Class / Patent application number | Description | Number of patent applications / Date published |
228008000 | WITH CONTROL MEANS RESPONSIVE TO SENSED CONDITION | 30 |
20080197168 | Wire Cleaning Guide - A wire cleaning guide for guiding a wire in a feed direction and to clean the wire, including a gas supply nozzle for supplying plasma generating gas, a plasma generating chamber with plasma generating gas supplied from the gas supply nozzle thereto for transforming the plasma generating gas into plasma by energizing a bonding wire that passes there through to clean the wire by means of the plasma gas, and wire-feeder-side and bonding-tool-side guide holes for guiding the wire in the feed direction, the diameter of the wire-feeder-side guide hole is greater than that of the bonding-tool-side guide hole so that the outflow rate of gas after wire cleaning flowing between the wire-feeder-side guide hole and the wire is greater than that of gas after wire cleaning flowing between the bonding-tool-side guide hole and the wire. | 08-21-2008 |
20080290136 | SOLDER SUPPLYING METHOD - Amounts of a solder are controlled to supply onto the respective connection terminals with different opening diameters such that a difference between contents of a substance diffused from the connection terminals into the solder, which is present in the solder after reflow on the connection terminals with the different opening diameters becomes equal to or smaller than 0.2 wt %. | 11-27-2008 |
20100308102 | SOLDER HANDLING TEMPERATURE CONTROLLER WITH TEMPERATURE LOCK MECHANISM - A solder handling temperature controller comprises a body ( | 12-09-2010 |
20120104074 | APPARATUS FOR MOUNTING SEMICONDUCTOR CHIP - Provided are an apparatus and a method for mounting a semiconductor chip. The semiconductor chip mounting apparatus includes a flux reservoir, a flux reservoir moving unit, a wafer support part, a wiring board support part, a transfer head, and a mounting head. The flux reservoir includes an accommodation recess in an upper surface to accommodate flux. The flux reservoir moving unit linearly moves the flux reservoir. The wafer support part is adjacent to a moving path of the flux reservoir and supports a wafer including a semiconductor chip. The wiring board support part is adjacent to the moving path and supports a wiring board. The transfer head picks up and places the semiconductor chip in the accommodation recess. The mounting head picks up the semiconductor chip from the accommodation recess and mounts the semiconductor chip on the wiring board through a surface mount process. | 05-03-2012 |
20120125974 | COMPLETE FLOOR WELDING SYSTEM FOR VARIOUS VEHICLE MODELS - The present disclosure relates to a welding system applied to a chassis assembly line for vehicles, and more particularly to a complete floor welding system for various vehicle models. The complete floor welding system for various vehicle models adapted to perform a welding operation after determining and regulating positions of welding spots different according to models of vehicles, comprises: at least one external unit for welding a plurality of parts disposed in a key welding process of a complete floor welding line and having an automatic spot welding gun, the external unit being configured to determine a position according to a model of a vehicle and enter a complete floor from three sides of the complete floor to perform a welding operation; a post structure for installing the external unit; and a controller configured to control the external unit. | 05-24-2012 |
20120160897 | WIRE FEEDER WIRE DRIVE DESIGN - A system and method of feeding wire is provided using at least one roller which is biased towards the wire. The at least one roller is permitted to deflect a limited amount during the wire feeding operation. The roller is permitted to deflect 50% or less than the wire diameter during feeding to prevent tangling. | 06-28-2012 |
20140151437 | APPARATUS FOR MOUNTING SEMICONDUCTOR CHIPS ON A CIRCUIT BOARD - A chip mounting apparatus includes a loading unit, a combining unit and a bonding unit. The loading unit loads a circuit board having contact pads and semiconductor chips having solder balls into the chip mounting apparatus. The combining unit positions the semiconductor chip onto a respective mounting area of the circuit board and combines the solder balls of the semiconductor chip with the contact pads of the circuit board by using flux. The combining unit has a flux coater for coating the solder balls with the flux and a flux controller for automatically supplementing the flux to the flux coater. The bonding unit bonds the solder balls to the respective contact pads by a reflow process. | 06-05-2014 |
20150314401 | PORTABLE EQUIPMENT FOR MONITORING AND CONTROLLING THE LEVEL OF OXYGEN IN REFLOW OVEN ATMOSPHERE - The present invention describes a portable device for monitoring and controlling the level of residual oxygen in re-flow oven atmosphere ( | 11-05-2015 |
20150380380 | SYSTEMS AND METHODS FOR DETERMINING AND ADJUSTING A LEVEL OF PARALLELISM RELATED TO BONDING OF SEMICONDUCTOR ELEMENTS - A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation. | 12-31-2015 |
20160375524 | TIME OF FLIGHT CAMERA FOR WELDING MACHINE VISION - A machine-vision-assisted welding system comprises welding equipment, a time of Flight (ToF) camera operable to generate a three-dimensional depth map of a welding scene, digital image processing circuitry operable to extract welding information from the 3D depth map, and circuitry operable to control a function of the welding equipment based on the extracted welding information. The welding equipment may comprise, for example, arc welding equipment that forms an arc during a welding operation, and a light source of the ToF camera may emit light whose spectrum comprises a peak that is centered at a first wavelength, wherein the first wavelength is selected such that a power of the peak is at least a threshold amount above a power of light from the arc at the first wavelength. | 12-29-2016 |
228009000 | Work-responsive (e.g., temperature, orientation of work, etc.) | 19 |
20080257937 | Electronic Component Mounting System, Electronic Component Mounting Device, and Electronic Component Mounting Method - To provide an electronic component mounting system, an electronic component placing device, and an electronic component mounting method, which can prevent waste due to the place of an electronic component onto a unit substrate having a print failure. | 10-23-2008 |
20080283578 | Methods and Apparatus for Wire Bonding with Wire Length Adjustment in an Integrated Circuit - An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area. | 11-20-2008 |
20090057372 | CONDUCTIVE BALL MOUNTING APPARATUS - A conductive ball mounting apparatus includes a stage including a placement surface, stage moving means that moves the stage between a supply position and a mounting position, mounting means that comprises an array mask and mounts the conductive ball to the object to be mounted via the array mask, elevating means that changes a distance between the array mask of the mounting means and the placement surface of the stage, and thickness measuring means provided at the supply position so as to measure a thickness of the object to be mounted placed on the placement surface. The thickness of the object to be mounted is measured at the supply position, and the conductive ball is mounted by controlling the elevating means to set a distance between an upper surface of the array mask and an upper surface of the object to be mounted at the mounting position to a predetermined value in accordance with the measured thickness. | 03-05-2009 |
20100270357 | SOLDER BALL PRINTING APPARATUS - The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. | 10-28-2010 |
20110284618 | MICRO-BUMP FORMING APPARATUS - A micro-bump forming apparatus includes: a film attachment mechanism that attaches a film on a surface of a substrate; exposure and developing mechanisms that provide openings in the film on electrodes formed on the substrate; a solder ball loading mechanism that loads solder balls into the openings, a flux printing mechanism that prints flux through the openings loaded with the solder balls; a reflow part that heats the solder balls to form solder bumps; and a film detachment mechanism that detaches the film from the surface of the substrate. After a loading head loads the solder balls into the openings of the film, a controller of the solder ball loading mechanism allows a line sensor to operate to check a loading state of the solder balls, and determines, based on the check result, whether to reload the solder balls. | 11-24-2011 |
20120031952 | BOARD PRINTING SYSTEM - A board printing system is provided with a printing apparatus for printing solder paste on each board, a printing inspection apparatus for inspecting a printed state of solder paste on each board, a transfer device for transferring each board in a forward direction from an unloading portion of the printing apparatus to a loading portion of the printing inspection apparatus, a reversible feed holding device configured to be able to hold a failure board which was taken out from the loading portion of the printing inspection apparatus as a result of being judged by the printing inspection apparatus to be rejected, after feeding the failure board in a reverse direction and then, to load the failure board to the loading portion of the printing inspection apparatus by feeding the failure board in the forward direction, and a selection device for enabling the transfer device and the reversible feed holding device to be used selectively. | 02-09-2012 |
20120111923 | WIRE BONDING APPARATUS AND METHOD USING THE SAME - Provided are a wire bonding apparatus and a method wire bonding and manufacturing a semiconductor device using the same. The wire bonding apparatus includes a heater block configured to support a stack including a chip mounting frame and a plurality of chips stacked on the chip mounting frame. The heater block is configured to supply heat to a first portion of the stack. The apparatus further includes a chip heating unit disposed at a different height from the heater block. The chip heating unit is configured to supply heat to a second portion of the stack at a different height from the first portion. The apparatus further includes a first temperature sensing unit positioned to be located at a first height and to determine a first temperature at the first portion of the stack, a second temperature sensing unit positioned to be located at a second height and to determine a second temperature at the second portion of the stack, and a temperature adjusting unit configured to compare the first temperature to the second temperature and to adjust the magnitude of the heat supplied by at least one of the heater block and the chip heating unit according to a result of the comparison. | 05-10-2012 |
20120181323 | SOLDER APPARATUS - A solder apparatus includes a platform, an operating mechanism, a solder member, a heater, and a control box module. The control box module includes a temperature controller and a temperature sensor. The temperature controller defines a predetermined temperature. The temperature sensor is capable of measuring the temperature of the solder member. The temperature controller has the heater heat the solder member when the measured temperature of the solder member is lower than or equal to the predetermined temperature, and has the heater stop heating the solder member, when the measured temperature of the solder member is higher than the predetermined temperature. | 07-19-2012 |
20130001272 | BRAZING SYSTEM - A brazing system for brazing component members of a workpiece has a brazing chamber an inside of which is made a heating space of a volume corresponding to the workpiece, a radiant heating means provided with a plurality of heating sources which are positioned so as to correspond to a plurality of regions into which two facing surfaces of the workpiece are respectively divided, a convection heating means for circulating a heated inert gas to the heating space so as to heat the workpiece, and a control means for controlling the operation of the heating sources and the circulation of the inert gas. Each heating source is independently controlled by the control means, and the convection heating means circulates the inert gas so as to reduce a temperature difference of the workpiece caused by the heating sources. | 01-03-2013 |
20140001241 | SOLDER BALL PRINTING AND MOUNTING APPARATUS | 01-02-2014 |
20140252072 | DEVICE FOR ASSEMBLING PHOTOELECTRIC ELEMENT ON SUBSTRATE - A device includes a vacuum nozzle, a driver, a measuring unit, and a controller. The nozzle lifts and holds a photoelectric element having a first electrode and a second electrode. The driver drives the nozzle to press the photoelectric element onto a substrate having a soldering pad and a contact, such that the second electrode is electrically connected to the soldering pad via a layer of conductive glue. | 09-11-2014 |
20160005709 | METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND BONDING MACHINES - A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile. | 01-07-2016 |
20160096232 | INTELLIGENT SOLDERING CARTRIDGE FOR AUTOMATIC SOLDERING CONNECTION VALIDATION - An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal. | 04-07-2016 |
20160172324 | ALIGNMENT OF THREE DIMENSIONAL INTEGRATED CIRCUIT COMPONENTS | 06-16-2016 |
20160250723 | AUGMENTED VISION SYSTEM WITH ACTIVE WELDER GUIDANCE | 09-01-2016 |
228010000 | Presence of work | 4 |
20110248068 | SOLDERING APPARATUS - In a reflow soldering apparatus, when changing the operation mode from a production mode to a temperature profile mode, a warning-issue-time is set to a point of time (for example, several seconds) before the circuit board reaches an exit of the main body of the soldering apparatus to issue an alarm at this set time. A control unit thereof calculates a period of time when the alarm issues based on the set warning-issue-time before circuit-board-discharge and the like. After a sensor of entrance side has detected that the circuit board enters into main body of the reflow soldering apparatus, the control unit determines whether or not the starting time of the alarm sound has been elapsed. The control unit controls the information unit to sound the alarm when the control unit determines that the starting time of the warning issue has elapsed. | 10-13-2011 |
20130256385 | BONDING APPARATUS - To provide a bonding apparatus capable of bonding at a high speed without performing a height measurement of a bonding point before a searching operation and the bonding. | 10-03-2013 |
20140008415 | WELDING SYSTEM AND METHOD FOR AUTOMATIC WELDING - A welding system for automatically welding a welding seam includes a welding arm, a sensor and a controller. The controller includes a welding seam contour detection component, a welding seam contour calculation component, a welding trajectory point calculation component, and a welding parameter setting component. The welding seam contour detection component is used for detecting an initial welding seam contour and detecting remaining welding seam contours after welding each layer of the welding seam. The welding seam contour calculation component is used for calculating the detected welding seam contours. The welding trajectory point calculation component is used for calculating welding trajectory points based on the calculated welding seam contours. The welding parameter setting component is used for setting welding parameters based on the calculated welding seam contours and the calculated welding trajectory points. | 01-09-2014 |
228011000 | To control feed of filler | 1 |
20090050673 | Soldering Apparatus and Solder Tip - The present application discloses a fixture-free, hands-free soldering apparatus having a base support assembly and a solder assembly. The base support assembly has a base member supporting a power supply and an electronic temperature, time and speed control system, and an actuator for remotely actuating the solder assembly without the use of the operator's hands or fixtures. The solder assembly is supported on the base member by vertically movable support arms. A main body supports a spool of solder, a solder feed mechanism operated by the actuator and a solder mechanism having adjustable operating temperature, speed and position. The main body and adjustable solder mechanism of the solder assembly adjust the angle and position of the solder being fed by the solder feed mechanism and an adjustable solder head supporting a concave solder tip. In addition to vertical movement, the main body is rotatable by about 60 degrees with respect to a central horizontal plane along the main body. The adjustable solder head of the solder assembly is also rotatable by over 100 degrees with respect to a central vertical plane along the main body. A pressure or motion sensor positioned on the adjustable soldering mechanism may be used to signal the contact to the mechanism by work pieces, and delays solder from being fed by the solder feed mechanism, until the desired time has elapsed for the pieces to reach a minimum desired temperature. A fume removal system removes soldering fumes from the work area during operation of the solder apparatus. | 02-26-2009 |
228012000 | Responsive to position of work carrier | 1 |
20140110458 | SOLDERING SYSTEM OF SOLDERING A DIP COMPONENT ON A CIRCUIT BOARD - A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler. | 04-24-2014 |