Class / Patent application number | Description | Number of patent applications / Date published |
216055000 | HEATING OR BAKING OF SUBSTRATE PRIOR TO ETCHING TO CHANGE THE CHEMICAL PROPERTIES OF SUBSTRATE TOWARD THE ETCHANT | 14 |
20090039057 | Method of increasing etchability of metals having chemical etching resistant microstructure - A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements. | 02-12-2009 |
20120223053 | Thermal Anneal of Block Copolymer Films with Top Interface Constrained to Wet Both Blocks with Equal Preference - Methods for fabricating sublithographic, nanoscale microstructures utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. | 09-06-2012 |
20130008870 | METHOD FOR PROCESSING OUTER PERIPHERY OF SUBSTRATE AND APPARATUS THEREOF - To make an arrangement so as not to give any damage to the central part of a substrate during the operation for removing unnecessary film coated on the outer peripheral part of the substrate. The stage is provided therein with a refrigerant chamber | 01-10-2013 |
20130026134 | COPPER OXIDE ETCHANT AND ETCHING METHOD USING THE SAME - In order to provide a copper oxide etchant and an etching method using the same capable of selectively etching exposure/non-exposure portions when laser light exposure is performed by using copper oxide as a thermal-reactive resist material, the copper oxide etchant for selectively etching copper oxides having different oxidation numbers in a copper oxide-containing layer containing the copper oxide as a main component contains at least a chelating agent or salts thereof. | 01-31-2013 |
20130248488 | NOVEL DIBLOCK COPOLYMER, PREPARATION METHOD THEREOF, AND METHOD OF FORMING NANO PATTERN USING THE SAME - The present invention relates to a diblock copolymer that may facilitate formation of a finer nano pattern, and be used for manufacture of an electronic device including a nano pattern or a bio sensor, and the like, a method for preparing the same, and a method for forming a nano pattern using the same, | 09-26-2013 |
20130313227 | APPARATUS FOR REDUCING VOLUME OF RESIN CONTAINING RADIOACTIVE MATERIAL, AND METHOD FOR OPERATING THE APPARATUS - Provided is an ion exchange resin volume reduction apparatus in which the ignition of plasma is facilitated and the plasma is prevented from extinguishing. A volume reduction apparatus according to aspects of the present invention includes a stage carrying thereon a resin to be treated, a CCP power source, and an ICP power source. The volume reduction apparatus according to a certain aspect of the present invention is provided with a supply mechanism, and the CCP power source continues operating when the resin to be treated is supplied in a depressurized state to a vacuum vessel. In the volume reduction apparatus according to a certain aspect of the present invention, the CCP power source continues operating when a gas condition under which gas is supplied into the vacuum vessel is changed. | 11-28-2013 |
20140061155 | Composition and method for preparing pattern on a substrate - A copolymer composition and a method of processing a substrate to form line space features thereon are provided. | 03-06-2014 |
20140091058 | COPPER OXIDE ETCHANT AND ETCHING METHOD USING THE SAME - In order to provide a copper oxide etchant and an etching method using the same capable of selectively etching exposure/non-exposure portions when laser light exposure is performed by using copper oxide as a thermal-reactive resist material, the copper oxide etchant for selectively etching copper oxides having different oxidation numbers in a copper oxide-containing layer containing the copper oxide as a main component contains at least a chelating agent or salts thereof. | 04-03-2014 |
20140202987 | ETCHANT AND ETCHING METHOD USING THE SAME - To provide an etchant for copper oxide, control of the etching rate, and etching method using the same for enabling exposed portions to be selectively etched against unexposed portions in the case of performing exposure with laser light using an oxide of copper as a heat-reactive resist material, an etchant of the invention is an etchant for copper oxide to selectively remove a copper oxide of a particular valence from a copper oxide-containing layer containing copper oxides of different valences, and is characterized by containing at least an amino acid, a chelating agent and water, where a weight percentage of the amino acid is higher than that of the chelating agent, and pH thereof is 3.5 or more. | 07-24-2014 |
20140263177 | System and Method for Heating Plasma Exposed Surfaces - A substrate support apparatus for a plasma processing system includes a layer of dielectric material having a top surface and a bottom surface. The top surface is defined to support a substrate in exposure to a plasma. The substrate support apparatus also includes a number of optical fibers each having a first end and a second end. The first end of each optical fiber is defined to receive photons from a photon source. The second end of each optical fiber is oriented to project photons received from the photon source onto the bottom surface of the layer of dielectric material. | 09-18-2014 |
20150315348 | SUB-10-NANOMETER NANOSTRUCTURES ENGINEERED FROM GIANT SURFACTANTS - A process of forming a nanopatterned substrate is provided. The process comprising the steps of first preparing a giant surfactant comprising a cage-like molecular nanoparticle head linked to a polymer chain tail through a chemical linkage. Next, using the giant surfactant, a thin film is formed. Next the thin film formed from the giant surfactant is annealed such that the giant surfactant self-assembles into a desired nanostructure. The desired nanostructure is comprised of periodic major domains and minor domains. Finally, at least some of either the major domain or the minor domain is selectively removed to form the nanopatterned substrate. | 11-05-2015 |
20150329432 | Method for Preparing Polycrystalline Metal Oxide Pattern - Disclosed is a method for preparing a polycrystalline metal oxide pattern, characterized by comprising: annealing a predetermined region of an amorphous metal oxide film by laser, so as to convert the amorphous metal oxide in the predetermined region into a polycrystalline metal oxide; and etching the amorphous metal oxide outside of the predetermined region so as to remove it. By the method according to the present invention, firstly, the predetermined region of an amorphous metal oxide film is annealed by laser so as to convert the amorphous metal oxide into a polycrystalline metal oxide, and then, the amorphous metal oxide outside of the predetermined region is etched away, thereby a polycrystalline metal oxide pattern is formed. The method for preparing a polycrystalline metal oxide pattern according to the present invention is simple, and can effectively shorten the production period and save production costs. | 11-19-2015 |
20160052199 | SACRIFICIAL MATERIALS - Various embodiments disclosed relate to sacrificial materials and methods of using the same. Various embodiments provide objects having the sacrificial material at least partially removed therefrom, and methods of making the same. Various embodiments provide sacrificial adhesives, sacrificial mechanical connectors, and methods of using the same. The sacrificial material can include a polymer including a repeating unit including a substituted or unsubstituted (C | 02-25-2016 |
20180022634 | GLASS FOR LASER PROCESSING AND METHOD FOR PRODUCING PERFORATED GLASS USING SAME | 01-25-2018 |