, a gate insulation layer, a gate electrode, a source electrode and a drain electrode. The gate line is electrically connected to the source electrode, and the data line is electrically coupled to the gate electrode. The pixel electrode is electrically connected to the drain electrode, and the common electrodes are disposed on the pixel electrode. A coupling capacitance among the common electrodes and the data line can be prevented and/or reduced to prevent a signal delay of the data line. Further, an aperture ratio of the display substrate can be improved by changing a layout of the data line and the gate line.02-07-2013
20130032826Integrated Apparatus Including Driver Chips, a Power Supply and LED Chips on an Isolative Substrate - Disclosed is an integrated apparatus including an isolative substrate, a plurality of driver chips provided on a side of the isolative substrate, a power supply provided on the side of the isolative substrate and electrically connected to the driver chips, and LED chips provided on another side of the isolative substrate and electrically connected to the driver chips. Thus, the driver chips, the power supply and the LED chips are integrated on the isolative substrate. The production is easy. The integrated apparatus is not vulnerable to surges and lightning strikes. Electromagnetic interferences are reduced. Heat radiation of the integrated apparatus is excellent so that the LED chips are protected from thermal effect.02-07-2013
20130032825Resonant Optical Cavity Semiconductor Light Emitting Device - The present invention is a light emitting device apparatus and method of fabrication. The structure employs a waveguide in the lateral (x) direction formed via materials index, resonant wavelength and/or current-induced index changes. In the vertical (y) direction a resonant optical cavity is formed via distributed Bragg reflector and/or metal mirrors with sufficient reflectivity so as to create a substantial standing wave. The light is thereby constricted to propagate in the longitudinal (z) direction. A tapered output section may be employed to suppress lasing in the longitudinal direction or to losslessly transfer the light from the confined section to a resonant output coupler. Conversely, feedback may be employed to induce lasing in the longitudinal direction by suitable means, such as a periodic variation in the material index, resonant wavelength, gain or loss. The resonant output coupler may be formed by suitable means, such as mirror or cavity modulation.02-07-2013
20130075767LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME - The light emitting device 03-28-2013
20130075768Organic Light Emitting Diode Display Device and Method of Fabricating the Same - In an organic light emitting diode (OLED) display device and a method for fabricating the same, OLED pixels are patterned through a photolithography process, so a large area patterning can be performed and a fine pitch can be obtained, and an organic compound layer can be protected by forming a buffer layer of a metal oxide on an upper portion of the organic compound layer or patterning the organic compound layer by using a cathode as a mask, improving device efficiency. In addition, among red, green, and blue pixels, two pixels are patterned through a lift-off process and the other remaining one is deposited to be formed without patterning, the process can be simplified and efficiency can be increased.03-28-2013
20130075766THIN FILM TRANSISTOR DEVICE AND PIXEL STRUCTURE AND DRIVING CIRCUIT OF A DISPLAY PANEL - A thin film transistor device, disposed on a substrate, includes a gate electrode, a semiconductor channel layer, a gate insulating layer disposed between the gate electrode and the semiconductor channel layer, a source electrode and a drain electrode disposed at two opposite sides of the semiconductor channel layer and partially overlapping the semiconductor channel layer, respectively, a capacitor electrode at least partially overlapping the gate electrode, and a capacitor dielectric layer disposed between the capacitor electrode and the gate electrode. The capacitor electrode, the gate electrode and the capacitor dielectric layer form a capacitor device.03-28-2013
20130082287Thin Film Transistor and Manufacturing Method thereof, Array Substrate, and Liquid Crystal Display Device - The present invention discloses a thin film transistor (TFT), a manufacturing method thereof, an array substrate, and a liquid crystal display (LCD) device. The TFT comprises a gate electrode and a source electrode. The gate electrode comprises a first metal layer block and a second metal layer block positioned on the first metal layer block. The thermal expansion coefficient of the second metal layer block is less than that of the first metal layer block. The top surface of the first metal layer block is in contact with the bottom surface of the second metal layer block, and the width of the top surface of the first metal layer block accords with that of the bottom surface of the second metal layer block. The present invention can prevent hillocks from being produced, and can effectively avoid the phenomenon of electricity leakage.04-04-2013
20100006864IMPLANTED CONNECTORS IN LED SUBMOUNT FOR PEC ETCHING BIAS - A sapphire growth substrate wafer has epitaxially grown over it N-type layers, an active layer, and P-type layers to form GaN LEDs. Each LED is a flip-chip with its cathode contact and anode contact formed on the same side. The wafer is then diced to separate out the LEDs. A P-type silicon submount wafer has N-type doped interconnect regions for interconnecting all the cathode contacts together after the LEDs are mounted on the submount wafer. The sapphire substrate is then removed by a laser lift-off process. A bias voltage is then applied to the cathode contacts via the interconnect regions to bias the N-type layers for a photo-electrochemical etching process that roughens the exposed layer for increased light extraction. The submount wafer is then diced, cutting through the doped interconnect regions.01-14-2010
20100044726Method for Packaging White-Light LED and LED Device Produced Thereby - This invention relates to light-emitting diodes or devices (LEDs), such as LED lighting assemblies and methods of manufacturing them. More particularly, this invention relates to white-light LED lighting assemblies, devices, and components, methods for packaging white-light LEDs, and LED devices produced thereby. A method for packaging a white-light LED is provided comprising providing a substrate with a resin injection hole and a vent hole, a packaging housing, at least one LED chip, a supporting frame and resin, installing the LED chip on the substrate, coating an inner wall of the packaging housing with fluorescent powder, connecting the packaging housing to the substrate by way of the supporting frame, so that a cavity is formed therebetween, injecting the resin into the cavity between the packaging housing and the substrate by way of the resin injection hole so that gas within the cavity is discharged by way of the vent hole, and curing the resin. LED assemblies made according to this method are also provided.02-25-2010
20120205675LIGHT-EMITTING DEVICE AND LIGHTING DEVICE - To provide a light-emitting device including the plurality of light-emitting elements having a structure in which a light-emitting area is large and defects in patterning of light-emitting elements are suppressed. To provide a lighting device including the light-emitting device. The light-emitting device includes a first wiring provided over a substrate having an insulating surface, an insulating film provided over the first wiring, a second wiring provided over the insulating film, and a light-emitting element unit including a plurality of light-emitting elements provided over the first wiring with the insulating film provided therebetween. The plurality of light-emitting elements each include a first electrode layer having a light-blocking property, a layer containing an organic compound in contact with the first electrode layer, and a second electrode layer having a light-transmitting property in contact with the layer containing an organic compound. The layers containing an organic compound are separated by a separation layer.08-16-2012
20100102336LIGHT EMITTING DIODE FOR AC OPERATION - The present invention discloses a light emitting diode (LED) including a plurality of light emitting cells arranged on a substrate. The LED includes half-wave light emitting units each including at least one light emitting cell, each half-wave light emitting unit including first and second terminals respectively arranged at both ends thereof; and full-wave light emitting units each including at least one light emitting cell, each full-wave light emitting units including third and fourth terminals respectively formed at both ends thereof. The third terminal of each full-wave light emitting unit is electrically connected to the second terminals of two half-wave light emitting units, and the fourth terminal of each full-wave light emitting unit is electrically connected to the first terminals of other two half-wave light emitting units. Also, a first half-wave light emitting unit is connected in series between the third terminal of a first full-wave light emitting unit and the fourth terminal of a second full-wave light emitting units, and a second half-wave light emitting units is connected in series between the fourth terminal of the first full-wave light emitting unit and the third terminal of the second full-wave light emitting unit.04-29-2010
20100096643SEMICONDUCTOR LIGHT SOURCE FOR ILLUMINATING A PHYSICAL SPACE INCLUDING A 3-DIMENSIONAL LEAD FRAME - The present invention is a semiconductor light source 04-22-2010
20090159902FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, PRINTED CIRCUIT BOARD FOR FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, MOUNTING STRUCTURE FOR FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING DIODE LAMP - A flip-chip type semiconductor light-emitting device having a positive electrode and a negative electrode similar in electrode area and capable of preventing the misalignment of the light-emitting device by utilizing the self alignment effect in manufacturing a light-emitting diode lamp and a printed circuit board for the flip-chip type semiconductor light-emitting device are provided. Furthermore, adopted are a flip-chip type semiconductor light-emitting device 06-25-2009
20090159906Light-emitting device, method for manufacturing light-emitting device, and electronic apparatus - A light-emitting device includes an organic insulating layer lying above a face of a substrate, reflective layers arranged on a face of the organic insulating layer, an inorganic insulating layer extending over the reflective layers, pixel electrodes arranged on the inorganic insulating layer, and light-emitting sections arranged on the respective pixel electrodes. The inorganic insulating layer has openings and regions in which no pixel electrodes are arranged when viewed from above. The openings extend through the respective regions to the organic insulating layer. A method for manufacturing such a light-emitting device includes forming openings in regions of the inorganic insulating layer in advance of the formation of the light-emitting sections such that the openings extend through the regions to the organic insulating layer, the regions having no pixel electrodes thereon when viewed from above.06-25-2009
20090159904LIGHT SOURCE DEVICE, LIGHT SOURCE MODULE, AND METHOD OF MAKING THE LIGHT SOURCE DEVICE - A light source device includes a lead frame, a first solid-state lighting chip, a first transparent encapsulation, a second solid-state lighting chip, and a second transparent encapsulation. The first solid-state lighting chip and the second solid-state lighting chip are respectively located at two opposite sides of the lead frame and electrically connected to the lead frame. The first transparent encapsulation and the second transparent encapsulation respectively encapsulate the first solid-state lighting chip and the second solid-state lighting chip.06-25-2009
20090159903LIGHT CHAIN - A light chain includes a plurality of light emitting diodes (LEDs) electrically connected to each other. Each LED includes an LED chip having a first pole and a second pole, and a packaging layer encapsulating the LED chip. A first electrode has an inner end connected to the first pole, and an outer end extending to the outside of the packaging layer. A second electrode has an inner end connected to the second pole, and an outer end extending to the outside of the packaging layer. A third electrode has a first outer end and a second outer end located at the outside. The outer end of the first electrode and the first outer end cooperatively form a first plug; the outer end of the second electrode and the second outer end cooperatively form a second plug configured to attach to a first plug of an adjacent LED.06-25-2009
20090108269ILLUMINATION DEVICE HAVING ONE OR MORE LUMIPHORS, AND METHODS OF FABRICATING SAME - A light emitter comprising a monolithic die comprising at least one solid state light emitting device and at least a first lumiphor covering part of a light emission region of the die. In some embodiments, at least a second lumiphor is provided on the die. The first lumiphor can be part of a first pattern of lumiphors, and/or the second lumiphor can be part of a second pattern of lumiphors. The first and second lumiphors can differ in luminescent material, size, shape and/or concentration of luminescent material. The lumiphors can overlap completely, partially, or not at all. Some embodiments comprise an electrical interconnection to electrically connect respective solid state light emitting devices. Also, a light emitter comprising unit cells each comprising a group of light emitting devices and at least one lumiphor. Methods of fabricating light emitters comprise selectively applying at least one lumiphor to a monolithic die.04-30-2009
20100109026LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided are a light emitting device and a method of manufacturing the same. The light emitting device includes each of first and second semiconductor stacked structures including first and second conductive type semiconductor layers and an active layer, first and second contacts on tops and bottoms of the first and second semiconductor stacked structures to be connected to the first and second conductive type semiconductor layers, a substrate structure including first and second sides, a first insulation layer on an area where no second contact is formed among a surface of the first and second semiconductor stacked layers, first and second conductive layers connected to the second contacts of the first and second semiconductor stacked structures, first and second wiring layers on the first side of the substrate structure, and first and second external connection terminals connected to the first and second contacts of the first semiconductor stacked structure.05-06-2010
20100109025OVER THE MOLD PHOSPHOR LENS FOR AN LED - Rectangular LED dice are mounted on a submount wafer. A first mold has rectangular indentations in it generally corresponding to the positions of the LED dice on the submount wafer. The indentations are filled with silicone, which when cured forms a clear first lens over each LED. Since the wafer is precisely aligned with the mold, the top surfaces of the first lenses are all within a single reference plane irrespective of any x, y, and z misalignments of the LEDs on the wafer. A second mold has rectangular indentations filled with a phosphor-infused silicone so as to form a precisely defined phosphor layer over the clear first lens, whose inner and outer surfaces are completely independent of any misalignments of the LEDs. A third mold forms an outer silicone lens. The resulting PC-LEDs have high chromaticity uniformity from PC-LED to PC LED within a submount wafer and from wafer to wafer, and high color uniformity over a wide viewing angle.05-06-2010
20100109027LIGHT EMITTING DIODE PACKAGE - Provided is an LED package. It is easy to control luminance according to the luminance and an angle applicable. Since heat is efficiently emitted, the LED package is easily applicable to a high luminance LED. The manufacturing process is convenient and the cost is reduced. The LED package includes a substrate, an electrode, an LED, and a heatsink hole. The electrode is formed on the substrate. The LED is mounted in a side of the substrate and is electrically connected to the electrode. The heatsink hole is formed to pass through the substrate, for emitting out heat generated from the LED.05-06-2010
20130134450ORGANIC LIGHT EMITTING DISPLAY APPARATUS - An organic light emitting display apparatus including sub pixels, each of the sub pixels including: first and second electrodes, the second electrode extending over the first electrode; and an intermediate layer disposed between the first and second electrodes, the intermediate layer including an emission layer, wherein a first portion of the first electrode, the second electrode, and the intermediate layer extends within a weak resonance region, the weak resonance region being configured to induce a first resonance of light generated by the emission layer between the first and second electrodes, and a second portion of the first electrode, the second electrode, and the intermediate layer extends within a strong resonance region, the strong resonance region being configured to induce a second resonance of light generated by the emission layer between the first and second electrodes, the second resonance being stronger than the first resonance.05-30-2013
20100320485MULTI-CHIP PACKAGED LED LIGHT SOURCE - A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.12-23-2010
20130026504LIGHTING DEVICE UTILIZING LIGHT ACTIVE SHEET MATERIAL WITH INTEGRATED LIGHT EMITTING DIODE, DISPOSED IN SEAM AND/OR IN LOW PROFILE APPLICATION - A light source includes a substrate arranged into at least two facing surfaces which form a seam therebetween; and a lighting device with light emitting diode (LED) chips embedded therein in a linear arrangement. The LED chips generate light photons. The lighting device has a first edge and a second edge opposite to the first edge, the light photons within the lighting device that are emitted by the LED chips from a top surface of the LED chips being output from the lighting device at the second edge of the device. The lighting device is sandwiched in the seam between the two facing surfaces, the second edge of the lighting device being exposed when the seam is in an opened position.01-31-2013
20130026503LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic light emitting diode (OLED) display includes a substrate, an OLED on the substrate, and an encapsulation layer on the substrate with the OLED therebetween. The encapsulation layer includes a plurality of metal layers. Two of the plurality of metal layers are directly attached to each other.01-31-2013
20130026502LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING SYSTEM - A light emitting device package according to the embodiment includes a body having a cavity; at least one light emitting device in the cavity; a resin member filled in the cavity while covering the light emitting device; and a fluorescence sheet coupled with a top surface of the body such that the fluorescence sheet is physically separable from the top surface of the body, and including a fluorescence material for converting light emitted from the light emitting device into another light.01-31-2013
20130026509THREE-DIMENSIONAL LED SUBSTRATE AND LED LIGHTING DEVICE - The invention includes one or more LED elements, a silicon substrate on which the LED elements are mounted via micro bumps and internally formed wiring is connected to the micro bumps, a heat insulation organic substrate which is stuck to the opposite side of the LED elements-mounting side of the silicon substrate and has through-holes in which the wiring goes through, a chip-mounting substrate which is stuck to the opposite side of the silicon substrate side of the heat insulation organic substrate and internally formed wiring is connected to wiring in the through-holes of the heat insulation organic substrate, and an LED control circuit chip which is connected to the wiring of the chip-mounting substrate via micro bumps, and mounted via the micro bumps on the opposite side of the heat insulation organic substrate side of the chip-mounting substrate.01-31-2013
20130026501TOUCH DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - The present invention discloses a touch display device and a manufacturing method thereof, the display device comprising: an OLED display layer disposed on a lower substrate; an upper substrate; an air layer formed between the upper substrate and the lower substrate; and a touch module, disposed above the OLED display layer, wherein the touch module comprises: a first sensing circuit layer and a second sensing circuit layer, further wherein the first sensing circuit layer and the second sensing circuit layer are spaced and the distance between them is more than 2 um. The display device can reduce interference in detection circuit caused by coupling capacitance formed between the sensing circuit layers thereby improving accuracy of touch detection.01-31-2013
20130026508LED MODULE WITH PASSIVE LED - An LED module (01-31-2013
20130026507MULTICHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.01-31-2013
20130026500LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM USING THE SAME - A light emitting device package of the embodiment includes a body including cavities; first and second lead electrodes disposed in the cavity of the body; a light emitting device disposed in the cavities, electrically connected to at least one of the first and second lead electrodes and emitting a first main peak wavelength in the range of 410˜460 nm; and a first resin layer having first phosphor on the light emitting device, wherein the first phosphor of the first resin layer emits light of a second main peak wavelength in the range of 461 nm˜480 nm by exciting some light having the first main peak wavelength, and the first and second main peak wavelengths have the wavelength different from each other and contain the light having the same color.01-31-2013
20130026506LIGHTING DEVICES WITH PRESCRIBED COLOUR EMISSION - Optical conversion layers based on semiconductor nanoparticles for use in lighting devices, and lighting devices including same. In various embodiments, spherical core/shell seeded nanoparticles (SNPs) or nanorod seeded nanoparticles (RSNPs) are used to form conversion layers with superior combinations of high optical density (OD), low re-absorbance and small FRET. In some embodiments, the SNPs or RSNPs form conversion layers without a host matrix. In some embodiments, the SNPs or RSNPs are embedded in a host matrix such as polymers or silicone. The conversion layers can be made extremely thin, while exhibiting the superior combinations of optical properties. Lighting devices including SNP or RSNP-based conversion layers exhibit energetically efficient superior prescribed colour emission01-31-2013
20130026505LARGE AREA ORGANIC LIGHT EMITTING DIODE DISPLAY - The invention relates to a large area organic light emitting diode display having a uniformed luminescence throughout the display area. The invention suggests an organic light emitting diode display comprising a thin film transistor substrate including a thin film transistor, a driving current line to supply an electric signal to the thin film transistor, a driving line contact hole to expose some portions of the driving current line, and an organic light emitting diode connected to the thin film transistor; a cap including a cap substrate and an auxiliary electrode disposed on a surface of the cap substrate with an area that is at least ⅓ of an area of the cap substrate; a conductive sealing material to electrically connect the auxiliary electrode and the driving current line through the driving line contact hole; and an organic adhesive joining the thin film transistor substrate and the cap.01-31-2013
20130087813GROOVED PLATE FOR IMPROVED SOLDER BONDING - A metal plate on a multi-die LED emitter substrate or a metal plate on a metal-core printed circuit board (MCPCB) that attaches to the emitter substrate (or both plates) can be fabricated with a number of generally radial grooves, at least some of which extend to the peripheral edge of the plate. These grooves can provide channels that allow air to escape during solder-bonding processes, reducing the size and/or total area of solder voids and thereby improving thermal transfer between the emitter and the MCPCB.04-11-2013
20130026499WAFER-LEVEL PACKAGING FOR SOLID-STATE TRANSDUCERS AND ASSOCIATED SYSTEMS AND METHODS - Wafer-level packaging of solid-state transducers (“SSTs”) is disclosed herein. A method in accordance with a particular embodiment includes forming a transducer structure having a first surface and a second surface opposite the first surface, and forming a plurality of separators that extend from at least the first surface of the transducer structure to beyond the second surface. The separators can demarcate lateral dimensions of individual SSTs. The method can further include forming a support substrate on the first surface of the transducer structure, and forming a plurality of discrete optical elements on the second surface of the transducer structure. The separators can form barriers between the discrete optical elements. The method can still further include dicing the SSTs along the separators. Associated SST devices and systems are also disclosed herein.01-31-2013
20090134407A1 ALLOY FILM, ELECTRONIC DEVICE, AND ACTIVE MATRIX SUBSTRATE FOR USE IN ELECTROOPTIC DISPLAY DEVICE - In accordance with one aspect of the present invention, an Al alloy film contains a first additive element composed of Ni, and at least one type of second additive element selected from the group consisting of Group 2A alkaline earth metals and Groups 3B and 4B metalloids in Period 2 or 3 of the periodic table of the elements. Furthermore, the composition ratio of the first additive element is 0.5-5 at %, and the composition ratio of the second additive element is 0.1-3 at %.05-28-2009
20100065863Light Emitting, Photovoltaic Or Other Electronic Apparatus and System - The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus comprising photovoltaic diodes, which may be created through a printing process, using a semiconductor or other substrate particle ink or suspension and using a lens particle ink or suspension. An exemplary apparatus comprises a base; at least one first conductor; a plurality of diodes coupled to the at least one first conductor; at least one second conductor coupled to the plurality of diodes; and a plurality of lenses suspended in a polymer deposited or attached over the diodes. The lenses and the suspending polymer have different indices of refraction. In some embodiments, the lenses and diodes are substantially spherical, and have a ratio of mean diameters or lengths between about 10:1 and 2:1. The diodes may be LEDs or photovoltaic diodes, and in some embodiments, have a junction formed at least partially as a hemispherical shell or cap.03-18-2010
20100065860LIGHT EMITTING DIODE LIGHTING DEVICE - The present invention relates to a light emitting diode (LED) lighting device (03-18-2010
20130087816ILLUMINATION DEVICE - An illumination device includes a base, a light-emitting module, a first layer, and a second layer. The light-emitting module is disposed on the base for generating a progressive-type light-emitting intensity. The first layer encapsulates the light-emitting module. The second layer encloses the first layer. The second layer has a progressive-type thickness corresponding to the progressive-type light-emitting intensity, and both the progressive-type light-emitting intensity and the progressive-type thickness are decreased or increased gradually, thus the progressive-type light-emitting intensity can be transformed into the same light-emitting intensity through the progressive-type thickness of the second layer.04-11-2013
20130087815HYBRID DISPLAY DEVICE - The disclosure provides a hybrid display device, comprising: a substrate, wherein the substrate comprises a first surface and a second surface; a TFT array layer formed on the first surface of the substrate; a first display device formed on the TFT array layer; and a second display device formed on the second surface of the substrate, wherein there exists a corresponding relationship between a dielectric constant (k) of the substrate and a thickness (t) of the substrate to drive at least one of the first display device and the second display device, or to drive both of the first display device and the second display device by the TFT array layer, especially the TFT array layer actively drive the first display device, the second display device or combinations thereof. The dielectric constant of the substrate is about 1-100 and the thickness of the substrate is about 0.1-60 μm.04-11-2013
20130087814LIGHT EMITTING DEVICE AND LIGHTING APPARATUS INCLUDING THE SAME - A light emitting device is disclosed. The disclosed light emitting device includes a light emitting structure including a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer, a second electrode layer disposed beneath the light emitting structure and electrically connected to the second-conductivity-type semiconductor layer, a first electrode layer including a main electrode disposed beneath the second electrode layer, and at least one contact electrode branching from the main electrode and extending through the second electrode layer, the second-conductivity-type semiconductor layer and the active layer, to contact the first-conductivity-type semiconductor layer, and an insulating layer interposed between the first electrode layer and the second electrode layer and between the first electrode layer and the light emitting structure. The first-conductivity-type semiconductor layer includes a first region and a second region having a smaller height than the first region, and the first region overlaps with the contact electrode.04-11-2013
20130087812LIGHT-EMITTING DEVICE WITH A SPACER AT BOTTOM SURFACE - A light-emitting device having at least one spacer located at a bottom surface is disclosed. In two other embodiments, an electronic display system and an electronic system having such light-emitting device are disclosed. The light-emitting device comprises a plurality of leads, a light source die, and a body. The body encapsulates a portion of the plurality of leads and the light source die. The body has a least one side surface and a bottom surface. The at least one spacer is located at the bottom surface. In use, the light-emitting device is attached to a top surface of a substrate. The spacer is configured to create an air vent between the bottom surface and the top surface of the substrate when the light-emitting device is attached to, and the spacer is in contact with the substrate.04-11-2013
20120181554MULTICOLORED MASK PROCESS FOR MAKING DISPLAY CIRCUITRY - A process for forming a pixel circuit is disclosed comprising: (a) providing a transparent support; (b) forming a multicolor mask having at least four different color patterns; (c) forming integrated electronic components of the pixel circuit having at least four layers of patterned functional material comprising a first conductor, a dielectric, a semiconductor, and a second conductor each layer of patterned functional material corresponding to the four different color patterns of the multicolor mask. The functional material is patterned using a photopattern corresponding to each color pattern.07-19-2012
20120181553LIGHT-EMITTING DEVICE - A light-emitting device includes a support substrate, a plurality of organic electroluminescence (EL) elements provided on the support substrate, and a partition wall separating the plurality of organic EL elements from each other. The partition wall has a peripheral portion arranged so as to surround a region in which the plurality of organic EL elements are provided, and a plurality of divider portions arranged in a striped pattern in a region surrounded by the peripheral portion and each having one end and the other end in a longitudinal direction coupled to the peripheral portion. The organic EL elements are arranged between the divider portions adjacent to each other. A depression extending toward the support substrate is provided in the peripheral portion on an extended line in the longitudinal direction of the divider portions.07-19-2012
20090045416Optical Element Coupled to Low Profile Side Emitting LED - A low profile, side-emitting LED with one or more optical elements, such as a reflector or lens, optically coupled to each light emitting sidewall is described. In one embodiment, a reflector is used to redirect the light emitted from each sidewall to a forward direction, e.g., in a flash configuration. In another embodiment, a lens is used to collimate the side emitted light in the horizontal plane, e.g., for backlighting. Each entrance surface of the lens is positioned so that the bottom edge is at or below the bottom of the light emitting sidewall so that the base of the lens does not block light that is emitted by the LED.02-19-2009
20130049034LIGHT-EMITTING DEVICE - This disclosure discloses a light-emitting device. The light-emitting device comprises: a substrate; a first light-emitting stack comprising a first active layer; a bonding interface formed between the substrate and the first light-emitting stack; and a contact structure formed between the first light-emitting stack and the bonding interface and comprising a first contact layer and a second contact layer closer to the bonding interface than the first contact layer; wherein the first contact layer and the second contact layer comprises the same material and the first contact layer has an impurity concentration lower than that of the second contact layer.02-28-2013
20130049033LIGHT EMITTING DIODE PACKAGE ARRAY AND METHOD FOR FABRICATING LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) package includes: an array substrate; a plurality of LEDs mounted on the array substrate and arranged in rows and columns; a plurality of wavelength conversion units disposed in a light path of light emitted from each of the plurality of LEDs to convert the wavelength thereof; a plurality of first inspection terminals formed on the array substrate and electrically connected to LEDs in the same rows, among the plurality of LEDs; and a plurality of second inspection terminals formed on the array substrate and electrically connected to LEDs in the same columns, among the plurality of LEDs.02-28-2013
20130049032ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE, METHOD OF MANUFACTURING ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE, AND ELECTRONIC SYSTEM - An organic electroluminescence display device includes: a light emission region including a plurality of pixels on a drive substrate, wherein each of the pixels includes, in order from a side close to the drive substrate, a first electrode, a functional layer, and a second electrode, the first electrode is provided for each of the pixels, and the functional layer includes at least an organic electroluminescence layer; a print pattern layer included in the functional layer and formed individually for each of the pixels; and a protrusion provided on the drive substrate and protruding further than any layer provided between the print pattern layer and the drive substrate.02-28-2013
20130049031LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE, AND LAMP - A light-emitting device which emits light omnidirectionally is provided. A light-emitting device according to the present invention includes: a package which is translucent; an LED provided in a recess in the package; and a sealing member for sealing the LED and packaging the recess; and the recess includes a bottom surface on which the LED is mounted and a side surface surrounding a bottom surface, and light emitted by the LED is transmitted inside the package through the bottom surface and the side surface of the recess and is emitted to outside of the package from the back surface and the side surface of the package.02-28-2013
20130049024ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE - An OLED device adapted to enhance reliability and light-emitting efficiency is disclosed. The disclosed OLED device includes: a first electrode; an emission layer formed on the first electrode; a second electrode formed on the emission layer; and an electron injection layer disposed on the emission layer, configure to be in contact with the second electrode and in a single layer which is formed from a mixture of an inorganic compound and a metal material with a low work function.02-28-2013
20130049023LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM - Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a body including a cavity, at least one light emitting device in the cavity, a resin member filled in the cavity while covering the light emitting device, and a reflective layer on a lateral side of the cavity. The reflective layer is formed while opening the upper region of the cavity. The reflective layer is selectively formed only in a lower region of the lateral side of the cavity in the body, and the resin member, which is filled in the upper portion of the cavity, directly adheres to the body. The air-tightness between the resin member and the body is improved.02-28-2013
20130049026SEMICONDUCTOR ELEMENT AND DISPLAY DEVICE USING THE SAME - A semiconductor having an active layer; a gate insulating film in contact with the semiconductor; a gate electrode opposite to the active layer through the gate insulating film; a first nitride insulating film formed over the active layer; a photosensitive organic resin film formed on the first nitride insulating film; a second nitride insulating film formed on the photosensitive organic resin film; and a wiring provided on the second, nitride insulating film. A first opening portion is provided in the photosensitive organic resin film, an inner wall surface of the first opening portion is covered with the second nitride insulating film, a second opening portion is provided in a laminate including the gate insulating film, the first nitride insulating film, and the second nitride insulating film inside the first opening portion, and the semiconductor is connected with the wiring through the first opening portion and the second opening portion.02-28-2013
20130049025LED PACKAGE DEVICE - An LED package device having a dam located on a substrate is provided, by which two regions are defined on the substrate. Two LED dies are respectively disposed on the two regions and separated by the dam; therefore, the LED package device has an enhanced intensity of the lateral-emitting light and a wide light emitting angle. The LED package devices can be used in backlight units to prevent mura and hot spot issues.02-28-2013
20100001295Embedded package structure module with high-density electrical connections and method for making the same - An embedded package structure module with high-density electrical connections, including: a drive IC structure, an LED array structure and a plurality of conductive structures. The drive IC structure has at least one concave groove. The LED array structure is received in the at least one concave groove of the drive IC structure, and the LED array structure has a plurality of second open grooves formed on its lateral wall and close to the drive IC structure. The conductive structures respectively traverse the second open grooves in order to make the conductive structures electrically connect between the drive IC structure and the LED array structure.01-07-2010
20130049030LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE - A light emitting device according to the embodiment includes a first light emitting structure including a first conductive type first semiconductor layer, a first active layer under the first conductive type first semiconductor layer, and a second conductive type second semiconductor layer under the first active layer; a first reflective electrode under the first light emitting structure; a second light emitting structure including a first conductive type third semiconductor layer, a second active layer under the first conductive type third semiconductor layer, and a second conductive type fourth semiconductor layer under the second active layer; a second reflective electrode under the second light emitting structure; a contact part that electrically connects the first conductive type first semiconductor layer of the first light emitting structure to the second reflective electrode; and a first insulating ion implantation layer between the contact part and the second conductive type second semiconductor layer.02-28-2013
20130049029ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display device includes a gate electrode, a source electrode, and a drain electrode on a substrate, a gate interconnection line connected to the gate electrode, a source and drain interconnection line connected to the source and drain electrodes, a first test pad electrically connected to the source and drain interconnection line, and a second test pad electrically connected to the gate interconnection line. The second test pad is at a same level as the first test pad, and the gate electrode is on a different layer than the source and drain electrodes.02-28-2013
20100133559AREA LIGHT SOURCE APPARATUS AND LIQUID CRYSTAL DISPLAY APPARATUS ASSEMBLY - Disclosed herein is an area light source apparatus for illuminating a liquid crystal display apparatus of the transmission type, which has a display area formed from a plurality of pixels arrayed in a two-dimensional matrix, from the back, including: a plurality of light emitting element assemblies each provided as a light source and each including a light emitting element and a lens through which light emitted from the light emitting element passes; and a plurality of dummy lenses disposed in the proximity of each of the light emitting element assemblies and configured same as the lenses of the light emitting element assemblies.06-03-2010
20100133552LAMP TYPE LIGHT EMITTING DEVICE FOR SAFETY FUSE - A lamp type light emitting device for safety fuse, including a substrate, an electrode layer, a chip set, a wire set, two leads and an encapsulator. The electrode layer is arranged on the substrate and includes a first T-shaped electrode, a second T-shaped electrode, a first stripe electrode and a second stripe electrode. The chip set includes a first resistor chip and a first light emitting chip arranged on the first T-shaped electrode and a second resistor chip and a second light emitting chip arranged on the second T-shaped electrode. The wire set has fuse wires electrically connected the first resistor chip, the first light emitting chip, the first stripe electrode, the second resistor chip, second light emitting chip, and the second stripe electrode. The leads are electrically connected to the first and the second T-shaped electrodes. The encapsulator encapsulates the electrode layer, the chip set and the wire set.06-03-2010
20090302333METHODS OF MANUFACTURING AN ORGANIC ELECTROLUMINESCENT DEVICE - A manufacturing method for an organic electroluminescent device that includes an effectively optical area including display pixels for display and a dummy area surrounding the effectively optical area, the dummy area including dummy pixels not for display is provided. The manufacturing method includes coating a first composite material on a first portion in the effectively optical area, the first portion corresponding to one of the display pixels, and coating a second composite material separately from the coating of the first composite material, the second composite material being coated on a second portion of the dummy area, the second portion corresponding to one of the dummy pixels, the first composite material including a first organic electroluminescent material that is dissolved or dispersed in a solvent and the second composite material including a second organic electroluminescent material that is dissolved or dispersed in a solvent.12-10-2009
20090302331OPTOELECTRONIC DISPLAY AND METHOD OF MANUFACTURING THE SAME - An optoelectronic display comprising a plurality of pixels, each pixel comprising a plurality of sub-pixels, wherein the optoelectronic display comprises a colour-forming layer which is patterned providing a plurality of discrete colour-forming regions in a two-dimensional array, and wherein an addressing array is provided for addressing the discrete colour-forming regions, at least some of the discrete colour-forming regions having portions which are separately addressable by the addressing array, each portion defining a sub-pixel of the optoelectronic display.12-10-2009
20090302332SEMICONDUCTOR CIRCUIT HAVING CAPACITOR AND THIN FILM TRANSISTOR, FLAT PANEL DISPLAY INCLUDING THE SEMICONDUCTOR CIRCUIT, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CIRCUIT - A flat panel display including a semiconductor circuit, and a method of manufacturing the semiconductor circuit are disclosed. In one embodiment, the semiconductor circuit includes i) a substrate, ii) a semiconductor layer and a first capacitor electrode formed on the substrate, the first capacitor electrode being doped to be conductive, iii) an insulating layer covering the semiconductor layer and the first capacitor electrode, iv) a gate electrode disposed on the insulating layer and corresponding to a portion of the semiconductor layer, and v) a second capacitor electrode disposed on the insulating layer and corresponding to the first capacitor electrode, wherein the gate electrode is thicker than the second capacitor electrode.12-10-2009
20120217520LED MOUNT BAR CAPABLE OF FREELY FORMING CURVED SURFACES THEREON - The present invention relates to a bar on which a plurality of LEDs are mounted. The bar has a first side surface having a plurality of grooves and a second side surface having a plurality of grooves, wherein the plurality of first grooves formed at the first side surface and the plurality of second grooves formed at the second side surface intersect each other such that the bar can be easily bent in a widthwise direction.08-30-2012
20120217519METHOD AND STRUCTURE FOR ENCAPSULATING SOLID-STATE LIGHT EMITTING CHIP AND LIGHT SOURCES USING THE ENCAPSULATION STRUCTURE - A structure and a method for encapsulating a solid-state lighting chip (08-30-2012
20120217518ORGANIC LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD OF THE SAME, ORGANIC DISPLAY PANEL, AND ORGANIC DISPLAY DEVICE - The upper surface portion of a planarization layer is planarized. In an anode formed on the planarization layer, upper surface portions at edge regions by a bank are located above an upper surface portion at a central region. A hole injection transporting layer is layered along the upper surface portions of the anode, and in the hole injection transporting layer, upper surface portions at the edge regions near the bank are located above an upper surface portion at the central region. In an organic light-emitting layer, upper surface portions at the edge regions (regions D08-30-2012
20120217517ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - An organic light emitting device according to one or more embodiments includes a gate line, a data line intersecting the gate line, a switching thin film transistor connected to the gate line and the data line, a driving thin film transistor connected to the switching thin film transistor, and a light emitting diode (LED) connected to the driving thin film transistor. The switching thin film transistor includes a control electrode connected to the gate line, a crystalline semiconductor overlapping the control electrode, and an input electrode and an output electrode are spaced apart from each other on the crystalline semiconductor, wherein the control electrode and the gate line are respectively disposed under and on the crystalline semiconductor and include different materials.08-30-2012
20120217516Light-Emitting Device and Electronic Device Using Light-Emitting Device - Provided is a highly reliable light-emitting device in which a light-emitting element is prevented from being damaged when external physical force is applied. The light-emitting device includes a light-emitting element formed over a first substrate, including a first electrode layer, a light-emitting layer, and a second electrode layer; a structure body formed over the first substrate; a second substrate provided to face the first substrate; and a bonding layer provided between the first substrate and the second substrate. The light-emitting layer is separated by the structure body. By strengthening adhesion between the structure body and the bonding layer, or between the structure body and the second electrode, the highly reliable light-emitting device in which damage of the light-emitting element is prevented can be provided.08-30-2012
20120217515DISPLAY DEVICE - A display device includes a pixel area including pixels arranged in a matrix and having a horizontal resolution of 350 ppi or more and a color filter layer overlapping with the pixel area. The pixels each include a first transistor whose gate is electrically connected to a scan line and whose one of a source and a drain is electrically connected to a signal line; a second transistor whose gate is electrically connected to the other of the source and the drain of the first transistor and whose one of a source and a drain is electrically connected to a current-supplying line; and a light-emitting element electrically connected to the other of the source and the drain of the second transistor. The first and second transistors each have a channel formation region including a single crystal semiconductor.08-30-2012
20110006312LIGHT-EMITTING DEVICE - This disclosure discloses a light-emitting device, comprising a substrate having a first major surface and a second major surface; a plurality of light-emitting stacks on the first major surface; and at least one electronic device on the second major surface, wherein the light-emitting stacks are electrically connected to each other in series via a first electrical connecting structure; the electronic device are electrically connected to the light-emitting stacks via a second electrical connecting structure.01-13-2011
20130056761PIXEL ARRAY SUBSTRATE - A pixel array substrate includes a pixel region and a circuit region adjacent to the pixel region. A plurality of display pixel units are disposed in the pixel region and a plurality of dummy pixel units are disposed in the circuit region. Each of the dummy pixel units includes a data line, a scan line, a plurality of switching elements and a plurality of pixel electrodes. The switching elements are electrically connected to the scan line and data line. The pixel electrodes are electrically connected to the switching elements. Particularly, electrostatic currents in the pixel region can be dissipated by the dummy pixel units in the circuit region. The dummy pixel units preserve the continuity of electricity in the pixel array substrate and function as an inner short ring. Therefore, the area of the circuit region on the pixel array substrate is larger.03-07-2013
20130056765LIGHT EMITTING DIODE LIGHT SOURCE INCLUDING ALL NITRIDE LIGHT EMITTING DIODES - A light source including at least two phosphor converted (pc) light emitting diodes (LEDs), each of the pc LEDs including an associated blue-emitting LED as an excitation source for a phosphor containing element.03-07-2013
20130056762DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A display device having a base substrate provided with light-emitting devices and terminal electrodes connected thereto; a sealing substrate disposed to face the base substrate; a first resin material between the base substrate and the sealing substrate so as to surround a first region in which the light-emitting devices are provided; and a second resin material between the base substrate and the sealing substrate and is filled in the first region surrounded by the first resin material so as to seal the light-emitting devices.03-07-2013
20130056759Packaging Device for Matrix-Arrayed Semiconductor Light-Emitting Elements of High Power and High Directivity - A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.03-07-2013
20130056760PIXEL ARRAY SUBSTRATE - A pixel array substrate includes a pixel region and a circuit region adjacent to the pixel region. A plurality of display pixel units are disposed in the pixel region and a plurality of dummy pixel units are disposed in the circuit region. Each of the dummy pixel units includes a data line, a scan line, a plurality of switching elements and a plurality of pixel electrodes. The switching elements are electrically connected to the scan line and data line. The pixel electrodes are electrically connected to the switching elements. Particularly, electrostatic currents in the pixel region can be dissipated by the dummy pixel units in the circuit region. The dummy pixel units preserve the continuity of electricity in the pixel array substrate and function as an inner short ring. Therefore, the area of the circuit region on the pixel array substrate is larger.03-07-2013
20130056758METHOD AND APPARATUS FOR THIN FILM MODULE WITH DOTTED INTERCONNECTS AND VIAS - A method to fabricate monolithically-integrated optoelectronic module apparatuses (03-07-2013
20130056756LIGHT-TRANSMISSIVE MEMBER, OPTICAL DEVICE, AND MANUFACTURING METHODS THEREOF - A light-transmissive member has a first principal face, a second principal face, and side faces. The first principal face has a first portion including a center of the first principal face and a second portion between the first portion and the side face sides. The member includes a plurality of altered portions formed between the first principal face and the second principal face so that the plurality of altered portions do not appear on the first principal face, the second principal face, and the side faces. Orthogonal projections of the plurality of altered portions onto the first principal face are included in the second portion.03-07-2013
20130056757LED ARRAY CAPABLE OF REDUCING UNEVEN BRIGHTNESS DISTRIBUTION - A light emitting element in use for an LED array comprises an electrode layer, a semiconductor light emitting layer consisting of a p-type semiconductor layer, an active layer and an n-type semiconductor layer, a first wiring layer formed along and in parallel to one side of the semiconductor light emitting layer, and a plurality of second wiring layers extending from the first wiring layer to the semiconductor light emitting layer and electrically connected to the n-type semiconductor layer on a surface of the semiconductor light emitting layer, wherein a plane shape of the semiconductor light emitting layer comprises two short sides including a portion inclined from a line perpendicular to a upper and a lower sides, and a vertical line from a vertex where the upper side and the short side meet crosses the lower side of the adjacent light emitting element.03-07-2013
20130161654REFLECTIVE LAYER ON DIELECTRIC LAYER FOR LED ARRAY - A light emitting diode array is described. The array includes a first light emitting diode with a first electrode and a second light emitting diode with a second electrode. The second light emitting diode is separated from the first light emitting diode. A first dielectric layer is positioned between the first light emitting diode and the second light emitting diode. An interconnect is located at least partially on the first dielectric layer that connects the first electrode to the second electrode. A second dielectric layer is formed over the first dielectric layer and the interconnect. A reflective layer is formed over the second dielectric layer. A permanent substrate is coupled to the reflective layer.06-27-2013
20130161657LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MAKING SAME - A light emitting diode package includes a triangular supporting member, a first substrate and a second substrate adhered on first and second inclined sidewalls the supporting member, respectively, a first LED chip and a second LED chip secured on the first substrate and the second substrate, respectively, and a package layer covering the first LED chip and a second LED chip. The first inclined sidewall and a bottom surface of the supporting member cooperatively form a first angle therebetween, and the second inclined sidewall and the bottom surface cooperatively form a second angle therebetween. The first angle and the second angle each range between 0 degree and 90 degrees. A method for making the light emitting diode package is also provided.06-27-2013
20130161658LIGHT EMITTER DEVICES AND COMPONENTS WITH IMPROVED CHEMICAL RESISTANCE AND RELATED METHODS - Light emitter devices, components and methods are disclosed. In one aspect, a light emitter component of a light emitter device is disclosed. The light emitter component can include a silver (Ag) portion at least partially disposed over a surface of the component. The component can further include a protective layer at least partially disposed over the Ag portion, the protective layer at least partially including an organic barrier material that increases or improves chemical resistance of the Ag portion. In some aspects, the protective layer includes a polyxylylene (e.g., poly(p-xylylene), a substituted poly(p-xylylene), a fluorocarbon containing poly(p-xylylene), and/or any other polymer prepared from a xylylene and/or comprising —CH06-27-2013
20130161659LIGHT-EMITTING DEVICE - A light-emitting device includes a substrate, and a plurality of light-emitting elements that are mounted on the substrate and each include an LED chip and a phosphor layer on a surface thereof. A maximum deviation in a value of a chromaticity coordinate x of light emitted from the plurality of light-emitting elements is not less than 0.0125.06-27-2013
20130161660LIGHT-EMITTING DEVICE - A light-emitting device includes a substrate, and a plurality of light-emitting elements that are mounted on the substrate and each emit light within a same color region. The plurality of light-emitting elements satisfy at least one of a first condition and a second condition. The first condition is that a maximum deviation in peak wavelength of light emitted from the plurality of light-emitting elements is not less than 1.25 nm. The second condition is that a maximum deviation in threshold voltage of the plurality of light-emitting elements is not less than 0.05 V.06-27-2013
20130161661CIRCUIT BOARD, DISPLAY MODULE, AND ELECTRONIC APPARATUS - A circuit board includes: a first substrate provided with a device section, the device section including one or a plurality of active devices; a plurality of first wiring layers each extending from the device section toward a periphery of the first substrate; and a plurality of second substrates each opposed to and bonded to the first wiring layer at the periphery of the first substrate and each having a second wiring layer, the second wiring layer being electrically connected to each of the first wiring layers. The first substrate has a cutout in one or more regions each facing one of the plurality of second substrates.06-27-2013
20130161663ELECTRO-OPTIC DISPLAYS, AND COMPONENTS FOR USE THEREIN - An electro-optic display comprises a substrate (06-27-2013
20130161664ELECTROLUMINESCENT ELEMENT, DISPLAY DEVICE AND LIGHTING DEVICE - An electroluminescent element (06-27-2013
20130161665LIGHT-EMITTING DEVICE AND SURFACE LIGHT SOURCE DEVICE USING SAME - A light emitting device includes: a light-emitting element 06-27-2013
20120112214ACTIVE DEVICE ARRAY SUBSTRATE - An active device array substrate is provided. First, a substrate having a display area and a sensing area is provided. Then, a first patterned conductor layer is disposed on the display area of the substrate. A gate insulator is disposed on the substrate. A patterned semiconductor layer, a second patterned conductor layer and a patterned photosensitive dielectric layer are disposed on the gate insulator, wherein the second patterned conductor layer includes a source electrode, a drain electrode and a lower electrode, the patterned photosensitive dielectric layer covering the second patterned conductor layer includes an interface protection layer disposed on the source electrode and the drain electrode and a photo-sensing layer disposed on the lower electrode. A passivation layer is then disposed on the substrate. After that, a third patterned conductor layer including a pixel electrode and an upper electrode is disposed on the passivation layer.05-10-2012
20120112213DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS HAVING THE SAME - A display substrate includes a substrate, a gate line formed on the substrate, a data line formed on the substrate and crossing the gate line, a first pixel electrode formed on the substrate on which the gate and the data line are formed, an insulation layer formed on the substrate and the first pixel electrode, and a second pixel electrode formed on the insulation layer. The second pixel electrode includes a first sub-electrode that overlaps the first pixel electrode and the data line, and a second sub-electrode that is electrically connected to the data line through a switching element.05-10-2012
20120112212ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME - An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes first and second substrates, an OLED interposed between the first and second substrates and an external sealant formed between the first and second substrates and configured to i) substantially seal the first and second substrates and ii) substantially surround the OLED. The OLED display may further include a dam formed between the external sealant and the OLED and configured to substantially surround the OLED, and a getter formed between the external sealant and the dam.05-10-2012
20130161656ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display apparatus including: a substrate; a plurality of pixels that are formed on the substrate and each have a light emission area from which visible rays are emitted and a transmission area through which external light is transmitted; a pixel circuit portion disposed in each light emission area of the plurality of pixels; a first electrode that is disposed in each light emission area and is electrically connected to the pixel circuit portion; an intermediate layer that is formed on the first electrode and includes an organic emissive layer; a second electrode formed on the intermediate layer; and a capping layer that is disposed on the second electrode and includes a first capping layer corresponding to the light emission area and a second capping layer corresponding to the transmission area. Accordingly, electrical characteristics and image quality of the organic light-emitting display apparatus may be improved.06-27-2013
20130056763SEMICONDUCTOR DEVICE - An object is to provide a semiconductor device that can realize a function of a thyristor without complication of the process. A semiconductor device including a memory circuit that stores a predetermined potential by reset operation and initialization operation is provided with a circuit that rewrite data in the memory circuit in accordance with supply of a trigger signal. The semiconductor device has a structure in which a current flowing through the semiconductor device is supplied to a load by rewriting data in the memory circuit, and thus can function as a thyristor.03-07-2013
20130056766SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SAME - Disclosed is a semiconductor device 03-07-2013
20130056764Display Device and Manufacturing Method Thereof - A display device in which light leakage in a monitor element portion is prevented without increasing the number of steps and cost is provided. The display device includes a monitor element for suppressing influence on a light-emitting element due to temperature change and change over time and a TFT for driving the monitor element, in which the TFT for driving the monitor element is provided so as not to overlap the monitor element. Furthermore, the display device includes a first light shielding film and a second light shielding film, in which the first light shielding film is provided so as to overlap a first electrode of the monitor element and the second light shielding film is electrically connect to the first light shielding film through a contact hole formed in an interlayer insulating film. The contact hole is formed so as to surround the outer edge of the first electrode of the monitor element.03-07-2013
20100084666ILLUMINATING MEANS - An illuminating means, including a radiation source for emitting electromagnetic radiation in the optical range, a support base, and an electrode arrangement with a first and at least a second electrode. The radiation source is disposed on the support base and connected by connecting wires to the electrode arrangement so as to be electrically conductive, and the radiation source is provided in the form of a first and at least a second semiconductor component. The first electrode is connected to the first semiconductor component via a first contact point, and the second electrode is connected to the second semiconductor component via a second contact point, so as to be electrically conductive. The distance of the first contact point from a center point or a line of symmetry of the support base is different from the distance of the second contact point from the center point or line of symmetry.04-08-2010
20100084665SOLID STATE LIGHT SHEET AND ENCAPSULATED BARE DIE SEMICONDUCTOR CIRCUITS - An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare die electronic element is provided having a top conductive side and a bottom conductive side. Each bare die electronic element is disposed so that the top conductive side is in electrical communication with the top electrically conductive surface and so that the bottom conductive side is in electrical communication with the bottom electrically conductive surface.04-08-2010
20090267089LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs (10-29-2009
20090267087LOW RESISTANCE WIRING STRUCTURE AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME - A low-resistance wiring structure and a liquid crystal display are disclosed. The liquid crystal display includes a first substrate; a thin film transistor (TFT) formed on the first substrate and formed of a gate wiring, a data wiring and a semiconductor layer; and a second substrate attached to the first substrate in a facing manner, wherein at least one of the gate wiring and the data wiring is formed as a first wiring made of copper, a second wiring made of a barrier metal preventing spreading of copper, and a metal oxide film pattern formed between the first and second wirings. A MO/Cu wiring structure is implemented by using pure molybdenum, so that the low-resistance wiring structure with high reliability can be formed at a low cost.10-29-2009
20090267086Thermal Management For LED - A method and system for removing heat from an LED facilitates the fabrication of LEDs having enhanced brightness. A thermally conductive interposer can be attached to the top of the LED. Heat can flow through the top of the LED and into the interposer. The interposer can carry the heat away from the LED. Light can exit the LED though an at least partially transparent substrate of the LED. By removing heat from an LED, the use of more current through the LED is facilitated, thus resulting in a brighter LED.10-29-2009
20090267085LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.10-29-2009
20090267088SYSTEMS, DEVICES AND METHODS OF BROADBAND LIGHT SOURCES WITH TUNABLE SPECTRUM - Broadband light source systems, devices, and methods with a tunable spectrum are described by multiplexing a plurality of light sources, such as LEDs, with thin-film filters or diffraction gratings. A plurality of light sources with different or same wavelengths are multiplexed together to construct a combined broadband light source. A diffraction grating diffracts light beams from the plurality of light sources to a slit-shaped aperture, depending on selected light sources, the relative positions of the light sources to the slit-shaped aperture, and the type of grating to produce a tunable spectrum.10-29-2009
20130062635DISPLAY AND ELECTRONIC UNIT - A display includes: a first region including first pixels configured of a single color; a second region including second pixels configured of a plurality of colors different from the single color, the second pixels having an organic layer including a common light emitting layer; and a dividing wall separating the first region from the second region.03-14-2013
20130062634SOLID STATE LIGHT SOURCE MODULE AND ARRAY THEREOF - A solid state light source array including a transparent substrate and N rows of solid state light emitting element series is provided. Each row of the solid state light emitting element series includes M solid state light emitting elements connected in series, wherein N, M are integrals and N≧1, M≧2. Each of the solid state emitting elements includes a first type electrode pad and a second type electrode pad. The first and the M03-14-2013
20130062632LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM INCLUDING THE SAME - Disclosed are a light emitting device package and a lighting system in which the light emitting device package includes a first cavity in a first region of the body, a second cavity in a second region of the body, first and second lead frames spaced apart from each other in the first cavity, a third lead frame spaced apart from the second lead frame in the second cavity, a first light emitting device on the first and second lead frames in the first cavity, a second light emitting device on the second and third lead frames in the second cavity, and a molding member in the first and second cavities.03-14-2013
20130062631LIGHT EMITTING STRUCTURE, LIGHT EMITTING MODULE, AND LIGHT EMITTING DEVICE - A light emitting module includes a carrier unit, a substrate unit, and a light emitting unit. The carrier unit includes at least one carrier body, and the carrier body has a mounting portion. The substrate unit includes at least one bendable substrate. The bendable substrate includes a plurality of substrate portions and a plurality of bending portions, the substrate portions are disposed on the mounting portion of the carrier body, and each bending portion is disposed between every two corresponding substrate portions. The light emitting unit includes a plurality of light emitting groups respectively disposed on the substrate portions, and each light emitting group includes at least one light emitting element electrically connected to each corresponding substrate portion. Because the substrate portions can be disposed on different planes after bending the substrate portions, thus light sources respectively generated by the light emitting elements can be projected toward different directions.03-14-2013
20130062633LED Array Having Embedded LED and Method Therefor - A light emitting array comprises a submount having a top surface and a bottom surface, and at least one LED at least partially embedded within the submount. The top surface of the submount is in contact with at least a side surface of the at least one LED. The submount may include one or more parallel layers. An optical layer may be covering the at least one LED in such a way that light emitted from the at least one LED passes through the optical layer.03-14-2013
20130062630OVERLAY CIRCUIT STRUCTURE FOR INTERCONNECTING LIGHT EMITTING SEMICONDUCTORS - A system and method for packaging light emitting semiconductors (LESs) is disclosed. An LES device is provided that includes a heatsink and an array of LES chips mounted on the heatsink and electrically connected thereto, with each LES chip comprising connection pads and a light emitting area configured to emit light therefrom responsive to a received electrical power. The LES device also includes a flexible interconnect structure positioned on and electrically connected to each LES chip to provide for controlLES operation of the array of LES chips, with the flexible interconnect structure further including a flexible dielectric film configured to conform to a shape of the heatsink and a metal interconnect structure formed on the flexible dielectric film and that extends through vias formed in the flexible dielectric film so as to be electrically connected to the connection pads of the LES chips.03-14-2013
20110204387SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING MULTI-CELL ARRAY, LIGHT EMITTING MODULE, AND ILLUMINATION APPARATUS - A semiconductor light emitting device includes a substrate, a plurality of light emitting cells, a connection part, and a concavo-convex part. The light emitting cells are arrayed on the top surface of the substrate. Each of the light emitting cells has a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer that are sequentially stacked on the top surface of the substrate. The connection part is formed to connect the light emitting cells in series, parallel or series-parallel. The concavo-convex part is formed in at least one of the bottom surface of the substrate and the top surface of an isolation region between the light emitting cells.08-25-2011
20110012140LIGHT EMITTING DIODE ARRANGEMENT - The invention relates to a light emitting diode arrangement comprising a first light emitting diode (01-20-2011
20110012139ORGANIC ELECTROLUMINESCENT DEVICE - An organic electroluminescent device with a configuration in which a functional layer, a transparent first electrode, alight emitting layer, and a second electrode are disposed in layer in this order, wherein a surface of the functional layer has a plurality of depressions and projections having a height of 0.5 μm to 100 μm, the surface being located on a side opposite to a side where the first electrode is, and the refractive index n01-20-2011
20110012138Light-Emitting Diode Die Packages and Methods for Producing Same - The present invention relates to a light-emitting diode die package. The LED die package includes a semiconductor base, at least two electrodes disposed on an electrode mounting surface of the semiconductor base, an insulation layer formed on the electrode-mounting surface and provided with two through holes for exposing the electrodes, a conductor-forming layer formed on the insulation layer and provided with two conductor-mounting holes in communication with the through holes, and conductor units formed within the through holes and the conductor-mounting holes in a manner electrically connected to the corresponding electrodes. The LED die package further includes a covering layer formed on a surface of the LED die opposite to the electrode-mounting surface and extending to an outer surface of the LED die. The covering layer is made of transparent material doped with phosphor powder.01-20-2011
20110012136DISPLAY APPARATUS - Provided is a display apparatus whose light extraction efficiency is not reduced even when a film thickness error of an image display device is caused. The display apparatus includes a plurality of image display devices. Each of the image display devices includes at least: a stack (01-20-2011
20110012135LIGHT-EMITTING DEVICE AND REPAIRING METHOD THEREOF - A light-emitting device including a plurality of light-emitting units is provided. Each of the light-emitting units includes a first common electrode layer, a plurality of light-emitting layers, and a second common electrode layer. The first common electrode layer includes a bridge conductive line and a plurality of first electrode patterns electrically insulated from each other, in which the first electrode patterns cover a portion of the bridge conductive line and are electrically connected to each other through the bridge conductive line. Each of the light-emitting layers is disposed on one of the first electrode patterns. The second common electrode layer is disposed on the light-emitting layers, in which the first common electrode layer of each of the light-emitting units is electrically connected to the second common electrode layer of an adjacent light-emitting unit.01-20-2011
20110037080METHODS FOR COMBINING LIGHT EMITTING DEVICES IN A PACKAGE AND PACKAGES INCLUDING COMBINED LIGHT EMITTING DEVICES - Methods of forming a light emitting device package assembly include defining a chromaticity region in a two dimensional chromaticity space within a 10-step MacAdam ellipse of a target chromaticity point, and subdividing the defined chromaticity region into at least three chromaticity subregions, providing a plurality of light emitting devices that emit light having a chromaticity that falls within the defined chromaticity region, selecting at least three of the plurality of light emitting devices, wherein each of the three light emitting devices emits light from a different one of the chromaticity subregions. The at least three light emitting devices are selected from chromaticity subregions that are complementary relative to the target chromaticity point to at least one other chromaticity subregion from which a light emitting device is selected.02-17-2011
20090261357SOLID STATE LIGHT SHEET AND BARE DIE SEMICONDUCTOR CIRCUITS WITH SERIES CONNECTED BARE DIE CIRCUIT ELEMENTS - An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare die electronic element is provided having a top conductive side and a bottom conductive side. Each bare die electronic element is disposed so that the top conductive side is in electrical communication with the top electrically conductive surface and so that the bottom conductive side is in electrical communication with the bottom electrically conductive surface.10-22-2009
20090261355Thin film transistor - To provide: a thin film transistor which can be operated with a low threshold and has a high transistor withstand voltage; a production method of the thin film transistor; and a semiconductor device, an active matrix substrate, and a display device, each including such a thin film transistor. The present invention is a thin film transistor including a semiconductor layer, a gate insulating film, a gate electrode on a substrate in this order, wherein a cross section of the semiconductor layer has a forward tapered shape; the gate insulating film covers a top surface and a side surface of the semiconductor layer; and the gate insulating film has a multilayer structure including a silicon oxide film on a semiconductor layer side and a film made of a material with a dielectric constant higher than a dielectric constant of silicon oxide on a gate electrode side; the gate insulating film satisfies 0.5≦B/A where a thickness of the gate insulating film on the top surface of the semiconductor layer is defined as A and a thickness of the gate insulating film on the side surface of the semiconductor layer is defined as B.10-22-2009
20130214301DISPLAY APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS - A display device is provided including a plurality of light emitting devices formed on a substrate, a plurality of first members corresponding to the light emitting devices and formed directly on a portion of the respective light emitting device, and a plurality of second members formed in areas between adjacent first members. The first members and the second members are configured to reflect and guide at least a portion of light emitted from the light emitting sections through the first members.08-22-2013
20130214302LIGHT EMITTING ELEMENT AND FABRICATING METHOD THEREOF - A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves.08-22-2013
20100123144CIRCUIT STRUCTURE OF PACKAGE CARRIER AND MULTI-CHIP PACKAGE - A circuit structure of a package carrier including a plurality of chip pads, a first electrode, a second electrode, a third electrode and a fourth electrode is provided. These chip pads are arranged in an M×N array. A first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad are disposed clockwise in the peripheral area of each chip pad in sequence. The orientations of each of the first, second, third, and fourth bonding pads of the (S−1)05-20-2010
20100123141EMISSIVE DEVICE WITH CHIPLETS - An emissive device includes a substrate having a substrate surface; a chiplet adhered to the substrate surface, the chiplet having one or more connection pads; a bottom electrode formed on the substrate surface, one or more organic or inorganic light-emitting layers formed over the bottom electrode, and a top electrode formed over the one or more organic or inorganic light-emitting layers; an electrical conductor including a transition layer formed over only a portion of the chiplet and only a portion of the substrate surface, the transition layer exposing at least one connection pad, the electrical conductor formed in electrical contact with the exposed connection pad and the bottom electrode; and an LED spaced from the chiplet and including a layer of light-emissive material formed over the bottom electrode and a top electrode formed over the light-emissive layer.05-20-2010
20130161662LIGHTING DEVICE - In a first aspect of the present invention, a lighting device including a metal plate, an electrical insulation layer that is smaller in size than an outline of the metal plate and arranged on an upper surface of the metal plate, a light-emitting element mounted on the electrical insulation layer, and a first connecting electrode and a second connecting electrode electrically connected to the light-emitting element and arranged on the electrical insulation layer.06-27-2013
20090236618LIGHT-EMITTING DIODE PACKAGE AND LEAD GROUP STRUCTURE FOR LIGHT-EMITTING DIODE PACKAGE - A light-emitting diode package 09-24-2009
20090236617LED ASSEMBLY INCORPORATING A STRUCTURE FOR PREVENTING SOLDER CONTAMINATION WHEN SOLDERING ELECTRODE LEADS THEREOF TOGETHER - An LED assembly includes a substrate and a plurality of LEDs mounted on the substrate. Each LED includes a base and a first and a second electrode leads inserted in the base. The first lead forms a groove in an end thereof, and the second lead forms a tab from an end thereof. The tab of each LED is received in the groove of an adjacent LED to thereby cooperatively define an accommodating space in the groove and above the tab. The accommodating space is used for receiving excess solder when soldering the first and the second leads together.09-24-2009
20090236616LED ASSEMBLY WITH SEPARATED THERMAL AND ELECTRICAL STRUCTURES THEREOF - An LED assembly includes a substrate and a plurality of LEDs mounted on the substrate. Each LED comprises an LED die, a base supporting the LED die thereon and thermally contacting the substrate to take heat generated by the LED die to the substrate, a pair of leads electrically connecting the LED die to input a current to the LED die, and an encapsulant enveloping the LED die. The pair of leads hover above the substrate to separate an electrical route of the LED assembly from a heat conducting pathway thereof. Furthermore, each LED has a plurality of legs extending raidally from the base thereof to fit in the base of an adjacent LED, to thereby engagingly lock with the adjacent LED.09-24-2009
20090236615LIGHT EMITTING DIODE - A semiconductor device including a wafer-level LED includes a semiconductor structure coupled to first and second electrodes. The semiconductor includes a P-doped portion of a first layer to an N-doped portion of a second layer. The first layer includes a surface configured to emit light. The first electrode is electrically coupled to the P-doped portion of the first layer on a first side of the semiconductor structure. The first side is adjacent to the surface that is configured to emit the light. The second electrode is electrically coupled to the N-doped portion of the second layer on a second side of the semiconductor structure. The second side is also adjacent to the surface that configured to emit light.09-24-2009
20130069089High Efficacy Semiconductor Light Emitting Devices Employing Remote Phosphor Configurations - A semiconductor light emitting apparatus a semiconductor light emitting device configured to emit light inside a hollow shell including wavelength conversion material dispersed therein or thereon. A semiconductor light emitting apparatus according to some embodiments is capable of generating in excess of 250 lumens per watt, and in some cases up to 270 lumens per watt.03-21-2013
20130069088LIGHT EMITTING DIODE WITH CONFORMAL SURFACE ELECTRICAL CONTACTS WITH GLASS ENCAPSULATION - An optoelectronic device (e.g., LED) comprising one or more conformal surface electrical contacts conforming to surfaces of the device; and a high refractive index glass partially or totally encapsulating the device and the conformal surface electrical contacts, wherein traditional wire bonds and/or bond pads are not used and the glass is a primary encapsulant for the device.03-21-2013
20130069087MULTI-LAYER WIRING SUBSTRATE, ACTIVE MATRIX SUBSTRATE, IMAGE DISPLAY APPARATUS USING THE SAME, AND MULTI-LAYER WIRING SUBSTRATE MANUFACTURING METHOD - A multiple-layer wiring substrate having a first conductive layer; an interlayer insulating layer; and a second conductive layer is disclosed, wherein the interlayer insulating layer includes a material whose surface energy is changed by receiving energy, and has a first region which does not include a contact hole and a second region which is formed such that its surface energy is higher than that of the first region, wherein a region within the contact hole of the first conductive layer has surface energy which is higher than surface energy of the second region of the interlayer insulating layer, and wherein the second conductive layer is formed by laminating, wherein the second conductive layer is in contact with the second region of the interlayer insulating layer along the second region, and is connected to the first conductive layer via the contact hole.03-21-2013
20130069086METHOD FOR PRODUCING A PLURALITY OF OPTOELECTRONIC SEMICONDUCTOR CHIPS - A method for producing a plurality of optoelectronic semiconductor chips includes providing a carrier wafer having a first surface and a second surface opposite the first surface. wherein a plurality of individual component layer sequences spaced apart from one another in a lateral direction are applied on the first surface, the component layer sequences being separated from one another by separation trenches; introducing at least one crystal imperfection in at least one region of the carrier wafer which at least partly overlaps a separation trench in a vertical direction; singulating the carrier wafer along the at least one crystal imperfection into individual semiconductor.03-21-2013
20130069085Organic Light-Emitting Display Device and Method of Fabricating The Same - Disclosed is an organic light-emitting display device capable of preventing the occurrence of cracks at corner regions of an adhesive layer. The organic light-emitting display device includes a first substrate including a plurality of pixels and a second substrate. A thin film transistor (TFT) located at each pixel of the first substrate. A pixel electrode is also located at each pixel. An organic light-emitting unit that emits light is coupled to each pixel electrode. A common electrode is electrically coupled to each organic light-emitting unit. An adhesive layer is coupled to the common electrode. The adhesive layer attaches the first and second substrates. The corner regions of the adhesive layer are rounded in order to control the creation of cracks in the adhesive layer and thereby prevent moisture from entering the active area of the device.03-21-2013
20130069084MULTIPLE DIE LED AND LENS OPTICAL SYSTEM - A light emitting device includes a number of light emitting diode dies (LEDs) mounted on a shared submount and covered with a single lens element that includes a corresponding number of lens elements. The LEDs are separated from each other by a distance that is sufficient for lens element to include separate lens elements for each LED. The separation of the LEDs and lens elements may be configured to produce a desired amount of light on a target at a predefined distance. In one embodiment, the lens elements are approximately flat type lens elements, such as Fresnel, TIR, diffractive lens, photonic crystal type lenses, prism, or reflective lens.03-21-2013
20130069083DIFFERENTIAL UNTRAVIOLET CURING USING EXTERNAL OPTICAL ELEMENTS - A lighting module has an array of solid state light emitters, a package in which the array of solid state light emitters resides, the package having a window and an external optical element arranged adjacent the window, the external optical element having a coating, the coating forming an optical pattern when illuminated by light from the array of solid state light emitters.03-21-2013
20090026467ELECTROOPTICAL DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR PRODUCING ELECTROOPTICAL DEVICE - An electrooptical device having a plurality of light-emitting regions includes a substrate, a bank disposed in a region other than the light-emitting regions on the substrate so as to surround the light-emitting regions, and a functional layer disposed in openings surrounded by the bank. The bank includes an upper bank segment and a plurality of lower bank segments having a higher wettability than the upper bank segment. The number of the lower bank segments exposed is smaller in second regions of the openings than in first regions of the openings.01-29-2009
20120235182Light-Emitting Diode Module and Corresponding Manufacturing Method - A new manufacturing method is described by the present invention for a new LED module 09-20-2012
20120235181LIGHT-EMITTING DEVICE AND LAMP - A light-emitting device including: a base which is translucent; a semiconductor light-emitting element provided on the base; a sealing member for sealing the semiconductor light-emitting element and including a first wavelength conversion material for converting a wavelength of light emitted by the semiconductor light-emitting element to a predetermined wavelength; and a groove provided on a side of the semiconductor light-emitting element, recessed from a top surface of the base on which the semiconductor light-emitting element is provided or a back surface of the base which is a surface opposite to the top surface, and for holding a second wavelength conversion material for converting the wavelength of the light emitted by the semiconductor light-emitting element to the predetermined wavelength.09-20-2012
20120235180Packaged Semiconductor Light Emitting Devices Having Multiple Optical Elements and Methods of Forming the Same - Methods of packaging a semiconductor light emitting device include providing a substrate having the semiconductor light emitting device on a front face thereof. A first optical element is formed from a first material on the front face proximate the semiconductor light emitting device but not covering the semiconductor light emitting device and a second optical element is formed from a second material, different from the first material, over the semiconductor light emitting device and the first optical element. Packaged semiconductor light emitting devices are also provided.09-20-2012
20120235179Measuring Method, Inspection Method, Inspection Device, Semiconductor Device, Method of Manufacturing a Semiconductor Device, and Method of Manufacturing an Element Substrate - An inspection method which simplifies an inspection step by eliminating the need to set probes on wiring or probe terminals, and an inspection device for performing the inspection step. A voltage is applied to each of inspected circuits or circuit elements to operate the same. Signal processing is performed on an output from each inspected circuit or circuit element during operation to form a signal (operation information signal) including information on the operating condition of the circuit or the circuit element. The operation information signal is amplified and the amplitude of an alternating current voltage separately input is modulated with the amplified operation information signal. The voltage of the modulated alternating current is read in a non-contact manner to determine whether the corresponding circuit or circuit element is non-defective or defective.09-20-2012
20120235178DISPLAY DEVICE AND ELECTRONIC APPARATUS - Disclosed herein is a display device including a plurality of pixels configured to have a first electrode, a light emitting layer, and a second electrode in that order over a substrate, wherein: the plurality of pixels include a first pixel having a first light emitting layer common to the pixels and a second pixel having the first light emitting layer and a second light emitting layer provided on each second pixel basis; and a surface of the first electrode in the first pixel is closer to the substrate than a surface of the first electrode in the second pixel.09-20-2012
20120235177SEMICONDUCTOR LIGHT EMITTING DEVICE WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a semiconductor light emitting device wafer includes a plurality of semiconductor light emitting devices, the plurality of semiconductor light emitting devices being collectively formed, and includes a light emitting unit and a wavelength conversion unit. The light emitting unit has a first major surface and a second major surface on a side opposite to the first major surface. The wavelength conversion unit is provided on the first major surface side. The wavelength conversion unit contains a fluorescer. A thickness of the wavelength conversion unit changes based on a distribution in a surface of the wafer of at least one selected from a wavelength and an intensity of light emitted from the light emitting unit of the plurality of semiconductor light emitting devices.09-20-2012
20120235176Optoelectronic Module Comprising at Least One First Semiconductor Body Having a Radiation Outlet Side and an Insulation Layer and Method for the Production Thereof - An optoelectronic module is provided which comprises a first semiconductor body (09-20-2012
20120235175ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display apparatus that improves image quality characteristics, the organic light-emitting display apparatus including: a substrate; a first electrode formed on the substrate; a pixel-defining layer (PDL) formed on the first electrode to expose a set or predetermined region of the first electrode; an intermediate layer formed in the exposed predetermined region of the first electrode and including an organic emission layer; and a second electrode having a light-scattering face facing the substrate or facing oppositely away from the substrate, the second electrode being disposed on the intermediate layer.09-20-2012
20120235173THREE DIMENSIONAL LIGHT EMITTING DIODE SYSTEMS, AND COMPOSITIONS AND METHODS RELATING THERETO - A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.09-20-2012
20120235172THREE DIMENSIONAL LIGHT EMITTING DIODE SYSTEMS, AND COMPOSITIONS AND METHODS RELATING THERETO - A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.09-20-2012
20120235171ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display includes a substrate having a plurality of organic light emitting elements thereon and a thin film encapsulation layer on the substrate. The thin film encapsulation layer covers the organic light emitting elements, and the thin film encapsulation layer includes a first porous inorganic layer and a second inorganic layer on the first porous inorganic layer.09-20-2012
20120235170Display Apparatus and Method of Fabricating the Same - A display apparatus comprises a first substrate, a second substrate separated from the first substrate and facing the first substrate, and a first sealing portion interposed between the first substrate and the second substrate, wherein the first substrate comprises a first region overlapped by the second substrate and a second region not overlapped by the second substrate, and the first sealing portion is situated on a boundary between the first region and the second region and comprises one or more injection holes.09-20-2012
20120235169SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD - A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer encapsulating at least one semiconductor light-emitting chip to emit various colored lights including white light. The semiconductor light-emitting device can include a base board with the chip mounted thereon, a frame located on the base board, a transparent plate located on the wavelength converting layer, a reflective material layer disposed between the frame and both side surfaces of the wavelength converting layer and the transparent plate, and a light-absorbing layer located on the reflective material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency and a contrast between a light-emitting and non-light-emitting surfaces by using the transparent material and light-absorbing layer. A wavelength-converted light that is emitted can have a high light-emitting efficiency and a high contrast between a light-emitting and non-light-emitting surface from a small light-emitting surface.09-20-2012
20120235168SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a semiconductor light emitting device includes a stacked structure body, first and second electrodes. The stacked structure body includes first and second semiconductor layers and a light emitting layer provided between the second and first semiconductor layers, and has first and second major surfaces. The first electrode has a first contact part coming into contact with the first semiconductor layer. The second electrode has a part coming into contact with the second semiconductor layer. A surface of the first semiconductor layer on a side of the first major surface has a first part having a part overlapping a contact surface with the first semiconductor layer and a second part having a part overlapping the second semiconductor layer. The second part has irregularity. A pitch of the irregularity is longer than a peak wavelength of emission light. The first part has smaller irregularity than the second part.09-20-2012
20120235167SOLID STATE OPTOELECTRONIC DEVICE WITH PREFORMED METAL SUPPORT SUBSTRATE - A wafer-level process for manufacturing solid state lighting (“SSL”) devices using large-diameter preformed metal substrates is disclosed. A light emitting structure is formed on a growth substrate, and a preformed metal substrate is bonded to the light emitting structure opposite the growth substrate. The preformed metal substrate can be bonded to the light emitting structure via a metal-metal bond, such as a copper-copper bond, or with an inter-metallic compound bond.09-20-2012
20110018009Light-Emitting Device - A light-emitting device comprising a light-emitting layer (01-27-2011
20120267645LIGHT EMITTING DIODE MODULE PACKAGE STRUCTURE - A light emitting diode (LED) module package structure is described. The LED module package structure includes a metal heat dissipating board, a plurality of light emitting diode chips fixed on the metal heat dissipating board, at least one chip-scale connector fixed on the metal heat dissipating board to electrically connect to the light emitting diode chip via a bonding wire. The chip-scale connector includes a sapphire substrate, a conductive metal layer and an insulation protruding member. The insulation protruding member divides the conductive metal layer into a plurality of conductive areas. In addition, the LED module package structure can further includes a chip-scale power connector fixed in the metal heat dissipating board to connect the chip-scale connector or the light emitting diode chip via the bonding wire.10-25-2012
20110042690LIGHT EMITTING DIODE PACKAGE - The present invention provides a light emitting diode package including: a package mold having a first cavity and a second cavity with a smaller size than that of the first cavity; first and second electrode pads provided on the bottom surfaces of the first cavity and the second cavity, respectively; an LED chip mounted on the first electrode pad; a wire for providing electrical connection between the LED chip and the second electrode pad; and a molding material filled within the first cavity and the second cavity.02-24-2011
20090315043ORGANIC LIGHT-EMITTING TRANSISTOR AND DISPLAY DEVICE - An organic light-emitting transistor having a source electrode layer; a drain electrode layer facing the source electrode layer; an organic light-emitting layer formed between the source electrode layer and the drain electrode layer; a semiconductor layer formed between the organic light-emitting layer and the source electrode layer; and a gate electrode layer deposited to face through a gate insulation film to one face of the source electrode layer opposite to the other face facing the drain electrode layer. The organic light-emitting transistor further comprises: a charge-carrier suppression layer formed between the organic light-emitting layer and the source electrode layer to have an aperture; and a relay region formed between the charge-carrier suppression layer and the source electrode layer to relay charge-carriers from the source electrode layer to the aperture.12-24-2009
20110210347SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device including: a thin film transistor substrate; and a driving circuit, wherein the thin film transistor substrate includes: a thin film transistor includes: a gate electrode; a gate insulating film that is formed on the insulating substrate and the gate electrode; a semiconductor layer that is formed on the gate insulating film; a channel protecting film; and a source electrode and a drain electrode that are formed to connect with the semiconductor layer; and a wiring converting unit that directly and electrically connects a first wiring layer and a second wiring layer through a first contact hole formed in the gate insulating film in the driving circuit, wherein the first wiring layer is formed at the same layer as the gate electrode on the insulating substrate; and wherein the second wiring layer is formed at the same layer as the source electrode and the drain electrode.09-01-2011
20120025219ARRANGEMENT OF OPTOELECTRONIC COMPONENTS - An arrangement includes at least two optoelectronic individual elements. At least two of the individual elements overlap partially in a lateral direction. Indirect or direct electrical contacting between the at least two laterally overlapping individual elements is brought about by at least one conductor track on a carrier top of the one individual element and by at least one conductor track on a carrier bottom of the other individual element.02-02-2012
20120061696METHOD FOR MANUFACTURING DISPLAY AND DISPLAY - A method for manufacturing a display, the method including the steps of: disposing a substrate over which a plurality of lower electrodes and a plurality of auxiliary electrodes are formed and a donor film over which a light-emitting functional layer is formed so that the light-emitting functional layer contacts with the lower electrodes and does not contact with the auxiliary electrodes; irradiating the donor film with an energy beam to selectively transfer the light-emitting functional layer onto the lower electrodes; and forming an upper electrode that covers the light-emitting functional layer and the auxiliary electrodes.03-15-2012
20120211772ARRAY SUBSTRATE, DISPLAY APPARATUS HAVING THE SAME AND METHOD OF MANUFACTURING THE SAME - An array substrate includes a substrate, a dummy pad and a driving signal output line. The substrate includes a display area displaying an image, and a peripheral area surrounding the display area. The dummy pad extends along a first direction in the peripheral area of the substrate, and includes a first protrusion portion protruding from an end portion of the dummy pad along the first direction. The driving signal output line extends along a second direction crossing with the first direction, is disposed adjacent to the dummy pad, and provides an external signal. Accordingly static electricity provided to the driving signal output line flows into the dummy pad having the first protrusion portion, so that static electricity may be prevented from flowing into the display area.08-23-2012
20120235174LIQUID CRYSTAL PANEL AND PIXEL STRUCTURE THEREOF - There is provided a pixel structure of a liquid crystal panel including a transparent substrate, and a gate line, a data line, a switching transistor, a first electrode, a second electrode and a shield layer formed on the transparent substrate. The gate line is substantially perpendicular to the data line. The switching transistor is located adjacent to a crossing point of the gate line and the data line, and is configured to input a display voltage of the data line to the second electrode according to the control of the gate line. The first electrode and the second electrode are arranged in such a way that the display voltage forms a transverse electric field between the first electrode and the second electrode. The shield layer overlaps at least a part of the gate and is electrically isolated from the first electrode and the second electrode.09-20-2012
20120267643Organic light emitting display apparatus - Embodiments relate to an organic light-emitting display device, comprising a first substrate defined by a plurality of pixels each including a pixel area and a transmittance area adjacent to the pixel area, the pixel area emitting light in a first direction and the transmittance area transmitting external light, and the first substrate including a pair of optical pattern units for transmitting or blocking the external light for each transmittance area according to coded patterns corresponding to the plurality of pixels, a second substrate facing the first substrate and encapsulating the plurality of pixels on the first substrate, and a pair of sensor units corresponding to the pair of optical pattern units, the pair of sensor units being arranged in a second direction that is opposite to the first direction in which the light is emitted, the pair of sensor units receiving the external light passing through the pair of optical pattern units.10-25-2012
20110278601LIGHT EMITTING DIODE PACKAGE - An LED package includes a silicon base, an LED and a glass encapsulant. The silicon base has a first surface and a second surface opposite to the first surface. The LED chip is located on the first surface of the silicon base. The glass encapsulant covers the LED chip. The glass encapsulant and the silicon base define a receiving space therebetween to receive the LED chip. The glass encapsulant is fixedly engaged with the first surface of the silicon base, so the glass encapsulant and the silicon base enclose the LED chip.11-17-2011
20110278603ORGANIC EL DISPLAY AND METHOD FOR MANUFACTURING SAME - Disclosed is a method for manufacturing an organic EL display, which comprises: a step of preparing an organic EL panel that comprises a substrate and organic EL elements arranged as a matrix on the substrate, wherein each organic EL element has a pixel electrode arranged on the substrate, an organic layer arranged on the pixel electrode, a transparent counter electrode arranged on the organic layer, a protective layer arranged on the transparent counter electrode, and a color filter arranged on the protective layer, and a defect portion present in the organic layer in each organic EL element is detected; a step of destroying a region of the transparent counter electrode positioned above the defect portion by irradiating the region with laser light through the color filter; and a step wherein a region of the color filter positioned above the defect portion is removed.11-17-2011
20110278602LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting device includes a substrate having an element mounting area in a principal surface thereof. The light emitting device also includes at least one light emitting element mounted in the element mounting area of the substrate. The light emitting device also includes a heat transfer member provided on the substrate. The heat transfer member has a thermal conductivity different from thermal conductivity of the substrate so as to form uneven thermal resistance distribution in the element mounting area. Thermal resistance in a heat radiation path through the substrate for release of heat emitted from the light emitting element changes with the mounting position of the light emitting element.11-17-2011
20110278600LIGHT EMITTING DIODE MODULE AND METHOD OF MAKING THE SAME - A light emitting diode module includes a substrate, at least two spaced apart light emitting diodes formed on the substrate, an insulating layer, and an electrically conductive layer. Each of the light emitting diodes includes a light emitting unit, an n-electrode, and a p-electrode. The light emitting unit has first and second portions. The first portion has an n-type top face and a first stepped side. The second portion has a p-type top face and a second stepped side. The insulating layer is formed on the n-type top face and the first stepped side of the first portion of one of the light emitting diodes, and the second stepped side and the p-type top face of the second portion of the other one of the light emitting diodes. The electrically conductive layer is formed on the insulating layer. A method of making the light emitting diode module is also disclosed.11-17-2011
20120097996LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.04-26-2012
20120097988LED Module - A LED module has a LED chip, LED packaging materials, a metal base circuit board, a power connection cable, a heat sink that also functions as a metal case; and an optional potting material. The LED chip is fixed to the metal base close to the surface of the board. The LED packaging materials forms a package. A power connection line has a continuous uninterrupted power supply line. A continuous power cord from the power connection line is mounted on the metal injection molded parts corresponding fixed location. Self-tapping screws are mounted to the metal base circuit board. The self-tapping screws are formed of metal. A plastic end connector cap is for the power cord. The power connection cable passes through the plastic end connector cap and joins together with the metal case to form a fixed electrical connection by connecting to the power connection cable.04-26-2012
20120097987Organic light emitting diode display - An organic light emitting diode display includes a substrate, a display unit that includes a common power line and a common electrode, an encapsulation substrate that is attached to the substrate by an adhering layer enclosing the display unit and includes a resin matrix and a plurality of carbon fiber. The display includes a first conductive portion and a second conductive portion. The first conductive portion is on a first inner surface region, a first side surface region, and a first outer surface region of the encapsulation substrate. The first conductive portion is adapted to supply a first electrical signal to the common power line. The second conductive portion is on a second inner surface region, a second side surface region, and a second outer surface region of the encapsulation substrate. The second conductive portion is adapted to supply a second electrical signal to the common electrode.04-26-2012
20110133223SOLID STATE EMITTER PACKAGES - A solid state emitter package may include at least one electrically conductive path associated with the solid state emitter package that is not in electrical communication with any solid state emitter of the solid state emitter package, with such electrically conductive path being susceptible to inclusion of a jumper or a control element. A solid state emitter package includes a principally red solid state emitter having peak emissions within 590 nm to 680 nm, a principally blue solid state emitter having peak emissions within 400 nm to 480 nm, and at least one of a common leadframe, common substrate, and common reflector, with the package being devoid of any principally green solid state emitters having peak emissions between 510 nm and 575 nm.06-09-2011
20110133219LIGHT EMITTING ELEMENT ARRAY - A method of fabricating a light emitting diode array, comprising: providing a temporary substrate; forming a first light emitting stack and a second light emitting stack on the temporary substrate; forming a first insulating layer covering partial of the first light emitting stack; forming a wire on the first insulating layer and electrically connecting to the first light emitting stack and the second light emitting stack; forming a second insulating layer fully covering the first light emitting stack, the wire and partial of the second light emitting stack; forming a metal connecting layer on the second insulating layer and electrically connecting to the second light emitting stack; forming a conductive substrate on the metal connecting layer; removing the temporary substrate; and forming a first electrode connecting to the first light emitting stack.06-09-2011
20110012137STRUCTURE OF AC LIGHT-EMITTING DIODE DIES - A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.01-20-2011
20090189166LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS AND METHOD OF FABRICATING THE SAME - Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source. In addition, since the semi-insulating buffer layer is employed, it is possible to prevent an increase in a leakage current through the thermally conductive substrate and between the light emitting cells.07-30-2009
20110127549LIGHT EMITTING DIODE CHIP HAVING DISTRIBUTED BRAGG REFLECTOR AND METHOD OF FABRICATING THE SAME - Exemplary embodiments of the present invention disclose a light emitting diode chip including a substrate having a first surface and a second surface, a light emitting structure arranged on the first surface of the substrate and including an active layer arranged between a first conductive-type semiconductor layer and a second conductive-type semiconductor layer, a distributed Bragg reflector arranged on the second surface of the substrate, the distributed Bragg reflector to reflect light emitted from the light emitting structure, and a metal layer arranged on the distributed Bragg reflector, wherein the distributed Bragg reflector has a reflectivity of at least 90% for light of a first wavelength in a blue wavelength range, light of a second wavelength in a green wavelength range, and light of a third wavelength in a red wavelength range.06-02-2011
20100283064NANOSTRUCTURED LED ARRAY WITH COLLIMATING REFLECTORS - The present invention relates to nanostructured light emitting diodes, LEDs. The nanostructured LED device according to the invention comprises an array of a plurality of individual nanostructured LEDs. Each of the nanostructured LEDs has an active region wherein light is produced. The nanostructured device further comprise a plurality of reflectors, each associated to one individual nanostructured LED (or a group of nanostructured LEDs. The individual reflectors has a concave surface facing the active region of the respective individual nanostructured LED or active regions of group of nanostructured LEDs.11-11-2010
20100320483LIGHT-EMITTING DIODE APPARATUS - An LED apparatus includes a base having thermal conductivity, an insulative substrate provided on one surface of the base and including electrodes provided on a surface of the substrate, at least one base-mounting area that is an exposed part of the base, exposed within a pass-through hole provided in the substrate, a plurality of LED elements mounted on the base in the base-mounting area and some of the LED elements in a unit electrically connected to the electrodes in series, a plurality of the units are electrically connected in parallel, and a frame disposed to surround the base-mounting area and configured to form a light-emitting area.12-23-2010
20120138964BACKLIGHT FILM, METHOD AND APPARATUS FOR FORMING SAME - A backlight film includes a flexible substrate with a first electrode layer, a polymeric light emitting layer, a second electrode layer and a protection layer formed subsequently on the flexible substrate. The first electrode layer, the polymeric light emitting layer and the second electrode layer each has a predetermined pattern. The backlight film further includes an insulating layer arranged around the polymeric light emitting layer. A method and an apparatus for forming the backlight film are also provided.06-07-2012
20120138970FOLDABLE ORGANIC LIGHT EMITTING DIODE DISPLAY - A foldable display includes a first plate, a second plate, a first protecting window, a second protecting window, a soft material layer and an intermediate layer which controls brightness. The first plate includes a thin film transistor and an organic light emitting diode (“OLED”), and displays at least one portion of an image to be displayed. The second plate includes a thin film transistor and an OLED, and displays a second portion different from the first portion of the image. The first protecting window is on the first plate. The second protecting window is on the second plate. The soft material layer is between the first and second protecting windows. The intermediate layer is between the soft material layer and a side surface of the first protecting window, and between the soft material layer and the second protecting window.06-07-2012
20110140132Light-Emitting Device - Provided are a light-emitting device, a light-emitting device package, and a method for fabricating the light-emitting device. The light-emitting device includes a first light-emitting structure; an insulation layer having non-conductivity, in which a current does not flow, on the first light-emitting structure; a second light-emitting structure on the insulation layer; and a common electrode simultaneously and electrically connected to the first light-emitting structure and the second light-emitting structure.06-16-2011
20090289267SOLID STATE LED BRIDGE RECTIFIER LIGHT ENGINE - A solid-state light engine comprised of light emitting diodes (LEDs) configured into a bridge rectifier with a current limiting module coupled to the LED bridge rectifier. The light engine may be packaged for high temperature operation. Optionally, the LEDs comprise wavelength-converting phosphors with a persistence that is a multiple of the peak to peak current period, to smooth and mask ripple frequency pulsation of emitted light.11-26-2009
20100155746HIGH VOLTAGE LOW CURRENT SURFACE-EMITTING LED - A monolithic LED chip is disclosed comprising a plurality of junctions or sub-LEDs (“sub-LEDs”) mounted on a submount. The sub-LEDs are serially interconnected such that the voltage necessary to drive the sub-LEDs is dependent on the number of serially interconnected sub-LEDs and the junction voltage of the sub-LEDs. Methods for fabricating a monolithic LED chip are also disclosed with one method comprising providing a single junction LED on a submount and separating the single junction LED into a plurality of sub-LEDs. The sub-LEDs are then serially interconnected such that the voltage necessary to drive the sub-LEDs is dependent on the number of the serially interconnected sub-LEDs and the junction voltage of the sub-LEDs.06-24-2010
20110297975LIGHT-EMITTING UNIT ARRAY - A light-emitting unit array includes a plurality of light-emitting units arranged and integrated monolithically in an array, and each of the light-emitting units includes a first doped type layer, a second doped type layer, a light-emission layer, and a photonic crystal structure. The light emission layer is disposed between the first doped type layer and the second doped type layer, wherein the second doped type layer has a surface facing away from the light emission layer. The photonic crystal structure is disposed on the surface of the second doped type layer.12-08-2011
20120286299ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display device is disclosed. The display device includes a substrate; a first electrode on the substrate; an auxiliary electrode patterned on and insulated from the first electrode, and having a top surface that has surface roughness; an intermediate layer on the first electrode and the auxiliary electrode; and a second electrode on the intermediate layer and facing the first electrode. The auxiliary electrode and the second electrode are electrically connected to each other via the surface roughness of the top surface of the auxiliary electrode.11-15-2012
20120286302Flexible Lighting Devices - A first device and methods for manufacturing the first device are provided. The first device may comprise a flexible substrate and at least one organic light emitting device (OLED) disposed over the flexible substrate. The first device may have a flexural rigidity between 1011-15-2012
20110284884LIGHT EMITTING DIODE CHIP FOR HIGH VOLTAGE OPERATION AND LIGHT EMITTING DIODE PACKAGE INCLUDING THE SAME - A light emitting diode (LED) chip for high voltage operation and an LED package including the same arc disclosed. The LED chip includes a substrate, a first array formed on the substrate and including n light emitting cells connected in series, and a second array formed on the substrate and including m (m≦n) light emitting cells connected in series. During operation of the LED chip, the first array and the second array are operated by being connected in reverse parallel to each other. Further, when a driving voltage of the first array is delined as Vd1 and a driving voltage of the second array is defined as Vd2, a difference between Vd1 and Vd2×(n/m) is not more than 2V.11-24-2011
20110284883SEMICONDUCTOR LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, LUMINAIRE, DISPLAY UNIT, TRAFFIC SIGNAL LAMP UNIT, AND TRAFFIC INFORMATION DISPLAY UNIT - Provided is a light-emitting element in which two LED structures are dividedly formed on a rectangular substrate. The LED structures are each a semiconductor layer made by laminating an n-type semiconductor layer (a LED structure), an active layer (not shown), and a p-type semiconductor layer, and are respectively provided near both ends of a diagonal line of the upper surface of the substrate. On the upper surface of the substrate, two bonding electrodes each having a circular surface are also respectively formed near both ends of the other diagonal line, and two resistance elements each formed of the n-type semiconductor layer are respectively provided near two opposite sides of the substrate.11-24-2011
20110284882LIGHT EMITTING DEVICE PACKAGE - A light emitting device package is provided comprising a substrate, a first light emitting device, a body including a first lead frame on which the first light emitting device is disposed and a second lead frame separated from the first lead frame and an ESD device which contacts the first and second lead frames, and at least a part to which is exposed the outside of the body.11-24-2011
20110284885LIGHT EMITTIG DEVICE PACKAGE AND IMAGE DISPLAY APPARATUS INCLUDING THE SAME - Disclosed herein is a light emitting device package including first lead frame and second lead frame mounted on a package body, a light emitting device electrically connected to the first lead frame and second lead frame, to emit light of a first wavelength range, and an encapsulant surrounding the light emitting device, the encapsulant comprising phosphors to be excited by the light of the first wavelength range, thereby emitting light of a second wavelength range, and a resin having a refractive index of 1.1 to 1.3.11-24-2011
20110284879LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE MODULE - A light emitting diode (LED) package comprising a carrier, an LED chip, a lens, and a phosphor layer is provided. The LED chip disposed on the carrier. The lens encapsulating the LED chip has a plurality of fins surrounding the LED chip and a conical indentation. The fins extending backward the LED chip radially. Each of the fins has at least one light-emitting surface and at least one reflection surface adjoining the light-emitting surface. A bottom surface of the conical indentation is served as an total reflection surface. The phosphor layer is disposed on the light-emitting surfaces of the lens. An LED package and an LED module are also provided.11-24-2011
20110284881DISPLAY APPARATUS - At least one of the pixels has a first region and a second region that are the same in color but different in viewing angle characteristic, and includes a switching circuit configured to independently turn on or off each of the organic EL elements provided in the respective first and second regions.11-24-2011
20110284877 POWER-TYPE LED - The invention discloses a power-type LED comprising a support frame, a group of LED chips mounted on the frame, and an exterior wrapping layer made of a fluorescent substance; Said support frame consists of a left support and an opposite right support placed at a distance from each other; The upper parts of the left and right supports are semi-cylinders, semi-cones, or semi-rings having multi-direction chip-fixing surfaces; A group of LED chips is respectively fixed onto the chip-fixing surfaces of the left support and the right support. All LED chips are serial-connected or parallel-connected with conducting wires. One of the supports is used as the positive pole and the other is used as the negative pole; The middle segment of the left and right supports is wrapped with an insulating layer which combines the left and right supports into an integrated support frame and insulates them from each other; The outer side of the upper part of the two-support frame is covered with a fluorescent layer which can enclose LED chips. The device can be made into a semiconductor light source and provides good heat-dissipating effect.11-24-2011
20090101921LED and thermal conductivity device combination assembly - AN LED and thermal conductivity device combination assembly includes a thermal conductivity device, two conducting members each having a metal conducting wire and an insulator surrounding the metal conducting wire and attached to the thermal conductivity device, LED chips each having a positive electrode and a negative electrode disposed at the top side and an insulation layer disposed at the bottom side and bonded to the surface of the thermal conductivity device, lead wires connected between the positive electrode and negative electrode of the LED chips and the metal conducting wires of the conducting members to connect the LED chips in series and in parallel, and a packaging device covering the LED chips.04-23-2009
20090152568Method for packaging submount adhering light emitting diode and package structure thereof - A method for packaging submount adhering LED comprises providing a first substrate which has an upper surface, a lower surface forming a plurality of heat-dissipating cavities and a plurality of die-attaching regions defined on the upper surface. Each of the heat-dissipating cavities corresponds to the die-attaching region and has a bottom surface, wherein there is a carrier base located between the bottom surface and the die-attaching region. Next, a heat conductor is formed in the heat-dissipating cavity and a plurality of LEDs are disposed on the die-attaching regions of the first substrate. Then, a second substrate is provided which has a first surface facing to the upper surface of the first substrate, a second surface opposite to the first surface and a plurality of reflective slots communicating with the first and second surfaces. Each of the reflective slots corresponds to the LED and the die-attaching region and couples the first and second substrates thereby allowing each of the LEDs to be located in the reflective slot.06-18-2009
20120001203LED CHIP PACKAGE STRUCTURE - A LED chip package structure includes a substrate unit, a light-emitting unit, and a package unit. The substrate unit includes a strip substrate body. The light-emitting unit includes a plurality of LED chips disposed on the strip substrate body and electrically connected to the strip substrate body. The package unit includes a strip package colloid body disposed on the strip substrate body to cover the LED chips, wherein the strip package colloid body has an exposed top surface and an exposed surrounding peripheral surface connected between the exposed top surface and the strip substrate body, and the strip package colloid body has at least one exposed lens portion projected upwardly from the exposed top surface thereof and corresponding to the LED chips. Hence, light beams generated by the LED chips pass through the strip package colloid body to form a strip light-emitting area on the strip package colloid body.01-05-2012
20120007109LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - Disclosed are a light emitting device and a method of fabricating the same. The light emitting device comprises a substrate. A plurality of light emitting cells are disposed on top of the substrate to be spaced apart from one another. Each of the light emitting cells comprises a first upper semiconductor layer, an active layer, and a second lower semiconductor layer. Reflective metal layers are positioned between the substrate and the light emitting cells. The reflective metal layers are prevented from being exposed to the outside.01-12-2012
20120007106ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display according to an exemplary embodiment includes an organic light emitting display panel that includes an organic light emitting member, a polarizing plate that is spaced-apart from the organic light emitting display panel and arranged at an upper portion thereof, and a window that is attached to an upper portion of the polarizing plate and protects the organic light emitting display panel. The polarizing plate may include a linear polarizing member and a retardation film that is disposed under the linear polarizing member. According to the exemplary embodiment, the external light visibility can be improved by absorbing light that is incident on the lower portion of the polarizing plate by the polarizing plate by attaching the polarizing plate to the lower portion of the window and separating the polarizing plate from the organic light emitting display panel.01-12-2012
20100006868AC LED device and method for fabricating the same - An AC LED device and method for fabricating the same are disclosed. An exemplary embodiment of the AC LED device includes at least two separate AC LED unit chips, wherein each of the AC LED unit chip includes a substrate having a first light emitting module and a second light emitting module. Each of the first and second light emitting modules includes a plurality of light emitting micro diodes connected between a first conductive electrode and a second conductive electrode, wherein the amount of light emitting micro diodes emitting light during a positive half cycle of an AC charge is equal to that during a negative half cycle of an AC charge. A plurality of conductive wires is respectively and electrically connected to the separate AC LED unit chips without passive devices.01-14-2010
20090152569LED MODULE WITH REDUCED OPERATING TEMPERATURE - The present invention relates to a LED module with a reduced operating temperature. The LED module includes a substrate, a plurality of LED chips, a carrier and an encapsulant layer. These LED chips are disposed on the substrate and electrically connected to the substrate and are divided into a first LED chip set and a second LED chip set. The carrier is coupled to the substrate and has a driving circuit. The driving circuit is electrically connected to the plurality of LED chips for driving operations of the plurality of LED chips. The first LED chip set and the second LED chip set emit light in an alternate lighting manner or in a combined simultaneous/alternate lighting manner so as to reduce the operating temperature of the LED module. The encapsulant layer covers the plurality of LED chips, the substrate and the carrier having the driving circuit.06-18-2009
20080308818Light-emitting device - A light-emitting device includes an LED chip emitting a primary light, and a phosphor deposited on the LED chip for absorbing the primary light to excite a secondary light, wherein the wavelength of the primary light is shorter than 430 nm and the LED chip is driven by current density greater than 200 mA/cm12-18-2008
20110297972LIGHT EMITTING DEVICE HAVING PLURALITY OF LIGHT EMITTING CELLS AND METHOD OF FABRICATING THE SAME - A light emitting device having a plurality of light emitting cells is disclosed. The light emitting device comprises a substrate; a plurality of light emitting cells positioned on the substrate to be spaced apart from one another, each of the light emitting cells comprising a p-type lower semiconductor layer, an active layer and an n-type upper semiconductor layer; p-electrodes positioned to be spaced apart from one another between the substrate and the light emitting cells, the respective p-electrodes being electrically connected to the corresponding lower semiconductor layers, each of the p-electrodes having an extension extending toward adjacent one of the light emitting cells; n-electrodes disposed on upper surfaces of the respective light emitting cells, wherein a contact surface of each of the n-electrodes electrically contacting with each light emitting cell exists both sides of any straight line that bisects the light emitting cell across the center of the upper surface of the light emitting cell; a side insulating layer for covering sides of the light emitting cells; and wires for connecting the p-electrodes and the n-electrodes, the wires being spaced apart from the sides of the light emitting cells by the side insulating layer.12-08-2011
20110297974LED ASSEMBLY WITH COLOR TEMPERATURE CORRECTION CAPABILITY - An illumination assembly is provided which is capable of correcting a color temperature. The assembly includes a substrate with a plurality of coatings applied on a respective plurality of surface portions of a base material. A light emitting device includes one or more light emitting elements of a first color temperature mounted on surface portions of the substrate having a first color coating, and one or more light emitting elements having a second color temperature mounted on surface portions of the substrate having a second color coating. Light emitting elements are individually sealed with a resin containing an excitable phosphor, with a reflectance factor of the first color coating and a reflectance factor of the second color coating set corresponding to light emitted from the light emitting elements having the first and second color temperatures, respectively, with respect to a desired color temperature for the light emitting device.12-08-2011
20110291115ORGANIC LIGHT EMITTING DISPLAY - An organic light emitting display having first pixel power source lines receiving a pixel driving voltage from first power supply sources and second pixel power source lines arranged between the first pixel power source lines and receiving a pixel driving voltage from second power supply sources, the light emitting diode of each of a plurality of pixels included in an image display unit is divided into two, and the divided light emitting diodes are coupled to the different pixel power source lines so that brightness non-uniformity of the image display unit caused by the IR drops of the pixel power source lines is reduced or prevented.12-01-2011
20110291114LED PACKAGE STRUCTURE - A light-emitting diode (LED) package structure includes a substrate, a first LED, a second LED, and a resin material. At least one enclosure made of a transparent material forms on a surface of the substrate, and encloses and forms at least one area on the substrate. The first LED and the second LED are disposed in the area and adjacent to each other, and the resin material is disposed in the area, and covers the first LED and the second LED. The LED package structure obtains desired illuminating lights by mixing lights respectively emitted by the first LED and the second LED.12-01-2011
20110291113FILTER FOR A LIGHT EMITTING DEVICE - Embodiments of the invention include a semiconductor light emitting device capable of emitting first light having a first peak wavelength and a wavelength converting element capable of absorbing the first light and emitting second light having a second peak wavelength. In some embodiments, the structure further includes a metal nanoparticle array configured to pass a majority of light in a first wavelength range and reflect or absorb a majority of light in a second wavelength range. In some embodiments, the structure further includes a filter configured to pass a majority of light in a first wavelength range and reflect or absorb a majority of light in a second wavelength range, wherein the filter is configured such that a wavelength at which a minimum amount of light is passed by the filter shifts no more than 30 nm for light incident on the filter at angles between 0° and 60° relative to a normal to a major surface of the filter.12-01-2011
20110291125LIGHTING MODULE - A lighting module may include a lighting band with a band-shaped flexible substrate, wherein at least one semiconductor light source is applied to a top side of the substrate, wherein the lighting module is faced with a protective layer such that at least one emission area of the at least one semiconductor light source is exposed thereby.12-01-2011
20100090229SEMICONDUCTOR LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME - A light emitting apparatus can have a front luminous intensity distribution having a sharp difference at the interface between the light emitting area and the surrounding non-light emitting area (outer environment) so as to suppress or prevent light color unevenness. The semiconductor light emitting apparatus can include a substrate, a plurality of light emitting elements each having a top surface as a light emitting surface and disposed on the substrate with a predetermined gap between the adjacent light emitting elements, bridge portions each disposed at the gap between the adjacent light emitting elements so as to connect the light emitting elements, and a wavelength conversion layer disposed over the top surfaces of the plurality of the light emitting elements and the bridge portions entirely. The wavelength conversion layer can have a decreased thickness at least around its peripheral area and gradually tapering to its end portion.04-15-2010
20110163334COLOUR MIXING METHOD FOR CONSISTENT COLOUR QUALITY - The present invention relates to a light emitting device (07-07-2011
20120286300DISPLAY DEVICE, DISPLAY, AND ELECTRONIC UNIT - A display device includes: a third electrode provided on a side of the second electrode opposite to the light-emitting layer; and an efficiency improving layer improving an efficiency of light extraction from the light-emitting layer, and the efficiency improving layer being provided between the second and third electrodes. The first and third electrodes are each in a laminated structure including a first layer being transmissive, and a second layer being transmissive and having a refractive index higher than a refractive index of the first layer.11-15-2012
20110291126ACTIVE MATRIX SUBSTRATE AND DISPLAY DEVICE - An active matrix substrate (12-01-2011
20110291124Improved Packaging for LED Combinations - In summary, the present invention relates to a device, a system, a method and a computer program enabling a thermally improved packaging of a plurality of light emitting diodes (12-01-2011
20110291123METHOD FOR PRODUCING A PLURALITY OF LED ILLUMINATION DEVICES AND A PLURALITY OF LED CHIPSETS FOR ILLUMINATION DEVICES, AND LED ILLUMINTATION DEVICE - A method for producing a plurality of LED illumination devices which each emit light having an average value of a first photometric parameter including producing a plurality of LED chips which emit light of the same color; measuring values of the first photometric parameter of the LED chips; combining the LED chips to form groups of at least two LED chips which have different values of the first photometric parameter such that differences in the average values of all the LED illumination devices are imperceptible to the human eye; and equipping a respective LED illumination device with a group of LED chips.12-01-2011
20110291122DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device with the substrate divided into three areas. A semiconductor layer is formed in the first second areas and includes a channel area and source/drain areas; a gate insulating layer formed on the semiconductor layer in an area corresponding to the channel area; and a gate electrode formed on the gate insulating layer. The source/drain electrodes contact the source/drain areas, respectively; a pixel electrode is formed in the same layer but in a third area; an interlayer insulating layer is formed on a whole surface of the substrate including the formed structures; and a gate line is formed on the interlayer insulating layer and is electrically connected to a gate electrode of the first area through a via contact hole of the interlayer insulating layer.12-01-2011
20110291120Light Emitting Devices Using Connection Structures And Methods Of Manufacturing The Same - Example embodiments of the present invention relate to a light emitting device having a connection structure and a method of manufacturing the light emitting device. The method of manufacturing may include forming a light emitting region and electrode layers on a substrate in which a plurality of cell regions and a bridge for partially connecting the cell regions are disposed, thereby providing a light emitting device that controls stress with relative ease and integrates electrical connections between the cell regions.12-01-2011
20110291121LIGHT EMITTING ELEMENT PACKAGE - A light emitting element package includes a substrate, at least two light emitting element modules and an encapsulation member. The substrate includes a circuit layer. The circuit layer includes a plurality of solder pads. The at least two light emitting element modules are mounted on the substrate. Each of the at least two light emitting element modules includes a plurality of light emitting elements. Each light emitting element of the at least two light emitting element modules is electrically coupled to neighboring light emitting element in serial through the solder pads. The at least two light emitting element modules are reversely arranged. The encapsulation member is configured to encapsulate the at least two light emitting element modules on the substrate.12-01-2011
20110291119ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display is disclosed. The organic light emitting diode display includes a base substrate including a display area and a non-display area around the display area, a plurality of pixels formed over the display area of the base substrate, the plurality of pixels including a common electrode, a common power line formed over the base substrate and electrically connected to a circuit of each of the plurality of pixels, an encapsulation substrate bonded to the base substrate by a sealing member surrounding the plurality of pixels, the encapsulation substrate including an inner surface facing the base substrate, a first conductive layer formed over the inner surface and electrically connecting the common power line to a first potential, and a second conductive layer formed over the inner surface and spaced apart from the first conductive layer, the second conductive layer electrically connecting the common electrode to a second potential.12-01-2011
20110291118Mother substrate for flat panel display apparatus and method of manufacturing the same - A mother substrate for forming flat panel display apparatuses and a method of manufacturing the same, the mother substrate including a substrate; a plurality of display units on the substrate, the display units being for forming a plurality of flat panel display apparatuses; a sealing substrate facing the display units; sealing members between the substrate and the sealing substrate, the sealing members surrounding each of the display units; a plurality of wiring units between the substrate and the sealing substrate, the wiring units overlapping the sealing members; a connecting unit including a conductive material, the connecting unit connecting adjacent wiring units in one direction and having a width that is greater than a width of each of the wiring units; and inlets connected to the plurality of wiring units and an external power source, the inlets being for applying a voltage to the plurality of wiring units.12-01-2011
20110291117ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREFOR - A manufacturing method of an organic light emitting diode (OLED) display device includes forming a thin film transistor and an organic light emitting diode in a display area of a first substrate, forming a thin film encapsulation layer that has a layering structure of an organic film and an inorganic film on one substrate of the first substrate and a second substrate, forming a sealing member by coating a sealing material that includes an inorganic sealant and an organic compound on an edge of the second substrate, removing the organic compound of the sealing member by baking the sealing member, layering the second substrate on the first substrate so that the sealing member contacts the first substrate, dissolving the sealing member by using a laser beam, solidifying the sealing member, attaching the sealing member to the first substrate, and removing the second substrate from the sealing member.12-01-2011
20110291116ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - An organic light emitting diode (OLED) display is disclosed. In one embodiment, the display includes i) a substrate, ii) a driving circuit formed on the substrate, iii) an organic light emitting diode formed on the substrate and electrically connected to the driving circuit, iv) an encapsulation thin film formed on the driving circuit and organic light emitting diode and v) a spacer formed on the substrate and surrounding the encapsulation thin film.12-01-2011
20110169017Electronic devices comprising electrodes that connect to conductive members within a substrate and processes for forming the electronic devices - An electronic device includes a substrate. The substrate includes a first pixel driving circuit, a first conductive member, and a second conductive member. The first and second conductive members are spaced apart from each other. The first conductive member is connected to the first pixel driving circuit. The second conductive member is part of a power transmission line. The electronic device further includes a well structure overlying the substrate and defining a pixel opening, a via, and a channel. The pixel opening is connected to the via through the channel. In addition, the electronic device includes a first electronic component. The electronic component includes a first electrode that contacts the first conductive member in the pixel opening, a second electrode that contacts the second conductive member in the via, and an organic layer lying between the first and second electrodes.07-14-2011
20100102335ORGANIC EL DISPLAY AND METHOD OF MANUFACTURING THE SAME - The present invention provides an organic EL display and a method of manufacturing the same capable of assuring excellent electric connection between an auxiliary wiring and a second electrode without using large-scale equipment. The organic EL display includes: a plurality of pixels each having, in order from a substrate side, a first electrode, an organic layer including a light emission layer, and a second electrode; an auxiliary wiring disposed in a periphery region of each of the plurality of pixels and conducted to the second electrode; and another auxiliary wiring disposed apart from the auxiliary wiring at least in a part of outer periphery of a formation region of the auxiliary wiring in a substrate surface.04-29-2010
20100078656LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - Disclosed are a light emitting device and a method of fabricating the same. The light emitting device comprises a substrate. A plurality of light emitting cells are disposed on top of the substrate to be spaced apart from one another. Each of the light emitting cells comprises a first upper semiconductor layer, an active layer, and a second lower semiconductor layer. Reflective metal layers are positioned between the substrate and the light emitting cells. The reflective metal layers are prevented from being exposed to the outside.04-01-2010
20120097995LIGHT-EMITTING DIODE ARRAY - A method of fabricating a light emitting diode array, comprising: providing a temporary substrate; forming a first light emitting stack and a second light emitting stack on the temporary substrate; forming a first insulating layer covering partial of the first light emitting stack; forming a wire on the first insulating layer and electrically connecting to the first light emitting stack and the second light emitting stack; forming a second insulating layer fully covering the first light emitting stack, the wire and partial of the second light emitting stack; forming a metal connecting layer on the second insulating layer and electrically connecting to the second light emitting stack; forming a conductive substrate on the metal connecting layer; removing the temporary substrate; and forming a first electrode connecting to the first light emitting stack.04-26-2012
20120097994LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - To provide a light emitting device high in reliability with a pixel portion having high definition with a large screen. According to a light emitting device of the present invention, on an insulator (04-26-2012
20120097993RECTIFYING UNIT, A LIGHT EMITTING DIODE DEVICE, AND THE COMBINATION THEREOF - A light emitting diode device includes a substrate; a first conducting terminal and a second conducting terminal receiving the alternative current signal; a first and a third light-emitting diode groups disposed on the substrate including a plurality of light emitting diodes electrically connecting with the first conducting terminal and the second conducting terminal and emitting light during the positive half power cycle; a second and the third light-emitting diode groups disposed on the substrate including a plurality of light emitting diodes electrically connecting with the first conducting terminal and the second conducting terminal and emitting light during the negative half power cycle; wherein one light emitting diode in the first light-emitting diode group includes more than three conductive connecting points to electrically connect to the second light-emitting diode group and the third light-emitting diode group.04-26-2012
20120097990ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display according to an exemplary embodiment includes a display substrate on which a plurality of organic light emitting diodes are formed; a conducting material layer contacting one of electrodes included in the organic light emitting diode; an encapsulation substrate facing the display substrate; and an anti-reflective light transmission layer that is formed on a surface of the encapsulation substrate and is connected to the conducting material layer.04-26-2012
20120097989Organic Light Emitting Diode Device - An organic light emitting diode device comprises a first electrode, a second electrode facing the first electrode, a first light emitting unit and a second light emitting unit positioned between the first electrode and the second electrode, a charge generation layer positioned between the first light emitting unit and the second light emitting unit, and a charge balance layer positioned adjacent to charge generation layer and including a lithium-containing compound.04-26-2012
20120097986WAFER LEVEL REFLECTOR FOR LED PACKAGING - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.04-26-2012
20120097985Light Emitting Diode (LED) Package And Method Of Fabrication - A light emitting diode (LED) package includes a substrate, a light emitting diode (LED) die mounted to the substrate, a frame on the substrate, a wire bonded to the light emitting diode (LED) die and to the substrate, and a transparent dome configured as a lens encapsulating the light emitting diode (LED) die. A method for fabricating a light emitting diode (LED) package includes the steps of: providing a substrate; forming a frame on the substrate; attaching a light emitting diode (LED) die to the substrate; wire bonding a wire to the light emitting diode (LED) die and to the substrate; and dispensing a transparent encapsulation material on the frame configured to form a transparent dome and lens for encapsulating the light emitting diode (LED) die.04-26-2012
20100032694LIGHT EMITTING DIODE WITH ITO LAYER AND METHOD FOR FABRICATING THE SAME - The present invention relates to a light emitting diode with enhanced luminance and light emitting performance due to increase in efficiency of current diffusion into an ITO layer, and a method of fabricating the light emitting diode. According to the present invention, there is manufactured at least one light emitting cell including an N-type semiconductor layer, an active layer and a P-type semiconductor layer on a substrate. The method of the present invention comprises the steps of (a) forming at least one light emitting cell with an ITO layer formed on a top surface of the P-type semiconductor layer; (b) forming a contact groove for wiring connection in the ITO layer through dry etching; and (c) filling the contact groove with a contact connection portion made of a conductive material for the wiring connection.02-11-2010
20100032693LED REFLECTING PLATE AND LED DEVICE - A recess is formed in a land (02-11-2010
20100032690Light emitting device with an insulating layer - The present invention is related to a light emitting device with an insulating layer, which comprises a transparent substrate, a first light emitting unit, a second light emitting unit, an insulating layer and a conducting layer. The first light emitting unit and the second light emitting unit are set up on the transparent substrate, wherein the second light emitting unit has an appearance of a stair structure. The insulating layer is set between the first and the second light emitting units. The conducting layer is on the insulating layer in order to conduct the first and the second light emitting units. Because of the appearance of the stair structure of the second light emitting unit, improving the cladding efficiency of the insulating layer, further improving the insulating efficiency of the insulating layer and avoiding the insulating layer loosing and the leakage between the first and the second light emitting units.02-11-2010
20110220921Organic light emitting display apparatus - An organic light emitting display apparatus includes a plurality of sub-pixels, each of the sub-pixels having a first electrode, a second electrode facing the first electrode, and an intermediate layer disposed between the first and second electrodes, the intermediate layer having a plurality of layers including an organic emission layer, at least one layer of the plurality of layers in the intermediate layer being commonly shared by two sub-pixels arranged in a first direction and by at least two sub-pixels arranged in a second direction perpendicular to the first direction.09-15-2011
20090224267Process for fabricating a thin film semiconductor device, thin film semiconductor device, and liquid crystal display - A process of fabricating a thin film semiconductor device is proposed, which is suitable for mass production and enables to lower the production cost. A first substrate is subject to anodization to form a porous layer thereon. Then, a thin film semiconductor layer is formed on the porous layer. Using the thin film semiconductor layer, a semiconductor device is formed, and wiring is formed between the semiconductor devices. After that, the semiconductor devices on the first substrate is bonded to a second substrate. The semiconductor devices are separated from the first substrate. Further, the semiconductor devices are electrically insulated by removing a part of the thin film semiconductor layer from the separated surface of the second substrate.09-10-2009
20100155747ORGANIC LIGHT EMISSION DIODE DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - An organic light emission diode (OLED) display device and a method of fabricating the same, wherein the OLED display device includes a substrate including a pixel region and a non-pixel region, a buffer layer disposed on the substrate, a semiconductor layer disposed on the buffer layer, and including a channel region and source/drain regions, a gate electrode disposed to correspond to the channel region of the semiconductor layer, a gate insulating layer insulating the semiconductor layer from the gate electrode, source/drain electrodes electrically connected to the source/drain regions of the semiconductor layer, and an interlayer insulating layer insulating the gate electrode from the source/drain electrodes, wherein areas of the buffer layer, the gate insulating layer and the interlayer insulating layer that are on the non-pixel region, respectively, are removed, and the partially removed area is 8% to 40% of a panel area.06-24-2010
20120025222Light-Emitting Diode Integration Scheme - A circuit structure includes a carrier substrate, which includes a first through-via and a second through-via. Each of the first through-via and the second through-via extends from a first surface of the carrier substrate to a second surface of the carrier substrate opposite the first surface. The circuit structure further includes a light-emitting diode (LED) chip bonded onto the first surface of the carrier substrate. The LED chip includes a first electrode and a second electrode connected to the first through-via and the second through-via, respectively.02-02-2012
20120025221Light Emitting Device - Provided is a light emitting device having a light emitting element such as a light emitting diode. The light emitting device includes a plurality of light sources each including a light emitting element, a first light reflective member which surrounds the plurality of light sources, and a second light reflective member disposed ahead of the first light reflective member in a light radiation direction of the plurality of light sources with reference to the plurality of light sources. The second light reflective member includes a light transmitting material.02-02-2012
20120025218SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD - A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located on at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, the chip mounted on the base board and a transparent plate disposed on the wavelength converting layer including a spacer and a phosphor having a high density. The wavelength converting layer can be formed in a thin uniform thickness between the transparent plate and a top surface of the chip using the spacer so as to extend toward the transparent plate. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the thin wavelength converting layer including the phosphor having a high density, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.02-02-2012
20120025217LED LIGHTING MODULE - The invention relates to a light emitting diode (LED) module that is characterized by a thermally conductive substrate which is used as the base of the module; a plurality of cavities positioned on the module; each cavity is filled with a transparent or diffused encapsulant material and a plurality of LED semiconductors chips are mounted within each cavity.02-02-2012
20120025216PHOSPHOR SUSPENDED IN SILICONE, MOLDED/FORMED AND USED IN A REMOTE PHOSPHOR CONFIGURATION - A light emitting package comprising a support hosting at least one light emitting diode. A light transmissive dome comprised of a silicone including a phosphor material positioned to receive light emitted by the diode. A glass cap overlies said dome02-02-2012
20120025215SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE - A semiconductor package includes a substrate, a number of electrodes formed in the substrate, a heat dissipating member fixed on the substrate, and at least one semiconductor chip mounted on the heat dissipating member and electrically connected to the electrodes. The heat dissipating member defines a receiving through hole and includes a conducting portion formed at the bottom of the receiving through hole. The at least one semiconductor chip is mounted on the conducting portion. The conducting portion efficiently conducts the heat generated by the semiconductor chip to the heat dissipating member and improves the heat dissipating efficiency of the semiconductor package.02-02-2012
20120025213THIN FILM SEMICONDUCTOR SUBSTRATE AND APPARATUS FOR MANUFACTURING THE SAME - A flat panel display is manufactured by mass production and easily stored and transported at low cost. Provided is a thin film semiconductor substrate which faces a plastic substrate 02-02-2012
20100252840HIGH VOLTAGE LOW CURRENT SURFACE EMITTING LED - An LED chip comprising a plurality of sub-LEDs on a submount. Electrically conductive and electrically insulating features are included that serially interconnect the sub-LEDs such that an electrical signal applied to the serially interconnected sub-LEDs along the electrically conductive features spreads to the serially interconnected sub-LEDs. A via is included that is arranged to electrically couple one of the sub-LEDs to the submount. The sub-LED can be interconnected by more than one of the conductive features, with each one of the conductive features capable of spreading an electrical signal between the two of the sub-LEDs.10-07-2010
20090159905Light Emitting Assembly - A light emitting assembly includes: a heat sink having a base wall and at least one mesa protruding from the base wall; and at least one light emitting package unit having at least one light emitting package bonded to the mesa so as to transfer heat generated from the light emitting package to the base wall through the mesa. A circuit board includes a substrate that is formed with at least one through-hole, and is provided with a conductive contact unit that is formed on the substrate. The heat sink is attached to the substrate such that the mesa protrudes from the base wall into and through the through-hole in the substrate so as to be bonded to the light emitting package.06-25-2009
20080272380Shield Member in LED Apparatus - An LED apparatus for illumination toward a preferential side in a downward and outward direction including a shield member in the form of a layer positioned over LED packages and secondary lens members. The shield member has a shield portion and a substantially planar non-shield portion thereabout. In preferred embodiments, the shield portion extends over a part of the lens portion of the secondary lens member. A cover preferably secures the shield member with respect to the secondary lens member, the primary lens and the LED package, the shield member preferably being sandwiched between the cover and the flange of the secondary lens member.11-06-2008
20100264429LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE USING THE SAME - A light emitting device and an electronic device using the same are provided. The light emitting device includes a light emitting chip having a wavelength between 460 nm and 650 nm and phosphor powders, in which the phosphor powders can be stimulated by light emitted from the chip to emit light with a wavelength between 700 nm and 1200 nm. The phosphor powders are selected from the group consisting of Cu-doped CdS, Cu-doped SeS, Cu-doped CdTe and combinations thereof.10-21-2010
20090121237LED ARRAY FOR MICRODISPLAYS OR LIKE APPLICATIONS, AND METHOD OF FABRICATION - An array of LEDs are grown by epitaxy on row-connecting conductor strips extending in parallel spaced relationship to one another on the surface of a semiconductor substrate and are thereby electrically interconnected in rows. The row-connecting conductor strips are formed by ion implantation of a p-type dopant into parts of an n-type silicon substrate. Column-connecting conductor strips extend over the light-emitting surfaces of the LEDs for electrically interconnecting them in columns. The LEDs are lit up individually by voltage application between one of the row-connecting conductor strips and one of the column-connecting conductor strips.05-14-2009
20090146156Led chip package structure with high-efficiency light-emitting effect and method for making the same - An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, a package colloid unit, and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The package colloid unit has a longitudinal package colloid covering the LED chips, and the longitudinal package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof. The frame unit that is a frame layer covering the substrate unit and disposed around a lateral side of the longitudinal package colloid for exposing the light-emitting colloid surface of the longitudinal package colloid.06-11-2009
20100032691LIGHT EMITTING DEVICE, LIGHT EMITTING SYSTEM HAVING THE SAME, AND FABRICATING METHOD OF THE LIGHT EMITTING DEVICE AND THE LIGHT EMITTING SYSTEM - A semiconductor device includes a first light emitting chip, the first light emitting chip having a first semiconductor layer, a second semiconductor layer, and a first active layer disposed therebetween, a second light emitting chip disposed on the first light emitting chip, the second light emitting chip having a third semiconductor layer, a fourth semiconductor layer, and a second active layer disposed therebetween, and a conductive layer disposed between the first semiconductor layer and the fourth semiconductor layer, the first semiconductor layer and the fourth semiconductor layer having different conductivity types.02-11-2010
20110169022BOARD MODULE AND METHOD OF MANUFACTURING SAME - A liquid crystal display device (07-14-2011
20110169021PACKAGE OF LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - Provided is a package of a light emitting diode. The package according to an embodiment includes a base layer, a light emitting diode chip on the base layer, a lead frame electrically connected to the light emitting diode chip, a reflective coating layer directly on the lead frame, and a molding material covering the light emitting diode chip in a predetermined shape.07-14-2011
20090014732CHIP-TYPE LIGHT EMITTING DEVICE AND WIRING SUBSTRATE FOR THE SAME - For providing a chip-type light emitting device, having a plural number of light emitting elements therein, so as to enable to obtain a high optical output with preferable conversion efficiency thereof, and a wiring substrate for that, the chip-type light emitting device, mounting the plural number of the light emitting diodes 01-15-2009
20110260178LIGHTING SYSTEM INCLUDING COLLIMATORS ALIGNED WITH LIGHT EMITTING SEGMENTS - A light source comprising a semiconductor light emitting device is connected to a mount. The light emitting device comprises a plurality of segments with neighboring segments spaced less than 200 microns apart. In some embodiments, multiple segments are grown on a single growth substrate. Each segment comprises a light emitting layer disposed between an n-type region and a p-type region. A spacer is positioned on a top surface of the mount. The light emitting device is positioned in an opening in the spacer. A plurality of collimators is attached to the spacer, wherein each collimator is aligned with a single segment.10-27-2011
20080265263Polarized Semiconductor Light Emitting Device - A light emitting device includes a light emitting diode (LED), a concentrator element, such as a compound parabolic concentrator, and a wavelength converting material, such as a phosphor. The concentrator element receives light from the LED and emits the light from an exit surface, which is smaller than the entrance surface. The wavelength converting material is, e.g., disposed over the exit surface. The radiance of the light emitting diode is preserved or increased despite the isotropic re-emitted light by the wavelength converting material. In one embodiment, the polarized light from a polarized LED is provided to a polarized optical system, such as a microdisplay. In another embodiment, the orthogonally polarized light from two polarized LEDs is combined, e.g., via a polarizing beamsplitter, and is provided to non-polarized optical system, such as a microdisplay. If desired, a concentrator element may be disposed between the beamsplitter and the microdisplay.10-30-2008
20080265262Methods and systems for testing a functional status of a light unit - A method for testing a status of a light unit is provided, wherein the method includes electrically coupling the light unit to a controller and transmitting a negative voltage from the controller to the light unit. The method also includes detecting at least one of current and voltage passing through the light unit and determining a status of the light unit based on at least one of the detected current and detected voltage.10-30-2008
20100123142FLAT PANEL DISPLAY APPARATUS - Provided is a flat panel display apparatus including a sealant which has a small effective width and is able to effectively attach a substrate and an encapsulation substrate. The flat panel display apparatus includes the substrate, a display unit disposed on the substrate, the encapsulation substrate disposed facing the substrate so that the display unit is disposed on inner side of the encapsulation substrate, and the sealant attaching the substrate and the encapsulation substrate, wherein an end surface of the sealant facing the substrate contacts a silicon oxide layer disposed on the substrate.05-20-2010
20120292644LED PACKAGE AND METHOD OF MANUFACTURING THE SAME - The present invention provides a Light Emitting Diode (LED) package, comprising a Printed Circuit Board (PCB), an LED mounted on the PCB, a pillar placed higher than the LED around the LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED, and a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting the light emitted from the LED into white light by changing a wavelength of the light, wherein an electrical pad of the LED and an electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.11-22-2012
20090309106LIGHT-EMITTING DEVICE MODULE WITH A SUBSTRATE AND METHODS OF FORMING IT - A light-emitting device module comprising a substrate, a light-emitting device chip and a heat-dissipating unit. The substrate has a cavity formed in the surface, has an insulator layer and metal layers, with layers of metal on the top and bottom surfaces. The light-emitting device chip is placed inside the cavity and is bonded onto the top metal layer of the substrate. The electrodes of the device chip are wired-bonded to electrodes formed on the top metal layer of the substrate. The cavity is filled with an encapsulating material to encapsulate the device chip. A heat-dissipating unit is bonded onto the bottom metal layer of the substrate.12-17-2009
20090212305SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device can vary color temperatures of its emission light and have a simple and small configuration. The semiconductor light emitting device can include a substrate, electrode wiring formed on the substrate, a plurality of semiconductor light emitting elements mounted on the electrode wiring, and a wavelength conversion layer surrounding the semiconductor light emitting elements. The semiconductor light emitting elements constitute a first semiconductor light emitting element group and a second semiconductor light emitting element group. The wavelength conversion layer has a thinner portion corresponding to the first group and a thicker portion corresponding to the second group and can be differentiated by a step provided on the substrate.08-27-2009
20110147768ORGANIC LIGHT EMITTING DEVICE CONNECTION METHODS - A light panel includes a light source having a generally planar, light emitting surface and a perimeter edge. A backsheet is disposed in substantially parallel relation with the light emitting surface, and an electrical feed-through region extends through the backsheet at a location spaced inwardly from the perimeter. A generally planar, flexible connector cable extends over the backsheet from the perimeter to the electrical feed-through region for establishing electrical connection with the light source. Openings in conductive pads provided in the flexible cable permit a conductive material to be inserted there through and mechanically and electrically interconnect the cable and the light panel.06-23-2011
20100084667Semiconductor Light Source Element for Beam Forming - A semiconductor light source element includes a substrate to which at least one semiconductor light source is mounted. An optical body is mounted to the substrate with its light receiving surface located adjacent the light emitting surface of the at least one semiconductor light source. The optical body has a shape and light output surface profile which are selected to produce a desired beam pattern with the light emitted by the at least one semiconductor light source. When two or more semiconductor light sources are employed in the semiconductor light source element, the light sources can be positioned at different locations about the light receiving surface to emit light from the front edge of the optical body in correspondingly diverse patterns.04-08-2010
20100078658LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a light emitting device and a method of manufacturing the light emitting device. According to the present invention, the light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein a side surface including the N-type or P-type semiconductor layer has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a light emitting device comprising a substrate formed with a plurality of light emitting cells each including an N-type semiconductor layer and a P-type semiconductor layer formed on the N-type semiconductor layer, and a submount substrate flip-chip bonded onto the substrate, wherein the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer of another adjacent light emitting cell are connected to each other, and a side surface including at least the P-type semiconductor layer of the light emitting cell has a slope of 20 to 80° from a horizontal plane. Further, the present invention is provides a method of manufacturing the light emitting device. Accordingly, there is an advantage in that the characteristics of a light emitting device such as luminous efficiency, external quantum efficiency and extraction efficiency are enhanced and the reliability is secured such that light with high luminous intensity and brightness can be emitted.04-01-2010
20110062460ORGANIC EL LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE - An organic EL light emitting element is provided with a conductive transparent electrode 03-17-2011
20110062459AC LIGHT EMITTING DIODE HAVING FULL-WAVE LIGHT EMITTING CELL AND HALF-WAVE LIGHT EMITTING CELL - The present invention discloses an alternating current (AC) light emitting diode (LED) having half-wave light emitting cells and full-wave light emitting cells. The AC LED has a plurality of light emitting cells electrically connected between bonding pads on a single substrate. The AC LED includes a first row of half-wave light emitting cells each having an anode terminal and a cathode terminal, a second row of full-wave light emitting cells each having an anode terminal and a cathode terminal, and a third row of half-wave light emitting cells each having an anode terminal and a cathode terminal. In the AC LED, the second row is arranged between the first row and the third row, and the third row includes a pair of light emitting cells that share a cathode terminal with each other. The cathode terminal shared by the pair of light emitting cells in the third row is electrically connected to the anode terminal of a corresponding light emitting cell of the half-wave light emitting cells in the first row through a conductor that is electrically insulated from the full-wave light emitting cells in the second row.03-17-2011
20110062457SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, IMAGE DISPLAY DEVICE, AND ELECTRONIC APPARATUS - A semiconductor light emitting device including an active layer, a compound semiconductor layer on the active layer, a contact layer on the compound semiconductor layer, and an electrode on the contact layer, where the contact layer is substantially the same size as the electrode.03-17-2011
20110062455OPTOELECTRONIC COMPONENT - Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.03-17-2011
20100006867LIGHT EMITTING DIODE HAVING LIGHT EMITTING CELL WITH DIFFERENT SIZE AND LIGHT EMITTING DEVICE THEREOF - There is provided a light emitting diode operating under AC power comprising a substrate; a buffer layer formed on the substrate; and a plurality of light emitting cells formed on the buffer layer to have different sizes and to be electrically isolated from one another, the plurality of light emitting cells being connected in series through metal wires.01-14-2010
20100006866LIGHT EMITTING DEVICE, DRIVING METHOD FOR THE SAME AND ELECTRONIC APPARATUS - It is a problem to provide a light-emitting device capable of obtaining a constant brightness without being affected by deterioration in an organic light-emitting layer or temperature change, and of making desired color display. The lowering in OLED brightness due to deterioration is reduced by causing the OLED to emit light while keeping constant the current flowing through the OLED instead of causing the OLED to emit light while keeping constant the OLED drive voltage. Namely, OLED brightness is controlled not by voltage but by current thereby preventing against the change in OLED brightness due to deterioration of OLED. Specifically, the drain current Id of a transistor for supplying a current to the OLED is controlled in a signal line drive circuit thereby keeping constant the drain current Id without relying upon the value of a load resistance.01-14-2010
20120091474NOVEL SEMICONDUCTOR AND OPTOELECTRONIC DEVICES - A light-emitting integrated wafer structure, comprising: three overlying layers, wherein each of the three overlying layers emits light at a different wavelength and wherein at least one of the three overlying layers is transferred to the light-emitting integrated wafer structure using one of atomic species implants assisted cleaving, laser lift-off, etch-back, or chemical-mechanical-polishing (CMP).04-19-2012
20110198628MULTI-CHIP LED PACKAGE - A multichip light-emitting-diode (LED) package includes a printed circuit board (PCB) having a tapered via hole and a circuit interconnection line on a surface of the PCB. An inclined surface of each via hole is used as a reflection plate reflecting light emitted by an LED chip located in the via hole. Each LED chip is directly bonded to a metal base for radiating heat. Additional heat radiation structures and reflection plates are not required, thus simplifying the structure of and manufacture of the multichip LED package, reducing manufacturing costs.08-18-2011
20090206350LED chip package structure with different LED spacings and a method for making the same - An LED chip package structure with different LED spacing includes a substrate unit, a light-emitting unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit, and the LEDs are separated from each other by totally different spacing or partially different spacing. For example, the spacings between each two LED chips are from rarefaction to condensation, from condensation to rarefaction, from center rarefaction to outer condensation, from center condensation to outer rarefaction, alternate rarefaction and condensation, or alternate condensation and rarefaction. The package colloid unit covers the LED chips.08-20-2009
20090050908Solid state lighting component - An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.02-26-2009
20090050907Solid state lighting component - An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.02-26-2009
20090283779LIGHT SOURCE WITH NEAR FIELD MIXING - A light emitting diode (LED) component comprising a submount with an array of LED chips and a lens over the array of LED chips. A diffuser is arranged so that at least some light from the LEDs passes through the diffuser to mix the LED light in the near field. The light passing through the diffuser appears as a mixture of LED chip light when directly viewed. A lighting device is also disclosed comprising an LED component comprising an array of LED chips and a near field diffuser to mix at least some of the light from the LED chips in the near field. A remote reflector is included to reflect at least some the light from the LED component so that is emits from the lighting device in the desired direction.11-19-2009
20090256163LEDs using single crystalline phosphor and methods of fabricating same - Methods for fabricating LED chips from a wafer and devices fabricated using the methods with one method comprising depositing LED epitaxial layers on an LED growth wafer to form a plurality of LEDs on the growth wafer. A single crystalline phosphor is bonded over at least some the plurality of LEDs so that at least some light from the covered LEDs passes through the single crystalline phosphor and is converted. The LED chips can then be singulated from the wafer to provide LED chips each having a portion of said single crystalline phosphor to convert LED light.10-15-2009
20100006870LIGHT EMITTING DEVICE - The present invention relates to a light emitting device. According to the present invention, the light emitting device comprises a substrate, a plurality of light emitting cells disposed on the substrate, a first insulation layer disposed on each light emitting cell, an electrically conductive material disposed on the first insulation layer to couple two of the light emitting cells, and a second insulation layer disposed on the electrically conductive material. Each light emitting cell comprises a first semiconductor layer, a second semiconductor layer, and an inclined surface. The second insulation layer corresponds to a contour of each light emitting cell.01-14-2010
20100006865SEMICONDUCTOR MODULE FOR POWER GENERATION OR LIGHT EMISSION - In order to collect a plurality of semiconductor elements easily from a semiconductor module where a plurality of rod-like semiconductor elements for power generation or light emission are built in and to reuse or repair them, two split modules 01-14-2010
20110169023METHODS FOR MAKING QUASI-VERTICAL LIGHT EMITTING DIODES - A method of making quasi-vertical light emitting devices includes growing semiconductor layers on a growth substrate and etching the semiconductor layers to produce device isolation trenches forming separable semiconductor devices and holes. Blind holes are drilled in the substrate at the location of each of the holes in the semiconductor layers. The drilling of the blind holes defines blind hole walls and a blind hole end in each of the blind holes. N-semiconductor metal is deposited in each of the blind holes. An n-electrode contact is formed in each of the blind holes by plating each of the blind holes with an n-electrode metal connected to the n-semiconductor metal. The substrate is thinned to expose the n-electrode metal as an n-electrode. Bonding metal is deposited to the n-electrode for packaging.07-14-2011
20110169019Display cell, display apparatus and method for making same - In an electrophoretic display device comprising a plurality of pixels, each pixel having a cell area containing a plurality of charged pigment particles dispersed between two opposite electrodes, a semiconducting passivation layer is provided on one or both of the two opposite electrodes. The semiconducting passivation layer can be made of MO07-14-2011
20080210956Light Emitting Diode Employing an Array of Nanorods and Method of Fabricating the Same - Disclosed are a light emitting diode employing an array of nanorods and a method of fabricating the same. The light emitting diode comprises an array of semiconductor nanorods positioned on a substrate. An upper electrode layer is deposited on the array of the nanorods such that an empty space remains between adjacent ones of the nanorods. Since the space between adjacent ones of the nanorods is not filled with an insulating material, the light extraction efficiency of a light emitting diode can be improved and a method of fabricating the light emitting diode can be simplified.09-04-2008
20080210953Luminaire with a Plurality of Light-Emitting Diodes in Decentralized Arrangement - A luminaire with a plurality of light-emitting diodes in a decentralized arrangement. To improve the light emission pattern issued by the luminaire, the emission region defined by the light guide emission ends is smaller than the arrangement region defined by the totality of the light-emitting diodes.09-04-2008
20080210955Group III-V semiconductor device and method for producing the same - An object of the invention is to prevent short circuit at a side surface of a semiconductor device in the method for producing semiconductor devices including a laser lift-off step. The production method of the invention includes forming, on a sapphire substrate, a group III nitride semiconductor layer containing a plurality of semiconductor devices isolated from one another by a groove which reaches the substrate; forming a protective film for preventing short circuit on the top surface and side surfaces of the semiconductor layer and on the top surface of the sapphire substrate; forming a resin layer in the groove; bonding the semiconductor layer to a support substrate via a low-melting-point metal layer; and removing the sapphire substrate through the laser lift-off process. The resin layer functions as a support for the protective film, to thereby prevent cracking or chipping of the protective film. As a result, current leakage or short circuit, which would otherwise be caused by cracking or chipping of the protective film, can be prevented.09-04-2008
20090114929WHITE LIGHT EMITTING DEVICE - There is provided a white light emitting device that prevents a red phosphor from resorbing wavelength-converted light to improve white luminous efficiency. A white light emitting device according to an aspect of the invention includes a package body; at least two LED chips mounted to the package body and emitting excitation light; and a molding unit including phosphors, absorbing the excitation light and emitting wavelength-converted light, in regions of the molding unit divided according to the LED chips and molding the LED chips. According to the aspect of the invention, since the phosphor for converted red light can be prevented from resorbing light generated from other regions of the molding unit, the white light emitting device that can improve white luminous efficiency or control color rendering and color temperature by adjusting a mixing ratio of converted light for white light emission.05-07-2009
20090114930LIGHT-EMITTING DIODE AND LIGHT-EMITTING DIODE ARRAY LIGHT SOURCE - A light-emitting diode (LED) includes a substrate, a metallic buffer layer, a first type doped semiconductor layer, a light-emitting layer, a second type doped semiconductor layer, a first electrode, and a second electrode. The substrate has a plurality of bowl-shaped concaves or convexes on a surface thereof. The metallic buffer layer is disposed on the substrate and covers the bowl-shaped structure. The first type doped semiconductor layer is disposed on the metallic buffer layer. The light-emitting layer is disposed on a part of the first type doped semiconductor layer. The second type doped semiconductor layer is disposed on the light-emitting layer. The first electrode is disposed on the first type doped semiconductor layer not covered by the light-emitting layer. The second electrode is disposed on the second type doped semiconductor layer.05-07-2009
20090108271LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a mount, a plurality of LED chips, and a first and a second sealants made of different materials. The mount has an accommodation space and at least one partition member to divide the accommodation space into a plurality of separate cavities. The LED chips are placed in the cavities, and emitting beams of the LED chips exiting through the cavities include a first emission with a first wavelength band and a second emission with a second wavelength band, and the second wavelength band is different to the first one. The first and the second sealants are respectively used for sealing at least one of the LED chips placed in at least one of the cavities through which the first or the second emission exits. The first and the second sealants are separate from each other by the partition member.04-30-2009
20110169018Liquid Crystal Display Device - An exemplary liquid crystal display device includes a data line, a pixel, a first gate line, a second gate line, an additional electrode and an additional gate line. The pixel includes a first sub-pixel and a second sub-pixel. The first gate line is electrically coupled to the first sub-pixel. The second gate line is electrically coupled to the second sub-pixel. The first sub-pixel is electrically coupled to the data line to receive a signal provided from the data line. The second sub-pixel is electrically coupled to the first sub-pixel through the additional electrode and to receive a signal provided from the data line through the first sub-pixel. The additional gate line is arranged crossing over the additional electrode and whereby a compensation capacitance is formed between the additional gate line and the additional electrode.07-14-2011
20100123143THREE-DIMENSIONAL LED LIGHT-EMITTING PLATE - In the field of opto-electronic technology, a three-dimensional (3D) light-emitting diode (LED) light-emitting plate is described. The 3D LED light-emitting plate includes an aluminum substrate. The aluminum substrate is vertically disposed. Notches are formed on an upper side of the aluminum substrate in a thickness direction. LED chips are mounted in the notches. A flexible circuit layer is disposed on a surface of the aluminum substrate. Each LED chip is connected to a circuit of the flexible circuit layer by a gold wire. A fluorescent colloid light-emitting shell is disposed outside each LED chip correspondingly. A cavity is formed between the LED chip and the fluorescent colloid light-emitting shell. A lower portion of the fluorescent colloid light-emitting shell is fixed on the aluminum substrate. The 3D LED light-emitting plate effectively improves the luminous brightness and efficiency of an LED and enlarges an effective light-emitting angle, and alleviates the problem of non-uniform light pattern and light color, such that an LED white light lamp can achieve the luminous effect of a tungsten lamp. The fluorescent colloid light-emitting shell wraps the LED chip, which not only protects the LED chip from dust and produces white light, but is also suitable for use in a severe environment. Moreover, the production cost is reduced due to the simple structure.05-20-2010
20090272986LED module, and LED chain containing the same - The present invention discloses an LED module comprising: a waterproof enclosure; an LED accommodated in the waterproof enclosure; a wire for coupling the LED module with other LED modules and a driver; and a radiating unit set in the bottom of the waterproof enclosure and exposed to the external environment. The invention further provides an LED chain comprising the above said LED module and a driver coupled with the LED module. The LED chain according to the invention may have a high waterproof level, for example, IP65. The heat generated during the operation of the high power LED module may be transmitted to the external environment in time via a heat sink set on the LED module, thereby effective thermal management for the LED module and a long service life of the LED module may be obtained. Moreover, the finish surface of the driver may be made handsome by encapsulating the driver through the low pressure molding.11-05-2009
20090272987Structure Of LED Of High Heat-Conducting Efficiency - A structure of LED of high heat-conducting efficiency is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein. Meanwhile, a fluorescent glue is attached to the light-emitting chip set, the gold wires and the metallic circuits. Eventually, an epoxy resin is filled into the interior of the ringed object to be dry for forming an epoxy resin layer. Thus, a packaging manufacture of LED is completed.11-05-2009
20090278139LIGHT-EMITTING DIODE PACKAGE ASSEMBLY - An electrical device containing multiple light emitting diode (LED) dies each having respective first and second connectors suitable to receive current through the LED die. A common base layer of a first electrically conductive material has cavities into which at least one LED die is mounted with its second connector electrically connected by a conductive bonding material to the first conductive material of the base layer. One or more over-layer sections of a second electrically conductive material each are electrically connected by a bond to at least one of the first connector of a LED die. And an insulator electrically separates the first conductive material of the base layer from the second conductive material of over-layer sections.11-12-2009
20090278140MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A manufacturing method of a semiconductor device comprises the steps of: providing a substrate; forming a plurality of grooves on the substrate by photolithograph etching or laser engraving, wherein the plurality of grooves divides a surface of the substrate into a plurality of mesas and the substrate is a patterned substrate; and growing a semiconductor device (e.g. photo-electronic device or LED) on the patterned substrate. The semiconductor device comprises at least one layer, wherein the layer directly disposed on the patterned substrate is the first layer. The first layer comprises a plurality of separated regions divided by the grooves.11-12-2009
20110198625NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE ARRAY - A nitride semiconductor light emitting device array, which includes a dielectric layer formed on a first conductivity lower nitride semiconductor layer, having a plurality of windows. Each of a plurality of hexagonal pyramid light emission structures is grown from a surface of the first conductivity lower nitride semiconductor layer exposed through each of the windows and onto a peripheral area of the window of the dielectric layer. Each of the hexagonal pyramid light emission structures includes a first conductivity upper nitride semiconductor layer, an active layer and a second conductivity nitride semiconductor layer formed in their order. The windows are disposed in such a triangular arrangement that side surfaces of the adjacent hexagonal pyramid light emission structures face each other. Also, a distance between bases of the adjacent hexagonal pyramid light emission structures is less than 0.3 times an interval between centers of the windows of the adjacent hexagonal pyramid light emission structures.08-18-2011
20110198624DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device includes an array of light emitting cells. Each light emitting cell includes first and second electrodes, and an organic light emitting layer located between the first and second electrodes. Banks are above the first electrode that partition the organic light emitting layer to define each of the light emitting cells. First and second light emitting cells are adjacent to one another and located in a peripheral region of the array. The first light emitting cell is closer to a center of the array than the second light emitting cell. A first bank borders the first light emitting cell and the second light emitting cell. An inclination angle of an innermost sidewall of the first bank that is adjacent the first light emitting cell is greater than an inclination angle of an outermost sidewall of the first bank that is adjacent the second light emitting cell.08-18-2011
20110198623DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device includes an array of light emitting cells. Banks define each of the light emitting cells. The light emitting cells include a first light emitting cell that is located in a central region of the array and a second light emitting cell that is located in a peripheral region of the array. First and third banks border the first light emitting cell with the first bank being closer to a periphery of the array than the second bank. Second and fourth banks border the second light emitting cell with the third bank being closer to the periphery of the array than the fourth bank. An inclination angle of an innermost sidewall of the third bank that is adjacent the second light emitting cell is different than an inclination angle of an innermost sidewall of the first bank that is adjacent the first light emitting cell.08-18-2011
20110198619LIGHT EMITTING DIODE ASSEMBLY HAVING IMPROVED LIGHTING EFFICIENCY - A light emitting diode assembly is disclosed in the present invention. The light emitting diode assembly has a substrate and several light emitting diode units. It can also include several light emitting diode units fabricated on cavities formed in the substrate. Any light emitting diode unit is composed of a light emitting diode chip covered with a phosphor layer for providing light beams, and a reflecting unit installed or formed on the substrate, coated with a reflective film, surrounding the light emitting diode chip for reflecting the light beams emitted from the light emitting diode chip, and directing the light beams upward. The light emitting diode unit further includes a light condenser provided above the light emitting diode chip for guiding the light beams upward. The assembly can collect all light beams emitted laterally. Hence, lighting efficiency for the light emitting diode assembly can be improved.08-18-2011
20090283778Electroluminescent display useful for displaying a predetermined pattern - An electroluminescent display comprising semiconductor nanocrystals, wherein the semiconductor nanocrystals are selected to emit light at a predetermined wavelength and are disposed in a predetermined pattern. In certain embodiments, semiconductor nanocrystals that emit light at different predetermined wavelengths are disposed in the display to create a predetermined multi-color pattern.11-19-2009
20130099261LIGHT EMITTING MODULE - In a light emitting module, a semiconductor light emitting element is mounted on a mounting board. A plated layer is provided on the surface of the mounting board so as to be electrically connected to the semiconductor light emitting element mounted on the mounting board. The plated layer has a power feeding portion and an element connection portion. The power feeding portion extends, of the surfaces of the mounting board, from the upper surface on which the semiconductor light emitting element is to be mounted to a stepped surface located below the upper surface, so that power can be fed, on the stepped surface, to the semiconductor light emitting element. The element connection portions are provided on the upper surface such that a plurality of the semiconductor light emitting elements mounted on the upper surface are connected together in series.04-25-2013
20130099262LIQUID CRYSTAL DISPLAY - A liquid crystal display according to an exemplary embodiment of the present invention includes a substrate, a plurality of pixels arranged in a matrix on the substrate where each pixel includes a switching element, a plurality of gate lines that are connected to the switching elements and extend in a row direction, and a gate driver that is connected to the gate lines and is formed on the substrate as an integrated circuit. In the liquid crystal display, the gate driver includes a first region and a second region that is not aligned with the first region.04-25-2013
20110169020SIDE MOUNTABLE SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGES, PANELS AND METHODS OF FORMING THE SAME - Side-mountable semiconductor light emitting device packages include an electrically insulating substrate having a front face and a back face and a side face extending therebetween. The side face is configured for mounting on an underlying surface. An electrically conductive contact is provided proximate an edge of the substrate on the back face of the substrate and/or on a recessed region on the side face of the substrate. The contact is positioned to be positioned proximate an electrical connection region of the underlying surface when the semiconductor light emitting device package is side mounted on the underlying surface. A conductive trace extends along the front face of the substrate and is electrically connected to the contact. A semiconductor light emitting device is mounted on the front face of the substrate and electrically connected to the conductive trace.07-14-2011
20090294780LIGHT EMITTING DEVICE - A light emitting device comprises: a plurality of light emitting diodes and an insulating (low temperature co-fired ceramic) substrate with an array of recesses each for housing a respective one of the light emitting diodes. The substrate incorporates a pattern of electrical conductors that is configured for connecting the light emitting diodes in a selected electrical configuration and to provide at least two electrical connections on the floor of each recess. Light emitting diodes can be electrically connected to the electrical connections by at least one bond wire or by flip chip bonding. Each recess is filled with a transparent material to encapsulate each light emitting diode. The transparent material can incorporate at least one phosphor material such that the device emits light of a selected color and/or color temperature.12-03-2009
20100283065LED DEVICE WITH A LIGHT EXTRACTING ROUGH STRUCTURE AND MANUFACTURING METHODS THEREOF - The invention relates to a light emitting diode device having a light extracting rough structure. The device includes a leadframe, one or more light emitting diode chips provided on and electrically connected to the leadframe, and a lens configured to encapsulate the one or more light emitting diode chips, the lens having a surface including a micro-roughness structure. The micro-roughness structure of the lens has a roughness between 0.1 μm and 50 μm. The invention also relates to a method of manufacturing a light emitting diode device having a light extracting rough structure.11-11-2010
20090140271LIGHT EMITTING UNIT - A light emitting unit has a chamber. The light emitting unit includes at least one substrate, a plurality of light emitting diode (LED) dies and a gel or a fluid. The LED dies are disposed on the substrate and in the chamber. At least two LED dies are electrically connected to each other in series or in parallel. The gel or the fluid is filled in the chamber.06-04-2009
20110204386METAL BASED ELECTRONIC COMPONENT PACKAGE AND THE METHOD OF MANUFACTURING THE SAME - A package for an electronic component and method of forming a package for an electronic component are disclosed. The package may include a metal base and a termination chip coupled to the metal base. The termination chip may include a die contact pad electrically coupled to a mounting pad and an isolating feature configured to provide electrical isolation between the metal base and the die contact pad. The contact may be configured for electrical connection to the electronic component. The metal base may be folded to form a molding cavity. The metal base may include at least one plating layer. The package may include a light emitting diode (LED) coupled to the metal base. The LED may be coupled to the metal base via a eutectic bond.08-25-2011
20110204390Solid State Light Sheet Having Wide Support Substrate and Narrow Strips Enclosing LED Dies In Series - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.08-25-2011
20090008654Semiconductor Light Emitting Device, Illumination Module, Illumination Apparatus, Method For Manufacturing Semiconductor Light Emitting Device, and Method For Manufacturing Semiconductor Light Emitting Element - A semiconductor light emitting device (01-08-2009
20090261359SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF10-22-2009
20090261356Sub-Mount, light emitting diode package and manufacturing method thereof - A sub-mount, a light emitting diode package, and a method of manufacturing thereof are disclosed. A sub-mount, on which multiple light emitting diodes are mounted, can include a multiple number of metal bodies on which the light emitting diodes are respectively mounted, and an oxide wall interposed between the metal bodies such that the adjacent metal bodies are supported by each other but electrically disconnected from each other. By utilizing certain embodiments of the invention, a high heat releasing effect may be obtained, and manufacturing costs may be reduced.10-22-2009
20110204388ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - An OLED display and a manufacturing method thereof are disclosed. The OLED display includes: a first substrate, an organic light emitting diode formed over the first substrate, the organic light emitting diode including a reflective surface configured to reflect light incident to the organic light emitting diode, a phase delay capping layer formed over the organic light emitting diode, configured to input linearly polarized light and output circularly polarized light, a second substrate disposed over the phase delay capping layer, and a polarizing plate formed over the second substrate, configured to pass through only linearly polarized light.08-25-2011
20100276705SOLID STATE LIGHTING DEVICE WITH AN INTEGRATED FAN - A solid state lighting device includes a light source having one or more solid state light emitting cells. The solid state lighting device also includes a fan to cool the light emitting cells.11-04-2010
20110006314SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A plurality of rectangle semiconductor substrates are attached to a single mother glass substrate. A pixel structure is determined so that even if a gap or a an overlapping portion is generated in a boundary between a plurality of semiconductor substrates, a single-crystal semiconductor layer does not overlap with the gap or the overlapping portion. Two TFTs are located in a first unit cell including the first light emitting element, four TFTs are located in a second unit cell including the second light emitting element, and no TFT is located in a third unit cell including the third light emitting element. A boundary line is between the third unit cell and a fourth unit cell.01-13-2011
20100102334LIGHTING DEVICE - The present invention relates to lighting device (04-29-2010
20100283066LIGHT EMITTING DEVICE AND DISPLAY DEVICE USING THE SAME - A light emitting device (11-11-2010
20100283067SEMICONDUCTOR ELEMENT AND DISPLAY DEVICE USING THE SAME - Provided is a semiconductor element including: a semiconductor having an active layer; a gate insulating film which is in contact with the semiconductor; a gate electrode opposite to the active layer through the gate insulating film; a first nitride insulating film formed over the active layer; a photosensitive organic resin film formed on the first nitride insulating film; a second nitride insulating film formed on the photosensitive organic resin film; and a wiring provided on the second nitride insulating film, in which a first opening portion is provided in the photosensitive organic resin film, an inner wall surface of the first opening portion is covered with the second nitride insulating film, a second opening portion is provided in a laminate including the gate insulating film, the first nitride insulating film, and the second nitride insulating film inside the first opening portion, and the semiconductor is connected with the wiring through the first opening portion and the second opening portion.11-11-2010
20110204391Solid State Light Sheet or Strip Having Cavities Formed in Top Substrate - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.08-25-2011
20080251796Light Emitting Device and Method of Manufacturing the Same - The present invention relates to a light emitting device and a method of manufacturing the light emitting device. According to the present invention, the light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein a side surface including the N-type or P-type semiconductor layer has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a light emitting device comprising a substrate formed with a plurality of light emitting cells each including an N-type semiconductor layer and a P-type semiconductor layer formed on the N-type semiconductor layer, and a submount substrate flip-chip bonded onto the substrate, wherein the N-type semiconductor layer of one light emitting cell and the P-type semi-conductor layer of another adjacent light emitting cell are connected to each other, and a side surface including at least the P-type semiconductor layer of the light emitting cell has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a method of manufacturing the light emitting device. Accordingly, there is an advantage in that the characteristics of a light emitting device such as luminous efficiency, external quantum efficiency and extraction efficiency are enhanced and the reliability is secured such that light with high luminous intensity and brightness can be emitted.10-16-2008
20100096642PACKAGING STRUTURE FOR HIGH POWER LIGHT EMITTING DIODE(LED) CHIP - The present invention relates to a packaging structure for high-power light emitting diode (LED) chip, comprising a metal plate, insulators and a cover plate. The metal plate comprises a containing slot and isolating slots formed on the surface by working, and the insulators can be embedded in the isolating slot. After forming a hollow slot and notches on the surface of the cover plate by working, the cover plate is combined with the metal plate and insulators and at the same time, the hollow slot and the notches are corresponding to the containing slot and the isolating slots on the metal plate to form a hollowness state, followed by application of surface treatment to form soldering portions and an anti-soldering layer at the bottom of the metal plate. Then the metal plate is cut on both sides along free ends of the insulators so as to generate electrode contacts with positive and negative electrodes, and the surface mount technology (SMT) can be adopted for assembly of the packaging structure of high-power LED chip so as to simplify manufacturing processes, facilitate mass production and achieve separation of electricity from heat, etc.04-22-2010
20110198622ORGANIC OPTO-ELECTRIC DEVICE AND A METHOD FOR MANUFACTURING AN ORGANIC OPTO-ELECTRIC DEVICE - An organic opto-electric device has a layer stack with a base electrode, an organic layer assembly, a cover electrode and a contact layer. The organic layer assembly is arranged between the base electrode and the cover electrode and the cover electrode is arranged between the organic layer assembly and the contact layer. The cover electrode and the base electrode are structured to form several laterally adjacent optically active areas and the base electrode, the organic layer assembly, the cover electrode and the contact layer are interconnected by vias such that at least two optically active areas are connected in series so that a current flow through the at least two optically active areas passes in a direction between the base electrode and a cover electrode. The current flow between the at least two optically active areas passes through the contact layer, wherein the contact layer contacts the base electrode above one of the vias laterally in the interior of the two optically active areas.08-18-2011
20110198621LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, METHOD OF MANUFACTURING LIGHT EMITTING DEVICE AND LIGHTING SYSTEM - A light emitting device according to the embodiment includes a conductive support member; a light emitting structure on the conductive support member including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second semiconductor layers; and a protective device on the light emitting structure.08-18-2011
20110198627Organic Optoelectronic Device And A Method For Encapsulating Said Device - The invention relates to an organic optoelectronic device, such as a display, lighting or signalling device, that is protected from the ambient air by a sealed encapsulation in the form of a thin film, and to a method for encapsulating such a device. An optoelectronic device (08-18-2011
20080237613Ac Light Emitting Device Having Photonic Crystal Structure and Method of Fabricating the Same - Disclosed is an AC light emitting device having photonic crystal structures and a method of fabricating the same. The light emitting device includes a plurality of light emitting cells and metallic wirings electrically connecting the light emitting cells with one another. Further, each of the light emitting cells includes a first conductive type semiconductor layer, a second conductive type semiconductor layer disposed on one region of the first conductive type semiconductor layer, and an active layer interposed between the first and second conductive type semiconductor layers. In addition, a photonic crystal structure is formed in the second conductive type semiconductor layer. The photonic crystal structure prevents light emitted from the active layer from laterally propagating by means of a periodic array, such that light extraction efficiency of the light emitting device can be improved. Furthermore, the metallic wirings electrically connect a plurality of light emitting cells with one another such that an AC light emitting device can be provided.10-02-2008
20100133557METAL-BASED PHOTONIC DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF - A metal-based photonic device package module that is capable of greatly improving heat releasing efficiency and implementing a thin package is provided. The metal-based photonic device package module includes a metal substrate that is formed the shape of a plate, a metal oxide layer that is formed on the metal substrate to have a mounting cavity, a photonic device that is mounted in the mounting cavity of the metal oxide layer, and a reflecting plane that is formed at an inner surface of the mounting cavity of the metal oxide layer.06-03-2010
20120032203LED UNIT - The LED unit 02-09-2012
20120032201LIGHT-EMITTING DISPLAY APPARATUS - To provide a light-emitting display apparatus having a curved display face which can be manufactured with ease and high yield. The light-emitting display apparatus includes a curved and light-transmitting substrate 02-09-2012
20130214300Solid State Light Sheet Having Wide Support Substrate and Narrow Strips Enclosing LED Dies in Series - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.08-22-2013
20080283848Semiconductor device and method for manufacturing the same - A plurality of rectangle semiconductor substrates are attached to a single mother glass substrate. A pixel structure is determined so that even if a gap or a an overlapping portion is generated in a boundary between a plurality of semiconductor substrates, a single-crystal semiconductor layer does not overlap with the gap or the overlapping portion. Two TFTs are located in a first unit cell including the first light emitting element, four TFTs are located in a second unit cell including the second light emitting element, and no TFT is located in a third unit cell including the third light emitting element. A boundary line is between the third unit cell and a fourth unit cell.11-20-2008
20080290350LED lamp with exposed heat-conductive fins - In one embodiment, a LED lamp includes a heat sink including rows of exposed fins on one surface and a conductive member opposite the fins and including two electrically connected side positive electrodes, one or more negative electrode spaced from and between the positive electrodes, and one or more conductive positioning strips each between the negative electrode and either positive electrode; a light array mounted on the conductive member and including rows of LEDs divided into electrically parallel connected groups with the LEDs of each group being electrically series connected together, each LED including positive and negative pins secured to one conductive positioning strip and electrically connected to either positive electrode and the negative electrode respectively, a positive conductor electrically connected to either positive electrode; and a negative conductor electrically connected to the negative electrode.11-27-2008
20080303037METHODS OF MAKING THIN FILM TRANSISTORS COMPRISING ZINC-OXIDE-BASED SEMICONDUCTOR MATERIALS AND TRANSISTORS MADE THEREBY - A method of making a thin film transistor comprising a thin film semiconductor element comprised of a transparent zinc-oxide-based semiconductor material, wherein spaced apart first and second contacts in contact with said material are positioned on either side of a channel in the thin film semiconductor element such that the elongated sides of the channel are aligned with an underlying gate structure. The method can be accomplished while maintaining the substrate temperature at no more than 300° C. during fabrication.12-11-2008
20110204392LED ARRAY GRID, METHOD AND DEVICE FOR MANUFACTURING SAID GRID AND LED COMPONENT FOR USE IN THE SAME - Disclosed herein is a method for producing an LED array grid including the steps of (i) arranging N electrically conducting parallel wires, where N is an integer >1, thus creating an array of wires having a width D perpendicular to a direction of the wires, (ii) arranging LED components to the array of wires such that each LED component is electrically coupled to at least two adjacent wires, (iii) stretching the array of wires such that the width D increases, and arranging the stretched LED array grid onto a plate or between two plates08-25-2011
20080237612DEVICE HAVING SPACERS - An electroluminescent device comprising: a substrate; one or more light-emitting elements formed over the substrate, the one or more light-emitting elements including first and second spaced-apart electrodes wherein at least one of the first and second electrodes is transparent and a light-emitting layer comprising quantum dots formed between the first and second electrodes; a cover located over the one or more light-emitting elements and spaced apart from the one or more light-emitting elements to form a gap between the cover and the one or more light-emitting elements; and separately formed spacer elements located in the gap between the cover and the one or more light-emitting elements and wherein the spacer elements are in physical contact with the one or more light-emitting elements, the cover, or both the one or more light-emitting elements and the cover.10-02-2008
20080210954Alternating Current Light Emitting Device - The present invention relates to a light emitting device in which light emitting cells of a first light emitting cell block are connected in parallel to light emitting cells of a second light emitting cell block corresponding thereto. A light emitting device of the present invention comprises a substrate, and first and second light emitting cell blocks formed on the substrate and having a plurality of light emitting cells electrically connected in series to one another, respectively. Each of the light emitting cells has an N-electrode and a P-electrode. A P-electrode at one end of the first light emitting cell block is connected to an N-electrode at one end of the second light emitting cell block, and an N-electrode at the other end of the first light emitting cell block is connected to a P-electrode at the other end of the second light emitting cell block. The P-electrode of each of the light emitting cells of the first light emitting cell block and the P-electrode of each of the light emitting cells of the second light emitting cell block corresponding thereto, or the N-electrode of each of the light emitting cells of the first light emitting cell block and the N-electrode of each of the light emitting cells of the second light emitting cell block corresponding thereto are electrically connected to each other. In the light emitting device of the present invention, the light emitting cells of the first light emitting cell block and the light emitting cells of the second light emitting cell block corresponding thereto are respectively connected in parallel so that a current can cross the light emitting cells of the first and second light emitting cell blocks. Thus, even though a leakage current occurs in some of light emitting cells, the current is allowed to cross light emitting cells connected in another direction, thereby preventing overload on some of the light emitting cells due to the leakage current and ensuring uniform light emission and prolonged life span in the AC light emitting device.09-04-2008
20080290351SEMICONDUCTOR LIGHT EMITTING APPARATUS - A light emitting apparatus with a combination of a plurality of LED chips and a phosphor layer is provided and can be configured to significantly reduce variations in chromaticity and luminance. The plurality of semiconductor light emitting devices (LED chips) are disposed with a gap therebetween, and the phosphor layer is formed on the upper surface thereof to bridge over the gaps between the LED chips. The phosphor layer may be uniform in thickness, but can be less in thickness over the gaps between the LED chips than on the upper surface of the LED chips. The phosphor layer can be continuously formed on the upper surface of the array of the chips with no phosphor layer present in between the chips. This configuration allows for reducing variations in luminance and chromaticity which may result from the gaps or the phosphor layer present in between the gaps.11-27-2008
20120292645ORGANIC ELECTROLUMINESCENCE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic electroluminescence display including: a gate line disposed on a substrate; a data line crossing the gate line; a TFT connected to the gate and data lines; a capacitor connected to the TFT; and an OLED connected to the TFT. A gate electrode of the TFT and a lower electrode of the capacitor are patterned from a first layer. A gate insulating layer disposed on the gate electrode and an insulating island disposed on the gate line are patterned from a second layer. A semiconductor island disposed on the insulating island and an active layer disposed on the gate insulating layer are patterned from a third layer. An insulating layer is disposed on the TFTs, the capacitor, and between the semiconductor island and the data line. An upper electrode of the capacitor, source/drain electrodes of the TFT, and the data line are patterned from a fourth layer.11-22-2012
20080277674Semiconductor Light Emitting Device, Lighting Module, Lighting Apparatus, and Manufacturing Method of Semiconductor Light Emitting Device - An LED bare chip which is one type of a semiconductor light emitting device (11-13-2008
20110266562GLASS SUBSTRATE WITH AN ELECTRODE, ESPECIALLY A SUBSTRATE INTENDED FOR AN ORGANIC LIGHT-EMITTING DIODE DEVICE - A glass substrate includes a first side and a second opposite side, and provided, on its second side, with an electrode which is formed by at least one electrically conductive film, the substrate having, over all of its second side, and through a thickness e extending toward the interior of the substrate in the direction of the first side, a refractive index variation, of the glass, obtained by an ion-exchange treatment, the refractive index at the surface being greater than that of the glass located beyond the thickness e.11-03-2011
20130119411LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode package structure includes a substrate, LED bare chips and a lens. The substrate has an upper surface, a lower surface and a side surface between the upper surface and the lower surface. The upper surface is provided with a circuit pattern. The side surface is provided with a groove. The LED bare chips are fixed on the upper surface and electrically connected with the circuit pattern. The lens covers the LED bare chips, the upper surface and the circuit pattern by an injection molding process so as to be inserted into the groove. With this arrangement, the connecting strength between the substrate and the lens can be enhanced, thereby achieving waterproof and anti-electrostatic effects. Further, material cost of the present invention is reduced greatly.05-16-2013
20130119412PIXEL CIRCUIT, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS - An electro-optical device formed on a semiconductor substrate, includes: a first transistor controlling a current level according to a voltage between a gate and a source; a second transistor electrically connected between a data line and the gate of the first transistor; a third transistor electrically connected between the gate and a drain of the first transistor; and a light-emitting element emitting light at a luminance according to the current level, in which one of a source and a drain of the second transistor and one of a source and a drain of the third transistor are formed by a common diffusion layer.05-16-2013
20110006315AC LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME - The present invention relates to an AC light emitting diode. An object of the present invention is to provide an AC light emitting diode wherein various designs for enhancement of the intensity of light, prevention of flickering of light or the like become possible, while coming out of a unified method of always using only one metal wire with respect to one electrode when electrodes of adjacent light emitting cells are connected through metal wires. To this end, the present invention provides an AC light emitting diode comprising a substrate; bonding pads positioned on the substrate; a plurality of light emitting cells arranged in a matrix form on the substrate; and a wiring means electrically connecting the bonding pads and the plurality of light emitting cells, wherein the wiring means includes a plurality of metal wires connecting an electrode of one of the light emitting cells with electrodes of other electrodes adjacent to the one of the light emitting cells.01-13-2011
20090152570LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same - An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof.06-18-2009
20110204393LED LAMP - An LED lamp (A08-25-2011
20110204389ILLUMINATING DEVICE - An illuminating device comprises one or more luminescent devices (08-25-2011
20100200871Self-Light-Emitting Device and Method of Manufacturing the Same - Failure light emission of an EL element due to failure film formation of an organic EL material in an electrode hole 08-12-2010
20100200870LIGHT-EMITTING DIODE DIE PACKAGE AND METHOD FOR PRODUCING SAME - The present invention relates to a light-emitting diode die package having an LED die and an accommodating housing. The LED die has a first doped layer doped with a p- or n-type dopant and a second doped layer doped with a different dopant from that doped in the first doped layer. Each of the first and second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is formed. The insulation layer is formed with exposure holes for exposing the electrodes corresponding thereto. Each of the exposure holes is formed inside with an electrically conductive linker. The accommodating housing has an open end through which an accommodating space is accessible. The LED die is positioned within the accommodating space in such a manner that the electrically conductive linker protrudes outwardly from the accommodating space.08-12-2010
20100200869METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE - A method of manufacturing a display device including the steps of: forming drive elements on a substrate; forming a planarization film in a position corresponding to each of the drive elements; forming a bottom electrode corresponding to each of the plurality of organic light emitting elements; forming a pixel isolation insulating film in a region between the bottom electrodes; forming an organic layer including a light emission layer above the bottom electrode by evaporation using an evaporation mask; and forming a top electrode over the organic layer. In the step of forming the bottom electrode includes the steps of: forming a bottom electrode material film; forming a photoresist film on the bottom electrode material film; exposing the photoresist film using the evaporation mask and developing it; and selectively removing the bottom electrode material film by etching using the photoresist film as a mask.08-12-2010
20090184333LIGHT EMITTING DIODE DEVICE - An LED device includes a substrate, a plurality of LEDs, a first light pervious layer, a reflective plate, and a plurality of phosphor particles contained in the first light pervious layer. The LEDs are electrically mounted on the substrate and configured for emitting light of a first wavelength. The reflective plate is mounted on the substrate for directing the light of the first wavelength to transmit through the first light pervious layer. The phosphor particles are configured for converting the light of the first wavelength into light of a second wavelength. A distribution of the phosphor particles in the first light pervious layer gradually decreases from a center to a periphery thereof.07-23-2009
20120138975LIGHT- EMITTING ELEMENT AND DISPLAY DEVICE - A light-emitting element and a display device having a resonator structure which has a small luminance fluctuation, even if a film thickness is deviated from a designed value, thereby resulting in a variation in resonator optical path length. There are included: a first reflective member; a second reflective member; and a light-emitting layer provided therebetween, and there is provided a resonator structure that transmits part of light by the first reflective member or the second reflective member, the light being resonated between the first reflective member and the second reflective member. The resonator structure has at least two or more resonance spectral peaks at respective wavelengths in a visible light range with a wavelength of a maximum value relative luminosity being a border line and an emission output spectrum has at least two or more peaks at respective wavelengths based on the resonance spectral peaks.06-07-2012
20120138968SEMICONDUCTOR PACKAGE AND DISPLAY PANEL ASSEMBLY HAVING THE SAME - Provided are a semiconductor package with a reduced lead pitch, and a display panel assembly having the semiconductor package. The semiconductor package includes a film having a hole formed therein, a plating pattern formed under the film and forming a wire; a semiconductor chip placed in the hole and electrically connected to the plating pattern; and a first passivation layer formed at a side opposite to the semiconductor chip about the plating pattern and protecting the plating pattern.06-07-2012
20120138965DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A display substrate includes a base substrate, a data line, a gate line, a switching element, a self assembled monolayer (SAM) and a pixel electrode. The data line is formed on the base substrate. The gate line is formed across the data line. The switching element includes a source electrode electrically connected to the data line, a drain electrode spaced apart from the source electrode, a semiconductor pattern covering the source and drain electrodes, and a gate electrode electrically connected to the gate line and facing the semiconductor pattern. The SAM is disposed around the semiconductor pattern and a conductive pattern including the data line. The pixel electrode is electrically connected to the switching element.06-07-2012
20090140270DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF - An object is to provide a system-on-panel display device including a display portion and a peripheral circuit for controlling display on the display portion over one substrate, which can operate more accurately. The display device has a display portion provided with a pixel portion including a plurality of pixels and a peripheral circuit portion for controlling display on the display portion, which are provided over a substrate. Each of the display portion and the peripheral circuit portion includes a plurality of transistors. For semiconductor layers of the transistors, single crystal semiconductor materials are used.06-04-2009
20090140269DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - In a display apparatus and a method of manufacturing the display apparatus, a gate line, a data line, and a plurality of layers are formed on an array substrate on which a pixel area, a pad area, and a peripheral area are defined. During the forming processes of the gate line, the data line, and the layers, the gate line and the data line are partially exposed in the peripheral area, or contact portions formed on the gate line and the data line in the peripheral area are exposed. Thus, the gate line and the data line may be tested using the contact portions as electrical terminals during the manufacturing process of the display apparatus.06-04-2009
20090140268LED array module and method of packaging the same - An LED array module includes a drive IC structure, at least one LED array, an adhesive element, and a first conductive structure. The drive IC structure has a concave groove formed on a top side thereof. The at least one LED array is received in the at least one concave groove. The adhesive element is disposed between the at least one LED array and the drive IC structure. The first conductive structure is electrically connected between the drive IC structure and the at least one LED array. Moreover, the LED array module can be disposed on a PCB that has at least one input/output pad. A second conductive structure is electrically connected between the drive IC structure and the at least one input/output pad.06-04-2009
20120193654LIGHT EMITTING DEVICE - A light emitting device is disclosed. The light emitting device includes a support member, a light emitting structure disposed over the support member and includes first and second light emitting structures, the first and second light emitting structures including a first semiconductor layer, a second semiconductor layer, and an active layer, a passivation layer disposed on one side surface of the first light emitting structure, a first electrode disposed between the support member and the first semiconductor layer in the first light emitting structure, a second electrode disposed on a side surface of the passivation layer and on the second semiconductor layer in the first light emitting structure, a third electrode disposed between the support member and the first semiconductor layer in the second light emitting structure, an insulation layer disposed with a through hole, and a fourth electrode disposed in the through hole.08-02-2012
20120068201Thin Film Deposition Apparatus, Method of Manufacturing Organic Light-Emitting Display Device by Using the Apparatus, and Organic Light-Emitting Display Device Manufactured by Using the Method - A thin film deposition apparatus, a method of manufacturing an organic light-emitting display device by using the thin film deposition apparatus, and an organic light-emitting display device manufactured by using the method. A thin film deposition apparatus for forming a thin film on a substrate includes a first chamber in a vacuum state; first and second stages arranged in parallel in the first chamber wherein the substrate is fixable to at least one of the first and second stages; a mask contactable with the substrate; and a first deposition source and a second deposition source that are movable relative to the first and second stages and are configured to discharge a deposition material onto the substrate.03-22-2012
20120068199THIN FILM DEPOSITION APPARATUS, METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE THIN FILM DEPOSITION APPARATUS, AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE MANUFACTURED BY USING THE METHOD - A thin film deposition apparatus that is suitable for manufacturing large-sized display devices on a mass scale and that can be used for high-definition patterning, a method of manufacturing an organic light-emitting display device by using the thin film deposition apparatus, and an organic light-emitting display device manufactured by using the method. The thin film deposition apparatus includes: a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in the first direction; a first barrier plate assembly including a plurality of first barrier plates that are disposed between the deposition source nozzle unit and the patterning slit sheet in the first direction, and that partition a space between the deposition source nozzle unit and the patterning slit sheet into a plurality of sub-deposition spaces; and a second barrier plate disposed at one side of the patterning slit sheet, wherein an inner part of the second barrier plate is partitioned into a plurality of spaces by a plurality of barrier ribs.03-22-2012
20120068198HIGH DENSITY MULTI-CHIP LED DEVICES - High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.03-22-2012
20090321754SIGNAL LIGHT USING PHOSPHOR COATED LEDS - A method for creating an improved signal light is disclosed. For example, the improved signal light includes a housing, one or more first type of light emitting diodes (LEDs) emitting a light energy having a first dominant wavelength deployed in the housing, one or more second type of LEDs emitting a light energy having a second dominant wavelength deployed in the housing, a filter and a mixer. The filter may filter the light energy of the one or more second type of LEDs such that only a third dominant wavelength passes from the one or more second type of LEDs. The mixer may mix the light energy having the first dominant wavelength and the filtered light energy having the third dominant wavelength to form a light energy having a desired fourth dominant wavelength.12-31-2009
20090321752ELECTRIC DEVICES AND METHODS OF MANUFATURING THE SAME - A process for manufacturing an electrical device, the process comprising the steps: providing a substrate; bringing a stamp into contact with the substrate whereby areas of the substrate contacted by the stamp have decreased wettability; and depositing a liquid comprising an electrically active material over areas of the substrate located between the areas of decreased wettability.12-31-2009
20110220923Conductor Structure, Pixel Structure, and Methods of Forming the Same - A method for forming a conductor structure is provided. The method comprises: (1) providing a substrate; (2) forming a patterned dielectric layer with a first opening which exposes a portion of the substrate; forming a patterned organic material layer on the dielectric layer with a second opening which corresponds to the first opening and expose the exposed portion of the substrate; (3) forming a first barrier layer on the organic material layer and the exposed portion of the substrate; (4) forming a metal layer on the first barrier layer; and (5) removing the organic material layer, the first barrier layer thereon and the metal layer thereon.09-15-2011
20120299030OPTOELECTRONIC SEMICONDUCTOR COMPONENT, LIGHTING DEVICE AND LENS - An optoelectronic semiconductor component for a lighting device including a carrier, at least one optoelectronic semiconductor chip mounted on the carrier and which includes a radiation passage face remote from the carrier, by which a plane is defined, and a lens comprising 1) a radiation exit face, which, relative to a height above the plane, exhibits a minimum, in particular in a central region, and at least two local maxima, and at least two local maxima, and 2) at least two connecting embankments which each extend from one of the maxima to another of the maxima, and each connecting embankment comprises a saddle point higher than the minimum and lower than the maxima adjoining the connecting embankment.11-29-2012
20090085046METHODS AND SYSTEMS RELATING TO SOLID STATE LIGHT SOURCES FOR USE IN INDUSTRIAL PROCESSES - Methods and systems relating to solid state light sources for use in industrial processes.04-02-2009
20090072249Nitride Semiconductor Light-Emitting Device - A nitride semiconductor light-emitting device including a first n-type nitride semiconductor layer, a light-emitting layer, a p-type nitride semiconductor layer, and a second n-type nitride semiconductor layer in this order, and further including an electrode formed of a transparent conductive film on the second n-type nitride semiconductor layer is provided. The nitride semiconductor light-emitting device has improved light extraction efficiency. The electrode formed of a transparent conductive film is preferably formed on a part of a surface of the second n-type nitride semiconductor layer.03-19-2009
20110220919FLUORESCENT SUBSTANCE, PROCESS FOR PRODUCTION OF FLUORESCENT SUBSTANCE, LIGHT-EMITTING DEVICE AND LIGHT-EMITTING MODULE - The embodiment provides a process for production of an oxynitride fluorescent substance. An compound containing In or Ga is adopted in the process as a material thereof. The red fluorescent substance produced by the process can be combined with a semiconductor light-emitting element, so as to be used in a light-emitting device or a light-emitting module.09-15-2011
20090065790LED chips having fluorescent substrates with microholes and methods for fabricating - Methods for fabricating semiconductor devices such as LED chips at the wafer level, and LED chips and LED chip wafers fabricated using the methods. An LED chip wafer according to the present invention comprises a plurality of LEDs on a wafer and a plurality of pedestals, each of which is on one of the LEDs. A fluorescent substrate or preform (“preform”) is provided covering at least some of the LEDs, the preform comprising holes with the pedestals arranged within the holes. During operation of the covered ones of said LEDs at least some light from the LEDs passes through the preform and is converted. LED chips are provided that are singulated from this LED chip wafer. One embodiment of a method for fabricating LED chips from a wafer comprises depositing LED epitaxial layers on an LED growth wafer to form a plurality of LEDs on the growth wafer. Pedestals are formed on the LEDs and a fluorescent preform is formed with holes. The fluorescent preform is bonded over at least some of the plurality of LEDs so that at least some light from the covered ones of said LEDs passes through the preform and is converted. The pedestals are arranged in the holes so that an electrical signal is applied to the LEDs through the pedestals.03-12-2009
20110220922Organic light emitting display device and method of manufacturing the same - An organic light emitting display device includes a substrate, a plurality of pixels on the substrate having a first region configured to emit light and a second region configured to transmit external light, a plurality of pixel circuit units, a plurality of first electrodes, a first organic layer on the plurality of first electrodes, a second organic layer on the first organic layer, the second organic layer including an emission layer, a third organic layer on the second organic layer, the third organic layer being positioned in the first region and outside a central portion of the second region, and a second electrode having a first portion only on the third organic layer.09-15-2011
20090200563Group III nitride semiconductor light-emitting device and production method therefor - Provided is a method for producing a Group III nitride semiconductor light-emitting device including a GaN substrate serving as a growth substrate, which method facilitates tapering of a bottom portion of the GaN substrate. In the production method, firstly, a Group III nitride semiconductor layer, an ITO electrode, a p-electrode, and an n-electrode are formed on the top surface of a GaN substrate through MOCVD. Thereafter, the GaN substrate is thinned through mechanical polishing of the bottom surface thereof, and then scratches formed by mechanical polishing are removed through chemical mechanical polishing, to thereby planarize the bottom surface. Subsequently, a mask is formed on the bottom surface of the GaN substrate, followed by wet etching with phosphoric acid. By virtue of anisotropy in etching of GaN with phosphoric acid, a tapered surface is exposed so as to be inclined by about 60° with respect to the GaN substrate.08-13-2009
20110140133LIGHT EMITTING DEVICE HAVING INCREASED LIGHT OUTPUT - The light intensity emitted from a package is increased by adjusting a portion of the package encapsulant so that light impacting the side walls of the adjusted encapsulant portion will encounter total internal reflection (TIR) with the reflected light directed toward the top surface of the package. The adjusted portion of the package is positioned so that air can be used as the second (exterior) medium with the critical TIR angle being such that light emitted from a light source (such as from an LED die) will be directed primarily so as to escape the package from the top surface as opposed to being scattered internal to the package. In one embodiment, a lower portion of the encapsulant is surrounded by a casing to inwardly direct light from the light source that impacts the side of the encapsulant with an angle less than the critical TIR angle.06-16-2011
20090184332Package structure module with high density electrical connections and method for packaging the same - A package structure module with high density electrical connections includes a drive IC structure, an LED array structure, and a plurality of conductive structures. The drive IC structure has a plurality of first open grooves formed on a lateral wall thereof. The LED array structure has a plurality of second open grooves formed on a lateral wall thereof to respectively face the first open grooves. Each conductive structure traverse the corresponding first open groove and the corresponding second open groove in order to electrically connect between the drive IC structure and the LED array structure.07-23-2009
20110227101METHOD FOR PROVIDING AND REMOVING DISCHARGING INTERCONNECT FOR CHIP-ON-GLASS OUTPUT LEADS AND STRUCTURES THEREOF - Microelectronic devices may be fabricated while being protected from damage by electrostatic discharge. In one embodiment, a shorting circuit is connected to elements of the microelectronic device, where the microelectronic device is part of a chip-on-glass system. In one aspect of this embodiment, a portion of the shorting circuit is in an area of a substrate where a microchip is bonded. In another embodiment, shorting links of the shorting circuit are comprised of a fusible material, where the fusible material may be disabled by an electrical current capable of fusing the shorting links.09-22-2011
20120104424LIGHT EMITTING DEVICE HAVING PLURALITY OF NON-POLAR LIGHT EMITTING CELLS AND METHOD OF FABRICATING THE SAME - Disclosed are a light emitting device having a plurality of non-polar light emitting cells and a method of fabricating the same. This method comprises preparing a first substrate of sapphire or silicon carbide having an upper surface with an r-plane, an a-plane or an m-plane. The first substrate has stripe-shaped anti-growth patterns on the upper surface thereof, and recess regions having sidewalls of a c-plane between the anti-growth patterns. Nitride semiconductor layers are grown on the substrate having the recess regions, and the nitride semiconductor layers are patterned to form the light emitting cells separated from one another. Accordingly, there is provided a light emitting device having non-polar light emitting cells with excellent crystal quality.05-03-2012
20120104423ORGANIC LIGHT-EMITTING ELEMENT, ORGANIC LIGHT-EMITTING DEVICE, ORGANIC DISPLAY PANEL, ORGANIC DISPLAY DEVICE, AND METHOD OF MANUFACTURING AN ORGANIC LIGHT-EMITTING ELEMENT - An organic light-emitting element includes a reflective anode, a first functional layer, an organic light-emitting layer that emits blue light, a second functional layer, a transparent cathode, and a coating layer. An optical thickness of the first functional layer is greater than 0 nm but not greater than 316 nm. A difference in refractive index between the transparent cathode and either a layer adjacent to the transparent cathode within the second functional layer or a layer adjacent to the transparent cathode within the coating layer is from 0.1 to 0.7 inclusive. The transparent cathode has a physical thickness greater than 0 nm but not greater than 70 nm, a refractive index from 2.0 to 2.4 inclusive, and an optical thickness greater than 0 nm but not greater than 168 nm.05-03-2012
20120104422ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light emitting display and a method of manufacturing the same. The organic light-emitting display is a transparent display where one can see through the display to view an image on the other side of the display. Each pixel of the display has a first region that includes an organic light emitting diode and a thin film transistor, and a larger second region that is transparent. The second region is made of either transparent layers or ultra thin layers so that light is not blocked. A second electrode of the display may include magnesium and may be produced by a selective deposition process, so that use of a fine metal mask may be avoided.05-03-2012
20120104421LEADFRAME PACKAGE WITH RECESSED CAVITY FOR LED - An LED package includes a die pad having a bottom surface, an upper surface and a centrally located recessed cavity. The recessed cavity has a chip attach surface between the bottom surface and upper surface and sidewalls that extend from the recessed chip attach surface to the upper surface. The package additionally has leads arranged on opposing sides of the die pad. The leads have a bottom surface that is coextensive with the bottom surface of the die pad and an upper surface coextensive with the upper surface of the die pad. An LED chip is attached to the chip attach surface. The package further includes a package body having an encapsulant which fills space between the die pad and leads forming a bottom encapsulant surface that is coextensive with the bottom surfaces of the die pad and leads.05-03-2012
20120104420DISPLAY DEVICE AND ORGANIC LIGHT EMITTING DIODE DISPLAY - A display device includes a substrate, a display unit formed on the substrate, a sealing substrate bonded to the substrate by a bonding layer surrounding the display unit, the sealing substrate comprising a complex member and an insulating member, wherein the complex member has a resin matrix and a plurality of carbon fibers and the insulator is connected to an edge of the complex member and comprises a penetration hole, a metal layer disposed at one side of the sealing substrate wherein the one side faces the substrate, and a conductive connection unit filling in the penetration hole and contacting the metal layer. The complex member and the insulator may be coupled by tongue and groovecoupling along a thickness direction of the sealing substrate where the protrusion-groove coupling structure is top-to-bottom symmetric and the insulator may have a thickness identical to that of the complex member.05-03-2012
20120104419TRANSISTOR ARRAY SUBSTRATE - A transistor array substrate includes a substrate, plural pads, plural shorting bars, at least one pixel array, plural first wires, and plural second wires. The substrate has at least one panel region and a peripheral circuit region surrounding the panel region. The pads and the shorting bars are disposed in the peripheral circuit region. The pixel array, the first wires, and the second wires are disposed in the panel region. The panel region has a pair of first edges and a pair of second edges. The first edges are connected between the second edges. The shorting bars are connected to the pads. The first wires and the second wires are electrically connected to the pixel array. The first wires are connected to some shorting bars through one of the first edges. The second wires are connected to the other shorting bars through at least one second edge05-03-2012
20120104418LIGHT-EMITTING MODULE AND ALTERNATING CURRENT LIGHT-EMITTING DEVICE - A light-emitting module is provided, including a heat sink and a plurality of insulating layers disposed over the heat sink. A plurality of light-reflective layers is disposed over one of the insulating layers, respectively, wherein the light-reflective layers comprise a plurality of light-reflective inclined surfaces. A plurality of conductive layers is disposed over one of the light-reflective layers, respectively. A light-emitting diode (LED) chip is disposed over the heat sink. A plurality of bonding wires is provided, connecting the LED chip with the conductive layers. A transparent housing is disposed over the LED chip. A phosphor layer is disposed over a surface of the transparent housing facing the heat sink, and does not physically contact the LED chip.05-03-2012
20090212303Light-emitting diode matrix and method for producing a light-emitting diode matrix - A light-emitting diode matrix comprises a substrate, first and second electrodes electrically insulated from each other formed in or on the substrate, and a first organic layer on the first electrode and a second organic layer on the second electrode. The first organic layer is separated from the second organic layer by separator means. Further, the light-emitting diode matrix comprises a cap electrode with an area disposed on the first organic layer and an area disposed on the second organic layer. The areas of the cap electrode are connected in an electrically conductive way via an area of the cap electrode disposed on the separator means.08-27-2009
20090212304Led chip package structure with multifunctional integrated chips and a method for making the same - An LED chip package structure with multifunctional integrated chips includes a substrate unit, a light-emitting unit, a chip unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The chip unit is electrically arranged on the substrate unit, and the chip unit is arranged between the light-emitting unit and a power source. The package colloid unit covers the LED chips. The package colloid unit is a strip fluorescent colloid corresponding to the LED chips.08-27-2009
20130214298LIGHT EMITTER DEVICE PACKAGES, COMPONENTS, AND METHODS FOR IMPROVED CHEMICAL RESISTANCE AND RELATED METHODS - Light emitter packages, components, and related methods for providing improved chemical resistance are provided herein. In one aspect, a component of a light emitter package is provided. The component can include a base material, a silver (Ag) containing material at least partially disposed over the base material, and a portion of phenyl containing silicone encapsulant at least partially disposed over the Ag portion. The component can be incorporated within a surface mount device (SMD) type light emitter package.08-22-2013
20130214295HEAT SPREADING SUBSTRATE - Heat spreading substrate. In an embodiment in accordance with the present invention, an apparatus includes a first conductive layer, a first insulating layer disposed in contact with the first conductive layer and a thermally conductive layer disposed in contact with the first insulating layer, opposite the first conductive layer. The faces of the first conductive layer, the first insulating layer and the thermally conductive layer are substantially co-planar; and a sum of widths of faces of the first conductive layer, the first insulating layer and the thermally conductive layer is greater than a height of the faces. The first conductive layer and the first insulating layer may include rolled materials.08-22-2013
20130214296HEAT SPREADING SUBSTRATE WITH EMBEDDED INTERCONNECTS - Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside the metal parallelepiped. The plurality of wires have a different grain structure than the metal parallelepiped. The plurality of wires are electrically isolated from the metal parallelepiped. The plurality of wires may be electrically isolated from one another.08-22-2013
20090230411INTERDIGITATED MULTIPLE PIXEL ARRAYS OF LIGHT-EMITTING DEVICES - The present invention discloses a plurality of interdigitated pixels arranged in an array, having a very low series-resistances with improved current spreading and improved heat-sinking. Each pixel is a square with sides of dimension l. The series resistance is minimized by increasing the perimeter of an active region for the pixels. The series resistance is also minimized by shrinking the space between a mesa and n-contact for each pixel.09-17-2009
20090230410LED PACKAGE AND METHOD OF MANUFACTURING THE SAME - The present invention relates to light emitting diode (LED) packages and methods of manufacturing the same, and more particularly, to an LED package and a method of manufacturing the same that can reduce a variation of color coordinates of mass-produced LED packages.09-17-2009
20090224268LIGHT-EMITTING DIODE AND LIGHTING APPARATUS USING THE SAME - A light-emitting diode includes a substrate, a light-emitting diode element mounted on an upper surface of the substrate, and a sealing member that covers the light-emitting diode element. At least one pair of lower electrodes electrically connected to the light-emitting diode element and at least one pair of connecting electrodes connected to each other are disposed on the substrate. A connecting wiring pattern for connecting the pair of connecting electrodes is provided between the connecting electrodes.09-10-2009
20090242909LIGHT-EMITTING DEVICE, LINEAR LIGHT SOURCE, PLANAR LIGHT UNIT AND DISPLAY APPARATUS - A light-emitting device used in a linear array of a plurality of them includes a semiconductor light-emitting element, a substrate on which the semiconductor light-emitting element is mounted, and a light-transmitting sealing resin formed on the front surface of the substrate to seal the semiconductor light-emitting element. Of each of the peripheral edge surfaces of the substrate and the sealing resin, at least one side surface that faces in the direction of the array is inclined in the array direction.10-01-2009
20090242908PLANAR LIGHT SOURCE DEVICE - A planar light source device includes: a substrate having a thickness larger than 0.9 mm and including a metal layer; and a plurality of light-emitting diode chips disposed on the substrate in a matrix array. Each light-emitting diode chip has a chip size ranging from 0.0784 mm10-01-2009
20090095961Combination of LED and heat dissipation device - A combination of LED and heat dissipating device includes a heat dissipating device, an electrically insulative thermal conductivity layer covered on a part of the surface of the heat dissipating device, thermal and electric conducting layers disposed at the electrically insulative thermal conductivity layer and electrically isolated from one another, LED units each having an LED unit installed in one thermal and electric conducting layer and a lead wire that connects the LED chip of the respective LED unit to the LED chip of another LED unit, and a packaging device covering the LED units.04-16-2009
20090095962METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING DISPLAY APPARATUS, APPARATUS OF MANUFACTURING SEMICONDUCTOR DEVICE, AND DISPLAY APPARATUS - A method of manufacturing a semiconductor device includes the steps of: modifying a semiconductor film by applying a laser beam; and forming a semiconductor device on the modified semiconductor film. In the step of modifying the semiconductor film, the laser beam and the substrate are moved relative to each other in a first direction and a second direction which is opposite to the first direction, a change in an optical characteristic between an area irradiated with the laser beam and an area which is not irradiated with the laser beam in the substrate or an optical characteristic of the irradiated area is measured in each of the first and second directions, and irradiation power of the laser beam is modulated so that the difference between a measurement result in the first direction and a measurement result in the second direction lies in a predetermined range.04-16-2009
20090242904Semiconductor Light Emitting Apparatus and Optical Print Head - A semiconductor light emitting apparatus is supplied capable of providing a high performance that can optimize simultaneously both an electrical characteristic and a light emitting characteristic. The semiconductor apparatus comprises an anode layer; a cathode layer that has a conductive type different from that of the anode layer; a gate layer that controls an electrical conduction between the anode layer and the cathode layer; an active layer that is set between the anode layer and the cathode layer and emits light through recombination of electron and positive hole; a first cladding layer that is set on one surface of the active layer and has an energy band gap larger than that of the active layer; and a second cladding layer that is set on other surface of the active layer, has an energy band gap larger than that of the active layer and has a conductive type different from that of the first cladding layer, wherein a thickness of the gate layer is or below a mean free path of carriers implanted into the gate layer.10-01-2009
20090242907DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - To achieve enlargement and high definition of a display portion, a single crystal semiconductor film is used as a transistor in a pixel, and the following steps are included: bonding a plurality of single crystal semiconductor substrates to a base substrate; separating part of the plurality of single crystal semiconductor substrates to form a plurality of regions each comprising a single crystal semiconductor film over the base substrate; forming a plurality of transistors each comprising the single crystal semiconductor film as a channel formation region; and forming a plurality of pixel electrodes over the region provided with the single crystal semiconductor film and a region not provided with the single crystal semiconductor film. Some of the transistors electrically connecting to the pixel electrodes formed over the region not provided with the single crystal semiconductor film are formed in the region provided with the single crystal semiconductor film.10-01-2009
20090242905SEMICONDUCTOR DEVICE, OPTICAL PRINT HEAD AND IMAGE FORMING APPARATUS - A semiconductor device and an optical print head, an image forming apparatus that has the semiconductor device are supplied capable of reduce occurrence probability of defect. The semiconductor device is formed by using semiconductor thin film bonded on the substrate, and includes a covering layer that covers at least one part region of the semiconductor thin film and covers at least one part of electroconductive member connecting with the semiconductor thin film.10-01-2009
20090242903LUMINOUS BODY WITH LED DIES AND PRODUCTION THEREOF - A luminous body comprises a transparent plastic moulding with indentations, and LED DIEs disposed within the indentations. One side of each LED DIE lies approximately flush with an upper side of the moulding, and each LED DIE is connected to an electricity supply via electrical conductors disposed on the moulding. A method for producing such a luminous body is also disclosed.10-01-2009
20090242910LIGHT EMITTING DEVICE - A light emitting device includes: a first semiconductor region; a second semiconductor region and third semiconductor region which are provided in the first semiconductor region; a first semiconductor light emitting element of which first electrode is electrically connected to a main surface of the second semiconductor region; a second semiconductor light emitting element of which third electrode is electrically connected to a main surface of the third semiconductor region; and a conductor which electrically connects the second electrode of the first semiconductor light emitting element and the third semiconductor region, and which electrically connects the second electrode and the third electrode through the third semiconductor region. In the light emitting device, the semiconductor light emitting elements are connected in series, and are directly connected to a power source.10-01-2009
20090242906SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING UNIT - A semiconductor light emitting device includes: an outer surrounding body having a recessed portion formed in an upper surface of the outer surrounding body; a lead terminal led out from a side surface of the outer surrounding body; and a semiconductor light emitting element disposed in the recessed portion. The outer surrounding body has a cut portion formed at a corner defined by a cross point of extension lines of adjacent sides in a planar outline of the outer surrounding body viewed from the upper surface of the outer surrounding body. The lead terminal is led out from the cut portion.10-01-2009
20090256164Active Device Array Substrate and Method for Fabricating the Same - An active device array substrate and its fabricating method are provided. According to the subject invention, the elements of an array substrate such as the thin film transistors, gate lines, gate pads, data lines, data pads and storage electrodes, are provided by forming a patterned first metal layer, an insulating layer, a patterned semiconductor layer and a patterned metal multilayer. Furthermore, the subject invention uses the means of selectively etching certain layers. Using the aforesaid means, the array substrate of the subject invention has some layers with under-cut structures, and thus, the number of the time-consuming and complicated mask etching process involved in the production of an array substrate can be reduced. The subject invention provides a relatively simple and time-saving method for producing an array substrate.10-15-2009
20100044727LED PACKAGE STRUCTURE - A LED package structure includes an insulating ceramic base, whereon a first surface and a second surface are formed. The LED package structure further includes a casing disposed on the first surface of the insulating ceramic base. A hole is formed on the casing. The LED package structure further includes a heat-dissipating structure connected to the second surface of the insulting ceramic base, at least one LED chip, and at least one conductive circuit disposed inside the casing. The conductive circuit includes a first conductive portion, and a second conductive portion connected to the first conductive portion via the hole and electrically connected to the LED chip.02-25-2010
20120193649LIGHT EMITTING DIODE (LED) ARRAYS INCLUDING DIRECT DIE ATTACH AND RELATED ASSEMBLIES - An electronic device may include a packaging substrate having a packaging substrate face with a plurality of electrically conductive pads on the packaging substrate face. A first light emitting diode die may bridge first and second ones of the electrically conductive pads. More particularly, the first light emitting diode die may include first anode and cathode contacts respectively coupled to the first and second electrically conductive pads using metallic bonds. Moreover, widths of the metallic bonds between the first anode contact and the first pad and between the first cathode contact and the second pad may be at least 60 percent of a width of the first light emitting diode die. A second light emitting diode die may bridge third and fourth ones of the electrically conductive pads. The second light emitting diode die may include second anode and cathode contacts respectively coupled to the third and fourth electrically conductive pads using metallic bonds. Widths of the metallic bonds between the second anode contact and the second pad and between the second cathode contact and the third pad may be at least 60 percent of a width of the first light emitting diode die.08-02-2012
20120193651LIGHT EMITTING DEVICES, SYSTEMS, AND METHODS - Light emitting devices, systems, and methods are disclosed. In one embodiment a light emitting device can include an emission area having one or more light emitting diodes (LEDs) mounted over an irregularly shaped mounting area. The light emitting device can further include a retention material disposed about the emission area. The retention material can also be irregularly shaped, and can be dispensed. Light emitting device can include more than one emission area per device.08-02-2012
20120193650Method for Packaging an LED Emitting Light Omnidirectionally and an LED Package - The present invention discloses a method for packaging an LED emitting light omnidirectionally and an LED package. The present invention utilizes a transparent glue to bond LED chips and electrodes onto one or more transparent glass or organic films, and vertically fixes the transparent bracket having the LED chips, electrodes and welding wires in a transparent vessel. When the diode power is on, the front face of the LED chips on the vertical transparent bracket can emit light properly, while the rear face of the LED chips can emit brighter light via the transparent glass or organic film. The present invention makes it possible to demonstrate the brightest face of an LED, and thus improves LED light extraction.08-02-2012
20120193647SOLID STATE LIGHTING COMPONENT PACKAGE WITH REFLECTIVE LAYER - A solid state lighting package is provided. The package comprising at least one LED element positioned on a top surface of a substrate or a submount capable of absorbing light emitted by the at least one LED element; and a reflective layer, the reflective layer covering at least a portion of the top surface of the substrate or the submount, whereby at least of portion of the light emitted by the LED element is reflected by the reflective layer. A method of manufacturing a solid state lighting package comprising the reflective layer, and a method of increasing the luminous flux thereof, is also provided.08-02-2012
20120193656DISPLAY DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF - A display device structure includes an active device, a passivation layer, a pixel electrode and a first conductive material. The passivation layer covers the active device and has a first through hole exposing a portion of the active device. The pixel electrode is disposed on the passivation layer, and the pixel electrode is a non-thin-film electrode consituted by a plurality of micro-conductive structures or includes an organic conductive polymer material. The first conductive material is disposed around the first through hole and electrically connected to the exposed active device. The pixel electrode is electrically connected to the first conductive material.08-02-2012
20120193655ALIGNMENT TOLERANT PATTERNING ON FLEXIBLE SUBSTRATES - A method is provided for fabricating a multilayer electronic device on a flexible substrate including at least a first and a second patterned layer, wherein the first patterned layer is defined with a linewidth that is smaller than the linewidth of the second patterned layer, and the second patterned layer is defined by a patterning technique which is capable of correcting for local distortions of the pattern of said first layer on top of the flexible substrate and wherein the first patterned layer is laid-out in such a way that the geometric overlap between a portion of the second layer and a portion of the first layer is insensitive against small variations of the position of the second patterned layer.08-02-2012
20120193653LED ARRAY FORMED BY INTERCONNECTED AND SURROUNDED LED CHIPS - A light emitting diode array includes a first light emitting diode having a first electrode and a second light emitting diode having a second electrode. The first and second light emitting diodes are separated. A first polymer layer is positioned between the light emitting diodes. An interconnect located at least partially on the first polymer layer connects the first electrode to the second electrode. A permanent substrate is coupled to the light emitting diodes. The permanent substrate is coupled to the side of the light emitting diodes opposite the interconnect. A second polymer layer at least partially encapsulates the side of the light emitting diodes with the interconnect.08-02-2012
20100148192ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display includes: a substrate member; a pixel electrode formed on the substrate member; a pixel defining film having an opening through which the pixel electrode is exposed, and formed on the substrate member; a light absorbing layer pattern for dividing the opening into a plurality of sub-emitting areas within the opening of the pixel defining film; an organic light emitting layer formed on the pixel electrode; and a common electrode formed on the organic light emitting layer.06-17-2010
20090315044ELECTRO-OPTIC DISPLAYS, AND COMPONENTS FOR USE THEREIN - An electro-optic display comprises a substrate (12-24-2009
20100148191High Luminous Flux Warm White Solid State Lighting Device - A high luminous flux warm white solid state lighting device with a high color rendering is disclosed. The device comprising two groups of semiconductor light emitting components to emit and excite four narrow-band spectrums of lights at high luminous efficacy, wherein the semiconductor light emitting components are directly mounted on a thermal effective dissipation member; a mixing cavity for blending the multi-spectrum of lights; a back-transferred light recycling member deposited on top of an LED driver and around the semiconductor light emitters; and a diffusive member to diffuse the mixture of output light from the solid state lighting device. The solid state lighting device produces a warm white light with luminous efficacy at least 80 lumens per watt and a color rendering index at least 85 for any lighting application.06-17-2010
20100148193SYSTEMS AND METHODS FOR PACKAGING LIGHT-EMITTING DIODE DEVICES - Embodiments disclosed herein provide packaged LED devices in which the majority of the emitted light comes out the top of each LED chip with very little side emissions. Because light only comes out from the top, phosphor deposition and color temperature control can be significantly simplified. A package LED may include a housing positioned on a supporting submount, sized and dimensioned to accommodate a single LED chip or an array of LED chips. The LED chip(s) may be attached to the submount utilizing the Gold-to-Gold Interconnect (GGI) process or solder-based approaches. In some embodiments, phosphor may be deposited on top of the LED chip(s) or sandwiched between glass plates on top of the LED chip(s). The phosphor layer may be inside or on top of the housing and be secured to the housing utilizing an adhesive. The housing may be adhered to the submount utilizing a thermal epoxy.06-17-2010
20100148190LIGHT EMITTING DIODE WITH ITO LAYER AND METHOD FOR FABRICATING THE SAME - The present invention relates to a light emitting diode with enhanced luminance and light emitting performance due to increase in efficiency of current diffusion into an ITO layer, and a method of fabricating the light emitting diode. According to the present invention, there is manufactured at least one light emitting cell including an N-type semiconductor layer, an active layer and a P-type semiconductor layer on a substrate. The method of the present invention comprises the steps of (a) forming at least one light emitting cell with an ITO layer formed on a top surface of the P-type semiconductor layer; (b) forming a contact groove for wiring connection in the ITO layer through dry etching; and (c) filling the contact groove with a contact connection portion made of a conductive material for the wiring connection.06-17-2010
20100171129ACTIVE MATRIX SUBSTRATE, ELECTROPHORETIC DISPLAY APPARATUS, AND ELECTRONIC DEVICE - An active matrix substrate includes a substrate; a plurality of data lines provided on the substrate; a plurality of scanning lines provided to cross the data lines on the substrate when seen in a plan view; a thin film transistor that is electrically connected to one of the plurality of data lines and one of the plurality of scanning lines and has an organic semiconductor layer; a pixel electrode electrically connected to the thin film transistor; and a capacitive element electrically connected in parallel with the thin film transistor between the data line and the pixel electrode.07-08-2010
20100155745MULTICHIP LIGHT-EMITTING DIODE - A multichip light-emitting diode (LED) includes a reflective cup, a plurality of light-emitting chips and a package. The light-emitting chips are disposed in the reflective cup and emit light when driven. The package is disposed in the reflective cup and covers the light-emitting chips. The package further has a plurality of lenses corresponding to the light-emitting chips one by one. The lenses refract light emitted by the corresponding light-emitting chips, respectively. An extrinsic light efficiency of the multichip is increased through the design of the multichip LED.06-24-2010
20100193808LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME - Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.08-05-2010
20100187546VERTICAL GEOMETRY LIGHT EMITTING DIODE PACKAGE AGGREGATE AND PRODUCTION METHOD OF LIGHT EMITTING DEVICE USING THE SAME - There are provided a vertical geometry light emitting diode package aggregate useful for the production of a light emitting device having a vertical geometry light emitting diode as the light source, the light emitting device satisfying requirements in terms of current capacity flowed for light emission, dissipation of heat generated due to flow of a large current, resistance to thermal stress, strength of device and light emission efficiency, and a method for producing a light emitting device having a vertical geometry light emitting diode as the light source by using the package aggregate. The vertical geometry light emitting diode package comprises a metal sheet having formed thereon a number of vertical geometry light emitting diode package units, each package unit comprising two or more substrate portions as a part of the metal sheet, which are separated by a slit, and a reflector having a penetrating opening and being adhered to the two or more substrate portions to cover parts of the slit such that the vertical geometry light emitting diode-mounting position is exposed in the inner side of the opening and at the same time, the end part of the slit is exposed in the outer side of the reflector.07-29-2010
20100187547Image display apparatus - An image display apparatus displaying an image by selectively emitting light from a plurality of semiconductor light emitting elements being regularly arranged, includes a substrate; a first conductive wiring layer being formed on the substrate and supplying a first electric potential; a second conductive wiring layer supplying a second electric potential; the plurality of semiconductor light emitting elements each including a first electrode layer being electrically connected to the first conductive wiring layer and a second electrode layer being electrically connected to the second conductive wiring layer; and a plurality of raised parts being disposed on the substrate, each of the raised parts having an upper surface which is higher than an upper surface of the first conductive wiring layer; wherein the plurality of semiconductor light emitting elements is fixed on the plurality of raised parts respectively.07-29-2010
20120032197LIGHT EMITTING DEVICE AND IMAGE DISPLAY UNIT - A light emitting device includes a package having a recess, a lead frame buried in the package so that one end of the lead frame is exposed at a bottom of the recess and another end protrudes to an exterior of the package, a light emitting element arranged on the lead frame exposed at the bottom of the recess, and an encapsulant filled in the recess. The package includes, at the side face where the lead frame protrudes, a first side face formed inwardly relative to a side face of the lead frame, and a second side face formed at a lower portion of the first side face and protruded so as to cover a top face of the lead frame.02-09-2012
20130214294LIGHT EMITTING DEVICE WITH PLANAR CURRENT BLOCK STRUCTURE - A light-emitting device comprises a support base having a planar surface, a semiconductor stacked structure disposed on the planar surface, the semiconductor stacked structure comprising a first semiconductor layer, an active layer, a second semiconductor layer, a current block region formed in one of the first semiconductor layer and the second semiconductor layer and physically contacts the planar surface and an electrode disposed on the semiconductor stacked structure.08-22-2013
20130214297HIGH VOLTAGE LIGHT EMITTING DIODE CHIP AND ITS MANUFACTURING METHOD - A high voltage light emitting diode chip and its manufacturing method are provided. The high voltage light emitting diode chip can be manufactured by forming a plurality of light emitting diode units on a substrate and electrically connecting the light emitting diode units, wherein a trench with a width of about 0.5 μm to about 7 μm is present between every two adjacent light emitting diode units to isolate the light emitting diode units. The procedure for manufacturing the high voltage light emitting diode chip is simple and the high voltage light emitting diode chip that is produced can exhibit satisfying luminous efficiency.08-22-2013
20130214299THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF - A thin film transistor array panel and a manufacturing method thereof according to an exemplary embodiment of the present invention form a contact hole in a second passivation layer formed of an organic insulator, protect a side of the contact hole by covering with a protection member formed of the same layer as the first field generating electrode and formed of a transparent conductive material, and etch the first passivation layer below the second passivation layer using the protection member as a mask. Therefore, it is possible to prevent the second passivation layer formed of an organic insulator from being overetched while etching the insulating layer below the second passivation layer so that the contact hole is prevented from being made excessively wide.08-22-2013
20130214303LIGHT EMITTING ELEMENT, LIGHT EMITTING ELEMENT ARRAY, OPTICAL WRITING HEAD, AND IMAGE FORMING APPARATUS - A light emitting element includes a semiconductor substrate, and an island structure formed on the semiconductor substrate. The island structure includes a light-emitting-unit thyristor and a current confinement structure. The light-emitting-unit thyristor includes stacked semiconductor layers having a pnpn structure. The current confinement structure includes a high-resistance region and a conductive region, and confines carriers in the conductive region.08-22-2013
20100193806Light Emitting Diode Unit, Display Apparatus Having the Same and Manufacturing Method of the Same - Disclosed are a light emitting diode unit, a display apparatus having the same, and a method of manufacturing the same. The light emitting diode unit includes at least one light emitting diode, a quantum dot layer, and a buffer layer. The light emitting diode emits first light. The quantum dot layer is provided on the light emitting diode and includes a plurality of quantum dots that absorb the first light to emit second light having a wavelength different from a wavelength of the first light. The buffer layer is interposed between the light emitting diode and the quantum dot layer and separates the light emitting diode from the quantum dot layer. The buffer layer includes a scattering agent which is dispersed in resin to diffuse the light emitted from the light emitting diode.08-05-2010
20090078944Light emitting device and method of manufacturing the same - This semiconductor light emitting device includes an optical cavity made of a group III nitride semiconductor having a major growth surface defined by a nonpolar plane and including a pair of cavity end faces parallel to c-planes, and a reflecting portion made of a group III nitride semiconductor having a major growth surface defined by a nonpolar plane and having a reflective facet opposed to one of the pair of cavity end faces and inclined with respect to a normal of the major growth surface. The optical cavity and the reflecting portion may be crystal-grown from the major surface of the substrate. The substrate is preferably a group III nitride semiconductor substrate having a major surface defined by a nonpolar plane.03-26-2009
20100187548LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME AND MONOLITHIC LIGHT EMITTING DIODE ARRAY - A light emitting device including: at least one light emitting stack including first and second conductivity type semiconductor layers and an active layer disposed there between, the light emitting stack having first and second surfaces and side surfaces interposed between the first and second surfaces; first and second contacts formed on the first and second surface of the light emitting stack, respectively; a first insulating layer formed on the second surface and the side surfaces of the light emitting stack; a conductive layer connected to the second contact and extended along one of the side surfaces of the light emitting stack to have an extension portion adjacent to the first surface; and a substrate structure formed to surround the side surfaces and the second surface of the light emitting stack.07-29-2010
20100258821CONCAVE-HEMISPHERE-PATTERNED ORGANIC TOP-LIGHT EMITTING DEVICE - A first device is provided. The first device includes an organic light emitting device, which further comprises a first electrode, a second electrode, and an organic emissive layer disposed between the first and second electrode. Preferably, the second electrode is more transparent than the first electrode. The organic emissive layer has a first portion shaped to form an indentation in the direction of the first electrode, and a second portion shaped to form a protrusion in the direction of the second electrode. The first device may include a plurality of organic light emitting devices. The indentation may have a shape that is formed from a partial sphere, a partial cylinder, a pyramid, or a pyramid with a mesa, among others. The protrusions may be formed between adjoining indentations or between an indentation and a surface parallel to the substrate.10-14-2010
20120241777OPTICAL ILLUMINATION DEVICE - The present invention relates to an optical lighting device comprising at least one light emitting diode configured for emitting said light with a trajectory, the device being capable of modifying said trajectory since it comprises an optical element comprising two faces each having a plurality of preferably rectangular lenses, each lens of one face being aligned with a lens of the other face.09-27-2012
20120241775ORGANIC LIGHT-EMITTING DISPLAY DEVICE - An organic light-emitting display device includes a first substrate and a second substrate that face each other; an organic light-emitting device that is disposed between the first and second substrates and includes a pixel electrode separately formed in each pixel, a common electrode facing the pixel electrode, and an organic light-emitting layer disposed between the pixel electrode and the common electrode; and an electrode unit and at least one wiring unit that are disposed between the first substrate and the second substrate, the electrode unit including at least one thin-film transistor for transmitting a light-emitting signal to the pixel electrode and at least one capacitor, wherein an optical property modification layer obtained by modifying an optical property of at least one of the electrode unit and the wiring unit is formed on a surface of the at least one of the electrode unit and the wiring unit.09-27-2012
20100176404METHOD FOR FABRICATING HIGH-POWER LIGHT-EMITTING DIODE ARRAYS - One embodiment of the present invention provides a method for fabricating a high-power light-emitting diode (LED). The method includes etching grooves on a growth substrate, thereby forming mesas on the growth substrate. The method further includes fabricating indium gallium aluminum nitride (InGaAlN)-based LED multilayer structures on the mesas on the growth substrate, wherein a respective mesa supports a separate LED structure. In addition, the method includes bonding the multilayer structures to a conductive substrate. The method also includes removing the growth substrate. Furthermore, the method includes depositing a passivation layer and an electrode layer above the InGaAlN multilayer structures, wherein the passivation layer covers the sidewalls and bottom of the grooves. Moreover, the method includes creating conductive paths which couple a predetermined number of adjacent individual LEDs, thereby allowing the LEDs to share a common power supply and be powered simultaneously to form a high-power LED array.07-15-2010
20100176405Light Emitting Diode Lighting Package with Improved Heat Sink - Improved lighting packages are described for light emitting diode (LED) lighting solutions having a wide variety of applications which seek to balance criteria such as heat dissipation, brightness, and color uniformity. The present approach includes a backing of thermally conductive material. The backing includes a cell structure. The cell structure comprises a plurality of hollow cells contiguously positioned in a side by side manner. The present approach also includes an array of LEDs. The array of LEDs is mounted to a printed circuit board (PCB). The PCB is attached to the cell structure to balance heat dissipation and color uniformity of the LEDs.07-15-2010
20100237359FLAT AND THIN LED-BASED LUMINARY PROVIDING COLLIMATED LIGHT - A light-emitting device (09-23-2010
20100237361WHITE LIGHT-EMITTING LAMP FOR ILLUMINATION AND ILLUMINATING DEVICE USING THE SAME - A white light emitting lamp 09-23-2010
20100237363Apparatus for Dissipating Thermal Energy Generated by Current Flow in Semiconductor Circuits - A thermal energy dissipating arrangement includes a semiconductor device and a thermally conductive medium. The semiconductor device includes a semiconductor circuit defining a semiconductor junction and encapsulating material in physical contact with and surrounding the semiconductor circuit. The thermally conductive medium defines an opening sized to receive the semiconductor device such that the thermally conductive medium defining the opening is in physical, thermally conductive contact with an exterior surface of the encapsulating material about the semiconductor device with the thermally conductive medium defining the opening intersecting an angle of less than or equal to a predefined angle relative to a plane defined by the semiconductor junction about a periphery of the semiconductor circuit. The thermally conductive medium absorbs thermal energy generated within the semiconductor device as a result of current flow through the semiconductor junction and rejects the absorbed thermal energy to an ambient environment surrounding the thermally conductive medium.09-23-2010
20110210348ORGANIC LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic EL device includes a first substrate and a plurality of organic EL elements above a first portion of the first substrate. A first inorganic layer covers the plurality of organic EL elements. An active layer is above a second portion of the first substrate that is different than the first portion. The active layer comprises a material that is at least one of hygroscopic and oxidizable. A second inorganic layer covers the active layer. A second substrate is opposite the first substrate, with the plurality of organic EL elements being between the first and second substrates. A seal extends between the first and second substrates to define a sealed space between the first and second substrates. The second inorganic layer includes through-holes that expose the active layer to the sealed space that is defined by the first substrate, the second substrate, and the seal.09-01-2011
20100001298LED-packaging arrangement and light bar employing the same - An LED-packaging arrangement, comprising: a first connection block with an enclosure groove at the bottom thereof; a second connection block with an enclosure groove at the bottom thereof; a light-emitting chip positioned at the top of the first connection block and via connection wires electrically coupled to the first and second connection blocks; a positioning/packaging body, and a transparent packaging body. Alternatively, a third connection block is provided with an enclosure groove at the bottom thereof. In this case, the electrical connection originally to the first connection block via the connection wire is changed to the third connection block. The first and second connection blocks are enclosed by the lower part of the positioning/packaging body in position such that the bottom surfaces of the first and second connection blocks are exposed. The upper part of the positioning/packaging body encloses the light-emitting chip so as to create a reflection cap. The transparent packaging body is employed to seal and fix the light-emitting chip and the connection wires in position for an optimal protection. In this way, the problem of the prior art is resolved that the heat generated by the light-emitting chip is not easily dissipated. Moreover, the heat-dissipating efficiency and the structural strength can be considerably enhanced.01-07-2010
20100001297LED ASSEMBLY WITH COLOR TEMPERATURE CORRECTION CAPABILITY - An illumination assembly is provided which is capable of correcting a color temperature. The assembly generally comprises a substrate and a light emitting device mounted on the substrate that further comprises a light emitting element and a resin containing a phosphor excitable by light emitted from the light emitting element. A reflectance factor of the substrate may be set corresponding to light emitted from the light emitting device, such that the light emitted by the light emitting device complies with a desired light emission for the illumination assembly. A translucent filling resin or translucent coating resin may further be applied on the light emitting device and the substrate, the translucent resin having a refractive index and correspondingly operable to suppress variations in color temperature. The assembly may comprise a plurality of light emitting devices having variable light color temperatures, wherein a plurality of substrate coatings may be provided having reflectance factors corresponding to the associated light color temperatures. One or more translucent resins may be applied on light emitting devices as desired to further suppress variations in color temperature.01-07-2010
20100001296LIGHT-EMITTING ELEMENT ARRAY WITH MICRO-LENSES AND OPTICAL WRITING HEAD - A light-emitting element array with the improvement of the light-emitting efficiency and the improvement of the uneven amount of light is provided.01-07-2010
20120138974LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF - There is provided a light emitting device package including: a substrate having a circuit pattern formed on at least one surface thereof and including an opening; a wavelength conversion layer formed by filling at least a portion of the opening with a wavelength conversion material; and at least one light emitting device disposed on a surface of the wavelength conversion layer and electrically connected to the circuit pattern.06-07-2012
20100237364Thermal Energy Dissipating and Light Emitting Diode Mounting Arrangement - A thermal energy dissipating and LED mounting arrangement includes a plurality of LEDs and a thermally conductive sheet. The thermally conductive sheet has a length, a width and a thickness, and defines a plurality of openings through the thickness. Each of the plurality of openings is sized to receive and securely hold therein a different one of the plurality of LEDs such that the thermally conductive sheet defining the opening is in physical, thermally conductive contact with an exterior surface of at least one side portion of encapsulating material surrounding a corresponding one of the plurality of LEDs. The thermally conductive sheet carries the plurality of LEDs, and also absorbs thermal energy generated within each of the plurality of LEDs as a result of current flow through the LED circuit and rejects the absorbed thermal energy to an ambient environment surrounding the thermally conductive sheet.09-23-2010
20100237362DISPLAY DEVICE AND PRODUCTION METHOD THEREOF - The present invention provides a display device capable of suppressing deterioration of characteristics of a display element even when a resin is used as a material for a substrate. A display device of the present invention comprises: a resin substrate; and 09-23-2010
20100237360LIGHT EMITTING DIODE AND BACK LIGHT MODULE THEREOF - A light emitting diode (LED) includes an LED chip, a substrate structure, a fluorescence layer, and a lens. The substrate structure includes a cavity. The fluorescence layer covers on the LED chip and is configured in the cavity and covering the LED chip. The lens is installed on the substrate structure. The lens includes a curved lateral wall, a plane at the top, and a conical concave portion at the top center.09-23-2010
20120138967LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An LED package includes: 2n lead frames (n is a natural number); n LED chips provided above the 2n lead frames, one terminal of each of the n LED chips being connected to each of the n lead frames, another terminal of each of the n LED chips being connected to each of other n lead frames; a wire connected between the terminal and one of the lead frames; and a resin body covering the n LED chips, the wire, and a part of each of the 2n lead frames. The each of the 2n lead frames includes; a base having an upper surface and side surfaces, the upper surface and the side surfaces being covered with the resin body; and a plurality of extending portions extending from the base, one of the extending portions having tip surface which is exposed at one side surface of the resin body, another of the extending portions having tip surface which is exposed at another side surface of the resin body, the one side surface and the another side surface being perpendicular to each other, and. An outer shape of the resin body forms an outer shape of the LED package.06-07-2012
20120138969LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING DEVICE WITH THE SAME - The present invention relates to a light emitting device, a light emitting device package, and a lighting device with the same. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a second electrode layer formed on an underside of the light emitting structure connected to the second conductive type semiconductor layer electrically, a first electrode layer in contact with the first conductive type semiconductor layer passed through the second conductive type semiconductor layer and the active layer, and an insulating layer formed between the second electrode layer and the first electrode layer, between the second conductive type semiconductor layer and the first electrode layer, and between the active layer and the first electrode layer.06-07-2012
20120138963PIXEL STRUCTURE - A pixel structure includes a substrate, a scan line, a first data line, a second data line, a first active device, a second active device, a first pixel electrode, and a second pixel electrode. The substrate has a first unit area and a second unit area. The first pixel electrode is disposed in the first unit area and includes a first main portion and first branch portions extending from the first main portion to an edge of the first unit area. The second pixel electrode is disposed in the second unit area and includes a second main portion and second branch portions extending from the second main portion to an edge of the second unit area, wherein at least a part of the first branch portions and at least a part of the second branch portions are asymmetrically arranged at two sides of the second data line.06-07-2012
20120187425ORGANIC EL DISPLAY AND ELECTRONIC APPARATUS - Disclosed herein is an organic EL display device in which pixels each including an organic EL element formed by interposing an organic layer between an anode electrode and a cathode electrode are arranged in a matrix, the organic EL display device including: a common layer configured to be included in the organic EL element and be formed in the organic layer in common to the pixels; and a metal interconnect configured to surround periphery of the anode electrode and be electrically connected to the organic layer, wherein potential of the metal interconnect is set to a potential lower than potential of the anode electrode in a non-light-emission state of the organic EL element.07-26-2012
20120193648CONFORMALLY COATED LIGHT EMITTING DEVICES AND METHODS FOR PROVIDING THE SAME - Methods are disclosed including applying a conformal coating to multiple light emitters. The conformal coating forms in gap areas between adjacent ones of the light emitters. The plurality of light emitters are separated into individual light emitters. The individual light emitters include the conformal coating that extends to a space corresponding to respective gap areas. Light emitting structures are disclosed including a semiconductor light emitting diode (LED) having an active region and a conformal coating including a first portion and a second portion, the first portion corresponding to at least one surface of the LED and the second portion extending from the first portion.08-02-2012
20100140633Methods for Combining Light Emitting Devices in a Package and Packages Including Combined Light Emitting Devices - Methods of forming a light emitting device package assembly include defining a chromaticity region in a two dimensional chromaticity space, and subdividing the defined chromaticity region into at least three chromaticity subregions, providing a plurality of light emitting devices that emit light having a chromaticity that falls within at least one of the defined chromaticity subregions, selecting at least three of the plurality of light emitting devices, each of the three light emitting devices emits light from a different one of the chromaticity subregions, and mounting the selected light emitting devices on a light emitting device package body.06-10-2010
20110006313LIGHT EMITTING APPARATUS - Provided is a light emitting apparatus in which light extraction efficiency can be improved without adversely affecting a functional layer of a light emitting device. The light emitting apparatus includes multiple light emitting devices formed on a substrate, each of the multiple light emitting devices at least including: a reflective layer; a first electrode; the functional layer including an emission layer with an emission region; and a second electrode. In which an optical waveguide including a periodic structure is formed between the emission regions and the optical waveguide includes a surface which is opposite to the substrate and is more repellent to a light emitting material liquid for forming the emission layer than the emission region.01-13-2011
20120126261LENS, LIGHT-EMITTING MODULE, LIGHT-EMITTING ELEMENT PACKAGE, ILLUMINATION DEVICE, DISPLAY DEVICE, AND TELEVISION RECEIVER05-24-2012
20120126260HIGH EFFICACY SEMICONDUCTOR LIGHT EMITTING DEVICES EMPLOYING REMOTE PHOSPHOR CONFIGURATIONS - A semiconductor light emitting apparatus a semiconductor light emitting device configured to emit light inside a hollow shell including wavelength conversion material dispersed therein or thereon. A semiconductor light emitting apparatus according to some embodiments is capable of generating in excess of 230 lumens per watt.05-24-2012
20120126259LIGHT EMITTING DIODE - A light emitting diode, comprising: a transparent substrate; a wiring layer; and a semiconductor light emitting element structure part between the transparent substrate and the wiring layer, the semiconductor light emitting element structure part further comprising: a semiconductor light emitting layer; a transparent conductive layer provided on the wiring layer side of the semiconductor light emitting layer; a transparent insulating film; a metal reflection layer; and a first electrode part and a second electrode part provided on the wiring layer side of the transparent insulating film, to be electrically connected to the wiring layer, wherein the first electrode part is electrically connected to the first semiconductor layer via a first contact part which is provided to pass through the transparent insulating film, and the second electrode part is electrically connected to the second semiconductor layer by a second contact part provided to pass through the transparent insulating film, the transparent conductive layer, the first semiconductor layer, and the active layer.05-24-2012
20120193652LED ARRAY FORMED BY INTERCONNECTED AND SURROUNDED LED CHIPS - A light emitting diode array includes a first light emitting diode having a first electrode and a second light emitting diode having a second electrode. The first and second light emitting diodes are separated. A first polymer layer is positioned between the light emitting diodes. An interconnect located at least partially on the first polymer layer connects the first electrode to the second electrode. A permanent substrate is coupled to the light emitting diodes. The permanent substrate is coupled to the side of the light emitting diodes with the interconnect. A second polymer layer at least partially encapsulates the side of the light emitting diodes opposite the permanent substrate (the side opposite the interconnect).08-02-2012
20100252839DISPLAY AND METHOD OF MANUFACTURING THE SAME - A display includes: a light-emitting element formed by laminating a first electrode layer, an organic layer including a light-emitting layer and a second electrode layer in order on a base; and an auxiliary wiring layer being arranged so as to surround the organic layer and being electrically connected to the second electrode layer, in which the auxiliary wiring layer includes a two-layer configuration including a first conductive layer and a second conductive layer, the first conductive layer has lower contact resistance to the second electrode layer than that of the second conductive layer, the two-layer configuration in the auxiliary wiring layer is formed so that an end surface of the second conductive layer is recessed inward from an end surface of the first conductive layer, thereby a part of a top surface of the first conductive layer is in contact with the second electrode layer.10-07-2010
20100140632Multi-Electrode Light Emitting Device - The invention relates to a broad-band light emitting diode having an active layer composed of a plurality of light emission regions of differing materials for emitting light at a plurality of wavelengths, wherein each of the emission regions of the active layer is electrically controlled by a separate electrode for providing a broad-band emission or optical gain with a multi-point control of its spectral profile.06-10-2010
20100140634SOLID STATE EMITTER PACKAGE INCLUDING RED AND BLUE EMITTERS - A solid state emitter package includes a principally red solid state emitter having peak emissions within 590 nm to 680 nm, a principally blue solid state emitter having peak emissions within 400 nm to 480 nm, and at least one of a common leadframe, common substrate, and common reflector, with the package being devoid of any principally green solid state emitters having peak emissions between 510 nm and 575 nm. A solid state emitter package may include at least one electrically conductive path associated with the solid state emitter package that is not in electrical communication with any solid state emitter of the solid state emitter package, with such electrically conductive path being susceptible to inclusion of a jumper or a control element.06-10-2010
20110108863METHOD FOR MANUFACTURING AN ELECTRO-OPTICAL DEVICE - An object of the present invention is to provide an EL display device having high operation performance and reliability.05-12-2011
20130126915FLEXIBLE ACTIVE DEVICE ARRAY SUBSTRATE AND ORGANIC ELECTROLUMINESCENT DEVICE HAVING THE SAME - A flexible active device array substrate including a flexible substrate, an active device array layer, a barrier layer, and a plurality of pixel electrodes is provided. The active device array layer is disposed on the flexible substrate. The barrier layer covers the active device array layer. The barrier layer includes a plurality of organic material layers and a plurality of inorganic material layers. The organic material layers and the inorganic material layers are alternately stacked on the active device array layer. The pixel electrodes are disposed on the barrier layer, and each of the pixel electrodes is electrically connected to the active device array layer.05-23-2013
20120241772ORGANIC LIGHT-EMITTING DISPLAY APPARATUS - An organic light-emitting display apparatus including: a first substrate; a second substrate disposed to face the first substrate; a first electrode disposed between the first substrate and the second substrate and a second electrode disposed to face the first electrode; and an organic light-emitting layer disposed between the first electrode and the second electrode, wherein at least one of the first electrode and the second electrode is a reflective electrode, and an optical property modification layer having at least one optical property modified from that of the reflective electrode is formed on a surface of the reflective layer.09-27-2012
20120241774DISPLAY MODULE AND MANUFACTURING METHOD THEREOF - A display module and a manufacturing method thereof are provided. The display module comprises a casing, an optical element and a display panel. The casing has an upper portion. The optical element is disposed in the casing. The display panel comprises a color filter substrate and a thin film transistor substrate. The color filter substrate is located within and toward the casing. The thin film transistor substrate is connected to the color filter substrate and connected to the upper portion of the casing.09-27-2012
20130126916PACKAGE FOR MOUNTING ELECTRONIC COMPONENTS, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING THE PACKAGE - A package includes: a leadframe made of conductive material and on which the plurality of electronic components are to be mounted, the leadframe including a first surface and a second surface opposite to the first surface and including a plurality of elongate portions arranged in parallel to each other with a gap interposed between the adjacent elongate portions; a heat sink including a first surface and a second surface opposite to the first surface, wherein the leadframe is disposed above the heat sink such that the second surface of the leadframe faces the first surface of the heat sink; and a resin portion, wherein the leadframe and the heat sink are embedded in the resin portion such that the first surface of the leadframe and the second surface of the heat sink are exposed from the resin portion, respectively.05-23-2013
20110057209LIGHT EMITTING DEVICE - Provided are a light emitting device. The light emitting device comprises a package body, an insulating layer on a surface of the package body, first and second electrode layers on the insulating layer, a light emitting diode disposed on the package body and electrically connected to the first and second electrode layers, a resistor layer connected to the first electrode layer, a first element part in a first doping region within the package body, a second element part in a second doping region within the package body, and a third electrode layer connected to the first element part and the second element part.03-10-2011
20110057208LIGHT EMITTING DISPLAY DEVICE - Provided is an organic light emitting display device sealed maintaining durability by preventing permeation of oxygen and moisture and improving impact resistance. The light emitting display device includes a first substrate; a second substrate disposed facing toward the first substrate; an emission unit disposed between the first substrate and the second substrate and comprising a plurality of light emitting devices; a first sealant disposed between the first substrate and the second substrate, and surrounding the emission unit and combining the first substrate and the second substrate; a first region formed between around a flat portion of the first sealant and a margin of the second substrate; a second region formed between around a corner of the first sealant and a margin of the second substrate; a second sealant disposed in the first region; and a third sealant disposed in the second region.03-10-2011
20110057207WHITE-LIGHT EMITTING DEVICE - An white-light emitting device including a carrier, light emitting diode (LED) chips, and a wavelength converting material is provided. The LED chips are disposed on and electrically connected to the carrier. An equivalent wavelength of the first light emitted from the LED chips and divided into groups is λ. A variation of peak wavelengths of the LED chips in one group is smaller than 5 nm. λ meets an equation:03-10-2011
20100127281BACKLIGHT UNIT EQUIPPED WITH LIGHT EMITTING DIODES - Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.05-27-2010
20100019254SEMICONDUCTOR LIGHT EMITTING DEVICE, LIGHTING MODULE, LIGHTING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT EMITTING DEVICE - An LED bare chip which is one type of a semiconductor light emitting device (01-28-2010
20100032692LIGHT EMITTING DEVICE FOR AC OPERATION - An AC light emitting device, in which a plurality of light emitting cells formed on a substrate are flip-bonded to a submount to be driven under an AC power source is disclosed. The light emitting device comprises a first serial array of light emitting cells, and a second serial array of light emitting cells, wherein the second serial array is connected in reverse parallel to the first serial array. Meanwhile, bonding patterns are formed on a submount substrate, and the light emitting cells of the first and second serial arrays are flip-bonded to the bonding patterns. Further, node connecting patterns are formed on the submount substrate, and connect the bonding patterns such that nodes corresponding to each other provided in the first and second serial arrays are electrically connected to each other. Accordingly, it is possible to provide an AC light emitting device which can prevent overvoltage from being applied to light emitting cells in the array to which reverse voltage is applied by bonding patterns and node connecting patterns formed on a submount substrate, thereby protecting the light emitting cells.02-11-2010
20080230789Light emitting device, method of manufacturing the same and monolithic light emitting diode array - A light emitting device including: at least one light emitting stack including first and second conductivity type semiconductor layers and an active layer disposed there between, the light emitting stack having first and second surfaces and side surfaces interposed between the first and second surfaces; first and second contacts formed on the first and second surface of the light emitting stack, respectively; a first insulating layer formed on the second surface and the side surfaces of the light emitting stack; a conductive layer connected to the second contact and extended along one of the side surfaces of the light emitting stack to have an extension portion adjacent to the first surface; and a substrate structure formed to surround the side surfaces and the second surface of the light emitting stack.09-25-2008
20080230788LIQUID CRYSTAL DISPLAY PANEL - A liquid crystal display (LCD) panel is provided. The LCD panel includes an active device array substrate, an opposite substrate, and a liquid crystal layer. The active device array substrate includes a plurality of pixel units, and each of the pixel units has a reflective area and a transmissive area. The opposite substrate is disposed above the active device array substrate and has a plurality of first alignment protrusions corresponding to the reflective area and a plurality of second alignment protrusions corresponding to the transmissive area. The first and the second alignment protrusions are positioned between the opposite substrate and the active device array substrate. Additionally, a height of the first alignment protrusions is greater than a height of the second alignment protrusions. The liquid crystal layer is disposed between the opposite substrate and the active device array substrate. The LCD panel has a high aperture ratio.09-25-2008
20090309107Nitride Micro Light Emitting Diode With High Brightness and Method For Manufacturing the Same - The present invention relates to a nitride micro light emitting diode (LED) with high brightness and a method of manufacturing the same. The present invention provides a nitride micro LED with high brightness and a method of manufacturing the same, wherein a plurality of micro-sized luminous pillars 12-17-2009
20090224265LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the same - An LED chip package structure with a high-efficiency heat-dissipating substrate includes a substrate unit, an adhesive body, a plurality of LED chips, package bodies and frame layers. The substrate unit has a positive substrate, a negative substrate, and a plurality of bridge substrates separated from each other and disposed between the positive and the negative substrate. The adhesive body is filled between the positive, the negative and the bridge substrates in order to connect and fix the positive substrate, the negative substrate and the bridge substrates together. The LED chips are disposed on the substrate unit and electrically connected between the positive substrate and the negative substrate. The package bodies are respectively covering the LED chips. The frame layers are respectively disposed around the packages bodies in order to form a plurality of light-projecting surfaces on the package bodies, and the light-projecting surfaces correspond to the LED chips.09-10-2009
20100193807LIGHT EMITTING DEVICE - A light emitting device is provided. The light emitting device comprises a substrate, a first lead frame and a second lead frame on the substrate, a first light emitting diode, a heat conductor on the substrate, and a heat transfer pad. The first light emitting diode on the first lead frame is electrically connected to the first lead frame and the second lead frame. The heat conductor is electrically separated from the first lead frame. The heat transfer pad contacts the first lead frame and the heat conductor thermally to connect the first lead frame to the heat conductor.08-05-2010
20090200564Method and Structure for Fabricating Smooth Mirrors for Liquid Crystal on Silicon Devices - A method for fabricating a liquid crystal on silicon display device. The method includes providing a substrate, e.g., silicon wafer. The method includes forming a transistor layer overlying the substrate. Preferably, the transistor layer has a plurality of MOS devices therein. The method includes forming an interlayer dielectric layer (e.g., BPSG, FSG) overlying the transistor layer. The method includes planarizing the interlayer dielectric layer and forming a sacrificial layer (e.g., bottom antireflective coating, polymide, photoresist, polysilicon) overlying the planarized interlayer dielectric layer. The method includes forming a plurality of recessed regions within a portion of the interlayer dielectric layer through the sacrificial layer while other portions of the interlayer dielectric layer remain intact. Preferably, lithographic techniques are used for forming the recessed regions. The method includes forming an aluminum layer (or other reflective layer or multilayers) to fill the recessed regions and overlying remaining portions of the sacrificial layer and selectively removing the aluminum layer overlying portions of the sacrificial layer to form a plurality of electrode regions corresponding to each of the recessed regions.08-13-2009
20090146157LIGHT-EMITTING DIODE PACKAGE - An LED package is provided. The LED package includes a leadframe having a pair of first electrodes and a pair of second electrodes, an LED chip disposed on the leadframe, and an encapsulant encapsulating a portion of the leadframe and the LED chip. The pair of first electrodes and the pair of second electrodes are electrically connected with the LED chip. The pair of first electrodes and the pair of second electrodes are located outside the encapsulant. The encapsulant has a top surface, a bottom surface, a first side surface and a second side surface opposite to the first side surface, wherein the pair of first electrodes extend from the first side surface to the bottom surface, and the pair of second electrodes extend from the second side surface to the bottom surface.06-11-2009
20090189165LIGHT-EMITTING DIODE LIGHT SOURCE - An LED light source comprises a lower substrate having an upper surface which is formed with a groove and covered with an insulating layer in an area outside the groove, wherein the insulating layer is partially covered with a metal layer; an upper substrate disposed on a top of the insulating layer and formed with an opening in an area corresponding to the groove; a plurality of sub-substrates disposed on an inner bottom portion of the groove, wherein each said sub-substrate has a surface covered with a circuit layer, adjacent said sub-substrates are electrically connected to each other at respective adjacent ends thereof by a first metal lead, and each said sub-substrate is provided thereon with a plurality of LED chips, in which each said LED chip is connected by a second metal lead to a corresponding electrical connection point; and a light-transmitting colloid filled in the groove and the opening. The plurality of LED chips are thus integrally packaged in the groove to form the LED light source, which can be easily manufactured while having a small volume and providing high brightness.07-30-2009
20090114928LIGHTING STRUCTURE COMPRISING AT LEAST ONE LIGHT-EMITTING DIODE, METHOD FOR MAKING SAME AND USES THEREOF - A luminous structure based on light-emitting diodes, which includes: a first dielectric element with a substantially plane main face associated with a first electrode; a second dielectric element with a substantially plane main face associated with a second electrode that faces the first electrode and lies in a different plane; at least a first light-emitting diode including a semiconductor chip including, on first and second opposed faces, first and second electrical contacts, the first electrical contact being electrically connected to the first electrode, the second electrical contact being electrically connected to the second electrode, and at least the first element at least partly transmitting radiation within the ultraviolet or in the visible.05-07-2009
20080303038Module Comprising Radiation-Emitting Semiconductor Bodies - A module comprising a regular arrangement of individual radiation-emitting semiconductor bodies (12-11-2008
20090072250CHIP TYPE SEMICONDUCTOR LIGHT EMITTING DEVICE - There is provided a reflective chip type semiconductor light emitting device, which has improved efficiency of taking out light and further improved luminance with the same input, and which emits high luminance light by emitting light uniformly from an area as large as possible and is suitable for lighting apparatuses. A pair of terminal electrodes (03-19-2009
20080272379DISPLAY APPARATUS, METHOD AND LIGHT SOURCE - In accordance with the invention, a display apparatus including a light source is provided, the light source having at least one superluminescent light emitting diode (SLED), the apparatus further having at least one light modulating device arranged in a beam path of a light beam emitted by the light source and operable to emit influenced light upon incidence of the light beam, the light modulating device being operatively connected to an electronic control, the display apparatus further having a projection optics arranged in a beam path of the influenced light.11-06-2008
20080272381ORGANIC LIGHT EMITTING DISPLAY WITH SINGLE CRYSTALLINE SILICON TFT AND METHOD OF FABRICATING THE SAME - Provided is an organic light emitting display, in which a semiconductor circuit unit of 2T-1C structure including a switching transistor and a driving transistor formed of single crystalline silicon is formed on a plastic substrate. A method of fabricating the single crystalline silicon includes: growing a single crystalline silicon layer to a predetermined thickness on a crystal growth plate; depositing a buffer layer on the single crystalline silicon layer; forming a partition layer at a predetermined depth in the single crystalline silicon layer by, e.g., implanting hydrogen ions in the single crystalline silicon layer from an upper portion of an insulating layer; attaching a substrate to the buffer layer; and releasing the partition layer of the single crystalline silicon layer by heating the partition layer from the crystal growth plate to obtain a single crystalline silicon layer of a predetermined thickness on the substrate.11-06-2008
20090108270MASTER, PIXEL ARRAY SUBSTRATE, ELECTRO-OPTICAL DEVICE AND METHODS OF MANUFACTURING THE SAME - A master having a substrate including displaying units and an ESD protection structure including an adjacent first region and a second region is provided. The displaying units have a predetermined-cutting region therebetween. Each displaying unit includes a peripheral circuit region and a display region having pixels. The ESD protection structure disposed on the predetermined-cutting region, located in the peripheral circuit region, and connecting the display region includes a first patterned conductive layer disposed on the first region and having an end away from the predetermined-cutting region, a first patterned dielectric layer disposed on the first patterned conductive layer and the substrate and having a first opening exposing a portion of the first patterned conductive layer, a patterned transparent conductive layer disposed corresponding to the predetermined-cutting region and connecting the first patterned conductive layer, and a second patterned dielectric layer covering the patterned transparent conductive layer and the substrate.04-30-2009
20090108275LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs (04-30-2009
20090108274LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs (04-30-2009
20090108272LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs (04-30-2009
20090108268COMPOSITE LIGHT-EMITTING-DIODE PACKAGING STRUCTURE - A composite light-emitting-diode (LED) packaging structure having oppositely arranged chips comprises a first substrate with a first surface and a second surface, a second substrate with a first surface and a second surface, a first LED chip on the first surface of the first substrate, and a second LED chip on the first surface of the second substrate. The second surface of the second substrate and the second surface of the first substrate are packaged integrally in contact.04-30-2009
20090108273LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs (04-30-2009
20090108267COMPOSITE LIGHT-EMITTING-DIODE PACKAGING STRUCTURE - A composite light-emitting-diode (LED) packaging structure includes an upper LED package structure and a lower LED package structure packaged integrally together. The upper LED package structure includes an upper substrate having a hollow structure and an upper LED transparent chip in the hollow structure and enclosed from top to bottom by a light transmitting filling material. The lower LED package structure includes a lower substrate and a lower LED transparent chip on the lower substrate, packaged in the hollow structure and having a light transmitting protection layer.04-30-2009
20100295066SEMICONDUCTOR SUBSTRATE AND METHODS FOR THE PRODUCTION THEREOF - The invention relates to semiconductor substrates and methods for producing such semiconductor substrates. In this connection, it is the object of the invention to provide semiconductor substrates which can be produced more cost-effectively and with which a high arrangement density as well as good electrical conductivity and closed surfaces can be achieved. In accordance with the invention, an electrically conductive connection is guided from its front side through the substrate up to the rear side. The electrically conductive connection is completely surrounded from the outside. The insulator is formed by an opening which is filled with material. The inner wall is provided with a dielectric coating and/or filled with an electrically insulating or conductive material. The electrically conductive connection is formed with a further opening which is filled with an electrically conductive material and is arranged in the interior of the insulator. The openings are formed with step-free inner walls aligned orthogonally to the front side or tapering continuously in the direction of the rear side.11-25-2010
20100301355Optoelectronic Component and Production Method for an Optoelectronic Component - An optoelectronic component includes a carrier element. At least two elements are arranged in an adjacent fashion on a first side of the carrier element. Each element has at least one optically active region for generating the electromagnetic radiation. The optoelectronic component has an electrically insulating protective layer arranged at least in part on a surface of the at least two adjacent elements which lies opposite the first side. The protective layer, at least in a first region arranged between the at least two adjacent elements, at least predominantly prevents a transmission of the electromagnetic radiation generated by the optically active regions.12-02-2010
20130134447LOW-LIGHT-EMITTING-ANGLE HIGH-LUMINANCE UV LED NAIL LAMP STRUCTURE AND LED LIGHT SOURCE MODULE THEREOF - A low-light-emitting-angle high-luminance ultraviolet (UV) light-emitting diode (LED) nail lamp structure and an LED light source module thereof are provided. The UV LED nail lamp structure includes a housing and an LED light source module. The LED light source module is provided in the housing and has a plurality of UV LEDs, wherein the light-emitting angle of each UV LED ranges between 25° and 80°. The UV LED nail lamp structure features high luminance and enhanced lighting effect.05-30-2013
20130134451Mask Assembly and Organic Light Emitting Diode Display Manufactured Using the Same - A mask assembly includes a frame forming an opening, and a plurality of unit masks which form a plurality of deposition openings, the longitudinal ends of the unit masks being fixed to the frame. At least two adjacent ones of the plurality of unit masks have deposition recesses formed on both sides facing each other. The width of the deposition recesses along a width direction of the unit masks is equal to or greater than the width of the deposition openings along the width direction of the unit masks.05-30-2013
20130134455SEMICONDUCTOR LIGHT EMISSION DEVICE, IMAGE FORMATION APPARATUS AND IMAGE DISPLAY APPARATUS - A semiconductor light emission device includes a substrate, and semiconductor light emission elements mounted on the substrate and each including an anode connection pad and a cathode connection pad. At least one of the anode connection pad and the cathode connection pad has a fine shaped portion. An image formation apparatus and an image display apparatus are described using the semiconductor light emission device.05-30-2013
20110248291METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - An object of the invention is to provide a method for manufacturing semiconductor devices that are flexible in which elements fabricated using a comparatively low-temperature (less than 500° C.) process are separated from a substrate. After a molybdenum film is formed over a glass substrate, a molybdenum oxide film is formed over the molybdenum film, a nonmetal inorganic film and an organic compound film are stacked over the molybdenum oxide film, and elements fabricated by a comparatively low-temperature (less than 500° C.) process are formed using existing manufacturing equipment for large glass substrates, the elements are separated from the glass substrate.10-13-2011
20100301353LED LIGHTING DEVICE HAVING A CONVERSION REFLECTOR - An LED lighting device is provided which may include at least one light-emitting diode and at least one conversion reflector, wherein the conversion reflector is configured to emit at least a portion of light emitted from the light-emitting diode at a converted wavelength, and wherein the conversion reflector covers the at least one light-emitting diode.12-02-2010
20100301354LIGHT EMISSION DEVICE AND DISPLAY DEVICE USING THE SAME - A light emission device includes: a substrate body having a plurality of concave portions recessed into the substrate body and extending along a first direction; a plurality of first electrodes in the plurality of concave portions and extending along the first direction; a plurality of electron emission units on the first electrodes; a plurality of second electrodes on a front surface of the substrate body and extending along a second direction crossing the first electrodes; a plurality of magnetic induction metallic films disposed between the front surface of the substrate body and the second electrodes to contact the front surface and the second electrodes; and a magnetic sheet on a rear surface of the substrate body.12-02-2010
20100308351DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A display device having a base substrate provided with light-emitting devices and terminal electrodes connected thereto; a sealing substrate disposed to face the base substrate; a first resin material between the base substrate and the sealing substrate so as to surround a first region in which the light-emitting devices are provided; and a second resin material between the base substrate and the sealing substrate and is filled in the first region surrounded by the first resin material so as to seal the light-emitting devices.12-09-2010
20100308348LIGHT-EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF - The disclosure provides a light-emitting device comprising a light-emitting epitaxy structure. The light-emitting epitaxy structure has a modulus of a critical reverse voltage not less than 50 volts while the light-emitting epitaxy structure is reverse-biased at a current density of −10 μA/mm12-09-2010
20110127548ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE - An organic light emitting diode (OLED) display device, including: a base substrate, on which OLEDs are formed; and an encapsulation substrate disposed on the base substrate, to cover the OLEDs; and a bonding member connecting the base substrate and the encapsulating substrate. The base substrate and/or the encapsulation substrate include bonding grooves, in which the bonding member is disposed.06-02-2011
20110001148Thin flat solid state light source module - Thin, flat solid state light source device and methods for manufacturing is described. LED chips and their circuit boards are mounted on a thermal conductive substrate. The LED chips are surrounded with a flat layer of reflecting material which may embed the circuit boards. The LED chips and the reflecting layer is then topped with a layer of diffusion material and a layer of cover material.01-06-2011
20100219425LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS CONNECTED IN SERIES AND METHOD OF FABRICATING THE SAME - Disclosed are a light emitting device having a plurality of light emitting cells connected in series and a method of fabricating the same. The light emitting device includes a buffer layer formed on a substrate. A plurality of rod-shaped light emitting cells are located on the buffer layer to be spaced apart from one another. Each of the light emitting cells has an n-layer, an active layer and a p-layer. Meanwhile, wires connect the spaced light emitting cells in series or parallel. Accordingly, arrays of the light emitting cells connected in series are connected to be driven by currents flowing in opposite directions. Thus, there is provided a light emitting device that can be directly driven by an AC power source.09-02-2010
20110108862LIGHT-EMITTING-DIODE ARRAY AND METHOD FOR MANUFACTURING THE SAME - A light-emitting-diode (LED) array is disclosed which comprises a first LED device having a first electrode, a second LED device having a second electrode, wherein the first and the second LED device are formed on the same substrate and separated by a gap, at least one polymer material substantially filling the gap, and an interconnect, formed on top of the at least one polymer material, electrically connecting the first and the second electrode.05-12-2011
20110108861PROCESS FOR ANISOTROPIC ETCHING OF SEMICONDUCTORS - A method is provided for anisotropically etching semiconductor materials such as II-VI and III-V semiconductors. The method involves repeated cycles of plasma sputter etching of semiconductor material with a non-reactive gas through an etch mask, followed by passivation of the side walls by plasma polymerization using a polymer former. Using this procedure small pixels in down-converted light-emitting diode devices can be fabricated.05-12-2011
20100133558FLIP CHIP TYPE LED LIGHTING DEVICE MANUFACTURING METHOD - A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type UP lighting devices.06-03-2010
20100133556LED ARRAY PACKAGE COVERED WITH A HIGHLY THERMAL CONDUCTIVE PLATE - A light source includes a substrate, a light emitting diode on the substrate, and a phosphor layer over the light emitting diode. A plate is on the phosphor layer. An attachment member is coupled to the plate and is configured to conduct heat away from the plate.06-03-2010
20100133555SOLID METAL BLOCK SEMICONDUCTOR LIGHT EMITTING DEVICE MOUNTING SUBSTRATES - A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes an insulating layer and a conductive layer on the insulating layer. The conductive layer is patterned to provide first and second conductive traces that connect to a semiconductor light emitting device. The second metal face may include heat sink fins therein. A flexible film including an optical element, such as a lens, also may be provided, overlying the semiconductor light emitting device.06-03-2010
20100133554SOLID STATE LIGHTING DEVICE - A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an exterior side wall of the package. A recess may be defined in the exterior side wall to receive a bent portion of an electrical lead. A body structure cavity may be bounded by a floor, and side wall portions and end wall portions that are separated by transition wall portions including a curved or segmented upper edge, with different wall portions being disposed at different angles of inclination.06-03-2010
20110241034SIGNAL LIGHT USING PHOSPHOR COATED LEDS - A method for creating an improved signal light is disclosed. For example, the improved signal light includes a housing, one or more first type of light emitting diodes (LEDs) emitting a light energy having a first dominant wavelength deployed in the housing, one or more second type of LEDs emitting a light energy having a second dominant wavelength deployed in the housing, a filter and a mixer. The filter may filter the light energy of the one or more second type of LEDs such that only a third dominant wavelength passes from the one or more second type of LEDs. The mixer may mix the light energy having the first dominant wavelength and the filtered light energy having the third dominant wavelength to form a light energy having a desired fourth dominant wavelength.10-06-2011
20110241032LIGHT-EMITTING DEVICE - A light-emitting device is disclosed capable of reducing the variation of an emission spectrum depending on an angle of viewing a light extraction surface. More particularly, a light-emitting device is disclosed capable of preventing impurities from dispersing from a light-emitting element into a thin film transistor as well as reducing the variation of an emission spectrum depending on an angle of viewing a light extraction surface. The disclosed light-emitting device comprises a substrate; a first insulating layer provided over the substrate; a transistor provided over the first insulating layer; and a second insulating layer having a first opening portion so that the transistor is covered and the substrate is exposed; wherein a light-emitting element is provided inside the first opening portion.10-06-2011
20110018007ELECTRONIC DEVICE, DISPLAY APPARATUS, AND ELECTRONIC DEVICE MANUFACTURING METHOD - Provided is a solution for narrowing of a light emitting region, increasing of leak current at an edge of a functional layer, peeling of the functional layer, or the like caused by non-uniform thickness of the functional layer at the edges thereof. Provided is an electronic device comprising a substrate; a conductive functional layer formed on the substrate; and an edge covering layer that covers edges of the functional layer, wherein the functional layer includes a functional region that is not covered by the edge covering layer. This functional layer may include a non-functional region that is made non-functional by covering the functional layer with the edge covering layer. The edge covering layer may be adhered to the substrate by an adhesion force that is greater than an adhesion force between the substrate and the functional layer.01-27-2011
20110018008Organic light emitting diode display and method for manufacturing the same - An organic light emitting diode display comprises a display substrate including an organic light emitting element, an encapsulation substrate disposed to face the display substrate, a sealant disposed between edges of the display substrate and the encapsulation substrate for bonding and sealing the display substrate and the encapsulation substrate together, a filler filling in a space between the display substrate and the encapsulation substrate, first spacers formed on one surface of the display substrate contacting the filler, and second spacers formed on one surface of the encapsulation substrate contacting the filler. The display substrate and the encapsulation substrate are divided into a dropping area and a spreading area surrounding the dropping area and positioned relatively close to the sealant, and either or both of the first spacers and the second spacers have different shapes in the dropping area and in the spreading area.01-27-2011
20110108859ORGANIC ELECTROLUMINESCENCE ELEMENT AND MANUFACTURING METHOD THEREOF - An organic luminescence includes pixel electrodes. Banks are each generally between adjacent ones of the pixel electrodes. The banks define apertures that each correspond to one of the pixel electrodes. An organic luminescent layer is within each of the apertures, and an upper electrode is above the banks and the organic luminescent layer. At least a portion of a periphery of each of the apertures includes curved portions and cusps. The curved portions are concave, and adjacent ones of the curved portions define each of the cusps.05-12-2011
20110024772ELECTRICAL CONNECTION FOR SEMICONDUCTOR STRUCTURES, METHOD FOR THE PRODUCTION THEREOF, AND USE OF SUCH A CONNECTION IN A LUMINOUS ELEMENT - The invention relates to a method for electrically contacting an arrangement of a plurality of semiconductor structures comprising contact regions therefor and emitting electromagnetic radiation when a voltage is applied thereto. According to said method, a viscous, hardenable material is applied to the arrangement of a plurality of semiconductor structures and hardened to form a material web. The invention also relates to a luminous element comprising a plurality of semiconductor structures (02-03-2011
20090065789LED chip package structure with high-efficiency light-emitting effect and method of packing the same - An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. Each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof.03-12-2009
20110031513WATERPROOF SMD LED MODULE AND METHOD OF MANUFACTURING THE SAME - A surface-mount device (SMD) light emitting diode (LED) module includes a leadframe, an LED chip, a waterproof protective film and a sealing material. The leadframe includes a plurality of leads and the LED chip is fixed on one of the leads. The waterproof protective film covers the LED chip and a portion of the leadframe, and exposes a portion of the leadframe for connecting to a circuit board. The sealing material is also formed on the leadframe to cover the LED chip. In addition, a method of manufacturing the SMD LED module is provided.02-10-2011
20110031514DISPLAY APPARATUS - There is provided a display apparatus that can improve the protective function and light utilization efficiency of organic EL devices and that has a simple structure. The display apparatus includes a plurality of organic EL devices formed on a substrate and a protective layer formed on the organic EL devices. The protective layer includes a first protective layer made of an inorganic material, a second protective layer made of a resin and having a microlens formed therein, and a third protective layer made of an inorganic material.02-10-2011
20110031510ENCAPSULATED LENS STACK - A wafer scale package includes two or more substrates (wafers) that are stacked in an axial direction and a plurality of replicated optical elements. An optical device includes one or more optical elements. The wafer scale package and the device include one or more cavities that house the optical elements, while the end faces of the package or the device are planar and do not have replicated optical elements thereon. The number of double sided substrates is reduced, and design and manufacture of the optical device is improved.02-10-2011
20110031512THIN FILM TRANSISTOR SUBSTRATE - A thin film transistor substrate, capable of being assembled, is attached to a filter substrate to provide a semi-finished liquid crystal display panel. The thin film transistor substrate includes a base substrate with thin film transistors formed thereon, wiring assemblies formed on the substrate and electrically connected to the corresponding thin film transistors selectively, metal sheets formed on the base substrate, a protection layer formed on the thin film transistors, the wiring assemblies, and the metal sheets, and a buffer module formed on the protection layer. The buffer module is positioned above a projection of a cutting line onto the base substrate, and the surplus materials of the filter substrate are removed along the cutting line.02-10-2011
20110031511ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME - An organic light emitting diode display and a method of manufacturing the same are disclosed. The organic light emitting diode display includes a substrate, a first electrode positioned on the substrate, an organic light emitting layer positioned on the first electrode, and a second electrode positioned on the organic light emitting layer. The organic light emitting layer includes an inorganic oxide layer between a light emitting layer and a common layer.02-10-2011
20130153938Light Emitting System - A light emitting assembly including a substrate having electrically conductive pathways that electrically connect a plurality of electrical component dies. The said electrical components include at least one light emitting diode engaged along the substrate to form an interface surface between the light emitting diode and the substrate. Therefore the combined and unified vector of thermal conduction from the light emitting diode dies are perpendicular to the interface surface when the combined and unified vector of thermal conduction crosses the interface surface from the light emitting diode die to the substrate.06-20-2013
20110114969LIGHT EMITTING DIODE CHIP HAVING DISTRIBUTED BRAGG REFLECTOR, METHOD OF FABRICATING THE SAME, AND LIGHT EMITTING DIODE PACKAGE HAVING DISTRIBUTED BRAGG REFLECTOR - An exemplary embodiment of the present invention discloses a light emitting diode chip including a substrate, a light emitting structure arranged on the substrate, the light emitting structure including an active layer arranged between a first conductive-type semiconductor layer and a second conductive-type semiconductor layer, and a distributed Bragg reflector to reflect light emitted from the light emitting structure. The distributed Bragg reflector has a reflectivity of at least 90% for light of a first wavelength in a blue wavelength range, light of a second wavelength in a green wavelength range, and light of a third wavelength in a red wavelength range.05-19-2011
20110114970LIGHT EMITTING DIODE STRUCTURE, A LAMP DEVICE AND A METHOD OF FORMING A LIGHT EMITTING DIODE STRUCTURE - A light emitting diode structure, a lamp device and a method of forming a light emitting diode structure are provided. The structure has a substrate coated with a first reflective material; an electrode coated with a second reflective material, one or more layers of light emitting material, the layers disposed between the substrate and electrode; wherein in use, the first reflective material and second reflective material reflects light out of the structure via at least one light emitting surface and in a direction away from the electrode.05-19-2011
20130153939ORGANIC LIGHT EMITTING DISPLAY DEVICE WITH ENHANCED EMITTING PROPERTY AND PREPARATION METHOD THEREOF - An organic light emitting display device in which an upper electrode and power supply lines are connected through through-holes such that charges can be smoothly supplied to the upper electrode of the organic light emitting display device, making it possible to improve light emitting efficiency.06-20-2013
20130153940ORGANIC ELECTRO-LUMINESCENCE DISPLAY DEVICE - An organic light emitting diode (OLED) display is disclosed. The display has high contrast and displays good black color by removing or decreasing influence of ambient light. The display includes an organic electro-luminescence emission layer and a plurality of pixels respectively including an active lighting layer disposed on the organic electro-luminescence emission layer. In the pixels, when the organic electro-luminescence emission layer emits light, light transmittance of the active lighting layer is decreased.06-20-2013
20100171130Semiconductor device and fabrication method - A semiconductor device comprising a plurality of regions of semiconductor material forming a junction at an interface there-between, the junction including a depletion region having a width which varies spatially in at least one direction along the depletion region. Without limitation, the spatial variation in depletion region width is provided by ionised dopants having a concentration which varies spatially along said at least one direction. Alternatively, or in addition, the spatial variation in depletion region width is achieved by varying the thickness of the region(s) of semiconductor spatially along said at least one direction, for example by creating a plurality of cells within said region(s) devoid of said semiconductor material. A method of fabricating a semiconductor device comprising the step of varying the width of the depletion region spatially there-within in at least one direction along the depletion region.07-08-2010
20110114972OPTICAL SEMICONDUCTOR SEALING RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE USING SAME - An optical semiconductor sealing resin composition includes a rubber-particle-dispersed epoxy resin (A) containing an alicyclic epoxy resin and, dispersed therein, rubber particles, in which the rubber particles comprise a polymer including one or more (meth)acrylic esters as essential monomeric components and have a hydroxyl group and/or a carboxyl group in a surface layer thereof as a functional group capable of reacting with the alicyclic epoxy resin, the rubber particles have an average particle diameter of 10 nm to 500 nm and a maximum particle diameter of 50 nm to 1000 nm, and the difference in refractive index between the rubber particles and a cured article obtained from the optical semiconductor sealing resin composition is within ±0.02. The optical semiconductor sealing resin composition can give a cured article which exhibits excellent cracking resistance while maintaining satisfactory thermal stability and high transparency.05-19-2011
20110210346LED MODULE - An LED module includes at least two LED package units and at least one connecting unit. Each LED package unit includes at least one first engaging portion, at least one first conductive portion, and at least one LED chip connected electrically to the first engaging portion. The connecting unit includes at least two second engaging portions, and at least one second conductive portion having two opposite end sections extending respectively to the second engaging portions. When the second engaging portions of the connecting unit engaged with the first engaging portions of the LED package units, respectively, the end sections of the second conductive portion contact electrically and respectively the corresponding first conductive portions so as to connect electrically the LED chips of the LED package units.09-01-2011
20090294781ARRAY SUBSTRATE FOR LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - A method of fabricating an array substrate for a liquid crystal display device includes: forming an initial photoresist (PR) pattern on a metallic material layer; etching the metallic material layer using the initial PR pattern as an etching mask to form the data line and a metallic material pattern, wherein the initial PR pattern is disposed on the data line; performing a first ashing process onto the initial PR pattern to partially remove the initial PR pattern so as to form a first ashed PR pattern, the first ashed PR pattern having a smaller width and a smaller thickness than the initial PR pattern such that end portions of the data line are exposed by the first ashed PR pattern; etching the intrinsic amorphous silicon layer and the impurity-doped amorphous silicon layer by a first dry-etching process; forming a source electrode and a drain electrode on the substrate.12-03-2009
20100219423Light Receiving or Light Emitting Semiconductor Module - Multiple semiconductor elements in a semiconductor module in which multiple spherical light receiving or emitting semiconductor elements are installed can easily be retrieved, reused, or repaired. In a semiconductor module 09-02-2010
20100219424ORGANIC EL DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - An organic EL display panel is provided which includes: a substrate which includes a plurality of luminescent regions which are arranged side by side in a specific direction and run in parallel to one another; a bank formed over the substrate, the bank defining a plurality of coating regions in each of the luminescent regions, the coating regions being aligned in a row along the long axis of the luminescent region; and a pixel electrode provided in each of the coating regions, the pixel electrode having a long axis which is in parallel with the long axis of the luminescent region, wherein, in each of the luminescent regions, the coating region positioned at a lengthwise end of the luminescent region is larger in size than the coating region positioned at a lengthwise center of the luminescent region.09-02-2010
20110241028LIGHT EMITTING DEVICE AND LIGHT UNIT HAVING THE SAME - Provided are a light emitting device and a light unit including the same. The light emitting device includes a body, a first cavity disposed at a center of the body, the first cavity having an opened upper side, a second cavity disposed around an upper portion of the body, the second cavity being spaced from the first cavity, first and second lead electrodes disposed within the first cavity, a light emitting chip disposed on at least one of the first and second lead electrodes, and a first molding member in the first cavity. The second cavity has an upper width grater than a lower width thereof and a side surface of the second cavity is formed of a vertical side surface with respect to a top surface of the body.10-06-2011
20110241027Organic EL Element, Image Display Device and Method for Manufacturing the Same - One embodiment of the present invention is an organic EL element, including a substrate, a first electrode having a pixel region, the first electrode formed on the substrate, a multi-step partition wall, including a first partition wall formed on the substrate, the first partition wall sectioning the first substrate and having an inverse tapered shape, and a second partition wall formed on the first partition wall, the second partition wall having a bottom part which is narrower than a top part of the first partition wall, a light emitting medium layer, including a first light emitting medium layer formed on the pixel region, the first partition wall and the second partition wall, the first light emitting medium layer made of an inorganic material, and an organic light emitting layer on the first light emitting medium layer, and a second electrode formed on the light emitting medium layer, wherein the first light emitting medium layer is formed on the first electrode and the multi-layer partition wall.10-06-2011
20110241026LIGHT-EMITTING DIODE CHIP AND PACKAGE STRUCTURE THEREOF - A light-emitting diode chip includes a first electrode and a metal composite layer. The metal composite layer is disposed on the first electrode and has a nickel layer. Since the metal composite layer is disposed on the first electrode, the yield of the wedge bonding can be increased, and the chip damage can be avoided.10-06-2011
20110241025LIGHTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A lighting device including a metal substrate to prevent temperature rise of LED chip is offered. The lighting device includes the metal substrate, an anode or cathode electrode of the LED chip disposed on the metal substrate, brazing materials connecting the LED chip and the metal substrate, and a groove formed in the anode or cathode electrode. Forming the groove can prevent an occurrence of a crack in the brazing materials.10-06-2011
20110241024LIGHT EMITTING DIODE HAVING A WAVELENGTH SHIFT LAYER AND METHOD OF MANUFACTURE - Embodiments of the present invention provide an LED having a Wavelength Shift Layer (WSL) and method of manufacture. Specifically, under embodiment of the present invention, a WSL layer is applied over an LED chip. The WSL itself typically comprises two layers: an adhesion layer applied over a set (at least one) of LED chips, and a conformal coating over the adhesion layer. The adhesion layer provides improved adhesive effect of the conformal coating to the LED chip(s). The conformal coating is comprised of a particular phosphor ratio that is determined based on a wavelength measurement of the underlying LED chip(s). Specifically, under the present invention, a wavelength of a light output by an LED chip(s) (e.g., blue or ultra-violet (UV)) is measured (e.g., at the wafer level). Typically, the phosphor ratio of is comprised of at least one of the following colors: yellow, green, or red. Regardless, this conformal coating is applied over a glue layer that itself is applied over the LED chip.10-06-2011
20090321753Light Emitting Device and Method of Manufacturing the Same - There is provided a light emitting device in which low power consumption can be realized even in the case of a large screen. The surface of a source signal line or a power supply line in a pixel portion is plated to reduce a resistance of a wiring. The source signal line in the pixel portion is manufactured by a step different from a source signal line in a driver circuit portion. The power supply line in the pixel portion is manufactured by a step different from a power supply line led on a substrate. A terminal is similarly plated to made the resistance reduction. It is desirable that a wiring before plating is made of the same material as a gate electrode and the surface of the wiring is plated to form the source signal line or the power supply line.12-31-2009
20110084287Organic light emitting diode display and method for manufacturing the same - An organic light emitting diode display includes a display substrate including organic light emitting diodes and a pixel defining layer having openings for defining respective light emitting regions of the organic light emitting diodes, an encapsulation substrate disposed to face the display substrate, a sealant disposed along the edge of the encapsulation substrate and bonding and sealing the display substrate and the encapsulation substrate together, and a filling material for filling the space between the display substrate and the encapsulation substrate. The pixel defining layer is divided into a plurality of deposit regions having a relatively small height and that are uniformly distributed, and a diffusion region surrounding the plurality of deposit regions and having a larger height than that of the plurality of deposit regions.04-14-2011
20110210349LED MULTI-CHIP BONDING DIE AND LIGHT STRIP USING THE SAME - An LED multi-chip bonding die (09-01-2011
20110210344BARRIER FILM COMPOSITE, DISPLAY APPARATUS INCLUDING THE BARRIER FILM COMPOSITE, AND METHOD OF MANUFACTURING DISPLAY APPARATUS INCLUDING THE BARRIER FILM COMPOSITE - A barrier film composite includes a heat-shrinkable layer having a conformable surface conforming to a surface shape of an object in contact with the heat-shrinkable layer, and a flat surface disposed opposite to the conformable surface; and a barrier layer having a smaller thickness than the heat-shrinkable layer and disposed flat on the flat surface of the heat-shrinkable layer.09-01-2011
20100012954Vertical III-Nitride Light Emitting Diodes on Patterned Substrates with Embedded Bottom Electrodes - A light emitting diode (LED) device is presented. The LED device includes a substrate, a layered LED structure, and an embedded bottom electrode. The layered LED structure includes a buffer/nucleation layer disposed on the substrate, an active layer, and a top-side contact. A first-contact III-nitride layer is interposed between the buffer/nucleation layer and the active layer. A second-contact III-nitride layer is interposed between the active well layer and the top-side contact. A bottom electrode extends through the substrate, through the buffer/nucleation layer and terminates within the first-contact III-nitride layer.01-21-2010
20100258822SEMICONDUCTOR LIGHT-EMITTING DEVICE ASSEMBLY MANUFACTURING METHOD, SEMICONDUCTOR LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, AND IMAGE DISPLAY DEVICE - A method of manufacturing a semiconductor light-emitting device assembly includes providing light-emitting device portions on a light-emitting device production substrate so as to be separated from each other, each of the light-emitting device portions including a laminated structure, in which a first compound semiconductor layer, an active layer, and a second compound semiconductor layer are sequentially laminated, and a second electrode provided on the second compound semiconductor layer; forming an insulating layer on an entire surface so as to have an opening portion in which a top central portion of the second electrode is exposed; providing an extraction electrode to each light-emitting device portion so as to be patterned to extend from a top surface of the second electrode to the insulating layer; and forming an adhesive layer so as to cover an entire surface and attaching a support substrate using the adhesive layer.10-14-2010
20110089440LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME - Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a first chip structure including a first reflective layer and a first light emitting structure having a plurality of compound semiconductor layers on the first reflective layer; a second chip structure bonded onto the first chip structure and including a second reflective layer and a second light emitting structure having a plurality of compound semiconductor layers on the second reflective layer; and an electrode on the second chip structure.04-21-2011
20110095310SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (04-28-2011
20090039359LIGHT EMITTING DIODE WITH IMPROVED CURRENT SPREADING PERFORMANCE - Disclosed is a light emitting diode (LED) for enhancing the current spreading performance. The LED includes a plurality of contact holes exposing an N-type semiconductor layer through a P-type semiconductor layer and an active layer, and a connection pattern electrically connecting exposed portions of the N-type semiconductor layer through the contact holes, thereby enhancing current spreading in the N-type semiconductor layer. In addition, disclosed is an LED including a plurality of light emitting cells spaced apart from one another on an N-type semiconductor layer and an N-contact layer between the light emitting cells. A plurality of light emitting cells are employed in the LED, so that current can be spread in the LED.02-12-2009
20100012955Light-Emitting Diode Arrangement and Method for Producing the Same - A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side (01-21-2010
20100038655Reflective Layer for Light-Emitting Diodes - A system and method for manufacturing a light-generating device is described. A preferred embodiment comprises a plurality of LEDs formed on a substrate. Each LED preferably has spacers along the sidewalls of the LED, and a reflective surface is formed on the substrate between the LEDs. The reflective surface is preferably located lower than the active layer of the individual LEDs.02-18-2010
20100038657LIGHTING APPARATUS - A lighting apparatus is provided with a plurality of light-emitting devices, a substrate, a blind member, and a reflector. The reflector is formed with a plurality of reflective surfaces corresponding to the light-emitting devices, individually. The shielding angle at which light emitted from that one of the light-emitting devices which is located on the outermost periphery is intercepted by the reflective surface corresponding to the outermost light-emitting device is greater than shielding angles at which light emitted from the light-emitting devices located inside the outermost light-emitting device is intercepted by the reflective surfaces corresponding to the inside light-emitting devices.02-18-2010
20090032826MULTI-CHIP LIGHT EMITTING DIODE PACKAGE - A multi-chip light emitting diode (LED) package having a plurality of LED chips, a substrate, and a plurality of conductive paste layers is provided. The substrate has at least two hollow areas with conductive patterns formed on a bottom surface thereon. The conductive paste layers are pasted on the bottom surfaces of the hollow areas respectively for fixing the LED chips and having the LED chips electrically connected to the conductive patterns. The LED chips in the different hollow areas are electrically connected in serial.02-05-2009
20090032825Structure Of LED-Based Display Module And Method For Manufacturing The Same - The display module contains a circuit board, a heat-resistant and transparent protective layer, and a transparent and waterproofing enclosing member. The circuit board has a number of LED devices configured on the front surface and at least a terminal on the back surface. The LED devices are electrically and signally wired to the terminal so that electricity and video signals are fed to the LED devices via the terminal. The protective layer is coated on the outer surfaces of the LED devices and the circuit board so as to protect the wiring, the soldering contacts, and the electrical components of the circuit board from being damaged by the high temperature during the process of forming the enclosing member. The enclosing member wraps the circuit board and the LED devices entirely within and exposes only the terminal.02-05-2009
20100065862Light Emitting, Photovoltaic Or Other Electronic Apparatus and System - The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus comprising photovoltaic diodes, which may be created through a printing process, using a semiconductor or other substrate particle ink or suspension and using a lens particle ink or suspension. An exemplary apparatus comprises a base; at least one first conductor; a plurality of substantially spherical or optically resonant diodes coupled to the at least one first conductor; at least one second conductor coupled to the plurality of diodes; and a plurality of substantially spherical lenses suspended in a polymer attached or deposited over the diodes. The lenses and the suspending polymer have different indices of refraction. In some embodiments, the lenses and diodes have a ratio of mean diameters or lengths between about 10:1 and 2:1. The diodes may be LEDs or photovoltaic diodes, and in some embodiments, have a junction formed at least partially as a hemispherical shell or cap.03-18-2010
20100065861LIGHT-EMITTING DEVICE - A light-emitting device 03-18-2010
20110101385PACKAGED SEMICONDUCTOR LIGHT EMITTING DEVICES HAVING MULTIPLE OPTICAL ELEMENTS AND METHODS OF FORMING THE SAME - Methods of packaging a semiconductor light emitting device include providing a substrate having the semiconductor light emitting device on a front face thereof. A first optical element is formed from a first material on the front face proximate the semiconductor light emitting device but not covering the semiconductor light emitting device and a second optical element is formed from a second material, different from the first material, over the semiconductor light emitting device and the first optical element. Packaged semiconductor light emitting devices are also provided.05-05-2011
20110101384LIGHT-EMITTING DEVICE, METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE, AND ILLUMINATION DEVICE - According to one embodiment, a light-emitting device includes a substrate, a plurality of pads and a plurality of light-emitting elements. The pads has electric conductance, and are arranged on the substrate. A reflecting layer which is formed by electroplating is provided on a surface of each of the pads. The light-emitting elements are mounted on the pads. A depressed part is left on the substrate. The depressed part is formed on the substrate by removing a pattern on the substrate, by which the pads are electrically connected.05-05-2011
20110248288ELECTRO-LUMINESCENT DISPLAY PANEL - An electro-luminescent display panel including an active device array substrate, a pixel definition layer, electro-luminescent devices, an electrode layer and a protective layer is provided. The substrate includes pixel electrodes. The pixel definition layer on the substrate includes openings, each exposing the corresponding one of the pixel electrodes. The electro-luminescent devices are in the openings. Each electro-luminescent device layer is on the corresponding one of the pixel electrode. The electrode layer is on the pixel definition layer and the electro-luminescent devices. The protective layer including a buffer layer, a first and a second encapsulation films is on the electrode layer. The buffer layer covers the pixel definition layer and the electro-luminescent devices. The first encapsulation film partially covers the buffer layer. The first encapsulation film includes island patterns on the pixel electrodes. The second encapsulation film covers the buffer layer and the first encapsulation film.10-13-2011
20110062461ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE - An organic EL display device of active matrix type wherein insulated-gate field effect transistors formed on a single-crystal semiconductor substrate are overlaid with an organic EL layer; characterized in that the single-crystal semiconductor substrate (03-17-2011
20110062458LIGHT EMITTING PANEL AND MANUFACTURING METHOD OF LIGHT EMITTING PANEL - Disclosed is a light emitting panel including: a light blocking section formed above a substrate, the light blocking section including an opening; a first electrode formed above the opening of the light blocking section; a dividing wall including an opening so that at least a portion of the first electrode is exposed, the opening corresponding to a shape of the opening of the light blocking section; a second electrode formed above the first electrode; and a carrier transport layer composed of at least one layer formed between the first electrode and the second electrode.03-17-2011
20110062456LIGHT-EMITTING DEVICE - This disclosure discloses a light-emitting device. The light-emitting device comprises: a substrate; and a first light-emitting unit comprising a plurality of light-emitting diodes electrically connected to each other on the substrate. A first light-emitting diode in the first light-emitting unit comprises a first semiconductor layer with a first conductivity-type, a second semiconductor layer with a second conductivity-type, and a light-emitting stack formed between the first and second semiconductor layers. The first light-emitting diode in the first light-emitting unit further comprises a first connecting layer on the first semiconductor layer for electrically connecting to a second light-emitting diode in the first light-emitting unit; a second connecting layer, separated from the first connecting layer, formed on the first semiconductor layer; and a third connecting layer on the second semiconductor layer for electrically connecting to a third light-emitting diode in the first light-emitting unit.03-17-2011
20110062454LIGHT EMITTING DEVICE HAVING REMOTELY LOCATED LIGHT SCATTERING MATERIAL - A light emitting device with a remotely located light scattering material which improves color mixing property is provided. The light emitting device includes a substrate defining a cavity; one or more light emitting elements bonded to the substrate and positioned in the cavity; at least one first layer covering the one or more light emitting elements, at least part of the at least one first layer within the cavity, wherein the at least one first layer has a refractive index less than the refractive index of the one or more light emitting elements; and at least one second layer including light scattering material disposed on the at least one first layer, wherein the refractive index of the first layer is less than or equal to the refractive index of the second layer.03-17-2011
20120119232ARRAY SUBSTRATE AND A MANUFACTURING METHOD THEREOF - An embodiment of the invention provides a method for manufacturing an array substrate, wherein the procedure for forming a data line, an active layer with a channel, a source electrode, a drain electrode and a pixel electrode comprises applying a photoresist on a data line metal thin film and performing exposure and development processes by using a multi-tone mask so as to form a photoresist pattern including a third thickness region, a second thickness region and a first thickness region whose thicknesses are successively increased, the third thickness region at least corresponding to the pixel electrode, the second thickness region corresponding to the data line, the active layer, the source electrode and the drain electrode, and the first thickness region corresponding to the other regions.05-17-2012
20120119237PIXELATED LED - A pixelated light emitting diode (LED) and a method for pixelating an LED are described. The pixelated LED includes two or more monolithically integrated electroluminescent elements disposed adjacent each other on a substrate, wherein at least a portion of each electroluminescent element immediately adjacent the substrate includes an inverted truncated pyramidal shape. The method for pixelating an LED includes selectively removing material from the major surface of an LED to a depth below the emissive region, thereby forming an array of inverted truncated pyramid shapes. The efficiency of the pixelated LEDs can be improved by incorporating the truncated pyramidal shape. Additionally, the crosstalk between adjacent LED pixels can be reduced by incorporating the truncated pyramidal shape.05-17-2012
20120119236Light-Emitting Diodes on Concave Texture Substrate - A semiconductor device having light-emitting diodes (LEDs) formed on a concave textured substrate is provided. A substrate is patterned and etched to form recesses. A separation layer is formed along the bottom of the recesses. An LED structure is formed along the sidewalls and, optionally, along the surface of the substrate between adjacent recesses. In these embodiments, the surface area of the LED structure is increased as compared to a planar surface. In another embodiment, the LED structure is formed within the recesses such that the bottom contact layer is non-conformal to the topology of the recesses. In these embodiments, the recesses in a silicon substrate result in a cubic structure in the bottom contact layer, such as an n-GaN layer, which has a non-polar characteristic and exhibits higher external quantum efficiency.05-17-2012
20120119235DISPLAY PANEL APPARATUS AND METHOD OF FABRICATING DISPLAY PANEL APPARATUS - A display panel apparatus includes a planarizing film formed on a substrate, at least one pixel including a lower electrode; an organic EL layer; and an upper electrode which are formed above the planarizing film; an auxiliary electrode electrically connected to the upper electrode which is the opposite to the lower electrode; a display section including a plurality of the pixels; an electrode plate electrically connected to the auxiliary electrode and arranged to cover the planarizing film outside the display section, and the electrode plate has a hole exposing a part of a surface of the planarizing film. Furthermore, the display panel apparatus also includes a hole injection layer which is an inorganic material layer made of an inorganic material and covering the hole.05-17-2012
20120119234PHOSPHOR, METHOD OF MANUFACTURING THE SAME, AND LIGHT-EMITTING DEVICE - The present invention is a phosphor expressed by the general formula (A05-17-2012
20120119233METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND OPTOELECTRONIC SEMICONDUCTOR COMPONENT - A method for producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier; shaping a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body covers all side areas of the at least one optoelectronic semiconductor chip, and wherein a surface facing away from the carrier at the top side and/or a surface facing the carrier at the underside of the at least one semiconductor chip remains substantially free of the shaped body or is exposed, and removing the carrier.05-17-2012
20120119231LED PACKAGE STRUCTURE WITH A DEPOSITED-TYPE PHOSPHOR LAYER AND METHOD FOR MAKING THE SAME - An LED package structure with a deposited-type phosphor layer includes a substrate unit, a light-emitting unit and a package unit. The substrate unit includes at least one circuit substrate. The light-emitting unit includes a plurality of LED chips disposed on and electrically connected to the at least one circuit substrate. The package unit includes at least one package resin body formed by a mold structure. The at least one package resin body is formed on the at least one circuit substrate to cover the LED chips, and the at least one package resin body includes a continuous phosphor layer formed therein and deposited on outer surfaces of the LED chips by centrifugal force. Hence, the instant disclosure provides the continuous phosphor layer with the deposited phosphor powders for covering the outer surfaces of the LED chips, thus the light-emitting efficiency of the LED package structure can be increased actually.05-17-2012
20120119230LED DEVICE HAVING A TILTED PEAK EMISSION AND AN LED DISPLAY INCLUDING SUCH DEVICES - An LED package and a lead frame include a reflector cup having a bottom surface with an LED asymmetrically positioned on the bottom surface and a wall surface inclined relative to the bottom surface and defining an opening at an upper end thereof. The bottom surface of the reflector cup has a first axial dimension along a first axis and a second axial dimension along a second axis, orthogonal to the first axis. A display having an asymmetrical FFP and asymmetrical screen curve includes an array of the LED modules including a plurality of LED packages. At least some of the LED packages include a dome-shaped lens asymmetrically positioned with respect to a geometric center of the bottom surface of the reflector cup.05-17-2012
20120119229THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF - A thin film transistor array panel includes: a substrate including a display area and a drive region in which a driving chip for transmitting a driving signal to the pixels is located; a gate line in the display area; a storage electrode line; a gate driving pad coupled to the driving chip; a gate insulating layer; a first semiconductor layer on the gate insulating layer and overlapped with a gate electrode protruding from the gate line; a second semiconductor layer formed on the gate insulating layer and overlapped with a sustain electrode protruding from the storage electrode line; a data line crossing the gate line in an insulated manner and a drain electrode separated from the data line; and a pixel electrode coupled to the drain electrode, and the drain electrode comprises a drain bar facing the source electrode, and a drain extender overlapped with the second semiconductor layer.05-17-2012
20130161655WHITE LED ASSEMBLY WITH LED STRING AND INTERMEDIATE NODE SUBSTRATE TERMINALS - A white LED assembly includes a string of series-connected blue LED dice mounted on a substrate. The substrate has a plurality of substrate terminals. A first of the substrate terminals is coupled to be a part of first end node of the string. A second of the substrate terminals is coupled to be a part of an intermediate node of the string. A third of the substrate terminals is coupled to be a part of a second end node of the string. Other substrate terminals may be provided and coupled to be parts of corresponding other intermediate nodes of the string. A single contiguous amount of phosphor covers all the LED dice, but does not cover any of the substrate terminals. In one example, the amount of phosphor contacts the substrate and has a circular periphery. All the LEDs are mounted to the substrate within the circular periphery.06-27-2013
20110248290Methods and Apparatus for LED Lighting with Heat Spreading in Illumintion Gaps - Techniques for light emitting diode (LED) lighting with heat spreading in illumination gaps. Inexpensive structural aluminum may be suitably employed to form a passive heat spreading mount for plural LEDs whose illumination collectively combines to provide the light needed by a particular lighting fixture, such as a pendant chandelier, by way of example, by angling fins of the passive heat spreading mount to correspond to illumination gaps of the LEDs.10-13-2011
20100258820MANUFACTURING METHOD FOR CONTACT PADS OF A THIN FILM TRANSISTOR ARRAY PANEL, AND A THIN FILM TRANSISTOR ARRAY PANEL HAVING SUCH CONTACT PADS - A thin film transistor array panel includes a first insulation substrate, a plurality of data wires formed on the first insulation substrate and extending in a first direction, a data pad region formed on the first insulation substrate and having plural ones of the data wires extending therefrom, and an organic layer formed on the data wires, where the organic layer has a greater thickness where it is disposed over the data wires than the thickness it has between the data wires. The surface of the organic layer of the data pad region includes minute slit patterns that extend parallel to the first direction of the data wires, and the data wires have line boundaries of a zigzag shape.10-14-2010
20100244056Addressable Or Static Light Emitting, Power Generating Or Other Electronic Apparatus - The present invention provides an addressable or static electronic apparatus, such as a light emitting display or a power generating apparatus. An exemplary apparatus comprises a substrate having a plurality of cavities; a plurality of first conductors coupled to the substrate and at least partially within the cavities, with the plurality of first conductors having a first and substantially parallel orientation; a plurality of light emitting diodes, photovoltaic diodes or other electronic components coupled to the plurality of first conductors and having a second orientation substantially normal to the first orientation; and a plurality of substantially optically transmissive second conductors coupled to the plurality of diodes and having a third orientation substantially normal to the second orientation and substantially perpendicular to the first orientation. In an exemplary method, the plurality of electronic components in a suspending medium are deposited within the plurality of cavities, and the plurality of electronic components are oriented using an applied field, followed by a bonding of the plurality of electronic components to the plurality of first conductors.09-30-2010
20100264430ORGANIC LIGHT EMITTING DEVICE - Provided is an organic light emitting device having a simple structure and enabling cost reduction. An organic light emitting device 10-21-2010
20110175117COATED LIGHT EMITTING DEVICE AND METHOD FOR COATING THEREOF - The present invention relates to the field of a light emitting device (07-21-2011
20090001388Semiconductor Display Device and Method for Manufacturing The Same - To provide a semiconductor display device capable of being easily manufactured and a method for manufacturing the semiconductor display device.01-01-2009
20120175645ORGANIC EL DISPLAY DEVICE AND ELECTRONIC APPARATUS - An organic EL display device includes organic EL elements provided for respective pixels. Each organic EL element has first and second electrodes between which an organic layer is provided and has a region that contributes to light emission and a region that does not contribute to light emission. A capacitor is formed between the first and second electrodes in the region that does not contribute to light emission and is used as a capacitance element in a drive circuit for the organic EL element.07-12-2012
20080315218Cubic illuminators - An exemplary illuminator includes a first electrode, a second electrode, and a light-emitting chip. The light-emitting chip includes light-emitting layers arranged three-dimensionally. The first and second electrodes are configured for providing different voltages to the light-emitting chip, and the light-emitting chip is capable of emitting light simultaneously along all dimensional axes.12-25-2008
20090166646LIGHT-EMITTING ELEMENT HAVING PNPN-STRUCTURE AND LIGHT-EMITTING ELEMENT ARRAY - A light-emitting element including a light-emitting thyristor and a Schottky barrier diode is provided. A Schottky barrier diode is formed by contacting a metal terminal to a gate layer of a three-terminal light-emitting thyristor consisting of a PNPN-structure. A self-scanning light-emitting element array may be driven at 3.0V by using such a Schottky barrier diode as a coupling diode of a diode-coupled self-scanning light-emitting element array.07-02-2009
20080315217Semiconductor Light Source and Method of Producing Light of a Desired Color Point - This invention relates to a solid-state light source (12-25-2008
20120199853Self-Light-Emitting Device and Method of Manufacturing the Same - Failure light emission of an EL element due to failure film formation of an organic EL material in an electrode hole 08-09-2012
20090050909LIGHT-EMITTING DIODE APPARATUS AND MANUFACTURING METHOD THEREOF - A light-emitting diode (LED) apparatus includes an epitaxial layer and an etching mask layer. The epitaxial layer has a first semiconductor layer, an active layer and a second semiconductor layer in sequence. The etching mask layer is disposed on the epitaxial layer and has a plurality of hollows. The second semiconductor layer includes a roughing structure.02-26-2009
20110156065SEMICONDUCTOR LIGHT EMITTING ELEMENT AND SEMICONDUCTOR LIGHT EMITTING DEVICE - Provided is a semiconductor light emitting element wherein generation of an open failure of the light emitting device can be eliminated by ensuring a current pathway when disconnection is generated in a transparent electrode layer. A semiconductor light emitting element (06-30-2011
20090020768BURIED CONTACT DEVICES FOR NITRIDE-BASED FILMS AND MANUFACTURE THEREOF - A semiconductor device comprising: a substrate; a first contact; a first layer of doped semiconductor material deposited on the substrate; a semiconductor junction region deposited on the first layer; a second layer of doped semiconductor material deposited on the junction region, the second layer having opposite semiconductor doping polarity to that of the first layer; and a second contact; wherein the second contact is in electrical communication with the second layer and the first contact is embedded within the semiconductor device between the substrate and the junction region and is in electrical communication with the first layer; and processes for manufacture of an embedded contact semiconductor device.01-22-2009
20110254025Light-Emitting Diode Packaging Structure and Module and Assembling Method Thereof - A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first and second electrode leads, the second electrode lead having first and second contact surfaces on an outer edge of the second electrode lead. The first metal plate includes at least one clamping portion that clamps and fixes the first electrode lead on the first metal plate. The second metal plate includes at least first and second clamping portions. The first contact surface of the second electrode lead contacts the first clamping portion, and the second contact surface of the second electrode lead contacts the second clamping portion, such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to a primary surface of the second metal plate on which the light-emitting diodes is mounted.10-20-2011
20110254023LUMINAIRE AND LIGHT-EMITTING APPARATUS WITH LIGHT-EMITTING DEVICE - According to one embodiment, the light-emitting apparatus is provided with a substrate, a plurality of light-emitting devices, and a phosphor layer. The plurality of light-emitting devices are mounted on the substrate. The phosphor layer is formed of a translucent resin containing a phosphor and includes a phosphor portion that is formed in a convex shape and covers a predetermined number of the light-emitting device. Bases of the adjacent phosphor portions are formed by being linked with one another.10-20-2011
20110163330ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes an organic light emitting element formed over a substrate and an encapsulation portion covering the organic light emitting element. Further, the encapsulation portion may include at least one organic layer and at least one inorganic layer, wherein ends of the inorganic layer and t he organic layer directly contact the substrate, and wherein the organic layer is thicker than the inorganic layer.07-07-2011
20080251797Array substrate and method for manufacturing the same - An array substrate is disclosed. The array substrate comprises a substrate, a gate metal layer, a gate insulation layer, a semiconductor layer, a patterned metal layer, a flat layer, and a pixel electrode. The patterned metal layer is disposed on the surface of the semiconductor layer comprising a source and a drain, and on the surface of the gate insulation layer comprising a storage capacitor line and a data line. The storage capacitor line has an extending portion parallel to a scan line. The pixel electrode overlaps parts of the scan line, parts of the data line, parts of the storage capacitor line, and parts of the extending portion. A method for manufacturing the array substrate is also provided.10-16-2008
20120199852LIGHT-EMITTING DIODE COMPONENT - An LED component includes, according to a first embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an optical lens overlying the LED chips and having a lens base attached to the substrate, where the LED chips are positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The LED component includes, according to a second embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an array of optical lenses, each optical lens overlying at least one of the LED chips and having a lens base attached to the substrate, where at least one of the LED chips is positioned to provide a peak emission shifted from a perpendicular centerline of the respective lens base.08-09-2012
20120032199Element Substrate and Light-Emitting Device - A potential of a gate of a driving transistor is fixed, and the driving transistor is operated in a saturation region, so that a current is supplied thereto anytime. A current control transistor operating in a linear region is disposed serially with the driving transistor, and a video signal for transmitting a signal of emission or non-emission of the pixel is input to a gate of the current control transistor via a switching transistor.02-09-2012
20120032196LIGHT EMITTING DEVICE - According to one embodiment, a light emitting device includes a base substrate, first and second substrates, first and second semiconductor light emitting elements. The first and second substrates are provided on a major surface of the base substrate and include first and second reflection regions, respectively. The first and second semiconductor light emitting elements include first and second structural bodies including first and second light emitting layers, respectively. Each of the first and second semiconductor light emitting elements is inputted with a power not less than 1 Watt. An area of a face of the first semiconductor light emitting element is S02-09-2012
20120032195DISPLAY PANEL - A display panel includes a substrate and a plurality of pixel units. Each pixel unit includes a first thin film transistor and a second thin film transistor. The first thin film transistor includes a first gate electrode electrically connected to a fist gate line, a first source electrode electrically connected to a data line, and a first drain electrode electrically connected to a first pixel electrode. The second thin film transistor includes a second gate electrode electrically connected to a second gate line, a second source electrode electrically connected to the data line, and a second drain electrode electrically connected to a second pixel electrode. The first drain electrode extends along a first direction to overlap the first gate electrode, and the second drain electrode extends along the first direction to overlap the second gate electrode.02-09-2012
20120032194LIGHTING MODULE WITH HIGH COLOR RENDING PROPERTY - A lighting module with high rending property includes a substrate, a plurality of first light emitting diode (LED) chips, a plurality of second LED chips and a wavelength conversion layer. The first LED chips are deposed on the substrate and electrically connected to the substrate. The second LED chips are deposed on the substrate and electrically connected to the substrate. The wavelength conversion layer seals the first LED chips and the second LED chips. The light emitted from the LED chips and the light emitted from the wavelength conversion layer caused by an excitation by the LED chips are mixing to form warm white light with high color rending property. The number ratio of the first LED chips to the second LED chips deposed on the substrate is 2:1.02-09-2012
20120199855LIGHT EMITTING ELEMENT AND IMAGE DISPLAY APPARATUS USING THE LIGHT EMITTING ELEMENT - The present invention is intended to realize a light emitting element which is easy to fabricate, is efficient, and is able to emit light in a uniform polarization state enabling the achievement of high luminance. A light emitting element of the present invention is a light emitting element including an active layer for generating light, the light emitting element including: a first reflection layer that allows the light generated at the active layer to reflect at a reflection section in which reflection members are periodically provided, and to exit from an exiting section between the reflection members; a polarization beam splitter layer that transmits a polarized light oriented in a first direction and diffracts a polarized light oriented in a second direction orthogonal to the first direction among the light exited from the exiting section; a wave plate layer that allows the light transmitted through the polarization beam splitter layer and the light diffracted at the polarization beam splitter layer to enter, and to exit as a light of a same polarization state; and a second reflection layer that reflects the light reflected at the first reflection light.08-09-2012
20110163333Display Device - A display device includes a plurality of pixels placed in a matrix form in which each pixel has a light emitting device. The light emitting device includes a light emissive layer; a reflective electrode disposed on a rear surface side of the light emissive layer; a transparent electrode disposed on a front surface side of the light emissive layer; a dividing wall, disposed between the reflective electrode and the light emissive layer at a periphery part of a region where the reflective electrode is formed; a protective layer on a front surface side of the transparent electrode; and a transparent substrate disposed above the protective layer. The protective layer and the transparent substrate are spaced from one another so as to delimit a space where a gas is sealed.07-07-2011
20110163332OLEDS AND OTHER ELECTRONIC DEVICES USING DESICCANTS - Electronic devices that use desiccants for protection from moisture. The electronic devices comprise a substrate (07-07-2011
20110163329Organic light emitting display apparatus and method of manufacturing the same - An organic light emitting display apparatus and a method of fabricating the same are provided. The organic light emitting display apparatus includes a pixel unit on which an organic light emitting device is formed, a thin film transistor (TFT) electrically connected to the pixel unit and a data line and a scan line electrically connected to the TFT and disposed crossing each other on a substrate. The data line and the scan line are formed in one layer. A bridge that allows one of the data line and the scan line to bypass the other is on an intersection of the data line and the scan line.07-07-2011
20110163331ORGANIC LIGHT-EMITTING DEVICE - The present invention relates to an organic light-emitting device capable of suppressing deterioration of organic EL elements at the corners of an emission region.07-07-2011
20100320481ORGANIC ELECTROLUMINESCENCE DEVICE, DISPLAY UNIT INCLUDING THE SAME, AND METHOD OF MANUFACTURING AN ORGANIC ELECTROLUMINESCENCE DEVICE - An organic electroluminescence device includes a first electrode, an organic layer formed on the first electrode and including a light-emitting layer, an intermediate layer formed on the organic layer; and a second electrode formed on the intermediate layer and having a thickness of 6 nm or less.12-23-2010
20100320484Light Emitting Device, Electronic Appliance, and Method for Manufacturing Light Emitting Device - To provide a light emitting device that has a structure in which a light emitting element is sandwiched by two substrates to prevent moisture from penetrating into the light emitting element, and a method for manufacturing thereof. In addition, a gap between the two substrates can be controlled precisely. In the light emitting device according to the present invention, an airtight space surrounded by a sealing material with a closed pattern is kept under reduced pressure by attaching the pair of substrates under reduced pressure. A columnar or wall-shaped structure is formed between light emitting regions inside of the sealing material, in a region overlapping with the sealing material, or in a region outside of the sealing material so that the gap between the pair of substrates can be maintained precisely.12-23-2010
20100320482LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting device comprises a substrate having a plurality of light emitting elements mounted thereon; a side wall structure having a partition wall portion separating a plurality of light emitting areas that each include at least one of the light emitting elements; and encapsulating resin filled in the light emitting areas to bury the light emitting elements therein. The side wall structure is separated by a space from the substrate at, at least, the partition wall portion so as to be in noncontact with the substrate, and the encapsulating resin is formed so as to integrally, continuously fill the light emitting areas and the space without producing any interface therein.12-23-2010
20100320479LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME - A light emitting apparatus and a production method of the apparatus are provided that can emit light with less color unevenness at high luminance. The apparatus includes a light emitting device, a transparent member receiving incident light emitted from the device, and a covering member. The transparent member is formed of an inorganic material light conversion member including an externally exposed emission surface, and a side surface contiguous to the emission surface. The covering member contains a reflective material, and covers at least the side surfaces of the transparent member. Substantially only the emission surface serves as the emission area of the apparatus. It is possible to provide emitted light having excellent directivity and luminance. Emitted light can be easily optically controlled. In the case where each light emitting apparatus is used as a unit light source, the apparatus has high secondary usability.12-23-2010
20130168708METHOD FOR DISPOSING FINE OBJECTS, APPARATUS FOR ARRANGING FINE OBJECTS, ILLUMINATING APPARATUS AND DISPLAY APPARATUS - This method for disposing fine objects, in a substrate preparing step, prepares a substrate having specified positions where fine objects (07-04-2013
20130168703DEPOSITION OF PHOSPHOR ON DIE TOP BY STENCIL PRINTING - A method for depositing a layer of phosphor-containing material on a plurality of LED dies includes disposing a template with a plurality of openings on an adhesive tape and disposing each of a plurality of LED dies in one of the plurality of openings of the template. The method also includes disposing a stencil over the template and the plurality of LED dies. The stencil has a plurality of openings configured to expose a top surface of each of the LED dies. Next, a phosphor-containing material is disposed on the exposed top surface of each the LED dies. The method further includes removing the stencil and the template.07-04-2013
20130168704Panel and method for fabricating the same - A panel is disclosed, in which, a patterned semiconductor layer is formed on an insulation layer. The patterned semiconductor layer includes a portion corresponding to an electrode and another portion corresponding to a wiring trace. The portion corresponding to the electrode may be formed as, for example, a channel, and the other portion corresponding to the wiring trace may protect the wiring trace during fabrication process or in the structure from scratching or corrosion.07-04-2013
20130168705SOLID-STATE LIGHT-EMITTING DEVICE AND SOLID-STATE LIGHT-EMITTING PACKAGE THEREOF - A solid-state light-emitting package includes a leadframe, a light-emitting chip, and a sealant. The leadframe includes a first electrode and a second electrode. The first electrode has at least one first contact end, and the second electrode has at least one second contact end. The light-emitting chip is electrically connected to the first electrode and the second electrode and is disposed between the first contact end and the second contact end. The sealant covers the leadframe and the light-emitting chip and has a first surface and a second surface. The first surface is the light output surface for the light-emitting chip. The first electrode and the second electrode are bent toward the first surface, where the first contact end and the second contact end are exposed by the first surface.07-04-2013
20130168706PRINTED LIGHT EMITTING DEVICES AND METHOD FOR FABRICATION THEROF - An array of light emitting devices and a method for large area fabrication of such is provided. The method includes providing a continuous flexible substrate and printing one or more layers of light emitting devices comprised of layers of transparent conductor, light emitting material, dielectric and electrode on the flexible substrate. The array of light emitting devices includes a flexible substrate and one or more layers of light emitting devices on the flexible substrate. The one or more layers of light emitting devices include layers of transparent conductor, light emitting material, dielectric and electrode.07-04-2013
20130168707ARRAY SUBSTRATE STRUCTURE OF DISPLAY PANEL AND METHOD OF MAKING THE SAME - An array substrate structure of a display panel includes a substrate, a plurality of first wirings, a first patterned insulating layer, a plurality of second wirings, a plurality of first protective patterns, and a plurality of second protective patterns. The substrate has a wiring region. The first wirings are disposed in the wiring region. The first patterned insulating layer is disposed on the first wirings. The second wirings are disposed on the first patterned insulating layer. The first protective patterns are disposed in the wiring region and disposed on the corresponding second wiring, respectively, where the first protective pattern includes a semiconductor material. The second protective patterns are disposed on the corresponding first protective pattern, respectively, where the second protective pattern includes an inorganic insulating material.07-04-2013
20110133221LED AND LED PACKAGE - A light emitting device (LED) and Package of the same are provided. The LED comprises a first conductivity type semiconductor layer, an active layer, a second conductivity type semiconductor layer, a first dielectric layer, and a first electrode layer. The first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer are on a substrate. The first dielectric layer covers the edges of the second conductivity type semiconductor layer and the active layer. The first electrode layer covers the edge of the first conductivity type semiconductor layer.06-09-2011
20110133224THERMALLY OPTIMISED LED CHIP-ON-BOARD MODULE - A LED Chip-on-Board (COB) module comprises a plurality of LED die arranged on a substrate in one or more radially concentric rings about a centre point such that each LED die is azimuthally offset from neighbouring LED die. The module includes thermal conduction pads each having lateral dimensions at least as large as the combined lateral dimensions of the LED die attached to it and a total surface area at least five times larger than the total surface area of all the LED die attached to it. At the same time, the total light emission area of the module is no greater than four times larger than the combined total surface emission area of all the individual LED die disposed on the substrate. A variety of configurations are possible subject to these criteria, which permit good packing density for enhanced brightness whilst ensuring optimal heat transfer. A method of manufacturing the module is also provided.06-09-2011
20110133222LED LAMP WITH REMOTE PHOSPHOR COATING AND METHOD OF MAKING THE LAMP - A light emitting diode (LED) lamp includes a base with one or more LED chips, an internal cover over the LED chips, where the cover is a translucent ceramic whose thermal conductivity is greater than glass, where the cover has an interior surface separated from the LED chips by a gap, and where an exterior surface of the cover is coated with a phosphor. The ceramic cover preferably has a bulk thermal conductivity of at least 5 W/(m·K), such as polycrystalline alumina. The LED chips preferably are blue LEDs and the phosphor is selected so that the lamp emits white light. In the method of making the lamp, the phosphor may be applied to the exterior surface of the cover as a preformed sheet or in a coating.06-09-2011
20110133218LIGHT EMITTING APPARATUS, METHOD OF MANUFACTURING THE SAME, AND LIGHTING SYSTEM - Disclosed are a light emitting apparatus, a method of manufacturing the same, and a lighting system. The light emitting apparatus includes a body, a light emitting device on the body, a conductive member electrically connected with the light emitting device on the body, a resin member surrounding the light emitting device, and an inorganic oxide layer having a refractive index less than a refractive index of the resin member on the resin member.06-09-2011
20110133217Led light emitting apparatus and vehicle headlamp using the same - Four LED chips are mounted on a sub-mount substrate so as to be parallel thereto. A wire 06-09-2011
20110133216METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE AND STACKED STRUCTURE BODY - According to one embodiment, a method is disclosed for manufacturing a semiconductor light emitting device. The method can include forming a plurality of semiconductor stacked bodies on a first major surface of a support substrate with a gap between two neighboring semiconductor stacked bodies. The semiconductor stacked bodies includes a first semiconductor layer, a second semiconductor layer, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The method can bond the plurality of semiconductor stacked bodies to one other support substrate with a bonding member. In addition, the method can remove the support substrate from the plurality of semiconductor stacked bodies by irradiating the plurality of semiconductor stacked bodies with a laser light from a second major surface of the support substrate on a side opposite to the first major substrate. The bonding member is not irradiated with the laser light.06-09-2011
20110254024Circuit Structure of Package Carrier and Multi-Chip Package - A multi-chip package comprises a plurality of chip pads and a plurality of LED chips. The chip pads are arranged in an M×N array, M and N each a positive integer greater than 1. A peripheral area of each chip pad comprises a respective first bonding pad, a respective second bonding pad, and a respective third bonding pad arranged in sequence in a clockwise direction. A first orientation of the respective first to third bonding pads in a first row of the N rows differs from a second orientation of the respective first to third bonding pads in a second row of the N rows by 90 degrees. Each of the LED chips is disposed on a respective one of the chip pads and electrically connected to two of the respective first to third bonding pads on a same side of the respective LED chip.10-20-2011
20110254022LIGHT EMITTING DEVICE - There is presented a light emitting device, having plural light emitting elements disposed on a substrate, in which a protection element, such as a zener diode, can be disposed at an appropriate position. The light emitting device includes: a substrate; a light emitting section having plural light emitting elements disposed in a mounting area on the substrate; a positive electrode and negative electrode each having a pad section and wiring section to apply voltage to the light emitting section through the wiring sections; a protection element disposed at one of the positive electrode and negative electrode and electrically connected with the other one electrode; and a light reflecting resin formed on the substrate such as to cover at least the wiring sections and the protection element, wherein the wiring sections are formed along the periphery of the mounting area such that one end portions thereof are adjacent to each other.10-20-2011
20110079797DISPLAY DEVICE - A display device includes an array of pixels including a plurality of organic EL elements each having a pair of electrodes and an organic compound layer including a light-emitting layer and disposed between the pair of electrodes and includes a protective layer disposed on the plurality of the organic EL elements. The protective layer has a first protective layer made of an inorganic material, a second protective layer made of a resin material and disposed on the first protective layer, and a third protective layer made of an inorganic material and disposed on the second protective layer. The second protective layer includes lenses for diverging at least part of light emitted from the light-emitting layer. The lenses have an elongated concave shape.04-07-2011
20110084288Organic light emitting diode display and method of manufacturing the same - An organic light emitting diode (OLED) display includes a substrate, a first electrode on the substrate, an emission layer on the first electrode, and a second electrode on the emission layer, the second electrode including a transflective conductive layer and a conductive oxide layer.04-14-2011
20110254026SURFACE MOUNTED LED PACKAGE - An LED device and LED module are provided. The LED device is coupled to a lead frame with a first plane and a second plane opposite to the first plane, the lead frame having a LED chip disposed on the first plane. The LED device includes a reflection cup structure disposed on the lead frame, a lens structure and at least one fixing structure. The LED chip is disposed in the reflection cup structure and electrically connected to the first plane of the lead frame. The lens structure covers the first plane and the second plane of the lead frame. The fixing structure and the fixing structures are formed integrally and cover the lead frame cooperatively.10-20-2011
20110186873LIGHT EMITTING DEVICE PACKAGES, SYSTEMS AND METHODS - Packages, systems and methods for light emitting devices are disclosed. An LED package in one aspect can be of various sizes and configurations and can include one or more LEDs of a size smaller than those typically provided. The LED package or packages can for example be used for backlighting or other lighting fixtures. Optimized materials and techniques can be used for the LED packages to provide energy efficiency and long lifetime.08-04-2011
20110186871ELECTROLUMINESCENT DISPLAY, ILLUMINATION OR INDICATING DEVICE, AND ITS FABRICATION PROCESS - The invention relates to an electroluminescent display, illumination or indicating device and to its fabrication process. This device (08-04-2011
20110186870LED PACKAGE STRUCTURE - An LED package structure includes a base and two diodes. The base includes an insulating layer having an outer peripheral edge, and a conductive bottom layer disposed on a bottom face of the insulating layer and having an outer peripheral edge spaced from the outer peripheral edge of the insulating layer at a predetermined distance. The insulating layer is formed with two spaced-apart through holes, and cooperates with the conductive bottom layer to form first and second cavities. The diodes are disposed within the first and second cavities, respectively. A transparent encapsulant covers the base and the diodes.08-04-2011
20110186869Organic Light Emitting Diode Display and Method of Manufacturing the Same - An organic light emitting diode (OLED) display comprises a first substrate and a second substrate configured to comprise a pixel area and a non-pixel area other than the pixel area, a sealing member configured to adhere the first substrate and the second substrate together, reinforcing materials filled into the non-pixel area of the first substrate and the second substrate, and an accommodation unit configured to accommodate some of the reinforcing materials within at least one of the first substrate and the second substrate corresponding to the non-pixel area. A method of manufacturing the OLED display comprises: preparing a mother substrate, including a plurality of display panels and cutting lines between two adjacent display panels; cutting the mother substrate into separated unit display panels; forming grooves on a side of each unit display panels; and filling reinforcing materials in a non-pixel area of the unit display panels, some of the reinforcing materials flowing into the grooves.08-04-2011
20110186867Arrangement Having at Least Two Light-Emitting Semiconductor Components and Method for the Production of Such an Arrangement - An arrangement having at least two light-emitting semiconductor components (08-04-2011
20110186864ELECTROLUMINESCENT LIGHT-EMITTING DEVICE COMPRISING AN ARRANGEMENT OF ORGANIC LAYERS, AND METHOD FOR ITS PRODUCTION - The invention relates to an electroluminescent light-emitting device comprising an arrangement of organic layers which are applied to a substrate, and also to a method for its production. The arrangement of organic layers comprises the following layers: at least one charge carrier transport layer consisting of organic material, and at least one light-emitting layer consisting of organic material. The arrangement of organic layers furthermore comprises at least one doped fullerene layer which has a doping that increases the electrical conductivity.08-04-2011
20110186866OPTOELECTRONIC DEVICE ARRAY - An optoelectonice device array includes a plurality of packages, each enclosing an optoelectronic device, and positioned in at least one row. Each package overlaps at least one adjacent package, and may be hermetically sealed.08-04-2011
20110186865Wide angle oval light emitting diode package - The present invention is directed to LED packages and LED displays utilizing LED packages where the peak emission of the LED displays can exhibit improved emission characteristics. In some embodiments the improved characteristics include a wider horizontal emission angle for the LED packages according to the present invention, which results in improved emission characteristics for the LED display such as a wider far field pattern. This provides improved picture intensity and quality when viewing the display at different horizontal viewing angles. Different embodiments also provide for improved emission characteristics for LED packages emitting different colors of light when viewing at different vertical angles. In one embodiment the red and green LED packages can have emission patterns that are substantially the same at different vertical viewing angles within a range. This helps the colors of the display appear consistent at those angles.08-04-2011
20100117101AC LIGHT EMITTING DIODE - Disclosed herein is an AC light emitting diode. The light emitting diode comprises a plurality of light emitting cells two-dimensionally arranged on a single substrate. Wires electrically connect the light emitting cells to one another to thereby form a serial array of the light emitting cells. Further, the light emitting cells are spaced apart from one another by distances within a range of 10 to 30 μm, and the serial array is operated while connected to an AC power source. Accordingly, the excellent operating characteristics and light output power can be secured in an AC light emitting diode with a limited size.05-13-2010
20100117100LIGHT-EMITTING MODULE AND ILLUMINATION DEVICE - There is provided a light-emitting module which makes it difficult to sense glare and which suppresses the temperature rise of light-emitting diode chips and has a cost advantage. The light-emitting module is provided with a base body formed with a non-metallic member having a thermal conductivity of 1 W/mk or less. In the base body, a plurality of LED chips are spaced 10 to 30 mm apart from each other, and their junction temperature when they are normally lit is preferably set at 90° C. or less. A translucent sealing member covering an area between the adjacent light-emitting diode chips is provided.05-13-2010
20110133215ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an organic light emitting diode (OLED) display includes forming an upper electrode power source line outside of a pixel area over a substrate, forming a lower electrode in the pixel area, forming at least one layer of an organic material layer in the pixel area and areas outside of the pixel area, forming an upper electrode in the pixel area, selectively removing portions of the organic material layer that are exposed outside of the upper electrode, thereby exposing the upper electrode power source line, and coating a conductive material between the upper electrode and the upper electrode power source line in a normal pressure condition such that the conductive material overlaps the upper electrode and the upper electrode power source line, thereby forming a connection portion.06-09-2011
20120146062LIGHT EMITTING DEVICE, DISPLAY APPARATUS, AND ELECTRONIC APPARATUS - In a display panel, a first electron injection layer is formed between an anode and a light-emitting functional layer, and a hole injection layer is formed between the anode and the first electron injection layer. In other words, the hole injection layer, the first electron injection layer, and the light-emitting functional layer are configured to be laminated on the anode in this order. An electron injection material used for the first electron injection layer is diffused into the hole injection layer, and the diffused electron injection material inhibits or promotes hole transportation of the hole injection layer, so that the amount of holes transported to a light-emitting functional layer is adjusted. As a result, the carrier balance is improved.06-14-2012
20120146064DEPOSITION MASK AND METHOD OF MANUFACTURING ORGANIC EL DISPLAY PANEL INCORPORATING DEPOSITION MASK - A deposition mask used in the manufacture of an organic EL display panel. A sheet of mask foil provided with a plurality of slit-shaped openings is fixed to a mask frame. Ends of successively arranged at least three openings are displaced from one another along the longitudinal direction of the openings.06-14-2012
20110095311Configuration of Multiple LED Module - A configuration of multiple LED modules having a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer. The first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.04-28-2011
20100219426LIGHT EMITTING DEVICE HAVING VERTICALLY STACKED LIGHT EMITTING DIODES - Disclosed is a light emitting device having vertically stacked light emitting diodes. It comprises a lower semiconductor layer of a first conductive type positioned on a substrate, a semiconductor layer of a second conductive type on the lower semiconductor layer of a first conductive type, and an upper semiconductor layer of a first conductive type on the semiconductor layer of a second conductive type. Furthermore, a lower active layer is interposed between the lower semiconductor layer of a first conductive type and the semiconductor layer of a second conductive type, and an upper active layer is interposed between the semiconductor layer of a second conductive type and the upper semiconductor layer of a first conductive type. Accordingly, there is provided a light emitting device having a structure in which a lower light emitting diode comprising the lower active layer and an upper light emitting diode comprising the upper active layer are vertically stacked. Therefore, light output per unit area of the light emitting device is enhanced as compared with a conventional light emitting device, and thus, a chip area of the light emitting device needed to obtain the same light output as the conventional light emitting device can be reduced.09-02-2010
20110260180IMAGE DISPLAY DEVICE AND THE METHOD FOR MANUFACTURING THE SAME - An image display device comprises: a first substrate having flexure property; a first resin layer which is attached to the first substrate and over which thin film transistors are located; a barrier layer which comprises an inorganic film covering a surface of the resin layer; and a first thin film layer and a second thin film layer which are located so as to sandwich the first resin layer with the barrier layer disposed therebetween.10-27-2011
20110260179FLEXIBLE LED PACKAGING STRUCTURE - A flexible LED packaging structure includes two or more metal foil substrates. One or more LED chips are assembled onto the primary metal foil substrate by silver glue or solder paste or eutectic. A secondary metal foil substrate is electrically connected with the LED chip by wires or eutectic. There is a spacing between the primary and secondary metal foil substrates. A packaging colloid, made of a flexible material, is fully covered onto the LED chip and partially covered onto the primary and secondary metal foil substrates, such that the lower surface of the primary and secondary metal foil substrates is exposed. With this principle, a plurality of LEDs is electrically connected in parallel or in series, and the metal foil substrate could be used to improve the heat-radiating effect, thus enabling flexible assembly onto multiple lightings.10-27-2011
20080217629Ac Light Emitting Diode Having Improved Transparent Electrode Structure - Disclosed is an AC light emitting diode having an improved transparent electrode structure. The light emitting diode comprises a plurality of light emitting cells formed on a single substrate, each of the light emitting cells having a first conductive type semiconductor layer, a second conductive type semiconductor layer positioned on one region of the first conductive type semiconductor layer, and an active layer interposed between the first and second conductive type semiconductor layers. A transparent electrode structure is positioned on each of the light emitting cells. The transparent electrode structure includes at least two portions separated from each other, or a center portion and branches laterally extending from both sides of the center portion. Meanwhile, wires electrically connect adjacent two of the light emitting cells. Accordingly, a plurality of light emitting cells are electrically connected, whereby a light emitting diode can be provided which can be driven under AC power source. Also, an improved transparent electrode structure is employed, so that the current density can be prevented from being locally increased.09-11-2008
20110186868LED PACKAGE - According to one embodiment, an LED package includes a first and a second lead frame, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and has one terminal connected to the first lead frame and another terminal connected to the second lead frame. The wire connects the one terminal to the first lead frame. The resin body covers the first and second lead frames, the LED chip, and the wire. The first lead frame includes a base portion and a plurality of extending portions. As viewed from above, a bonding position of the wire is located inside one of polygonal regions connecting between roots of the two or more of the extending portions. An appearance of the resin body is a part of an appearance of the LED package.08-04-2011
20110186872Light Emitting Device Package, Method Of Manufacturing The Same, And Lighting System - The light emitting device package includes a light emitting structure including a first conductive semiconductor layer, an active layer partially formed under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer, an insulating layer disposed on lateral surfaces of the active layer and the second conductive semiconductor layer, an electrode disposed under the first conductive semiconductor layer and electrically insulated from the active layer and the second conductive semiconductor layer by the insulating layer, and a metallic support layer disposed under the second conductive semiconductor layer, the insulating layer, and the electrode and including a first conductive region electrically connected to the electrode, a second conductive region electrically connected to the second conductive semiconductor layer, and an insulating region disposed between the first and second conductive regions and insulating the first conductive region from the second conductive region.08-04-2011
20110147769Organic light emitting display and manufacturing method thereof - An organic light emitting display includes a gate electrode on a substrate, an active layer insulated from the gate electrode, source and drain electrodes that are insulated from the gate electrode and contact the active layer, an insulating layer between the active layer and the source and drain electrodes, a light blocking layer that is on the active layer and that blocks light of a predetermined wavelength from the active layer, and an organic light emitting device that is electrically connected to one of the source and drain electrodes.06-23-2011
20110186874White Light Apparatus and Method - A method of manufacturing LED devices using substrate scale processing includes providing a substrate member having a surface region. A reflective layer is disposed on the surface region, the reflective surface having a reflectivity of at least 85%, An array of conductive regions is spatially disposed on the reflective surface. LED devices are affixed to each of the array regions.08-04-2011
20100038656Nitride LEDs based on thick templates - Thick HVPE templates of nitrides enhance both the growth conditions and resulting device performance of LEDs, power devices, solar cells, and other electrical elements. The use of HVPE templates greater than 15 microns allows for increased incorporation of indium and/or aluminum in alloys with gallium nitride relative to a thinner MOCVD template for a given reactor growth temperature. The use of these thicker templates further allows the formation of epitaxial chips. The use of this approach forms more efficient nitride devices between 520 nm and 1.7 microns. These devices may be used for both emitting and absorbing applications such as LEDs and solar cells.02-18-2010
20100025698DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME - A display panel includes a substrate having a display area and a blank area. The blank area includes at least one of a non-metal line region and a metal-line region. The non-metal line region includes a plurality of insulating patterns and a first conductive pattern layer formed on the substrate. The insulating patterns are isolated from each other by the first conductive pattern layer. The metal-line region includes an insulating multilayer formed on the substrate and a conductive pattern layer formed on the insulating multilayer. Several isolated zones are formed by the conductive pattern layer on the surface of the insulating multilayer.02-04-2010
20110215346LIGHT EMITTING DIODE - AC LED according to the present invention comprises a substrate, and at least one serial array having a plurality of light emitting cells connected in series on the substrate. Each of the light emitting cells comprises a lower semiconductor layer consisting of a first conductive compound semiconductor layer formed on top of the substrate, an upper semiconductor layer consisting of a second conductive compound semiconductor layer formed on top of the lower semiconductor layer, an active layer interposed between the lower and upper semiconductor layers, a lower electrode formed on the lower semiconductor layer exposed at a first corner of the substrate, an upper electrode layer formed on the upper semiconductor layer, and an upper electrode pad formed on the upper electrode layer exposed at a second corner of the substrate. The upper electrode pad and the lower electrode are respectively disposed at the corners diagonally opposite to each other, and the respective light emitting cells are arranged so that the upper electrode pad and the lower electrode of one of the light emitting cells are symmetric with respect to those of adjacent another of the light emitting cells.09-08-2011
20110215345SOLID STATE LAMP WITH THERMAL SPREADING ELEMENTS AND LIGHT DIRECTING OPTICS - Lamps and bulbs are disclosed generally comprising different combinations and arrangements of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. The lamps according to the present invention can also comprise thermal management features that provide for efficient dissipation of heat from the LEDs, which in turn allows the LEDs to operate at lower temperatures. The lamps can also comprise optical elements to help change the emission pattern from the generally directional (e.g. Lambertian) pattern of the LEDs to a more omni-directional pattern.09-08-2011
20100019253AC LIGHT EMITTING DIODE - Disclosed herein is an AC light emitting diode. The light emitting diode comprises a plurality of light emitting cells two-dimensionally arranged on a single substrate. Wires electrically connect the light emitting cells to one another to thereby form a serial array of the light emitting cells. Further, the light emitting cells are spaced apart from one another by distances within a range of 10 to 30 D, and the serial array is operated while connected to an AC power source. Accordingly, the excellent operating characteristics and light output power can be secured in an AC light emitting diode with a limited size.01-28-2010
20120146065LIGHTING EMITTING DEVICE, MANUFACTURING METHOD OF THE SAME, ELECTRONIC DEVICE HAVING THE SAME - One pixel is divided into a first region including a first light emitting element and a second region including a second light emitting element, wherein the first region emits light in one direction and the second region emits light in the direction opposite to that of the first region. Independently driving the first light emitting element and the second light emitting element allows images to be displayed independently on the surface.06-14-2012
20120146061ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - A large size organic light emitting diode (OLED) display and manufacturing method thereof are disclosed. In one embodiment, the method includes i) forming a display unit including a plurality of pixels on a substrate, ii) forming a getter layer, a bonding layer and a conductive contact layer around the display unit and iii) manufacturing a sealing member including a flexible polymer film and a metal layer formed on at least one side of the polymer film. The method may further include laminating the sealing member on the substrate using a roll lamination process such that the metal layer contacts the conductive contact layer and curing the contact layer and the conductive contact layer.06-14-2012
20120146063LIGHT EMITTING DIODE LAMP - An LED lamp comprises a front cover comprising an upper plate, a first sidewall perpendicular to the upper plate, a through hole in a central portion of the upper plate; a rear cover comprising a bottom plate, a second sidewall perpendicular from the bottom plate to engage the front and rear covers by sleeving over the first sidewall; a lamp body comprising a first and second substrates, a third sidewall interconnecting the first and second substrates, the third sidewall penetrating through the through hole and is between the upper and bottom plates; a first LED unit on the first substrate, facing the second substrate; a second LED unit on the second substrate, facing away the first substrate, wherein the LED lamp is configure to direct light from the first LED units via the third sidewall, and light from the second LED units along a direction away from the first substrate.06-14-2012
20120146059Organic light emitting diode display - An organic light emitting diode (OLED) display includes: a substrate; an organic light emitting diode disposed on the substrate; a sealing member sealed with the substrate, interposing the organic light emitting diode therebetween; a pad portion disposed on the substrate, corresponding to an edge of the sealing member, and electrically connected with the organic light emitting diode; a conductive line portion formed on the sealing member and/or on the substrate, and applied with driving power supplied to the organic light emitting diode; and a conductive connection portion directly connecting the pad portion and the conductive line portion.06-14-2012
20090173954Semiconducting sheet - A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements.07-09-2009
20090095963BARE DIE SEMICONDUCTOR DEVICE CONFIGURED FOR LAMINATION - A bare die semiconductor device, e.g., a bare die LED, includes a substrate having a bottom face and a bottom die electrode. There is also a top face having a top face edge, a top face area, a top face periphery and a top die electrode. A semiconductor material provides a p-n semiconductor junction between the top and bottom faces. The top die electrode inhibits an external top planar electrode from contact with the top face edges. Such bare die LEDs can be incorporated into a light sheet that has a transparent first substrate having a planar top electrode and a second substrate having a bottom substrate electrode. An adhesive secures the second substrate to the first substrate. Bare die LEDs are disposed in the adhesive with their top die electrodes contacting the top planar electrode and their bottom die electrodes contacting the bottom substrate electrode.04-16-2009
20100320480PHOSPHOR CONVERTING IR LEDS - The production of light of various wavelengths using IR phosphor down conversion techniques using existing LED emissions to pump sensitizer-rare earth ions that emit at other wavelengths. A sensitizer absorbs an LED chip pump emission and then transfers that energy with high quantum efficiency to dopant ions that then emits at their characteristic wavelength.12-23-2010
20110073880GLASS PLATE WITH GLASS FRIT STRUCTURE - A light emitting device includes: a first substrate; a second substrate; a light emitting unit interposed between the first substrate and the second substrate; and a sealing material bonding the first substrate to the second substrate and sealing the light emitting unit. The sealing material comprises V03-31-2011
20110073883LED LAMP - An LED lamp A03-31-2011
20110073882System for Wafer-Level Phosphor Deposition - System for wafer-level phosphor deposition. In an aspect, a semiconductor wafer is provided that includes a plurality of LED dies wherein at least one die includes an electrical contact, a photo-resist post covering the electrical contact, and a phosphor deposition layer covering the semiconductor wafer and surrounding the photo-resist post. In another aspect, a semiconductor wafer is provided that comprises a plurality of LED dies wherein at least one die comprises an electrical contact, a phosphor deposition layer covering the semiconductor wafer, and a cavity in the phosphor deposition layer exposing the at least one electrical contact.03-31-2011
20110073881LEDs USING SINGLE CRYSTALLLINE PHOSPHOR AND METHODS OF FABRICATING SAME - Methods for fabricating LED chips from a wafer and devices fabricated using the methods with one method comprising depositing LED epitaxial layers on an LED growth wafer to form a plurality of LEDs on the growth wafer. A single crystalline phosphor is bonded over at least some the plurality of LEDs so that at least some light from the covered LEDs passes through the single crystalline phosphor and is converted. The LED chips can then be singulated from the wafer to provide LED chips each having a portion of said single crystalline phosphor to convert LED light.03-31-2011
20110073879LIGHT-EMITTING DEVICE HAVING LIGHT-EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs (03-31-2011
20110073878LED ARRAY PACKAGE COVERED WITH A HIGHLY THERMAL CONDUCTIVE PLATE - A light source includes a substrate, a light emitting diode on the substrate, and a phosphor layer over the light emitting diode. A plate is on the phosphor layer. An attachment member is coupled to the plate and is configured to conduct heat away from the plate.03-31-2011
20110073877HIGH-CURRENT/LOW COST READ-IN INTEGRATED CIRCUIT - A Read-In Integrated Circuit scene generator incorporates an array of unit cells, with each cell having a switching control circuit. An array of emitting elements is associated with the unit cells and each element is connected with a lead to the switching control circuit of the associated cell. A first electrically conducting overlayer is deposited substantially covering the array of unit cells and connected for current supply. Each emitting element is connected to the first conducting overlayer and the first conducting overlayer includes vias through which each connecting lead from the emitting element to the switching control circuit extends. A second electrically conducting overlayer is deposited substantially covering the array of unit cells and connected for current return. Each switching control circuit is connected to the second conducting overlayer. The second conducting overlayer also has vias through which each lead from the emitting element extends to the switching circuit.03-31-2011
20110073876LIGHT-EMITTING DEVICE AND DISPLAY - A light-emitting device allowed to obtain polarized light without increasing the number of components or the thickness thereof, and a display including the light-emitting device are provided. The light-emitting device includes: a light-emitting element including, on a substrate, a first electrode, a light-emitting layer and a second electrode in order from the substrate. The substrate has, on a surface facing the first electrode, a first concavo-convex structure including a plurality of strip-shaped protrusion sections with a width equal to or smaller than an upper wavelength limit of visible light, and the first electrode, the light-emitting layer and the second electrode each have, on a surface opposite to a surface facing the substrate, a second concavo-convex structure imitating the protrusion sections of the first concavo-convex structure.03-31-2011
20120097992Method of Manufacturing Organic Light Emitting Display Apparatus, and Organic Light Emitting Display Apparatus Manufactured by Using the Method - A method of manufacturing an organic light emitting display device and an organic light emitting display device manufactured using the method, which are suitable for manufacturing large-sized display devices on a mass scale and can be used for high-definition patterning. The method includes consecutively forming organic layers on a substrate on which a plurality of panels are arranged parallel to each other; forming a second electrode on the organic layers, for each of the panels; forming a passivation layer on the second electrode on each of the panels to cover the second electrode; and removing a part of the organic layers that exists between the passivation layer on the second electrode of one of the panels and the passivation layer on the second electrode of an adjacent one of the panels.04-26-2012
20120097991Light-Emitting Element, Light-Emitting Device, and Lighting Device - Described is a solid-state light-emitting element, a light-emitting device using the solid-state light-emitting element, and a lighting device using the light-emitting device. The solid-state light-emitting element comprises a member with a low refractive index which has a hemispherical structure on a first surface and an uneven structure on a second surface, a bonding layer with a high refractive index which planarizes the uneven structure, and a light-emitting body whose light-emitting surface is in contact with a flat surface of the bonding layer. The uneven structure of the member with a low refractive index is provided inside at least an outside shape of the hemispherical structure formed on the first surface; and the light-emitting body is provided such that an outside shape of the light-emitting region of the light-emitting body is smaller than the outside shape of the hemispherical structure and overlaps with the hemispherical structure.04-26-2012
20120032204METHOD OF MANUFACTURING OLED-ON-SILICON - A method of manufacturing an Organic Light Emitting Diode (OLED). A substrate (02-09-2012
20120032198OPTOELECTRONIC SEMICONDUCTOR DEVICE - An optoelectronic semiconductor device including: a substrate; a semiconductor system having an active layer formed on the substrate; and an electrode structure formed on the semiconductor system, wherein the electrode structure includes: a first conductivity type bonding pad; a second conductivity type bonding pad; a first conductivity type extension electrode; and a second conductivity type extension electrode, wherein the first conductivity type extension electrode and the second conductivity type extension electrode form a three-dimensional crossover; wherein the first conductivity type extension electrode and the second conductivity type extension electrode are on the opposite sides of the active layer.02-09-2012
20120032200METHOD FOR COATING LIGHT-EMITTING DEVICES, LIGHT COUPLER, AND METHOD FOR MANUFACTURING THE LIGHT COUPLER - A method of coating a light emitting device is provided. The method includes preparing a plurality of light emitting devices. The plurality of light emitting devices are coated with a first photocurable liquid. First light is selectively exposed to the first photocurable liquid to form a first coating layer on at least a partial region of a surface of each of the plurality of light emitting devices. The plurality of light emitting devices on which the first coating layer is formed are coated with a second photocurable liquid. Second light is selectively exposed to the second photocurable liquid to form a second coating layer on at least a partial region of the surface of each of the plurality of light emitting devices or a surface of the first coating layer. The first coating layer corresponds to the cured first photocurable liquid, while the second coating layer corresponds to the cured second photocurable liquid.02-09-2012
20120032202PLANAR LIGHT SOURCE DEVICE AND DISPLAY DEVICE PROVIDED WITH THE PLANAR LIGHT SOURCE DEVICE - A planar light source device is provided which satisfies the inequality α02-09-2012
20110303927LIGHT EMITTING MODULE AND ILLUMINATION APPARATUS - A light emitting module (12-15-2011
20110140135LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.06-16-2011
20110140134DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - It is an object of the present invention to prevent an influence of voltage drop due to wiring resistance, trouble in writing of a signal into a pixel, and trouble in gray scales, and provide a display device with higher definition, represented by an EL display device and a liquid crystal display device.06-16-2011
20090057690Wafer level phosphor coating technique for warm light emitting diodes - Methods for wafer level fabricating of light emitting diode (LED) chips are disclosed with one embodiment of a method according to the present invention comprising providing a plurality of LEDs and then coating of the LEDs with a layer of first conversion material so that at least some light from the LEDs passes through the first conversion material. The light is converted to different wavelengths of light having a first conversion material emission spectrum. The LEDs are then coated with a layer of second conversion material arranged on the first layer of conversion. The second conversion material has a wavelength excitation spectrum, and at least some light from the LEDs passes through the second conversion material and is converted. The first conversion material emission spectrum does not substantially overlap with the second conversion material excitation spectrum. Methods according to the present invention can also be used in wafer level fabrication of LED chips and LED packages with pedestals for electrically contacting the LEDs through the conversion coatings.03-05-2009
20110114971SUBSTRATE FOR SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE - A substrate for a semiconductor device is provided, including: a substrate; a transistor, formed on the substrate, that includes a semiconductor layer, and a gate electrode disposed so as to be opposed to the semiconductor layer with a gate insulating film interposed therebetween; and an underlying film disposed below the semiconductor layer, as an underlayer of the transistor, and formed in an island shape so as to at least partially overlap the semiconductor layer, in a plan view of the substrate.05-19-2011
20110057210ORGANIC ELECTROLUMINESCENCE DEVICE AND METHOD FOR PRODUCING THE SAME - To provide an organic electroluminescence device including: a plurality of organic electroluminescence display portions, each of which includes at least an anode, a light-emitting layer and a cathode; a plurality of lenses which are placed over the organic electroluminescence display portions, and each of which controls an optical path of light emitted from the light-emitting layer; and a plurality of filter layers, each of which is formed integrally with each lens and placed so as to cover the optical path in each lens, and transmits the light emitted from the light-emitting layer, wherein the filter layer formed integrally with one lens among the lenses absorbs at least light with a peak wavelength among light which has passed through at least one of lenses that are adjacent to the one lens.03-10-2011
20120305951LIGHT-EMITTING DEVICE HAVING LIGHT-EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs (12-06-2012
20120305950DISPLAY APPARATUS - Disclosed is a method of making a display apparatus including a step of forming an underlying layer on a substrate, the underlying layer having a protrusion; and a step of depositing a material of a lens portion so as to form a film having a shape that follows a shape of the underlying layer.12-06-2012
20120305947THIN FILM TRANSISTOR SUBSTRATE AND METHOD FOR FABRICATING THE SAME - A thin film transistor substrate and a method for fabricating the same are discussed. According to an embodiment, the thin film transistor substrate includes a gate line arranged on a substrate in a first direction; a data line arranged in a second direction crossing the gate line to define adjacent first and second pixel regions, the data line being used in common by the first and second pixel regions; an entire common line arranged in the second direction substantially parallel with the data line; a thin film transistor including a gate electrode connected with the gate line, a source electrode connected with the data line, a drain electrode formed to face the source electrode, and an active layer formed to be overlapped with the gate electrode by interposing a gate insulating film between the active layer and the gate electrode; and a pixel electrode connected with the drain electrode.12-06-2012
20120305948LIGHT-EMITTING DIODE AND METHOD FOR MAKING THE SAME - A light-emitting diode includes: an epitaxial substrate including a base member, and a plurality of spaced apart first light-transmissive members; a light-emitting unit including a first-type semiconductor layer, a light-emitting layer, and a second-type semiconductor layer; and an electrode unit electrically connected to the light-emitting unit. The first-type semiconductor layer has a bottom film covering the first light-transmissive members, a plurality of spaced apart second light-transmissive members formed on a top face of the bottom film, and a top film formed on the bottom film to cover the second light-transmissive members.12-06-2012
20120305949Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies - An electronic device may include a packaging substrate having a packaging face and first and second pluralities of light emitting diodes electrically and mechanically coupled to the packaging face of the packaging substrate. The packaging substrate may include first and second electrically conductive pads on the packaging face. The light emitting diodes of the first plurality of light emitting diodes may be electrically coupled in parallel between the first electrically conductive pad and an interconnection structure on the packaging face. The light emitting diodes of the second plurality of light emitting diodes may be electrically coupled in parallel between the interconnection structure and the second electrically conductive pad.12-06-2012
20120146060Organic Light Emitting Display Device and Manufacturing Method for the Same - An organic light emitting display device may comprises a thin film transistor including an active layer, a gate electrode including a gate lower electrode and a gate upper electrode, a source electrode, a drain electrode, and an organic light emitting device electrically connected to the thin film transistor. A pixel electrode formed of the same material and in the same layer as the gate lower electrode, an intermediate layer including a light emitting layer, and an opposed electrode are sequentially deposited. A first pad electrode is formed in the same layer as the gate lower electrode, a second pad electrode is formed on at least a part of the first pad electrode and in the same layer as the gate upper electrode, and a third pad electrode contacts at least a part of the second pad electrode and is formed in the same layer as the source electrode.06-14-2012
20120037933LIGHT EMITTING DEVICE AND LIGHTING SYSTEM HAVING THE SAME - The present invention provides a light emitting device comprising a first light emitting portion that emits white light at a color temperature of 6000K or more and a second light emitting portion that emits white light at a color temperature of 3000K or less, which include light emitting diode chips and phosphors and are independently driven. The present invention has an advantage in that a light emitting device can be diversely applied in a desired atmosphere and use by realizing white light with different light spectrums and color temperatures. Particularly, the present invention has the effect on health by adjusting the wavelength of light or the color temperature according to the circadian rhythm of humans.02-16-2012
20120037932Display Device and Driving Method of the Same - A problem in that a light emitting element slightly emits light is solved by an off current of a thin film transistor connected in series to the light emitting element, thereby a display device which can perform a clear display by increasing contrast, and a driving method thereof are provided. When the thin film transistor connected in series to the light emitting element is turned off, a charge held in the capacitance of the light emitting element itself is discharged. Even when an off current is generated at the thin film transistor connected in series to the light emitting element, this off current charges this capacitance until the capacitance of the light emitting element itself holds a predetermined voltage again. Accordingly, the off current of the thin film transistor does not contribute to light emission. In this manner, a slight light emission of the light emitting element can be reduced.02-16-2012
20120037930METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, OPTOELECTRONIC COMPONENT, AND COMPONENT ARRANGEMENT HAVING A PLURALITY OF OPTOELECTRONIC COMPONENTS - A method for producing optoelectronic components including A) providing a growth substrate with a semiconductor layer arranged thereon that produces a zone which is active during operation, B) applying separating structures on the semiconductor layer, C) applying a multiplicity of copper layers on the semiconductor layer in regions delimited by the separating structures, D) removing the separating structures, E) applying, a protective layer at least on lateral areas of copper layers, F) applying an auxiliary substrate on the copper layers, G) removing the growth substrate, H) singulating a composite assembly comprising the semiconductor layer, the copper layers and the auxiliary substrate to form components which are separated from one another.02-16-2012
20120037929OPTOELECTRONIC COMPONENT - An optoelectronic component has an optoelectronic semiconductor chip, a contact frame, a contact carrier, a first electrical connection zone and a second electrical connection zone electrically insulated from the first electrical connection zone, which each have a part of the contact frame and a part of the contact carrier, wherein the contact frame has a recess which separates the first electrical connection zone at least in places from the second electrical connection zone and into which the optoelectronic semiconductor chip projects, and wherein the contact frame has a contact element which connects the contact frame electrically with the optoelectronic semiconductor chip.02-16-2012
20120037927LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode package structure includes a substrate (02-16-2012
20120037926SOLID STATE LIGHTS WITH COOLING STRUCTURES - A solid state lighting (SSL) with a solid state emitter (SSE) having thermally conductive projections extending into an air channel, and methods of making and using such SSLs. The thermally conductive projections can be fins, posts, or other structures configured to transfer heat into a fluid medium, such as air. The projections can be electrical contacts between the SSE and a power source. The air channel can be oriented generally vertically such that air in the channel warmed by the SSE flows upward through the channel.02-16-2012
20120205679Light-Emitting Module, Light-Emitting Panel, and Lighting Device - An object is to provide a light-emitting module in which a light-emitting element suffering a short-circuit failure does not cause wasteful electric power consumption. Another object is to provide a light-emitting panel in which a light-emitting element suffering a short-circuit failure does not allow the reliability of an adjacent light-emitting element to lower. Focusing on heat generated by a light-emitting element suffering a short-circuit failure, provided is a structure in which electric power is supplied to a light-emitting element through a positive temperature coefficient thermistor (PTC thermistor) thermally coupled with the light-emitting element.08-16-2012
20120205676Light-Emitting Device and Display Device - A technique of manufacturing a display device with high productivity is provided. In addition, a high-definition display device with high color purity is provided. By adjusting the optical path length between an electrode having a reflective property and a light-emitting layer by the central wavelength of a wavelength range of light passing through a color filter layer, the high-definition display device with high color purity is provided without performing selective deposition of light-emitting layers. In a light-emitting element, a plurality of light-emitting layers emitting light of different colors are stacked. The closer the light-emitting layer is to the electrode having a reflective property, the longer the wavelength of light emitted from the light-emitting layer is.08-16-2012
20130146903DISPLAY UNIT AND METHOD OF MANUFACTURING THE SAME, ELECTRONIC APPARATUS, ILLUMINATION UNIT, AND LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A display unit includes: a plurality of light-emitting devices; and a separation section disposed between any adjacent two of the plurality of light-emitting devices and including a photoexcited material. A light-emitting device includes: an excitation light source; a wavelength conversion layer converting excitation light emitted from the excitation light source into light of a wavelength different from a wavelength of the excitation light; and a wavelength selection film disposed on a surface farther from the excitation light source of the wavelength conversion layer.06-13-2013
20120037931SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING AN OPTICALLY TRANSMISSIVE ELEMENT AND METHODS FOR PACKAGING THE SAME - Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.02-16-2012
20110108860OPTOELECTRONIC MODULE - An optoelectronic module includes a layer structure having a plurality of semiconductor layers including a substrate layer, a first layer arrangement and a second layer arrangement arrangement, wherein 1) the first layer arrangement has a light-emitting layer arranged on the substrate layer, 2) the second layer arrangement contains at least one circuit that controls an operating state of the light-emitting layer, and 3) the second layer arrangement is arranged on the substrate layer and/or surrounded by the substrate layer.05-12-2011
20110316010LIQUID CRYSTAL DISPLAY DEVICE AND TELEVISION SET - Provided is a liquid crystal display device, including: a liquid crystal display panel; and a backlight unit, in which: the backlight unit includes: a plurality of light emitting diodes each having an anode and a cathode; a first substrate; and a second substrate, the plurality of light emitting diodes being mounted on the first substrate and the second substrate; the first substrate and the second substrate are disposed adjacent to each other; light emitting diodes which are adjacent across a boundary between the first substrate and the second substrate are disposed so that the respective anodes are opposed to each other and so as to have a pitch equal to or smaller than a pitch of other adjacent light emitting diodes.12-29-2011
20110316006Surface-Textured Encapsulations for use with Light Emitting Diodes - Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode (LED) array apparatus includes a plurality of LEDs mounted to a substrate and an encapsulation covering the LEDs and having a surface texturing configured to extract light, wherein the surface texturing is includes at least one light extracting feature having a diameter larger than two or more of the LEDs.12-29-2011
20110316013OLEDS CONNECTED IN SERIES - OLED device (12-29-2011
20110316008FLAT PANEL DISPLAY - According to one embodiment, a flat panel display includes a first mounting portion including a first input pad and a first output pad, a second mounting portion including a second input pad and a second output pad, a first common terminal and a second common terminal, which have a common potential, and a guard ring wiring which is formed in a manner to extend from the first common terminal, to pass between the first input pad and the first output pad of the first mounting portion, to pass between the second input pad and the second output pad of the second mounting portion, and to reach the second common terminal, the guard ring wiring including a first resistor element of a first resistance value and a second resistor element of a second resistance value which is higher than the first resistance value.12-29-2011
20110316007DISPLAY DEVICE - A display device includes, on a substrate, light emitting elements each formed by sequentially stacking a first electrode layer, an organic layer including a light emission layer, and a second electrode layer and arranged in first and second directions which cross each other, a drive circuit including drive elements that drive light emitting elements, and a wiring extending in the first direction, and an insulating layer disposed in a gap region sandwiched by the light emitting elements neighboring in the second direction and having a recess or a projection. The wiring is disposed in an overlap region overlapping with the recess or the projection in the insulating layer in a thickness direction, in the gap region, and the second electrode layers in the light emitting elements neighboring in the second direction are separated from each other by the recess or the projection in the insulating layer.12-29-2011
20110316011LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE UNIT, AND METHOD FOR FABRICATING LIGHT EMITTING DEVICE - In a light emitting device, a light emitting device unit, and a method for fabricating a light emitting device according to an embodiment of the present invention, a light emitting device (12-29-2011
20110316012ORGANIC LIGHT EMITTING DIODE SEGMENT - The invention relates to an organic light emitting diode segment (12-29-2011
20110316009LIGHT-EMITTING DEVICE - A light-emitting device includes a substrate, and a plurality of light-emitting arrays or light-emitting groups arranged on the substrate. The light-emitting arrays or light-emitting groups include a plurality of LED elements connected in parallel with a pair of adjacent electrodes. The number of the LED elements constituting each of the light-emitting arrays or the light-emitting groups differs in each of the light-emitting arrays or the light-emitting groups. Of the plurality of light-emitting arrays arranged in parallel with each other or the light-emitting groups arranged in a line, the number of the LED elements of the light-emitting arrays or the light-emitting groups positioned inside the substrate is more than the number of the LED elements of the light-emitting arrays or the light-emitting groups positioned outside the substrate.12-29-2011
20120043559LIGHT EMITTING DEVICE - There is provided a light emitting device which includes a light emitting element having a main emission peak in the wavelength region of greater than 420 nm and equal to or less than 500 nm, and a phosphor layer formed on the light emitting element. The light emitting element of this light emitting device has a junction temperature of from 100° C. to 200° C. at the time of continuous driving. Furthermore, the phosphor layer contains a phosphor represented by the following general formula (A), which absorbs the light emitted from the light emitting element and thereby emits light having a main emission peak in the wavelength region of equal to or greater than 650 nm and equal to or less than 665 nm:02-23-2012
20090261358EMISSION TUNING METHODS AND DEVICES FABRICATED UTILIZING METHODS - A method for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs, typically on a wafer, and coating the LEDs with a conversion material so that at least some light from the LEDs passes through the conversion material and is converted. The light emission from the LED chips comprises light from the conversion material, typically in combination with LED light. The emission characteristics of at least some of the LED chips is measured and at least some of the conversion material over the LEDs is removed to alter the emission characteristics of the LED chips. The invention is particularly applicable to fabricating LED chips on a wafer where the LED chips have light emission characteristics that are within a range of target emission characteristics. This target range can fall within an emission region on a CIE curve to reduce the need for binning of the LEDs from the wafer. The emission characteristics of the LED chips in the wafer can be tuned to the desired range by micro-machining the conversion material over the LEDs.10-22-2009
20120043562ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR - Provided is an organic eletroluminescence display device, which is capable of preventing transfer of an attached matter from the vapor deposition mask to the insulating layer, without increasing steps or manufacturing cost. The organic eletroluminescence display device includes: a first insulating layer formed on a substrate; multiple first electrodes disposed on the first insulating layer; an opening formed in the first insulating layer at a periphery of the first electrode; a second insulating layer disposed in a region overlapping with the opening; an organic compound layer covering the first electrodes; and a second electrode formed on the organic compound layer, in which: a material forming the first electrodes is absent in the opening; and the second insulating layer has a recess formed in a surface thereof, reflecting the opening of the first insulating layer, the recess being formed in a vertical direction of the substrate surface.02-23-2012
20120043558ACTIVE DEVICE ARRAY SUBSTRATE AND METHOD FOR FABRICATING THE SAME - An active device array substrate and a fabricating method thereof are provided. A first patterned conductive layer including separated scan line patterns is formed on a substrate. Each scan line pattern includes a first and second scan lines adjacent to each other. Both the first and the second scan lines have first and second contacts. An open inspection on the scan line patterns is performed. Channel layers are formed on the substrate. A second patterned conductive layer including data lines interlaced with the first and second scan lines, sources and drains located above the channel layers, and connectors is formed on the substrate. The sources electrically connect the data lines correspondingly. At least one of the connectors electrically connects the first and second scan lines, so as to form a loop in each scan line pattern. Pixel electrodes electrically connected to the drains are formed.02-23-2012
20120061699ELECTRIC LAMP - An electric lamp (03-15-2012
20120061694LIGHT-EMITTING STRUCTURE - An embodiment of the present application discloses a light-emitting structure, comprising a first unit; a second unit; a trench formed between the first unit and the second unit, and having a less steep sidewall and a steeper sidewall steeper than the less steep sidewall; and an electrical connection arranged on the less steep sidewall.03-15-2012
20120205682Semiconducting sheet - A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements.08-16-2012
20120205683Semiconducting sheet - A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements.08-16-2012
20120205681DISPLAY APPARATUS - Provided is a display apparatus and a method of manufacture. The display apparatus includes a first substrate with a plurality of organic electroluminescence devices, a second substrate with a color filter, the second substrate facing the first substrate, and an adhesive layer disposed between the first substrate and the second substrate so as to cover the plurality of organic electroluminescence devices, the adhesive layer being made of a material selected from the group consisting of a phenol resin, a melanin resin, an unsaturated polyester resin, an epoxy resin, a silicon resin and a polyurethane resin.08-16-2012
20120205677LED MODULE - An LED module includes a substrate, one or more LED chips supported by a main surface of the substrate, and wirings. The substrate has one or more through holes penetrating from the main surface to a rear surface. The wirings are formed on the substrate and make electrical conduction with the LED chips. The wirings include pads which are formed on the main surface and make electrical conduction with the LED chips, rear surface electrodes which are formed on the rear surface, and through wirings which make electrical conduction between the pads and the rear surface electrodes and are formed on the inner sides of the through holes.08-16-2012
20120205673Organic Light-Emitting Display Device - An organic light-emitting display device. The organic light-emitting display device includes a substrate, a semiconductor layer arranged on the substrate, an insulating film arranged on the semiconductor layer and a conductive layer arranged on the insulating film, wherein the semiconductor layer comprises a plurality of protrusion lines extending in a first direction, the protrusion lines being parallel to a peripheral edge of the conductive layer.08-16-2012
20120001202Semiconductor Light Emitting Device and Method for Manufacturing the Same - A method for manufacturing a semiconductor light emitting device includes: (a) providing a temporary substrate; (b) forming a multi-layered LED epitaxial structure, having at least one light emitting unit, on the temporary substrate, wherein a first surface of the light emitting unit contacts the temporary substrate, and the light emitting unit includes a n-type layer, an active region, and a p-type layer; (c) forming a n-electrode on the n-type layer; (d) forming a p-electrode on the p-type layer; (e) bonding a permanent substrate on the light emitting unit, the n-electrode and the p-electrode; (f) removing the temporary substrate to expose the first surface of the light emitting unit; and (g) removing a portion of the light emitting unit from the first surface, to expose at least one of the n-electrode and the p-electrode.01-05-2012
20120001204COLOR ADJUSTING ARRANGEMENT - Disclosed is a color adjusting arrangement comprising: i) a first wavelength converting material arranged to receive ambient light and capable of converting ambient light of a first wavelength range into light of a second wavelength range, and/or reflecting ambient light of said second wavelength range, said second wavelength range being part of the visible light spectrum; and ii) a complementary wavelength converting material arranged to receive ambient light and capable of converting part of said ambient light into light of a complementary wavelength range, which is complementary to said second wavelength range, and arranged to allow mixing of light of said second wavelength range and said complementary wavelength range; such that light of said second wavelength range that is emitted and/or reflected by said first wavelength converting material and light of said complementary wavelength range is mixed when leaving the color adjusting arrangement towards a viewing position, the light leaving the color adjusting arrangement thereby appearing less colored, i.e. having a color point substantially near the black body line. The invention thus allows an undesirable colored appearance of a semiconductor-phosphor based light source to be at least partly extinguished or neutralized.01-05-2012
20110156061Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof - A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.06-30-2011
20110156060Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof - A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.06-30-2011
20110156063ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAY DEVICE - An exemplary OLED display device includes a substrate, a colored photo-resist layer and a white OLED arranged in that order. The white OLED includes a reflecting electrode, a transmitting electrode, and an organic white light emitting layer arranged between the reflecting electrode and the transmitting electrode for emitting a white light. The colored photo-resist layer at least includes first through third photo-resist regions, the first through third photo-resist regions contain red pigment particles, green pigment particles and blue pigment particles respectively for extracting red, green and blue light components from the white light. Moreover, the colored photo-resist layer has an expected haze value e.g., greater than 30 by at least utilizing the scattering of the red, green and blue pigment particles and/or mixing of scattering particles that are different from the red, green and blue pigment particles into the first through third photo-resist regions.06-30-2011
20110156064LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - Disclosed are a light emitting device and a method of fabricating the same. The light emitting device includes a substrate; first and second light emitting cells, each including a first semiconductor layer, an active layer, and a second semiconductor layer; and a connector located between the first and second light emitting cells and the substrate, to electrically connect the first and second light emitting cells to each other. The connector extends from the second semiconductor layer of the first light emitting cell, across the substrate, and through central regions of the second semiconductor layer and active layer of the second light emitting cells, to contact the first semiconductor layer of the second light emitting cell.06-30-2011
20110156062ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display device and a method of manufacturing the same. The organic light-emitting display device includes a first film formed of an inorganic material, a second film that is formed of an organic material and formed on the first film, and includes a first surface and a second surface facing each other and lateral surfaces at boundaries of the first surface and the second surface, with the first surface contacting the first film, a third film that is formed of an inorganic material and covers the second surface and lateral surfaces of the second film, with a first sealing region contacting the first film being formed at a boundary between the second film and the third film, an organic light-emitting unit that is disposed on the third film to overlap with the second film, and a fourth film that covers the organic light-emitting unit, with a second sealing region contacting the third film being formed at a boundary of the fourth film. Accordingly, the organic light-emitting display device is protected from water penetration, thereby providing a long life span to the organic light-emitting display device.06-30-2011
20120043564COMMON OPTICAL ELEMENT FOR AN ARRAY OF PHOSPHOR CONVERTED LIGHT EMITTING DEVICES - A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced.02-23-2012
20120043563High Voltage Low Current Surface Emitting Light Emitting Diode - A light emitting diode chip includes a submount, a reflective layer on the submount, an insulating layer on the reflective layer opposite the submount, and a plurality of sub-LEDs on the insulating layer. Each of the sub-LEDs includes a first face adjacent to the submount and a transparent contact on the first face between the sub-LED and the insulating layer and electrical interconnects between adjacent ones of the sub-LEDs.02-23-2012
20120056213LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, DISPLAY DEVICE, AND ELECTRONIC APPARATUS - A light-emitting element includes: an anode; a cathode; a light-emitting layer which is provided between the anode and the cathode and emits light as the anode and the cathode are electrically connected to each other; and an organic layer which is provided between the anode and the light-emitting layer to come in contact with both layers. The organic layer has a first function of transporting holes and a second function of preventing electrons infiltrating from the light-emitting layer from staying in the organic layer.03-08-2012
20120056211POLARIZING FILM, OPTICAL FILM LAMINATE INCLUDING POLARIZING FILM, STRETCHED LAMINATE FOR USE IN PRODUCTION OF OPTICAL FILM LAMINATE INCLUDING POLARIZING FILM, PRODUCTION METHODS FOR THEM, AND ORGANIC EL DISPLAY DEVICE HAVING POLARIZING FILM - Provided is a continuous web of polarizing film for an organic EL display device which has a thickness of 10 μm or less and exhibits high optical characteristics. The polarizing film for an organic EL display device is made of a polyvinyl alcohol type resin having a molecularly oriented dichroic material, and formed through stretching to have a thickness of 10 μm or less and exhibit optical characteristics satisfying the following conditions: T≧42.5; and P≧99.5, wherein T is a single layer transmittance, and P is a polarization rate. The polarizing film for an organic EL display device may be prepared by subjecting a laminate comprising a non-crystallizable ester type thermoplastic resin substrate and the polyvinyl alcohol type resin layer formed on the substrate, to 2-stage stretching consisting of preliminary in-air stretching and in-boric-acid-solution stretching.03-08-2012
20120056215LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.03-08-2012
20120056212LIGHT-EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF - A light-emitting device includes: a carrier; a light-emitting structure formed on the carrier, wherein the light-emitting structure has a first surface facing the carrier, a second surface opposite to the first surface, and an active layer between the first surface and the second surface; a plurality of first trenches extended from the first surface and passing through the active layer so a plurality of light-emitting units is defined; and a plurality of second trenches extended from the second surface and passing through the active layer of each of the plurality of light-emitting units.03-08-2012
20120056209LIGHT EMITTING DEVICE - A light emitting device according to one embodiment includes a board; plural first light emitting elements mounted on the board to emit light having a wavelength of 250 nm to 500 nm; plural second light emitting elements mounted on the board to emit light having a wavelength of 250 nm to 500 nm; a first fluorescent layer formed on each of the first light emitting elements, the first fluorescent layer including a first phosphor; and a second fluorescent layer formed on each of the second light emitting elements, the second fluorescent layer including a second phosphor. The second phosphor is higher than the first phosphor in luminous efficiency at 50° C., and is lower than the first phosphor in the luminous efficiency at 150° C.03-08-2012
20120056207PIXEL ARRAY - A pixel array includes pixel sets. Each pixel set includes a first and second scan lines arranged in parallel on a substrate, a data line not parallel to the first and second scan lines, a first active device electrically connecting the first scan line and the data line, a second active device electrically connecting the second scan line and the data line, a first pixel electrode electrically connecting the first active device, a second pixel electrode electrically connecting the second active device, and an auxiliary electrode pattern that includes a connecting portion and a first and second branch portions. A gap is between the first and second pixel electrodes. The connecting portion underneath the gap between the first and second pixel electrodes partially overlaps the first and second pixel electrodes. The first and second branch portions connect the connecting portion and partially overlap the first and second pixel electrodes, respectively.03-08-2012
20120056206SOLID STATE LIGHTING DIES WITH QUANTUM EMITTERS AND ASSOCIATED METHODS OF MANUFACTURING - Solid state lighting dies and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state lighting die includes a substrate material, a first semiconductor material, a second semiconductor material, and an active region between the first and second semiconductor materials. The second semiconductor material has a surface facing away from the substrate material. The solid state lighting die also includes a plurality of openings extending from the surface of the second semiconductor material toward the substrate material.03-08-2012
20120056210LIGHT EMITTING APPARATUS AND MULTI-SURFACE PATTERN SUBSTRATE - A light emitting apparatus capable of increasing the number of substrates formed from one multi-surface pattern substrate and capable of reducing the manufacturing cost. The light emitting apparatus (03-08-2012
20120056208SYSTEM FOR DISPLAYING IMAGES - A system for displaying images includes an organic light-emitting device (OLED) including an anode layer on a substrate, a cathode layer, and an organic light-emitting layer disposed between the anode and cathode layers. The cathode layer includes a metal layer in direct contact with the organic light-emitting layer, a transparent conductive layer, and an organic buffer layer with a carrier mobility in a range of 1003-08-2012
20120007112LIGHT EMITTING DEVICE - A light emitting device includes a substrate, a light emitting element, an additional light emitting element, a light reflecting resin member, an electrically conductive wire, an additional electrically conductive wire, and a sealing member. The substrate is provided with a conductor wiring. The light emitting element is mounted on the substrate. The electrically conductive wire electrically connects the conductor wiring and the light emitting element with at least a part of the electrically conductive wire being embedded in the light reflecting resin member. The additional electrically conductive wire electrically connects the light emitting element and the additional light emitting element, with the additional electrically conductive wire not being in contact with the light reflecting resin member. The sealing member is disposed in a region surrounded by the light reflecting resin member to cover the light emitting element.01-12-2012
20120007111LIGHT EMITTING DEVICE MODULE AND LIGHTING SYSTEM INCLUDING THE SAME - Disclosed herein is a semiconductor light emitting device module comprising: a heat transfer member having a cavity; first conductive layer and second conductive layer contacting the heat transfer member via an insulating layer, the first conductive layer and the second conductive layer being electrically separated from each other in accordance with exposure of the insulating layer or exposure of the heat transfer member; and at least one semiconductor light emitting device electrically connected to the first conductive layer and the second conductive layer, the at least one semiconductor light emitting device is thermally contacted an exposed portion of the heat transfer member, wherein the insulating layer has an exposed portion disposed outside the cavity.01-12-2012
20120007110Light Emitting Device - To provide a light emitting device in which generation of cross talk between adjacent light emitting elements is suppressed, even when the light emitting device uses a light emitting element having high current efficiency. Also, to provide a light emitting device having high display quality even when the light emitting device uses a light emitting element having high current efficiency. The light emitting device has a pixel portion including a plurality of light emitting elements, wherein each of the plurality of light emitting elements includes a plurality of light emitting bodies provided between a first electrode and a second electrode and a conductive layer formed between the plurality of light emitting bodies, wherein the conductive layer is provided for each light emitting element, and wherein an edge portion of the conductive layer is covered with the plurality of light emitting bodies.01-12-2012
20120007108LIGHT EMITTING DEVICE AND DISPLAY APPARATUS - A light emitting device includes: a light emitting chip arranged on a substrate; a resin lens which covers the light emitting chip and focuses irradiation light from the light emitting chip; a mask which covers a region of an upper layer surface of the substrate, other than the resin lens; and a low surface tension film formed on a region of the upper layer surface of the substrate, other than in the proximity of the light emitting chip.01-12-2012
20120007107Organic light emitting diode display and manufacturing method thereof - An organic light emitting diode (OLED) display includes: a first substrate; a display portion that is formed on the first substrate and includes a driving circuit portion and an organic light emitting diode; a thin film encapsulation layer that covers the display portion; an adhesive layer that covers an upper surface and a side of the thin film encapsulation layer; an absorption functional layer that is formed on the adhesive layer and absorbs at least one of oxygen and moisture; and a second substrate that is formed on the absorption functional layer.01-12-2012
20120119228LED DEVICE WITH IMPROVED THERMAL PERFORMANCE - An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.05-17-2012
20100270563METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, ACTIVE MATRIX DEVICE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS - A method of manufacturing a semiconductor device includes: forming, on one surface of a substrate, source electrodes and drain electrodes, a semiconductor layer provided between the source electrodes and the drain electrodes, and a gate insulator layer provided to cover a surface of the semiconductor layer; forming an insulator layer on a surface of the gate insulator layer, the insulator layer having through portions; and forming electrodes on the gate insulator layer around the bottom of the through portions and on the insulator layer in the vicinity of the through portions by a vapor film formation method simultaneously so as not to come into contact with each other, forming gate electrodes by using the electrodes formed on the gate insulator layer, and forming pixel electrodes electrically connected to the source electrodes or the drain electrodes by using the electrodes formed on the insulator layer.10-28-2010
20130119414LIGHT-EMITTING DEVICES WITH VERTICAL LIGHT-EXTRACTION MECHANISM - A light-emitting device comprises a lattice structure to minimize the horizontal waveguide effect by reducing light traveling distance in the light-absorption medium of the light-emitting devices, and to enhance light extraction from the light-emitting layer. The lattice structure includes sidewalls and/or rods embedded in the light-absorption medium and dividing the light-absorption medium into a plurality of area units. The area units are completely isolated or partially separated from each other by the sidewalls. Also provided is a method of fabricating a light-emitting device that comprises a lattice structure, which lattice structure includes sidewalls and/or rods embedded in the light-absorption medium and dividing the light-absorption medium into a plurality of area units.05-16-2013
20120205674LIGHT EMITTING DEVICE HAVING SURFACE-MODIFIED SILICATE LUMINOPHORES - Exemplary embodiments of the present invention relate to a light emitting device including a light emitting diode and a surface-modified luminophore. The surface-modified luminophore includes a silicate luminophore and a fluorinated coating arranged on the silicate luminophore.08-16-2012
20120205680SEMICONDUCTOR LIGHT EMITTING DEVICE, OPTICAL PICKUP UNIT AND INFORMATION RECORDING/REPRODUCTION APPARATUS - A semiconductor light emitting device downsized by devising arrangement of connection pads is provided. A second light emitting device is layered on a first light emitting device. The second light emitting device has a stripe-shaped semiconductor layer formed on a second substrate on the side facing to a first substrate, a stripe-shaped p-side electrode supplying a current to the semiconductor layer, stripe-shaped opposed electrodes that are respectively arranged oppositely to respective p-side electrodes of the first light emitting device and electrically connected to the p-side electrodes of the first light emitting device, connection pads respectively and electrically connected to the respective opposed electrodes, and a connection pad electrically connected to the p-side electrode. The connection pads are arranged in parallel with the opposed electrodes.08-16-2012
20110018010INFRARED LIGHT EMITTING DEVICE - Provided is an infrared light emitting device in which dark current and diffusion current caused by thermally excited holes are suppressed. Thermally excited carriers (holes) generated in a first n-type compound semiconductor layer (01-27-2011
20120012866BACKLIGHT MODULE AND LIGHT-EMITTING SOURCE PACKAGE STRUCTURE THEREOF - The present invention provides a backlight module and a light-emitting source package structure thereof. The light-emitting source package structure comprises: a heat-dissipation base, at least one chip and a heat-dissipation fixing element. The heat-dissipation base has a connection hole. The heat-dissipation fixing element further has a connection post and a heat-dissipation fin with an abutting surface, and the connection post of the heat-dissipation fixing element passes through a through hole of a fixed plate to fix in the connection hole, so that for closely aligning the abutting surface of the heat-dissipation fin and can abut against the fixed plate. Thus, and the heat-dissipation base and the heat-dissipation fixing element are stably fixed on the both sides of the fixed plate to ensure the tightly abutting relationship with the fixed plate and enhance the assembly reliability. Meanwhile, the heat-dissipation fin can additionally increase the heat-dissipation efficiency of the heat-dissipation fixing element. Thus, the temperature of the chip can be surely lowered to prevent from lowing the working efficiency of the chip. Hence, it is advantageous for the chip to stably work, and the lifetime thereof can be increased.01-19-2012
20120012865LED ARRAY PACKAGE WITH A HIGH THERMALLY CONDUCTIVE PLATE - A light source includes a substrate, a light emitting diode on the substrate, and a plate supporting member attached to the substrate and surrounding the light emitting diode to form a cavity. In addition, the light source includes a plate on the plate supporting member such that a distance between the plate and the substrate is approximately less than or equal to 1 mm. Furthermore, the light source includes a phosphor layer on the plate opposite the cavity.01-19-2012
20120205678Light-Emitting Device and Manufacturing Method Thereof, Lighting Device, and Display Device - In a light-emitting device, an insulating separation layer whose upper portion protrudes more than a bottom portion in a direction parallel to a substrate is provided on and in contact with a common wiring provided over the substrate. An EL layer provided over the separation layer on the common wiring is physically divided by the separation layer. An upper electrode layer formed in the same position is also physically divided by the separation layer and is in contact with the common wiring in a region overlapped with the most protruding portion of the separation layer. Such a common wiring may be used as an auxiliary wiring. Further, such a light-emitting device may be applied to a lighting device and a display device.08-16-2012
20110049538FLIP CHIP LED DIE AND ARRAY THEREOF - A flip chip LED die is provided and includes a first type doped layer, a second type doped layer, a first electrode layer, a second electrode layer and an insulation layer. The second type doped layer is disposed under the first type doped layer. The first electrode layer is disposed under the first type doped layer without contacting the second type doped layer. The first electrode layer has an exposed area for directly coating an electrically conductive adhesive thereon. The second metal/electrode layer is disposed under the second type doped layer, and also has an exposed area for directly coating the electrically conductive adhesive thereon. The insulation layer is disposed between the first electrode layer and the second electrode layer for electrically insulating and supporting the first electrode layer and the second electrode layer.03-03-2011
20110049537LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME - Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a plurality of light emitting cells including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode layer connected to the first conductive semiconductor layer of a first light emitting cell of the plural light emitting cells; a plurality of second electrode layers under the light emitting cells, a portion of the second electrode layers being connected to the first conductive semiconductor layer of an adjacent light emitting cells; a third electrode layer disposed under a last light emitting cell of the plural light emitting cells; a first electrode connected to the first electrode layer; a second electrode connected to the third electrode layer; an insulating layer around the first to third electrode layers; and a support member under the insulating layer.03-03-2011
20110049536LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING SAME - An exemplary light emitting diode package includes a housing, and a light emitting unit received in the housing. The light emitting unit includes a first carbon nanotube layer, a plurality of spaced light emitting chips, and a second carbon nanotube layer. The light emitting chips are formed on the first carbon nanotube layer. The second carbon nanotube layer covers the light emitting chips.03-03-2011
20120153311LOW-COST SOLID-STATE BASED LIGHT EMITTING DEVICES WITH PHOTOLUMINESCENT WAVELENGTH CONVERSION AND THEIR METHOD OF MANUFACTURE - A method of manufacturing a light emitting device comprises: mounting and electrically connecting a plurality of solid-state light emitters onto a substrate in a known configuration; screen printing a pattern of at least one photo luminescent material onto a surface of a light transmissive carrier such that there is a respective region of photo luminescent material corresponding to a respective one of the light emitters and mounting the carrier to the substrate such that each region of photo luminescent material overlays a respective one of the light emitters. Where the light transmissive carrier comprises a thermo formable material the method can further comprise heating and vacuum molding the carrier such as to form an array of hollow features configured such that a respective feature corresponds to a respective light emitter and is capable of housing a respective light emitter.06-21-2012
20120104425Method of Driving A Light Emitting Device - The present invention is characterized in that a transistor with its L/W set to 10 or larger is employed, and that |V05-03-2012
20120025220POLARIZED, LED-BASED ILLUMINATION SOURCE - An illumination source includes a number of light emitting diodes (LEDs) operating at a first wavelength. Light from the LEDs illuminates a phosphor material that generates light at a second wavelength. A reflective polarizer transmits light at the second wavelength in a first polarization state and reflects light at the second wavelength in a second polarization state orthogonal to the first polarization state. The light at the second wavelength reflected by the reflective polarizer is directed back towards the phosphor material without an increase in angular range. In some embodiments the LEDs, having a conformal layer of phosphor material, are attached directly to the first surface of a liquid cooled plate. A liquid coolant contacts a second surface of the plate.02-02-2012
20120061695LIGHT-EMITTING DIODE PACKAGE - A light emitting diode (LED) package is provided. The LED package includes: a package body including an LED; a bottom heat transfer metal layer formed on the bottom of the package body; and a metal plate bonded to the bottom heat transfer metal layer, wherein the bottom heat transfer metal layer is bonded to the metal plate through soldering or an adhesive such as Ag epoxy, and the metal plate includes only metal without a resin layer.03-15-2012
20120061697ORGANIC LIGHT-EMITTING ELEMENT, ORGANIC LIGHT-EMITTING TRANSISTOR, AND LIGHT-EMITTING DISPLAY DEVICE - An organic light-emitting element comprises a large number of unit pixels each at least composed of a base, an auxiliary electrode, a first insulating layer to cover at least the auxiliary electrode, a charge injection layer on the first insulating electrode, laminated bodies each consisting of a first electrode and a second insulating layer and provided in a predetermined pattern, an organic light-emitting layer formed in regions where the laminated bodies are not provided, and a second electrode to cover at least the organic light-emitting layer. The unit pixel has first partitions provided to demarcate the organic light-emitting layer from other adjacent unit pixels and at least one or more second partitions to have a uniform coated thickness, and at least one of the first partition and the second partition is the laminated body.03-15-2012
20120061693OPTOELECTRONIC COMPONENT WITH FLIP-CHIP MOUNTED OPTOELECTRONIC DEVICE - Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.03-15-2012
20120061692LIGHT EMITTING DIODE PACKAGE HAVING INTERCONNECTION STRUCTURES - A light emitting diode (LED) package includes a substrate, a first LED chip and a second LED chip. The substrate includes first to fourth electrodes, and an interconnection electrode. A mounting area is defined at center of a top surface of the substrate. The first to fourth electrodes are respectively in four corners of the substrate out of the mounting area. The first interconnection electrode is embedded in the substrate to electrically connect the first and the third electrodes. The first LED chip and the second LED chip are arranged in the mounting area. Each LED chip includes an anode pad and a cathode pad. The first to fourth electrodes are respectively connected to the four pads of the first and the second LED chips via a plurality of metal wires, and no metal wire connection is formed between the first and the second LED chips.03-15-2012
20120061691LIGHT-EMITTING DEVICE - This disclosure discloses a light-emitting device. The light-emitting device comprises: a light-emitting array comprising a first light-emitting unit and a second light-emitting unit electrically connected in serial with the first light-emitting unit; at least two first bonding pads formed on the first light-emitting unit; and at least two second bonding pads formed on the second light-emitting unit. One of the two first bonding pads is in a floating level, and one of the two second bonding pads is in a floating level.03-15-2012
20120061698Method for Treating Metal Surfaces - A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications and in manufacturing light emitting diodes (LEDs).03-15-2012
20100102337LIGHT EMITTING DIODE FOR AC OPERATION - The present invention discloses a light emitting diode (LED) including a plurality of light emitting cells arranged on a substrate. The LED includes half-wave light emitting units each including at least one light emitting cell, each half-wave light emitting unit including first and second terminals respectively arranged at both ends thereof; and full-wave light emitting units each including at least one light emitting cell, each full-wave light emitting units including third and fourth terminals respectively formed at both ends thereof. The third terminal of each full-wave light emitting unit is electrically connected to the second terminals of two half-wave light emitting units, and the fourth terminal of each full-wave light emitting unit is electrically connected to the first terminals of other two half-wave light emitting units. Also, a first half-wave light emitting unit is connected in series between the third terminal of a first full-wave light emitting unit and the fourth terminal of a second full-wave light emitting units, and a second half-wave light emitting units is connected in series between the fourth terminal of the first full-wave light emitting unit and the third terminal of the second full-wave light emitting unit.04-29-2010
20120068202ACTIVE MATRIX SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND DISPLAY EQUIPMENT USING ACTIVE MATRIX SUBSTRATE MANUFACTURED BY THE SAME METHOD - The present invention provides an active matrix substrate and a method of manufacturing the same by decreasing the number of photolithographic processes to reduce the manufacturing cost. The invention also provides a display device using an active matrix substrate manufactured by said manufacturing method. In a process for preparing pixels on an active substrate, which constitutes a display device, a bank or an etching pattern is formed by performing half-tone exposure on a photo resist film or on a black color photo resist film where an active matrix and a display electrode are prepared by coating, and an insulator film is fabricated, and a transparent conductive film and a color filter are prepared by inkjet method.03-22-2012
20120153314LIGHT SIGNAL - A light signal contains a semiconductor light source and a convex lens system for representing signal aspects, especially on rail-bound traffic routes. In order to eliminate the need for monochrome semiconductor light sources, the semiconductor light source is a white point light source. A signal aspect-specific color filter is provided in the aperture region of the point light source.06-21-2012
20110042695LIGHT EMITTING DEVICE AND DISPLAY PANEL - Organic semiconductor layers include between a first electrode and a photoelectric converting layer a light extraction improving layer that contains at least silver or gold in part as a component, partially reflects light, and has transparency. The light extraction improving layer is in contact with or is inserted into a functional layer containing, for example, an organic semiconductor material, an oxide, a fluoride, or an inorganic compound having strong acceptor properties or strong donor properties with an ionization potential of 5.5 eV or higher, within the organic semiconductor layers.02-24-2011
20110042694LIGHT-EMITTING ELEMENT AND DISPLAY PANEL - Light extraction efficiency is improved as a whole light emitting element. A light emitting element (02-24-2011
20110042693SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device (02-24-2011
20110042692ACTIVE MATRIX SUBSTRATE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC DEVICE - An active matrix substrate is provided which does not cause reductions in the brightness of electroluminescence elements, and which comprises appropriate peripheral circuitry occupying a small area. The active matrix substrate comprises peripheral circuits to supply current to EL elements provided for each pixel, and corresponding to EL elements, and further comprises a holding element (C) which holds a control voltage, a first active element (T02-24-2011
20110042691ORGANIC ELECTROLUMINESCENT DISPLAY AND MANUFACTURING METHOD THEREFOR - This invention provides a means for suppressing streaks of light emission in an organic EL display having an organic light-emitting layer formed by coating by an ink jet method. A manufacturing process of the organic EL display of this invention includes: preparing a display substrate having two or more linear banks in parallel to each other, and two or more pixel regions arranged in a region between the linear banks; arranging an ink jet head such that the alignment direction of nozzles and the line direction of the linear banks are in parallel; and relatively moving the ink jet head in a direction perpendicular to the line direction of the linear banks and discharging the ink from the nozzles to apply the ink to every region defined by the linear banks.02-24-2011
20090272985White LED Lamp and Backlight Using the Same, and Liquid Crystal Display Device Using the Backlight - This invention provides a white LED lamp using an ultraviolet light emitting LED, which can simultaneously realize a high level of color rendering and a high level of brightness by virtue of an improved combination of a blue light emitting phosphor, a green light emitting phosphor, and a red light emitting phosphor.11-05-2009
20120153310DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A display substrate includes an insulating substrate, a signal line, first and second pixel electrodes, a connection line and an insulating layer. The signal line is disposed on the insulating substrate. The first pixel electrode is electrically connected to the signal line through a switching element. The second pixel electrode overlaps the first pixel electrode. The connection line contacts an end portion of the signal line and extends to an end portion of the insulating substrate. The insulating layer is disposed between the first and second pixel electrodes and covers the connection line. The connection line is protected by the insulating layer, and the reliability of the display substrate is enhanced.06-21-2012
20120153316LIGHT EMITTING DEVICE HAVING A TRANSPARENT THERMALLY CONDUCTIVE LAYER - A light emitting device and method of producing the same is disclosed. The light emitting device includes a transparent thermally conductive layer, a phosphor layer provided on the transparent thermally conductive layer, wherein the phosphor layer is not enclosed within any layers not containing phosphor, and at least one light emitting semiconductor arranged to emit light toward the transparent thermally conductive layer and the phosphor layer.06-21-2012
20120153313LIGHT EMITTING DEVICE AND ILLUMINATION APPARATUS USING SAME - A light emitting device includes a solid light-emitting element; a mounting substrate mounting the solid light-emitting element thereon; an encapsulating member encapsulating the solid light-emitting element; and a lead frame electrically connected to the solid light-emitting element through a wire. The lead frame is arranged on a rear surface of the mounting substrate, and the mounting substrate includes a front mounting surface on which the solid light-emitting element is mounted. The front mounting surface having a smooth surface region covered with the encapsulating member. The mounting substrate further includes a wire hole through which the wire extends from the front mounting surface of the mounting substrate to the rear surface thereof.06-21-2012
20120153315LIGHT EMITTING DEVICE - A light emitting device includes: a chip-mounting base formed with a plurality of conductive contacts; a reflector mounted on the chip-mounting base and defining a central hole; a first light emitting chip mounted on the chip-mounting base within the central hole and in electrical contact with respective ones of the conductive contacts for generating light with a first primary wavelength; a second light emitting chip stacked on and in electrical contact with the first light emitting chip for generating light with a second primary wavelength different from the first primary wavelength; and an encapsulant filling the central hole and capable of converting the first and second primary wavelengths into first and second secondary wavelengths, respectively.06-21-2012
20120153312ARRAY SUBSTRATES AND METHODS FOR MANUFACTURING THE SAME - Disclosed is a method of forming array substrates having a peripheral wiring area and a display area. The method is processed by only three lithography processes with two multi-tone photomasks and one general photomask. In the peripheral wiring area, the top conductive line directly contacts the bottom conductive line without any other conductive layer. The conventional lift-off process is eliminated, thereby preventing a material (not dissolved by a stripper) from suspending in the stripper or remaining on the array substrate surface.06-21-2012
20120153307LED LIGHTING DEVICE WITH EXCELLENT HEAT DISSIPATION PROPERTY - The present invention relates to an improved LED lighting device with good heat dissipation, comprising: a housing; a copper circuit layer, disposed on the housing; a plurality of LED chips, disposed on the copper circuit layer; and a white reflective member, disposed on the plurality of LED chips and the copper circuit layer, wherein the white reflective member is used to increase the light-emitting efficiencies of the LED chips. In the present invention, the copper circuit layer is directly disposed on the housing without using an aluminum substrate or a print circuit board, so that the cost of the improved LED lighting device is reduced; moreover, that also prevents the LED chips from damage when welding the LED chips, and makes the improved LED lighting device performing better heat dissipation property.06-21-2012
20120153309DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A display apparatus includes a first insulating substrate including a display area in which a first opening is formed, as well as a non-display area. A second insulating substrate faces the first insulating substrate. The second insulating substrate includes a shutter part having a second opening corresponding to the first opening. The shutter part moves between two different positions to transmit or block light according to an overlap between the first opening and the second opening.06-21-2012
20120153308ORGANIC LIGHT-EMITTING DISPLAY APPARATUS - An organic light-emitting display apparatus is disclosed. In one embodiment, the display apparatus includes i) a substrate and ii) an organic light-emitting device formed on the substrate, the organic light-emitting device including a stack structure including a first electrode, an organic light-emitting layer, and a second electrode. The apparatus may further include a sealing layer formed on the substrate so as to cover the organic light-emitting device, the sealing layer including an inorganic layer and a porous layer interposed between the sealing layer and the organic light-emitting device. One embodiment can reduce a stress due to a sealing inorganic layer so as to maintain characteristics for a long time in a severe environment and not affect an organic light-emitting device.06-21-2012
20120153306HIGH POWER LEDS WITH NON-POLYMER MATERIAL LENSES AND METHODS OF MAKING THE SAME - LED chips and packages are disclosed having lenses made of materials that resist degradation at higher operation temperatures and humidity, and methods of fabricating the same. The lenses can be made of certain materials that can withstand high temperatures and high humidity, with the lenses mounted to the LED prior to certain critical metallization steps. This helps avoid damage to the metalized part that might occur as a result of the high mounting or bonding temperature for the lens. One embodiment of an LED chip comprises a flip-chip LED and a lens mounted to the topmost surface of the flip-chip LED. Lenses can be bonded to LEDs at the wafer level or at the chip level. The lens comprises a non-polymer material and the LED chip is characterized as having substantially no polymer materials in contact with the LED chip.06-21-2012
20100096646SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS HAVING THEREOF - Embodiments relate to a semiconductor light emitting device and a light emitting apparatus comprising the same. The semiconductor light emitting device according to embodiments comprises a plurality of light emitting cells comprising a plurality of compound semiconductor layers; a plurality of ohmic contact layers on the light emitting cells; a first insulating layer on the ohmic contact layer; a second electrode layer electrically connected to a first light emitting cell of the light emitting cells; and a plurality of interconnection layers connecting the light emitting cells in series.04-22-2010
20100096645DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a display device and a display device which can reduce the number of times that an insulation substrate is put into a CVD device and is taken out from the CVD device are provided. The manufacturing method of a display device includes the steps of forming a conductive layer including first electrode films and second electrode films, a first insulation layer, semiconductor films, a second insulation layer and a protective layer on an insulation substrate; forming first resist films having a predetermined thickness which are arranged in first regions above the semiconductor films, opening portions which are arranged in second regions above the second electrode films and second resist films having a large thickness which are arranged in regions other than the first regions and the second regions on the protective layer; etching portions below the second regions, removing the first resist films by ashing; forming first holes which reach the semiconductor films below the first regions and second holes which reach the second electrode films below the second regions; removing the second resist films, and forming lines which are connected to the semiconductor films and lines which are connected to the second electrode films.04-22-2010
20100096644Light Emitting Device Package and Light Emitting Apparatus - Disclosed are a light emitting device package and a light emitting apparatus. The light emitting device package comprises a package body comprising a light emitting surface inclined at an oblique angle with respect to a bottom surface, a plurality of lead electrodes in the package body, and at least one light emitting device electrically connected to the lead electrodes.04-22-2010
20090250709LED PACKAGE AND LIGHT SOURCE DEVICE USING SAME - An exemplary LED package includes a dielectric plate, a heat conductor, a first planar electrode and a second planar electrode, a LED chip, and metal wires. The dielectric plate comprises a receiving groove defined therein. The heat conductor is positioned in the dielectric plate opposite to the receiving groove, and the heat conductor comprises a holding portion exposed on bottom of the receiving groove. The first and second planar electrodes are respectively received in the dielectric plate extending to the receiving groove and are spaced from the heat conductor. The first and second electrodes are respectively electrically connected to the LED chip by the metal wires. The LED chip is mounted on the holding portion of the heat conductor.10-08-2009
20090134408LIGHT EMITTING DIODE PACKAGE, METHOD OF FABRICATING THE SAME AND BACKLIGHT ASSEMBLY INCLUDING THE SAME - A light emitting diode (“LED”) package includes: a mold including an accommodating groove formed therein and which includes a side surface and a bottom surface; an electrode pattern disposed on the bottom surface; a plurality of LED chips disposed on the electrode pattern; and protective resin disposed in the accommodating groove. A center LED chip of the plurality of LED chips is disposed at a center of the bottom surface, and a height of the center LED chip above the bottom surface is greater than heights of other LED chips of the plurality of LED chips above the bottom surface.05-28-2009
20120161169LIGHT-EMITTING DIODE DIE PACKAGE AND METHOD FOR PRODUCING SAME - The present invention relates to a light-emitting diode die package having an LED die and an accommodating housing. The LED die has a first doped layer doped with a p- or n-type dopant and a second doped layer doped with a different dopant from that doped in the first doped layer. Each of the first and second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is formed. The insulation layer is formed with exposure holes for exposing the electrodes corresponding thereto. Each of the exposure holes is formed inside with an electrically conductive linker. The accommodating housing has an open end through which an accommodating space is accessible. The LED die is positioned within the accommodating space in such a manner that the electrically conductive linker protrudes outwardly from the accommodating space.06-28-2012
20120161167Light-Emitting Unit, Light-Emitting Device, Lighting Device, and Method for Manufacturing Light-Emitting Unit - A light-emitting unit with small energy loss is provided. Further, a light-emitting unit with high reliability is provided. A light-emitting unit is provided in the following manner: a separation layer including a leg portion and a stage portion, which protrudes over an electrode is formed so that a projected area of the stage portion is larger than that of the leg portion; a layer containing a light-emitting organic compound, an upper electrode of the first light-emitting element, and an upper electrode of the second light-emitting element are formed; and the upper electrode of the first light-emitting element is electrically connected to a lower electrode of the second light-emitting element in a region overlapping with the stage portion of the separation layer.06-28-2012
20120161168LIGHT EMITTING DEVICE - A light emitting device includes: a chip-mounting base formed with a plurality of conductive contacts; a reflector mounted on the chip-mounting base and defining a central hole; a first light emitting chip mounted on the chip-mounting base within the central hole and in electrical contact with respective ones of the conductive contacts for generating light with a first primary wavelength; a second light emitting chip stacked on and in electrical contact with the first light emitting chip for generating light with a second primary wavelength different from the first primary wavelength; and an encapsulant filling the central hole and capable of converting the first and second primary wavelengths into first and second secondary wavelengths, respectively.06-28-2012
20120161166LIGHTING DEVICE - For integration of light-emitting elements and for suppression of a voltage drop, plural stages of light-emitting element units provided over a substrate having an insulating surface and each including a plurality of light-emitting elements which is connected in parallel are connected in series. Further, besides a lead wiring with a large thickness, a plurality of auxiliary wirings with different widths and different thicknesses is used, and the arrangement of the wirings, electrodes of the light-emitting elements, and the like is optimized. Note that in the lighting device, light emitted from the light-emitting element passes through the substrate having an insulating surface and then is extracted.06-28-2012
20080277675LIGHT-EMITTING DIODE ASSEMBLY WITHOUT SOLDER - An electrical device in the form of a light emitting diode (LED) assembly. A plurality of LEDs are provided, wherein each has an anode and a cathode. A base holds this plurality of LEDs in a substantially fixed relationship. One or more anode conductors then each connect electrically to one or more of the LED anodes in a manner characterized by not including any solder material. Similarly, one or more cathode conductors each connect electrically to one or more of the LED cathodes in a manner characterized by not including any solder material.11-13-2008
20130015474WHITE LIGHT EMITTING DIODE (LED) LIGHTING DEVICEAANM Zhang; MingAACI ChengduAACO CNAAGP Zhang; Ming Chengdu CNAANM Zhao; KunAACI ChengduAACO CNAAGP Zhao; Kun Chengdu CNAANM Li; Dong-mingAACI ChengduAACO CNAAGP Li; Dong-ming Chengdu CN - An alternating current (AC) white LED lighting device and a method for manufacturing the same are provided. The AC white LED lighting device consists of blue, violet or ultraviolet LED chips, blue afterglow luminescence materials A and yellow luminescence materials B. Wherein the weight ratio of the blue afterglow luminescence materials A to the yellow luminescence materials B is 10-70 wt %:30-90 wt %. Because of using afterglow luminescence materials, the light will be sustained when an excitation light source disappears, which can eliminate the influence of LED chips light output variation due to the AC fluctuation on the lighting device. And the problem of the heating of the chips also can be overcome. At the same time, the influence of temperature quenching effect and direction change of the AC current on the AC white LED lighting device is eliminated.01-17-2013
20120161162Optoelectronic Semiconductor Component - An optoelectronic semiconductor device is specified, comprising a multiplicity of radiation-emitting semiconductor chips (06-28-2012
20120211777FLAT PANEL DISPLAY AND METHOD OF FABRICATING THE SAME - A flat panel display and a method of fabricating the same are provided. The flat panel display includes a conductor, and a passivation layer pattern disposed on a side end of the conductor. As such, the passivation layer pattern can prevent or reduce corrosion and damage of the conductor. In one embodiment, the conductor includes a conductive layer formed of a material selected from the group consisting of aluminum and an aluminum alloy. The passivation layer pattern may be formed of an organic material or an inorganic material.08-23-2012
20120211776ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE - An organic electroluminescence display device is provided. The organic electroluminescence display device includes plural organic electroluminescence elements. Each organic electroluminescence element includes: a lower electrode; an insulating layer having an opening, in which a lower electrode is exposed at the bottom of the opening; an auxiliary wiring; a stacked structure provided from a portion over the lower electrode exposed at the bottom of the opening to a portion of the insulating layer surrounding the opening, including a light emitting layer made of an organic light-emitting material; and an upper electrode. At least one layer of the stacked structure partially contacts the auxiliary wiring. The insulating layer and the auxiliary wiring are provided in common to the plurality of organic EL elements. The upper electrode covers the whole surface of the stacked structures and the auxiliary wiring.08-23-2012
20120211775Lighting Device - A lighting device having a novel structure for integration of a plurality of light-emitting elements, and a manufacturing method thereof are provided. In the lighting device, a plurality of light-emitting elements is electrically connected to each other through plugs (connecting members) and a connection wiring for integration. The connection wiring is provided on a counter substrate and the plugs are provided over an element substrate or for the counter substrate. Such a connection structure enables an appropriate electrical connection between the plurality of light-emitting elements in the lighting device.08-23-2012
20120211774SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD - A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located over at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The light-emitting device can include a base board, a frame located on the base board, the chip mounted on the base board, the wavelength converting layer located between an optical plate and the chip so as to extend from the optical plate toward the chip, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the optical plate.08-23-2012
20120211773LIGHT-EMITTING DEVICES COMPRISING NON-LINEAR ELECTRICALLY PROTECTIVE MATERIAL - A circuit comprising an array of light emitting diodes (LEDs), and a layer of VSD material positioned to contact an input and an output of each LED in the array of LEDs, so as to protect each LED from both a forward surge and a reverse surge of voltage on the array of LEDs. The layer of VSD material is able to switch into a carrying current state in response to either of the forward or reverse surge exceeding a characteristic voltage level (V08-23-2012
20120313121DISPLAY DEVICE AND METHOD THEREOF - A display device includes a pixel electrode disposed on a first substrate, and including a first portion, a second portion and a connection portion disposed between the first portion and the second portion, a capacitor line disposed on the first substrate and between the first substrate and the connection portion, a nonsymmetrical shaped capacitor electrode disposed on the first substrate and overlapping the pixel electrode and the capacitor line, and electrically connected to the pixel electrode through contact holes, and a common electrode disposed on a second substrate and including first and second opening patterns disposed overlapping the first portion and the second portion of the pixel electrode, respectively.12-13-2012
20100289037SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE - The present invention provides a semiconductor device having a plurality of MOS transistors with controllable threshold values in the same face and easy to manufacture, a manufacturing method thereof and a display device. The invention is a semiconductor device having a plurality of MOS transistors in the same face each having a structure formed by stacking a semiconductor active layer, a gate insulator, and a gate electrode, wherein the semiconductor device includes: an insulating layer stacked on a side opposite to a gate electrode side of the semiconductor active layer; and a conductive electrode stacked on a side opposite to a semiconductor active layer side of the insulating layer and extending over at least two of the plurality of MOS transistors.11-18-2010
20120126257LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.05-24-2012
20120126255LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a substrate, one or more light emitting diodes (LEDs) disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. In one aspect, a method for making a light emitting device is disclosed. The method can include providing a substrate with one or more LEDs comprising electrical connectors. The method can further include providing a retention material on at least a portion of the substrate wherein the retention material is disposed over at least a portion of the electrical connectors.05-24-2012
20120126258DISPLAY DEVICE, ORGANIC LIGHT EMITTING DIODE DISPLAY, AND MANUFACTURING METHOD OF SEALING SUBSTRATE - A display device includes a display unit, a sealing substrate, a first metal layer, a second metal layer, and a conductive wire member. The display unit is formed over a substrate. A sealing substrate is secured to the substrate by a bonding layer, and comprising a composite member and an insulating member. A first metal layer is formed over the inner surface of the sealing substrate facing the substrate, and a second metal layer is formed over the outer surface of the sealing substrate. A conductive wire member successively passes through at least two points of each of the first metal layer, the insulating member, and the second metal layer, and is secured to the sealing substrate to provide conduction of the first metal layer and the second metal layer.05-24-2012
20120126256LED PACKAGE - According to one embodiment, an LED package includes a first and a second lead frame separated from each other, an LED chip, a wire and a resin body. The LED chip is provided above the first and second lead frames, and has a pair of terminals provided on an upper surface of the LED chip. One of the terminals is connected to the first lead frame and one other terminal is connected to the second lead frame. The wire is drawn out from the one terminal horizontally to connect the one terminal to the first lead frame. The resin body covers the LED chip and the wire, an upper surface, a part of a lower surface and a part of an end surface of each of the first and second lead frames to expose a remaining part of the lower surface and a remaining part of the lower surface.05-24-2012
20120126254LED LAMP WITH IMPROVED DIE ARRANGEMENT - An LED lamp with improved die arrangement includes a main board equipped with a plurality of lines of light-emitting dies. The lines of the light-emitting dies are spaced by a distance equal to or greater than 0.38 mm. A number of the light-emitting dies in each of the lines may be added or reduced for fitting the main board. The light-emitting dies in one of the lines may be aligned with or offset from the light-emitting dies in the adjacent line. The LED lamp may have the light-emitting dies deployed in both of the aligned manner and the offset manner, so that the light-emitting dies fit a desired lighting pattern of the LED lamp and the LED lamp illuminates with enhanced uniformity and brightness.05-24-2012
20120161165LIGHTING DEVICE - For integration of light-emitting elements and for suppression of a voltage drop, plural stages of light-emitting element units each including a plurality of light-emitting elements which is connected in parallel are connected in series. Further, besides a lead wiring with a large thickness, a plurality of auxiliary wirings with different widths and different thicknesses is used, and the arrangement of the wirings, electrodes of the light-emitting elements, and the like is optimized.06-28-2012
20120248471PIXEL ARRAY SUBSTRATE AND DISPLAY DEVICE - A pixel array substrate includes: a first through fourth transistors (Ta through Td); a light-emitting element (OEL); a scanning line connected with a control terminal of the fourth transistor; a data line connected with one conducting terminal of the fourth transistor; a first control line (AZi) connected with one conducting terminal of the third transistor; a second control line (Ei) connected with a control terminal of the first transistor; and a first power source line (Ypj) connected with one conducting terminal of the first transistor. One conducting terminal of the second transistor is connected with the first power source line via the first transistor. A control terminal of the second transistor is connected with the data line via the fourth transistor and with a terminal of the light-emitting element via a capacitor (C). The terminal of the light-emitting element, the other conducting terminal of the second transistor, the other conducting terminal of the third transistor, and a control terminal of the third transistor are connected with one another. This configuration makes it possible to reduce the number of wiring of a pixel array substrate which includes an organic light-emitting diode.10-04-2012
20120248472METHOD FOR CREATING SERIALLY CONNECTED OLED DEVICES - By the invention it is proposed a method of preparing a serial connection of OLED-devices, comprising the steps of providing a carrier substrate; depositing a first electrode material layer on said carrier substrate; depositing a layer of an organic optoelectronic active material on said first electrode material layer; depositing a second electrode material layer on said organic optoelectronic active material layer; ablating at least the second electrode material layer and the organic optoelectronic active material layer at least in selected areas to build a trench forming separated OLED-devices on the carrier surface; electrically interconnecting neighboring OLED-devices by connecting the anode of a first OLED-device to the cathode of a neighboring second OLED-device, wherein in the steps of depositing the organic optoelectronic active material layer and the cathode layer, the carrier substrate surface is covered over its entire functional area with said layers, and wherein the electrical interconnection of the neighboring OLED-devices is performed by at least partially filling the trenches built in the ablating step with an electrical conductive material. Furthermore, an illuminant is provided comprising serial connected OLED-devices.10-04-2012
20120248465ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic light emitting diode display capable of reducing the shortening of image stacking lifetime caused by the residue of the barrier ribs produced during the forming of the barrier ribs is provided. The display includes: a substrate; a first pixel electrode formed on the substrate; barrier ribs formed on the substrate, and having an opening exposing the first pixel electrode; a second pixel electrode formed on the first pixel electrode; an organic light emitting member formed on the second pixel electrode; an organic light emitting member formed on the second pixel electrode; a common electrode formed on the organic light emitting member; and a thin film encapsulation member covering the common electrode. The width of the second pixel electrode is greater than the exposure width of the first pixel electrode exposed through the opening of the barrier ribs.10-04-2012
20120248466METAL ENCAPSULATING SHEET AND ORGANIC LIGHT-EMITTING DISPLAY APPARATUS INCLUDING THE SAME - A metal encapsulating sheet is configured to cover a display unit on a substrate and includes an insulating base film, and metal wirings on the base film for forming a current path between the display unit and a power supply, wherein connecting units of the metal wirings coupled to the power supply are outside a light-emitting region corresponding to the display unit.10-04-2012
20120248467ORGANIC LIGHT EMITTING DEVICE AND DISPLAY UNIT INCLUDING THE SAME - An organic light emitting device includes a first electrode and a second electrode, an organic layer including a light emitting layer between the first electrode and the second electrode, and an insulating film covering a rim of the first electrode from a surface thereof to a side surface thereof, and having an internal wall surface being in contact with the organic layer, and one or more corner sections in the internal wall surface with a ridge line thereof in parallel with the surface of the first electrode.10-04-2012
20120161163LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device package uses a metal layer as a reflective region and includes a light-emitting device chip and an electrode pad that are disposed on an insulating layer. In addition, the electrode pad and an electrode pattern of a printed circuit board are connected to each other by an electrode pattern formed of conductive ink. A method of manufacturing a light-emitting device package includes forming an insulating layer on a metal layer, and bonding a light-emitting device chip and an electrode pad on the insulating layer. The electrode pad and a printed circuit board are connected to each other by conductive ink.06-28-2012
20120161164LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are a light-emitting device package and a method of manufacturing the same. The light-emitting device package may include a plurality of light-emitting chips on one substrate (board). The plurality of light-emitting chips may produce colors around a target color. The target color may be produced by combinations of the colors of light emitted from the plurality of light-emitting chips. The colors around the target color may have the same hue as the target color and have color temperatures different from that of the target color. The plurality of light-emitting chips may have color temperatures within about ±250K of that of the target color.06-28-2012
20100078657SEMICONDUCTOR LIGHT EMITTING DEVICE, LIGHT EMITTING MODULE, LIGHTING APPARTUS, DISPLAY ELEMENT AND MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT EMITTING DEVICE - An LED array chip (04-01-2010
20100207129LIGHT EMITTING DIODE LIGHT SOURCE FOR EMITTING POLARIZED LIGHT - An exemplary light emitting diode (LED) light source includes a frame and light emitting units. The frame includes a supporting surface having a curved surface and one or more receiving holes configured in the curved surface. Each of the light emitting units is received in a respective receiving hole. Each of the light emitting units includes an LED die for generating light of two polarization states, a reflective polarizer for preferentially reflects one polarization state back into the LED die and preferentially transmitting the other polarization state out of the light emitting unit, a polarization converting film for converting the reflected light of the first polarization state into light of the second polarization state, and a reflective film for reflecting light of the converted second polarization state to the reflective polarizer.08-19-2010
20100207130ACTIVE MATRIX SUBSTRATE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING ACTIVE MATRIX SUBSTRATE - An active matrix substrate 08-19-2010
20120132932ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display is disclosed. The organic light emitting diode display includes: a substrate, an organic light emitting diode positioned on the substrate, a metal layer positioned on the substrate with the organic light emitting diode interposed therebetween, and a resin layer positioned on the metal layer and configured to reinforce a strength of the metal layer.05-31-2012
20120132931LED MODULE - According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame. The resin body covers the LED chip, covers an upper surface, a part of a lower surface, and a part of an end surface of each of the first lead frame and the second lead frame, and exposes a remaining part of the lower surface and a remaining part of the end surface.05-31-2012
20120132935METHOD OF MANUFACTURING AN ORGANIC LIGHT-EMITTING ELEMENT, ORGANIC LIGHT-EMITTING ELEMENT, DISPLAY PANEL, AND DISPLAY DEVICE - A method of manufacturing an organic light-emitting element. A first layer is formed above a substrate, and exhibits hole injection properties. A bank material layer is formed above the first layer using a bank material. Banks are formed by patterning the bank material layer, and forming a resin film on a surface of the first layer by attaching a portion of the bank material layer to the first layer, the banks defining apertures corresponding to light-emitters, the resin material being the same as the bank material. A functional layer is formed by applying ink to the apertures that contacts the resin film. The ink contains an organic material. The functional layer includes an organic light-emitting layer. A second layer is formed above the functional layer and exhibits electron injection properties. The hole injection properties of the first layer are then degraded by applying electrical power to an element structure.05-31-2012
20120132933LED MODULE AND ILLUMINATION APPARATUS - According to one embodiment, an LED module includes a substrate, an interconnect layer, an LED package, and a resin. The resin is provided on the substrate to cover the LED package. The resin has a refractive index higher than a refractive index of air. The resin is transmissive with respect to light emitted from the LED package. The LED package includes first and second leadframes, an LED chip, and a resin body. The first and second leadframes are disposed on a plane. An exterior form of the resin body is used as an exterior form of the LED package.05-31-2012
20120132934ORGANIC EL ELEMENT, DISPLAY APPARATUS, AND LIGHT-EMITTING APPARATUS - An organic EL element has an anode, a cathode, a hole injection layer and at least one functional layer disposed between the anode and the cathode. The at least one functional layer contains an organic material. Holes are injected into the functional layer from the hole injection layer, which contains a tungsten oxide. A Ultraviolet Photoelectron Spectroscopy (UPS) spectrum obtained from a UPS measurement has a protrusion near a Fermi surface and within a region corresponding to a binding energy range lower than a top of the valence band. The tungsten oxide contained in the hole injection layer satisfies a condition, determined from an X-ray Photoelectronic Spectroscopy measurement, that a ratio in a number density of atoms other than tungsten and oxygen atoms to the tungsten atoms does not exceed approximately 0.83.05-31-2012
20110180823LIGHT-EMITTING DEVICE, PRODUCTION METHOD THEREFOR, AND DISPLAY CONTAINING THE SAME - The present invention provides a light-emitting device which includes, in the order mentioned, a light-emitting layer containing a light-emitting portion, an interference layer, and a fine concavo-convex pattern, wherein the interference layer is disposed over a second surface of the light-emitting layer which surface is opposite to a first surface of the light-emitting layer, and reflects, toward the first surface, light emitted from the light-emitting layer, and wherein the fine concavo-convex pattern has a cross-sectional shape which has portions projected and recessed with respect to the light-emitting layer, and reflects light emitted from the light-emitting layer.07-28-2011
20110180822Optoelectronic Component - An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or—receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.07-28-2011
20110180821DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device includes an array of light emitting cells. Each of the light emitting cells includes a first electrode, a second electrode, and an organic light emitting layer located between the first electrode and the second electrode. Banks are above the first electrode that partition the organic light emitting layer to define each of the light emitting cells. The light emitting cells include a peripheral light emitting cell that is located in a peripheral region of the array. The banks include first and second banks that each border the peripheral light emitting cell. The first bank is closer to a periphery of the array than the second bank. An inclination angle of an innermost sidewall of the first bank that is adjacent the peripheral light emitting cell is greater than an inclination angle of an outermost sidewall of the second bank that is adjacent the peripheral light emitting cell.07-28-2011
20110180820LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - Disclosed are a light emitting device and a method of fabricating the same. The light emitting device includes a substrate; first and second light emitting cells, each including a first semiconductor layer, an active layer, and a second semiconductor layer; and a connector located between the first and second light emitting cells and the substrate, to electrically connect the first and second light emitting cells to each other. The connector extends from the second semiconductor layer of the first light emitting cell, across the substrate, and through central regions of the second semiconductor layer and active layer of the second light emitting cells, to contact the first semiconductor layer of the second light emitting cell.07-28-2011
20110180819LIGHT-EMITTING ARRANGEMENT - The invention relates to a light-emitting arrangement comprising a printed circuit board, PCB, having at least one electrically and thermally conductive portion, a light-emitting diode, LED, being thermally connected to the at least one electrically and thermally conductive portion by at least one contact of the LED, and a heat release member for dissipating heat generated by the LED, the heat release member being thermally connected to the at least one electrically and thermally conductive portion, wherein the heat generated by the LED is transferred along a heat transfer path extending from the LED via the at least one contact and the at least one electrically and thermally conductive portion to the heat release member.07-28-2011
20110180818Solid State Light Sheet Using Thin LEDs For General Illumination - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture.07-28-2011
20110180817LIGHT EMITTING DEVICE - A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.07-28-2011
20120161161ARRAY ASSEMBLIES WITH HIGH VOLTAGE SOLID STATE LIGHTING DIES - Various embodiments of solid state lighting (“SSL”) assemblies with high voltage SSL dies and methods of manufacturing are described herein. In one embodiment, an array assembly of SSL dies includes a first terminal and a second terminal configured to receive an input voltage (Vo). The array assembly also includes a plurality of SSL dies coupled between the first terminal and the second terminal, at least some of which are high voltage SSL dies coupled in parallel.06-28-2012
20120313120Method For Depositing A Phosphor Layer On LEDs, And Apparatus Made Thereby - A method for depositing a phosphor layer on a light-emitting diode (“LED”) chip includes coating at least a light-emitting side of the LED chip with a phosphor-adhesive material, and applying phosphor particles to an exposed surface of the material such that the phosphor layer forms of phosphor particles that adhere to the exposed surface. A method for depositing phosphor layers on each of a plurality of LED chips includes mounting the LED chips to a common substrate, coating at least a light-emitting side of the LED chips with a phosphor-adhesive material, and applying phosphor particles to exposed surfaces of the material such that the phosphor layers form of phosphor particles that adhere to the material. A processed LED chip includes an unpackaged LED chip, a phosphor-adhesive material applied to a light-emitting side of the LED chip, and a phosphor layer formed of phosphor particles adhered to the material.12-13-2012
20120313122SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENTS, AND LIGHT-EMITTING DEVICE - A substrate for mounting light-emitting elements to mount a plurality of double wire type light-emitting elements so as to be connected in parallel, comprising a substrate main body made of a sintered product of an inorganic material powder and having a mounting surface for light-emitting elements; wiring conductors provided so as to be connected to electrodes of the light-emitting elements in one-to-one at a position out of a portion between the light-emitting elements, on the mounting surface; a reflection film formed on the mounting surface excluding the wiring conductors and a periphery thereof; and an overcoat glass film provided on the mounting surface so as to cover the entire reflection film including its edge and so as to exclude the wiring conductors and a periphery thereof, and a light-emitting device using it.12-13-2012
20120313115LIGHT EMITTER DEVICE PACKAGES, MODULES AND METHODS - Light emitter device packages, modules and methods are disclosed having a body and a cavity that can be formed from a single substrate of material. The material can be thermally conductive and/or metallic. A light emitter device package can have at least one isolating layer creating at least a first isolated portion of the body and/or first isolated portion of the cavity. The isolating layer can be formed from the same material as the single substrate which forms the package body and cavity, and can be a layer which is thermally and electrically isolated. A light emitter or light emitter device, such as an LED chip can be mounted upon a surface of the cavity and upon at least a portion of the isolating layer.12-13-2012
20120248469LIGHT EMITTING APPARATUS - A light emitting apparatus is disclosed. The light emitting apparatus includes a light-transmissive substrate having a top surface and a bottom surface, at least one semiconductor light emitting device disposed on the top surface of the light-transmissive substrate, a reflective part disposed over the semiconductor light emitting device to reflect light from the semiconductor light emitting device toward the light-transmissive substrate, and a first wavelength converter disposed between the light-transmissive substrate and the reflective part.10-04-2012
20120168784Two-Transistor Pixel Array - A two-transistor (2T) pixel comprises a chemically-sensitive transistor (ChemFET) and a selection device which is a non-chemically sensitive transistor. A plurality of the 2T pixels may form an array, having a number of rows and a number of columns. The ChemFET can be configured in a source follower or common source readout mode. Both the ChemFET and the non-chemically sensitive transistor can be NMOS or PMOS device.07-05-2012
20120168778ORGANIC LIGHT EMITTING DIODE DISPLAY - An OLED display includes a substrate, a first electrode on the substrate, an organic emission layer on the first electrode, a second electrode on the organic emission layer, an insulating layer substantially covering the second electrode and having an opening that exposes a center portion of the second electrode, and a power supply electrically coupled with the second electrode through the opening of the insulating layer and configured to supply power to the second electrode.07-05-2012
20120168783ORGANIC LIGHT EMITTING DISPLAY DEVICE - An organic light emitting display device includes a substrate, a plurality of pixels on the substrate having a first region configured to emit light and a second region configured to transmit external light, a plurality of pixel circuit units, a plurality of first electrodes, a first organic layer on the plurality of first electrodes, a second organic layer on the first organic layer, the second organic layer including an emission layer, a third organic layer on the second organic layer, the third organic layer being positioned in the first region and outside a central portion of the second region, and a second electrode having a first portion only on the third organic layer.07-05-2012
20120168782LIGHT EMITTING DIODE, LIGHT EMITTING DIODE LAMP, AND ILLUMINATING APPARATUS - Disclosed is a light-emitting diode, which has an infrared emission wavelength of 700 nm or more, excellent monochromatism characteristics, and high output and high efficiency and excellent humidity resistance. The light-emitting diode is provided with: a light-emitting section (07-05-2012
20120168781LIGHT-EMITTING-ELEMENT ENCAPSULATING COMPOSITION, LIGHT-EMITTING DIODE AND LIQUID-CRYSTAL DISPLAY DEVICE - An encapsulating composition for a light emitting element, a light emitting diode (LED) and a liquid crystal display device (LCD) are provided. A silicone-cured product included as a main ingredient and a conductivity-providing agent having excellent compatibility and capable of providing superior conductivity can be used to significantly reduce the surface resistivity of the silicone-cured product. Therefore, the encapsulating composition for a light emitting element, the LED and the LCD can be useful in solving the problems regarding attachment of a foreign substance such as dust due to static electricity, and degradation of transparency since the composition has low surface resistivity when used as a semiconductor encapsulation material for an LED, and also in providing a cured product having excellent properties such as light resistance, heat resistance, durability and optical transparency.07-05-2012
20120168780RESIN FOR TRANSPARENT ENCAPSULATION MATERIAL, AND ASSOCIATED ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE - A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.07-05-2012
20120168779ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic light emitting diode display includes: a substrate; a display device formed on the substrate, and including a common power line and a common electrode; a sealing substrate attached to the substrate by a junction layer surrounding the display device, the sealing substrate sealing the display device with the substrate; a first conductor formed over an outer side, a lateral side, and an inner side of the sealing substrate, the first conductor being for supplying a first electrical signal to the common power line; a second conductor formed on the inner side, the lateral side, and the outer side of the sealing substrate, the second conductor being for supplying a second electrical signal to the common electrode; and a plurality of arranging members formed into the sealing substrate, the first conductor, and the second conductor, the arranging members being for arranging positions of the sealing substrate, the first conductor, and the second conductor.07-05-2012
20120168777LED PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - An LED package structure includes: a carrier; at least a first protruding portion and a plurality of electrical contacts formed on the carrier; a plurality of LED chips disposed on the first protruding portion and on the carrier in a region free from the first protruding portion, respectively; a plurality of bonding wires electrically connecting the07-05-2012
20120248468Metal Wiring Structure, Organic Light-Emitting Display Device Using the Same, and Method of Manufacturing the Organic Light-Emitting Display Device - An organic light-emitting display device comprises a substrate, an anode electrode formed on the substrate, an organic layer formed on the anode electrode, a cathode electrode formed on the organic layer, and an organic capping layer formed on the cathode electrode and containing a capping organic material and a rare-earth material which has higher oxidizing power than the material which forms the cathode electrode.10-04-2012
20100051973LIGHT-EMITTING DEVICE, ELECTRONIC EQUIPMENT, AND PROCESS OF PRODUCING LIGHT-EMITTING DEVICE - A light-emitting device includes a light-reflecting layer, a first electrode disposed on or above the light-reflecting layer, a semi-transparent reflective second electrode, a light-emitting function layer disposed between the first electrode and the second electrode, and an electron-injection layer disposed between the light-emitting function layer and the second electrode. The second electrode is made of an Ag alloy having an Ag content of from 50% by atoms to 98% by atoms.03-04-2010
20100051971HIGH EFFICIENCY LIGHT EMITTING ARTICLES AND METHODS OF FORMING THE SAME - A light emitting article (03-04-2010
20100051970PLANARIZED LED WITH OPTICAL EXTRACTOR - A light emitting article is disclosed and includes a light emitting diode having an n-layer or p-layer with a first refractive index value. A planarizing layer having a refractive index value equal to or greater than the first refractive index value is disposed on the n-layer or p-layer, and a patterned electrode is disposed on the n-layer or p-layer. An extractor having a light input surface is optically coupled to the planarizing layer.03-04-2010
20100051969Display device - A display device includes a transparent substrate, and a plurality of single-crystal thin-film semiconductor light-emitting elements disposed on one side of the transparent substrate. Each of the single-crystal thin-film semiconductor light-emitting elements is composed of single-crystal thin-film semiconductor layers separated from a base substrate, and includes a light-emitting layer and two non-light-emitting layers disposed on both sides of the light-emitting layer.03-04-2010
20120313119THREE DIMENSIONAL LIGHT-EMITTING-DIODE (LED) STACK AND METHOD OF MANUFACTURING THE SAME - A three dimensional (3-D) light-emitting-diode (LED) stack and method of manufacturing the same, comprising: a substrate; at least a first LED, stacked on said substrate; and at least a second LED, stacked on said first LED, such that energy gap of said first LED is smaller than energy gap of said second LED. In said stack mentioned above, a material of larger energy gap capable of emitting light of shorter wavelength can be penetrated by lights emitted by another material of smaller energy gap capable emitting lights of longer wavelength, such that lights are mixed together and then emitted, and said materials are put into a three dimensional stack arrangement, to form a brand new light emitting device of mixed light, so as to emit lights as required.12-13-2012
20120175646LIGHT EMITTING DIODE MODULE - An LED module includes a base, a circuit layer formed on the base and multiple LEDs each having an LED die connecting to the circuit layer. The circuit layer includes multiple connecting sections. Each connecting section includes a first connecting part and a second connecting part electrically insulating and spaced from each other. Each LED includes an electrode layer having a first section and a second section electrically insulated from the first section and respectively electrically connecting the first and second connecting parts of a corresponding connecting section. The LED die is electrically connected to the second section. A transparent electrically conductive layer is formed on the LED die and electrically connects the LED die to the first section of the electrode layer. An electrically insulating layer is located between the LED die and surrounding the LED die except where the transparent electrically conductive layer connects.07-12-2012
20120175648DISPLAY PANEL DEVICE, DISPLAY DEVICE, AND METHOD OF MANUFACTURING DISPLAY PANEL DEVICE - Provided is a display panel device including a pixel unit including a luminescent layer, and a lens that covers a luminescent region of the luminescent layer placed above the pixel unit and that transmits light emitted from the luminescent layer. The height between a luminescent face of the luminescent region and an apex of the lens is uniform along the straight line in the long axis direction of the luminescent region. Furthermore, at both end parts of the lens, a cross-section of the light emitting side corresponding to the long axis direction of the luminescent region has a shape of an elliptic arc having a predetermined curvature.07-12-2012
20120175644DISPLAYS WITH EMBEDDED MEMS SENSORS AND RELATED METHODS - Embodiments of displays with embedded MEMS sensors and related methods are described herein. Other embodiments and related methods are also disclosed herein.07-12-2012
20120175643Packaging Photon Building Blocks Having Only Top Side Connections in an Interconnect Structure - Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks.07-12-2012
20120256198LED PACKAGE STRUCTURE FOR INCREASING THE LIGHT UNIFORMING EFFECT - A LED package structure for increasing the light uniforming effect includes a substrate unit, a light emitting unit, a first package unit, and a second package unit. The substrate unit includes at least one substrate body. The light emitting unit includes at least one light emitting element disposed on the at least one substrate body and electrically connected to the at least one substrate body. The first package unit includes a first package resin body formed on the at least one substrate body to cover the at least one light emitting element. The second package unit includes a second package resin body formed on the at least one substrate body to cover the first package resin body. The second package resin body is a light uniforming resin body having a light diffusing material mixed therein, and the second package resin body has an exposed light uniforming surface formed thereon.10-11-2012
20120313114Method of manufacturing thin film transistor, thin film transistor manufactured by using the method, method of manufacturing organic light-emitting display apparatus, and organic light-emitting display apparatus manufactured by using the method - A method of manufacturing a thin film transistor (TFT), a TFT manufactured by the method, a method of manufacturing an organic light-emitting display apparatus that includes the TFT, a display including the TFT. By including a buffer layer below and an insulating layer above a silicon layer for the TFT, the silicon layer can be crystallized without being exposed to air, so that contamination can be prevented. Also, due to the overlying insulating layer, the silicon layer can be patterned without directly contacting photoresist. The result is a TFT with uniform and improved electrical characteristics, and an improved display apparatus.12-13-2012
20100270565SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than or equal to 1. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.10-28-2010
20100270564LED PACKAGE AND BACKLIGHT UNIT USING THE SAME - The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization.10-28-2010
20120217514ARRAY SUBSTRATE, A DISPLAY PANEL HAVING THE ARRAY SUBSTRATE AND A METHOD OF MANUFACTURING THE ARRAY SUBSTRATE - A substrate includes a storage line, first and second gate lines and first and second pixel electrodes. The storage line extends along a first direction on the substrate. The first and second gate lines are substantially parallel with the storage line. The first pixel electrode is formed between the first gate line and the storage line. The second pixel electrode is formed between the second gate line and the storage line.08-30-2012
20120074440ILLUMINATION DEVICE, DISPLAY DEVICE, AND TELEVISION RECEIVER - A backlight unit (03-29-2012
20120074439FLAT PANEL DISPLAY AND METHOD FOR MAKING THE SAME - A flat panel display includes a thin film transistor formed on a substrate; a planarization layer formed on the thin film transistor; a first electrode layer formed on the planarization layer and electrically connected with the thin film transistor through the via hole formed in the planarization layer; a pixel definition layer formed on the planarization layer and in which an opening for at least partially exposing the first electrode layer is formed; an adhesive reinforcement layer formed at least between the planarization layer and the pixel definition layer on the top of the planarization layer; an emitting layer formed on the first electrode layer; and a second electrode layer formed on the emitting layer and the pixel definition layer. The flat panel display has an improved adhesive property between a pixel definition layer and a planarization layer, which prevents a chipping phenomenon of the pixel definition layer.03-29-2012
20120074438METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE, LIGHT EMITTING ELEMENT SUBSTRATE, AND QUALITY MANAGEMENT METHOD - A method for manufacturing a light emitting device includes forming a plurality of light emitting elements on a light emitting element substrate. an identification portion is formed on each of the light emitting elements to allow a pertinent light emitting element to be distinguishable from other light emitting elements. The light emitting elements are separated to form a plurality of light emitting devices. The identification portion may have an external appearance allowing each of the light emitting elements to be distinguishable from the other light emitting elements.03-29-2012
20120074437LED UNIT HAVING UNIFORM LIGHT EMISSION - An LED unit includes a plurality of LEDs connected to each other and a plate supporting the LEDs. Each LED includes a base, a chip mounted on the base, a pair of leads fixed to the base and electrically connected to the chip and an encapsulant sealing the chip. The base includes a main body and a pair of steps. The leads each have two opposite ends protruding from two opposite ends of the main body and located below/above a corresponding step. The protruding ends of the leads of adjacent LEDs are connected to each other. The encapsulants of adjacent LEDs are continuously connected together. Light emitted from the chips of the LEDs are evenly distributed in the encapsulants whereby the light from the LEDs forms a rectangular, uniform light source.03-29-2012
20120074435ORGANIC LIGHT EMITTING DISPLAY - An organic light emitting display is disclosed. In one embodiment, the display includes 1) a substrate, 2) a plurality of pixels formed on the substrate, wherein each of the pixels comprises at least one circuit region including i) a first light emission area, ii) a second light emission area iii) at least one transmission area transmitting external light, and iv) a pixel circuit unit and 3) a first pixel electrode formed in the first light emission area and electrically connected to the pixel circuit unit, wherein the first pixel electrode comprises a first transparent conductive layer and a reflective layer. The display may further include 1) a second pixel electrode formed in the second light emission area and electrically connected to the first pixel electrode, wherein the second pixel electrode comprises a second transparent conductive layer, 2) a first opposite electrode substantially directly below or above the first pixel electrode, 3) a second opposite electrode substantially directly below or above the second pixel electrode and 4) an organic emission layer formed between the first pixel electrode and the first opposite electrode and between the second pixel electrode and the second opposite electrode.03-29-2012
20120074434LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS USING THE SAME - Disclosed is a light emitting device package, which is free from thermal degradation by preventing reactions between moisture and light or between moisture and heat. The light emitting device package includes a light emitting device, a package body supporting the light emitting device, an electrode provided on the package body and electrically connected to the light emitting device, a filler covering the light emitting device, and a protective layer formed on a surface of the package body at which light and/or heat generated by the light emitting device arrives.03-29-2012
20120074432LED PACKAGE MODULE AND MANUFACTURING METHOD THEREOF - A light emitting diode (LED) package module and the manufacturing method thereof are presented. A plurality of LEDs and a plurality of semiconductor elements are disposed on a silicon substrate, and then a plurality of lenses is formed above the positions of the plurality of the LEDs, and the plurality of the lenses is corresponding to the plurality of the LEDs. Then, a plurality of package units is defined on the silicon substrate, and each package unit has a semiconductor element and at least one LED. After that, the silicon substrate is cut to form a plurality of LED package modules, and each LED package module has at least one package unit.03-29-2012
20120074433ELECTRONIC APPARATUS - An electronic apparatus is provided that includes a number of first components on a first substrate and a number of second components on a second substrate. A lamination material that includes a conducting material is placed between the first components and the second components. Any one first component can couple to a varied subset of second components.03-29-2012
20100006869SEMICONDUCTOR CHIP, WIRING SUBSTRATE OF A SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING THE SEMICONDUCTOR CHIP AND DISPLAY DEVICE HAVING THE SEMICONDUCTOR PACKAGE - A semiconductor chip can include a semiconductor substrate, an input portion and an output portion. A circuit element can be formed in the semiconductor substrate. The input portion can be formed on the semiconductor substrate. The input portion can include a first input pad to receive an input signal from the outside and a second input pad spaced apart from the first input pad, the second input pad being electrically connected to the first input pad through an external connection line such that the second input pad inputs the input signal to the circuit element. The output portion can be formed on the semiconductor substrate. The output pad can include an output pad to output an output signal from the circuit element.01-14-2010
20100244060LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME - Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.09-30-2010
20100244059SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - An aspect of the present invention provides a semiconductor device, in which densely packaging and high performance of optical elements are realized by a simple manufacturing process. The semiconductor device includes: a first chip module, a second chip module and a bonding layer. The first chip module includes a plurality of optical chips that are bonded within a substantially same plane with a first resin layer. The second chip module includes a plurality of control semiconductor chips and a plurality of connecting chips. The connecting chips include conductive materials piercing through the connecting chips. The control semiconductor chips and the connecting chips are bonded within a substantially same plane with a second resin layer. And the optical chips and the control semiconductor chips are electrically connected through the connecting chips.09-30-2010
20100244055SEMICONDUCTOR-BASED SUB-MOUNTS FOR OPTOELECTRONIC DEVICES WITH CONDUCTIVE PATHS TO FACILITATE TESTING AND BINNING - The disclosure facilitates testing and binning of multiple LED chip or other optoelectronic chip packages fabricated on a single semiconductor wafer. The testing can take place prior to dicing. For example, in one aspect, metallization on the front-side of a semiconductor wafer electrically connects together cathode pads (or anode pads) of adjacent sub-mounts such that the cathode pads (or anode pads) in a given column of sub-mounts are electrically connected together. Likewise, metallization on the back-side of the wafer electrically connects together anode pads (or cathode pads) of adjacent sub-mounts such that the anode pads (or cathode pads) in a given row of sub-mounts are electrically connected together. Probe pads, which can be located one or both sides of the wafer, are electrically connected to respective ones of the rows or columns.09-30-2010
20100244058Light emitting diode package - A light emitting diode package includes a substrate, a plurality of light emitting diode chips, a fluorescence layer, and a plurality of reflecting layers. The light emitting diode chips, the fluorescence layer, and the reflecting layers are disposed on the substrate. The fluorescence layer covers the light emitting diode chips, and the reflecting layers are disposed right above the light emitting diode chips, respectively.09-30-2010
20100244057ORGANIC LIGHT EMITTING DISPLAY DEVICE - An organic light emitting display device, including: a first substrate on which a plurality of light emitting elements are formed; a second substrate that is disposed to be opposed to the first substrate; a primary dam member that is provided between the first substrate and the second substrate in order to surround the plurality of light emitting elements; a filler that is filled between the first substrate and the second substrate and in a first region defined by the primary dam member, an auxiliary dam member that is between the first substrate and the second substrate and in a second region outside the first region, and is made of porous material; and an inorganic sealant that is provided between the first substrate and the second substrate and in a third region outside the first region and the second region, and is jointed to the first substrate and the second substrate.09-30-2010
20120313118ACTIVE-MATRIX ORGANIC LIGHT-EMITTING DIODE DISPLAY DEVICE WITH SHORT PROTECTION - An active-matrix OLED display device, which reduces the adverse effects of short circuits across OLED devices in a densely packed array by having a thin-film resistive layer integrated in series with the OLED device. The OLED device includes a substrate, and first and second pixels situated proximate each other on the substrate. The first pixel comprises an OLED and means for preventing a failure of the first pixel due to a short from affecting the operation of the second pixel. The preventing means includes a resistor electrically connected in series with the OLED of the first pixel. The resistor is in the form of a thin-film resistive layer. The first pixel includes an anode, wherein the thin-film resistive layer is situated adjacent the anode. The anode and the thin-film resistive layer have substantially the same dimensions and are formed simultaneously.12-13-2012
20120313117LIGHT-EMITTING DIODE PACKAGE - Disclosed is a light-emitting diode package according to an embodiment, including; a body having a cavity formed therein, a lead frame placed in the cavity; and a light emitting diode electrically connected to the lead frame while having a slope angle relative to the bottom surface of the cavity, wherein a light emitting part and a non-light emitting part are present on the light emitting diode, and wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part.12-13-2012
20120313116Liquid Crystal Display and Chip On Film Thereof - A chip on film (COF) is disclosed in the present disclosure, which comprises an adhesive base layer, a driving integrated circuit (IC), an adhesive layer and a copper layer. The driving IC is embedded on a surface of the adhesive base layer; the adhesive layer is located under the adhesive base layer; the copper layer is located under the adhesive layer. The adhesive base layer is formed with a heat and pressure spreading structure. A heat and pressure spreading structure is disposed on the adhesive base layer of the COF so that deformation or unevenness of the glass substrate in the bonded area can be avoided when the COF is thermally pressed to the glass substrate of the LCD. These guarantees the consistency between the bonded area and the unbounded area, the bonded area and the unbounded area of the glass substrate will have the same transmissivity and luminance.12-13-2012
20120187430Packaging Photon Building Blocks Having Only Top Side Connections in a Molded Interconnect Structure - Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.07-26-2012
20120256206LED MODULE WITH COOLING PASSAGE - An LED module with a cooling passage is disclosed. The LED module includes a light source unit having a plurality of LED's which provide light through an appropriate power supply, and one or more cooling units which form said cooling passage, which combine heat generated from the LEDs with ambient heat and discharges the combined heat in an opposite direction.10-11-2012
20120256200HIGH EFFICIENCY LEDS - A light emitting device and method of fabricating the same is disclosed that comprises at least one light emitter comprising an active region which emits light. The device further comprising a submount arranged such that the at least one light emitter is mounted to the submount such that the active region is angled in relation to the submount.10-11-2012
20120223344ARRAY OF SCALABLE CERAMIC DIODE CARRIERS HAVING LEDS - Ceramic diode carriers (09-06-2012
20120223343LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a first lead frame comprising a first hole cup, a second lead frame comprising a second hole cup and disposed to face the first lead frame with a gap disposed between the first lead frame and the second lead frame, a first light emitting diode chip disposed on the first hole cup, and a second light emitting diode chip disposed on the second hole cup, the first lead frame comprising a first enlarged region formed between the gap and the first hole cup, and the second lead frame comprising a second enlarged region formed between the gap and the second hole cup.09-06-2012
20120223342Light-Emitting Device and Lighting Device - A highly reliable light-emitting device or lighting device is provided. Further, a light-emitting device or lighting device with a high manufacturing yield is provided. Provided is a light-emitting device having a contact structure which includes a separation layer having a shape typified by a reverse tapered shape in which an outline of the bottom portion is inside an outline of an upper portion and which utilizes the difference between an amount of a light-emitting layer extending inside the outline and that of an upper electrode extending inside the outline. Further, when the outline of the separation layer which forms the contact portion has a depression and a projection, the length of the contact portion can be increased, and thus, contact resistance can be reduced.09-06-2012
20110101383Semiconductor Component and Method for Producing a Semiconductor Component - A semiconductor component comprising at least one optically active first region (05-05-2011
20120256205LED LIGHTING MODULE WITH UNIFORM LIGHT OUTPUT - The invention relates to a light emitting diode (LED) module that is characterized by a thermally conductive substrate which is used as the base of the module; and a plurality of cavities positioned on the module; and a plurality of LED semiconductors chips are mounted within each cavity. Within each cavity; secondary cavities are formed and a plurality of LED semiconductors chips are mounted within each of the secondary cavity. A multiple layer configuration of encapsulation is used to fill the cavities to help mix and diffuse the light from the LED chips and ensure that we achieve a uniform light output from the light emitting surface of the module.10-11-2012
20120256201ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An OLED display includes: a substrate; an organic light emitting element formed on the substrate and including a first electrode, an emission layer, and a second electrode; and an encapsulation layer formed on the substrate while covering the organic light emitting element. The encapsulation layer includes an organic layer and an inorganic layer, and a protrusion and depression structure is formed in an interface between the organic layer and the inorganic layer.10-11-2012
20120256207ILLUMINATION DEVICE AND DISPLAY APPARATUS - An illumination device includes: a substrate; a first transparent electrode covering approximately an entire surface of a display region of the substrate; a second transparent electrode which overlaps with the first transparent electrode when seen in plan view and covers approximately the entire surface of the display region; and a plurality of island shaped light emitting elements disposed between the first transparent electrode and the second transparent electrode. The first and second transparent electrodes are formed as single continuous films.10-11-2012
20120256204Light-Emitting Device and a Method of Manufacturing Light-Emitting Device - To provide a highly reliable light-emitting device and especially a light-emitting device which can be formed without use of a metal mask and includes a plurality of light-emitting elements. A structural body at least an end of which has an acute-angled shape is provided so that the end can pass downward through an electrically conductive film formed over the insulating layer and can be at least in contact with an insulating layer having elasticity, thereby physically separating the electrically conductive film, and the electrically conductive films are thus electrically insulated from each other. Such a structure may be provided between adjacent light-emitting elements so that the light-emitting elements can be electrically insulated from each other in the light-emitting device.10-11-2012
20120256202ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic light emitting diode (OLED) display a includes: a substrate; an organic light emitting element on the substrate and including a first electrode, a light emission layer, and a second electrode; and an encapsulation layer on the substrate while covering the organic light emitting element. The encapsulation layer includes an organic layer and an inorganic layer. A mixed area, where organic materials forming the organic layer and inorganic materials forming the inorganic layer co-exist along a plane direction of the encapsulation layer, is formed at the boundary between the organic layer and the inorganic layer.10-11-2012
20120187424LIGHT EMITTING DIODE - Exemplary embodiments of the present invention relate to light emitting diodes including a plurality of light emitting cells on a substrate to be suitable for AC driving. The light emitting diode includes a substrate and a plurality of light emitting cell formed on the substrate. Each light emitting cell includes a first region at a boundary of the light emitting cell and a second region opposite to the first region. A first electrode pad is formed in the first region of the light emitting cell. A second electrode pad having a linear shape is disposed to face the first electrode pad while regionally defining a peripheral region together with the boundary of the second region. A wire connects the first electrode pad to the second electrode pad between two adjacent light emitting cells.07-26-2012
20120187429LED LIGHT SOURCE AND METHOD OF MANUFACTURING THE SAME - After the LEDs 07-26-2012
20120187427LAMINATING ENCAPSULANT FILM CONTAINING PHOSPHOR OVER LEDS - A process is described for wavelength conversion of LED light using phosphors. LED dies are tested for correlated color temperature (CCT), and binned according to their color emission. The LEDs in each_bin are mounted on a single submount to form an array of LEDs. Various thin sheets of a flexible encapsulant (e.g., silicone) infused with one or more phosphors are preformed, where each sheet has different color conversion properties. An appropriate sheet is placed over an array of LED mounted on a submount, and the LEDs are energized. The resulting light is measured for CCT. If the CCT is acceptable, the phosphor sheet is permanently laminated onto the LEDs and submount. By selecting a different phosphor sheet for each bin of LEDs, the resulting CCT is very uniform across all bins.07-26-2012
20120187428METHOD FOR THE PRODUCTION OF WHITE LEDS AND WHITE LED LIGHT SOURCE - For the production of a white LED having a predetermined color temperature, a blue LED (07-26-2012
20120187426LIGHT SOURCE UNIT AND DEVICE USING SAME - Provided is a light source unit in which locating components are mounted on a substrate together with LEDs forming a light emitting portion, and with this, the light source unit can be more easily replaced, and the number of components can be reduced.07-26-2012
20090026468Semiconductor Light Emitting Element - In a semiconductor light emitting element, a p-type layer (01-29-2009
20090020769Semiconductor light emitting element - A semiconductor light emitting element having a rectangular shape in plan view comprising at least a first side and a second side adjacent to the first side, the semiconductor light emitting element including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, a plurality of first electrodes having a long shape along the first side and being arranged on the first conductivity-type semiconductor layer in a lattice form of x columns (x≧2) along the first side and y rows (y>x) along the second side, and a second electrode arranged on the second conductivity-type semiconductor layer. The first electrode and the second electrode are arranged on the same surface side. The first electrode is surrounded by the first conductivity-type semiconductor layer, the second conductivity-type semiconductor layer, and the second electrode is provided.01-22-2009
20090020767Active Matrix Substrate - An active matrix substrate is provided. Within the field of the probe contact area of the pad portion, a buffer layer is arranged on a pad in order to increase the thickness of the pad portion; or, to hollow out the pad and form an opening within the probe contract area. Thus, the probe will not touch the pad directly even if the probe is pressed inadequately to pierce the conductive layer. As a result, the substrate structure can prevent the metallic pad from chemically reacting with the mist or the air, and further to avoid an electrical erosion state. Therefore the signal of the probe can still be transmitted through the conductive layer.01-22-2009
20120256199DISPLAY DEVICE AND A METHOD OF MANUFACTURING THE SAME - A display device includes an array substrate, a driving film and an adhesive member. The array substrate includes a first base substrate, a plurality of first signal pads formed on the first base substrate and a first dummy pad formed adjacent to the first signal pads. The driving film includes a base film, a plurality of output terminals formed on the base film and a first alignment mark formed adjacent to the output terminals. The adhesive member adheres the first signal pads to the output terminals, and adheres the first dummy pad to the first alignment mark.10-11-2012
20120256203ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display includes a substrate, a display portion on the substrate, and a sealing substrate fixed on the substrate and sealingly engaging the display portion. The sealing substrate is fixed by an adhesive layer that surrounds the display portion. The sealing substrate includes a composite member, at least one conductive portion, and an insulation sheet. The composite member includes a resin base layer and a plurality of carbon fibers. The at least one conductive portion extends over inner and outer sides of the composite member and penetrates the composite member. The at least one conductive portion includes a double-layered structure having a metal foil layer and a plating layer. The insulation sheet is on the outer side of the composite member and the insulation sheet covers the at least one conductive portion10-11-2012
20120228647ORGANIC ELECTROLUMINESCENT ELEMENT - The present invention provides an organic EL element configured to stably emit light while suppressing total reflection that occurs at an electrode. This organic EL element includes a pair of electrodes and one or more organic layers provided between the electrodes, and includes a light-emitting layer as the one or more organic layers. Surfaces of the pair of electrodes facing each other are flat. At least one organic layer of the one or more organic layers has a periodic structure that makes the traveling direction of light, traveling in the direction generally perpendicular to the thickness direction of the light-emitting layer, inclined to the thickness direction. The periodic structure has a periodic configuration that is arranged with a two-dimensional period in a plane that is perpendicular to the thickness direction of the light-emitting layer.09-13-2012
20120228646LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MAKING THE SAME - An LED package includes a substrate; a plurality of LED units formed on the substrate; and a phosphor tape arranged on the LED units. Light from the LED units travels to an external environment through the phosphor tape. The phosphor tape has phosphor particles evenly distributed therein. A method for forming the LED package is also provided.09-13-2012
20120228645LED LAMP STRIP AND MANUFACTURING PROCESS THEREOF - A process of manufacturing an LED lamp strip includes the steps of forming a plurality of through holes on an adhesive tape, mounting the adhesive tape to a top side of a scrollable lead frame, bonding a plurality of LED chips to the top side of the scrollable lead frame according to the positions of the through holes, packaging the LED chips respectively, and finally cutting the scrollable lead frame. In light of this, the LED lamp strip can be produced under the circumstances of low production cost and less production time.09-13-2012
20120228649LED MODULE, METHOD FOR MANUFACTURING THE SAME, AND LED CHANNEL LETTER INCLUDING THE SAME - Disclosed herein is a method for manufacturing a light emitting diode (LED) module, the method including: disposing a circuit board at a molding space formed by an upper mold and a lower mold; adding a filling material to the molding space; hardening the filling material to form a molding cover covering at least a portion of an upper surface, a lower surface, and a side surface of the circuit board, the molding cover having an opening exposing the lower surface of the circuit board; removing the upper mold and the lower mold from the circuit board; and disposing an LED on the upper surface of the circuit board.09-13-2012
20120228650Light Emitting Diode Emitter Substrate with Highly Reflective Metal Bonding - The present disclosure provides one embodiment of a method for fabricating a light emitting diode (LED) package. The method includes forming a plurality of through silicon vias (TSVs) on a silicon substrate; depositing a dielectric layer over a first side and a second side of the silicon substrate and over sidewall surfaces of the TSVs; forming a metal layer patterned over the dielectric layer on the first side and the second side of the silicon substrate and further filling the TSVs; and forming a plurality of highly reflective bonding pads over the metal layer on the second side of the silicon substrate for LED bonding and wire bonding.09-13-2012
20120261681PRODUCING METHOD OF LIGHT EMITTING ELEMENT TRANSFER SHEET, PRODUCING METHOD OF LIGHT EMITTING DEVICE, LIGHT EMITTING ELEMENT TRANSFER SHEET, AND LIGHT EMITTING DEVICE - A method for producing a light emitting transfer sheet includes the steps of preparing a light emitting element sheet including a light semiconductor layer connected to an electrode portion on one side surface and a phosphor layer laminated on the other side surface; dividing the light emitting element sheet into plural pieces to form a plurality of light emitting elements; disposing a plurality of the light emitting elements on a substrate to be spaced apart from each other; forming a reflecting resin layer containing a light reflecting component on the substrate so as to cover the light emitting elements; and removing the reflecting resin layer partially so that one side surface of the electrode portion is exposed from the reflecting resin layer.10-18-2012
20120261680LED Array Having Embedded LED and Method Therefor - An LED array comprises a base layer, at least one LED disposed on the base layer, and a diffusion layer including a luminescent material. The diffusion layer covers the at least one LED and the base layer in such a way that light emitted from the at least one LED passes through the diffusion layer.10-18-2012
20120228648LIGHT-EMITTING DEVICE, LIGHT-EMITTING APPARATUS, DISPLAY DEVICE AND ELECTRONIC APPARATUS - A light-emitting device includes an anode, a cathode, a first phosphorescent layer and a fluorescent layer that are provided between the anode and the cathode and emit phosphorescent light and fluorescent light, respectively, upon energization of the anode and the cathode, and an intermediate layer provided between the first phosphorescent layer and the fluorescent layer, the intermediate layer including a hole transport layer and an electron transport layer that are in contact with each other, the electron transport layer being located on the anode side, the hole transport layer being located on the cathode side.09-13-2012
20110121327ORGANIC LIGHT-EMITTING DIODE THREE-DIMENSIONAL IMAGE DISPLAY DEVICE - Disclosed herein is an organic light-emitting diode three-dimensional image display device which comprises a first substrate, a cathode formed on the first substrate, an electron injection layer formed on the cathode, an electron transfer layer formed on the electron injection layer, an emission layer formed on the electron transfer layer, a hole transfer layer formed on the emission layer, a hole injection layer formed on the hole transfer layer, an anode formed on the hole injection layer, a wire grid polarizer formed on the anode and composed of a metal thin film pattern formed at a first angle and a method thin film pattern formed at a second angle perpendicular to the first angle, which are alternately arranged, and a second substrate arranged on the wire grid polarizer.05-26-2011
20110121326Submount Having Reflective Cu-Ni-Ag Pads Formed Using Electroless Deposition - A submount for an LED has relatively large copper pads formed on its top surface using an electroless process so that no electrical bias circuitry is required for the submount. The copper pads are then coated with nickel using an electroless process. The nickel layer is then coated with silver using an electroless process, such as an immersion silver process. In one embodiment, the silver layer is less than one micron thick. The Ni layer prevents a reduction in reflectivity of the Ag after long periods of use while conducting the high current (300 mA to >1 amp) needed for high power LEDs. The silver layer surrounds at least 75% of the periphery of the LED die and extends at least 1 mm around the periphery of the die to reflect the LED light.05-26-2011
20110121323Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity - A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.05-26-2011
20110121325SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME - There are disclosed TFTs having improved reliability. An interlayer dielectric film forming the TFTs is made of a silicon nitride film. Other interlayer dielectric films are also made of silicon nitride. The stresses inside the silicon nitride films forming these interlayer dielectric films are set between −5×1005-26-2011
20100327296DISPLAY APPARATUS - Provided is a display apparatus which can easily bond a drive panel and a sealing panel together. The drive panel includes organic electroluminescence devices on a substrate for drive and extracts light from the side of the organic electroluminescence devices. The sealing panel includes a color filter on a substrate for sealing. The drive panel and the sealing panel are disposed to face each other, and the whole facing surfaces of the drive panel and the sealing panel are bonded together with an adhesive layer. The adhesive layer is cured with at least heat, and is made of only one coating liquid or a combination of two or more coating liquids for curing. A temporary fixing portion is formed in an edge portion of the adhesive layer. The temporary fixing portion is made of, for example, an ultraviolet cure resin, and is formed so as to straddle between the sealing panel and the drive panel to align their relative positions.12-30-2010
20100327295LED PACKAGE STRUCTURE WITH EXTERNAL CUTTING CHAMFER AND METHOD FOR MANUFACTURING THE SAME - An LED package structure includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area, and the substrate body has a cutting chamfer formed on one side thereof. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the substrate body by coating. A distance between an outermost side of the annular reflecting resin body and an outermost side of the substrate body is between 0 and 1.5 mm, and the annular reflecting resin body surrounds the LED chips to form a resin position limiting space. The package unit has a translucent package resin body for covering the LED chips, and the position of the translucent package resin body is limited in the resin position limiting space.12-30-2010
20100327294LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND CONTROLLING LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME - An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space.12-30-2010
20080296591Conductor Structure, Pixel Structure, and Methods of Forming the Same - A method for forming a conductor structure is provided. The method comprises: (1) providing a substrate; (2) forming a patterned dielectric layer with a first opening which exposes a portion of the substrate; forming a patterned organic material layer on the dielectric layer with a second opening which corresponds to the first opening and expose the exposed portion of the substrate; (3) forming a first barrier layer on the organic material layer and the exposed portion of the substrate; (4) forming a metal layer on the first barrier layer; and (5) removing the organic material layer, the first barrier layer thereon and the metal layer thereon.12-04-2008
20080296590LED-Based Light Source Having Improved Thermal Dissipation - A light source having a plurality of dies mounted on leads that are partially enclosed in a plastic body is disclosed. Each die is powered by first and second contacts. One contact is connected to the lead on which the die is mounted. Light from the LED exits the die through the top surface. Each lead includes a layer of metal of substantially constant thickness. The layer includes a boundary, a die mounting region within the boundary and a heat transfer region within the boundary. The boundary increases in a dimension perpendicular to a line connecting the die mounting region and the heat transfer region. The leads are arranged such that the die mounting regions are proximate to a first point and oriented such that the lines radiate from the first point. The light source can be manufactured using conventional lead frame techniques.12-04-2008
20120319140ORGANIC LIGHT EMITTING DISPLAY MODULE AND PRODUCING METHOD THEREOF - An organic light emitting diode (OLED) display module including a first carrier, a second carrier and an OLED display panel is provided. The second carrier disposed on the first carrier is integrally formed with the first carrier. The OLED display panel is disposed on the second carrier. A continuous joint surface is formed between the first and the second carriers. A producing method of the OLED display module is also provided.12-20-2012
20110018006MICRO-SIZED SEMICONDUCTOR LIGHT-EMITTING DIODE HAVING EMITTING LAYER INCLUDING SILICON NANO-DOT, SEMICONDUCTOR LIGHT-EMITTING DIODE ARRAY INCLUDING THE MICRO-SIZED SEMICONDUCTOR LIGHT-EMITTING DIODE, AND METHOD OF FABRICATING THE MICRO-SIZED SEMICONDUCTOR LIGHT-EMITTING DIODE - A micro-sized semiconductor light-emitting diode includes an emission material layer formed on a silicon substrate, and including a silicon nano-dot; a hole injecting layer and an electron injecting layer that face each other, wherein the hole injecting layer and an electron injecting layer are formed between the emission material layer; a transparent conductive electrode layer formed on the electron injecting layer; and a first electrode and a second electrode that respectively inject a current in the hole injecting layer and the transparent conductive electrode layer from the outside.01-27-2011
20110037079Structure and method for fabricating fluorescent powder gel light emitting module - The present invention relates to a structure and a method for fabricating a fluorescent powder gel light emitting module. A circuit is arranged on a surface of the circuit board, and a plurality of wire connection points is arranged thereon for providing the electrical connection to the electronic components and the light emitting diodes respectively with the circuit board. A plastic ring is formed on an outer portion of the light emitting diodes on the surface of the circuit board to form a specific region and coat the fluorescent powder gel onto the surface of the circuit board in the specific region between every visible light emitting face of the plurality of light emitting diodes and the adjacent region of every light emitting diode, and further to bake for forming a light emitting module to produce light overlapping region by the side light between every adjacent light emitting diode to further produce an extended light source plane to effectively gain a high light emitting efficiency, higher brightness and even irradiation of the radiated light.02-17-2011
20120299029DISPLAY DEVICE - It is an object to provide a highly reliable display device. It is a feature an IC is over a substrate and a material layer having the same height is thereover. An IC is provided on one side of the substrate, and a material layer having the same height as the IC is provided on at least another side. Further, an IC is provided on one side of the substrate, and material layers having the same height as the IC are provided on the other sides. Further, an IC is provided on one side of the substrate, and a material layer having the same height as the IC is provided at a corner of the substrate.11-29-2012
20120299028MANUFACTURING METHOD FOR LIQUID CRYSTAL DISPLAY DEVICE - A LCD device having a large pixel holding capacitance includes opposedly facing first and second substrates, and liquid crystal between them. The first substrate includes a video signal line, a pixel electrode, a thin film transistor having a first electrode connected to the video signal line and a second electrode connected to the pixel electrode, a first silicon nitride film formed above the second electrode, an organic insulation film above the first silicon nitride film, a capacitance electrode above the organic insulation film, and a second silicon nitride film above the capacitance electrode and below the pixel electrode. A contact hole etched in both the first and second silicon nitride films connects the second electrode and the pixel electrode to each other. A holding capacitance is formed by the pixel electrode, the second silicon nitride film and the capacitance electrode.11-29-2012
20120299027DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - To achieve enlargement and high definition of a display portion, a single crystal semiconductor film is used as a transistor in a pixel, and the following steps are included: bonding a plurality of single crystal semiconductor substrates to a base substrate; separating part of the plurality of single crystal semiconductor substrates to form a plurality of regions each comprising a single crystal semiconductor film over the base substrate; forming a plurality of transistors each comprising the single crystal semiconductor film as a channel formation region; and forming a plurality of pixel electrodes over the region provided with the single crystal semiconductor film and a region not provided with the single crystal semiconductor film. Some of the transistors electrically connecting to the pixel electrodes formed over the region not provided with the single crystal semiconductor film are formed in the region provided with the single crystal semiconductor film.11-29-2012
20120299026LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting device comprises a substrate having a plurality of light emitting elements mounted thereon; a side wall structure having a partition wall portion separating a plurality of light emitting areas that each include at least one of the light emitting elements; and encapsulating resin filled in the light emitting areas to bury the light emitting elements therein. The side wall structure is separated by a space from the substrate at, at least, the partition wall portion so as to be in noncontact with the substrate, and the encapsulating resin is formed so as to integrally, continuously fill the light emitting areas and the space without producing any interface therein.11-29-2012
20120299025MANUFACTURING METHOD OF LIGHT EMITTING DEVICE AND MANUFACTURING DEVICE THEREOF - The present invention provides a structure in which a pixel region 11-29-2012
20120299024PATTERNING SLIT SHEET ASSEMBLY, ORGANIC LAYER DEPOSITION APPARATUS, METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS, AND THE ORGANIC LIGHT-EMITTING DISPLAY APPARATUS - A patterning slit sheet assembly for performing a deposition process to form a thin film on a substrate in a desired fine pattern. The patterning slit sheet assembly includes a patterning slit sheet having a plurality of slits, a frame combined with the patterning slit sheet to support the patterning slit sheet, and a support unit including an upper member that is allowed to be moved or fixed to support the patterning slit sheet when a gravitational force is applied to the patterning slit sheet and a lower member disposed more apart from the patterning slit sheet than the upper member, wherein the upper member is fixed on the lower member.11-29-2012
20120299023ORGANIC LAYER DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME - An organic layer deposition apparatus for forming an organic layer on a substrate includes: a deposition source configured to discharge a deposition material; a deposition source nozzle unit arranged at a side of the deposition source and including a plurality of deposition source nozzles; and a patterning slit sheet facing the deposition source nozzle unit and including a plurality of patterning slits and at least one spacer arranged between a pair of adjacent patterning slits of the plurality of patterning slits, the patterning slit sheet being smaller than the substrate in at least one of a first direction or a second direction perpendicular to the first direction, and the substrate is spaced apart from the organic layer deposition apparatus by a predetermined distance, and at least one of the substrate or the organic layer deposition apparatus is movable relative to the other.11-29-2012
20120299022LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a light emission area disposed over the submount. The light emission area can include one or more light emitting diodes (LEDs), a fillet at least partially disposed about the one or more the LEDs, and filling material. The filling material can be disposed over a portion of the one or more LEDs and a portion of the fillet.11-29-2012
20120299021DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - Drive units arranged on a transistor array substrate include faulty drive units. The pixel electrodes include first pixel electrodes and second pixel electrodes, the first pixel electrodes corresponding one-to-one to the faulty drive units, and the second pixel electrodes corresponding one-to-one to the non-faulty drive units, a portion of each second pixel electrode is embedded in the contact hole corresponding thereto, and is in contact with a power supply pad of the non-faulty drive unit corresponding thereto, so that the second pixel electrode is electrically connected to the non-faulty drive unit. Each first pixel electrode is electrically insulated from the faulty drive unit corresponding thereto, and is connected by a connector to any of the second pixel electrodes adjacent thereto. A surface of each connector facing the interlayer insulation film is entirely in contact with the interlayer insulation film.11-29-2012
20120299020LED PACKAGE MODULE FOR LIGHTING - An LED package module for lighting includes a plurality of LED chips spacedly arranged on a hard substrate and a plurality of dome-shaped encapsulants arranged on the hard substrate in such a way that the encapsulants enclose the LED chips respectively. By means of the dome-shaped encapsulants, the light extracting rate of the LED chips is enhanced. On the surface of the hard substrate, no dam structure is needed; therefore, the amount of the encapsulant material used in the LED package module can be effectively saved.11-29-2012
20120299019Systems and Methods Providing Semiconductor Light Emitters - A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.11-29-2012
20120299018BAT-WING LENS DESIGN WITH MULTI-DIE - A batwing beam is produced from an optical emitter having a primary LED lens over a number of LED dies on a package substrate. The LED lens includes a batwing surface formed by rotating a parabolic arc about an end of the parabolic arc over a center of the optical emitter. A center of each of the LED dies is mounted to the package substrate about the focus of a parabola whose arc forms the batwing surface, for example, between about 0.5 to 1.5 of a focal distance from the vertex of the parabola. The batwing surface reflects light from the number of LED dies through total internal reflection (TIR) or through a reflectivity gel coating.11-29-2012
20120319144DISPLAY PANEL AND DISPLAY DEVICE - Disclosed is a display panel 12-20-2012
20120267644ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display includes a substrate and an organic light emitting element on the substrate and including a first electrode, a plurality of organic emission layers on the first electrode and including at least one P-type impurity doped organic emission layer, and a second electrode on the plurality of organic emission layers.10-25-2012
20120267647LIGHT EMITTING DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME - A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.10-25-2012
20120267646ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - An organic light emitting diode display includes a substrate; an organic light emitting element provided over the substrate; a thin film encapsulation layer configured to seal the organic light emitting element together with the substrate; a phase delay layer provided over the thin film encapsulation layer and contacting the thin film encapsulation layer; and a polarizing film attached to the phase delay layer and having an area smaller than that of the phase delay layer.10-25-2012
20120267649LIGHT-EMITTING DIODE DIE PACKAGES AND ILLUMINATION APPARATUSES USING SAME - The present invention relates to an LED die package, which has a light-emitting diode die having a sapphire layer, a first doped layer doped with a p- or n-type dopant, and a second doped layer doped with a different dopant from that doped in the first doped layer. A surface of the sapphire layer opposite to the surface on which the first doped layer is disposed is formed with generally inverted-pyramidal-shaped recesses and overlaid with a phosphor powder layer. Each of the first and the second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is disposed and formed with exposure holes for exposing the electrodes. The exposure holes are each filled with an electrically conductive linker.10-25-2012
20120267648LIGHT-EMITTING DIODE DIE PACKAGES AND ILLUMINATION APPARATUSES USING SAME - The present invention relates to an LED die package, which has a light-emitting diode die having a sapphire layer, a first doped layer doped with a p- or n-type dopant, and a second doped layer doped with a different dopant from that doped in the first doped layer. A surface of the sapphire layer opposite to the surface on which the first doped layer is disposed is formed with generally inverted-pyramidal-shaped recesses and overlaid with a phosphor powder layer. Each of the first and the second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is disposed and formed with exposure holes for exposing the electrodes. The exposure holes are each filled with an electrically conductive linker.10-25-2012
20120319141ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - An organic light emitting diode (OLED) display includes a substrate main body, a plurality of organic light emitting elements on the substrate main body, a column spacer on the substrate main body and between two or more of the plurality of organic light emitting elements, and an encapsulation thin film covering at least one of the organic light emitting elements and having regions divided by the column spacer.12-20-2012
20120319143LIGHT EMITTING DEVICE AND ILLUMINATION APPARATUS INCLUDING SAME - A light emitting device includes a plurality of solid-state light emitting elements mounted on a substrate; and a wavelength converting unit covering the solid-state light emitting elements, the wavelength converting unit containing fluorescent materials. The solid-state light emitting elements include inner solid-state light emitting elements arranged in a central position of the substrate and outer solid-state light emitting elements arranged outwardly of the inner solid-state light emitting elements, and the wavelength converting unit is configured such that a probability that light propagating through the wavelength converting unit is brought into contact with the fluorescent materials in a portion of the wavelength converting unit covering the outer solid-state light emitting elements is lower than a probability that light propagating through the wavelength converting unit is brought into contact with the fluorescent materials in other portions.12-20-2012
20120319142GEL UNDERFILL LAYERS FOR LIGHT EMITTING DIODES AND METHODS OF FABRICATING SAME - A light emitting device is fabricated by providing a mounting substrate and an array of light emitting diode dies adjacent the mounting substrate to define gaps. A gel that is diluted in a solvent is applied on the substrate and on the array of light emitting dies. At least some of the solvent is evaporated so that the gel remains in the gaps, but does not completely cover the light emitting diode dies. For example, the gel substantially recedes from the substrate beyond the array of light emitting diode dies and also substantially recedes from an outer face of the light emitting diode dies. Related light emitting device structures are also described.12-20-2012
20110210350LIGHT EMITTING ELEMENT WITH A PLURALITY OF CELLS BONDED, METHOD OF MANUFACTURING THE SAME, AND LIGHT EMITTING DEVICE USING THE SAME - The present invention relates to a light emitting element with arrayed cells, a method of manufacturing the same, and a light emitting device using the same. The present invention provides a light emitting element including a light emitting cell block with a plurality of light emitting cells connected in series or parallel on a single substrate, and a method of manufacturing the same, wherein each of the plurality of light emitting cells includes an N-type semiconductor layer and a P-type semiconductor layer, and the N-type semiconductor layer of one light emitting cell is electrically connected to the P-type semiconductor layer of another adjacent light emitting cell. Further, the present invention provides a light emitting device including a light emitting element with a plurality of light emitting cells connected in series. Accordingly, it is possible to simplify a manufacturing process of a light emitting device for illumination capable of being used with a household AC power source, to decrease a fraction defective occurring in manufacturing a light emitting device for illumination, and to mass-produce the light emitting device for illumination. Further, there is an advantage in that DC driving efficiency can be enhanced in an AC operation by installing a predetermined rectifying circuit outside the light emitting element.09-01-2011
20110227100LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THEREOF - A light-emitting device comprises: a substrate; a plurality of organic electroluminescent elements provided on the substrate; and a partition defining pixel areas in each of which one of the organic EL elements is provided. The partition comprises an insulating film provided with openings each hollowly formed in an area corresponding to one of the pixel areas and a partition body provided on an opposite side of the insulating film with respect to the substrate. Each of the organic EL elements comprises a pair of electrodes and a light-emitting portion that is interposed between the electrodes and that is arranged in an area surrounded by the insulating film. The thickness of the insulating film is smaller than the thickness of the light-emitting portion.09-22-2011
20110227098ORGANIC LIGHT EMITTING DISPLAY - An organic light emitting display is capable of reducing or minimizing the number of wiring lines to improve an aperture ratio. The organic light emitting display includes scan lines and data lines that cross each other at crossing regions, sub pixels located at the crossing regions that display an image in accordance with an amount of current that flows from a first power source to respective organic light emitting diodes in the sub pixels, and first power source lines that are parallel to the data lines, each of the first power source lines corresponding to at least two of the data lines. The first power source lines include a first group of the first power source lines that receive the first power source and a second group of the first power source lines that receive a second power source.09-22-2011
20110227097ACTIVE MATRIX SUBSTRATE, PRODUCTION METHOD OF THE SAME, LIQUID CRYSTAL PANEL, LIQUID CRYSTAL DISPLAY DEVICE, LIQUID CRYSTAL DISPLAY UNIT, AND TELEVISION RECEIVER - An active matrix substrate includes: pixel regions (09-22-2011
20120080693LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME - The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.04-05-2012
20120080691LIGHT EMITTING DIODE AND MAKING METHOD THEREOF - An LED includes a substrate, a first P-type semiconductor layer formed on the substrate and a plurality of LED dies arranged on the first P-type semiconductor layer. The LED dies are electrically connected to each other in series. The present invention also relates to a method for making such an LED.04-05-2012
20110241031OPTOELECTRONIC PROJECTION DEVICE - An optoelectronic projection device which generates a predefined image during operation, including a semiconductor body having an active layer that generates electromagnetic radiation and a radiation exit side and is an imaging element of the projection device, wherein, to electrically contact the semiconductor body, a first contact layer and a second contact layer are arranged at a rear side of the semiconductor body, the rear side lying opposite the radiation exit side, and are electrically insulated from one another by a separating layer.10-06-2011
20110241029ORGANIC LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light emitting display device can prevent a voltage dropping in a cathode electrode. The organic light emitting display device includes a substrate, cathode wiring arranged on a surface of the substrate, an anode electrode arranged on the substrate and electrically insulated from the cathode wiring, an organic layer arrangement arranged on the anode electrode to form a plurality of unit pixels, a cathode electrode covering the organic layer arrangement and at least one electrical connection unit to electrically connect the cathode wiring to the cathode electrode.10-06-2011
20110266564SEMICONDUCTOR DISPLAY DEVICE - A semiconductor display device using a light-emitting element, which can suppress luminance unevenness among pixels due to the potential drop of a wiring, is provided. Power supply lines to which a power supply potential is supplied are electrically connected to each other in a display region where a plurality of pixels are arranged. Further, an interlayer insulating film is formed over a wiring (an auxiliary power supply line) for electrically connecting the power supply lines to each other in the display region and a gate electrode of a transistor included in a pixel; and the power supply lines are formed over the interlayer insulating film which is formed over the auxiliary power supply line and the gate electrode. Furthermore, a wiring (an auxiliary wiring) formed over the interlayer insulating film is electrically or directly connected to the auxiliary power supply line.11-03-2011
20120326180LIGHT-EMITTING ELEMENT, DISPLAY AND DISPLAY DEVICE - A light-emitting element of the present invention includes (i) a light-emitting layer (12-27-2012
20120326183LIGHT EMITTING DEVICE PACKAGE - A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup.12-27-2012
20120280258Nitride Light-Emitting Diode with a Current Spreading Layer - A nitride light-emitting diode is provided including a current spreading layer. The current spreading layer includes a first layer having a plurality of distributed insulating portions configured to have electrical current flow therebetween; and a second layer including interlaced at least one substantially undoped nitride semiconductor layer and at least one n-type nitride semiconductor layer configured to spread laterally the electrical current from the first layer11-08-2012
20120280257TFT ARRAY SUBSTRATE AND MANUFACTURING AND REPAIRING METHODS OF THE SAME - An embodiment of the disclosed provides a TFT-LCD array substrate is provided, comprising a base substrate; a first transparent conductive film, a gate layer, a gate insulating layer, a semiconductor layer, and a source/drain electrode layer sequentially formed on the base substrate from the bottom up, wherein for each pixel unit of the array substrate the first transparent conductive film comprises at least a first part and a second part that do not contact with each other, and the first part is located under an area of the data line, without contacting the gate line and the common electrode line. When a data line in the array substrate has an open failure, this part of the transparent conductive film can be welded together with the data line using laser welding so as to repaire the data line.11-08-2012
20120280256REMOTE PHOSPHOR LIGHT EMITTING DEVICES, COMPONENTS AND FABRICATION - A substrate including phosphor is remotely illuminated by an LED. Optical radiation that emerges through the substrate is measured. Portions of the substrate, such as raised features on the substrate, are then selectively removed responsive to the measuring, so as to obtain a desired optical radiation. In removing portions of the substrate, holes may be drilled through the substrate to provide a separate path for light from the LED that does not pass through the phosphor. Alternatively, a separate LED may be provided outside the dome.11-08-2012
20110297973LED WITH AN ADSORPTION PLATE - The present invention relates to an LED with an adsorption plate attached thereto, and more particularly, to an LED which is covered with a light transmitter made of a light-transmitting material to prevent light scattering and to restrict the light radiation range to the size of the light transmitter. The light transmitter has a thin film light-transmitting portion and a thick film light-transmitting portion to improve visibility at a short distance and at a long distance, and from the front and the side. Further, a user may freely combine LEDs with adsorption plates attached thereto to express words or sentences for advertisements, and may also easily change the words or sentences.12-08-2011
20120326179DISPLAY DEVICE AND MANUFACTURING METHOD OF THE DISPLAY DEVICE - The MEMS shutter includes a shutter having an aperture part, a first spring connected to the shutter, a first anchor connected to the first spring, a second spring and a second anchor connected to the second spring, an insulation film on a surface of the shutter, the first spring, the second spring, the first anchor and the second anchor, the surfaces being in a perpendicular direction to a surface of a substrate, and the insulation film is not present on a surface of the plurality of terminals, and a surface of the shutter, the first spring, the second spring, the first anchor and the second anchor, the surfaces being in a parallel direction to a surface of the substrate and on the opposite side of the side facing the substrate.12-27-2012
20120326172LIQUID CRYSTAL DISPLAY AND METHOD FOR MANUFACTURING THE SAME - Provided is a liquid crystal display including: a first substrate; a thin film transistor disposed on the first substrate; a passivation layer disposed on the thin film transistor and comprising a contact hole exposing an electrode of the thin film transistor; a pixel electrode disposed on the passivation layer and connected to the electrode of the thin film transistor through the contact hole; a lower buffer layer disposed on the pixel electrode; a lower alignment layer disposed on the lower buffer layer; a second substrate facing the first substrate; a common electrode disposed on the second substrate; an upper buffer layer disposed on the common electrode; and an upper alignment layer disposed on the upper buffer layer, in which the lower buffer layer comprises parylene, the upper buffer layer comprises parylene, or both the lower and the upper buffer layers comprise parylene.12-27-2012
20120326171LIGHT EMITTING DIODE HAVING ELECTRODE PADS - The present invention relates to light-emitting diodes. A light-emitting diode according to an exemplary embodiment of the present invention includes a first group including a plurality of first light emitting cells connected in parallel to each other, and a second group including a plurality of second light emitting cells connected in parallel to each other. Each first light emitting cell and second light emitting cell has a semiconductor stack that includes a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer disposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. At least two light emitting cells of the first light emitting cells share the first conductivity-type semiconductor layer, and at least two light emitting cells of the second light emitting cells share the first conductivity-type semiconductor layer. The first light emitting cells are connected in series to the second light emitting cells.12-27-2012
20120326182IMAGE DISPLAY APPARATUS AND IMAGE DISPLAY APPARATUS MANUFACTURING METHOD - Provided is an image display apparatus in which color breakup of a reflection image formed from reflected ambient light may be reduced to suppress the influence of an ambient environment. The image display apparatus includes multiple pixels. Each of the pixels includes a light-emitting layer and a structure layer having a refractive index distribution in an in-plane direction parallel to a screen of the image display apparatus, for extracting light generated from the light-emitting layer. The structure layer includes multiple structures formed of a first medium and a layer formed of a second medium having a refractive index different from a refractive index of the first medium. The multiple structures are non-periodically arranged in the layer. Reflected ambient light is reflected by the multiple structures formed of the first medium to have an overlap range to reduce color breakup of a reflection image formed from the reflected ambient light.12-27-2012
20120091482ORGANIC EL ELEMENT, METHOD FOR MANUFACTURING THE SAME, AND ORGANIC EL DISPLAY DEVICE04-19-2012
20120091481LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A light-emitting device includes a light-emitting element and a support substrate. The light-emitting element has an insulating layer and first and second vertical conductors passing through the insulating layer. The support substrate has a substrate part and first and second through electrodes and is disposed on the insulating layer. The first through electrode passes through the substrate part with one end connected to an opposing end of the first vertical conductor, while the second through electrode passes through the substrate part with one end connected to an opposing end of the second vertical conductor. The opposing ends of the first and second vertical conductors are projected from a surface of the insulating layer and connected to the ends of the first and second through electrode inside the support substrate.04-19-2012
20120091480LIGHT-EMITTING DEVICE - A light-emitting device includes a substrate, a plurality of light-emitting elements mounted on one surface of the substrate, a first glass film provided to one surface of the substrate and having a plurality of apertures that form a light-reflecting frame surrounding the perimeter of each the light-emitting elements, and a second glass film provided to the other surface of the substrate. A coefficient of thermal expansion of the second glass film is greater than that of the substrate when a coefficient of thermal expansion of the first glass film is greater than that of the substrate, and a coefficient of thermal expansion of the second glass film is less than that of the substrate when a coefficient of thermal expansion of the first glass film is less than that of the substrate.04-19-2012
20120091479ELECTROOPTIC DEVICE AND ELECTRONIC APPARATUS - Pixel electrodes having reflectivity are arranged at a predetermined pitch in a matrix form on an effective display region on an opposed surface of an element substrate. A first conductive pattern which is formed by the same layer as the pixel electrodes is provided on an ineffective display region which is at an outer side with respect to the effective display region and at an inner side with respect to a sealing region when seen from the above. A second conductive pattern which is formed by the same layer as the pixel electrodes is provided on the sealing region. An area density of the second conductive pattern is smaller than an area density of the first conductive pattern when seen from the above.04-19-2012
20120091478LIGHT EMITTING DEVICE HAVING A PLURALILTY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME - A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.04-19-2012
20120091477Organic Light Emitting Diode Display - An organic light emitting diode (OLED) display comprises: a substrate; a display unit formed on the substrate and including an organic light emitting element; an interception layer positioned at the outside of the display unit on the substrate; and a thin film encapsulation layer which is formed with a stacked film of an inorganic film and an organic film, which has an end portion contacting the interception layer, and which covers the entire display unit and at least a part of the interception layer.04-19-2012
20120091476LIGHT EMITTING DEVICE - A light emitting device includes a light emitting unit and a submount. The light emitting unit has a plurality of light emitting diodes (LEDs), and the submount has a plurality of conductive contacts on a side thereof. The LEDs are coupled to the conductive contacts in various electrical connection manners, such that the LEDs are connected in series or/and in parallel.04-19-2012
20120091475Method of treating the surface of a soda lime silica glass substrate, surface-treated glass substrate, and device incorporating the same - Certain example embodiments of this invention relate to methods of treating the surface of a soda lime silica glass substrate, e.g., a soda lime silica alkali ion glass substrate, and the resulting surface-treated glass articles. More particularly, certain example embodiments of this invention relate to methods of removing a top surface portion of a glass substrate using ion sources. During or after removal of this portion, the glass may then be coated with another layer, to be used as a capping layer. In certain example embodiments, the glass substrate coated with a capping layer may be used as a color filter and/or TFT substrate in an electronic device. In other example embodiments, the glass substrate with the capping layer thereon may be used in a variety of display devices.04-19-2012
20120326175LED PACKAGE AND METHOD FOR MAKING THE SAME - An LED package includes a substrate with two opposite lateral bulging portions, an LED die, an electrode structure, and a reflective layer. The substrate includes a first substrate and a second substrate stacked together; the first substrate and the second substrate are transparent; and the substrate includes an emitting surface for emitting light of the LED package. The electrode structure is sandwiched between the first substrate and the second substrate. The LED die is mounted in the substrate and electrically connected to the electrode structure. The reflective layer is formed on an outer surface of the substrate except the emitting surface and the bulging portions. The disclosure also provides a method for manufacturing such an LED package.12-27-2012
20120326174ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an organic light-emitting display device includes forming a gate electrode including a lower gate electrode on a gate insulating layer and an upper gate electrode on the lower gate electrode; forming a source region and a drain region at a semiconductor active layer using the gate electrode as a mask; forming an interlayer insulating layer on a substrate and etching the interlayer insulating layer, resulting in contact holes that expose portions of the source region and the drain region; forming a source/drain electrode raw material on the substrate and etching the source/drain electrode raw material to form a source electrode and a drain electrode; forming a gold overlapped lightly doped drain (GOLDD) structure having a LDD region at the semiconductor active layer by injecting impurity ions; depositing a protective layer on the substrate; and forming a display device on the substrate.12-27-2012
20120326173LIGHT EMITTING DIODE ELEMENT, METHOD OF FABRICATION AND LIGHT EMITTING DEVICE - A light emitting diode comprises a multi-layer semiconductor, a first electrode and a second electrode. The multi-layer semiconductor has a light emitting active layer substantially perpendicular to the predetermined surface, a first semiconductor layer located on a surface of the light emitting active layer and a second semiconductor layer located on an opposite surface of the light emitting active layer. The first electrode is provided adjacent to and electrically connect to the first semiconductor layer. The second electrode is provided adjacent to and electrically connect to the second semiconductor layer. In addition, a method of fabricating LED element and a light emitting device having the LED elements are provided.12-27-2012
20120326181LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE, ILLUMINATING DEVICE, AND BACKLIGHT - In a light emitting device, one hundred or more bar-like structured light emitting elements (12-27-2012
20120326178OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT - An optoelectronic component includes at least one inorganic optoelectronically active semiconductor component having an active region that emits or receives light during operation, and a sealing material applied by atomic layer deposition on at least one surface region, the sealing material covering the surface region in a hermetically impermeable manner.12-27-2012
20120326177DISPLAY DEVICE AND FABRICATION METHOD FOR DISPLAY DEVICE - A display device capable of suppressing decrease in capacitance and capable of reducing area even when a capacitor unit is repaired is provided. A capacitor unit in a display device includes: a capacitor element having a first capacitor electrode connected to a power line and provided in an SD electrode layer and a second capacitor electrode provided in a GM electrode layer; a backup capacitor electrode provided in the TM electrode layer; a disconnect-able portion at which a connection between the first capacitor electrode and the power line can be disconnected; and a connectable portion at which the backup capacitor electrode and the power line can be connected, and the disconnect-able portion and the connectable portion overlap in a stacking direction.12-27-2012
20120326176DISPLAY DEVICE AND FABRICATION METHOD FOR DISPLAY DEVICE - A capacitor unit in a display device includes: a capacitor element having a first capacitor electrode connected to a power line and provided in a GM electrode layer and a second capacitor electrode connected to a line and provided in an SD electrode layer; a backup capacitor element having a first backup capacitor electrode provided in the GM electrode layer and a second backup capacitor electrode connected to the power line and provided in the SD electrode layer; a disconnect-able portion at which a connection between the second capacitor electrode and the line can be disconnected; and a connectable portion at which the first backup capacitor electrode and the line can be connected, and the disconnect-able portion and the connectable portion are arranged at a position in which the disconnect-able portion and the connectable portion overlap in a stacking direction.12-27-2012
20120286303DISPLAY APPARATUS - The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus being formed by bonding semiconductor thin film element on a plastic substrate, a thin film metal layer is formed on surface of the semiconductor thin film element for promoting heat release.11-15-2012
20120286301LED MODULE - An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.11-15-2012
20120286298BUS LINE DESIGNS FOR LARGE-AREA OLED LIGHTING - Systems, and methods for the design and fabrication of OLEDs, including large-area OLEDs with metal bus lines, are provided. Various bus line design rules for large area OLED light panels may include mathematical models developed to optimize bus line design and/or layout on large area OLED light panels. For a given panel area dimension, target luminous emittance, OLED device structure and efficiency (as given by the JVL characteristics of an equivalent small area pixel), and electrical resistivity and thickness of the bus line material and electrode onto which the bus lines are disposed, a bus line pattern may be designed such that Fill Factor (FF), Luminance Uniformity (U) and Power Loss (PL) may be optimized. One general design objective may be to maximize FF, maximize U and minimize PL. Another approach may be, for example, to define minimum criteria for U and a maximum criteria for PL, and then to optimize the bus line layout to maximize FF. OLED panels including bus lines with different resistances (R11-15-2012
20120138976ORGANIC ELECTROLUMINESCENT ELEMENT, ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE, AND ORGANIC ELECTROLUMINESCENT ILLUMINATING DEVICE - An organic electroluminescent element according to the present invention includes: an anode (06-07-2012
20120138973ORGANIC LIGHT-EMITTING PANEL AND MANUFACTURING METHOD THEREOF, AND ORGANIC DISPLAY DEVICE - A non-light-emitting cell 06-07-2012
20120138972ARRAY SUBSTRATE AND A METHOD FOR FABRICATING THE SAME AND AN ELECTRONIC PAPER DISPLAY - The present disclosure discloses a method for fabricating an array substrate comprising: depositing a source/drain metallic film on a first base substrate, and forming a source electrode, a drain electrode and a data line; sequentially depositing a semiconductor layer film, a gate insulating layer film and a gate metallic film on the first base substrate, and forming a semiconductor layer, a gate insulating layer, a gate electrode and a gate line; depositing a gate protection layer film on the first base substrate, and forming a gate protection layer and a through hole, wherein the through hole is formed on the gate protection layer corresponding to the drain electrode to expose a portion of the drain electrode; and depositing a pixel electrode film on the first base substrate, and forming a pixel electrode, wherein the pixel electrode is connected to the drain electrode via the through hole.06-07-2012
20120138971Organic Electro-Optical Component - An organic electro-optical component, with an electrode, counter-electrode, and organic region made up of one or more organic materials, which is in electrical contact and in an active region overlapping with the electrode and the counter-electrode, wherein the electrode and/or the counter-electrode have part electrodes which extend from a part electrode connecting section which is arranged outside of the active region, a distal electrode section is electrically connected via a proximal electrode section to the part electrode connecting section, the distal electrode section is formed at least in sections within the active region, and the proximal electrode section is formed outside of the active region and by means of an electrical pathway, the pathway length of which is larger than the shortest distance between an end of the distal electrode section facing the part electrode connecting section and the part electrode connecting section.06-07-2012
20120138966Organic Light Emitting Diode Display - An organic light emitting diode (OLED) display includes a first electrode including a conductive black layer, a second electrode facing the first electrode, and an organic emission layer provided between the first electrode and the second electrode.06-07-2012
20130009177ORGANIC LAYER DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME - An organic layer deposition apparatus, and a method of manufacturing an organic light-emitting display device using the organic layer deposition apparatus. The organic layer deposition apparatus includes: an electrostatic chuck that fixedly supports a substrate that is a deposition target; a deposition unit including a chamber maintained at a vacuum and an organic layer deposition assembly for depositing an organic layer on the substrate fixedly supported by the electrostatic chuck; and a first conveyer unit for moving the electrostatic chuck fixedly supporting the substrate into the deposition unit, wherein the first conveyer unit passes through inside the chamber, and the first conveyer unit includes a guide unit having a receiving member for supporting the electrostatic chuck to be movable in a direction.01-10-2013
20130009174VERTICAL STACKED LIGHT EMITTING STRUCTURE - A vertical stacked light emitting structure includes a substrate unit, a first light emitting unit, a light guiding unit, and a second light emitting unit. The substrate unit includes at least one substrate body. The first light emitting unit includes at least one first LED bare chip disposed on the substrate body and electrically connected to the substrate body. The light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Therefore, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially.01-10-2013
20130009176DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A display substrate includes a base substrate, color filter layers, a bottom supporting layer and a light-blocking and maintaining element. The base substrate includes a gate line, a data line crossing the gate line, and a switching element on the base substrate. The color filter layers are adjacent to each other on the base substrate. The bottom supporting layer is between the color filter layers adjacent to each other and on the base substrate. The light-blocking and maintaining element is between the color filter layers adjacent to each other, and on the bottom supporting layer. The light-blocking and maintaining element includes a light blocking portion, and a maintaining portion which overlaps the bottom supporting layer and protrudes from the light blocking portion.01-10-2013
20130009178LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode package includes an electrically insulated base, first and second electrodes, an LED chip, a voltage stabilizing module, and an encapsulative layer. The base has a first surface and an opposite second surface. The first and second electrodes are formed on the first surface of the base. The LED chip is electrically connected to the first and second electrodes. The voltage stabilizing module is formed on the first surface of the base, positioned between and electrically connected to the first and second electrodes. The voltage stabilizing module connects to the LED chip in reverse parallel and has a polarity arranged opposite to that of the LED chip. The voltage stabilizing module has an annular shape and encircles the first electrode. The encapsulative layer is formed on the base and covers the LED chip.01-10-2013
20130009175VERTICAL STACKED LIGHT EMITTING STRUCTURE - A vertical stacked light emitting structure includes a substrate unit, a stacked type light emitting module, and a flip-chip type light emitting module. The substrate unit includes a substrate body. The stacked type light emitting module includes a first light emitting unit and a light guiding unit. The first light emitting unit includes at least one first LED bare chip disposed on and electrically connected to the substrate body, and the light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The flip-chip type light emitting module includes a second light emitting unit. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Hence, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially.01-10-2013
20100133553THERMALLY CONDUCTIVE STRUCTURE OF LED AND MANUFACTURING METHOD THEREOF - A thermally conductive structure of a light emitting diode (LED) includes a vapor chamber, an insulating layer, an electrically conductive layer and a plurality of LEDs. In the invention, the insulating layer is plated over a surface of the vapor chamber; the electrically conductive layer disposed on the insulating layer is electrically separated from the vapor chamber and has a first electrode and a second electrode; and the LEDs arranged on the insulating layer respectively have a first leg connected to the first electrode and a second leg connected to the second electrode; thereby, the invention has an excellent performance of thermal conduction and heat dissipation, which is capable of prolonging the lifespan of LED.06-03-2010
20130015472METHOD FOR PACKAGING LIGHT EMITTING DIODES AND LIGHT EMITTING MODULE HAVING LED PACKAGES FORMED BY THE METHODAANM LO; HSING-FENAACI HukouAACO TWAAGP LO; HSING-FEN Hukou TW - A method for making a light emitting module includes: a. providing a flexible substrate; b. forming a plurality of rigid portions in the flexible substrate; c. forming an electrically conductive layer on the rigid portions, the electrically conductive layer having several electrodes apart from each other; d. arranging a plurality of LED dies on the electrically conductive layer with each LED die striding over and electrically connected to two neighboring electrodes; e. forming an encapsulating layer to cover the LED dies; and f. cutting through the flexible substrate. At least one of above steps b, c, d, e is performed by a roll applying process.01-17-2013
20130015473LIGHT-EMITTING DEVICEAANM CHEN; CHAO-HSINGAACI Hsinchu CityAACO TWAAGP CHEN; CHAO-HSING Hsinchu City TWAANM CHUNG; CHIEN-KAIAACI Hsinchu CityAACO TWAAGP CHUNG; CHIEN-KAI Hsinchu City TWAANM LIU; HSIN-MAOAACI Hsinchu CityAACO TWAAGP LIU; HSIN-MAO Hsinchu City TWAANM YAO; CHIU-LINAACI Hsinchu CityAACO TWAAGP YAO; CHIU-LIN Hsinchu City TWAANM HUANG; CHIEN-FUAACI Hsinchu CityAACO TWAAGP HUANG; CHIEN-FU Hsinchu City TW - The application provides a light-emitting device, comprising a substrate; a plurality of first light-emitting diode units on the substrate, wherein every first light-emitting diode unit has a first electrode structure; and a plurality of second light-emitting diode units among the plurality of first light-emitting diode units, wherein every second light-emitting diode unit has a second electrode structure. The second electrode structure of the second light-emitting diode unit is flipped over and electrically connected with the adjacent first electrode structure of the first light-emitting diode unit.01-17-2013
20130015471ETCHANT FOR METAL LAYER INCLUDING COPPER OR A COPPER ALLOY, METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE SAME AND DISPLAY SUBSTRATEAANM PARK; Hong-SickAACI Suwon-siAACO KRAAGP PARK; Hong-Sick Suwon-si KRAANM Lee; Wang-WooAACI Suwon-siAACO KRAAGP Lee; Wang-Woo Suwon-si KR - An etchant includes about 50% by weight to about 70% by weight of phosphoric acid, about 1% by weight to about 5% by weight of nitric acid, about 10% by weight to about 20% by weight of acetic acid, about 0.1% by weight to about 2% by weight of a corrosion inhibition agent including an azole-based compound and a remainder of water.01-17-2013
20130015475ORGANIC EL PANEL AND METHOD OF MANUFACTURING THE SAMEAANM Miyazawa; KazutoshiAACI OsakaAACO JPAAGP Miyazawa; Kazutoshi Osaka JP - The present invention prevents a local luminance reduction at defects in pixel electrodes with a rapid and easy method. The present invention provides a method of manufacturing an organic EL panel that includes a TFT panel and organic EL devices disposed over a surface of the TFT panel in matrix arrangement, each of the organic EL devices including a pixel electrode disposed over the surface of the TFT panel, an organic luminescent layer disposed over the pixel electrode, and a counter electrode disposed over the organic functional layer. The method includes the steps of: providing a TFT panel; patterning pixel electrodes on a surface of the TFT panel; detecting in the pixel electrodes defects in which the surface of the TFT panel is exposed; roughening a portion of the surface of the TFT panel by applying a laser beam onto the portion, the portion including a surface exposed through the defect in the pixel electrode; forming an organic functional layer over the pixel electrodes and the surface of the TFT panel exposed through the defect in the pixel electrode; and forming a counter electrode over the organic functional layer.01-17-2013
20110133220LIGHT EMITTING DIODE, METHOD FOR FABRICATING PHOSPHOR LAYER, AND LIGHTING APPARATUS - A light emitting diode includes: a light emitting diode chip including a substrate and a light emission structure disposed on the substrate; and a phosphor layer formed to cover at least one surface of a diode upper surface and a diode lower surface, when a surface formed by the light emitting diode chip, when viewed from above the light emission structure, is defined as the diode upper surface and a surface formed by the light emitting diode chip, when viewed from below the substrate is defined as the diode lower surface. The phosphor layer is formed in a manner such that the phosphor layer does not deviate from the diode upper surface or the diode lower surface and has a flat surface parallel to the diode upper surface or the diode lower surface and a curved surface connecting the flat surface to corners of the diode upper surface or the diode lower surface.06-09-2011
20130020590LIGHT EMITTING DEVICES AND COMPONENTS HAVING EXCELLENT CHEMICAL RESISTANCE AND RELATED METHODS - Light emitting devices and components having excellent chemical resistance and related methods are disclosed. In one embodiment, a component of a light emitting device can include a silver (Ag) portion, which can be silver on a substrate, and a protective layer disposed over the Ag portion. The protective layer can at least partially include an inorganic material for increasing the chemical resistance of the Ag portion.01-24-2013
20130020589WAFER LEVEL PHOTONIC DEVICE DIE STRUCTURE AND METHOD OF MAKING THE SAME - A vertical Light Emitting Diode (LED) device includes an epi structure with a first-type-doped portion, a second-type-doped portion, and a quantum well structure between the first-type-doped and second-type-doped portions and a carrier structure with a plurality of conductive contact pads in electrical contact with the epi structure and a plurality of bonding pads on a side of the carrier structure distal the epi structure, in which the conductive contact pads are in electrical communication with the bonding pads using at least one of vias and a Redistribution Layer (RDL). The vertical LED device further includes a first insulating film on a side of the carrier structure proximal the epi structure and a second insulating film on a side of the carrier structure distal the epi structure.01-24-2013
20130020594SEMICONDUCTOR TEMPLATE SUBSTRATE, LIGHT-EMITTING ELEMENT USING A SEMICONDUCTOR TEMPLATE SUBSTRATE, AND A PRODUCTION METHOD THEREFOR - A light-emitting device includes a semiconductor layer, a light-emitting stack structure formed on a first surface of the semiconductor layer, and a plurality of inverted pyramid structures formed on a second surface of the semiconductor layer opposite to the first surface. Each of the inverted pyramid structures has a sectional area increasing as each of the inverted pyramid structures is more extended in a vertical direction from the second surface.01-24-2013
20130020592LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE ARRAY, OPTICAL RECORDING HEAD, IMAGE FORMING APPARATUS, AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE - Provided is a light-emitting device including a semiconductor substrate of a first conductivity type, a semiconductor multilayer reflection mirror of the first conductivity type, formed on the semiconductor substrate, a first semiconductor layer of the first conductivity type, formed on the semiconductor multilayer reflection mirror, a second semiconductor layer of a second conductivity type, formed on the first semiconductor layer, a third semiconductor layer of the first conductivity type, formed on the second semiconductor layer, a fourth semiconductor layer of the second conductivity type, formed on the third semiconductor layer, a first electrode formed on a rear surface of the semiconductor substrate, and a second electrode formed on the fourth semiconductor layer, wherein the semiconductor multilayer reflection mirror includes a first selectively oxidized region and a first conductive region adjacent to the first oxidized region, and the first conductive region electrically connects the semiconductor substrate and the first semiconductor layer.01-24-2013
20130020593AC LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME - The present invention relates to a light emitting device, including a plurality of light guide portions, a reflection prevention substance disposed on an inclined surface of each light guide portion of the plurality of light guide portions, and a plurality light emitting regions. Each light emitting region includes a first-type semiconductor layer, a second-type semiconductor layer, and an active layer disposed between the first-type semiconductor layer and the second-type semiconductor layer. Each light guide portion of the plurality of light guide portions is surrounded by light emitting regions of the plurality of light emitting regions.01-24-2013
20130020591DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A display substrate includes first, second, and third insulating layers in a display area thereof. The first and third insulating layers are in not only the display area but also a pad area adjacent to the display area and including a pad therein. Thus, defects of the display panel may be reduced.01-24-2013
20120241778LIGHT-EMITTING DEVICE AND METHOD FOR ASSEMBLING A LIGHT-EMITTING DEVICE - A light-emitting device, including a heatsink arranged at a tip of the light-emitting device, at least one light source, in particular a light-emitting diode, arranged on an underside of the heatsink, and a reflector arranged below the heatsink for reflecting at least some of the light emitted by the at least one light source.09-27-2012
20120241776TFT-LCD ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An embodiment of the invention provides a thin film transistor liquid crystal display (TFT-LCD) array substrate comprising: a gate line and a data line that intersect with each other to define a pixel region; and a pixel electrode and a thin film transistor formed in the pixel region. The thin film transistor comprises: a gate electrode connected with the gate line; a semiconductor island positioned above the gate electrode; and a source electrode and a drain electrode that are formed on the semiconductor island. A surface of the semiconductor island contacting with the source electrode and the drain electrode comprises ohmic contact regions subject to a surface treatment and a region of the semiconductor layer between the source electrode and the drain electrode is covered with a barrier layer. Another embodiment of the invention provides a method of manufacturing a thin film transistor liquid crystal display (TFT-LCD) array substrate.09-27-2012
20120241773LED BAR MODULE WITH GOOD HEAT DISSIPATION EFFICIENCY - An LED bar module includes a lengthwise base and a number of LED chips. The lengthwise base includes a metal layer, a metal circuit layer, and an insulated layer between the metal layer and the metal circuit layer. The insulated layer has a groove in a central thereof to expose a part of the metal layer. The LED chips are placed in the groove and directly contact the exposed part of the metal layer. The metal circuit layer has two connecting portions electrically connecting with the LED chips. The LED chips are arranged in a line which is located between and juxtaposed with the two connecting portions of the metal circuit layer.09-27-2012
20120241771ORGANIC ELECTROLUMINESCENT DEVICE, DISPLAY DEVICE, AND ILLUMINATION DEVICE - According to one embodiment, an organic electroluminescent device comprises a translucent substrate, a light extraction layer including a convex structure disposed in a net form on one surface of the substrate and having a tilted surface forming an acute angle relative to the substrate, and a planarizing layer disposed on the convex structure, a first electrode disposed on the light extraction layer, a luminescent layer disposed on the first electrode and containing a host material and a luminescent dopant, and a second electrode disposed on the luminescent layer. A refractive index of the planarizing layer is approximately equal to a refractive index of the first electrode or is larger than the refractive index of the first electrode, and a refractive index of the convex structure is smaller than a refractive index of the planarizing layer.09-27-2012
20080251798Semiconductor device, LED head and image forming apparatus - A semiconductor device is supplied which is able to efficiently liberate heat produced by semiconductor element toward external, prevent temperature rise, improve operation characteristic and maintain stable operation. The semiconductor device comprises a substrate and a semiconductor thin film layer which is accumulated on the substrate and contains semiconductor element, the substrate is a metal substrate, between the metal substrate and the semiconductor thin film layer, a diamond-like carbon layer with high heat conductivity and good insulativity is furnished as a surface coating layer.10-16-2008
20130140587POLARIZATION STRUCTURE, METHOD OF MANUFACTURING A POLARIZATION STRUCTURE AND ORGANIC LIGHT EMITTING DISPLAY DEVICE HAVING A POLARIZATION STRUCTURE - A polarization structure for a display device is disclosed. In one embodiment, the structure includes a retardation layer, a first polarizing layer, a first uniaxial optical compensation layer, a second polarizing layer and a second uniaxial optical compensation layer. The retardation layer may be configured to create a phase difference between two polarization components of an incident light. The first polarizing layer may be disposed on the retardation layer. The first uniaxial optical compensation layer may be disposed on the first polarizing layer. The second polarizing layer may be disposed on the first uniaxial optical compensation layer. The second uniaxial optical compensation layer may be disposed between the first polarizing layer and the first uniaxial optical compensation layer or between the first polarizing layer and the second polarizing layer.06-06-2013
20130140588LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - Exemplary embodiments of the present invention disclose a light emitting diode (LED) and a method of fabricating the same. The LED includes a substrate, a semiconductor stack arranged on the substrate, the semiconductor stack including an upper semiconductor layer having a first conductivity type, an active layer, and a lower semiconductor layer having a second conductivity type, isolation trenches separating the semiconductor stack into a plurality of regions, connectors disposed between the substrate and the semiconductor stack, the connectors electrically connecting the plurality of regions to one another, and a distributed Bragg reflector (DBR) having a multi-layered structure, the DBR disposed between the semiconductor stack and the connectors. The connectors are electrically connected to the semiconductor stack through the DBR, and portions of the DBR are disposed between the isolation trenches and the connectors.06-06-2013
20080224154Semiconductor Light-Emitting Device With Metal Support Substrate - One embodiment of the present invention provides a semiconductor light-emitting device which includes a multi-layer structure. The multilayer structure comprises a first doped layer, an active layer, and a second doped layer. The semiconductor light-emitting device further includes a first Ohmic-contact layer configured to form a conductive path to the first doped layer, a second Ohmic-contact layer configured to form a conductive path to the second doped layer, and a support substrate comprising not less than 15% chromium (Cr) measured in weight percentage.09-18-2008
20080224153ELECTRONIC DEVICE, METHOD OF PRODUCING THE SAME, LIGHT-EMITTING DIODE DISPLAY UNIT, AND METHOD OF PRODUCING THE SAME - An electronic device includes a base having a first wiring thereon; a flexible film having a second wiring thereon; a plurality of elements each including a first connecting portion and a second connecting portion; and an adhesive agent layer, wherein each of the elements is sandwiched between the base and the film in a state in which the first connecting portion is in contact with the first wiring, the second connecting portion is in contact with the second wiring, and a tensile force is applied to the film, and, in this state, the base and the film are bonded with the adhesive agent layer.09-18-2008
20080224152Flat panel display having a control frame pedestal and method of making same - A method for providing a flat panel display comprising the steps of: providing an anode assembly containing a plurality of pixels; applying a photoresist to a surface of the anode assembly; applying a mask that defines a control frame top surface; exposing the mask to UV radiation and causing the photoresist to cross link at the exposed areas of the photoresist such that the exposed photoresist is inert and does not outgas in a vacuum; removing the unexposed areas of the photoresist to define a pedestal; forming a planarizing layer over the exposed photoresist pedestal; applying a metal layer over the planarizing layer; applying a second photoresist over the metal layer; exposing portions of the second photoresist and removing excess of the metal layer and the planarizing layer to form the metal layer only on top of the exposed photoresist pedestal; and applying nanotube emitters on the metal layer.09-18-2008
20130175551Packaging Method and System for LEDs - A slim LED package configured to handle large current, having a narrow width, an LED chip mounting area positioned centro-symmetrically within the package, mounting holes positioned equidistantly from the mounting area, wherein multiple packages may be arranged with alternating anode and cathode ends in such a manner that a high-power density radiometric flux line may be created. Some embodiments include current density management areas positioned on one more sides of the LED chip mounting area.07-11-2013
20130175557LIGHT EMITTING APPARATUS - A lighting apparatus comprising a plurality of diodes and an electrical interface configured to receive an electrical signal and transmit the electrical signal to the plurality of diodes is provided.07-11-2013
20130175550Donor Film, Method for Manufacturing Organic Light Emitting Diode Display Using the Same, and Organic Light Emitting Diode Display Manufactured by Using the Method - In a donor film, an organic light emitting diode display manufacturing method using the same, and an organic light emitting diode display manufactured by using the method, the donor film includes a donor substrate and a transfer layer formed on the donor substrate. The donor substrate includes a base film, a light-to-heat conversion (LTHC) layer disposed on the base film, and a curved interlayer film provided on the light-to-heat conversion layer and having a wrinkled side. The transfer layer includes an organic emission layer which is formed so as to be curved along a shape of the wrinkled side of the curved interlayer film.07-11-2013
20130175552ARRAY SUBSTRATE AND MANUFACTURING METHOD - Manufacturing an array substrate includes forming data and gate lines which cross and a gate electrode on a substrate. The data line is discontinuously disposed to be separated from the gate line, or the gate line is discontinuously disposed to be separated from the data line. Active and gate insulating layers including bridge and source electrode vias are formed on the substrate. The bridge vias correspond to adjacent discontinuous sections of the data line or the gate line. The source electrode via corresponds to the data line. Pixel, source, and drain electrodes and a bridge line are formed on the substrate. The pixel electrode and the drain electrode are integral. The source electrode is connected to the data line through the source electrode via. The bridge line connects adjacent discontinuous sections of the data line or adjacent discontinuous sections of the gate line through bridge vias.07-11-2013
20130175553LIGHT-EMITTING DIODE DEVICE - The present invention is directed to a light-emitting diode (LED) device, which includes at least one LED unit. Each LED unit includes at least one LED, which includes a first doped layer, a second doped layer and a conductive defect layer. The conductive defect layer is formed on the first or second doped layer. The conductive defect layer may be deposited between two LEDs, or between the first/second doped layer and an electrode.07-11-2013
20130175554LED PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING LED PACKAGE - There is provided a light emitting diode (LED) package substrate including: a substrate including a chip mounting region on which a plurality of LED chips is mountable; a conductive layer including a plurality of electrode patterns disposed on the chip mounting region; and a groove part, forming a dam, wherein the groove part surrounds the chip mounting region and is spaced apart from the chip mounting region by a predetermined interval.07-11-2013
20130175555LIGHT EMITTING DIODE PACKAGE HAVING INTERCONNECTION STRUCTURES - A light emitting diode (LED) package includes a substrate, a first LED chip and a second LED chip. The substrate includes first to fourth electrodes, and an interconnection electrode. A mounting area is defined at center of a top surface of the substrate. The first to fourth electrodes are respectively in four corners of the substrate out of the mounting area. The first interconnection electrode is embedded in the substrate to electrically connect the first and the third electrodes. The first LED chip and the second LED chip are arranged in the mounting area. Each LED chip includes an anode pad and a cathode pad. The first to fourth electrodes are respectively connected to the four pads of the first and the second LED chips via a plurality of metal wires, and no metal wire connection is formed between the first and the second LED chips.07-11-2013
20130175556LIGHT EMITTING APPARATUS - A lighting apparatus comprising a plurality of diodes and an electrical interface configured to receive an electrical signal and transmit the electrical signal to the plurality of diodes is provided.07-11-2013
20130175558LED LIGHTING DEVICES - Packaged chip-on-board (COB) LED arrays are provided where a color conversion medium is distributed within a glass containment plate, rather than silicone, to reduce the operating temperature of the color conversion medium and avoid damage while increasing light output. In accordance with one embodiment of the present disclosure, a lighting device is provided comprising a chip-on-board (COB) light emitting diode (LED) light source, a light source encapsulant, a distributed color conversion medium, and a glass containment plate. The COB LED light source comprises a thermal heat sink framework and at least one LED and defines a light source encapsulant cavity in which the light source encapsulant is distributed over the LED. The glass containment plate is positioned over the light source encapsulant cavity and contains the distributed color conversion medium. The light source encapsulant is distributed over the LED at a thickness that is sufficient to encapsulate the LED and define encapsulant thermal conduction paths T07-11-2013
20130181238ELECTRONIC DEVICES WITH YIELDING SUBSTRATES - In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.07-18-2013
20130181239SEMICONDUCTOR LIGHT EMITTING DEVICE - Disclosed is a semiconductor light emitting device. The semiconductor light emitting device comprises a first semiconductor layer, a second semiconductor layer, an active layer formed between the first semiconductor layer and the second semiconductor layer, a first reflective electrode on the first semiconductor layer to reflect incident light, and a second reflective electrode on the second semiconductor layer to reflect the incident light.07-18-2013
20130181233SILICON PHOTONICS WAFER USING STANDARD SILICON-ON-INSULATOR PROCESSES THROUGH SUBSTRATE REMOVAL OR TRANSFER - Processing for a silicon photonics wafer is provided. A silicon photonics wafer that includes an active silicon photonics layer, a thin buried oxide layer, and a silicon substrate is received. The thin buried oxide layer is located between the active silicon photonics layer and the silicon substrate. An electrical CMOS wafer that includes an active electrical layer is also received. The active silicon photonics layer of the silicon photonics wafer is flip chip bonded to the active electrical layer of the electrical CMOS wafer. The silicon substrate is removed exposing a backside surface of the thin buried oxide layer. A low-optical refractive index backing wafer is added to the exposed backside surface of the thin buried oxide layer. The low-optical refractive index backing wafer is a glass substrate or silicon substrate wafer. The silicon substrate wafer includes a thick oxide layer that is attached to the thin buried oxide layer.07-18-2013
20130181234LIGHTING DEVICES WITH PRESCRIBED COLOUR EMISSION - Optical conversion layers based on semiconductor nanoparticles for use in lighting devices, and lighting devices including same. In various embodiments, spherical core/shell seeded nanoparticles (SNPs) or nanorod seeded nanoparticles (RSNPs) are used to form conversion layers with superior combinations of high optical density (OD), low re-absorbance and small FRET. In some embodiments, the SNPs or RSNPs form conversion layers without a host matrix. In some embodiments, the SNPs or RSNPs are embedded in a host matrix such as polymers or silicone. The conversion layers can be made extremely thin, while exhibiting the superior combinations of optical properties. Lighting devices including SNP or RSNP-based conversion layers exhibit energetically efficient superior prescribed colour emission07-18-2013
20130181235Organic Light-Emitting Display Device and Method of Manufacturing the Same - In an organic light-emitting display device and a method of manufacturing the same, the organic light-emitting display device includes: a substrate; an organic light-emitting unit that includes a plurality of organic light-emitting devices formed on the substrate; and an encapsulation unit that seals the organic light-emitting unit. The encapsulation unit includes: a barrier layer and a planarization layer that are stacked on the organic light-emitting unit; and a cover layer that is disposed between the barrier layer and the planarization layer to cover a crack occurring in each of the organic light-emitting devices.07-18-2013
20130181236LIGHT EMITTING DEVICE AND LIGHTING EQUIPMENT - A light emitting device has a base comprising at least one pair of leads having a silver-containing layer on their surfaces and being secured by a resin molded body, a light emitting element mounted on said leads, a protective film made of an inorganic material that covers the upper surface of said base, and a sealing resin disposed on the base surface via said protective film. The sealing resin has a first resin that covers said light emitting element, and a second resin having a higher hardness than said first resin that covers the boundaries between said resin molded body and said leads.07-18-2013
20130181237Light Emitting Systems and Methods - A light emitting system and related method are disclosed.07-18-2013
20080217628LIGHT EMITTING DEVICE - The present invention relates to a light emitting device having a light emitting diode package with a plurality of light emitting cells and an integrated electronic element formed on the same substrate. The light emitting device comprises a substrate, a light emitting cell block having a first array with a plurality of light emitting cells formed on one region of the substrate arranged therein, a second array formed on the same region as the first array, and electrodes for AC power connecting the first and second arrays in reverse parallel; and at least one integrated electronic element formed on another region of the same substrate as the light emitting cell block.09-11-2008
20120248470DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a method for manufacturing a highly reliable display device at a low cost with high yield. According to the present invention, a step due to an opening in a contact is covered with an insulating layer to reduce the step, and is processed into a gentle shape. A wiring or the like is formed to be in contact with the insulating layer and thus the coverage of the wiring or the like is enhanced. In addition, deterioration of a light-emitting element due to contaminants such as water can be prevented by sealing a layer including an organic material that has water permeability in a display device with a sealing material. Since the sealing material is formed in a portion of a driver circuit region in the display device, the frame margin of the display device can be narrowed.10-04-2012
20130134452DISPLAY DEVICE - Provided is a display device including: a substrate; and multiple pixels provided on the substrate, the pixels each having an organic EL element obtained by laminating a lower electrode provided on the substrate, an organic compound layer, and an upper electrode in the stated order, and the lower electrode including an electrode independently placed for each of the pixels, in which: the lower electrode is formed of a first lower electrode layer provided on the substrate and a second lower electrode layer provided on the first lower electrode layer; the organic compound layer and the upper electrode cover the first lower electrode layer and the second lower electrode layer; and charge injection property from the second lower electrode layer into the organic compound layer is larger than charge injection property from an end portion of the first lower electrode layer into the organic compound layer.05-30-2013
20130134449DISPLAY PANEL AND MANUFACTURING METHOD THEREOF - A display panel includes a substrate, a plurality of bottom electrodes, an isolation layer, a plurality of light emitting layers, a top electrode, and at least one first auxiliary electrode. The bottom electrodes and the isolation layer are disposed on the substrate. The isolation layer has a plurality of pixel region openings and at least one buffer region. Each of the pixel region openings respectively exposes the corresponding bottom electrode. The buffer region is disposed between two adjacent pixel region openings. The light emitting layers are respectively disposed on the corresponding bottom electrodes. The top electrode covers the light emitting layers, the isolation layer, and the buffer region. The first auxiliary electrode is disposed in the buffer region.05-30-2013
20130134448LIGHT MODULE AND LIGHT COMPONENT THEREOF - A light component includes a printed circuit board and a plurality of lighting emitting diodes (LEDs). The printed circuit board has a metal substrate. The LEDs are disposed on the printed circuit board, wherein two opposite edges of the metal substrate protrude out and are bent towards the LEDs to form two metal clamps.05-30-2013
20130092961LIGHT EMITTING DEVICE MODULE - According to example embodiments, a light emitting device (LED) module includes a substrate, a LED on the substrate, a first reflector on the substrate, and a phosphor structure contacting the first reflector. The first reflector may surround the LED from a plan view. The first reflector may have a width at a middle portion of the reflector that is smaller than a width at a bottom portion of the reflector. The LED module may obtain a desired view angle depending on various applications by adjusting a height of the first reflector and/or a difference between the height of first reflector and a height of a phosphor structure.04-18-2013
20130092962LIGHT EMITTING DEVICE (LED), MANUFACTURING METHOD THEREOF, AND LED MODULE USING THE SAME - A light emitting device (LED), a manufacturing method thereof, and an LED module using the same. The LED may include a first semiconductor layer, an active layer, and a second semiconductor layer formed sequentially on a light-transmitting substrate, a first electrode formed in a region exposed by removing a part of the first semiconductor layer, a second electrode formed on the second semiconductor layer, a passivation layer formed on the first electrode and the second electrode to expose a region of the first electrode and a region of the second electrode, a first bump formed in a first region including the first electrode exposed through the passivation layer, and extended to another region of the second electrode on which the passivation layer is formed, and a second bump formed in a second region including the second electrode exposed through the passivation layer.04-18-2013
20130092963SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND ELECTRONIC DEVICE - A load, a transistor which controls a current value supplied to the load, a capacitor, a power supply line, and first to third switches are provided. After a threshold voltage of the transistor is held by the capacitor, a potential in accordance with a video signal is inputted and a voltage that is the sum of the threshold voltage and the potential is held. Accordingly, variation in current value caused by variation in threshold voltage of the transistor can be suppressed. Therefore, a desired current can be supplied to a load such as a light emitting element. In addition, a display device with a high duty ratio can be provided by changing a potential of the power supply line.04-18-2013
20130099258Organic Light Emitting Diode Display - An organic light emitting diode (OLED) display according to an exemplary embodiment of the invention includes: a display substrate including a plurality of pixel areas; a tilt layer formed on the display substrate of each of the plurality of pixel areas, and having a tilt angle with respect to the display substrate; a first electrode formed on the tilt layer; an organic emission layer formed on the first electrode; a second electrode formed on the organic emission layer; an encapsulation substrate disposed on the second electrode and in parallel with the display substrate; and a prism sheet formed on the encapsulation substrate and having a plurality of prisms.04-25-2013
20130099259HIGH-VOLTAGE LIGHT-EMITTING DEVICE - The present invention relates to a high-voltage light-emitting device suitable for light-emitting diode chip array module. The device comprises a set of light emitting diode chips, about 18-25 chips, deposited on a substrate by using a non-matrix arrangement. Through the adjustments, the high-voltage light-emitting device of the present invention has optimized luminous efficiency.04-25-2013
20130099257LED PACKAGE WITH EFFICIENT ILLUMINATION - An LED package with efficient illumination includes a base, a plurality of LED chips, an enclosure and an optically transparent plate. The LED chips are placed on the base and are electrically connecting to the base. The enclosure is located on the surface of the base. The LED chips are enclosed by the enclosure. A plurality of grooves is uniformly formed on the surface of the optically transparent plate. A volume of silicone mixed with phosphor powder is injected into each of the grooves. Thus, when packaging the plurality of LED chips, it will reduce the usage amount of the phosphor powder of the optically transparent plate.04-25-2013
20130113002LOW COST MOUNTING OF LEDs IN TL-RETROFIT TUBES - This invention relates to a lighting device comprising a light transmissive light outlet unit (05-09-2013
20130113001LED PACKAGE MODULE - An LED package module includes a circuit board, a metal board, a plurality of chips, a plurality of wires and a molding component. The metal board directly covers the whole upper surface of the circuit board, wherein the metal board is provided with a plurality of chip-mounting pads and a plurality of openings arranged adjacent to the chip-mounting pads so as to expose the wiring area of the circuit board. The chips are respectively arranged on each of the chip-mounting pads. The wires electrically connect chips and the wiring area of the circuit board. The molding component respectively covers each chip, wires and the wiring area.05-09-2013
20130113000DISPLAY SUBSTRATES AND METHODS OF FABRICATING THE SAME - Display substrates are disclosed. In one aspect, display substrates include a first signal line, a second signal line, a first detour signal line and a second detour signal line. The first signal line includes a first region and a pair of second regions disposed on opposite sides of the first region. The pair of second regions are spaced apart from the first region. The second signal line crosses the first signal line. The second signal line includes a third region and a pair of fourth regions disposed on opposite sides of the third region. The pair of fourth regions are spaced apart from the third region. The first detour signal line electrically connects the pair of second regions to each other. The second detour signal line electrically connects the pair of fourth regions to each other. Related methods are also disclosed.05-09-2013
20110266563METHOD FOR FORMING A MULTI-LEVEL SURFACE ON A SUBSTRATE WITH AREAS OF DIFFERENT WETTABILITY AND A SEMICONDUCTOR DEVICE HAVING THE SAME - The invention relates to a method 11-03-2011
20110266561Optical Systems Fabricated by Printing-Based Assembly - The present invention provides optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity. Optical systems of the present invention include, however, devices and device arrays provided on conventional rigid or semi-rigid substrates, in addition to devices and device arrays provided on flexible, shapeable and/or stretchable substrates.11-03-2011
20110266560WHITE-EMITTING LED CHIPS AND METHOD FOR MAKING SAME - Methods and devices for light emitting diode (LED) chips are provided. In one embodiment of a method, a pre-formed capping wafer is provided, with the capping wafer comprising a conversion material. A wire-bond free LED wafer is fabricated comprising a plurality of LEDs. The capping wafer is bonded to the LED wafer using an adhesive. The LED chips are later singulated upon completion of all final fabrication steps. The capping wafer provides a robust mechanical support for the LED chips during fabrication, which improves the strength of the chips during fabrication. Additionally, the capping wafer may comprise an integrated conversion material, which simplifies the fabrication process. In one possible embodiment for an LED chip wafer, a submount wafer is provided, along with a plurality of LEDs flip-chip mounted on the submount wafer. Additionally, a capping wafer is bonded to the LEDs using an adhesive, and the capping wafer comprises a conversion material. At least some of the light emitted from the LEDs passes through the capping wafer where at least some of the light is converted by the conversion material.11-03-2011
20130119410WHITE LIGHT EMITTING DIODE (LED) LIGHTING DEVICE DRIVEN BY PULSE CURRENT - A white LED lighting device driven by a pulse current is provided, which consists of blue, violet or ultraviolet LED chips, blue afterglow luminescence materials A and yellow luminescence materials B. Wherein the weight ratio of the blue afterglow luminescence materials A to the yellow luminescence materials B is 10-70 wt %:30-90 wt %. The white LED lighting device drives the LED chips with a pulse current having a frequency of not less than 50 Hz. Because of using the afterglow luminescence materials, the light can be sustained when an excitation light source disappears, thereby eliminating the influence of LED light output fluctuation caused by current variation on the illumination. At the same time, the pulse current can keep the LED chips being at an intermittent work state, so as to overcome the problem of chip heating.05-16-2013
20130126917LIGHT EMITTING DIODES AND SUBSTRATES - A thin layer substrate has a plurality of micron sized electrically conductive whisker components which are arranged in parallel and extending from one surface of the substrate to another surface to provide electrically conductive paths though the substrate. Such a substrate may be usable for micron sized LEDs.05-23-2013
20130126914HIGH-VOLTAGE AC LIGHT-EMITTING DIODE STRUCTURE - A high-voltage alternating current (AC) light-emitting diode (LED) structure is provided. The high-voltage AC LED structure includes a circuit substrate and a plurality of high-voltage LED (HV LED) chips. Each one of the HV LED chips includes a first substrate, an adhering layer, first ohmic contact layers, epi-layers, a first insulating layer, at least two first electrically conducting plates, at least two second electrically conducting plates, and a second substrate. The HV LED chips manufactured by a wafer-level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure.05-23-2013
20130126913THIN MULTI-LAYER LED ARRAY ENGINE - A thin multi-layer LED array engine is provided, which includes a substrate having a phosphor layer and a silica gel protection layer formed thereon. The phosphor layer is disposed on LED dices and makes direct contact with the substrate, and the silica gel protection layer is disposed on the phosphor layer. The LED dices are covered with the phosphor layer, and thereby the phosphor particles in the phosphor layer can be uniformly dispersed around the LED dices, so that the narrow color temperature distribution can be achieved. Furthermore, the phosphor layer makes direct contacts with the substrate, and thereby heat generated in the phosphor layer can be effectively dissipated through the substrate, and thereby the reliability of the optical components can be increased.05-23-2013
20130187178LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS - In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.07-25-2013
20130187175MULTI-LAYER ARRAY TYPE LED DEVICE - A multi-layer array type LED device is provided, which includes a substrate, an encapsulation body, two lead frames, a plurality of LED dices, and a set of optical lens. The outer circumferential edge and the upper and lower periphery of the substrate are completely encapsulated by the encapsulation body so that the multi-layer array type LED device can be tightly packaged. In the present invention, a fluorescent layer is disposed between an optical grease layer and a silica gel protection layer, and thereby the fluorescent layer is protected, and is capable of preventing moisture from permeating therein. On the other hand, in the present invention, the reflection coefficient of the optical grease layer is at least larger than a certain value so that the probability of the light emitted out of the optical chamber can be increased.07-25-2013
20130187176SILICONE RESIN - A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode.07-25-2013
20130187177DISPLAY PANEL MANUFACTURING METHOD AND DISPLAY PANEL - A method of manufacturing a display panel includes a sub-step of forming a photosensitive material layer for formation of a second layer on a first layer, a sub-step of disposing, over the photosensitive material layer, a photomask having a different degree of transparency in a first region and a second region thereof, the first region overlapping the photosensitive material layer, in plan view, at a location for formation of a second aperture, and the second region being a remainder of the photomask other than the first region, and a sub-step of exposing the photosensitive material layer via the photomask. In plan view, the area of the first region in the photomask is larger than the area of a first aperture in the first layer.07-25-2013
20110272717Light Emitting Device And Method of Manufacturing The Same - A light emitting device having a structure in which oxygen and moisture are prevented from reaching light emitting elements, and a method of manufacturing the same, are provided. Further, the light emitting elements are sealed by using a small number of process steps, without enclosing a drying agent. The present invention has a top surface emission structure. A substrate on which the light emitting elements are formed is bonded to a transparent sealing substrate. The structure is one in which a transparent second sealing material covers the entire surface of a pixel region when bonding the two substrates, and a first sealing material (having a higher viscosity than the second sealing material), which contains a gap material (filler, fine particles, or the like) for protecting a gap between the two substrates, surrounds the pixel region. The two substrates are seated by the first sealing material and the second sealing material. Further, reaction between electrodes of the light emitting elements (cathodes or anodes) and the sealing materials can be prevented by covering the electrodes with a transparent protective layer, for example, CaF11-10-2011
20110272716LEAD FRAME FOR CHIP PACKAGE, CHIP PACKAGE, PACKAGE MODULE, AND ILLUMINATION APPARATUS INCLUDING CHIP PACKAGE MODULE - A lead frame for a chip package, a chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other.11-10-2011
20110272715ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE ORGANIC LIGHT EMITTING DISPLAY DEVICE - An organic light-emitting display device and a method of manufacturing the same are disclosed. The organic light-emitting display device includes: a substrate, a plurality of pixels on the substrate, a plurality of first electrodes, each disposed in each of the plurality of pixels, a pixel defining layer including a first pixel defining sub-layer disposed between each two adjacent first electrodes, and a second pixel defining sub-layer covering the first pixel defining sub-layer and surface edge portions of each two adjacent first electrodes, an intermediate layer disposed on each of the first electrodes and including an emission layer, and a second electrode configured to face the first electrodes.11-10-2011
20110272714Organic light emitting diode display - An organic light emitting diode (OLED) display including a display substrate; a sealing member facing the display substrate; a sealant between the display substrate and the sealing member, the sealant cohering the display substrate and the sealing member; a plurality of conductive wires on the display substrate and overlapping the sealant; and a heat blocking film between the conductive wire and the sealant, the heat blocking film including a plurality of sub-heat blocking films.11-10-2011
20130134446COST-EFFECTIVE LED LIGHTING INSTRUMENT WITH GOOD LIGHT OUTPUT UNIFORMITY - The present disclosure involves a lighting instrument. The lighting instrument includes a board or substrate, for example, a printed circuit board. The lighting instrument also includes a plurality of light-emitting devices disposed on the substrate. The light-emitting devices may be light-emitting diode (LED) dies. The LED dies belong to a plurality of different bins. The bins are categorized based on the light output performance of the LED dies. In some embodiments, the LED dies may be binned based on the wavelength or radiant flux of the light output. The LED dies are distributed on the substrate according to a predefined pattern based on their bins. In some embodiments, the LED dies are bin-mixed in an interleaving manner.05-30-2013
20130134445COMPLEX PRIMARY OPTICS AND METHODS OF FABRICATION - A light emitter package with primary optic and method of fabricating the same is disclosed that comprises a light emitter disposed on a surface. The package further comprises at least one intermediate element on the surface and at least partially surrounding the light emitter. Furthermore, an encapsulant is over the light emitter forming a primary optic. The intermediate element at least partially defines the shape of the primary optic.05-30-2013
20130146900DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A display substrate includes a base substrate, a switching element, a protecting layer, an organic layer, a first pixel electrode and a second pixel electrode. The switching element is on the base substrate, and includes a gate electrode, a source electrode and a drain electrode. The protecting layer is on the switching element, and includes a first hole exposing the drain electrode. The organic layer is on the protecting layer, and includes a second hole which exposes a side surface of the protecting layer which defines the first hole and exposes a top surface of the protecting layer which is adjacent to the side surface of the protecting layer. The first pixel electrode is on the organic layer. The second pixel electrode overlaps the first pixel electrode, and is electrically connected to the drain electrode via the first and second holes.06-13-2013
20130146901COMPRESSION VOLUME COMPENSATION - A liquid-filled light emitting diode (LED) bulb including a base, a shell, one or more LEDs, a thermally conductive liquid, and a bladder. The shell is connected to the base and the thermally conductive liquid is held within the shell. The one or more LEDs are disposed within the shell and immersed in the thermally conductive liquid. The bladder is also immersed in the thermally conductive liquid and is configured to compensate for expansion of the thermally conductive liquid.06-13-2013
20130146902DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A display substrate includes a metal pattern, a first insulation layer pattern and a second insulation layer pattern. The metal pattern is on a base substrate. The first insulation pattern is on the metal pattern and includes one of a silicon nitride (SiN06-13-2013
20110210345LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Provided is a light emitting device. The light emitting device includes a light emitting structure layer comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a first electrode connected to the first conductive type semiconductor layer, a current spreading layer on the second conductive type semiconductor layer, an insulation layer on the first electrode, and a second electrode comprising at least one bridge portion on the insulation layer and a first contact portion contacting at least one of the second conductive type semiconductor layer and the current spreading layer.09-01-2011
20080197363Light Emitting Device Having a Plurality of Light Emitting Cells and Method of Fabricating the Same - Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source. In addition, since the semi-insulating buffer layer is employed, it is possible to prevent an increase in a leakage current through the thermally conductive substrate and between the light emitting cells.08-21-2008
20110220920METHODS OF FORMING WARM WHITE LIGHT EMITTING DEVICES HAVING HIGH COLOR RENDERING INDEX VALUES AND RELATED LIGHT EMITTING DEVICES - Methods of forming a light emitting device are provided in which a solid state lighting source is heated and a luminescent solution is applied to the heated solid state lighting source to form the light emitting device. The luminescent solution includes a first material that down-converts the radiation emitted by the solid state lighting source to radiation that has a peak wavelength in the green color range and that has a full width half maximum emission bandwidth that extends into the cyan color range, and at least one additional material that down-converts the radiation emitted by the solid state lighting source to radiation having a peak wavelength in another color range.09-15-2011
20110227099MASK FRAME ASSEMBLY FOR THIN FILM DEPOSITION, ORGANIC LIGHT-EMITTING DISPLAY DEVICE USING THE SAME, AND METHOD OF MANUFACTURING THE ORGANIC LIGHT-EMITTING DISPLAY DEVICE - A mask frame assembly for thin film deposition, a organic light-emitting display device using the same, and a method of manufacturing the organic light-emitting display device. The organic light-emitting display device includes a first electrode and a second electrode patterned on a substrate to face each other, and a plurality of organic layers formed between the first and second electrodes. The plurality of organic layers include at least a plurality of stripe-shaped organic layers and a plurality of discontinuous dot-shaped organic layers.09-22-2011
20110241035LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND CONTROLLING LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME - An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space.10-06-2011
20110241033LIGHT-EMITTING DEVICE - A light-emitting device includes a base and a light-emitting element that is disposed on the base. The light-emitting element is made up of a plurality of semiconductor layers including a light-emitting layer, and at the same time, is covered with a wavelength converting portion that includes a wavelength converting material. The light-emitting layer emits primary light, and the wavelength converting material absorbs part of the primary light and emits secondary light. The luminance of the primary light emitted from the edge portion of the light extraction surface of the light-emitting device is higher than the luminance of the primary light emitted from the inner region located inside the edge portion, and the ratio of the primary light and the secondary light that are emitted from a light extraction surface of the wavelength converting portion is substantially uniform across the light extraction surface of the wavelength converting portion. Thereby, a light color difference across the light extraction surface of the wavelength converting portion that covers the light-emitting element can be reduced further, and it is possible to irradiate an irradiation surface with light of uniform color.10-06-2011
20110241030LIGHT EMITTING DEVICE PACKAGE - A light emitting device package is provided which may prevent a Zener element mounted on an electrode from being positioned on an inclined plane of a cavity. The light emitting device package may include a light emitting device mounted on a first electrode, a Zener element mounted on a second electrode, and a body having cavity inclined planes that form a cavity on the first and second electrodes. The cavity inclined planes may include a first cavity inclined plane adjacent to the Zener element. The first cavity inclined plane may include an inclined plane forming a first inclination angle with respect to the second electrode and an interfacing plane forming a second inclination angle with respect to the second electrode, the second inclination angle being different from the first inclination angle.10-06-2011
20110248289LIGHT EMITTING DIODE PACKAGE, LIGHTING DEVICE AND LIGHT EMITTING DIODE PACKAGE SUBSTRATE - A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad.10-13-2011
20110248287HIGH REFLECTIVE SUBSTRATE OF LIGHT EMITTING DEVICES WITH IMPROVED LIGHT OUTPPUT - Apparatuses and methods for producing light emitting devices maximizing luminous flux output are disclosed. In one possible embodiment, a light emitting device comprises a substrate and a reflective layer at least partially covering the substrate. The reflective layer is non-yellowing, and may be substantially light transparent. One or more light emitting diode (LED) chips are disposed on the substrate. The light emitting device may emit white light. The reflective layer may comprise a silicone carrier with light reflective particles dispersed in the silicone carrier. A light diffusion lens may also be disposed on the substrate and surrounding the LED chips. Furthermore, one or more microspheres, light scattering particles, and/or phosphor particles may be dispersed in the lens. In one possible method for producing a light emitting device, a substrate is provided. One or more LED chips are coupled with the substrate, and a high reflective, non-yellowing coating is applied on at least a portion of the top surface of the substrate. The coating comprises a carrier with reflective particles dispersed throughout.10-13-2011
20130146904Optoelectronic Structures with High Lumens Per Wafer - An optoelectronic structure includes a wafer, a plurality of light emitting diode structures on a surface of the wafer, and a coating including a wavelength conversion material on the plurality of light emitting diode structures. The light emitting diode structures and the coating are configured to emit white light in response to electrical energy supplied to the light emitting diode structures. The light emitting diode structures from a single wafer are configured to generate an aggregate light output in excess of 800,000 lumens.06-13-2013
20130146905Light Emitting, Photovoltaic Or Other Electronic Apparatus and System - The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus comprising photovoltaic diodes, which may be created through a printing process, using a semiconductor or other substrate particle ink or suspension and using a lens particle ink or suspension. An exemplary apparatus comprises a base; at least one first conductor; a plurality of substantially spherical or optically resonant diodes coupled to the at least one first conductor; at least one second conductor coupled to the plurality of diodes; and a plurality of substantially spherical lenses suspended in a polymer attached or deposited over the diodes. The lenses and the suspending polymer have different indices of refraction. In some embodiments, the lenses and diodes have a ratio of mean diameters or lengths between about 10:1 and 2:1. The diodes may be LEDs or photovoltaic diodes, and in some embodiments, have a junction formed at least partially as a hemispherical shell or cap.06-13-2013
20100308350LED Chip-Based Lighting Products And Methods Of Building - Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors.12-09-2010
20100308349LIGHT-EMITTING DIODE, METHOD FOR MAKING LIGHT-EMITTING DIODE, INTEGRATED LIGHT-EMITTING DIODE AND METHOD FOR MAKING INTEGRATED LIGHT-EMITTING DIODE, METHOD FOR GROWING A NITRIDE-BASED III-V GROUP COMPOUND SEMICONDUCTOR, LIGHT SOURCE CELL UNIT, LIGHT-EMITTING DIODE BACKLIGHT, AND LIGHT-EMITTING DIODE DISPLAY AND ELECTRONIC DEVICE - A light-emitting diode with (a) a substrate having at least one recessed portion on one main surface; (b) a sixth nitride-based III-V group compound semiconductor layer grown on the substrate without forming a space in the recessed portion; and (c) a third nitride-based III-V group compound semiconductor layer of a first conduction type, an active layer and a fourth nitride-based III-V group compound semiconductor layer of a second conduction type formed over the sixth nitride-based III-V group compound semiconductor layer, wherein, a dislocation occurring, in the sixth nitride-based III-V group compound semiconductor layer, from an interface with a bottom surface of the recessed portion in a direction vertical to the one main surface arrives at an inclined face or its vicinity of a triangle having the bottom surface of the recessed portion as a base and bends in a direction parallel to the one main surface.12-09-2010
20100308347Light Emitting Device - A light emitting device includes a plurality of micro diodes, which are electrically connected to constitute a bridge rectifier circuit. Each branch of the bridge rectifier circuit includes a single micro diode or a plurality of micro diodes. The light emitting device is electrically connected to an AC power source, which alternately drives the light emitting device in two current loops. Therefore, the micro diodes in two current loops of the bridge rectifier circuit emit light by turns.12-09-2010
20100308346LIGHT-EMITTING DIODE AND MODULE THEREOF - A light-emitting diode module includes a transparent base, a support and a plurality of light-emitting chips. The base has a plurality of cavities separated from each other by a predetermined distance in order to respectively receive the light-emitting chips to form light-exiting areas. The base has a reflecting portion opposite to the cavities. The reflecting portion is at least one inclined plane for reflecting light that have projected outside walls of the cavities to the peripheral area of the light-emitting areas in order to increase the uniformity of the light source. In addition, the light-emitting chips are arranged to form a line or surface light source of any sizes by adjusting the numbers of the cavity and the light-emitting chips.12-09-2010
20120273814Light Emitting Diode with a Current Concentrating Structure - A light emitting diode (LED) includes a transparent insulating layer; and at least one transparent conductive oxide layer substantially enclosing the transparent insulating layer, wherein the transparent insulating layer and the at least one transparent conductive oxide layer are configured to distribute a current through the LED toward a peripheral region of the LED.11-01-2012
20120273813LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME - The present disclosure provides an LED package and a method for fabricating the same. The LED package includes a base, at least one LED chip mounted on the base, a transparent wall disposed on the base and extending around the LED chip, and a fluorescent material disposed inside of the transparent wall and covering upper and side surfaces of the LED chip.11-01-2012
20120273812LIGHT SOURCE FOR ILLUMINATION - The present invention aims to provide a light source for illumination that achieves excellent luminous intensity distribution and can be easily assembled. A light source 11-01-2012
20120273811HOUSING FOR AN OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING A HOUSING - A housing for an optoelectronic component including a main housing body formed by a first plastics material, and which has a recess, and a coating formed by a second plastics material, and which, at least in a region of the recess, connects at least in places to the main housing body and is in direct contact with the main housing body, wherein the first plastics material is different from the second plastics material, and the first plastics material and the second plastics material differ from one another with regard to at least one of the following material properties: temperature resistance with regard to discoloration, temperature resistance with regard to deformation, temperature resistance with regard to destruction, and resistance to electromagnetic radiation.11-01-2012
20120273810Booster Circuit, Semiconductor Device, and Electronic Apparatus - The invention provides a booster circuit including a first transistor, a second transistor, a first capacitor element, a second capacitor element, a diode, and an inverter, wherein one electrode of the first transistor is maintained at a predetermined potential, the output of the inverter is connected to the gate electrode of the first transistor and one electrode of the second transistor through the second capacitor element, the input of the inverter is connected to the other electrode of the first transistor through the first capacitor element and connected to the gate electrode of the second transistor, and the diode is connected between the other electrode of the first transistor and the other electrode of the second transistor so as to be forwardly biased.11-01-2012
20120273809LIGHT EMITTING DIODE DEVICE - An LED package includes a substrate, a first LED module and a second LED module. The first LED module includes a plurality of first LEDs arranged at the substrate. The second LED module includes a plurality of second LEDs arranged at the substrate and surrounding the first LED module. A luminous intensity of the first LED module is less than a luminous intensity of the second LED module.11-01-2012
20120273808LED ARRAY MODULE AND FABRICATION METHOD THEREOF - An LED array module is manufactured by: attaching an upper conductive layer to a lower conductive layer by an insulative adhesion layer; forming an insulating layer on the entire exposed surface of the upper conductive layer and the lower conductive layer; forming a plurality of LED mounting regions by machining the upper conductive layer so the upper surface of the lower conductive layer is exposed; mounting an LED in each of the LED mounting regions for supplying power to the LED by the lower and upper conductive layers; charging each of the LED mounting regions with an insulating and transparent resin; and forming respective separation grooves in the upper layer and lower conductive layers abreast in a width direction such that each of the upper and lower conductive layers is divided into a plurality of slices.11-01-2012
20120273807Method for the Producing of a Light-Emitting Semiconductor Chip, Method for the Production of a Conversion Die and Light-Emitting Semiconductor Chip - A light-emitting semiconductor chip is provided, the semiconductor chip comprising a semiconductor body having a pixel region with at least two electrically isolated sub-regions, each sub-region comprising an active layer, which generates electromagnetic radiation of a first wavelength range during operation, a separately manufactured ceramic conversion die over a radiation emission area of at least one sub-region, said conversion die being configured to convert radiation of the first wavelength range into electromagnetic radiation of a second wavelength range, wherein a width of the conversion die does not exceed 100 μm. Further, a method for the production of a light-emitting semiconductor chip and method for the production of a conversion die are provided.11-01-2012
20120273806LED PACKAGE STRUCTURE - An LED package structure with standby bonding pads for increasing wire-bonding yield includes a substrate unit, a light-emitting unit, a conductive wire unit and a package unit. The substrate unit has a substrate body and a plurality of positive pads and negative pads. The light-emitting unit has a plurality of LED bare chips. The positive electrode of each LED bare chip corresponds to at least two of the positive pads, and the negative electrode of each LED bare chip corresponds to at least two of the negative pads. Each wire is electrically connected between the positive electrode of the LED bare chip and one of the at least two positive pads or between the negative electrode of the LED bare chip and one of the at least two negative pads. The package unit has a light-permitting package resin body on the substrate body to cover the LED bare chips.11-01-2012
20110233572ORGANIC EL DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME - Disclosed is an organic EL display panel which has: a substrate; two or more pixel electrodes arranged on the substrate; a bus electrode, which is positioned beside at least one pixel electrode and is disposed on the substrate; an organic layer which is formed on the pixel electrode by means of a coating method; two or more banks, which are disposed on the substrate and define the arrangement region of the organic layer; and a counter electrode, which is disposed on the organic layer and is connected to the bus electrode. The two or more banks include a bank disposed between the bus electrode and the pixel electrode, and a bank disposed between the pixel electrodes, and the lyophilicity of the surface of the bank disposed between the bus electrode and the pixel electrode is lower than that of the bank disposed between the pixel electrodes.09-29-2011
20110233571LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM HAVING THE SAME - Provided is a light emitting device package. The light emitting device package includes a body having a cavity, a plurality of lead frames within the cavity, a light emitting device on at least one of the plurality of lead frames, and a moisture permeation prevention member between each of the lead frames and the body. Each of the lead frames includes a first frame disposed within the cavity, a second frame disposed on a lower surface of the body, and a third frame connecting the first frame to the second frame. The second frame of the lead frames is disposed within the body and at least one portion of the second frame is inclined with respect to the lower surface of the body. The moisture permeation prevention member is disposed on at least third frame of each of the lead frames.09-29-2011
20110233570ORGANIC LIGHT EMITTING DIODE DISPLAY INCLUDING A MICROLENS ARRAY - An organic light emitting diode (OLED) display including a microlens array is disclosed. In one embodiment, the OLED includes a substrate and an organic light emitting diode including a first electrode formed on the substrate, an organic emission layer formed on the first electrode, and a second electrode formed on the organic emission layer. The OLED also includes an encapsulation layer covering the organic light emitting diode, wherein part of the encapsulation layer contacts the substrate, and a microlens array neighboring the encapsulation layer. In one embodiment, the distance between the organic emission layer and the microlens array is about 0.5 μm to about 300 μm.09-29-2011
20110233569ORGANIC LIGHT EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - An organic light emitting display apparatus and method of manufacturing the same to improve an image quality of the organic light emitting display apparatus. The organic light emitting display apparatus includes: a first electrode formed on a substrate; an intermediate layer disposed on the first electrode, the intermediate layer having an organic emission layer; and a second electrode formed on the intermediate layer, wherein the first electrode includes an etching unit facing the intermediate layer.09-29-2011
20110233568LED STREET LAMP - Disclosed is a light emitting diode (LED) street lamp using an LED as a light source and capable of minimizing a luminance deviation within an illuminated area while increasing the luminance of the entire illuminated area. The LED street lamp includes a case provided at a front end of a lamp post; a board provided inside the case and having a plurality of LEDs spaced apart from each other; and heat dissipation units closely adhered to the board and dissipating heat generated when the LEDs emit light, wherein the plurality of LEDs have different luminance levels from each other, the luminance levels gradually increase from the center of the board to the edge of the board, and diffusing members diffusing the light generated from the plurality of LEDs are provided on board portions corresponding to areas between each of the plurality of LEDs.09-29-2011
20110233567PIXEL ARRAY - A pixel array is located on a substrate and includes a plurality of pixel sets. Each of the pixel sets includes a first scan line, a second scan line, a data line, a data signal transmission line, a first pixel unit, and a second pixel unit. The data line is not parallel to the first and the second scan lines. The data signal transmission line is disposed parallel to the first and the second scan lines and electrically connected to the data line. Distance between the first and the second scan lines is smaller than distance between the data signal transmission line and one of the first and the second scan lines. The first pixel unit is electrically connected to the first scan line and the data line. The second pixel unit is electrically connected to the second scan line and the data line.09-29-2011
20110233574LIGHT EMITTING DEVICE HAVING A PLURALILTY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME - Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.09-29-2011
20110233573Method for Producing Temperature-Stable Large-Size Emitting LEDs and LEDs - The invention relates to a method for producing temperature-stable large-size emitting LEDs and LEDs produced by said method. The method is characterised in that a large-area emitting light emitter is provided in the form of semiconductor nanocrystals which furthermore is temperature-stable and has a narrow band emission. A colloidal solution of emitting nanocrystals and a matrix of either inorganic gels or at least one polymer are alternately applied to the substrate with the first electrode by spraying, as a result of the electrostatic interactions between substrate, nanoparticles and inorganic gels or polymers, the nanopartides or the polymers of the matrix are adsorbed and the impurities run down with the solvent. The layer of alternately sprayed nanocrystals and matrix are heated to give a gel cross-linking the metal oxide nanoparticles, wherein thee size of thee semiconductor nanocrystals which determine the emission wavelength are determined by the temperature and duration of the heating. The second electrode is then applied by means of a conventional PVD method.09-29-2011
20100314637HEAT RELEASING SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS INCLUDING THE SAME - A heat releasing semiconductor package, a method for manufacturing the same, and a display apparatus including the same. The heat releasing semiconductor package includes a film, an electrode pattern formed over the film, a semiconductor device mounted over the electrode pattern, and a first heat releasing layer formed over the semiconductor device including the electrode pattern, the first heat releasing layer including a first adhesive and a first heat releasing material.12-16-2010
20100314636ORGANIC LIGHT EMITTING DEVICE, DISPLAY UNIT INCLUDING THE SAME, AND ILLUMINATING DEVICE INCLUDING THE SAME - An organic light emitting device includes a first electrode and second electrode on a substrate. Light emitting units are positioned between the first and second electrodes. A first light emitting unit includes a first light emitting layer, and a second light emitting unit includes a second light emitting layer. The first electrode reflects light from at least one of the light emitting units to generate an interference pattern with light emitted from the first light emitting layer. The interference pattern has a plurality of interference positions such that a first interference position is located within the first light emitting layer, and a second interference position is located within the second light emitting layer.12-16-2010
20100314635CHIP ARRANGEMENT, CONNECTION ARRANGEMENT, LED AND METHOD FOR PRODUCING A CHIP ARRANGEMENT - A chip arrangement for an optoelectronic component includes at least one semiconductor chip which emits electromagnetic radiation, and a connection arrangement which includes planes that are electrically insulated from one another, at least one plane having a cavity and at least one plane being a heat dissipating plane, wherein at least two electrically insulated conductors are arranged in at least the two planes, the semiconductor chip is arranged within the cavity and has at least two connection locations, and each of the connection locations is electrically conductively connected to a respective one of the conductors.12-16-2010
20100314634PIXEL STRUCTURE AND MANUFACTURING METHOD THEREOF AND DISPLAY PANEL - A pixel structure and a manufacturing method thereof and a display panel are provided. An electrode material layer, a shielding material layer, an inter-layer dielectric material layer, a semiconductor material layer and a photoresist-layer are sequentially formed on a substrate. The semiconductor material layer, the inter-layer dielectric material layer, the shielding material layer and the electrode material layer are patterned using the photoresist-layer as a mask to form a semiconductor pattern, an inter-layer dielectric pattern, a shielding pattern and a pixel electrode. A source/drain electrically connected to the pixel electrode and covering a portion of the semiconductor pattern is formed on the pixel electrode. A channel is another portion of the semiconductor uncovered by the source/drain. A dielectric layer covering the source/drain, the semiconductor pattern, the inter-layer dielectric pattern, the shielding pattern and the pixel electrode and a gate disposed on the dielectric layer above the channel are formed.12-16-2010
20100314633FRONT END SCRIBING OF LIGHT EMITTING DIODE (LED) WAFERS AND RESULTING DEVICES - A wafer of light emitting diodes (LEDs) is laser scribed to produce a laser scribing cut. Then, the wafer is cleaned, for example by wet etching, to reduce scribe damage. Then, electrical contact layers for the LEDs are formed on the wafer that has been cleaned. Alternatively, the scribing cut may be produced by multiple etches before contact formation. Related LEDs are also described.12-16-2010
20130153941SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE UNIT, ACTIVE MATRIX SUBSTRATE, LIQUID CRYSTAL PANEL, AND LIQUID CRYSTAL DISPLAY - A semiconductor device (06-20-2013
20130153942LIGHT EMITTING DEVICE, CIRCUIT BOARD, PACKAGING ARRAY FOR LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING PACKAGING ARRAY FOR LIGHT EMITTING DEVICE - A light emitting device includes a light emitting element and a package. The package is made up of a molded article and a lead that is embedded in the molded article. The lead includes a mounting part on which the light emitting element is mounted, a terminal part that is linked to the mounting part, and an exposed part. The package has a front face that is a light emitting face, a rear face opposite the front face, and a bottom face contiguous with the front face and the rear face. The light emitting element is mounted on the front face side of the mounting part. The exposed part is linked to the rear face side of the mounting part, and is exposed from the molded article at the bottom face and the rear face. The terminal part is exposed from the molded article at the bottom face.06-20-2013
20130153935Light Emitting Systems and Methods - Light-emitting systems and related methods of their fabrication are disclosed.06-20-2013
20130153936DEVICE MANUFACTURING METHOD AND ORGANIC EL DEVICE - A device manufacturing method including substrate preparation, pixel electrode formation, photosensitive film formation, first part exposure, second part exposure, and development. In first part exposure, after execution of photosensitive film formation, first photomask is arranged to face substrate and exposure is performed to cause first part of photosensitive film to be exposed to light via first photomask. In second part exposure, after or together with execution of first part exposure, second photomask is arranged to face substrate and exposure is performed to cause second part of photosensitive film, which is different from first part at least partially, to be exposed to light via second photomask. In second part exposure, second photomask is arranged such that end thereof overlaps with end of first photomask, and overlap between first and second photomasks positionally corresponds to electrical wire.06-20-2013
20130153937ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - In an organic light-emitting display device and a method of manufacturing the organic light-emitting display device, the method includes forming thin film transistors (TFTs) on a substrate; and forming organic light emitting diodes (OLEDs), each of the OLEDs including a first electrode having a portion exposed by a pixel defining layer (PDL) on the TFTs, an organic layer on the exposed portion of the first electrode and including an emission layer (EML) configured to emit light having a respective one of a plurality of colors, and a second electrode on the organic layer. The EML is formed in each of a sub-pixel region with one color and other sub-pixel regions with other colors that are formed by forming openings in the PDL. A solution supply unit for sub-pixel region that communicates with the sub-pixel region with one color is formed in the sub-pixel region with one color.06-20-2013
20130092960Multi-Die LED Package - A light-emitting device comprising (a) a submount having front and back sides and including a ceramic layer; (b) an array of light-emitting diodes (LEDs) on the front side; and (c) a lens overmolded on the submount and covering the LED array. In some embodiments, the submount comprises at least two electrically-conductive contact pads on the front side, and each LED in the array is secured with respect to one of the contact pads.04-18-2013
20110284880LIGHT EMITTING DEVICE ARRAY, METHOD FOR FABRICATING LIGHT EMITTING DEVICE ARRAY AND LIGHT EMITTING DEVICE - A light emitting device array includes a first supporting member, at least two bonding layers disposed on the first supporting member, a second supporting member disposed on each of the at lest two bonding layers, a light emitting structure disposed on the second supporting member, the light emitting structure comprising a first conductivity type semiconductor layer, a second conductivity type semiconductor layer and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, and a first electrode disposed on the light emitting structure.11-24-2011
20110291128LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT - A light emitter and method for manufacturing a light emitter. The light emitter includes a first electrode, a charge injection transport layer, a light-emitting layer, and a second electrode that are layered in this order. At least the light-emitting layer is defined by bank. The charge injection transport layer includes a recessed portion having an inner bottom surface in contact with a bottom surface of the light-emitting layer and an inner side surface continuous with the inner bottom surface and in contact at least partly with a side surface of the light-emitting layer. The inner side surface has a lower edge continuous with the inner bottom surface, and an upper edge is aligned with a portion of a bottom periphery of the bank, the portion being in contact with the light-emitting layer or in contact with a bottom surface of the bank.12-01-2011
20110291127LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE LIGHT EMITTING DEVICE - Disclosed is a light emitting device including, a light emitting structure that has a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, wherein the active layer is provided between the first conductive semiconductor layer and the second conductive semiconductor layer, and includes a plurality of well layers and at least one barrier layer, wherein the barrier layer includes a first nitride layer and a second nitride layer provided on the first nitride layer, and wherein the first nitride layer has a larger energy band gap than the second nitride layer while the energy band gap of the second nitride layer is larger than that of each well layer.12-01-2011
20110297971LED LIGHTING DEVICE - An LED lighting device A12-08-2011
20110297970INTEGRALLY FORMED SINGLE PIECE LIGHT EMITTING DIODE LIGHT WIRE AND USES THEREOF - An integrally formed single piece light emitting diode (LED) light wire that provides a smooth, uniform lighting effect from all directions of the LED light wire. The integrally formed single piece LED light wire includes a support substrate, a conductive base formed on the support substrate, the conductive bus comprising a plurality of conductive bus elements, at least one conductive segment arranged between the plurality of conductive bus elements, the at least one conductive segment comprising at least one LED. The integrally formed single piece LED light wire may include built-in sensors/detectors and/or a plurality of LED modules with individually controlled LEDs via microprocessors. The integrally formed single piece LED light wire may also include an interlocking alignment system which permits the coupling of at least two LED light wires. Further, a plurality of the integrally formed single piece LED light wires may create a lighting panel.12-08-2011
20110297969SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, a transparent layer, and a fluorescent material layer. The transparent layer is provided on the first major surface of the semiconductor layer. The transparent layer is transparent with respect to light emitted by the light emitting layer and has a trench provided outside the outer circumference of the light emitting layer. The fluorescent material layer is provided in the trench and on the transparent layer. The fluorescent material layer includes a first fluorescent material particle provided in the trench and a second fluorescent material particle provided on the transparent layer. A particle size of the first fluorescent material particle is smaller than a width of the trench. A particle size of the second fluorescent material particle is larger than the width of the trench and larger than the particle size of the first fluorescent material particle.12-08-2011
20130119413LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, AND METHOD FOR PRODUCING LIGHT-EMITTING ELEMENT - A light-emitter including: a transparent first electrode; a charge injection transport layer; a light-emitting layer; and a transparent second electrode, layered in this order. The light-emitting layer is defined by a bank. The charge injection transport layer has a recessed structure including: an inner bottom surface in contact with a bottom surface of the light-emitting layer; and an inner side surface continuous with the inner bottom surface. The inner side surface includes: a lower edge continuous with the inner bottom surface; and an upper edge continuous with the lower edge. The upper edge is aligned with a bottom periphery of the bank, or has contact with a bottom surface of the bank. The charge injection transport layer has contact with a side surface of the light-emitting layer.05-16-2013
20110303928LED LAMP - An LED lamp A includes a plurality of LED modules 12-15-2011
20110303926LIGHT EMITTING DIODE SYSTEMS INCLUDING OPTICAL DISPLAY SYSTEMS HAVING A MICRODISPLAY - Light emitting diode systems are disclosed.12-15-2011
20110309386LAMP HAVING OUTER SHELL TO RADIATE HEAT OF LIGHT SOURCE - A lamp includes an outer shell having heat conductivity, a base provided in the outer shell, and a cover provided in the outer shell. The outer shell has a light source support, and a heat radiating surface exposed to the outside of the outer shell. The light source support is formed integral with the heat radiating surface. A light source is supported on the light source support. The light source is heated during lighting, and thermally connected to the light source support. The light source is covered with the cover.12-22-2011
20110309385DISPLAY PANEL DEVICE AND METHOD OF MANUFACTURING THE SAME - A display panel device having a structure that is more reliable than that of a conventional display panel device includes: a bank and an opening surrounded by an inclined side wall of the bank; a pixel electrode that is a first electrode layer formed on the opening of the bank; a hole injection layer and an organic EL layer that are organic functional layers formed on the first electrode layer; and a common electrode that is a second electrode layer formed on the organic functional layers, wherein the first electrode layer has (i) an end portion that is in contact with the side wall of the bank so that the end portion runs on the side wall, and (ii) a depressed portion that opens upward in a peripheral portion close to the end portion.12-22-2011
20110309384SEMICONDUCTOR LIGHT EMITTING DEVICE - The present invention relates to a semiconductor light emitting device including: a substrate for element mounting; a wiring provided on the substrate; an LED element provided on the substrate and electrically connected to the wiring; an encapsulating resin layer for encapsulating the LED element; and a wavelength conversion layer which contains a phosphor material and converts a wavelength of light emitted by the LED element, in which the wavelength conversion layer is provided on an upper side of the LED element, and a diffusive reflection resin layer is provided in a state that side faces of the LED element are surrounded therewith, and an area at the LED element face side of the wavelength conversion layer is at least twice larger by area ratio than an area of light emitting area on an upper surface of the LED element.12-22-2011
20110309383LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a crystalline substrate having a plurality of side surfaces, a light emitting structure layer comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer on the substrate, and a first electrode on the first conductive type semiconductor layer and a second electrode on the second conductive type semiconductor layer. An amorphous region is defined in a side surface of the substrate, and the amorphous regions of two sides adjacent to each other have different depths from a top surface of the substrate.12-22-2011
20110309382NANOWIRE LED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode (LED) structure includes a plurality of devices arranged side by side on a support layer. Each device includes a first conductivity type semiconductor nanowire core and an enclosing second conductivity type semiconductor shell for forming a pn or pin junction that in operation provides an active region for light generation. A first electrode layer extends over the plurality of devices and is in electrical contact with at least a top portion of the devices to connect to the shell. The first electrode layer is at least partly air-bridged between the devices.12-22-2011
20110309381LIGHT-EMITTING DEVICE AND LIGHTING APPARATUS - According to one embodiment, a light-emitting device includes a series circuit, a substrate, and a sealing member. The series circuit includes a plurality of parallel circuits each including a plurality of light-emitting elements connected in parallel. The plurality of parallel circuits are connected in series. A plurality of groups are provided on the substrate. Each of the groups includes at least one of the light-emitting elements in the parallel circuit. The light-emitting elements are arranged in a divided manner according to each of the groups. The sealing member covers at least one of the light-emitting elements.12-22-2011
20110309380MOTHER SUBSTRATE, ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a mother substrate and a method for manufacturing the same, the mother substrate comprising: a substrate, comprising at least one display region and pre-cutting regions in a periphery of the display region, wherein the display region comprises gate scanning lines and data scanning lines, the pre-cutting regions comprise a gate-line connecting line and a data-line connecting line electrically connected to each other, and the gate-line connecting line is electrically connected to all of the gate scanning lines in the display region, and the data-line connecting line is electrically connected to all of the data scanning lines in the display region substrate.12-22-2011
20110309379LIGHT-EMITTING DEVICE AND LUMINARE - According to one embodiment, a light-emitting device includes a substrate, a plurality of light-emitting elements and a sealing resin. The substrate is formed in a substantially rectangular shape. The plurality of light-emitting elements forms a plurality of rows by being arranged in a direction perpendicular to a longer dimension of the substrate. The rows are arranged in a longer direction of the substrate with a gap provided therebetween. The gap is set between the rows such that illumination intensity is evenly produced. The sealing resin coves each of the rows of the light-emitting elements.12-22-2011
20110309378METHOD FOR MANUFACTURING A MONOLITHIC LED MICRO-DISPLAY ON AN ACTIVE MATRIX PANEL USING FLIP-CHIP TECHNOLOGY AND DISPLAY APPARATUS HAVING THE MONOLITHIC LED MICRO-DISPLAY - A high-resolution, Active Matrix (AM) programmed monolithic Light Emitting Diode (LED) micro-array is fabricated using flip-chip technology. The fabrication process includes fabrications of an LED micro-array and an AM panel, and combining the resulting LED micro-array and AM panel using the flip-chip technology. The LED micro-array is grown and fabricated on a sapphire substrate and the AM panel can be fabricated using CMOS process. LED pixels in a same row share a common N-bus line that is connected to the ground of AM panel while p-electrodes of the LED pixels are electrically separated such that each p-electrode is independently connected to an output of drive circuits mounted on the AM panel. The LED micro-array is flip-chip bonded to the AM panel so that the AM panel controls the LED pixels individually and the LED pixels exhibit excellent emission uniformity. According to this constitution, incompatibility between the LED process and the CMOS process can be eliminated.12-22-2011
20110309377Optoelectronic Module having a Carrier Substrate and a Plurality of Radiation-Emitting Semiconductor Components and Method for the Production Thereof - An optoelectronic module is specified, comprising a carrier substrate (12-22-2011
20120286297LED PACKAGE STRUCTURE AND MODULE THEREOF - The present invention discloses a LED package structure and a module thereof. The LED package structure comprises a metallic chip-carrying lead frame, a metallic anode lead frame, a metallic cathode lead frame and a forming resin. At least one LED chip is stuck to the metallic chip-carrying lead frame. The metallic anode lead frame and metallic cathode lead frame are arranged beside the metallic chip-carrying lead frame. The forming resin includes a top member, a first sidewall, and a second sidewall. The top member is arranged on the metallic chip-carrying lead frame and has an opening to reveal the LED chip. A reflective wall is formed along the opening. The first sidewall is arranged between the metallic chip-carrying lead frame and the metallic anode lead frame to join them. The second sidewall is arranged between the metallic chip-carrying lead frame and the metallic cathode lead frame to join them.11-15-2012
20120012864LED ARRAY PACKAGE WITH A COLOR FILTER - A light source includes a substrate, a light emitting diode on the substrate within a cavity, a plate over the cavity, a phosphor layer on the plate, and a color filter on the plate between the phosphor layer and the cavity.01-19-2012
20130193458SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD - A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located on at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a casing having a cavity and a mounting surface, the chip mounted on the mounting surface, a transparent plate mounted on the wavelength converting layer within a top surface of the chip and a reflective layer located in the cavity so as to surround the transparent plate, the wavelength converting layer and the chip. The semiconductor light-emitting device can be configured to improve light-colored variability and light-emitting efficiency of the chip by using the reflective layer as a reflector, and therefore can emit a wavelength-converted light having a substantially uniform color tone and a high light-emitting efficiency from a smaller light-emitting surface than the top surface of the chip.08-01-2013
20130193459LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device includes a substrate; a light-emitting element formed on the substrate; a seal member sealing the light-emitting element, the seal member formed of a transparent dry film resist laminated on the substrate with the light-emitting element interposed therebetween.08-01-2013
20130193460LIGHT EMITTING DEVICE - A light emitting device includes a plurality of light emitting elements, a plurality of lead frames, and a package. The light emitting elements are mounted on the lead frames. The package is made of resin. The package has an opening. A part of the lead frames is embedded in an inner portion of the package and another part of the lead frames is exposed on a bottom surface of the opening. A resin bottom surface on which the resin is exposed is provided on the bottom surface of the opening of the package. The package includes a wall portion projecting from the bottom surface of the opening between the light emitting elements in the opening. The light emitting elements are connected by wire that straddles the wall portion.08-01-2013
20130193461ARRAY SUBSTRATE AND DISPLAY DEVICE HAVING THE SAME - An array substrate includes a lower substrate, a switching element and a pixel electrode. In the lower substrate, unit pixel areas are each divided into a plurality of domains. The switching element is disposed on the lower substrate and transmits a pixel signal. The pixel electrode is disposed on the unit pixel area and is electrically connected to the switching element. The pixel electrode includes a plurality of slit portions disposed thereon. A portion of the slit portions is longitudinally extended in a zigzag shape along different directions in correspondence with the domains.08-01-2013
20130193462LIGHT EMITTING DEVICE - A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.08-01-2013
20130193463Methods Of Integrating LED Chips With Heat Sinks, And Led-Based Lighting Assemblies Made Thereby - An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB.08-01-2013
20120018748LIGHT EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME - A light emitting diode device includes: at least one light emitting diode chip, which includes a semiconductor unit, two electrodes that are disposed on an electrode-mounting surface of the semiconductor unit, a light-transmissive insulating layer that is disposed on the electrode-mounting surface and that has two via holes, a reflective metal layer disposed on a portion of the light-transmissive insulating layer, a protective insulating layer that is disposed on the reflective metal layer, a conductor-receiving insulating layer that has two conductor-receiving holes respectively in communication with the via holes, and two conductor units that are formed respectively in the conductor-receiving holes; and a light-transmissive envelope layer that covers a surface of the light emitting diode chip opposite to the electrode-mounting surface, that extends to cover outer lateral surfaces of the light emitting diode chip, and that is doped with a fluorescence powder.01-26-2012
20120018747LED LEAD FRAME AND METHOD OF MAKING THE SAME - An LED lead frame assembly comprises a wiring board having a plurality set of positive and negative poles arranged on a top surface thereof A plurality of LED chips are disposed on the wiring board, and electrically bonded to the bus line. A transparent cover is arranged upon the wiring board and covering the LED chip and the conductive lead.01-26-2012
20120018746ARRAY-TYPE LED DEVICE - An array-type LED device includes a substrate; and a plurality of light-emitting elements located on the substrate, wherein each of the plurality of light-emitting elements includes a first semiconductor layer having a first region and a second region; and a second semiconductor layer with an oblique angle located on the second region. The light-emitting element further includes a first electrical-contact region located on the first region, and a second electrical-contact region located on the second semiconductor layer, wherein the lateral resistance of the second semiconductor layer is larger than that of the first semiconductor layer.01-26-2012
20120018745INTEGRATED LIGHTING APPARATUS AND METHOD OF MANUFACTURING THE SAME - An integrated lighting apparatus includes at least a lighting device, a control device comprising an integrated circuit, and a connector that is used to electrically connect the lighting device and the control device. With the combination, the integrated circuit drives the lighting device in accordance with its various designed functionality, thus expands applications of the integrated lighting apparatus.01-26-2012
20130193452LIGHT EMITTING DIODE SYSTEM AND METHODS RELATING THERETO - A light emitting diode system is disclosed having a bent layered structure conformed to a least a portion of a self-supporting three dimensional heat sink and maintains a breakdown voltage from 150 to 350 V/micron. The bent layered structure has an electrical circuit, a dielectric layer and at least one LED package, LED chip on board or mixtures thereof attached to the electrical circuit. The dielectric layer is a polyimide derived from at least 70 mole percent aromatic dianhydride based upon total dianhydride content of the polyimide and at least 70 mole percent aromatic diamine based upon total diamine content of the polyimide.08-01-2013
20130193453Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies - An electronic device may include a packaging substrate having a packaging face, and the packaging substrate may include positive and negative electrically conductive pads on the packaging face. A plurality of light emitting diodes may be electrically and mechanically coupled to the packaging face of the packaging substrate, with the plurality of light emitting diodes being electrically coupled between the positive and negative electrically conductive pads on the packaging face. A continuous optical coating may be provided on the plurality of light emitting diodes and on the packaging face of the packaging substrate so that the plurality of light emitting diodes are between the optical coating and the packaging substrate.08-01-2013
20130193454Electric Resistance Element Suitable for Light-Emitting Diode, Laser Diodes, or Photodetectors - An electric resistance element comprising: a base body, which is formed with a semiconductor material; a first contact element, which is electrically conductively connected to the base body; and a second contact element, which is electrically conductively connected to the base body. The base body has a first main surface into which a cutout is introduced. The first contact element is electrically conductively connected to the base body at least in places in the cutout. The base body has a second main surface, which is arranged in a manner lying opposite the first main surface. The second contact element is electrically conductively connected to the base body at least in places at the second main surface08-01-2013
20130193455LIGHT EMITTER PACKAGES AND DEVICES HAVING IMPROVED WIRE BONDING AND RELATED METHODS - Light emitter packages and devices having improved wire bonding and related methods are disclosed. In one embodiment a light emitter package can include at least one light emitting diode (LED) chip electrically connected to an electrical element via a wire bond. The wire bond can be provided at improved wire bonding parameters such as a temperature of approximately 150° C. or less, a bonding time of approximately 100 ms or less, a power of approximately 1700 mW or less, and a force of approximately 100 grams force (gf) or less, or combinations thereof.08-01-2013
20130193457Light-Emitting Circuit, Luminaire, and Manufacturing Method for the Light-Emitting Circuit - According to one embodiment, a light-emitting circuit includes: a plurality of substrates in which wiring pattern layers are formed, the substrates including light-emitting elements connected to and mounted on the wiring pattern layers; and a linear conductor having electric conductivity, the linear conductor including linear joining sections at both ends electrically connected to the wiring pattern layers of the substrates and a convex section formed to be bent in a convex shape in an intermediate section between the joining sections, and the joining sections being respectively joined to the wiring pattern layers among the plurality of substrates adjacent to one another.08-01-2013
20130193456ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display includes a substrate, a white pixel and a color pixel, each including an emission area, a non-emission area, a thin film transistor on the substrate, and an organic light emitting element on the substrate and electrically connected to the thin film transistor and configured to emit light at the emission area, a color filter layer between the organic light emitting element of the color pixel and the substrate at the emission area of the color pixel, and an overcoat layer having an overcoat opening corresponding to the emission area of the white pixel, and covering the color filter layer between the organic light emitting element of the color pixel and the color filter layer.08-01-2013
20120025214LED PACKAGING STRUCTURE AND PACKAGING METHOD - The present invention relates to an LED packaging structure and packaging method. Said packaging structure includes a substrate, an LED chip, one or more convex walls and a colloid lens shaped by the restriction of the convex walls. Said convex walls are arranged on the substrate, at least one LED chip is arranged on the substrate within an area surrounded by the convex walls, and the colloid lens enclosing the LED chip is arranged within the area surrounded by the convex walls. The colloid lens is formed with desired colloid shape by placing a liquid colloid within the area confined by the convex walls and utilizing surface tension of the liquid, and is cured. Compared to prior art, the LED packaging structure of the present invention is simple and reasonable, with simple production process and lower costs.02-02-2012
20120292646SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, AND LIGHTING APPARATUS AND DISPLAY APPARATUS USING THE SAME - The present invention aims to provide a semiconductor light emitting device that may be firmly attached to a substrate with maintaining excellent light emitting efficiency, and a manufacturing method of the same, and a lighting apparatus and a display apparatus using the same.11-22-2012
20120032205MICRODISPLAY PACKAGING SYSTEM - Some embodiments provide a microdisplay integrated circuit (IC), a substantially transparent protective cover coupled to the microdisplay IC, and a base coupled to the microdisplay IC. Thermal expansion characteristics of the base may be substantially similar to thermal expansion characteristics of the protective cover. According to some embodiments, at least one set of imaging elements is fabricated on an upper surface of a semiconductor substrate, and a base is affixed to a lower surface of the semiconductor substrate to generate substantially negligible mechanical stress between the semiconductor substrate and the base.02-09-2012
20120037928ANTI-REFLECTION FILM AND FOLDABLE DISPLAY DEVICE EMPLOYING THE SAME - A anti-reflection film includes a light phase delay film which changes a phase of incident light, a polarizing film on the light phase delay film and transmitting light with a polarization component in a particular direction, and a protective film on the polarizing film and protecting the polarizing film. All of the polarizing film, the light phase delay film, and the protective film include flexible materials.02-16-2012
20120043561Organic Light Emitting Diode Display - An organic light emitting diode display includes: a substrate; a first electrode positioned on the substrate; an organic layer positioned on the first electrode; a transflective layer positioned on the organic layer; an organic emission layer positioned on the transflective layer; and a second electrode positioned on the organic emission layer.02-23-2012
20120043560LAMP MODULE - A lamp module is provided, including a circuit board, at least an LED, an insulator and a metal barrier. The LED is disposed on the circuit board and has two conductive leads on opposite sides thereof. The insulator is disposed on the circuit board, having an opening and two protruding sheets. The metal barrier is disposed on the insulator, wherein the LED and the protruding sheets are extended through the metal barrier. The conductive leads are insulated from the metal barrier by the protruding sheets of the insulating member.02-23-2012
20120056214LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting device of the invention includes a thin film transistor, an insulating layer covering the thin film transistor, an electrode which is electrically connected to the thin film transistor through a contact hole formed on the insulating layer, and a light emitting element formed by interposing a light emitting layer between a first electrode which is electrically connected to the electrode and a second electrode. The light emitting device further includes a layer formed of a different material from that of the insulating layer only between the electrode and the first electrode over the insulating layer and the insulating layer.03-08-2012
20130200398LIGHT EMITTING DIODE WITH WAVELENGTH CONVERSION LAYER - A light-emitting device comprises a base, a light-emitting unit comprising a semiconductor stack disposed on the base, and a wavelength conversion layer covering the light-emitting unit, wherein the wavelength conversion layer does not physically contact the base.08-08-2013
20130200399DISPLAY DEVICE - A display device includes a first insulation layer on a substrate, gate wires on the first insulation layer, the gate wires extending in a first direction, a second insulation layer on the gate wires, data wires on the second insulation layer, the data wires extending in a second direction crossing the first direction, pixels at intersection regions of gate wires and data wires, respectively, the pixels being connected to respective gate wires and data wires, and data leading diodes having an island form and connected to the data wires, the data leading diodes being configured to induce breakage of the first insulation layer when external static electricity passes through the data wires.08-08-2013
20130200400PCB HAVING INDIVIDUAL REFLECTIVE STRUCTURE AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE USING THE SAME - A printed circuit board (PCB) having an individual reflective structure and a method for manufacturing a light emitting diode (LED) package using the same, which can prevent reabsorption of light between LED chips by providing an individual reflective structure between the LED chips when the LED package is configured using two or more LED chips. The PCB includes a PCB; a wiring pattern-forming material layer formed on the PCB with an insulating layer interposed therebetween; dams formed on the wiring pattern-forming layer around chip mounting areas of the PCB; and a light reabsorption prevention dam formed on the wiring pattern-forming material layer between the chip mounting areas where LED chips are mounted.08-08-2013
20130200401CIRCUIT SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND ELECTROOPTICAL DEVICE - A circuit substrate includes, on an insulating substrate, a plurality of devices, a plurality of conductive layers connected in one-to-one correspondence with the devices, and an insulating layer provided between the devices and the conductive layers. The insulating layer includes a first insulating layer covering the devices, a second insulating layer formed on the first insulating layer, and a plurality of contact holes each passing through the first and second insulating layers in a thickness direction thereof. Side surfaces of the first and second insulating layers contact each other in at least part of the inside of each contact hole. Each conductive layer extends along an upper surface of the second insulating layer, at least a part of a side surface of the contact hole in which the side surfaces of the first and second insulating layers contact each other, and a bottom surface of the contact hole.08-08-2013
20130200402LIGHT-EMITTING MODULE - A light-emitting module includes a plate substrate, two circuit substrates, at least one LED chip, a plurality of wires and a molding component. The plate substrate includes a plurality of chip carriers protrudingly arranged from an upper surface and a lower surface of the plate substrate. The two circuit substrates directly stack on the upper and lower surface of the plate substrate, respectively, wherein a plurality of openings are arranged corresponding to the chip carriers penetrating therethrough and the upper surface of each chip carrier is at a higher or the same horizontal of the surface of the corresponding circuit substrate. The LED chip is arranged on each chip carrier. Each LED chip and the corresponding circuit substrates are electrically connected with a plurality of wires. Each of LED chips, each of chip carriers, wires and a portion of the circuit substrates are covered with the molding component.08-08-2013
20130200403PACKAGE STRUCTURE FOR SEMICONDUCTOR LIGHT EMITTING DEVICE - A package structure for a semiconductor light emitting device is provided. The package structure includes a semiconductor light emitting device, a lead frame, an electrostatic discharge protection device and an encapsulation. The lead frame supports the semiconductor light emitting device, and has a gap. The electrostatic discharge protection device is fastened in the gap and electrically connected to the lead frame. The encapsulation covers the lead frame, the semiconductor light emitting device and the electrostatic discharge protection device.08-08-2013
20130200404THIN FILM TRANSISTOR DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - A thin film transistor display panel includes: a gate electrode, a source electrode and a drain electrode which are included in a thin film transistor on a substrate; a data line connected to the source electrode; a pixel link member connecting the drain electrode to a pixel electrode; and a gate pad connected to the gate electrode through a gate line and including a first gate subpad, a second gate subpad and a gate pad link member, in which the pixel link member and the gate pad link member are substantially same in thickness.08-08-2013
20130200405Optoelectronic Semiconductor Component - An optoelectronic semiconductor component includes a substrate that has an upper side and an under side lying opposite the upper side. The substrate is formed with an electrically conductive mounting region, an electrically conductive connection region and an electrically isolating oxidation region. An optoelectronic part is arranged on the upper side of the substrate in the region of the mounting region. The oxidation region electrically isolates the mounting region from the connection region. The oxidation region extends, without interruption, from the upper side of the substrate to the underside of the substrate. The mounting region and the connection region are formed with aluminum and the oxidation region is formed with an oxide of the aluminum. The mounting region, the oxidation region and the connection region being are designed contiguously to form an entity.08-08-2013
20130200406CERAMIC-BASED LIGHT EMITTING DIODE (LED) DEVICES, COMPONENTS, AND METHODS - Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a ceramic body having a top surface, one or more light emitter devices mounted directly or indirectly on the top surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the ceramic body by one or more non-metallic layers. Components disclosed herein can result in improved light extraction and thermal management.08-08-2013
20120061690LED MODULE AND PACKING METHOD OF THE SAME - A LED module and a packing method of the same include plural boards defined with a positive line and a negative line. The positive line connects to at least one positive joint, and the negative line connects to at least one negative joint. Some LEDs are respectively disposed on each board, and conducting ends of the LEDs are separately connected to the positive line and the negative line. A number of electronic elements are individually installed on each board, and conducting ends of the electronic elements are separately connected to the positive line and the negative line disposed on the board. A positive guiding line connects to the positive joint of each board, and a negative guiding line connects to the negative joint of each board. The LED module achieved in accordance with above-mentioned construction contributes to the flexibility.03-15-2012
20120068200Liquid Crystal Display Device and Method for Manufacturing the Same - A liquid crystal display device with a built-in touch screen, which uses a common electrode as a touch-sensing electrode including an intersection of a gate line and a data line to define a pixel region, a gate metal disposed in a central portion of the pixel, an insulating layer formed on the gate metal, a first contact hole disposed through the insulating layer to expose a predetermined portion of an upper surface of the gate metal, a contact metal on the insulating layer and inside the first contact hole, the contact metal electrically connected with the gate metal, a first passivation layer on the contact metal, a second contact hole disposed through the first passivation layer to expose a predetermined portion of an upper surface of the contact metal, a common electrode on the first passivation layer and inside the second contact hole, a conductive line electrically connected with the common electrode, and a second passivation layer on the first passivation layer and the conductive line, wherein the gate metal and the common electrode are electrically connected via the contact metal.03-22-2012
20120299017BATWING LED WITH REMOTE PHOSPHOR CONFIGURATION - An LED emitter uses a molded lens with phosphor material embedded in a circumferential trench to generate a batwing beam pattern. After the lens is molded over a package substrate with connected LED dies thereon, the phosphor material is molded, injected, or dispensed into a circumferential trench. The molded lens is shaped such that a majority of the light emitted by the one or more LED dies is reflected by the top surface to the side surfaces through the phosphor material.11-29-2012
20120074436LED UNIT HAVING SELF-CONNECTING LEADS - An LED unit includes a plurality of LEDs connected to each other and a plate supporting the LEDs. Each LED includes a base, a chip mounted on the base, a pair of leads fixed to the base and electrically connected to the chip and an encapsulant sealing the chip. The base includes a main body and a pair of steps. The leads each have two opposite ends protruding from two opposite ends of the main body and located below/above a corresponding step. The protruding ends of the leads of each LED are connected to those of adjacent LEDs to electrically connect the LEDs in series or in parallel.03-29-2012
20120080692DISPLAY PANEL, DISPLAY DEVICE, ILLUMINATION PANEL AND ILLUMINATION DEVICE, AND METHODS OF MANUFACTURING DISPLAY PANEL AND ILLUMINATION PANEL - Disclosed herein is a display panel including a mounting substrate in which one or more light-emitting devices each including one or more light-emitting elements are mounted on a circuit substrate; and a transparent substrate disposed to face the light-emitting device side of the mounting substrate, wherein the transparent substrate has a transparent base material and a resin layer formed on the mounting substrate side of the transparent base material, and the resin layer is in contact with the light-emitting device and has, formed on an upper surface or a side surface of the light-emitting device, an inclined part which spreads from the light-emitting device side toward the transparent base material side.04-05-2012
20120086025ORGANIC LIGHT-EMITTING DIODE MODULE - An organic light-emitting diode (OLED) module includes a substrate, a bus line, an organic light-emitting device layer, a plurality of conductive elements, and at least one conductive wire. The bus line is configured on the substrate. The organic light-emitting device layer is configured on the substrate and electrically connected to the bus line. The conductive elements are configured on the substrate and electrically connected to the bus line. The conductive wire is configured next to the conductive elements and electrically connected to the conductive elements.04-12-2012
20120086024MULTIPLE CONFIGURATION LIGHT EMITTING DEVICES AND METHODS - Multiple configuration light emitting diode (LED) devices and methods are disclosed wherein LEDs within the device can be selectively configured for use in higher voltage, or variable voltage, applications. Variable arrangements of LEDs can be configured. Arrangements can include one or more LEDs connected in series, parallel, and/or a combination thereof. A surface over which one or more LEDs may be mounted can comprise one or more electrically and/or thermally isolated portions.04-12-2012
20120086023Insulating glass (IG) or vacuum insulating glass (VIG) unit including light source, and/or methods of making the same - Certain example embodiments of this invention relate to techniques for improving the performance of Lambertian and non-Lambertian light sources. In certain example embodiments, this is accomplished by (1) providing an organic-inorganic hybrid material on LEDs (which in certain example embodiments may be a high index of refraction material), (2) enhancing the light scattering ability of the LEDs (e.g., by fractal embossing, patterning, or the like, and/or by providing randomly dispersed elements thereon), and/or (3) improving performance through advanced cooling techniques. In certain example instances, performance enhancements may include, for example, better color production (e.g., in terms of a high CRI), better light production (e.g., in terms of lumens and non-Lambertian lighting), higher internal and/or external efficiency, etc.04-12-2012
20120086022Light source with light scattering features, device including light source with light scattering features, and/or methods of making the same - Certain example embodiments of this invention relate to techniques for improving the performance of Lambertian and non-Lambertian light sources. In certain example embodiments, this is accomplished by (1) providing an organic-inorganic hybrid material on LEDs (which in certain example embodiments may be a high index of refraction material), (2) enhancing the light scattering ability of the LEDs (e.g., by fractal embossing, patterning, or the like, and/or by providing randomly dispersed elements thereon), and/or (3) improving performance through advanced cooling techniques. In certain example instances, performance enhancements may include, for example, better color production (e.g., in terms of a high CRI), better light production (e.g., in terms of lumens and non-Lambertian lighting), higher internal and/or external efficiency, etc.04-12-2012
20130207135LIGHT EMITTING ELEMENT - A light emitting element is provided in this application, including a carrier; a conductive connecting structure disposed on the carrier and including a transparent conductive connecting layer; and an epitaxial stack structure disposed on the conductive connecting structure and including a plurality of electrically connected epitaxial light-emitting stacks, which substantially have the same width.08-15-2013
20130207133LIGHT-EMITTING DIODE - A light-emitting diode includes a carrier with a mounting face and includes a metallic basic body and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein an outer face of the metallic basic body includes the mounting face, the at least two light-emitting diode chips connect in parallel with one another, the at least two light-emitting diode chips are embedded in a reflective coating, the reflective coating covering the mounting face and side faces of the light-emitting diode chips, and the light-emitting diode chips protrude with their radiation exit surfaces out of the reflective coating, and the radiation exit surfaces face away from the carrier.08-15-2013
20130207134DISPLAY SUBSTRATE, DISPLAY PANEL HAVING THE DISPLAY SUBSTRATE, AND DISPLAY DEVICE HAVING THE DISPLAY PANEL - A display substrate includes a base substrate, a gate line portion, a data line portion, and a pixel portion. The base substrate includes a display area divided into first to fourth divided display areas, and first to fourth peripheral areas. The gate line portion includes a plurality of first gate lines, and a plurality of second gate lines. The data line portion includes a plurality of first data lines, and a plurality of second data lines. The pixel portion is disposed in the display area to be electrically connected to the first and second gate lines and the first and second data lines, respectively.08-15-2013
20130207128LIGHT-EMITTING DIODE LIGHT MODULE FREE OF JUMPER WIRES - An LED light module free of jumper wires has a substrate and multiple LED chips. The substrate has a positive side circuit, a negative side circuit, multiple first chip connection portions and multiple second connection portions. The first and second chip connection portions are respectively connected to the positive and negative side circuits, and are juxtaposedly and alternately arranged on the substrate so that a width between each first chip connection portion and a corresponding second chip connection portion is smaller than a width of each LED chip. Each LED chip can be directly mounted on corresponding first and second chip connection portions to electrically connect to the positive and negative side circuits. Accordingly, jumper wires for connecting the LED chips and the positive and negative side circuits can be removed to avoid broken jumper wires occurring when the LED light module is shipped or assembled.08-15-2013
20130207129Light-Emitting Diode Area Light Module and Method for Packaging the Same - An LED area light module has a substrate and a circuit layer and a solder mask layer formed on the substrate. The solder mask layer partially covers the circuit layer for the partially exposed circuit layer to form multiple electrical contacts. An embankment wall is formed on the solder mask layer with a solder mask material for the electrical contacts to be located within the embankment wall. Multiple LED chips are mounted on the solder mask layer within the embankment wall and electrically connected to the electrical contacts. Optically-transmissive adhesive is filled and concentrated within the embankment wall and covers the LED chips by a tension force thereof, and forms an optically-transmissive adhesive layer after congealed. Accordingly, the LED area light module eliminates the use of thick frame made of metal or rubber and steps of manufacturing and mounting the frame to simplify the packaging processes.08-15-2013
20130207130LIGHT EMITTER DEVICES HAVING IMPROVED LIGHT OUTPUT AND RELATED METHODS - Light emitter devices having improved light output and related methods are disclosed. In one embodiment, light emitter devices can include a light emission area including one or more light emitting chips. The emitter device can further include a filling material at least partially disposed over the one or more light emitting chips. The filling material can include a first discrete layer of phosphor containing material and a second discrete layer of optically clear material. The device can optionally include more than one discrete layer of optically clear material. Each of the discrete layers of material can be separately dispensed within the light emission area such that the filling material is dispensed to a level that is substantially flush with an upper surface of the emitter device.08-15-2013
20130207131ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display device including a substrate; a sealing sheet, which covers the substrate; a getter, which is interposed between at least a portion of the substrate and the sealing sheet; and an adhesive layer comprising an adhesive, which bonds the sealing sheet onto the substrate, wherein a getter-housing groove is in surfaces of the sealing sheet and the adhesive layer facing the substrate, and the getter is located in the getter-housing groove.08-15-2013
20130207132SOLID STATE WHITE LIGHT EMITTER AND DISPLAY USING SAME - A light emitting assembly comprising a solid state device coupleable with a power supply constructed and arranged to power the solid state device to emit from the solid state device a first, relatively shorter wavelength radiation, and a down-converting luminophoric medium arranged in receiving relationship to said first, relatively shorter wavelength radiation, and which in exposure to said first, relatively shorter wavelength radiation, is excited to responsively emit second, relatively longer wavelength radiation. In a specific embodiment, monochromatic blue or UV light output from a light-emitting diode is down-converted to white light by packaging the diode with fluorescent organic and/or inorganic fluorescers and phosphors in a polymeric matrix.08-15-2013