| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 228110100 | Using high frequency vibratory energy (e.g., ultrasonic) | 50 |
| 20110186616 | THERMALLY-INSULATED VIBRATION WELDING TOOL - A welding assembly for forming a weld along a welding interface of a work piece(s) using vibrations includes a welding tool and a thermal barrier. The thermal barrier is at least a chemical and/or mechanical insulating layer positioned adjacent to the welding tool, which minimizes the rate of dissipation of heat generated by the vibrations at or along the welding interface. The welding assembly may also include a wear-resistant layer adjacent to the thermal barrier, which protects the thermal barrier from damage or wear. The welding tool is a portion an anvil assembly and/or a sonotrode assembly. A method of insulating a welding tool includes applying or connecting a thermal barrier to a surface of the welding tool, and minimizing the rate of dissipation of heat generated by the vibrations at or along the welding interface using the thermal barrier, which includes an insulating layer. | 08-04-2011 |
| 20130075454 | TORSION SONOTRODE, ULTRASONIC WELDING DEVICE AND METHOD FOR PRODUCING A WELDED CONNECTION BY MEANS OF ULTRASONIC SOUND - The invention relates to a torsion sonotrode, comprising two mutually opposing end faces (S | 03-28-2013 |
| 20100140325 | ULTRASONIC JOINING METHOD AND APPARATUS - An ultrasonic joining method and apparatus is provided, by which a large joined area can be obtained in a short period of operating time without damage. The ultrasonic joining apparatus includes a chip and an anvil, between which the first conductor of the first flexible flat cable and the second conductor of the second flexible flat cable as an object to be joined are put. An end surface of the chip facing the anvil is formed flat. The end surface is provided with a plurality of the first straight grooves. The first straight groove is formed extending straight. The plurality of the first straight grooves are arranged in parallel with each other. | 06-10-2010 |
| 20100096437 | BONDING METHOD - A bonding method of applying vibrations to a metal unit including copper while pressing the metal unit onto a bonding object to bond the metal unit to the bonding object is provided. The method includes: applying vibrations to the metal unit and bringing the metal unit into contact with the bonding object while applying the vibrations; gradually increasing a pressing load of the metal unit on the bonding object to a first pressing load; and reducing the pressing load to a second pressing load smaller than the first pressing load and gradually increasing an output power of the vibrations from a first output power to a second output power after the pressing load reaches the first pressing load, the first output power being applied during the first pressing load. | 04-22-2010 |
| 20090230172 | METHOD OF BONDING - The present invention provides a bonding method in which a bonded portion having a sufficient bonding strength can be obtained at a relatively low temperature, for example, in die bonding a semiconductor chip. A metal paste | 09-17-2009 |
| 20130026211 | BONDING TOOL, APPARATUS FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING BONDING TOOL - In some cases, it is difficult to carry out ultrasonic joining of high quality with a conventional bonding tool. A bonding tool includes: a horn that transmits an ultrasonic vibration; an ultrasonic vibrator that is provided at one end of the horn, and generates the ultrasonic vibration; and an electronic component holding part that holds an electronic component, wherein the electronic component holding part has a male fitting part in a shape of a tapering-off, and an electronic component holding face that holds the electronic component on an opposite side to the male fitting part, a female fitting part in a shape according to a shape of the male fitting part is formed in a predetermined face of the horn, and the male fitting part is fitted into the female fitting part via an adhesion layer. | 01-31-2013 |
| 20090294513 | ULTRASONIC WELDING MEMBER FOR SMOOTHING FLEXIBLE BELT SEAMS AND METHOD FOR USING - An ultrasonic welding member for use in welding seamed flexible belts to produce smoother seams having reduced seam thickness. The ultrasonic welding member has a unique configuration, that includes an increased tip surface formed in such a manner that more energy from the horn is dispersed over the seam overlap region for a longer duration of time to produce a smoother and thinner weld. | 12-03-2009 |
| 20130062397 | METHOD FOR WELDING TOGETHER TWO PLANAR COMPONENTS - A method for welding together at least two planar metal components oriented with respect to one another using ultrasound, wherein for the welding operation the components are arranged between a tool transmitting ultrasonic vibrations and a counter-holder and fixed between same by the application of pressure. In order for the components to have a desired orientation with respect to one another after the welding operation that corresponds to the orientation prior to the welding operation, according to the invention the components, prior to applying the ultrasonic vibrations for welding the same together, are deformed by means of at least one projection that projects from the tool and/or the counter-holder beyond the respective working surface using the application of force such that a translatable and rotatable relative movement is suppressed, or substantially suppressed, between the components and that the welding operation is carried out after the deformation. | 03-14-2013 |
| 20130098972 | METHODS FOR ATTACHING CUTTING ELEMENTS TO EARTH-BORING TOOLS AND RESULTING PRODUCTS - Methods of attaching cutting elements to earth-boring tools, comprising abutting a portion a cutting element against at least one surface of an earth-boring tool with a braze material disposed therebetween; and brazing the cutting element to the earth-boring tool by applying high-frequency vibrations to cause the braze material to become flowable. Methods of securing cutting elements to earth-boring tools may comprise at least partially coating a cutting element with a braze material. The cutting element may be at least partially disposed in a pocket formed in a body of an earth-boring tool with the braze material adjacent surfaces defining the pocket. The cutting element and the braze material may be ultrasonically torsionally oscillated to braze the cutting element within the pocket. | 04-25-2013 |
| 20130112735 | ULTRASONIC BONDING SYSTEMS INCLUDING WORKHOLDER AND RIBBON FEEDING SYSTEM - An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation. | 05-09-2013 |
| 20100170935 | METHOD FOR CONNECTING STRANDED WIRES IN AN ELECTRICALLY CONDUCTING MANNER AND ULTRASOUND WELDING DEVICE - An ultrasound welding device and a method for connecting stranded wires in an electrically conducting manner with a metal U-shaped support by ultrasound welding, where the stranded wires are made of individual wires that are essentially aluminum. The sonotrode used according to the invention is a sonotrode has a welding surface which is shaped like an open trapezoid having short base sides as the bottom face during welding, the stranded wires directly contacting the bottom face and the lateral faces that extend therefrom and form an obtuse angle. The overall cross-sectional area F | 07-08-2010 |
| 20090277951 | ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD - There is provided an electronic component mounting apparatus including: a component holder which holds an electronic component; a pressing unit which applies pressure to the held electronic component through the component holder; and an ultrasonic transducer which applies ultrasonic vibration to the held electronic component through the component holder. The component holder includes a horn at one end of which is mounted the ultrasonic transducer and a holding tool which is fixed to the other end of the horn by using bolts and holds the electronic component. The horn has a surface A | 11-12-2009 |
| 20090152327 | WIRE BONDING METHOD - According to an aspect of an embodiment, a wire bonding method includes vibrating a capillary of a bonding head, the capillary having a heater attached thereto at a position corresponding to a node of vibration of the capillary generated by the vibration heating the capillary with the heater and performing a wire bonding operation while heating the capillary with the heater. | 06-18-2009 |
| 20080296349 | Method for treating metal member - A metal member is treated and vibrated with a number of vibrating particles to have the particles to strike and act onto an outer peripheral portion of the metal member in order to smooth the outer peripheral portion of the metal member, the particles are immersed with an additive for allowing the additive to be transmitted from the particles to the metal member and for allowing the outer peripheral portion of the metal member to be polished with the particles, the metal member may have dirt or impurities removed with a sand blasting method. The metal member may be tempered to form an oxidized membrane on the outer peripheral portion of the metal member, and may be immersed with in a rust preventive. | 12-04-2008 |
| 20080265003 | Method of ultrasonic mounting and ultrasonic mounting apparatus using the same - A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip | 10-30-2008 |
| 20080265004 | Method for Producing a Welded Joint Between Electrical Conductors by Means of an Ultrasonic Welding Method - A method for production of a welded connection between at least one first electrical conductor and at least one second electrical conductor, in which the conductors are brought into a compression chamber enclosed by delimitation elements and welded therein by an ultrasound welding device, one of the delimitation elements forming a sonotrode which may be subjected to ultrasound vibration. According to the invention, in order to connect a first conductor in the desired circumference with second conductors, where the total cross-section of the second conductors for connection to the first conductor can optionally be greater than the usual cross-section with the ultrasound device used, the first conductor is welded sequentially with two or more second conductors in the compression chamber. | 10-30-2008 |
| 20090294512 | MEMBER FOR SMOOTHING FLEXIBLE BELT SEAMS AND METHOD FOR USING - An improved member for use in welding seamed flexible belts to produce smoother seams having reduced seam thickness. The improved member has a unique configuration, that includes a ridge defined at an end of the member and further includes a V-shape groove or cut defined in the ridge, which helps facilitate welding of the seam overlap region. | 12-03-2009 |
| 20110266329 | BONDING DEVICE, ULTRASONIC TRANSDUCER, AND BONDING METHOD - A bonding device, particularly for producing bond connections between electrical conductors made of wire material or strip material and contact points of substrates such as electrical circuits, wherein the bonding device comprises a bonding head ( | 11-03-2011 |
| 20090200358 | ULTRASOUND WELDING DEVICE - The present invention relates to a device for ultrasound welding of at least two overlapping sheets, comprising: at least one sonotrode for emitting ultrasound, at least one reaction part disposed at least partially facing the sonotrode, at least one intermediate wall other than a roller, movable relative to the at least one sonotrode and the reaction part, said intermediate wall at least partially defining a gap in which the sheets to be welded are inserted so as to execute at least one seal weld extending parallel in the direction of movement of the intermediate wall at the gap. At least one of the intermediate wall and the sonotrode has a transverse section comprising at least one relief projecting toward the gap. | 08-13-2009 |
| 20100176184 | ULTRASONIC WELDING USING AMPLITUDE PROFILING - A method of ultrasonic welding aluminum parts together includes placing the aluminum parts in an ultrasonic welding apparatus and contacting at least one of the aluminum parts with a horn tip of a weld horn of the ultrasonic welding apparatus. A weld amplitude is profiled during a weld cycle of the ultrasonic welding apparatus by producing a high weld amplitude above 55 μm at the horn tip of the weld horn during an initial period of a weld cycle and producing a low weld amplitude below 55 μm at the horn tip after the initial period. | 07-15-2010 |
| 20100224671 | Method and Apparatus for Ultrasonic Welding of Terminals - A method and apparatus for welding of battery terminals to an interconnect includes: juxtaposing two or more battery cell terminals to each other to create a terminal stack including an innermost terminal and an outermost terminal; juxtaposing a battery cell interconnect with the innermost terminal of the stack; positioning an anvil in contact with the interconnect; directing an air stream against the outermost terminal so that the air stream compresses the terminal stack and urges the innermost terminal into contact with the interconnect; positioning a sonotrode horn in contact with the outermost terminal; and energizing the sonotrode horn to vibrate the terminal stack and thereby make an ultrasonic weld between the stacked terminals of the terminal stack and the interconnect. The air stream is directed at the terminal below the sonotrode horn to capture any debris and a suction removes the debris. | 09-09-2010 |
| 20120125976 | PROCESS FOR REDUCING ALUMINIUM PICK-UP, AND ULTRASONIC WELDING DEVICE - A process for reducing aluminum pick-up and adherence during the ultrasonic welding of aluminum braids which are welded in a vertically and/or horizontally adjustable compression chamber of an ultrasonic welding device. The static tool parts which delimit the compression chamber have working surfaces made from polycrystalline diamond (PCD). | 05-24-2012 |
| 20100288819 | Method and device for connecting a cable to an electrical connection elements - The invention relates to a method for connecting a cable to an electrical connection element ( | 11-18-2010 |
| 20100219229 | BONDING TOOL AND ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD - A bonding tool, including: a component mounting unit including a horn that has a heater insertion hole, in which a heater is inserted with a predetermined clearance, and transmits ultrasonic vibration, an ultrasonic transducer that is fixed on the horn and produces the ultrasonic vibration, and an electronic component holder that is fixed on the horn, holds an electronic component and is heated by the heater; a leg that supports the horn on both sides of the horn at nodal points of the ultrasonic vibration on the horn; a supporter that holds the leg; and a heater holder that holds the heater on both sides of the horn, wherein the leg and the heater holder are formed integrally with each other. | 09-02-2010 |
| 20110017806 | FORMING GAS KIT DESIGN FOR COPPER BONDING - A wire bond apparatus and method can include wire bonder head having a capillary there through and a bond wire within the capillary. A forming gas inlet to the capillary allows injection of forming gas directly into the wire bond head capillary. The forming gas can be forced from the end of the capillary to accurately envelop an end of the bond wire in forming gas during free-air ball formation, which can decrease oxidation of the free-air ball during formation, reduce a quantity of forming gas used, and result in a more symmetrical free-air ball and an improved bond wire attachment. | 01-27-2011 |
| 20110042444 | ULTRASONIC WELDING APPARATUS AND ULTRASONIC WELDING METHOD - An ultrasonic welding apparatus | 02-24-2011 |
| 20100065613 | ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD - In a direction parallel to a direction | 03-18-2010 |
| 20110248069 | ULTRASONIC WELD PAD FOR WELDING BATTERY CELL TABS - A weld pad for an ultrasonic welding horn for welding a battery cell tab is described. The weld pad includes a plurality of inner knurls having at least one sharp edge; and a plurality of outer knurls surrounding the plurality of inner knurls, the outer knurls being shorter than the inner knurls and having a rounded outer edge. A method of welding battery cell tabs using the weld pad is also described. | 10-13-2011 |
| 20110062218 | ULTRASONIC BONDING METHOD OF ELECTRIC WIRE - In an ultrasonic bonding method of an electric wire in which the electric wire | 03-17-2011 |
| 20090127317 | DEVICE AND METHOD FOR PRODUCING A BONDING CONNECTION - A bonding device and method for producing a bonding connection is disclosed. One embodiment provides a bonding stamp and an ultrasonic generator coupled thereto. The ultrasonic frequency and an effective length, which is given by the distance between the lower end of the bonding stamp and the coupling location of the ultrasonic generator at the bonding stamp in the vertical direction, are coordinated with one another in such a way that the following holds true: | 05-21-2009 |
| 20090127316 | APPARATUS AND METHOD FOR PRODUCING A BONDING CONNECTION - One aspect relates to a bonding apparatus for producing a bonding connection between a bonding wire and a bonding partner. The bonding apparatus includes a heel shaper, which is provided for avoiding damage to the bonding wire in the heel region during the bonding operation. | 05-21-2009 |
| 20100320257 | Ultrasonic welding device and method for welding two components together - The invention relates to a ultrasonic welding device for welding two components (B | 12-23-2010 |
| 20100181368 | GOLF CLUB ASSEMBLY USING ULTRASONIC WELDING - A process for ultrasonic welding of a shaft to a golf club head is disclosed herein. The process involves positioning a tip end of a shaft within a bore of a hosel of the golf club head and imparting vibrational energy at least 20 kiloHertz to the interface to ultrasonically weld the shaft to the interior wall of the hosel. The diffusion of materials creates a strong attachment off the shaft to the golf club head. | 07-22-2010 |
| 20090001135 | SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD - A semiconductor manufacturing apparatus operable to simultaneously apply supersonic vibration to two bonding sites located at different heights to simultaneously perform bonding of the two bonding sites, the apparatus includes: a cylindrical body; a first protrusion provided on an outer peripheral surface of the cylindrical body and receiving supersonic vibration propagated through the cylindrical body; and a second protrusion provided on the outer peripheral surface of the cylindrical body and receiving supersonic vibration propagated through the cylindrical body. A distance between an axial center of the cylindrical body and the tip of the first protrusion is generally equal to the distance between the axial center of the cylindrical body and the tip of the second protrusion. A tip surface of the first protrusion and a tip surface of the second protrusion are on different planes, respectively. | 01-01-2009 |
| 20120125977 | ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE BONDS USING ULTRASONIC TRANSDUCERS - A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another. | 05-24-2012 |
| 20090057376 | Automated evacuation and sealing process - An automatic chamber evacuating method, system, and apparatus are disclosed, which include a nest, wherein a region or chamber, such as for example the reference chamber of an absolute pressure sensor, may be placed. A switch is used to initiate an automatic process whereby an air operated chuck seals to a tubular region protruding from the chamber via compressed air. An evacuating device connected to the tubular region by the chuck then applies a vacuum which evacuates the chamber. When the chamber has been sufficiently evacuated a message is sent to a programmable logic controller which then outputs a signal to an ultrasonic welding apparatus. The ultrasonic welder crimps and seals the tubular region thereby quickly and efficiently creating a permanent vacuum in the chamber. | 03-05-2009 |
| 20110121057 | BONDING APPARATUS AND BONDING METHOD - The present invention is a bonding apparatus which bonds a first object to be bonded and a second object to be bonded by bringing a bonding member into contact with an upper surface of the second object to be bonded placed on an upper surface of the first object to be bonded and ultrasonically vibrating the second object to be bonded by the bonding member, and the bonding member includes: a contact portion brought into contact with the second object to be bonded; and a holding portion holding the second object to bonded. With this structure, it is possible to prevent the object to bonded from sliding sideways to thereby properly bond the objects to be bonded to each other, even with a low pressing force. | 05-26-2011 |
| 20120080507 | SOLAR SUBSTRATE RIBBON BONDING SYSTEM - An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates. | 04-05-2012 |
| 20120085812 | SOLAR SUBSTRATE RIBBON BONDING SYSTEM - An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates. | 04-12-2012 |
| 20090152326 | ULTRASONIC WELDING-BASED MICROFLUIDIC DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an ultrasonic welding-based microfluidic device, the method including: forming a bottom board having two welding stoppers formed right and left and having a certain height and a certain interval; forming a top board having two energy directors formed with an interval greater than the interval between the two welding stoppers; putting the top board on the bottom board to locate the energy directors at the outside of welding stoppers, respectively; and welding the top board to the bottom board by using ultrasonic welding, wherein a channel is formed between the two welding stoppers without additional energy directors. Accordingly, it is possible to prevent a phenomenon that a fluid irregularly flows due to an uneven surface formed on a side of the channel while the energy directors are melted. | 06-18-2009 |
| 228111000 | With treating other than heating | 5 |
| 20110278349 | WIRE BONDING APPARATUS AND WIRE BONDING METHOD - Provided is a wire bonding apparatus including: a wire cutting unit configured to cut a wire by bonding the wire using a capillary and then moving the capillary and a first clamper upward while the first clamper remains closed; and a wire extending unit configured to extend a tail wire from a tip end of the capillary by moving the capillary upward and then moving the capillary and the first clamper upward in a state in which the first clamper is opened and a second clamper is closed. The wire bonding apparatus having such a structure effectively prevents the wire from falling out and bending. | 11-17-2011 |
| 20090184152 | Soldering Method, Semiconductor Module Manufacturing Method, and Soldering Apparatus - A soldering method for soldering an electronic component onto a circuit board is provided. The soldering method uses a cooling circuit board as the circuit board. The cooling circuit board includes an insulation substrate and a metal heat sink. The insulation substrate has a front surface with a metal circuit and a rear surface to which the heat sink is fixed. The heat sink has a refrigerant passage. The electronic component is arranged on the metal circuit with solder in between. A heated heating medium is supplied to the refrigerant passage when heating and melting the solder. | 07-23-2009 |
| 20120205423 | WIRE END PROCESSING METHOD - A wire end processing method includes tree steps. In a core wire portion exposing step, a sheath of a wire is stripped so as to expose a core wire portion composed of a plurality of element wires. In a core wire portion unifying step, ultrasonic vibration is applied to the exposed core wire portion while applying a pressure thereto, thereby causing the plurality of the element wires to rub against one another so as to unify the core wire portion. In a terminal connecting step, the unified core wire portion is press-contacted or press-fitted to the terminal. | 08-16-2012 |
| 20120006882 | CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME - A method of forming a conductive bump is provided. The method includes the steps of: ( | 01-12-2012 |
| 20110180590 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPARATUS - A terminal of a compact wire loop with a great strength of bonding is formed by a method including: a first folding step in which a tip end of a capillary is raised by a height of H | 07-28-2011 |
| 228111500 | Soldering or liquid phase bonding | 5 |
| 20100140327 | Spot Heat Wirebonding - Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating electromagnetic energy from a heat source and transmitting heat to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is used in the formation of a wirebond. | 06-10-2010 |
| 20100140326 | BONDING TOOL, ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD - A bonding tool comprises: a horn which transmits an ultrasonic vibration; a ultrasonic transducer which is provided on one end of the horn, and produces the ultrasonic vibration; a heater disposition part, in which a heater is disposed, which is provided between the one end of the horn and the other end of the horn; a bonding action part which is provided between the one end of the horn and the other end of the horn, holds an electronic component, and is heated by the heater; a first cooling part, through which a fluid flows, which is provided between the heater disposition part and the one end of the horn; and a second cooling part, through which a fluid flows, which is provided between the heater disposition part and the other end of the horn. | 06-10-2010 |
| 20080203138 | Method of mounting an electronic component and mounting apparatus - In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps. | 08-28-2008 |
| 20120000964 | BATTERY TAB JOINTS AND METHODS OF MAKING - A method of soldering battery cell tabs to a conductor is provided. The battery cell tab and the conductor are made of a material independently selected from aluminum, copper, or nickel-plated copper. The method include preparing an assembly of the battery cell tabs and the conductor with a first joining surface of one battery cell tab face-to-face with a first joining surface of the conductor, at least one joining surface having a layer of solder thereon; pressing the assembly so that the facing joining surfaces engage the solder, and heating the solder to a temperature above a melting temperature of the solder in the absence of a fluxing agent while limiting the displacement of the joining surfaces to a predetermined value; and holding the joining surfaces against each other and solidifying the solder to form a soldered joint between the battery cell tabs and the conductor. | 01-05-2012 |
| 20090020589 | Ultrasonic brazing of aluminum alloy and aluminum matrix composite - A method of ultrasonic brazing metal matrix composite, which forms a reinforced composite bond without filling welding wire with reinforcement or adding alloy element to generate ceramic phase, includes the steps of setting a filler metal; introducing ultrasonic vibration to braze in air; dissolving the base materials, and introducing ultrasonic wave again. The method performs the aluminum brazing at low temperature. The periodic time of brazing is shorter and the cost is lower than the conventional brazing methods. The strength, service temperature and dimensional stability of the joint are close to the base article. | 01-22-2009 |
