Class / Patent application number | Description | Number of patent applications / Date published |
216094000 | Etching using radiation (e.g., laser, electron-beam, ion-beam, etc.) | 29 |
20080237189 | METHOD FOR LASER SCRIBING OF SOLAR PANELS - A method and device for ablation of thin layers on the rim region of the surface of a plane substrate coated with a thin film. The rim region runs along the edge or edges of the substrate, and the thin layers should be ablated in at least two, not necessarily unconnected areas of the rim region along edge pieces not parallel to one another. A laser beam is pointed toward an ablation area. The areas of the rim region to be ablated are guided through the area so that in a plane of the surface of the substrate, during the whole ablation process, there is basically a constant distance in the space that lies partly in the ablation area and has its starting point outside the substrate surface and its end point within the substrate surface. | 10-02-2008 |
20080277381 | Etching Solutions - The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant. | 11-13-2008 |
20080296263 | LASER SCRIBING AND MACHINING OF MATERIALS - Disclosed are systems and methods for directing laser energy to surfaces of materials via elements which have sharp points, and for reducing the adverse effects of particles which become dislodged by scribing and laser machining of materials. | 12-04-2008 |
20090071941 | Method for laser etching and/or laser embossing and powder coating a substrate - A method for finishing a substrate including transferring an image onto the substrate and powder coating the substrate. Embodiments provide methods for producing simulated wood grain finishes on engineered wood products such as medium density fiberboard. Logos, graphics, text, and the like may be embossed and/or etched onto the substrate using a laser. In alternative embodiments, the substrate may comprise a solid polymer. | 03-19-2009 |
20090084760 | METHOD FOR REMOVING MATERIAL FROM SOLIDS AND USE THEREOF - The invention relates to a method for material removal on solid bodies, in particular for microstructuring and cutting, by means of liquid jet-guided laser etching, the removed material just as the non-reacted etching components being recycled to a high degree. In this way, silicon with high purity can be recovered either in a polycrystalline manner or be deposited epitaxially on other substrates in the same process chain. | 04-02-2009 |
20090107956 | Thermal Gradient Control of High Aspect Ratio Etching and Deposition Processes - A technique is described whereby temperature gradients are created within a semiconductor wafer. Temperature sensitive etching and/or deposition processes are then employed. These temperature sensitive processes proceed at different rates in regions with different temperatures. To reduce pinch off in etching processes, a temperature sensitive etch process is selected and a temperature gradient is created between the surface and subsurface of a wafer such that the etching process proceeds more slowly at the surface than deeper in the wafer. This reduces “crusting” of solid reaction products at trench openings, thereby eliminating pinch off in many cases. Similar temperature-sensitive deposition processes can be employed to produce void-free high aspect ratio conductors and trench fills. | 04-30-2009 |
20090212020 | Method for Microstructuring Solid Surfaces - The invention relates to a method for microstructuring solid surfaces by chemical or electrochemical etching, in which the solid surface is treated with an etching fluid with formation of intermediate products which are insoluble or low-soluble in the etching fluid. By additional use of a particle stream, these intermediate products can be removed in a simple manner. Associated herewith is the advantage that low damage microstructuring of solid bodies is made possible. | 08-27-2009 |
20100072173 | SURFACE PROFILE ADJUSTMENT USING GAS CLUSTER ION BEAM PROCESSING - A method of treating a workpiece is described. The method comprises selectively forming a sacrificial material on one or more regions of a substrate or a layer on the substrate using a gas cluster ion beam (GCIB), and adjusting a surface profile of a surface on the substrate or the layer on the substrate by performing an etching process following the selective formation. | 03-25-2010 |
20100108641 | LAVACOAT PRE-CLEAN AND PRE-HEAT - Embodiments described herein provide methods of surface preparation using an electromagnetic beam prior to modification of the surface of a component which advantageously improve the quality of the final texture in those places and correspondingly reduces particle contamination. In one embodiment a method of providing a texture to a surface of a component for use in a semiconductor processing chamber is provided. The method comprises defining a plurality of regions on the surface of a component, moving an electromagnetic beam to a first region of the plurality of regions, scanning the electromagnetic beam across a surface of the first region to heat the surface of the first region, and scanning the electromagnetic beam across the heated surface of the first region to form a feature. | 05-06-2010 |
20100193472 | MULTIPLE NOZZLE GAS CLUSTER ION BEAM PROCESSING SYSTEM AND METHOD OF OPERATING - A gas cluster ion beam (GCIB) processing system using multiple nozzles for forming and emitting at least one GCIB and methods of operating thereof are described. The GCIB processing system may be configured to treat a substrate, including, but not limited to, doping, growing, depositing, etching, smoothing, amorphizing, or modifying a layer thereupon. Furthermore, the GCIB processing system may be operated to produce a first GCIB and a second GCIB, and to irradiate a substrate simultaneously and/or sequentially with the first GCIB and second GCIB. | 08-05-2010 |
20100213174 | Method for Manufacturing Glass Cliche Using Laser Etching and Apparatus For Laser Irradiation Therefor - A method for manufacturing a glass cliché using laser etching includes a dipping step for dipping a glass cliché, which will be etched, into an etching solution, a patterning step for irradiating laser to the glass cliché dipped in the etching solution to form a pattern therein, and a washing step for washing the patterned glass cliché. This method allows making a cliché with a high aspect ratio and fine line widths in comparison to a conventional cliché manufacturing method using photoresist for etching, and also ensures more efficient energy consumption and higher etching efficiency rather than an etching method using laser only. | 08-26-2010 |
20100276394 | MICROFEATURE WORKPIECE PROCESSING SYSTEM FOR, e.g., SEMICONDUCTOR WAFER ANALYSIS - The present disclosure suggests apparatus and methods that can be used to chemically process microfeature workpieces, e.g., semiconductor wafers. One implementation of the invention provides a method in which a surface of a microfeature workpiece is contacted with an etchant liquid. The wall of the processing chamber may be highly transmissive of an operative wavelength range of radiation, but the etchant liquid is absorptive of the operative wavelength range. The etchant liquid is heated by delivering radiation through the wall of a processing chamber. This permits processing chambers to be formed of materials (e.g., fluoropolymers) that cannot be used in conventional systems that must conduct heat through the wall of the processing chamber. | 11-04-2010 |
20110031218 | METHOD FOR MAKING THERMOACOUSTIC DEVICE - The present invention relates to a method for making a thermoacoustic device. The method includes the following steps. A substrate with a surface is provided. A plurality of microspaces is formed on the surface of the substrate. A sacrifice layer is fabricated to fill the microspaces. A metal film is deposited on the sacrifice layer, and the sacrifice layer is removed. A signal input device is provided to electrically connect with the metal film. | 02-10-2011 |
20110240602 | HIGH-VOLTAGE GAS CLUSTER ION BEAM (GCIB) PROCESSING SYSTEM - The invention includes a high-voltage gas cluster ion beam (GCIB) processing system for treating a workpiece using a gas cluster ion beam. The high-voltage GCIB processing system includes a high-voltage (HV) source system that includes a high-voltage (HV) source chamber having a high-voltage (HV) nozzle subassembly, a nozzle element, and a high-voltage (HV) skimmer subassembly therein. The high-voltage gas cluster ion beam (GCIB) processing system includes a high-voltage (HV) power supply coupled to the HV nozzle subassembly and the HV skimmer subassembly. A high-voltage (HV) ionization chamber can be coupled to the HV source chamber and can include an ionizer coupled to the chamber wall by an isolation structure. In addition, a grounded GCIB processing chamber can be coupled to the HV ionization chamber by an isolation structure and can include a scanable workpiece holder. | 10-06-2011 |
20120145673 | DIELECTRIC PLASMA CHAMBER APPARATUS AND METHOD WITH EXTERIOR ELECTRODES - A dielectric barrier discharge plasma generator includes a dielectric chamber. The chamber contains or incorporates a solid surface that is to be treated with non-thermal plasma. The chamber can be substantially sealed and confine an atmosphere therein. An atmosphere control system is provided for controlling the atmosphere within the chamber. At least one or two electrodes are located outside of the chamber. When actuated by an appropriate source of plasma generating electrical power the electrodes cause the generation of a solid surface modifying non-thermal plasma in a plasma zone within the chamber. A transport system is provided for moving the electrode and the chamber relative to one another. A plasma zone is confined within the chamber adjacent to the electrodes, and remains substantially stationary relative to the electrodes. The chamber carries the solid surface through the plasma zone. The solid surface remains substantially stationary relative to the chamber. | 06-14-2012 |
20120152902 | FORMING NANOMETER-SIZED PATTERNS BY ELECTRON MICROSCOPY - A method for forming nanometer-sized patterns and pores in a membrane is described. The method comprises incorporating a reactive material onto the membrane, the reactive material being a material capable of lowering an amount of energy required for forming a pore and/or pattern by irradiating the membrane material with an electron beam, thus leading to a faster pore and/or pattern formation. | 06-21-2012 |
20120285930 | PRINTING FORM AND PROCESS FOR PREPARING THE PRINTING FORM WITH CURABLE COMPOSITION HAVING EPOXY NOVOLAC RESIN - The invention pertains to a printing form and a process for preparing the printing form from a curable composition that includes an epoxy novolac resin having an epoxide equivalent weight of 156 to 300 g/equivalent, and an amine curing agent selected from primary amines and secondary amines, the agent having an amine equivalent weight of less than or equal to 60 g/equivalent. The process includes applying the curable composition to a supporting substrate to form a layer, curing the layer at one or more temperatures in a temperature range, and engraving to form at least one cell in the cured layer. The process prepares printing forms, particularly gravure printing forms, having a cured resin composition layer that is engravable, resistant to solvent inks and to mechanical wear, and capable of printing gravure-quality images. | 11-15-2012 |
20130126478 | Etching Solutions - The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant: | 05-23-2013 |
20130168356 | METHOD FOR PRODUCING SILICON FINE PARTICLES AND METHOD FOR CONTROLLING PARTICLE DIAMETER OF SILICON FINE PARTICLES - An object and project of the present invention is to provide a method for producing silicon fine particles and a method for controlling a particle diameter of silicon fine particles which enable efficient production of silicon fine particles having a uniform particle diameter. A the characteristics of the present invention is producing silicon fine particles having a smaller particle diameter than silicon particles and controlling a particle diameter of silicon fine particles by immersing the silicon particles into an etching solution and irradiating the silicon particles immersed in the etching solution with light having a larger energy than a band gap energy of the silicon particles | 07-04-2013 |
20140131315 | METHOD OF PROCESSING A MATERIAL-SPECIMEN - A method for generating a smooth surface in a material-specimen includes generating a substantially smooth, first surface region by removing a first material-volume by particle beam etching. The first material-volume is partially defined by the first surface region. An angle between a beam direction and a surface normal of the first surface region is greater than | 05-15-2014 |
20140151335 | Microfluidics Delivery Systems - Methods of dispensing a small amount of liquid onto a work piece includes in some embodiments known providing a microscopic channel for the liquid to flow from the nanodispenser. In some embodiments, dispensing the liquid includes dispensing the liquid using a nanodispenser have at least one slit extending to the tip. Some methods include controlling the rate of evaporation or the rate of liquid flow to establish an equilibrium producing a bubble of a desired size. | 06-05-2014 |
20140151336 | MANUFACTURING METHOD OF LIQUID DISCHARGING HEAD - A manufacturing method of a liquid discharging head includes: preparing a substrate having an energy-generating element and a resin layer on a first face side; irradiating a laser beam on the substrate so as to pass through the resin layer to form a hole serving as a liquid supply port in the substrate; removing a portion of the resin layer including a region which the laser beam has passed through, thereby forming a portion from which the resin layer has been removed as a channel, and forming a portion in which the resin layer remains as a side wall; and forming a discharge port forming member on a far side from the substrate of the side wall, and to form the channel forming member using the side wall and the discharge port forming member. | 06-05-2014 |
20140231390 | METHOD OF MANUFACTURING SUBSTRATE INCLUDING MICRO HOLE - A method of manufacturing a substrate including a micro hole, includes: setting a scanning rate (μm/sec) of pulsed laser light to 1×10 | 08-21-2014 |
20140332499 | ENDOLUMINAL IMPLANTABLE SURFACES, STENTS, AND GRAFTS AND METHOD OF MAKING THE SAME - A method of manufacturing an endoluminal implantable surface, stent, or graft includes the steps of providing an endoluminal implantable surface, stent, or graft having an inner wall surface, an outer wall surface, and a wall thickness and forming a pattern design into the endoluminal implantable surface, stent, or graft. At least one groove is created in the inner surface of the intravascular stent by applying a laser machining method to the inner surface. | 11-13-2014 |
20150108089 | METHOD FOR CUTTING SUBSTRATE - A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points. | 04-23-2015 |
20150328660 | PRETREATMENT METHOD AND SYSTEM FOR APPLICATION OF COATING TO SHOE PARTS - A pretreatment method for application of coating to shoe parts is capable of replacing the conventional primer coating process with the UV radiation process. The coating pretreatment to the shoe parts can be carried out continuously in an automatic manner. Besides, creating etching effect by using UV-C radiation and ozone activating improves the bonding of the shoe parts to the adhesives, without substantial increase in equipment cost. A pretreatment system for application of coating to shoe parts can be provided with more reaction chambers for UV-C radiation and cleaning, so as to increase the breadth of application of the UV radiation system. Subjecting the surface of the shoe parts to UV-C radiation and cleaning process more than one time can activate the surface, and improve the follow-up coating quality. | 11-19-2015 |
20150378261 | Methods and Apparatus for Nanofabrication Using a Pliable Membrane Mask - Apparatus for nanofabrication on an unconventional substrate including a patterned pliable membrane mechanically coupled to a membrane support structure, a substrate support structure to receive a substrate for processing, and an actuator to adjust the distance between the pliable membrane and the substrate. Nanofabrication on conventional and unconventional substrates can be achieved by transferring a pre-formed patterned pliable membrane onto the substrate using a transfer probe or non-stick sheet, followed by irradiating the substrate through the patterned pliable membrane so as to transfer the pattern on the pliable membrane into or out of the substrate. The apparatus and methods allow fabrication of diamond photonic crystals, fiber-integrated photonic devices and Nitrogen Vacancy (NV) centers in diamonds. | 12-31-2015 |
20160114617 | METHOD FOR CUTTING SUBSTRATE - A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points. | 04-28-2016 |
20160121028 | MANUFACTURING METHOD OF IRON-BASED ALLOY MEDICAL APPARATUS - Disclosed is a manufacturing method of an iron-based alloy medical apparatus, comprising: nitriding the iron-based alloy preformed unit at 350-550° C. for 30 100 minutes; and ion etching the iron-based alloy preformed unit with an ion etching time of 80-110% of the nitriding time, Ion nitriding and ion etching can be performed in situ in the same equipment using this manufacture method with high production efficiency, and in the ion nitriding and ion etching process, nitrogen atoms continuously permeate the preformed unit, making the time it takes for he medical apparatus to be absorbed by the human body and both the hardness and strength of the instrument surface achieve requirements. | 05-05-2016 |