Class / Patent application number | Description | Number of patent applications / Date published |
228046000 | WITH MEANS TO COOL WORK OR PRODUCT | 6 |
20080237300 | Method and apparatus for soldering interconnectors to photovoltaic cells - A method and apparatus for soldering interconnectors to photovoltaic cells that, after soldering, prevents bending of the photovoltaic cells due to heat warping caused by heat contraction of the lead wires. The interconnectors are positioned at predetermined positions on the photovoltaic cell, the interconnectors and the photovoltaic cells are held tightly together, and the solder is melted as the photovoltaic cells are heated, after which the photovoltaic cells are sequentially cooled in the long direction of the interconnectors with cold blasts from the end of the photovoltaic cells in the long direction of the interconnector. | 10-02-2008 |
20100001040 | DEVICE AND METHOD FOR BRAZING A HEAT PIPE - The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor. | 01-07-2010 |
20100170934 | METHODS AND SYSTEMS FOR MITIGATING RESIDUAL TENSILE STRESSES - Residual tensile stresses can be mitigated through methods and systems provided by the present invention. Such a method can include securing a metal member ( | 07-08-2010 |
20110049220 | ASSEMBLY FOR HEAD WELDING - The assembly is intended for application to manufacturing of tubes, bottles, boxes. Characterized by improved quality of the weld and low reject percentage. It has a mandrel ( | 03-03-2011 |
20110198388 | Flux-free chip to wafer joint serial thermal processor arrangement - A serial thermal processing arrangement for treating a pre-assembled chip/wafer assembly of semiconductor material in a rotary processor, through a series of intermittent, rotatively advanced, movements into independent, temperature and pressure controlled, circumferentially disposed chambers, | 08-18-2011 |
20150090768 | Soldering Apparatus and Manufacturing Method of Soldered Product - An excellent soldering apparatus and manufacturing method of soldered product are provided where a workpiece can be efficiently soldered in a short cycle time. The soldering apparatus includes a thermal radiation heater and two coolers for cooling the workpiece which sandwich the heater therebetween. The coolers are movable between a standby position and a cooling position and form a recessed portion in which the heater is placed. The coolers move to the standby position where the coolers are separated from the workpiece and stand by such that the heater is in a state of protruding from the recessed portion while the heater heats the workpiece. The coolers can move from the standby position to the cooling position to cool the workpiece. | 04-02-2015 |