Class / Patent application number | Description | Number of patent applications / Date published |
204227000 | Cells with base treatment means | 10 |
20100072059 | Electrolytic System and Method for Enhanced Radiological, Nuclear, and Industrial Decontamination - The present electrolytic system for decontaminating a contaminant disposed on a substrate includes means for providing a brine solution; means for providing a pair of electrodes interposed by a permeable membrane to create a first channel and a second channel; means for flowing the brine solution through the first and second channel; means for applying a potential to the pair of electrodes to produce a first ionized decontamination solution in the first channel and a second ionized decontamination solution in the second channel; means for applying one of the first ionized decontamination solution and the second decontamination solution to the contaminant; and means for recovering the at least one of the first ionized decontamination solution and the second ionized decontamination solution and the contaminant from the substrate. | 03-25-2010 |
20110278158 | ELECTROLYTIC CHLORINATOR - A method of cleaning one or more electrodes ( | 11-17-2011 |
20120234673 | SALT WATER CHLORINATOR - A salt water chlorinator ( | 09-20-2012 |
20120261254 | METHOD AND APPARATUS FOR FILLING INTERCONNECT STRUCTURES - Methods, apparatus, and systems for depositing copper and other metals are provided. In some implementations, a wafer substrate is provided to an apparatus. The wafer substrate has a surface with field regions and a feature. A copper layer is plated onto the surface of the wafer substrate. The copper layer is annealed to redistribute copper from regions of the wafer substrate to the feature. Implementations of the disclosed methods, apparatus, and systems allow for void-free bottom-up fill of features in a wafer substrate. | 10-18-2012 |
20120285820 | TOOL ADAPTER ASSEMBLY AND MACHINING SYSTEM - A machining system is provided and includes a machining tool comprising a spindle, one or more electrodes configured to perform the electromachining, and one or more tool holding elements configure to conductively hold the respective one or more electrodes and be assembled onto the spindle of the machining tool. The machining system further comprises one or more adapters and one or more power sources configured to electrically connect to the respective one or more adapters and the workpiece. The one or more adapters are configured to conductively contact the respective one or more tool holding elements. Further, the machining system comprises one or more machining solution sources provided to pass one or more machining solutions between the workpiece and the respective one or more electrodes. A tool adapter assembly is also presented. | 11-15-2012 |
20130032470 | SYSTEMS INCLUDING NANOTUBULAR ARRAYS FOR CONVERTING CARBON DIOXIDE TO AN ORGANIC COMPOUND - A system including nanostructure arrays for converting carbon dioxide to an organic compound, e.g., methanol, which does so, for example, without any external electric energy. In one embodiment, the system for converting carbon dioxide to an organic compound includes an array of nanotubes, which include nanoparticles of an electron mediator, e.g. palladium, dispersed on a surface of the nanotubes, and an electrically conductive fluid. The array of nanotubes is at least partially immersed in the electrically conductive fluid. The system further includes a light source that irradiates the array of nanotubes, a source of carbon dioxide, and an inlet for delivering the carbon dioxide to the electrically conductive fluid whereat at least a portion of the carbon dioxide is converted to a different organic compound, such as methanol, via contact with an irradiated array of nanotubes. In one example, the array is an ordered array of titania nanotubes. | 02-07-2013 |
20130161186 | Electrorefiner System For Recovering Purified Metal From Impure Nuclear Feed Material - An electrorefiner system according to a non-limiting embodiment of the present invention may include a vessel configured to maintain a molten salt electrolyte and configured to receive a plurality of alternately arranged cathode and anode assemblies. The anode assemblies are configured to hold an impure nuclear feed material. Upon application of the power system, the impure nuclear feed material is anodically dissolved and a purified metal is deposited on the cathode rods of the cathode assemblies. A scraper is configured to dislodge the purified metal deposited on the cathode rods. A conveyor system is disposed at a bottom of the vessel and configured to remove the dislodged purified metal from the vessel. | 06-27-2013 |
20140124361 | METHOD AND APPARATUS FOR FILLING INTERCONNECT STRUCTURES - Methods, apparatus, and systems for depositing copper and other metals are provided. In some implementations, a wafer substrate is provided to an apparatus. The wafer substrate has a surface with field regions and a feature. A copper layer is plated onto the surface of the wafer substrate. The copper layer is annealed to redistribute copper from regions of the wafer substrate to the feature. Implementations of the disclosed methods, apparatus, and systems allow for void-free bottom-up fill of features in a wafer substrate. | 05-08-2014 |
20150096883 | APPARATUS FOR WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING - Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer. | 04-09-2015 |
20180023209 | METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST METAL PLATING | 01-25-2018 |