Entries |
Document | Title | Date |
20080203071 | LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES - A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links. | 08-28-2008 |
20080210671 | Fast axis beam profile shaping by collimation lenslets for high power laser diode based annealing system - A dynamic surface anneal apparatus for annealing a semiconductor workpiece has a workpiece support for supporting a workpiece, an optical source and scanning apparatus for scanning the optical source and the workpiece support relative to one another along a fast axis. The optical source includes an array of laser emitters arranged generally in successive rows of the emitters, the rows being transverse to the fast axis. Plural collimating lenslets overlie respective ones of the rows of emitters and provide collimation along the fast axis. The selected lenslets have one or a succession of optical deflection angles corresponding to beam deflections along the fast axis for respective rows of emitters. Optics focus light from the array of laser emitters onto a surface of the workpiece to form a succession of line beams transverse to the fast axis spaced along the fast axis in accordance with the succession of deflection angles. | 09-04-2008 |
20080264910 | Process for Fabricating Optical Waveguides - A one step process for fabricating planar optical waveguides comprises using a laser to cut at least two channels in a substantially planar surface of a piece of dielectric material defining a waveguide there between. The shape and size of the resulting guide can be adjusting by selecting an appropriate combination of laser beam spatial profile, of its power and of the exposure time. A combination of heating and writing lasers can also be used to fabricate waveguides in a dielectric substrate, wherein the heating laser heats the substrate with a relatively broad focused spot, the power of the heating laser being controlled to raise the temperature heating the substrate just below the substrate's threshold temperature at which it begins to absorb electro-magnetic radiation, the writing laser, which yields a spot size smaller than the heating laser then melts the substrate within the focal spot of the heating laser. Compare to processes from the prior art, a waveguide fabrication process according to the present invention results in lower cost, faster processing time and applicability to a wider range of materials. The present process is particularly suited for the mass production of inexpensive photonic devices. | 10-30-2008 |
20090001058 | METHOD AND APPARATUS FOR DEPOSITING RAISED FEATURES AT SELECT LOCATIONS ON A SUBSTRATE TO PRODUCE A SLIP-RESISTANT SURFACE - An improved apparatus and method for applying a plurality of raised features at select locations on a metallic substrate using a high-powered radiant energy source, such as a laser, in combination with powder metallurgy such that the resultant substrate surface exhibits increased slip-resistance resulting from the presence of the raised features on the substrate. | 01-01-2009 |
20090120914 | SYSTEM AND METHOD FOR CONTROLLING THE POWER LEVEL OF A LASER APPARATUS IN A LASER SHOCK PEENING PROCESS - An on-the-fly analog switching method and system for providing a switching time of less than one second between energy levels and laser heads for laser shock peening applications. An analog switch is used with variable resistance devices that produce a switching time of less than one second. One advantage of the present invention is that a switching time of less than one second is provided which provides for an energy and time efficient system. The laser shock peening process is never delayed for switching purposes as the switching occurs during the standard pause between treated linear areas. | 05-14-2009 |
20090134130 | Process and System for Creating Internal Stress in a Metallic Workpiece - A process and a system for creating internal stress in a metallic workpiece by laser shock peening is provided. In the process, a first laser pulse is applied to a treatment site of the workpiece covered by a surface layer. A second laser pulse follows the first laser pulse in time, and is applied to the treatment site of the workpiece. A covering layer, such as flowing water, is provided over the treatment site during the application of the laser pulses. | 05-28-2009 |
20090145887 | ENERGY COLLECTION AND POWER REDUCTION IN LASER COUPLING PROCESS - An energy collector is used to assist a laser coupling process by reducing the amount of output power of a laser that is used to modify a device attaching element. The energy collector includes an energy collector tip configured to be placed proximate to a device attaching element during the laser coupling process. The energy collector tip is configured to receive laser energy reflected from the device attaching element during the laser coupling process and is formed from a material that converts this reflected energy to heat. Sufficient thermal coupling is created between the energy collector and a surface to provide a conductive pathway for the energy, which has been converted to heat, between the energy collector and the device attaching element. | 06-11-2009 |
20090152246 | Method for Processing Material by Laser Ablation and Material Processed by Processing Method Thereof - In order to easily control the laser pulse width and perform high-precision processing, the method for processing a material by laser ablation according to the present invention is characterized in that the material having a region of which a double logarithmic chart shows a linearly-shaped line with a gradient of not more than 0.5, when a relationship between laser pulse width and ablation threshold is represented in the logarithmic chart with a laser pulse width in picosecond plotted along the horizontal axis and an ablation threshold in J/cm | 06-18-2009 |
20090152247 | Fast axis beam profile shaping for high power laser diode based annealing system - A dynamic surface anneal apparatus for annealing a semiconductor workpiece has a workpiece support for supporting a workpiece, an optical source and scanning apparatus for scanning the optical source and the workpiece support relative to one another along a fast axis. The optical source includes an array of laser emitters arranged generally in successive rows of the emitters, the rows being transverse to the fast axis. Plural collimating lenslets overlie respective ones of the rows of emitters and provide collimation along the fast axis. The selected lenslets have one or a succession of optical deflection angles corresponding to beam deflections along the fast axis for respective rows of emitters. Optics focus light from the array of laser emitters onto a surface of the workpiece to form a succession of line beams transverse to the fast axis spaced along the fast axis in accordance with the succession of deflection angles. | 06-18-2009 |
20090159578 | MULTIBEAM LASER DEVICE FOR FABRICATING A MICRORETARDER BY HEATING PROCESS - A multi-beam laser device is used to make a microretarder plate, which comprises a plurality of first retardation state areas and second retardation state areas alternating with each other. The device comprises an infrared laser, a beam splitter, and a driving means. The beam splitter is used to split the laser beam into a plurality of equal intensity parallel beams and bring the parallel beams into focus. The driving mechanism is used to drive the beam splitter in one direction, and the beam splitter will scan a plurality of parallel scan lines by the direction on a surface. | 06-25-2009 |
20090188899 | METHOD AND DEVICE FOR PREVENTIVE TREATMENT OF AN OPTICAL SURFACE DESIGNED TO BE EXPOSED TO A LASER FLUX - A device for preventive treatment of an optical surface designed to be exposed to a laser flow including a thermal excitation source for providing a localized thermal annealing of a site of the optical surface) by means of a beam applied to the site. The device further includes a measuring member for measuring, in real time said during said localized thermal annealing, a quantity representing the temperature of the site of the optical surface) and at least one control member for increasing the linear power density of the beam applied to the site by the excitation source and, when the quantity reaches a predetermined set point, for gradually decreasing the linear power density. | 07-30-2009 |
20090230099 | Method and Apparatus in Connection with Laser Use - A method in connection with laser use, wherein one or more laser beams emitted by one or more laser sources are focused by beam guiding elements on a fusing spot. A filler delivered to the fusing spot is melted, especially for performing a welding, coating, and/or piece manufacturing process. The filler includes a substantially solid-state, elongated filler material that is fed by a delivery system to the fusing spot. The fusing spot is centrally located relative to the one or more laser beams focusing on the fusing spot. The one or more laser beams are diverged with a multi-segment mirror, especially for maintaining the symmetry of the intensity distribution thereof, whereby beams or divisional beams, reflecting from its various segment elements in substantially divergent directions, are converged on the fusing spot by a condenser system included in the beam guiding elements. | 09-17-2009 |
20090242521 | ON-THE-FLY MANIPULATION OF SPOT SIZE AND CUTTING SPEED FOR REAL-TIME CONTROL OF TRENCH DEPTH AND WIDTH IN LASER OPERATIONS - Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface. | 10-01-2009 |
20090242522 | PHOTONIC MILLING USING DYNAMIC BEAM ARRAYS - A laser processing system includes a beam positioning system to align beam delivery coordinates relative to a workpiece. The beam positioning system generates position data corresponding to the alignment. The system also includes a pulsed laser source and a beamlet generation module to receive a laser pulse from the pulsed laser source. The beamlet generation module generates a beamlet array from the laser pulse. The beamlet array includes a plurality of beamlet pulses. The system further includes a beamlet modulator to selectively modulate the amplitude of each beamlet pulse in the beamlet array, and beamlet delivery optics to focus the modulated beamlet array onto one or more targets at locations on the workpiece corresponding to the position data. | 10-01-2009 |
20090266800 | LASER PROCESSING METHOD FOR TRANSPARENT PLATE - A laser processing method for a transparent plate having a predetermined breaking line including the step of applying a pulsed laser beam to the transparent plate along the breaking line to thereby form a laser processed groove. The pulsed laser beam has an absorption wavelength to the transparent plate. The repetition frequency of the pulsed laser beam is set to 200 kHz or more and the energy density per pulse of the pulsed laser beam is set to 3.8 J/cm | 10-29-2009 |
20090277884 | SURFACE MODIFICATION METHOD - The present invention relates to a surface modification method allowing the surface of a subject to be more effectively modified. In a pulsed-laser device suitable for use in this surface modification method, a semiconductor laser light source and a modulator constitute a seed light source. The seed light output from the seed light source is amplified by fibers for optical amplification, and the amplified light constitutes output from the pulsed-laser device. The pulsed-laser device allows the pulse width and repetition frequency of the output pulsed-laser light to be varied independently of each other. The pulse width of the pulsed-laser light output from the pulsed-laser device is preferably not more than 10 ns, and the repetition frequency is preferably at least 50 kHz. | 11-12-2009 |
20090277885 | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD - The present invention relates to a laser processing apparatus having a structure for effectively processing of objects by condensing a laser beam, and a laser processing method. A laser processing apparatus comprises a common mount surface on which plural objects are disposed in an array, a light source, a lens the reflection direction of which is changeable, and a condensing direction modifier. A laser beam from the light source arrives at the lens through a galvano-mirror. Herein, the galvano-mirror is arranged such that the reflection position thereof agrees with the front focal position of the lens. As the galvano-mirror reflects a laser beam toward the lens while the reflection direction is changed, the arriving position of the laser beam is scanned on the entrance surface of the lens. The condensing direction modifier modifies, according to the irradiation position of the laser beam arrived from the lens, an exit direction of the laser beam. | 11-12-2009 |
20100032416 | Laser Processing Method and Processing Apparatus Based on Conventional Laser-Induced Material Changes - The present invention relates to a technique that remarkably increases the processing speed of a conventional ultra-fast laser micro process having a very high processing accuracy. According to the present invention, a laser processing method based on transient changes in the status of laser-induced material couples a pulse of a ultrafast laser to a pulse of at least one auxiliary laser other than the ultrafast laser to reversibly change a material to be processed. | 02-11-2010 |
20100133242 | LASER PIGMENTS FOR CERAMICS - A coating containing metal phosphate-based compounds and mixtures, mixed compounds, mixed salts or adducts which contain such compounds as pigments for the production of single-coloured or multi-coloured markings, inscriptions and/or decorations by means of laser light in and/or on ceramic, stoneware, pottery, earthenware, porcelain, ceramic glazes, engobe, glass or glass paste (enamel). The method of marking by applying a laser to the coatings is also provided | 06-03-2010 |
20100193481 | LASER CONSTRUCTED WITH MULTIPLE OUTPUT COUPLERS TO GENERATE MULTIPLE OUTPUT BEAMS - A laser beam switching system employs a laser coupled to a beam switching device that causes a laser beam to switch between first and second beam positioning heads such that while the first beam positioning head is directing the laser beam to process a workpiece target location, the second beam positioning head is moving to another target location and vice versa. A preferred beam switching device includes first and second AOMs. When RF is applied to the first AOM, the laser beam is diffracted toward the first beam positioning head, and when RF is applied to the second AOM, the laser beam is diffracted toward the second beam positioning head. A workpiece processing system employs a common modular imaged optics assembly and an optional variable beam expander for optically processing multiple laser beams. | 08-05-2010 |
20100282721 | SYSTEM AND METHOD FOR IMPROVED FILM COOLING - A system for producing at least one trench to improve film cooling in a sample is provided. The system includes at least one laser source outputting at least one pulsed laser beam. The pulsed laser beam includes a pulse duration including a range less than about 50 μs, an energy per pulse having a range less than about 0.1 Joule, and a repetition rate with a range greater than about 1000 Hz. The system also includes a control subsystem coupled to the laser source, the control subsystem configured to synchronize a position of the sample with the pulse duration and energy level in order to selectively remove at least one of a thermal barrier coating, a bondcoat and a substrate metal in the sample to form the at least one trench. | 11-11-2010 |
20110011837 | SYSTEMS FOR FORMING A PLURALITY OF CELLS ON THE MASTERING TOOLS - Mastering tools and systems and methods for forming a plurality of cells on the mastering tools are provided. In particular, the systems vary the geometry of the cells or the placement of the cells, or both, for forming a textured surface on a mastering tool. | 01-20-2011 |
20110024400 | METHOD AND APPARATUS FOR LASER PROCESSING THE SURFACE OF A DRUM - A method for exposing the surface of a drum to patterned illumination from a pulsed laser source at a suitable energy density in order to cause ablation of the surface to form a dense, regular array of 3-D microstructures, comprising the steps locating a mask containing a line of different features on a fixed pitch relative to a target area; projecting a uniform line shaped laser beam through the mask in order to project an image made up of a multiplicity of the features on the mask onto the target area; de-magnifying the image carried by the beam between the mask and the target area; locating the surface of the drum for ablation in the target area; rotating the drum continuously so the surface moves in a first direction perpendicular to the axis of rotation of the drum and also simultaneously moving the projected beam with respect to the drum in a second direction parallel to the axis of rotation of the drum; tilting the projected array of microstructures to correspond to the helical path followed by the laser beam on the drum surface; and controlling the firing of the pulsed laser in relation to the exact angular position of the drum in the target area. Apparatus for carrying out the method is also described. | 02-03-2011 |
20110095002 | LASER LAP WELDING METHOD FOR GALVANIZED STEEL SHEETS - A laser lap welding method, for a galvanized steel sheet, includes preparing two steel sheets in lap configuration, at least one of which is the galvanized steel sheet, so that a galvanized layer thereof is located at an interface of the steel sheets; and irradiating a surface of any one of the two steel sheets in an overlapped region with a laser to perform lap welding. The welding is performed by applying the laser to travel at a predetermined power density and at a predetermined traveling velocity so as to partially and temporarily form an elongated hole in a molten pool extending backward from a laser irradiation spot at least in the steel sheet on the surface side, whereby metal vapor produced by laser irradiation is vented through the elongated hole backward in a laser traveling direction and in a laser irradiation source side. | 04-28-2011 |
20110163076 | METHOD AND APPARATUS FOR ACTIVATING COMPOUND SEMICONDUCTOR - A compound semiconductor is placed in a reaction vessel ( | 07-07-2011 |
20110240611 | Methods and Device for Laser Processing - The present invention relates to laser ablation microlithography. In particular, we disclose a new SLM design and patterning method that uses multiple mirrors per pixel to concentrate energy to an energy density that facilitates laser ablation, while keeping the energy density on the SLM mirror surface at a level that does not damage the mirrors. Multiple micro-mirrors can be reset at a very high frequency, far beyond current DMD devices. | 10-06-2011 |
20110297653 | METHOD AND DEVICE FOR PRODUCING NANO-STRUCTURED SURFACES - An apparatus and a method for producing nanostructured surfaces are particularly suited for producing surfaces having very low roughness over large lateral extents. The method includes the following steps: providing an article having a surface to be structured; generating short-pulse laser radiation with laser pulses whose pulse durations lie in the subnanosecond range, preferably in the range of 100 fs to 300 fs, directing the short-pulse laser radiation onto the surface to be structured on the article, such that a fluence F of each individual pulse of the short-pulse laser radiation is less than a multishot threshold fluence F | 12-08-2011 |
20120024827 | LASER ASSISTED MACHINING APPARATUS WITH DISTRIBUTED LASERS - Laser assisted machining process and machine utilizing multiple distributed laser units that are strategically distributed around the workpiece being machined to simultaneously heat the workpiece, creating a desired temperature distribution for laser assisted machining. Sequential incremental heating from different directions and positions are used, resulting in longer tool life and shorter machining time. | 02-02-2012 |
20120061356 | LASER MACHINING DEVICE AND LASER MACHINING METHOD - The controllability of modified spots is improved. A laser processing apparatus | 03-15-2012 |
20120067855 | FEMTOSECOND LASER PULSE SURFACE STRUCTURING METHODS AND MATERIALS RESULTING THEREFROM - Embodiments of the present invention are generally directed to materials processing methods using femtosecond duration laser pulses, and to the altered materials obtained by such methods. The resulting nanostructured (with or without macro- and micro-structuring) materials have a variety of applications, including, for example, aesthetic applications for jewelry or ornamentation; biomedical applications related to biocompatibility; catalysis applications; and modification of, for example, the optical and hydrophilic properties of materials including selective coloring. | 03-22-2012 |
20120152915 | SINGULATION OF LAYERED MATERIALS USING SELECTIVELY VARIABLE LASER OUTPUT - Systems and methods for processing, selectively ablating, and singulating layered materials. According to some embodiments, methods for selectively ablating a layered material may include selectively varying a wavelength of at least a portion of a primary ultrafast laser beam to create a secondary ultrafast laser beam with a second wavelength, the primary ultrafast laser beam being configured to ablate a layer of the layered material, the secondary ultrafast laser beam being configured to ablate an additional layer of the layered material and applying the first and second ultrafast laser beams to the layered material to create a singulated product. | 06-21-2012 |
20120160814 | METHODS AND SYSTEMS FOR LINK PROCESSING USING LASER PULSES WITH OPTIMIZED TEMPORAL POWER PROFILES AND POLARIZATIONS - Systems and methods ablate electrically conductive links using laser pulses with optimized temporal power profiles and/or polarizations. In certain embodiments, the polarization property of a laser beam is set such that coupling between the laser beam and an electrically conductive link reduces the pulse energy required to ablate the electrically conductive link. In one such embodiment, the polarization is selected based on a depth of a target link structure. In another embodiment, the polarization changes as deeper material is removed from a target location. In addition, or in other embodiments, a first portion of a temporal power profile of a laser beam includes a rapid rise time to heat an upper portion of an electrically conductive link so as to form cracks in a passivation layer over upper corners of the electrically conductive link, without forming cracks at lower corners of the electrically conductive link. | 06-28-2012 |
20120205349 | LASER IRRADIATION APPARATUS AND LASER MACHINING METHOD - A laser irradiation apparatus which is provided with: an environment isolation container, which houses a laser oscillator and is disposed in water; a laser irradiation head, which collects laser beams and irradiates a part to be machined with the laser beams; a light guide section which transmits the laser beams from the laser oscillator to the laser irradiation head; a power supply apparatus which supplies the laser oscillator with power; a cooling water supplying apparatus, which supplies the laser oscillator with cooling water through a cooling water supplying path; and a temperature sensor which measures the temperature inside of the environment isolation container. The temperature and/or the flow quantity of the cooling water to be supplied from the cooling water supplying apparatus is controlled on the basis of the measurement results obtained from the temperature sensor. | 08-16-2012 |
20120273470 | METHOD OF PROTECTING HIGH POWER LASER DRILLING, WORKOVER AND COMPLETION SYSTEMS FROM CARBON GETTERING DEPOSITS - There is provided a high power laser system for performing high power laser operations and methods and systems for protecting optics and components of high power laser systems while performing laser operations from damage from carbon gettering migration. | 11-01-2012 |
20120273471 | LASER MATCH HONING SYSTEM AND METHOD - A laser match honing system and method are provided for processing one of a pair of mechanically matching components ( | 11-01-2012 |
20120298636 | LASER PROCESSING APPARATUS - A laser processing apparatus includes a chuck table for holding a workpiece and a laser beam applying unit for applying a laser beam to the workpiece. A laser beam oscillating unit oscillates a laser beam and a focusing unit focuses the laser beam onto the workpiece. A reflecting unit is provided on the optical axis of the focusing unit. A wavelength detecting unit detects the wavelength of the plasma light reflected by the reflecting unit, and a controller determines the material of the workpiece according to a detection signal from the wavelength detecting unit, to control the laser beam applying unit. | 11-29-2012 |
20120325784 | NOVEL THERMAL PROCESSING APPARATUS - The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. An energy source for the optical system is typically a plurality of lasers, which are combined to form the energy field. | 12-27-2012 |
20120325785 | Method for controlling the quality of laser-welding processes, control system and program product therefor - Described herein is a method for controlling the quality of a laser-welding process, for example, of laser welds of semifinished products constituted by elements of sheet metal of different thickness and/or properties (“tailored blanks”), of the type that comprises the steps of: detecting a radiation (E*) produced in the welding area and issuing signals (E*) indicating said radiation; acquiring and processing said signals (E*) indicating said radiation; making a division into blocks of said signals (E*) indicating said radiation; calculating for each block a block-mean value (u) and a value of block standard deviation (o); and in supplying input values comprising block-mean values (u) and values standard deviation (o) for identifying defects and/or porosities and insufficient penetration. | 12-27-2012 |
20130075374 | MEMBER SEPARATION APPARATUS AND MEMBER SEPARATION METHOD - According to one embodiment, a member separation apparatus includes a stage and a light source. The stage is configured to mount a workpiece. The workpiece includes a first member and a second member. The first member is transmissive to light in a wavelength region. The wavelength region includes a first wavelength. The second member contacts with the first member. The second member has a higher absorptance for light in the wavelength region than the first member. The light source generates laser light and irradiates the workpiece with the laser light. The laser light contains a component of the first wavelength and a component of a second wavelength. The second wavelength includes the wavelength region different from the first wavelength. | 03-28-2013 |
20130146568 | LASER REFLECTOMETRY FOR SUBSTRATE PROCESSING - Embodiments of the present invention relate to methods and apparatus for control of laser devices and safety features related to utilization of laser devices in substrate processing systems. In one embodiment, a system for processing a substrate is provided. The system includes a chamber having a processing volume, a first laser device to emit a beam at a first wavelength into the processing volume, and a second laser device to emit a beam at a second wavelength into the processing volume, wherein the second wavelength is different than the first wavelength, and the second laser device comprises a filter adapted to attenuate one or both of the first wavelength and the second wavelength. | 06-13-2013 |
20130153548 | REOPENING OF COOLING-AIR BORES USING A NANOSECOND LASER IN THE MICROSECOND RANGE - A process for reopening cooling-air holes by a laser in order to remove coat down is provided. A nanosecond laser is provided and used for reopening the holes, wherein pulse times between 1 μs and 20 μs and a pulse frequency between 20 kHz and 40 kHz provided by the nanosecond laser are used. | 06-20-2013 |
20130200049 | APPARATUS AND METHOD FOR CORRECTING POSITION OF LASER BEAM FOR USE IN MANUFACTURING BIOSENSOR WITH FINE PATTERN - An embodiment includes a loading unit with an alignment mark configured to support a substrate, a laser beam generating unit configured to generate a laser beam toward the upper surface of the loading unit, a vision unit that causes the laser beam generating unit to irradiate the laser beam onto the substrate on the loading unit to form an alignment mark on the substrate and that generates corrected coordinate values based on the formed alignment mark on the substrate, a position detector located at the center of the loading unit to detect information about the laser beam generated by the laser beam generating unit, and a controller that controls an X-Y scanning mirror according to the corrected coordinate values, and controls power of the laser beam generated by the laser beam generating unit or the position of the loading unit according to the information detected by the position detector. | 08-08-2013 |
20130228557 | TOTAL INTERNAL REFLECTION LASER TOOLS AND METHODS - There is provided high power laser tools and laser heads that utilize total internal reflection (“TIR”) structures to direct the laser beam along a laser beam path within the TIR structure. The TIR structures may be a TIR prism having its hypotenuse as a TIR surface. | 09-05-2013 |
20130256279 | LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS - A laser processed hole is formed in a workpiece. The workpiece has a first member formed of a first material bonded to a second member formed of a second material. The laser processed hole extends through the first member to the second member. The wavelength of plasma light generated by applying a pulsed laser beam to the first member and the second member is detected. Application of the laser beam is continued at a first power until the plasma light intensity generated from only the first member is decreased to reach a predetermined value. The laser beam is applied at a second power which is lower than the first power so as to not generate cracks in the first member when the plasma light intensity has reached the predetermined value. Application of the plasma laser beam stops when plasma light generated from the second member is detected. | 10-03-2013 |
20130256280 | DEVICE FOR CUTTING A STRUCTURE INCLUDING WIRE-LIKE NANOSCALE OBJECTS, AND RELATED METHOD - A device for cutting a structure including nanotubes, including: a mechanism to polarize linearly laser pulses emitted in a direction of the structure, wherein a duration of the laser pulses is roughly between 1 femtosecond and 300 femtoseconds; and a mechanism to focus the linearly polarized laser pulses on the structure. | 10-03-2013 |
20130277340 | Fiber Based Spectroscopic Imaging Guided Laser Material Processing System - Methods and systems for fiber-based near-field material processing are disclosed, including generating electromagnetic radiation from a USP laser coupled to a central processing unit; coupling the electromagnetic radiation to an acousto-optic modulator; coupling the electromagnetic radiation to a beam delivery system; coupling the electromagnetic radiation to a beam delivery/collection fiber; using the electromagnetic radiation to generate a plasma on a target mounted to an adjustable stage coupled to the central processing unit; coupling the electromagnetic radiation from the plasma to the beam delivery/collection fiber; coupling the electromagnetic radiation to an optical fiber bundle; coupling the electromagnetic radiation to a spectrum analysis unit; coupling the electromagnetic radiation to a detector; and coupling the detector to the central processing unit; wherein the central processing unit uses the output from the detector as feedback in making adjustments to the USP laser and the adjustable stage. Other embodiments are described and claimed. | 10-24-2013 |
20130299465 | METHODS AND SYSTEMS FOR OPERATING LASER PROCESSING SYSTEMS - Embodiments of methods and systems for distributing laser energy are disclosed herein. A method configured in accordance with one embodiment includes establishing communication with a laser energy source configured to dispense laser energy, and enabling the laser energy source to dispense laser energy by transferring laser energy credits to the laser energy source. The transferred laser energy credits correspond to an amount of enabled laser energy. | 11-14-2013 |
20130299466 | Method for Forming Superior Local Conductivity in Self-Organized Nanodots of Transparent Conductive Film by Femtosecond Laser - A simple method is developed in the present invention for fabricating periodic ripple microstructures on the surface of an ITO film by using single-beam femtosecond laser pulses. The periodic ripple microstructures composed of self-organized nanodots can be directly fabricated through the irradiation of the femtosecond laser, without scanning. The ripple spacing of ˜800 nm, ˜400 nm and ˜200 nm observed in the periodic ripple microstructures can be attributed to the interference between the incident light and the scattering light of the femtosecond laser from the surface of the ITO film. In the present invention, the self-organized dots are formed by the constructive interference formed in the surface of the ITO film, where includes higher energy to break the In—O and Sn—O bonds and then form the In—In bonds. Therefore, the dots have higher surface current greater than other disconstructive regions of the ITO film. | 11-14-2013 |
20130299467 | COMPONENT HAVING WELD SEAM AND METHOD FOR PRODUCING A WELD SEAM - During welding, frequently cracks develop at the end of the weld seam. A method is provided in which the power is reduced at the end of the weld seam, reducing the development of cracks. For the method, a welding appliance is used wherein the welding appliance may be a laser. | 11-14-2013 |
20130341308 | ABERRATION-CORRECTING METHOD, LASER PROCESSING METHOD USING SAID ABERRATION-CORRECTING METHOD, LASER IRRADIATION METHOD USING SAID ABERRATION-CORRECTION METHOD, ABERRATION-CORRECTION DEVICE AND ABERRATION-CORRECTING PROGRAM - In an aberration-correcting method according to an embodiment of the present invention, in an aberration-correcting method for a laser irradiation device | 12-26-2013 |
20130341309 | LASER MACHINING DEVICE - A laser machining apparatus, including: a laser light source; a transparent member that is set on an optical path of a laser beam and transmits the laser beam; a contact type temperature difference sensor, set on a surface of the transparent member outside an irradiation range of the laser beam, for detecting a temperature difference between a surface of the transparent member, which is spaced apart from a center of the transparent member by a first distance, and another surface of the transparent member, which is spaced apart from the center of the transparent member by a second distance larger than the first distance; and a controller correcting a focal position based on the temperature difference detected by the contact type temperature difference sensor to stabilize a beam diameter of the laser beam condensed onto a machining object. | 12-26-2013 |
20140014631 | LASER PROCESSING METHOD - A laser processing method of applying a pulsed laser beam having a repetition frequency of 20 kHz or more to a workpiece to thereby process the workpiece. The relation between the wavelength of the pulsed laser beam and the pulse width generating no cracks is determined by experiment on the basis of the absorption edge of the workpiece, thereby setting the processing conditions. The relation between various set values for the wavelength and the limits of the pulse width is plotted to prepare a graph having a vertical axis representing the wavelength and a horizontal axis representing the pulse width. The pulsed laser beam is applied in the region below a curve obtained by connecting the limits of the pulse width at the various set values for the wavelength. | 01-16-2014 |
20140027412 | METHOD FOR MARKING ON METALLIC MEMBER - Provided is a method for marking on a pressed metallic component whose visibility and corrosion resistance in a marking target is ensured. The method includes a step of irradiating a base treatment target region including a marking target region with a laser beam on a first irradiation condition, and a step of irradiating the marking target region with the laser beam on a second irradiation condition, in which a charged energy of the laser beam is set to be smaller on the first irradiation condition than the second irradiation condition, thereby providing between the marking pattern and a non-irradiation region, a base region having a residual stress greater than that of the non-irradiation region and a residual stress smaller than that of the marking pattern, so as to ensure a visibility. Furthermore, a corrosion resistance is ensured by using a metallic member which is heat-treated to enhance the hardness. | 01-30-2014 |
20140076863 | PULSE WIDTH CONTROLLER - A pulse width controller for a thermal processing system is disclosed. Pulsed electromagnetic radiation is directed through a rotatable wave plate to a polarizing beam splitter, which reflects and transmits according to the phase angle of the wave plate. Radiation transmitted by the polarizing beam splitter is directed into an optical circuit that returns the radiation to the polarizing beam splitter after a transit time. A second rotatable wave plate is positioned in the optical circuit. The polarizing beam splitter reflects and transmits the returned radiation according to the phase angle of the second rotatable wave plate. A second pulse width controller may be nested in the optical circuit, and any number of pulse width controllers may be nested. | 03-20-2014 |
20140083983 | METHOD AND APPARATUS FOR SEPARATION OF WORKPIECES AND ARTICLES PRODUCED THEREBY - The present invention is a method for separating a workpiece from a common substrate. It includes the steps of providing the workpiece, generating, within a beam source, a beam of laser pulses configured to modify a portion of the workpiece, determining a depth for creating a modified region based upon a characteristic of the workpiece and modifying a plurality of regions within the workpiece to form a plurality of modified regions. Modifying the plurality of regions includes directing the beam of laser pulses from an output of the beam source onto the workpiece, causing relative motion between the workpiece and the output of the beam source while directing the beam of laser pulses onto workpiece, and modifying a characteristic of the pulses of the beam upon generating a number of pulses which generally correspond to creating the modified regions to the determined depth. | 03-27-2014 |
20140083984 | Formation Of Laser Induced Periodic Surface Structures (LIPSS) With Picosecond Pulses - A method of forming a laser induced periodic surface structure (LIPSS), comprises directing a beam of picosecond laser pulses across the surface of a polycrystalline material to pattern the material with a LIPSS, where the laser pulses have a time duration of no greater than a selected pulse duration T and a pulse fluence above a threshold value of about H; wherein the laser pulses are directed across the surface so as to expose the polycrystalline material to at least a selected dosage; wherein T is 40 ps and the selected dosage is 20 J/mm | 03-27-2014 |
20140103018 | Spatially chirped pulses for femtosecond laser ablation through transparent materials - Temporal focusing of spatially chirped femtosecond laser pulses overcomes previous limitations for ablating high aspect ratio features with low numerical aperture (NA) beams. Simultaneous spatial and temporal focusing reduces nonlinear interactions, such as self-focusing, prior to the focal plane so that deep (˜1 mm) features with parallel sidewalls are ablated at high material removal rates. | 04-17-2014 |
20140151346 | METHOD FOR PRODUCTION OF SAFETY/RUPTURE DISCS - A method for production of safety/rupture discs ( | 06-05-2014 |
20140166632 | Dual-loop control for laser annealing of semiconductor wafers - Systems and methods for performing semiconductor laser annealing using dual loop control are disclosed. The first control loop operates at a first frequency and controls the output of the laser and controls the 1/f laser noise. The second control loop also controls the amount of output power in the laser and operates at second frequency lower than the first frequency. The second control loop measures the thermal emission of the wafer over an area the size of one or more die so that within-die emissivity variations are average out when determining the measured annealing temperature. The measured annealing temperature and an annealing temperature set point are used to generate the control signal for the second control loop. | 06-19-2014 |
20140175067 | METHODS OF FORMING IMAGES BY LASER MICROMACHINING - A method and laser processing system ( | 06-26-2014 |
20140183172 | LASER CRYSTALLIZATION SYSTEM AND METHOD OF MANUFACTURING DISPLAY APPARATUS USING THE SAME - A laser crystallization system is disclosed. In one embodiment, the laser crystallization system includes i) a mother substrate including first, second, and third display regions sequentially arranged in a first direction and ii) a stage for supporting the mother substrate and moving in the first direction and in a second direction. The system also includes i) a first laser irradiation unit for irradiating a first laser beam having a width greater than or identical to a width of a side of one of the display regions in the first direction and ii) a second laser irradiation unit spaced apart from the first laser irradiation unit and irradiating a second laser beam having a width greater than or identical to the width of the side in the first direction. Furthermore, the first and second laser beams may correspond to widths of sides of the first and third display regions. | 07-03-2014 |
20140190946 | Laser Microdissection Method and Laser Microdissection Device - Methods and apparatuses for laser microdissection are provided. For example, by a user at least one first system parameter is adjusted, for example varied, and at least one second system parameter of the laser microdissection system is adjusted automatically by the laser microdissection system such that a cut line has a desired cut line parameter. | 07-10-2014 |
20140263207 | Method and Apparatus for Welding Dissimilar Material with a High Energy High Power Ultrafast Laser - Methods and systems for welding are disclosed, including generating electromagnetic radiation from an ultrashort pulse laser; coupling the electromagnetic radiation from the ultrashort pulse laser to a scanner comprising a scanning and focus range, wherein the scanner is configured to receive the electromagnetic radiation from the ultrashort laser and to scan and focus the electromagnetic radiation onto a joining interface of one or more materials; using a computer to adjust the pulse repetition rate and the average power of the ultrashort pulse laser; using one or more stages to position the joining interface; using a dichroic filter positioned between the scanner and the one or more materials; and focusing an imager and processor through the dichroic filter and onto the joining interface to monitor the joining interface of the one or more materials within the scanning and focus range of the electromagnetic radiation. Other embodiments are described and claimed. | 09-18-2014 |
20140263208 | THERMAL PROCESSING WITH LINE BEAMS - Multi-beam, multi-wavelength processing systems include two or more lasers configured to provide respective beams to a substrate. The beams have wavelengths, pulse durations, beam areas, beam intensities, pulse energies, polarizations, repetition rates, and other beam properties that are independently selectable. Substrate distortion in processes requiring local heating can be reduced by preheating with a large area beam at a first wavelength followed by exposure to a focused beam at a second wavelength so as to heat a local area to a desired process temperature. For some processing, multiple wavelengths are selected to obtain a desired energy deposition within a substrate. | 09-18-2014 |
20140291304 | PULSE SPREAD LASER - A system and method for precision welding using a fiber laser is disclosed in which varying intensity laser pulses are spread across the material junction in a number of high aspect ratio areas. The power density applied along each area is varied to accommodate differences in the material characteristics of each material while allowing for the creation of a more uniform weld pool alloy. | 10-02-2014 |
20140332507 | PROCESS FOR PRODUCING A SHAPED BODY BY LAYERWISE BUILDUP FROM MATERIAL POWDER - The invention relates to a method for producing a moulded body by building up layers of powdered material, comprising the steps of:
| 11-13-2014 |
20140360987 | LASER APPARATUS AND METHOD OF IRRADIATING LASER BEAM USING THE SAME - A laser apparatus includes: a laser which selectively irradiates a laser beam to a portion of a target based on a laser driving voltage, where an intensity of the laser beam is substantially stabilized within about 10 nanoseconds; a stage which controls a relative location between the target and the laser based on a stage driving voltage; and a controller which applies the stage driving voltage to the stage, and applies the laser driving voltage to the laser | 12-11-2014 |
20140360988 | LASER DICING METHOD - A laser dicing method includes: placing a workpiece substrate on a stage; generating a clock signal; emitting a pulse laser beam synchronous with the clock signal; switching irradiation and non-irradiation of the workpiece substrate with the pulse laser beam in a unit of light pulse in synchronization with the clock signal to perform first irradiation of the pulse laser beam on a first straight line by controlling the pulse laser beam using a pulse picker; performing second irradiation of the pulse laser beam on a second straight line, which is adjacent to the first straight line in a substantially parallel fashion, after the first irradiation; and forming a crack reaching a workpiece substrate surface on the workpiece substrate by the first irradiation and the second irradiation. | 12-11-2014 |
20140360989 | METHODS AND SYSTEMS FOR OPERATING LASER PROCESSING SYSTEMS - Embodiments of methods and systems for distributing laser energy are disclosed herein. A system for dispensing laser energy by one or more laser energy sources in accordance with one embodiment of the present technology includes a laser energy credit transferring component configured to communicate with a laser energy source. The laser energy source is configured for producing and dispensing laser energy. The laser energy credit transferring component is further configured to receive a request from the laser energy source for laser energy and transfer laser energy credits to the laser energy source. The laser energy credits enable the laser energy source to dispense a corresponding amount of laser energy. | 12-11-2014 |
20150014286 | CO2 LASER WITH RAPID POWER CONTROL - Subject matter of the invention is a CO | 01-15-2015 |
20150034612 | METHOD AND APPARATUS FOR NON-ABALTIVE, PHOTOACCOUSTIC COMPRESSION MACHINING IN TRANSPARENT MATERIALS USING FILAMENTATION BY BURST ULTRAFAST LASER PULSES - An apparatus, system and method for the processing of orifices in materials by laser filamentation that utilizes an optical configuration that focuses the incident laser light beam in a distributed manner along the longitudinal beam axis. This distributed focusing method enables the formation of filaments over distances, and the laser and focusing parameters are adjusted to determine the filament propagation and termination points so as to develop a single/double end stopped orifice, or a through orifice. Selected transparent substrates from a stacked or nested configuration may have orifices formed therein/therethrough without affecting the adjacent substrate. These distributed focusing methods support the formation filaments with lengths well beyond ten millimeters in borosilicate glass and similar brittle materials and semiconductors. | 02-05-2015 |
20150034613 | SYSTEM FOR PERFORMING LASER FILAMENTATION WITHIN TRANSPARENT MATERIALS - Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding up to 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process. | 02-05-2015 |
20150048062 | DYNAMIC OPTICAL VALVE FOR MITIGATING NON-UNIFORM HEATING IN LASER PROCESSING - Embodiments of the present invention generally relate to an optical valve that modifies a laser beam to allow more energy to be irradiated onto less absorbing areas on a substrate and less energy to be irradiated onto more absorbing areas on the substrate, thus creating a more uniform heating field. The optical valve is a layered structure comprising a reflective switch layer, an absorbing layer, a thermal resistor and a thermal bath. | 02-19-2015 |
20150083697 | Method for Laser Remote Processing of a Workpiece on a Fillet and Device Therefor - The invention relates to a method for laser remote processing of a component on a fillet, wherein a laser beam is directed by means of a scanner device onto the component and guided over said component. The working range of the laser beam on the workpiece is illuminated with illuminating radiation and is captured by at least one image capturing unit. The illuminating radiation is directed onto the component at an angle of attack which is set depending the fillet geometry of the component. The captured image data are evaluated automatically and, with the aid of the evaluation, if appropriate, an automatic correction of the path of the laser beam is carried out. | 03-26-2015 |
20150096963 | LASER CLADDING WITH PROGRAMMED BEAM SIZE ADJUSTMENT - A method for heating an irregularly shaped target surface ( | 04-09-2015 |
20150108101 | METHOD FOR MARKING COMPONENTS OF AN AIRPLANE ENGINE - A method of marking components of an aircraft engine, especially turbine blades of a titanium aluminide intermetallic compound. A solid state laser generates a pulsed laser beam with a pulse width of less than 10 ps and the component is marked with the pulsed laser beam. | 04-23-2015 |
20150136743 | METHOD OF CLOSED FORM RELEASE FOR BRITTLE MATERIALS USING BURST ULTRAFAST LASER PULSES - A method for machining and releasing closed forms from a transparent, brittle substrate includes using a burst of ultrafast laser pulses to drill patterns of orifices in the substrate. Orifices are formed by photoacoustic compression and they extend completely or partially in the transparent substrate. A scribed line of spaced apart orifices in the transparent substrate comprise a closed form pattern in the substrate. A heat source is applied in a region about said scribed line of spaced apart orifices until the closed form pattern releases from the transparent substrate. | 05-21-2015 |
20150336208 | TEMPORAL PULSE SHAPING FOR LASER SHOCK PEENING - Methods, systems, and apparatuses are disclosed for temporal pulse shaping of laser pulses used in laser shock peening applications. In one embodiment, a system for temporal pulse shaping of a laser beam used for laser shock peening comprises a laser; a modulator; a high voltage driver, a waveform generator, a polarizer, and an optical amplifier. | 11-26-2015 |
20150352666 | MACHINING DEVICE AND MACHINING METHOD - Provided are a machining device and a machining method in which machining of higher precision can be performed with a simple configuration. The machining device has an irradiation head ( | 12-10-2015 |
20150352667 | MATERIAL PROCESSING SYSTEM WITH LOW-INERTIA LASER SCANNING AND END EFFECTOR MANIPULATION - An apparatus includes a robotic manipulator with a stationary base, and an end effector actuated by the robotic manipulator, wherein the end effector is adjacent to a workpiece. A scanning laser head unit includes a laser and an optical train configured to move a laser beam over the workpiece. A control unit is configured to move the robotic manipulator such that movement of the end effector tracks movement of the laser beam. | 12-10-2015 |
20150375337 | POWER CONTROL METHOD FOR FIBER LASER PROCESSING MACHINE, AND FIBER LASER PROCESSING MACHINE - There is provided a power control method for a fiber laser processing machine including: a fiber laser oscillator having a plurality of fiber laser modules each of which generates a laser beam; a laser processing head for emitting the laser beam generated from the fiber laser oscillator; and a condenser lens with a prescribed focal length provided between a workpiece and the laser processing head, for irradiating the workpiece with the laser beam having a spot diameter output from the laser processing head, wherein the number of the plurality of fiber laser modules oscillated is adjusted so as to achieve the spot diameter corresponding to the workpiece, and thereby, a beam quality from the laser processing head is adjusted. | 12-31-2015 |
20150375338 | Laser System for Modifying Objects - A system for modifying a surface of an object, including a transport mechanism for transporting an object, a laser pulse generator for generating a laser pulse having an energy between 200 mJ and 400 mJ by pumping an active medium, a spatial light modulator being adapted to spatially modulate a laser pulse generated by the laser pulse generator and including an emitting surface that is adapted to emit a spatially modulated laser pulse, the spatial light modulator and the laser pulse generator being arranged to emit a spatially modulated laser pulse onto a surface of an object transported by the transport mechanism, wherein the laser pulse generator includes a Q-switch and a control unit that is adapted to control the point in time the Q-switch is switched, depending on a transport property of the object; and a method for modifying the surface of an object. | 12-31-2015 |
20160008920 | PROCESSING APPARATUS AND PROCESSING METHOD | 01-14-2016 |
20160016261 | LASER WELDING SYSTEM AND METHOD - A system and method for precision welding using a fiber laser is disclosed in which varying intensity laser pulses are spread across the material junction in a number of high aspect ratio areas. The power density applied along each area is varied to accommodate differences in the material characteristics of each material while allowing for the creation of a more uniform weld pool alloy. | 01-21-2016 |
20160067824 | LASER ABLATION AND PROCESSING METHODS AND SYSTEMS - Systems and methods for ablating or processing a surface using a laser beam are provided. A method includes directing a laser beam at a surface to form a contact area. The method also includes moving the contact area to form a contact curve. The method includes tuning a wavelength and a power of the laser beam to process a material and/or ablate a coating. The wavelength and the power may be further tuned to not damage the surface beneath the coating. Moving the contact area may include forming a second contact curve by superimposing, at a same time, the second contact curve on the contact curve. A system includes a laser and a directing arrangement configured to direct a laser beam from the laser at a surface to form a contact area. A non-transitory processor-readable medium having instructions stored thereon is provided. | 03-10-2016 |
20160074953 | METHOD FOR MODIFYING THE VALUE OF AN ELECTRIC RESISTOR COMPRISING A FERROMAGNETIC MATERIAL - A method for modifying the value of an electrical resistance ( | 03-17-2016 |
20160085067 | HIGH POWER HANDLING OPTICAL SPATIAL LIGHT MODULATOR - Laser-based material processing systems including a Micro-Electromechanical System devices (MEMs) based reflective, optical modulator with dielectric mirrors for high power handling and methods of manufacturing and using the same are described. Generally, the system includes a workpiece support, a laser, a workpiece support, a laser, a MEMs based reflective, optical modulator to modulate a beam generated by the laser; and imaging optics to direct modulated light from the optical modulator onto a workpiece on the workpiece support. The optical modulator includes a number of surfaces with dielectric mirrors formed thereon to modulate the beam generated by the laser. Other embodiments are also described. | 03-24-2016 |
20160136757 | AUTOMATED DYNAMIC LASER PEENING SYSTEM - Methods, systems, and apparatuses are disclosed for automated dynamic laser peening of a workpiece. In one embodiment, a system for automated dynamic laser peening of a workpiece comprises: a laser; a laser beam delivery system; and a dynamic platform system. | 05-19-2016 |
20160151857 | LASER PROCESSING APPARATUS | 06-02-2016 |
20160158886 | INTERFEROMETRIC LASER PROCESSING - The present disclosure relates to the field of laser induced modification and processing of materials. Modification is achieved by confining laser-material interaction within an array of narrow zones characterizing an optical interference profile. Disclosed is a method of laser induced modification of a material comprising applying at least one laser pulse to the material, the at least one laser pulse being incident on the first interface of the material, wherein the material is selected on the basis that it can support an optical interference pattern such that a thin volume at a site of at least one intensity maxima of the optical interference pattern is characterized by a laser intensity above a threshold value to responsively produce the laser induced modification of the material at a location relative to the first interface. | 06-09-2016 |
20160167170 | BONDED BODY AND POWER MODULE SUBSTRATE | 06-16-2016 |
20160184926 | LASER ABLATION SYSTEM INCLUDING VARIABLE ENERGY BEAM TO MINIMIZE ETCH-STOP MATERIAL DAMAGE - An ablation system includes an ablation tool configured to generate an energy beam to ablate an energy-sensitive material formed on at least one embedded feature of a workpiece. The ablation tool selects an initial fluence and an initial pulse rate of the energy beam to ablate a first portion of the energy-sensitive layer. The ablation tool further reduces at least one of the initial fluence and the initial pulse rate of the energy beam to ablate a second remaining portion of the energy-sensitive layer such that the embedded feature is exposed without being damaged or deformed. | 06-30-2016 |
20160199935 | PARALLEL LASER MANUFACTURING SYSTEM AND METHOD | 07-14-2016 |
20160250714 | FAST BEAM MANIPULATION FOR CROSS-AXIS MIROMACHING | 09-01-2016 |
20220134480 | LASER ROUGHENING: ENGINEERING THE ROUGHNESS OF THE BURL TOP - Methods, computer program products, and apparatuses for reducing sticking during a lithography process are disclosed. An exemplary method of reducing sticking of an object to a modified surface that is used to support the object in a lithography process can include controlling a light source to deliver light to a native surface thereby causing ablation of at least a portion of the native surface to increase the roughness of the native surface thereby forming the modified surface. The increased roughness reduces the ability of the object to stick to the modified surface. | 05-05-2022 |