| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 228178000 | Plural joints | 86 |
| 20100032471 | Connector Between a Reaction Pipe and a Cooling Pipe and Method for Connecting a Reaction Pipe to a Cooling Pipe - Connector between a reaction pipe and a cooling pipe and method for connecting a reaction pipe to a cooling pipe. The cooling pipe is a double pipe having an inner pipe, disposed in the extension of the reaction pipe, and an outer pipe that surrounds the inner pipe to form an intermediate cooling space between them. A supply chamber is connected to the cooling space for supplying coolant thereto. A transition piece, connected to the reaction pipe, has a fork-shaped end portion composed of an inner portion and an outer portion with heat-insulating material between them. The outer portion is secured to the base of the supply chamber coaxially relative to the longitudinal axis of the cooling pipe. The supply chamber, transition piece and half shells form a prefabricated unit. An inner tube section is welded to, and extends out of, the supply chamber and is aligned with the inner portion of the transition piece. The inner tube section has a thickness, inner diameter and outer diameter corresponding to those of the inner pipe. The thickness, inner diameter and outer diameter of the half shells correspond to those of the outer pipe. The axial length of the half shells is greater than the length of the part of the inner tube section extending out of the supply chamber. | 02-11-2010 |
| 20110259942 | WELDING METHOD OF BUTTED PROFILE - The present invention provides a welding method of butted profile. The welding method of the butted profile comprises the following steps of: assembling a profile without backing bars and a profile with double backing bars and/or a profile with a single backing bar of the butted profile together; and welding two lateral parts of the profile without backing bars with the corresponding profile with double backing bars and/or the profile with a single backing bar at the same time. By welding the two lateral parts of the profile without backing bars with the corresponding profile with double backing bars and/or the profile with a single backing bar at the same time, the two lateral parts of the profile without backing bars can simultaneously form an integer with the corresponding profile with double backing bars and/or the profile with a single backing bar in the welding process, therefore, the phenomenon of misalignment at one side of the profile without backing bars when the other side of the profile without backing bars is welded is effectively avoided, and the welding quality of the butted profile is improved. | 10-27-2011 |
| 20120111925 | Reducing Formation Of Oxide On Solder - In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder. | 05-10-2012 |
| 20090127318 | Method for Manufacturing a Printing Form and Printing Form with Thermally Insulating Layer - Reusable printing forms and thermal image setting on the printing forms is optimized in terms of performance. A method for manufacturing the printing form, in particular a rewritable printing form, having a thermally insulating layer, is distinguished by the fact that the thermally insulating layer is produced by the configuration of individual layers to form a layer sequence as a multilayer system. A printing form which is manufactured by the method according to the invention can have images set on it with a low power image setting device, as it is possible to effectively prevent heat from dissipating in an undesirably pronounced manner, for example into a metallic carrier. | 05-21-2009 |
| 20120217287 | FLIP CHIP ASSEMBLY METHOD EMPLOYING POST-CONTACT DIFFERENTIAL HEATING - A first substrate mounted to a bonder head and a second substrate mounted to a base plate are held at different elevated temperatures at the time of bonding that provide a substantially matched thermal expansion between the second substrate and the first substrate relative to room temperature. Further, the temperature of the solder material portions and the second substrate is raised at least up to the melting temperature after contact. The distance between the first substrate and the second substrate can be modulated to enhance the integrity of solder joints. Once the distance is at an optimum, the bonder head is detached, and the bonded structure is allowed to cool to form a bonded flip chip structure. Alternately, the bonder head can control the cooling rate of solder joints by being attached to the chip during cooling step. | 08-30-2012 |
| 20120261459 | LASER METALWORKING USING REACTIVE GAS - A method of metalworking a substrate ( | 10-18-2012 |
| 228179100 | Of electrical device (e.g., semiconductor) | 68 |
| 20100155456 | METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RICH SOLDER ALLOY - Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state. Further, the addition of a trace amount of nucleation sites within the composition facilitates control over the number, size, and orientations of primary intermetallic compounds in tin rich crystallite grains. Moreover, trace amounts of one or more solid and/or insoluble nucleating modifiers within a given volume of solder reduces the size of average crystallites within the composition. | 06-24-2010 |
| 20100163605 | BALL IMPLANTATION METHOD AND SYSTEM APPLYING THE METHOD - A ball-implantation method and a system applying the method are provided. To begin with, solder balls are implanted onto a flux applied to each of the ball pads on a substrate plate. Then, a vibration force of preset magnitude is exerted on the substrate plate, inducing vibration and causing any solder balls that have deviated from positions corresponding to the ball pads exposed from the openings of a solder mask provided on the substrate plate to return to the correct orientation and be kept therein by the vibration force and gravity. Subsequently, the ball implantation process is completed using a reflow process to solder the implanted solder balls. Using this method and the system thereof, the problem of missing or misaligned solder balls that occurs after the reflow process is solved, thereby dispensing with rework and improving the production yield and product reliability. | 07-01-2010 |
| 20090120998 | HEATING AND PRESSURIZING APPARATUS FOR USE IN MOUNTING ELECTRONIC COMPONENTS, AND APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS - A heating and pressurizing apparatus ( | 05-14-2009 |
| 20090008431 | Solderable EMI Gasket and Grounding Pad - Apparatus, which is useful as both a conductive gasket and a grounding pad, which has a compressible elastomeric substrate having at least one side surface and two ends, a conductive elastomeric layer adjacent to all of the side surfaces of the compressible substrate, and a metal layer adjacent to the conductive layer. | 01-08-2009 |
| 20130119118 | METHOD FOR MANUFACTURING SEMICONDUCTOR LASER APPARATUS, SEMICONDUCTOR LASER APPARATUS, AND OPTICAL APPARATUS - This method for manufacturing a semiconductor laser apparatus includes steps of forming a first semiconductor laser device having a first electrode, forming a second semiconductor laser device having a second electrode, forming a first solder layer with a first melting point through a first barrier layer on a third electrode, forming a second solder layer with a second melting point through a second barrier layer on a fourth electrode, bonding the first electrode to the third electrode through a first reaction solder layer, a melting point of which rises to a third melting point higher than the second melting point by reacting the first electrode with the first solder layer, and bonding the second electrode to the fourth electrode by applying heat of a first heating temperature to melt the second solder layer with the second melting point after the step of bonding the first electrode to the third electrode. | 05-16-2013 |
| 20110278350 | Metal foil interconnection of electrical devices - An electrical assembly ( | 11-17-2011 |
| 20090050677 | METHOD OF WELDING ELECTRONIC COMPONENTS ON PCBS - An exemplary method of welding electronic components on PCBs is disclosed. Firstly, a metal tray including a number of supporting areas is provided. At least one through hole is formed in each of the supporting areas. Secondly, solder pastes are applied onto welding pads of PCBs. Thirdly, electronic components are mounted on the welding pads. Fourthly, PCBs are placed on the metal tray in a manner that each printed circuit board is placed in a corresponding supporting area and the welding pads being above the through hole. Finally, the solder pastes are heated to weld the electronic components on the printed circuit board. By doing so, the heat can pass through the through holes in each supporting area directly and fully melt the solder paste. As a result, welding defects can be reduced. | 02-26-2009 |
| 20090152329 | Method and apparatus for mounting at least two types of electronic components - Provided is a method and apparatus for mounting a plurality of electronic components. The method comprises mounting a first electronic component on a substrate; forming a mask on the substrate to expose the first electronic component and a region of the substrate on which a solder paste is to be applied; forming a guide on a portion of the mask disposed around the first electronic component; applying the solder paste onto the substrate by using a squeezer contacting a portion of the mask disposed around the region of the substrate on which the solder paste is to be applied; removing the guide and the mask; and mounting a second electronic component on the solder paste. | 06-18-2009 |
| 20080245846 | HEAT CYCLE-ABLE CONNECTION - A method of creating an electrical connection involves providing a pair of contacts each on one of two different chips, the pair of contacts defining a volume therebetween, the volume containing at least two compositions each having melting points, the compositions having been selected such that heating to a first temperature will cause a change in at least one of the at least two compositions such that the change will result in a new composition having a new composition melting point of a second temperature, greater than the first temperature and the melting point of at least a first of the at least two compositions, and heating the pair of contacts and the at least two compositions to the first temperature. | 10-09-2008 |
| 20090166396 | MICROBALL ATTACHMENT USING SELF-ASSEMBLY FOR SUBSTRATE BUMPING - Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a plurality of bonding pads thereon, and providing a plurality of solder microballs, the microballs including a coating thereon. The method also includes flowing the solder microballs onto the substrate and positioning the solder microballs on the bonding pads. The method also includes heating the solder microballs to reflow and form a joint between the solder microballs and the bonding pads. Other embodiments are described and claimed. | 07-02-2009 |
| 20090200362 | METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE - In a lead-free solder, a semiconductor package and a method of manufacturing the semiconductor package, the lead-free solder includes about 3.5 percent by weight to about 6 percent by weight of silver, about 0.05 percent by weight to about 0.5 percent by weight of copper and a remainder of tin. The lead-free solder is employed in the semiconductor package. The lead-free solder has high impact resistance and high heat resistance to reduce failures of the semiconductor package. | 08-13-2009 |
| 20080302860 | AIR BEARING GAP CONTROL FOR INJECTION MOLDED SOLDER HEADS - An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place. | 12-11-2008 |
| 20110049221 | METHOD OF JOINING A CHIP ON A SUBSTRATE - A method and apparatus for making chip assemblies is disclosed that prevent or reduce the cracking and delamination of ultra low-k dielectrics in the back-end-of-line in Si chips that can occur during the chip assembly process. The method and apparatus apply pressure to the top and bottom surfaces of a substrate during the chip bonding process so that the bending and warping of the assembled modules are reduced. The reduced bending and warping prevent or reduce the cracking and delamination of ultra low-k dielectrics. | 03-03-2011 |
| 20090014502 | METHOD AND APPARATUS FOR PLACING CONDUCTIVE BALLS - An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite to the one surface of the arrangement member and positioning openings, wherein the positioning openings are arranged corresponding to the pattern such that the openings are through from the one surface to the another surfaces of the arrangement member so that the balls are inserted therein. The another surface of the arrangement member is positioned opposite to the one surface of the base unit. The arrangement member has two or more line members of which the core axes are substantially aligned. The transfer device is arranged in a manner that the line members are substantially in a horizontal position to contact with the balls supplied to one surface of the arrangement member, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings. | 01-15-2009 |
| 20100116869 | Electrical Microfilament to Circuit Interface - Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments. | 05-13-2010 |
| 20120055978 | Contacting Means and Method for Contacting Electrical Components - A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste. | 03-08-2012 |
| 20120153008 | JOINED STRUCTURE, METHOD FOR PRODUCING THE SAME, AND ANISOTROPIC CONDUCTIVE FILM USED FOR THE SAME - A joined structure of the present invention including a first substrate having a wiring thereon, any one of a second substrate and an electronic part, and an anisotropic conductive film containing conductive particles, wherein the first substrate and any one of the second substrate and the electronic part are electrically joined via the anisotropic conductive film, and wherein the conductive particles pressure-bonded to the wiring of the first substrate protrude from both edges of the wiring in a width direction, and an interval of the wiring is 3.5 times or more larger than an average particle diameter of the conductive particles which are not pressure-bonded to the wiring. | 06-21-2012 |
| 20120012645 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - Disclosed are an electronic component mounting system and an electronic component mounting method capable of reducing the space occupied by equipment and equipment cost and ensuring high connection reliability. An electronic component mounting system ( | 01-19-2012 |
| 20090134204 | Soldering Method and Semiconductor Module Manufacturing Method - A soldering method for soldering a semiconductor element to each of bonding portions defined at a plurality of locations on a circuit board is disclosed. The soldering method includes laying out the bonding portions in a non-linear manner in at least three locations on the circuit board, placing the semiconductor elements on the bonding portions with solder in between, placing a weight on the at least three semiconductor elements, which are laid out in a non-linear manner, so that the weight extends over the semiconductor elements, and soldering the semiconductor elements to the bonding portions by melting the solder while pressurizing the semiconductor elements with the weight. This reduces variations in thickness of the solder at the plurality of bonding portions when soldering the plurality of semiconductor elements to the circuit board. | 05-28-2009 |
| 20120118938 | WIRING METHOD AND DEVICE - To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in which a respective one of the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction; in this way a row of aligned components is obtained, each component having a corresponding electrode aligned to the subsequent one in the row, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e. electrically and mechanically bonding the tensioned wire to the corresponding electrodes; in this way all components are simultaneously bonded to the wire, and f. cutting the wire to separate the components from each other thereby forming a respective lead terminal for each electrode. | 05-17-2012 |
| 20120318851 | CHIP BONDING PROCESS - A chip bonding process includes the following steps. At least one chip is transferred onto a carrier, and a negative pressure environment is provided. Heat is provided to the at least one chip and/or the carrier, and a positive pressure is applied onto the at least one chip. | 12-20-2012 |
| 20120267422 | SOLDERING ASSISTANCE DEVICE AND SOLDERING METHOD THEREOF - A soldering assistance device is used for soldering a multi-pin electronic element with a row of pins on a PCB. The row of pins includes an outer pin at two ends thereof. The soldering assistance device includes a holding portion and a soldering portion connected to the holding portion. The soldering portion is adjacent to the outer pin. An interval between the soldering portion and the outer pin is less than an interval between each two adjacent pins of the row of pins. The soldering portion is made of a metal which is easy to solder. A soldering method using the soldering assistance device is also provided. | 10-25-2012 |
| 20120080508 | LINEAR CELL STRINGING - Techniques for linear cell stringing are disclosed. In some embodiments, a plurality of sets of solar cells are linearly positioned, a plurality of tabbing ribbon segments are placed in contact with the plurality of sets of solar cells, and the plurality of sets of solar cells and corresponding plurality of tabbing ribbon segments are soldered together to form a plurality of solar cell strings. In some cases, the plurality of solar cell strings is substantially simultaneously formed in parallel. | 04-05-2012 |
| 20100230475 | ELECTRICAL INTERCONNECT FORMING METHOD - An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad. | 09-16-2010 |
| 20110290862 | LOW PROFILE AND COMPACT SURFACE MOUNT CIRCULATOR ON BALL GRID ARRAY - A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate. | 12-01-2011 |
| 228180100 | Simultaneous bonding of multiple joints (e.g., dip soldering of printed circuit boards) | 30 |
| 20130082092 | Curable Amine, Carboxylic Acid Flux Composition And Method Of Soldering - A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: | 04-04-2013 |
| 20130126591 | Thermal Compress Bonding - A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together. | 05-23-2013 |
| 20080272180 | METHOD OF MANUFACTURING HEAT SPREADER MODULE - A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 μm when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 μg/cm | 11-06-2008 |
| 20090179067 | SELECTIVE SOLDERING SYSTEM - A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs. | 07-16-2009 |
| 20090108052 | Selective soldering using fiber optic device - A fiber optic device for enabling soldering is described. The fiber optic device includes an entry portion comprising an optical fiber bundle for receiving a single light beam wherein the optical fiber bundle splits the light beam into a plurality of separate portions, each of the separate portions for enabling soldering. The fiber optic device further includes an exit portion for emitting each of the plurality of separate portions of the light beam in a pattern to enable soldering at a plurality of locations simultaneously utilizing the single light beam. | 04-30-2009 |
| 20110049222 | QUICK-LOADING SOLDERING APPARATUS - A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a second PCB work site is angularly positioned for soldering pre-loaded PCB components at a soldering station. Correct rotation of the deck is ensured by a sensor mounted on the deck. If the rotation angle is correct, locator pins provided externally of the deck become actionable by an operator to register the deck prior to the PCB being soldered. | 03-03-2011 |
| 20110089224 | LEAD-FREE SOLDER - An inexpensive lead-free solder which prevents the occurrence of tin pest at extremely low temperatures and which has good wettability and impact resistance has a composition consisting essentially of, in mass %, Cu: 0.5-0.8%, Bi: at least 0.1% and less than 1%, Ni: 0.02-0.04%, and a remainder of Sn. | 04-21-2011 |
| 20080217383 | MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD - A screen plate having a plurality of openings is placed on a suspension substrate in which a plurality of conductive pads are formed. Conductive paste is moved in one direction on an upper surface of the screen plate, so that the conductive paste is applied onto the conductive pads through the openings. A recess that is inwardly bent is formed in each of the openings of the screen plate. | 09-11-2008 |
| 20120097734 | System and Method for Packaging Electronic Devices - In accordance with particular embodiments, a method for packaging electronic devices includes melting solder for a solder jet. The method additionally includes depositing the melted solder from the solder jet in a pattern on a first substrate of a first component of an electronic device. The pattern comprises a plurality of individual dots of melted solder. The method also includes aligning a second substrate of a second component of the electronic device with the pattern deposited on the first substrate of the electronic device. The method further includes re-melting the solder deposited in the pattern on the first substrate. The method additionally includes, while the solder is re-melting, compressing the first and second substrates. | 04-26-2012 |
| 228180210 | Component terminal to substrate surface (i.e., nonpenetrating terminal) | 21 |
| 20080217384 | ELLIPTIC C4 WITH OPTIMAL ORIENTATION FOR ENHANCED RELIABILITY IN ELECTRONIC PACKAGES - An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations at various preferably corner locations on a semiconductor chip. | 09-11-2008 |
| 20120305632 | LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS - A method is provided for the forming of a metallic solder joint without a liquid flux to create a solder joint that has minimal voids and can be reflowed multiple times without void propagation. This process can be done for any solder alloy, and is most specifically used in the application of first level thermal interface in a IC or micro processor or BGA microprocessor. | 12-06-2012 |
| 20090134205 | Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus - A soldering method for soldering an electronic component to a circuit board is disclosed. The soldering method includes placing the electronic component on the bonding portion of the circuit board with solder arranged between the electronic component and the bonding portion, placing a weight on the electronic component, and heating and melting the solder while pressing the electronic component toward the circuit board with the weight. The weight is spaced from the electronic component while the temperature of the solder is still high after the melted solder wets the bonding portion and the bonding surface of the electronic component and spreads out therebetween. | 05-28-2009 |
| 20110121059 | ELECTRICAL BOND CONNECTION SYSTEM - An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least one of the contact surfaces via at least one first bond connection. At least one additional second electrical conductor ( | 05-26-2011 |
| 20120318852 | METHOD OF PREVENTING EMI FOR A FASTENING HOLE IN A CIRCUIT BOARD AND A FIXTURE THEREFOR - A method of preventing EMI for a fastening hole in a circuit board includes the steps of providing a circuit board which includes a plurality of fastening holes extending through opposite first and second surfaces thereof and a plurality of solder pads disposed on the second surface, each fastening hole being surrounded by the solder pads; disposing an electronic component on the first surface; positioning the circuit board on a fixture such that the solder pads are not covered by the fixture; and wave soldering the circuit board so that the electronic component is fixed to the circuit board and the solder pads are attached with solder materials. | 12-20-2012 |
| 20110272452 | SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS USING MULTIPLE SOLDER WIRES - An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated. | 11-10-2011 |
| 228180220 | Lead-less (or "bumped") device | 15 |
| 20100147928 | METHOD FOR THE MANUAL PLACEMENT OF BOTTOM TERMINATED LEADLESS DEVICE ELECTRONIC PACKAGES USING A MATED STENCIL PAIR - The present invention relates to a process for the rework of bottom terminated leadless devices as well as a pair of stencils for the manual reattachment of such devices (commonly known as a QFN, LGA or MLF packages). This process is used to remount these devices once they have been removed from the printed circuit board or placing new devices on an already populated PCB. It is also used to add bumps to the bottom side of an electronic device package or pads. | 06-17-2010 |
| 20090050678 | METHOD FOR MOUNTING ELECTRONIC PARTS - When a surface-mount electronic part, which includes at least two mounting electrodes on an external underside thereof, is bonded to circuit terminals on a wiring board using solder, a protrusion, which is thicker than the circuit terminal, is provided on a surface of the wiring board facing the outer bottom surface of the electronic part to have the clearance between the mounting electrode and the circuit terminal that is not smaller than a predetermined value, so that the thickness of the solder between the mounting electrode and the circuit terminal is maintained to be large. | 02-26-2009 |
| 20090020591 | CONDUCTIVE BALL MOUNTING METHOD - There is provided a method of mounting one conductive ball on each of a plurality of connection pads on a substrate. The method includes: (a) providing a pre-alignment base including: a support layer formed to allow a flux to pass therethrough; and an alignment layer provided on the support layer and having pockets for containing the conductive ball; (b) applying a paste containing the conductive balls dispersed in the flux onto the alignment layer such that each of the pockets receives one of the conductive balls together with the flux; (c) aligning the pre-alignment base with the substrate such that each of the pockets corresponds to one of the connections pads; and (d) transferring the paste contained in each of the pockets onto the connection pads, thereby mounting the conductive balls along with the flux on the connection pads. | 01-22-2009 |
| 20090289101 | METHOD FOR BALL GRID ARRAY (BGA) SOLDER ATTACH FOR SURFACE MOUNT - A method is provided for solder reflow which includes the steps of providing a receptacle having receptacle pads formed on an upper surface and placing a component on the receptacle, the component having a ball grid array of solder balls attached thereto. The component is placed on the receptacle in a manner which aligns the solder balls with the receptacle pads on the receptacle. The method further includes the steps of placing a weight having a predetermined size and a predetermined mass on top of the component to form a stack of the receptacle, the component and the weight, and reflowing the stack to attach the component to the receptacle by exposing the stack to high temperature to reflow the solder balls. | 11-26-2009 |
| 20080197173 | Method for Forming Solder Bump and Method for Mounting Semiconductor Device - [Problem] To provide a method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device. | 08-21-2008 |
| 20090026247 | APPARATUS AND METHOD OF MOUNTING CONDUCTIVE BALL - There is provided a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of connection pads formed on a substrate. The conductive ball mounting apparatus includes: an outer frame; an inner cylinder provided in the outer frame, wherein an upper surface and a lower surface of the inner cylinder are opened; a sieve provided in the inner cylinder, wherein the inner cylinder is partitioned into an upper space and a lower space by the sieve; an inlet port for supplying an air from an outside to the lower space of the inner cylinder; a mask provided to a lower end of the outer frame and having openings, the openings being provided to correspond to conductive ball mounting positions; and an exhaust port for exhausting an air from an upper surface of the mask to the outside and being provided to the lower end of the outer frame, wherein the inner cylinder is adapted to vibrate without being restricted by the outer frame. | 01-29-2009 |
| 20110226841 | ROOM TEMPERATURE DIRECT METAL-METAL BONDING - A method for forming direct metal-metal bond between metallic surfaces is disclosed. The method comprises depositing a first nanostructured organic coating ( | 09-22-2011 |
| 20110031300 | CLEANING-FREE ACTIVATED RESINOUS COMPOSITION AND METHOD FOR SURFACE MOUNTING USING THE SAME - Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight. | 02-10-2011 |
| 20110240717 | COMPONENT MOUNTING METHOD AND DEVICE MANUFACTURED USING THE SAME - The present invention provides technology for mounting components with simple processing and with comparatively high dimensional precision. Welding sections ( | 10-06-2011 |
| 20100320258 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - In one embodiment, a first substrate having first solder bumps and a second substrate having second solder bumps are stacked while temporarily tacking the solder bumps to each other, and then a stack is disposed inside a furnace. The gas in the furnace is exhausted to be in a reduced pressure atmosphere, and then a carboxylic acid gas is introduced into the furnace. While increasing a temperature inside the furnace where the carboxylic acid gas is introduced, the gas in the furnace is exhausted to be in a reduced pressure atmosphere at a temperature in a range from a reduction temperature of oxide films by the carboxylic acid gas to lower than a melting temperature of the solder bumps. By increasing the temperature inside the furnace up to a temperature in a range of the melting temperature of the solder bumps and higher, the first solder bumps and the second solder bumps are melted and joined. | 12-23-2010 |
| 20120018498 | PRE-SOLDER METHOD AND REWORK METHOD FOR MULTI-ROW QFN CHIP - A pre-solder method for a multi-row quad flat no-lead (QFN) packaged chip is provided. Solder paste is applied on at least one pad of the multi-row QFN packaged chip. The multi-row QFN packaged chip is heated, such that the solder paste on the at least one pad of the multi-row QFN packaged chip becomes solid solder before the multi-row QFN packaged chip is mounted on a substrate. | 01-26-2012 |
| 20120104076 | JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT - A practical bonding technique is provided for solid-phase room-temperature bonding not requiring a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. Since an adhering substance layer is thin immediately after a surface activating treatment using an energy wave, a bonding interface is spread by crushing the adhering substance layer to perform bonding, so that a new surface appears on a bonding surface, and objects to be bonded are bonded together. In order to crush the adhering substance layer more easily, a bonding metal of a bonding portion of the object to be bonded requires a low hardness. According to the results of various experiments conducted by the present inventors, it was found that the hardness of the bonding portion which is a Vickers hardness of 200 Hv or less is particularly effective for room-temperature bonding. | 05-03-2012 |
| 20120118939 | PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE - The process for manufacturing the semiconductor device and the apparatus, which achieve stable production of semiconductor devices with improved connection reliability, is presented. First terminals of circuit boards | 05-17-2012 |
| 20120318854 | THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS INCORPORATING THERMALLY ACTIVATED BASE GENERATORS - Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces. | 12-20-2012 |
| 20120318853 | HEATER BLOCK FOR WIRE BONDING SYSTEM - A heater block for a wire bonding system includes a mounting base configured to receive a lead frame and a semiconductor die mounted on the lead frame. A heating structure is removably coupled to a top surface of the mounting base. The heating structure includes a central heating surface and side heating panels surrounding the central heating surface. The heating structure selectively heats wire bonding areas of the lead frame. | 12-20-2012 |
| 228180500 | Wire bonding | 13 |
| 20090321501 | METHOD OF FABRICATING WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE - A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first semiconductor die may be electrically coupled to the substrate with a plurality of stitches in a forward ball bonding process. The second semiconductor die may in turn be electrically coupled to the first semiconductor die using a second set of stitches bonded between the die bond pads of the first and second semiconductor die. The second set of stitches may each include a lead end having a stitch ball that is bonded to the bond pads of the second semiconductor die. The tail end of each stitch in the second set of stitches may be wedge bonded directly to lead end of a stitch in the first set of stitches. | 12-31-2009 |
| 20090212093 | PRESSURE SENSE DIE PAD LAYOUT AND METHOD FOR DIRECT WIRE BONDING TO PROGRAMMABLE COMPENSATION INTEGRATED CIRCUIT DIE - A method for direct die-to-die wire bonding incorporates a pressure sense die and a programmable compensation IC die that can be mounted on a ceramic substrate. The two die can be positioned beside each other such that wire bond pads on the pressure sense die and bonding leads on the compensation IC die are in same order. The pressure sense die and the compensation IC can be connected directly with wire bonds in order to reduce the number of wire bonds and to improve reliability. The pressure sense die can be designed with multiple wire bond pad patterns in order to be utilized with different programmable compensation IC dies. | 08-27-2009 |
| 20080237310 | Die backside wire bond technology for single or stacked die package - Methods and apparatus to provide die backside connections are described. In one embodiment, the backside of a die is metallized and coupled to another die or a substrate. Other embodiments are also described. | 10-02-2008 |
| 20090140029 | METHOD AND DEVICE FOR WIRE BONDING - The invention provides a device for wire bonding with a copper-containing bonding wire for connecting a component to a support, wherein provision is made on the component as well as on the support for at least one bond pad, encompassing a guide for the bonding wire and a device for melting a part of a bonding wire, which is provided for a connection to one of the bond pads, wherein the guide for the bonding wire is embodied in such a manner that the melted part of the bonding wire is brought into contact in each case with at least one bond pad in a bonding chamber, characterized in that provision is made for at least one plasma nozzle, with part of the bonding wire provided for the connection to the bond pad can be acted upon by a plasma and/or the bond pad can be acted upon by a plasma and/or the bonding chamber can be acted upon by a plasma. The invention also relates to a method for wire bonding. | 06-04-2009 |
| 20080197172 | Bonding Tool - Means to increase the UPH of TAB bonding on an HSA manufacturing line to allow a higher UPH to keep cost down and also allow the use of one or more grounds to be add to an HSA to help control ESD without lowering the UPH or redesigning the lines through the use of a multi-head contact TAB bonding tool as described herein A bonding tool for use in tape automated bonding (TAB) is provided that is for multi-contact. The multi-contact TAB bonding tool is ESD safe so as not to damage a device being bonded. | 08-21-2008 |
| 20100230476 | REDUCED OXIDATION SYSTEM FOR WIRE BONDING - A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area. | 09-16-2010 |
| 20120241506 | Concave Solder Tip - A solder tip having a bottom end. The bottom end includes a concave channel between a front side of the bottom end and a back side of the bottom end. The concave channel has a substantially uniform cross-sectional shape. | 09-27-2012 |
| 20100059574 | WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTROL PROGRAM - The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed. | 03-11-2010 |
| 20120006884 | CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PROCESSED FROM THE CLAD MATERIAL - A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability. | 01-12-2012 |
| 20120104075 | METHOD OF OPERATING A CLAMPING SYSTEM OF A WIRE BONDING MACHINE - A method of operating a wire bonding machine is provided. The method includes the steps of: (1) providing a workpiece secured in a bonding position by a device clamp of a wire bonding machine; (2) raising the device clamp to a first height above the workpiece, the device clamp remaining at the first height for a first predetermined period of time; and (3) raising the device clamp to a second height above the workpiece after step (2), the second height being further away from the workpiece than the first height. | 05-03-2012 |
| 20090308914 | WIRE BONDING METHOD - A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises a capillary, moves the capillary toward a second bonding point and then lowers the capillary by an amount that is smaller than an amount in which the capillary was raised, and a step that raises the capillary to allow the wire to be paid out of the capillary and moves the capillary toward a second bonding point, thus connecting the wire to the second bonding point. | 12-17-2009 |
| 20120160902 | WIRE FEED SYSTEM AND METHOD OF OPERATING THE SAME - A wire feed system for a wire bonding machine is provided. The wire feed system includes (1) a wire supply, and (2) an air guide for receiving a length of wire from the wire supply. The air guide has an air inlet for receiving a pressurized fluid. The wire feed system is configured to apply a variable tension to the length of wire received by the air guide. | 06-28-2012 |
| 20100206940 | WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTROL PROGRAM - The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed. | 08-19-2010 |
| 228181000 | Honeycomb structure | 2 |
| 20110062221 | METHOD OF CREATING A HONEYCOMB CORE USING A SERPENTINE WELDING PATH - A honeycomb core is created from a stack of metal sheets that are welded together using a serpentine weld path. Each sheet in the stack is welded to the sheet underneath. All the odd-numbered sheets, excluding the bottom sheet, are welded using a first serpentine welding pattern that includes a plurality of long welds and a plurality of short welds. All the even-numbered sheets are welded using a second serpentine welding pattern that includes a plurality of long welds and a plurality of short welds, such that the long welds of the second serpentine welding pattern are shifted from the long welds of the first serpentine welding pattern. When a sufficient number of sheets have been welded, the stack is trimmed to remove the short welds. The stack is expanded by pulling the sheets one from another to form the honeycomb core. | 03-17-2011 |
| 20080203140 | Method and Device for Brazing Material Application, Method for Producing a Honeycomb Body, Exhaust Gas Treatment Unit and Vehicle - A device and a method for applying brazing material to an at least partially structured metal foil include a) providing at least one flat metal foil, b) shaping the at least one metal foil to produce a structure, and c) applying brazing material to the at least one metal foil. Steps b) and c) are carried out discontinuously and at least partially together. The device and method are preferably used in the production of metallic honeycomb bodies for the treatment of exhaust gases in vehicles. | 08-28-2008 |
| 228182000 | Of mechanical article | 6 |
| 228183000 | Heat exchanger structure | 5 |
| 20080237312 | Brazing method - In a brazing method, tubes for a heat exchanger, in which an inner fluid flows and exchanges heat with an outer fluid, are bonded to fins for expanding a heat exchange area at a time of exchanging the heat, by using a brazing material of paste form. The method includes a mounting step of stacking the tubes and the fins alternately in layers to form an assembly, a coating step of coating portions near outside abutting portions where the tubes abut on the fins with the brazing material after the mounting step, and a brazing step of carrying the assembly coated with the brazing material in the coating step into a brazing furnace and of brazing the tubes to the fins. | 10-02-2008 |
| 20080237311 | APPARATUS AND METHOD FOR PRODUCING BRAISED PARTS - The invention relates to a plant and a method for the production of soldered components, in particular of heat exchangers, from light metal, in particular from aluminum materials, under protective gas, with a continuous soldering furnace or a chamber soldering furnace, which is designed as a muffle which is formed from a muffle material. | 10-02-2008 |
| 20080277455 | METHOD FOR JOINING COMPONENTS MADE OF A HIGH-STRENGTH ALUMINUM MATERIAL AND HEAT EXCHANGER ASSEMBLED ACCORDING TO THE METHOD - The invention relates to a method for joining components made of a high-strength aluminum material, whereby at least two components of high-strength aluminum alloys are joined by soldering, both components separated from each other by at least one aluminum layer with a lower magnesium content compared with the contact surfaces before joining is carried out, and a heat exchanger produced according to this method. | 11-13-2008 |
| 20120145772 | DEVICE AND METHOD FOR BRAZING A HEAT PIPE - The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor. | 06-14-2012 |
| 20100270361 | Device and Method For Applying a Flow Agent For Hard Soldering of Parts - The invention relates to an apparatus and a process for the preferably uneven application of flux to a material surface, in particular to the finned side of a plate of a plate-type radiator. | 10-28-2010 |
| 228184000 | Pressure vessels, tanks, and container-type structures | 1 |
| 20090095796 | WIRE WRAPPED PRESSURE VESSELS - A pressure vessel ( | 04-16-2009 |
| 228189000 | Using bridge or spacer | 1 |
| 20080283581 | Apparatus and method for connecting copper tubes - An apparatus and method for connecting copper tubes are developed to facilitate welding operation in the refrigerating device. The new apparatus will reduce the poor welding rate so that it will effectively prevent clogging of the copper tubes and leaking the refrigerant. It also has merit to easily determine a suitable heating time while the copper tubes are welding. Thus, the rate of poor welding is reduced, as well as a method for connecting copper tubes by using the tube connecting apparatus. | 11-20-2008 |
| 228190000 | Of concurrently bonded stacked laminae | 3 |
| 20100140331 | DEVICE AND METHOD FOR BRAZING A HEAT PIPE - The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor. | 06-10-2010 |
| 20100133325 | UNIFIED METAL ALLOYING IN A DIFFUSION FURNACE - A method and apparatus for performing a unified metal alloying of jet stacks without the use of a bond press, and without the use of a continuous belt driven furnace. The method may include horizontally stacking fusible parts onto a fixture and transporting the fixture into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior of the reaction chamber and the diffusion furnace may increase a temperature of an atmosphere of the interior of the reaction chamber to a predefined dwell temperature to perform a first level alloying for a predefined dwell time. The diffusion furnace may thereafter increase the temperature of the interior of the reaction chamber to a predefined brazing temperature to perform a second level alloying for a predefined brazing time. | 06-03-2010 |
| 20090072009 | Method of preventing bonding between a load distribution block and a plate set of stacked sheets during diffusion bonding of a fluid flow structure - The present invention relates to diffusion bonding of patterned sheets to form a fluid flow handling structure, and to a method of preventing bonding between a load distribution block and a plate set of stacked sheets during the diffusion bonding process. | 03-19-2009 |
