| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 216033000 | ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.) | 51 |
| 20100163524 | METHOD FOR MANUFACTURING SUSCEPTOR - A method for manufacturing a susceptor includes: forming a concave pattern in a surface of a substrate to be processed; applying a SiC paste containing a SiC powder and a sintering agent to the surface of the substrate to be processed to fill the concave pattern to form a SiC coating layer; laminating a SiC substrate on the SiC coating layer; and firing the SiC coating layer to form a SiC layer having at least one convex section on the surface of the SiC substrate. | 07-01-2010 |
| 20090212009 | Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed Layers That Are Partially Removed Via Planarization - Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of such structures which incorporate sheets of dielectric material and/or wherein seed layer material used to allow electrodeposition over dielectric material is removed via planarization operations; (2) the formation of such structures wherein masks used for at least some selective patterning operations are obtained through transfer plating of masking material to a surface of a substrate or previously formed layer, and/or (3) the formation of such structures wherein masks used for forming at least portions of some layers are patterned on the build surface directly from data representing the mask configuration, e.g. in some embodiments mask patterning is achieved by selectively dispensing material via a computer controlled inkjet nozzle or array or via a computer controlled extrusion device. | 08-27-2009 |
| 20110204022 | HARDWARE SYSTEM FOR HIGH PRESSURE ELECTROCHEMICAL CELL - A method of manufacture includes an electrochemical cell structure having a first conductive member and a second conductive member. The first conductive member is spaced from the second conductive member. An adhesive is disposed between the first conductive member and the second conductive member. The adhesive has a solid state and a liquid state. The adhesive is liquefied to form a seal between the first conductive member and the second conductive member. | 08-25-2011 |
| 20100140217 | METHOD FOR REPAIRING A DAMAGED AREA OF A COMPOSITE FIBRE COMPONENT WITH INTEGRATED FIBRE OPTICS, TOGETHER WITH A DEVICE - The invention relates to a method that is particularly suitable for the repair of damaged composite fibre components with integrated fibre optics on aircraft. The method involves:
| 06-10-2010 |
| 20090120903 | Method of multi-stage substrate etching and terahertz oscillator manufactured using the same method - A method of multi-stage substrate etching is provided. The method comprises the steps of: forming a first mask pattern on one surface of a first substrate; forming a hole by etching the first substrate using the first mask pattern as an etching mask; forming a second mask pattern on one surface of a second substrate; forming a hole by etching the second substrate to a predetermined depth using the second mask pattern as an etching mask; bonding the first and second substrates together such that an etched surface of the first substrate faces an etched surface of the second substrate; forming a third mask pattern on the second substrate; and forming a hole passing through the second substrate by etching the second substrate using the third mask pattern as an etching mask, whereby it is prevented the occurrence of a radius of curvature in the bottom surface and the overhang structure occurring on a step surface, so that etching quality is improved, a precise bonding between the substrates is obtained using the alignment key positioned on each substrate, and a multi-layer process is carried out. | 05-14-2009 |
| 20090152237 | Ceramic-Copper Foil Bonding Method - A ceramic-copper foil bonding method includes wet-oxidizing a copper foil such that a surface of the copper foil is oxidized to a copper oxide layer, contacting the copper oxide layer with a surface of a ceramic substrate, and bonding the copper oxide layer of the copper foil to the surface of the ceramic substrate by heat treatment. Preferably, a protective layer is provided on an opposite surface of the copper foil so that the opposite surface is not oxidized during wet-oxidizing the copper foil. | 06-18-2009 |
| 20080308525 | POTASSIUM NIOBATE DEPOSITED BODY AND METHOD FOR MANUFACTURING THE SAME, PIEZOELECTRIC THIN FILM RESONATOR, FREQUENCY FILTER, OSCILLATOR, ELECTRONIC CIRCUIT, AND ELECTRONIC APPARATUS - A method for manufacturing a potassium niobate deposited body includes: forming a buffer layer above a substrate composed of an R-plane sapphire substrate; forming above the buffer layer a potassium niobate layer or a potassium niobate solid solution layer that epitaxially grows in a (100) orientation in a pseudo cubic system expression; and forming an electrode layer above the potassium niobate layer or the potassium niobate solid solution layer, wherein a (100) plane of the potassium niobate layer or the potassium niobate solid solution layer is formed to tilt with a [11-20] direction vector as a rotation axis with respect to an R-plane (1-102) of the R-plane sapphire substrate. | 12-18-2008 |
| 20110049093 | Stacked crystal resonator and manufacturing method thereof - An object of the invention is to provide a method of manufacturing a stacked crystal resonator whereby a large number of stacked crystal resonators formed on a wafer can be easily broken away from the wafer, and the risk of damage to the outside surfaces and the like of the stacked crystal resonators is reduced. There is formed a framed crystal plate connected to a first wafer by a first support section, a cover connected to a second wafer by a second support section, and a base connected to a third wafer by a third support section, and a thickness of at least one of the first support section through third support section is thinner than a thickness the connected wafer. | 03-03-2011 |
| 20080308524 | Electrochemical Fabrication Methods With Enhanced Post Deposition Processing - An electrochemical fabrication process for producing three-dimensional structures from a plurality of adhered layers is provided where each layer comprises at least one structural material (e.g. nickel) and at least one sacrificial material (e.g. copper) that will be etched away from the structural material after the formation of all layers have been completed. A copper etchant containing chlorite (e.g. Enthone C-38) is combined with a corrosion inhibitor (e.g. sodium nitrate) to prevent pitting of the structural material during removal of the sacrificial material. A simple process for drying the etched structure without the drying process causing surfaces to stick together includes immersion of the structure in water after etching and then immersion in alcohol and then placing the structure in an oven for drying. | 12-18-2008 |
| 20120006783 | METHOD FOR PRODUCING A DEVICE WITH A FLUID-ENCAPSULATING MEMBRANE - The invention relates to a method for producing a device with a membrane used to encapsulate a fluid contained in a cavity, in which:
| 01-12-2012 |
| 20120111829 | METHOD FOR PRODUCTION OF A DEVICE WITH A GRAPHICAL ELEMENT - A method for producing a device, with a graphical element, including: a) producing a stack including at least one sacrificial layer positioned between a first substrate and a protective layer, and a graphical element produced in a first face of the protective layer opposite a second face of the protective layer, such that the second face is positioned against the sacrificial layer; b) attaching the stack to at least one second substrate such that the graphical element is positioned between the first substrate and the second substrate; and c) separating the sacrificial layer from the protective layer. | 05-10-2012 |
| 20120248062 | MICROCHIP FOR FORMING EMULSION AND METHOD FOR MANUFACTURING THE SAME - A microchip for forming an emulsion has a first glass substrate, a second glass substrate and a silicon substrate. The silicon substrate has formed therein a first fluid flow path through which a first fluid flows and a second fluid flow path through which a second fluid that is not mixed with the first fluid flows. The first fluid flow path has a plurality of branched flow paths that join at a joint portion. The second fluid flow path communicates with the joint portion. The silicon substrate has formed therein an emulsion formation flow path that faces an edge portion of the second fluid flow path at the joint portion. An emulsion composed of the first fluid and the second fluid that is surrounded by the first fluid is formed in the emulsion formation flow path. | 10-04-2012 |
| 20120074095 | METHOD OF EVALUATING CENTER SEGREGATION OF CONTINUOUS CAST SLAB - A method for evaluating center segregation of a continuous cast slab is provided. The method of the present invention includes (A) creating a center segregation image of a slab using an etching solution comprising a picric acid (C | 03-29-2012 |
| 20120298623 | METHOD FOR MAKING THERMOACOUSTIC ELEMENT - The present disclosure relates to a method for making a thermoacoustic element. In the method, a graphene film is arranged on a metal substrate. A nonmetal substrate is stacked with the graphene film located on the metal substrate to form a laminate structure. The graphene film is sandwiched between the nonmetal substrate and the metal substrate. The metal substrate is removed from the stacked structure. A number of through-holes are formed in the nonmetal substrate. The graphene film is exposed through the plurality of through-holes. | 11-29-2012 |
| 20110226732 | Reducing Adherence in a MEMS Device - In one embodiment, an apparatus for reducing adherence in a micro-electromechanical system (MEMS) device comprises a substrate. A MEMS is disposed outwardly from the substrate. The MEMS comprises structures and corresponding landing pads. Dibs are disposed outwardly from the substrate. Each dib has a surface with depressions. An adherence-reducing material is disposed within each depression. The adherence-reducing material reduces adherence between at least a portion of a structure and a corresponding landing pad. | 09-22-2011 |
| 20120325772 | INK-JET RECORDING HEAD, RECORDING ELEMENT SUBSTRATE, METHOD FOR MANUFACTURING INK-JET RECORDING HEAD, AND METHOD FOR MANUFACTURING RECORDING ELEMENT SUBSTRATE - An ink-jet recording head includes a plurality of recording element substrates each having an ejection pressure generating element configured to generate pressure for ejecting ink from an ink discharge port. The plurality of recording element substrates each include a first surface on which the corresponding ejection pressure generating element is disposed and a second surface, serving as an end surface intersecting with the first surface, being at least partially formed by etching. | 12-27-2012 |
| 216034000 | Etching improves or promotes adherence of preforms being bonded | 16 |
| 20120181250 | INFRARED LASER WELDING OF PLASTIC PARTS WITH ONE OR MORE OF THE PARTS HAVING A MODIFIED SURFACE PROVIDING INCREASED ABSORBTIVITY TO INFRARED LASER LIGHT - A method of using TTIr welding to weld together two high transmissivity plastic parts includes providing one or both parts with a modified surface that increases that plastic part's absorbtivity to laser light. The two parts are then laser welded by directing a beam of infrared laser light to the parts which are oriented so that the beam of infrared laser light first passes through one of the parts, impinges the modified surface (or surfaces) at a weld interface where the two plastic parts abut each other to melt the plastic parts at the weld interface, and then passes through the other plastic part. | 07-19-2012 |
| 20130048601 | Use of Hydrogen-Oxygen Plasma for Forming Hydroxyl Functional Groups on a Polymer Surface - A method for improving adhesion between polymeric materials is provided. The method includes treating a surface of a first polymeric material with plasma of oxygen gas and hydrogen-containing gas. The first polymeric material may be a fully cured polymeric material. A second polymeric material may then be deposited on the plasma treated surface of the first polymeric material. The second polymeric material may be an uncured polymeric material. This plasma treatment may be used in improving the adhesion between polymeric components of an inkjet printer. It provides good adhesion between the polymeric components of the inkjet printer even after long exposure to ink. | 02-28-2013 |
| 20130056443 | PLASMA TREATMENT IN FABRICATING DIRECTIONAL DRILLING ASSEMBLIES - Methods for improving adhesion or bonding between materials used in forming components of directional drilling assemblies, such as rotors and stators, are provided. A surface of a component may be treated, such as through cleaning, etching and/or activating a surface. The use of plasma treatment may enhance the adhesion between the surfaces and/or materials to be bonded, thereby reducing the degradation or mechanical failure of these materials in oilfield applications. | 03-07-2013 |
| 20100237043 | PLASMA DEPOSITION TO INCREASE ADHESION - Plasma etching of a polymeric dielectric material such as polyurethane results in volatile byproducts that are deposited onto the surface of an inert substrate. The surface treatment increases adhesiveness so that the surface of the inert material may be bonded to another material. Portions of a medical device comprising an inert substrate such as a fluoropolymer may therefore be securely affixed to other portions of the medical device formed of polymeric, metallic, or ceramic materials. | 09-23-2010 |
| 20120097638 | Method For Low Temperature Bonding And Bonded Structure - A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO | 04-26-2012 |
| 20090261064 | PROCESS FOR BONDING BY MOLECULAR ADHESION - The invention relates to a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s). | 10-22-2009 |
| 20120267339 | CERAMICS COMPOSITE MEMBER AND METHOD OF PRODUCING THE SAME - A ceramics composite member includes a structure in which a first ceramic member and a second ceramic member are integrated with a joint portion. The joint portion has a texture in which a silicon phase having an average diameter of 0.05 μm or more and 10 μm or less is continuously provided in a network form in interstices of silicon carbide particles having an average particle diameter of 0.1 μm or more and 0.1 mm or less. | 10-25-2012 |
| 20100264112 | METHOD FOR ISOLATING FLEXIBLE SUBSTRATE FROM SUPPORT SUBSTRATE - A method for isolating a flexible substrate from a support substrate and method for fabricating a flexible electronic device are provided. The method for isolating a flexible substrate from a support substrate includes providing a flexible substrate with a bottom surface. A surface treatment is subjected to the bottom surface of the flexible substrate, forming a bottom surface with detachment characteristics. The flexible substrate is fixed on the support substrate by means of an adhesive layer, wherein the bottom surface with detachment characteristics faces the support substrate. The flexible substrate is cut and isolated from the support substrate. | 10-21-2010 |
| 20110094992 | Method for Producing a Heat Exchanger - Method for manufacturing a heat exchanger, wherein two neighboring metal tubes ( | 04-28-2011 |
| 20120145667 | Process for Fabricating an Acoustic Wave Resonator Comprising a Suspended Membrane - A process for fabricating an acoustic wave resonator comprising a suspended membrane comprising a piezoelectric material layer, comprises the following steps: production of a first stack comprising at least one layer of first piezoelectric material on the surface of a first substrate; production of a second stack comprising at least one second substrate; production of at least one non-bonding initiating zone by deposition or creation of particles of controlled sizes leaving the surface of one of said stacks endowed locally with projecting nanostructures before a subsequent bonding step; direct bonding of said two stacks creating a blister between the stacks, due to the presence of the non-bonding initiating zone; and, thinning of the first stack to eliminate at least the first substrate. | 06-14-2012 |
| 20120111830 | Double-sided pressure-sensitive adhesive tapes for producing or sticking together LC displays with light-absorbing properties - The invention relates to a pressure-sensitive tape, particularly for producing or sticking together optical liquid crystal data displays (LCDs), comprising a top side and an underside. The pressure-sensitive adhesive tape also comprises a carrier film with a top side and an underside, and the pressure-sensitive adhesive tape is provided with a pressure-sensitive adhesive layer both on the top side as well as on the underside. The pressure-sensitive adhesive tape is characterized in that the carrier film has a content of antiblocking agents of less than 4000 ppm, and at least one light-absorbing chromophoric layer is provided between the carrier film and the pressure-sensitive adhesive layers. | 05-10-2012 |
| 20090289032 | METHOD AND KIT FOR SURFACE PREPARATION - A method includes contacting a treatment composition including a permanganic acid to a surface of a first substrate to form a treated substrate surface, wherein the first substrate comprises a polyarylenesulfide. The method further includes adhesively bonding the treated substrate surface to a second substrate surface. An associated kit is also provided | 11-26-2009 |
| 20120152893 | METHOD FOR SECURING A SHEATH TO A BLADE - A method for bonding a sheath made of a first metallic material to an airfoil made of a second metallic material includes treating the bonding surface of the airfoil; treating the bonding surface of the sheath; placing an adhesive between the bonding surfaces of the airfoil and the sheath; and pressing the airfoil and sheath together so that the adhesive bonds the sheath to the airfoil. | 06-21-2012 |
| 20120080403 | GLASS FILM LAMINATE, METHOD OF PRODUCING THE SAME, AND METHOD OF PRODUCING GLASS FILM - A glass film laminate comprises a glass film ( | 04-05-2012 |
| 20110266254 | Method of Manufacturing Textile Fabric Article - A method of manufacturing a textile fabric article comprises the steps of: (i) applying an uncured silicone elastomer ( | 11-03-2011 |
| 216035000 | Bonding of preform of metal or an alloy thereof to a preform of a nonmetal | 1 |
| 20120305524 | INSULATION STRUCTURE OF LNG CARRIER CARGO TANK AND METHOD FOR CONSTRUCTING THE SAME - An insulation structure of a cargo tank in an LNG carrier and a method of constructing the insulation structure include a first metal foil attached and installed in between the top insulation panel and the bottom insulation panel, a second metal foil attached to and installed on the first metal foil that is positioned on an upper side of a gap formed between the bottom insulation panels, and a top bridge panel attached to and installed on an upper side of the second metal foil. | 12-06-2012 |
| 216036000 | Removing at least one of the self-sustaining preforms or a portion thereof | 19 |
| 20110174772 | MICRO-FLUID EJECTION DEVICE AND METHOD FOR ASSEMBLING A MICRO-FLUID EJECTION DEVICE BY WAFER-TO-WAFER BONDING - A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of the first wafer, to a second silicon oxide layer of a second wafer, defining a nozzle plate on a second silicon substrate of the second wafer. Nozzle holes are formed in the nozzle plate in alignment with actuator elements of the actuator chip of the first wafer either before or after bonding the first and second wafers together. The second silicon substrate of the second wafer is used as a handle and then removed from the silicon oxide layer of the second wafer after bonding the first and second wafers together. | 07-21-2011 |
| 20100089868 | METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT HAVING A FILLER LAYER AND A MASKING LAYER - A method for producing a micromechanical component is proposed, a trench structure being substantially completely filled up by a first filler layer, and a first mask layer being applied on the first filler layer, on which in turn a second filler layer and a second mask layer are applied. A micromechanical component is also proposed, the first filler layer filling up the trench structure of the micromechanical component and at the same time forming a movable sensor structure. | 04-15-2010 |
| 20120223049 | THIN-SHEET GLASS SUBSTRATE LAMINATE AND METHOD OF MANUFACTURING THE SAME - There is provided a thin-sheet glass substrate laminate which is approximately 100% impermeable to gas or vapor and has a high transparency and a thin thickness, and a method of manufacturing the same. A support is temporarily attached to one surface of a glass substrate after forming a pattern P on the one surface, the glass substrate is thinned by etching another surface of the glass substrate, a film base is temporarily attached to the etched another surface, the temporarily attached support is peeled off from the one surface of the glass substrate, the one surface from which the support is peeled off is laminated to a surface of a cover glass, and the temporarily attached film base is peeled off from the another surface. | 09-06-2012 |
| 20110284498 | METHOD OF REDUCING RIGIDITY OF ANGIOPLASTY BALLOON SECTIONS - A dilatation balloon is fabricated according to a process that forms cavities and indentations in the balloon and/or catheter sections. A length of tubing is axially elongated and radially expanded in a form to provide the requisite biaxial orientation and strength. Then, an excimer laser or another type of laser or mechanical material removal tool is used to remove the polymeric material, virtually without thermal effects. Cavities in the sleeve sections of the balloon are defined and if desired, indentations in the cone sections are defined. Material removal, particularly near the balloon sleeves enables a thinner, more flexible bonding area between the catheter shaft and the balloon. Further, the indentations along the cone sections enables tighter wrapping of the balloon for a reduced delivery profile. Rigidity near the sleeves is reduced for better maneuverability of the catheter in tortuous passageways. | 11-24-2011 |
| 20090250430 | Methods for Fabrication of Three-Dimensional Structures - A multi-layer fabrication method for making three-dimensional structures is provided. In one embodiment, the formation of a multi-layer three-dimensional structure comprises: 1) fabricating a plurality of layers with each layer comprising at least two materials; 2) aligning the layers; 3) attaching the layers together to form a multi-layer structure; and 4) removing at least a portion of at least one of the materials from the multi-layer structure. Fabrication methods for making the required layers are also disclosed. In another embodiment, the formation of a multi-layer three-dimensional structure comprises: 1) attaching a layer of a material to a substrate or a previously formed layer; 2) machining the attached layer to form a layer that comprises at least two materials; and 3) repeating the operations of 1) and 2) a plurality of times to form a multi-layer structure; and 4) removing at least a portion of at least one of the materials from the multi-layer structure to form a desired three-dimensional structure. | 10-08-2009 |
| 20110108521 | Methods of manufacturing and transferring larger-sized graphene - Example embodiments relate to methods of manufacturing and transferring a larger-sized graphene layer. A method of transferring a larger-sized graphene layer may include forming a graphene layer, a protection layer, and an adhesive layer on a substrate and removing the substrate. The graphene layer may be disposed on a transferring substrate by sliding the graphene layer onto the transferring substrate. | 05-12-2011 |
| 20110253669 | METHOD FOR MAKING TRANSMISSION ELECTRON MICROSCOPE MICRO-GRID - A method for making a TEM micro-grid is provided. The method includes the following steps. A carrier, a carbon nanotube structure, and a protector are provided. The carrier defines a first through opening. The protector defines a second through opening. The protector, the carbon nanotube structure and the carrier are stacked such that the carbon nanotube structure is located between the carrier and the protector. The second through opening at least partly overlaps with the first through opening. | 10-20-2011 |
| 20110163067 | METHOD FOR MANUFACTURING FLEXIBLE DISPLAY DEVICE AND FLEXIBLE DISPLAY DEVICE - A flexible display device and a method for manufacturing a flexible display are provided. The flexible display device includes a flexible substrate, a display element layer formed on the flexible substrate; an insulating protective layer covering the display element layer; and a rigid substrate. The rigid substrate has an etching selectivity at least 20 times greater than that of the insulating protective layer. | 07-07-2011 |
| 20110163066 | Methods of manufacturing surface light source devices - Provided are methods of manufacturing a surface light source device, the methods include forming a first structure that includes a first substrate and a plurality of glass beads each partially embedded in the first substrate. A second structure is formed that includes a second substrate and an adhesive material layer formed on the second substrate. The first structure and the second structure are adhered to each other in such a way that the glass beads are each partially embedded into the adhesive material layer. | 07-07-2011 |
| 20110073562 | METHOD OF MANUFACTURE OF ATOMICALLY THIN BORON NITRIDE - The present invention provides a method of fabricating at least one single layer hexagonal boron nitride (h-BN). In an exemplary embodiment, the method includes (1) suspending at least one multilayer boron nitride across a gap of a support structure and (2) performing a reactive ion etch upon the multilayer boron nitride to produce the single layer hexagonal boron nitride suspended across the gap of the support structure. | 03-31-2011 |
| 20120248063 | FORMING A MEMBRANE HAVING CURVED FEATURES - Processes for making a membrane having a curved feature are disclosed. A profile-transferring substrate surface having a curved feature is created by vacuum bonding a membrane to a top surface of a substrate, where the top surface has a cavity formed therein. The surface of the membrane is exposed to a fluid pressure such that the membrane deforms and the undersurface of the membrane touches the bottom of the cavity. The curved feature formed in the deformed membrane can be made permanent by annealing the bonding areas between membrane and substrate. A uniform layer of material deposited over the exposed surface of the membrane will include a curved feature at the location where the membrane has bent into the cavity. After at least one layer of material has been uniformed deposited on the membrane, the cavity can be etched open from the bottom to remove the membrane from the underside. | 10-04-2012 |
| 20110315657 | METHOD AND APPARATUS FOR MANUFACTURING GRAPHENE TRANSFER FILM - A method and an apparatus for manufacturing a graphene transfer film are provided. The method of manufacturing the graphene transfer film includes: forming graphene on a graphene growth film comprising a carbonization catalyst; disposing a carrier film and the graphene growth film so that the carrier film and the graphene growth film, on which the graphene is formed, face each other; applying air pressure to at least one of the graphene growth film and the carrier film so that the graphene and the carrier film are attached to each other; and removing at least a part of the graphene growth film. | 12-29-2011 |
| 20120006784 | TRANSMISSION ELECTRON MICROSCOPE GRID AND METHOD FOR MAKING SAME - The present disclosure relates to a method for making a transmission electron microscope grid. The method includes: (a) providing a substrate with a graphene layer on a surface of the substrate; (b) applying a carbon nanotube film structure to cover the graphene layer; (c) removing the substrate, to obtain a graphene layer-carbon nanotube film composite structure; and (d) placing the graphene layer-carbon nanotube film composite structure on a grid. | 01-12-2012 |
| 20120152894 | MICRO-FLUID EJECTION DEVICE AND METHOD FOR ASSEMBLING A MICRO-FLUID EJECTION DEVICE BY A WAFER-TO-WAFER BONDING - A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of the first wafer, to a second silicon oxide layer of a second wafer, defining a nozzle plate on a second silicon substrate of the second wafer. Nozzle holes are formed in the nozzle plate in alignment with actuator elements of the actuator chip of the first wafer either before or after bonding the first and second wafers together. The second silicon substrate of the second wafer is used as a handle and then removed from the silicon oxide layer of the second wafer after bonding the first and second wafers together. | 06-21-2012 |
| 20120125888 | METHOD FOR PRODUCING A MEDICAL FUNCTIONAL ELEMENT COMPRISING A SELFSUPPORTING LATTICE STRUCTURE - A method for producing a medical functional element having a self-supporting lattice structure which has interconnected webs. The method applies a first layer to the substrate layer, the first layer is structured by an etching process, the structured first layer is under-cut of a wet chemical etching process acting on the substrate layer, the substrate layer is removed in order to form the self-supporting lattice structure, a web constructional layer is applied to the first layer. The method is distinguished by the forming the first web attachment layer which has a smaller layer thickness than the web constructional layer and is intimately bonded to the web constructional layer in such a way that the web attachment layer, together with the web constructional layer, forms the webs of the self-supporting lattice structure. | 05-24-2012 |
| 20110049094 | Method of manufacturing keycap structure, keypad structure, panel, and housing - A keycap structure is made by providing an elastomer laminate comprising an elastomer transparent layer and an elastomer colored layer, performing an etching process to locally remove the elastomer colored layer to form a pattern, bonding the elastomer laminate and a carrier to form a bonded structure, and combining the bonded structure and a keycap body. The keycap structure and the bonded structure may be utilized to make articles. The articles thereby have a leather-like soft touch and exquisite appearance. | 03-03-2011 |
| 20120273457 | THIN FILM PATTERNING METHOD - Provided is a thin film patterning method for patterning a thin film made of one of inorganic, organic, and organic/inorganic materials provided on a first substrate including: forming and patterning a thin film made of a material A on the first substrate; forming a thin film made of a material B, which is one of inorganic, organic, and organic/inorganic materials, on the first substrate and on the thin film; bonding the thin film, which is formed on the thin film, to a second substrate, thereby laminating the first substrate and the second substrate together to produce a laminated substrate; and removing the thin film and the thin film, which is provided on the thin film, from the first substrate. | 11-01-2012 |
| 20120285927 | METHOD OF FORMING MICROPATTERN, DIE FORMED BY THIS METHOD OF FORMING MICROPATTERN, TRANSFER METHOD AND MICROPATTERN FORMING METHOD USING THIS DIE - A micropattern is joined to a substrate (W | 11-15-2012 |
| 20120285928 | METHOD OF FORMING MICROPATTERN, DIE FORMED BY THIS METHOD OF FORMING MICROPATTERN, TRANSFER METHOD AND MICROPATTERN FORMING METHOD USING THIS DIE - A micropattern is joined to a substrate (W | 11-15-2012 |
