Class / Patent application number | Description | Number of patent applications / Date published |
219121580 | With work holder | 7 |
20090065486 | PLASMA TREATMENT APPARATUS, AND SUBSTRATE HEATING MECHANISM TO BE USED IN THE APPARATUS - A plasma processing apparatus includes a chamber configured to accommodate a target substrate; a plasma generation mechanism configured to generate plasma inside the chamber; a process gas supply mechanism configured to supply a process gas into the chamber; an exhaust mechanism connected to the chamber to exhaust gas from inside the chamber; a table configured to place the target substrate thereon inside the chamber, the table including a table main body and a heating element disposed in the main body to heat the substrate; a support portion that supports the substrate table; a fixing member that fixes the support portion to the chamber; and an electrode configured to supply a power to the heating element, wherein the heating element and the electrode are made of an SiC-containing material, the electrode is fixed to the fixing member, extends through the support portion, and is connected to the heating element at a distal end, and an electrode sheath member made of a quartz-containing insulative material envelops the electrode except for the distal end, and extends through a portion of the substrate table below the heating element, the support portion, and the fixing member. | 03-12-2009 |
20110042359 | PLASMA HEATING DEVICE FOR AN OPTICAL FIBER AND RELATED METHODS - A heating device for an optical fiber may include a crucible body having an optical fiber receiving slotted passageway therein for receiving the optical fiber therein, and a heating element receiving passageway therein adjacent the optical fiber receiving slotted passageway and spaced apart therefrom. The heating device may further include a respective electrically powered plasma heating element enclosed within the heating element receiving passageway for heating the optical fiber within the optical fiber receiving slotted passageway. | 02-24-2011 |
20120018411 | APPARATUS FOR SPATIAL AND TEMPORAL CONTROL OF TEMPERATURE ON A SUBSTRATE - An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. | 01-26-2012 |
20120279946 | APPARATUS AND METHODS FOR HANDLING WORKPIECES IN A PROCESSING SYSTEM - Apparatus and methods for handling workpieces in a processing system. The workpiece vertical lift mechanism ( | 11-08-2012 |
20130153547 | MULTI-CHAMBER HEAT TREATMENT DEVICE - A multi-chamber heat treatment device (S | 06-20-2013 |
20140131326 | OPTICAL FIBER FUSION SPLICER - An optical fiber fusion splicer includes a base having a fiber groove for containing an optical fiber, a fiber clamp for pressing the optical fiber contained in the fiber groove against the base and load changing means for changing a load for the fiber clamp to press the optical fiber. | 05-15-2014 |
20140346152 | MOUNTING TABLE AND PLASMA PROCESSING APPARATUS - A mounting table includes an electrostatic chuck, a base, and a cylindrical sleeve. The electrostatic chuck has a top surface to be exposed to plasma and a bottom surface opposite to the top surface, and a first through-hole is formed through the electrostatic chuck. The base is bonded to the bottom surface of the electrostatic chuck by a first adhesive, and a second through-hole is formed through the base. The second through-hole communicates with the first through-hole and has a diameter larger than a diameter of the first through-hole. The sleeve is bonded to the bottom surface of the electrostatic chuck by a second adhesive while communicating with the first through-hole. | 11-27-2014 |