Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees

Metal compounds or inorganic components (except water)

Subclass of:

252 - Compositions


252073000 - Organic components

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
252075000 Organic compounds of nonmetals other than C, H, and O 44
252076000 Carboxylic organic compounds containing 18
20130032752HEAT CONDUCTIVE ELASTOMER COMPOSITION - The object of the present invention is to provide a heat conductive elastomer composite useful as the heat radiating member of electric parts or electronic parts, or the like. In the present invention, an aluminum hydroxide having a surface covered with an organic coupling agent and/or an inactivated magnesium oxide, being a magnesia clinker having a surface covered with an inorganic substance and/or an organic substance, is (are) combined as heat conductive filler(s) in an elastomer composite mainly composed of a styrenic elastomer.02-07-2013
20090152491Thermally conductive resin compositions - Thermally conductive polymer resin compositions comprising polymer, spherical or granular shape thermally conductive filler, and platy thermally conductive filler, and optionally a polymeric toughening agent. The compositions are particularly useful for metal/polymer hybrid parts.06-18-2009
20120217434THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATIVE POLYMER COMPOSITIONS CONTAINING A THERMALLY INSULATIVE FILLER AND USES THEREOF - Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a thermally insulative filler with an intrinsic thermal conductivity less than or equal to 10 W/mK; and c. from 5 to 15 vol % of a thermally conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; ii. a thermal conductivity of at least 7 times the total filler volume fraction times the thermal conductivity of the pure thermoplastic polymer; and iii. a volume resistivity of at least 1008-30-2012
20110127461THERMALLY CONDUCTIVE COMPOSITION AND METHOD FOR PRODUCING THEM - Disclosed is a thermally conductive composition obtained by a sol-gel method in which a sol containing inorganic particles, an alkoxysilane, and water is prepared, the sol is gelated to prepare a gel, and the gel is thermally cured.06-02-2011
20080302998Carbon nanoparticle-containing hydrophilic nanofluid with enhanced thermal conductivity - The present invention relates to a nanofluid that contains carbon nanoparticles, metal oxide nanoparticles and a surfactant in a thermal transfer fluid. The present invention also relates to processes for producing such a nanofluid with enhanced thermal conductive properties.12-11-2008
20110155948Polyamide Based Resin Composition Having Excellent Whiteness, Thermal Conductivity, and Extruding Moldability - The present invention provides a polyamide resin composition that can have good whiteness, thermal conductivity and extrusion molding properties, which includes (A) polyamide resin; (B) heat conductive filler; (C) filler; and (D) thermoplastic resin which is miscible with the polyamide resin and has a weight average molecular weight of about 500,000 to about 5,000,000.06-30-2011
20110140034COMPOSITE FOR HEAT-DISSIPATING FILM - A composite for coating and sputtering a heat-dissipating film, wherein composite contains silicon carbide, resin, and dilute solvent which are mixed and blended to be capable of being coated, sputtered, and cured into a heat-dissipating film of a specific thickness. As such, the heat-dissipating performance could be conveniently enhanced. here is no need to rely on heat-sinking fins of large surface area. The production cost is reduced, recycling is easier, and the highly contaminating anodizing treatment could be avoided, while the robustness against erosion and harsh weather is still maintained.06-16-2011
20110168942CARBON FIBROUS AGGREGATOR, METHOD FOR MANUFACTURING THEREOF, AND COMPOSITE MATERIAL INCLUDING THEREOF - Disclosed is a carbon fibrous aggregator obtained by a chemical vapor phase growing method, which comprises plural granular parts, and plural carbon fibers which are mutually independently extended outwardly from their respective granular parts so that each granular part is associated with two or more of carbon fibers, wherein the carbon fibers show a three dimensional expansion in all; and 07-14-2011
20120097887HIGH THERMAL CONDUCTIVITY METAL MATRIX COMPOSITES - Discontinuous diamond particulate containing metal matrix composites of high thermal conductivity and methods for producing these composites are provided. The manufacturing method includes producing a thin reaction formed and diffusion bonded functionally graded interactive SiC surface layer on diamond particles. The interactive surface converted SiC coated diamond particles are then disposed into a mold and between the particles and permitted to rapidly solidify under pressure. The surface conversion interactive SiC coating on the diamond particles achieves minimal interface thermal resistance with the metal matrix which translates into good mechanical strength and stiffness of the composites and facilitates near theoretical thermal conductivity levels to be attained in the composite. Secondary working of the diamond metal composite can be performed for producing thin sheet product.04-26-2012
20100133465DISPERSANT CONTAINING METAL COMPLEX FOR CARBON NANOTUBE - Disclosed is a composite formed by physical and chemical bonding of (a) a carbon nanotube (CNT); and (b) a metal complex with at least one kind of ligand coordinated to a central metal, the CNT being connected to the metal within the metal complex by a direct bond to the metal. Also, provided is a dispersant for a CNT containing a metal complex comprising (i) a complex ion with at least one kind of ligand (Ln) chemically bonded to a central metal; and (ii) a counter ion. By using a metal complex as a dispersant for a CNT, various characteristics possessed by the metal complex can be provided to the CNT, and the dispersibility of the CNT can be meaningfully increased by introducing a ligand and/or a counter ion having dispersion medium-affinitive properties. 06-03-2010
20100283001HEAT-PROCESSABLE THERMALLY CONDUCTIVE POLYMER COMPOSITION - The present invention relates to a heat-processable thermally conductive polymer composition comprising (a) 30 to 95% by weight of a thermoplastic polymer (b) 5 to 40% by weight of a graphite powder; and (c) 0 to 65% by weight of optional further component(s), wherein the particles of the graphite powder are in the form of platelets having a thickness of less than 500 nm, and a process for the preparation heat-processable thermally conductive polymer composition.11-11-2010
20110204280THERMAL INTERFACE MATERIALS INCLUDING THERMALLY REVERSIBLE GELS - Thermal interface materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a thermal interface material includes at least one thermally conductive filler in a thermally reversible gel.08-25-2011
20100200801THERMAL INTERFACE MATERIALS AND METHODS FOR MAKING THEREOF - A thermal interface material is constructed from a base matrix comprising a polymer and 5 to 90 wt. % of boron nitride filler having a platelet structure, wherein the platelet structure of the boron nitride particles are substantially aligned for the thermal interface material to have a bulk thermal conductivity of at least 1 W/mK.08-12-2010
20110140033GRAPHITE MICROFLUIDS - Fluids comprising graphite particles and related methods are generally described. In some embodiments, “microfluids” are described. Generally, the microfluids can comprise a fluid and a plurality of graphite particles with microscale dimensions.06-16-2011
20100187468COMPOSITE HYDROGEN STORAGE MATERIAL AND METHODS RELATED THERETO - Embodiments of the invention relate to a composite hydrogen storage material comprising active material particles and a binder, wherein the binder immobilizes the active material particles sufficient to maintain relative spatial relationships between the active material particles.07-29-2010
20100213403THERMALLY CONDUCTIVE THERMOPLASTIC PRESSURE SENSITIVE ADHESIVE COMPOSITION - It is an object of the present invention to provide a thermally conductive thermoplastic pressure sensitive adhesive composition excellent in thermal conductivity, which can be used for lamination of a glass panel of a plasma display or a radiator plate of electronic devices etc., and can disassemble easily in product repair or after ending of life cycle. The present invention is a thermally conductive thermoplastic pressure sensitive adhesive composition characterized by having, as essential components: (A) liquid rubber; (B) at least either of styrene-based rubber and an amorphous olefin-based resin; (C) a tackifier resin; and (D) graphite, where formulation amount of graphite of the (D) component is in a range of from 30 to 75% by mass relative to total mass of the composition.08-26-2010
20100219369COMPOSITION OF THERMAL INTERFACE MATERIAL - A composition of a thermal interface material is provided. The deficiencies of low thermal conductivity and high thermal resistance in the conventional thermal interface materials are resolved. By using carbon fibers with high thermal conductivity, the thermal conductivity of the thermal interface material can be about 7˜10 times higher than the traditional thermal interface materials. The added amount of carbon fibers is less than the added amount of metal or ceramic powders. The dispersion process is thereby improved. Further, the thermal interface material has a phase change temperature at about 40˜65° C. Holes, gaps and dents on the surface of device are filled at the normal operation temperature of device to reduce the thermal resistance of the entire device and to increase the interfacial bonding strength.09-02-2010
20110101265CARBON NANOFIBER, PRODUCING METHOD AND USE OF THE SAME - A catalyst for producing a carbon nanofiber is obtained by dissolving or dispersing [I] a compound containing Fe element; [II] a compound containing Co element; [III] a compound containing at least one element selected from the group consisting of Ti, V, Cr, and Mn; and [IV] a compound containing at least one element selected from the group consisting of W and Mo in a solvent to obtain a solution or the fluid dispersion, and then impregnating a particulate carrier with the solution or the fluid dispersion. A carbon nanofiber is obtained by bringing a carbon element-containing compound into contact with the catalyst in a vapor phase at a temperature of 300 degrees C. to 500 degrees C.05-05-2011
20110163261COMPOSITION - A composition for controlling a temperature elevation of an electronic component when soldering the electronic component on a substrate, includes a first resin for providing the composition with adhesion to the electronic component, a curing agent for curing the first resin by heat treatment for soldering, and a second resin for facilitating removal of the composition from the electronic component.07-07-2011
20110163260GLYCERIN-CONTAINING ANTIFREEZING AGENT CONCENTRATES WITH CORROSION PROTECTION - The present invention relates to antifreeze/anticorrosion concentrates comprising from 10 to 50% by weight, based on the total amount of the concentrate, of glycerol, to processes for preparing such concentrates from superconcentrates, to aqueous coolant compositions from these concentrates, and to their use, for example in internal combustion engines.07-07-2011
20100283000STRUCTURAL BODY COMPRISING FILLER AND INCOMPATIBLE RESIN OR ELASTOMER, AND PRODUCTION PROCESS OR USE THEREOF - The present invention provides a novel structure in which a filling material that is a filler is dispersed in an incompatible resin selected from a thermoplastic resin or a thermosetting resin and/or an incompatible elastomer; and use of the novel structure. In a cocontinuous structure formed from a binary system that is selected from an incompatible resin selected from a thermoplastic resin or a thermosetting resin and/or an incompatible elastomer, a filling material that is a filler is dispersed selectively and uniformly in one of the incompatible resin selected from the thermoplastic resin or the thermosetting resin and/or the incompatible elastomer. The structure is obtained by putting the filling material and the resin and/or the elastomer in a cylinder having a screw through a put-in part provided at an end of a melt-kneading part having a heating part; processing the resin or elastomer under the conditions where a rotation speed of the screw is 100 rpm to 3000 rpm and a shear rate is 150 to 4500 sec11-11-2010
20110147646MODIFIED BISMALEIMIDE RESINS, PREPARATION METHOD THEREOF AND COMPOSITIONS COMPRISING THE SAME - A modified bismaleimide resin of Formula (I) or (II) is provided.06-23-2011
20110024674COOLANT COMPOSITION - The disclosed embodiments include coolant compositions, packages of such compositions, and articles of manufacture derived from coolant compositions. According to one embodiment disclosed a liquid coolant composition is disclosed that comprises: (a) glycerol, (b) an aqueous solution of menthol, (c) calcium hydroxide, (d) barium hydroxide, and (e) water. According to another embodiment, a gel coolant composition is disclosed that comprises: (a) glycerol, (b) an aqueous solution of menthol, (c) calcium hydroxide, (d) barium hydroxide, (e) water, and (f) sodium polyacrylate. Such gel coolant composition can be converted to solid form by adding paraffin.02-03-2011
20120097886NANOCOMPOSITES INCLUDING CARBON NANOTUBES HAVING METAL NANOPARTICLES - Compositions include a multi-walled nanotube including metal nanoparticles. The metal nanoparticles are bound to the multi-walled nanotube through functional groups on a surface of the multi-walled nanotube.04-26-2012
20110073798HIGH THERMAL CONDUCTIVITY AND LOW DISSIPATION FACTOR ADHESIVE VARNISH FOR BUILD-UP ADDITIONAL INSULATION LAYERS - A high thermal conductivity and low dissipation factor adhesive varnish for (build-up) combining additional insulation layers is disclosed to be used for high-density interconnected printed circuit boards or IC-package substrates and to be formed by well mixing an epoxy resin precursor, a bi-hardener mixture, a catalyst, a flow modifier, an inorganic filler with high thermal conductivity, and a solvent. The epoxy resin precursor is formed by mixing at least two epoxy resins with a certain ratio, where the at least two epoxy resins are selected from a group including a tri-functional epoxy resin, a rubber-modified or Dimmer-acid-modified epoxy resin, a bromide-contained epoxy resin, a halogen-free/phosphorus-contained epoxy resin, a halogen-free/phosphorus-free epoxy resin, a long-chain/halogen-free epoxy resin, and a bisphenol A (BPA) epoxy resin.03-31-2011
20110315916CURABLE COMPOSITION - A conductive curable resin composition including (a) at least one vinylarene oxide, (b) at least one curing agent, and (c) at least one conductive filler; a process for making the above curable resin composition; and a cured resin composition made therefrom. The curable resin composition when cured produces a thermoset having a higher heat resistance after cure than analogous prior art compositions. The curable compositions of the present invention are advantageously useful, for example, as a die attach adhesive for semiconductor packaging material thermoset materials.12-29-2011
20110049415Fabrication Method of ZNO Nano-Particle and Fabrication Method of ZNO Nano-Fluid Using Thereof - Provided are a method for preparing zinc oxide (ZnO) nanoparticles and a method for preparing ZnO nanofluid using the same. The method for preparing ZnO nanoparticles includes: a) heating deionized water; b) dissolving zinc (Zn) salt in the deionized water to prepare a precursor solution; c) adding solid alkali salt to the precursor solution to prepare a dispersion of ZnO nanoparticles; and d) separating the ZnO nanoparticles by solid-liquid separation and washing them with deionized water. Highly pure, crystalline ZnO nanoparticles with spherical shape and very narrow particle size distribution of 10 to 50 nm can be prepared quickly and at large scale and low cost using inexpensive materials via a stable low-temperature process, without using a dispersant. The associated low-temperature, normal-pressure process produces few harmful materials and may be easily employed for production of ZnO nanoparticles.03-03-2011
20120153216High Transverse Thermal Conductivity Fiber Reinforced Polymeric Composites - High thermal conductivity sintered metallic networks are provided for enhancing the transverse thermal conductivity of fiber reinforced polymeric materials. The approach establishes sintered metallic networks in both the intratow and interlaminar regions of a FRP part after appropriate thermal processing Dispersing metallic nanoparticles into a fluxing polymeric resin, and optionally mixing in low and high melting point metallic particles, can establish continuous metallurgical networks through the thickness of a FRP laminate. The fluxing polymeric resin has the dual benefit of reducing native oxides on the metallic fillers to aid the sintering reactions, and also to tailor the rheological properties to yield usable material embodiments with limited impact on material density. The high intrinsic thermal conductivity of the metallic networks yields a FRP part with enhanced transverse thermal conductivity.06-21-2012
20120313033Method for Making a Highly Thermally Conductive Composite - Disclosed is a method for making a highly thermally conductive composite. At first, paraffin wax is subjected to apparent modification. Expandable graphite is oxidized and organically modified. The modified paraffin wax is melted and mixed with the modified expandable graphite so that the modified expandable graphite is evenly distributed in the modified paraffin wax. With the expandable graphite, which exhibits an excellent heat transfer coefficient, the thermal conductivity of the paraffin wax is improved. The melting and solidifying rates of the paraffin wax are improved.12-13-2012
20120256121METHOD FOR PRODUCING GRAPHENE SOLUTIONS, GRAPHENE ALKALI METAL SALTS, AND GRAPHENE COMPOSITE MATERIALS - The present invention relates to a process for preparing graphene solutions by means of alkali metal salts, to graphene solutions, to processes for preparing graphene alkali metal salts, to graphene alkali metal salts and to graphene composite materials and to processes for producing the graphene composite materials.10-11-2012
20120228542THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATIVE POLYMER COMPOSITIONS CONTAINING A LOW THERMALLY CONDUCTIVE FILLER AND USES THEREOF - Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a low thermally conductive, electrically insulative filler with an intrinsic thermal conductivity of from 10 to 30 W/mK; c. from 5 to 15 vol % of a high thermally conductive, electrically insulative filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK; and d. from 5 to 15 vol % of a high thermally conductive, electrically conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; and ii. a volume resistivity of at least 1009-13-2012
20100207056SELF ORIENTING MICRO PLATES OF THERMALLY CONDUCTING MATERIAL AS COMPONENT IN THERMAL PASTE OR ADHESIVE ADHESIVE - The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.08-19-2010
20100276630PROCESS FOR UNIFORM AND HIGHER LOADING OF METALLIC FILLERS INTO A POLYMER MATRIX USING A HIGHLY POROUS HOST MATERIAL - A method relating to making a metal coated filler includes mixing a solution of an organic diol with a plurality of porous filler particles to obtain a support mixture; contacting a metal salt solution with the support mixture forming a reaction mixture; and heating the reaction mixture to a temperature within a temperature range from about 50 degrees Celsius to about 200 degrees Celsius. The metal cations in the metal salt solution are reduced to metal particles by the organic diol and are disposed on the porous filler particles and on filler particle pore surfaces. The metal coated filler may then be optionally isolated. Electrically and/or thermally conductive articles including the metal coated fillers and methods for their manufacture are also disclosed.11-04-2010
20080197318HEAT TRANSPORT MEDIUM - Carbon nanotubes, which carry surface functional groups on side walls thereof relative to lengths thereof, and a dispersant are added to a base liquid to provide a heat transport medium capable of achieving high heat conductivity while suppressing an increase in kinetic viscosity.08-21-2008
20130200296POLYMER NANOCOMPOSITE CONTAINING GLASS FIBER COATED WITH METAL-CARBON NANOTUBE AND GRAPHITE AND METHOD OF PREPARING THE SAME - The present disclosure relates to a polymer nanocomposite including a metal-carbon nanotube coated glass fiber and graphite, in which a metal-carbon nanotube coated glass fiber serving as an electromagnetic wave shielding material is hybridized with graphite having an excellent heat conductivity, thereby improving the electromagnetic wave shielding performance in a low frequency range. The polymer nancomposite according to the disclosure is broadly applicable to a variety of fields requiring electromagnetic wave shielding performance such as, for example, various electronic component housings for a vehicle, components of an electric vehicle, a mobile phone, and a display device, and a method of preparing the polymer nanocomposite.08-08-2013
20130200297THERMALLY CONDUCTIVE AND DIMENSIONALLY STABLE LIQUID CRYSTALLINE POLYMER COMPOSITION - A thermally conductive polymer composition is disclosed including liquid crystalline polymer; graphite, talc and low aspect fibrous filler. The composition has a thermal conductivity of at least about 3 W/m·K.08-08-2013
20130200298THERMAL CONDUCTIVE SHEET - A thermal conductive sheet contains boron nitride particles, an epoxy resin, and a curing agent. The epoxy resin contains a crystalline bisphenol epoxy resin and the curing agent contains a phenol resin having a partial structure represented by the following formula (1).08-08-2013
20130207028HEAT-PROTECTION MATERIAL - A heat protection material for a surface, made of a mixture comprising a resin, cork granules and refractory fibers, wherein the proportion of cork granules in the mixture is 08-15-2013
20130207027HEAT-PROTECTION MATERIAL - A heat protection material for a surface, made of a mixture comprising a resin, cork granules and refractory fibers; the proportion of cork granules in the mixture is 50 to 80% by mass, wherein the corresponding proportion of refractory fibers in the mixture is 1 to 11% by mass.08-15-2013

Patent applications in class Metal compounds or inorganic components (except water)

Patent applications in all subclasses Metal compounds or inorganic components (except water)