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219 - Electric heating

219050000 - METAL HEATING (E.G., RESISTANCE HEATING)

219121110 - By arc

219121600 - Using laser

219121670 - Cutting

219121680 - Etching or trimming

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DocumentTitleDate
20100126972Method of removing coating resin layer of resin-coated metal tube - The present invention provides a method of removing a coated resin layer of a resin-coated metal tube whereby a resin layer can be stripped rapidly without the risk of damaging a plating layer. In a method of removing a coating resin layer of a resin-coated metal tube according to the present invention, a coating resin layer is removed by a rotating body of a rotating body stripping apparatus, whereupon the coating resin layer is removed by a laser beam of a laser apparatus.05-27-2010
20110186553COATING LAYER REMOVING APPARATUS AND METHOD FOR THE SAME - The present invention discloses a coating layer removing apparatus and a method for the same. The apparatus of the present invention comprises a transport device displacing an electrode plate; a laser device having a laser head arranged above the displacement path of the electrode plate; and a control center electrically connected to the transport device and the laser device. The method of the present invention comprises mounting an electrode plate on the transport device; using the control center to set the speed of displacing the electrode plate, and program the time interval, count and penetration depths of the laser beams; and using the device of the present invention to form exposed areas equidistantly on the electrode plate. The apparatus of the present invention automatically removes a coating layer with a laser beam without directly contacting the electrode plate. Therefore, the present invention can fast form exposed areas of high quality.08-04-2011
20130075376RELIEF PRINTING PLATE MANUFACTURING METHOD, RELIEF PRINTING PLATE CREATING APPARATUS, AND RECORDING MEDIUM - A relief printing plate manufacturing method includes: generating binary image data based on multivalued image data representing a printing image; generating, from the binary image data, target stereoscopic shape data; calculating, based on the target stereoscopic shape data, exposure amount data; providing a predetermined exposure amount to an outside image adjacent pixel in a range of predetermined pixels adjacent to an ON pixel; and applying laser light to an area of OFF pixels based on the exposure amount data to engrave a portion outside of an area, and applying laser light to the outside image adjacent pixel based on the predetermined exposure amount to form a relief having a projecting shape with a corner part of a flange part of a top face of the relief at least partially chamfered.03-28-2013
20100072181Method and apparatus for laser engraving - A method and apparatus for laser engraving a three-dimensional pattern on a surface. A moveable laser head having a plurality of laser beams is provided. Preferably, the number of laser beams is four. Each beam is capable of being individually adjustably controllable. A carriage slideway is provided. The carriage slideway has a carriage axis whose length corresponds to the width of the roller that is to be engraved. The apparatus also has a laser slideway with an axis that is perpendicular to the carriage axis. The laser slideway is mountable to the carriage slideway such that the laser slideway is controllable to slide along the carriage axis slideway. The moveable laser head is mounted to the laser slideway such that the laser head is controllable to slide along the laser axis of the laser slideway. An indexing roller mechanism is provided when engraving rollers. When engraving flat surfaces, a second carriage slideway is substituted for the indexing roller mechanism. The second carriage slideway is perpendicular to the first one. The use of multiple laser beams enables the ability to use a novel engraving method based on pre-calculated volumes of material that are to be removed. The surface is first apportioned into laminated layers of material to be removed. The laminated layers are divided into elementary volumes to be removed, with each elementary volume corresponding to a particular laser beam. Then, a three-dimensional patch size is determined. The total surface is then divided into a series of contiguous patches such that each patch corresponds to a particular calculated elementary volume wherein the engraved surface can be produced without visible borderlines or pitch lines in the case where a roller or flat surface is engraved. This is accomplished by slightly shifting the respective deflected beams in each patch as that patch is engraved, such that each engraved patch overlaps the adjacent patch.03-25-2010
20080302771LASER ENGRAVING SYSTEM AND ENGRAVING METHOD - A laser engraving system (12-11-2008
20090057280Method for Embellishing Surface of Handle via Laser Engraving Machine - A method for embellishing surface of a handle includes: first step: preparing a body of the handle injected from a mold; second step: laser-engraving the body of the handle to form a plurality attached portions thereon; third step: preparing a skin with pattern or color and laser-cutting the skin to form a plurality of ornamental skins corresponding to the attached portions; fourth step: attaching the ornamental skins to the corresponding attached portions on the body and getting a finished handle.03-05-2009
20100044357COLOR SENSING FOR LASER DECOATING - A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive detector and analyzer. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the laser source is external to the integrated device and a fiber optic cable is used to connect the laser source to the integrated device.02-25-2010
20100108651METHOD FOR INCORPORATING A STRUCTURE INTO A SURFACE OF A TRANSPARENT WORKPIECE - The invention relates to a method for incorporating a structure (M) into a surface (O) of a workpiece (W) that is transparent in a certain wavelength range. For this purpose the surface (O) to be structured is brought into contact with a target surface (05-06-2010
20100108650Automatic Positioning/Engraving Method For A Laser Engraving Machine - An automatic positioning/engraving method for a laser engraving machine is provided. A pen carriage of the laser engraving machine is moved above a provided workpiece. Before engraving, at least two positioning points on the peripheries of the workpiece are first positioned. A processor is used to calculate and determine a center for the positioning points. Finally, a driving unit is utilized to move the pen carriage to the center point and begin pattern engraving or cutting operation.05-06-2010
20100320179Method for Creating Trench in U Shape in Brittle Material Substrate, Method for Removing Process, Method for Hollowing Process and Chamfering Method Using Same - A method for creating a trench in U shape according to which trenches in lines which are continuous or broken or curved in a plane can be easily created on the surface of a substrate, as well as a chamfering method using this, are provided.12-23-2010
20100006547REVERSE ACTING RUPTURE DISC WITH LASER-DEFINED ELECTROPOLISHED LINE OF WEAKNESS AND METHOD OF FORMING THE LINE OF WEAKNESS - A reverse acting rupture disc is provided having a laser defined electropolished line-of-weakness recess, and an improved method of forming an electropolished line-of-weakness recess in a reverse acting rupture disc that assures full opening of the disc upon reversal. A rupture disc blank is pre-bulged, final bulged, and then provided with a layer of resist material. A laser is used to remove at least a portion of the layer of resist material corresponding to a desired line-of-weakness recess in the concave face of the bulged rupture disc. The disc is then subjected to an electropolishing operation to remove metal from the lased area of the rupture disc, thereby forming a lustrous polished line-of-weakness recess in the disc of desired configuration and of a predetermined depth that is related to material thickness. The electropolished line of weakness is defined by spaced opposed channel portions separated by a central raised crown portion wherein the channel portions are of greater depth than the crown portion. The burst/reversal pressure of the disc having an electropolished line-of-weakness recess may be selectively controlled by varying the pre-bulging pressure on the disc.01-14-2010
20100006546Laser Engraving of Ceramic Articles - A method for engraving an image on a surface of an article selected from a group consisting of brick, ceramic tile, concrete pavers and natural stone articles, comprising providing a laser engraving apparatus comprising a steerable laser beam, steering the laser beam continuously over a first beam path on the surface to provide an engraved image and repeatedly traversing the laser beam over a path substantially parallel to the first beam path and incrementally spaced therefrom to define a perimeter of the engraved image. The method further comprises steering the laser beam within an infill area defined by the perimeter of the engraved image to provide a plurality of engraved segments extending within infill area.01-14-2010
20090242526LASER MICROMACHINING THROUGH A PROTECTIVE MEMBER - A small feature at a target location on a working surface of a workpiece is laser machined. A laser beam propagating along a beam path is directed for incidence at the target location on the working surface to machine the small feature. A focusing lens sized to converge the laser beam on the working surface is set in the beam path at a short working distance from the working surface to laser machine the small feature and thereby eject target material from the workpiece back toward the focusing lens. A sacrificial protective member positioned between the focusing lens and the working surface transmits without appreciable distortion or adsorption the laser beam focused by the focusing lens and incident on the working surface. The sacrificial protective member intercepts the ejected target material to prevent a sufficient amount of it from reaching and thereby appreciably contaminating the focusing lens.10-01-2009
20130213943LASER MACHINING METHOD - A laser machining method includes a trial machining step of placing a machined material serving as a target of laser machining on a machining table and performing trial machining of the machined material before performing actual machining for cutting out a product from the machined material, wherein the trial machining step includes a cutting-out step of cutting out a trial-machining cut piece having a preset shape from a trial machining area that is set in the machined material by laser machining, a detecting step of detecting whether the trial-machining cut piece remains in the machined material by using the machined material having undergone the cutting-out step as a target to confirm whether the trial-machining cut piece is present, and a determining step of determining whether shifting to the actual machining is permitted according to a detection result at the detecting step.08-22-2013
20130213944System for Laser Direct Writing of MESA Structures Having Negatively Sloped Sidewalls - In the field of photolithography systems designed to produce electronic components using the technique known as “lift-off” on a plane substrate comprising one or more plane photosensitive layers, a system uses a laser direct-write technique. It comprises optical or mechanical means configured such that the useful part of the optical beam is inclined on the plane of the photosensitive layers in order to create profiles with an inverted slope within said layers, the useful part of the optical beam being the part of the optical beam which effectively contributes to creating said profiles. In one preferred embodiment, the system comprises means for partial shuttering of the optical beam situated in the neighborhood of the focusing optics.08-22-2013
20120234807LASER SCRIBING WITH EXTENDED DEPTH AFFECTATION INTO A WORKPLACE - Systems and methods for laser scribing provide extended depth affectation into a substrate or workpiece by focusing a laser beam such that the beam passes into the workpiece using a waveguide, self-focusing effect to cause internal crystal damage along a channel extending into the workpiece. Different optical effects may be used to facilitate the waveguide, self-focusing effect, such as multi-photon absorption in the material of the workpiece, transparency of the material of the workpiece, and aberrations of the focused laser. The laser beam may have a wavelength, pulse duration, and pulse energy, for example, to provide transmission through the material and multi-photon absorption in the material. An aberrated, focused laser beam may also be used to provide a longitudinal spherical aberration range sufficient to extend the effective depth of field (DOF) into the workpiece.09-20-2012
20080296272MULTIPLE LASER WAVELENGTH AND PULSE WIDTH PROCESS DRILLING - Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.12-04-2008
20110278268WRITING AN IMAGE ON FLEXOGRAPHIC MEDIA - A method writing an image to a surface of a flexible media mounted on a imaging drum includes mounting a flexible media on the imaging drum; scanning the surface of the flexible media with an optical displacement sensor (ODS); providing the scanned data to a microprocessor; providing imaging data to said microprocessor; combining the scanned data and the imaging data; sending the combined data to an imaging head; and imaging said combined data on the flexible media.11-17-2011
20110278269METHOD AND SYSTEM FOR ELECTRICAL CIRCUIT REPAIR - A system and method of repairing electrical circuits including employing a laser and at least one laser beam delivery pathway for laser pre-treatment of at least one conductor repair area of a conductor formed on a circuit substrate and employing the laser and at least part of the at least one laser beam delivery pathway for application of at least one laser beam to a donor substrate in a manner which causes at least one portion of the donor substrate to be detached therefrom and to be transferred to at least one predetermined conductor location.11-17-2011
20100089882HIGH SPEED LASER SCRIBING METHOD OF FRAGILE MATERIAL - In a method for scribing fragile material, a laser beam is irradiated onto a work plate of the fragile material. The work plate is heated by absorption of the irradiated laser beam and generating thermal stress by the heating. The laser beam is formed by a plurality of laser beam groups arranged along a beam scanning direction on a same line, and the plurality of laser beam groups are divided into two groups. One takes charge of initial heating and rising up temperature of the work plate, and another takes charge of temperature holding of the work plate. The laser beam intensity corresponding to each of the laser beam groups is adjusted so as to obtain optimum values.04-15-2010
20100326971THERMAL BARRIER COATING REMOVAL VIA SHOCKWAVE STRESSES - A method for removing a thermal barrier coating on a surface of a machine component, the method comprising the steps of arranging plural shockwave generators so as to focus shockwave energy on a target area of the machine component; and subjecting the target area of the thermal barrier coating to plural focuses shockwaves such that the thermal barrier coating is caused to delaminate and can be removed from the machine component.12-30-2010
20090294420Laser Cutting of Glass Along A Predetermined Line - Disclosed are systems and methods for separating a glass sheet along a predetermined line. Laser beams are generated and shaped into elongated laser beams. Arm members are provided that are pivotally coupled together to form a chain of arm members. Each elongated laser beam is directed therefrom a respective laser beam toward the glass sheet to form a contiguous chain of elongated laser beams thereon a surface of the glass sheet. The arm members can be moved to move the contiguous chain of elongated laser beams along the predetermined line to scoring the glass sheet along the predetermined line.12-03-2009
20090321399DYNAMIC SCRIBE ALIGNMENT FOR LASER SCRIBING, WELDING OR ANY PATTERNING SYSTEM - Methods and systems for improving the alignment between a previously formed feature and a subsequently formed feature are provided. An exemplary method can include laser scribing a workpiece (12-31-2009
20090014424Method For Manufacturing Layered Elements With Incisions - A manufacturing method may include forming incisions through an incision layer that is secured to a transfer layer. After defining the incisions, the incision layer is secured to a substrate layer, and the transfer layer is then separated from the incision layer. The manufacturing method may be applied to elements used in footwear, apparel, or a variety of other products.01-15-2009
20080237204Laser Beam Machining Method for Printed Circuit Board - A laser beam machining method for a printed circuit board, for enabling to bring the depth of a bottom surface of grooves within an overlap region, which is irradiated with a laser beam, repetitively, to be nearly equal to that of the bottom surface of grooves within other regions, comprises the following steps of: fixing a line beam 10-02-2008
20100102043LASER ENGRAVING APPARATUS - In laser engraving apparatus for engraving a gray-scale image on a plastic ID-card, the laser is a modulatable optically pumped semiconductor laser. Focusing optics focus a beam from the laser into a focal spot about 10 micrometers in diameter. The ID-card is mounted on a turntable which is rotated such that the focal spot sweeps over the ID card. The turntable is translated in a direction transverse to the rotation direction and the laser is modulated such that the engraved gray-scale image is formed by a matrix of parallel black lines of various length and spacing.04-29-2010
20120168412APPARATUS AND METHOD FOR FORMING AN APERTURE IN A SUBSTRATE - A method of forming an aperture in a substrate having a first side and a second side opposite the first side includes irradiating the substrate with a laser beam to form a laser-machined feature within the substrate and having a sidewall. The sidewall is etched with an etchant to change at least one characteristic of the laser-machined feature. The etching can include introducing the etchant into the laser-machined feature from the first side and the second side of the substrate. An apparatus and system for forming an aperture are also disclosed.07-05-2012
20100000977METHOD FOR REMOVAL OF CONTENT-BASED STRIPE AND THE LIKE ON A SUBSTRATE AND EQUIPMENT THEREOF - The present invention relates to a method for removal of content based stripe and the like on a substrate. More particularly relates to a method of removal of content based stripe and the like, using lasers. The method comprising acts of generating and applying predetermined waves or pulses of the laser beams onto the determined content-based stripe and the like for removal from the substrate.01-07-2010
20120091105DITHERED SCANNED LASER BEAM FOR SCRIBING SOLAR CELL STRUCTURES - Provided herein are methods of scribing a solar cell structure to create isolated solar cells. The methods involve scanning and high frequency dithering of a laser beam across a solar cell structure such that the beam creates a stepped scribed line profile. In certain embodiments, a structure including an absorber layer sandwich between two contact layers is provided. The scanned dithered laser beam ablates all of these layers on one part of the scribe line while the back contact layer on another part of the scribe line, leaving an exposed back contact layer. The scribe electrically isolates solar cell structures on either side of the scribe line from each other, while providing a contact point to the back contact layer of one of solar cell structure for subsequent cell-cell interconnection.04-19-2012
20080264911Non-contact laser carving process and the equipment - A non-contact laser carving process and the equipment. By the orientation of an orienting module, the center of a wafer can be amended and oriented to the orienting module precisely. By the rotation of the orienting module and an optical sensor of a transmission mechanical module, the center of the wafer can be obtained precisely. By the compensation of the optical sensor, a specific boundary position is oriented. No matter what the external diameter of the wafer is, the specific boundary position in the wafer can be carved by laser precisely through the transmission mechanical module cooperated with a laser-carving unit, and a specific number can be carved at the specific boundary position of each wafer. Therefore, the wafer can be efficiently traced and controlled, and the amount of the wafer can be figured out easily to raise the quality of the wafer.10-30-2008
20090026184Method and Apparatus for Scale Manufacture Without Substantial Removal of Material - A method of making metrological scale for scale reading apparatus includes directing a laser beam onto a scale substrate (01-29-2009
20090321398METHOD AND DEVICE FOR MACHINING A TARGET USING A FEMTOSECOND LASER BEAM - The invention relates to a method and device for machining a target using a femtosecond laser beam. The invention consists in taking advantage of the deterministic nature of the ablation threshold and the nonlinear dependence thereof through the use of amplitude or phase pupillary filtering using the polarising effect or any other technique in order to reduce significantly the machining dimensions obtained by focusing a laser beam in nanotechnologies. One such filtering process modifies the distribution of the intensity in the focal plane such as to reduce the maximum of the central component of the spectrum of laser pulses while maintaining the bright rings below the deterministic ablation threshold. The invention associates the femtosecond ablation technique with deterministic threshold and the apodisation technique.12-31-2009
20110139757METHOD AND APPARATUS FOR PROCESSING SUBSTRATE EDGES - A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing methods that use large volumes of purified water and hazardous chemicals including solvents, acids, alkalis, and proprietary strippers.06-16-2011
20100264122LASER SCRIBER WITH SELF-CORRECTING MECHANISM AND SELF-CORRECTION METHOD THEREOF - A laser scriber with a self-correcting mechanism comprises a laser scribing unit, a detection unit, a control unit and a drive unit. The laser scribing unit scribes a pattern on a solar panel according to a drive signal. The detection unit detects the pattern to generate a correction signal. The control unit corrects a scribing program based on the correction signal. The drive unit generates the above-described drive signal based on the scribing program. A self-correction method of a laser scribing process comprises the steps of: setting a scribing program on a laser scriber; fixing a solar panel to the laser scriber and performing a position calibration procedure; scribing a pattern on the solar panel via the laser scriber based on the scribing program; examining whether the pattern corresponds to a specification or not; and if no, automatically generating a patch program to replace the scribing program.10-21-2010
20090242527Method and Apparatus for Processing Coated Spectacle Lenses - By means of the method and the apparatus in accordance with the invention, coated spectacle lenses are processed to form at the latter joining surfaces which permit a reliable adhesive bonding of the lenses to the bridge and the lugs of rimless spectacles. The method provides that for the respective spectacle lens two processing areas are predetermined with the shape, size and location thereof at the lens and that in the two predetermined processing areas the coating at the lens is locally removed by irradiation by a laser beam. The apparatus excels by a holder including at least one mount for a lens, a laser beam device including a laser head for generating a laser beam, a positioning device for moving the holder and the laser head relative to each other in a reference plane and a control means wherein for the laser beam device and the positioning device, wherein the laser power, the relative position between the laser head and the at least one lens as well as a scanning motion of the laser beam are controllable by the control means wherein.10-01-2009
20090255911LASER SCRIBING PLATFORM AND HYBRID WRITING STRATEGY - Laser scribing can be performed on a workpiece (10-15-2009
20090261082Methods and systems for forming microstructures in glass substrates - A method for forming microstructure cavities in a glass substrate includes directing a first laser pulse onto the glass substrate thereby forming a first microstructure cavity having a tapered configuration. The first laser pulse may have first spot area on the surface of the glass substrate. A second laser pulse having a second spot area on the surface of the glass substrate may be directed onto the glass substrate thereby forming a second microstructure cavity having a tapered configuration. The second spot area may be substantially the same as the first spot area and may overlap the first spot area such that a portion of the sidewall disposed between first microstructure cavity and the second microstructure cavity is ablated. After the portion of the sidewall is ablated, the diameter of each of the first and second microstructure cavities may be less than the diameter of the first spot area.10-22-2009
20100163536Substrate treatment device and method and encoder scale treated by this method - The invention provides a substrate treatment method and apparatus. Embodiments show a substrate in the form of a rotary encoder ring having a pattern of marks producable by means of a laser treatment device controllable to produce the pattern in the correct manner whilst there is continuous relative displacement between the ring and the laser treatment device.07-01-2010
20100147811APPARATUS FOR LASER SCRIBING OF DIELECTRIC-COATED SEMICONDUCTOR WAFERS - A groove pattern is scribed into a silicon-nitride layer on a silicon wafer using four independently scanned, focused beams of laser radiation. Each focused beam is scannable within one of four scan-field positions on a turntable. The wafer is transported incrementally from the first scan-field position to the second, third and fourth scan-field positions. The scanned focused laser beam in each scan-field position scribes a portion of the groove pattern on the wafer, with scribing of the groove pattern being completed at the fourth scan-field position.06-17-2010
20100155380Micro Matrix Data Marking - The invention provides methods and systems for the application and reading of micro markings for coding of information for placement on the surfaces of individual very small devices. In preferred embodiments, a two dimensional micro matrix of markings or dots is realized on a scale of a 25 um cell size and smaller.06-24-2010
20100163535Method of forming a pattern on a work piece, method of shaping a beam of electromagnetic radiation for use in said method, and aperture for shaping a beam of electromagnetic radiation - A method of forming a pattern (07-01-2010
20090078687Laser Processing Apparatus, Processed Data Generating Method, and Computer Program - The present invention aims to rapidly and easily create processed data for scan controlling a laser light beam, and to create the processed data for the laser processing apparatus at high precision. A setting plane corresponding to a scanning region of a laser marker is displayed on a processed data generating device. A user operates the processed data generating device to arrange the processing pattern on the setting plane. Here, a marker head coincides an optical axis of the laser light beam L on a position corresponding to the reference point of the processing pattern, and photographs a work W with a camera which light receiving axis is coaxial with the optical axis of the laser light beam L. A photographed image monitor displays the photographed image along with a symbol indicating the position of the light receiving axis of the camera.03-26-2009
20100213180Jig for a laser engraving machine and method of use - A jig is disclosed for properly positioning an article to be engraved by a laser engraving machine along with a method of using the jig and machine. The jig includes a light source that projects beams of light onto an article to be engraved. The light beams typically intersect and thereby indicate the correct location for the article to be positioned for engraving. A retaining device is provided to engage the article and hold it in the proper place during engraving.08-26-2010
20100252543LASER-SCRIBING TOOL ARCHITECTURE - The present disclosure relates to apparatuses and systems for laser scribing a vertically-oriented workpiece. In many embodiments, a laser-scribing apparatus includes a frame, a first fixture coupled with the frame, a second fixture coupled with the frame, a laser operable to generate output able to remove material from at least a portion of the workpiece, and a scanning device coupled with the laser and the frame. The first fixture is configured for engagement with a first portion of the workpiece. The second fixture is configured for engagement with a second portion of the workpiece. When the workpiece is engaged by the first and second fixtures the workpiece is substantially vertically oriented. The scanning device is operable to control a position of the output from the laser relative to the workpiece.10-07-2010
20100243623METHOD OF CUTTING SUBSTRATE - A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel.09-30-2010
20100078415METHOD AND APPARATUS FOR MATERIAL PROCESSING - An apparatus processes a surface of an inhabitable structure. The apparatus includes a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure. The laser base unit includes a laser generator and a laser head coupled to the laser generator. The laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes an anchoring mechanism adapted to be releasably coupled to the structure and releasably coupled to the laser head. The apparatus further includes a controller electrically coupled to the laser base unit. The controller is adapted to transmit control signals to the laser base unit in response to user input.04-01-2010
20090321400DEVICE AND METHOD FOR RECORDING INFORMATION IN A DATA CARRIER - A method and a device for recording information within an information surface region in a data carrier, consisting of a carrier layer and a transparent plastic layer, by means of at least one laser beam of a point-like laser source wherein the laser beam is deflected via at least one deflection surface, in particular a mirrored surface before it impinges on the data carrier, wherein the at least one deflection surface is arranged in a region between the laser source and the data carrier and outside an intermediate region bounded by notional straight connection lines between the laser source and edge regions of the information surface region.12-31-2009
20090107965METHOD OF MANUFACTURING AND TESTING MONOFILAMENT AND MULTI-FILAMENTS SELF-RETAINING SUTURES - The present invention relates to self-retaining (“barbed”) systems for surgical procedures, methods of manufacturing self-retaining systems for surgical procedures, included their uses and testing. In various embodiments of the invention, a device and method for barbing sutures uses a laser to cut the suture under appropriate temperature and tensile strength conditions. In various embodiments of the invention, a device and method tests the tensile strength and elasticity of a barbed monofilament or multifilament suture. In various embodiments of the invention, a potting material can be used to retain one end of the suture for manufacture or testing.04-30-2009
20100294746LASER SCRIBING PLATFORM WITH MOVING GANTRY - Laser scribing can be performed on a workpiece such as a substrate with layers formed thereon for use in a solar cell without need to move the workpiece during the scribing process. A series of lasers can be used to concurrently remove material from multiple positions on the workpiece. These laser outputs are directed to the workpiece using an optical system partially attached to a gantry. The gantry can be moved longitudinally and the portion of the optical system attached to the gantry can be moved laterally so that the combined outputs of all lasers can be directed to substantially any position on the workpiece without moving the workpiece.11-25-2010
20100314365Method and Apparatus for Using a Laser to Both Score and Emblazon a Wrapping Sheet - A laser is used to both score and emblazon a sheet to thereby provide a scored, emblazoned sheet. That scored, emblazoned sheet is then used to wrap an item (such as, but not limited to, a foodstuff item). By one approach this can comprise providing a plurality of lasers and exposing a substantially taut sheet to this plurality of lasers. So configured, these lasers are used substantially contemporaneously with one another such that each laser both scores and emblazons a corresponding portion of the substantially taut sheet to provide the aforementioned scored, emblazoned sheet.12-16-2010
20110127242METHODS FOR LASER SCRIBING AND SEPARATING GLASS SUBSTRATES - A method of forming a scribe line in a glass substrate having a compressive surface layer and an inner tension layer includes forming a defect through the compressive surface layer that is offset from a first edge of the glass substrate. The defect extends through the compressive surface layer to partially expose the inner tension layer. A scribe line is generated through the compressive surface layer by translating the glass substrate with respect to a laser beam and a cooling jet. The scribe line is initiated at the defect and is terminated at a termination location along the scribe line that is offset from a second edge of the glass substrate.06-02-2011
20110127244METHODS FOR LASER SCRIBING AND SEPARATING GLASS SUBSTRATES - Methods of forming scribe vents in a strengthened glass substrate having a compressive surface layer and an inner tension layer are provided. In one embodiment, a first and second defect is formed to partially expose the inner tension layer. A first scribe vent may be generated in a first scribing direction by translating a laser beam and a cooling jet on a surface of the strengthened glass substrate at a first scribing speed. A second scribe vent intersecting the first scribe vent may be generated in a second scribing direction by translating the laser beam and the cooling jet on the surface of the strengthened glass substrate at a second scribing speed that is greater than the first scribing speed. The defects may be perpendicular to the scribing directions. In another embodiment, the first scribe vent may be fused at an intersection location prior to generating the second scribe vent.06-02-2011
20110108531LASER BEAM SCRIBING SYSTEM - Techniques are described for laser-scribing a feature on a surface in relation to a reference feature on that surface, such as a feature created by a previous placement of the laser beam. In particular, using a laser beam focusing and deflection system to direct a laser scribing spot onto a surface through an optical path, an optical detection system provides reliable detection of the position of an existing feature on the surface as viewed through the optical path of the deflection system. Based on feedback provided from the detection system to the deflection system, the position of the laser beam may be modified through the deflection system in relation to the viewed feature to scribe a subsequent feature on the surface which tracks the existing feature in real time. A method of scribing to accomplish the objectives is also disclosed.05-12-2011
20100133245METHOD OF MARKING OR INSCRIBING A WORKPIECE - The present invention provides a method of marking or inscribing a workpiece (06-03-2010
20100133244METHOD OF MARKING OR INSCRIBING A WORKPIECE - The present invention provides a method of and apparatus for marking or inscribing a workpiece (06-03-2010
20090065487Method of Providing a Machine Readable Marking - A method of providing a machine readable marking on a substrate being a part of an actuator is described, in which the marking includes at least first and second marks, and the method including repeatedly firing a laser device so that at each of a plurality of row positions of a first area of the substrate, substrate material is heated and displaced thus to provide a depression in the surface of the substrate at least partially surrounded by displaced material, the method including providing a plurality of rows of such depressions in the first area to form the first mark, repeatedly firing a laser device so that at each of a plurality of row positions of a second area of the substrate, substrate material is heated and displaced thus to provide a depression in the surface of the substrate at least partially surrounded by displaced material, the method including providing a plurality of rows of such depressions in the second area to form the second mark, and wherein each depression of the rows of depressions of the first and second marks has a depth determined from the general surface of the substrate less than 4 μm, and the height of the displaced material determined from the general surface of the substrate is not greater than 4 μm.03-12-2009
20090230102Method for Creating Scribe Line on Brittle Material Substrate and Apparatus for Creating Scribe Line - A method and an apparatus for creating a scribe line are provided, so that a brittle material substrate can be divided into pieces along highly straight scribe lines.09-17-2009
20110127243ELECTRODE CONTACT CONTAMINATE REMOVAL - Manufacturing an electrode assembly comprising forming an intermediate assembly comprising a carrier member having one or more electrode contacts embedded therein, the surface of the electrode contacts having a layer of carrier member material thereon; removing the layer of carrier member from the surface of the one or more electrode contacts, wherein a residual amount of the carrier member material remains on the surface of at least one of the electrode contacts; and substantially removing the residual carrier member material from the surface of the at least one electrode contact so as to increase the effective surface area of the at least one electrode contact.06-02-2011
20100038349LASER MARKING METHOD AND LASER MARKING SYSTEM - A laser marking method and a laser marking system are provided. The laser marking method includes the following steps. Firstly, a substrate having at least M pattern lines is provided, wherein M is an integer which is larger than or equal to 1. Next, a laser beam is provided. Then, the laser beam is divided into at least two laser sub-beams including a first laser sub-beam and a second laser sub-beam. Afterwards, the second laser sub-beam is aimed at an (N-M)-th pattern line, and an N-th pattern line is marked by the first laser sub-beam, wherein N is an integer which is larger than or equal to M.02-18-2010
20110062127LASER-BASED METHOD AND SYSTEM FOR REMOVING ONE OR MORE TARGET LINK STRUCTURES - Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.03-17-2011
20100243624RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND METHOD FOR PRODUCING RELIEF PRINTING PLATE - A relief printing plate precursor for laser engraving, including a relief forming layer formed by thermally crosslinking a resin composition including (A) a polymer having an ethylenically unsaturated bond in a side chain wherein the polymer is an acrylic resin or a polyvinyl acetal, (B) carbon black, and (C) a thermopolymerization initiator.09-30-2010
20090314752IN-SITU MONITORING FOR LASER ABLATION - In a system where scribe lines are formed by a series of partially-overlapping ablation spots, discontinuities can be detected by capturing an intensity of light generated during each instance of ablation for a respective spot. In any instance where the intensity of light given off falls below a desired threshold, such that the ablation spot might not sufficiently overlap any adjacent spot, the position of that instance can be captured such that another attempt at ablation can be carried out at that location.12-24-2009
20080314882METHOD OF MAKING A BIOSENSOR - The present invention relates to a method of forming a biosensor. The method includes providing a substrate coated with a electrically conductive material, ablating the electrically conductive material to form electrodes and a code pattern, wherein there is sufficient contrast between the conductive coating and the substrate such that the code pattern is discernible, and applying a reagent to at least one of the electrodes.12-25-2008
20100320180TEXTURED IMPRESSIONS FOR MAKING JEWELRY COMPONENTS - A purpose-designed textured impression is described for producing components used in jewelry making. The purpose-designed texture impression comprises a geometric shape for a specific component of an end-item jewelry piece, a texture or design that specifically follows the geometric shape, and a means for applying the impression of specific shape and integral texture into a desired medium.12-23-2010
20110210104Method and apparatus for alignment optimization with respect to plurality of layers - A method of patterning a plurality of layers of a work piece in a series of writing cycles in one or a plurality of write machines, the workpiece being deviced to have a number of N layers and layers of the workpiece having one or a plurality of boundary condition(s) for pattern position, the method comprising the steps of: determining the boundary conditions of layers 09-01-2011
20110089152METHOD AND SYSTEM FOR EXPOSING DELICATE STRUCTURES OF A DEVICE ENCAPSULATED IN A MOLD COMPOUND - A system utilizes a laser to remove the mold compound of an IC without damaging the internal die, wire leads, solder connections and any other critical structures encapsulated within the mold compound, thereby leaving them available for the provisional and electrical analysis. A laser beam is focused through appropriate optics onto a plane corresponding to the surface of an IC. A layer of material which is opaque at the wave length of the laser beam is applied at the surface of the IC chip to be ablated prior to each pass of the laser. A spray nozzle may be provided to move in synchronous motion ahead of the laser being to apply coat of the opaque material.04-21-2011
20110095004SYSTEM AND METHOD FOR TRACKING AND REMOVING COATING FROM AN EDGE OF A SUBSTRATE - A method for removing coating from a substrate may include: locating an edge of a substrate; directing a laser beam along a first path to a first position on a surface of the substrate proximate to an edge of the substrate at an angle of incidence suitable to redirect the laser beam along a second path, through the substrate, to a second position on a second surface of the substrate corresponding to the located edge of the substrate, where the second surface can include a coating; and ablating at least a portion of coating at the second position on the second surface of the substrate.04-28-2011
20100025387TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER - Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.02-04-2010
20100018955DEVICE FOR RECORDING GRAPHICAL DATA ON A MEDIUM - This is a device for recording graphical data (01-28-2010
20100176101HIGH SPEED AND HIGH POWER LASER SCRIBING METHODS AND SYSTEMS - A method of scribing a graphic on a material is provided, in which laser output is applied to the material. The laser output is moved relative to the material at a high speed greater than 10 m per second, and at a high power greater than 500 W, to scribe a graphic on a surface of the material. Also provided is a system for scribing a graphic on a material. The method and system of the invention are especially useful in the scribing of building materials.07-15-2010
20090314751LASER SCRIBE INSPECTION METHODS AND SYSTEMS - Methods and systems for use during laser-scribing of a workpiece are provided. Some of the methods and systems provided use an imaging device to control the formation of a laser-scribed feature so as to more closely align with a previously-formed feature. Some of the methods and systems provided use an imaging device for inspection of a laser-scribed feature and/or process control. Some of the methods and systems provided use an imaging device to detect and avoid a workpiece defect during the formation of a laser-scribed feature.12-24-2009
20120205354REDUCING DROSS WELDING PHENOMENON DURING IRRADIATION ENGRAVING OF A METAL SHEET - A groove is formed in a metal sheet by performing an irradiation engraving operation on a first surface area of the metal sheet. The irradiation engraving operation displaces metal particles from the first surface area onto a second surface area of the metal sheet. The environment of the irradiation engraving operation is controlled to reduce the number of displaced metal particles that would otherwise weld to the second surface area.08-16-2012
20120043306METHOD AND APPARATUS FOR OPTIMALLY LASER MARKING ARTICLES - The invention is a method and apparatus for laser marking a stainless steel specimen with commercially desirable marks. The method includes providing a laser processing system having a laser, laser optics and a controller with pre-determined laser pulse parameters, selecting the pre-determined laser pulse parameters associated with the desired mark, and directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired marks including temporal pulse widths greater than about 1 and less than about 1000 picoseconds.02-23-2012
20120000893Precision Laser Ablation - Methods and systems for precisely removing selected layers of materials from a multi-layer work piece using laser ablation are disclosed. Precise removal of one or more selected layers of materials of a work piece may be performed by irradiating at least one location on a multi-layer work piece with a laser beam, ablating material at the at least one location, detecting one or more characteristics of the material ablated at the at least one location and analyzing the one or more characteristics to identify a change in at least one of the one or more characteristics that indicates a change in the type of material being ablated. Related systems are also described.01-05-2012
20110180519Laser scribing method and apparatus - To form a deeper scribed groove with less energy or to improve the scribing speed, without making the apparatus configuration complicated is intended. The present invention relates to a laser scribing method which includes: forming on a workpiece a plurality of beam spots arranged in a state being separated from one another along the scribing direction, and forming a linear scribed groove on the workpiece by moving the plurality of beam spots in the scribing direction. The plurality of beam spots are obtained from a laser beam of a single ray bundle.07-28-2011
20120211478Multiple laser machining at different angles - A process using a single millisecond laser is presented. The process is traversed over the surface of a component a number of times. The tilt angle of the laser beam with respect to a drilling axis during a subsequent traverse is different from the tilt angle with respect to the drilling axis during the first traverse of the surface. By using the single millisecond laser which although producing rougher surfaces than other millisecond lasers has higher material-removal rates, repeated traverses using different process parameters allow millisecond lasers to be successfully used to produce smooth surfaces.08-23-2012
20120211477METHOD AND APPARATUS FOR IMPROVED LASER SCRIBING OF OPTO-ELECTRIC DEVICES - Disclosed are laser scribing systems for laser scribing semiconductor substrates with backside coatings. In particular these laser scribing systems laser scribe opto-electric semiconductor wafers with reflective backside coatings so as to avoid damage to the opto-electric device while maintaining efficient manufacturing. In more particular these laser scribing systems employ ultrafast pulsed lasers at wavelength in the visible region and below in multiple passes to remove the backside coatings and scribe the wafer.08-23-2012
20100012631TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER - Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.01-21-2010
20110095005Laser machining apparatus and method for forming a surface on an unifinished product - The invention concerns a method and an apparatus for the laser machining of an unfinished object (04-28-2011
20120074107SYSTEM FOR THE CALIBRATION OF OPERATING PARAMETERS OF A LASER ENGRAVER - The present invention concerns a system for the calibration of at least one parameter of a laser engraver, the laser engraver comprising on one hand an engraving system with a focusing lens positioned at a distance of the surface of an substrate intended to be engraved and on the other hand a vision system for at least the positioning and the verification of the engraving, the vision system including a camera associated with an appropriate illumination and, wherein the engraving device of the laser is arranged in such way that the engraving device works to engrave a substrate with specific engraved layout corresponding to variation of at least one parameter and wherein the vision system is connected to a comparison device of at least one measured engraved parameter with the template value of at least one stored data in a memorisation device connected to a engraving correction device.03-29-2012
20120312792METHOD OF MARKING A METAL COMPONENT SURFACE WITH MODIFYING SEQUENCES IN WHICH THE SEGMENTS OF THE MARKINGS ARE FORMED - The present invention resides in a method of providing a mark on a surface of a metal component, where the mark comprises a symbol (12-13-2012
20100326972ARTICLE WITH MULTIPLE SURFACE DEPRESSIONS AND METHOD AND SYSTEM FOR MAKING THE SAME - Articles having multiple surface depressions and process and apparatus for making the same. The invention is useful in making, inter alia, glass plates having a surface depression array which can be used in semiconductor and electronics manufacture, drug discovery and display devices.12-30-2010
20120261394Method and Apparatus for Forming an Anilox Roll - The invention relates to a method and apparatus for forming an anilox roll. The method includes supplying a cylinder of the anilox roll that has an outer surface to be tooled, supplying at least a laser source and laser engraving the outer surface of the anilox roll with a laser spot that is formed by a laser source for obtaining a tooled anilox roll, and applying an optical guide in the light path of the laser for enabling the laser spot to move reciprocally on the outer surface to be tooled.10-18-2012
20110036818OPTICAL ETCHING DEVICE FOR LASER MACHINING - An optical etching device for laser machining is provided and includes a laser light source and an optical head. The laser light source emits an incident beam. The optical head includes a transparent substrate, an opaque film and a sub-wavelength annular channel. The laser energy tolerance of the transparent substrate ranges from 8 J/cm02-17-2011
20120318776METHOD AND APPARATUS FOR MACHINING A WORKPIECE - Numerous embodiments of methods and apparatus for machining workpieces using one or more optical pulses are disclosed. One embodiment of a method of machining a Workpiece includes directing an optical pulse to impinge upon a surface of the workpiece. The optical pulse can be configured to initiate a vaporization process within a first period of time after impinging upon the workpiece surface. After the first period of time, a characteristic of the optical pulse is changed while maintaining the initiated vaporization process and, after a second period of time, the optical pulse is terminated to terminate the maintained vaporization process. Exemplary articles that may be produced by machining workpieces are also disclosed.12-20-2012
20120080414METHOD AND SYSTEM FOR LASER PATTERNING A SEMICONDUCTOR SUBSTRATE - A method for laser patterning a sample is presented. The method includes coating at least one side of a substrate to form a sample, where coating the at least one side of the substrate forms an interface between the coating and the at least one side of the substrate. Further, the method includes configuring a scanning pattern for patterning the sample. In addition, the method includes determining settings for one or more laser beams of a laser based on the configured scanning pattern. Moreover, the method includes focusing the one or more laser beams of the laser at or near a surface of the substrate by selecting a focal point of the one or more laser beams near the surface of the substrate and setting a scribe depth near the surface of the substrate. The method also includes patterning the sample based on the configured scanning pattern using the one or more laser beams to generate one or more pixelated devices from the sample.04-05-2012
20090039060Lasercutting With Scanner - The embodiments described relate to a laser cutting method suitable for cutting multilayered or painted materials such as for example car bodies. The method involves the step of scanning a low laser beam a plurality of turns along an intended cut edge. Utilizing the described cutting method, the paint located in the vicinity of the cut edge is only slightly affected by the heat generated by the laser beam.02-12-2009
20110253688Laser Processing Method - A laser processing method discloses a laser processing method, which emits a laser light onto an incidence plane of a wafer to form a trench on the wafer. The ratio of a depth of the trench to the thickness of the wafer is smaller than or equal to about 1/5. Make the laser light process the plural times of the back and forth indenting in the trench on the wafer with a high speed, whereupon there is no residuum near the trench such that the brightness of a light emitting diode (LED) can be increased, and make the wafer easier to be broken into dies.10-20-2011
20080223834Method and apparatus for laser marking objects - Embodiments of the present invention comprise an apparatus for laser marking individual objects with indicia at a marking station wherein a predetermined window exists during which each object can be marked as the objects are conveyed along at least one path at a predetermined speed, the apparatus comprising, at least first and second lasers positioned adjacent one or more paths configured to direct a laser beam onto the objects to mark the same with indicia as the objects pass through the marking station, with each of the first and second lasers marking alternate following objects as they pass through the marking station.09-18-2008
20110240614METHOD AND APPARATUS TO SCRIBE THIN FILM LAYERS OF CADMIUM TELLURIDE SOLAR CELLS - A method of laser scribing a CdTe solar cell structure includes providing a laser operable to produce an optical pulse. The optical pulse is characterized by a temporal profile having a first power level during a first portion of the optical pulse and a second power level less than the first power level during a second portion of the optical pulse. The method also includes directing the optical pulse to impinge on the CdTe solar cell structure. The CdTe solar cell structure includes a substrate, a transmission spectrum control layer adjacent the substrate; a barrier layer adjacent the transmission spectrum control layer, and a conductive layer adjacent the barrier layer. The method further includes initiating a removal process for the conductive layer and terminating the removal process prior to removing the insulating layer.10-06-2011
20130153553APPARATUS AND METHOD FOR THE INTERFERENCE PATTERNING OF PLANAR SAMPLES - Apparatus for interference patterning of a planar sample including a laser and a focusing arrangement positioned in a beam path of the laser so that the laser beam is imaged in a first spatial direction in a focused manner into a sample volume in which the planar sample is positioned. An expanding and splitting arrangement is positioned downstream of the focusing arrangement for the laser beam, whilst maintaining the focused imaging in a first spatial direction which can be expanded in a second spatial direction, and which can be split into two partial beams. These two partial beams can be directed onto the sample volume.06-20-2013
20130153554FIBRE OPTIC LASER MACHINING EQUIPMENT FOR ETCHING GROOVES FORMING INCIPIENT CRACKS - A laser machining equipment for etching grooves in a wall of a mechanical part, or in a connecting rod for a spark ignition engine, includes a fiber optic laser device arranged to supply laser pulses. The fiber optic laser device is controlled so that laser pulses have a peak power of more than 400 W and at least two times greater than maximum mean power of the laser device, and duration of the laser pulses is below or within the nanosecond range of 1 ns to 1000 ns. The fiber optic laser device can be controlled in a quasi continuous wave (QCW) mode, or can be controlled in a Q-switch mode. The selected operating modes increase machining efficiency and produce a groove with an optimum transverse profile, particularly with a small mean radius of curvature at a bottom of the groove which then allows precise subsequent fracturing of the mechanical part with less force.06-20-2013
20130153552SCRIBING APPARATUS AND METHOD FOR HAVING ANALYSIS FUNCTION OF MATERIAL DISTRIBUTION - A scribing apparatus having a function to analyze distribution of a material forming a semiconductor or solar cell in real-time in a process producing the semiconductor or solar cell of is disclosed. The scribing apparatus having the analysis function of material distribution comprises: a laser irradiation unit, which conducts scribing by irradiating laser to a position to be scribed of an analysis subject; a spectrum detection optical unit, which detects a spectrum generated from plasma, which is produced by the irradiated laser; a spectrum information storage, which stores spectrum state information of each material forming the analysis subject; and a spectrum analysis unit, which analyzes distribution state information of the material by comparing the spectrum state information and the detected spectrum.06-20-2013
20110233177METHOD AND APPARATUS TO SCRIBE A LINE IN A THIN FILM MATERIAL USING A BURST OF LASER PULSES WITH BENEFICIAL PULSE SHAPE - A series of laser pulses in a pulse train, each pulse with a beneficial temporal power shape instead of the conventional laser temporal power shape, scribes a line in a thin film of material on a substrate. The beneficial temporal pulse shape has a spike/plateau chair shape or a square pulse shape. Scribing a line in the thin film is achieved by placing the series of laser pulse spots on the line to be scribed such that there is an overlapping area between adjacent laser pulse spots along the line. The use of a series of laser pulses with beneficial pulse shape to scribe a line in the thin film results in a better quality and cleaner scribing process compared to that achieved with the conventional pulse shape.09-29-2011
20110233176SPLIT LASER SCRIBE - A dual-beam laser cutting system uses laser beam polarization to output two identical laser beams. The dual identical laser beams are spaced appropriately to simultaneously cut a water thus increasing the laser cutting system's throughput as compared to a single-laser cutting system. In one implementation, the dual-beam laser cutting system 09-29-2011
20130180966LASER CUTTING SYSTEM AND METHODS FOR CREATING SELF-RETAINING SUTURES - A laser-machining system and method is disclosed for forming retainers on a suture thread. The laser system is preferably a femtosecond laser system which is capable of creating submicron features on the suture thread while preserving strength of the suture thread. The laser-machining system enables creation of retainers and self-retaining suture systems in configurations which are difficult and/or impossible to achieve using mechanical cutting technology.07-18-2013
20130180967METHOD AND SYSTEM FOR AUTOMATICALLY INSPECTING AND TRIMMING A PATCH ANTENNA - A system for automatically inspecting and trimming a ceramic patch antenna includes an inspection apparatus electrically connected to a radio frequency component testing fixture. The inspection apparatus is inputted standard parameters of electrical characteristics of the ceramic patch antenna. The ceramic patch antenna is arranged on the radio frequency component testing fixture. Then, the inspection apparatus is configured to measure electrical characteristics of the ceramic patch antenna and to judge whether the electrical characteristics of the ceramic patch antenna are the same as the standard parameters or not. The inspection apparatus is configured to drive a trimming machine for trimming a radiation metal surface of the ceramic patch antenna if the electrical characteristics of the ceramic patch antenna are different from the stand parameters.07-18-2013
20130200050LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION - The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.08-08-2013

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