Class / Patent application number | Description | Number of patent applications / Date published |
216016000 | Forming or treating resistive material | 6 |
20090159558 | Method of Manufacturing an Integrated Circuit - A method of manufacturing an integrated circuit including a memory device that includes the following processes: forming a mask layer structure above a composite structure including a resistivity changing layer and an electrode layer disposed above the resistivity changing layer; partially patterning the mask layer structure using a first substance; stopping patterning the mask layer structure before exposing the top surface of the electrode layer; at least partially exposing the top surface of the electrode layer using a second substance, the second substance chemically not reacting with the electrode layer material. | 06-25-2009 |
20120125881 | METHOD OF MANUFACTURING A COORDINATE DETECTOR - A method of manufacturing a coordinate detector having a resistive film and a common electrode for applying a voltage to the resistive film is disclosed that includes the steps of (a) applying a photoresist onto the resistive film formed on a substrate formed of an insulator; (b) forming a resist pattern on the resistive film by exposing the applied photoresist to light through a predetermined mask and subsequently developing the applied photoresist; (c) forming a resistive film removal region by removing a portion of the resistive film without the resist pattern; (d) removing the resist pattern after step (c); and (e) forming the common electrode over the resistive film removal region after step (d). | 05-24-2012 |
20130001187 | METHOD FOR MANUFACTURING A MAGNETORESISTIVE SENSOR USING SIMULTANEOUSLY FORMED HARD BIAS AND ELECTRICAL LAPPING GUIDE - A method for manufacturing a magnetic sensor using an electrical lapping guide deposited and patterned simultaneously with a hard bias structure of the sensor material. The method includes depositing a sensor material, and patterning and ion milling the sensor material to define a track width of the sensor. A magnetic, hard bias material is then deposited and a second patterning and ion milling process is performed to simultaneously define the back edge of an electrical lapping guide and a back edge of the sensor. | 01-03-2013 |
20130032568 | ELECTRICAL DEVICE WITH TEETH JOINING LAYERS AND METHOD FOR MAKING THE SAME - A process of making an article of manufacture, the process including constructing an electrical device which implements circuitry having a portion in cavities, the portion defined by an epoxy dielectric material delivered with solid content sufficient that etching the epoxy forms cavities located in, and underneath an initial surface of, the dielectric material, sufficient that the etching of the epoxy uses non-homogeneity with the solid content in bringing about formation of the cavities and sufficient that the etching of the epoxy is such that a plurality of the cavities have a cross-sectional width that is greater than a maximum depth with respect to the initial surface, wherein the etching forms the cavities, and a conductive material, a portion of the conductive material in the cavities thereby forming teeth in the cavities, such that the conductive material forms the portion of the circuitry of the electrical device. | 02-07-2013 |
20140291283 | METHOD FOR MAKING A CURRENT-PERPENDICULAR-TO-THE-PLANE (CPP) MAGNETORESISTIVE (MR) SENSOR WITH REDUCED-WIDTH SELF-ALIGNED TOP ELECTRODE - A method for making a current-perpendicular-to-the-plane magnetoresistive sensor structure produces a top electrode that is “self-aligned” on the top of the sensor and with a width less than the sensor trackwidth. A pair of walls of ion-milling resistant material are fabricated to a predetermined height above the biasing layers at the sensor side edges. A layer of electrode material is then deposited onto the top of the sensor between the two walls. The walls serve as a mask during angled ion milling to remove outer portions of the electrode layer. The height of the walls and the angle of ion milling determines the width of the resulting top electrode. This leaves the reduced-width top electrode located on the sensor. Because of the directional ion milling using walls that are aligned with the sensor side edges, the reduced-width top electrode is self-aligned in the center of the sensor. | 10-02-2014 |
20150371873 | PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a packaging substrate includes: patterning a first photo-resisting layer having first openings on a copper foil layer to expose portions of the copper foil layer; patterning a removable second photo-resisting layer having second openings on the first photo-resisting layer to expose the first openings; filling copper into the first and second openings to form base portions and a first wiring layer; orderly forming a first dielectric layer and a second wiring layer on the first wiring layer; patterning a removable third photo-resisting layer comprising covering portions opposite to the base portions on the copper foil layer; and etching the copper foil layer to form protruding portions connected to and corresponding to the base portions to define a copper pillar bump, a size of the copper pillar bump gradually increasing from the protruding portions to the base portions. | 12-24-2015 |