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Composite

Subclass of:

174 - Electricity: conductors and insulators

174680100 - CONDUITS, CABLES OR CONDUCTORS

174126100 - Conductor structure (nonsuperconductive)

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DocumentTitleDate
20130043057ELECTRODE FOR POWER STORAGE DEVICE AND POWER STORAGE DEVICE - An electrode for a power storage device with good cycle characteristics and high charge/discharge capacity is provided. In addition, a power storage device including the electrode is provided. The electrode for the power storage device includes a conductive layer and an active material layer provided over the conductive layer, the active material layer includes graphene and an active material including a plurality of whiskers, and the graphene is provided to be attached to a surface portion of the active material including a plurality of whiskers and to have holes in part of the active material layer. Further, in the electrode for the power storage device, the graphene is provided to be attached to a surface portion of the active material including a plurality of whiskers and to cover the active material including a plurality of whiskers. Further, the power storage device including the electrode is manufactured.02-21-2013
20130133923A CARBON COMPOSITE ELECTRODE FOR THE ELECTRIC DOUBLE-LAYER CAPACITOR - The present invention concerns a high power density carbon composite electrode for electric double layer capacitors, and a method of manufacture of high density electrode consisting of mineral carbon with suitable nanostructures and morphology. The invention describes a statistical model, which makes possible to select and/or develop carbide carbon materials having a great energy and electrical capacity properties used in the manufacture of the carbon composite electrodes. The simultaneous compliance and achievement of all the statistical parameters of the model allows manufacture superior power density electrodes for super capacitor.05-30-2013
20100089613ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - Disclosed is an electronic component comprising a connecting terminal part having a surface of an electroconductive base material and a germanium-containing nickel plating film provided on the surface. In the electronic component, the plating film provided on the surface of the electroconductive base material in the connecting terminal part possesses excellent heat resistance and solder wettability.04-15-2010
20130037307Electric Conduction Through Supramolecular Assemblies of Triarylamines - The present invention relates to a method for modifying a surface of a solid conducting material, which comprises a step (E), in which a potential difference is applied between this surface and a surface of another conducting solid material positioned facing it, and wherein, simultaneously, said surface (S) is put into contact with a liquid medium comprising in solution triarylamines (I):02-14-2013
20100163276SILVER-COATED MATERIAL FOR MOVABLE CONTACT COMPONENT AND METHOD FOR MANUFACTURING SUCH SILVER-COATED MATERIAL - A silver-coated material for a movable contact component is provided, in which a conductive base member (07-01-2010
20100044075ELECTRIC CONDUCTOR - This invention relates to an electrical conductor (02-25-2010
20100044076COMPOSITE WIRE FOR IMPLANTABLE CARDIAC LEAD CONDUCTOR CABLE AND COILS - A composite wire can include a core including a material chosen from the group consisting of Ag and Ir and combinations thereof, a shell around the core including a material chosen from the group consisting of Ta, MP35N, and Nb and combinations thereof, and an outer layer over the shell including a material chosen from the group consisting of Pt and Pt—Ir and combinations thereof.02-25-2010
20100108359CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME - A connecting wire having an electrically conductive core—preferably provided by a wire or ribbon—with a coating provided on the surface of the core, the coating being composed of a nitrogen-containing tantalum alloy or tungsten alloy, and also optionally containing silicon as an additional alloy component. The invention further relates to a manufacturing method for such a connecting wire.05-06-2010
20100108358ELECTRONIC COMPONENT, LEAD-WIRE AND THEIR PRODUCTION METHODS - Disclosed is a lead wire having a lead electrode made of a metal and a cap. The cap covers the front end portion of the lead electrode and is made of a metal harder than that of the lead electrode. Also disclosed is an electronic component having a functional device and the lead wire. The lead electrode is led out from the functional device.05-06-2010
20130133924ELECTRODE FOR ENERGY STORAGE DEVICE, MANUFACTURING METHOD THEREOF AND CONNECTING METHOD THEREOF - To increase a ground contact area in comparison with the conventional jointing by the spot-welding or the conventional fastening by a bolt so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop of the voltage.05-30-2013
20090114420Electrical conductor and core for an electrical conductor - A core for an electrical conductor. The core includes an inner core component, an intermediate cladding component and an outer cladding component. The inner core component comprises a plurality of glass based stranded members in a first resin matrix. The intermediate cladding component surrounds the inner core component and comprises a plurality of carbon stranded members in a second resin matrix. The outer cladding component surrounds the intermediate cladding component and comprises a plurality of glass based stranded members in a third resin matrix. The first resin matrix and the second resin matrix are substantially independent of each other, meeting at a boundary. An electrical conductor as well as a manufacturing method is likewise disclosed.05-07-2009
20130081855COMPOSITE MATERIAL, ELECTRIC CONTACT ELECTRODE, ELECTRIC CONTACT FILM, CONDUCTIVE FILLER, ELECTRIC CONTACT STRUCTURE USING COMPOSITE MATERIAL, AND MANUFACTURING METHOD OF COMPOSITE MATERIAL - A composite material includes a metal matrix of a metal and a reducing agent. The reducing agent is dispersed in the metal matrix and is capable of reducing an oxide of the metal at room temperature. Even when the oxide of the metal is generated on a surface of the composite material, the reducing agent reduces the oxide of the metal to the metal04-04-2013
20130087364Film Conductor for Flat Cells and Method for Producing Same - A foil conductor for flat cells includes a contact zone for contact with further cells or busbars, an adhesion zone for adhesive bonding with a packaging foil of a cell, and a connection zone for connection to an electrode foil within the cell. At least two of the zones have a surface composition differing from each other.04-11-2013
20100101832COMPOUND MAGNETIC NANOWIRES FOR TCO REPLACEMENT - This invention provides an optically transparent electrically conductive layer with a desirable combination of low electrical sheet resistance and good optical transparency. The conductive layer comprises a multiplicity of compound magnetic nanowires in a plane, the compound nanowires being aligned roughly (1) parallel to each other and (2) with the long axes of the compound nanowires in the plane of the layer, the compound nanowires further being configured to provide a plurality of continuous conductive pathways, and wherein the density of the multiplicity of compound magnetic nanowires allows for substantial optical transparency of the conductive layer. A compound magnetic nanowire may comprise a silver nanowire covered by a layer of magnetic metal such as nickel or cobalt. Furthermore, a compound magnetic nanowire may comprise a carbon nanotubes (CNT) attached to a magnetic metal nanowire. A method of forming the conductive layer on a substrate includes: depositing a multiplicity of compound magnetic conductive nanowires on the substrate and applying a magnetic field to form the compound nanowires into a plurality of conductive pathways parallel to the surface of the substrate.04-29-2010
20090301757METHOD AND SYSTEM FOR COMPOSITE BOND WIRES - Bond wires for integrated circuits are implemented using a variety of methods. Using one such method, a composite bond wire is produced for use in an integrated circuit. A conductive material is melted and mixed with a material of particles less than 100 micrometers in size to create a mixture. The mixture is used to create the composite bond wire. A composite wire having an inner core and an outer layer having a higher conductivity than the inner core is also provided. The outer layer is designed to be thicker than the skin depth at the operating frequency for carrying AC signals.12-10-2009
20130056241EMITTER WIRE WITH LAYERED CROSS-SECTION - By selecting different materials for each layer, a multi-layered electrode structure can be made with superior performance characteristics. For example, a multilayered electrode can include a high tensile strength tungsten core, a conductive intermediate palladium, palladium-nickel, or other platinum group metal layer for generating a corona discharge, and a hardened layer comprising rhodium or other platinum group metal or alloy of the same to resist frictional abrasion during removal of silica dendrites that accumulate on the electrode surface during operation.03-07-2013
20120103660GRID AND NANOSTRUCTURE TRANSPARENT CONDUCTOR FOR LOW SHEET RESISTANCE APPLICATIONS - Transparent conductors and methods of forming same are provided. A transparent conductor can include a nanostructure layer and a low sheet resistance grid disposed on a transfer film surface having an acceptable level of surface roughness. The presence of the low sheet resistance grid lowers the sheet resistance of the transparent conductor to an acceptable level. After release of the transparent conductor from the transfer film, the surface roughness of the transparent conductor will be at least comparable to the surface roughness of the transfer film.05-03-2012
20090095502MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAKING SAME - A multi-layer pillar and method of fabricating the same is provided. The multi-layer pillar is used as an interconnect between a chip and substrate. The pillar has at least one low strength, high ductility deformation region configured to absorb force imposed during chip assembly and thermal excursions04-16-2009
20090266580METHOD FOR MANUFACTURING A TRANSPARENT CONDUCTIVE ELECTRODE USING CARBON NANOTUBE FILMS - The present invention relates to a method for preparing a transparent electrode using a carbon nanotube(CNT) film, and more particularly, to a method for preparing a transparent electrode, the method comprising the steps of forming a CNT film on a desired substrate using a dispersed solution of CNT and then reducing/forming metal nanoparticles on the surface of the CNT film. According to the present invention, a transparent electrode in which gold nanoparticles are formed on the surface of high density CNT film having high purity, can be prepared. The inventive transparent electrode has high visible ray penetration and an excellent electrical conductivity by hyperfine metal particles uniformly formed on the surface thereof as well as a uniform increase in electrical conductivity over the whole CNT film, and thus it can be applied to various displays as well as image sensors, solar cells, touch panels, digital papers, electromagnetic shielding agents, static charge preventing agents and the like.10-29-2009
20110011619BONDING WIRE FOR SEMICONDUCTOR DEVICES - It is an object of the present invention to provide a highly-functional bonding wire which can reduce damages at a neck part, has good linearity of loops, stability of loop heights, and stability of bonded shape of a bonding wire, and can cope with semiconductor packaging techniques, such as low looping, thinning, achievement of a fine pitch, and three-dimensional packaging. A semiconductor-device bonding wire comprises a core member formed of an electrically-conductive metal, and a skin layer mainly composed of a face-centered cubic metal different from the core member and formed thereon. The percentage of <100> orientations in crystalline orientations in the lengthwise direction in the surface of the skin layer is greater than or equal to 50%.01-20-2011
20090008124MULTILAYER STRUCTURE, AND ELECTRODE FOR ELECTRICAL CIRCUIT USING THE SAME - A multilayer structure including a transparent conductive thin film and a molybdenum metal thin film, the transparent conductive thin film having a thickness of 35 nm or less.01-08-2009
20100032186TRANSPARENT ELECTRODE FOR DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - The present invention relates to a transparent electrode for a display device which includes a first transparent conductive film containing nitrogen, and a second transparent conductive film not containing nitrogen, wherein the first transparent conductive film is in contact with an aluminum alloy film. In accordance with the present invention, there is obtained a transparent electrode for a display device which is capable of, even when a barrier metal layer to be generally provided between an aluminum alloy film and the transparent electrode is omitted, controlling the variance small while keeping the low contact resistance, and further which is also excellent in light transmission characteristics.02-11-2010
20110100677FIBER-POLYMER COMPOSITE - The present invention is a fiber-polymer composite-supported conductor with a fiber-polymer composite core and a tubular metal conductor. The tubular metal conductor is on the core. Substantially all mechanical tension resulting from the disposition of the conductor is borne by the fiber-polymer composite core.05-05-2011
20100170696SPUTTERING TARGET, TRANSPARENT CONDUCTIVE FILM AND TRANSPARENT ELECTRODE - A sputtering target which is composed of a sintered body of an oxide which contains at least indium, tin, and zinc and includes a spinel structure compound of Zn07-08-2010
20110290531WIRE ELECTRODE FOR ELECTRICAL DISCHARGE CUTTING - The invention relates to a wire electrode (12-01-2011
20100263912COMPOSITE ELECTRIC WIRE - Provided is a composite electric wire, which is intended to realize a light weight and improve a mechanical strength at the same time and which is enabled to improve the reliability by avoiding the problem of oxide coating or electric erosion so that the electric wire may be easily handled for use as a car-mounted wire harness.10-21-2010
20110214900ELECTRIC CONTACT MEMBER - Provided is an electric contact member which reduces, to the utmost, peel-off of a carbon film that is caused at the time of use of the electric contact member having at least an edge to keep stable electric contact over a long period of time. Disclosed is an electric contact member which repeatedly contacts with a device under test at a tip part of the electric contact member in which the tip part has an edge, the electric contact member comprising: a base material; an underlying layer comprising Au, Au alloy, Pd or Pd alloy, which is formed on a surface of the base material of the tip part; an intermediate layer which is formed on a surface of the underlying layer; and a carbon film comprising at least one of a metal and a carbide thereof which is formed on a surface of the intermediate layer, wherein the intermediate layer has a lamination structure comprising: an inner layer comprising Ni or Ni alloy; and an outer layer comprising at least one of Cr, Cr alloy, W and W alloy.09-08-2011
20100101830MAGNETIC NANOPARTICLES FOR TCO REPLACEMENT - This invention provides an optically transparent conductive layer with a desirable combination of low electrical sheet resistance and good optical transparency. The conductive layer comprises a multiplicity of magnetic nanoparticles in a plane, the nanoparticles being aligned in strings, the strings being roughly parallel to each other and configured to provide a plurality of continuous conductive pathways, and wherein the density of the multiplicity of magnetic nanoparticles allows for substantial optical transparency of the conductive layer. Furthermore, the conductive layer can include an optically transparent continuous conductive film, wherein the multiplicity of magnetic nanoparticles are electrically connected to the continuous conductive film. A method of forming the conductive layer on a substrate includes: depositing a multiplicity of magnetic conductive nanoparticles on the substrate and applying a magnetic field to form the nanoparticles into a plurality of conductive pathways parallel to the surface of the substrate.04-29-2010
20120186852Structure of electrolessly palladium and gold plated films and process for making the same, assembled structure of palladium and gold plated films bonded with copper or copper-palladium wire and assembling process therefore - Disclosed is a structure of electrolessly palladium (Pd) and gold (Au) plated films on a bonding pad, comprising a Pd plated layer on the bonding pad; and an Au plated layer on the Pd plated layer. Also disclosed is an assembled structure formed of the electrolessly Pd—Au plated films wire-bonded with a copper (Cu) or Pd—Cu wire to the Au plated layer. In addition, a process for producing the structure of the electrolessly Pd—Au plated films and an assembling process for the assembled structure are disclosed. According to the present invention, the Pd plated layer is used to replace the conventional nickel layer so as to enhance the wire-bonding strength between the Cu or Pd—Cu wire and the bonding pad.07-26-2012
20090151982METAL-CERAMIC COMPOSITE SUBSTRATE AND METHOD OF ITS MANUFACTURE - A metal-ceramic composite substrate having excellent heat dissipation and a method of manufacturing such a metal-ceramic composite substrate at low cost are disclosed. A metal-ceramic composite substrate (06-18-2009
20110168431ELECTRIC CONDUCTOR AND METHOD FOR MANUFACTURING AN ELECTRIC CONDUCTOR - The invention relates to an electric conductor (07-14-2011
20100018747Conductive Nanowires For Electrical Interconnect - An electrical interconnect includes first and second electrical contacts to be electrically connected, each electrical contact having a plurality of electrically conductive nanowires extending outwardly from a respective electrical contact; and the nanowires of the first electrical contact configured to mesh with the nanowires of the second electrical contact such that an electrical connection is established between the first electrical contact and the second electrical contact. A method for interconnecting electrical contacts includes meshing a first array of electrically conductive nanowires extending from a first electrical contact with a second array of electrically conductive nanowires extending from a second electrical contact so as to establish an electrical connection between said first and second electrical contacts.01-28-2010
20100089612Electrical connection element of packaging substrate - An electrical connection element of packaging substrate is disclosed. Wherein a plurality of conductive pads and a solder mask are formed on the surface of the packaging substrate, and a plurality of openings is formed in the solder mask to expose the conductive pads covered there beneath. The electrical connection element formed on the conductive pad comprises a core layer, a first covering layer and a second covering layer. The first covering layer covers the core layer, and the density of the first covering layer is higher than the density of the core layer. The second covering layer covers the first covering layer.04-15-2010
20130098659PRE-PLATED LEAD FRAME FOR COPPER WIRE BONDING - A pre-plated lead frame comprises a substrate comprising copper or a copper alloy which has a first side and a second side opposite to the first side. A first plating layer comprising nickel is plated on the first and second sides of the substrate and a second plating layer comprising palladium is plated onto the first plating layer on the first and second sides of the substrate. A third plating layer comprising gold is then plated onto the second plating layer on the second side of the substrate, the third plating layer on the second side of the substrate having a thickness of more than 3 nm. On the first side of the substrate, there is either no gold plated onto the second plating layer, or a third plating layer comprising gold plated onto the second plating layer which has a thickness of 1.5 nm or less.04-25-2013
20090288856MULTI-COATED ELECTRODE AND METHOD OF MAKING - Various embodiments provide an electrode comprising a conductive substrate, a first layer of a mixture comprising iridium oxide in a crystalline phase and tantalum oxide in an amorphous phase on a portion of an outer surface of the conductive substrate, and a second layer of the mixture comprising iridium oxide in an amorphous phase and tantalum oxide in an amorphous phase on an outer surface of the first layer.11-26-2009
20110203831METAL/CNT AND/OR FULLERENE COMPOSITE COATING ON STRIP MATERIALS - A composite coating on metal strips or prestamped metal strips with an improved friction coefficient and/or good contact resistance and/or good friction corrosion resistance and/or good wear resistance and/or good formability includes carbon nanotubes and/or fullerenes and a metal. A method for producing a metal strip coated according to the invention with carbon nanotubes and/or fullerenes and a metal is also disclosed.08-25-2011
20090095503COMPOSITE CONDUCTIVE FILM AND SEMICONDUCTOR PACKAGE USING SUCH FILM - A composite conductive film and a semiconductor package using such film are provided. The composite conductive film is formed of a polymer-matrix and a plurality of nano-sized conductive lines is provided. The composite conductive film has low resistance, to connect between a fine-pitch chip and a chip in a low temperature and low pressure condition. The conductive lines are parally arranged and spaced apart from each other, to provide anisotropic conductivity. The present conductive film can be served as an electrical connection between a fine-pitch chip and a chip or a fine-pitch chip and a substrate04-16-2009
20120292080Composite Conductive Component and Method for Making it - A method of manufacturing a composite conductive component comprising the steps of providing at least two blanks of metallic material, said blanks consisting of dissimilar metallic materials; placing said blanks in edge to edge or in partially overlapping relationship with one another, solid state joining said blanks to each other, by rolling or welding, so as to form a composite body, rolling said composite body along the joint over the entire width of the composite body to reduce the thickness thereof, and cutting the rolled composite body across the joint to produce at least two composite conductive components, each comprising the metallic materials of said at least two blanks and having a joint between said at least two different metallic materials. A composite conductive component comprises at least a first portion of a first metallic material and at least a second portion of a second metallic material, said first and second metallic materials being dissimilar from each other is produced by the method. An electrical connector or conductor or a device for heat conduction comprises the composite conductive component.11-22-2012
20100101831ELECTRICAL CONTACT MATERIAL, METHOD FOR MANUFACTURING THE SAME AND ELECTRICAL CONTACT - The present invention relates to an electrical contact material having a surface layer made of a noble metal or an alloy having the noble metal as its main component, a method for manufacturing the same and an electrical contact using the same. Recently, electrical contact materials having excellent abrasion resistance are used for sliding electrical contacts such as a connector terminal of an automobile harness, a contact switch mounted in a cellular phone and terminals of a memory card. Although there have been known ones having an organic coating film composed of either aliphatic amine or mercaptan or a mixture of the both provided on the electrical contact material described above as the electrical contact materials having excellent abrasion resistance, they have had problems that even though they are effective with a low load of 0.5 N or below, abrasion accelerates when the load exceeds 0.5 N and sliding characteristics drop under a high-temperature environment. The invention solves the abovementioned problems by providing an organic coating film formed of an organic compound containing aliphatic amine on the electrical contact material.04-29-2010
20100101829MAGNETIC NANOWIRES FOR TCO REPLACEMENT - This invention provides an optically transparent conductive layer with a desirable combination of low electrical sheet resistance and good optical transparency. The conductive layer comprises a multiplicity of magnetic nanowires in a plane, the nanowires being aligned roughly (1) parallel to each other and (2) with the long axes of the nanowires in the plane of the layer, the nanowires further being configured to provide a plurality of continuous conductive pathways, and wherein the density of the multiplicity of magnetic nanowires allows for substantial optical transparency of the conductive layer. Furthermore, the conductive layer can include an optically transparent continuous conductive film, wherein the multiplicity of magnetic nanowires are electrically connected to the continuous conductive film. A method of forming the conductive layer on a substrate includes: depositing a multiplicity of magnetic conductive nanowires on the substrate and applying a magnetic field to form the nanowires into a plurality of conductive pathways parallel to the surface of the substrate.04-29-2010
20100096162Lightweight copper/aluminum composite conductors - A lightweight composite electrical conductor for aerospace applications, having a core of a plurality of aluminum strands surrounded by an outer layer of a plurality of copper strands. The conductor may be a wire rope having a core of a plurality of aluminum members each having a plurality of aluminum strands, the core of aluminum members being surrounded by an outer layer of a plurality of copper members each having a plurality of copper strands.04-22-2010
20110266031ELASTIC ELECTRIC CONTACT TERMINAL - Disclosed is an elastic electric contact terminal including an elastic foam core having a sheet form, a non-foam rubber coating layer adhered to upper and lower surfaces of the elastic foam core and continued along any one side surface of the elastic foam core, and a heat-resistant polymer film, one side of which is adhered to the non-foam rubber coating layer in an enclosing manner and the other side of which is integrally formed with a metal layer.11-03-2011
20110266030MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT - The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.11-03-2011
20120285726ELECTRICALLY CONDUCTIVE ELEMENT, PHOTOSENSITIVE MATERIAL FOR FORMATION OF ELECTRICALLY CONDUCTIVE ELEMENT, AND ELECTRODE - Disclosed are: an electrically conductive element having high electrical conductivity; a photosensitive material for formation of an electrically conductive element, which is suitable for producing the electrically conductive element; and an electrode. The electrically conductive element comprises: a support; a metal pattern layer comprising an electrically conductive metal; and an electrically conductive microparticle-containing layer comprising needle-shaped electrically conductive microparticles having an average long axis length of from 0.2 μm to 20 μm, an average short axis length of from 0.01 μm to 0.02 μm, and an aspect ratio of 20 or more, a binder, and a sucrose fatty acid ester.11-15-2012
20080308297Ubm Pad, Solder Contact and Methods for Creating a Solder Joint - A UBM pad has a first material layer which has a first material, and a second material layer which has a second material and represents an end layer or is arranged between an end layer and the first material layer. The first material and the second material exhibit properties with regard to a solder material that the presence of the second material prevents any metallurgical reactions of the first material with the solder material in the entire temperature range of connecting and of the operation of the structured electronic device which are detrimental to the reliability of the overall joint.12-18-2008
20120090875CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a conductive film. The conductive film includes: a base member; a transparent electrode formed on the base member; and electrode wirings connected to one side or both sides of the transparent electrode and having a first metal layer formed on the lower portion thereof and a second metal layer made of a metal different from the first metal layer and formed to be thicker than the thickness of the first metal layer stacked on the upper portion thereof.04-19-2012
20130118775METAL NANOWIRES, NANOMESH, AND A METHOD OF FABRICATION - The present invention relates to a method of forming copper nanowires with a metallic coating. In a preferred embodiment, the metallic coating is copper. Due to the metal coating, the nanowires become magnetically guidable and chemically stable. As such, the nanowires can be used to form nanomesh. Further, the nanowire and nanomesh of the present invention can be used as transparent electrodes that are used in TV, PC, touch-control, and solar industries.05-16-2013
20110005808Hybrid Conductors and Method of Making Same - Hybrid conductors capable of achieving enhanced conductivity and current capacity over a wide range of frequencies are disclosed. The hybrid conductors may be used in electrical or thermal applications, or combinations of both. One method of fabricating such hybrid conductors includes complexing conductive metal elements (e.g., silver, gold, copper), transition metal elements, alloys, wires, or combinations thereof, with carbon nanotube materials. In the alternative, the hybrid conductors may be formed by doping the carbon nanotube materials in salt solutions.01-13-2011
20080257581TERMINAL FOR ENGAGING TYPE CONNECTOR - A terminal for an engaging type connector includes a punched Cu alloy strip as a base material, a coating formed on the Cu alloy strip by postplating processes and including a Sn layer, and a Cu—Sn alloy layer sandwiched between the base material and the Sn layer. The Sn layer is smoothed by a reflowing process. The terminal has an engaging part and a solder-bonding part, and the surface of a part of the base material corresponding to the engaging part has a surface roughness higher than that of the surface of the base material corresponding to the solder-bonding part. The engaging part has a low frictional property and the solder-bonding part has improved solder wettability.10-23-2008
20130213689CORE-JACKET BONDING WIRE - A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.08-22-2013
20090025959EDM WIRE - An EDM wire having an outer coating of gamma phase brass with an overlayer of continuous unalloyed zinc or ductile epsilon phase brass entrapping the gamma phase and a process for manufacturing the EDM wire is provided. A second process for synthesizing a ductile epsilon phase brass coating on the aforementioned and other substrates is also provided. The first process includes coating a copper bearing metallic core with zinc. The zinc coating is then converted to gamma phase brass via a diffusion anneal and subsequently re-coated with zinc prior to being cold drawn to its finish diameter. The process of converting a zinc coating to a ductile epsilon phase brass includes heat treating the wire at a temperature low enough to minimize or eliminate changes in the mechanical properties of the composite wire.01-29-2009
20090229857ELECTRODE AND METHOD OF FORMING THE ELECTRODE - An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (09-17-2009
20090229856Master Electrode and Method of Forming the Master Electrode - An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (09-17-2009
20090250244TRANSPARENT CONDUCTIVE FILM, DISPLAY DEVICE, AND MANUFACTURING METHOD THEREOF - A transparent conductive film having a multilayer film of two or more layers (a pixel electrode, a gate terminal pad, and a source terminal pad) includes a first transparent conductive film having an amorphous structure, and a second transparent conductive film, formed over the first transparent conductive film, and having a crystalline structure.10-08-2009
20100163277TERMINAL FOR ENGAGING TYPE CONNECTOR - A terminal for an engaging type connector includes a punched Cu alloy strip as a base material, a coating formed on the Cu alloy strip by postplating processes and including a Sn layer, and a Cu—Sn alloy layer sandwiched between the base material and the Sn layer. The Sn layer is smoothed by a reflowing process. The terminal has an engaging part and a solder-bonding part, and the surface of a part of the base material corresponding to the engaging part has a surface roughness higher than that of the surface of the base material corresponding to the solder-bonding part. The engaging part has a low frictional property and the solder-bonding part has improved solder wettability.07-01-2010
20100186993SILVER-COATED MATERIAL FOR MOVABLE CONTACT COMPONENT AND METHOD FOR MANUFACTURING SUCH SILVER-COATED MATERIAL - A silver-coated material for a movable contact component includes an electrically conductive base member (07-29-2010
20130126212CONDUCTIVE MEMBERS USING CARBON-BASED SUBSTRATE COATINGS - A conductive member includes a metal substrate and a carbon-based substrate (CBS) network applied to the metal substrate. The CBS network includes a framework of fibers and particulates embedded in the framework that provide cathodic protection for the metal substrate. The particulates may penetrate entirely through the framework. The particulates may be iron particulates. The particulates may be metal particulates having a higher corrosion potential than the metal substrate. The CBS network may be a yarn, a sheet, or a tape. The CBS network with the particulates may be applied by coating or plating the metal substrate with the CBS network.05-23-2013
20100294537METHOD OF PRODUCING AN ALUMINIUM WIRE COVERED WITH A COPPER LAYER, AND WIRE OBTAINED - To produce an aluminum wire covered with copper, capable of retaining its original electrical and mechanical properties when used in environments in which the temperatures exceed 150° C., the wire is produced by a method during which a material foreign to copper and to aluminum is introduced in a small amount at the interface between the aluminum core and the copper layer. The material has the effect of retarding the precipitation of copper in the aluminum and the growth of Guinier-Preston zones. The wire is produced by a known method of reducing the diameter of a composite bar and the foreign material is introduced into the interface between the copper and the aluminum during production of the composite bar so as to be present in trace amounts after reduction of the diameter.11-25-2010
20110240339CONDUCTIVE CHANNEL OF PHOTOVOLTAIC PANEL AND METHOD FOR MANUFACTURING THE SAME - An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar.10-06-2011
20100038111Plated article having metal thin film formed by electroless plating, and manufacturing method thereof - The present invention provides a plated article that has a thin seed layer having uniform thickness, formed by electroless plating and allowing formation of ultrafine wiring, and that avoids the complicated formation of a bilayer of a barrier layer and a catalytic metal layer prior to forming the seed layer. The present invention also provides a method for manufacturing the plated article. The plated article has an alloy thin film formed on a substrate and having a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5 at % to 40 at % of the metal (A). The metal thin film formed by electroless displacement and reduction plating is a metal thin film having a thickness no greater than 10 nm and a resistivity no greater than 10 μΩ·cm. Preferably, the metal (B) has a barrier function with respect to a metal of the metal thin film.02-18-2010
20100044074CARBON NANOTUBE NETWORKS WITH METAL BRIDGES - Structures comprising a carbon nanotube (CNT) network and metal, as well as methods for making a CNT network structure, are provided.02-25-2010
20120241192MICROFIBER SUPPORTED METAL SILICIDE NANOWIRES - An arrangement of elongated nanowires that include titanium silicide or tungsten silicide may be grown on the exterior surfaces of many individual electrically conductive microfibers of much larger diameter. Each of the nanowires is structurally defined by an elongated, centralized titanium silicide or tungsten silicide nanocore that terminates in a distally spaced gold particle and which is co-axially surrounded by a removable amorphous nanoshell. A gold-directed catalytic growth mechanism initiated during a low pressure chemical vapor deposition process is used to grow the nanowires uniformly along the entire length and circumference of the electrically conductive microfibers where growth is intended. The titanium silicide- or tungsten silicide-based nanowires can be used in a variety electrical, electrochemical, and semiconductor applications.09-27-2012
20120118610BONDING WIRE FOR SEMICONDUCTOR - There is provided a bonding wire for semiconductor, capable of ensuring a favorable wedge bondability even when bonded to a palladium-plated lead frame, superior in oxidation resistivity and having a core wire of copper or a copper alloy. This bonding wire comprises: a core wire of copper or a copper alloy; a coating layer containing palladium and having a thickness of 10 to 200 nm; and an alloy layer formed on a surface of the coating layer, such alloy layer containing a noble metal and palladium and having a thickness of 1 to 80 nm. The aforementioned noble metal is either silver or metal, and a concentration of such noble metal in the alloy layer is not less than 10% and not more than 75% by volume.05-17-2012
20100258335STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNECTS AND METHODS OF FABRICATING THE SAME - Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.10-14-2010
20090260852ALTERNATING CORE COMPOSITE WIRE - A wire having an outer shell and a core, the core including at least a first plurality of core segments that may be made of a first core material and a second plurality of core segments that may be made of a second core material different from the first core material. The first and second core segments are arranged in a periodic alternating arrangement along the length of the wire. The outer shell may be made of a metal, such as a biocompatible metal, and the core segments may be made of different materials to provide periodic material properties along the length of the wire. The wire is manufactured by inserting the core segments into the outer shell to form a wire construct, followed by subjecting the wire construct to one or more initial draws while applying a compressive force to the core segments on an upstream side of the die to maintain the core segments in contact with one another upon dense contact between the outer shell and core segments, following by closing of the outer shell onto the core segments, as the wire is pulled through a drawing die. The resulting wire may then be subjected to a plurality of finishing draws. Exemplary applications of the wire include medical devices, such as in vivo heating devices, thermally-actuated snares, in vivo positioning devices, stents, and tissue scaffolds.10-22-2009
20080202792INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS - An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.08-28-2008
20110162871SOLDER MATERIAL COMPRISING A METAL STEARATE AND USE OF METAL STEARATES IN SOLDER MATERIALS - Solder materials, such as a solder paste, and contact surfaces for solder connections are provided in which a metal stearate is used as a flux. The metal stearate is applied either as a solid layer on the solder particles or as contact surfaces or is present as a dispersion or solution in a binder. Advantageously, such materials allow one to avoid the use of classical fluxes. In particular, non-resin solder materials can be provided. A simplified storage and processability of the solder materials results, while at the same time producing comparatively better solder connections. The ability to use metal stearates as a flux is achieved if the first oxide of the metals used is formed from pure metal at lower oxygen activity (a07-07-2011
20100282495BONDING WIRE FOR SEMICONDUCTOR DEVICE - An object of the present invention is to provide a high-performance bonding wire that is suitable for semiconductor mounting technology, such as stacked chip bonding, thinning, and fine pitch mounting, where wire lean (leaning) at an upright position of a ball and spring failure can be suppressed and loop linearity and loop height stability are excellent. This bonding wire for a semiconductor device includes a core material made of a conductive metal, and a skin layer formed on the core material and containing a metal different from the core material as a main component; wherein a relationship between an average size (a) of crystal grains in the skin layer on a wire surface along a wire circumferential direction and an average size (b) of crystal grains in the core material on a normal cross section, the normal cross section being a cross section normal to a wire axis, satisfies an inequality of a/b≦0.7.11-11-2010
20090188696Bonding wire for semiconductor device - The present invention provides a bonding wire improved in formability of a ball part, improved in bondability, good in loop controllability, improved in bonding strength of a wedge connection, securing industrial production ability as well, and mainly comprised of copper which is more inexpensive than gold wire, that is, provides a bonding wire for a semiconductor device comprised of a bonding wire having a core material having copper as its main ingredient and a surface covering layer over the core material and of a conductive metal of a composition different from the core material, characterized in that the surface covering layer has as its main ingredients two or more types of metals selected from gold, palladium, platinum, rhodium, silver, and nickel and the surface covering layer has a concentration gradient of one or both of a main ingredient metal or copper in the wire radial direction.07-30-2009
20090173517SOLDER WIRE CONSTRUCTION - A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.07-09-2009
20100071932NANO-HOLE ARRAY IN CONDUCTOR ELEMENT FOR IMPROVING THE CONTACT CONDUCTANCE - A nano-hole array for improving contact conductance of a conductor element that consists of a first layer and a second layer is provided. The nano-hole array formed between the first and second layers comprises a plurality of holes. The contact conductance of the conductor element is enhanced by reducing the hole size of the hole array, increasing the occupation rate of the hole array, and performing thermal annealing.03-25-2010
20100018748Solar cell lead wire and method of manufacturing the same - A solar cell lead wire includes a conductive material, and a solder plated layer on a periphery of the conductive material. The solder plated layer is formed flat by rolling. A method of manufacturing a solar cell lead wire includes feeding an elongate conductive material from a feed reel, the elongate conductive material including a rectangular conductor or a round conductor, soaking the conductive material in a molten solder in a molten solder plating bath, cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material, and winding the plated wire on a winding reel. The plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling.01-28-2010
20110315429METAL COATING FOR INDIUM BUMP BONDING - A process of making efficient metal bump bonding with relative low temperature, preferably lower than the melting point of Indium, is described. To obtaining a lower processing temperature (preferred embodiments have a melting point of <100° C.), a metal or alloy layer is deposited on the indium bump surface. Preferably, the material is chosen such that the metal or alloy forms a passivation layer that is more resistant to oxidation than the underlying indium material. The passivation material is also preferably chosen to form a low melting temperature alloy with indium at the indium bump surface. This is typically accomplished by diffusion of the passivation material into the indium to form a diffusion layer alloy. Various metals, including Ga, Bi, Sn, Pb and Cd, that can be used to form a binary to quaternary low melting point alloy with indium. In addition, diffusion of metal such as Sn, Sn—Zn into Ga—In alloy; Sn, Cd, Pb—Sn into Bi—In alloy; Cd, Zn, Pb, Pb—Cd into Sn—In alloy can help adjust the melting point of the alloy.12-29-2011
20120118608CONDUCTIVE CONTACT TERMINAL FOR SURFACE MOUNTING ON SUBSTRATE - The present invention provides a conductive contact terminal for surface mounting on a substrate. In the conductive contact terminal, an elastic core imparts elasticity to the contact terminal. A metal layer covers the outer portion of the elastic core. A conductive adhesive layer is interposed between the elastic core and the metal layer to bond the elastic core and the metal layer to each other. The conductive contact terminal has a low electrical resistance, does not exhibit a deformation in the material even in a high-temperature reflow soldering process, and does not lose conductivity even though a metal layer, which imparts electrical conductivity to the conductive contact terminal, is broken.05-17-2012
20110155418MITIGATION OF WHISKERS IN SN-FILMS - An electronic device includes a metallic conducting lead having a surface. A pre-solder coating over the surface consists essentially of tin and one or more dopants selected from Al or a rare earth element.06-30-2011
20120247808TRANSPARENT CONDUCTIVE MATERIAL - A transparent conductive material, including a substantially transparent carbon nanotube layer, and a metal layer deposited onto the carbon nanotube layer, in which the metal layer increases an electrical conductance of the transparent conductive material without substantially reducing an optical transmittance of the transparent conductive material.10-04-2012
20120118609ELECTRODE BASE - An electrode base in which a lead wire made of aluminum is bonded to a surface of a glass substrate that is a thin-film base having a plate thickness of about 0.7 to 2.0 mm, by using an ultrasonic bonding method. An external lead-out electrode made of copper is formed so as to extend from a surface of one end portion of the lead wire to a region outside the glass substrate. The lead wire functions as an internal signal receiver, and the external lead-out electrode has an external signal transmission function.05-17-2012
20100132978WHISKER-FREE COATING STRUCTURE AND METHOD OF FABRICATING THE SAME - A whisker-free coating structure and a method for fabricating the same are disclosed. The whisker-free coating structure includes a substrate, a tungsten doped copper layer overlaying the substrate, and a lead-free tin layer overlaying the tungsten doped copper layer.06-03-2010
20100263911COMPOSITE ELECTRIC WIRE - Provided is a composite electric wire, which is intended to realize a light weight and improve a mechanical strength at the same time and which is enabled to improve the reliability by avoiding the problem of oxide coating or electric erosion so that the electric wire may be easily handled for use as a car-mounted wire harness.10-21-2010
20100288531TRANSPARENT CONDUCTIVE FILM, METHOD OF MANUFACTURING TRANSPARENT CONDUCTIVE FILM, AND TRANSPARENT ELECTRODE FOR ELECTRONIC DEVICE - Provided is a transparent conductive film exhibiting high conductivity together with excellent transparency, and also exhibiting film strength tolerant to a washing treatment and a pattern forming treatment while maintaining conduction to an electronic device layer formed on an transparent conductive layer. Also disclosed is a method of manufacturing a transparent conductive film possessing a transparent substrate and provided thereon, a transparent conductive layer containing a metal nanowire, possessing the steps of forming a layer containing a crosslinking agent on the substrate, coating a coating solution containing a metal nanowire onto the layer containing the crosslinking agent, drying the coating solution, and conducting a treatment by which the crosslinking agent is reacted.11-18-2010
20120261162METHOD FOR MANUFACTURING ELECTRODE STRUCTURE, ELECTRODE STRUCTURE, AND CAPACITOR - Provided are an electrode structure capable of suppressing a leakage current, having a high capacitance, allowing an electrical short circuit caused through contact with an electrolyte to be suppressed, and operable to be applied as an anode of a capacitor; a method for manufacturing the electrode structure; and a capacitor including the electrode structure. The method for manufacturing the electrode structure includes: a covering layer formation step of forming on a surface of an aluminum material a covering layer of a dielectric precursor including valve metal; and a reduction heating step of heating in a reducing atmosphere including no carbon the aluminum material having the covering layer formed thereon. The electrode structure includes: an aluminum material; a covering layer being formed on a surface of the aluminum material, including valve metal, and having an electrically conductive portion; and an interposing layer being formed between the aluminum material and the covering layer and including aluminum and oxygen.10-18-2012
20110120750ELECTRICAL CIRCUIT ASSEMBLIES AND STRUCTURAL COMPONENTS INCORPORATING SAME - Composite structural components are disclosed that include electrically conducting fibres providing multiple signal or paths to electrical components disposed on or adjacent the material. The signal paths may therefore be embedded in the structural component as an intrinsic reinforcing element. Also disclosed are materials for making up the structure and fabrics and methods for the production thereof.05-26-2011
20080289853COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE - In a composite body, a frame body to be connected to a first major surface of a substrate body includes a frame member made of an insulating material and a plurality of connection members formed by bending thin metal plates. The frame member includes a through-hole at the approximate center thereof and extends along a peripheral portion of the first major surface of the substrate body so as to define a frame shape. Each of the plurality of connection members has a first strip and a second strip continuously connected to opposed ends of a middle strip. The connection members are disposed in the frame member so as to face each other with the through-hole therebetween. Each of the first strip and the second strip of the connection member is exposed on a corresponding one of the two major surfaces extending around the through-hole of the frame member. The first strip and the second strip extend in a direction in which the connection members face each other with the through-hole therebetween, and the opposed ends of the middle strip are continuously connected to an end of the first strip and an end of the second strip on the side adjacent to the through-hole. The middle strip extends through the inside of the frame member.11-27-2008
20110226509ELECTRICAL TRANSMISSION LINE - An electrical transmission line for transmitting electricity is made of a composite material in which aluminum and a plurality of carbon nanotubes are combined, and a weight ratio of the carbon nanotubes to the aluminum is 0.5 to 3 wt %. The carbon nanotubes are oriented at an angle within 30° along a length direction of the electrical transmission line.09-22-2011
20120318559ELECTRONIC COMPONENT, CONDUCTIVE PASTE, AND METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT - The conductive paste contains the following dispersed in a binder resin dissolved in a solvent: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide-comprising powder. The oxide contains vanadium with a valence no greater than 4 and a glass phase. In the method for manufacturing an electronic component, the conductive paste is applied to a substrate and fired, forming electrode wiring. The electronic component is provided with electrode wiring that has: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide affixing the particles to a substrate. The oxide contains vanadium with a valence no greater than 4. A compound layer containing vanadium and aluminum is formed on the surfaces of the particles, and the vanadium in the compound layer includes vanadium with a valence no greater than 4. This results in an electrode wiring with high reliability and water resistance.12-20-2012
20120298402METHOD FOR FORMING PATTERNED CONDUCTIVE FILM - The present invention is directed to a method for forming a patterned conductive film, which comprises the step of bringing a substrate having a layer made of platinum microcrystal particles formed thereon in a pattern and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120° C.11-29-2012
20100224390MULTILAYER STRUCTURE, ELECTRODE FOR ELECTRICAL CURCUIT USING THE SAME, AND METHOD FOR PRODUCING THE SAME - A multilayer structure including a transparent conductive thin film and a molybdenum metal thin film wherein difference of internal stress between the transparent conductive thin film and the molybdenum metal thin film is 1600 MPa or less.09-09-2010
20120325517RELIABLE WIRE STRUCTURE AND METHOD - A wire structure, which may be configured for a semiconductor device, is disclosed. The wire may include an elongate flexible core formed of a conductor material and a cladding layer covering an outer surface of the core. The cladding layer may be a conductor. In various aspects the cladding layer and core have a different grain sizes. An average grain size of the core material may several orders of magnitude greater than an average grain size of the cladding layer material. The cladding layer may be an alloy having a varying concentration of a minor component across its thickness. Methods of forming a wire structure are also disclosed.12-27-2012
20100175908Metal Strip, Connector, and Method of Manufacturing Metal Strip - A Ni plating is applied on a base metal in a metal strip form, and a brightener-free Sn-(1 to 4% by mass)Cu plating is applied on the Ni plating. The metal strip is heat-treated at a temperature at or above the melting point (solidus line) of a Sn-(1 to 4% by mass)Cu alloy to form a Cu—Sn compound layer or a Cu—Ni—Sn-compound layer on the Ni plating layer and a Sn layer or a Sn—Cu-ally layer on the Cu—Sn compound layer or the Cu—Ni—Sn-compound layer. The metal strip is further fabricated into a connector. Thus, a metal strip, which has good soldability on a substrate, is free from the occurrence of whiskers at a terminal part during storage or upon fitting into FPC or FFC, and is necessary for a lead-free connector, can be realized.07-15-2010
20120241193ELECTRICITY TRANSMISSION BODY AND PRODUCTION METHOD OF SAME - The present invention provides an electricity transmission body that is capable of realizing both tensile strength and elongation while having high electrical conductivity and that is also capable of adequately preventing poor conductivity attributable to the occurrence of cracking, and a production method thereof. The present invention is an electricity transmission body provided with an Al alloy conductive wire containing an Al alloy that contains 1.2 to 2.2% by mass of Fe, 0.15 to 0.4% by mass of Si, and 0.06 to 0.2% by mass of Cu, with the remainder being formed of Al and unavoidable impurities, and the mass ratio of Ti/Fe being 0.00045 to 0.00750.09-27-2012
20080236870ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.10-02-2008
20130175071PLATE-LIKE CONDUCTOR FOR A BUSBAR AND THE BUSBAR CONSISTING OF THE PLATE-LIKE CONDUCTOR - A plate-like conductor for a busbar, which is a clad member consisting of two copper layers derived from respective two copper plates clad on respective opposite major surfaces of an aluminum plate, an aluminum layer derived from the aluminum plate and formed integrally with the copper layers, and two alloy layers consisting of aluminum and copper and formed between the aluminum layer and the two copper layers.07-11-2013
20130140058GRAPHENE ELECTRICAL WIRE AND A METHOD FOR MANUFACTURING THEREOF - The present disclosure relates to a graphene electrical wire and a method for manufacturing thereof. In particular, the graphene electrical wire includes a metal core having a shape of fiber, and a graphene layer synthesized on the outer surface of the metal core. Also, the method includes the steps of providing a metal core having a shape of fiber, and synthesizing a graphene layer on the outer surface of the metal core.06-06-2013
20130140059SPIN-CURRENT EFFECT IN CARBON COATED CONDUCTORS - The present invention introduces a method and a structure for effectively generating spin currents in a metallic electric conductor. When, for example, a conductor manufactured from copper is evenly coated with a thin carbon layer, the internal direction of the magnetic axis, i.e. the spin, of the electrons acting as charge carriers can be polarized in such a way that the spins of the set of electrons align in the area of the interface between carbon and copper. This results in intensive generation of the spin current in the coated conductor. The generation of the spin current enables reduction of losses, shortening of delays relating to signal transfer and improvement of the general immunity to interferences.06-06-2013
20080196926Copper clad ballast wire - Copper clad wire for ballast of fluorescent lamps is disclosed as having a core wire of a lower priced metal core than copper and a copper coating fixed on the core wire by means of a thin diffusion layer.08-21-2008
20120273255Electrical Conductors Having Organic Compound Coatings - An electrical conductor includes a metallic substrate having a surface and an organic compound coating deposited on the surface. The organic compound coating may comprise a graphene coating, a carbon nanotube (CNT) coating or a blended graphene/CNT coating. The organic compound coating defines a separable interface of the electrical conductor configured to be mated to and unmated from a mating conductor. The organic compound coating is electrically conductive. The organic compound coating has a lower friction coefficient than the surface of the metallic substrate.11-01-2012
20100314157CONTACT UNIT AND METHOD FOR PRODUCING A CONTACT UNIT - The invention relates to a contact unit and particularly a solder pin, and a method for producing a contact unit, comprising a body having a metal core and a tin layer surrounding the metal core. The tin layer is thereby designed as a duplex layer, and comprises a radially inner layer overlay of matte tin and a radially outer layer overlay of glossy tin.12-16-2010
20130180757BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE - A bonding structure of a ball-bonded portion is obtained by bonding a ball portion formed on a front end of a multilayer copper bonding wire. The multilayer copper bonding wire includes a core member that is mainly composed of copper, and an outer layer that is formed on the core member and is mainly composed of at least one noble metal selected from a group of Pd, Au, Ag and Pt. Further, a first concentrated portion of such noble metal(s) is formed in a ball-root region located at a boundary with the copper bonding wire in a surface region of the ball-bonded portion.07-18-2013
20120018191COATING AND ELECTRONIC COMPONENT - The present invention provides a coating 01-26-2012
20130192874CONNECTING CONTACT - A connecting contact for SM D-components includes a metal material and the metal material at least partially comprises a coating with a different metal material. The connecting contact has a substantially laminar contact area for solderable contact to a board and comprises edge regions. At least one segment of the edge region is at a distance from the laminar contact area, so that a soldered fillet is formed for a soldered contact to a board. Also, a method for producing connecting contacts for SM D-components for solderably contacting a board includes the steps of punching metal strips, bending the metal strips so that a conducting region and a laminar contact area are produced, and forming the edge areas at the laminar contact area. At least one segment of the edge area is at a distance from the laminar contact area.08-01-2013
20130192873STRUCTURE BODY AND ELECTRONIC COMPONENT AND PRINTED WIRING BOARD INCLUDING THE SAME - This structure body includes a conductor comprising Cu as a main component, an intermediate layer formed on the conductor, and a protective layer formed on the intermediate layer, the intermediate layer includes at least Cu, Sn, Ni, and P, and the protective layer includes at least Ni and P.08-01-2013

Patent applications in class Composite