Class / Patent application number | Description | Number of patent applications / Date published |
205686000 | Moving tool electrode | 14 |
20090038960 | APPARATUS AND METHOD OF ELECTROLYTIC REMOVAL OF METALS FROM A WAFER SURFACE - An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and anodes provided with a power source. The conductive pad is structured and configured to contact all metal islands on a surface of the wafer. Gaps are provided between pairs of the plurality of alternating cathodes and anodes. | 02-12-2009 |
20100000877 | Method for electrochemical mechanical polishing - The present invention provides a method of electrochemical polishing of a workpiece using a polishing pad having a cellular polymeric layer overlying a conductive substrate, the cellular polymeric layer having a thickness less than 1.5 mm; wherein the cellular polymeric layer comprises a plurality of pores that extend through the thickness of the cellular polymeric layer from a polishing surface of the cellular polymeric layer to the conductive substrate; and wherein the plurality of pores exhibit a diameter that is smaller at the polishing surface than at the conductive substrate. | 01-07-2010 |
20100038259 | METHOD FOR MACHINING A COATED FRICTIONAL CONTACT SURFACE MADE OF ELECTRICALLY CONDUCTIVE MATERIAL, AND ELECTRODE FOR ELECTROCHEMICAL MACHINING - The invention relates to a method for machining a coated, subtantially cylindrical frictional contact surface ( | 02-18-2010 |
20100051476 | ELECTROCHEMICAL MACHINING METHOD AND ELECTROCHEMICAL MACHINING DEVICE - A method and a device for electrochemically machining workpiece having blade end plates at the longitudinal both ends of a blade-shaped portion having aerofoil shape in cross section by extending and retracting divided electrodes. A part of the blade-shaped portion and one blade end plate continued therewith are electrochemically machined by advancing the main electrode in an acute angle direction relative to the longitudinal direction of the blade-shaped portion. At the same time or subsequently, the remaining part of the blade-shaped portion and the other blade end plate continued therewith are electrochemically machined by slidably advancing an auxiliary electrode along the slope of the main electrode forming an acute angle relative to the blade-shaped-portion-machining-surface. Thus, the number of the parts of an electrode unit can be reduced and the structure thereof can be simplified. | 03-04-2010 |
20100126877 | ELECTROCHEMICAL GRINDING ELECTRODE, AND APPARATUS AND METHOD USING THE SAME - An electrochemical grinding electrode comprises an electrically conductive material; an arc resistance material; and an abrasive material different from the arc resistance material. An electrochemical grinding apparatus and a method are also presented. | 05-27-2010 |
20100170806 | Method and device for electrochemical machining of substrates - A method and a device with the aid of which a substrate is electrochemically machined, material being removed from the surface of a conductive substrate with the aid of an also conductive tool. The removal takes place as a function of the surface structure which is incorporated into the tool. The core of the present invention is that the substrate and the tool are moved toward one another during the electrochemical etching process. However, it may alternatively also be provided that either the substrate or the tool is locally stationary, while only the counterpart is moved. In a particularly preferred embodiment of the present invention, only the tool is moved toward the substrate. | 07-08-2010 |
20100187126 | ETCHING SYSTEM AND METHOD FOR FORMING MULTIPLE POROUS SEMICONDUCTOR REGIONS WITH DIFFERENT OPTICAL AND STRUCTURAL PROPERTIES ON A SINGLE SEMICONDUCTOR WAFER - Disclosed is an electrochemical etching system with localized etching capability. The system allows multiple different porous semiconductor regions to be formed on a single semiconductor wafer. Localized etching is achieved through the use of one or more stationary and/or movable computer-controlled inner containers operating within an outer container. The outer container holds the electrolyte solution and acts as an electrolyte supply source for the inner container(s). The inner container(s) limit the size of the etched region of the semiconductor wafer by confining the electric field. Additionally, the current amount passing through each inner container during the electrochemical etching process can be selectively adjusted to achieve a desired result within the etched region. Localized etching of sub-regions within each etched region can also be achieved through the use of different stationary and/or moveable electrode structures and shields within each inner container. Also disclosed are associated method embodiments. | 07-29-2010 |
20120103830 | DEVICE AND METHOD FOR ELECTROCHEMICALLY REMOVING A SURFACE OF A COMPONENT - The invention relates to a device ( | 05-03-2012 |
20140076739 | ELECTROPOLISHING DEVICE AND METHOD - A device for repositioning a device during an electropolishing process. A fixture is disclosed that is configured to reposition the device during the electropolishing process in order to more evenly electropolish a surface of the device. | 03-20-2014 |
20150008140 | METHOD FOR FABRICATING MICROCHANNELS IN FLUID COOLED COMPONENTS - A method for manufacturing a microchannel cooling passage in a surface of a machine component that includes: forming an elongated open channel in the surface of the machine component, the open channel comprising a cross-sectional profile having a mouth and a floor, and, defined therebetween, a middle region; inserting a corresponding elongated electrode having a directional bias into the channel; and using the electrode as a tooling piece in an electrochemical machining process, widening the middle region of the open channel. | 01-08-2015 |
20150027904 | MULTIPART ELECTRODE ARRAY AND METHOD FOR THE ELECTROCHEMICAL TREATMENT OF BLADES HAVING SHROUDING BANDS - The invention relates to a method for electrochemically machining blades of a turbomachine having at least one U-shaped or trapezoidal cross-sectional profile of the surface to be treated, wherein an electrode array having at least three electrodes that can be moved in different directions is provided. The electrodes are moved from a start position having a first distance to the surface to be machined into an end position having a second distance to the surface to be machined, wherein in the end position, a closed work surface of the electrodes having a negative shape of the surface contour of the surface to be machined is located opposite thereof. The invention further relates to an electrode array for carrying out an electrochemical machining, wherein the electrode array comprises at least three electrodes that can be moved in different directions to one another, and to stationary mounting, wherein the electrodes can be moved from a start position to an end position. | 01-29-2015 |
20160002816 | ELECTROPOLISHING DEVICE AND METHOD - A device for repositioning a device during an electropolishing process. A fixture is disclosed that is configured to reposition the device during the electropolishing process in order to more evenly electropolish a surface of the device. | 01-07-2016 |
20160074952 | ELECTROCHEMICAL MACHINING OF A WORKPIECE - The invention relates to a machine having a base ( | 03-17-2016 |
20160151849 | APPARATUS USING ELECTROCHEMICAL DISCHARGE MACHINING PROCESS AND METHOD USING THE SAME | 06-02-2016 |