Class / Patent application number | Description | Number of patent applications / Date published |
219121780 | Beam position control | 75 |
20080223836 | METHOD AND SYSTEM FOR LASER PROCESSING - A laser processing system has a platform to support a work piece to be processed, a laser to operate on the work piece, a laser control system to control operation of the laser, and a system control to provide instructions to the laser control system based upon at least the work piece to be processed. A method of manufacture includes identifying at least a portion of a structure to be laser processed, creating a set of instructions to direct a laser to process the portion of the structure, operating the laser in accordance with the set of instructions to laser process the portion of the structure, measuring at least one of an electrical characteristic or a mechanical characteristic to obtain an actual electrical characteristic value, comparing the actual value to a target value to determine if further processing is needed, if further processing is needed, automatically adjusting operation of the laser to reprocess the portion of the structure, and repeating the measuring, comparing and adjusting until the actual value matches the target value within a given tolerance. | 09-18-2008 |
20080223837 | USE OF PREDICTIVE PULSE TRIGGERING TO IMPROVE ACCURACY IN LINK PROCESSING - A predictive pulse triggering (PPT) method enables precise triggering of a laser beam in a link-processing system. The PPT method entails triggering the laser beam based on estimated relative motion parameters of the target and laser beam axis. The PPT method allows for a six-fold improvement in laser positioning accuracy over the conventional, entirely measurement-based method. | 09-18-2008 |
20080264914 | Sensor Arrangement for a Laser Machine Tool and an Insulator for such a Sensor Arrangement - An insulator for a sensor arrangement of a laser processing machine comprises an outer insulating part of plastics material for electrical shielding and an inner shielding part of a non-conductive heat-resistant material for shielding against laser irradiation and/or heat. | 10-30-2008 |
20090001062 | High Dynamics Laser Processing Machine - Multi-axis laser cutting systems are provided. The cutting systems include a multi-axis, relatively high acceleration drive system, which includes drives that are configured to generate balanced inertial forces. In some implementations, the drives operate according to a polar coordinate systems. | 01-01-2009 |
20090071948 | LASER BEAM PROCESSING APPARATUS - This laser beam processing apparatus includes a fiber laser oscillator, a laser beam branching unit, a laser beam injecting unit, a fiber transmission system, a laser beam irradiating unit, and a processing table. Based on a fiber laser beam, which is oscillation-outputted from the fiber laser oscillator, the laser beam branching unit executes simultaneous multi-branching from the fiber laser beam into a plurality of branched laser beams. The laser beam injecting unit injects the branched laser beams respectively into optical fibers for transmission and the laser beam irradiating units condense and apply the branched laser beams from the optical fibers for transmission respectively to processing points. | 03-19-2009 |
20090120917 | Laser Processing Machines and Methods for Providing a Gas to the Beam Guide of a Laser Processing Machine - ABSTRACT A laser processing machine having a laser processing head that is open to a workpiece has a device for providing gas to the laser beam guide that introduces a first gas through a first gas inlet into the laser beam guide and introduces a second gas through a second gas inlet into the laser beam guide. | 05-14-2009 |
20090230104 | LASER SHOCK PEENING - An embodiment of an apparatus for laser shock peening a treatment region of a metallic member includes a base oriented along a longitudinal axis; an engagement member actuable to engage a surface of the metallic member, the base in connection with engagement member; and a laser peening head adapted to emit laser radiation disposed with the base, the laser peening head moveable relative to the longitudinal axis. | 09-17-2009 |
20100096372 | OPERATING HEAD, PARTICULARLY FOR A LASER MACHINE - A management method for a redundant axis laser machine of the type comprising a movable structure controlled by actuators and operated according to a first set of variables (X, Y, Z, A) and an operating head operated according to a second set of said variables (W, B, C), said first set of variables (X, Y, Z, A) and second set of variables (W, B, C) identifying one or more redundant variables. Such method envisions a filtering allowing the work trajectory to be decomposed into defined trajectories for a first low dynamic system made up of said first set of variables (X, Y, Z, A) and a second high dynamic system made up of said second set of said variables (W, B, C), respectively. | 04-22-2010 |
20110100968 | LASER MACHINE MONITORING - A laser processing machine head, a laser processing machine head monitoring system, and a method of monitoring an optical element of a laser processing machine feature a light-transmissive optical element and an optical element holder defining a cavity in which the optical element is retained against rotation. A light source mounted to the holder directs a beam of light into the optical element through a peripheral surface of the optical element. A light receiver is responsive to light from the light source reflected through the optical element. Monitoring a signal from the light receiver allows a status of the optical element to be assessed. | 05-05-2011 |
20110315667 | METHOD AND APPARATUS FOR RELIABLY LASER MARKING ARTICLES - The invention is a method and apparatus for laser marking a stainless steel specimen with commercially desirable marks. The method includes providing a laser processing system having a laser, and laser optics and a controller with pre-determined laser pulse parameters, selecting the pre-determined laser pulse parameters associated with the desired mark, and directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired marks including temporal pulse widths greater than about 1 and less than about 1000 picoseconds. | 12-29-2011 |
20120031883 | LASER MACHINING DEVICE AND LASER MACHINING METHOD - The machining device is equipped with a fiber laser oscillator for oscillating laser light of a top hat shape, and a light collecting lens and a machining head for collecting the laser light of the top hat shape and emitting the laser light onto a machining target such that the beam diameter of the laser light of the top hat shape at a position where light intensity becomes the one corresponding to a machining threshold of the machining target is about three times the size of the beam diameter of laser light in a Gaussian mode at the same position, when the laser light in the Gaussian mode has a beam quality substantially the same as that of the laser light of the top hat shape. | 02-09-2012 |
20120217230 | METHODS AND SYSTEMS FOR TRIMMING CIRCUITS - Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot. | 08-30-2012 |
20120312793 | LASER PROCESSING APPARATUS - A laser processing apparatus including a pulsed laser oscillator for oscillating a pulsed laser beam, a focusing objective lens for focusing the pulsed laser beam, and a varifocal lens provided between the pulsed laser oscillator and the focusing objective lens. The varifocal lens has a piezoelectric device to change its focal length according to the period of radio-frequency waves produced by the piezoelectric device. A repetition frequency adjusting unit is connected to the pulsed laser oscillator, and a radio-frequency current frequency adjusting unit is connected to the piezoelectric device. The laser processing apparatus further includes a controller for controlling the repetition frequency adjusting unit and the radio-frequency current frequency adjusting unit so as to produce a phase difference between the repetition frequency of the pulsed laser beam and the frequency of the radio-frequency current to be applied to the piezoelectric device of the varifocal lens. | 12-13-2012 |
20130026146 | PRODUCTIVITY AND EFFICIENCY IMPROVEMENTS FOR LASER REPETITIVE PULSE MELT DEEP CRYSTALLIZATION - The present invention generally relates to methods and apparatus for thermally processing substrates. The apparatus include an energy source, a plurality of chambers, and one or more energy switches. The one or more optical switches are adapted to direct an amount of energy emitted from the energy source to one of the plurality of chambers, and then change switch positions to direct the energy to a second of the plurality of chambers at a preselected time. The plurality of chambers may each include a heated support and a plurality of lamps therein to heat a substrate. The methods generally include thermally processing a first substrate in a first chamber while preheating or aligning a second substrate in a second chamber. After the first substrate is thermally processed, the second substrate is processed in the second chamber using the same energy source as was used to process the first substrate. | 01-31-2013 |
20130068740 | LASER PROCESSING APPARATUS - A pulsed laser beam is applied to a workpiece held on a chuck table by a laser beam applying unit. The laser beam applying unit includes a pulsed laser beam oscillator, a focusing lens, and a piezoelectric motor for displacing the focusing unit in a direction inclined at a predetermined angle (α) with respect to the Z direction. A controller controls the frequency and voltage of an RF current to be applied to the piezoelectric motor in relation to the repetition frequency of the pulsed laser beam to move the focusing unit in the X direction by Δx and in the Z direction by Δz in feeding the chuck table in the X direction, thereby displacing the focal point of the pulsed laser beam to be focused by the focusing lens in the thickness direction of the workpiece held on the chuck table. | 03-21-2013 |
20130112672 | LASER CONFIGURATION FOR ADDITIVE MANUFACTURING - An additive manufacturing assembly includes a work space including a plurality of separate regions and an energy transmitting device for focusing an energy beam to a specific location within one of the plurality of regions within the work space. The energy transmitting device includes features for expanding the workspace for fabricating parts of increased size and volume. | 05-09-2013 |
20130140288 | METHOD AND SYSTEM OF ANNEALING AND REAL-TIME MONITORING BY APPLYING LASER BEAM - A method of annealing and real-time monitoring by applying laser beam includes steps of emitting a laser beam and splitting it into a first light beam and a second light beam; irradiating the first light beam along a first path at a to-be-annealed work-piece in order to process annealing for the work-piece; irradiating the second light beam along a second path at the to-be-annealed work-piece; having the to-be-annealed work-piece changed to an annealed work-piece after the process of annealing is completed for the to-be-annealed work-piece; retrieving a characteristic of a characteristic of changes of properties of matter generated from the second light beam irradiated at the to-be-annealed work-piece and the annealed work-piece. | 06-06-2013 |
20130161300 | MOVING ENCLOSURES FOR LASER EQUIPMENT - Moving enclosures for laser equipment are provided. A machine tool installation is disclosed, including (a) a laser cutting head configured to be movable in three dimensions; (b) a workpiece support configured to support a workpiece in operative relationship with the laser cutting head; (c) a skirt configured to surround the laser cutting head on three sides and intercept light that passes from the head and is reflected off of the workpiece or workpiece support; and (d) a protective cover positioned to intercept light that is reflected off of the workpiece or workpiece support and is not intercepted by the skirt. The skirt and protective cover are configured to move laterally with the laser cutting head. | 06-27-2013 |
20130200053 | LASER PROCESSING CONTROL METHOD - A control system for controlling a laser machining/processing apparatus and uses two separate control modules, each of which operates interdependently with the other. A laser control module contains instructions for controlling the laser beam while a movement control module contains instructions for controlling the movement of the laser apparatus relative to a workpiece. The instructions in each module are executed in parallel and interdependently of the instructions in the other module. The laser control module controls the actions of the laser apparatus while, in parallel, the movement control module controls the relative movements and/or positioning of the laser beam relative to the workpiece. Again, in parallel, the laser control module continuously checks the actual position of the laser apparatus against the desired position where laser action should be executed and, if the difference between the actual and the desired positions are within a predetermined margin of error, the relevant laser action is executed. | 08-08-2013 |
20130319986 | APPARATUS FOR LASER WORKING OF FLAT ELEMENTS - The present invention relates to an apparatus for laser working of flat or basically flat pieces or elements, such as plastic sheets, glass or ceramic sheets, metal plates, wooden panels or fabric slivers of various kinds. In particular, the invention relates to an apparatus provided with a simple structure suitable for supporting and moving a fiber laser head capable of reaching any point of a flat piece by means of a combined crosswise-rotating movement. | 12-05-2013 |
20140008341 | METHOD FOR TREATING A WORK PIECE - A method for machining a workpiece is proposed where a laser beam and/or a workpiece are moved relative to each other and a cutting edge is produced on the workpiece by means of the removal of material by laser ablation. First, initial alignment of the workpiece ( | 01-09-2014 |
20140034626 | ADDITIVE MANUFACTURING - Methods of additive manufacturing a superalloy component are disclosed. In one method a powder bed of superalloy powder is selectively scanned with a focused laser beam in a line-by-line manner; and the spacing between adjacent scan lines is no more than twice the layer thickness being formed. In another method a compressive stress treatment is applied to the surface of the final component prior to separation of said component from the substrate. In a further method a superalloy component is formed on a substrate and the method includes Hot Isostatic Processing of the component wherein the mass of the substrate is reduced prior to the Hot Isostatic Processing. The methods may be combined in a multi-step process. | 02-06-2014 |
20140116998 | LASER PROCESSING APPARATUS - A laser processing apparatus includes worktable for loading a workpiece, a laser emitter, a user interface, a detecting unit, and a controller. The user interface allows inputting a thickness value of the workpiece. The detecting unit includes a signal emitter, a signal receiver for receiving signals emitted by the signal emitter, and a lifting unit. The workpiece is positioned between the signal emitter and the signal receiver. The controller controls the lifting device to adjust a height of the signal emitter and signal receiver relative to the worktable to be equal to a sum of the input thickness value and a focal length of the laser emitter. The controller controls the driving device to adjust a height of the laser emitter relative to the worktable if the signal receiver receives the signals and stop to adjust the laser emitter if the signal receiver does not receive the signals. | 05-01-2014 |
20140138363 | Method for Processing a Workpiece and Processing Device - A method for processing a workpiece with a processing device which has a processing head which can be moved at a defined speed and distance from a surface of the workpiece, the method comprising at least partially detecting a surface topography of the workpiece to be processed, determining a minimum desired operating distance of the processing head from the workpiece with reference to the detected surface topography of the workpiece and a trailing spacing of the processing head associated with the defined speed, and processing the workpiece with the processing head at the established minimum desired operating distance of the processing head from the workpiece. | 05-22-2014 |
20140183174 | HEAT TREATMENT DEVICE FOR CRANK SHAFT - A crankshaft heat treatment device may include a base frame, a jig frame in which a crankshaft is rotatably supported and that is disposed to be able to move in a horizontal direction and in a vertical direction at the base frame, and a laser unit that is disposed in a predetermined fixed position and irradiates laser beam to a pin portion and a journal portion of the crankshaft so as to treat the pin portion and the journal portion with heat. | 07-03-2014 |
20150060422 | APPARATUS FOR LASER MATERIALS PROCESSING - An apparatus for laser materials processing including a laser ( | 03-05-2015 |
20150352665 | Method and Apparatus for Reducing Stripe Patterns - An apparatus comprises an optical detector configured to receive scattered light signals from a surface of a wafer including a plurality of sensor arrays, each of which has a boundary smaller than a boundary of a laser beam, a light source optically coupled to the surface of the wafer, wherein light from the light source hits the surface with a small incident angle and a processor configured to measure a distance between a sensor array boundary and a laser beam boundary, wherein a laser annealing process is recalibrated if the distance is less than a predetermined value. | 12-10-2015 |
20160158887 | DEVICE FOR MACHINING MATERIAL USING A LASER BEAM - A device for guiding a laser beam for machining a work piece, the laser beam being guided via a mirror system and a focusing optical system to processing points on the work piece that are preselectable by a suitable alignment of the mirrors. The mirror system is disposed farther away than the simple focal length from the optical main plane of the optical system. The device makes it possible to machine work pieces having elevations with the aid of a laser scanning device without the occurrence of self-shading. | 06-09-2016 |
20160167166 | LASER PROCESSING METHOD AND LASER BEAM IRRADIATION APPARATUS | 06-16-2016 |
20160193707 | Machine Tool having a Covering Hood Guided in a Displaceable Manner on a Slide Guide Rail | 07-07-2016 |
20180021886 | LASER MACHINING APPARATUS WITH WORKPIECE POSITION ADJUSTING CAPABILITY RELATIVE TO FOCAL POINT OF LASER BEAM | 01-25-2018 |
219121790 | Path adjustment | 8 |
20090050611 | LASER BEAM POSITIONING SYSTEMS FOR MATERIAL PROCESSING AND METHODS FOR USING SUCH SYSTEMS - Laser beam positioning systems for material processing and methods for using such systems are disclosed herein. One embodiment of a laser-based material processing system, for example, can include (a) a radiation source configured to produce a laser beam and direct the beam along a beam path toward a material processing area, and (b) a laser beam positioning assembly in the beam path. The laser beam positioning assembly can include a first focusing element, first and second reflective optical elements (e.g., movable mirrors), and a second focusing element. The first focusing element can focus the laser beam to a first focal point between the first and second reflective optical elements. The first and second reflective optical elements can direct the laser beam toward the material processing area while the laser beam has a decreasing or increasing cross-sectional dimension (e.g., diameter). The second focusing element can focus the laser beam and direct the beam toward a material processing area to modify a workpiece at least proximate to the material processing area. | 02-26-2009 |
20090308854 | AUTOMATIC RECIPE MANAGEMENT FOR LASER PROCESSING A WORK PIECE - To better address these problems, one or more characteristics are measured from a work piece ( | 12-17-2009 |
20100078419 | POST-LENS STEERING OF A LASER BEAM FOR MICRO-MACHINING APPLICATIONS - In a laser micro-machining system including a simple focusing lens located between a laser source and a beam steering mechanism along the path of a laser beam pulse. The focusing lens being a simple single-element spherical lens with an optical axis of the focusing lens located inline with a laser beam input from the laser source. The focusing lens located further away from a work piece than the beam steering mechanism. An active beam path management system moves the simple focusing lens in concert with and relative to the beam steering mechanism to maintain a focal point coincident with a surface of the work piece at all deflection angles affected by the beam steering mechanism. The focusing lens is rapidly moveable in concert with the beam steering mechanism to maintain a constant beam path length from the lens output to the work piece at all times. | 04-01-2010 |
20100122972 | APPARATUS FOR IMPROVING RESIDUAL STRESS IN TUBULAR BODY AND ADJUSTMENT METHOD OF THE SAME - Aims are to provide a tubular-body residual-stress improving apparatus and an adjustment method thereof capable of adjusting irradiation position with favorable reproducibility, even when an optical fiber is eccentric. In the tubular-body residual-stress improving apparatus, an optical control unit ( | 05-20-2010 |
20130270240 | BEAM PROCESSOR - A beam processor for processing a work surface of a workpieee W by irradiating the work surface with a beam, includes: an output source for outputting the beam, a beam moving device for moving the beam output from the output source; and a plurality of reflectors disposed on an optical path of the beam between the beam moving device and the work surface for reflecting the beam moved by the beam moving device and conducting the beam to the work surface, wherein the plurality of reflectors is inclined a predetermined angle corresponding to an incident direction of the beam so that the beam moved by the beam moving device is conducted nearly vertically to a different position of the work surface. | 10-17-2013 |
20140217076 | ROBOT SYSTEM AND METHOD FOR CONTROLLING THE ROBOT SYSTEM - A robot system includes a robot, a controller, and a laser emitter which is configured to emit a laser beam to a target workpiece and which is configured to be moved by the robot. The controller is configured to control the laser emitter to emit the laser beam based on information regarding an arbitrarily-shaped work path and movement information of the laser emitter. The controller is configured to determine whether or not a reference position of the arbitrarily-shaped work path on the target workpiece is located in a predetermined range of the laser emitter while the laser emitter is moving. The controller is further configured to control the laser emitter to emit the laser beam to the arbitrarily-shaped work path if the reference position is located in the predetermined range. | 08-07-2014 |
20150048070 | SEALING APPARATUS, SUBSTRATE-SEALING APPARATUS INCLUDING THE SAME AND SUBSTRATE-SEALING METHOD - The sealing apparatus includes a measuring unit moving above a sealing unit to measure a pattern of the sealing unit, a laser beam irradiation device moving along the measuring unit to irradiate a laser beam onto the sealing unit, and a control unit controlling a moving path and a size of a focusing area of the laser beam irradiation device according to the pattern of the sealing unit that is measured in the measuring unit. | 02-19-2015 |
20160096233 | LASER MICRO/NANO PROCESSING SYSTEM AND METHOD - A laser micro/nano processing system ( | 04-07-2016 |
219121800 | Swept or scanned | 12 |
20080217301 | Laser beam processing machine - A laser beam processing machine comprising a laser beam application means for applying a pulse laser beam to a workpiece held on a chuck table and a controller, wherein the laser beam application means comprises a laser beam oscillation means for oscillating a pulse laser beam, an optical axis changing means for deflecting the optical axis of a pulse laser beam oscillated from the laser beam oscillation means in the processing-feed direction, and a condenser for converging a pulse laser beam whose optical axis has been deflected by the optical axis changing means; and the controller comprises a memory for storing a plurality of processing position coordinates set in the workpiece, controls the optical axis changing means according to the frequency of a pulse laser beam oscillated from the laser beam oscillation means and determines a plurality of predetermined processing position coordinates to be processed to ensure that the time interval between pulses of the pulse laser beam to be applied to the same processing position coordinates becomes a predetermined time or more when one pulse of the pulse laser beam is applied each time to a plurality of predetermined processing position coordinates to be processed sequentially and the pulse laser beam is applied to a plurality of predetermined processing position coordinates to be processed a predetermined number of times sequentially repeatedly. | 09-11-2008 |
20080308534 | PYROMETER FOR LASER ANNEALING SYSTEM COMPATIBLE WITH AMORPHOUS CARBON OPTICAL ABSORBER LAYER - In a laser annealing system for workpieces such as semiconductor wafers, a pyrometer wavelength response band is established within a narrow window lying between the laser emission band and a fluorescence emission band from the optical components of the laser system, the pyrometer response band lying in a wavelength region at which the optical absorber layer on the workpiece has an optical absorption coefficient as great as or greater than the underlying workpiece. A multi-layer razor-edge interference filter having a 5-8 nm wavelength cut-off edge transition provides the cut-off of the laser emission at the bottom end of the pyrometer response band. | 12-18-2008 |
20090261078 | RADIANT ANNEAL THROUGHPUT OPTIMIZATION AND THERMAL HISTORY MINIMIZATION BY INTERLACING - The time between illumination of adjacent zones of a workpiece edge is extended by a long cool-down period or delay, by interlacing a radiation beam scanning pattern. During the cool-down period, the beam successively scans (along the fast axis) two rows separated by about half the wafer diameter, and travels back and then forth (along the slow axis) across the distance between the two rows, while the radiation beam source continuously generates the beam. | 10-22-2009 |
20100314360 | METHOD AND APPARATUS FOR FAST AND LOCAL ANNEAL OF ANTI-FERROMAGNETIC (AF) EXCHANGE-BIASED MAGNETIC STACKS - A method (and structure) of thermally treating a magnetic layer of a wafer, includes annealing, for a predetermined short duration, a magnetic layer of a single wafer. | 12-16-2010 |
20110006043 | APPARATUS FOR FORMING PATTERN USING LASER - An apparatus for forming a pattern using a laser is provided. The apparatus includes a pattern storing unit, a controller, a laser oscillating unit, an X-Y driver, a header unit, and a stage. The pattern storing unit stores data on light guide patterns of a discontinuous straight line shape. The controller transmits position signal of the light guide patterns to the X-Y driver and simultaneously, transmits a switching signal to the laser oscillating unit. The laser oscillating unit outputs a laser beam synchronized with a movement of the header unit. The X-Y driver moves the header unit and the stage. The header unit moves along a first guide rail. The stage moves along a fixed second guide rail in the front and rear direction of the light guide panel. | 01-13-2011 |
20110062125 | APPARATUS FOR FORMING PATTERN ON LIGHT GUIDE PANEL - An apparatus for forming a pattern is provided. The apparatus includes a pattern storing unit, a controller, a laser oscillating unit, an X-Y driver, a header unit, and a stage. The pattern storing unit stores data on a light guide pattern. The controller reads out the data on the light guide pattern, and transmits a position signal of each light guide pattern to the X-Y driver and simultaneously, transmits a switching signal to the laser oscillating unit. The laser oscillating unit outputs a laser beam synchronized with a movement of a header unit. The X-Y driver moves the header unit and the stage. The header unit moves along a fixed first guide rail in the left and right direction of the light guide panel. The stage moves along a fixed second guide rail in the front and rear direction of the light guide panel. | 03-17-2011 |
20120205347 | Scanned laser light source - The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation. | 08-16-2012 |
20140138359 | METHOD AND SYSTEM FOR DAMAGE REDUCTION IN OPTICS USING SHORT PULSE PRE-EXPOSURE - A method of processing an optical element includes providing the optical element. A surface region of the optical element includes one or more pre-cursors. The method also includes raster scanning a laser beam across the optical element. The laser beam comprises a plurality of laser pulses, each of the laser pulses being characterized by a pulse length less than 1 ns. The method further includes exposing the one or more pre-cursors to the laser beam and observing a light emission event from one of the one or more pre-cursors. | 05-22-2014 |
20140263201 | LASER SYSTEMS AND METHODS FOR AOD ROUT PROCESSING - Laser systems and methods improve the processing velocity of the routs or other features to avoid exceeding the laser system's dynamic limits. A laser processing system divides laser processing commands corresponding to a plurality of features to be processed on or in the workpiece into process segments. Laser processing parameters and beam trajectories are simulated to determine a maximum processing velocity for each of the process segments. The laser processing system selects one or more of the maximum processing velocities for processing the plurality of features on or within the workpiece. A slowest processing velocity of the maximum processing velocities may be used to process each of the plurality of features. Alternatively, each continuous rout sequence may be processed using a different processing velocity. In other embodiments, each process segment is processed using its corresponding maximum processing velocity. | 09-18-2014 |
20160172819 | LIGHT AMPLIFYING DEVICE AND LASER PROCESSING APPARATUS | 06-16-2016 |
20160250718 | LASER MACHINING APPARATUS | 09-01-2016 |
20220134474 | OPTICAL DEVICE AND LASER MACHINING DEVICE - Optical device ( | 05-05-2022 |
219121810 | Condition responsive | 24 |
20080210673 | Femtosecond Laser Micromachining Device with Dynamic Bean Conformation - The device comprises a laser-type coherent light radiation source transmitting ultrashort pulses, a dynamic beam shaping arrangement and an arrangement for using and processing a laser beam. The dynamic beam shaping arrangement comprises an optical system including a part for actively modifying the laser beam wavefront and a detecting part, excepting a phase meter, used for three-dimensionally shaping the beam. These parts are connected by a feed-back circuit and the active modifying part comprises a first fixed or active component and a second active component. | 09-04-2008 |
20090206066 | Position-Based Laser Triggering for Scanner - A method of directing a laser beam along a desired path on a workpiece and at spaced intervals delivering a pulse of laser energy comprising the steps of: using a position command stream and position feedback to control the positioning of galvanometer scanned mirror or mirrors to define the path a laser beam will travel to intersect the desired path on the workpiece; and using position feedback alone to determine when a pulse of laser energy is delivered to strike the workpiece at locations such that are uniformly overlapped along the path notwithstanding variations in galvanometer mirror velocity. | 08-20-2009 |
20090242531 | PHOTONIC CLOCK STABILIZED LASER COMB PROCESSING - Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece. | 10-01-2009 |
20100326974 | METHOD FOR IMPROVING RESIDUAL STRESS IN TUBULAR BODY - An object is to provide a method and an apparatus for improving a residual stress in a tubular body, which are enabled to improve the residual stress reliably by clearly defining controlling rage for treatment conditions without depending on an installation state and configuration of the tubular body. When a cylindrical tubular body ( | 12-30-2010 |
20130082037 | METHOD OF ABLATING A THREE-DIMENSIONAL SURFACE USING A LASER ABLATION DEVICE AND THROUGH THE USE OF A CALIBRATION STEP; DEVICE FOR IMPLEMENTING SUCH A METHOD - The invention relates to a method characterized in that it comprises—a step (E | 04-04-2013 |
20130082038 | METHOD OF DETECTING CONDENSING SPOT POSITION IN LASER BEAM PROCESSING APPARATUS - A method of detecting a condensing spot position in a laser beam processing apparatus, including: a detection position setting step of setting a plurality of Z-axis directional positions in a range from a starting point to an ending point of detection positions into which the condenser is positioned; a laser beam processed groove forming step of sequentially positioning the condenser into the detection positions in the range from the starting point to the ending point, performing a predetermined interval indexing feeding by operating indexing feeding means each time the detection position for the condenser is changed, and forming a laser beam processed groove of a predetermined length in the plate-shaped body at each of the detection positions for the condenser; and a laser beam processed groove imaging step of imaging the laser beam processed grooves formed in the plate-shaped body by imaging means. | 04-04-2013 |
20130220983 | Device and Method for Joining Workpieces by Means of a Laser Beam and Movable Pressing Element - The invention relates to a method and a device for joining workpieces by means of a laser beam, wherein the device comprises: a scanner optics for guiding the laser beam; a press element, which, during the joining process, is pressed along a pressing direction onto at least one of the workpieces; and a housing, which houses the scanner optics and the laser beam running from the scanner optics towards the workpieces, wherein the press element forms a part of the housing and is movable relative to the rest of the housing by at least one degree of movement freedom. | 08-29-2013 |
20130299474 | Fiber Laser Apparatus and Method of Aligning Laser Light Irradiation Position - A fiber laser apparatus that generates invisible laser light using an amplification optical fiber having a single-mode core and outputs the invisible laser light via an output optical fiber is provided. The fiber laser apparatus includes a visible laser light source that generates visible laser light, an introducing section that introduces the visible laser light generated by the visible laser light source into a core of one of the amplification optical fiber and the output optical fiber, and a drive unit that drives, in a case of performing alignment of an irradiation position of the invisible laser light with respect to a workpiece, the visible laser light source and emits the visible laser light via the core of the output optical fiber. | 11-14-2013 |
20130334184 | ROTOR BALANCE DEVICE FOR LASER REMOVAL AND METHOD THEREOF - The present invention provides a rotor balance device and a method thereof. The device includes a balance measurement unit and at least one laser unit. The balance measurement unit has a correcting platen for supporting the rotor and at least one sensor. The laser unit receives a sensing signal outputted by the sensor to identify at least one position to be removed on the rotor and controls a laser beam to illuminate the position to be removed. By the inventive device and method, an improved degree of balance and reduced working hours can be obtained. | 12-19-2013 |
20140027421 | Method of Determining a Focal Point or Beam Profile of a Laser Beam in a Working Field - In a method for determining the focal point or the beam profile of a laser beam, which can be deflected in the x and y directions by a scanner optic or an x-y-movement unit and can be displaced in the z direction by a focusing optic or a z-movement unit, at a plurality of measurement points in the two-dimensional working field or three-dimensional working space of the laser beam. An aperture diaphragm, followed by a detector, is arranged at each measurement point. At each measurement point, for x-y-focal point or beam profile measurements, the laser beam is moved by the scanner optic or the x-y-movement unit in an x-y-grid over the measurement aperture in the aperture diaphragm, and, at each grid point, the laser power is measured by the detector, the scanner axis of the scanner optic or the x-y-movement unit being stationary. For z-focal point measurements, the laser beam is displaced by the focusing optic or the z-movement unit in the z direction within the measurement aperture in the aperture diaphragm. The laser power is measured by the detector at each grid point. The focal point and/or the beam profile of the laser beam is then determined at each measurement point from the measurement values. | 01-30-2014 |
20140042133 | Apparatus for focusing a laser beam and method for monitoring a laser processing operation - An apparatus for focusing a laser beam on a workpiece includes at least one transmissive optical element which is arranged at a tilting angle with respect to a plane perpendicular to a beam axis of the laser beam, the transmissive optical element comprising a first side and a second side through which the laser beam passes, a spatially-resolving detector configured to detect laser radiation reflected from the transmissive optical element, and an image evaluation device coupled to the detector, the image evaluation device configured to distinguish laser radiation reflected from the first side of the optical element from laser radiation reflected from the second side of the optical element. | 02-13-2014 |
20140175071 | Method for Detecting Defects During a Laser-Machining Process and Laser-Machining Device - Detection of defects during a machining process includes: moving a laser beam along a predefined path over multiple workpieces to be machined so as to generate a weld seam or a cutting gap in the workpieces; detecting, in a two-dimensional spatially resolved detector field of a detector, radiation emitted and/or reflected by the multiple workpieces; selecting at least one detection field section in the detection field of the detector based on laser beam control data defining movement of the laser beam along the predefined path or based on a previously determined actual-position data of the laser beam along the predefined path, wherein each detection field section comprises a region encompassing less than the entire detection field; evaluating the radiation detected in in the selected detection field section; and determining whether a defect exists at the weld seam or the cutting gap based on the evaluated radiation. | 06-26-2014 |
20140209584 | LASER MACHINING DEVICE - A laser machining device includes a stationary platform configured for carrying a workpiece, a movable platform opposite to the stationary platform, a laser machining unit and a distance measuring unit both fixed on the movable platform. The laser machining unit machines micro-structures on the workpiece. The distance measuring unit measures a distance between the movable platform and the workpiece, and adjusts the movable platform to make sure a laser beam emitted by the laser machining unit is focused on the workpiece. | 07-31-2014 |
20140251964 | LASER ASSEMBLY WITH PACKAGE BEAM POINTING REGISTRATION - A laser assembly ( | 09-11-2014 |
20140263223 | LASER SYSTEMS AND METHODS FOR AOD TOOL SETTLING FOR AOD TRAVEL REDUCTION - Laser systems and methods insert a settling time before and after each tooling action. A peak AOD excursion generally occurs at the transition in velocity between inter-feature moves and tooling moves. This transition occurs both before tooling (on the approach to the tooling location) and after tooling (on the departure from the completed tooling location to the next location). By adding a settling delay on each end of the tooling period, the AOD excursion is allowed to settle to a lower value. This then allows higher inter-tooling velocities (for high throughput) while keeping the AOD travel excursion within the bounds of the system's AOD configuration. | 09-18-2014 |
20140312018 | Dynamic Height Adjusting System and Method for Head Assembly of Laser Processing System - The present invention relates to a dynamic height adjusting system and method that uses capacitance for a head assembly of a laser processing system throughout a process cycle. The proposed system and method involves use of a single frequency in which a change in phase is measured and processed to determine changes in height and distance between a work piece with an increased reliability. The system further enables operative computerized processor control and substantial improvements in process control signal and feedback distribution throughout an integrated system and optional remote interfaces. | 10-23-2014 |
20140339208 | LASER MACHINING DEVICE AND ADJUSTING METHOD FOR SAME - A laser machining device includes a laser emitting device, a supporting device including a supporting surface, a controller, and optical detecting units mounted on the supporting surface. The laser machining device sets an X-Y coordinates having an original point and moves to being substantially above one of the optical detecting units. | 11-20-2014 |
20150076126 | WELDING AND CUTTING LASER DISPLACEMENT COMPENSATION SYSTEM - A movement control system is provided for cutting and welding applications which uses a laser movement detection system to detect deflection or displacement in a guide rail movement system. A movement controller controls the movement of the cutting or welding operation based on the detected laser beam displacement. | 03-19-2015 |
20150090702 | LASER CUTTING DEVICE AND METHOD - Provided is a laser cutting device and method which changes a cutting speed of a laser according to a difference between characteristics (absorption coefficients) of an object to be cut, so as to uniformly supply an energy of laser to the whole of the object, thereby preventing the object from being incompletely cut. A laser cutting device includes a database that stores information about a cutting pattern, a moving part that changes a location of a laser beam emitted to an object to be cut, a characteristic value input part that receives speed information from a user according to locations on the cutting pattern, and a control part that adjusts a moving speed of the laser beam by controlling the moving part according to the speed information from the characteristic value input part, and the information about the cutting pattern from the data base. | 04-02-2015 |
20150343561 | Laser Machining System and Method for Machining Three-Dimensional Objects From A Plurality of Directions - A laser machining system for machining a work-piece includes a laser scanning head, external optical subsystems, and an image acquisition device. The external optical subsystems correspond to optical channels that include a first optical channel and a second optical channel. The laser scanning head controls an optical path so that a laser beam is directed and focused on the work-piece through the first optical channel and the second optical channel at different times. The first optical channel and the second optical channel correspond to respective specific portions of the work-piece to be machined by the laser beam. The image acquisition device is positioned to view the work-piece through the optical path. The image acquisition device acquires via the first optical channel one or more images of the work-piece to determine a displacement of the work-piece with reference to a best optical focus position of the second optical channel. | 12-03-2015 |
20160031038 | Laser Processor and Laser Processing Method - A laser processing machine includes a first focal point change amount calculating unit for calculating the time difference between an irradiation period during which a laser beam is irradiated from a laser processing head and a down time, or calculating the amount of change in focal point position from a detected temperature of an optical system in its entirety. A second focal point change amount unit calculates the amount of change in focal point position relative to a temperature change of a protective glass. A focal point position correcting unit causes a processing machine main body control device to correct the focal point position with the use of the sum of the change amounts of focal point position calculated by the first and second focal point change amount calculating units. | 02-04-2016 |
20160059350 | Method for Measuring the Distance Between a Workpiece and a Machining Head of a Laser Machining Apparatus - According to a method for measuring the distance between a workpiece and a machining head of a laser machining apparatus, a machining head is provided, which has a housing that has an interior and an opening for emergence of the laser radiation from the machining head. The laser radiation is directed on to the workpiece, after it has passed through the interior and the opening. An object beam is directed on to the workpiece by a light source of an optical coherence tomograph in such a manner that the object beam passes through the interior and the opening before being incident upon the workpiece. In addition to the object beam, a measuring beam passes through the interior. The measuring beam is used to compensate falsifications of the measured distance that have been caused by pressure fluctuations in the interior. The measuring beam in this case may be reflected at a reflective face that is formed on an inner face of an outlet nozzle that comprises the opening, which inner face delimits the interior. | 03-03-2016 |
20160059351 | LASER BEAM MACHINING APPARATUS WITH HIGH-SPEED POSITIONING FUNCTION - When an operation is performed in a direction (Z-axis direction) in which a machining head is brought closer to workpiece, a numerical controller that controls a laser beam machine avoids a collision of the machining head with the workpiece by switching to gap control when a gap sensor detects a gap amount between the machining head and the workpiece. At this point, whether to perform the operation to bring the machining head closer to the workpiece by gap control using a detection value of the gap sensor or by moving the machining head to a position determined by parameters can be selected using a mode switching unit. | 03-03-2016 |
20160184923 | LASER PROCESSING DEVICE HAVING FUNCTION FOR AVOIDING INTERFERENCE AT THE TIME OF NOZZLE APPROACH - A laser processing device having a function for avoiding interference during an approach motion of a processing nozzle of the laser processing device. When a distance between a processing nozzle and a workpiece is equal to a setting value where gap control can be started, it is judged as to whether or not the mechanical position of the processing nozzle is above a predetermined processing start position. When the mechanical position of the processing nozzle is higher than the processing start position, a controller judges that an abnormality occurs by which laser processing cannot be carried out, and automatically stops the approach motion of the processing nozzle. | 06-30-2016 |