Entries |
Document | Title | Date |
20080203064 | Bundle Drawn Metal Fiber with Three Layers - A bundle drawn metal fiber has a radial cross section comprising at least three concentric metal layers, being a core layer, a surface layer and at least one intermediate layer. The intermediate layer or layers envelop the core layer. The surface layer envelops the intermediate layer or layers. The surface layer provides the outer surface of the bundle drawn metal fiber A bundle drawn metal fiber is characterized in that its surface layer has an average thickness of less than 30% of the equivalent diameter of the metal fiber. The invention further relates to a method to provide such bundle drawn metal fibers. | 08-28-2008 |
20080272090 | Compact, Portable Resistance Heating Device - A compact, portable resistance heating device that takes a source of alternating current electricity and through a series of connections and circuitry splits the alternating current electricity into a plurality of circuits. The compact, portable resistance heating device is capable of heating a plurality of cartridge heaters at one time, individually or a combination thereof. The compact, portable resistance heating device is controlled by at least one controller that controls three (3) power output receptacles. The controller is capable of producing 0-100% output power to each respective cartridge heater. Each cartridge heater may be individually controlled by an on/off switch, and an indicator light may be provided and illuminate when each cartridge heater is energized. The cartridge heaters of the compact, portable resistance heating device do not require close tolerances with an axial bore of a stud or threaded bolt and are further capable of being bent to suit the particular operation. | 11-06-2008 |
20090218320 | Frit sealing using direct resistive heating - An frit-sealed device comprising a resistive heating element having an electrically-closed-loop structure and process for frit-sealing a device by using such heating element. The element can be advantageously made of a metal such as InvarĀ® and/or KovarĀ®. The invention enables hermetic frit sealing with low residual stress in the seal. The invention is particularly advantageous for hermetic sealing of OLED display devices. | 09-03-2009 |
20090218321 | Shape Memory Implant Heating Device | 09-03-2009 |
20120261386 | Non-Contact Rail Heater With Insulating Skirt - A track rail heating assembly that is adapted to position a heater element in spaced relation proximate to a surface of a track rail of a railroad. The assembly includes at least one heating element, and a housing that is operable to at least partially surround the heating element while positioning the heating element near to track rail. The hood positions the heating element relative to the rail section such that a gap exists between the heating element and the rail section. As the heating element does not contact the rail, the heating element cannot form an electrical by-pass for signals passing through the rail section. The assembly further incorporates a flexible barrier that at least partially isolates a side surface of the track rail from ambient conditions to reduce heat loss. | 10-18-2012 |
20120279944 | ANNEALING APPARATUS - Provided is an annealing apparatus, which is free from a problem of reduced light energy efficiency resulted by the reduction of light emission amount due to a heat generation and capable of maintaining stable performance. The apparatus includes: a processing chamber | 11-08-2012 |
20130213940 | ON-CHIP ALKALI DISPENSER - Embodiments described herein provide for an on-chip alkali dispenser. The on-chip alkali dispenser includes a monolithic semiconductor substrate defining a trench therein, and an evaporable metal material disposed in the trench. A heating element is disposed proximate the evaporable metal material and configured to provide heat to the evaporable metal material. A getter material is disposed to sorb unwanted materials released from the evaporable metal material. | 08-22-2013 |
20130233832 | IMPLEMENTING SELECTIVE REWORK FOR CHIP STACKS AND SILICON CARRIER ASSEMBLIES - A method, apparatus, and structure are provided for implementing selective rework for chip stacks. A backside metal layer to create resistive heating is added to a chip backside in a chip stack. A rework tool applies a predefined current to the backside metal layer to reflow solder connections and enables separating selected chips in the chip stack. | 09-12-2013 |
20130327743 | Heat Treatment of Helical Springs or Similarly Shaped Articles by Electric Resistance Heating - Apparatus is provided for metallurgical heat treatment of coil springs, or similarly shaped workpieces and articles of manufacture, by electric resistance heating along the entire length of the workpiece so that the ends of the workpiece can be heat treated to the same degree and quality as the section of the workpiece between its two ends. | 12-12-2013 |