| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205159000 | Coating predominantly nonmetal substrate | 23 |
| 20090321267 | METHOD FOR SURFACE TREATING PLASTIC PRODUCTS - A method for surface treating plastic products is provided. The method includes the steps of providing a plastic substrate, the plastic substrate being made of electroplatable material; forming at least one electroconductive coating on the plastic substrate surface by electro-less plating; forming a copper layer on the electroconductive coating by electroplating; partially etching the surface of the copper layer using a laser to form a rough area; and forming a top coating on the copper layer by electroplating. Both shiny appearance and dusky appearance of the plastic substrate can be present by this method. | 12-31-2009 |
| 20080314755 | LAYERED ELECTROCATALYST FOR OXIDATION OF AMMONIA AND ETHANOL - A layered electrocatalyst for oxidizing ammonia, ethanol, or combinations thereof, comprising: a carbon support integrated with a conductive metal; at least one first metal plating layer at least partially deposited on the carbon support, wherein the at least one first metal plating layer is active to OH adsorption and inactive to a target species, and wherein the at least one first metal plating layer has a thickness ranging from 10 nanometers to 10 microns; and at least one second metal plating layer at least partially deposited on the at least one first metal plating layer, wherein the at least one second metal plating layer is active to the target species, and wherein the at least one second metal plating layer has a thickness ranging from 10 nanometers to 10 microns, forming a layered electrocatalyst. | 12-25-2008 |
| 20110089041 | METHODS OF DEPOSITING DISCRETE HYDROXYAPATITE REGIONS ON MEDICAL IMPLANTS - A method for electrochemically depositing discrete regions of calcium phosphate onto a medical implant. The method includes providing an implant including at least one area having a metallic surface. At least a portion of the metallic surface is contacted with an electrolyte solution comprising calcium ions and phosphate ions. The metallic surface is used as a cathode, and an electrical potential is applied between the cathode and the electrolyte solution. The electrical potential is applied with a constant current density of from about 10 to about 50 mA/cm | 04-21-2011 |
| 20120080319 | METAL AND METAL OXIDE CO-FUNCTIONALIZED SINGLE-WALLED CARBON NANOTUBES FOR HIGH PERFORMANCE GAS SENSORS - A method of co-functionalizing single-walled carbon nanotubes for gas sensors, which includes the steps of: fabricating single-walled carbon nanotube interconnects; synthesizing tin oxide onto the single-walled carbon nanotube interconnects; and synthesizing metal nanoparticles onto the tin oxide coated single-walled carbon nanotube interconnects. | 04-05-2012 |
| 205161000 | Perforated, foraminous, or permeable substrate | 3 |
| 20110083966 | ELECTRODE FOR LEAD-ACID BATTERY AND METHOD FOR PRODUCING SUCH AN ELECTRODE - An electrode for lead-battery comprises a current collector covered by an active layer of lead-containing paste. The current is formed by a glassy carbon substrate on which is deposited an intermediate layer. The glassy carbon substrate has preferably a thickness comprised between 1 mm and 3 mm whereas the thickness of the intermediate layer is advantageously comprised between 50 μm and 200 μm. In a particular embodiment, the glassy carbon substrate is in form of a comb. | 04-14-2011 |
| 20120111730 | COMPOSITE ELECTRODE AND METHOD FOR MANUFACTURING THE SAME - A composite electrode and a method for manufacturing the same are disclosed. By using a composite electrode that includes a porous support made of ceramic or metal and a conductive polymer or a metal oxide formed on a surface of the porous support, a capacitor or secondary cell that provides increased charge/discharge capacity and increased energy/output density, as well as high-temperature stability and high reliability, can be manufactured. | 05-10-2012 |
| 20120325672 | Method for Depositing a Metal Onto A Porous Carbon Layer - The invention relates to a method for depositing a metal M1 onto a carbon layer, as well as to a method for manufacturing an electrode for fuel cells and to a method for manufacturing a fuel cell. The method for depositing a metal M1 onto a porous carbon layer according to the invention includes a step of depositing said metal M1 by means of the electrochemical reduction of an electrolytic solution of a salt of the metal M | 12-27-2012 |
| 205162000 | Ceramic or glass substrate | 4 |
| 20090277797 | METHOD AND SYSTEM FOR REMOVING CONTAMINANTS FROM A FLUID - A method and system for removing contaminants from a fluid are provided. The method can generally include providing microstructures in the fluid. At least some of the contaminants in the fluid are attracted to the microstructures and adhered to the microstructures. With the contaminants attached to the microstructures, the microstructures can be separated from the fluid so that the contaminants are thereby removed from the fluid. | 11-12-2009 |
| 20090242414 | ELECTRONCHEMICAL DEPOSITION OF TANTALUM AND/OR COPPER IN IONIC LIQUIDS - The invention relates to a process for the electrochemical deposition of tantalum and/or copper on a substrate in an ionic liquid comprising at least one tetraalkylammonium, tetraalkylphosphonium, 1,1-dialkylpyrrolidinium, 1-hydroxyalkyl-1-alkylpyrrolidinium, 1-hydroxyalkyl-3-alkylimidazolium or 1,3-bis(hydroxyalkyl)imidazolium cation, where the alkyl groups or the alkylene chain of the hydroxyalkyl group may each, independently of one another, have 1 to 10 C atoms. | 10-01-2009 |
| 20110048957 | Method for forming an ultrathin Cu barrier/seed bilayer for integrated circuit device fabrication - A structure and method for forming a relatively thin diffusion barrier/seed bilayer for copper metallization in an electronic device is disclosed. A single layer of an alloy is formed over a dielectric (and possibly the copper layer). The alloy includes a copper platable metal (e.g., ruthenium) and a nitride forming material (e.g., tungsten) and nitrogen. The alloy layer is annealed, and the alloy naturally segregates into two layers. The first layer is a barrier layer including the nitride forming material and nitrogen. The second layer is a seed layer including the copper platable metal. | 03-03-2011 |
| 20110259753 | CERAMIC ELEMENT INLAID WITH AT LEAST ONE METALLIC DECORATION - The invention relates to an inlaid ceramic decoration ( | 10-27-2011 |
| 205164000 | Synthetic resin substrate | 12 |
| 20110284388 | Resin Plating Method Using Graphene Thin Layer - According to an example embodiment a method of plating resin using a graphene thin layer includes forming a graphene thin layer on a resin substrate and electroplating the resin substrate having the graphene thin layer fog on the resin substrate. | 11-24-2011 |
| 20100032308 | METALLIZATION PROCESS FOR MAKING FUSER MEMBERS - The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal nanoparticle seeding or special substrate treatment. In embodiments, a metallized substrate, formed by dip-coating or spraying with a metal nanoparticle dispersion which is subsequently thermally annealed, is used for the complete fabrication of the fuser member. | 02-11-2010 |
| 20090294296 | METHOD OF MANUFACTURING FLEXIBLE FILM - A method of manufacturing a flexible film is disclosed. The method includes (a) forming at least one hole on an insulating film, (b) after the step (a), forming a first metal layer on a first surface corresponding to an inner circumferential surface of the hole, and at least one of a second surface corresponding to an upper surface of the insulating film and a third surface corresponding to a lower surface of the insulating film, and (c) forming a second metal layer on the first metal layer. A thickness of the first metal layer is smaller than a thickness of the second metal layer. | 12-03-2009 |
| 20110240482 | PLATING CATALYST LIQUID, PLATING METHOD, AND METHOD FOR PRODUCING LAMINATE HAVING METAL FILM - A plating catalyst liquid which places little burden on the environment, which does not roughen the surface of a plating target, which can be easily controlled for the amount of plating catalyst applied and which is at low risk of inflammation and is highly safe, and a plating method using the plating catalyst are provided. The plating catalyst liquid includes a palladium compound, water, and a water-soluble combustible liquid serving as a combustible liquid ingredient, has a flash point of 40° C. or more and contains the water-soluble combustible liquid in an amount of 0.1 to 40 wt %. | 10-06-2011 |
| 20100059386 | DIRECT PLATING METHOD AND SOLUTION FOR PALLADIUM CONDUCTOR LAYER FORMATION - A surface of an object to be plated is subjected to a treatment for palladium catalyst impartation to impart a palladium catalyst to the surface of an insulating part thereof. A palladium conductor layer is formed on the insulating part from a solution for palladium conductor layer formation which contains a palladium compound, an amine compound, and a reducing agent. On the palladium conductor layer is then directly formed a copper deposit by electroplating. Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline. Consequently, the polyimide is prevented from being attacked and no adverse influence is exerted on adhesion. By adding an azole compound to the solution for palladium conductor layer formation, a palladium conductor layer is prevented from depositing on copper. Thus, the reliability of connection between the copper part present on a substrate and the copper deposit formed by electroplating is significantly high. | 03-11-2010 |
| 20120305406 | Method for Metallising Objects Which Have at Least Two Different Plastics on the Surface - The following method is to improve selectivity during metallisation of surface areas to be metallised on objects | 12-06-2012 |
| 20090120798 | Method For Manufacturing Plated Resin Molded Article - The present invention provides a method for manufacturing plated resin molded article having strong adhesion of plating and giving beautiful appearance. Specifically, it provides a method for manufacturing plated resin molded article having the steps of: contact-treating a thermoplastic resin molded article using an acid or base free from heavy metal; treating the contact-treated thermoplastic resin molded article by a catalyst imparting liquid; forming an electrically conductive layer on the surface of the thermoplastic resin molded article using a direct plating method; and applying electroplating to the electrically conductive layer; without applying the step of etching by an acid which contains heavy metal. | 05-14-2009 |
| 20120073978 | USE OF IONIC LIQUIDS FOR THE PRETREATMENT OF SURFACES OF PLASTICS FOR METALLIZATION - Process for coating plastics with metals, wherein the plastics are pretreated with a composition comprising at least one salt having a melting point of less than 100° C. at 1 bar (hereinafter referred to as ionic liquid). | 03-29-2012 |
| 20110226629 | PROCESS FOR OPTOPHYSICAL SURFACE TREATMENT OF POLYMER SUBSTRATES AND DEVICE FOR IMPLEMENTING THE PROCESS - A surface treatment process which enables a substrate (polymer) to be given specific physical properties, especially surface nanoporosity, for example with a view to electroless metallizing it, and which completely replaces surface treatment by sulfo-chromic pickling. The surface treatment includes a hybrid UV/corona treatment of the substrate surface followed by non-electrolytic metallization. A device for implementing these processes is also disclosed. | 09-22-2011 |
| 205165000 | Conductive material applied to substrate by vacuum or vapor deposition | 1 |
| 20120193241 | METHOD FOR APPLYING SEMI-DRY ELECTROPLATING METHOD ON SURFACE OF PLASTIC SUBSTRATE - A method for applying a semi-dry electroplating method on a surface of plastic substrate is related to an electroplating method of plastic. which realizes the surface metallization of plastic materials, simplifies the electroplating procedure, dramatically reduces the amount of waste water, reduces the pollution to environment and expands electroplatable range of plastic substrates, is provided. Water-free cleaning and dust removal are conducted to a plastic substrate; a first-time activated treatment is conducted to the surface of the plastic substrate; a PVD plating metallic base layer, an alloy transition layer and a metallic electrical conductive layer are applied in turn on it, ultrasonic water washing and a second-time activated treatment are conducted on the treated plastic substrate; the treated plastic substrate is directly electroplated with acid copper or is moved to a nickel plating bath, and then complete the final surface treatment according to the actual process requirements. | 08-02-2012 |
| 205166000 | Conductive material applied to substrate by painting, spraying, or immersion | 2 |
| 20100300889 | ANODICALLY ASSISTED CHEMICAL ETCHING OF CONDUCTIVE POLYMERS AND POLYMER COMPOSITES - A novel activation/etch method is disclosed for conductive polymer substrates and conductive polymer composite substrates to achieve good adhesion to subsequently applied coatings. The method in a preferred case involves anodically polarizing conductive polymers/polymer composites in aqueous etching solutions. | 12-02-2010 |
| 205167000 | Conductive material applied to substrate by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.) | 1 |
| 20080202937 | Method for Manufacturing an Emi Shielding Element - A method for manufacturing an EMI shielding element from a sheet of polymer material includes forming the shielding element by vacuum- or pressure-molding. The formed element is then chemically etched to roughen its surface on a microscopic scale. The surface is subsequently treated with a catalyzing solution to enable the shielding element to be plated by electroless plating. A first metallic layer is deposited on the etched and catalyzed surface by electroless plating, and a second metallic layer is deposited on the first by electrolytic plating. | 08-28-2008 |
