Class / Patent application number | Description | Number of patent applications / Date published |
205102000 | Depositing predominantly single metal or alloy coating on single metal or alloy using specified waveform other than pure DC | 31 |
20110024301 | PROCESS FOR OPTIMIZING THE PROCESS OF COPPER ELECTRO-WINNING AND ELECTRO-REFINING BY SUPERIMPOSING A SINUSOIDAL CURRENT OVER A CONTINUOUS CURRENT - This invention discloses a process of the electro-winning of metals, in particular copper, is done in a strongly acidic aqueous solution (˜180 gpl H | 02-03-2011 |
20120031766 | Electric Al or Al Alloy Plating Bath Using Room Temperature Molten Salt Bath and Plating Method Using the Same - Disclosed herein is an electric Al or Al alloy plating bath which comprises (A) an aluminum halide; (B) one kind of compound or at least two kinds of compounds selected from the group consisting of N-alkylpyridinium halides, N-alkylimidazolium halides, N,N′-alkylimidazolium halides, N-alkyl-pyrazolium halides, N,N′-alkylpyrazolium halides, N-alkylpyrrolidinium halides and N,N-alkyl-pyrrolidinium halides; and (C) a high boiling point aromatic hydrocarbon solvent, wherein the molar ratio of the aluminum halide (A) to the compound (B) ranges from 1:1 to 3:1 and the flash point of the plating bath is not less than 50° C. The plating bath never involves any risk of causing an explosion, can be handled industrially with safety and can provide a smooth and fine Al of Al alloy plated film. Moreover, the resulting film has high resistance to corrosion even when it does not contain any chromium and therefore, it is quite suitable from the viewpoint of the environmental protection and it can thus be used in a wide variety of applications including the plating of parts for motorcars, and the plating of parts for electrical appliances. | 02-09-2012 |
20140374266 | METHOD AND APPARATUS FOR FORMING A CADMIUM ZINC TELLURIDE LAYER IN A PHOTOVOLTAIC DEVICE - A method and apparatus for controlling and changing the composition of a cadmium zinc telluride (CZT) transition layer as it is formed over a partially completed photovoltaic device using electrochemical deposition (ECD) where plating variables are systematically changed while the CZT transition layer is formed to change the composition of the plated CZT transition layer. | 12-25-2014 |
205103000 | Reversing current or voltage | 17 |
20080283404 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE TO DECREASE DEFECT NUMBER OF PLATING FILM - A method for manufacturing a semiconductor device is provided which includes performing an electroplating step to fill concavities formed on a substrate. The electroplating step further includes: performing a first electroplating step; performing a first reverse bias step; performing a second electroplating step; performing a second reverse bias step; and a third electroplating step. The polarity of the first and the second reverse bias steps is different from that of the first electroplating step. A difference between the third current density and the fourth current density is larger than a difference between the first current density and the second current density. | 11-20-2008 |
20090236230 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper - The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating | 09-24-2009 |
20090283410 | COATED ARTICLES AND RELATED METHODS - Coated articles and related methods are described. In some cases, the coated articles may exhibit high strength, hardness, brightness, abrasion resistance, corrosion resistance, and other desirable structural and functional properties. In some embodiments, the coatings may include an alloy, such as a nickel-tungsten alloy and/or metal oxides. | 11-19-2009 |
20090308755 | ELECTROLYTE FOR THE GALVANIC DEPOSITION OF ALUMINIUM FROM APROTIC SOLVENTS IN A PLATING BARREL - The invention relates to an electrolyte for the electrodeposition of aluminium from aprotic solvents containing a compound of the formula: N(R | 12-17-2009 |
20100116675 | ELECTRODEPOSITION BATHS, SYSTEMS AND METHODS - Electrodeposition baths, systems and methods are provided. In some embodiments, the baths, systems and methods are used to deposit metal alloy coatings. | 05-13-2010 |
20100307925 | COPPER FILLING-UP METHOD - There is provided a method of well filling copper in a conductivity-rendered non-through hole having an aspect ratio (depth/hole diameter) of 5 or more on a substrate in a short period of time, and the method comprises using an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid, chlorine ion, a brightener and a copolymer of diallylamines and sulfur dioxide and filling copper in the non-through hole by periodic current reversal copper plating. | 12-09-2010 |
20110132765 | CRYSTALLINE CHROMIUM DEPOSIT - An electroplating bath and a process for electrodepositing a crystalline chromium deposit on a substrate, in which the electroplating bath comprising trivalent chromium and a source of divalent sulfur, and substantially free of hexavalent chromium; immersing a substrate in the electroplating bath; and applying an electrical current to deposit a crystalline chromium deposit on the substrate, wherein the chromium deposit is crystalline as deposited, and/or has a lattice parameter of 2.8895+/−0.0025 Å, and/or the crystalline chromium deposit has a {111} preferred orientation. | 06-09-2011 |
20110155579 | UNDERPOTENTIAL DEPOSITION-MEDIATED LAYER-BY-LAYER GROWTH OF THIN FILMS - A method of depositing contiguous, conformal submonolayer-to-multilayer thin films with atomic-level control is described. The process involves the use of underpotential deposition of a first element to mediate the growth of a second material by overpotential deposition. Deposition occurs between a potential positive to the bulk deposition potential for the mediating element where a full monolayer of mediating element forms, and a potential which is less than, or only slightly greater than, the bulk deposition potential of the material to be deposited. By cycling the applied voltage between the bulk deposition potential for the mediating element and the material to be deposited, repeated desorption/adsorption of the mediating element during each potential cycle can be used to precisely control film growth on a layer-by-layer basis. This process is especially suitable for the formation of a catalytically active layer on core-shell particles for use in energy conversion devices such as fuel cells. | 06-30-2011 |
20110198227 | HIGH PURITY ELECTROLYTIC SULFONIC ACID SOLUTIONS - Disclosed is a solution for an electrochemical process, the solution containing a sulfonic acid and having a low concentration of sulfur compounds, either low or high valence, that are susceptible to reduction and which is intended for use in electrodeposition, batteries, conductive polymers and descaling processes. | 08-18-2011 |
20120145551 | Electroplated Magnetic Film for Read-Write Applications - A process is described for the fabrication, through electrodeposition, of Fe | 06-14-2012 |
20130062210 | MANUFACTURING METHOD OF SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE - Manufacturing methods of a substrate and a wiring substrate include a step A of forming a primary plating layer on a lower side of a glass substrate having a through-hole; a step B of sealing a lower opening of the through-hole by forming a first layer on an upper side using electroplating; and a step C of filling the through-hole by depositing a second layer in the through-hole using electroplating from the upper side. In the step A, the primary plating layer is formed on from a lower opening edge to a partial sidewall surface of the through-hole. In the step B, the lower opening is sealed by growing the first layer from a primary plating layer surface inside the through-hole. In the step C, the through-hole is filled with plating metal by growing the second layer from a first layer surface inside the through-hole toward an upper opening. | 03-14-2013 |
20130220819 | ELECTRODEPOSITION OF CHROMIUM FROM TRIVALENT CHROMIUM USING MODULATED ELECTRIC FIELDS - A layer of chromium metal is electroplated from trivalent chromium onto an electrically conducting substrate by immersing the substrate and a counter electrode in a electroplating bath and passing a modulated electric current between the electrodes. In one embodiment, the current contains pulses that are cathodic with respect to said substrate and in another embodiment the current contains pulses that are cathodic and pulses that are anodic with respect to said substrate. The cathodic pulses have a duty cycle greater than about 80%. | 08-29-2013 |
20130334053 | COPPER FILLING-UP METHOD - There is provided a method of well filling copper in a conductivity-rendered non-through hole having an aspect ratio (depth/hole diameter) of 5 or more on a substrate in a short period of time, and the method comprises using an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid, chlorine ion, a brightener and a copolymer of diallylamines and sulfur dioxide and filling copper in the non-through hole by periodic current reversal copper plating. | 12-19-2013 |
20150299884 | ALLOYING INTERLAYER FOR ELECTROPLATED ALUMINUM ON ALUMINUM ALLOYS - A method of forming a coated aluminum alloy component includes first preparing the surface of the aluminum alloy component and then electrodepositing an intermediate aluminum alloy interlayer on the surface of the component from an ionic liquid. A final step includes electrodepositing an aluminum protective coating on the intermediate aluminum alloy interlayer from an ionic liquid. | 10-22-2015 |
20150345040 | METHOD OF MANUFACTURING NICKEL-BASED ALLOY BARRIER LAYER OF WIRING CONNECTION TERMINAL - A method of manufacturing a nickel-based alloy barrier layer of a wiring connection terminal includes providing a substrate having a metal wiring; electroplating a nickel or a nickel-based alloy to the metal wiring at a deposition rate of 15-30 μm/hr to form a first layer thereon, wherein the first layer is of a thickness of 0.5 μm-5 μm, and the nickel-based alloy layer has nickel content of at least 50%; and plating a gold layer to the first layer to form thereon a second layer of a thickness of 0.03 μm-0.3 μm. The surface of the nickel-based alloy electroplated layer features a crystalline-phase structure full of micro-protuberances, and the thickness of the gold plated layer is reduced to 0.03 μm. | 12-03-2015 |
20150354077 | ELECTRODEPOSITION OF CHROMIUM FROM TRIVALENT CHROMIUM USING MODULATED ELECTRIC FIELDS - A layer of chromium metal is electroplated from trivalent chromium onto an electrically conducting substrate by immersing the substrate and a counter electrode in a electroplating bath and passing a modulated electric current between the electrodes. In one embodiment, the current contains pulses that are cathodic with respect to said substrate and in another embodiment the current contains pulses that are cathodic and pulses that are anodic with respect to said substrate. The cathodic pulses have a duty cycle greater than about 80%. | 12-10-2015 |
20160204003 | METHOD OF FORMING ASPER-SILVER ON A LEAD FRAME | 07-14-2016 |
205104000 | Nonreversing pulsed current or voltage | 11 |
20090301890 | FORMATION OF NANOSTRUCTURES COMPRISING COMPOSITIONALLY MODULATED FERROMAGNETIC LAYERS BY PULSED ECD - The present invention is related to a method for forming a structure that contains alternating first and second ferromagnetic layers of different material compositions. A substrate containing a supporting matrix with at least one open pore and a conductive base layer is first formed. Electroplating of the substrate is then carried out in an electroplating solution that contains at least one ferromagnetic metal element and one or more additional, different metal elements. A pulsed current with alternating high and low potentials is applied to the conductive base layer of the substrate structure to thereby form alternating ferromagnetic layers of different material compositions in the open pore of the supporting matrix. | 12-10-2009 |
20110036721 | Electrical Discharge Coating Method and Green Compact Electrode Used Therein - An electrical discharge coating method comprising the steps of: generating pulsed discharge between a green compact electrode | 02-17-2011 |
20110290653 | GOLD ALLOY ELECTROLYTES - Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color. | 12-01-2011 |
20120199488 | Turbo Titanium Coating Technology for Broad Application - A method for electroplating titanium alloy coating into plastic and carbon foam comprises the steps of activating the given specimen, deposition of electroless nickel and electroplating process of titanium alloy to the surface of the specimen. The electroplating process of electroplating titanium alloy coating includes a direct current method and a pulse plating method. The direct current method characterized by lager sized grains and the pulse plating method characterized by smaller sized grains. The advantages of proposed electroplating processes are: a) low cost, b) very broad applications and c) relatively low number of the process steps. Unique combination of physical, mechanical and chemical properties makes the electroplating methods of titanium coating an attractive technology for medicine, biotechnology, sports, defense, aeronautic, and auto industries. | 08-09-2012 |
20120279864 | PROCESS FOR ELECTROPLATING METALS INTO MICROSCOPIC RECESSED FEATURES - Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling. | 11-08-2012 |
20130112564 | Electroplating Solutions and Methods For Deposition of Group IIIA-VIA Films - The embodiment described herein relate to pulse electroplating methods and solutions. | 05-09-2013 |
20140001049 | SELF-TERMINATING GROWTH OF PLATINUM BY ELECTROCHEMICAL DEPOSITION | 01-02-2014 |
20140374267 | METHOD TO PRODUCE METAL MATRIX NANOCOMPOSITE - A method for coating a substrate includes disposing a deposition composition in a container. The deposition composition includes a plurality of nanosheets and a metal material. The method also includes disposing a substrate in the container, contacting the substrate with the deposition composition, applying a voltage to the substrate, electrodepositing, on the substrate, a coating that includes a metal from metal ions and the nanosheets in response to biasing the substrate at the first potential. | 12-25-2014 |
20160105975 | FILLING THROUGH-HOLES - Pulse plating methods which include a forward pulse but no reverse pulse inhibit or reduce dimpling and voids during copper electroplating of through-holes in substrates such as printed circuit boards. The pulse plating methods may be used to fill through-holes with copper where the through-holes are coated with electroless copper or flash copper. | 04-14-2016 |
20160145756 | ENVIRONMENTALLY FRIENDLY GOLD ELECTROPLATING COMPOSITIONS AND METHODS - Gold electroplating compositions are substantially free of many environmental toxins to provide an environmentally friendly pure gold electroplating composition. The substantially pure gold electroplating compositions may electroplate gold over a broad current density range to deposit bright to matte gold layers on various types of electronic components and decorative articles. | 05-26-2016 |
20160177455 | Single Solution for Electro-Electroless Deposition of Metals | 06-23-2016 |