Class / Patent application number | Description | Number of patent applications / Date published |
205112000 | Coating is discontinuous single metal or alloy layer (e.g., islands, porous layer, etc.) | 20 |
20080314753 | Electrode Surface Coating and Method for Manufacturing the Same - An electrode surface coating and method for manufacturing the electrode surface coating comprising a conductive substrate; and one or more surface coatings comprising one or more of the following metals titanium, niobium, tantalum, ruthenium, rhodium, iridium, palladium, or gold, or an alloy of two or more metals, or a combination of two or more alloys or metal layers thereof having an increase in the surface area of 5 times to 500 times of the corresponding surface area resulting from the basic geometric shape. | 12-25-2008 |
20090057155 | Process of preparing copper foil for use in fine geometry circuit boards - Process of preparing copper foil for use in fine geometry circuit boards in which spaced apart islands are formed in the copper foil, with the islands being smaller in dimension than crystals in the foil so that most of the islands are single crystals, and the islands are grown out until they meet one another to form a continuous foil having a columnar structure that etches preferentially along the intersections of the islands in directions perpendicular to the surface of the foil thus formed. | 03-05-2009 |
20090145766 | ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD, AND PRODUCTION METHOD OF PRINTED WIRING BOARD - The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers. | 06-11-2009 |
20090188804 | Plating method - Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit. | 07-30-2009 |
20110100827 | ANTIREFLECTION FILM, OPTICAL ELEMENT COMPRISING ANTIREFLECTION FILM, STAMPER, PROCESS FOR PRODUCING STAMPER, AND PROCESS FOR PRODUCING ANTIREFLECTION FILM - An antireflection film of the present invention includes a plurality of first raised portions, each of which has a two-dimensional size of not less than 1 μm and less than 100 μm when seen in a direction normal to the film, and a plurality of second raised portions, each of which has a two-dimensional size of not less than 10 nm and less than 500 nm when seen in a direction normal to the film. In at least one embodiment, the antireflection film has a first surface shape or a second surface shape that is inverse to the first surface shape relative to a film surface. In the first surface shape, the second raised portions are provided on the first raised portions and between the plurality of first raised portions, and the elevation angle α of a surface of the first raised portions relative to the film surface is about 90° or more. The antireflection film of the present invention has a more excellent antiglare function than conventional ones. | 05-05-2011 |
20110297550 | METHOD OF FORMING THE STRUCTURE OF THERMAL RESISTIVE LAYER - The prevent disclosure discloses a structure of thermal resistive layer and the method of forming the same. The thermal resistive structures, formed on a plastic substrate, comprises a porous layer, formed on said plastic substrate, including a plurality of oxides of hollow structure, and a buffer layer, formed on said porous layer, wherein said porous layer can protect said plastic substrate from damage caused by the heat generated during manufacturing process. With the structure and method disclosed above, making a thin film transistor and forming electronic devices on the plastic substrate in the technology of Low Temperature PolySilicon, i.e. LTPS, without changing any parameters is possible. | 12-08-2011 |
20120024711 | COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING - A composition for filling submicrometer sized features having an aperture size of 30 nanometers or less comprising a source of copper ions, and at least one suppressing agent selected from compounds of formula (I) wherein the R1 radicals are each independently selected from a copolymer of ethylene oxide and at least one further C3 to C4 alkylene oxide, said copolymer being a random copolymer. the R2 radicals are each independently selected from R1 or alkyl. X and Y are spacer groups independently, and X for each repeating unit independently, selected from C1 to C6 alkylen and Z—(O—Z)m wherein the Z radicals are each independently selected from C2 to C6 alkylen, n is an integer equal to or greater than 0. m is an integer equal to or greater than 1. | 02-02-2012 |
20120234686 | METHOD AND SYSTEM FOR PREPARATION OF HIGHLY POROUS AND PREFERENTIALLY-ORIENTED PLATINUM NANOWIRES AND THIN FILMS - A method for preparation of highly porous and preferentially-oriented {100} platinum on a substrate by electrodeposition in a deposition bath, comprising using a deposition potential E | 09-20-2012 |
20120325670 | METHOD FOR FORMING ANODIZED LAYER, METHOD FOR PRODUCING MOLD AND METHOD FOR PRODUCING ANTIREFLECTIVE FILM - An anodized layer formation method of an embodiment of the present invention includes the step a of providing an aluminum film which is formed on a first principal surface of a support and the step b of anodizing a surface of the aluminum film to form a porous alumina layer which has a plurality of minute recessed portions. In the step a, a second principal surface of the support which is opposite to the first principal surface is provided with a low heat conduction member that has a predetermined pattern. According to an embodiment of the present invention, a porous alumina layer can be formed which includes regions of different minute structures in the predetermined pattern. | 12-27-2012 |
20130015073 | NANOPOROUS OXIDE CERAMIC MEMBRANES OF TUBULAR AND HOLLOW FIBER SHAPE AND METHOD OF MAKING THE SAME - The present invention is aimed to fabricate nanoporous anodic oxide ceramic membrane tubes with excellent pore characteristics by anodizing metal tubes located in a cylindrical symmetry with respect to a cathode which itself has a cylindrical symmetry. The membrane tubes may have protruded portions acting as supports and joints. The present invention also deals with stacks and bundles consisted of numbers of the anodic oxide ceramic tubes for filter and dialysis applications. | 01-17-2013 |
20130240365 | MEDICAL SUPPLIES AND METHOD OF PRODUCING THE SAME - A method of producing metallic medical supplies includes supplying a metallic material as a base material; treating the base material by carrying out any one of electrochemical treatment, chemical treatment, thermal and/or mechanical treatment or a combination of two or more of these treatments to form a film having micro pores and/or micro unevennesses having a density of 5′ 104/mm2 on a surface of the base material; and carrying out iodine-impregnation treatment to impregnate the film with iodine or iodine compounds. | 09-19-2013 |
20130256141 | TITANIUM OR TITANIUM ALLOY-AND-RESIN COMPOSITE AND METHOD FOR MAKING THE SAME - A method for making a titanium-and-resin composite or titanium alloy-and-resin composite includes: providing a titanium or titanium alloy substrate; electrochemically treating the substrate to form a titanium hydride layer; anodizing the substrate having the titanium hydride layer to form an nano-porous oxide film on the surface of the substrate, the nano-porous oxide film having nano pores and comprising at least two layers of different porosity or pore diameters; and inserting the substrate in a mold and melting resin on the surface of the nano-porous oxide film to form the composite. | 10-03-2013 |
20140014520 | METHOD FOR FORMING METAL MEMBER ON CASING - A method for forming metal members on a casing, includes steps of providing the casing of an electron device; selecting at least two areas on a common surface of the casing; forming, by an electroplating way, a metal layer on all of the selected areas; and forming, by a patterning way, the metal layer respectively with different metal member pattern layers on different selected areas, wherein the metal member pattern layers are selected from the group consisting of an antenna member pattern, a ground wire member pattern, and an electromagnetic shielding member pattern, so as to use these members as an antenna member, a ground wire member, or an electromagnetic shielding member of the electron device. | 01-16-2014 |
20140061054 | ANODIZING COLOR DRAWING METHOD - An anodizing color drawing method includes the steps of providing a metal workpiece; performing an anodic treatment of the metal workpiece to form a coating layer on a surface of the metal workpiece and a plurality of pores on the coating layer; using a plurality of electronic ink-jet nozzles to spray a plurality of dyes by a printing method and the dyes permeate into the pores of the coating layer, and forming a color drawing pattern on the coating layer; and performing a sealing treatment on the coating layer with the color drawing pattern. A color drawing layer processed by the anodic treatment has an enhanced hardness to reduce scratches and damages and maintain the aesthetic look. | 03-06-2014 |
20140124374 | DEVICE FOR INDICATING THE POSITION AND ORIENTATION OF A DENTAL IMPLANT - A position locator for use in dental restorative procedure is described. The position locator is inserted into a replica of a dental implant or into a replica of an abutment. The position and orientation of the implant replica is determined by scanning the model with the implant replica and the position locator. Alternatively, the position locator can be inserted into the dental implant and scanning is carried out in the mouth of the patient. The position locator is made of an optically opaque material, such as titanium, and has an outer surface detectable by an optical scanner, e.g. with a layer of porous titanium oxide applied through anodic oxidation. | 05-08-2014 |
20140197036 | MOLD PRODUCTION METHOD - A method for manufacturing a moth-eye mold of an embodiment of the present invention employs a mold base including a metal base, an organic insulating layer provided on the metal base, and an aluminum alloy layer provided on the organic insulating layer, the aluminum alloy layer containing aluminum and a non-aluminum metal element M, an absolute value of a difference between a standard electrode potential of the metal element M and a standard electrode potential of aluminum being not more than 0.64 V, and a content of the metal element M in the aluminum alloy layer not exceeding 10 mass %. | 07-17-2014 |
20150075995 | Coating Process for Non-Conductive Substrates and Devices Made From the Coating Process - A method for manufacturing a surgical implant. A metal layer is deposited onto a polyaryletherketone (PAEK) substrate by generating a series of pulses using a high power impulse magnetron sputtering process. Each pulse is applied in a series of micro pulse steps comprising (i) micro pulse on steps ranging from 10 μs to 100 μs and (ii) micro pulse off steps ranging from 5 μs as to 400 μs; at a repetition frequency ranging from 50-2000 Hz with 2 micropulses to 20 micropulses per repetition, a total pulse on time ranging from 25 μs to 800 μs for 5 minutes to 300 minutes at averaged power ranging from 200 W to 3000 W. The series of pulses are performed in a unipolar mode or a bipolar mode. | 03-19-2015 |
20160102412 | METHOD FOR PRODUCING PLATED ARTICLE - There is provided a method for producing a plated article, comprising immersing a substrate made of a conductive metal in a plating solution and forming a plating layer on the substrate by electroplating, wherein the plating solution is a solution containing 0.01 to 1 mol/L of Ni ions with pH of 6 or more; and a porous Ni plating layer is formed by performing the electroplating at a cathode current density of 10 A/dm | 04-14-2016 |
20160153105 | PRODUCING A NANOPORE FOR SEQUENCING A BIOPOLYMER | 06-02-2016 |
20190145015 | METHOD FOR PREPARING POROUS COPPER ALLOY WICK AND PRODUCT PREPARED BY THE SAME | 05-16-2019 |