Class / Patent application number | Description | Number of patent applications / Date published |
219850100 | Brazing or soldering | 29 |
20090261074 | THERMODE DEVICE FOR A MULTITUDE OF SEMICONDUCTOR COMPONENTS - A thermode device for connecting and/or electrically contacting a plurality of first semiconductor components to at least one support element and/or to a plurality of second semiconductor components by heating an adhesive under the application of pressure. An example thermode device includes a basic body and a heating element which can be extended out of the basic body and which, under the application of pressure, acts on at least one of the first semiconductor components, wherein the basic body has on its underside a plurality of heating plates which are oriented vertically and are arranged next to one another. Each heating plate has on its end and underside a plurality of the extendable heating elements, to the underside of each of which there is assigned a first semiconductor component. | 10-22-2009 |
20100108647 | Heat Transferring Member for Solder Handling Device, and Electric Soldering Iron and Electric Desoldering Tool with the Heat Transferring Member - A heat transferring member comprises a heat transfer body for melting solder, and a pipe inserted into a hole formed in the heat transfer body, wherein heat from a heating member is conducted to the heat transfer body. The pipe includes a tubular-shaped substrate made of copper or copper alloy, and an aluminum oxide film formed at least on a peripheral surface of the tubular-shaped substrate. The pipe may be press-fitted in the hole. | 05-06-2010 |
20100181293 | Reflow apparatus, Reflow method, and package apparatus - Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil. | 07-22-2010 |
20100213177 | DEVICE FOR VACUUM TIGHT SOLDERING AN EVACUATED FLAT PANEL SOLAR COLLECTOR - Device for vacuum tight soldering together a perimeter metal coating ( | 08-26-2010 |
20110024395 | ELECTRIC SOLDERING IRON WITH AUTOMATIC POWEROFF AND METHOD THEREOF - An electric soldering iron comprises a power unit connecting the electric soldering iron to an external power source, an electric soldering iron body comprising an iron head and a motion sensor for detecting motion of the electric soldering iron body, and a control system connected to the power unit and the electric soldering iron body, which comprises a switch, a control unit and a timer. The control unit directs the switch to maintain or terminate connection between the power unit and the iron head based on motion detected by the motion sensor and duration measured by the timer. When the duration exceeds a predetermined value, the control system enables the switch to terminate connection of the iron head and the power unit to achieve automatic cutoff of power. | 02-03-2011 |
20130134136 | ELECTRICAL SOLDERING IRON HEAD - An electric soldering iron head includes a heat-conducting pipe, a connecting member mounted to the heat-conducting pipe, a first heating block extending down from the connecting member, a second heating block slidably attached to the connecting member, and an operation member rotatably installed in the connecting member. The operation member includes a gear. The first heating block includes a first clamping portion. The second heating block includes a gear rack meshing with the gear and a second clamping portion facing the first clamping portion. When the operation member is operated to rotate, the gear drives the gear rack to slide, the second clamping portion slides toward or away from the first clamping portion. | 05-30-2013 |
219850120 | Utilizing radiant energy | 4 |
20090289039 | Circuit board conveying and soldering apparatus - A circuit board and components provided thereupon are held by and between lower and upper palettes. The upper palette has protecting portions that are provided above and opposed to the components. The shielding components prevent light beams irradiated by a preheating light source from directly reaching the components made of colored synthetic resin. Meanwhile, the upper palette has openings that are opposed to the circuit board except for the components protected by the protecting portions members. The light beams from the light source travel through the openings and applied to the circuit board. Openings are formed so as to be opposed to terminals that are soldered on and connected to the circuit board. Inner surfaces of the openings are made of light-reflecting material that reflects downward the light beams from the light source. | 11-26-2009 |
219850130 | Methods | 3 |
20130161295 | Laser Cavity Exhibiting Low Noise - Inventive single cavities for use in a high power fiber laser systems are described that include a high reflective grating, a gain fiber, an output coupler having a bandwidth in the range of 1 nm to 2 nm; and an output fiber connected to the single cavity that supplies power from the single cavity. The single cavity can be used in a wide variety of applications, including welding, cutting, brazing or drilling a material, or to seed a downstream amplifier. | 06-27-2013 |
20130284707 | APPARATUS OF MOUNTING AND REMOVING COMPONENT, METHOD OF MOUNTING COMPONENT AND METHOD OF REMOVING COMPONENT - An apparatus for mounting and removing a component includes: a light source configured to radiate light toward a component supported by solder; a light sensor configured to sense displacement of the component; and a member mounted on the component, the member including a hole in a portion to be irradiated with the light of the light source. | 10-31-2013 |
20150321278 | HEAT-BONDING APPARATUS AND METHOD OF MANUFACTURING HEAT-BONDED PRODUCTS - A heat-bonding apparatus and method of manufacturing a heat-bonded product not allowing the temperature of the object to be heat-bonded to overshoot greatly from a specified target temperature suitable for heat-bonding, and setting the temperature of the object to the target temperature in a shorter time and with higher efficiency and accuracy than the conventional when heat-bonding in vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for applying heat to the buffer part in contact with the object in the chamber, a cooler for discharging heat of the buffer part, a sensor for detecting temperature of the object heated through the buffer part and a controller for controlling the temperature of the object to be the target temperature by adjusting heat discharge from the buffer part with the cooler based on the detected temperature of the object. | 11-12-2015 |
219850140 | With filler metal in circuit | 4 |
20140319104 | ELECTRICAL INSULATING ELEMENT MADE OF CERAMIC MATERIAL FOR AN ELECTRICAL PROCESSING DEVICE, CORRESPONDING PROCESSING DEVICE - An electrical welding or soldering device ( | 10-30-2014 |
219850150 | Methods | 3 |
20090166339 | METHOD FOR PRODUCING AN ELECTRONIC MODULE BY SEQUENTIAL FIXATION OF THE COMPONENTS - The invention relates to a method for producing an electronic module ( | 07-02-2009 |
20090294409 | Method for inhibiting electromigration-induced phase segregation in solder joints - A method for inhibiting electromigration-induced phase segregation suitable for solder joint configurations used in a chip package is described as following. First, a chip package including a wiring board, a chip and numbers of solder joints is provided, wherein the chip is disposed on the wiring board, and the solder joints are disposed between the chip and the wiring board to electrically connect the chip to the wiring board. Next, a first current and a second current are alternately applied to a side of the solder joints, wherein flowing directions of the first current and the second current are opposite. The current density of the first current is 10 | 12-03-2009 |
20150306697 | RESISTANCE SPOT WELDING METHOD - A resistance spot welding method can be used to join polymeric and metallic workpieces together and includes the following steps: (a) placing an electrically conductive coating between a polymeric workpiece and a metallic workpiece, wherein the metallic workpiece has a textured surface facing the polymeric workpiece; (b) piercing the polymeric workpiece with first and second electrically conductive pins of a welding electrode assembly; (c) applying electrical energy to the first and second electrically conductive pins so that an electrical current flows through the first electrically conductive pin, the electrically conductive coating, and the second electrically conductive pin in order to at least partially melt the polymeric workpiece and the electrically conductive coating, thereby forming a weld pool; and (d) cooling the weld pool to form a solid weld nugget in order to establish a mechanical interface lock between the solid weld nugget and the textured surface. | 10-29-2015 |
219850160 | Electrically heated tool (e.g., electrodes, heaters, etc.) | 4 |
20080296266 | PROCESSING APPARATUS - A processing head is supported for pivotal movement around a pivot point in a processing apparatus. An urging member applies an urging force to the processing head at the pivot point. The processing apparatus allows establishment of point contact between the urging member and the processing head. When the surface of an object inclines from a predetermined attitude, the processing head is allowed to follow the inclination of the surface. The processing head is allowed to establish a predetermined attitude relative to the surface of the object. The processing head thus reliably enables a predetermined action to the object as desired. | 12-04-2008 |
20100187205 | SOLDERING DEVICE AND METHOD OF MAKING SAME - A soldering device includes a tip member and a temperature sensor embedded within the tip member by a buckled copper pipe that is thermally conductive. A soldering device includes a tip member and a temperature sensor embedded within the tip portion by application of a crimping force that deforms the tip portion onto the temperature sensor. A soldering device includes a tip member, a heater member, and a thermally conductive wedge that is pushed into a gap between the tip member and the heater member. A soldering device includes a tip cartridge carried by a handle assembly that includes an o-ring and an o-ring cover that keeps the o-ring from falling off of the handle assembly. The o-ring cover includes a hook portion that engages a catch feature of the handle housing. | 07-29-2010 |
20100224598 | QUICK TEMPERATURE COMPENSATION METHOD FOR AN ELECTRIC SOLDERING IRON AND A QUICK TEMPERATURE COMPENSABLE ELECTRIC SOLDERING IRON - The present invention provides quick temperature compensation method for an electric soldering iron and a quick temperature compensable electric soldering iron which includes a static temperature control circuit and a dynamic temperature control circuit, wherein the amount of the static temperature control is mainly depending on the temperature setting signal, real-time temperature detecting signal and the temperature additional signal, while the dynamic temperature control is made on the basis of Kalman digital filter principle. During the dynamic temperature control, the temperature regulation and control signal that has amplified through difference is identified by the function of the heat conduction transmission of the soldering iron head, and the temperature additional compensation is exported, when the temperature regulation and control signal accords with the function of the heat conduction transmission of the soldering iron head. The present invention is implemented to quickly detect and response the change of the thermal load of the iron head without the affect of the interfering noise outside, and to ensure that the iron head is operated at the setting temperature by the quick and effective control on the electrical heating element. Therefore, the rosin joint and cold joint result from the temperature change of the solder during the welding can be avoided, and the welding speed and quality can be improves. Simultaneously, the electric energy is saved and the operating life of the iron head is extended. | 09-09-2010 |
20100308020 | ELECTRICAL SOLDERING IRON - An electrical soldering iron is provided. The soldering iron comprises a heating element, a constant temperature heating circuit, a motion sensor, and a processor. The constant temperature heating circuit is configured for heating the heating element. The motion sensor is configured for detecting motion of the electrical soldering iron. The processor is configured for determining motion state of the electrical soldering iron according to signals from the motion sensor and directing the constant temperature heating circuit to bring the heating element to a temperature of a predetermined value corresponding to the motion state. | 12-09-2010 |
219850190 | Machine for predetermined operation | 1 |
20110127240 | AUTOMATIC SOLDERING MACHINE - An automatic soldering machine includes a frame assembly, an electric iron and a movable module fixed on the frame assembly. The movable module is used for making the electric iron connected with the movable module randomly move to a specified position at a predetermined area. The movable module includes a first driving unit having a first leading element movable along a first axis, a second driving unit having a second leading element movable along a second axis perpendicular to the first axis, a third driving unit having a third leading element movable along a third axis perpendicular to the first and second axis and a rotating unit capable of rotating around an axis thereof. The third driving unit is connected with the first leading element. The second driving unit is connected with the third leading element. The rotating unit is connected with the second leading element. | 06-02-2011 |
219850200 | Fluxes or solders | 2 |
20110089145 | SOLDER BONDING METHOD AND APPARATUS - The present invention generally relates to an automated solar cell electrical connection module that is positioned within an automated solar cell fabrication line and is configured to ensure a robust and reliable bond is formed during the electrical connection process. The electrical connection module generally provides a module and process for automatically attaching a junction box to a composite solar cell structure during the fabrication of a completed solar cell device. The electrical connection module further provides a thermode assembly including heating elements for forming a soldered connection between the junction box and the composite solar cell structure and a temperature sensing device in thermal communication with the heating elements for detecting a temperature profile during the connection process. The heating elements and temperature sensing device are linked to a controller configured to monitor and compare the energy input into the heating elements with the temperature near the tip of the heating elements throughout the connection process. The controller is further configured to compare the actual energy versus temperature profile to an expected profile throughout the connection process and verify whether a quality bond is achieved. | 04-21-2011 |
20110220617 | Anticorrosive flux - Aluminum parts, such as heat exchangers, with improved resistance towards corrosion caused by contact with stationary water or aqueous compositions can be obtained by addition of Li compounds to the flux used for brazing such parts. LiF and especially Li fluoroaluminates are very suitable. Another aspect of the invention concerns fluxes containing Li salts and their use for brazing of aluminum parts. | 09-15-2011 |
219850220 | Methods | 8 |
20090001055 | Method and apparatus for control of resistance brazing - An apparatus for control of resistance brazing is provided in a resistance brazing apparatus which grips parts of a weld object between which a brazing material is interposed between a pair of electrodes, applies pressure to the parts of the weld object, and feeds power to said electrodes in that state for resistance brazing, including a power feed time measurement unit measuring a power feed time to said electrodes required from when an amount of displacement of a distance between the pair of electrodes reaches a first amount of displacement to when it reaches a second amount of displacement and a control unit decreasing the amount of power feed to the pair of electrodes when the power feed time is a lower limit threshold value or less and increasing the amount of power feed to the electrodes when the power feed time is the upper limit threshold value or more. | 01-01-2009 |
20100059487 | METHOD FOR THE PRODUCTION OF A SCREEN, PARTICULARLY A RIGID SCREEN, FOR THE TREATMENT OF FIBROUS MATERIAL SUSPENSIONS SUITABLE FOR THE PRODUCTION OF PAPER - A method for the production of a screen, particularly a rigid screen, for the treatment of fibrous suspensions suitable for the production of paper, the method including the steps of: providing at least two screen layers; introducing a plurality of openings in the at least two screen layers, at least a portion of the openings being shaped and arranged such that the openings run through each of the at least two screen layers; and joining the at least two screen layers flat to one another thereby forming a flat joint, wherein the plurality of openings are introduced into the at least two screen layers before joining the at least two screen layers. | 03-11-2010 |
20100140227 | Brazing Method With Application of Brazing Flux On One Side Of A Section Of A Flat Tube For A Heat Exchanger - A process for brazing flat tubes ( | 06-10-2010 |
20120312789 | METHOD AND A DEVICE FOR BRAZING - A method for controlling a brazing process, including the steps of applying a welding current through an electrode ( | 12-13-2012 |
20130068731 | Reflow Apparatus, Reflow Method, And Package Apparatus - A reflow method of a solder ball provided to a treatment object may include providing a coil, applying a current to the coil, and moving the treatment object through an internal space surrounded by the coil. | 03-21-2013 |
20130087532 | SELF SECURING BRAZING PREFORM CLIP - An apparatus for and a method of brazing copper armature conductors to a commutator during the production of automotive starting motors. In the inventive method, two conductors of the armature are brazed together and are also brazed to the corresponding slot in a commutator in a single step. The process is aided by an inventive brazing clip which includes a cleat or inwardly bent tab that engages the conductor of an armature to hold it in place. | 04-11-2013 |
20130161296 | METHOD FOR ELECTRICALLY CONNECTING A PAIR OF CIRCUIT BOARDS USING A PAIR OF BOARD CONNECTORS AND AN INTERCONNECTOR - A system for electrically connecting circuit boards includes a pair of board connectors configured to be electrically connected to respective circuit boards. Each of the board connectors includes a plurality of electrical conductors and a housing configured to enclose at least a portion of the electrical conductors. An interconnector includes a plurality of electrical conductors, each of which is configured to be electrically connected to a respective electrical conductor of the board connectors, thereby electrically connecting the circuit boards. An interconnector housing is configured to cooperate with the housings of the board conductors to at least partially enclose the electrical connections between the electrical conductors of the interconnector and the board connectors. | 06-27-2013 |
20140097159 | SYSTEM AND METHOD FOR BRAZING TSP MATERIALS TO SUBSTRATES - Methods and systems of attaching a thermally stable polycrystalline diamond (TSP) material layer to a substrate. The methods include placing a braze material between the TSP material layer and the substrate, pressing at least one of the TSP material layer and substrate against the other of the TSP material layer and the substrate, heating the braze material to a temperature of at least 800° C., and cooling the braze forming a bond attaching the TSP material layer to the substrate. | 04-10-2014 |