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Noble metal (gold, silver, ruthenium, rhodium, palladium, osmium, iridium, platinum)

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252 - Compositions

252500000 - ELECTRICALLY CONDUCTIVE OR EMISSIVE COMPOSITIONS

252512000 - Free metal containing

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DocumentTitleDate
20110175040METHOD FOR PRODUCING METAL PARTICLE DISPRESION, CONDUCTIVE INK USING METAL PARTICLE DISPERSION PRODUCED BY SUCH METHOD, AND CONDUCTIVE COATING FILM - Disclosed is a method for producing a metal particle dispersion wherein a metal compound is reduced by using carbodihydrazide represented by the formula (1) below or a polybasic acid polyhydrazide represented by the formula (2) below (wherein R represents an n-valent polybasic acid residue) in a liquid medium. By reducing the metal compound in the presence of a compound having a function preventing discoloration of the metal, there can be obtained a metal particle dispersion having excellent discoloration preventing properties. Metal particles produced by such methods have a uniform particle diameter and are excellent in dispersion stability. By using a conductive resin composition or conductive ink containing a metal particle dispersion obtained by such production methods, there can be formed a conductive coating film, such as a conductive circuit or an electromagnetic layer, having good characteristics.07-21-2011
20090194745Conductive Filler - Disclosed is a conductive filler which can be fusion-bonded under lower temperature conditions (with the peak temperature of not less than 181° C.) than the reflow heat treatment conditions for an Sn-37Pb eutectic solder. This conductive filler is applicable to heat-resistant uses similar to those of the Sn-37Pb eutectic solder. The conductive filler is a mixture of first metal particles composed of an alloy having a chemical composition including 25-40% by mass of Ag, 2-8% by mass of Bi, 5-15% by mass of Cu, 2-8% by mass of In and 29-66% by mass of Sn, and second metal particles composed of an alloy having a chemical composition including 5-20% by mass of Ag, 10-20% by mass of Bi, 1-15% by mass of Cu and 50-80% by mass of Sn. In the mixture, 20-10,000 parts by mass of the second metal particles are contained per 100 parts by mass of the first metal particles.08-06-2009
20130075672Kit for preparing a conductive pattern - The invention relates to a kit for preparing a conductive element comprising a container A containing a liquid dispersion A′, comprising dispersed nanoparticles having a metallic surface and a ligand capable of binding to said surface; a container B—which may be the same or different as the container A containing the liquid dispersion A′—said container B containing a liquid B′ comprising reducible silver ions or other reducible metal ions; and a further container C containing a liquid C′ comprising a reducing agent for the metal ions of the liquid from container B.03-28-2013
20130037761THICK FILM PASTE CONTAINING LEAD-TELLURIUM-LITHIUM-TITANIUM-OXIDE AND ITS USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES - The present invention is directed to an electroconductive thick film paste composition comprising Ag and a lead-tellurium-lithium-titanium-oxide both dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode.02-14-2013
20100078603PASTE FOR SOLAR CELL ELECTRODE AND SOLAR CELL - In a paste for a solar cell light-receiving surface electrode including silver particles, glass frit, resin binder, and thinner, silver particles with a specific surface of 0.20-0.60 m04-01-2010
20100072434METHOD FOR PREPARING METAL NANOPARTICLES USING MATAL SEED AND METAL NANOPARTICLES COMPRISING METAL SEED - It provides a method for preparing metal nanoparticles using a metal seed and metal nanoparticles including the metal seed, the method including: preparing a solution by adding a polymer surfactant in an alcohol solvent; heating the solution; forming a metal seed by adding a first metal salt of at least one metal salt selected from the group consisting of platinum, palladium and iridium in the heated solution; and adding a second metal salt into the solution including the metal seed. This method allows the production of uniform-sized nanoparticles under high concentration conditions in high yield and mass production in which the metal nanoparticles have high dispersion stability so that they are suitable for various application.03-25-2010
20130082217METHOD OF PRODUCING METAL PARTICLES, AND INK COMPOSITION AND PASTE COMPOSITION PRODUCED BY THE SAME - Disclosed is a method of producing metal particles, including preparing a first solution including a silver (Ag) compound and a solvent, heating and stirring the first solution, adding an organophosphorus compound to the first solution and heating the first solution, and forming metal particles capped with a phosphorus (P) compound from the first solution.04-04-2013
20100044650 NANOPARTICLE COMPOSITION, A DEVICE AND A METHOD THEREOF - The invention provides a nanoparticle composition, a device including the nanoparticle composition, and a method thereof. The composition comprises nanoparticles such as Gold nanorods (NR) and electrically charged self-assembled molecular aggregates such as disodium chromoglycate (DSCG) in a common solvent such as water. The nanoparticles are assembled as, for example, side-by-side and end-to-end assemblies of nanorods, through a non-covalent interaction such as anisotropic electrostatic interaction with the electrically charged self-assembled molecular aggregates. The invention can be used in a cloaking device, a biological sensing device, a drug delivery, a meta material, a negative index material, an enhanced imaging device, and a device for solar energy conversion, and exhibits many merits such as simpler process without the need of a covalent bonding between the nanoparticles, different manners of nanoparticles assembling with same linker, higher thermal stability, cost effectiveness, and capability of gradual controlling of the degree of NR assembly, among others.02-25-2010
20130026425Conductive Composition and Method for Manufacturing - The present invention provides a conductive composition which comprises a conductive functional phase mixture. The conductive functional phase mixture is made of a metal and a metal oxide, wherein the metal oxide is as the filler and the metal is as the main body. A coating portion covers substantially at least a partial surface of the filler, wherein the coating portion includes at least silver or copper.01-31-2013
20100065790Conductive Composition - Conductive compositions which are useful as thermally conductive compositions and may also be useful as electrically conductive compositions are provided. The compositions include a conductive particle constituent in combination with a sintering aid which can, for example be a compound of the same metal in the nanometal, an organo-metallic, a metalorganic salt, mercaptan and/or resinate. In some embodiments the conductive particles include a small amount of nanoscale (<200 nm) particles. The compositions exhibit increased thermal conductivity.03-18-2010
20100065789METHOD FOR PRODUCING SILVER PARTICLE POWDER - Provided is a method for producing a silver particle powder excellent in the dispersibility in a liquid organic medium having a low polarity, which comprises reducing a silver compound in an alcohol having a boiling point of from 80° C. to 200° C. or in a polyol having a boiling point of from 150 to 300° C., at a temperature of from 80° C. to 200° C. under reflux while maintaining the stream having a Reynolds number of not more than 3.70×1003-18-2010
20130087746LEAD FREE GLASS FRIT POWDER FOR MANUFACTURING SILICON SOLAR CELL, ITS PRODUCING METHOD, METAL PASTE COMPOSITION CONTAINING THE SAME AND SILICON SOLAR CELL - Disclosed are lead free glass frit powder for manufacturing a silicon solar cell, its producing method, a metal paste composition containing the same and a silicon solar cell. The lead free glass frit powder for manufacturing a silicon solar cell includes Bi04-11-2013
20090200521MICROVARISTOR-BASED OVERVOLTAGE PROTECTION - A method is disclosed for producing a non-linear powder having microvaristor particles which have a non-linear current-voltage characteristic. The production steps includes mixing non-metallic particles with the microvaristor particles, thermally treating the non-metallic particles for decomposing them into electrically conductive particles and fusing the electrically conductive particles onto the microvaristor particles. Embodiments, among other things, relate to: breaking up agglomerates of the non-metallic particles during mixing; keeping the decomposition temperature below a sintering or calcination temperature of the microvaristor particles; and choosing micron-sized or nano-sized non-conductive particles for microvaristor decoration. The production method produces varistor powder with improved reproducibility of the non-linear electric current-voltage characterstic and with reduced switching fields (E08-13-2009
20130056689HIGHLY CONDUCTIVE ELECTRICALLY CONDUCTIVE ADHESIVES - The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.03-07-2013
20130056688NANOMETAL-POLYMER COMPOSITE CONDUCTIVE FILM AND METHOD FOR PREPARING THE SAME - A method for preparing a nanometal-polymer composite conductive film includes the steps of (1) mixing a metal oxide with a polymer solution; (2) coating a substrate with a solution resulting from step (1), followed by drying the resultant solution to form a film; (3) performing thermal treatment on the film formed in step (2); and (4) sintering the film thermally treated in step (3). The method dispenses with any reducing agent or dispersing agent but allows nanometallic particles to be formed in situ and thereby reduces surface resistance of the polymer film efficiently.03-07-2013
20120112137MANUFACTURING METHOD FOR METAL OXIDE SEMICONDUCTOR MATERIAL FOR GAS SENSOR - Provided is a manufacturing method of a metal oxide semiconductor material for gas sensors by which an oxide precursor and noble metal colloid particles will not readily cohere in the manufacturing process. The manufacturing process implements a precursor solution synthesis step 05-10-2012
20110012068Process for producing fine silver particle colloidal dispersion, fine silver particle colloidal dispersion, and conductive silver film - A process for producing a fine silver particle colloidal dispersion which can simply form conductive silver layers and antimicrobial coatings by screen printing or the like. The process is characterized by having a reaction step of allowing an aqueous silver nitrate solution to react with a mixed solution of an aqueous iron(II) sulfate solution and an aqueous sodium citrate solution to form an agglomerate of fine silver particles, a filtration step of filtering the resultant agglomerate of fine silver particles to obtain a cake of the agglomerate of fine silver particles, a dispersion step of adding pure water to the cake to obtain a first fine silver particle colloidal dispersion of a water system in which dispersion the fine silver particles have been dispersed in the pure water, and a concentration and washing step of concentrating and washing the first fine silver particle colloidal dispersion of a water system.01-20-2011
20130161572CONDUCTIVE PASTE COMPOSITION WITH SYNTHETIC CLAY ADDITIVE AND ITS USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES - A conductive paste composition contains a source of an electrically conductive metal, a fusible material, a synthetic clay additive, and an optional etchant additive, dispersed in an organic medium. An article such as a photovoltaic cell is formed by a process having the steps of deposition of the paste composition on a semiconductor substrate by a process such as screen printing and firing the paste to remove the organic medium and sinter the metal and fusible material. The synthetic clay additive aids in establishing a low resistance electrical contact between the front side metallization and underlying semiconductor substrate during firing.06-27-2013
20130161573LEAD-FREE CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH - A lead-free conductive paste composition contains a source of an electrically conductive metal, a fusible material, an optional additive, and an organic vehicle. An article such as a high-efficiency photovoltaic cell is formed by a process of deposition of the lead-free paste composition on a semiconductor substrate (e.g., by screen printing) and firing the paste to remove the organic vehicle and sinter the metal and fusible material.06-27-2013
20090236567Silver particle powder and process for production thereof - A powder of silver particles having an organic protective film, which has a broad particle size distribution of such that the CV value, as computed according to the following formula (1) in which the particle diameter is determined by TEM (transmission electromicroscopy), is at least 40%. The organic protective film comprises, for example, a fatty acid (oleic acid, etc.) having a molecular weight of from 100 to 1000 and an amine compound having a molecular weight of from 100 to 1000, and at least any one of the fatty acid and the amine compound has at least one unsaturated bond in one molecule.09-24-2009
20130069017NOBLE METAL FINE PARTICLE, METHOD FOR WITHDRAWING NOBLE METAL FINE PARTICLES, AND METHOD FOR PRODUCING NOBLE METAL FINE PARTICLE DISPERSED MATERIAL USING WITHDRAWN NOBLE METAL FINE PARTICLES - The present invention provides a noble metal fine particle with a protein adsorbed thereon, including a noble metal fine particle, and a protein adsorbed on a surface of the noble metal fine particle. The protein has an isoelectric point in a range of pH 4.0 to 7.5. An amount of the protein adsorbed is in a range of 3 to 55.1 wt % with respect to a total weight of the noble metal fine particle and the protein. The noble metal fine particle with a protein adsorbed thereon according to the present invention has excellent redispersibility. That is, by adjusting the pH of a noble metal fine particle dispersed liquid to the isoelectric point of the proteins and allowing the noble metal fine particles to be aggregated without adding a degrading enzyme that degrades the proteins to the noble metal fine particle dispersed liquid, it is possible to allow the noble metal fine particles with proteins adsorbed thereon withdrawn from the noble metal fine particle dispersed liquid to have an average particle diameter that is not increased significantly even after they are redispersed in another dispersion medium.03-21-2013
20130069016THERMOFORMABLE POLYMER THICK FILM SILVER CONDUCTOR FOR CAPACITIVE SWITCHES - This invention is directed to a polymer thick film conductive composition. More specifically, the polymer thick film conductive composition may be used in applications where thermoforming of the base substrate occurs as in capacitive switches. Polycarbonate substrates are often used as the substrate and the silver conductor composition may be used without any barrier layer.03-21-2013
20130214216CONDUCTIVE REFLECTIVE FILM AND METHOD OF MANUFACTURING THE SAME - A conductive reflective film has a silver nanoparticle-sintered film with a surface coating composition containing a hydrolysate of a metal alkoxide wet-coated thereto. The coated film is then fired. Also provided is a method of manufacturing the conductive reflective film comprising the steps of coating a surface coating composition containing a hydrolysate of a metal alkoxide on a silver nanoparticle-sintered film using a wet coating method, and firing the silver nanoparticle-sintered film having the coated film. The conductive reflective film provides improved adhesion properties with respect to a base material while maintaining a high reflectivity and a high conductivity of a silver nanoparticle-sintered film.08-22-2013
20110278507THICK FILM SILVER PASTES CONTAINING IODONIUM AND/OR SULFONIUM SALTS AND THEIR USE IN PHOTOVOLTAIC CELLS - This invention provides a silver thick film paste composition comprising electrically conductive silver powder, one or more onium salts selected from the group consisting of iodonium salts and sulfonium, flux and an organic medium. Also provided are photovoltaic cells that contain an electrode made using these silver thick film paste compositions. Such photovoltaic cells show improved efficiencies.11-17-2011
20110114898CONDUCTOR PASTE FOR CERAMIC SUBSTRATE AND ELECTRIC CIRCUIT - A conductor paste for a ceramic substrate contains a) a conductive metal powder comprising a silver powder and a palladium powder; b) a glass powder; and c) an organic solvent, wherein the conductive metal powder has an average particle diameter of not more than 1.2 μm, and the glass powder is a Bi05-19-2011
20090001328Paste for Solar Cell Electrode and Solar Cell - In a paste for a solar cell light-receiving surface electrode including silver particles, glass frit, resin binder, and thinner, silver particles with a specific surface of 0.20-0.60 m01-01-2009
20110291058TRANSPARENT CONDUCTIVE FILM AND CONDUCTIVE SUBSTRATE USING THE SAME - A transparent conductive film (12-01-2011
20090256118Fine Silver Particle Colloidal Dispersion, Coating Liquid for Silver Film Formation, Processes for Producing These, and Silver Film - A process for producing a fine silver particle colloidal dispersion the fine silver particles of which have a larger average particle diameter than those in the conventional Carey-Lea process and also which has superior dispersion stability. An aqueous silver nitrate solution is allowed to react with a mixed solution of an aqueous iron(II) sulfate solution and an aqueous sodium citrate solution, and the resultant reaction fluid containing an agglomerate of fine silver particles is left at 0 to 100° C. to obtain an agglomerate of fine silver particles having grown into granular particles. Next, this agglomerate of fine silver particles having grown into granular particles is filtered, and, to the resultant cake of the agglomerate of fine silver particles, pure water is added to obtain a fine silver particle colloidal dispersion having an average particle diameter of 20 to 200 nm. This fine silver particle colloidal dispersion is concentrated and washed, further followed by addition of an organic solvent containing dimethyl sulfoxide, to obtain a coating liquid for silver film formation.10-15-2009
20090173919Conductive Ink Compositions - Disclosed are conductive ink compositions that include at least one monomer containing exactly one ethylenically unsaturated group, one or more thermoplastic polymers, one or more free radical initiators, and conductive particles. Also disclosed are conductive thermoplastic materials which include at least one thermoplastic polymer produced by polymerization of one or more monomers containing exactly one ethylenically unsaturated group; and conductive particles dispersed in said thermoplastic polymer. The conductive ink compositions and thermoplastic materials can be used in the manufacture of electronic devices, such as radiofrequency identification (“RFID”) devices.07-09-2009
20120286219SPUTTERING TARGET, SEMICONDUCTING COMPOUND FILM, SOLAR CELL COMPRISING SEMICONDUCTING COMPOUND FILM, AND METHOD OF PRODUCING SEMICONDUCTING COMPOUND FILM - The present invention provides a sputtering target which comprises an alkali metal, a Ib group element, a IIIb group element, and a VIb group element, and has a chalcopyrite crystal structure. Provided is a sputtering target comprising Ib-IIIb-VIb group elements and having a chalcopyrite crystal structure, which is suitable for producing, via a single sputtering process, a light-absorbing layer comprising the Ib-IIIb-VIb group elements and having the chalcopyrite crystal structure.11-15-2012
20110062389CONDUCTIVE MATERIAL FORMED USING LIGHT OR THERMAL ENERGY, METHOD FOR FORMING THE SAME AND NANO-SCALE COMPOSITION - An electrically conductive material includes a plurality of nanowires and a plurality of nanoconnectors. The ratio by weight of the plurality of nanowires to the plurality of nanoconnectors is in a range of from 1:9 to 9:1. Nanoconnectors can be heated by thermal energy or light energy so that the nanoconnectors can be closely interconnected to each other and to nanowires, resulting in significant increase of the electrical conductivity of the electrically conductive material.03-17-2011
20110168958ELECTRICAL CONTACT ENHANCING COATING - The electrical contact enhancing coating is a composition that includes finely divided precious metal particles mixed with a dielectric carrier to form a coating. The dielectric carrier is a vegetable oil (preferably soybean-based) carrier of the type used as a dielectric coolant in power transformers, and is preferably high in antioxidant content. In a first embodiment, the precious metal is 100% silver having an average particle size of about 5-10 μm. In a second embodiment, the precious metal is about 65-85% silver and 15-35% gold (average particle size 0.5-1.8 μm), by weight. In a third embodiment, the precious metal is about 65-85% silver, 12.5-30% gold, and 2.5-5% palladium (average particle size 0.5-1.8 μm), by weight. The precious metals may be cryogenically treated prior to mixing with the dielectric carrier.07-14-2011
20080210912Use of Conductor Compositions in Electronic Circuits - Use of a composition comprising finely divided particles of (a) an electrically-conductive material; (b) one or more inorganic binders; and (c) zinc, wherein components (a), (b) and (c) are dispersed in a liquid vehicle, in the manufacture of an electrically-conductive pattern on a substrate for the purpose of increasing the resistivity of said electrically-conductive pattern.09-04-2008
20090272947POLYCRYSTALLINE ALUMINUM THIN FILM AND OPTICAL RECORDING MEDIUM - A polycrystalline aluminum thin film is made of polycrystals of an alloy of aluminum. The polycrystalline aluminum thin film includes a first additive which is distributed with even concentration over an inside of each crystal grain and an interface of the crystal grain and a second additive which is distributed with higher concentration in the interface of the crystal grain than in the inside of the crystal grain.11-05-2009
20090294741SILVER COMPOSITION FOR MICRO-DEPOSITION DIRECT WRITING SILVER CONDUCTOR LINES ON PHOTOVOLTAIC WAFERS - Embodiments of the invention relate to a silicon semiconductor device, and a conductive thick film composition for use in a solar cell device.12-03-2009
20130099176ELECTRODE COMPOSTION FOR INKJET PRINTING AND METHOD FOR MANUFACTURING ELECTRODE FOR DYE-SENSITIZED SOLAR CELL USING THE SAME - The present invention provides an electrode composition for inkjet printing, which can be used to form an electrode having a uniform thickness on a curved substrate by inkjet printing, and a method for manufacturing an electrode for a dye-sensitized solar cell using the same. In particular, the present invention provides an electrode composition for inkjet printing, the electrode composition including about 10 to 40 wt % of platinum nanoparticles, about 1 to 10 wt % of polymer surface stabilizer, and about 40 to 89 wt % of solvent.04-25-2013
20130099179METAL NANOPARTICLE COMPOSITIONS FOR REFLECTIVE FEATURES - A composition for the fabrication of reflective features using a direct-write tool is disclosed. The composition comprises metal nanoparticles having an average particle size less than 300 nm and which carry thereon a polymer for substantially preventing agglomeration of the nanoparticles, wherein the nanoparticles exhibit a metal-polymer weight ratio of 100:1 to 10:1. The composition further includes a vehicle for forming a dispersion with the metal nanoparticles. A number of electronic devices comprising a reflective layer formed from the composition are also disclosed. One example case provides an electronic device having a reflective electrode. The reflective electrode comprises a percolation network of the metal nanoparticles embedded in a matrix of the polymer and having an average particle size of less than 300 nm, wherein the reflective electrode is reflective in the visible light range and does not diffract incident light.04-25-2013
20100140565EMI/RFI Shielding Resin Composite Material and Molded Product Made Using the Same - Disclosed is an electromagnetic wave interference (EMI)/radio frequency interference (RFI) shielding resin composite material including (A) a thermoplastic polymer resin, (B) a tetrapod whisker, and (C) a low melting point metal.06-10-2010
20100140564CONDUCTIVE INK - A conductive ink comprising 10 to 75 wt % of at least one solvent comprising ≦20 wt % water; 0 to 50 wt % of at least one radiation curable material having a Mn in the range of from 50 to 10,000 g/mol; 5 to 70 wt % of at least one polyurethane having a Mw in the range of from 4,000 to 70,000 g/mol, 0 to 5 wt % of isocyanate-reactive component(s) bearing ionic or potentially ionic water-dispersing groups and a free isocyanate group content <0.5 wt % and 20 to 85 wt % of a conductive material.06-10-2010
20090140217ELECTROCONDUCTIVE THICK FILM COMPOSITION(S), ELECTRODE(S), AND SEMICONDUCTOR DEVICE(S) FORMED THEREFROM - The present invention is directed to an electroconductive thick film composition comprising: (a) electroconductive metal particles selected from (1) Al, Cu, Au, Ag, Pd and Pt; (2) alloy of Al, Cu, Au, Ag, Pd and Pt; and (3) mixtures thereof; (3) glass frit wherein said glass frit is Pb-free; dispersed in (d) an organic medium, and wherein the average diameter of said electroconductive metal particles is in the range of 0.5-10.0 μm. The present invention is further directed to an electrode formed from the composition as detailed above and a semiconductor device(s) (for example, a solar cell) comprising said electrode.06-04-2009
20120138871INK JETTABLE SILVER/SILVER CHLORIDE COMPOSITIONS - The present invention uses a silver/silver chloride composition and ink jet technology in the art of digital printing, especially for use in blood glucose sensors.06-07-2012
20110220852CONDUCTOR COMPOSITION V - A conductive composition consisting essentially of (a) 50-95 wt % finely divided particles of an electrically-conductive material dispersed in (b) a liquid vehicle, for use in the manufacture of an electrically-conductive pattern on a substrate for the use of reducing cross-sectional area and width while retaining conductivity and resistivity.09-15-2011
20090101872LEAD-FREE CONDUCTIVE COMPOSITIONS AND PROCESSES FOR USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES: Mg-CONTAINING ADDITIVE - Described herein are a silicon semiconductor device and a conductive lead-free silver paste for use in the front side of a solar cell device.04-23-2009
20090200522CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES USING THE SAME, AND ELECTRIC CONNECTION METHOD BETWEEN ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE USING THE SAME - The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided.08-13-2009
20090230364CRYSTALLINE METALLIC NANOPARTICLES AND COLLOIDS THEREOF - Apparatus for forming metallic crystalline nanoparticles includes a dispersion medium, first and second electrodes separated from each other by a predetermined span and being inserted into the dispersion medium. The electrodes are connected to a supply of electrical current at a preselected voltage. A filament is in contact with the two electrodes and is also inserted into the dispersion medium. Upon a first switch connecting the supply of electrical current to the electrodes, a pulsed current passes through the electrodes and the filament at a voltage preselected to disintegrate the filament into fragments, but does not create plasma from the filament. The fragments include a plurality of crystalline nanoparticles09-17-2009
20120032121METALLIC COMPOSITE AND COMPOSITION THEREOF - A metallic composite in which a conjugated compound having a molecular weight of 200 or more is adsorbed to a metallic nanostructure having an aspect ratio of 1.5 or more, for example, a metallic composite in which a compound having a group represented by the formula (I) or a repeating unit represented by the formula (II) or both of them is adsorbed to a metallic nanostructure having an aspect ratio of 1.5 or more, is useful for electronic devices such as a light-emitting device, a solar cell and an organic transistor.02-09-2012
20100127223HIGH CONDUCTIVITY POLYMER THICK FILM SILVER CONDUCTOR COMPOSITION FOR USE IN RFID AND OTHER APPLICATIONS - Disclosed are thick film silver compositions comprised of silver flake and organic medium useful in radio frequency identification devices (RFID). The invention is further directed to method(s) of antenna formation using RFID circuits or other circuits using polymer thick film (PTF).05-27-2010
20110057153DNA-BASED FUNCTIONALIZATION OF SINGLE WALLED CARBON NANOTUBES FOR DIRECTED ASSEMBLY - Disclosed herein is a method of orienting a carbon nanotube comprising functionalizing a nucleic acid or a carbon nanotube with a plurality of functional groups to form either a functionalized nucleic acid or a functionalized carbon nanotube; disposing a nucleic acid on a functionalized carbon nanotube or a functionalized nucleic acid on a carbon nanotube or a functionalized nucleic acid on a functionalized carbon nanotube to form a nucleic acid-carbon nanotube molecular composite; adsorbing the nucleic acid-carbon nanotube molecular composite upon a substrate; the substrate comprising a plurality of material phases, at least one of which the nucleic acid-carbon nanotube molecular composite has an affinity for; and orienting the nucleic acid-carbon nanotube molecular composite so that it contacts two or more identical material phases.03-10-2011
20110024699POLYMERIC POLYMER CONTAINING POLY(OXYETHYLENE)-AMINE AND APPLICATION THEREOF TO PREPARING SILVER NANOPARTICLE - A polymeric polymer containing poly(oxyethylene)-amine and its application to preparation of silver nanoparticles. The polymeric polymer is prepared from poly(oxyethylene)-amine and a linker, for example, poly(styrene-co-maleic anhydride) (SMA) or dianhydride. The polymeric polymer can chelate silver ions and reduce them to silver atoms which are dispersed as nanoparticles. No additional reducing agent is needed and more than 30% of solid content of the nanoparticles solution can be achieved without aggregation. The prepared silver nanoparticles are both hydrophilic and hydrophobic and therefore are compatible with polymers.02-03-2011
20110031451SINTERED BODY, AND THERMOELECTRIC CONVERSION MATERIAL - Disclosed are a sintered body and a thermoelectric conversion material. The sintered body comprises a manganese-based oxide as a main component, and further comprises an oxide A wherein the oxide A represents one or more members selected from among nickel oxides, copper oxide and zinc oxide, and a metal M wherein the metal M represents one or more members selected from among Pd, Ag, Pt and Au.02-10-2011
20100148131CONDUCTIVE INK FOR LETTERPRESS REVERSE PRINTING - The present invention provides a conductive ink for forming a fine conductive pattern on a substrate by letterpress reverse printing. In particular, the conductive ink enables the pattern to be formed stably without the occurrence of transfer failures and is able to impart superior conductivity by low-temperature baking. The conductive ink, which contains substantially no binder component, comprises as essential components thereof conductive particles having a volume average particle diameter (Mv) of 10 to 700 nm, a release agent, a surface energy regulator and a solvent component, the solvent component being a mixture of a solvent having a surface energy at 25° C. of 27 mN/m or more (high surface energy solvent) and a volatile solvent having a boiling point at atmospheric pressure of 120° C. or lower (low boiling point solvent), and the surface energy of the ink at 25° C. is 10 to 21 mN/m.06-17-2010
20100243967COMPOSITION CONTAINING FINE SILVER PARTICLES, PRODUCTION METHOD THEREOF, METHOD FOR PRODUCING FINE SILVER PARTICLES, AND PASTE HAVING FINE SILVER PARTICLES - A composition containing fine silver particles which have a uniform particle size, can form a fine drawing pattern, and have a small environmental impact, a method for producing that composition, a method for producing fine silver particles, and a paste having fine silver particles are provided.09-30-2010
20100224837FEATURE FORMING PROCESS USING ACID-CONTAINING COMPOSITION - A process including: (a) forming a feature comprising uncoalesced silver-containing nanoparticles; (b) heating the uncoalesced silver-containing nanoparticles to form coalesced silver-containing nanoparticles wherein the feature comprising the coalesced silver-containing nanoparticles exhibits a low electrical conductivity; and (c) subjecting the coalesced silver-containing nanoparticles to an acid-containing composition to increase the electrical conductivity of the feature by at least about 100 times.09-09-2010
20100025639Silver particle composite powder and process production thereof - A silver particle composite powder produced by mixing a silver particle powder (A) which bears on the surface of each silver particle, an organic protective layer comprising an amine compound having at least one unsaturated bond in one molecule and having a molecular weight of from 100 to 1000, and has a mean particle diameter D02-04-2010
20110042626METHOD FOR PRODUCING SEMICONDUCTOR MICROPARTICLES AND THE MICROPARTICLES - It is an object to provide a method for producing compound semiconductor particles in which monodisperse compound semiconductor particles can be prepared according to the intended object, clogging with products does not occur due to self-dischargeability, a large pressure is not necessary, and productivity is high. In producing compound semiconductor particles by separating and precipitating, in a fluid, semiconductor raw materials, the fluid is formed into a thin film fluid between two processing surfaces arranged so as to be able to approach to and separate from each other, at least one of which rotates relative to the other, and the semiconductor raw materials are separated and precipitated in the thin film fluid. Further, in producing semiconductor microparticles containing semiconductor elements by reacting a compound containing semiconductor elements, in a fluid, with a reducing agent, the fluid is formed into a thin film fluid between two processing surfaces arranged so as to be able to approach to and separate from each other, at least one of which rotates relative to the other, and the compound containing semiconductor elements is reacted with the reducing agent in the thin film fluid.02-24-2011
20100264378PHOTOSENSITIVE COMPOSITION, TRANSPARENT CONDUCTIVE FILM, DISPLAY ELEMENT AND INTEGRATED SOLAR BATTERY - A photosensitive composition including a random copolymer formed through copolymerization of at least one compound represented by the following General Formula (1) and another monomer having an unsaturated bond, a photosensitive compound, and a nanowire structure:10-21-2010
20090294740Method and apparatus for preventing catastrophic contact failure in ultra high temperature piezoresistive sensors and transducers - A method to prevent the catastrophic failure of electrical contacts of silicon piezoresistive transducers located on a silicon wafer at temperatures above 600° C. comprising the steps of using a lead-free glass frit to surround the contacts and bonding the sensor wafer to a glass wafer employing a lead-free glass and utilizing a modified electrostatic bonding technique to join the silicon wafer to the lead-free glass wafer to form a high temperature SOI device.12-03-2009
20110253949FINE SILVER PARTICLE POWDER, METHOD FOR MANUFACTURING THE SAME, SILVER PASTE USING THE POWDER, AND METHOD OF USE OF THE PASTE - A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (D10-20-2011
20100320425LOW TEMPERATURE CO-FIRED CERAMIC CIRCUIT BOARD - Provided is a low-temperature fired ceramic circuit board formed by subjecting a conductor paste and a green sheet to simultaneous firing at 800 to 900° C., in which: the green sheet contains a glass powder which contains 35 to 39% by weight of SiO12-23-2010
20100283013SILVER MICROPOWDER, SILVER INK, SILVER COATING, AND METHODS FOR PRODUCTION OF THESE MATERIALS - Provided is a silver micropowder coated with a protective material and capable of more drastically reducing the sintering temperature than before. The silver micropowder comprises silver particles processed to adsorb hexylamine (C11-11-2010
20100252784PROCESS FOR PREPARING SILVER-CONTAINING AQUEOUS FORMULATION USEFUL FOR ELECTRICALLY CONDUCTIVE OR REFLECTIVE COATINGS - Process for preparing A silver-containing, disperse, water-containing formulation useful for producing electrically conductive and/or optically reflective coatings, which comprises (i) reacting a silver salt solution with a solution containing hydroxide ions, wherein at least one of said solutions comprises a polymeric dispersant, to produce an Ag10-07-2010
20110095240Conductive paste for forming a solar cell electrode - A conductive paste for forming a solar cell electrode, including: a conductive powder comprising silver as a main component; glass frit; and an organic vehicle, wherein the glass frit contains tellurium glass frit having tellurium oxide as a network-forming component. The conductive paste of the present invention makes it possible to form a solar cell electrode having a low dependence on firing temperature without causing problems due to fire-through into the substrate, and to thereby obtain a solar cell having good solar cell characteristics.04-28-2011
20110095241SILVER COATED FLAKY MATERIAL FILLED CONDUCTIVE CURABLE COMPOSITION AND THE APPLICATION IN DIE ATTACH - The present invention is to provide a semiconductor packaging applicable conductive composition using silver coated material flakes as a conductive filler, curable epoxy, acrylate, bismaleimide chemical, or the like or their combination as organic resin, and the method for preparing the same. The composition is capable of showing desired workability as dispensable die attach adhesive with right rang of rheology, viscosity and physical stability in storing, being excellent in reliability of conductivity or corrosion resistance, and reducing the amount of high price silver in composition.04-28-2011
20110095239COPPER POWDER FOR CONDUCTIVE PASTE AND CONDUCTIVE PASTE - Copper powder is provided, which, while having fine granularity and resistance to oxidation, does not lose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.05 to 10 atomic % Bi inside each particle.04-28-2011
20110186789SYNTHESIS OF GRAPHENE SHEETS AND NANOPARTICLE COMPOSITES COMPRISING SAME - A method for producing isolatable and dispersible graphene sheets, wherein the graphene sheets may be tailored to be soluble in aqueous, non-aqueous or semi-aqueous solutions. The water soluble graphene sheets may be used to produce a metal nanoparticle-graphene composite having a specific surface area that is 20 times greater than aggregated graphene sheets. Graphene sheets that are soluble in organic solvents may be used to make graphene-polymer composites.08-04-2011
20100148132Particulate nanoparticles and nanowires of silver and method for large scale producing the same - Disclosed is a method suitable for large-scale producing silver nanostructures including nanoparticles and nanowires with high crystallization and purity in a short period of time. In this method, silver particles with mean diameter less than 200 nm and silver nanowires with length in micrometers are produced through a microwave-assisted wet chemistry method. Tens to hundreds grams of silver nanoparticles and nanowires are obtained in minutes by microwave irradiation treatment to a precursor pre-made by highly concentrated silver salt solution and other additives. These silver nanoparticles and nanowires have good dispersibility and are ideal for forming conductive adhesives.06-17-2010
20100193751 Silver Paste for Forming Conductive Layers - The present invention provides a silver paste for forming electrically conductive pattern comprising 0.1 to 60 wt % of a silver C0 to C12 aliphatic carboxylate; 1 to 80 wt % of silver powder; 0.1 to 15 wt % of a binder; and a residual organic solvent.08-05-2010
20120305859LOW TEMPERATURE FIREABLE THICK FILM SILVER PASTE - The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Ph-free Bi-based glass frit both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420° C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.12-06-2012
20120305858LOW TEMPERATURE FIREABLE THICK FILM SILVER PASTE - The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Pb-free bismuth-tellurium oxide both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420° C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.12-06-2012
20110315937CONDUCTIVE PASTE AND ELECTRONIC PART EQUIPPED WITH ELECTRODE WIRING FORMED FROM SAME - Provided is a conductive paste which contains an inexpensive metal, such as copper or aluminum, as an electrode wiring material and has oxidation resistance that enables the paste to withstand a high-temperature process performed in an oxidizing atmosphere and an electronic part equipped with electrode wiring formed from the paste. The electronic part in accordance with the present invention is equipped with electrode wiring that comprises a conductive glass phase containing transition metals and phosphorus, metal particles, and none of the substances prohibited by the RoHS directive. The electronic part is characterized in that each of the transition metals contained in the conductive glass phase is present in the state of having a plurality of oxidation numbers and that the proportion of the atoms which have the largest oxidation number for each transition metal satisfies a given relationship.12-29-2011
20120043510COATED SILVER NANOPARTICLES AND MANUFACTURING METHOD THEREFOR - The present invention provides coated silver nanoparticles for use as an electrically conductive material capable of sintering at lower temperatures that is able to be used even with flexible printed substrates having low heat resistance, and a manufacturing method therefor. The coated silver nanoparticles of the present invention have a mean particle diameter of 30 nm or less and are coated with protective molecules amine, and are characterized in that the weight loss rate when heated to 160° C. in thermogravimetric measurement is 30% or more. The coated silver nanoparticles of the present invention are also characterized in that a silver-colored sintered film can be formed by sintering at a temperature of 100° C. or lower for 1 hour or less. These coated silver nanoparticles are manufactured by mixing a silver compound that forms metallic silver when decomposed by heating, an alkylamine and an alkyldiamine to prepare a complex compound, and by thermally decomposing the silver compound by heating the complex compound.02-23-2012
20080277630Metal Colloidal Particles, Metal Colloid and Use of Metal Colloid - With respect to the metal colloid of the present invention, metal colloidal particles capable of forming a metal colloid by dispersing in either or both of an aqueous dispersion medium and a nonaqueous dispersion medium in a predetermined proportion while mixing, comprise metal particles and a protective agent coordination-modified on the surface of the particles, the protective agent having a carbon skeleton containing either or both of sulfur and oxygen in the molecule, and having a structure of being coordination-modified on the surface of the metal particles using an atom or an atomic group of either or both of sulfur and oxygen as an anchor, wherein the protective agent has one, or two or more functional groups selected from the group consisting of alkoxysilyl group, silanol group and hydroxyalkyl group in a molecular structure.11-13-2008
20120119163SOLDERABLE POLYMER THICK FILM SILVER ELECTRODE COMPOSITION FOR USE IN THIN-FILM PHOTOVOLTAIC CELLS AND OTHER APPLICATIONS - The invention is directed to a polymer thick film silver composition comprising (a) a conductive silver powder; and (b) an organic medium comprising three different resins and organic solvent, wherein the ratio of the weight of the conductive silver powder to the total weight of the three different resins is between 5:1 and 45:1. The composition may be processed at a time and energy sufficient to remove all solvent.05-17-2012
20100276646PT OR PT ALLOY MATERIALS HARDENED BY OXIDE DISPERSION, PRODUCED BY INNER OXIDATION AND HAVING PROPORTIONS OF OXIDE AND GOOD DUCTILITY - A solid body of a metal alloy comprising less than 99% by weight of noble metal and more than 1% by weight of dispersion-strengthening metals is converted for production of a dispersion-strengthened platinum material by at least 90% oxidation of the dispersion-strengthening metals into a dispersion-strengthened platinum material. The dispersion-strengthened platinum material contains a noble metal component and a dispersion-strengthening agent, the proportion by mass of the noble metal component amounting to between 95 and 99% by weight and the noble metal component of platinum or a platinum alloy including at least 55% by weight Pt, 0 to 30% by weight Rh, 0 to 30% by weight Au, and 0 to 40% by weight Pd. The remaining proportion by mass of more than 1% by weight is a dispersion-strengthening agent, which contains at least one metal oxidized at least 90% by weight with oxygen, the metal being selected from the group of Ce, Zr, Sc, and Y.11-04-2010
20120153239Formation of High Electrical Conductivity Polymer Composites with Multiple Fillers - Electrically conductive compositions and composites, and methods of making the same are disclosed herein. An exemplary electrically conductive composite includes a polymer and a filler comprising a porous particle at least partially coated with metal. Additional fillers may be added, including metal particles such as acicular copper. Also disclosed are articles including the polymers and fillers and methods for their manufacture, where such articles may include an interconnect, circuit board, semiconductor, radio frequency identification tag, printed circuit, flexible circuit, tape, film, adhesive, gasket, sealant, ink, or paste.06-21-2012
20110049441NON-AQUEOUS LIQUID COMPOSITIONS COMPRISING ION EXCHANGE POLYMERS CROSS REFERENCE TO RELATED APPLICATION - Compositions, and methods of making thereof, comprising from about 1% to about 5% of a perfluorinated sulfonic acid ionomer or a hydrocarbon-based ionomer; and from about 95% to about 99% of a solvent, said solvent consisting essentially of a polyol; wherein said composition is substantially free of water and wherein said ionomer is uniformly dispersed in said solvent.03-03-2011
20120025152CONDUCTIVE SILVER POWDER PREPARATION METHOD - A conductive silver powder preparation method includes the following steps: forming a silver salt solution by mixing a silver salt with a DI (De-ionized) water; forming a sodium citrate solution by well-mixing a sodium citrate with the DI water; heating the silver salt solution until maintaining the silver salt solution at a constant temperature of no less than 80° C.; forming a brown solution by adding the sodium citrate solution into the heated silver salt solution; cooling the brown solution to the room temperature for precipitating to form a brown powder; and forming a conductive silver powder by freezing and drying the brown powder. This method simplifies the prior chemical method without usages of toxic reducing agent and additional protective agent, and complies with the requirements of environment, step simplification and economy.02-02-2012
20120061625TRANSPARENT CONDUCTIVE FILMS, COMPOSITIONS, ARTICLES, AND METHODS - Transparent conductive films, compositions, articles, and methods and disclosed and claimed. Improved abrasion resistance is provided without adversely affecting coating solution shelf life, film resistivity, or film light transmittance. Such films are useful in such articles as electronic displays, touch screens, and the like.03-15-2012
20120061626PASTE COMPOSITION USED FOR FORMING AN ELECTRODE OR WIRING WHICH IS CURABLE AT A LOW TEMPERATURE - The invention is directed to a paste composition used for forming an electrode or wiring, wherein it comprises a) a conductive powder; b) a cellulose binder; c) an acrylate monomer; d) a radical polymerization initiator; and e) a solvent, and it is curable at a low temperature when compared to the prior paste compositions and it has excellent hardness, electrical resistivity and stability so that it can be usefully used for forming an electrode or wiring for a solar cell, RFID (Radio Frequency Identification) or PCB (Printed Circuit Board).03-15-2012
20100096598METHOD OF MAKING SOLAR CELL CONTACTS - Formulations and methods of making solar cells are disclosed. In general, the invention presents a solar cell contact made from a mixture wherein the mixture comprises a solids portion and an organics portion, wherein the solids portion comprises from about 85 to about 99 wt % of silver, and from about 1 to about 15 wt % of a glass component wherein the glass component comprises from about 15 to about 75 mol % PbO, and from about 5 to about 50 mol % SiO04-22-2010
20120119164THERMOELECTRIC MATERIAL WITH LOW ELECTRICAL RESISTIVITY AND MANUFACTURE THEREOF - Thermoelectric material has attracted more attentions as a promising energy material in recent years. Research nowadays are devoted to improvement of figure-of-merit (zT=S05-17-2012
20120119165ELECTROCONDUCTIVE THICK FILM COMPOSITION(S), ELECTRODE(S), AND SEMICONDUCTOR DEVICE(S) FORMED THEREFROM - The present invention is directed to an electroconductive thick film composition comprising: (a) electroconductive metal particles selected from (1) Al, Cu, Au, Ag, Pd and Pt; (2) alloy of Al, Cu, Au, Ag, Pd and Pt; and (3) mixtures thereof; (3) glass frit wherein said glass frit is Pb-free; dispersed in (d) an organic medium, and wherein the average diameter of said electroconductive metal particles is in the range of 0.5-10.0 μm. The present invention is further directed to an electrode formed from the composition as detailed above and a semiconductor device(s) (for example, a solar cell) comprising said electrode.05-17-2012
20120126183CONDUCTIVE FINE PARTICLE AND METAL PASTE FOR ELECTRODE FORMATION, AND ELECTRODE - An object of the present invention is to provide a conductive fine particle for producing a metal paste that can produce an electrode film having a low resistance, and a metal paste utilizing the conductive fine particle. The present invention is a conductive particle for electrode formation having a core/shell structure, and the conductive particle comprises a core particle made of Pt or a Pt alloy and having a particle diameter of 10 to 200 nm, and a shell made of a ceramic containing Al05-24-2012
20120168692Method for Preparing Water-Soluble Nanoparticles and Their Dispersions - Provided is a method for preparing an aqueous dispersion of metal nanoparticles having superior dispersibility and being sinterable at low temperature by modifying the surface of metal nanoparticles having hydrophobic groups with hydrophilic groups. Specifically, by treating the surface hydrophobic groups of the metal nanoparticles with a surface modification solution containing a surfactant and a wetting-dispersing agent, the treatment throughput can be improved about 10-fold and the particles can be monodispersed without agglomeration. Further, by using an antioxidant and a ligand removal agent in the solution, denaturation and oxidation of the particles can be prevented and the high-boiling-point hydrophobic ligands can be eliminated effectively. The hydrophilically treated metal nanoparticles may be dispersed in an aqueous-based solvent to prepare a metal ink sinterable at low temperature.07-05-2012
20120168691PASTE COMPOSITION FOR SOLAR BATTERY ELECTRODE - It is provided a paste composition for a solar battery electrode, that includes electrically conductive powder, glass frit, and a vehicle, wherein the glass frit is made of glass that comprises, as amounts converted into those of oxides as ratios, Li07-05-2012
20120168690NANOWIRE RECOVERY METHODS, COMPOSITIONS, AND ARTICLES - Methods of recovering compositions comprising nanowires and the product compositions are disclosed and claimed. The product compositions produced by these methods are able to provide equivalent performance to virgin raw materials in transparent conductive film manufacturing processes.07-05-2012
20110180764SILVER-CONTAINING POWDER, METHOD FOR PRODUCING THE SAME, CONDUCTIVE PASTE USING THE SAME, AND PLASTIC SUBSTRATE - The present invention relates to powder containing silver nanoparticles having an average particle size of 2 to 50 nm in an amount of 95% or more by mass and to applications of the powder. Silver-containing powder containing the silver nanoparticles is obtained by reducing a silver compound in the presence of a compound obtained by bonding polyethylene glycol to polyethyleneimine having a certain molecular weight and then by performing a concentration step and a drying step. A plastic substrate is obtained by directly applying a conductive paste that uses the powder on a plastic substrate and by performing drying.07-28-2011
20120168693SILVER-(CONJUGATED COMPOUND) COMPOSITE - A silver-(conjugated compound) composite comprising silver particles having a number-average Feret diameter of not more than 1,000 nm, and a conjugated compound having a weight-average molecular weight of not less than 3.0×1007-05-2012
20100270515ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH THE SAME, AND SEMICONDUCTOR DEVICE BONDED WITH THE SAME - The present invention provides a bonding material and a method of bonding for metal bonding at a bonding interface capable of a higher bonding strength at a lower temperature without application of pressure, compared to a bonding material of metal particles having an average particle size of not greater than 100 nm. An electrically conductive bonding material including (A) silver particles, (B) silver oxide, and (C) a dispersant including organic material containing not more than 30 carbon atoms as essential components, wherein a total amount of (A) the silver powder, (B) the silver oxide powder, and (C) the dispersant including an organic material containing not more than 30 carbon atoms is in a range of 99.0% to 100% by weight, is provided. In other words, no resin binder is contained.10-28-2010
20120228559CONDUCTIVE FINE PARTICLES AND ANISOTROPIC CONDUCTIVE MATERIAL - Conductive fine particles have core particle surfaces coated with a metal-plated coating film layer containing nickel and phosphorus and a multilayer conductive layer comprising a palladium layer as the outer surface. The phosphorus content in region A of the metal-plated coating film layer, at a distance of no greater than 20% of the thickness of the entire metal-plated coating film layer from the surface of the core particle, is 7-15 wt % of the entire region A. The phosphorus content in region B of the metal-plated coating film layer, at a distance of no greater than 10% of the thickness of the entire metal-plated coating film layer from the surface of the metal-plated coating film layer on the palladium layer side, is 0.1-3 wt % of the entire region B, and the phosphorus content of the entire metal-plated coating film layer is 7 wt % or greater.09-13-2012
20120228560CONDUCTIVE ADHESIVE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME - The present invention relates to a conductive adhesive, a method for manufacturing the same, and an electronic device including the same. The conductive adhesive includes: a conductive particle; a low-melting alloy powder including an alloy including Sn and at least one material selected from the group consisting of Ag, Cu, Bi, Zn, In, and Pb; a nano powder; a first binder including a thermosetting resin; and a second binder including a rosin compound.09-13-2012
20080296540METALLIC PARTICLES FOR ELECTROKINETIC OR ELECTROSTATIC DEPOSITION - Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.12-04-2008
20100327237CONDUCTIVE PARTICLE AND METHOD FOR PRODUCING CONDUCTIVE PARTICLE - A conductive particle 12-30-2010
20120298931VISCOSITY MODIFIER COMPOSITIONS AND METHODS - Disclosed are conductive coatings that exhibit improved clarity, uniformity, and mechanical strength. Such coatings comprising volatile viscosity modifiers are useful for electronics applications.11-29-2012
20120298930NANOSTRUCTURE COMPOSITIONS, COATINGS, AND FILMS - Stable multicomponent coating systems with superior coatability and stability are disclosed. Such stable coating systems comprising nanostructures, cellulosic polymers, and blocked isocyanates provide coatings and films exhibiting superior surface resistivity and crosslinking.11-29-2012
20120280186METAL-NANOPARTICLE-CONTAINING COMPOSITE, DISPERSION LIQUID THEREOF, AND METHODS FOR PRODUCING THE METAL-NANOPARTICLE-CONTAINING COMPOSITE AND THE DISPERSION LIQUID - Provided are a composite of nanoparticles of a metal such as gold, silver, a platinum metal, or copper, and a polymer, the composite allowing formation of a metal film having a sufficiently low resistivity in terms of practicality simply by drying at room temperature without requiring any special heating-baking step or any step of removing a protective agent with a solvent; a dispersion liquid of the composite; methods for producing the foregoing; and a plastic substrate formed from the dispersion liquid. When a dispersion liquid of a metal-nanoparticle-containing composite that is prepared by reducing metal ions in an aqueous medium in the presence of a (meth)acrylic-based copolymer having, as side chains, a polyethylene glycol chain and a phosphate residue represented by —OP(O)(OH)11-08-2012
20120280187FINE METAL PARTICLE-CONTAINING COMPOSITION - A fine silver particle-containing composition includes a large number of fine silver particles 11-08-2012
20090127518Electrically Conductive Powder and Production Thereof, Paste of Electrically Conductive Powder and Production of Paste of Electrically Conductive Powder - Electrically conductive powder includes polyhedral large particles and flakey small particles. The aspect ratio of the small particles is not less than 3 and is at least 1.3 times greater than that of the large particles. The electrically conductive powder is surface treated with a fatty acid. The electrically conductive powder has good contact among the polyhedral large particles and the flakey small particles. An electrically conductive paste of the electrically conductive powder achieves excellent electrical and thermal conductivities because the particles are in contact not at points but through surfaces. The electrically conductive paste is capable of filling via-holes in a satisfactory manner.05-21-2009
20120138872LEAD-FREE CONDUCTIVE COMPOUND FOR SOLAR CELL ELECTRODES - A lead-free conductive compound for a solar cell electrode including: a conductive powder; a glass frit; and a vehicle; the glass fit includes at least one kind of lead-free glass including 10 to 29 (mol %) of Bi06-07-2012
20100078602METAL NANOWIRE-CONTAINING COMPOSITION, AND TRANSPARENT CONDUCTOR - The present invention provides a metal nanowire-containing composition containing at a least metal nanowire and a heterocyclic compound having an interaction potential of less than −1 mV.04-01-2010
20130168613HIGH IMPACT STRENGTH CONDUCTIVE ADHESIVES - The high impact strength conductive adhesive is a mixture formed from a bisphenol A-based epoxy resin, a curing agent, and silver flakes. In one embodiment, the bisphenol A-based epoxy resin forms about 10.5 wt % of the mixture and the curing agent forms about 14.5 wt % of the mixture, the balance being silver flakes. In this embodiment, the curing agent is preferably an oligomeric polyamine curing agent, such as amidoamine-polyoxypropylenediamine t-butyl phenol. Each silver flake preferably has a tap density of between about 4.0 g/cm07-04-2013
20090173920BI-PHASE PLATINUM CATALYST, METHOD OF MANUFACTURING THE SAME, AND SOLAR CELL USING THE BI-PHASE PLATINUM CATALYST - A bi-phase platinum catalyst, a method of manufacturing the same, an electrode including the bi-phase platinum catalyst, and a solar cell including the electrode. The bi-phase platinum catalyst includes platinum particles and an amorphous metal oxide.07-09-2009
20080224102Black conductive thick film compositions, black electrodes, and methods of forming thereof - This invention is directed to black conductive compositions, black electrodes made from such compositions and methods of forming such electrodes. In particular, the invention is directed to a single layer bus electrode.09-18-2008
20130175485ELECTROCONDUCTIVE LIQUID RESIN COMPOSITION AND AN ELECTRONIC PART - An electroconductive liquid resin composition including epoxy resin; a curing agent, such that an equivalent ratio of the curing agent to the epoxy resin ranges from 0.8 to 1.25, wherein at least one of the components is liquid; a curing promoter in an amount of 0.05 to 10 parts by mass, per total 100 parts by mass of the resin and agent; an electroconductive filler in an amount of 300 to 1,000 parts by mass, per total 100 parts by mass of the resin and agent; and particles of a thermoplastic resin which is solid at 25 degrees C. in an amount of 3 to 50 parts by mass, per total 100 parts by mass of the resin and agent, wherein when the composition is heated, an average diameter of the particles after heated becomes at least one and a half times an average diameter of the particles before heated.07-11-2013
20130092884THICK FILM PASTE CONTAINING BISMUTH-TELLURIUM-OXIDE AND ITS USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES - The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Pb-free bismuth-tellurium-oxide both dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode. The present invention is also directed to the bismuth-tellurium oxide that is a component of thick film pastes.04-18-2013
20130099177THICK FILM SILVER PASTE CONTAINING AL2O3 AND LEAD-TELLURIUM-OXIDE AND ITS USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES - The present invention is directed to a thick film silver paste comprising (i) silver, (ii) Al04-25-2013
20130099178THICK FILM SILVER PASTE AND ITS USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES - The present invention is directed to an electroconductive silver thick film paste composition comprising Ag, a glass frit and rhodium resinate, Cr04-25-2013
20130140501SILVER-COATED SPHERICAL RESIN, METHOD FOR PRODUCING SAME, ANISOTROPICALLY CONDUCTIVE ADHESIVE CONTAINING SILVER-COATED SPHERICAL RESIN, ANISOTROPICALLY CONDUCTIVE FILM CONTAINING SILVER-COATED SPHERICAL RESIN, AND CONDUCTIVE SPACER CONTAINING SILVER-COATED SPHERICAL RESIN - This silver-coated spherical resin includes: a spherical resin; and silver coated on a surface of the spherical resin, wherein an amount of the silver is in a range of 2 to 80 parts by mass with respect to 100 parts by mass of the silver-coated spherical resin, and a crystallite diameter of the silver measured by X-ray diffractometry is in a range of 18 to 24 nm. This method for producing a silver-coated spherical resin includes: a process of subjecting a spherical resin to a pretreatment using an aqueous solution of a tin compound; and a subsequent process of subjecting the spherical resin to an electroless silver plating using a reducing agent, wherein, during the pretreatment, a temperature of the aqueous solution of the tin compound is set to be in a range of 20 to 45° C.06-06-2013
20100276647SILVER PARTICLES AND PROCESSES FOR MAKING THEM - There is disclosed a silver powder comprising silver particles, each said silver particle comprising silver components 100-500 nm long, 80-100 nm wide, and 80-100 nm thick, assembled on the surface of silver to form a spherically-shaped, open structured particle, wherein the surface of the particle resembles the surface of an orange rind and the d11-04-2010
20130119322CONDUCTIVE SINTERED LAYER FORMING COMPOSITION - There is provided a conductive sintered layer forming composition and a conductive sintered layer forming method that can lower heating temperature and shorten heating time for a process of accelerating sintering or bonding by sintering of metal nano-particles coated with an organic substance. The conductive sintered layer forming composition may be obtained by utilizing a phenomenon that particles may be sintered at low temperature by mixing silver oxide with metal particles coated with the organic substance and having a grain size of 1 nm to 5 μm as compared to sintering each simple substance. The conductive sintered layer forming composition of the invention is characterized in that it contains the metal particles whose surface is coated with the organic substance and whose grain size is 1 nm to 5 μm and the silver oxide particles.05-16-2013
20110233481Fluorinated silver paste for forming electrical connections in highly dielectric films, and related products and methods - Certain example embodiments of this invention relate to silver pastes that are capable of making an electrical connection with at least one conductive layer in a layer stack, even where the at least one conductive layer is protected by one or more strong dielectric layers, and/or methods of making the same. Certain example embodiments include a chemically modified silver paste that may be cured or fired using a standard glass tempering furnace (e.g., an electrical or gas-fuelled furnace) or a short-wave infrared heating process at temperatures below 750 degrees C. In certain example embodiments, the fluorine causes apertures or micro-factures in the dielectric layer(s), which allows the silver in the paste to move therethrough (e.g., by capillary action) to form a contact with the conductive layer(s).09-29-2011
20110272642COMPOSITION CONTAINING FINE SILVER PARTICLES, PRODUCTION METHOD THEREOF, METHOD FOR PRODUCING FINE SILVER PARTICLES, AND PASTE HAVING FINE SILVER PARTICLES - A composition containing fine silver particles which have a uniform particle size, can form a fine drawing pattern, and have a small environmental impact, a method for producing that composition, a method for producing fine silver particles, and a paste having fine silver particles are provided.11-10-2011
20130126799ELECTROCONDUCTIVE FILM, TOUCH PANEL AND SOLAR BATTERY - An electroconductive film including: electroconductive fibers, wherein the electroconductive film satisfies the following expression: 0.0105-23-2013
20130126798METHOD FOR PRODUCING A METAL NANOPARTICLE COLLOID - The problems can be solved by using a method for producing a metal nanoparticle colloid, which comprises the steps of S05-23-2013
20130153835LOW-TEMPERATURE SINTERING CONDUCTIVE PASTE, CONDUCTIVE FILM USING THE SAME, AND METHOD FOR FORMING CONDUCTIVE FILM - When a substrate having a low heat resistance is used, heat treatment at approximately 120° C. at which deformation does not occur is desirable. When a low resistance is achieved regardless of the type of resin used for a conductive paste, a flexible design of a paste is possible according to purposes, and fields to which the paste could be applied are expanded. Thus, a conductive paste capable of forming a conductive film exhibiting a high conductivity even at low temperatures of approximately 120° C. regardless of whether the constituting resin is a thermosetting resin or a thermoplastic resin is provided. In a method for forming a conductive film, a conductive paste in which a dicarboxylic acid having 2 to 8 carbon atoms is added to a paste including silver nanoparticles coated with an organic substance having 2 to 6 carbon atoms, a dispersion medium, and a resin is used.06-20-2013
20110278508COMPOSITION CONTAINING FINE SILVER PARTICLES, PRODUCTION METHOD THEREOF, METHOD FOR PRODUCING FINE SILVER PARTICLES, AND PASTE HAVING FINE SILVER PARTICLES - A composition containing fine silver particles which have a uniform particle size, can form a fine drawing pattern, and have a small environmental impact, a method for producing that composition, a method for producing fine silver particles, and a paste having fine silver particles are provided.11-17-2011
20110309312PASTE COMPOSITION FOR SOLAR CELL ELECTRODE - It is provided a paste composition for a solar cell electrode containing a conductive powder, a glass frit, and a vehicle, the glass frit being made of glass containing PbO, B12-22-2011
20130187102SINTERABLE SILVER FLAKE ADHESIVE FOR USE IN ELECTRONICS - A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition.07-25-2013
20130187101THICK FILM SILVER PASTE CONTAINING COPPER AND LEAD-TELLURIUM-OXIDE AND ITS USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES - The present invention is directed to a thick film silver paste comprising (i) silver, (ii) copper, and (iii) a Pb—Te—O all dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste and a semiconductor device and, in particular, a solar cell comprising such an electrode. The electrodes provide good electrical performance.07-25-2013
20130187100POLYMER THICK FILM SOLDER ALLOY CONDUCTOR COMPOSITION - The invention is directed to a polymer thick film composition comprising solder alloy powder and organic medium comprising organic polymeric binder and solvent. The composition may be processed at a time and temperature necessary to remove all solvent. The invention is further directed to method(s) of electrode formation on circuits using such compositions and to articles formed from such methods and/or compositions.07-25-2013
20120018682Composite Thermoelectric Material and Method for Producing the Same - The present disclosure provides a thermoelectric material which can be formed into a flexible and thin type material. The thermoelectric material is a composite that includes a binder resin, thermoelectric material particles dispersed in the binder resin, and fine metal particles supported on a surface of the thermoelectric material particles.01-26-2012
20130200313HYBRID PARTICLES AND ASSOCIATED METHODS - Hybrid particles that comprise a coating surrounding a chalcopyrite material, the coating comprising a metal, a semiconductive material, or a polymer; a core comprising a chalcopyrite material and a shell comprising a functionalized chalcopyrite material, the shell enveloping the core; or a reaction product of a chalcopyrite material and at least one of a reagent, heat, and radiation. Methods of forming the hybrid particles are also disclosed.08-08-2013
20130200312Composition Of Palladium Unsaturated Organoamine Complex and Palladium Nanoparticles - A palladium first composition is disclosed, including a palladium salt and an unsaturated organoamine, wherein the composition is substantially free of water, and wherein the first composition forms a second composition including stable palladium nanoparticles and a palladium unsaturated organoamine. The composition permits the use of solution processing methods to form a palladium layer on a wide variety of substrates, including in a pattern to form circuitry or pathways for electronic devices.08-08-2013

Patent applications in class Noble metal (gold, silver, ruthenium, rhodium, palladium, osmium, iridium, platinum)