Class / Patent application number | Description | Number of patent applications / Date published |
204298090 | Specified cooling or heating | 36 |
20090084676 | Heating-pressurizing zig for manufacturing 5-layer MEA - The present invention provides a heating-pressurizing jig for manufacturing a 5-layer membrane electrode assembly (MEA), in which: metal plates are formed integrally with heating plates to obviate the difficulty in increasing the temperature of the metal plates to a normal state every time when manufacturing a plurality of 5-layer MEAs; an MEA is mounted to external guides while being spaced apart from lower guides at predetermined intervals to prevent the MEA from being dried, contracted and deformed by the heated metal plates; and the lower guides and upper plate supports are elastically supported by springs, respectively, so that the external guides can respond in real time to the change in the thickness caused when upper and lower gas diffusion layers are compressed, thus preventing the MEA from being bent. | 04-02-2009 |
20090114534 | Sputtering Assembly - Methods and devices are provided for improved sputtering systems. In one embodiment of the present invention, a sputtering system for use with a substrate is provided. The system comprises of a sputtering chamber; at least one magnetron disposed in the chamber; and at least one, non-convection based cooling system in the sputtering chamber. This system may optionally use at least one chilled roller positioned along the path of the substrate. This chilled roller may be in the sputtering chamber or optionally, outside the sputtering chamber. This system may optionally include at least one emissivity based cooling apparatus located within the chamber for drawing heat away from the substrate. In another embodiment the present invention, the sputtering system may use a non-convection, non-conduction system for cooling the substrate. The system may use a non-contact cooling system that is spaced apart from the substrate. This system may optionally include at least one emissivity based cooling apparatus located within the chamber for drawing heat away from the substrate. Optionally, outside the sputtering chamber, at least one chilled roller positioned along the path of the substrate to further cool the substrate. | 05-07-2009 |
20090134019 | COOLED BACKING PLATE FOR A SPUTTERING TARGET, AND SPUTTERING TARGET COMPRISING A PLURALITY OF BACKING PLATES - Claimed is a sputtering target system comprising a plurality of backing plates to be individually cooled. Each backing plate is provided on its back side with a meandering groove that is closed off by a sealing plate. The sealing plate is welded around its circumference to the backing plate and at the same time is welded to at least one ridge located at a distance from the frame, which separates two grooved sections from one another. The sealing plate thus welded to the backing plate not only closes off the grooves to form a cooling channel, but also is used for reinforcement of the otherwise relatively flat backing plate. | 05-28-2009 |
20100243437 | RESEARCH-SCALE, CADMIUM TELLURIDE (CDTE) DEVICE DEVELOPMENT PLATFORM - An apparatus for dry deposition of thin films of cadmium telluride and other material layers required for a photovoltaic device. The apparatus includes a vacuum deposition chamber. A preheat station and source container are provided in the chamber, and the source container and material therein are heated to a deposition temperature. An integral shutter is placed in the chamber, and the shutter includes a planar body with a carrier receiver extending out from one end shaped as a two-prong fork or a closed loop. The shutter is positioned with the receiver and a received carrier in the preheat station and the body covering the source container outlet. The preheat station heats the carrier and sample to avoid thermal shock during deposition. The shutter is then positioned with the body moved from the source container outlet and the carrier receiver positioned to expose a sample surface to the deposition material. | 09-30-2010 |
20100294655 | RADIOISOTOPE PRODUCTION O-18 WATER TARGET HAVING IMPROVED COOLING PERFORMANCE - A target apparatus for producing a radioisotope having improved cooling performance including a cavity member including a cavity accommodating H | 11-25-2010 |
20110031116 | MAGNETRON SPUTTERING TARGET ASSEMBLY AND COATING APPARATUS HAVING SAME - A coating apparatus includes a shielding casing defining a chamber, a substrate holder received in the chamber and a target assembly located inside the shielding casing. The substrate holder is configured to hold a substrate. The target assembly faces the substrate. The target assembly includes a target frame, two opposite target electrodes, a number of magnetrons and a transport unit. The target base includes two opposite end surfaces and a number of side surfaces interconnecting the end surfaces. The two opposite target electrodes are fixed on the two opposite side surfaces. The magnetrons are received in the receiving cavity and disposed between the target electrodes. The transport unit is configured to carry the magnetrons to circulate therearound. | 02-10-2011 |
20110073471 | METHOD AND APPARATUS FOR CATHODIC ARC ION PLASMA DEPOSITION - A method and apparatus for depositing a coating material on a surface of a substrate by an ion plasma deposition process using a hollow cathode is disclosed. The cathode may be a substantially cylindrical hollow cathode. A plasma arc is formed on the outer circumference of the cathode to remove coating material from the cathode, which is then deposited on a surface of a substrate. An internal arc drive magnet is contained within the hollow bore of the cathode and cooling is provided to the magnet during operation. | 03-31-2011 |
20110132755 | IN-LINE SYSTEM FOR MANUFACTURING SOLAR CELL - An in-line system for manufacturing a solar cell is provided. The in-line system includes a substrate loading zone for inputting a substrate, a deposition part for sequentially continuously depositing a light absorption layer on a top surface of the substrate, and a thermal processing part for thermally processing the substrate transferred from the deposition part. The substrate loading zone and the thermal processing part are sequentially installed in a partitioned internal space of one integration chamber. | 06-09-2011 |
20110155568 | INDEXING MAGNET ASSEMBLY FOR ROTARY SPUTTERING CATHODE - A magnet assembly for a rotary cathode having a rotatable target cylinder is provided. The magnet assembly comprises a coolant tube configured to be positioned within the target cylinder, and a magnet bar configured to be positioned within the target cylinder and extending substantially parallel to the coolant tube. The magnet bar moves laterally with respect to the target cylinder in a synchronous manner with rotation of the target cylinder. | 06-30-2011 |
20110155569 | COOLING SYSTEM - A cooling system that cools a wafer in a vacuum chamber of a sputtering apparatus, includes a wafer cooling stage for cooling the wafer, a cooling mechanism for cooling the wafer cooling stage, cooling gas supply units which introduces a cooling gas to the wafer cooling stage, a wafer rotating mechanism which holds the wafer in a state separated from the wafer cooling stage by a predetermined gap, and is rotated while holding the wafer, and a driving mechanism which rotates the wafer rotating mechanism at a predetermined rotational speed. | 06-30-2011 |
20110259738 | MAGNETRON SPUTTERING DEVICE - A magnetron sputtering device includes a holding compartment, a target assembly, a supporting base, and a rotation module. The holding compartment is divided to a reactive chamber and a receiving chamber. The target assembly includes two cooling plates, two magnetic units, and a target. The two cooling plates define a magnetron room communicating with the receiving chamber. The two magnetic units are suspended in the magnetron room. The target is attached on the cooling plate under the magnetic units. The supporting base is for supporting work-pieces. The rotation module is received in the receiving chamber, and jointed to the two magnetic units. The rotation module drives the magnetic units to spin about a central axis thereof and move back and forth along a direction lengthwise of the magnetic unit. | 10-27-2011 |
20110266144 | SPUTTERING APPARATUS - A sputtering apparatus for coating workpieces includes a preheating case defining a preheating cavity, a deposition case defining a deposition cavity, a bridge assembly connecting the preheating case to the deposition case, two supporting assemblies, posts for fixing the workpieces, and a transmission assembly positioned in the preheating case. The bridge assembly includes a bridge member defining a passage and a valve moveably connected to the bridge member. The valve communicates the preheating cavity with the deposition cavity through the passage or separates the preheating cavity from the deposition cavity. One supporting assembly is received in the preheating cavity, and the other supporting assembly is received in the deposition cavity. The transmission assembly removes the posts from one of the supporting assemblies and fixes the posts to the other supporting assembly. | 11-03-2011 |
20120031755 | DEPOSITION SYSTEM CAPABLE OF PROCESSING MULTIPLE ROLL-FED SUBSTRATES - A deposition system includes a chamber, a plurality of targets in a center region in the chamber and a plurality of substrates in the chamber. The targets are sequentially positioned when viewed in a first direction. At least one of the targets includes a sputtering surface facing outward. The substrates are sequentially positioned when viewed in the first direction. At least one of the substrates includes a deposition surface configured to receive material sputtered off the sputtering surface. | 02-09-2012 |
20120160670 | Target Cooling Device - The invention relates to a laser deposition device, comprising at least one target, a substrate arranged opposite of the at least one target and a laser for generating a laser beam, which beam is directed on the target, such that a plasma plume of target material is generated and is deposited onto the substrate, further comprising a base frame, a rotatable target frame with at least two target holders arranged in the base frame and at least one cooling device arranged to the base frame, which cooling device can be moved relative to the target frame to bring the cooling device in heat exchanging contact with the target frame. | 06-28-2012 |
20130001077 | NON-ADHESIVE SPUTTERING STRUCTURE INCLUDING A SPUTTERING TARGET AND BACKING PLATE - A non-adhesive sputtering structure includes a sputtering target having a plate shape; and a backing plate having a plate shape. The backing plate faces the sputtering target, and facing surfaces of the sputtering target and the backing plate are in contact with each other. The backing plate includes a body having a longitudinal axis; and a cooling member through which a cooling material flows in a longitudinal direction of the body substantially parallel to the longitudinal axis. The cooling material conducts heat generated from the sputtering target from sputtering to outside the backing plate. The non-adhesive sputtering structure further includes a plurality of non-adhesive fastening members which maintain the facing surfaces of the backing plate and the sputtering target in contact with each other. The non-adhesive fastening members are extended through a thickness of the backing plate and correspond to regions of the backing plate excluding the cooling member. | 01-03-2013 |
20130037406 | Sputtering apparatus - A sputtering device for depositing a deposition material from a deposition source to a deposition target, wherein a sputtering pressure between the deposition source and the deposition target is from about 6.70×10 | 02-14-2013 |
20130270107 | OFF-ANGLED HEATING OF THE UNDERSIDE OF A SUBSTRATE USING A LAMP ASSEMBLY - Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a thermal process on a substrate. The chamber has an annular radiant source disposed between a processing location and a transportation location of the chamber. Lift pins have length sufficient to maintain the substrate at the processing location while the substrate support is lowered below the radiant source plane to afford radiant heating of the substrate. A method of processing a substrate having apertures formed in a first surface thereof includes depositing material on the first surface in the apertures and reflowing the material by heating a second surface of the substrate opposite the first surface. A second material can then be deposited, filling the apertures partly or completely. Alternately, a cyclical deposition/reflow process may be performed. | 10-17-2013 |
20140027275 | ADAPTER OF SPUTTERING CHAMBER - The adapter used in the sputtering chamber or the sputtering tool is provided. The adapter body of the adapter has a central hole and at least one cooling channel embedded therein. The cooling channel circulates the adapter body with a fluid flowing therein, and the cooling channel is set surrounding the central hole and is located between a border of the adapter body and the central hole. The adapter having the cooling channel improves the cooling efficiency of the heater as well as the yield of the sputtering chamber. | 01-30-2014 |
20140061039 | TARGET COOLING FOR PHYSICAL VAPOR DEPOSITION (PVD) PROCESSING SYSTEMS - Target assemblies for use in a substrate processing system are provided herein. In some embodiments, a target assembly for use in a substrate processing system may include a source material to be deposited on a substrate, a first backing plate configured to support the source material on a front side of the first backing plate, such that a front surface of the source material opposes the substrate when present, a second backing plate coupled to a backside of the first backing plate, and a plurality of sets of channels disposed between the first and second back plates. These channels permit a coolant to be provided closer to the heat source (target face) thereby facilitating more efficient heat removal from the target. More efficient heat removal from the target results in a target with a lesser thermal gradient and therefore less mechanical bowing/deformation. | 03-06-2014 |
20140138242 | LITHIUM SPUTTER TARGETS - Described are methods of fabricating lithium sputter targets, lithium sputter targets, associated handling apparatus, and sputter methods including lithium targets. Various embodiments address adhesion of the lithium metal target to a support structure, avoiding and/or removing passivating coatings formed on the lithium target, uniformity of the lithium target as well as efficient cooling of lithium during sputtering. Target configurations used to compensate for non-uniformities in sputter plasma are described. Modular format lithium tiles and methods of fabrication are described. Rotary lithium sputter targets are also described. | 05-22-2014 |
20140174918 | Sputter Gun - A sputter gun is provided. The sputter gun includes a target and a first plate coupled to a surface of the target. A first magnet is disposed over a second magnet. A second plate coupled to a surface of the first magnet and a gap is defined between a surface of the second magnet and a surface of the first plate. A fluid inlet and a fluid outlet are disposed above a surface of the first magnet. A restriction bar is coupled to the second plate, wherein the restriction bar is configured to prevent a flow path of fluid through the first inlet to the second inlet unless the fluid traverses the gap defined between a surface of the second magnet and a surface of the first plate. Alternative configurations of the sputter gun are included. | 06-26-2014 |
20140174919 | ELECTRODE HAVING HEAT SINKS AND COATING DEVICE - An electrode is made of conductive material, and includes a first surface, a second surface, and two opposite side surfaces. The second surface is opposite to the first surface. The two side surfaces are connected to the first surface and the second surface. A number of heat sinks are positioned on the second surface and the two first side surfaces, and are configured for exhausting heat generated by the electrode. | 06-26-2014 |
20140174920 | EVAPORATION SOURCE - Evaporation source, in particular for use in a sputtering process or in a vacuum arc evaporation process, preferably a cathode vacuum arc evaporation process. The evaporation source includes an inner base body which is arranged in an outer carrier body and which is arranged with respect to the outer carrier body such that a cooling space in flow communication with an inlet and an outlet is formed between the base body and the carrier body. In accordance with the invention, the cooling space includes an inflow space and an outflow space, and the inflow space is in flow communication with the outflow space via an overflow connection for the cooling of the evaporation source such that a cooling fluid can be conveyed from the inlet via the inflow space the overflow connection and the outflow space to the outlet. | 06-26-2014 |
20140246313 | IN-SITU SPUTTERING APPARATUS - A sputtering apparatus that includes at least a target presented as an inner surface of a confinement structure, the inner surface of the confinement structure is preferably an internal wall of a circular tube. A cathode is disposed adjacent the internal wall of the circular tube. The cathode preferably provides a hollow core, within which a magnetron is disposed. Preferably, an actuator is attached to the magnetron, wherein a position of the magnetron within the hollow core is altered upon activation of the actuator. Additionally, a carriage supporting the cathode and communicating with the target is preferably provided, and a cable bundle interacting with the cathode and linked to a cable bundle take up mechanism provided power and coolant to the cathode, magnetron, actuator and an anode of the sputtering apparatus. | 09-04-2014 |
20140291145 | VACUUM PROCESSING APPARATUS - A vacuum processing apparatus includes a substrate holder which can tilt relative to a target and includes a refrigerating machine which cools a substrate, hoses which transport a refrigerant between a compressor provided outside a vacuum vessel and a cooling device inside the substrate holder, and a housing unit which is provided outside the vacuum vessel and houses the hoses in a coiled state with a curvature radius that does not exceed a predetermined curvature radius. | 10-02-2014 |
20150008120 | IN-VACUUM ROTATIONAL DEVICE - This invention relates to the in-vacuum rotational device on a cylindrical magnetron sputtering source where the target or target elements of the target construction of such device are enabled to rotate without the need of a vacuum to atmosphere or vacuum to coolant dynamic seal. This invention relates to the use of the device in vacuum plasma technology where a plasma discharge, or any other appropriate source of energy such as arcs, laser, which can be applied to the target or in its vicinity would produce suitable coating deposition or plasma treatment on components of different nature. This invention also relates but not exclusively to the use of the device in sputtering, magnetron sputtering, arc, plasma polymerisation, laser ablation and plasma etching. This invention also relates to the use of such devices and control during non-reactive and reactive processes, with or without feedback plasma process control. This invention also relates to the arrangement of these devices as a singularity or a plurality of units. This invention also relates to the target construction which can be used in such device. This invention also relates to the use of these devices in different power modes such as DC, DC pulsed, RF, AC, AC dual, HIPIMS, or any other powering mode in order to generate a plasma, such as sputtering plasma, plasma arc, electron beam evaporation, plasma polymerization plasma, plasma treatment or any other plasma generated for the purpose of a process, for example, and not exclusively, as deposition process or surface treatment process, etc. | 01-08-2015 |
20150075980 | EXTENDED DARK SPACE SHIELD - Apparatus for physical vapor deposition are provided. In some embodiments, an apparatus for use in a physical vapor deposition substrate processing chamber includes a process shield having a central opening passing through a body of the process shield and defining a processing volume of the substrate processing chamber, wherein the process shield comprises an annular dark space shield fabricated from a ceramic material and an annular ground shield fabricated from a conductive material, and wherein a ratio of a length of the annular dark space shield to a length of the annular ground shield is about 2:1 to about 1.6:1. | 03-19-2015 |
20150129420 | Substrate Processing System with a Damage Preventing Function - Disclosed is a substrate processing system with a damage preventing function, comprising: a fluid tank which stores fluid; a chamber which receives the fluid from the fluid tank and provides a space where a substrate is processed; a pipe which connects the fluid tank and the chamber and through which the fluid flows; and a damage preventing unit which allows the fluid tank to be changed in position corresponding to thermal expansion caused in the pipe by receiving heat as the fluid flows in the pipe. | 05-14-2015 |
20150348764 | ROTATING DISK CARRIER WITH PBN HEATER - Various embodiments provide a substrate carrier configured to rotatably carry at least one substrate through a plurality of processing stations. The substrate carrier includes an integrated heater for heating a first side of the substrate while the second side of the substrate undergoes one or more manufacturing processes at each of the plurality of processing stations, e.g., to promote the desired growth of HAMR media. This can result in the elimination of one or more processing stations, thereby realizing cost savings, decreased substrate processing time, as well as a reduced area within which a substrate processing system can be implemented. | 12-03-2015 |
20150368790 | DISPLAY APPARATUS MANUFACTURING APPARATUS - A thin film encapsulation manufacturing apparatus includes a first cluster configured to form a first inorganic layer on a first substrate, on which an emission unit is formed, by a sputtering process; a second cluster configured to form a first organic layer on the first inorganic layer on the first substrate conveyed from the first cluster by an organic deposition process; a first connection module configured to connect the first cluster and the second cluster, configured to convey the first substrate on which the first inorganic layer is formed from the first cluster to the second cluster, and configured to cool the first substrate in a non-contact manner; and a third cluster configured to form a second inorganic layer on the first organic layer on the first substrate conveyed from the second cluster by a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process. | 12-24-2015 |
20150380223 | HOLDING ASSEMBLY FOR SUBSTRATE PROCESSING CHAMBER - A holding assembly for retaining a deposition ring about a periphery of a substrate support in a substrate processing chamber, the deposition ring comprising a peripheral recessed pocket with a holding post. The holding assembly comprises a restraint beam capable of being attached to the substrate support, the restraint beam comprising two ends, and an anti-lift bracket. The anti-lift bracket comprises a block comprising a through-channel to receive an end of a restraint beam, and a retaining hoop attached to the block, the retaining hoop sized to slide over and encircle the holding post in the peripheral recessed pocket of the deposition ring. | 12-31-2015 |
20160064201 | SPUTTERING TARGET HAVING INCREASED POWER COMPATIBILITY - A plate-centering system that has a plate with a holder, in which the plate is centered in the holder both at room temperature and at higher temperatures, independently of the thermal expansion of the plate and the holder, and the plate can freely expand in the holder at higher temperatures. The invention relates in particular to a target having a frame-shaped target mount, which is very well suited for use in a coating source for high power pulsed magnetron sputtering of the target. | 03-03-2016 |
20160071706 | CENTERING OF A PLATE IN A HOLDER BOTH AT ROOM TEMPERATURES AND AT HIGHER TEMPERATURES - A system that has a plate with a holder, in which the plate is centered in the holder both at room temperatures and at higher temperatures, independently of the thermal expansion of the plate and the holder, and in which the plate can freely expand in the holder at higher temperatures. | 03-10-2016 |
20160071707 | PROCESSING APPARATUS - A processing apparatus includes a processing chamber, a rotatable mounting table, a cooling mechanism and a driving mechanism. A sputtering target is provided in the processing chamber. The rotatable mounting table is provided in the processing chamber and configured to mount thereon an object to be processed. The cooling mechanism is configured to cool the mounting table. The driving mechanism is configured to change a relative position of the mounting table with respect to the cooling mechanism. The driving mechanism changes a conductivity of heat from the mounting table to the cooling mechanism at least by switching a first state in which the mounting table and the cooling mechanism are separated from each other and a second state in which the mounting table and the cooling mechanism become close to each other. | 03-10-2016 |
20160172166 | TARGET, ADAPTED TO AN INDIRECT COOLING DEVICE, HAVING A COOLING PLATE | 06-16-2016 |
20160376697 | THIN SUBSTRATE PROCESSING DEVICE - A thin substrate processing device includes a substrate processing unit configured to process a thin substrate, and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate. | 12-29-2016 |