Class / Patent application number | Description | Number of patent applications / Date published |
216027000 | FORMING OR TREATING THERMAL INK JET ARTICLE (E.G., PRINT HEAD, LIQUID JET RECORDING HEAD, ETC.) | 70 |
20080197108 | Fluid Ejection Assembly - A fluid ejection assembly includes a first layer, and a second layer positioned on a side of the first layer. The second layer has a side adjacent the side of the first layer and includes barriers defining a fluid chamber on the side, a drop ejecting element formed within the fluid chamber, and a thermal conduction path extended between the fluid chamber and the barriers. | 08-21-2008 |
20080217290 | METHOD OF MANUFACTURING NOZZLE PLATE AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD - The method of manufacturing a nozzle plate includes: a lyophobic film forming step of preparing a nozzle plate having a recess-shaped counterbore section and a nozzle opened in a bottom surface of the counterbore section, and forming a lyophobic film on a surface of the nozzle plate including the bottom surface of the counterbore section of the nozzle plate and at least a portion of an inner wall of the nozzle; an abutting step of preparing a protective plate having a projecting section, and abutting a top surface of the projecting section of the protective plate against the bottom surface of the counterbore section of the nozzle plate in such a manner that the top surface of the projecting section of the protective plate makes tight contact with an opening edge of the nozzle on a liquid ejection side of the nozzle plate; a lyophobic film removing step of removing the lyophobic film from the inner wall of the nozzle of the nozzle plate by etching the nozzle plate from a liquid supply side which is opposite to a side of the nozzle plate that is abutted against the protective plate; and a separating step of separating the protective plate from the nozzle plate. | 09-11-2008 |
20080230513 | METHOD OF MANUFACTURING INK-JET PRINT HEAD - A method for manufacturing an ink-jet print head including: preparing a single crystal silicon wafer having a (110) crystal plane orientation, as a substrate; forming a heater to heat an ink, on a front surface of a silicon substrate; forming a trench inward of the heater; forming a flow channel layer defining an ink passage, on the front surface of the substrate; forming a nozzle layer having a nozzle on the flow channel layer; and forming an ink supply channel from a rear surface of the substrate to the trench by anisotropic wet etching. | 09-25-2008 |
20080245766 | METHOD FOR MANUFACTURING LIQID DISCHARGE HEAD - A method for manufacturing liquid discharge heads having a substrate where energy generation elements that generate energy used for discharging liquid are formed, a wiring electrically connected to the energy generation elements, and a flow path communicating with discharge ports for discharging liquid and corresponding to the energy generation elements. The method includes forming a resin layer on the substrate, a first pattern for forming the wiring on the resin layer, the wiring on the substrate using the first pattern, a second pattern for forming the flow path on the resin layer, a coating layer for coating the second pattern, and the flow path by removing the second pattern. | 10-09-2008 |
20080283494 | METHOD OF MANUFACTURING THERMAL INKJET PRINTHEAD - A method of manufacturing a thermal inkjet printhead. The method includes forming on a substrate a chamber layer having an ink chamber, forming a sacrificial layer on the chamber layer wherein the sacrificial layer fills the ink chamber, and planarizing a top surface of the sacrificial layer and of the chamber layer using a primary Chemical Mechanical Polishing (CMP) process until the sacrificial layer and the chamber layer attain a desired height, wherein a slurry is used in the primary CMP process that includes polishing particles having an average particle size of 500 nm˜2 μm. | 11-20-2008 |
20080283495 | MICRO ELECTRO MECHANICAL SYSTEM DEVICE AND METHOD OF MANUFACTURING THE SAME - A MEMS (Micro Electro Mechanical System) device and a method of manufacturing the same, in which an detection indicator is formed on a chamber layer stacked on a substrate such that a user easily inspects whether the chamber layer has a required thickness. The MEMS device can include two detection indicators that are formed on the chamber layer and have different depth from each other, or an detection indicator which is formed on the chamber layer and has a tapered sectional shape in which an upper surface of the detection indicator is gradually narrowed in a downward direction such that a user can easily inspect whether the chamber layer has a required thickness. The user can precisely determine whether the chamber layer is planarized to a required thickness by planarizing the detection indicator formed on the chamber layer, and inspecting the detection indicator by using an optical microscope, thereby facilitating inspection for a thickness of the chamber layer. | 11-20-2008 |
20090001048 | METHOD OF MANUFACTURING INKJET PRINTHEAD - A method of manufacturing an inkjet printhead includes forming a chamber layer, in which a plurality of ink chambers is formed, on a substrate, forming trench to define an island surrounded by the trench on an upper part of the substrate by etching an upper surface of the substrate to a predetermined depth, forming a sacrifice layer on the chamber layer to fill the trenches and the ink chambers, forming a nozzle layer, in which a plurality of nozzles are formed, on the sacrifice layer and the chamber layer, forming an ink feed hole by etching a lower part of the substrate until the sacrifice layer that is filled in the trench is exposed, and removing the sacrifice layer and the island. | 01-01-2009 |
20090014413 | SELF-ALIGNED PRECISION DATUMS FOR ARRAY DIE PLACEMENT - A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon. | 01-15-2009 |
20090020504 | Method for manufacturing ink-jet head - A method for manufacturing an ink-jet head is disclosed. The method for manufacturing an ink-jet head including a chamber containing an ink, a reservoir connected with the chamber and supplying the ink to the chamber, a restrictor connected with the chamber and the reservoir and controlling a flow of the ink, a nozzle connected with the chamber and jetting the ink, and a channel connecting the nozzle to the chamber, may include: forming the chamber, the reservoir, the restrictor and the channel by etching a portion of a substrate; covering the chamber; and bonding a nozzle plate, in which a nozzle is formed, to the substrate such that the channel is covered. Using this method, the various structures of the ink-jet head may be formed by etching a substrate, whereby the process may be simplified, and the yield and reliability of the products can be improved. | 01-22-2009 |
20090065472 | METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD SUBSTRATE - To provide a manufacturing method, for a liquid discharge head substrate that includes a silicon substrate in which a liquid supply port is formed, includes the steps of: preparing the silicon substrate, on one face of which a mask layer, in which an opening has been formed, is deposited; forming a first recessed portion in the silicon substrate, so that the recessed portion is extended through the opening from the one face of the silicon substrate to the other, reverse face of the silicon substrate; forming a second recessed portion by performing wet etching for the substrate, via the first recessed portion, using the mask layer; and performing dry etching for the silicon substrate in a direction from the second recessed portion to the other face. | 03-12-2009 |
20090065473 | MANUFACTURING METHOD FOR LIQUID DISCHARGE HEAD SUBSTRATE - To provide a manufacturing method, for a liquid discharge head that includes a silicon substrate in which a supply port is formed for supplying a liquid, includes the steps of: providing the silicon substrate, a mask layer provided with an opening that corresponds to the supply port being provided on one face of the silicon substrate; forming a groove in the silicon substrate along the shape of the opening in the mask layer; removing, using sandblasting, silicon of the silicon substrate from the inner wall of the groove in the silicon substrate; and performing, from the one face, anisotropic etching of the silicon substrate that has been sandblasted, and forming the supply port. | 03-12-2009 |
20090065474 | LIQUID-EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID-EJECTION HEAD SUBSTRATE - A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess. | 03-12-2009 |
20090065475 | METHOD OF FABRICATING INKJET PRINTHEAD WITH PROJECTIONS PATTERNED ACROSS NOZZLE PLATE - A method of fabricating an inkjet printhead. The method includes the steps of: (a) forming a plurality of MEMS ink ejection assemblies on an ink-ejection surface of a silicon substrate, each ink ejection assembly being sealed with roof material spanning across the ink ejection assemblies to define a nozzle plate; (b) etching partially into the roof material to form simultaneously a respective nozzle rim for each ink ejection assembly and a plurality of projections patterned across the nozzle plate between nozzle rims; and (c) etching through the roof material to form a respective nozzle aperture for each ink ejection assembly. The projections patterned across the nozzle plate between nozzle rims are useful for reducing stiction between particulates and the nozzle plate. | 03-12-2009 |
20090071936 | METHOD OF MANUFACTURING INKJET PRINTHEAD AND INKJET PRINTHEAD MANUFACTURED USING THE SAME - A method of manufacturing an inkjet printhead using a channel forming material, in which a glue layer to enhance an adhesive force between a substrate and a channel forming layer is not required. | 03-19-2009 |
20090071937 | METHOD FOR MANUFACTURING FLUID EJECTING HEAD AND METHOD FOR MANUFACTURING FLUID EJECTING APPARATUS - A method for manufacturing a fluid ejecting head that includes a nozzle formation process in which a nozzle is formed in a nozzle substrate. The nozzle has a first concave portion and a smaller, corresponding second concave portion. The fluid ejecting head is assembled by combining the nozzle substrate, a cavity substrate, and an electrode substrate. As part of the method of manufacturing, an oxide-film etching process is performed in such a manner that a sidewall portion of a concave formed in an oxide film on the surface of a nozzle substrate has an inclined portion that has an angle of inclination that is obtained through isotropic etching and further that the depth-directional distance of the inclined portion is set at a value that is larger than that of the depth-directional distance of the oxide film that is etched in a subsequent oxide-film etching process. | 03-19-2009 |
20090078674 | Reactive Ion Etching Process for Etching Metals - A method of etching a metal by a reactive ion etching process is provided. The etchant gas chemistry for the reactive ion etching process consists essentially of NH | 03-26-2009 |
20090078675 | METHOD OF REMOVING PHOTORESIST - A method of photoresist removal is provided. The method employs a plasma formed from a gas chemistry comprising NH | 03-26-2009 |
20090095708 | METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD - A method for manufacturing a liquid discharge head including a substrate on which supply ports for supplying a liquid are provided, includes forming a first supply port among the supply ports by performing crystal anisotropic etching on the substrate from one surface of the substrate, and forming a plurality of second supply ports among the supply ports by performing dry etching on the substrate using a crystal anisotropic etching method from a surface exposed toward the one surface of the substrate to a rear surface so that the independent second supply ports are respectively opened on the rear surface. | 04-16-2009 |
20090095709 | METHOD OF ETCHING INK SUPPLY CHANNEL WITH HYDROPHILIC SIDEWALLS - A method of etching an ink supply channel for an inkjet printhead. The method comprises simultaneous etching and passivation processes. A single etching and passivating gas plasma comprises: (a) a passivating gas comprising oxygen; (b) an inert sputtering gas; (c) a fluorinated etching gas; and (d) a hydrophilizing dopant. The resultant ink supply channel has relatively hydrophilic sidewalls. | 04-16-2009 |
20090120902 | Method Of Fabricating Filtered Printhead Ejection Nozzle - A method of fabricating a printhead ejection nozzle is provided which includes depositing sacrificial material on a planar substrate form a scaffold of the sacrificial material on the substrate, defining openings in the sacrificial material to the plane of the substrate at positions for sidewalls of a nozzle chamber and a filter structure for the nozzle chamber, depositing roof material over, and into the openings of, the sacrificial material so as to form the sidewalls of the nozzle chamber on the substrate, a roof of the nozzle chamber bridging the sidewalls, and the filter structure, etching the roof material to the sacrificial material to form a nozzle aperture through the roof of the nozzle chamber, and removing the sacrificial material. | 05-14-2009 |
20090127225 | MEASUREMENT OF ETCHING - Methods and apparatus for determining the extent of etching in material by locating a detector element adjacent to a portion of the material that is to be etched. The width of the element varies. The resistance of the element is measured upon etching the portion. | 05-21-2009 |
20090139961 | METAL FILM PROTECTION DURING PRINTHEAD FABRICATION WITH MINIMUM NUMBER OF MEMS PROCESSING STEPS - A method of fabricating a printhead having a hydrophobic ink ejection face, the method comprising the steps of: (a) providing a partially-fabricated printhead comprising a plurality of nozzle chambers and a nozzle plate having relatively hydrophilic nozzle surface, the nozzle surface at least partially defining the ink ejection face of the printhead; (b) depositing a hydrophobic polymeric layer onto the nozzle surface; (c) depositing a protective metal film onto at least the polymeric layer; (d) depositing a sacrificial material onto the polymeric layer; (e) patterning the sacrificial material to define a plurality of nozzle opening regions; (f) defining a plurality of nozzle openings through the metal film, the polymeric layer and the nozzle plate; (g) subjecting the printhead to an oxidizing plasma; and (h) removing the protective metal film, thereby providing a printhead having a relatively hydrophobic ink ejection face. | 06-04-2009 |
20090152236 | METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS - A method for manufacturing a liquid ejecting head includes performing a dry cleaning process of cleaning the surface of a wire side of a second substrate by dry etching of a plasma etching mode, and performing a liquid cleaning process of cleaning the surface of a pressure generation chamber side of a first substrate. | 06-18-2009 |
20090159564 | INK JET HEAD HAVING AN ELECTROSTATIC ACTUATOR AND MANUFACTURING METHOD OF THE SAME - An inkjet head having an electrostatic actuator and a manufacturing method of the same are disclosed. The inkjet head having an electrostatic actuator, comprising a stator, on which is formed a plurality of comb pattern shaped first protrusion parts and second protrusion parts in both directions, and a rotor consisting of a first component and a second component, the ends of which join with the diaphragm, wherein a third protrusion part is formed on the first component, facing the first protrusion parts and meshing with the first protrusion parts without contact; and a fourth protrusion part is formed on the second component, facing the second protrusion parts and meshing with the second protrusion parts without contact, may decrease the size of the head composition and may increase the electrostatic force so that a large displacement may be obtained with little voltage to increase the ink discharge pressure. | 06-25-2009 |
20090212008 | LIQUID EJECTION HEAD AND MANUFACTURING METHOD THEREOF - A liquid ejection head includes a substrate, having a front surface and a back surface, provided on the front surface with an energy generating element for generating energy used for ejecting liquid; a supply port, provided so as to penetrate between the front surface and the back surface of the substrate, for supplying the liquid to the energy generating element; a first film provided on the front surface of the substrate; and a second film provided so as to coat a wall of the substrate defining the supply port. The first film and the second film surface-contact each other with respect to two directions substantially perpendicular to each other. | 08-27-2009 |
20090230088 | FORMING A PRINT HEAD WITH A THIN MEMBRANE - A microfabricated device and method for forming a microfabricated device are described. A thin membrane including silicon is formed on a silicon body by bonding a silicon-on-insulator substrate to a silicon substrate. The handle and insulator layers of the silicon-on-insulator substrate are removed, leaving a thin membrane of silicon bonded to a silicon body such that no intervening layer of insulator material remains between the membrane and the body. A piezoelectric layer is bonded to the membrane. | 09-17-2009 |
20090301998 | METHOD OF FORMING NOZZLE HOLE AND METHOD OF MANUFACTURING INKJET RECORDING HEAD - A first substrate | 12-10-2009 |
20090301999 | Method Of Forming An Ink Supply Channel - A method of forming an ink supply channel for an inkjet printhead comprises the steps of: (i) providing a wafer having a frontside and a backside; (ii) etching a plurality of frontside trenches into the frontside; (iii) filling each of the trenches with a photoresist plug; (iv) forming nozzle structures on the frontside using MEMS fabrication processes; (v) etching a backside trench from the backside, the backside trench meeting with one or more of the plugs; (vi) removing a portion of each photoresist plug via the backside trench by subjecting the backside to a biased oxygen plasma etch, thereby exposing sidewall features in the backside trench; (vii) modifying the exposed sidewall features; and (viii) removing the photoresist plugs to form the ink supply channel. The ink supply channel connects the backside to the frontside. | 12-10-2009 |
20090314742 | METHOD FOR PROCESSING SUBSTRATE AND METHOD FOR PRODUCING LIQUID EJECTION HEAD AND SUBSTRATE FOR LIQUID EJECTION HEAD - A method for processing a substrate includes preparing a substrate having a first layer on a first surface side thereof, the first layer having a material capable of suppressing transmission of laser light, processing the substrate with laser light from a second surface that is opposite the first surface of the substrate toward the first surface of the substrate, and allowing the laser light to reach the first layer to form a hole in the substrate, and performing etching of the substrate from the second surface through the hole. | 12-24-2009 |
20100018948 | Manufacturing method of nozzle for inkjet head - A manufacturing method of a nozzle for an inkjet head. With the nozzle for an inkjet head, including a first board in which a nozzle hole is perforated, a middle layer stacked on the first board and perforated in an area corresponding to the nozzle hole, and a second board stacked on the middle layer and perforated in an area corresponding to the nozzle hole, where a hydrophobic layer is joined onto the inner perimeter of the nozzle hole and onto the first board around the nozzle hole, the uniformity and reproduction quality may be improved of nozzles treated for hydrophobicity, as the depth of the hydrophobic layer may be controlled to be uniform and the deposition of the hydrophobic layer may be prevented at the back surface of the nozzles. | 01-28-2010 |
20100018949 | PRINTHEAD AND METHOD OF FORMING SAME - A printhead and a method of manufacturing a printhead are provided. The printhead includes a polymeric substrate including a surface. Portions of the polymeric substrate define a liquid chamber. A material layer is disposed on the surface of the polymeric substrate. Portions of the material layer define a nozzle bore. The nozzle bore is in fluid communication with the liquid chamber. | 01-28-2010 |
20100032408 | INK-JET PRINTHEAD MANUFACTURING PROCESS - A process for manufacturing an inkjet print head comprising the steps of providing a print head wafer comprising a plurality of print head dice coated with a barrier layer, each print head die comprising a plurality of actuators and interconnections, the barrier layer comprising a plurality of openings in correspondence with the plurality of actuators and interconnections, providing a debondable SOI wafer comprising a handle layer, a buried layer, and a device layer, forming a protective layer on the surface of the device layer, bonding the device layer to the barrier layer, debonding the handle layer from the SOI wafer, etching the device layer so as to realize a plurality of openings in correspondence with the plurality of actuators and interconnections, and removing the protective layer in correspondence of the plurality of openings. | 02-11-2010 |
20100051580 | METHOD OF MANUFACTURING INKJET PRINTHEAD - A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole. | 03-04-2010 |
20100072171 | Method Of Fabricating A Printhead IC - Provided is a method of fabricating a printhead integrated circuit (IC). The method includes the step of depositing metal layers interspersed with interlayer dielectric (ILD) layers onto a silicon wafer substrate. A passivation layer is deposited onto an outermost metal layer and at least a portion of the passivation layer is masked with a photoresist. A pit is etched into the silicon wafer substrate, said pit having a base and sidewalls. Etching is carried out along an edge of the substrate to expose the last metal layer to define bonding pads for operatively connecting a microprocessor. A step of etching portions adjacent the pit to expose the outermost metal layer to define electrode portions. The electrode portions are for supporting a heater element to be suspended in the pit. | 03-25-2010 |
20100078407 | LIQUID DROP EJECTOR HAVING SELF-ALIGNED HOLE - A method for forming a self-aligned hole through a substrate to form a fluid feed passage is provided by initially forming an insulating layer on a first side of a substrate having two opposing sides; and forming a feature on the insulating layer. Next, etch an opening through the insulating layer, such that the opening is physically aligned with the feature on the insulating layer; and coat the feature with a layer of protective material. Patterning the layer of protective material will expose the opening through the insulating layer. Dry etching from the first side of the substrate forms a blind feed hole in the substrate corresponding to the location of the opening in the insulating layer, the blind feed hole including a bottom. Subsequently, grind a second side of the substrate and blanket etch it to form a hole through the entire substrate. | 04-01-2010 |
20100116783 | METHOD OF MANUFACTURING INK-JET HEAD - A method of manufacturing an ink-jet head is disclosed. The method in accordance with an embodiment of the present invention includes: forming a dividing groove such that one surface of a piezoelectric element is divided corresponding to the position of the chamber; filling the dividing groove with a filler; bonding one surface of the piezoelectric element to one surface of the ink-jet head in which the chamber is formed; and polishing the other surface of the piezoelectric element such that the filler is exposed. | 05-13-2010 |
20100140215 | Thermal head manufacturing method - To keep printing quality uniform and to improve productivity, while maintaining a heating efficiency and a strength against an external load, provided is a thermal head manufacturing method including: a concave portion forming step of forming a concave portion on one face of a supporting substrate; an upper substrate forming step of forming an upper substrate in which an etching layer and a non-etching layer are arranged in layers in a substrate thickness direction, the etching layer being etched at a predetermined etching rate, the non-etching layer being lower in etching rate than the etching layer; a bonding step of bonding the one face of the supporting substrate in which the concave portion has been formed in the concave portion forming step to a surface on a side of the non-etching layer of the upper substrate; a thinning step of etching the etching layer of the upper substrate which has been bonded to the supporting substrate in the bonding step; and a heating resistor forming step of forming a heating resistor across from the concave portion of the supporting substrate on the upper substrate which has been thinned in the thinning step. | 06-10-2010 |
20100140216 | Method Of Forming A Nozzle Chamber Incorporating An Ink Ejection Paddle And Nozzle Chamber Rim - A method of forming a nozzle chamber of a printhead includes steps of forming a first laminate of sacrificial layers on a substrate, the first laminate of sacrificial layers being formed as a ring on the substrate; photoimaging the first laminate of sacrificial layers to cause edges thereof to angle inwards, forming an approximate trapezoidal cross-section; depositing a TiN layer over the first laminate of sacrificial layer and the substrate, the TiN layer being inclined at portions deposited over the inwardly angled edges; etching the TiN layer to form a paddle and a nozzle chamber rim, the paddle incorporating an inner inclined portion and the nozzle chamber rim incorporating a complementary outer inclined portion, the paddle and nozzle rim defining an aperture therebetween; and removing the one or more sacrificial layers. | 06-10-2010 |
20100147793 | METHOD FOR PRODUCING LIQUID DISCHARGE HEAD - The present invention provides a method for producing a liquid discharge head including a silicon substrate having, on a first surface, energy generating elements, and a supply port penetrating the substrate from the first surface to a second surface, which is a rear surface of the first surface of the substrate. The method includes the steps of: preparing the silicon substrate having a sacrifice layer at a portion on the first surface where the ink supply port is to be formed and an etching mask layer having a plurality of openings on the second surface, the volume of a portion of the sacrifice layer at a position corresponding to a portion between two adjacent said openings being smaller than the volume of a portion of the sacrifice layer at a position corresponding to the opening; etching the silicon substrate from the plurality of openings and etching the sacrifice layer. | 06-17-2010 |
20100206840 | BONDING A MICRO-FLUID EJECTION HEAD TO A SUPPORT SUBSTRATE - A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is covalently bound to a substantially planar support material, and a method of making the same. | 08-19-2010 |
20100213165 | LOW EJECTION ENERGY MICRO-FLUID EJECTION HEADS - A micro-fluid ejection device structure and method therefor having improved low energy design. The devices include a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors. | 08-26-2010 |
20100252528 | LIQUID DROPLET EJECTION HEAD, APPARATUS FOR EJECTING LIQUID DROPLET, AND METHOD OF PRODUCING LIQUID DROPLET EJECTION HEAD - A liquid droplet ejection head includes: a nozzle plate that has a plurality of nozzles ejecting a liquid droplet; a flow path member that includes: pressure generating chambers that communicate with the nozzles; and liquid supply paths through which liquid is supplied to the pressure generating chambers; and a damper portion that is disposed in at least one part of a region, the region being on the nozzle plate, corresponding to the liquid supply paths, the damper portion reducing a fluctuation of an ejection amount of the liquid droplets to enable stable ejection. | 10-07-2010 |
20110024389 | METHOD OF ETCHING BACKSIDE INK SUPPLY CHANNELS FOR AN INKJET PRINTHEAD - A method of etching backside ink supply channels for an inkjet printhead. The method includes the steps of: (a) attaching a frontside of the printhead to a handle wafer; (b) etching the backside of the printhead using an anisotropic DRIE process to form a plurality of ink supply channels, the DRIE process including alternating etching and passivation steps, the passivation steps depositing a polymeric coating on sidewalls of the ink supply channels; and (c) removing the polymeric coating by etching the backside of the printhead in a biased plasma etching chamber using an O | 02-03-2011 |
20110031212 | Manufacturing method for a thermal head - Provided is a manufacturing method for a thermal head, including: bonding a flat upper substrate in a stacked state onto a flat supporting substrate including a heat-insulating concave portion open to one surface thereof so that the heat-insulating concave portion is closed (bonding step (SA | 02-10-2011 |
20110049091 | METHOD OF REMOVING PHOTORESIST AND ETCH-RESIDUES FROM VIAS - A method of photoresist removal with concomitant de-veiling is provided. The method employs a plasma formed from a gas chemistry comprising O | 03-03-2011 |
20110049092 | INKJET PRINTHEAD BRIDGE BEAM FABRICATION METHOD - A method of fabricating a bridge beam of an inkjet printhead employs a cavity formed under the bridge beam and an etch-stop layer that limits a back-surface recess formation. The method includes forming a cavity that connects between a bottom of a pair of trenches in and extending from a front surface of a substrate and depositing an etch-stop layer at a bottom of the cavity. The method further includes forming a recess in a back surface of the substrate, the recess exposing the etch-stop layer and the etch-stop layer limiting a depth of the formed recess. The method further includes removing the exposed etch-stop layer to connect the cavity and the recess, the bridge beam being a portion of the substrate above the formed cavity and between the trenches. | 03-03-2011 |
20120097637 | METHOD OF MANUFACTURING SUBSTRATE FOR LIQUID DISCHARGE HEAD - Provided is a method of manufacturing a substrate for a liquid discharge head including a first face, energy generating elements which generate the energy to be used to discharge a liquid to a second face opposite to the first face, and liquid supply ports for supplying the liquid to the energy generating elements. The method includes preparing a silicon substrate having, at the first face, an etching mask layer having an opening corresponding to a portion where the liquid supply ports are to be formed, and having first recesses provided within the opening, and second recesses provided in the region of the second face where the liquid supply ports are to be formed, the first recesses and the second recesses being separated from each other by a portion of the substrate; and etching the silicon substrate by crystal anisotropic etching from the opening of the first face to form the liquid supply ports. | 04-26-2012 |
20120111828 | METHOD FOR MANUFACTURING EJECTION ELEMENT SUBSTRATE - Provided is a method for manufacturing an ejection element substrate which is provided with a flow-channel-forming member having an ejection orifice for ejecting a liquid and a liquid flow channel that is communicated with the ejection orifice, and a substrate having a supply port for supplying the liquid to the liquid flow channel, and further a filter structure formed in the bottom of the supply port, including: forming the supply port by forming a through-hole by etching the substrate from a second face of the substrate on the side opposite to a first face of the substrate, on which the flow-channel-forming member is disposed; providing a resinous protection film on the side face and the bottom of the supply port; and forming a minute opening in the resinous protection film in the bottom of the supply port by carrying out a laser processing from the side of the second face. | 05-10-2012 |
20120199550 | METHOD OF PRODUCING LIQUID EJECTION HEAD - Provided is a method of producing a liquid ejection head substrate, the method including, in sequence; grinding a second surface of a silicon substrate, which is an opposite surface of a first surface on which a function element is formed, polishing the ground second surface, etching the polished second surface by reactive ion etching using ion incident energy, forming an etching mask on the second surface after the reactive ion etching, and forming a liquid supply port by subjecting the silicon substrate to wet etching using the etching mask. | 08-09-2012 |
20120298622 | ASSEMBLY TO SELECTIVELY ETCH AT INKJET PRINTHEAD - An assembly for selectively etching an inkjet printhead includes a substrate and printhead layers formed on the substrate. A bonding region can provide a location on the printhead layers for an electrical bond. An ink channeling region can be defined at least in part by the printhead layers. A mask layer can partially cover the printhead layers and include a first opening positioned over the bonding region and a second opening positioned over the ink channeling region. The assembly can also include a via at the first opening and a trench at the second opening having greater depth than the via. | 11-29-2012 |
20130082028 | FORMING A PLANAR FILM OVER MICROFLUIDIC DEVICE OPENINGS - A method of fabricating a microfluidic device, the method includes etching a plurality of frame-shaped grooves into a first side of a substrate, each frame-shaped groove surrounding a non-etched portion of the substrate; dispensing a sacrificial photoresist on the first side of the substrate; spinning the wafer to obtain a substantially planar surface of the sacrificial photoresist; patterning the sacrificial photoresist to form openings defining walls for a plurality of chambers and fluid passageways; laminating a polymer film over the patterned sacrificial photoresist; etching a portion of the substrate from a second side of the substrate until the etched portion meets the frame-shaped grooves; removing the sacrificial resist to provide a plurality of chambers, each chamber being adjacent to at least one of the plurality of walls; and removing the non-etched portions of the substrate surrounded by the frame-shaped grooves to form a plurality of feed holes. | 04-04-2013 |
20130161286 | PROCESSING METHOD FOR AN INK JET HEAD SUBSTRATE - Provided is a processing method for an ink jet head substrate, including: forming a barrier layer on a substrate and forming a seed layer on the barrier layer; forming a resist film on the seed layer and patterning the resist film so that the patterned resist film corresponds to a pad portion for electrically connecting an ink jet head to an outside of the ink jet head; forming the pad portion in an opening of the patterned resist film; removing the resist film; subjecting the substrate to anisotropic etching to form an ink supply port; removing the barrier layer and the seed layer; and performing laser processing from a surface of the substrate. | 06-27-2013 |
20130206723 | METHOD OF MANUFACTURING LIQUID EJECTION HEAD AND METHOD OF PROCESSING SUBSTRATE - A liquid ejection head includes a substrate having an ejection energy generating element formed at a first surface side thereof, a common liquid chamber formed at a second surface of the substrate, and a liquid supply port extending from the bottom of the common liquid chamber to the first surface. The liquid ejection head is manufactured by preparing a substrate having the common liquid chamber formed at the second surface side, then arranging a material to be filled in the common liquid chamber, subsequently forming an aperture in the filled material as corresponding to the liquid supply port to be formed, and thereafter forming the liquid supply port by reactive ion etching, using at least the filled material as a mask. | 08-15-2013 |
20130256260 | METHOD OF FORMING SUBSTRATE FOR FLUID EJECTION DEVICE - A method of forming a substrate for a fluid ejection device includes forming an opening in the substrate from a second side of the substrate toward a first side of the substrate, further forming the opening in the substrate to the first side of the substrate, anisotropically wet etching the substrate, including increasing the opening at the second side of the substrate and forming the opening with converging sidewalls from the second side to the first side, and after anisotropically wet etching the substrate, isotropically etching the substrate. | 10-03-2013 |
20130284694 | EJECTION DEVICES FOR INKJET PRINTERS AND METHOD FOR FABRICATING EJECTION DEVICES - Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device. | 10-31-2013 |
20130341302 | METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD - A method for manufacturing a liquid discharge head includes a step of preparing a first substrate having an energy generating element at a front surface side thereof; a step of forming a wall member, which is to become a wall for a liquid flow passage, at the front surface side of the first substrate; a step of forming a mask having an opening on the wall member and forming a second substrate, which is composed of silicon and is to become an orifice plate, on the mask; and a step of forming a liquid supply port in the first substrate and a liquid discharge port in the second substrate by supplying an etchant from a back surface side of the first substrate, the back surface being a surface opposite the front surface. | 12-26-2013 |
20140008322 | DRY ETCHING METHOD - According to one aspect of the present invention, there is provided a dry etching method which carries out patterning of a resin film provided on a substrate, by reactive ion etching using a resist mask, wherein a gas mixture containing CF | 01-09-2014 |
20140034604 | PROCESSES FOR PRODUCING SUBSTRATE WITH PIERCING APERTURE, SUBSTRATE FOR LIQUID EJECTION HEAD AND LIQUID EJECTION HEAD - The invention provides a process for producing a substrate with a piercing aperture, the piercing aperture being formed by conducting dry etching from the side of a second surface opposite to a first surface of a substrate to the first surface, the process comprising, in the following order, the steps of (a) forming a groove around a region where the piercing aperture is formed in the first surface of the substrate, (b) forming an etch-stop layer in the region where the piercing aperture is formed in the first surface of the substrate and in the interior of the groove, and (c) forming the piercing aperture by conducting the dry etching from the side of the second surface. | 02-06-2014 |
20140061152 | METHOD FOR MANUFACTURING LIQUID EJECTION HEAD - A method for manufacturing a liquid ejection head includes the steps of: disposing an etching mask layer on a substrate having a first face and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the support port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting a device chip for liquid ejection; and connecting the selected device chip to a liquid supply part. | 03-06-2014 |
20140138349 | METHOD FOR RENEWING ORGANIC SOLVENT, METHOD FOR USING ORGANIC SOLVENT, AND METHOD FOR PRODUCING INKJET RECORDING HEAD - A method for renewing an organic solvent includes an ultraviolet irradiation step in which an organic solvent containing a resin is irradiated with ultraviolet rays so as to enhance the ability of the organic solvent to dissolve the resin. A method for using an organic solvent and a method for producing an inkjet recording head utilize the method for renewing an organic solvent. | 05-22-2014 |
20140284305 | MANUFACTURING METHOD OF LIQUID EJECTING HEAD - A piezoelectric actuator which is provided on the flow path formation substrate, and a protection substrate which is bonded to the flow path formation substrate on the piezoelectric actuator side, the method including: bonding the flow path formation substrate on which the piezoelectric actuator is formed, and the protection substrate to form a bonded body; bonding a sealing member to the protection substrate of the bonded body on the surface side opposite the flow path formation substrate, and disposing a protection material containing a nitro compound in a space between the sealing member and the protection substrate. | 09-25-2014 |
20140291285 | MANUFACTURING METHOD OF LIQUID EJECTING HEAD - Provided is a manufacturing method of a liquid ejecting head having a flow-path forming substrate in which a liquid flow path is provided to communicate with a nozzle opening through which liquid is discharged. The method includes performing wet etching on both surfaces of the flow-path forming substrate and forming the liquid flow path by removing a burr that is formed when the wet etching is performed on the flow-path forming substrate. | 10-02-2014 |
20150060397 | METHOD OF MANUFACTURING AN EJECTION ORIFICE MEMBER - A method of manufacturing an ejection orifice member includes: preparing a substrate including a first layer, a second layer, and a third layer, the first layer protruding in a first direction crossing a principal surface of the substrate, the second and third layers being formed on the first direction side of the first layer, the preparing a substrate including forming the second layer to follow a contour of a first direction side surface of the first layer, and then forming the third layer on a surface of the second layer which protrudes on the first direction side; performing plating using the second layer as a seed to form a fourth layer on the first direction side of the second layer; removing the third layer from the fourth layer to form a hole as the ejection orifice in the fourth layer; and thinning the fourth layer at least around the hole. | 03-05-2015 |
20150060398 | PROCESS FOR PRODUCING A LIQUID EJECTION HEAD - A process for producing a liquid ejection head including a silicon substrate having a supply port to supply a liquid to a flow path, and an ejection-orifice-forming member forming the flow path between the ejection-orifice-forming member and the silicon substrate and having an ejection orifice to eject the liquid in the flow path. The process includes forming an etching protection film so as to cover the ejection-orifice-forming member; forming the supply port passing through the silicon substrate by anisotropic etching using an alkaline aqueous solution; and removing the etching protection film. The etching protection film includes an organic polymer material having a storage modulus at 80° C. of 1.0×10 | 03-05-2015 |
20150114927 | FORMING MEMRISTORS ON IMAGING DEVICES - Forming memristors on imaging devices can include forming a printhead body comprising a first conductive material, forming a memory on the printhead body by performing an oxidation process to form a switching oxide material on the first conductive material, and forming a second conductive material on the switching oxide material. | 04-30-2015 |
20150129542 | METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD - There is provided a method for manufacturing a liquid discharge head including a substrate in which a liquid supply port is formed, a channel forming member that forms a liquid channel communicating with the liquid supply port on the substrate. The method includes preparing a substrate on which a hole serving as the liquid supply port is open, attaching a dry film on the substrate to cover an opening of the hole with the dry film, curing a cover part of the dry film that covers the hole, patterning the dry film to form a mold for the liquid channel, of a region of the dry film that includes the cover part, forming the channel forming member such that it covers the mold, and removing the mold to form the liquid channel. | 05-14-2015 |
20150290939 | METHOD FOR MANUFACTURING LIQUID EJECTION HEAD - A method for manufacturing a liquid ejection head having a substrate, heat generating elements formed at the front surface side of the substrate, and a nozzle layer forming liquid chambers and liquid ejection ports at the front surface side of the substrate, and the method includes a process of preparing a substrate having heat generating elements and a nozzle layer formation material layer at the front surface side, a process of driving the heat generating elements for heating to form air bubbles serving as the liquid chambers in the nozzle layer formation material layer, and a process of forming liquid ejection ports which communicate with the liquid chambers in the nozzle layer formation material layer, and then forming a nozzle layer forming the liquid chambers and the liquid ejection ports at the front surface side of the substrate. | 10-15-2015 |
20150343783 | METHOD OF MANUFACTURING AN INKJET HEAD - A method of manufacturing an inkjet head includes: forming an annular groove on a first surface of a substrate made of a first material; forming a side wall by filling a second material in the annular groove and forming a nozzle plate by forming a thin film made of the second material on the first surface of the substrate; forming a ring-shaped piezoelectric element on the nozzle plate surrounded by the side wall, the piezoelectric element comprising a lower electrode, a piezoelectric film, and an upper electrode; forming a ink chamber disposed over an area of a lower surface of the nozzle plate that is surrounded by the side wall from a second surface opposite the first surface of the substrate, the ink chamber being formed by a single dry etching process; and forming a nozzle to the nozzle plate positioned inside of the annular piezoelectric element. | 12-03-2015 |
20160152029 | INK-JET RECORDING HEAD, RECORDING ELEMENT SUBSTRATE, METHOD FOR MANUFACTURING INK-JET RECORDING HEAD, AND METHOD FOR MANUFACTURING RECORDING ELEMENT SUBSTRATE | 06-02-2016 |
20170232745 | METHOD FOR MANUFACTURING LIQUID EJECTION HEAD | 08-17-2017 |