Entries |
Document | Title | Date |
20090057151 | Detection of additive breakdown products in acid copper plating baths - An additive breakdown product in an acid copper plating bath sample is detected by performing a voltammetric analysis for the leveler additive in two measurement solutions comprising different volume fractions of the copper plating bath sample in a background electrolyte. When the plating bath sample contains a substantial concentration of the additive breakdown product, the analyses for the first and second measurement solutions indicate different concentrations for the leveler additive in the plating bath sample. A comparison of the leveler additive concentrations indicated by the two analyses provides a measure of the concentration of the additive breakdown product. | 03-05-2009 |
20090057152 | Two-dimensional control of electrochemical surface potentials - A method for providing a two dimensional spatially varying surface potential on a surface of a conductive substrate and use thereof. The method comprises providing a conductive substrate having a first conductive surface and comprising an array of“n” electrical potential contact points spatially arranged in two dimensions on the first conductive surface, wherein “n” is at least 3. An electrical potential is then applied to each of the “n” electrical contact points, wherein the electrical potentials applied to at least two of the “n” electrical potential contact points are different. Also disclosed are methods and applications for use of the methods disclosed herein. | 03-05-2009 |
20090057153 | PROFILE CONTROL ON RING ANODE PLATING CHAMBERS FOR MULTI-STEP RECIPES - The present disclosure generally addresses the problem of controlling a plating profile in multi-step recipes and addresses, in particular, the problem of compensating for variations of the plating tool state to stabilize the plating results. The compensation is done by adjustments of corrections factors for currents of a plating tool in a multi-anode configuration. The described method enables control of recipes with different current ratios in each recipe step and models different deposition sensitivities in each recipe step. Generally, the method of the present disclosure requires a measurement step, where the tool state is determined, and a data processing step, where the correction factors are set based on models describing the plating process and the tool sate. | 03-05-2009 |
20090065362 | Chloride analysis in acid copper plating baths - The chloride concentration in an acid copper plating bath is determined from the chloride oxidation current measured under controlled hydrodynamic conditions at a noble metal electrode using specific voltammetric parameters. The measurement is made directly on the undiluted plating bath so that the chloride measurement is fast and no waste stream is generated. | 03-12-2009 |
20090183991 | CORROSION DETECTION METHOD AND MONITORING PATTERN USED THEREIN - A corrosion detection method detects galvanic corrosion occurring in a heterogeneous metal layer using a forming step and an observing step. The forming step is the step of forming the heterogeneous metal layer and a monitoring pattern by electrolytic plating a plurality of types of metal layers on a substrate. The observing step is the step of observing a surface of the monitoring pattern from above. The monitoring pattern has an identical structure of the heterogeneous metal layer. The monitoring pattern is in an area different from an area in which the heterogeneous layer is formed on the substrate. | 07-23-2009 |
20090200171 | ELECTROCHEMICAL SENSING AND DATA ANALYSIS SYSTEM, APPARATUS AND METHOD FOR METAL PLATING - An electrochemical sensing and data analysis system (and apparatus and methods) adapted for control of electroplating of various metal(s) on a wafer or other suitable substrate. Components of the system utilize multi-variate analysis (MVA) and galvanostatic, potentiodynamic or other electrical measurements (or combinations thereof) to predict, adjust or control plating parameters, e.g., to achieve improved yield of plated substrates with acceptable levels of defects (or lack thereof). | 08-13-2009 |
20090205964 | ELECTROCHEMICAL SAMPLING HEAD OR ARRAY OF SAME - A sampling head, and/or an array including same for use in electrochemical deposition of various metal(s) on wafers or other substrates suitable for use in microelectronic devices or components thereof. | 08-20-2009 |
20090250350 | DETECTION DEVICE AND METHOD OF ANODIC OXIDE FILM - A device for detecting an anodic oxide film during an anodic oxidation treatment includes a container receiving an electrolyte therein, an aluminum sheet immersed in the electrolyte, a power source supplying a current to the aluminum sheet to form an anodic oxide film on the aluminum sheet, a data acquisition unit measuring a potential of the anodic oxide film at a time, a data processor unit calculating a differential value of the potential, and a display unit displaying a differential curve generated according to the differential values of the potentials at different times. The quality of the anodic oxide film can be judged by reading the shape of the differential curve. | 10-08-2009 |
20090308754 | FABRICATION OF FREESTANDING MICRO HOLLOW TUBES BY TEMPLATE-FREE LOCALIZED ELECTROCHEMICAL DEPOSITION - The present invention provides a method of fabricating a micro hollow tube, more specifically, a method of fabricating a micro hollow tube by template-free localized electrochemical deposition, in which the micro hollow tube is fabricated by the accurate control of the distribution of the electric field strength during deposition with precise interplay of the applied voltage and the distance between the microelectrode and the grown structure. | 12-17-2009 |
20100032302 | METHOD TO DIRECT PATTERN METALS ON A SUBSTRATE - A microscopic metallic structure is produced by creating or exposing a patterned region of increased conductivity and then forming a conductor on the region using electrodeposition. In some embodiments, a microscopic metallic structure is formed on a substrate, and then the substrate is etched to remove the structure from the substrate. In some embodiments, a focused beam of gallium ion without a deposition precursor gas scans a pattern on a silicon substrate, to produce a conductive pattern on which a copper structure is then formed by electrochemical deposition of one or more metals. The structure can be freed from the substrate by etching, or can used in place. A beam can be used to access an active layer of a transistor, and then a conductor can be electrodeposited to provide a lead for sensing or modifying the transistor operation while it is functioning. | 02-11-2010 |
20100038251 | CARBON NANOTUBE NETWORK-BASED NANO-COMPOSITES - Techniques for manufacturing carbon nanotube network-based nano-composites are provided. In some embodiments, a nano-composite manufacturing method includes forming a carbon nanotube (CNT) network, immersing the CNT network into an electroplating solution, applying electrical energy, and relaying the electrical energy flow to produce a nano-composite having uniform conductive bridges on the CNT network. | 02-18-2010 |
20100059384 | Electrodeposition method with analysis of the electrolytic bath by solid Phase Extraction - A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous. | 03-11-2010 |
20100147694 | METHOD AND APPARATUS FOR EVALUATION OF COATED PARTS - A method of verifying performance of a coated part includes calculating a deflection value as a function of a predetermined strain threshold value and a total thickness of a test coupon that comprises a coating on a substrate. The coating of the test coupon is co-deposited in a deposition process for producing a coated part. The test coupon is bent in an amount equal to the calculated deflection value and then evaluated as an indication of whether a mechanical characteristic of the coated part meets a specified level. | 06-17-2010 |
20100147695 | Multi-cell Masks and Methods and Apparatus for Using Such Masks To Form Three-Dimensional Structures - Multilayer structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. Selectivity of deposition is obtained via a multi-cell controllable mask. Alternatively, net selective deposition is obtained via a blanket deposition and a selective removal of material via a multi-cell mask. Individual cells of the mask may contain electrodes comprising depositable material or electrodes capable of receiving etched material from a substrate. Alternatively, individual cells may include passages that allow or inhibit ion flow between a substrate and an external electrode and that include electrodes or other control elements that can be used to selectively allow or inhibit ion flow and thus inhibit significant deposition or etching. Single cell masks having a cell size that is smaller or equal to the desired deposition resolution may also be used to form structures. | 06-17-2010 |
20100155251 | HARD ANODIZE OF COLD SPRAY ALUMINUM LAYER - A process for repairing components includes the steps of providing a component having an affected area on a surface of a component to be repaired; depositing a repair material over the affected area on the surface of the component so that the repair material plastically deforms without melting and bonds to the affected area upon impact with the affected area and thereby covers the affected area; providing a sulfuric acid based anodizing solution; anodizing a deposited repair material on the surface of said component in the sulfuric acid based anodizing solution; consuming only a portion of the deposited repair material to form a hard anodized coating layer upon the deposited repair material to form a hard anodized coated component; providing a corrosion resistant sealant solution; and contacting a hard anodized coated component with the corrosion resistant sealant solution to form a corrosion resistant sealant coating on the hard anodized coated component. | 06-24-2010 |
20100206736 | METHOD FOR ANALYZING METALLIC MATERIAL - A method for analyzing a metallic material includes the steps of electrolyzing a metal sample in an electrolyte; removing the electrolyzed metal sample from the electrolyte; immersing the metal sample removed from the electrolyte into a dispersive solution that is different from the electrolyte to separate at least one selected from the group consisting of a precipitate and an inclusion deposited on the metal sample; and analyzing the at least one selected from the group consisting of a precipitate and an inclusion extracted into the dispersive solution. | 08-19-2010 |
20100219078 | PLATING APPARATUS AND PLATING METHOD - A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section. | 09-02-2010 |
20100300886 | CONTINUOUS MICRO ANODE GUIDED ELECTROPLATING DEVICE AND METHOD THEREOF - A continuous micro anode guided electroplating device and a method thereof are revealed. By real-time image monitoring and capillary action of the micro/nanoscale tube, a three-dimensional microstructure is deposited on a workpiece at the cathode. The deposit is growing smoothly under the real-time image monitoring. Moreover, the workpiece is not immersed in an electrolyte so that contaminations of the workpiece caused by electrolyte are reduced. | 12-02-2010 |
20110011743 | LOW POWER RF TUNING USING OPTICAL AND NON-REFLECTED POWER METHODS - Aspects of the present invention include methods and apparatuses that may be used for monitoring and adjusting plasma in a substrate processing system by using a plasma data monitoring assembly. In one embodiment, an apparatus for monitoring a plasma in a substrate processing system is provided. The apparatus includes a plasma chamber having a plurality of walls, at least one of the plurality of walls having a dielectric ceiling, at least one inner coil element and at least one outer coil element disposed outside the chamber, a current sensor coupled to one of the inner coil element or the outer coil element, the current sensor adapted to detect current from an inductively coupled plasma generated in the plasma chamber, an RF power source, and one or more adjustable capacitors coupled to each of the one or more coil elements. | 01-20-2011 |
20110094888 | Rejuvenation method for ruthenium plating seed - A method of rejuvenating a Ru plating seed layer during write pole fabrication in a PMR head is disclosed that involves forming an opening in a mold forming layer. A Ru seed layer is deposited by CVD within the opening and on a top surface of the mold forming layer. The substrate with the Ru seed layer is immersed in an acidic solution and an electric potential is applied for 1 to 2 minutes such that hydrogen is generated to reduce ruthenium oxides to Ru metal on the seed layer surface in an activation step. One or more surfactants are used to improve wettability of the Ru layer. The substrate is transferred directly to an electroplating solution without drying following the activation step to minimize exposure to oxygen that could regenerate oxides on the surface of the Ru layer. As a result, write pole voids and delamination are significantly reduced. | 04-28-2011 |
20110180411 | PLATING APPARATUS AND WIRE INSPECTION METHOD OF THE SAME - When a controller turns on a relay, a closed circuit constituted by a power supply device, a wire, a resistance, a relay and wires is formed. This causes a current to flow through the closed circuit. The power supply device performs constant current control. The controller compares a measured voltage value output from a voltage detecting circuit with a preset reference voltage value. In the case of no connection failure of the wire, the measured voltage value substantially equals to the reference voltage value. In the case of connection failure of the wire, the measured voltage value is larger than the reference voltage value. | 07-28-2011 |
20110203935 | APPARATUS FOR DETECTING PATTERN ALIGNMENT ERROR - An apparatus for detecting pattern alignment error includes a first conductive pattern disposed over a first insulation member with a power source applied of the first conductive pattern; a second insulation member for covering the first conductive pattern; a second conductive pattern disposed on the second insulation member; a conductive via connected to the second conductive pattern and passing through the second insulation member; and an insulation pattern disposed in the first conductive pattern for detecting an alignment error in response to a position of the conductive via. The apparatus for detecting pattern alignment error can detect the alignment of lower wiring in a device with multi-layer wiring | 08-25-2011 |
20110240477 | METHOD FOR ANALYZING METAL MATERIAL - A method for analyzing a metal material includes electrolyzing a metal sample in an electrolytic solution, immersing a remaining portion of the metal sample taken out of the electrolytic solution in a dispersible solution to separate at least one substance selected from the group consisting of precipitates and inclusions attached to the remaining portion of the metal sample, filtering the dispersible solution containing the at least one separated substance through filters having straight pores and a porosity of 4% or more to obtain residues trapped on the filters and filtrates, and analyzing at least one of the residues and the filtrates. | 10-06-2011 |
20110266154 | Analysis of an auxiliary leveler additive in an acid copper plating bath - An auxiliary leveler additive that cannot be analyzed by conventional CVS methods for acid copper plating baths is analyzed by cyclic voltammetry at a platinum rotating disk electrode from its effect on the anodic current at very positive potentials. | 11-03-2011 |
20110290651 | ELECTRODEPOSITION BATHS, SYSTEMS AND METHODS - Electrodeposition baths, systems and methods are provided. In some embodiments, the baths, systems and methods are used to deposit metal alloy coatings. | 12-01-2011 |
20110315554 | Satin nickel electroplating techniques that include homogenization units - Certain example embodiments of this invention relate to improved electroplating techniques. More particularly, certain example embodiments of this invention relate to electroplating techniques that incorporate a homogenization unit to help maintain an emulsion within an electrolyte solution (e.g., a nickel electrolyte solution) used in creating a finish (e.g., a satin nickel finish) in an electroplating process. By varying the operational characteristics of the unit (including, for example, pressure, velocity, pore size, ultrasound wave frequency, sonication time, etc.), it becomes possible to control the emulsion particle size distribution so as, for example, increase or decrease the diameter of such particles and thereby resulting in a deposit with a desired surface topography. It will be appreciated that the variations in size will cause variation in surface topography which, in turn, will change the surface appearance. | 12-29-2011 |
20120043213 | ELECTRODEPOSITION BATHS, SYSTEMS AND METHODS - Electrodeposition baths, systems and methods are provided. In some embodiments, the baths, systems and methods are used to deposit metal alloy coatings. | 02-23-2012 |
20120181179 | METHOD OF ELECTROCHEMICAL MACHINING - The invention relates to the metalworking field, particularly to electrochemical sizing machining, and can be used for manufacturing of machine workpieces having an intricate profile and shaping furniture from chromium-containing steels and alloys operating in aggressive environment under excessive friction. | 07-19-2012 |
20120273361 | CONTROL OF ELECTROMAGNETIC SIGNALS OF COINS THROUGH MULTI-PLY PLATING TECHNOLOGY - The present invention relates to novel metallic composites that are useful as coinage materials. These composites are produced through a multi-ply plating process and are designed to overcome difficulties associated with calibrating vending machines that can result in fraud. In one embodiment, the metallic composite comprises a steel core over which nickel and then a non-magnetic metal such as copper, brass or bronze is deposited as a layered pair. The magnetic and non-magnetic metals may also be applied in the reverse order, with the copper, brass or bronze applied directly over the steel and then covered by the nickel. The electromagnetic signature (EMS) of the composite is controlled by defining the thickness of the deposited metal layers. Advantageously, the invention overcomes problems associated when different coins are made from the same alloy and have similar sizes, and therefore cannot be distinguished by vending machines. | 11-01-2012 |
20120305402 | Process for Continuous Coating Deposition and an Apparatus for Carrying Out the Process - A process for forming coatings on metallic web, the process including: immersing at least three metallic webs in an electrolytic solution contained in a reaction chamber; passing wave multiphase alternating current across said metallic webs by using back-to-back thyristors connected in parallel; moving the metallic webs through the electrolytic solution; and removing the coated webs from the reaction chamber. | 12-06-2012 |
20130056358 | DROPLET BILAYER FORMATION USING THROUGHPUT LIQUID HANDLING TECHNIQUES - The invention relates to methods and devices for forming and measuring lipid bilayers, for example, by joining lipid monolayers that self-assemble at the interface of aqueous and organic phases using sessile aqueous droplets in contact with a measurement electrode. At least one of the aqueous solution, the lower aqueous phase, and/or the upper organic phase comprise lipids. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention. | 03-07-2013 |
20130075263 | METHOD FOR REFURBISHING PtAl COATING TO TURBINE HARDWARE REMOVED FROM SERVICE - A method of repairing damaged airfoils. The method comprises the steps of stripping thermal barrier coatings from the airfoil. After the coatings are removed, cracks are removed from the airfoil. Cracks that appear in the bond coat area over the airfoil fillet portion are removed by locally grit blasting the fillet portion of the airfoil. This operation also results in locally removing the bond coating from the fillet portion. Cracks and other damage sustained by the airfoil tip are removed and replaced by welding superalloy material. The airfoil then may be cleaned by thermal etching. The airfoil is then placed in a plating tool permitting preferential plating of airfoil areas from which plating has been removed. After plating, the airfoil is then heat treated to diffuse the platinum coating with the superalloy substrate materials. The diffusion heat treated airfoil is aluminided by any aluminiding process, forming a PtAl coating. | 03-28-2013 |
20130153430 | ELECTRODEPOSITION BATHS, SYSTEMS AND METHODS - Electrodeposition baths, systems and methods are provided. In some embodiments, the baths, systems and methods are used to deposit metal alloy coatings. | 06-20-2013 |
20130206601 | METHOD FOR MANUFACTURING ANODIZED ALUMINA, AND DEVICE AND METHOD FOR INSPECTING THE SAME - The present invention relates to a method of manufacturing an article having a fine concave-convex structure on a surface thereof, the structure having pores in which a pore interval is less than or equal to a wavelength of visible light, including: irradiating a surface of the article having the fine concave-convex structure on the surface, with light from an illumination device; capturing an image of reflected light from the surface of the article having the fine concave-convex structure on the surface using imaging device; acquiring color information from an image captured by the imaging device; and inspecting the article having the fine concave-convex structure based on the color information. According to the present invention, it is possible to easily inspect the depth of the pores of anodized alumina and the pitch between the pores, and to provide a method of manufacturing anodized alumina having a stable pore shape. | 08-15-2013 |
20130213813 | Color Control of Trivalent Chromium Deposits - A method of adjusting and controlling the color of trivalent chromium deposits is provided. The method includes the steps of: (a) measuring the color of a trivalent chromium deposit standard; (b) adding one or more color enhancing additives to a trivalent chromium electrolyte; (c) contacting the substrate with the trivalent chromium electrolyte containing the one or more color enhancing additives to deposit trivalent chromium on the substrate; (d) measuring the color of the color-enhanced trivalent chromium deposit; (e) comparing the color of the color-enhanced chromium deposit to that of the standard; and (f) if necessary, adjusting the amount of the one or more color enhancing additives added to the trivalent chromium electrolyte if the color of the color-enhanced chromium deposit is outside of a desired optical variation from that of the standard color-enhanced chromium deposit. The color of the trivalent chromium deposit may be measured using a spectrophotometer. | 08-22-2013 |
20130213814 | FILM INSPECTION METHOD - A method for forming a defect marker on a thin film of a photovoltaic device by plating to detect pinholes and/or electrical shunts during device fabrication is disclosed. Also disclosed is a system for implementing such a method. | 08-22-2013 |
20130220818 | Complex Alloy Electroplating Method - One embodiment is for the close agitation of electroplating solution substantially near an electrode in an electroplating cell. The agitation occurs within the Nernst diffusion layer allowing for ion replenishment of the electroplating solution at the working electrode face. The system operates by producing a flat agitation face ( | 08-29-2013 |
20130292254 | METHODS AND APPARATUSES FOR CLEANING ELECTROPLATING SUBSTRATE HOLDERS - Disclosed herein are methods of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated in prior electroplating operations. The methods may include orienting a nozzle such that it is pointed substantially at the inner circular edge of the lipseal and/or cup bottom, and dispensing a stream of cleaning solution from the nozzle such that the stream contacts the inner circular edge of the lipseal and/or cup bottom while they are being rotated, removing metal deposits. In some embodiments, the stream has a velocity component against the rotational direction of the lipseal and/or cup bottom. In some embodiments, the deposits may include a tin/silver alloy. Also disclosed herein are cleaning apparatuses for mounting in electroplating devices and for removing electroplated metal deposits from their lipseals and/or cup bottoms. In some embodiments, the cleaning apparatuses may include a jet nozzle. | 11-07-2013 |
20130306483 | PLATING APPARATUS AND PLATING SOLUTION MANAGEMENT METHOD - A plating apparatus plates a substrate with Sn alloy to form an Sn alloy film on a surface of the substrate. The apparatus includes: a plating bath for retaining a plating solution therein, the substrate being immersed in the plating solution in a position opposite to an insoluble anode; a plating solution dialysis line for extracting the plating solution from the plating bath and returning the plating solution to the plating bath; a dialysis cell provided in the plating solution dialysis line and configured to remove a free acid from the plating solution by dialysis using an anion exchange membrane; a free acid concentration analyzer; and a controller for controlling a flow rate of the plating solution flowing through the plating solution dialysis line based on the concentration of the free acid measured by the free acid concentration analyzer. | 11-21-2013 |
20130319869 | Metal Treatment - In a process for anodising a metal object ( | 12-05-2013 |
20130341196 | REFINING PROCESS FOR PRODUCING LOW ALPHA TIN - A method for purifying tin includes exposing an electrolytic solution comprising tin to an ion exchange resin and depositing electrorefined tin from the electrolytic solution. The deposited electrorefined tin has alpha particle emissions of less than about 0.01 counts/hour/cm | 12-26-2013 |
20140069815 | ELECTROCHEMICAL DEPOSITION AND SPECTROSCOPIC ANALYSIS METHODS AND APPARATUS USING DIAMOND ELECTRODES - A method of analysing chemical species in a solution, the method comprising: providing an electrochemical deposition apparatus comprising a first electrode ( | 03-13-2014 |
20140262794 | ELECTROCHEMICAL DEPOSITION PROCESSES FOR SEMICONDUCTOR WAFERS - A method for electroplating a wafer detects plating bath failure based on a voltage change. The method is useful in plating wafers having TSV features. Voltage of each anode of a plating processor may be monitored. An abrupt drop in voltage signals a bath failure resulting from conversion of an accelerator such as SPS to it's by products MPS. Bath failure is delayed or avoided by current pulsing or current ramping. An improved plating bath has a catholyte with a very low acid concentration. | 09-18-2014 |
20140311912 | FLOW SENSORS WITH MODULAR MICROFLUIDIC CHANNELS AND METHODS OF MANUFACTURE - Modular microfluidic channel structures for conducting liquid from a reservoir include a sensor for monitoring a parameter (such as flow rate or pressure) relating to liquid flowing therethrough. The microfluidic channel generally comprises a thermally insulating substrate made of one or more materials such as, e.g., glass, fused silica, parylene, and/or silicone. | 10-23-2014 |
20160377573 | ELECTROLYTIC COPPER PLATING SOLUTION ANALYZER, AND ELECTROLYTIC COPPER PLATING SOLUTION ANALYSIS METHOD - An electrolytic copper plating solution analyzer comprises an analysis container for accommodating a part of an electrolytic copper plating solution containing additives including a promoter, an inhibitor and a leveler, a working electrode immersed in the electrolytic copper plating solution accommodated in the analysis container, a reference electrode immersed in the electrolytic copper plating solution and used as a reference when a potential of the working electrode is determined, a counter electrode immersed in the electrolytic copper plating solution, a rotation drive unit for rotating the working electrode at a given speed, a current generation unit passing an electric current with a given current density between the working electrode and the counter electrode, a potential measurement unit for measuring the potential between the working electrode and the reference electrode, and an analysis unit for analyzing the relationship between an elapsed time after the current passage and the potential. | 12-29-2016 |
20190145018 | CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS | 05-16-2019 |