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Conductor structure (nonsuperconductive)

Subclass of:

174 - Electricity: conductors and insulators

174680100 - CONDUITS, CABLES OR CONDUCTORS

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
174126200 Composite 101
174128100 Plural strand 32
174126400 Metal coated on insulation 19
174133000 Noncircular strand section 18
174126300 Corrugated or slotted 1
20090159311BATTERY SYSTEM FOR A VEHICLE WITH SEVERABLE CONNECTIONS - A battery system for storing electrical power and supplying electrical power to a vehicle is disclosed. The system includes multiple battery packs, each with a plurality of cells. The cells in each battery pack are electrically connected with one another and the multiple battery packs are also electrically connected with one another to combine the total energy output of the cells of the system. The electrical connections between at least some of the cells include a severable feature, whereby the electrical connection is severed locally at the severable feature in response to an impact force that is in excess of a predetermined magnitude and/or an overcurrent/overtemperature condition.06-25-2009
Entries
DocumentTitleDate
20130043056THREE-DIMENSIONAL CROSSBAR ARRAY - A three-dimensional crossbar array may include a metal layer, and an insulator layer disposed adjacent the metal layer. A trench may be formed in the metal layer to create sections in the metal layer, and a portion of the trench may include an insulator. A hole may be formed in the trench and contact a section of the metal layer. The hole may define a via. A contact region between the via and the section of the metal layer may define a crossbar array.02-21-2013
20120168200METHOD FOR MANUFACTURING JOINT STRUCTURE OF STEEL SHEET AND ALUMINUM SHEET, AND JOINT STRUCTURE OF STEEL SHEET AND ALUMINUM SHEET MANUFACTURED BY THE METHOD - A process for producing a joint structure of a steel sheet and an aluminum sheet, in which the steel sheet and the aluminum sheet are joined to each other so as to be electrically connected to each other. The process is characterized by comprising a step of forming at least one resin coating film in a thickness of 0.1 to 5.0 μm on a contact surface on the steel sheet side, wherein the resin is selected from the group consisting of a polyolefin resin, a polyurethane resin and an epoxy resin.07-05-2012
20090229853SOLDER BUMP, ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT - An electronic component includes a plurality of first electrode pads arranged on a first substrate, a plurality of second electrode pads arranged at positions corresponding to the first electrode pads on a second substrate and a plurality of solder bumps which join together the first electrode pads and the second electrode pads. Here, the first substrate is located over the second substrate so that the first electrode pads and the second electrode pads are at positions which are shifted from opposite positions where the first electrode pads opposite to the second electrode pads, and at least a part of the solder bumps are solidified into hourglass-shaped.09-17-2009
20100084161CONDUCTIVE FILM AND PROCESS FOR MAKING SAME - A conductive polyolefin film characterized by acceptable physicals, no pinholes, and a resistance through its thickness of less than about 100 ohms, preferably less than about 10 ohms, and a method for making the same. The film includes a structural polymeric material such as a polyolefin blended with conductive additives such as carbon filler to produce desired characteristics. The film may be surface treated to enhance its ability to bond to other materials. The process includes combining and blending a plurality of resins with different conductive carbon loaded polymers, drying the conductive resin mix to a selected moisture content, converting the conductive film resin into a fluidized solid, and forming a film. The film and method of the present invention provide films suitable for use in a range of applications, including as conductive media for electrodes in batteries and capacitors or in desalination/deionization systems. The film has an inherent property of Positive Temperature Coefficient Resistance that may be selected by selecting the ratio of structural material and conductive material, wherein the film increases in resistance at selectable voltages and limits current at a particular point, protecting batteries from short circuit, for example.04-08-2010
20100071931LIGHTWEIGHT COMPOSITE ELECTRICAL WIRE WITH BULKHEADS - A lightweight composite electrical wire having a fusible alkali core encased or enclosed by a wall, and further including a plurality of transverse bulkheads that separate the core into a plurality of sections. In embodiments the core is sodium, and the wall is aluminum. The transverse bulkheads separate the core longitudinally, precluding or mitigating any loss of core material in accident scenarios, and may include visual and/or tactile indicators to facilitate identifying locations for cutting and connecting the conductor. A insulative outer layer may also provided. In an embodiment the fusible alkali core comprises a plurality of parallel elements separated laterally by wall material and longitudinally by the bulkheads. At least a portion of the bulkheads may be formed from a material having a melting temperature higher than the maximum normal operating temperature of the wire, but lower than the boiling point of the alkali core.03-25-2010
20100071930SOLVENT SOFTENING TO ALLOW DIE PLACEMENT - Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and seating IC elements onto/into a receiving substrate, such as a chip substrate. Specifically, the assembly of IC chips can include embedding IC elements onto the receiving substrate upon softening the receiving substrate. Such softening can be performed by using a softening agent and/or an activatable thermal barrier material. In an exemplary embodiment, pockets can be formed in the receiving substrate using the activatable thermal barrier material for the IC assembly.03-25-2010
20130037306MULTILAYER ELASTIC TUBE HAVING ELECTRIC PROPERTIES AND METHOD FOR MANUFACTURING THE SAME - A multilayer elastic tube having electric property, the multilayer elastic tube including: an elastic core having a tube shape; and an elastic rubber coating layer adhering to an inner surface of the core, the elastic rubber coating layer having at least one electric property of electric conductivity, piezoelectricity, and electric wave absorptiveness. The elastic rubber coating layer is formed by curing liquid elastic rubber having the electric property and adhering to the inner surface of the core, and has a closed loop shape to improve the electric property.02-14-2013
20130206454ELECTRODE FOR MEDICAL APPLICATIONS, SYSTEM HAVING SUCH AN ELECTRODE, AND METHOD FOR PRODUCING SUCH AN ELECTRODE - An electrode for intravascular medical applications for neuromodulation and/or nerve stimulation and/or neurological signal detection, wherein the electrode can be compressed and expanded in order to insert same into a hollow organ of a body and is or can be coupled to a current supply. A compressible and expandable lattice structure is provided, which has cells formed from lattice webs and is or can be coupled to the current supply, the lattice structure being obtained at least partially by physical vapor deposition.08-15-2013
20100139946SELF-ASSEMBLED NANOPARTICLES-NANOTUBE STRUCTURES BASED ON ANTENNA CHEMISTRY OF CONDUCTIVE NANORODS - The present invention relates in general to nanostructured materials and processes for making same. More particularly, the present inventions relates to a nanoscale composite structure and methods for making same involving a conductive nanorod comprising a tip at each of the nanorod extrema; and a material deposited on at the least the tips, wherein the material comprises a reduced form of a redox species, wherein the redox species is adapted for electrochemical reaction with the conductive nanorod when the conductive nanorod is stimulated as an antenna by an electric field.06-10-2010
20100044073Transparent conductive body and transparent conductive material - The transparent conductor of the present invention comprises a conductive layer containing a conductive particle, a binder, a polymerization initiator, and a radical scavenger. In the transparent conductor of the present invention, the conductive layer contains the radical scavenger in addition to the conductive particle. Therefore, even when the conductive particle is pumped upon irradiation with UV rays, so that a radical occurs in the conductive layer, the radical scavenger contained in the conductive layer captures the radical. This restrains the radical from acting on the remaining polymerization initiator and thereby causing a side reaction. As a result, adjacent conductive particles are restrained from fluctuating the distance therebetween.02-25-2010
20100044072Methods of Fabricating Complex Two-Dimensional Conductive Silicides - The embodiments disclosed herein relate to the fabrication of complex two-dimensional conductive silicide nanostructures, and methods of fabricating the nanostructures. In an embodiment, a conductive silicide includes a plurality of connected and spaced-apart nanobeams linked together at an about 90-degree angle, the plurality of nanobeams forming a two-dimensional nanostructure having a mesh-like appearance. In an embodiment, a method of fabricating a two-dimensional conductive silicide includes performing chemical vapor deposition, wherein one or more gas or liquid precursor materials carried by a carrier gas stream react to form a nanostructure having a mesh-like appearance and including a plurality of connected and spaced-apart nanobeams linked together at an about 90-degree angle.02-25-2010
20090159310Photonic-Crystal Transparent-Conductor Assembly - A photonic-crystal (PC)-based transparent-conductor assembly is disclosed, wherein the assembly includes a photonic-crystal cloaking element (PCCE) that surrounds at least one opaque conducting element. The PCCE has a refractive index distribution designed to “cloak” the at least one conductor contained therein from light incident upon the PCCE within a select wavelength range. The cloaking effect from the PCCE leaves light incident upon the assembly traveling in its original path as if undisturbed, thereby effectively rendering the conductor, as well as the PCCE, “transparent.” This allows for the formation of a transparent conductor from an otherwise opaque conductor. One or more such PC transparent-conductor assemblies can be configured so that a pattern of otherwise opaque conducting elements can form a transparent electrode array useful for a variety of electric-field-driven optical devices such as optical displays.06-25-2009
20090133899DRAWN STRAND FILLED TUBING WIRE - A wire for use in medical applications. The wire is formed by forming a bundle from a plurality of metallic strands and positioning the bundle within an outer tube. The tube and strands are then drawn down to a predetermined diameter to form a wire for use in medical devices. The wire may be covered with an insulating material.05-28-2009
20100000761Lead pin for package boards - Provided is a lead pin for package boards including a disk-shaped head of which the diameter increases toward the middle portion thereof and that has a hexagonal vertical cross-sectional shape; and a connection pin that is formed so as to project from the center of the upper surface of the head.01-07-2010
20130087363METAL NANOWIRES WITH HIGH LINEARITY, METHOD FOR PRODUCING THE METAL NANOWIRES AND TRANSPARENT CONDUCTIVE FILM INCLUDING THE METAL NANOWIRES - Metal nanowires with high linearity can be produced using metal salts at a relatively low temperature. A transparent conductive film can be formed using the metal nanowires. Particularly, the transparent conductive film has high transmittance, low sheet resistance, and good thermal, chemical and mechanical stability. The transparent conductive film has a high electrical conductivity due to the high linearity of the metal nanowires. The metal nanowires take up 5% or less of the volume of the transparent conductive film, ensuring high transmittance of the transparent conductive film. Furthermore, the metal nanowires are useful as replacements for existing conductive materials, such as ITO, conductive polymers, carbon nanotubes and graphene. The metal nanowires can be applied to flexible substrates and other various substrates due to their good adhesion and high applicability to the substrates. Moreover, the metal nanowires can find application in various fields, such as displays and solar cell devices.04-11-2013
20090266579INTERCONNECTOR - The present invention provides a solar module with inter-connectors with improved flexibility. The flexibility is achieved by placing a fabric between the solar elements. The fabric is conductive and may be soldered or welded to the solar elements.10-29-2009
20120222885Transparent conductive film for optoelectronic device - A transparent conductive (TC) film includes a main transparent conductive layer and a plurality of conductors electrically contacting with the main transparent conductive layer. The conductors are disposed on the surface of the main transparent conductive layer separately from each other. The transparent conductive film of the present invention has numerous separate conductors to collect electrical current which flow in the TC film, thereby reducing the internal resistance of the TC film while keeping the light transmission unchanged. Furthermore, the new conductor layout reduces the risk of the TC film from high current density damages, thereby achieving better reliability.09-06-2012
20110011618COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE - The present invention provides a semiconductor-device copper-alloy bonding wire which has an inexpensive material cost, ensures a superior ball joining shape, wire joining characteristic, and the like, and a good loop formation characteristic, and a superior mass productivity. The semiconductor-device copper-alloy bonding wire contains at least one of Mg and P in total of 10 to 700 mass ppm, and oxygen within a range from 6 to 30 mass ppm.01-20-2011
20130161066METHOD FOR MAKING CARBON NANOTUBE-LOADED ELECTRODE, CARBON NANOTUBE-LOADED ELECTRODE MADE BY THE METHOD, AND APPLICATIONS THEREOF - The present invention provides a method for fabricating a carbon nanotube-loaded electrode enabling that hybrid carbon nanotubes comprising dendrimer-encapsulated metal nanoparticles covalently immobilized on carbon nanotubes via a first covalent bond are made and such hybrid carbon nanotubes are then covalently immobilized on a metal electrode coated with a self-assembled monolayer via a second covalent bond. Also provided is a carbon nanotube-loaded electrode made by the method. The electrode thus made possesses high durability, reactivity and stability.06-27-2013
20110278044MAGNETIC ATTACHMENT STRUCTURE - The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package.11-17-2011
20080277140ELECTROLESS GOLD PLATING METHOD AND ELECTRONIC PARTS - Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold plating bath including a water-soluble gold compound, a completing agent, formaldehyde and/or a formaldehyde-bisulfite adduct, and an amine compound represented by the following general formula R11-13-2008
20090120666Clad Contact Point Material and Method for Mounting a Clad Contact Point Material - A clad contact point material 05-14-2009
20110284261WIRE MOUNT CATHODE - Wire-suspended thermionic cathodes provide lower power, further reduction in size, better stability and accuracy, and higher loading then conventional art. The cathodes are too small for use with conventional heaters and so are heated from behind by an electron beam or an intense light beam, such as laser light transmitted via optical fiber to the back of the cathode. The cathodes are electrically isolated from the focus electrode, thus allowing beam cutoff and modulation.11-24-2011
20110284265COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE - To provide a components joining method and a components joining structure which can realize joining of components while securing conduction at a low electrical resistance with high reliability.11-24-2011
20110284263CONDUCTIVE COMPONENT - A conductive component includes a tubular body having at least one of at least one through-hole which penetrates the tubular body from outside to inside thereof; and at least one notch which is cut in from an edge of the tubular body, which are formed at least one predetermined portion on the tubular body. The tubular body includes a first portion, which includes a solder joint portion, and a second portion, which includes a contact portion. The first portion and the second portion are located on the opposite sides from one another with the at least one predetermined portion sandwiched therebetween. The tubular body further includes at least one spring portion which includes the at least one predetermined portion.11-24-2011
20110284262Controlled Self Assembly of Anisotropic Conductive Adhesives Based on Ferromagnetic Particles - An anisotropic conductive adhesive (ACA) arrangement is disclosed, including a thermosetting resin disposed between a connector of a first structure and a connector of a second structure, and a plurality of ferromagnetic conductive particles dispersed through the thermosetting resin, wherein the plurality of ferromagnetic conductive particles form columns between the connector of the first structure and the connector of the second structure, and wherein a density of the ferromagnetic particles in the columns is substantially higher than a density of the plurality of ferromagnetic particles away from the columns.11-24-2011
20110284264CONDUCTOR OF HIGH VOLTAGE ELECTRICAL APPARATUS - In a conductor of a high voltage electrical apparatus, the conductor being placed in a vessel filled with insulating gas together with an electrical apparatus, the conductor is configured by a polygonal tubular conductor, and an opening portion which makes the insulating gas flowing in from an end portion of the polygonal tubular conductor flow out is formed in at least one surface of the polygonal tubular conductor. This aims to obtain the conductor of the high voltage electrical apparatus, the conductor being capable of achieving reduction in cost and high reliability.11-24-2011
20100170694THERMOPLASTIC-BASED, CARBON NANOTUBE-ENHANCED, HIGH-CONDUCTIVITY WIRE - A conductive wire includes a plurality of thermoplastic filaments each having a surface, and a coating material having a plurality of carbon nanotubes dispersed therein. The coating material is bonded to the surface of each thermoplastic filament. The thermoplastic filaments having the coating bonded thereto are bundled and bonded to each other to form a substantially cylindrical conductor.07-08-2010
20110290530RIBBON FOR PHOTOVOLTAIC MODULE - A ribbon for a photovoltaic module includes a plurality of first interconnection ribbons connected to one solar battery cell, a plurality of second interconnection ribbons connected to another solar battery cell, and a bus ribbon through which the first and second interconnection ribbons are connected. In the ribbon, the bus ribbon includes a first ribbon connecting portion connected to the plurality of first interconnection ribbons, a second ribbon connecting portion connected to the plurality of second interconnection ribbons, and a string connecting portion connected between the first and second ribbon connecting portions. Accordingly, it is possible to decrease resistance at the connected portion between the bus ribbon and the interconnection ribbon and to minimize loss caused by serial resistance, thereby improving the power and light conversion efficiency of solar battery cells.12-01-2011
20110297420High Performance Redox Capacitors Using Materials Possessing Non-Stoichiometry and Defect Chemical Equilibrium - A pseudocapacitor employs plates having an active material of a nanoparticles sized ceramic mixed ionic-electronic conductor such as may have the nominal formula of ABO12-08-2011
20110297419ELECTRODE FOR ELECTRICITY STORAGE DEVICE AND MANUFACTURING THE SAME - An electrode for an electricity storage device (12-08-2011
20100263909ELECTRIC CABLE - The invention relates to an electric conductor (L), made of an electrically conductive material comprising aluminum. The electric conductor is surrounded at least in a region intended for the connection of an electric contact element by a protective layer (10-21-2010
20090205850Steering fabric that facilitates reducing power use for proximity communication - One embodiment of the present invention provides a system that facilitates reducing the power needed for proximity communication. This system includes an integrated circuit with an array of transmission pads that transmit signals using proximity communication. This array is comprised of a set of macropads, where each given macropad is comprised of a set of micropads that can be configured to transmit a signal. A steering fabric routes signals to and within macropads, such that a subset of the micropads in the array can be configured to transmit the signal to a receiving component. Each macropad receives a limited number of input signals, with the steering fabric routing input signals to the micropads of the macropads. By limiting the number of input signals that are routed to the micropads of the macropads, the steering fabric eliminates redundant steering configurations for the array and reduces the power needed to transmit the signal.08-20-2009
20090188695NANOSTRUCTURES AND METHOD FOR MAKING SUCH NANOSTRUCTURES - The invention provides nanostructures, being arrays of nanosized filamentary material such as carbon nanotubes (CNTs) and other nanomaterials and especially to such materials connected to a substrate such as at least one top electrode and one bottom electrode, and to a method for manufacturing such nanostructures. A device according to the present invention comprises a first and a second layer (07-30-2009
20120024572CONDUCTIVE COMPOSITION, TRANSPARENT CONDUCTOR USING THE SAME, AND TOUCH PANEL CONTAINING THE TRANSPARENT CONDUCTOR - A conductive composition including metal nanowires having an average minor axis diameter of 5 nm to 45 nm, and a water-insoluble polymer containing at least one ethylenically unsaturated group selected from an acryloyl group and a methacryloyl group.02-02-2012
20120024571ELECTRODE ASSEMBLY - The present invention relates to an electrode assembly having a laminate structure comprising: a first insulating capping layer; a first conducting layer capped by the first insulating capping layer and substantially sandwiched by at least the first insulating capping layer such as to leave exposed only an electrical contact lip of the first conducting layer; and an array of etched voids extending through at least the first insulating capping layer and the first conducting layer, wherein each void is partly bound by a surface of the first conducting layer which acts as an internal submicron electrode.02-02-2012
20110147047POWER UMBILICAL - An umbilical for use, for example, in deep water applications includes a plurality of power cables and may include other elements bundled together and within a sheath. An end termination at each of the power cables or at a plurality of the power cables includes a resin ferrule around the cable at the end termination and provides a connection between the cable and an installation to which the umbilical is connected.06-23-2011
20090120665GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS AND HIGH RESIN FLOWABILITY RESISTANCE - There is provided a gold alloy wire for a bonding wire having high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire contains one kind or two kinds of Pt and Pd of 5000 ppm to 2% by mass in total, Ir: 1 to 200 ppm, Ca: 20 to 200 ppm, Eu: 10 to 200 ppm, Be: 0.1 to 30 ppm, if necessary, and La: to 200 ppm, if necessary. At least two kinds of Ca, Eu, Be, and La are in a range of 50 to 250 ppm in total.05-14-2009
20110168430METHOD OF FORMING METAL WIRING AND ELECTRONIC PART INCLUDING METAL WIRING - [Problems] To provide a method of forming metal wiring capable of forming metal wiring of ultrathin film and an electronic part including the metal wiring of ultrathin film.07-14-2011
20090272560CONDUCTIVE FILM AND METHOD OF PRODUCING THEREOF - A method for producing a conductive film, having the steps: forming, on a support, a conductive metal portion containing a conductive material and a binder; bringing the conductive metal portion into contact with vapor or a hot water; and immersing the conductive metal portion into hot water having a temperature of 40° C. or higher.11-05-2009
20110168429HYDRO-INSENSITIVE ELECTROLUMINESCENT DEVICES AND METHODS OF MANUFACTURE THEREOF - A water vapor permeable composite is disclosed for use in electroluminescent devices. The composite includes polymeric material having a first surface energy, a phosphorescent material dispersed within said polymeric material; and an electrically conductive material on at least one side of said polymeric material. The conductive material has a second surface energy, said the first and second surface energies are each between about 32 dynes/cm and 46 about dynes/cm. The polymeric material has a moisture vapor transmission rate of at least one gram/100 sq. inches for a 24 hour period at 100° F. for a one mil thick barrier.07-14-2011
20090038823WIRING SUBSTRATE WITH LEAD PIN AND LEAD PIN - A wiring substrate with lead pins formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials is provided and in the lead pin, the end face side bonded as opposed to the electrode pad of a head part formed in one end of a shaft part is formed in a conic protrusion part and also a vertex angle of the conic protrusion part is set in an angle range of 110° to 140°, and the conductive material is interposed between the conic protrusion part and the electrode pad and also extends to a flat part of the head part and reaches an outer surface of the shaft part and the lead pin is bonded to the electrode pad.02-12-2009
20080245549WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - In a method of manufacturing a wiring board, the method includes: (i) forming a plurality of conductive patterns to come into contact with a support plate; (ii) forming a resin layer to cover the plurality of conductive patterns and to come into contact with the support plate; (iii) forming another conductive pattern connected to at least one of the plurality of conductive patterns; and (iv) removing the support plate. A first area of the support plate coming into contact with at least one of the plurality of conductive patterns in step (i) is different in surface roughness from a second area of the support plate coming into contact with the resin layer in step (ii).10-09-2008
20090166055TRANSPARENT CONDUCTORS AND METHODS FOR FABRICATING TRANSPARENT CONDUCTORS - Transparent conductors and methods for fabricating transparent conductors are provided. In one exemplary embodiment, a method for fabricating a transparent conductor comprises forming a dispersion comprising a plurality of conductive components and a solvent, applying the dispersion to a substrate in an environment having a predetermined atmospheric humidity that is based on a selected surface resistivity of the transparent conductor, and causing the solvent to at least partially evaporate such that the plurality of conductive components remains overlying the substrate.07-02-2009
20090166056Contact member, connecting method of the contact member, and socket - A contact member inserted in a piercing hole of a socket provided between a first contacted member and a second contacted member facing each other, the contact member includes a first contact part configured to come in contact with a first pad formed in the first connected member; a second contact part configured to come in contact with a second pad formed in the second connected member; and a spiral cylindrical part formed in a spiral manner with respect to an axial line connecting the first pad and the second pad, the spiral cylindrical part having one end formed in a large diameter curved part having the first contact part, the spiral cylindrical part having another end formed in a small diameter curved part having the second contact part; the spiral cylindrical part having an external circumferential surface coming in contact with an inside wall of the piercing hole.07-02-2009
20100139947CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER - A circuit-connecting material for electrical connection of two circuit members with circuit electrodes formed thereon, with the circuit electrodes opposing, wherein the circuit-connecting material comprises an adhesive composition and conductive particles, and the conductive particles are conductive particles having a plurality of protrusions on the surface and consisting of a core made of an organic high molecular compound covered with a metal layer composed of nickel or a nickel alloy, the mean particle size of the core being 1-4 μm and the thickness of the metal layer being 65-125 nm.06-10-2010
20100206614ELECTRONIC FABRIC AND PREPARING THEREOF - Disclosed herein is an electronic fabric and preparing thereof. The electronic fabric comprises a backing layer configured to have a circuit electrically floated and a surface layer configured to electrically connect to the circuit of the backing layer. The backing layer or the surface layer comprises a) a base layer composed of a synthetic, regenerated or natural fiber and b) a conductive layer formed on the base layer to be capable of being freely formed by a pre-designed electric pattern. The base layer and the conductive layer are successively formed to be symmetrically to the backing layer and the surface layer to each other. An insulating layer is formed on the backing layer or the surface layer, or a partial upper portion of the conductive layer, or in a region where the conductive layer is not formed.08-19-2010
20090151981GAP FREE ANCHORED CONDUCTOR AND DIELECTRIC STRUCTURE AND METHOD FOR FABRICATION THEREOF - A microelectronic structure and a method for fabricating the microelectronic structure use a dielectric layer that is located and formed upon a first conductor layer. An aperture is located through the dielectric layer. The aperture penetrates vertically into the first conductor layer and extends laterally within the first conductor layer beneath the dielectric layer while not reaching the dielectric layer, to form an extended and winged aperture. A contiguous via and interconnect may be formed anchored into the extended and winged aperture while using a plating method, absent voids06-18-2009
20090183898Conductive Contact and Method of Manufacturing Conductive Contact - A shape of a cross-section perpendicular to a longitudinal direction of a main body section of a conductive contact is anisotropic.07-23-2009
20120067619CONNECTION METHOD, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE - [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost.03-22-2012
20120067618METHOD FOR PRODUCING A COATED ITEM BY MEANS OF TEXTURE ETCHING - The invention relates to a method for manufacturing a coated object (03-22-2012
20120067617PRINTING PASTE COMPOSITION AND ELECTRODE PREPARED THEREFROM - The present invention relates to a printing paste composition comprising a printing paste solvent of which the slow drying property and the swelling property are optimally controlled to obtain a printed pattern having excellent printability, and an electrode prepared therefrom. According to one embodiment of the present invention, provided is a printing paste composition which comprises 50-90 parts by weight of metal particles, 2-20 parts by weight of binder resin, 2-50 parts by weight of a solvent having a boiling point of 250 or higher and a swelling property (SP) of 5 or less, and 0.1-10 parts by weight of a glass frit; and a display panel electrode made with the printing paste composition. Due to the high boiling point and low swelling property of the solvent used in the composition of the present invention, the air drying of a solvent and the swelling of a blanket by a solvent in a cliché are inhibited in offset printing. Therefore, the printing paste composition containing the solvent shows excellent printability regardless of a plurality of repeated printing processes. That is, the linearity and clarity of a printed pattern are excellent, and a printed pattern is obtained, wherein the line height does not decrease, line width variation is small, and sheet resistance is constant. The printing paste composition of the present invention can be used for printing display panel electrodes.03-22-2012
20110139488Metamaterial and Method for Manufacturing Same - A metamaterial that includes a metallic wire and a supporting member. The metallic wire has a length of substantially half the wavelength of electromagnetic waves, and is coiled in the shape of a spring. The supporting member fixes the metallic wire such that the central axis of the metallic wire is parallel in direction to an electric field generated between a signal line through which an electric current flows and a ground. The metallic wire placed in such manner resonates with electromagnetic waves having a wavelength approximately twice as long as the metallic wire, and exhibits a negative dielectric constant.06-16-2011
20100155103ELECTRICALLY CONDUCTIVE INK - The invention relates to an electrically conductive ink comprising fine metal particles, an inorganic binder, and a solvent. The inorganic binder comprises a coupling agent containing Ti or Al or a chelate containing Ti or Al. It is preferred that the inorganic binder is present in an amount of 1 to 50 parts by weight per 100 parts by weight of the fine metal particles in the conductive ink. An electrical conductor thin film is produced by the process of printing the conductive ink on a substrate to form a printed pattern by additive processing and firing the printed pattern at 100° C. to 950° C.06-24-2010
20090211783LIGHT-TRANSMITTING METAL ELECTRODE AND PROCESS FOR PRODUCTION THEREOF - The present invention provides a light-transmitting metal electrode including a substrate and a metal electrode layer having plural openings. The metal electrode layer also has such a continuous metal part that any pair of point-positions in the part is continuously connected without breaks. The openings in the metal electrode layer are periodically arranged to form plural microdomains. The plural microdomains are so placed that the in-plane arranging directions thereof are oriented independently of each other. The thickness of the metal electrode layer is in the range of 10 to 200 nm.08-27-2009
20090229855 ELECTRODE AND METHOD OF FORMING THE MASTER ELECTRODE - An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (09-17-2009
20090229854Electrode and method of forming the electrode - An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (09-17-2009
20100263908METHOD FOR FABRICATION OF CONDUCTIVE FILM USING CONDUCTIVE FRAME AND CONDUCTIVE FILM - Disclosed are a method for fabricating a conductive film, and a conductive film fabricated by the same. The method comprises: forming a mixed solution consisting of at least one of a metallic precursor and a conductive polymer; spraying atomized droplets of the mixed solution on a surface of a substrate so as to form conductive frames; and coupling carbon nanotubes to the conductive frames so as to enhance electric conductivity. Accordingly, the conductive film can have enhanced electric conductivity, and can be easily fabricated.10-21-2010
20100263910Dry-Particle Based Adhesive and Dry Film and Methods of Making Same - Dry process based energy storage device structures and methods for using a dry adhesive therein are disclosed.10-21-2010
20100147552METHOD OF FORMING BENDS IN A WIRE LOOP - A method of forming a bend in a wire loop is provided. The method includes the steps of: (1) forming a first bend in the wire loop at a predetermined portion of the wire loop; (2) paying out a length of wire after step (1); and (3) forming a second bend in the wire loop at the predetermined portion after step (2).06-17-2010
20100147553Forced guidance of a connection material - The invention relates to a method for applying a connection material with a specified shape on at least one surface of at least one workpiece, wherein the connection material and the surface have complementary wetting or wettable properties, and wherein the connection material (06-17-2010
20100170695THERMOPLASTIC-BASED, CARBON NANOTUBE-ENHANCED, HIGH-CONDUCTIVITY LAYERED WIRE - A conductive wire includes a thermoplastic filament having a circumference and a plurality of coating layers dispersed about the circumference of the thermoplastic filament. The coating layers include a plurality of conductive layers comprising aligned carbon nanotubes dispersed therein and at least one thermoplastic layer between each pair of conductive layers.07-08-2010
20100186991 CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAME - A method of forming a conductive bump using a wire-bonding machine is provided. The method includes (a) depositing a free air ball bump on a contact pad of a semiconductor element, (b) forming a first fold of wire on the deposited free air ball bump, and (c) forming a second fold of wire on the first fold of wire.07-29-2010
20100258334SKIN MATERIAL OF VEHICLE INTERIOR EQUIPMENT AND MANUFACTURING METHOD FOR THE SAME - In a skin material of vehicle interior equipment, which includes a first fabric material that is formed of a first conductive wire material and a main fiber material weaker than the first conductive wire material, and a manufacturing method for the skin material, part of the main fiber material is removed from the first fabric material, and a conductive member, which is used to supply electric power to the conductive wire material, is electrically connected to the exposed first conductive wire material.10-14-2010
20100193218POLARIZABLE ELECTRODE - A polarizable electrode to be used in an electric double layer capacitor, which has an excellent depressing effect on the generation of gas, is coated on the surface thereof with a thin film layer of a gelling organic polymer compound whose thickness is less than 5 μm. As the gelling organic polymer compound, organic polymer compounds having —COO— bonds, or preferably acrylic polymers, can be used. Specific examples thereof include polyalkyl methacrylate or polyalkyl acrylate, which are capable of forming a stereocomplex. Among these, poly(methyl methacrylate) is preferable. Polyvinylidene fluoride resins can also be preferably used. It is preferable that an electrical double layer capacitor include a pair of polarizable electrodes and a separator disposed therebetween and that at least one of the pair of polarizable electrodes be the above-described polarizable electrode having an excellent depressing effect on the gas generation.08-05-2010
20100193219TRANSPARENT CONDUCTOR AND METHOD FOR PRODUCING THE SAME - A transparent conductor provided with a conductive layer that contains a cured Si oxide body and a conductive powder, characterized in that the conductive powder is fixed by the cured Si oxide body.08-05-2010
20100236815PLANAR CONTACT WITH SOLDER - A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.09-23-2010
20120031644ULTRACONDUCTING ARTICLES - Ultraconducting devices and methods of making thereof, said ultraconducting devices comprising continuous, aligned carbon nanotubes and a metallic matrix which substantially surrounds the carbon nanotubes.02-09-2012
20120193123POWER SUPPLY LINE FOR HIGH-FREQUENCY CURRENT, MANUFACTURING METHOD FOR SAME, AND POWER SUPPLY LINE HOLDING STRUCTURE - A power supply line for high-frequency current has a two-layered tubular conductor including an inner tube portion and an outer tube portion which is concentric to the inner tube portion and integrally linked thereto by four connecting portions along the entire length in the longitudinal direction. The four connecting portions are circumferentially disposed at predetermined intervals. By providing the four connection portions between the inner tube portion and the outer tube portion, it is possible to more accurately position the inner tube portion and to reduce high frequency resistance when compared with the likes of conventional power supply lines for high-frequency current having only one connecting portion between an inner tube portion and an outer tube portion.08-02-2012
20100126755ELECTRIC CONDUCTOR WITH GOOD CURRENT CAPABILITY AND A METHOD FOR IMPROVING THE CURRENT CAPABILITY OF AN ELECTRIC CONDUCTOR - The present invention relates to an electric conductor with large current capability and a method for enhancing current capability of an electric conductor, and particularly relates to a test probe with good current capability and a method for improving the current capability of a test probe. In the present invention, dents are formed on the surface of an electric conductor to make the surface rough, so that the electric conductor can have a greater surface area. The larger surface area of the electric conductor provides more paths for passage of the electric current in order to improve the current capability of the electric conductor.05-27-2010
20090020312PORTABLE ELECTRONIC DEVICE WITH CONDUCTING POLE - A portable electronic device (01-22-2009
20080230255ELECTRODE PATTERN AND WIRE BONDING METHOD - An electrode pattern for wire-bonding includes: a wire-bonding reference pattern indicating a reference position for determination of a wire-bonding position; and a wire-bonding recognition pattern. The distance between the reference position and a wire-bonding metal portion bonded to the electrode pattern and the distance between the wire-bonding recognition pattern and the wire-bonding metal portion satisfy predetermined relationships.09-25-2008
20100294535LIGHT-TRANSMITTING CONDUCTIVE FILM, DISPLAY DEVICE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF LIGHT-TRANSMITTING CONDUCTIVE FILM - An object is to provide a transparent conductive film having favorable transparency and conductivity at low cost. Another object is to reduce the resistivity of a transparent conductive film formed using conductive oxynitride including zinc and aluminum. Another object is to provide a transparent conductive film that is formed using conductive oxynitride including zinc and aluminum. When aluminum and nitrogen are made to be included in a transparent conductive film formed using oxide including zinc to form a transparent conductive film that is formed using conductive oxynitride including zinc and aluminum, the transparent conductive film can have reduced resistivity. Heat treatment after the formation of the transparent conductive film that is formed using conductive oxynitride including zinc and aluminum enables reduction in resistivity of the transparent conductive film.11-25-2010
20100294534CONDUCTOR WIRE FOR ELECTRONIC APPARATUS AND ELECTRICAL WIRE FOR WIRING USING THE SAME - Disclosed herein is a conductor wire for electronic device, which has high strength and excellent electrical conductivity and is composed of a copper alloy containing 0.5-3.0 mass percent, 0.1-1.0 mass percent of silicon, and the balance being copper and inevitable impurities. The copper alloy may further contain 0.1-3.0 mass percent of nickel and may further contain the sum total of 0.05-1.0 mass percent of one or two or more elements selected from the group consisting of iron, silver, chromium, zirconium and titanium. The copper alloy may also contain the sum total of 0.01-3.0 mass percent of one or two or more elements selected from the group consisting of 0.05-0.5 mass percent of magnesium, 0.1-2.5 mass percent of zinc, 0.1-2.0 mass percent of tin, 0.01-0.5 mass percent of manganese and 0.01-0.5 mass percent of aluminum.11-25-2010
20100294536TRANSPARENT CONDUCTOR AND PRODUCTION METHOD THEREOF - To provide a transparent conductor, containing: a convex-concave portion formed on a surface of a base such that a plurality of concave portions are aligned based on the surface; an auxiliary electrode layer formed of a conductive material, and provided at least on slant faces of the convex-concave portion; and a transparent conductive layer formed on surfaces of the convex-concave portion and the auxiliary electrode layer.11-25-2010
20110017493Carbon Microbeads with Hierarchical Structure - The preset invention is a hierarchically-structured carbon microbead and method for forming the microbead utilizing hydrothermal carbonization of a biomass/catalyst mixture to produce partially carbonized amorphous microspheres, wherein the biomass is an inexpensive material containing a high oxygen content component (e.g., sugar, starch, alcohol), and the catalyst is a metal or metal-containing compound, preferably a transition metal compound, and more specifically a transition metal selected from Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, and Pt. Subsequently, a heat treatment is performed where the amorphous microspheres are heated to a temperature that is sufficiently high so as to result in carbonization, graphitization, and production of a carbonaceous coating or shell on the core of the microbead.01-27-2011
20110024158CARBON-NANOTUBE/GRAPHENE-PLATELET-ENHANCED, HIGH-CONDUCTIVITY WIRE - A conductive wire includes an aramid fiber and at least one layer attached about the aramid fiber, the at least one layer including at least one of aligned carbon nanotubes and graphene platelets.02-03-2011
20110030991Large area deposition and doping of graphene, and products including the same - Certain example embodiments of this invention relate to the use of graphene as a transparent conductive coating (TCC). In certain example embodiments, graphene thin films grown on large areas hetero-epitaxially, e.g., on a catalyst thin film, from a hydrocarbon gas (such as, for example, C02-10-2011
20110127068POLYMER PARTICLE, CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE - An object of the present invention is to provide a polymer particulate material with a low compression modulus and a high recovery rate from compression deformation.06-02-2011
20110240337INTERCONNECTS FOR PHOTOVOLTAIC PANELS - Various embodiments of the invention provide an interconnect designed to be placed between layers of a photovoltaic laminate, and that has built-in in-plane stress relief features. In accordance with various embodiments, the interconnect, once implemented into a photovoltaic laminate, can withstand at least 200 temperature cycles, as is required by certain certifying bodies, without suffering failure. According to one embodiment of the present invention, an interconnect is provided for connecting a first photovoltaic cell to the bus array or a second photovoltaic cell within a photovoltaic laminate, the interconnect comprising: a single conductive wire having a cross-section sufficient for placement between layers of a photovoltaic laminate; wherein the single conductive wire comprises a stress-relief feature, and the stress-relief feature enables the interconnect to maintain a connection between the first photovoltaic cell and the bus array or the second photovoltaic cell while absorbing stress induced by a change in position of the first photovoltaic cell relative to a position of the bus array or the second photovoltaic cell.10-06-2011
20110240338Ternary Oxide Supercapacitor Electrodes - The present invention describes supercapacitors with enhanced energy density and power density, achieved largely through use of electrodes that incorporate ternary oxide(s). Ternary oxide(s) are ternary nanostructures have the formula A10-06-2011
20100200271ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER - In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.08-12-2010
20100038110ELECTRICALLY CONDUCTIVE, MECHANICALLY FLEXIBLE CONNECTION BETWEEN ELECTRICAL AND ELECTRONIC COMPONENTS - An electrical device having an electrical connection, which is made of a connecting material, between a first electrical or electronic component which is acted upon by a first thermal coefficient of expansion, and a second electrical or electronic component, which is acted upon by a second thermal coefficient of expansion, there being a difference between the first and the second thermal coefficient of expansion, which is in the range of D>≈10*10 E-6/K.02-18-2010
20100065303ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE AND METHOD FOR PRODUCING THE JOINED STRUCTURE - Provided is an anisotropic conductive film having enhanced adhesion strength to a circuit member and attaining high conduction reliability; a joined structure; and a method for producing the joined structure03-18-2010
20110100676HIGH STRENGTH AND HIGH CONDUCTIVITY COPPER ALLOY ROD OR WIRE - A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.05-05-2011
20110067899Lead pin for package substrate - A lead pin for a package substrate includes a coupling pin, a head portion, and a flowing prevention portion. The coupling pin is to be inserted into a hole which is formed in an external substrate. The head portion is formed at one end of the coupling pin. The flowing prevention portion is formed on the top surface of the head portion and prevents a solder paste from flowing toward the coupling pin on the top surface of the head portion when the head portion is mounted on the package substrate.03-24-2011
20120118606CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF - Disclosed herein are conductive film including: a base member; N transparent electrodes formed on one surface of the base member, the N transparent electrodes being arranged in a second direction of the base member, while being extended in a first direction of the base member; and electrode wirings each correspondingly connected to one end or both ends of the N transparent electrodes and including wiring portions configured of a plurality of wirings extended in a third direction of the base member and bent and extended in the second direction of the base member and insulating portions having the wiring portions impregnated therein and formed on an upper surface of one side or both sides of the transparent electrode and a manufacturing method thereof. Accordingly, the plurality of wirings are formed in a three-dimensional shape vertically in the insulating portion rather than a plane of the base member, making it possible to reduce the area of a non-display region due to the electrode wirings.05-17-2012
20110024159RELIABLE AND DURABLE CONDUCTIVE FILMS COMPRISING METAL NANOSTRUCTURES - Reliable conductive films formed of conductive nanostructures are described. The conductive films have low levels of silver complex ions and show substantially constant sheet resistance following prolonged and intense light exposure.02-03-2011
20110147048ELECTRODE STRUCTURE, WIRING BODY, ADHESIVE CONNECTION STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING SAME - There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.06-23-2011
20110147046SELF EXPANDING ELECTRODE CUFF - An electrode lead assembly is described. The lead assembly includes an expandable cuff electrode that includes a series of spaced apart electrode elements and a substantially re-closable opening.06-23-2011
20110147045Composite Material, A Structural Element Comprised of the Composite Material, An Airplane Wing Spar and Their Methods of Production - Disclosed is to a composite material, a structural element comprised of the composite material, an airplane wing spar and their methods of production. Some embodiments of the present invention include composite materials comprised of multiple layers of arrays of metallic bodies separated by layers of non-metallic material, wherein the orientation of metallic bodies in some metallic layers is structurally complementing to the orientation of metallic layers in adjacent metallic layers. Other embodiments of the present invention include structural elements, such as an airplane wing spar, comprised of the composite material.06-23-2011
20110147044SYSTEM TO IMPROVE CORELESS PACKAGE CONNECTIONS AND ASSOCIATED METHODS - A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent at least some of the connection members and respective ball grid array pads to increase respective connection members' inductance.06-23-2011
20090255710Solar cell lead wire and production method therefor and solar cell using same - A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.10-15-2009
20100300728NANOWIRES USING A CARBON NANOTUBE TEMPLATE - The present disclosure generally describes methods for forming nanowires on a substrate, where carbon nanotubes may be placed in a pattern on a surface of a substrate. The surface of the substrate may be exposed to conditions such that carbothermal reduction occurs between the carbon nanotubes and the substrate to form nanotrenches in the pattern, and a conductive material may be deposited into the nanotrenches for forming nanowires.12-02-2010
20110162870METAL NANOWIRE THIN-FILMS - A conductive nanowire film based on a high aspect-ratio metal is disclosed. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.07-07-2011
20110114367Vibration Resistant Cable - A vibration resistant cable having a first conductor and a second conductor. The second conductor may be twisted around the first conductor at a lay length configured to cause a locking force between the first conductor and the second conductor. The locking force may be configured to prevent relative movement of the first conductor and the second conductor that may result in bags in the vibration resistant cable. The lay length may be predetermined or may vary a predetermined amount per unit of length of the vibration resistant cable. The lay length maybe c05-19-2011
20110132637CONDUCTIVE RESIN COMPOSITION AND CHIP-TYPE ELECTRONIC COMPONENT - A conductive resin composition which allows a resin electrode which is favorable in terms of shape and adhesion to a ceramic device to be formed reliably, and a chip-type electronic component including resin electrodes formed with the conductive resin component are described. The conductive resin composition contains a linear bifunctional epoxy resin having a molecular weight of 11000 to 40000 and a terminal glycidyl group, a conductive silver powder, and a solvent, and has a yield value of 3.6 Pa or less. In addition, the conductive powder can have a surface attached to a fatty acid or a salt thereof, and the ratio of the fatty acid or salt thereof to the conductive powder is 0.5 wt % or less. Furthermore, the conductive powder can be spherical, and the ratio of the conductive powder in solids constituting the conductive resin composition can be 42 to 54 vol %.06-09-2011
20110174523Arrangement for Energy Conditioning - Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.07-21-2011
20100186992CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING THE SAME, WIRING USING THE CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a conductive paste in which fine metal particles are dispersed into a chemical adsorption liquid produced from a mixture of at least an alkoxysilane compound, a silanol condensation catalyst, and a nonaqueous organic solvent to form an organic thin film comprising molecules covalently bound to the surface of the fine metal particle by having the surface of the fine metal particle react with the alkoxysilane compound, so that fine metal particles that are given a reactive function to the surface are produced while almost maintaining the original conductivity of the fine metal particles, and further the particles are pasted with an organic solvent.07-29-2010
20090288855POSITIVE-TYPE RADIATION-SENSITIVE RESIN COMPOSITION FOR PRODUCING A METAL-PLATING FORMED MATERIAL, TRANSCRIPTION FILM AND PRODUCTION METHOD OF A METAL-PLATING FORMED MATERIAL - The positive-type radiation-sensitive resin composition for producing a metal-plating formed material relating to the present invention comprises (A) a polymer containing a structural unit having an acid-dissociative functional group, which is dissociated in the presence of an acid to generate an acidic functional group, and a crosslinking structure; (B) a radiation-sensitive acid generator; and (C) an organic solvent. The positive-type radiation-sensitive resin composition is excellent in sensitivity and resolution, exhibits excellent adhesion to a substrate, leaves no residue at an opening after development, and is capable of preventing occurrence of crack in the resin film after metal plating and push-in of plated metal into the resin film.11-26-2009
20110186331ELECTRICAL CONTACT - An electrical contact includes a soldering plate, first curved plate extended upwardly from one end of the soldering plate, a middle plate extended from the free end of the curved plate, a second curved plate extended upwardly from the free end of the soldering plate, a contact plate extended from the free end of the second curved plate, a vertical plate extended downwardly from each of opposite lateral edges of the contact plate and beyond a bottom surface of the middle plate, and a restricting plate extended inwardly from the vertical plate and positioned between the soldering plate and the middle plate. The movement of the contact plate and the middle plate are limited to resist a vertical force for preventing the electrical contact from permanent deformation in a vertical direction by the restricting plates.08-04-2011
20100025075Four-Layer Element and Method for Producing a Four-Layer Element - A multilayer element has a body in which at least one first internal electrode and at least one second internal electrode are arranged. These internal electrodes have an overlapping region, which extends up to the surface of the body on at least one side. The internal electrodes have a recess in a corner region of the body.02-04-2010
20120037400ELECTRICALLY ISOLATING POLYMER COMPOSITION - A composition that includes at least one crosslinkable monomer; at least one hydrophobic monomer; and at least one dielectric constant enhancing agent selected from dielectric enhancing monomers, ferroelectric particulates, and electroactive polymers. Coatings including the polymer of compositions, and articles including electrically isolating layers are also disclosed.02-16-2012
20090173516NANOTUBES AS MICROWAVE FREQUENCY INTERCONNECTS - The present invention provides nanotube interconnects capable of carrying current at high frequencies for use as high-speed interconnects in high frequency circuits. It is shown that the dynamical or AC conductance of single-walled nanotubes equal their DC conductance up to at least 10 GHZ, demonstrating that the current carrying capacity of nanotube interconnects can be extended into the high frequency (microwave) regime without degradation. Thus, nanotube interconnects can be used as high-speed interconnects in high frequency circuits, e.g., RF and microwave circuits, and high frequency nano-scale circuits. In a preferred embodiment, the nanotube interconnects comprise metallic single-walled nanotubes (SWNTs), although other types of nanotubes may also be used, e.g., multi-walled carbon nanotubes (MWNTs), ropes of all metallic nanotubes, and ropes comprising mixtures of semiconducting and metallic nanotubes. Applications for the nanotube interconnects include both digital and analog electronic circuitry.07-09-2009
20100300729PATTERN EXPOSURE METHOD, CONDUCTIVE FILM PRODUCING METHOD, AND CONDUCTIVE FILM - There are provided a pattern exposure method, a conductive film producing method, and a conductive film, wherein a photosensitive material is subjected to a proximity exposure through a photomask disposed with a proximity gap of 70 to 200 μm, and thereby is exposed in the mask pattern periodically in the conveying direction to obtain a conductive film. The conductive film has a plurality of conductive portions of first and second conductive thin metal wires and a plurality of opening portions. A side of each thin metal wire has a protrusion extending toward the opening portion from a virtual line representing a designed width of the thin metal wire, and the protruding amount of the protrusion is 1/25 to 1/6 of the designed width.12-02-2010
20110114366Spring with Multiple Conducting Coils - An electrically conductive spring having first and second coils defining first and second electrical pathways for completing an electric circuit between two components which may move relative to each other. In one embodiment, the spring is a double start helical spring with first and second coils extending between respective, electrically insulated ends with the coils extending in alternating, spaced relation to each other.05-19-2011
20100000762METALLIC PASTES AND INKS - A metallic composition including a solvent and a plurality of metal nanoparticles dispersed therein is formulated such that curing of the metallic composition on a substrate provides a metallic conductor with a resistivity of about 5×1001-07-2010
20120037399ANISOTROPIC CONDUCTIVE FILM AND METHOD OF FABRICATING THE SAME - A method of fabricating anisotropic conductive film comprises the steps of: mixing conductive particles, a resin material and a solvent to form slurry; and providing a separate means for progressively distributing the conductive particles on one side of the resin material when forming the anisotropic conductive film from slurry. The method disclosed in the present invention is easy to use, and the anisotropic conductive film fabricated by the method has high conductive particles capturing rate.02-16-2012
20100206613PROCESS FOR PREPARATION OF CONDUCTING POLYMERS - Methods of preparing conducting polymers and the conductive polymers prepared therefrom are provided. Electronic devices can be made using the polymers prepared as described herein. A method of preparing a conducting polymer is disclosed comprising: combining a di(C08-19-2010
20120006580Electrically Conductive Laminate Structures, Electrical Interconnects, And Methods Of Forming Electrical Interconnects - Some embodiments include electrical interconnects. The interconnects may contain laminate structures having a graphene region sandwiched between non-graphene regions. In some embodiments the graphene and non-graphene regions may be nested within one another. In some embodiments an electrically insulative material may be over an upper surface of the laminate structure, and an opening may extend through the insulative material to a portion of the laminate structure. Electrically conductive material may be within the opening and in electrical contact with at least one of the non-graphene regions of the laminate structure. Some embodiments include methods of forming electrical interconnects in which non-graphene material and graphene are alternately formed within a trench to form nested non-graphene and graphene regions.01-12-2012
20120061122CONDUCTOR FOR ELECTRIC WIRE, AND ELECTRIC WIRE FOR AUTOMOBILE - A conductor for electric wire that has excellent strength and excellent weldability, and an electric wire for automobile including the conductor. The conductor for electric wire contains a copper alloy having an oxygen content of 50 mass parts per million or less, the copper alloy containing 0.1 to 0.6 mass % Mg, and a balance of copper and an unavoidable impurity. It is preferable that the copper alloy further contains one or a plurality of material elements selected from the group consisting of Ag, In, Sr and Ca, the selected one or plurality of material elements being 0.0005 to 0.3 mass % in total. It is preferable that the copper alloy further contains 0.2 to 0.75 mass % Sn.03-15-2012
20120118607ELECTRIC WIRE OR CABLE - There is provided an aluminum-alloy material having sufficient electric conductivity and tensile strength as a wiring material and excellent in wire-drawing property, and an electric wire or cable using the same. An electric wire or cable includes an aluminum-alloy strand formed of an aluminum-alloy including Fe: 0.1% by mass or more to less than 1.0% by mass, Zr: 0 to 0.08% by mass, Si: 0.02 to 2.8% by mass, at least one of Cu: 0.05 to 0.63% by mass and Mg: 0.04 to 0.45% by mass, and the remainder being aluminum and unavoidable impurities.05-17-2012
20120125659COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE SUBSTRATE AND MANUFACTURING METHOD THEREOF, COPPER CONDUCTOR WIRING AND MANUFACTURING METHOD THEREOF, AND TREATMENT SOLUTION - Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.05-24-2012
20100288530Large-Diameter 3D Carbon Nano-Onion Structures - A method includes imparting energy to a target in an oxygen-containing atmosphere at room temperature to provide a substrate facing the target with a carbonaceous coating that includes nested carbon structures.11-18-2010
20120211261LAYERED ACTUATOR - The layered actuator comprises at least two electrode layers and an electronically nonconductive membrane in between, where the electrode layer contains carbide-derived carbon, a polymer material and an ionic liquid. The layered actuator bends due to relocation of the membrane ions when direct current is applied to the electrodes.08-23-2012
20120211260SHIELD WIRE, METHOD FOR PROCESSING TERMINAL TREATMENT OF BRAID OF THE SAME AND APPARATUS FOR PROCESSING TERMINAL TREATMENT OF BRAID OF THAT - For providing a shield wire, in which efficiency of processing terminal treatment of braid can be improved, and an apparatus for processing terminal treatment of braid, an apparatus for processing terminal treatment of braid of a shield wire includes a first hold unit holding a top of the braid covering the electric wire, a second hold unit holding a far-side of the braid, a push unit pushing the top toward the far-side so as to fold a part of braid from the top to form an overlap portion, and a forming unit forming the overlap portion into a cone shape, in which the top is located. The formed overlap portion is clamped by a set of inner and outer ring brackets.08-23-2012
20100051319CONTROLLING THE POROSITY OF METAL PASTES FOR PRESSURE FREE, LOW TEMPERATURE SINTERING PROCESS - Metal pastes and methods make it possible to produce extremely compact layers between contact surfaces of structural components, which layers are sufficiently elastic to permanently withstand mechanical and thermal stress variations. This is achieved by the porosity of a corresponding contact area being controlled. For this purpose, a metal paste is provided which contains 70-90% by weight of a metal powder, 1-20% by weight of an endothermically decomposable metal compound and 5-20% by weight of a solvent having a boiling point or range above 220° C., the metal paste being compactable exothermically to form a metal contact.03-04-2010
20100270055Electrically Conductive Films Formed From Dispersions Comprising Conductive Polymers and Polyurethanes - An aqueous dispersion and a method for making an aqueous dispersion. The dispersion including at least one conductive polymer such as a polythienothiophene, at least one polyurethane polymer and optionally at least one colloid-forming polymeric acid and one non-fluorinated polymeric acid. Devices utilizing layers formed of the inventive dispersions are also disclosed.10-28-2010
20120255762METAL NANOWIRES, METHOD FOR PRODUCING SAME, TRANSPARENT CONDUCTOR AND TOUCH PANEL - To provide metal nanowires which have high electrical conductivity and excellent heat resistance while maintaining excellent light transmission, a production method thereof, a transparent electrical conductor and a touch panel.10-11-2012
20110120749TRANSPARENT CONDUCTOR STRUCTURE - A transparent conductor structure includes a transparent, insulating substrate and a discontinuous, transparent conducting layer established on the substrate. The discontinuous conducting layer is partitioned into a plurality of segments, each of which has a thickness ranging from about 1 nm to about 10 μm. Two or more of the segments are connected together by i) a metal trace disposed on or between them, or ii) a mesh, formed from a plurality of metal traces, disposed across a surface of the segments.05-26-2011
20110266028CONDUCTIVE FILM AND METHOD FOR MAKING SAME - A method for making a conductive film includes: providing a carbon nanotube film defining a plurality of holes therein; attaching the carbon nanotube film on a substrate; adjusting a temperature of the carbon nanotube film in a range from about 7° C. to about 9° C.; dropping and rubbing a nanoparticle aqueous solution in the carbon nanotube film, the nanoparticles aqueous solution containing a plurality of nanoparticles; and adjusting the temperature of the carbon nanotube film in a range from about 24° C. to about 26° C. and drying the carbon nanotube film to obtain the conductive film on the substrate.11-03-2011
20110266029ALUMINUM ALLOY WIRE MATERIAL - An aluminum alloy wire material, which has an alloy composition containing: 0.1 to 0.4 mass % of Fe, 0.1 to 0.3 mass % of Cu, 0.02 to 0.2 mass % of Mg, and 0.02 to 0.2 mass % of Si, and further containing 0.001 to 0.01 mass % of Ti and V in total, with the balance being Al and unavoidable impurities, in which a grain size is 5 to 25 μm in a vertical cross-section in a wire-drawing direction thereof, and an average creep rate between 1 and 100 hours is 1×1011-03-2011
20130014973HIGH FREQUENCY CABLE, HIGH FREQUENCY COIL AND METHOD FOR MANUFACTURING HIGH FREQUENCY CABLE - A high frequency cable includes: a central conductor made from aluminum or an aluminum alloy; a covering layer made from copper covering the central conductor, and having a fiber-like structure in a longitudinal direction; and an intermetallic compound layer formed between the central conductor and the covering layer and having greater volume resistivity than the covering layer, wherein a cross-sectional area of the covering layer is 15% or less of an entire cross-sectional area including the central conductor, the intermetallic compound layer and the covering layer.01-17-2013
20090308635SPUTTERING TARGET, TRANSPARENT CONDUCTIVE FILM, AND TRANSPARENT ELECTRODE FOR TOUCH PANEL - A sputtering target which is composed of a sintered body of an oxide containing indium, tin and zinc as main components; the atomic ratio of In/(In+Sn+Zn) being 0.10 to 0.35; the atomic ratio of Sn/(In+Sn+Zn) being 0.15 to 0.35; and the atomic ratio of Zn/(In+Sn+Zn) being 0.50 to 0.70; and containing a hexagonal layered compound shown by In12-17-2009
20130098658Electrode Apparatus and Method of Manufacturing Electrodes - A method is provided for creating an electrode node array device. First and second conductors are stamped from a stock sheet. Each of the conductors has a plurality of raised protrusions. The protrusions are interleaved in a manner in which in both directions of the array, a raised protrusion of one conductor alternates with a raised protrusion of the other conductor. The method includes assembling the device in stages on a vacuum apparatus having guide pins that interact with guide holes on laminate sheets that are applied to both sides of the first and second conductors.04-25-2013
20130118774SPUTTERING TARGET, TRANSPARENT CONDUCTIVE FILM AND TRANSPARENT ELECTRODE - A sputtering target which is composed of a sintered body of an oxide which contains at least indium, tin, and zinc and includes a spinel structure compound of Zn05-16-2013
20130126211FIXTURE FOR COMPONENT TO BE MOUNTED TO CIRCUIT BOARD - An object is to provide a fixture for a component to be mounted on a circuit board which is easily manufactured and can exhibit good solderability and high whisker resistance. In a fixture which includes a solder joint plate part 05-23-2013
20130140057Carbon Nanotube Contact Structures For Use With Semiconductor Dies And Other Electronic Devices - A method of making carbon nanotube contact structures on an electronic device includes growing a plurality of carbon nanotube columns on a mandrel. Electrically-conductive adhesive is applied to ends of the columns distal from the mandrel, and the columns are transferred to the electronic device. An electrically-conductive material is deposited onto some or all of the columns. The mandrel can be reused to grow a second plurality of carbon nanotube columns.06-06-2013
20110209899Metal Interconnect Structure with a Side Wall Spacer that Protects an ARC Layer and a Bond Pad From Corrosion and Method of Forming the Metal Interconnect Structure - A metal interconnect structure, which includes a bond pad, an overlying anti-reflective coating layer, an overlying passivation layer, and an opening that exposes a top surface of the bond pad, eliminates corrosion resulting from the anti-reflective layer being exposed to moisture during reliability testing by utilizing a side wall spacer in the opening that touches the side wall of the passivation layer, the side wall of the anti-reflective coating layer, and the top surface of the bond pad.09-01-2011
20110220393NON-WOVEN FIBROUS MATERIALS AND ELECTRODES THEREFROM - Fibrous materials composed of activated carbon fibers and methods for their preparation are described. Electrodes comprising the fibrous materials are also disclosed.09-15-2011
20090194317Electrical Conductors and Devices from Prion-Like Proteins - The present invention provides novel polypeptides comprising a prion-aggregation domain and a second domain; novel polynucleotides encoding such polypeptides; host cells transformed or transfected with such polynucleotides; novel fibrils with specific functionalities and unusually high chemical and thermal stability; and methods of making and using the foregoing.08-06-2009
20100307792RELIABLE AND DURABLE CONDUCTIVE FILMS COMPRISING METAL NANOSTRUCTURES - Reliable and durable conductive films formed of conductive nanostructures are described. The conductive films show substantially constant sheet resistance following prolonged and intense light exposure.12-09-2010
20100307791Electrically Conductive Polymers - An electrically conductive film suited to use as a transparent anode, a method of forming the film, and an electronic device comprising the film are disclosed. The device includes a conductive polymer electrode defining first and second surfaces and having an electrical conductivity gradient between the first and second surfaces. A second electrode is spaced from the second surface by at least one organic material layer, such as a light emitting layer.12-09-2010
20120273254SOLDERING PAD - A pad includes a first mating section and a second mating section. The first mating section includes a first horizontal plane and a first inclined plane. The second mating section includes a second horizontal plane and a second inclined plane. The first mating section is a copper foil capable of being connected to a wire. The second mating section is made of insulating material. The first inclined plane and the second inclined plane are bonded together.11-01-2012
20100314156AU ALLOY WIRE FOR BALL BONDING - [Issues to be Solved] To provide Au alloy wire for ball bonding, which is superior in wire strength, and also is superior in formability of molten ball and roundness of compressed ball. Moreover it is superior at stitch bondability, and is available for high density wiring of semiconductor devices.12-16-2010
20110303435ALUMINUM ALLOY CONDUCTOR CABLE AND METHOD FOR MANUFACTURING THE SAME - Optimum compositional elements and contents (wt %) of an aluminum alloy conductor cable are newly established to enhance rigidity against vibration and electrical conductivity of the aluminum alloy conductor cable. Further, a process for the aluminum alloy conductor cable is presented to provide an aluminum alloy conductor cable having satisfactory tensile strength (mechanical strength) and electrical conductivity.12-15-2011
20130192872ELECTRODE, AND ELECTRONIC DEVICE COMPRISING SAME - The present invention relates to an electrode comprising an auxiliary electrode comprising a conductive pattern and a main electrode provided on at least a portion of the auxiliary electrode to be electrically connected to the auxiliary electrode, and a manufacturing method thereof.08-01-2013
20130199822FLEXIBLE, PERMEABLE, ELECTRICALLY CONDUCTIVE AND TRANSPARENT TEXTILES AND METHODS FOR MAKING THEM - Methods for forming a flexible, permeable, electrically conductive and substantially transparent textile utilizing vapor phase deposition are described. A number of applications of the electrically conductive textile are discussed.08-08-2013
20120298401METHOD FOR FABRICATING A THREE-DIMENSIONAL ULTRAFINE POLYMER CONDUCTING WIRE, OMNIDIRECTIONAL WIRING, AND ULTRAFINE POLYMER CONDUCTING WIRE FABRICATED USING THE METHOD - Disclosed herein is a method for fabricating a three-dimensional ultrafine conducting polymer wire having a high aspect ratio by local chemical polymerization using a micropipette. The fabricating method includes the steps of: (a) disposing a lower end of the micropipette, filled with an aqueous monomer solution corresponding to a conducting polymer, over a surface of a substrate at an alignment point at which the ultrafine conducting polymer wire is to be formed; (b) bringing the lower end of the micropipette into contact with the surface of the substrate at the alignment point; (c) drawing the micropipette away from the surface of the substrate by a predetermined distance to form a meniscus of the aqueous monomer solution between the lower end of the micropipette and the surface of the substrate; and (d) moving the micropipette in a growth direction of the ultrafine conducting polymer wire at a constant speed such that the meniscus is grown into the ultrafine conducting polymer wire having a high aspect ratio by a polymerization reaction of the meniscus with oxygen in the air.11-29-2012

Patent applications in class Conductor structure (nonsuperconductive)

Patent applications in all subclasses Conductor structure (nonsuperconductive)