Class / Patent application number | Description | Number of patent applications / Date published |
219121650 | Melting | 59 |
20090026183 | Methods for Repairing Gas Turbine Engine Knife Edge Seals - Methods for repairing a gas turbine engine knife edge seals are provided. A representative method includes: providing a knife edge of a gas turbine component, the component comprising IN-100, the knife edge being degraded; directing a laser beam toward the knife edge; and dispensing IN-100 powder such that the IN-100 powder is melted by the laser beam and is deposited on the knife edge. | 01-29-2009 |
20100012630 | Apparatus for manufacturing a three-dimensional object layer by layer - An apparatus for manufacturing a three-dimensional object ( | 01-21-2010 |
20100282724 | Laser irradiation apparatus and method of manufacturing display device using the same - A laser irradiation apparatus for bonding a first substrate and a second substrate of a display device by melting a plurality of bonding members disposed between the first and second substrates to define cells when the display device is manufactured, the display device including light emitting elements disposed on a surface of the first substrate such that the bonding members respectively encompass lateral regions of the light emitting elements, the laser irradiation apparatus including a stage on which the first substrate is mounted, a laser oscillation member configured to irradiate a laser beam that melts the bonding members disposed between the first substrate and the second substrate, and a scanner configured to irradiate the laser beam incident from the laser oscillation member onto the bonding members, the scanner being configured to sequentially irradiate the laser beam on portions of the bonding members. | 11-11-2010 |
20110006044 | PYROMETER FOR LASER ANNEALING SYSTEM COMPATIBLE WITH AMORPHOUS CARBON OPTICAL ABSORBER LAYER - In a laser annealing system for workpieces such as semiconductor wafers, a pyrometer wavelength response band is established within a narrow window lying between the laser emission band and a fluorescence emission band from the optical components of the laser system, the pyrometer response band lying in a wavelength region at which the optical absorber layer on the workpiece has an optical absorption coefficient as great as or greater than the underlying workpiece. A multi-layer razor-edge interference filter having a 5-8 nm wavelength cut-off edge transition provides the cut-off of the laser emission at the bottom end of the pyrometer response band. | 01-13-2011 |
20120111838 | Thermal Processing of Substrates with Pre- and Post-Spike Temperature Contro - Provided are apparatuses and method for the thermal processing of a substrate surface, e.g., controlled laser thermal annealing (LTA) of substrates. The invention typically involves irradiating the substrate surface with first and second images to process regions of the substrate surface at a substantially uniform peak processing temperature along a scan path. A first image may serve to effect spike annealing of the substrates while another may be used to provide auxiliary heat treatment to the substrates before and/or after the spike annealing. Control over the temperature profile of the prespike and/or postspike may also reduce stresses and strains generated in the wafers. Also provided are microelectronic devices formed using the inventive apparatuses and methods. | 05-10-2012 |
20120145684 | METHOD OF THERMAL PROCESSING STRUCTURES FORMED ON A SUBSTRATE - Methods used to perform an annealing process on desired regions of a substrate are disclosed. In one embodiment, an amount of energy is delivered to the surface of the substrate to preferentially melt certain desired regions of the substrate to remove unwanted damage created from prior processing steps (e.g., crystal damage from implant processes), more evenly distribute dopants in various regions of the substrate, and/or activate various regions of the substrate. The preferential melting processes will allow more uniform distribution of the dopants in the melted region, due to the increased diffusion rate and solubility of the dopant atoms in the molten region of the substrate. The creation of a melted region thus allows: 1) the dopant atoms to redistribute more uniformly, 2) defects created in prior processing steps to be removed, and 3) regions that have hyper-abrupt dopant concentrations to be formed. | 06-14-2012 |
20120248077 | Soldering device for forming electrical solder connections in a disk drive unit - A soldering device for forming electrical solder connections in a disk drive unit comprises a nozzle device comprising at least two separated movable housings that provides a passage, the upper ends of the housings form an entrance, and the lower ends of the housings form a nozzle; and an actuating device connecting with the nozzle device and arranged for controlling the housings of the nozzle device to move together or apart, thereby controlling the inner diameter size of the nozzle. The present invention provides movable housings of the nozzle device so as to make the size of the nozzle controllable, finally benefits to perform a solder connection. | 10-04-2012 |
20120267348 | SYSTEMS AND METHOD FOR OPTIMIZATION OF LASER BEAM SPATIAL INTENSITY PROFILE - A thin beam directional crystallization system configured to process a substrate comprises a laser configured to produce laser light, the laser configured to have a high energy mode and a low energy mode. The high energy mode is configured to produce light energy sufficient to completely melt a substrate coated with amorphous silicon film, while the low energy mode is configured to produce light energy that is not sufficient to completely melt a substrate coated with amorphous silicon film. The system further comprises beam shaping optics configured to convert the laser light emitted from the laser into a long thin beam with a short axis and a long axis, a stage configured to support the substrate and film, and a translator coupled with the stage, the translator configured to advance the substrate and film so as to produce a step size in conjunction with the firing of the laser. | 10-25-2012 |
20120267349 | JOINING DEVICE FOR NON-POSITIVE JOINING BY MEANS OF A FILLER MATERIAL USING SENSORS - A joining device for a bonded connection by means of a filler material has a feeding device for a wire as the filler material, which is configured to feed the wire during operation of the joining device at a predetermined speed of advance, and a guiding device for an energy beam with at least two partial beams for the melting of the wire. The joining device has a first measuring sensor for detecting a lateral deflection of the wire and a second measuring sensor for detecting a quantity related to the advancement of the wire, wherein the guiding device for the energy beam is connected to the first and the second measuring sensor and configured such that the energy beam is deflected and/or focused in dependence on the output signals of the first and second measuring sensor. | 10-25-2012 |
20140008336 | APPARATUS FOR DISCONNECTING SOLDER JOINTS BETWEEN TWO WELDED SURFACES - An apparatus for disconnecting solder joints between two welded surfaces includes a laser device for emitting laser beams to a solder joint, and a solder material removal device. And the solder material removal device includes a nozzle device having a first passage, a holder holding the nozzle device and having a second passage communicated with the first passage, and at least two pumping devices connected to the holder to pump the melted solder material out from the nozzle device and the holder. The laser device and the solder material removal device are separated, a glass cover with a hole formed thereon is covered on the top of the holder, and the laser device is located above the glass cover and separated from the holder. The present invention can shorten maintenance time and maintenance workload and improve work efficiency, furthermore reduce and stabilize the laser energy. | 01-09-2014 |
20140027417 | EXCIMER LASER APPARATUS PROJECTING A BEAM WITH A SELECTIVELY VARIABLE SHORT-AXIS BEAM PROFILE - Apparatus for homogenizing and projecting two laser-beams is arranged such that the projected homogenized beams are aligned parallel to each other in a first transverse axis and partially overlap in second transverse axis perpendicular to the first transverse axis. The projected homogenized laser-beams have different intensities in the second axis and the degree of partial overlap is selected such that the combined intensity of the laser beams in the second axis has a step profile. | 01-30-2014 |
20140076867 | BEAM SHAPERS, ANNEALING SYSTEMS EMPLOYING THE SAME, METHODS OF HEAT TREATING SUBSTRATES AND METHODS OF FABRICATING SEMICONDUCTOR DEVICES - A treatment system comprises an energy source that generates a energy beam that is emitted along an energy beam pathway. A beam section shaper is positioned along the energy beam pathway that receives an incident energy beam and modifies a section shape thereof to output a shape-modified energy beam. A beam intensity shaper is positioned along the energy beam pathway that receives an incident energy beam having a first intensity profile and outputs an intensity-modified energy beam having a second intensity profile, wherein the first intensity profile has a relative maximum average intensity at a center region thereof and wherein the second intensity profile has a relative minimum average intensity at a center region thereof. | 03-20-2014 |
20140138362 | NOVEL THERMAL PROCESSING APPARATUS - The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. An energy source for the optical system is typically a plurality of lasers, which are combined to form the energy field. | 05-22-2014 |
20140209578 | STAGE UNIT AND LASER ANNEALING APPARATUS INCLUDING THE SAME - A stage unit may include a frame, a first guide device, a stage, a second guide device and a pad. The first guide device may be arranged over an upper surface of the frame and configured to guide the stage in a first direction. T he stage may be movably connected to the first guide device. The second guide device may be arranged over an upper surface of the stage and configured to guide the pad in a second direction substantially perpendicular to the first direction. The pad may be movably connected to the second guide device and configured to support a substrate. Therefore, the substrate may be supported by and uniformly floated by the frame, the stage and the pad. | 07-31-2014 |
20150034614 | METHOD OF MONITORING A LASER BEAM AND LASER IRRADIATION APPARATUS USING THE SAME - A laser irradiation apparatus is provided. The laser irradiation apparatus includes a laser beam generator configured to generate laser beams; a slit unit configured to selectively transmit the laser beams; a mirror unit configured to change a path of the selectively transmitted laser beams, so as to irradiate the selectively transmitted laser beams onto a processing target; a first optical system, wherein a first portion of the selectively transmitted laser beams penetrates through the mirror unit and is projected to the first optical system; and a second optical system, wherein a second portion of the selectively transmitted laser beams penetrates through the mirror unit and is projected to the second optical system. | 02-05-2015 |
20160035603 | LASER ANNEALING APPARATUS - Provided is a laser annealing apparatus that may include: a laser light source section configured to output pulsed laser light to be applied to a thin film formed on a workpiece; a pulse width varying section configured to vary a pulse width of the pulsed laser light; a melt state measuring section configured to detect that the thin film irradiated with the pulsed laser light is in a melt state; and a controlling section configured to determine, based on a result of detection by the melt state measuring section, a duration of time during which the thin film is in the melt state, and to control the pulse width varying section to allow the duration of time to be of a predetermined length. | 02-04-2016 |
20160184915 | NOZZLE FOR CONNECTING OR DISCONNECTING SOLDER JOINTS BETWEEN HEAD BONDING PADS IN A HARD DISK DRIVE, AND LASER SOLDERING OR REFLOWING TOOL WITH THE SAME - A nozzle for connecting or disconnecting solder joints between head bonding pads of in a hard disk drive, includes a nozzle body including a tip, the tip disposed at a distal end of the nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads; and a central duct disposed along a central axis of the nozzle body and configured to convey the solder ball to or from the tip. The tip includes a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation. | 06-30-2016 |
20160250704 | Device for the Separate Application of Connecting Material Deposits | 09-01-2016 |
219121660 | Methods | 41 |
20080223832 | REAL TIME IMPLEMENTATION OF GENERALIZED PREDICTIVE CONTROL ALGORITHM FOR THE CONTROL OF DIRECT METAL DEPOSITION (DMD) PROCESS - A linear model based generalized predictive control system controls the molten pool temperature during a Direct Metal Deposition (DMD) process. The molten pool temperature is monitored by a two-color pyrometer. A single-input single-output linear system that describes the dynamics between the molten pool temperature and the laser power is identified and validated. The incremental generalized predictive control algorithm with Kalman filter estimation is used to control the molten pool temperature. | 09-18-2008 |
20080308537 | METHOD AND APPARATUS FOR FAST AND LOCAL ANNEAL OF ANTI-FERROMAGNETIC (AF) EXCHANGE-BIASED MAGNETIC STACKS - A method (and structure) of thermally treating a magnetic layer of a wafer, includes annealing, for a predetermined short duration, a magnetic layer of a single wafer. | 12-18-2008 |
20090120916 | Through-Via Laser Reflow Systems And Methods For Surface Mount Components - A system and method are disclosed for remelting solder balls in the forming of electrical connections between an electrical component being mounted on a printed circuit board (PCB). Vias are formed in the PCB. Underneath the PCB, a laser is directed through the via to remelt the solder ball to make the connection. In one version, the laser is included on a positioning device. The positioning device translates the laser to a location from which it is aimed through the aperture at the solder mass. In other versions, a camera on the positioning device helps position the laser by making reference to a fiducial mark on the PCB. Further, a detector can be used to determine laser intensity by measuring the output after it passes through the via. | 05-14-2009 |
20090200279 | AUTOMATIC FOCUS AND EMISSIVITY MEASUREMENTS FOR A SUBSTRATE SYSTEM - An apparatus for thermally processing a substrate includes a first radiation source configured to heat a substrate and emit radiation at a heating wavelength, focusing optics configured to direct radiation from the first radiation source to the substrate, and a second radiation source configured to emit radiation at a second wavelength different from the heating wavelength and at a lower power than the first radiation source. Radiation from the second radiation source is directed onto the substrate. The apparatus further includes a first detector configured to receive reflected radiation at the second wavelength and a computer system configured to receive an output from the first detector and adjust a focus plane of the first radiation source relative to the substrate. The second radiation source is configured to have substantially the same focus plane as the first radiation source. | 08-13-2009 |
20090206065 | Procedure and apparatus for in-situ monitoring and feedback control of selective laser powder processing - The present invention relates to a method and a device to monitor and control the Selective Laser Powder Processing. A Selective Laser Powder Processing device comprising a feedback controller to improve the stability of the Selective Laser Powder Processing process is presented. A signal reflecting a geometric quantity of the melt zone is used in the feedback controller to adjust the scanning parameters (e.g. laser power, laser spot size, scanning velocity, . . . ) of the laser beam ( | 08-20-2009 |
20100038348 | METHOD FOR JOINING ALIGNED DISCRETE OPTICAL ELEMENTS - A method for joining aligned discrete optical elements by which the optical elements can be joined in the aligned state. A thermal connection having long-term stability can be produced at little expense and with high positioning accuracy. Surface regions to be joined can be provided with at least one thin metallic layer by the method for joining aligned discrete optical elements. The surface regions are subsequently wetted using a liquid solder free of flux in a contactless dosed manner. The solder is applied to the surface regions to be joined via a nozzle using a pressurized gas stream. | 02-18-2010 |
20100065536 | Micro Laser Assisted Machining - A method and apparatus ( | 03-18-2010 |
20100224602 | METHOD AND SYSTEM FOR REMOVING THERMAL BARRIER COATING - A method and system for removing a thermal barrier coating on a turbine component is provided. The method includes the steps of selecting at least one turbine component having a thermal barrier coating, and subjecting at least a portion of the thermal barrier coating to a shockwave. The shockwave forms cracks in the thermal barrier coating, such that the substrate of the turbine component is not substantially deformed. | 09-09-2010 |
20100258542 | LASER POLISHING OF A BACK CONTACT OF A SOLAR CELL - Provided herein are methods of polishing, cleaning and texturing back contacts of thin-film solar cells. According to various embodiments, the methods involve irradiating sites on the back contact with laser beams to remove contaminants and/or smooth the surface of the back contact. The back contact, e.g., a molybdenum, copper, or niobium thin-film, is smoothed prior to deposition of the absorber and other thin-films of the photovoltaic stack. In certain embodiments, laser polishing of the back contact is used to enhance the diffusion barrier characteristics of the back contact layer, with all or a surface layer of the back contact becoming essentially amorphous. In certain embodiments, the adhesion of the absorber layer is enhanced by the textured back contact and by the presence of the amorphous metal at the deposition surface. | 10-14-2010 |
20100270276 | System and Method for Repairing Hermetic Solder Seals in RF Electronic Assemblies - The system contains a laser beam source and a work piece having a soldered joint. A work piece holder holds the work piece at an angle relative to the laser beam source. A crack is formed in a soldered joint of the work piece. The laser beam source is positioned approximately centered on the crack. At least one temperature sensitive electronic element is contained within the work piece. | 10-28-2010 |
20110011838 | Method for fabricating semicoductor wafers applicable to integrated circuit manufacture - The present invention discloses a method for fabricating semiconductor wafers applicable to IC manufacture, which comprises steps: providing an ingot; slicing the ingot into a plurality of wafers; using a laser to illuminate the surface of the wafers to eliminate the saw marks generated by slicing and fuse the microcracks on the surface of the wafers; pickling, polishing and inspecting the wafers. The present invention uses intensive laser energy to remove saw marks generated by slicing and fuse microcracks generated by stress. Thereby, the effect of isotropic etching is reduced in the succeeding pickling procedures, and the damage layer is minimized. Thus, the thickness of the removed material is reduced, and a single ingot can be sliced into more wafers. | 01-20-2011 |
20110089151 | LASER PROCESSING HEAD AND LASER CLADDING METHOD - A laser processing head in accordance with the present invention comprises: a laser emitting unit for irradiating a workpiece with a laser light; and a powder feeder disposed around a periphery of the laser emitting unit for discharging filler material powder to the workpiece, in which the powder feeder includes: a position adjustment mechanism for adjusting a position where the powder concentrates; and a powder concentration diameter adjustment mechanism for adjusting a diameter of the filler material powder. The laser processing head further comprises a controller for controlling the position adjustment mechanism and the powder concentration diameter adjustment mechanism. | 04-21-2011 |
20110163077 | LASER THIN FILM POLY-SILICON ANNEALING OPTICAL SYSTEM - A high energy, high repetition rate workpiece surface heating apparatus is disclosed which comprise a XeF laser producing a laser output light pulse beam, an optical system narrowing the laser output light pulse beam in the short axis of the laser output light pulse beam and expanding the laser output light pulse beam to form in a long axis of the beam a workpiece covering extent of the long axis, the optical system focuses the laser output light pulse beam at a field stop with a magnification sufficient to maintain an intensity profile that has sufficiently steep sidewalls to allow the field stop to maintain a sufficiently steep beam profile at the workpiece. | 07-07-2011 |
20120006796 | METHOD AND SYSTEM FOR HIGH POWER REFLECTIVE OPTICAL ELEMENTS - A method of repairing damage in an optical element includes providing a laser system including at least one optical element having a coating layer having an incident light surface and directing a laser pulse from the laser system to impinge on the incident light surface. The method also includes sustaining damage to a portion of the incident light surface and melting the damaged portion of the incident light surface and a region adjacent to the damaged portion. The method further includes flowing material from the region adjacent the damaged portion to the damaged portion and solidifying the material in the damaged portion and the region adjacent to the damaged portion. | 01-12-2012 |
20120037603 | METHOD AND APPARATUS FOR IRRADIATING A SEMICONDUCTOR MATERIAL SURFACE BY LASER ENERGY - A method for irradiating semiconductor material including irradiating a region of a semiconductor material layer surface with a first laser having laser irradiation parameters to melt at least a part of the region and controlling the irradiation process by adapting the irradiation parameters by determining the depth of the melted region part. An apparatus for irradiating semiconductor material is disclosed which has a first laser for irradiating a region of a semiconductor layer surface to melt at least a part of the region. The laser having laser irradiation parameters and a controller for controlling the irradiation process by adapting the laser irradiation parameters by determining the depth of the melted region part. | 02-16-2012 |
20120132627 | ADDITIVE LAYER FABRICATION METHOD - A selective layer melting or other additive layer fabrication method in which powdered material is fused by heating it with a pulsed laser, the pulses being modulated whilst the laser is traversing the substrate so as to control the thickness and/or width of the layer being formed. Initial layers of the fabrication structure may be formed more thickly than subsequent layers, e.g. by means of a CW laser, to reduce distortion. This aspect of the invention may be employed independently of the use of a pulsed laser to form the subsequent layers. | 05-31-2012 |
20130082036 | ELECTRODE FOR GMAW HYBRID LASER ARC WELDING - A welding electrode hybrid laser arc welding is provided which is either a solid or metal core electrode. The electrode contains at least carbon, manganese, silicon, sulfur and phosphorus. The electrode has is no more than 0.02% carbon, manganese in the range of 0.6 to 1.2%, silicon in the range of 0.3 to 0.6%, no more than 0.01% sulfur, and no more than 0.01% phosphorus in % by weight of the electrode. | 04-04-2013 |
20130119026 | Method and Device for Laser Material Processing of a Workpiece - Cutting a workpiece with a laser beam includes using the laser beam to melt and/or vaporize at least a portion of the workpiece, and moving at least one of the workpiece and the laser beam relative to one another to form a cutting front on the workpiece, in which the laser beam includes either at least two different radially polarized beam portions offset relative to each along an advancing direction of the laser beam, or multiple laser beam strips extending along the advancing direction of the laser beam. Each laser beam strip has a different linear polarization direction, and the advancing direction corresponds to a direction along which the workpiece is cut by the laser beam. | 05-16-2013 |
20130153550 | APPARATUSES FOR VACUUM INSULATING GLASS (VIG) UNIT TIP-OFF, AND/OR ASSOCIATED METHODS - Certain example embodiments of this invention relate to apparatuses for sealing the tips of pump-out tubes of vacuum insulating glass (VIG) units, and/or associated methods. In certain example embodiments, a laser source used in sealing the pump-out tube is thermally insulated from the VIG unit and emits a laser beam through one or more windows in an oven towards a mirror located therein. The mirror is located so as to redirect the laser beam onto the pump-out tube to thereby seal it. For instance, a substantially horizontal laser beam emitted from a laser source located outside the oven enters into the oven through one or more windows and is reflected by a mirror towards the pump-out tube to be sealed. The repositioning of the laser source advantageously can change its effective focal length and/or the location of the laser beam, e.g., because of the fixed location of the mirror. | 06-20-2013 |
20130153551 | LIGHTING SOLUTION FOR APPARATUSES FOR VACUUM INSULATING GLASS (VIG) UNIT TIP-OFF, AND/OR ASSOCIATED METHODS - Certain example embodiments of this invention relate to apparatuses for sealing the tips of pump-out tubes of vacuum insulating glass (VIG) units, and/or associated methods. In certain example embodiments, a laser source used in sealing the pump-out tube is thermally insulated from the VIG unit and emits a laser beam through one or more windows in an oven towards a mirror located therein. The mirror is located so as to redirect the laser beam onto the pump-out tube to thereby seal it. For instance, a substantially horizontal laser beam emitted from a laser source located outside the oven enters into the oven through one or more windows and is reflected by a mirror towards the pump-out tube to be sealed. The repositioning of the laser source advantageously can change its effective focal length and/or the location of the laser beam, e.g., because of the fixed location of the mirror. | 06-20-2013 |
20130270234 | METHODS FOR STRIPPING AND MODIFYING SURFACES WITH LASER-INDUCED ABLATION - A coating removal apparatus removes a coating from a surface. The apparatus has a movable scanning head and scanning optics. The scanning head is movable in one dimension, and the scanning optics adjust in two dimensions to compensate for movement of the scanning head to implement long range scanning with a uniform scanning pattern. Further, a surface roughness is determined by measuring specular and scattered reflections at various angles. For composite surfaces, the apparatus utilizes UV laser radiation and a controlled atmosphere to remove coating and alter the chemical characteristics at the surface. | 10-17-2013 |
20130270235 | METHOD FOR JOINING METALLIC MEMBERS, JOINT STRUCTURE AND BRAZING FILLER METAL - In joining an Fe-based metallic member comprising an Fe-based material and an Al-based metallic member comprising an Al-based material by a Zn-based brazing filler metal, a joined part of the Fe-based metallic member is heated at a temperature higher than a melting point of the Fe-based material. | 10-17-2013 |
20130299470 | Method for oxide dispersion strengthening of metallic material using laser - An oxide dispersion strengthening (ODS) method of a metallic material using a laser is provided, which includes melting a surface of a metallic matrix placed on a movable stage by irradiating a laser onto the surface (step 1), supplying an oxide dispersion strengthening (ODS) powder at a site of the matrix surface which is melt at step 1 (step 2), and cooling the matrix in which the ODS powder is supplied at step 2 (step 3). Because oxide particles are directly supplied into previously-made sheet or tube matrix, fabrication process is simplified, fabrication cost is reduced, and end product is fabricated efficiently. | 11-14-2013 |
20140008337 | Method for Hybrid Machining Colored Glass - The present application relates to a method for hybrid machining colored glass, includes the following steps: (1) providing a laser generator having a machining head, the colored glass is processed through the machining head by means of laser beam emitted by the laser generator. The colored glass particles melted or vaporized by the laser beam are blown away by the pressured gas through the nozzle on the machining head, so as to form a pore on the colored glass; (2) the colored glass is further processed at the pore by means of mechanical machining tools. The method for hybrid machining colored glass in the present application possesses economical, fast machining speed and high machining successful rate (or high successful machining product rate) as such beneficial characteristics. | 01-09-2014 |
20140027418 | Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium - The present invention relates to a method for electrically contacting terminal faces of two substrates ( | 01-30-2014 |
20140042131 | LASER WELDING CONSUMABLE - A system and method for heating a filler wire (consumable) using a laser in brazing, cladding, building up, filling, overlaying, welding, and joining applications. The filler wire includes a first surface that absorbs energy from a laser beam and a second surface separated from said first surface by a thickness t that is in a range of 0.010 inch to 0.045 inch. A cross-sectional shape of the filler wire includes at least one bend toward the laser beam along a length of the cross-sectional shape. The cross-sectional shape has a projected width w that is in a range of 0.030 inch to 0.095 inch. | 02-13-2014 |
20140110384 | METHOD AND APPARATUS FOR MARKING AN ARTICLE - The invention is a method and an apparatus for marking an article and the article thus marked. It includes providing the article. Generating a plurality of groups of laser pulses. At least one of the plurality of groups is generated by modulating a beam of laser pulses to form a plurality of beamlets. Each, of the plurality of beamlets, include at least one laser pulse. It also includes directing the plurality of groups of laser pulses onto the article such that laser pulses within the at least one of the plurality of groups impinge upon the article at spot areas that do not overlap one another, wherein laser pulses within the plurality of groups are configured to produce a visible mark on the article. | 04-24-2014 |
20140202997 | REDUCING SURFACE ASPERITIES - Surface asperities, such as roughness characteristics, are reduced or otherwise mitigated via the control of surface regions including the asperities in different regimes. In accordance with various embodiments, the height of both high-frequency and low-frequency surface asperities is reduced by controlling characteristics of a surface region under a first regime to flow material from the surface asperities. A second regime is implemented to reduce a height of high-frequency surface asperities in the surface region by controlling characteristics of the surface region under a second regime to flow material that is predominantly from the high-frequency surface asperities, the controlled characteristics in the second regime being different than the controlled characteristics in the first regime. Such aspects may include, for example, controlling melt pools in each regime via energy pulses, to respectively mitigate/reduce the asperities. | 07-24-2014 |
20140299585 | LASER CLADDING METHOD - In a laser cladding method, a laser beam is emitted from a semiconductor laser to melt alloy powder for laser cladding on the surface of a hydraulic support column. The semiconductor laser is a laser functioning with semiconductor material as gain medium and lighting by means of semiconductor material transition among energy bands. The hydraulic support column is mainly made of alloy steel of 27 SiMn. With the laser cladding method, the energy absorption efficiency of laser beam can be increased, and the energy utilization efficiency is increased, so that the power consumption is saved reduced. | 10-09-2014 |
20140339206 | REMELTING METHOD AND SUBSEQUENT REFILLING AND COMPONENT - A method for re-melting and refilling a defect ( | 11-20-2014 |
20140367369 | Method for Laser Engraved Reflective Surface Structures - Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface so as to be visible from the outside of the housing. The markings may be precisely formed using a laser. Processing may be used to increase reflectivity of the markings. | 12-18-2014 |
20150028004 | METHOD FOR MARKING COMPONENTS EMPLOYING OVERLAPPING AND SUBSEQUENTLY BARELY OVERLAPPING LASER PULSES - A method for marking components ( | 01-29-2015 |
20150034615 | Laser decoating of coated metal sheets - Methods, devices and systems for laser decoating of coated metal sheets, in particular for removing a metal protective layer from a metal sheet by a laser beam. The laser beam is directed onto a surface of a metal sheet coated with a metal protective layer, such that the laser beam strikes the surface of the metal sheet at a laser spot and melts material of the metal protective layer. A gas is directed by a plurality of nozzles at a pressure of at least 3 bar and at an acute angle with respect to the laser beam onto the laser spot. The nozzles are arranged around the laser beam such that the gas directed from the nozzles blows away the melted material of the metal protective layer from the metal sheet. | 02-05-2015 |
20150122784 | LEVITATION APPARATUS AND LEVITATION METHOD - A levitation apparatus and a levitation method are provided. The levitation apparatus includes a top electrode and a bottom electrode disposed to be spaced apart from each other, a main power source adapted to apply a voltage to the top electrode or the bottom electrode such that a charged object levitates against gravity by using an electrostatic force generated by the voltage, a laser to heat the charged object, and spherical mirrors to re-reflect reflected light reflected from the charged object to the charged object. The reflected light may be generated when output light of the laser passing through a through-hole formed in a surface central region of each of the spherical mirrors is reflected by the charged object. | 05-07-2015 |
20150129564 | METHOD FOR UTILIZING A BRAZE MATERIAL WITH CARBON STRUCTURES - A method of brazing including melting a surface region ( | 05-14-2015 |
20150355031 | OPTICAL NON-DESTRUCTIVE INSPECTION METHOD AND OPTICAL NON-DESTRUCTIVE INSPECTION APPARATUS - An optical non-destructive inspection method includes: heating including setting a measurement spot on a surface of a workpiece and irradiating the measurement spot with heating laser light using a heating laser light source, heat ray detectors, and a controller; acquiring a temperature rise property that is a temperature rise state of the measurement spot according to a heating time by detecting a heat ray radiated from the measurement spot to determine a temperature at the measurement spot; and determining whether or not a pressure contact state at pressure contact portions, which include a contact area and a contact pressure, is appropriate based on the temperature rise property. | 12-10-2015 |
20160008919 | LASER METHOD WITH DIFFERENT LASER BEAM AREAS WITHIN A BEAM AND DEVICES | 01-14-2016 |
20160023303 | METHOD FOR FORMING THREE-DIMENSIONAL ANCHORING STRUCTURES - A method for texturing a surface to form anchoring structures for a coating. The method includes: traversing an energy beam ( | 01-28-2016 |
20160052176 | PROCESS OF MANUFACTURING AN INJECTION MOULD COMPONENT - An injection mould component for moulding the outer surface of a preform neck, which allows improved cooling of the preform node inside the mould, while in the same time reducing the mould cycle time. A related production process of said injection mould component, which allows the section of the cooling channels to be optimized, determining a more effective cooling, is also described. | 02-25-2016 |
20160114429 | DISSIMILAR METAL JOINED BODY - A dissimilar metal joined body includes a copper material, an aluminum material and a molten mixed portion. The molten mixed portion is configured so that part of the aluminum material is melted and flows into the copper material. The depth from a surface of the copper material which contacts the aluminum material in the molten mixed portion is at least 5 μm and no greater than 30 μm. | 04-28-2016 |
20160199939 | HOT WIRE LASER CLADDING PROCESS AND CONSUMABLES USED FOR THE SAME | 07-14-2016 |