| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 174264000 | Voidless (e.g., solid) | 80 |
| 20080257596 | WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD - A semiconductor device | 10-23-2008 |
| 20130075147 | PRINTED WIRING BOARD - A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer. | 03-28-2013 |
| 20130032389 | CONNECTION SUBSTRATE - A connection substrate | 02-07-2013 |
| 20100044094 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - The printed wiring board | 02-25-2010 |
| 20100044093 | LAYOUT GEOMETRIES FOR DIFFERENTIAL SIGNALS - In one embodiment the present invention includes an electrical arrangement comprising conductive elements such as electrical traces. The conductive elements carry differential signals. The conductive elements extend horizontally and have alternating sections around one or more center lines. Ground lines may be included the further enhance signal integrity. In one embodiment, magnetic field cancellation may be achieved by providing an offset between pairs of alternating differential elements. | 02-25-2010 |
| 20100096177 | Coreless substrate having filled via pad and method of manufacturing the same - Disclosed herein is a coreless substrate having filled via pads and a method of manufacturing the same. Insulating layers are formed on both sides of a build-up layer, and via-pads are embedded in the insulating layers such that the via-pads are flush with the insulating layers. The via pads are not separated from a substrate, and thus reliability of the pads is increased. Flatness of bumps is increased, and thus bonding of flip chips becomes easy. | 04-22-2010 |
| 20100032202 | Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate - A wiring substrate of the invention comprises electrical insulation substrate ( | 02-11-2010 |
| 20090057001 | INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF - An IC package includes: a multi-layered PCB having a plurality of insulating layers and a plurality of conductive pattern layers stacked in sequence and a plurality of via-holes formed through the plurality of the insulating layers for an electrical connection between the layers; and an IC chip disposed in a core insulating layer of the plurality of the insulating layers to be embedded in the multi-layered PCB and including a plurality of input/output pads on their surface. The input/output pads disposed at an outermost area of the IC chip are coupled to outer terminals by connection members without passing through said via-hole, the remaining input/output pads except for the input/output pads disposed at the outermost area of the IC chip are coupled to the outer terminals through the via-hole. | 03-05-2009 |
| 20110284281 | LAMINATED HIGH-FREQUENCY MODULE - In a laminated high-frequency module, a laminate includes a plurality of dielectric layers. In a lower layer region including some of the plurality of dielectric layers, a digital circuit is provided. In an interlayer region including some of the plurality of dielectric layers, a digital circuit and an analog circuit are arranged so that they do not overlap in plan view of the laminate. In an upper layer region including some of the plurality of dielectric layers, a digital circuit is provided. Digital ICs are mounted on the surface of the uppermost dielectric layer in the upper layer region. An inner-layer ground electrode is provided on substantially an entire boundary surface between the lower layer region and the interlayer region and on substantially an entire boundary surface between the interlayer region and the upper layer region. In the interlayer region, a digital line and an inner-layer ground electrode are alternately arranged in the lamination direction. | 11-24-2011 |
| 20110290549 | WIRING BOARD, WIRING BOARD MANUFACTURING METHOD, AND VIA PASTE - A wiring board includes a plurality of wirings laid via an insulating resin layer, and a via-hole conductor provided for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes a region made of copper particles, a first metal region mainly composed of tin, a tin-copper alloy, or a tin-copper intermetallic compound, and a second metal region mainly composed of bismuth, and has Cu/Sn of from 1.59 to 21.43. The copper particles are in contact with one another, thereby electrically connecting the wirings, and at least part of the first metal region covers around and extends over the portions where the copper particles are in plane contact with one another. | 12-01-2011 |
| 20090294167 | MULTILAYER WIRING BOARD - A multilayer wiring board is capable of preventing the occurrence of cracking in the vicinity of a connection portion of a conductor pattern disposed inside a basic material layer and a via-hole conductor even when the conductor pattern is connected to the via-hole conductor. A multilayer wiring board includes basic material layers and the constraining layers that are alternately stacked. In the material layer, a via-hole conductor is connected to an intermediate conductor pattern. An extended portion is defined by extending an end of the via-hole conductor beyond the intermediate conductor pattern inside the basic material layer. | 12-03-2009 |
| 20110214915 | PRINTED WIRING BOARD - A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. | 09-08-2011 |
| 20110168439 | MULTILAYER CERAMIC CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - There is provided a method of manufacturing a multilayer ceramic circuit board. A multilayer ceramic circuit board according to an aspect of the invention may include: preparing a plurality of ceramic green sheets; forming a recess having a desired line shape and a via hole connected to the recess in at least one of the plurality of ceramic green sheets; forming a conductive via by filling the via hole with a conductive material; forming a circuit line connected to the conductive via by filling the recess with a conductive material; stacking the plurality of ceramic green sheets upon one another to thereby form a ceramic green sheet stack; and sintering the ceramic green sheet stack. | 07-14-2011 |
| 20120024586 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT - A printed wiring board including a substrate that includes wiring through-hole portions where wiring through-holes which each penetrate the substrate from a surface on a front side of the substrate to a surface on a back side of the substrate, the wiring through-hole portions being made using a dielectric material having a thermal expansion coefficient different from a thermal expansion coefficient of the substrate; and thermal-expansion adjusting portions produced by filling prepared-holes with the dielectric material, the prepared-holes being produced at a surface of the substrate. The surface is partitioned into predetermined blocks, in each of which the thermal-expansion adjusting portions are placed in a layout that minimizes a difference between a thermal expansion coefficient in the block in a length direction and a thermal expansion coefficient in the block in a width direction according to a placement of the wiring through-hole portions in the block. | 02-02-2012 |
| 20090308652 | PACKAGE SUBSTRATE HAVING DOUBLE-SIDED CIRCUITS AND FABRICATION METHOD THEREOF - A package substrate having double-sided circuits and a method of manufacturing the same are proposed. The package substrate includes a core board having a plated through hole, a plurality of first electrical contact pads, and a first solder mask layer formed on the core board. A first wiring layer and a second wiring layer are disposed on two opposite surfaces of the core board, respectively, and electrically connected to the plated through hole. A portion of the first wiring layer is exposed from a first opening formed in the first solder mask layer. The first electrical contact pads are disposed on the exposed portion of the first wiring layer. The top surface of the first electrical contact pads is higher than that of the first wiring layer to thereby allow a semiconductor chip to be mounted on the electrical contact pads for improving electrical connection. | 12-17-2009 |
| 20090294166 | PRINTED WIRING BOARD - Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner space of the large-sized via. A small-sized through hole penetrates through the corresponding filling material along the longitudinal axis of the small-sized through hole. A small-sized via is formed in the shape of a cylinder along the inward wall surface of the small-sized through hole. The filling material and the core layer are uniformly distributed within the specific area in the in-plane direction of the core substrate. This results in suppression of uneven distribution of thermal stress in the core layer in the in-plane direction of the core layer. | 12-03-2009 |
| 20090038838 | CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME - A circuit board and a method for fabricating the same are provided. The circuit board includes a core board, a first bonding layer disposed on the core board, and a first wiring layer disposed on the first bonding layer. The first bonding layer enables the first wiring layer to be bonded to the core layer better, thereby preventing delamination and forming a fine-pitch wiring layer. | 02-12-2009 |
| 20080283288 | Printed circuit board using paste bump and manufacturing method thereof - A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained. | 11-20-2008 |
| 20080308315 | Multilayer printed circuit board and method of fabricating the same - This invention relates to a multilayer printed circuit board and a method of fabricating the same, which can increase the reliability of the multilayer printed circuit board and can decrease the process time to thus improve productivity. | 12-18-2008 |
| 20080264687 | Printed circuit board and manufacturing method thereof - A printed circuit board and a method of manufacturing a printed circuit board are disclosed. Using a method of manufacturing a printed circuit board, which includes: forming a multilayer board by alternately stacking circuit pattern layers and insulation layers such that a predetermined thickness of a partial area has only insulation layers stacked therein; and removing insulation layers from the partial area of the multilayer board, a printed circuit board can be manufactured that is suitable for a slim module. | 10-30-2008 |
| 20090178838 | CIRCUIT BOARD HAVING AN ELECTRODEPOSITED COATING ON A CONDUCTIVE CORE WITHIN A VIA AND METHOD OF MAKING SAME - A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening, and electrodepositing a third insulating material on the exposed edge of the first electrically conductive core. A circuit board fabricated using the process is also provided. | 07-16-2009 |
| 20120103679 | THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A through wiring substrate includes a substrate having a first face and a second face; and a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole, which penetrates between the first face and the second face. The through-hole has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and at least the inner peripheral part is formed in a circular arc shape in the longitudinal cross-section. | 05-03-2012 |
| 20120138352 | SUBSTRATE FOR ELECTRICAL COMPONENT AND METHOD - Insulating substrates may be selectively removed to form electrical connections between conductive patterns on different faces of the insulating substrate or between conductive patterns on the insulating substrate and external circuits. | 06-07-2012 |
| 20100018764 | SUBSTRATE-PENETRATING ELECTRICAL CONNECTIONS - A wafer assembly ( | 01-28-2010 |
| 20080314634 | Electromagnetic bandgap structure and printed circuit board - An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency. | 12-25-2008 |
| 20090008145 | EMBEDDED CIRCUIT STRUCTURE AND FABRICATING PROCESS OF THE SAME - A fabricating process for an embedded circuit structure is provided. A through hole is formed in a core panel and penetrates the core panel. Two indent patterns are respectively formed on two opposite surfaces of the core panel. A conductive material is electroplated into the through hole and the indent patterns, so as to form a conductive channel in the through hole and two circuit patterns in the indent patterns respectively. Portions of the circuit patterns, which exceed the indent patterns respectively, are removed for planarizing the circuit patterns to be level with the two surfaces of the core panel respectively. | 01-08-2009 |
| 20080277155 | Wiring substrate and method of manufacturing the same - In a method of manufacturing a wiring substrate of the present invention, a through-hole plating layer is formed from an inner surface of a through hole in a substrate to both surface sides, then a resin is filled in a through hole, and then a first resist in which an opening portion is provided on the through hole is formed. Then, a partial cover plating layer is formed in the opening portion in the first resist, then the first resist is removed, and then a second resist that covers a whole of the partial cover plating layer and has a pattern for patterning the through-hole plating layer is formed. Then, a pad wiring portion containing the partial cover plating layer and a wiring pattern are obtained by etching the through-hole plating layer while using the second resist as a mask. | 11-13-2008 |
| 20100307808 | WIRING BOARD - A wiring board includes a core substrate having a structure including an insulating base material and a large number of filamentous conductors densely provided in the insulating base material and piercing the insulating base material in a thickness direction thereof. Pads made of portions of wiring layers are oppositely disposed on both surfaces of the core substrate and electrically connected to opposite ends of a plurality of filamentous conductors in such a manner that the pads share the filamentous conductors. A wiring connection between one surface side and the other surface side of the core substrate is made through the pads. The insulating base material is made of an inorganic dielectric. Pads made of portions of the wiring layers are disposed on both surfaces of the core substrate and electrically connected only to corresponding one end sides of different groups each formed of a plurality of filamentous conductors. | 12-09-2010 |
| 20100307807 | DOUBLE-SIDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A method for manufacturing a double-sided circuit board includes preparing a substrate having the first and second surfaces, forming a first hole having a first opening with a diameter R | 12-09-2010 |
| 20090065246 | Circuit board structure and method for manufacturing the same - A circuit board disclosed in the present invention includes a core board on which a first circuit layer is placed, wherein the first circuit layer has a plurality of conductive pads; and at least one built-up structure covering the surface of the circuit board, which comprises a dielectric layer, a second circuit layer, and a plurality of conductive vias without being surrounded by annular metal rings. The conductive vias are conducted with the conductive pads of the first circuit layer and the second circuit layer. Besides, the surface of the second circuit layer is in the same height as the surface of the dielectric layer. Also, the present invention provides a method for manufacturing the above-mentioned circuit board structure. Therefore, a circuit board having fine circuits can be formed, and the shape of the circuit can be ensured efficiently. Moreover, electric performances of the circuit board can be improved. | 03-12-2009 |
| 20110042131 | Ceramic substrate and manufacturing method thereof - The present invention provides a ceramic substrate including: a ceramic stacked layer structure in which multiple ceramic layers are stacked to be interconnected through a via provided within each of the ceramic layers, the ceramic stacked layer structure having a hole provided therein to expose a top portion of the via provided within a ceramic layer of being a surface layer; a conductive material filled within the hole; and an external electrode formed on the surface of the ceramic stacked layer structure so that the external electrode is electrically connected to the conductive material, and a manufacturing method thereof. | 02-24-2011 |
| 20110240356 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a core substrate, a first laminated structure formed on a surface of the substrate and including conductive and insulation layers, and a second laminated structure formed on the opposite surface of the substrate and including conductive and insulation layers. The substrate has a connection conductor made of a plating. The insulation layers of the first laminated structure have connection conductors stacked one over another and made of platings. The insulation layers of the second laminated structure have connection conductors stacked one over another and made of platings. The connection conductors of the laminated structures are stacked on the connection conductor of the substrate. The connection conductors of the laminated structures include outer-layer connection conductors which have positions shifted in a substantially same direction from the position of the connection conductor of the substrate. | 10-06-2011 |
| 20110209911 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion. | 09-01-2011 |
| 20090218126 | PRINTED CIRCUIT BOARD - A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A write wiring trace is formed, above the write wiring trace, on the second insulating layer. A ground trace is formed on one side of the write wiring trace at a distance on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring trace and the ground trace. An opening is formed in a region, below the write wiring trace, of the suspension body. | 09-03-2009 |
| 20100038126 | INTERPOSER STRUCTURES AND METHODS OF MANUFACTURING THE SAME - Flexible and rigid interposers for use in the semiconductor industry and methods for manufacturing the same are described. Auto-catalytic processes are used to minimize the costs associated with the production of flexible interposers, while increasing the yield and lifetime. Electrical contact regions are easily isolated and the risk of corrosion is reduced because all portions of the interposer are plated at once. Leads projecting from the flexible portion of the interposers accommodate a greater variety of components to be tested. Rigid interposers include a pin projecting from a probe pad affixed to a substrate. The rigidity of the pin penetrates oxides on a contact pad to be tested. Readily available semiconductor materials and processes are used to manufacture the flexible and rigid interposers according to the invention. The flexible and rigid interposers can accommodate pitches down to 25 μm. | 02-18-2010 |
| 20100059265 | CONTACT OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A contact of semiconductor device and manufacturing method thereof prevent generation or inlet of noise through a contact plug which connects wires in different layers. The contact includes a lower wire, an insulating layer covering the lower wire, a contact plug connected to the lower wire through the insulating layer, a conductive tube encircling the contact plug and having the insulating layer in between, and an upper wire connected to the contact plug. | 03-11-2010 |
| 20110100698 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first rigid wiring board having a substrate with a penetrating hole, a first insulation layer formed on the substrate to cover at least one opening of the penetrating hole, and a first wiring layer formed on the first insulation layer, a second rigid wiring board having a second wiring layer on a main surface and being accommodated in the penetrating hole, a first connection conductor which connects the first wiring layer and the second wiring layer, and a first interlayer insulation layer formed on the first wiring layer. | 05-05-2011 |
| 20110067913 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer. | 03-24-2011 |
| 20080314635 | Printed circuit board having electromagnetic bandgap structure - A printed circuit board solving a mixed signal problem between an analog circuit and a digital circuit is disclosed. In accordance with an embodiment of the present invention, the printed circuit board, having an analog circuit and a digital circuit, includes: a first metal layer and a second metal layer, one of the first metal layer and the second metal layer being a power layer and the other being a ground layer; a third metal layer, layer-built between the first metal layer and the second metal layer; and a mushroom type structure including a via connected to a metal plate, the metal plate being arranged-in a space between circuit patterns of the third metal layer. With the present invention, the printed circuit board can lower the noise level within the same frequency band as compared with other structures having the same size. | 12-25-2008 |
| 20080314633 | Printed circuit board - A printed circuit board, which increases the contact area between an IC and a printed circuit board, thus increasing the degree of adhesion, is disclosed. The printed circuit board includes: an insulation layer which includes a first circuit pattern, including at least one via land, embedded in the upper surface of the insulation layer to be flush with the upper surface, and a second circuit pattern formed in the lower surface of the insulation layer to be flush with the lower surface; a solder resist layer formed on the insulation layer; a via hole and a bump integrally formed on the second circuit pattern through the via hole and the via land such that it protrudes from the insulation layer to be higher than the solder resist layer. | 12-25-2008 |
| 20080283287 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board and method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate, such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) or through hole penetrates the base substrate and vias are formed in at least one of the first substrate or the second substrate. | 11-20-2008 |
| 20120199389 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD - A method for manufacturing a printed wiring board, in which filled vias with a reduction in faulty connections are formed, and providing such a printed wiring board. After an electroless plated film is formed on an inner wall of a via opening, electrolytic plating is performed on insulative resin base material; the via opening is filled with plating metal and a filled via is formed. Therefore, during electrolytic plating, a plating metal is deposited from electroless plated film on the side wall of the via opening as well as from the bottom of the via opening. As a result, the via opening may be completely filled through electrolytic plating, forming a filled via with a reduction in faulty connections. | 08-09-2012 |
| 20110132652 | STRUCTURE OF VERY HIGH INSERTION LOSS OF THE SUBSTRATE NOISE DECOUPLING - A structure includes a substrate comprising a region having a circuit or device which is sensitive to electrical noise. Additionally, the structure includes a first isolation structure extending through an entire thickness of the substrate and surrounding the region and a second isolation structure extending through the entire thickness of the substrate and surrounding the region. | 06-09-2011 |
| 20100163297 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a substrate having a first surface, a second surface on the opposite side of the first surface and a through-hole extending between the first and second surfaces, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor filling the through-hole and connecting the first and second conductive circuits. The through-hole has a first opening portion tapering from the first surface toward the second surface and a second opening portion tapering from the second surface toward the first surface. The substrate is made of a resin and a reinforcing material portion in the resin. The reinforcing material portion has a protruding portion protruding into the through-hole at the intersection of the first and second opening portions. The protruding portion encroaches into the through-hole conductor. | 07-01-2010 |
| 20090308651 | WIRING SUBSTRATE INCLUDING CONDUCTIVE CORE SUBSTRATE, AND MANUFACTURING METHOD THEREOF - A wiring substrate includes a core substrate having a first main surface and a mutually opposing second main surface, the second main surface having a conductive property. A first through hole penetrates a core substrate. A first conductive layer extends from the first main surface to the second main surface via the first through hole. An insulating layer is formed on the first conductive layer. A second through hole has the insulating layer as an interior wall. And a second conductive layer is formed inside the second through hole. | 12-17-2009 |
| 20110259631 | METHOD AND APPARATUS FOR LASER MACHINING RELATIVELY NARROW AND RELATIVELY WIDE STRUCTURES - The method uses a common optical, system and sequentially creates structures of different sizes in a polymer substrate by means of different laser processes is described. One process uses a laser beam that is tightly focussed on the substrate surface and is used for creating fine groove structures by semi-continuous direct write type beam movement. The second process uses a second laser beam that is used to form a larger size image on the substrate surface and is used to create blind pads and contact holes in the substrate in step and drill mode. A third optional process uses the second laser beam operating in direct writing mode to remove layers of the substrate over larger continuous areas or in a mesh type pattern. | 10-27-2011 |
| 20100025099 | Circuit board and method of manufacturing the same - A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability. | 02-04-2010 |
| 20090255722 | Printed circuit board having landless via hole and method of manufacturing the same - This invention relates to a printed circuit board having a landless via hole, including a circuit pattern formed on a via made of a first metal and having a line width smaller than the diameter of the via hole, in which the circuit pattern includes a seed layer made of a second metal and a plating layer made of a third metal, which is different from the second metal, and to a method of manufacturing the same. In the printed circuit board, the via has no upper land, thus making it possible to finely form the circuit pattern which is connected to the via, thereby realizing a high-density circuit pattern. | 10-15-2009 |
| 20110303454 | LAMINATED CIRCUIT BOARD AND BOARD PRODUCING METHOD - A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is made of a bonding resin, being laid between the first wiring board and the second wiring board, wherein the bonding layer electrically connects the first land and the second land via a conducting material; anda plate that has a through-hole into which the conducting material is supplied, wherein the plate has a resin accommodating space that accommodates therein an excess bonding resin that appears during layer stacking. | 12-15-2011 |
| 20110303453 | LAMINATED CIRCUIT BOARD AND BOARD PRODUCING METHOD - A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is laid between the first wiring board and the second wiring board and electrically connects the first land and the second land via a conducting material; and a plate that has a through-hole through which the first land is connected to the second land, wherein a diameter of the through-hole of the plate is larger than a diameter of a component that is made by filling the conducting material. | 12-15-2011 |
| 20120145447 | Via structure, method for forming the via structure, and circuit board with the via structure and method for manufacturing the circuit board - Disclosed herein is a via structure with a conductive via. There is provided a via structure, including: a substrate laminate having a multilayer structure and a via hole penetrating through the multilayer structure; a first circuit pattern formed on one surface of the substrate laminate; a second circuit pattern formed on the other surface of the substrate laminate; and a conductive via formed in the via hole and having one end connected to the first circuit pattern and the other end connected to the second circuit pattern, wherein the multilayer structure includes resin layers having different etching rates using an alkaline solution. | 06-14-2012 |
| 20110155439 | MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - The multilayer wiring substrate includes: a first insulating layer comprising a first surface and a second surface opposite to the first surface; a second insulating layer on the first surface of the first insulating layer; a first wiring pattern on the second surface of the first insulating layer; a second wiring pattern on a surface of the second insulating layer; a first via formed through the first insulating layer; a second via formed through the second insulating layer; and a third wiring pattern formed on the first surface of the first insulating layer and embedded in the second insulating layer, the third wiring pattern having a hole therethrough. A diameter of the hole is smaller than each diameter of the first and second vias. The first via and the second via are connected to each other through a metal filled in the hole of the third wiring pattern. | 06-30-2011 |
| 20120111625 | Printed circuit board and method for filling via hole thereof - Disclosed herein is a method for filling a via hole of a printed circuit board, the method including: a dividing step of dividing a via hole that is to be formed in a base substrate into a predetermined number; a first via forming step of forming a first divided via by primarily processing portions of the divided via hole; a first filling step of filling the formed first divided via with a metal; a second via forming step of forming a second divided via by secondarily processing other portions of the divided via hole; and a second filling step of filling the formed second divided via with a metal to fill the via hole, thereby making it possible to fill the via hole without a dimple. | 05-10-2012 |
| 20100155130 | Multilayer Printed Wiring Board - A multilayer printed wiring board comprises insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof. | 06-24-2010 |
| 20120012380 | Back Drill Verification Feature - A back drill verification feature is provided on a layer of a circuit board. Before a back drill operation is performed, an electrical connection exists between conductive material in a via hole and the back drill verification feature. After the back drill operation, the electrical connection is severed. | 01-19-2012 |
| 20120055708 | ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR PRODUCING THE ELECTRONIC COMPONENT PACKAGE SEALING MEMBER - An electronic component package includes a first sealing member and a second sealing member. The first sealing member has one principal surface on which an electronic component element is to be mounted. The second sealing member is opposite the first sealing member. The second sealing member hermetically encloses an electrode of the electronic component element. A through hole passes through between one principal surface and another principal surface of a substrate constituting the first sealing member. A conducting material fills the through hole. A resin material seals an open end portion of the through hole at a side of the other principal surface of the substrate. | 03-08-2012 |
| 20120247824 | SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit includes a conductive pattern on a top surface thereof. A folded-back portion that is capable of being folded back toward a back surface side is provided therein. At the circumference edge of the folded-back portion, a part of the circumference edge is continuous to the suspension board with circuit around the folded-back portion via a bent portion and the remaining portion of the circumference edge is disposed apart from the suspension board with circuit around the folded-back portion by a penetrating space that penetrates the suspension board with circuit in a thickness direction. The conductive pattern at least includes a top-surface-side terminal that is disposed on the top surface of the suspension board with circuit and a back-surface-side terminal that is disposed in the folded-back portion. | 10-04-2012 |
| 20090139760 | Multilayer printed wiring board and method of manufacturing the same - A multilayer printed wiring board including an insulation layer and a first interlayer resin insulation layer provided on the insulation layer. A layered capacitor section is provided on the first interlayer resin insulation layer and has a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. Also included is a second interlayer resin insulation layer provided on the first interlayer resin insulation layer and the layered capacitor section, and a metal thin-film layer provided over the layered capacitor section and on the second interlayer resin insulation layer. An outermost interlayer resin insulation layer is provided on the second interlayer resin insulation layer and the metal thin-film layer, and a mounting section is provided on the outermost interlayer resin insulation layer and has first and second external terminals to mount a semiconductor element. Multiple via conductors penetrate each interlayer resin insulation layer. The via conductors include first via conductors that electrically connect the first layered electrode to the first external terminals, and second via conductors that electrically connect the second layered electrode to the second external terminals. | 06-04-2009 |
| 20100096178 | NON-SHIRINKAGE CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF - A non-shrinkage ceramic substrate includes: a ceramic laminated body formed by laminating a plurality of green sheets; an electrode part including a via electrode penetratingly formed at the ceramic laminated body and an outer electrode formed on a surface of the ceramic laminated body and electrically connected with the via electrode; and an interface part formed between the ceramic laminated body and the electrode part to prevent an electrical connection between the electrodes from weakening. | 04-22-2010 |
| 20090133919 | MULTILAYER PRINTED WIRING BOARD, METHOD FOR MANUFACTURING BUILDUP PRINTED WIRING BOARD, AND ELECTRONIC APPARATUS - A multilayer printed wiring board includes: an insulating base including an indentation section formed thereon; a conductor pattern formed on the insulating base, the conductor pattern including a thick film section formed by embedding a conductor in the indentation section; and a via hole section formed in an upper layer of the insulating base, the via hole section including a bottom portion that is in contact with the thick film section. | 05-28-2009 |
| 20120168221 | RELAY BOARD FOR TRANSMISSION CONNECTOR USE - A relay board for relaying plurality of electric wires to a transmission connector, the relay board provided with first and second front ground pads | 07-05-2012 |
| 20120168220 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a multi-layer printed circuit board and a method of manufacturing the same. In the multi-layer printed circuit board and the method of manufacturing the same, circuit layers formed in a plurality of insulating layers are electrically interconnected through vias formed in a lump, thereby making it possible to secure bonding reliability of an interlayer circuit layer and more stably secure performance of the printed circuit board. In addition, since a stacked type via structure may be implemented by performing a via hole drilling process, a desmear process, and a copper plating process only one time after an insulating layer and an circuit layer are stacked, a manufacturing process, a manufacturing time, and manufacturing costs of the stacked type via structure may be reduced. | 07-05-2012 |
| 20090020327 | Wiring unit, method for producing wiring unit, liquid jetting apparatus, and method for producing liquid jetting apparatus - A wiring unit includes a first insulating layer which is provided with an electrode and a wire electrically connected to the electrode on one surface of the first insulating layer; a second insulating layer which is formed on the one surface of the first insulating layer and which covers the wire; an adhesive layer which is formed on a surface, of the second insulating layer, not facing the first insulating layer; a through hole which is formed through the adhesive layer and the second insulating layer and in which the electrode is exposed; a protective sheet which is detachably adhered on a surface, of the adhesive layer, not facing the second insulating layer, and; and a liquid electroconductive material which is filled in a space defined by the through hole, the electrode exposed in the through hole, and the protective sheet. | 01-22-2009 |
| 20120261179 | INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An interposer substrate of the present invention includes a planar substrate, and through hole wiring that is formed by filling a through hole that connects together a first main surface and a second main surface of this substrate with a conductor. When the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape whose side walls are formed by an inside surface of the through hole, and two side faces of the trapezoid are not parallel to each other. The two side faces of the trapezoid are both inclined towards the same side relative to two perpendicular lines that are perpendicular to the first main surface or the second main surface at two apex points forming a top face or a bottom face of the trapezoid. | 10-18-2012 |
| 20110120762 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board including a substrate having first and second surfaces and a penetrating hole extending through the substrate between the surfaces, a first conductive circuit on the first surface, a second conductive circuit on the second surface, and a through-hole conductor in the hole and connecting the first and second conductive circuits. The conductor includes an electroless plated film on the inner-wall surface of the hole, a first electrolytic plated film formed on the electroless plated film and forming a first opening portion opening on the first surface and a second opening portion opening on the second surface, a second electrolytic plated film filling the first portion, and a third electrolytic plated film filling the second portion. The first and second portions taper toward the central portion of the hole with respect to the axis direction of the hole and have cross sections forming a substantially U-shape, respectively. | 05-26-2011 |
| 20110036626 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board including a first insulating layer, a first conductor layer having conductor circuits on one surface of the first insulating layer, a second conductor layer having conductor circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having conductor circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes which are formed in openings of the first and second insulating layers and made of conductive materials filled to the top of the openings such that conductor circuits in the first and third conductor layers are connected to one or more conductor circuits in the second conductor layer, and the first and second via holes are tapering toward the second conductor layer. | 02-17-2011 |
| 20120298410 | Interposer Testing Using Dummy Connections - An interconnection component includes a substrate, and an active through-substrate via (TSV) penetrating through the substrate. Active metal connections are formed over the substrate and electrically connected to the active TSV. At least one of a dummy pad and a dummy solder bump are formed at surfaces of the interconnection component. The dummy pad is over the substrate and electrically connected to the active TSV and the active metal connections. The dummy solder bump is under the substrate and electrically connected to the active metal connections. The dummy pad and the dummy solder bump are open ended. | 11-29-2012 |
| 20110220406 | ELECTRODE PORTION STRUCTURE - In an electrode portion structure in which an electrode is formed in an end portion of a through-wiring, disconnection is prevented in an electrode portion. A through-hole that vertically pierces a substrate is made in the substrate, and a through-electrode is provided in the through-hole. The through-electrode is projected in s curved-surface manner from an upper surface of the substrate. The upper surface of the substrate | 09-15-2011 |
| 20110220405 | METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a multilayer printed wiring board, the method includes forming a group of first through holes in a first insulating substrate; forming a group of second through holes in a second insulating substrate that has the same shape and the same size as a shape and a size, respectively, of the first insulating substrate, the second through holes having the same shape and the same size as a shape and a size, respectively, of the first through holes and being formed at the same positions as positions at which the first through holes are formed. At least one of the first through holes is filled with a first conductive member and at least one of the second through holes is filled with a second conductive member. And stacking the first insulating substrate and the second insulating substrate together. | 09-15-2011 |
| 20120298411 | ON-CHIP INTERCONNECTS WITH REDUCED CAPACITANCE AND METHOD OF AFBRICATION - An electronics interconnection system is provided with reduced capacitance between a signal line and the surrounding dielectric material. By using a non-homogenous dielectric, the effective dielectric constant of the material is reduced. This reduction results in less power loss from the signal line to the dielectric material, and therefore reduces the number of buffers needed on the signal line. This increases the speed of the signal, and reduces the power consumed by the interconnection system. The fabrication techniques provided are advantageous because they can be preformed using today's standard IC fabrication techniques. | 11-29-2012 |
| 20120085574 | Heat radiating substrate and method of manufacturing the same - Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured. | 04-12-2012 |
| 20130092429 | CROSS TALK REDUCTION FOR HIGH-SPEED ELECTRICAL CONNECTORS - An electrical connector includes a printed circuit board that includes a body that carries a plurality of ground conductors that define respective ground contact pads, and a plurality of signal conductors that define respective signal contact pads. The contact pads are configured to mate with electrical contacts of a complementary electrical connector. The printed circuit board includes a ground coupling assembly that electrically connects at least a pair of the ground conductors. | 04-18-2013 |
| 20130098670 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME - Embodiments of the present invention provide a wiring substrate that includes a structure where a plurality of projection electrodes are arranged within an electrode formation region on a substrate main surface. At least one among the plurality of projection electrodes has a larger outer diameter than an outer diameter of a via conductor and is a variant projection electrode which has a roughened upper surface. Embodiments of the present invention also provide methods for manufacturing wiring substrates having one or more of said variant projection electrode. | 04-25-2013 |
| 20130118793 | METHOD FOR FILLING THROUGH HOLE OF SUBSTRATE WITH METAL AND SUBSTRATE - The present invention relates to a method for filling a through hole of a substrate with a metal. The method includes a step of preparing a bonded substrate including a first substrate having conductivity in at least a surface thereof and a second substrate having a through hole, both substrates being bonded to each other through a nonionic surfactant; a step of exposing, in the bonded surface of the bonded substrate, the conductive surface of the first substrate, which is positioned at the bottom of the through hole, by removing the nonionic surfactant positioned at the bottom of the through hole of the second substrate; and a step of filling the through hole with a metal by applying an electric field to the conductive surface of the first substrate. | 05-16-2013 |
| 20130140073 | ROUTING STRUCTURE FOR CONNECTING SENSOR ELECTRODES USING BLACK ARTWORK ON TOUCH-PANEL GLASS - A structure and method is disclosed for a routing structure for connecting the transparent conductive oxide (TCO) electrodes of a touch-sensor panel to a touch controller while providing the requisite cross-over routing. Routing is confined to the border area of a single glass panel where there is no need for transparency. By applying the TCO electrodes to the glass surface, first, and then applying the non-conducting artwork layer above them, there is no need to extend the TCO electrodes above the glass surface and, thereby, subject these thin and brittle electrodes to mechanical stress. Instead, vias are positioned in the artwork then filled with conductive plugs. These provide the connectivity between the TCO electrodes and metal traces above them. | 06-06-2013 |
| 20080196935 | Multilayer printed wiring boards with copper filled through-holes - Printed circuit boards have circuit layers with one or more copper filled through-holes and methods of manufacturing the same. An aspect of an embodiment of the present invention enhances thermal characteristics of filled through-holes of printed circuit boards to provide extra reliability to the printed circuit boards. In one embodiment, a printed circuit broad has a plurality of through-holes to connect copper patterns on different layers of the printed circuits broad. Here, at least one of the through-holes is copper plated closed at both ends with at least 70% volume of the through-hole plated with copper to, e.g., enhance thermal characteristics of the through-hole, thereby providing extra reliability to the printed circuit board. In one embodiment, the printed circuit board includes a surface conductor (or cap) that is directly plated over the copper filled barrel plated through-hole. | 08-21-2008 |
| 174265000 | Preform in hole | 4 |
| 20090145652 | PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD - The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing. | 06-11-2009 |
| 20090200074 | Circuit Substrate Having Post-Fed Die Side Power Supply Connections - A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die, which act as power supply planes. Pins are inserted through the plated-through holes to further lower the resistance of the power supply path(s). The bottom ends of the pins may extend past the bottom of the substrate to provide solderable interconnects for the power supply connections, or the bottom ends of the pins may be soldered to “jog” circuit patterns on a bottom metal layer of the substrate which connect the pins to one or more power supply terminals of an integrated circuit package including the substrate. | 08-13-2009 |
| 20080230264 | INTERCONNECTION STRUCTURE AND METHOD THEREOF - The present invention discloses an interconnection structure which is formed by a method comprising providing a first conductive substrate, a second conductive substrate, and an insulating substrate; respectively forming a first circuit and a second circuit on the first conductive substrate and the second conductive substrate; forming a conductive bump on the second circuit; and connecting the insulating substrate with the first circuit and the second circuit by pressing the first conductive substrate, the insulating substrate and the second conductive substrate, wherein the conductive bump penetrates the insulating substrate to contact the first circuit. | 09-25-2008 |
| 20100038127 | Power-Ground Plane Partitioning and Via Connection to Utilize Channel/Trenches for Power Delivery - An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes. | 02-18-2010 |
