Class / Patent application number | Description | Number of patent applications / Date published |
205183000 | Forming nonelectrolytic coating before depositing predominantly single metal or alloy electrolytic coating | 31 |
20080210565 | Method of Surface Treatment for Metal and Nonmetal Surfaces - A method of treating the surface of each of a plurality of objects comprising washing the objects; positioning the objects on each of a plurality of structural members; depositing a thin coating on each object; drying the thin coatings; placing the objects and the structural members on a tray in a heating chamber wherein an electric heating unit is disposed in the heating chamber for forming a first metal coat on the thin coating of each object and a second metal coat on each structural member by evaporation; placing the objects and the structural members in a tank filled with electro-coating solution such that after conducting the electro-coating solution positive or negative ions of the electro-coating solution are dissociated and move to the surfaces of the objects for depositing an outer layer thereon; and removing the objects from each structural member. | 09-04-2008 |
20090065365 | METHOD AND APPARATUS FOR COPPER ELECTROPLATING - A method and apparatus for a copper electroplating procedure, wherein a first additive is preferentially adsorbed onto the field region of a substrate and a second additive is preferentially adsorbed onto the surfaces of at least one recessed region of the substrate, is provided. The first additive is more resistive to the electrodeposition relative to the second additive such that the recessed regions are filled at a faster rate than a layer is deposited on the field region. | 03-12-2009 |
20090152121 | THIN FILM CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. | 06-18-2009 |
20090205968 | ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND METHODS OF USE THEREOF - This invention relates to organometallic compounds having the formula (L | 08-20-2009 |
20090266716 | Method of fabricating a bipolar electrode for use in a semi fuel cell - A bipolar electrode fabricated with a combination of materials that will physically separate the catholyte from the metal anode of the electrode while providing high electrical conductivity between the metal anode and the catalyst cathode. This is accomplished by layering the catalyst cathode over a composite of conductive adhesive and conductive foil that is then affixed to the metal anode. | 10-29-2009 |
20090277798 | CATALYST ATTACHMENT-ENHANCING AGENT - Disclosed is a technique for direct plating which causes no deposition of a metal on the rack coating. A catalyst attachment-enhancing agent comprising a high molecular compound having primary, secondary and tertiary amino groups as active ingredient; and a method for direct electroplating onto a Pd/Sn colloidal catalyst which has been subjected to a conductivity-imparting treatment, comprising the step of, prior to the attachment of the Pd/Sn colloidal catalyst to a non-conductive material, treating the non-conductive material with a catalyst attachment-enhancing agent which comprises a high molecular compound having primary, secondary and tertiary amino groups as an active ingredient. | 11-12-2009 |
20100012500 | DEPOSITION OF CONDUCTIVE POLYMER AND METALLIZATION OF NON-CONDUCTIVE SUBSTRATES - A process is provided for metallizing a surface of a substrate with electrolytically plated copper metallization, the process comprising electrolytically depositing copper over the electrically conductive polymer by immersing the substrate in an electrolytic composition and applying an external source of electrons, wherein the electrolytic composition comprises a source of copper ions and has a pH between about 0.5 and about 3.5. In another aspect, a process is provided for metallizing a surface of a dielectric substrate with electrolytically plated copper metallization, the process comprising immersing the substrate into a catalyst composition comprising a precursor for forming an electrically conductive polymer on the surface of the dielectric substrate and a source of Mn(II) ions in an amount sufficient to provide an initial concentration of Mn(II) ions of at least about 0.1 g/L to form an electrically conductive polymer on the surface of the dielectric substrate, and electrolytically depositing copper over said electrically conductive polymer. | 01-21-2010 |
20100176002 | METHOD OF FORMING A COLORFUL COATING ON A TRANSPARENT PLASTIC ARTICLE - A method for forming a colorful coating on a transparent plastic article comprises following steps: dipping a transparent plastic article into liquid coating bath for dyeing, removing the dyed plastic article from the coating bath and then washing and baking it, and subsequently vacuum depositing a metallic film on the plastic article. As a result, there is a colorful coating formed on the transparent plastic article. | 07-15-2010 |
20110024302 | Molecular Imprinted Nanosensors And Process For Producing Same - A molecular recognition sensor system is provided incorporating a molecular imprinted nanosensor device formed by the process steps of:
| 02-03-2011 |
20110073484 | METAL MATERIAL WITH A BISMUTH FILM ATTACHED AND METHOD FOR PRODUCING SAME, SURFACE TREATMENT LIQUID USED IN SAID METHOD, AND CATIONIC ELECTRODEPOSITION COATED METAL MATERIAL AND METHOD FOR PRODUCING SAME - This invention provides a metal material with a bismuth coating being enables the subsequent coating to be accomplished at a high throwing power, and has excellent corrosion resistance, coating adhesion, and, being able to be produced with reduced damage to the environment, the metal material having a surface and a bismuth-containing layer deposited on at least a part of the surface of the metal material, wherein a percentage of bismuth atoms in number of atoms in the surface layer of the metal material with a bismuth coating is at least 10%. | 03-31-2011 |
20120285835 | ADHESION PROMOTION OF METAL TO A DIELECTRIC - An adhesion solution containing curable amine compounds and curable epoxy compounds are applied to a dielectric material followed by drying the solution and electrolessly plating a thin metal layer on the dielectric material. The composite is then annealed to cure the amine and epoxy compounds. The adhesion solution contains an excess amount of curable amine to curable epoxy. The adhesion solution and method may be used in the manufacture of printed circuit boards. | 11-15-2012 |
20130228468 | Method for Continuously Producing Flexible Copper Clad Laminates - The present invention provides a method for continuously producing flexible copper clad laminates, which comprises a step of performing continuous copper plating after the steps or step of performing continuous ion implantation and/or plasma deposition on the surface of an organic macromolecular polymer film. The bonding force between the copper film and the substrate in a two-layer flexible copper clad laminate produced by the method provided by the present invention is much larger than that in a flexible copper clad laminate produced by a sputtering/plating method and equivalent to that in a flexible copper clad laminate produced by a coating method and a lamination method. Meanwhile the thickness of the copper film can be easily controlled to be less than 18 microns. In addition, more importantly, in the method provided by the present invention for continuously producing the two-layer flexible copper clad laminates, not only one surface of the film substrate, but also the two surfaces of the film substrate can be simultaneously treated, so the production efficiency is high. | 09-05-2013 |
20140138253 | COMPOSITION AND METHOD FOR THE DEPOSITION OF CONDUCTIVE POLYMERS ON DIELECTRIC SUBSTRATES - The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions. | 05-22-2014 |
20160020034 | Solid Electrolytic Capacitor with High Temperature Leakage Stability - A solid electrolytic capacitor and method for forming a solid electrolytic capacitor with high temperature leakage stability is described. The solid electrolytic capacitor has improved leakage current and is especially well suited for high temperature environments such as down-hole applications. | 01-21-2016 |
205184000 | Nonelectrolytic coating or coatings all contain single metal or alloy | 17 |
20100155255 | PRETREATMENT PROCESS FOR ELECTROLESS PLATING OF RESIN MOLDED BODY, METHOD FOR PLATING RESIN MOLDED BODY, AND PRETREATMENT AGENT - The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article. | 06-24-2010 |
20100243465 | METHOD OF PRODUCING SURFACE-TREATED METAL MATERIAL AND METHOD OF PRODUCING COATED METAL ITEM - A method of producing a surface-treated metal material, comprising: surface treating a metal material using a treatment liquid (1), which comprises from 10 to 10,000 ppm of tin ions and has a pH of 1.0 or greater, and subjecting the metal material that has undergone surface treatment with the treatment liquid (1) to an additional chemical conversion treatment using a treatment liquid (2), which comprises zirconium ions and/or titanium ions. | 09-30-2010 |
20110100829 | MULTI MATERIAL SECONDARY METALLIZATION SCHEME IN MEMS FABRICATION - Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and two or more sacrificial secondary metals that provide structural support for the primary metal component during machining. A first secondary metal is thinly plated around the primary metal and over the entire surface of the substrate without using photolithography. A second secondary metal, is then thickly plated over the deposited first secondary metal without using photolithography. Additionally, techniques are disclosed to increase the deposition rate of the first secondary metal between primary metal features in order to prevent voiding and thus enhance structural support of the primary metal during machining. | 05-05-2011 |
20130175178 | METHOD FOR ALUMINIZING A SURFACE BY MEANS OF THE ADVANCE DEPOSITION OF A PLATINUM AND NICKEL LAYER - A method for depositing an aluminizing coating onto a substrate. The method includes: (a) depositing a layer, containing platinum and at least 35% of nickel, onto a surface of the substrate; and (b) depositing an aluminum coating onto the layer. | 07-11-2013 |
20130299356 | PLATING METHOD USING INTAGLIO PROCESSING - Disclosed is a plating method using etching during surface treatment of a material, including: forming a nickel plating layer on the surface of an original material; masking a masking jig in a form of a plate on which a graphic is engraved on the nickel plating layer; etching the masked nickel plating layer; removing the masking jig from the nickel plating layer; and forming a chromium plating layer on the etched nickel plating layer, in which a desired graphic is engraved without deterioration of appearance, corrosion resistance, abrasion resistance and the like. | 11-14-2013 |
205186000 | Nonelectrolytic coating by vacuum or vapor deposition | 6 |
20080237053 | STRUCTURE COMPRISING A BARRIER LAYER OF A TUNGSTEN ALLOY COMPRISING COBALT AND/OR NICKEL - An interconnection structure comprising a substrate having a dielectric layer with a via opening therein; wherein the opening has an underlayer of cobalt and/or nickel therein, barrier layer of an alloy of cobalt and/or nickel; and tungsten is provided. | 10-02-2008 |
20110174630 | FILM FORMATION METHOD AND STORAGE MEDIUM - A film formation method includes preparing a substrate formed a Co film as a seed layer on a surface of the substrate, applying a negative voltage to the substrate such that a surface potential of Co is lower than an oxidation potential of the Co, and in a state when the negative voltage is applied to the substrate, dipping the Co film in a plating solution mainly containing copper sulfate solution, thereby a Cu film is formed on the Co film of the substrate by electroplating. | 07-21-2011 |
20110297551 | METHOD FOR FABRICATING ELECTRONIC COMPONENT AND ELECTRO-PLATING APPARATUS - A method for fabricating an electronic component according to an Embodiment, includes a seed film forming process and an electro-plating process. In the seed film forming process, a seed film is formed above a substrate. In the electro-plating process, electro-plating is performed by soaking the seed film in a plating solution in a plating bath to which the plating solution being bubbled by a nitrogen gas is supplied, using the seed film as a cathode. | 12-08-2011 |
20120085656 | COLOR FILTER BY COPPER AND SILVER FILM AND METHOD FOR MAKING SAME - The present invention discloses a color filter by copper and silver film, comprising: a lower copper layer; a lower silver layer formed on the lower copper layer; a medium formed on the lower silver layer; an upper copper layer formed on the medium; and an upper silver layer formed on the upper copper layer. | 04-12-2012 |
20130146468 | CHEMICAL VAPOR DEPOSITION (CVD) OF RUTHENIUM FILMS AND APPLICATIONS FOR SAME - Methods for depositing ruthenium-containing films are disclosed herein. In some embodiments, a method of depositing a ruthenium-containing film on a substrate may include depositing a ruthenium-containing film on a substrate using a ruthenium-containing precursor, the deposited ruthenium-containing film having carbon incorporated therein; and exposing the deposited ruthenium-containing layer to a hydrogen-containing gas to remove at least some of the carbon from the deposited ruthenium-containing film. In some embodiments, the hydrogen-containing gas exposed ruthenium-containing film may be subsequently exposed to an oxygen-containing gas to at least one of remove at least some carbon from or add oxygen to the ruthenium-containing film. In some embodiments, the deposition and exposure to the hydrogen-containing gas and optionally, the oxygen-containing gas may be repeated to deposit the ruthenium-containing film to a desired thickness. | 06-13-2013 |
20160010205 | METALLIZATION OF FLUOROELASTOMER FILMS | 01-14-2016 |
205187000 | Nonelectrolytic coating by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.) | 6 |
20080308425 | CORROSION AND WEAR RESISTANT COATING FOR MAGNETIC STEEL - A method is provided for manufacturing a magnetic steel component. An electroless nickel plating is formed on a substrate that includes magnetic steel. A thermal cycle is thereafter performed at a temperature that is sufficiently high to sinter the electroless nickel plating and thereby form a densified plating on the substrate. According to one embodiment, the thermal cycle includes a solid state diffusion sintering process wherein the substrate and the densified plating are heated to a temperature of at least about 1300° F. (about 704° C.) but.below the melting temperature of the electroless nickel plating. According to another embodiment, the thermal cycle includes a transient liquid phase sintering process wherein the substrate and the densified plating are heated at least to the melting temperature of the electroless plating. | 12-18-2008 |
20100108528 | MATERIAL FOR FORMING ELECTROLESS PLATE, COATING SOLUTION FOR ADHERING CATALYST, METHOD FOR FORMING ELECTROLESS PLATE, AND PLATING METHOD - A material for forming electroless plate comprising a non-conductive base material and a catalyst adhering layer provided on the non-conductive base material is constituted so that the catalyst adhering layer should comprise a hydrophilic (meth)acrylic resin constituted with a hydrophilic monomer and a hydrophobic monomer and containing the hydrophobic monomer at a ratio of 50 to 90 mol %. This material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of the catalyst adhering layer from the non-conductive base material, no dissolution of the catalyst adhering layer into a plating solution, and no discoloration of plate layer during the catalyst adhering step, development step and other steps. | 05-06-2010 |
20120097548 | STABLE NANOPARTICLES FOR ELECTROLESS PLATING - Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium. | 04-26-2012 |
20120145554 | PLATING CATALYST AND METHOD - Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices. | 06-14-2012 |
20120145555 | PLATING CATALYST AND METHOD - Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices. | 06-14-2012 |
20120222961 | SYSTEM, METHOD, AND APPARATUS FOR LEACHING CAST COMPONENTS - A method includes removing a casting shell and core from a cast component, which may be a gas turbine blade. The method further includes utilizing a focused removal technique, such as a water jet or laser drill, to remove a portion of a virtual pattern cast (VPC) shell from the cast component. The cast component is then exposed to a leaching solution and high pressure water wash to remove an internal core material and a portion of the VPC shell remainder from the cast component. The method further includes exposing the cast component to a high agitation leaching solution and to the high pressure water wash for a minimal time. An electroless nickel-boron coating is then applied to the cast component, and an electrolytic palladium coating is further applied to the cast component. The cast component is further exposed to a high agitation leaching solution for an extended period. | 09-06-2012 |