Class / Patent application number | Description | Number of patent applications / Date published |
216042000 | Resist material applied in particulate form or spray | 6 |
20080245768 | Process - A process for etching a metal or alloy surface which comprises applying an etch-resist ink by ink jet printing to selected areas of the metal or alloy, solidifying the etch-resist ink without the use of actinic light and/or particle beam radiation and then removing the exposed metal or alloy by a chemical etching process wherein the etch-resist ink comprises the components:
| 10-09-2008 |
20090114618 | METHOD OF MAKING HIERARCHICAL ARTICLES - Provided is a method of making hierarchical structures that contain nanofeatures and microstructures. The method includes adding the nanofeatures to existing microstructures using nanoparticles as an etch mask. | 05-07-2009 |
20120234793 | Method and Device for Treating a Substrate Surface of a Substrate - In a method for the treatment of a substrate surface of a flat substrate with a process medium at the substrate underside, the process medium has a removing or etching effect on the substrate surface. The substrates are wetted with the process medium from below in a manner lying horizontally. The upwardly facing substrate top side is wetted or covered with water or a corresponding protective liquid over a large area or over the whole area as protection against the process medium acting on the substrate top side. | 09-20-2012 |
20130327742 | SCANNED SOURCE ORIENTED NANOFIBER FORMATION - Nanofibers are formed using electrospray deposition from microfluidic source. The source is brought close to a surface, and scanned in one embodiment to form oriented or patterned fibers. In one embodiment, the surface has features, such as trenches on a silicon wafer. In further embodiments, the surface is rotated to form patterned nanofibers, such as polymer nanofibers. The nanofibers may be used as a mask to create features, and as a sacrificial layer to create nanochannels. | 12-12-2013 |
20140166615 | MOLD STRUCTURE AND METHOD OF IMPRINT LITHOGRAPHY USING THE SAME - Mold structures for imprint lithography are provided. Mold chip patterns including patterns for nano structures are disposed on a mold substrate. A trench region is provided between the mold chip patterns. Protrusion portions protrude from a bottom surface of the trench region. The protrusion portions extend along the trench region in a plan view. | 06-19-2014 |
20140291287 | SELECTIVE ETCHING OF A MATRIX COMPRISING SILVER NANO WIRES - The present invention refers to a method for selectively structuring of a polymer matrix comprising AgNW (silver nano wires) or CNTs (carbon nano tubes) or comprising mixtures of AgNW and CNTs on a flexible plastic substructure or solid glass sheet. The method also includes a suitable etching composition, which allows to proceed the method in a mass production. | 10-02-2014 |