Class / Patent application number | Description | Number of patent applications / Date published |
228175000 | Plural diverse bonding | 15 |
20080302858 | Wiring Method and Device - To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in which a respective one of the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction; in this way a row of aligned components is obtained, each component having a corresponding electrode aligned to the subsequent one in the row, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e. electrically and mechanically bonding the tensioned wire to the corresponding electrodes; in this way all components are simultaneously bonded to the wire, and f. cutting the wire to separate the components from each other thereby forming a respective lead terminal for each electrode. | 12-11-2008 |
20090200361 | Method for joining components using a brazing technique - A method for joining components using a brazing technique, namely relatively thin-walled components, in particular sheet-metal panels, which are not inherently stable and thus are susceptible to deformation, comprising at least the following steps:
| 08-13-2009 |
20100200643 | METHOD FOR PRODUCING ELECTRONIC PART UNIT - A method for producing an electronic part unit, the method includes: mounting a first electronic part on a first surface of a first substrate by reflow soldering; mounting a second electronic part on a second surface of a second substrate by reflow soldering; adhering a second surface of the first substrate to a first surface of a third substrate; and adhering a second surface of the second substrate to a second surface of the third substrate. | 08-12-2010 |
20100327044 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE - After disposing bonding material including thermosetting resin containing solder particles in a region that covers at least land part on an upper surface of base wiring layer and holding electronic component by base wiring layer by positioning terminal part with respect to land part and adhesively bonding at least terminal part to bonding material that covers at least land part, bonding material is semi-cured by heating. Therefore, warp deformation of the base wiring layer can be suppressed and bonding reliability can be secured. | 12-30-2010 |
20110084118 | MANUFACTURING METHOD OF SOLID-STATE IMAGE PICKUP DEVICE - After a wiring substrate having, on its lower surface, an opening and terminals arranged therearound is provided, a sealing material is supplied to the lower surface of the wiring substrate, and a sensor chip is flip-chip mounted on the lower surface of the wiring substrate. The sensor chip has, on its front surface, a sensor surface and bump electrodes, and each bump electrode is thermocompression-bonded onto each terminal of the wiring substrate and the sensor surface is exposed from the opening. The sensor chip has, in its outer peripheral portion of the front surface, a first region where the bump electrodes are arranged and a second region where no bump electrode is arranged. The sealing material is supplied to a region planarly overlapped with the first region when the sensor chip is mounted later, and no sealing material is supplied to a region planarly overlapped with the second region. | 04-14-2011 |
20110139857 | METHOD FOR THE PERMANENT CONNECTION OF TWO COMPONENTS BY MEANS OF GLASS OR METAL SOLDER - The invention is a method for permanent connection of two components by soldering employing a glass or metal solder as the solder material. A layer system providing adhesion is applied to both components, between which the solder material is introduced. the layer system is heated to a soldering temperature characteristic for the solder material and results in a permanent solder connection between both components after cooling. The layer system providing adhesion has an adhesive layer applicable directly to the component and a solderable layer. The adhesive layer, if a glass solder is used, contains oxidic, carbidic, or nitridic components or mixed compounds thereof and, if a metal solder is used, the adhesive layer contains carbidic or nitridic components or mixed compounds thereof. | 06-16-2011 |
20120097733 | NOVEL BONDING PROCESS AND BONDED STRUCTURES - A sealing and bonding material structure for joining semiconductor wafers having monolithically integrated components. The sealing and bonding material are provided in strips forming closed loops. There are provided at least two concentric sealing strips on one wafer. The strips are laid out so as to surround the component(s) on the wafers to be sealed off when wafers are bonded together. The material in the strips is a material bonding the semiconductor wafers together and sealing off the monolithically integrated components when subjected to force and optionally heating. A monolithically integrated electrical and/or mechanical and/or fluidic and/or optical device including a first substrate and a second substrate, bonded together with the sealing and bonding structure, and a method of providing a sealing and bonding material structure on at least one of two wafers and applying a force and optionally heat to the wafers to join them are described. | 04-26-2012 |
20120298728 | METHOD FOR MANUFACTURING SUBSTRATE - In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting insulating resin layer. Bumps of a conductive paste containing metal fillers are formed on a metal foil which is to be contact-bonded to an insulating resin layer, the bumps are heated to bound the metal fillers to each other, and form a metallic bond between the bumps and the metal foil, the metal columns are press-fitted into the insulating resin layer to contact-bond the metal foil to the insulating resin layer, and join the tips of the metal columns to a metal foil, the metal columns are then reheated to form a metallic bond between the metal columns and the metal foil. | 11-29-2012 |
20130026212 | SOLDER DEPOSITION SYSTEM AND METHOD FOR METAL BUMPS - A manufacturing technique includes creating stud bumps on the electrical contacts on a die, either in wafer or die form. A separate stencil or carrier is provided with cavities that correspond to the electrical contacts on the die. The cavities are filled with solder paste and the die is brought into close proximity with the stencil so that the stud bumps extend into the cavities and come into contact with the solder paste. When the die is removed, the solder paste stays affixed to the stud bumps and thereby the solder paste is transferred and delivered to the stud bumps. The die can then be affixed to a substrate such as a PCB. | 01-31-2013 |
20140084045 | CLOTH ELECTRONIZATION PRODUCT AND METHOD - Cloth electronic product, by which physiological information can be examined through cloth, includes a packaging cloth or a heat melt adhesive film as circuit, at least an electronic component, such as resistors, microprocessors and sensing assembly, etc., at least a transmission line to be connected with the conductive region of electronic component. Method of producing a cloth electronic product includes sewing the electronic component on packaging cloth or heat melt adhesive film after being connected with the transmission line, or connecting electronic component with the transmission line during the process of jointing of transmission or sewing of packaging cloth or heat melt adhesive film, and then sewing the packaging cloth on the clothing cloth or integrating the heat melt adhesive film into the packaging cloth or clothing cloth. Original structure of the heat melt adhesive film cannot be viewed and miniaturization effects can be produced. | 03-27-2014 |
20140263580 | TEMPORARY ADHESIVE FOR COMPONENT BONDING - A rosin composition includes a gum rosin, an emulsifier, a randomizing additive and a bonding agent. This rosin composition may be used as a temporary or permanent adhesive for the soldering of components. The rosin composition may be temporary as it is easily removed from a surface without damaging the surface. | 09-18-2014 |
20150048147 | LASER LIGHT SOURCE DEVICE AND METHOD FOR MANUFACTURING LASER LIGHT SOURCE DEVICE - The present invention is a laser light source device having: a silicon substrate having a first flat surface and a second flat surface which is formed at a position lower than the first flat surface by a level difference in the thickness direction; a first junction having a microbump structure comprising Au formed on the first flat surface; a second junction having a microbump structure comprising Au formed on the second flat surface; a first optical element and a second optical element for emitting laser light, which are joined to the first junction by a surface activation technique; a reflective member for reflecting the laser light from the first optical element toward a multiplexer, the reflective member being joined to the second junction by the abovementioned technique; and a multiplexer for directly receiving the laser light from the second optical element and multiplexing the laser light from the first optical element and the laser light from the second optical element, the multiplexer being joined to the second junction by the abovementioned technique; a configuration being adopted whereby the distance between the first optical element and the reflective member is different from the distance between the second optical element and the multiplexer, and the length of the optical path from the first optical element to the multiplexer is equal to the length of the optical path from the second optical element to the multiplexer. | 02-19-2015 |
20160096240 | Subterranean Screen Assembly Manufacturing Method - A filtering assembly is laid flat on an outer shroud. An inner drainage layer is set over the filtering assembly while laid flat such that the inner drainage layer overlaps the filtering assembly. The inner drainage layer is sealed and secured to the outer shroud by diffusion bonding or welding while overlaying the filtering assembly. With the filtering assembly held firm between the inner drainage layer and the outer shroud a spiral winding procedure is commenced to roll the flat assembly into a cylindrical shape. The edges are sealed by welding or diffusion bonding. The spiral winding and seam closure can be done on a perforated base pipe or the base pipe can be inserted into the finished assembly at a later time and secured. Alternatively the filtering assembly and outer shroud, with or without the drainage layer can be wound over a perforated base pipe or a complete screen assembly. | 04-07-2016 |
20160100491 | Method of mounting self-adhesive substrate on electronic device - A method of mounting a self-adhesive substrate on an electronic device comprising steps of: (S | 04-07-2016 |
20160122183 | LID AND METHOD FOR SEALING A NON-MAGNETIC PACKAGE - A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has gold/tin solder preforms attached to a sealing surface of the lid. | 05-05-2016 |