Class / Patent application number | Description | Number of patent applications / Date published |
216095000 | Substrate is multilayered | 18 |
20090173718 | Method of damaged low-k dielectric film layer removal - An apparatus, system and method for removing a damaged material from a low-k dielectric film layer include identifying a control chemistry, the control chemistry configured to selectively remove the damaged material from the low-k dielectric film layer, the damaged material being in a region where a feature was formed through the low-k dielectric film layer; establishing a plurality of process parameters characterizing aspects of the damaged material to be removed and applying the control chemistry to the low-k dielectric film layer, the application of the control chemistry being defined based on the established process parameters of the damaged material, such that the damaged material is substantially removed from the areas around the feature and the areas around the feature are substantially defined by low-k characteristics of the low-k dielectric film layer. | 07-09-2009 |
20090302004 | METHOD FOR REMOVING THE COATING FROM A GAS TURBINE COMPONENT - A method for removing the coating from a gas turbine component, namely for the complete or partial removal of a multilayer wear protection coating from the surface of the gas turbine component, the wear protection coating having at least one relatively hard ceramic layer and at least one relatively soft metallic layer, wherein, in order to remove the multilayer wear protection coating, the gas turbine component is alternately positioned in two different chemical baths, a first bath being used exclusively for the removal of each relatively hard ceramic layer, and a second bath being used exclusively for the removal of each relatively soft metallic layer of the wear protection coating. | 12-10-2009 |
20100012623 | DELAMINATING SHAPED ARTICLE SUBSTRATES HAVING SILICONE COVERINGS ADHERED THERETO - Shaped article substrates, e.g., plastics, textiles, extrudates, films, etc., having silicone material coverings adhered thereto, are delaminated by treating same with an aqueous solution containing an alkali metal or alkaline earth metal hydroxide and a phase transfer catalyst; particular such shaped article substrates are airbag type of inflatable protection bags having layers of silicone elastomer adhered thereto and used for the protection of the occupants of a motor vehicle. | 01-21-2010 |
20100176090 | METHOD FOR THE PRODUCTION OF METAL-COATED BASE LAMINATES - The invention relates to a method for producing metal-coated base laminates having a support ( | 07-15-2010 |
20110017708 | METHOD OF REPRODUCING A MOLDING DIE FOR MOLDING GLASS - A method of reproducing the molding die for molding glass, the molding die for molding glass comprising a base material, a first intermediate layer, which is made of titanium or other materials that is not easy to be attacked, on the base material, a protective film, which is made of molybdenum alloy, on the first intermediate layer; the method comprising the steps of attacking the protective film to remove the protective film but keep the first intermediate layer and the base material still, and then coating a new protective layer on the first intermediate layer. | 01-27-2011 |
20120187087 | ETCHING SOLUTION COMPOSITION FOR METAL THIN FILM CONSISTING PRIMARILY OF COPPER - The problem of the present invention is to provide an etching solution composition that can etch with high accuracy a metal-laminated film pattern comprising thin films of copper and a copper alloy, can form an excellent pattern shape, and has practically excellent and stable characteristics with long solution life, and to provide an etching method using such etching solution composition. The present invention relates to an etching method for etching a metal-laminated film having a layer consisting of copper and a layer consisting of a copper alloy containing copper, using an etching solution composition comprising phosphoric acid, nitric acid, acetic acid and water, as well as to said etching solution composition. | 07-26-2012 |
20130001199 | PRODUCTION METHOD OF METALLIZED CERAMIC SUBSTRATE - The present invention provides a method of forming a fine pattern by the post-firing method. The production method of a metallized ceramic substrate comprises: a first step of forming an organic base layer on a ceramic substrate; a second step of forming a metal paste layer on the organic base layer to produce a metallized ceramic substrate precursor; and a third step of firing the metallized ceramic substrate precursor, wherein the organic base layer is a layer which absorbs a solvent in the metal paste layer and thermally decomposes at a temperature of firing the metal paste layer. | 01-03-2013 |
20130043214 | SACRIFICIAL ETCH PROTECTION LAYERS FOR REUSE OF WAFERS AFTER EPITAXIAL LIFT OFF - There is disclosed a growth structure comprising a growth substrate, a sacrificial layer, a buffer layer, at least three substrate protective layers, at least one epilayer, at least one contact, and a metal or alloy-coated host substrate. In one embodiment, the device further comprises at least three device structure protecting layers. The sacrificial layer may be positioned between the growth substrate and the at least one epilayer, wherein the at least three substrate protective layers are positioned between the growth substrate and the sacrificial layer, and the at least three device structure protecting layers are positioned between the sacrificial layer and the epilayer. There is also disclosed a method of preserving the integrity of a growth substrate by releasing the cell structure by etching the sacrificial layer and the protective layers. | 02-21-2013 |
20130082031 | Decapsulator with Applied Voltage for Etching Plastic-Encapsulated Devices - An apparatus and a method for selectively etching an encapsulant forming a package of resinous material around an electronic device includes an electronic device package mountable on the etch head; a conductive electrode in electrical contact with package leads of the electronic device package to apply a first voltage to the package leads of the electronic device; a first pump configured to pump a first quantity of the etchant solution from the source into the etch head where the etchant solution is electrically biased to a second voltage different from the first voltage. An etch cavity is formed on an exterior surface of the electronic device package. When the etchant solution has etched through an exterior surface of the electronic device package, the conductive bond wires of the electronic device is prevented from being etched by the applied first voltage. | 04-04-2013 |
20130134131 | PROCESS FOR MANUFACTURING AN INTEGRATED MEMBRANE OF NOZZLES IN MEMS TECHNOLOGY FOR A SPRAY DEVICE AND SPRAY DEVICE USING SUCH MEMBRANE - A process for manufacturing a membrane of nozzles of a spray device, comprising the steps of laying a substrate, forming a membrane layer on the substrate, forming a plurality of nozzles in the membrane layer, forming a plurality of supply channels in the substrate, each supply channel being substantially aligned in a vertical direction to a respective nozzle of the plurality of nozzles and in direct communication with the respective nozzle. | 05-30-2013 |
20130161287 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A preprocess step for supplying an inert gas into an enclosed space in which a substrate is disposed, while exhausting gas by sucking out of the enclosed space. And then, an etching step for supplying a process vapor into the enclosed space while exhausting gas out of the enclosed space at an rate lower than a rate in the preprocess step. And then a post-process step for supplying an inert gas into the enclosed space while exhausting gas by sucking out of the enclosed space at a rate higher than the rate in the etching step. | 06-27-2013 |
20130206727 | PATTERN-FORMING METHOD - A pattern-forming method includes forming a prepattern on a substrate. A space other than a space in which the prepattern is formed on the substrate is filled with a resin composition containing a compound which is diffusible into the prepattern. The compound is diffused into a part of the prepattern. Portions in which the compound is undiffused in the prepattern are removed using a removing liquid. | 08-15-2013 |
20150034597 | PROSTHESIS - A prosthesis comprising: an inner layer formed from a polyaryletherketone; a first outer layer adjacent to said inner layer formed from a porous polyaryletherketone, at least some of said pores having located therein material to promote osteointegration; and a second outer layer adjacent to said first outer layer formed from a porous polyaryletherketone, a portion of said pores being free of material to promote osteointegration. The invention also relates to a method of manufacture of the prosthesis. In an alternative arrangement, the prosthesis comprises: an inner layer formed from a polyaryletherketone; a first outer layer adjacent to said inner layer formed from a porous polyaryletherketone, at least some of said pores having located therein material to promote osteointegration having a crystallinity of from about 60% to about 90%; and a second outer layer adjacent to said first outer layer formed from a porous polyaryletherketone, at least a portion of said pores having located therein material to promote osteointegration having a crystallinity of less than about 50%. | 02-05-2015 |
20160024639 | Sapphire thin film coated flexible substrate - A method to transfer a layer of harder thin film substrate onto a softer, flexible substrate. In particular, the present invention provides a method to deposit a layer of sapphire thin film on to a softer and flexible substrate e.g. PET, polymers, plastics, paper and fabrics. This combination provides the hardness of sapphire thin film to softer flexible substrates. | 01-28-2016 |
20160060120 | METHOD OF PRODUCING REDUCED GRAPHENE OXIDE - A method of producing reduced graphene oxide includes the steps of selecting a substrate; forming a carbon layer on a top of the substrate through sputter deposition or vapor deposition; subjecting the substrate and the carbon layer to an oxidation process at the same time for the carbon layer to form a graphene oxide layer; and subjecting the substrate and the graphene oxide layer to a reduction process at the same time to form a reduced graphene oxide layer on the substrate. With the method, low-cost, high-quality and large-area reduced graphene oxide sheet can be directly produced on different types of substrate, including metal and non-metal substrates. | 03-03-2016 |
20160102403 | METALLIZATION INHIBITORS FOR PLASTISOL COATED PLATING TOOLS - The plastisol coated plating tools are used to secure polymer containing substrates in electroless plating baths during electroless plating of the polymers. To prevent metallization of the plastisol coated plating tools during electroless metallization, compositions of sulfur compounds are applied to the plastisol. After metallization the plastisol coated plating tools may be re-used without the need to strip the unwanted metal from the tools. | 04-14-2016 |
20160122580 | DEFECT REDUCTION METHODS AND COMPOSITION FOR VIA FORMATION IN DIRECTED SELF-ASSEMBLY PATTERNING - The present invention relates to a two novel processes, “Dual Coating Process and Single Coating Process,” for forming an array of via's by employing a graphoepitaxy approach, where an array of pillars the surface of the pillars has been modified by the formation of a hydrophobic poly(vinyl aryl) brush at the surface of the pillars. The present invention also relates to a composition comprising a poly(vinyl aryl) hydrophopic polymer brush precursor terminated at one chain end with a reactive functional group, a diblock copolymer comprising an etch resistant hydrophobic block and a highly etchable hydrophilic block, a thermal acid generator and a solvent. | 05-05-2016 |
20160195804 | METHODS OF FABRICATING PELLICLES USING SUPPORTING LAYER | 07-07-2016 |