Class / Patent application number | Description | Number of patent applications / Date published |
204297010 | Electrode support or work holder | 38 |
20090065353 | Ionic foot bath array with ionic circulation - An ionic foot bath array for generating an ionic foot bath includes an upper rod support structure, at least one electrically non-conductive support structure leg depending downwards from the upper rod support structure and a plurality of generally cylindrical electrically conductive ionic rods each having the same diameter, the ionic rods being removably mounted and depending downwards from the upper rod support structure, each of the ionic rods extending generally parallel with one another in spaced-apart relationship in at least two generally parallel rows, the ionic rods having an intra-row spacing therebetween of no greater than two times the diameter of each ionic rod, the rows being spaced no greater than three times the diameter of each ionic rod, with at least one of the rows being positively charged and at least one of the rows being negatively charged. | 03-12-2009 |
20090107836 | Closed Contact Electroplating Cup Assembly - Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup. | 04-30-2009 |
20090139857 | Symmetrical double contact electro-winning - A symmetrical double-double contact mechanism for an electro-deposition mechanism. Using a base insulator, a cap block insulator is formed to support four series of electrodes of two different types (anode and cathode). Because of the contact mechanism employed, redundant contacts are provided so that should a short occur, alternative electrical pathways are available to maintain operation of the affected cathode or anode. | 06-04-2009 |
20090173624 | SET OF PARTS FOR POSITIONING ELECTRODES IN CELLS FOR THE ELECTRODEPOSITING OF METALS - A vertical guide for electrodes characterized in that it includes 1) an upper portion or aligning head and a lower portion that corresponds to the guide itself, whose aligning head, designed to make it easier to introduce the cathode in the guide, has cylindrical-hexahedral perforations that permit attaching the vertical guide by means of bolts or another means to the electrolytic cell's support structure made of insulating material; 2) the head formed by a cylindrical housing having a horizontal axis and two inclined symmetrical surfaces that approach each other in a downward line until they become tangential to the interior faces of the “U” profile that continues downward, so that they are similar to a funnel open on one side; 3) a lower portion made up of the actual guide, whose space through which the electrode slides must be slightly wider than it, consists of a U-type profile with flanges, and which, on the outside, has triangular, or rectangular stiffening ribs, or both types, preferably separated at regular intervals; and 4) a lower end that is introduced into the vertical housing of the union elbow. | 07-09-2009 |
20100044221 | Apparatus Used in an Electroplating Process for Holding Workpieces - An apparatus for holding a plurality of workpieces to be electroplated includes at least one container immersed in and rotatable relative to a plating solution. The container includes two end plates, and a surrounding plate cooperating with the end plates to define a receiving space adapted to receive the workpieces, and an opening adapted for entry and exit of the workpieces into and out of the receiving space. The surrounding plate includes a curved sliding section having two opposite first and second ends, a tumbling section that is adapted to allow the workpieces to tumble thereon when the container is rotated and that has a third end connected to the first end, and a fourth end opposite to the third end, and a plurality of through holes formed in the sliding and tumbling sections. The opening is disposed between the second and fourth ends. | 02-25-2010 |
20100065423 | Capping Board Section and Assembly with Reinforced Mating Projection - The invention concerns a capping board assembly and its multiple connectable sections. Each pair of sections is connected with an interlocking joint, each of which comprises at least one projection and at least one recess that cooperate and prevent the longitudinal and lateral movement of the sections. Each interlocking joint is reinforced by a rod embedded within the section and extending within the projection. The rod has a tip that anchors the projection. The interlocking joints allow precision assembly of the sections of the capping board which greatly benefits strength, installation, replacement and transportation. | 03-18-2010 |
20100116652 | ELECTROCOAGULATION APPARATUS WITH IN-PLACE ELECTRODE CLEANING - An electrocoagulation wastewater treatment apparatus is disclosed wherein a primary electrocoagulation reactor chamber houses treatment electrodes having front and rear faces. Electrode positioners are located in the reactor chamber for holding the treatment electrodes, each of the electrode positioners having a feed core connectable with a high pressure source of fluid. A plurality of passages extend from the feed cores, the passages located so that jets of fluid are directed at both the front and rear faces of each of the electrodes held by the positioners. | 05-13-2010 |
20100116653 | SERVICE MODULE WITH AT LEAST ONE ANODE CLAMP AND MEANS FOR APPLYING A FORCE OR A SHOCK ON THE ANODE ROD - A tending module for a series of electrolysis cells designed for the manufacture of aluminum by igneous electrolysis, each cell including a series of anodes provided with a metal rod designed to fix and electrically connect the anodes to a metal anode frame. The tending module includes a frame to be fixed to a mobile component, and at least one anode handling unit connected to the frame. The module also includes, integral with the anode handling unit, an activator that can exert at least one force or impulse on the anode rod, with a force such that, although the stem is firmly maintained in contact against the anode frame, the contact surfaces are moved in relation to each other by an amount sufficient for electrical contact to be improved. Advantageously, the activator is a jack or an impulse generator integral with the anode clamp. | 05-13-2010 |
20110132753 | Contact Bar for Capping Board - Disclosed is a contact bar for use on a capping board of a given length in order to electrically connect a plurality of anodes and cathodes extending in spaced apart, alternate positions in adjacent electrolytic cells all along the capping board. The contact bar extends over the length of the capping board and is of a given average cross-section. This contact bar comprises a central core that is made of an insulating material and extends all over its length. This contact bar also comprises a plurality of contact pieces that are made of an electrically conductive material and are positioned in spaced apart positions all along the core, each of the pieces defining a segment on which only a short number of the anodes and cathodes are connected. Due to such a division of the contact bar into segments formed by the contact pieces that are no more an electrical contact with each other thanks to the core made of insulating material, any short circuit that occurs by accident is no more “transferred” to all the electrodes of the cells. It is actually transmitted only to the few electrodes in contact with the segment(s) to which is connected the electrode that may cause the trouble. | 06-09-2011 |
20110180400 | METHOD OF PROVIDING ELECTRIC CURRENT TAKER FOR SUPPORT BAR, AND SUPPORT BAR - The invention relates to a method of providing an electric current taker made from silver and having a highly electroconductive contact surface into an aluminium support bar to be used in electrolysis. In order for the support bar and the electric current taker therein to be easily, quickly and inexpensively manufactured, the method comprises a) heating a first end of the support bar and providing on top of it a solder containing a substance whose affinity to oxygen is high after a temperature of an aluminium surface is at a temperature which exceeds a melting temperature of the solder, whereby the solder is spread in a molten state on top of the surface, b) breaking an aluminium oxide layer between the aluminium and the molten solder by a mechanical treatment so that oxygen is released from the aluminium oxide layer, the oxygen reacting with the substance of the solder having a high affinity to oxygen and forming, together with the substance, on the surface of the molten solder an oxide layer, and c) providing, on top of the solder, the electric current taker and letting the solder to solidify and the electric current taker to become attached to the solidified solder. The invention further relates to a support bar. | 07-28-2011 |
20110233056 | ELECTROPLATING CUP ASSEMBLY - Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup. | 09-29-2011 |
20140042021 | SEAL ASSEMBLIES FOR CATHODE COLLECTOR BARS - The cathode collector bar end portion extending through a window in a sidewall of an electrolytic cell for refining aluminum is snugly received in a central opening of a seal assembly. Such seal assembly maintains a hermetic seal preventing ingress of air through the sidewall window while permitting longitudinal (horizontal) movement of the collector bar and also movement in a vertical plane (side to side, or up and down, or diagonally) which can be caused by changing heat conditions inside the cell. | 02-13-2014 |
20140251798 | SUBSTRATE ELECTROPLATING JIG - A substrate plating jig including a first plate-shaped holding member and a second holding member including a ring-shaped seal packing, including an internal circumferential part, an external circumferential part, and an opening formed at the center of the ring-shaped seal packing. Leading edges of the internal circumferential part and external circumferential part of the ring-shaped seal packing come in close contact with a substrate surface-to-be plated and the first holding member, respectively. The edge of the substrate-to-be-plated is held between the internal circumferential part and the external circumferential part of the ring-shaped seal packing. The substrate surface-to-be-plated is exposed in the opening. A first ring-shaped conducting member includes multiple protruding contact points inside the ring-shaped seal packing, and the substrate surface-to-be-plated comes in contact with the protruding contact points inside the ring-shaped seal packing by interposing and clamping the substrate-to-be-plated between the first holding member and the second holding member. | 09-11-2014 |
20150068890 | SUBSTRATE PLATING JIG AND PLATING DEVICE USING SAME - A plating jig and a plating device used for plating treatment of a substrate. The plating jig includes a mechanism rotatably driving a substrate holder, and detachably mounted on a plating bath integrally with a support portion. The plating jig includes the support portion which is formed in an engageable manner with a side wall of the plating bath, and the substrate holder which is vertically rotatably mounted on the support portion. The plating jig further includes a rotary mechanism for the substrate holder. The plating device utilizes the plating jig. | 03-12-2015 |
20150294894 | SUBSTRATE PLATING JIG - A plating jig that can form a metal plating film simultaneously on both surfaces of a semiconductor wafer by one plating process. The plating jig includes a base section and a cover section that can hold a substrate to be plated, and a center section that holds the substrate between the base section and cover section; the base section, the cover section and the center section each having an annular portion having an opening at a center thereof; seal packings each having a conductive ring disposed thereon being attached to each of facing surfaces of the annular portions of the base section and the cover section; the substrate to be plated being disposed inside the opening of the center section; and the substrate to be plated being held from front and back surfaces thereof with the seal packings attached to the cover section and the center section. | 10-15-2015 |
20150354075 | SEGMENTED CAPPING BOARD AND CONTACT BAR ASSEMBLY AND METHODS IN HYDROMETALLURGICAL REFINING - An assembly for use in refining metals includes two adjacent capping board segments defining a joint interface there-between, a contact bar that may be a contact bar segment and is sized and configured to lay on the two capping boards and to span across the joint interface, and two engagement mechanisms provided on respective sides of the joint interface, to hold the capping board segments together. Each engagement mechanism may include a projecting anchor element and a retaining cavity sized and configured to receive a corresponding projecting anchor element. The contact bar may include the projecting anchor elements and the capping board segments may include the retaining cavities. Methods and uses of such contact bars and capping board segments are also provided for hydrometallurgical refining operations. | 12-10-2015 |
20160115607 | CONFIGURATIONS AND POSITIONING OF CONTACT BAR SEGMENTS ON A CAPPING BOARD FOR ENHANCED CURRENT DENSITY HOMOGENEITY AND/OR SHORT CIRCUIT REDUCTION - Techniques for installing contact bar segments in an electrolytic cell can include positioning a series of contact bar segments on a capping board to provide enhanced current density distribution in the series of contact bar segments positioned along the capping board, the contact bar segments including at least three contact regions for anodes and cathodes. In some scenarios, sub-sets of contact bar segments may be provided, such that one sub-set is configured to contact N number of anodes and N number of cathodes; another sub-set is configured to contact N number of anodes and N+1 number of cathodes including one center segment; and a further sub-set configured to contact N+1 number of anodes and N number of cathodes including two end segments. | 04-28-2016 |
20160160375 | ELECTRODE-RIGIDIFYING DEVICE AND RIGIDIFYING SYSTEM USING SAID DEVICE - An electrode stiffening device that avoids the occurrence of short-circuits produced between anodes and cathodes during electrodepositing processes, wherein said device comprises a rigid monolithic body of side inclined walls configuring a triangular-shaped cross-section that is wider in its rear portion, where said side inclined walls join in the front portion of the device, forming a fit area arranged to receive the peripheral edge of an electrode tightly, preferably of an anode and making it stiff in its whole extension and separating it from the adjacent electrodes. | 06-09-2016 |
20160201212 | MULTI-CONTACT LIPSEALS AND ASSOCIATED ELECTROPLATING METHODS | 07-14-2016 |
20170233882 | HANGING BAR FOR ANODES WITHOUT LUGS | 08-17-2017 |
204297020 | Magnetic support | 1 |
20110186424 | CONTACTING DEVICE - The present invention relates to a device for contacting a wafer during submersion in a liquid. The device comprises a main body fixed to a transportation device; an electrical contact for contacting the wafer and a pressure element for pressing the electrical contact towards the wafer. | 08-04-2011 |
204297050 | Mask for workpiece | 3 |
20080237037 | MASK AND METHOD OF MANUFACTURING THE SAME - A mask includes a transparent substrate, a light-blocking layer and a halftone layer. The light-blocking layer includes a source electrode pattern portion including a first electrode portion, a second electrode portion and a third electrode portion, and a drain electrode pattern portion disposed between the second electrode portion and the third electrode portion. The halftone layer includes a halftone portion corresponding to a spaced-apart portion between the source electrode pattern portion and the drain electrode pattern portion, and a dummy halftone portion more protrusive than ends of the second electrode portion and the third electrode portion. Thus, a photoresist pattern corresponding to a channel portion of a thin film transistor (TFT) may be formed with a uniform thickness, to thereby prevent an excessive etching of the channel portion. | 10-02-2008 |
20110132754 | PERPENDICULAR MAGNETIC RECORDING MEDIUM, METHOD OF MANUFACTURING THE SAME, AND MAGNETIC READ/WRITE APPARATUS - According to one embodiment, patterns of protrusions and recesses includes a substrate including a conductive region on at least one major surface, and a projecting pattern layer formed on the conductive region on the major surface, and made of a microcrystalline material, a polycrystalline material, an amorphous material, or an oxide of the microcrystalline, polycrystalline, or amorphous material. | 06-09-2011 |
20130062197 | PLATING CUP WITH CONTOURED CUP BOTTOM - Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer. | 03-14-2013 |
204297060 | Workpiece rack | 9 |
20130228460 | HOLDER FOR WORKPIECES TO BE ELECTROPLATED - A holder is devised for holding a workpiece to be electroplated. The holder includes a shell, a cover and a conducting element. The shell includes pins and least one holding region. The pins extend from the shell. The holding region includes upper and lower abutting elements for abutting upper and lower edges of the workpiece when the holding region receives the workpiece. The cover includes pin-receiving apertures and at least one pair of branch-receiving apertures. The pin-receiving apertures receive the pins to align the cover with the shell. The conducting element includes a stem and at least one pair of branches extending from the stem. The stem is attached to the cover. The pair of branches contacts the workpiece through the pair of branch-receiving apertures. | 09-05-2013 |
20140034488 | NON-PERMEABLE SUBSTRATE CARRIER FOR ELECTROPLATING - One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed. | 02-06-2014 |
20160108541 | NON-PERMEABLE SUBSTRATE CARRIER FOR ELECTROPLATING - One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed. | 04-21-2016 |
204297070 | Adjustable | 4 |
20160168745 | SUPPORTING TOOL FOR SUPPORTING CYLINDRICAL PARTS, LIKE LANDING GEAR RODS AND CYLINDERS | 06-16-2016 |
204297080 | Mechanized | 1 |
20150034480 | PANEL FRAME CARRIER - A panel frame carrier, comprises: a frame body; a transverse first rail assembly arranged at a front side of the frame body; a transverse second rail assembly arranged at a rear side of the frame body; a transformed rail arranged on a support plate; a longitudinal carrying assembly provided for supporting a support plate to drive the longitudinal displacement of the support plate; a panel frame including a sliding platform moveably disposed on the any rails mentioned above; a first moving member provided for pushing the panel frame from the first moving member to the transformed rail; and a second moving member provided for pushing the panel frame from the panel frame to the second moving member; whereby the panel frame is transmitted from an end of the first rail assembly through the transformed rail to the second rail assembly and vice versa. | 02-05-2015 |
204297090 | Including resilient means (e.g., spring, etc.) | 2 |
20100000858 | Substrate Holder and Plating Apparatus - The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member. | 01-07-2010 |
20120103799 | METHOD AND APPARATUS FOR FLUID PROCESSING A WORKPIECE - A workpiece holder for fluid processing a workpiece including a transportable frame, a flexible member connected to the frame and defining at least one retaining feature, and a ring comprising at least one engagement feature engageable with the at least one retaining feature of the flexible member, wherein the flexible member is flexed to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece. | 05-03-2012 |
204297100 | Including resilient means (e.g., spring, etc.) | 2 |
20120181170 | WAFER ELECTROPLATING APPARATUS FOR REDUCING EDGE DEFECTS - Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings. | 07-19-2012 |
20130075252 | ELECTROPLATING PROCESS, SYSTEM AND COMPONENTS THEREOF - An electroplating system and components thereof facilitate an efficient electroplating process which in part reduces or eliminates the number of clips used on electroplating racks. Some electroplating racks may use skewers on which multiple plastic pieces are typically mounted. The plastic pieces may also be configured to be joined to form an assembly which is mounted on an electroplating rack. The configurations help reduce the time spent loading and unloading pieces on the racks. | 03-28-2013 |
204297140 | Including resilient means (e.g., spring, etc.) | 5 |
20110278162 | SYSTEM FOR PLATING A CONDUCTIVE SUBSTRATE, AND A SUBSTRATE HOLDER FOR HOLDING A CONDUCTIVE SUBSTRATE DURING PLATING THEREOF - A system for plating a conductive substrate is provided. The system comprises a conductive substrate, comprising a first and a second conductive side, wherein said first side of the conductive substrate is to be plated. Furthermore, the system comprises a substrate holder with an attachment means, for attaching the conductive substrate to the substrate holder, such that a first surface of the substrate holder faces the second side of the conductive substrate. The substrate holder also comprises a resilient contact means, attached to the first surface of the substrate holder, said resilient contact means being connectable to a first external potential. The second side of the conductive substrate is provided with an insulating material exposing the second side of the conductive substrate, such that at least one contact area is provided, wherein the resilient contact means is in contact with the exposed second side in said at least one contact area. A substrate holder therefore is also provided. | 11-17-2011 |
20130081941 | Electrochemical deposition apparatus - The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member. | 04-04-2013 |
20150122641 | ELASTIC CUSHION MATERIAL AND ION EXCHANGE MEMBRANE ELECTROLYTIC CELL UTILIZING SAME - Provided are an elastic cushion member and an ion exchange membrane electrolyzer using the same, which elastic cushion member can be installed even in an ion exchange membrane electrolyzer having such a small gap between an electrode and an electrode current collecting plate that a conventional elastic cushion member cannot be arranged therein. An elastic cushion member ( | 05-07-2015 |
20160115615 | PLATING CUP WITH CONTOURED CUP BOTTOM - Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer. | 04-28-2016 |
20160186355 | LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPARATUSES - Disclosed herein are lipseal assemblies for use in electroplating clamshells which may include an elastomeric lipseal for excluding plating solution from a peripheral region of a semiconductor substrate and one or more electrical contact elements. The contact elements may be structurally integrated with the elastomeric lipseal. The lipseal assemblies may include one or more flexible contact elements at least a portion of which may be conformally positioned on an upper surface of the elastomeric lipseal, and may be configured to flex and form a conformal contact surface that interfaces with the substrate. Some elastomeric lipseals disclosed herein may support, align, and seal a substrate in a clamshell, and may include a flexible elastomeric upper portion located above a flexible elastomeric support edge, the upper portion having a top surface and an inner side surface, the later configured to move inward and align the substrate upon compression of the top surface. | 06-30-2016 |