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With electrical device

Subclass of:

174 - Electricity: conductors and insulators

174680100 - CONDUITS, CABLES OR CONDUCTORS

174250000 - Preformed panel circuit arrangement (e.g., printed circuit)

Patent class list (only not empty are listed)

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Entries
DocumentTitleDate
20130025923COMPONENT WITH PINS AND FIXED ON CIRCUIT BOARD - A component fixed on a circuit board. The circuit board has a first perforation and a second perforation. The component has a body, a first pin, and a second pin. The first pin is connected to a side of the body. The first pin has a first section, a first bent section, and a second bent section. The first bent section is stuck in the first perforation. The second pin is connected to another side of the body. The second pin has a second section, a third bent section, and a fourth bent section. The third bent section is stuck in the second perforation. The design prevents the body from toppling and makes it stable and convenient to assemble the component onto the circuit board.01-31-2013
20130025922BONDING ENTITIES TO CONJOINED STRIPS OF CONDUCTIVE MATERIAL - Methods and apparatus are provided for mass production of electronic devices. Rows of perforation are formed across a sheet of conductive material such that plural conjoined strips are defined. Respective electronic entities are soldered to each of the conjoined strips. The strips are separated by severing the perforations such that plural discrete electronic devices are defined. Solar panels, electronic circuits and other apparatus can be formed in this way.01-31-2013
20130025924LEAD COMPONENT HOLDER AND ELECTRONIC DEVICE - A lead component holder includes a plurality of supporting portions each supporting a lead component at a position distant from a component mounting surface of a substrate, and at least one coupling member coupling the adjacent supporting portions at a position distant from the component mounting surface. An electronic device includes the substrate, the lead component holder, and an electronic component mounted to the substrate located below the coupling member.01-31-2013
20100155125Circuit Device and Electronic Device - An electronic circuit device comprising an attaching material between an electronic component and a circuit board is disclosed. A bonding resin is situated on a side of an electronic component and flowed between the electronic component and a circuit board. The flow action may be facilitated by thermoplasticity and capillary action.06-24-2010
20100155126FINE WIRING PACKAGE AND METHOD OF MANUFACTURING THE SAME - At least one electronic component having a plurality of terminals on one of surfaces is temporarily fixed to a surface of a first support with a first adhesive layer in such a manner that the terminal side of the electronic component faces the first support. A second support having a second adhesive layer is fixed to the electronic component in order to interpose the electronic component between the first support and the second support. The first support and the first adhesive layer are peeled. The electronic component on the second support is sealed with a sealing resin in such a manner that at least a part of the terminals of the electronic component is exposed. An insulating resin layer and a wiring layer to be electrically connected to the terminal of the electronic component are stacked on the electronic component and the sealing resin.06-24-2010
20100018759ELECTRONIC DEVICE AND CIRCUIT BOARD - According to one embodiment, an electronic device includes a housing, a circuit board housed in the housing, and a reinforcing member. The circuit board has a first surface and a second surface on the rear of the first surface. The first surface has a first electronic component mounted thereon. The second surface has a second electronic component mounted thereon at an opposite position of the first electronic component. The reinforcing member includes a base member and a bridge. The base member is provided on the second surface to reinforce a first mount area on which the first electronic component is mounted. The bridge passes through the first mount area, and extends, across and over the second electronic component, from at least two points on the base member.01-28-2010
20090194322DEVICE MOUNTING BOARD AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR MODULE - A device mounting board has a double-layer wiring structure where a first wiring layer and a second wiring layer are stacked together with an insulating layer held between the first and second wiring layers. The first wiring layer and the second wiring layer are electrically connected by way of a via conductor provided on a side wall of a through-hole that penetrates the insulating layer. The through-hole that penetrates the insulating layer has a stepped portion. The via conductor, provided along the insulating layer in the via conductor, has a step associated with the stepped portion of the via conductor.08-06-2009
20080257594Printed board assembly and a method - The present invention relates to a method and a printed board assembly for use in a MicroTCA system, wherein backplane pin connectors of the printed board assembly are arranged to be received in receiving connectors of a backplane interconnect, characterized in that it comprises at least one switch unit which is arranged with physical output/input ports that have physical port numbers that can be overridden by logical port numbers, an optimal routing of a number of sets of conductive threads in the printed board assembly arranged so that none of the conductive threads cross over each other while connecting physical output/input ports of the switch units with the backplane pin connectors, and printed circuit board layers arranged to shield signals travelling in the conductive threads in conductive layers of the printed circuit board layers from any significant crosstalk.10-23-2008
20130075143ELECTRONIC COMPONENT MODULE AND ITS MANUFACTURING METHOD - The electronic component module includes a substrate; an electronic component mounted on an electronic component mounting surface of the substrate; an insulating body that covers the electronic component on the electronic component mounting surface of the substrate; and a metal film formed by electroless plating, the metal film covering an exterior surface of the insulating body and a side surface of the substrate. The substrate has a space section in which a space is formed, the space being dented inward of the substrate in the periphery of a surface opposite to the electronic component mounting surface of the substrate, and the metal film entirely covers at least one side surface of the electronic component module except for at least a portion located on a surface perpendicular to the electronic component mounting surface of the substrate in the space section.03-28-2013
20100147573CIRCUIT SUBSTRATE, CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE CIRCUIT SUBSTRATE - A thin circuit substrate and a circuit module are arranged such that the circuit module includes an IC mounted on a circuit substrate, the IC includes an IC body and an solder bump located on a mounting surface of the IC body, and the circuit substrate includes a substrate including a recess formed by recessing a portion of a mounting surface of the substrate on which the IC is to be mounted, and a terminal protruding from the mounting surface of the substrate. The terminal is to be electrically connected to the solder bump.06-17-2010
20100071947Multilayer circuit board and motor driving circuit board - A multilayer circuit board formed by laminating conductor layers and insulating layers alternately includes: a conductor that has a surface substantially parallel to a top surface of the multilayer circuit board, and that is connected to an uppermost conductor layer such that a gap is formed between the conductor and the top surface of the multilayer circuit board; and a sealing material serving as a dielectric that is charged into a space including a periphery of the conductor and the gap, wherein, in the conductor layers, a conductor is not formed in a position facing the gap in a lamination direction of the conductor layers and the insulating layers.03-25-2010
20100071946ELECTRONIC COMPONENT MOUNTING STRUCTURE - An electronic component mounting structure includes: an electronic component including a plurality of bump electrodes that includes a base resin provided on an active face of the electronic component and a plurality of conductive films that cover a part of a surface of the base resin, expose an area excluding the part of the surface, and are electrically coupled to a plurality of electrode terminals provided on the active face; and a substrate including a plurality of terminals. In the structure, the electronic component is mounted on the substrate, and the base resin includes: a first opening surrounding the plurality of the electrode terminals; a connection portion in which a part of one ends of the plurality of the conductive films that are drawn out on the surface of the base resin is disposed, the other ends of the conductive films being coupled to the electrode terminals; and a bonding portion that is bonded to the substrate, and is formed in an area excluding the first opening and the connection portion, and an elastic deformation of the base resin at the connection portion allows the bonding portion to bond the substrate so as to maintain the conductive films and the plurality of the terminals on the substrate in a bonded state.03-25-2010
20100071945BONDING SHEET, ELECTRONIC CIRCUIT DEVICE AND ITS MANUFACTURING METHOD - A bonding sheet includes an insulating sheet with cavities formed within the insulating sheet, and adhesive-filling portions made of an electrically conductive adhesive filled in the cavities. An electronic circuit device includes an IC package mounted on a circuit board, with the bonding sheet disposed between the IC package and the circuit board. The IC package is provided with terminal electrodes in the lower surface, and electrode bumps project from the terminal electrodes. The circuit board has recesses in the upper surface, and electrode pad are formed on the bottom of the recesses. The electrically conductive adhesive that flows out from the adhesive-filling portions filled the recesses and fix the electrode bumps and the electrode pads.03-25-2010
20100071943PACKAGE AND SUBSTRATE STRUCTURE WITH AT LEAST ONE ALIGNMENT PATTERN - A package structure with an alignment pattern is provided, which includes a first substrate, a second substrate and at least one contact. At least one first conductive structure and at least one first alignment pattern are disposed on the first substrate. The second substrate is disposed opposite to the first substrate. In addition, at least one second conductive structure is disposed on the second substrate. The at least one contact is between the first conductive structure on the first substrate and the second conductive structure on the second structure. Particularly, the at least one first alignment pattern has at least one widest part and at least one narrowest part, and the widest part or the narrowest part is aligned or close to a central portion of the at least one contact.03-25-2010
20100071942CIRCUIT BOARD WITH LOW NOISE - A circuit board includes an analog area and a digital area. The analog area includes an analog ground layer and an analog wiring layer formed on the analog ground layer. The digital area includes a digital ground layer and a digital wiring layer formed on the digital ground layer. The digital ground layer is connected with the analog ground layer to form a main ground layer. The digital wiring layer is separate from the analog wiring layer.03-25-2010
20120175161MODULE INCORPORATING ELECTRONIC COMPONENT - A module incorporating electronic component includes a substrate, a wiring pattern located on at least one surface of the substrate, at least one electronic component electrically bonded to the wiring pattern, and bonded to the substrate, and a sealing resin arranged to cover the surface of the substrate including the bonded electronic component. The wiring pattern includes a plurality of land electrodes, and electrically bonded to the electronic component or a via conductor, and a wiring electrode arranged to connect the land electrodes, and an insulating resin is disposed on the wiring electrode except for a boundary between the land electrode and the wiring electrode, so as to cross at least one boundary between the substrate and the wiring electrode such that an adhesion strength between the insulating resin and the sealing resin is higher than an adhesion strength between the insulating resin and the wiring pattern.07-12-2012
20120175160METHOD AND SYSTEM FOR REDUCING TRACE LENGTH AND CAPACITANCE IN A LARGE MEMORY FOOTPRINT - A method and system are disclosed to reduce trace length and capacitance in a large memory footprint. When more dual in-line memory module (DIMM) connectors are used per memory channel, the overall bus bandwidth may be affected by trace length and trace capacitance. In order to reduce the overall trace length and trace capacitance, the system and method use a palm tree topology placement, i.e., back-to-back DIMM placement, to place surface mount technology (SMT) DIMM connectors (instead of through-hole connectors) back-to-back in a mirror fashion on each side of a printed circuit board (PCB). The system and method may improve signal propagation time when compared to the commonly used traditional topology placements in which all DIMM connectors are placed on one side of the PCB.07-12-2012
20130032385METAL THIN SHIELD ON ELECTRICAL DEVICE - This disclosure provides systems and methods for forming a metal thin film shield over a thin film cap to protect electromechanical systems devices in a cavity beneath. In one aspect, a dual or multi layer thin film structure is used to seal a electromechanical device. For example, a metal thin film shield can be mated over an oxide thin film cap to encapsulate the electromechanical device and prevent degradation due to wafer thinning, dicing and package assembly induced stresses, thereby strengthening the survivability of the electromechanical device in the encapsulated cavity. During redistribution layer processing, a metal thin film shield, such as a copper layer, is formed over the wafer surface, patterned and metalized.02-07-2013
20130032387MICROELECTRONIC PACKAGE WITH TERMINALS ON DIELECTRIC MASS - A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably connect the top terminals to bottom terminals on the package substrate. The dielectric mass can be formed, for example, by molding or by application of a conformal layer.02-07-2013
20130032386ELECTRICAL DEVICE INCLUDING A FUNCTIONAL ELEMENT IN A CAVITY - A substrate includes a functional element. An insulating first film forms a cavity which stores the functional element, together with the substrate, and includes a plurality of through-holes. An insulating second film covers the plurality of through-holes, is formed on the first film, and has a gas permeability which is higher than that of the first film. An insulating third film is formed on the second film and has a gas permeability which is lower than the second film. An insulating fourth film is formed on the third film and has an elasticity which is larger than the third film.02-07-2013
20100044089INTERPOSER INTEGRATED WITH CAPACITORS AND METHOD FOR MANUFACTURING THE SAME - An interposer integrated with capacitors (02-25-2010
20100044090RESIN COMPOSITION, PREPREG, LAMINATED BOARD, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - Provided are a resin composition whose storability is not reduced, a prepreg which uses the resin composition and which is uniformly colored, a laminated board, a multilayer printed wiring board having excellent results in reliability tests such as a thermal shock test and the like, and a semiconductor device. The resin composition is a resin composition for a multilayer printed wiring board, comprising (A) a novolac type epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a colorant, wherein the exothermic peak temperature of the resin composition, as measured by DSC, is within ±5° C. of the exothermic peak temperature of a resin composition composed of (A) a novolac type epoxy resin, (B) a curing agent, and (C) an inorganic filler.02-25-2010
20090194321PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in a periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A pair of slits is formed in the metal layer such that a region being opposite to the electronic component is sandwiched therebetween. Each slit is formed so as not to divide the metal layer into a plurality of regions.08-06-2009
20100116535Thin-film device including a terminal electrode connected to respective end faces of conductor layers - A thin-film device incorporates a device main body and four terminal electrodes. The device main body has four side surfaces. The terminal electrodes are disposed to touch respective portions of the side surfaces. The device main body includes a lower conductor layer that is not used to form a passive element, and an upper conductor layer used to form the passive element. The upper and lower conductor layers include respective lead electrode portions that have respective end faces located at the side surfaces of the device main body. At the side surfaces of the device main body, the end face of the lead electrode portion of the lower conductor layer and the end face of the lead electrode portion of the upper conductor layer are electrically and physically connected to each other. The terminal electrodes touch these end faces and are thereby connected to the upper and lower conductor layers.05-13-2010
20100116534Printed Circuit Board Having Flow Preventing Dam And Manufacturing Method Thereof - Disclosed is a printed circuit board having a flow preventing dam and a manufacturing method thereof The printed circuit board includes a base substrate having a solder pad, a solder bump formed on the solder pad of the base substrate, and a flow preventing dam formed on a peripheral area of the base substrate using a dry film resist. The flow preventing dam can prevent the outflow of an underfill solution and can be simply formed.05-13-2010
20100096174FILTER CIRCUIT ELEMENT AND ELECTRONIC CIRCUIT DEVICE - A plurality of vias is disposed side by side on a multilayer board. A first via which is one of the vias disposed at one outer portion is electrically connected to a first outgoing line provided on the multilayer board. A second via at the other outer portion is electrically connected to a second outgoing line provided on the multilayer board. A plurality of the vias is connected to a first fixed potential layer (a ground layer, for example) of the multilayer board. At least one second fixed potential layer is provided, with a plurality of the vias through a clearance and having the same potential as that of the first fixed potential layer, as an inner layer of the multilayer board between the first and second outgoing lines and the fixed potential layer. Therefore, a BPF whose rate of occupied area is low is formed on the multilayer board without additional production processes.04-22-2010
20090159322THROUGH HOLE CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A through hole capacitor at least including a substrate, an anode layer, a dielectric layer, a first cathode layer, and a second cathode layer is provided. The substrate has a plurality of through holes. The anode layer is disposed on the inner surface of at least one through hole, and the surface of the anode layer is a porous structure. The dielectric layer is disposed on the porous structure of the anode layer. The first cathode layer covers a surface of the dielectric layer. The second cathode layer covers a surface of the first cathode layer, and the conductivity of the second cathode layer is greater than that of the first cathode layer. The through hole capacitor can be used for impedance control, as the cathode layers of the through hole are used for signal transmission.06-25-2009
20090159321ELECTRONIC DEVICES WITH ULTRAVIOLET BLOCKING LAYERS AND PROCESSES OF FORMING THE SAME - An electronic device can include a conductive feature and an ultraviolet (“UV”) blocking layer overlying the conductive feature. The electronic device can also include an insulating layer overlying the UV blocking layer. The electronic device can further include a conductive structure extending into an opening within the insulating layer, wherein the conductive structure is electrically connected to the conductive feature. In one aspect, the UV blocking layer lies within 90 nm of the conductive structure. The insulating layer can be at least 4 times thicker than the UV blocking layer. In another aspect, a method can be used in forming the electronic device. In still a further aspect, a system can include the electronic device, a processor, and a display, wherein the processor is electrically coupled to the electronic device and the display.06-25-2009
20090159320Low Cost High Frequency Device Package and Methods - A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.06-25-2009
20090159319Resin ejection nozzle, resin encapsulation method, and electronic part assembly - A resin ejection nozzle is scanned over a substrate on which an electronic part is mounted, and ejects an encapsulation resin to an encapsulation area of the substrate. The resin ejection nozzle comprises an ejection part adapted to eject the encapsulation resin, the ejection part having a longitudinal direction which is perpendicular to a direction of movement of the nozzle. An ejection hole part is adapted to cause the encapsulation resin to contact a substantially half area of a side of the electronic part which lies at right angles to the direction of movement of the nozzle. A remaining portion of the side of the electronic part is gradually contacted by the encapsulation resin after the substantially half area of the side of the electronic part is contacted by the encapsulation resin.06-25-2009
20090159323SOLID ELECTROLYTIC CAPACITOR HAVING CURRENT BREAKING FUNCTION - A solid electrolytic capacitor that can be miniaturized while maintaining the function for breaking current when excessive short-circuit current flows to a capacitor element. The solid electrolytic capacitor includes an anode body, a dielectric layer formed on the anode body, a conductive polymer layer formed on the dielectric layer, and a cathode layer formed on the conductive polymer layer. The conductive polymer layer contains thermally expandable graphite.06-25-2009
20100108372Electronic component package and manufacturing method thereof - An electronic component package and a manufacturing method thereof. The electronic component package includes: an insulation layer; a single layer of circuit pattern buried in the insulation layer and having a surface exposed at one side of the insulation layer, the circuit pattern comprising a bonding pad and a solder ball pad; and an electronic component mounted on one side of the insulation layer and electrically connected with the bonding pad. In addition, the electronic component package includes a portion of the insulation layer being removed in correspondence with the position of the solder ball pad such that the solder ball pad is exposed at the other side of the insulation layer.05-06-2010
20100108370SYSTEM AND METHOD OF FORMING A PATTERNED CONFORMAL STRUCTURE - A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.05-06-2010
20100108371WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component in which an electronic component is flip-chip mounted to be built in, including a conductive-pattern layer, a connection terminal formed in the conductive-pattern layer and electrically connected to the electronic component, and a solder resist layer formed on the conductive-pattern layer. The solder resist layer is formed around the connection terminal on the conductive-pattern layer, but it is not formed in at least part of the other region on the conductive-pattern layer.05-06-2010
20100108369Printed Circuit Boards, Printed Circuit Board Capacitors, Electronic Filters, Capacitor Forming Methods, and Articles of Manufacture - Printed circuit board capacitors include a first electrode comprising a via extending at least partially through a multi-layer printed circuit board and a plurality of conductive pads in electrical contact with the via and extending radially outward from the via, and a second electrode electrically isolated from the first electrode and comprising a plurality of ground-plane layers of the printed circuit board. The plurality of ground-plane layers include electrically conductive material overlapping the plurality of conductive pads.05-06-2010
20090145643PRINTED WIRING BOARD WITH A BUILT-IN RESISTIVE ELEMENT - A printed wiring board with a built-in resistive element comprising a first electrode formed on the surface of an insulating member, a second electrode provided adjacent to the first electrode to form a space therebetween, a resistor-filling part formed by the space between the first electrode and the second electrode, and a resistive element comprising a resistive material provided in the resistor-filling part wherein the resistor-filling part is substantially enclosed by the first electrode and the second electrode.06-11-2009
20130081867ELECTRONIC DEVICE - An electronic device including a first ground conductor layer positioned at an underside of a first insulation layer; a second ground conductor layer positioned at an upper side of the first insulation layer; a second insulation layer positioned at an upper side of the second ground conductor layer; a first connection pattern formed in inside wall of a first opening penetrating the first insulation layer and the second insulation layer and interconnecting the first ground conductor layer and the second ground conductor layer; a conductive member provided in the first opening and connected to the first ground conductor layer; and an electronic element mounted on the member and grounded to the member.04-04-2013
20130081866PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a penetrating hole, a first conductive layer on a first surface of the substrate, a second conductive layer on a second surface of the substrate, a first electronic component having an electrode and accommodated in the hole such that the electrode faces the first surface, a first structure on the first surface and including a pad for mounting a second electronic component on the first structure and a via conductor connected to the electrode, and a second structure on the second surface. The electrode has an upper surface facing toward the first surface, the first layer has an upper surface facing away from the first surface, and the first component is positioned in the hole such that the upper surface of the electrode forms a gap with the upper surface of the first layer.04-04-2013
20090178833SLICED ELECTROMAGNETIC CAGE FOR INDUCTORS - A system within a circuit is disclosed. The system comprises a first shield and a device above the first shield. The system also includes a plurality of conductive walls coupled to and extending from the first shield to block electromagnetic (EM) waves to other parts of the circuit. A system and method in accordance with the present invention adds metal walls on the edge of a sliced shield. The walls block the electromagnetic wave from coupling to other parts of the circuit from a sideways direction. The use of this structure allows for more compact layout placement with insignificant degradation.07-16-2009
20130087375MULTILAYER WIRING SUBSTRATE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF MULTILAYER WIRING SUBSTRATE - There is provided a multilayer wiring substrate that includes a plurality of insulator layers, and electric conductors, the electric conductors and the plurality of insulator layers being configured to be stacked alternately, wherein a plurality of holes are formed from a surface of the multilayer wiring substrate in a thickness direction of the multilayer wiring substrate, the holes being formed leaving at least one of the insulators.04-11-2013
20130048360SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM IN PACKAGE - Method for providing a printed circuit board (02-28-2013
20100006330STRUCTURE AND PROCESS OF EMBEDDED CHIP PACKAGE - A process of an embedded chip package structure includes following steps. Firstly, a metal core layer having a first surface, a second surface opposite to the first surface, an opening, and a number of through holes are provided. The opening and the through holes connect the first surface and the second surface. A chip is then disposed in the opening. Next, a dielectric layer is formed in the opening and the through holes to fix the chip in the opening. Thereafter, a number of conductive vias are respectively formed in the through holes and insulated from the metal core layer by a portion of the dielectric layer located in the through holes. A circuit structure is then formed on the first surface of the metal core layer by performing a build-up process, and the circuit structure electrically connects the chip and the conductive vias.01-14-2010
20090114435Electronic device and method of manufacturing same - A method of manufacturing an electronic device includes: roughening an underside surface of a film made of a resin, opposite to a mounting surface of the film for mounting a circuit chip; forming a conductor pattern on the mounting surface of the film, thereby obtaining a substrate made of the film where the conductor pattern is formed; and attaching a thermoset adhesive to a conductor-pattern-formed surface of the substrate. The method further includes: mounting the circuit chip to be connected to the conductor pattern on the substrate via the thermoset adhesive; clamping the substrate by a heating apparatus having a presser section and a support section, the presser section abutting the circuit chip mounted on the substrate and the support section abutting the underside surface of the roughened film; and fixing the circuit chip to the conductor pattern by heating and hardening the thermoset adhesive using the heating apparatus.05-07-2009
20130056252MOUNTING STRUCTURE - A mounting structure includes an electronic component mounted on a circuit board. Land electrodes are disposed on a board body and are connected to outer electrodes of the electronic component through solders, respectively. A distance from each of the land electrodes to a top of the corresponding solder is not larger than about 1.27 times a distance from each of the land electrodes to an exposed portion of a capacitor conductor exposed at an end surface of the electronic component, the capacitor conductor being positioned closest to the circuit board.03-07-2013
20120217049WIRING BOARD WITH BUILT-IN IMAGING DEVICE - A wiring board with a built-in imaging element including a substrate having an accommodation portion, an imaging device having a light receiver and positioned in the accommodation portion such that the light receiver faces a first surface of the substrate, first insulation layers having an opening portion and formed on the first surface of the substrate such that the light receiver is exposed from the opening portion, and second insulation layers formed on a second surface of the substrate. The first insulation layers include a first insulation layer, the second insulation layers include a second insulation layer, the second insulation layer is positioned at a predetermined tier and has a thermal expansion coefficient which is set lower than that of the first insulation layer at a predetermined tier such that imbalance in thermal expansion and contraction between the first and second insulation layers is substantially offset or mitigated.08-30-2012
20110056737ELECTROCHEMICAL DEVICE - Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 03-10-2011
20090283311Electronic element wafer module and method for manufacturing electronic element wafer module, electronic element module, and electronic information device - An electronic element wafer module is provided, and the module includes: electronic element wafers, in which a plurality of electronic elements are provided on the front surface side and wiring is provided on the back surface side; and support substrates adhered by a resin adhesive layer, opposing the front surface side of the electronic element wafer, where: a groove for dicing is formed along a dicing line in between adjacent electronic elements, penetrating the electronic element wafers from the back surface; and an insulation film for insulating a semiconductor layer from the wiring on the back surface is formed on the back surface of the electronic element wafer including the through hole and is formed at least on a side wall of the groove.11-19-2009
20090084593HIGH-FREQUENCY CIRCUIT COMPONENTS - High-frequency circuit components are disclosed in which parasitic capacitance between a high-frequency circuit element and a substrate is reduced and mechanical strength is improved. An exemplary component has a conductive substrate, a coil as the high-frequency circuit-element, a mounting board including a thin dielectric film on which the coil is mounted, and a support board that couples the mounting board to the substrate. The mounting board is coupled so that it floats relative to the substrate as a result of deliberate warping of the support board.04-02-2009
20090056996ELECTRONIC COMPONENT MODULE - An electronic component module 03-05-2009
20090266595ELECTRONIC DEVICE - An electronic device has a multilayer capacitor and a circuit board on which the capacitor is mounted. The capacitor is formed in a nearly rectangular parallelepiped shape and has a first terminal electrode and a second terminal electrode arranged at respective ends thereof. On the circuit board there are a first land to which the first terminal electrode of the capacitor is fixed and a second land to which the second terminal electrode is fixed. The circuit board has a slit formed so as to open on the second land side and surround the first land, when viewed from a direction perpendicular to a principal surface of the circuit board. An imaginary straight line connecting one end and the other end of the slit intersects with the capacitor when viewed from the direction perpendicular to the principal surface of the circuit board.10-29-2009
20090266594WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate and method of forming a wiring substrate. The wiring substrate includes a base substrate, a first resin insulating layer provided on the base substrate and a laminated capacitor formed within the first resin insulating layer. The laminated capacitor includes a plurality of capacitors laminated to each other by adhesive, each capacitor including a first electrode, a second electrode opposing the first electrode and a dielectric layer interposed between the first and second electrodes. A first via conductor electrically connects the first electrodes of the plurality of capacitors to each other, and a second via conductor electrically connects the second electrodes of the plurality of capacitors to each other. A first external terminal electrically connects to the first via conductor, and a second external terminal electrically connects to the second via conductor.10-29-2009
20090266593SURFACE-MOUNTABLE ELECTRONIC DEVICE - A surface-mountable electronic device free of leads has a plurality of solderable connection surfaces at its lower side, with at least one of the connection surfaces having a rectangular portion. The outline of this rectangular portion corresponds to a connection surface of the JEDEC Standard MO-236 or of any other standard according to which the respective connection surface should not extend directly up to a side edge of the lower device side. The at least one connection surface furthermore has an extension section which extends, starting from the rectangular portion, in the direction of a side edge of the lower side of the device.10-29-2009
20130062109Electrical Conductive Member and Electrical Conductive Member Assembly - An electrical conductive member is provided with a base layer and a conductor. The base layer includes a first portion, a second portion extending at an angle relative to the first portion, and a curved portion connecting the first portion and the second portion. The conductor is arranged on a portion of the base layer.03-14-2013
20130062110ELECTRONIC DEVICE, CABLE COUPLING STRUCTURE, AND METHOD OF FABRICATING ELECTRONIC DEVICE - A structure includes a substrate on a surface of which a functional element and a first electrode are disposed, wherein the functional element provides a predetermined function by an operation based on an electrical signal and the first electrode is coupled to the functional element; an insulating member in a thin film that covers the surface of the substrate and extends from an end of the substrate; and a second electrode disposed on a substrate-side surface of the extending portion, which is extending from the end of the substrate, of the insulating member, wherein the second electrode is coupled to the first electrode. The second electrode is electrically coupled to a coaxial cable.03-14-2013
20080289865Method for Manufacturing Dielectric Layer Constituting Material, Dielectric Layer Constituting Material Obtained Thereby; Method for Manufacturing Capacitor Circuit Forming Piece Using Dielectric Layer Constituting Material, Capacitor Circuit Forming Piece Obtained Thereby; and Multi-Layer Printed Wiring Board Obtained by Using Dielectric Layer Constituting Material and/or Capacitor Circuit Forming Piece - An object is to obtain a dielectric layer constituting material, a capacitor circuit forming piece, etc. in which unnecessary dielectric layer is removed except capacitor circuit parts that improve accuracy of position of an embedded capacitor circuit in a multi-layer printed wiring board. For the purpose of achieving the object, “a method for manufacturing a dielectric layer constituting material characterized in that step a is a step for forming a first electrode circuit by etching a conductor layer on one side of a metal clad dielectric comprising a conductor layer on each side of a dielectric layer; step b is a step for removing the dielectric layer that is exposed between the first electrode circuits to manufacture the dielectric layer constituting material; and the step a is conducted and then the step b is conducted” is adopted. Then as a process for manufacturing a capacitor circuit forming piece, the dielectric layer constituting material obtained above is used and a process for forming a second electrode at a position facing the first electrode is conducted.11-27-2008
20120222895MANY-UP WIRING SUBSTRATE, WIRING SUBSTRATE, AND ELECTRONIC DEVICE - In a many-up wiring substrate including a base substrate having dividing grooves formed as part of main surfaces thereof, along boundaries of a plurality of wiring substrate regions, the plurality of wiring substrate regions being arranged in a matrix, when seen in a transparent plan view, dividing grooves of the main surface and dividing grooves of an opposite main surface are formed to be deviated in one direction of transverse direction or longitudinal direction, and a distance between bottoms of the dividing grooves of one main surface and bottoms of the dividing grooves of the opposite main surface is smaller than a distance between the bottoms of the dividing grooves of the one main surface and the opposite main surface and a distance between the bottoms of the dividing grooves of the opposite main surface and the one main surface.09-06-2012
20110036624CONNECTING MEMBER OF ELECTRICAL CIRCUIT - A connecting member such as a terminal base is used, which allows a printed circuit board unit in which circuit elements such as a power module are mounted on a printed circuit board to be rated at higher current as compared to a conventional printed circuit board unit; and therefore an increase in size of the unit can be reduced or prevented with a simple configuration of connection sections. The connecting member of an electrical circuit connects the circuit element of the electrical circuit including the printed circuit board, to an electrical wire. The connecting member includes a terminal connecting section to be directly connected to terminal pins of the circuit element; a wire connecting section to be connected to the electrical wire; and attachment sections for attaching the connecting member to the printed circuit board.02-17-2011
20110011636Multilayer wiring board and method of manufacturing the same - There are provided a multilayer wiring board and a method of manufacturing the same. The multilayer wiring board according to an aspect of the invention may include: a main body having a plurality of insulting layers stacked upon each other, including a first layer provided as an inner layer and a second layer provided as an outer layer; a first resistor provided on the first layer; and a second resistor provided on the second layer, connected in parallel with the first resistor, and having a smaller area than the first resistor. The multilayer wiring board obtains a target resistance value using the first and second resistors formed on the first and second layers. The second resistor, formed on the outer layer, can have a smaller area than the first resistor. Accordingly, the usable area of the outer layer is increased to thereby reduce the size of the multilayer wiring board.01-20-2011
20110011635Method for Arranging a Component on a Circuit Board - A method for arranging a component on a circuit board, a circuit board, and a mobile device comprising a circuit board are described.01-20-2011
20110011634CIRCUIT PACKAGE WITH INTEGRATED DIRECT-CURRENT (DC) BLOCKING CAPACITOR - A circuit package includes a substrate formed using a plurality of layers, the substrate having a first surface and a second surface, at least some of the plurality of layers being electrically interconnected by a via; and at least one standard surface-mount capacitive element electrically coupled to at least one surface of the substrate, thereby allowing electrical and mechanical access to the first surface and the second surface, the at least one standard surface-mount capacitive element located to prevent the passage of a direct current (DC) signal through the circuit package.01-20-2011
20090236135MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A multilayer wiring substrate having no core substrate is provided. The multilayer wiring substrate includes: a laminated body includes: a plurality of insulating layers; and a plurality of wiring layers. The laminated body has: a mounting surface on which a semiconductor element is mounted; and a bonding surface to which external connection terminals are bonded. At least one of the insulating layers contains a glass cloth.09-24-2009
20090236134Low frequency ball grid array resonator - A ball grid array resonator for use as, for example, a high “Q” inductive element in the tank circuit of a voltage controlled oscillator. The resonator comprises a ceramic substrate including opposed top and bottom surfaces, each having a continuous strip of conductive material formed thereon and, in one embodiment, at least two conductive vias which extend through the substrate and electrically interconnect the respective strips of conductive material to define a continuous and elongate path or transmission line for an RF signal. The respective strips of conductive material may be spiral-shaped, hook-shaped, serpentine-shaped, or otherwise suitably shaped depending upon the desired application. Conductive balls/spheres on the bottom surface define RF signal input/output pads and ground pads adapted for electrical connection to the printed circuit board or substrate of, for example, a voltage controlled oscillator.09-24-2009
20130068515INTERCONNECT BOARD AND ELECTRONIC APPARATUS - An electronic apparatus (03-21-2013
20120228014CIRCUITIZED SUBSTRATE WITH INTERNAL THIN FILM CAPACITOR AND METHOD OF MAKING SAME - A circuitized substrate for use in such electrical structures as information handling systems wherein the substrate includes a capacitive substrate as part thereof. The capacitive substrate includes a thin film layer of capacitive material strategically positioned on a conductive layer relative to added electrically conductive elements to in turn provide a plurality of internal capacitors within the final circuitized substrate during operation thereof. A method of making such a circuitized substrate is also provided.09-13-2012
20090008141Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof - The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.01-08-2009
20090008140Electronic Assemblies Without Solder and Methods for their Manufacture - An electronic assembly 01-08-2009
20090242257ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE - In a dielectric element, the side faces are roughened so that the surface roughness Ra is 15 nm or greater. By this means, the area of contact between a glass epoxy resin substrate and insulating material is increased, adhesion with resin substrates is improved, and strength and reliability can be enhanced when buried between two resin substrates. In the dielectric element, the surface roughness Ra of side surfaces is 5000 nm or less, so that when burying the dielectric element between a glass epoxy resin substrate and insulating material, the occurrence of air bubbles between the surface of the dielectric element and the resin can be prevented.10-01-2009
20120234588LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS - A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.09-20-2012
20120234587PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD UNIT, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board is disclosed that includes insulating layers, conductive layers stacked with the insulating layers alternately, a through hole penetrating the insulating layers and the conductive layers, a first plate resist part formed on a first portion of an inner wall of the through hole, the first portion being located from one end of the through hole to one of the conductive layers stacked between one pair of the insulating layers, and a plated part formed on a second portion of the inner wall of the through hole other than the first portion.09-20-2012
20080296054HIGH PERFORMANCE CHIP CARRIER SUBSTRATE - A multilayer chip carrier with increased space for power distribution PTHs and reduced power-related noise. In a multilayer chip carrier with two signal redistribution fanout layers, in addition to signal escape from near-edge signal pads at the first fanout layer, remaining signal pads are moved closer to the edge of the chip footprint. At the voltage layer below the first fanout layer, the remaining signal pads are moved again, closer to the edge of the chip footprint. In the second fanout layer, below the voltage layer, the remaining signal pads escape. The region where signal pads are moved provides increased space for power PTHs.12-04-2008
20080296053ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an electronic component module includes mounting an electronic component on at least one surface of a first board, subsequently inspecting the first board for functions, forming a resin layer burying or covering the electronic component on the one surface of the first board to flatten the one surface side of the first board, aligningly stacking the first board, a plate-like member and a second board so that the other surface of the first board is opposite one surface of the plate-like member and so that the other surface of the plate-like member is opposite one surface of the second board, pressurizing the first board, the plate-like member and the second board which have been stacked, and heating the first board, the plate-like member, and the second board which have been stacked.12-04-2008
20080296052MULTILAYER PRINTED WIRING BOARD - A package substrate free of malfunction or error even with an IC chip in a high frequency range, particularly an IC chip with a frequency exceeding 3 GHz, is provided. A conductor layer 12-04-2008
20100089628COMPONENT BUILT-IN CIRCUIT SUBSTRATE AND METHOD OF PRODUCING THE SAME - A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling a gap between the bottom surface of the electronic component and the front surface of the core layer and covering the resist and the solder part, to prevent a defect of a component built-in printed circuit substrate.04-15-2010
20090301771CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE USING THE SAME - A conductive bump formed on an electrode of an electronic component. The conductive bump is composed of a first bump having one or more layers formed on the electrode and including resin containing at least a spherical-shaped conductive filler, and a second bump formed on an upper surface of the first bump and including photosensitive resin containing a scale-shaped conductive filler.12-10-2009
20110061917LAMINATED SUBSTRATE FOR AN INTEGRATED CIRCUIT BGA PACKAGE AND PRINTED CIRCUIT BOARDS - A laminated substrate for an integrated circuit package, including a core layer and at least one build-up layer located above only one side of said core layer. An integrated circuit package, including a laminated substrate and including an integrated circuit die placed above the side build-up layer.03-17-2011
20110278054CIRCUIT BOARD WITH NOTCHED CONDUCTOR PADS - Various circuit board conductor structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided. The method includes forming a first conductor pad on a circuit board. The first conductor pad includes a first notch and is adapted to couple to a first solder portion.11-17-2011
20090188709ELECTRICAL DEVICE - A substrate includes a functional element. An insulating first film forms a cavity which stores the functional element, together with the substrate, and includes a plurality of through-holes. An insulating second film covers the plurality of through-holes, is formed on the first film, and has a gas permeability which is higher than that of the first film. An insulating third film is formed on the second film and has a gas permeability which is lower than the second film. An insulating fourth film is formed on the third film and has an elasticity which is larger than the third film.07-30-2009
20120186866WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a core substrate having an opening portion and a through hole adjacent to the opening portion, a capacitor positioned in the opening portion, and a through-hole conductor formed in the through hole of the core substrate and having a conductor filling the through hole. The core substrate has a first surface and a second surface on the opposite side of the first surface, the opening portion of the core substrate penetrates from the first surface to the second surface, the through-hole conductor has a first conductive portion and a second conductive portion connected to the first conductive portion in the core substrate, the first conductive portion of the through-hole conductor becomes narrower from the first surface toward the second surface, and the second conductive portion of the through-hole conductor becomes narrower from the second surface toward the first surface.07-26-2012
20090288866ELECTRONIC CARRIER BOARD - An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening.11-26-2009
20090178835Multileveled printed circuit board unit including substrate interposed between stacked bumps - Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate is interposed between the adjacent stacked conductive bumps. The interposer substrate is made of a porous material. When any difference in the expansion is caused between the printed wiring substrate and the mounted component, one side of the interposer substrate receives a relatively smaller displacement force while the other side of the interposer substrate receives a relatively larger displacement force. A shearing stress is induced in the interposer substrate. Deformation of the porous material serves to absorb the shearing stress in the interposer substrate. The conductive bumps bonded on one side of the interposer substrate as well as the conductive bumps bonded on the other side of the interposer substrate may be relieved from a shearing stress. Accordingly, the durability of the conductive bumps can be improved. The conductive bumps are allowed to keep a stronger bonding in a longer duration.07-16-2009
20110272187SILICON NITRIDE SUBSTRATE MANUFACTURING METHOD, SILICON NITRIDE SUBSTRATE, SILICON NITRIDE CIRCUIT SUBSTRATE, AND SEMICONDUCTOR MODULE - Provided is a manufacturing method with which a high thermal conductivity silicon nitride substrate having excellent sintering performance can be manufactured without the occurrence of a molding crack or degreasing crack, as well as to provide a silicon nitride substrate, and a silicon nitride circuit board and a semiconductor module using said silicon nitride substrate.11-10-2011
20090205860WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR PACKAGE - In a wiring substrate in which plural wiring layers and insulating layers are alternately stacked and the adjacent wiring layers are electrically connected through a via hole formed in the insulating layer, plural holes constructing substrate management information recognizable as a character, a symbol, etc. are formed in the outside insulating layer of the insulating layers.08-20-2009
20090090545Electroconductive Particle Placement Sheet and Anisotropic Electroconductive Film - This invention provides an electroconductive particle placement sheet comprising electroconductive particles and an insulating resin sheet. The thickness of the insulating resin sheet is smaller than the average particle diameter of the electroconductive particles. Electroconductive particles are protruded from the reference plane (P04-09-2009
20110284278MOUNTING STRUCTURE - A mounting structure includes an insulating substrate having a substrate electrode on which at least one electrode notch is provided and a resist, an electronic component having an electronic component electrode to be electrically connected to the substrate electrode, and solder paste printed on a surface of the substrate electrode. The substrate electrode has a following relation, 011-24-2011
20100170709ELECTRONIC CARRIER BOARD AND PACKAGE STRUCTURE THEREOF - An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings for exposing the bond pads. A groove is formed between the paired bond pads and has a length larger than a width of an electronic component mounted on the paired bond pads. The groove is adjacent to one of the paired bond pads and communicates with a corresponding one of the openings where this bond pad is exposed. Accordingly, a clearance between the electronic component and the electronic carrier board can be effectively filled with an insulating resin for encapsulating the electronic component, thereby preventing voids and undesirable electrical bridging between the paired bond pads from occurrence.07-08-2010
20100101846METHOD AND APPARATUS FOR SPATIALLY OPTIMIZING SURFACE MOUNT PADS ON A BALL GRID ARRAY PACKAGE - Method and apparatus for spatially optimizing the arrangement of surface mount pads on a ball grid array package. An array containing T surface mount pads with a diameter less than or equal to 0.4 millimeter is arranged in an array of rows and columns less than or equal to 0.5 millimeters center-to-center. The array of pads is subdivided into N groups of pads respectively numbered G04-29-2010
20080289866Wiring Board and Wiring Board Manufacturing Method - A wiring board including a stacked wiring layer portion in which a dielectric layer and a conductor layer are stacked is formed on a core board portion, the stacked wiring layer portion including a stacked composite layer portion in which a polymer dielectric layer, a conductor layer and a ceramic dielectric layer are stacked in this order, the conductor layer being partially cut in the in-plane direction so as to have a conductor side cut portion, the ceramic dielectric layer being partially cut in the in-plane direction so as to have a ceramic side cut portion, the ceramic side cut portion and the conductor side cut portion being communicated to form a communication cut portion, a polymer constituting the polymer dielectric layer being filled in the communication cut portion so as to extend through the conductor side cut portion to the ceramic side cut portion.11-27-2008
20090321120PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE - A printed circuit board according to the present invention includes a printed wiring board, first electrodes, second electrodes, third electrodes, solders, and a flip chip. The printed wiring board includes a first surface and a second surface which is opposite the first surface. The first electrodes are respectively formed on the first surface. The second electrodes correspond to and are disposed near each of the first electrodes, and are respectively formed on the first surface. The third electrodes electrically respectively connect the first electrodes and the second electrodes corresponding to each of the first electrodes. The solders are applied so as to respectively cover the first electrodes, the second electrodes corresponding to the first electrodes, and the third electrodes connecting the first electrodes and the second electrodes. The flip chip is electrically connected to each of the first electrodes at a position opposed to the first electrodes.12-31-2009
20090032297 COMPONENT CASING COMPRISING A MICRO CIRCUIT - A component case comprising one or more micro circuits (02-05-2009
20110005823PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer to a lower surface of the core board so as to cover the cavity, disposing an electronic component on an upper surface of the adhesive layer, the upper surface corresponding to the cavity, covering the circuit pattern by stacking a first insulator on an upper surface of the core board such that the cavity is filled, the first insulator having no backing material filled therein, and stacking a second insulator on both upper and lower sides of the cord board, in which the second insulator has a backing material filled therein.01-13-2011
20090183906SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME - A substrate for mounting a device includes: an insulating resin layer made of an insulating resin; a wiring layer provided on one major surface of the insulating resin layer; and a projected portion that projects toward the direction opposite to the insulating resin layer from the wiring layer, and that is used for supporting a low-melting metal ball, while being connected to the wiring layer electrically. The wiring layer and the projected portion are formed into one body.07-23-2009
20100032196MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a multilayer wiring board having a wiring layer, a pad, an insulating layer provided between the wiring layer and the pad, and a plurality of connecting vias provided on the insulating layer and connecting the wiring layer to the pad, the connecting vias are provided on a peripheral edge of the pad.02-11-2010
20100032193ELECTRODE PAD FOR MOUNTING ELECTRONIC COMPONENT AND STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT - Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode parts are disposed adjacent to the first and second electrode parts for forming corners of the electrode pad together with the first and second electrode parts. At least one of the first to fourth electrode parts includes a chamfered surface formed by cutting a corner of the at least one of the first to fourth electrode parts forming the corner of the electrode pad. Therefore, when the electrode pad is used for mounting an electronic component, the width of an outer electrode of the electronic component can be sufficiently increased, and thus the shape or size of the outer electrode can be easily adjusted.02-11-2010
20100032194PRINTED WIRING BOARD, MANUFACTURING METHOD FOR PRINTED WIRING BOARD AND ELECTRONIC DEVICE - A printed wiring board including an insulation layer, a pad formed in the insulation layer, a solder bump formed over the pad, and a metallic film interposed between the pad and the solder bump and covering at least a portion of the top surface and/or the side surface of the pad over the insulation layer. The pad has a via land portion and a via conductor portion. The insulation layer has the first surface, the second surface on the opposite side of the first surface and a via-hole extending between the first surface and the second surface. The via land portion of the pad is formed over the second surface of the insulation layer. The via conductor portion of the pad is filling the via-hole of the insulation layer.02-11-2010
20090314534ELECTRONIC COMPONENT - An electronic component (12-24-2009
20090101399Suspension board with circuit - A suspension board with circuit includes a slider mounting portion provided with three pedestals arranged in mutually spaced apart relation for supporting a slider on which a magnetic head is mounted.04-23-2009
20090101396ELECTRONIC DEVICE - An electronic device is provided. The electronic device includes: a circuit board having a surface on which a hollow is formed; an electronic component placed into the hollow; a pattern wiring which is formed on a bottom surface of the hollow and whose tip is provided at a position corresponding to a signal electrode of the electronic component; a signal wire connecting a tip of the pattern wiring and the signal electrode of the electronic component; two in-hollow ground patterns formed so as to sandwich the tip of the pattern wiring therebetween on the bottom surface of the hollow; and two or more ground wires that connect two ground electrodes provided on the electronic component so as to sandwich the signal electrode therebetween to the corresponding in-hollow ground patterns, respectively.04-23-2009
20090101398Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component - In a method for fixing an electronic component (04-23-2009
20100263922SURFACE MOUNTING CHIP CARRIER MODULE - A device includes a carrier and an integrated circuit chip having a first side supported by the carrier and a second side having contacts. The carrier has multiple carrier contacts supported by the carrier and separated from the integrated circuit chip. Multiple leads are coupled between the contacts on the integrated circuit chip and the multiple carrier contacts. A resin encapsulates the integrated circuit chip leaving the multiple carrier contacts at least partially uncovered for attaching to a card or board.10-21-2010
20100032195PRINTED WIRING BOARD - Provided is a multilayer printed wiring board in which multiple via holes that connect a first power supply wiring with a second power supply wiring are aligned in a line in parallel to a direction along which current flows. In order to prevent current from being concentrated on the via hole connected to a farthest end of the power supply wiring among the via holes, a narrow portion between the via hole and the via hole is narrowed to increase a resistance. A narrow portion that is narrowed is disposed similarly at a farthest end of the power supply wiring of the second conductor layer.02-11-2010
20120097440METHOD FOR ELECTRONIC COMPONENT LAYOUT OF CIRCUIT BOARD AND PRINTED CIRCUIT BOARD STRUCTURE - A method for electronic component layout of a printed circuit board includes the following steps. First, a first solder joint is formed on a first surface of the printed circuit board. Then, an electronic component is clipped on a side edge of the printed circuit board in an installation direction. At this time, a first pin of the electronic component is placed on the first solder joint, and presses against a limiting portion of the first solder joint, and a second pin of the electronic component is placed on a second surface of the printed circuit board. Finally, a second solder joint is formed on the second surface, so that the second pin is fixed on the second solder joint and the first pin is fixed on the first solder joint.04-26-2012
20110214912VIA STRUCTURE FOR MULTI-GIGAHERTZ SIGNALING - A via structure is disclosed to pass electronic signals from a first conductive pathway formed on a first outermost substrate of a multi-layer PCB to a second conductive pathway formed on a second outermost substrate of the multi-layer PCB. The via structure allows the electronic signals to pass from the first outermost substrate through one or more inner substrates to the second outermost substrate. The one or more inner substrates include one or more closed geometric structures to enclose the via structure.09-08-2011
20110214911CIRCUIT SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of a circuit system includes: providing a carrier base; forming a cavity in the carrier base; forming a bridge lead over the cavity, the bridge lead exposing the cavity; and mounting a device having an anchor interconnect, the anchor interconnect is in the cavity and conformal to the bridge lead over the cavity.09-08-2011
20090166074ELECTRONIC COMPONENT - The present invention provides an electronic component which is capable of effectively suppressing the characteristic deterioration of the passive element portion. An electronic component comprises a ceramic substrate, a passive element portion on the substrate, an insulator layer which is provided over the passive element portion and comprises a through-hole, a lead terminal which is fitted in the through-hole of the insulator layer and electrically connected to the passive element portion, and an external connection terminal which is electrically connected to the lead terminal. The insulator layer comprises a first face on the side of the passive element portion, a second face on the side opposite the passive element portion, and a third face which connects the first face and the second face and constitutes the peripheral face of the insulator layer, the external connection terminal is in contact with the lead terminal and the second face and the third face of the insulator layer. In a cross-section of the through-hole in a thickness direction of the substrate, a boundary line between the internal surface of the through-hole and the lead terminal is inclined in a direction moving away from a region of the third face with which the external connection terminal is in contact with an end of the boundary line on the side of the first face being taken as a fixed point.07-02-2009
20090145649MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE - A multi-layered wiring substrate, in which a wiring layer and an insulative layer are alternately arranged, having pads to connect to electronic components at one side thereof and wires to connect the corresponding pads to the wiring layer, is composed so that the multi-layered wiring substrate is provided with through holes in which a resin material is filled, at least a part of the pads is formed on the resin material, and at least a part of the wire is contained in the resin material.06-11-2009
20120024583MULTILAYER LAMINATE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A multilayer laminate package and a method of manufacturing the same are provided. The multilayer laminate package includes a cavity layer, a non-cavity layer, an electronic component, and a metalized blind via. The cavity layer includes a first adhesive layer and two first circuit layers, which are stacked with the first adhesive layer between, and an opening. The non-cavity layer includes a second adhesive layer and a second circuit layer. The non-cavity layer is bonded to the cavity layer with the second adhesive layer so as to close one side of the opening. The electronic component is mounted in the opening and is electrically connected to the non-cavity layer exposed through the opening. The metalized blind via electrically connects the non-cavity layer to one of the circuit layers of the cavity layer.02-02-2012
20090151991MOUNTING STRUCTURE, ELECTROOPTIC DEVICE, AND ELECTRONIC APPARATUS - A mounting structure includes: a wiring board; an electronic element which is mounted in the wiring board and supplied with a periodic signal; and a first opening which is formed in the wiring board along one side of the electronic element in a longitudinal direction of the electronic element. The opening is opposed to the entire one side of the electronic element.06-18-2009
20090145648MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE - A multilayer wiring board is so constituted that: a group of electronic part mounting capture pads are provided on one surface thereof; a first wiring layer formed on an uppermost layer thereof includes a first connection part arranged on the same surface as the surface where the pads are provided, and a second connection part spaced from the first connection part; the pad and the first connection part are electrically connected through a conductor wire, and the conductor wire is provided in a first insulating layer laminated on the first wiring layer; and the first connection part is connected linearly or curvedly to the second connection part through a first wiring pattern.06-11-2009
20090145646Electromagnetic bandgap structure and printed circuit board - According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates.06-11-2009
20090145645Interconnection element with posts formed by plating - An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.06-11-2009
20090101397PRINTED CIRCUIT BOARD HAVING IMPROVED SOLDER PAD LAYOUT - A printed circuit board (04-23-2009
20100122841Printed circuit board assembly of electronic appliance - Disclosed herein is a printed circuit board assembly of an electronic appliance including a plurality of boards on which electrical parts to perform functions necessary for the electronic appliance are separately arranged according to the specification of the electronic appliance. The printed circuit board assembly is divided into a plurality of boards, such that electrical parts having a common specification and electrical parts having different specifications are arranged on different boards, thereby optimizing the printed circuit board assembly and configuring the boards according to the specification of the electronic appliance without loss. Microprocessors are arranged on the boards, and the boards are connected to each other in a serial communication, thereby reducing the number of wiring harnesses (W/H) and thus configuring the printed circuit board assembly with high reliability. Furthermore, the boards are connected to each other in an insulation manner, thereby configuring the boards in an anti-resistance structure.05-20-2010
20100294552ELECTRONIC COMPONENT MOUNTED STRUCTURE - An electronic component (chip) mounted structure includes a chip having a terminal, a wiring board having a terminal electrically connected to the terminal of the chip, and an interposing board disposed between the chip and the wiring board and having a structure including an insulating base material provided with a large number of filamentous conductors penetrating the insulating base material in a thickness direction thereof. The terminal of the chip is electrically connected to the terminal of the wiring board via a plurality of filamentous conductors provided in the interposing board.11-25-2010
20100126760PRINT CIRCUIT BOARD AND ELECTRONIC DEVICE USING THE SAME - A print circuit board includes a first layer on which a land is formed, a second layer on which an analog signal pattern and a first ground pattern are wired, a third layer on which a digital signal pattern and a second ground pattern are wired, and a fourth layer on which a third ground pattern is wired. The digital signal pattern is vertically sandwiched between the first ground pattern and the third ground pattern. The analog signal pattern and digital signal pattern are arranged without overlapping each other on the projection plane. The analog signal pattern and second ground pattern are arranged so as to overlap each other.05-27-2010
20090120674BUILT-IN BATTERY ASSEMBLY AND A METHOD OF ASSEMBLING THE BUILT-IN BATTERY WITH A CIRCUIT BOARD - A built-in battery assembly (05-14-2009
20100078204Printed circuit board including electronic component embedded therein and method of manufacturing the same - Disclosed herein is a printed circuit board including an electronic component embedded therein and a method of manufacturing the printed circuit board. The electronic component is disposed in a cavity of a resin layer including circuit layers formed on both sides thereof. The resin layer, the electronic component and the circuit layers are attached to each other via adhesive layers disposed therebetween. The printed circuit board is manufactured by a compression process, thus shortening a production time and simplifying a manufacturing process.04-01-2010
20120228015PROCESS OF ELECTRONIC STRUCTURE AND ELECTRONIC STRUCTURE - A process of electronic structure is provided. First, a carrier board is provided, in which the carrier board has a first surface. Next, a first release layer is formed on the first surface of the carrier board. The first release layer has property of withstanding high-temperature and temporary adhesion capability and the first release layer entirely or mostly overlays the first surface. Then, a built-up structure is formed on the first release layer. Finally, a separating process is performed so that the built-up structure is separated from the carrier board to form an electronic structure.09-13-2012
20100084175COMPONENT BUILT-IN WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A component built-in wiring substrate (04-08-2010
20100084174SEALING MATERIAL AND MOUNTING METHOD USING THE SEALING MATERIAL - A sealing material is provided which has sealing characteristics with low stress and high reliability upon mounting electronic parts on a board, and good repairablity after the sealing. The sealing material contains a heat-curable resin component and is characterized by ΔE/ΔT in a range of from 0.5 MPa/° C. to 30 MPa/° C. wherein ΔE/ΔT represents a ratio of change (ΔE) in storage elastic modulus (E) relative to a temperature change (ΔT) when the storage elastic modulus (E) is determined as the temperature is raised within a temperature range including a glass transition point (Tg) of the cured sealing material.04-08-2010
20100078205WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole and contoured such that a sheet for positioning the electronic component in the penetrating hole is laminated horizontally with respect to the first surface of the core substrate over the penetrating hole.04-01-2010
20090288865DISPLAY DEVICE AND ELECTRONIC APPARATUS - A display device includes an anode electrode provided for each pixel, an opening insulation film which covers the periphery of the anode electrode and which defines an pixel opening, and a storage capacitor disposed below the anode electrode through a planarizing insulation film, having a function to store charge for driving a pixel, and including capacitor electrodes wider than the pixel opening.11-26-2009
20090120676Process for the production of a conductor track structure - The invention concerns a process for the production of a conductor track structure on a flexible plastic film, a conductor track structure produced in accordance therewith, wherein the conductor track structure is connected to the plastic film by means of an adhesive layer hardened by irradiation, and is formed from an electrically conducting thin film layer in pattern form, which is galvanically reinforced with at least one metal layer, as well as an electronic component or an electronic circuit having such a conductor track structure.05-14-2009
20090120675MOUNTED STRUCTURAL BODY AND METHOD OF MANUFACTURING THE SAME - Including a wiring board having an electronic component mounted at least on a first surface, a resin applied at least between the electronic component and the wiring board, and a through-hole provided in a region corresponding to the mounting position of the electronic component in the wiring board, a protrusion is formed on the wiring board so as to overlap at least with the electronic component, around a region corresponding to the mounting position of the electronic component.05-14-2009
20100089629ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING THE SAME - In a method for producing an electronic component device, a heat bonding step is performed in a state in which low melting point metal layers including low melting point metals including, for example, Sn as the main component, are arranged to sandwich, in the thickness direction, a high melting point metal layer including a high melting point metal including, for example, Cu as the main component, which is the same or substantially the same as high melting point metals defining first and second conductor films to be bonded. In order to generate an intermetallic compound of the high melting point metal and the low melting point metal, the distance in which the high melting point metal is to be diffused in each of the low melting point metal layers is reduced. Thus, the time required for the diffusion is reduced, and the time required for the bonding is reduced.04-15-2010
20110198116LAMINATE STRUCTURE - According to one embodiment of the present invention, a laminate structure comprises a laminate including a first substrate and a second substrate which is overlapped with the first substrate; and an exterior frame which surrounds a side surface of the laminate, and covers a region of both main surfaces of the laminate. Both of the first substrate and the second substrate have a through hole which is positioned at the region of the both main surfaces of the laminate. The exterior frame comprises a material which has lower elastic modulus than the laminate, and portions of the exterior frame extend into the through holes.08-18-2011
20100006331Printed Circuit Board With Embedded Semiconductor Component and Method for Fabricating the Same - A printed circuit board having a semiconductor component embedded therein and a method of fabricating the same are proposed, including: providing a circuit board body having a through hole, a first surface and an opposing second surface both provided with a core circuit layer thereon; forming on the first surface a first dielectric layer with a dielectric-layer opening for exposing part of the first surface; forming a first circuit layer on the first dielectric layer, and forming first conductive vias in the first dielectric layer; fixing in position to the through hole a semiconductor chip having an active surface with electrode pads thereon; forming in the dielectric-layer opening a third dielectric layer for covering the active surface of the semiconductor chip; forming a third circuit layer on the third dielectric layer, and forming third conductive vias in the third dielectric layer. The printed circuit board thus fabricated is warpage-free.01-14-2010
20090277675Substrate for mounting electronic component and electronic apparatus including the substrate11-12-2009
20090126980PRINTED WIRING BOARD - In a printed wiring board, contacts are formed only on one side surface of a printed board, and electronic components are arranged only on the other side surface of the printed board. Then, soldering work employing Pb free solder is conducted only on the other side surface of the printed board on which the electronic components are arranged, and thus, the electronic components are mounted.05-21-2009
20090272567ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME - An electronic device includes: first and second electronic parts, each of which has a conductive contact; and a plurality of first and second conductive filaments formed on the conductive contacts of the first and second electronic parts, respectively. The first and second electronic parts are connected detachably and coupled electrically to each other through interlocking between the first and second conductive filaments.11-05-2009
20090272568Microwave Chip Supporting Structure - The present invention relates to a microwave chip supporting structure comprising a first microwave laminate layer, with a first side and a second side, and an outer limit. At least one conductor is formed on said first side, extending towards said outer limit. The microwave chip supporting structure further comprises a second microwave laminate layer, with a first side and a second side, the second side of the second laminate layer being fixed to at least a part of the first side of the first laminate layer. The first laminate layer and/or the second laminate layer comprises at least one recess arranged for receiving a microwave chip intended to be connected to said conductor. The second laminate layer extends outside the outer limit of the first laminate layer, said conductors continuing on the second side of the second laminate layer without contacting the first laminate layer.11-05-2009
20090277676IN-MOLD DECORATION DEVICE AND MANUFACTURING METHOD THEREOF - An in-mold decoration (IMD) device and a manufacturing method thereof are provided. The manufacturing method of the IMD device includes following steps. First, a patterned film is formed. The patterned film includes a pattern layer and a film layer located below the pattern layer. A conductive layer is then formed on the film layer. Next, the conductive layer is connected to an electrical connection element. Thereafter, a resin layer is formed on the conductive layer.11-12-2009
20090266596PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENTS AND METHODS FOR THE SAME - The present invention discloses a printed circuit board. The printed circuit board is made by the method of providing a substrate; forming a first circuit on the substrate; depositing a thin film on the substrate; building an electronic component on the substrate by the thin film and allowing the electronic component to electrically connect the first circuit; forming a blanket dielectric layer enclosing the electronic component; and removing the substrate.10-29-2009
20090283313SMALL FORM FACTOR MOLDED MEMORY CARD AND A METHOD THEREOF - A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is located on the upper surface of the circuit substrate and electrically connected with the circuit layer. The encapsulant covering is formed by using a mold to press encapsulant entering at least one encapsulant inlet provided on at least one side surface of the circuit substrate. The encapsulant covering encapsulates all the above components with only the electric contacts exposed. A trace mark of the encapsulant inlet remaining on the encapsulant covering is then cut to obtain a shape-molding structure of memory card with an smooth and intact outer appearance.11-19-2009
20090283312Printed wiring board and method for manufacturing the same - A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.11-19-2009
20090294162Printed circuit board and manufacturing method thereof - Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board, having an electronic component mounted thereon, in accordance with an embodiment of the present invention includes: a substrate having a circuit pattern and a pad formed on one side thereof; a solder resist layer formed on one side of the substrate so as to expose the pad; and a dam formed on the solder resist layer by an inkjet printing method and disposed at a position corresponding to where the electronic component is mounted so as to control a flow of an underfill solution injected between the substrate and the electronic component.12-03-2009
20110203839WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A wiring substrate with improved heat dissipation capability and with reduced size is disclosed. The wiring substrate includes a metal core substrate, a buffer layer formed so as to cover at least a part of the metal core substrate and containing a phase change material or a material with an electrocaloric effect, an electronic device mounted on a surface of a base including the metal core substrate and the buffer layer or inside the base, and a thermal via formed between the electronic device and the buffer layer.08-25-2011
20090008139MULTILAYER PWB AND A METHOD FOR PRODUCING THE MULTILAYER PWB - A multilayered printed wiring board, a multilayer PWB, and a method for manufacturing the same. The multilayer PWB comprises a first main surface and an opposing second main surface, where the multilayer PWB has a height being defined by the distance from the first main surface to the opposing second main surface. The two surfaces and the height together define the thickness of the multilayer PWB. The multilayer PWB comprises a reference ground plane, a microstrip conductor separated from the reference ground plane by a first dielectric layer and a stripline conductor connected with the microstrip conductor and being separated from the reference ground plane by a second dielectric layer. The reference ground plane is formed by two or more different partial reference ground planes positioned at different layers of the multilayer PWB. Furthermore, the reference ground plane is moveable from the first partial reference ground plane to the second partial reference ground plane when a signal current transits from the microstrip conductor to the stripline conductor, and vice versa.01-08-2009
20090166073CERAMIC SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND ELECTRICAL DEVICE USING THE SAME - Provided are a ceramic substrate, a method of manufacturing the same, and an electrical device using the same. A ceramic substrate includes a first laminated body, a second laminated body and an adhesive part. The first laminated body includes a predetermined electrode formed therein. The second laminated body is laminated on and electrically connected to the first laminated body. Also, the adhesive part is intervened between the first laminated body and the second laminated body to adhere the first and second laminated bodies through interfacial reaction.07-02-2009
20090166072ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME, AND WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An electronic apparatus includes a multilayer wiring structure having insulating layers and wiring layers which are stacked and having a surface on which an electronic component is mounted, a dipole antenna formed on a surface 07-02-2009
20110198115ELECTRONIC COMPONENT BUILT-IN MODULE AND METHOD OF MANUFACTURING THE SAME - An electronic component built-in module includes an electronic component, a substrate on which the electronic component is mounted, a first resin covering the electronic component and the substrate, and a second resin covering the surface of the first resin. The first resin is formed of a resin including pores. The first resin is formed so that the thickness of the first resin on an area where the electronic component is not mounted is larger than that on an area where the electronic component is mounted on the surface of the substrate. A porosity of the second resin is smaller than that of the first resin.08-18-2011
20120292089CIRCUIT BOARD STRUCTURE WITH CAPACITORS EMBEDDED THEREIN AND METHOD FOR FABRICATING THE SAME - A circuit board structure with capacitors embedded therein and a method for fabricating the same are disclosed. The structure comprises at least two core layers individually comprising a dielectric layer having two opposite surfaces, circuit layers disposed on the outsides of the two opposite surfaces of the dielectric layer, and at least two capacitors embedded respectively on the insides of the two opposite surfaces of the dielectric layer and individually electrically connecting with the circuit layer at the same side; at least one adhesive layer disposed between the core layers to combine the core layers as a core structure; and at least one conductive through hole penetrating the core layers and the adhesive layer, and electrically connecting the circuit layers of the core layers. Accordingly, the present invention can improve the flexibility of circuit layout, and realize parallel connection between the capacitors to provide more capacitance.11-22-2012
20080245554FABRICATION METHOD AND STRUCTURE OF PCB ASSEMBLY, AND TOOL FOR ASSEMBLY THEREOF - A fabrication method and structure for a PBCA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having a plurality of openings exposing at least one first pad and a plurality of second pads arranged beyond the first pad, on a surface. The first solder joint has a maximum width J10-09-2008
20100101849ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an electronic component built-in substrate, includes the steps of mounting a chip-like electronic component having a connection pad and a metal protection layer formed on a whole of one surface to cover the connection pad, on a wiring substrate to direct the connection pad upward; embedding the electronic component with the insulating layer; processing the insulating layer in a thickness direction to leave the insulating layer in a side of the electronic component and to expose the metal protection layer of the electronic component; and forming an upper wiring layer having an in-chip wiring part which is connected to the connection pad and contacts an upper surface of the electronic component and is constructed by an underlying metal pattern layer formed by patterning the metal protection layer and a conductive pattern layer formed thereon, and an extended wiring part which is connected to the in-chip wiring part to extend onto the insulating layer and is formed by an identical layer as the conductive pattern layer.04-29-2010
20100101848SUBSTRATE UNIT, INFORMATION PROCESSOR AND METHOD OF MANUFACTURING SUBSTRATE UNIT - A substrate unit includes an electronic component having a plurality of electrodes arranged in a given shape, a circuit substrate having a first face where the electronic component is mounted and the electrodes are jointed and a second face underside of the first face, and a resin-coated portion formed on the second face according to a projected area of the second face to which the given shape is projected.04-29-2010
20100101847ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.04-29-2010
20080251284Electronics Structures Using a Sacrificial Multi-Layer Hardmask Scheme - An electronic structure including a substrate having a having a dielectric layer with at least one metallic interconnect structure within and a dielectric barrier layer above the dielectric layer, and a multi-layer hardmask stack coated with a self-assembled layer, where the self-assembled layer is a pattern of nanoscale and/or microscale voids which are generated into the dielectric barrier layer and into the dielectric layer next to the metallic interconnect structure to create columns in the dielectric barrier layer and dielectric layer therein. Electronics structures prepared with the process are useful to prepare electronics devices, such as computers and the like.10-16-2008
20080251285CAPACITOR AND WIRING BOARD INCLUDING THE CAPACITOR - A capacitor is provided having a tough surface portion which prevents cracking that tends to occur when the capacitor is built-in or surface-mounted on a wiring board. A ceramic sintered body of the capacitor includes a capacitor forming layer portion, a cover layer portion and an interlayer portion. The capacitor forming layer portion has a laminated structure wherein ceramic dielectric layers and inner electrodes connected to a peripheral portion of capacitor via conductors, are alternately laminated. The cover layer portion is exposed at a surface portion of the ceramic body and has a laminated structure wherein ceramic dielectric layers and dummy electrodes not connected to the capacitor via conductors, are alternately laminated.10-16-2008
20110266041METHOD FOR EMBEDDING A COMPONENT IN A BASE - A method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base, when part of the base structure is, as it were, manufactured around the semiconductor components. Through-holes for the semiconductor components are made in the base, in such a way that the holes extend between the first and second surface of the base. After the making of the holes, a polymer film is spread over the second surface of the base structure, in such a way that the polymer film also covers the through-holes made for the semiconductor components from the side of the second surface of the base structure. Before the hardening, or after the partial hardening of the polymer film, the semiconductor components are placed in the holes made in the base, from the direction of the first surface of the base. The semiconductor components are pressed against the polymer film in such a way that they adhere to the polymer film.11-03-2011
20110266040MULTILAYER CERAMIC CAPACITOR, PRINTED CIRCUIT BOARD INCLUDING THE SAME, METHODS OF MANUFACTURING THEREOF - There are provided a multilayer ceramic capacitor, a printed circuit board including the same, a method of manufacturing the multilayer ceramic capacitor, and a method of manufacturing the printed circuit board. The method of manufacturing a multilayer ceramic capacitor includes: preparing a capacitor body on which external electrode material layers are formed, dry polishing the capacitor body such that surfaces of the external electrode material layers are smooth and compact, and forming plating layers on the surfaces of the external electrode material layers in order to form external electrodes. Therefore, the surface smoothness, compactness, and uniformity of an external electrode plating layer can be improved.11-03-2011
20110180312Printed circuit board with embedded chip capacitor - A printed circuit board having an embedded chip capacitor includes a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, having a first electrode connected to the first conductive layer through being seated in a cavity formed between the first conductive layer and the second conductive layer; a filled material, filled in a space excluding a space occupied by the chip capacitor in the cavity; and a via, penetrating the filled material and connecting the second conductive layer to the second electrode of the chip capacitor.07-28-2011
20110180311SOLDER, ELECTRONIC PART, AND METHOD OF FABRICATING ELECTRONIC PART - A solder material with favorable mechanical properties and high corrosion resistance is provided. The solder material is not apt to be melted in a re-heating process after the soldering process is performed. The solder material includes first solder powder, Cu powder, and a flux. The first solder powder contains Cu, Si, Ti, and Sn. Here, Cu accounts for 7 wt %˜9 wt %, Si accounts for 0.001 wt %˜0.05 wt %, Ti accounts for 0.001 wt %˜0.05 wt %, and the rest is Sn. The Cu powder is coated by Ag. The flux is mixed with the first solder powder and the Cu powder.07-28-2011
20120292088ELECTRONIC DEVICE WITH OBLIQUELY CONNECTED COMPONENTS - According to the disclosure, an electronic device comprising a circuit board and an electrical component is disclosed. The circuit board has a first surface and includes a solder pad array including solder pads. The solder pad array is disposed on a first surface of the circuit board, and the circuit board further has vias passing through the solder pads and the circuit board. The electrical component is disposed on the first surface and between two of the solder pads next to each other. The electrical component includes two contacts electrically connected to the two solder pads next to each other. A line passing through the centers of the two contacts forms an acute angle with a line passing through the centers of the two solder pads next to each other.11-22-2012
20090166070FLEXIBLE FILM AND DISPLAY DEVICE COMPRISING THE SAME - A flexible film is provided. The flexible film includes a dielectric film, a first metal layer, which is formed on the dielectric film, and a second metal layer, which is formed on the first metal layer, wherein the surface of the dielectric film is modified so as to provide a haze of 2-25%. Therefore, it is possible to improve the peel strength of a dielectric film with respect to a metal layer and facilitate the testing of circuit patterns on a flexible film.07-02-2009
20090166071Substrate and Electronic Device Using the Same - An electronic device which includes a feedthrough capacitor mounted on a front surface of a substrate. A feedthrough electrode penetrates a laminate (body of the capacitor). External electrodes are electrically connected to opposite ends of the feedthrough electrode. A capacitor electrode is disposed to form capacity in cooperation with the feedthrough electrode. A wiring conductor is formed on a rear surface of the substrate or inside the substrate, and via-hole conductors are connected to the wiring conductor. The feedthrough electrode and the external electrodes constitute a first current path. The wiring conductor and the via-hole conductors constitute a second current path electrically connected in parallel to the first current path.07-02-2009
20080277151Electronic Assemblies without Solder and Methods for their Manufacture - The present invention provides an electronic assembly 11-13-2008
20080277150WIRING BOARD WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a wiring board with built-in component. The method provides a secure connection between a component and interlayer insulating layers so that the wiring board with built-in component has excellent reliability. The wiring board is manufactured through a core board preparation step, a component preparation step, an accommodation step and a height alignment step. In the core board preparation step, a core board having an accommodation hole therein is prepared. In the component preparation step, a ceramic capacitor having therein a plurality of protruding conductors which protrudes from a capacitor rear surface is prepared. In the accommodation step, the ceramic capacitor is accommodated in the accommodation hole with the core rear surface facing the same side as the capacitor rear surface. In the height alignment step, a surface of a top portion of the protruding conductor and a surface of a conductor layer formed on the core rear surface are aligned to the same height.11-13-2008
20080277149ELECTRONIC DEVICE MANUFACTURING METHOD AND SUPPORTER - A method for manufacturing an electronic device includes: preparing an electronic component having an electrode; fixing the electronic component to a supporter, the supporter having a support surface and an inlet disposed in a position that is at a side of the support surface and lower than the support surface, by supporting the electronic component with the support surface so that the electronic component does not come into contact with the inlet and so that a part of a surface of the electronic component adjacent to the support surface is exposed out of the support surface and by attracting a region of the electronic component exposed out of the support surface toward the inlet; and electrically coupling the electrode and a conductive pattern with the electronic component fixed to the supporter.11-13-2008
20080283283Material for Forming Capacitor Layer and Method for Manufacturing the Material for Forming Capacitor Layer - An object of the present invention is to provide a material for forming a capacitor layer comprising a dielectric layer formed by any one of a sol-gel method, an MOCVD method, and a sputtering deposition method. The material can reduce a leakage current of a capacitor circuit. In order to achieve the object, a material for forming a capacitor layer comprising a dielectric layer between a first conductive layer to be used for forming a top electrode and a second conductive layer to be used for forming a bottom electrode, characterized in that the dielectric layer is a dielectric oxide film formed by any one of a sol-gel method, an MOCVD method, and a sputtering deposition method; and particles constituting the dielectric oxide film are impregnated with a resin component is employed. In addition, a manufacturing method characterized in that the dielectric oxide film is formed on the surface of a material to be the bottom electrode by any one of a sol-gel method, an MOCVD method, and a sputtering deposition method; a resin varnish is impregnated into a surface of the dielectric oxide film; the resin is dried and cured to form the dielectric layer; and then a top electrode constituting layer is provided on the dielectric layer is employed.11-20-2008
20080289867MULTI-STRAND SUBSTRATE FOR BALL-GRID ARRAY ASSEMBLIES AND METHOD - A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11-27-2008
20080308310Device Comprising a Substrate Including an Electronic Contact, and Transponder - The invention relates to a device comprising a first electric contact (12-18-2008
20090321118Printed circuit board embedded chip and manufacturing method thereof - An electronic component embedded printed circuit board and a manufacturing method thereof. The electronic component embedded printed circuit board includes an insulating layer forming a core layer; an electronic component inserted to project a part thereof on an upper part of the insulating layer; a metallic seed layer formed on the insulating layer including a projected surface of the electronic component; a plating layer formed on the metallic seed layer; circuit patterns electrically connected to pads of the electronic component through via-holes formed on the insulating layer; and a solder resist layer which is formed on the insulating layer and has solder balls attached onto the via-holes electrically connected to the circuit patterns. In the electronic component embedded printed circuit board, a heat radiation characteristic can be maximized and a thickness of the printed circuit board can be minimized. In case that the insulating is made of a thermoplastic resin, the electronic component can be reutilized, thereby saving product cost.12-31-2009
20080308309Structure of packaging substrate having capacitor embedded therein and method for fabricating the same - A structure of a packaging substrate having capacitors embedded therein is disclosed. The structure comprises a core substrate, a dielectric layer, and an outer circuit layer. The core substrate comprises an inner circuit layer. The dielectric layer is disposed at both sides of the core substrate, having first conductive vias each connecting to the inner circuit layer through a piece of outer electrode plate, a piece of high dielectric material layer, a piece of inner electrode plate, and a piece of adhesive layer, in sequence. The outer circuit layer is disposed on the surface of each of the dielectric layers. Herein, the capacitor is composed of a piece of the outer electrode plate, the high dielectric material layer and the inner electrode plate. The invention further comprises a method for manufacturing the same. This can achieve low costs, avoid the formation of voids, and reduce parasitic capacitance.12-18-2008
20130118790Localized Skew Compensation Technique for Reducing Electromagnetic Radiation - Techniques are provided for electrically connecting components on a printed circuit board (PCB), semiconductor chip package, or other electronic device. More specifically, a first component, configured to generate a differential signal, is disposed on the PCB, while a second component, configured to receive the differential signal from the first component, is also disposed on the PCB. A differential conductor pair comprising first and second parallel conductors extends along a path between the first and second components. The path of the differential conductor pair comprises at least one turn that causes a change in direction of the first and second conductors. The first conductor comprises at least one localized skew compensation bend disposed at the turn such that, at the end of the turn, the first and second conductors have substantially the same length with respect to the first component.05-16-2013
20130118791LAMINATED WIRING BOARD AND MANUFACTURING METHOD FOR SAME - A laminated wiring board, includes: a first substrate in which a conductor circuit is formed on one surface of an insulating layer and an adhesive layer is formed on an other surface of the insulating layer, and conductors are formed in via holes that pass through the insulating layer and the adhesive layer so that the conductor circuit is partially exposed therefrom; an electronic component electrically connected to the conductor circuit by allowing electrodes of the electronic component to be connected to the conductors; an embedding member arranged around the electronic components so that the electronic component is embedded therein; and a second substrate having an adhesive layer laminated to face the adhesive layer of the first substrate and sandwich the electronic component and the embedding member, wherein each of the electrodes of the electronic component is continuous with the conductor circuit through two or more of the conductors.05-16-2013
20080236876MULTILAYER PRINTED CIRCUIT BOARD - The multilayer printed circuit board according to the present invention is a multilayer printed circuit board, in which conductor circuits and insulating layers are formed and layered, an optical path for transmitting an optical signal comprising a resin composite is formed, and conductor circuits are formed on an outermost insulating layer. Herein, an end portion of the above described optical path for transmitting an optical signal protrudes from the surface of the outermost insulating layer.10-02-2008
20110005822STRUCTURE OF A PACKAGE FOR ELECTRONIC DEVICES AND METHOD FOR MANUFACTURING THE PACKAGE - A package structure for an electronic device having an electronic device mounted on a substrate; the electronic device including an external electrode; the substrate including an interconnection and an electrode pad for mounting the electronic device thereon. Part or entire of the interconnection and part or entire of the electrode pad of the substrate are formed of the same material; and the external electrode of the electronic device is joined to the electrode pad of the substrate with a joining part which is the same material as the interconnection and the electrode pad.01-13-2011
20100139963Interconnect substrate, method of manufacturing interconnect substrate and semiconductor device - Embodiments of the invention provide an interconnect substrate capable of improving the connection reliability and yield of a semiconductor device, a method of manufacturing the interconnect substrate, and a semiconductor device using the interconnect substrate.06-10-2010
20090090544System and Method for Substrate with Interconnects and Sealing Surface - A method includes providing a base. At least one lead is deposited on the base, the at least one lead including a trace of electrically conductive material having a first end and a second end. A dielectric layer is deposited on a portion of the at least one lead between the first end and the second end. A sealing surface is deposited on a portion of the dielectric layer, the sealing surface including a contiguous shape of metal separating an enclosed area of the base located inside the contiguous shape from an open area of the base located outside the contiguous shape. The first end of the at least one lead is located in the enclosed area and the second end of the at least one lead is located in the open area. Moreover, the dielectric layer electrically insulates the at least one lead from the sealing surface.04-09-2009
20100139962WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer (resin layer) interposed therebetween, and the wiring layers are connected to each other through a via formed in each of the resin layers. A recessed portion is formed in an annular shape surrounding a chip mounting area on the outermost resin layer on a chip mounting surface side of the wiring board. Alternatively, a projected portion is formed instead of the recessed portion.06-10-2010
20090178834ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE - An anisotropic electrically conductive film formed by a thermosetting acrylic resin composition is disclosed. The composition contains at least a thermosetting agent (A), a thermo-settable ingredient (B), an acrylic rubber containing hydroxyl groups (C), organic fine particles (D) and electrically conductive particles (E). The thermo-settable ingredient (B) may include a phosphorus-containing acrylic ester (b1). The weight averaged molecular weight of the acrylic rubber containing the hydroxyl groups (C) is not less than 1000000. The organic fine particles (D) include polybutadiene-based fine particles (d1).07-16-2009
20090178836WIRING BOARD FOR SEMICONDUCTOR DEVICE - A wiring board for a semiconductor device has a substrate, a solder resist provided on the substrate, a land, and a wiring line. The solder resist is not in contact with the land, and an end portion of the wiring line is arranged such that, when a solder ball is not provided, the end portion of the wiring line and the land face each other with a distance therebetween.07-16-2009
20100000774Suspension board with circuit and producing method thereof - A suspension board with circuit includes a metal supporting board; an insulating base layer formed on the metal supporting board; a conductive pattern formed on the insulating base layer; an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern; and an optical waveguide. The optical waveguide is provided on the metal supporting board separately from the insulating base layer, the conductive pattern, and the insulating cover layer.01-07-2010
20090025970Multilayer Wiring Board, and Electronic Module and Electronic Device Including the Multilayer Wiring Board - A multilayer wiring board (01-29-2009
20090139757MULTILAYER CHIP CAPACITOR AND CIRCUIT BOARD DEVICE INCLUDING THE SAME - A multilayer chip capacitor including: a capacitor body having a lamination structure where a plurality of dielectric layers are laminated and including a first capacitor part and a second capacitor part arranged according to a lamination direction; first to fourth outer electrodes formed on side surfaces of the capacitor body, the first and third outer electrodes having the same polarity and the second and fourth outer electrodes having the same polarity opposite to that of the first outer electrode; and one or more connection conductor lines formed on an outer surface of the capacitor body and connecting the first outer electrode to the third outer electrode or connecting the second outer electrode to the fourth outer electrode.06-04-2009
20090139756FABRICATING PROCESS OF CIRCUIT BOARD WITH EMBEDDED PASSIVE COMPONENT - A fabricating process of a circuit board with an embedded passive component is described. First, a conductive layer including a first surface and a second surface opposite thereto is provided. The first surface has at least one component region on which at least one passive component material layer is formed. A passivation layer is formed on the first surface to cover the passive component material layer. A brown oxidation process is performed on the conductive layer. A circuit unit and an insulation layer are provided, and the insulation layer is set between the circuit unit and the conductive layer. The conductive layer, the circuit unit and the insulation layer are laminated. The passive component material layer is between the insulation layer and the conductive layer. The conductive layer is patterned to form a circuit layer.06-04-2009
20090139755SURFACE MOUNTED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - The present invention provides a surface mounted semiconductor device 06-04-2009
20090250258Wiring Substrate, Semiconductor Package, Electronic Instrument, And Wiring Substrate Manufacturing Method - One embodiment of the invention is a wiring substrate including an insulating base material layer, a metal layer on the insulating base material layer, and a solder resist laminated to the most superficial surface of the wiring substrate above the insulating base material layer, wherein the metal layer has a loop shaped pattern formed along the edge of the insulating base material layer, and the solder resist is formed in such a way that one portion of the pattern is exposed from, and one portion covered with, an extremity of the solder resist on the edge side, along the pattern.10-08-2009
20090250257Electronic parts packaging structure and method of manufacturing the same - An electronic parts packaging structure of the present invention includes a core substrate having such a structure that a recess portion is provided by forming a prepreg insulating layer having an opening portion therein on a resin layer, and an electronic parts mounted on a bottom portion of the recess portion of the core substrate such that a connection pad of the electronic parts is directed upward, and also, such a structure may be employed that the electronic parts is embedded in a resin layer of a core substrate having a structure that the resin layer is formed on the prepreg insulating layer.10-08-2009
20090250256SOCKET CONTACT TERMINAL AND SEMICONDUCTOR DEVICE - A socket contact terminal for electrical connection between a connection portion formed of a metal conductor on a printed circuit board and a connection terminal of an IC package. The contact terminal comprises a metal terminal composed of a main columnar portion and arm portions on both sides and having an angular U shape and an elastomeric member attached to the metal terminal. A metal surface is exposed from the outer surface of each arm portion. The elastomeric member is firmly held between the arm portions of the metal terminal and exhibits a repulsive force when the arm portions are pressed in the direction that the arm portions approach each other.10-08-2009
20090250255Connections for electronic devices on double-sided circuit board - In the present electronic structure, a substrate is provided in the form of a circuit board. First and second electronic devices are positioned on opposite sides of the circuit board, each having a plurality of contacts connected to the circuit board. Each of the contacts of the first device is connected to a contact of the second device by a connector though the circuit board. At least one of the contacts of the first device is connected to the contact of the second device which is most adjacent to that contact of the first device across the circuit board.10-08-2009
20090250254METHODS FOR CONFIGURABLE MANUFACTURING AND APPARATUS - A method of manufacturing industrial controls includes partially assembling a pre-product at a first stage in manufacturing, including at least partially populating a printed circuit board with generic components and/or laser trimmable components, storing the pre-product for later manufacturing stages. The method further includes populating the printed circuit board with unique components and/or using a laser to establish unique values of the laser trimmable components at a second stage of manufacturing to form a unique model.10-08-2009
20120067636INTERPOSER-EMBEDDED PRINTED CIRCUIT BOARD - Disclosed herein is an interposer-embedded printed circuit board, including: a substrate including a cavity formed in one side thereof and having a predetermined height in a thickness direction of the substrate; an interposer disposed in the cavity and including a wiring region and an insulating region; and a circuit layer formed in the substrate and including a connection pattern connected with one side of the wiring region. The interposer-embedded printed circuit board is advantageous in that an interposer is embedded in a substrate, so that the thickness of a semiconductor package can be reduced, thereby keeping up with the trend of slimming the semiconductor package.03-22-2012
20120067635Package substrate unit and method for manufacturing package substrate unit - A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.03-22-2012
20120067634PRINTED CIRCUIT BOARD WITH VIBRATION-GENERATING ELECTRONIC COMPONENT - Surface mounted ceramic capacitors (03-22-2012
20090200073PRINTED WIRING BOARD WITH CAPACITOR - A printed wiring board includes a capacitor including a dielectric body having a first surface and a second surface, a first electrode provided on the first surface of the dielectric body, and a second electrode provided on the second surface of the dielectric body. The first electrode has an area facing and being smaller than the first surface of the dielectric body, and the second electrode has an area facing and being larger than the second surface of the dielectric body.08-13-2009
20090242258ELECTRONIC DEVICE PACKAGE WITH CONNECTION TERMINALS INCLUDING UNEVEN CONTACT SURFACES - An electronic device package includes an electronic device including a plurality of input/output terminals, a wiring board which places the electronic device on a first surface and includes wiring connected to the input/output terminals of the electronic device, and a first connection terminal formed on a second surface of the wiring board and connected to the wiring, wherein the first connection terminal has an uneven contact surface formed to receive solder material placed thereon.10-01-2009
20090084592Semiconductor device including wiring excellent in impedance matching, and method for designing the same - A semiconductor device includes an interposer, and a semiconductor chip mounted on the interposer. In a plan view, the interposer includes a first region overlapping the semiconductor chip, and a second region excluding the first region. The interposer includes at least one wiring formed astride the first region and the second region. The cross-sectional area of the wiring in the first region and the cross-sectional area of the wiring in the second region are different from each other.04-02-2009
20090050356Capacitors with Insulating Layer Having Embedded Dielectric Rods - A circuit structure is provided. The circuit structure includes a capacitor including a top capacitor electrode; a bottom capacitor electrode parallel to the top capacitor electrode; and an insulating layer between the top and the bottom capacitor electrodes. The insulating layer includes a dielectric rod enclosed by a dielectric material. The dielectric rod has a higher dielectric constant than that of the dielectric material. The circuit structure may be a printed circuit board or packaging substrate, wherein the capacitor is formed between the two layers of the capacitor. Additional dielectric rods may be formed in the insulating layer of the capacitor and spaced apart from the dielectric rods.02-26-2009
20090101400METHOD FOR MANUFACTURING COMPONENT-EMBEDDED SUBSTRATE AND COMPONENT-EMBEDDED SUBSTRATE - A component-embedded substrate includes a component embedded in an uncured resin layer of a second layer. After curing the resin layer, a hole passing through the second layer in the vertical direction is formed. The hole is filled with an electroconductive paste to form a second interlayer connection conductor. A first in-plane conductor including a plurality of lands, a first layer, and the second layer are respectively stacked in that order and pressed to join together, and the first layer is heated to form an integrated structure. A method for manufacturing the component-embedded substrate can form an interlayer connection conductor having a small diameter and high straightness and thus can achieve a miniaturized component-embedded substrate including interlayer connection conductors at a narrow pitch.04-23-2009
20090084594HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are connected by via hole is formed. A via hole is formed on the surface of a mirror-processed Si substrate by using a heat resistant substrate composed of Si substrate so that finer wiring than a resin substrate having unevenness in its surface can be formed, whereby achieving fine pitches. Further, by forming the wiring on a mirror processed surface, dispersion of wiring decreases thereby decreasing dispersion of impedance.04-02-2009
20100155124WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a conductive pattern, an electronic component connected to the conductive pattern by means of a via hole, and a substrate where the electronic component is built into. The connection interface between the via hole and the electronic component inclines toward the connection interface between the via hole and the conductive pattern.06-24-2010
20090205859METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.08-20-2009
20090166069Solder Mounting Structure, Method for Manufacturing Such Solder Mounting Structure and Use of Such Solder Mounting Structure - The camera module structure (07-02-2009
20090211793SUBSTRATE MODULE, METHOD FOR MANUFACTURING SUBSTRATE MODULE, AND ELECTRONIC DEVICE - In a substrate module of the present invention, a connection electrode is provided on a first surface of a substrate, and a first penetrating hole portion is running through the substrate in a thickness direction thereof so as to reach a reverse surface of the connection electrode, with a penetrating electrode being provided inside the first penetrating hole portion. The penetrating electrode defines a depression in a position opposing the reverse surface of the connection electrode, and an upper portion of the penetrating electrode is thicker than a side portion of the penetrating electrode. The penetrating electrode is present also on a second surface of the substrate, and is connected to a wiring electrode on the second surface.08-27-2009
20090205858Circuit carrier - Circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the latter having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the support layer.08-20-2009
20110220401LATENT HARDENER WITH IMPROVED BARRIER PROPERTIES AND COMPATIBILITY - A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.09-15-2011
20110220400CAPACITOR-CIRCUIT BOARD INTERFACE FOR WELDING SYSTEM COMPONENTS - A welding system component includes a circuit board for the welding system component. An interface has a main riser portion with a fastener passageway formed therethrough. The interface has an extension portion with a terminal passageway formed therethrough. The extension portion is electrically connected to the circuit board with a terminal disposed in the terminal passageway. The extension portion is spaced away from a surface of the circuit board. A capacitor is electrically connected to the main riser portion with a fastener disposed in the fastener passageway.09-15-2011
20090211794Wiring board and manufacturing method therefor - In order to provide a wiring board having a structure different from a conventional structure and a manufacturing method therefor, a wiring board (08-27-2009
20090211795Printed Board And Portable Electronic Device Which Uses This Printed Board - A printed board comprising a packaging surface on which an electronic component is packaged, an adhesion prohibited portion which is provided at a region of the printed board different from a region where the electronic component is provided, and to which adhesion of the adhesive material is prohibited, and a blocking step portion which is formed at a region between the region where the electronic component is provided and the region where the adhesion prohibited portion is provided, which blocks any adhesive material which has spilled out from between the bottom surface of the electronic component and the packaging surface from reaching the adhesion prohibited portion.08-27-2009
20090242252Method for Manufacturing A Multilayer Printed Wiring Board for Providing an Electronic Component Therein - A multilayer printed wiring board and method for manufacturing a multilayer printed wiring board. One method include a method for manufacturing a multilayer printed wiring board having an electronic component housed therein. The method includes forming a conduction circuit on a core substrate and forming an alignment mark on the core substrate separate from the conduction circuit. Also included is forming a concavity in the core substrate, the concavity being formed in an area of the core substrate not including the conductor circuit and alignment mark, and inserting the electronic component into the concavity in the core substrate by using the alignment mark on the core substrate to align the electronic component with the concavity.10-01-2009
20090229871FEEDTHROUGH CAPACITOR AND MOUNTED STRUCTURE THEREOF - A feedthrough capacitor has: a capacitor element body of a substantially rectangular parallelepiped shape in which a plurality of insulator layers are laminated together; a signal internal electrode arranged in the capacitor element body; a ground internal electrode arranged in the capacitor element body and opposed to the signal internal electrode; signal terminal electrodes connected to the signal internal electrode; and a ground terminal electrode connected to the ground internal electrode. The signal terminal electrodes are provided on first and second end faces, respectively, in a longitudinal direction of the capacitor element body. The ground terminal electrode is provided on at least one side face out of first to fourth side faces extending along the longitudinal direction of the capacitor element body. Furthermore, the ground terminal electrode is located nearer at least one end face out of the first end face and the second end face.09-17-2009
20090260864CIRCUIT BOARD AND SEMICONDUCTOR INTEGRATED CIRCUIT MODULE INCLUDING THE SAME - A circuit board includes a plurality of differential signal line pairs, and a plurality of electromagnetic bandgap (EBG) patterns, each configured to be disposed to overlap the plurality of differential signal line pairs, wherein the EBG patterns are electrically insulated from the differential signal line pairs.10-22-2009
20090242253FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS - According to one embodiment, a plurality of conductive-paste-filling openings are provided in the cover layer to align with the conductive pattern portion, and a plurality of conductive portions are formed by filling conductive paste in the plurality of conductive-paste-filling openings to conductively join the metal layer to the conductive pattern portion.10-01-2009
20090242254MULTILAYER WIRING BOARD AND ELECTRICAL CONNECTING APPARATUS USING THE SAME - The present invention makes repair easy and reduces effects on the electrical connection conditions of an electronic component to an internal wiring after repair and on the mechanical strength of the repair part in a case of breakage or separation of an electrode for implementation of the electronic component. In a multilayer wiring board, a plurality of wiring sheets each having an internal wiring and a plurality of electrical insulating sheets are arranged alternately in the thickness directions of these sheets, and a plurality of electrodes for implementing an electronic component electrically connected to the internal wirings are formed on the surface of an uppermost sheet. The multilayer wiring board further comprises a plurality of spare electrodes corresponding to the electrodes and electrically connected to the internal wirings connected to the corresponding electrodes directly under the corresponding electrodes on a sheet located directly under the uppermost sheet.10-01-2009
20090242251Embedded printed circuit board and manufacturing method thereof - The present invention relates to an embedded printed circuit board and a manufacturing method thereof. The present invention provides an embedded printed circuit board including a substrate in which a cavity is formed in a predetermined portion and a wiring layer is formed in a portion without the cavity; a chip inserted into the cavity and including a plurality of pads; a filler filled between the chip and the cavity to fix the chip; and a connection layer formed between the wiring layer and the pads to connect the wiring layer and the pads to each other. Further, the present invention provides a manufacturing method of the embedded printed circuit board.10-01-2009
20100147572Electrical Device, System and Method for Operating with Reduced Acoustic Noise Generation - Disclosed herein is a device for reducing noise generated by an electrical component, the device including a stiffening component secured to an electrical component, wherein the stiffening component provides rigidity to the electrical component, thereby reducing the mechanical resonance of the electrical component during operation. The electrical component has at least one end face and a flange portion that includes a flange face that extends about a perimeter of the end face. The flange face is substantially parallel to the end face, wherein the stiffening component is secured to the flange face of the electrical component such that it does not extend into a plane of the end face. Further, the stiffening component can include a stiffening portion and a securing portion, wherein the stiffening portion is secured to the flange face of the electrical component by the securing portion. Further, the electrical component can be a power semiconductor device.06-17-2010
20090277677Electronic Assemblies without Solder and Method for their Design, Prototyping, and Manufacture - A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components 11-12-2009
20120193132ELECTRONIC SYSTEM WITH EXPANSION FEATURE - An electronic system is provided including forming a substrate having a radiating patterned pad, mounting an electrical device having an external interconnect over the radiating patterned pad with the external interconnect offset from the radiating patterned pad, and aligning the external interconnect with the radiating patterned pad.08-02-2012
20090255718PRINTED CIRCUIT BOARD - A printed circuit board includes a signal layer and a voltage source layer. The signal layer includes a connecting area. The voltage source layer includes an isolation area corresponding to the connecting area. The isolation area is used for preventing interference caused by a pulsing current in the connecting area from affecting the voltage source layer.10-15-2009
20090260866WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid on each side of a planar temporary bonding means, arranging a slot from the at least one structural aid on each side of the planar temporary bonding means, embedding the electrical component in the slot, such that the terminals of the electrical component face away from the planar temporary bonding means, mounting at least one electrical component on a component foil, such that the terminals of the electrical component face the component foil, mounting the component foil at least partially on the at least one structural aid, on each side of the planar temporary bonding means.10-22-2009
20090260865MICRO-ELECTROMECHANICAL SYSTEM - A micro-electromechanical system (MEMS) includes a micro-electromechanical chip, a printed circuit board and a metal wire. The metal wire electrically connects the micro-electromechanical chip and the printed circuit board. A connection distance and a connection angle are defined between the micro-electromechanical chip and the printed circuit board.10-22-2009
20090260863Parallel Test Fixture for Mixed Signal Integrated Circuits - The present invention provides a parallel test fixture for mixed signal integrated circuits (ICs). The fixture includes a multi-layer printed circuit board (PCB). The fixture comprises: a test area, which is disposed on a central area of the multi-layer PCB and includes several test regions for a plurality of mixed signal ICs; an analog signal ground layer, which is operationally connected with the analog signals of the mixed signal ICs in the test area; and a digital signal ground layer, which is operationally connected with the digital signals of the mixed signal ICs in the test area. Thereby, when a plurality of mixed signal ICs are parallel tested, not only the problem due to cross-talk could be solved but also the numbers of the layers of the multi-layer PCB could be reduced effectively.10-22-2009
20100263923WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART - A method of making a wiring substrate includes forming a first metal layer on a surface of a support member, the first metal layer having at least one columnar through hole that exposes the surface of the support member, forming a columnar metal layer that fills the columnar through hole, forming an insulating layer on the columnar metal layer and on the first metal layer, forming an interconnection layer on a first surface of the insulating layer such that the interconnection layer is electrically connected to the columnar metal layer through the insulating layer, and forming a protruding part including at least part of the columnar metal layer by removing at least the support member and the first metal layer, the protruding part protruding from a second surface of the insulating layer opposite the first surface and serving as at least part of a connection terminal of the wiring substrate.10-21-2010
20120103672Low Profile Inductors For High Density Circuit Boards - An inductor includes a core formed of a magnetic material and a foil winding wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace. A second end of the winding fauns a solder tab. At least a portion of the extended output tongue and the solder tab are formed at a same height relative to a bottom surface of the core. Another inductor includes a core formed of a magnetic material, a winding wound at least partially around or through at least a portion of the core, and a ground return conductor attached to the core. The core does not form a magnetic path loop around the ground return conductor.05-03-2012
20120103671PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same capable of implementing a slim and small semiconductor package by the printed circuit board configured to include a circuit layer and an insulating layer as a single layer and shortening a process time and reducing processing costs by forming a bump using a screen printing method. Further, disclosed herein is a method for manufacturing a printed circuit board capable of improving a warpage problem of the printed circuit board that occurs during a polishing process by adopting a coining process instead of a polishing process.05-03-2012
20100163291SUBSTRATE EMBEDDED WITH PASSIVE DEVICE - A substrate embedded with a passive device, including a substrate, on which a cavity is formed; a passive device in the cavity, the passive being pre-molded; and a conductive material for adhering the passive device to the cavity, the conductive material being laminated on the cavity.07-01-2010
20100163290PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.07-01-2010
20100187002METHOD OF ATTACHING DIE USING SELF-ASSEMBLING MONOLAYER AND PACKAGE SUBSTRATE INCLUDING DIE ATTACHED THERETO USING SELF-ASSEMBLING MONOLAYER - Disclosed herein are a method of attaching a die using a self-assembling monolayer and a package substrate including a die attached thereto using a self-assembling monolayer. A first self-assembling monolayer formed on a die and a second self-assembling monolayer formed on a substrate are provided with the same hydrophilic or hydrophobic functional group, so that the die is attached to the substrate using an attractive force acting between the first and second self-assembling monolayers. An accuracy of alignment between the die and the substrate can be improved by the simple solution.07-29-2010
20100181101PRINTED CIRCUIT BOARD - A printed circuit board (PCB) reduces a simultaneous switching noise (SSN) causing power noise, thereby reducing radiated electromagnetic interference (EMI). In a double-layered PCB, a first substrate is arranged in parallel with a second substrate while being spaced apart from the second substrate by a predetermined distance. The first substrate includes a ground plane, which is deposited over an entirety of the first substrate. The second substrate includes a power plane deposited at a position of a component mounted to the printed circuit board (PCB) to transmit power to the component. Thus, the power trace of the PCB is simplified in structure, thereby reducing EMI radiation noise.07-22-2010
20090314535Printed Board - A printed board is provided, which includes at least a first connecting electrode and a second connecting electrode. A solder is provided over the first connecting electrode and the second connecting electrode, and a chip component is provided over the solder. The chip component includes a first terminal electrode and a second terminal electrode. The first connecting electrode is overlapped with the first terminal electrode and is electrically connected to the first terminal electrode through the solder. The second connecting electrode is overlapped with the second terminal electrode and is electrically connected to the second terminal electrode through the solder. Two corner portions of each of the first connecting electrode and the second connecting electrode are overlapped with two corner portions of each of the first terminal electrode and the second terminal electrode.12-24-2009
20090314536PRINTED CIRCUIT BOARD, ELECTRIC INSTRUMENT, AND SEMICONDUCTOR PACKAGE - A printed circuit board, an electronic instrument, and a semiconductor package are provided that are excellent in bonding strength and easy in rework. The printed circuit board includes a printed wiring board, an electronic device that is the semiconductor package, and an adhesion part. A protection member of the electronic device is arranged along the periphery of a mounting surface of a package body so as to abut a mounting surface of the printed wiring board. The adhesion part is provided in a stepped part defined by a peripheral wall of the electronic device and part of the mounting surface of the printed wiring board in the vicinity of the electronic device.12-24-2009
20090078455LIGHT EMITTING MODULE AND METHOD FOR MANUFACTURING THE SAME - Provided are: a light emitting module which has an improved heat-dissipating property and whose reflectance reduction is prevented. The light emitting module mainly includes: a metal substrate; a conductive pattern formed on the upper surface of the metal substrate; and a light emitting element disposed on the upper surface of the metal substrate and electrically connected to the conductive pattern. Furthermore, in the light emitting module, an insulating layer is removed in a region where the conductive pattern is not formed, but is left unremoved in a region right below (or covered with) the conductive pattern. In other words, in the region where the conductive pattern is not formed, the upper surface of the metal substrate is not covered with the conductive pattern, and a metal material constituting the metal substrate is exposed.03-26-2009
20100193230ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a printed circuit board on which a part is mounted, a first connector for external connection provided in a peripheral portion of the printed circuit board, a reinforcing plate, a first fixing member, and a second fixing member. The reinforcing plate has a first portion to be attached in a region corresponding to the part on the printed circuit board, and a second portion attached to the printed circuit board to reinforce the first connector. The first fixing member fixes the first portion to the printed circuit board at an end of the first portion that is opposite to a portion facing the second portion. The second fixing member fixes the second portion to the printed circuit board.08-05-2010
20100018761EMBEDDED CHIP SUBSTRATE AND FABRICATION METHOD THEREOF - An embedded chip substrate includes a first insulation layer, a core layer, a chip, a second insulation layer, a first circuit layer, and a second circuit layer. The core layer disposed on the first insulation layer has an opening that exposes a portion of the first insulation layer. The chip is adhered into a recess constructed by the opening and the first insulation layer. The second insulation layer is disposed on the core layer for covering the chip. The first circuit layer is disposed at the outer side of the first insulation layer located between the first circuit layer and the core layer. The second circuit layer is disposed at the outer side of the second insulation layer located between the second circuit layer and the core layer. The first circuit layer is electrically connected to the second circuit layer that is electrically connected to the chip.01-28-2010
20100018760Semiconductor device and semiconductor package including the same - A semiconductor device includes a first substrate including at least one first well region and first impurity regions on portions of the substrate and a bias voltage plate on a surface of the substrate. A semiconductor device may be of a three dimensional stack structure, and in example embodiments, the semiconductor device may further include a through contact plug substantially perpendicularly penetrating at least one substrate and at least one bias voltage plate. Therefore, a design margin of a semiconductor device may be enhanced and a bias voltage may be provided reliably.01-28-2010
20100193231Circuit Board and Structure Using the Same - According to one of the invention, a circuit board comprises a conductive layer. The conductive layer includes a first land portion, a second land portion apart from the first land portion in a plan view, and a line portion connecting the first land portion and the second land portion to each other. The line portion includes lead portions through which a current is to flow and an opening portion arranged between the lead portions. The opening portion penetrates the conductive layer in a thickness direction.08-05-2010
20100276189SEMICONDUCTOR PACKAGE INCLUDING POWER BALL MATRIX AND POWER RING HAVING IMPROVED POWER INTEGRITY - In a method of multiple-bit programming of a three-dimensional memory device having arrays of memory cells that extend in horizontal and vertical directions relative to a substrate, the method comprises first programming a memory cell to be programmed to one among a first set of states. At least one neighboring memory cell that neighbors the memory cell to be programmed to one among the first set of states is then first programmed. Following the first programming of the at least one neighboring memory cell, second programming the memory cell to be programmed to one among a second set of states, wherein the second set of states has a number of states that is greater than the number of states in the first set of states.11-04-2010
20100212946WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a substrate, an electronic component having an electrode and arranged inside the substrate, and a wiring layer formed over the substrate and connected to the electrode through a via hole. The electrode has a connection surface portion contacting the via hole, and the connection surface portion has a thickness which is made thinner than a thickness of the electrode surrounding the connection surface portion.08-26-2010
20100212947Circuit Board and Structure Using the Same - According to one embodiment of the invention, a circuit board comprises a conductive layer including a land portion and a line portion connected to the land portion, and; a conductor connected to a surface of the land portion. A planar shape of the connected portion between the conductor and the land portion has a elongated shape along a width direction of the line portion. A part of the connected portion is located within an imaginary region formed by imaginarily extending the line portion toward the land portion.08-26-2010
20100252316ELECTRONIC COMPONENT - An electronic component achieves reduced variations in the mounting positions of elements even with variations in the size of solder bumps and easily supports finer pitches of the bumps. The electronic component includes a common substrate, at least two elements mounted on a first main surface of the common substrate, a conductive pattern provided on the first main surface of the common substrate so as to extend in a direction along which the at least two elements are disposed adjacent to each other and including a plurality of lands arranged at positions corresponding to terminals of the elements insulating films provided at least on the conductive pattern so as to be spaced apart from both side edges of the lands in a direction perpendicular or substantially perpendicular to a land extending direction and adjacent to both ends of the lands in the land extending direction, and solder bumps that are disposed on the lands and are arranged to connect the lands and the terminals of the elements.10-07-2010
20100252312ASSEMBLY AND PRODUCTION OF AN ASSEMBLY - An assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is situated in a recess of the substrate that accommodates at least some areas of the component. A method for producing an assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is brought into a recess of the substrate that accommodates at least some areas of the component.10-07-2010
20120031657ELECTRONIC DEVICE MOUNTING STRUCTURE AND ELECTRONIC DEVICE MOUNTING METHOD - An electronic device mounting structure including: a supporting member that includes a supporting substrate, and a through electrode that penetrates the supporting substrate from a first principal surface that is one principal surface of the supporting substrate to a second principal surface that is the other principal surface, and that includes a projecting portion that projects from the second principal surface; and an electronic device that includes a device substrate on which a circuit is formed, and a through hole that penetrates between both principal surfaces of the device substrate, wherein the electronic device is arranged on the second principal surface of the supporting substrate so that the projecting portion of the supporting member is inserted into the through hole, and the circuit of the electronic device is electrically connected with the projecting portion.02-09-2012
20100236821Electronic Component-Embedded Printed Circuit Board - Disclosed herein is an electronic component-embedded printed circuit board including: a base plate including an insulating resin layer and circuit layers; and an electronic component embedded in the insulating resin layer, wherein the insulating resin layer has a thickness 1.3˜3 times greater than that of the electronic component. The electronic component-embedded printed circuit board has an optimum thickness ratio of its constituents in order to minimize the warpage thereof at the time of manufacturing the same.09-23-2010
20100236822WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board is formed with a substrate, conductive patterns laminated in the thickness direction of the substrate, multiple pads having a predetermined pitch and formed on the same layer as the conductive patterns, a conductive bonding layer arranged on each of the multiple pads, and an electronic component having electrodes. Here, the electronic component is arranged inside the substrate. The electrodes of the electronic component and the multiple pads are electrically connected to each other by means of bonding layers. Also, the height of each of the multiple pads is greater than the height of the conductive pattern adjacent to each pad. Moreover, a protective material related to the bonding layers is not formed at least on the layer where the pads and the first conductive patterns are formed.09-23-2010
20100252314COIN TYPE ELECTRIC DOUBLE-LAYERED CAPACITOR, AND CAPACITOR-PACKAGED ELEMENT - A coin-type electric double-layered capacitor of the present invention includes: a capacitor element; a lower cover for housing the capacitor element impregnated with an electrolyte; an upper cover for sealing an opening of the lower cover through an insulating ring-shaped packing; an upper terminal plate having one end portion connected to an outer surface of the upper cover; and a lower terminal plate having a first end portion connected to an outer surface of the lower cover and a second end portion provided with a through hole, the capacitor being configured such that at least part of the through hole is opened without being covered by an outer surface located on a bottom of the lower cover.10-07-2010
20100252315Printed Circuit Board With Coextensive Electrical Connectors And Contact Pad Areas - A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.10-07-2010
20120138350ELECTRONIC COMPONENT ALIGNING DEVICE, ELECTRONIC COMPONENT PACKAGING BODY, AND ELECTRONIC COMPONENT MOUNTING BOARD. - There is provided a device for electronic components including: a tray provided with electronic components formed by stacking dielectric sheets on which inner conductors are formed; a transfer unit continuously transferring the electronic components moved from the tray; and a magnetic field providing unit providing a magnetic field to the electronic components moved from the transfer unit to align the inner conductors in a direction in which the magnetic field and magnetic resistance are reduced.06-07-2012
20100243307LEADED MULTI-LAYER CERAMIC CAPACITOR WITH LOW ESL AND LOW ESR - A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.09-30-2010
20100252313Connection Terminal, Package Using the Same, and Electronic Apparatus - A connection terminal has, on an upper surface of a first dielectric layer, a first line conductor and a first grounding line conductor provided adjacent to both sides of the first line conductor, and has, on an upper surface of a third dielectric layer, a third line conductor and a third grounding line conductor provided adjacent to both sides of the third line conductor. These conductors are connected to a second line conductor and a second grounding line conductor provided adjacent to both sides of the second line conductor, respectively, the second line conductor and the second grounding line conductor being provided on an upper surface of a second dielectric layer. It is possible to obtain the connection terminal having a small size and capable of complying with a high-frequency signal.10-07-2010
20100252311TERMINAL ASSEMBLY WITH REGIONS OF DIFFERING SOLDERABILITY - An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes an electrically conductive terminal including a first end and a second end opposed to the first end. The first and second ends are configured to receive a solder ball. An axial hole extends inward from the first end of the terminal, and an electrically conductive core member is disposed within the hole. The core member is sized and shaped to obstruct the hole. In addition, at least an outer surface of the core member includes a first material and at least an outer surface of the body includes a second material, the first material having greater solderability than the second material.10-07-2010
20100000775CIRCUIT SUBSTRATE AND METHOD OF FABRICATING THE SAME AND CHIP PACKAGE STRUCTURE - A circuit substrate suitable for being connected to at least one solder ball is provided. The circuit substrate includes a substrate, at least one bonding pad, and a solder mask. The substrate has a surface. The bonding pad is disposed on the surface of the substrate for being connected to the solder ball. The solder mask covers the surface of the substrate and has an opening for exposing a portion of the bonding pad. The opening has a first end and a second end. As compared with the second end, the first end is much farther from the bonding pad, and a diameter of the first end is larger than that of the second end.01-07-2010
20110056736FABRICATION METHOD OF CIRCUIT BOARD, CIRCUIT BOARD, AND CHIP PACKAGE STRUCTURE - A circuit board, a chip package structure and a fabrication method of the circuit board are provided. By applying the fabrication method, a plurality of conductive channels can be formed in a single through hole of the circuit substrate. Unlike the conductive channels respectively formed in the through holes according to the related art, the conductive channels of the proposed circuit board can be formed in a single through hole. As such, it is conducive to the expansion of available layout area of the circuit board, the increase in layout flexibility, and the improvement of layout density of the circuit board.03-10-2011
20110056735MULTILAYER CHIP CAPACITOR AND CIRCUIT BOARD DEVICE - There are provided a multilayer chip capacitor and a circuit board device. The multilayer chip capacitor includes a capacitor body including a plurality of dielectric layers that are stacked, first and second outer electrodes formed on an outer surface of the capacitor body and having opposite polarity, first and second inner electrodes opposing each other, interleaved with the dielectric layers in the capacitor body, and each including an electrode plate forming capacitance and a lead extending from the electrode plate, the lead of the first inner electrode and the lead of the second electrode being respectively connected to the first and second outer electrodes, and third inner electrodes interposed between the first and second inner electrodes. At least one of the third inner electrodes adjacent to the first inner electrode includes a conductive pattern having the same shape as the lead of the first inner electrode and is connected to the first outer electrode. At least one of the third inner electrodes adjacent to the second inner electrode includes a conductive pattern having the same shape as the lead of the second inner electrode and is connected to the second outer electrode.03-10-2011
20110056734ELECTRONIC DEVICE SUBMOUNTS WITH THERMALLY CONDUCTIVE VIAS AND LIGHT EMITTING DEVICES INCLUDING THE SAME - A submount for an electronic device includes an electrically insulating substrate including first and second surfaces and having a thickness between the first and second surfaces, a thermally conductive pad on the first surface of the substrate, and a thermally conductive via extending from the first surface of the substrate toward the second surface of the substrate and having a length that is less than the thickness of the substrate. The thermally conductive via has a higher thermal conductivity than a thermal conductivity of the substrate. Methods of forming submounts are also disclosed.03-10-2011
20100000773ELECTRONIC COMPONENT MOUNTING STRUCTURE - The invention intends to provide an electronic component mounting structure where the repairability and the impact resistance are combined. In an electronic component mounting structure, a plurality of solder balls disposed in plane between an electronic component and a substrate is melted to bond the electronic component and the substrate and a resin of which tensile elongation after the curing is in the range of 5 to 40% is filled in portions that are gaps between the electronic component and the substrate and correspond to at least four comers of the electronic component to reinforce. Since the reinforcement area is small, the repairability such as the easy removability of the resin and the reusability of the substrate are excellent, the resin itself is allowed to expand to the impact at the drop to play a role of reinforcing the bonding without breaking, and the impact resistance is excellent as well.01-07-2010
20090211796ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRONIC DEVICE AND ITS FABRICATION METHOD - An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.08-27-2009
20090145644Printed wiring board, air conditioner, and method of soldering printed wiring board - To provide a printed wiring board capable of completely soldering a solder land to a lead under simple control over a manufacturing process even in the case of using a lead-free solder of a low solder wettability. A printed wiring board for mounting a surface mounting device includes a solder land for mounting the surface mounting device, and a leader pattern led from the solder land with only a predetermined portion of the leader pattern being soldered.06-11-2009
20090145647SURFACE MOUNT DEVICE - The disclosed subject matter includes a surface mount electronic device with high reliability and favorable optical characteristics. The surface mount electronic device can include a circuit board with at least one conductor pattern formed on an insulating board and an electronic component that is mounted on a die bonding pad located on the at least one conductor pattern with an adhesive material. The die bonding pad can include a plurality of cutout sections that expose the insulating board and extend towards a center from a circumference thereof. Therefore, the adhesive material can adhere to both the die bonding pad and the insulating board exposed in the plurality of cutout sections along with the electronic component. In this case, the plurality of cutout sections can be formed so as not to drag the adhesive material upwards on each of the side surfaces of the electronic component. Thus, the surface mount electronic device can improve reliability thereof while maintaining predetermined optical characteristics.06-11-2009
20080289868CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF - The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.11-27-2008
20090107712Sensor for a Hardware Protection System for Sensitive Electronic-Data Modules Protecting Against External Manipulations - A hardware protection system for sensitive electronic-data modules protects against external manipulations. As a result, the sensor has a correspondingly adapted layout.04-30-2009
20090038835MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayer printed wiring board includes a core substrate, a resin insulation layer laminated on the core substrate and a capacitor section coupled to the resin insulating layer. The capacitor section includes a first electrode including a first metal and configured to be charged by a negative charge, and a second electrode including a second metal and opposing the first electrode, the second electrode configured to be charged by a positive charge. A dielectric layer is interposed between the first electrode and second electrode, and an ionization tendency of the first metal is larger than and ionization tendency of the second metal.02-12-2009
20090107713SURFACE COATING - A composite is provided, comprising a substrate and a film on the substrate. The film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than70 dyne/cm; and a durability of 10 to 5000 microNewtons. Depending on the particular environment in which the film is to be used, a durability of 10 to 500 microNewtons may be preferred. A film thickness 3 to 100 times the RMS surface roughness of the film is preferred.04-30-2009
20090107715WIRING BOARD WITH A BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE SAME - Provided is a wiring board with a built-in component, which has an electric/electronic component (04-30-2009
20100300737WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board is formed with a substrate designating either the upper surface or the lower surface as a first surface and the other as a second surface; an electronic component arranged inside the substrate; and a first conductive layer formed on the first-surface side of the substrate by means of a first insulation layer made up of a first lower insulation layer and a first upper insulation layer. In such a wiring board, the first lower insulation layer and the first upper insulation layer are made of different materials from each other. Moreover, the first lower insulation layer is positioned on the first surface of the substrate and the electronic component, and the material that forms the first lower insulation layer fills a clearance between the substrate and the electronic component.12-02-2010
20100294553PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR - A package substrate having embedded capacitor is provided. The package substrate includes a core circuit board, at least one embedded capacitor, at least one dielectric layer and at least one wiring layer. The core circuit board has at least one metal layer, and the core circuit board has at least one conductive through hole connected to the metal layer. At least one embedded capacitor is embedded in the core circuit board and connected to the metal layer. At least one dielectric layer covers the core circuit board, and the dielectric layer has an embedded hole. At least one wiring layer covers the dielectric layer and connected to the embedded hole.11-25-2010
20100300739ELECTRONIC APPARATUS AND REINFORCING COMPONENT - An electronic apparatus includes a substrate including a wire, an electronic component and a reinforcing component. The electronic component includes a plate-like external shape including a corner at an outer periphery, where the electronic component is mounted on the substrate and connected with the wire at a surface of the electronic component that faces the substrate. The reinforcing component includes a rigidity higher than a rigidity of the substrate, the reinforcing component includes a frame fixed to the substrate at a position where the frame surrounds the electronic component and a pressing portion that projects inward from the frame and that presses at least the corner of the electronic component against the substrate.12-02-2010
20100300738WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a substrate designating one of the upper and lower surfaces as a first surface and the other as a second surface, a first laminated section laminated on the second-surface side of the substrate, a first external connection terminal and second external connection terminals formed on the first laminated section, and an electronic component arranged inside the substrate and having first pads on the second-surface side. The first pads and first terminal as well as the first pads and second terminals are electrically connected, and the first terminal and second terminals are formed to avoid being directly over the first pads. When the first pads, first terminal and second terminals are projected onto the second surface, the first terminal is positioned to be surrounded by the first pads, and the first pads and first terminal are positioned to be surrounded by the second terminals.12-02-2010
20100319974PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - An electronic device comprises: a printed wiring board that comprises a substrate, pads formed on the substrate, and an insulating film layer covering a surface of the substrate on which the pads are formed; and an electronic element that comprises external terminals electrically connected to the pads and that is mounted on the printed wiring board. The insulating film layer comprises at least one connecting opening section each exposing at least part of one of the pads. At least part of an inner wall of the connecting opening section comprises at least one step section.12-23-2010
20110127079ELECTRONIC CIRCUIT MODULE AND METHOD OF CONNECTING COAXIAL CABLE - An electronic circuit module is mounted on an electronic circuit board. The electronic circuit module includes an electronic component that has a first electrode and a second electrode that form a facing surface. The electronic circuit module also includes a coaxial cable with a core wire and a shielded wire being exposed in stages. The core wire and the shielded wire of the coaxial cable are directly connected to the first electrode and the second electrode that are exposed at a predetermined cable connecting surface of the electronic component.06-02-2011
20090242255WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SAME - A method of manufacturing a wiring board with a built-in electronic component includes providing a first base material comprising a support body and a first metal foil detachably adhered on the support body, forming a connection terminal for mounting an electronic component on the first metal foil of the first base material by an additive method, electrically connecting an electronic component and the connection terminal by arranging the electronic component on the first base material such that a surface of the electronic component on which a circuit is formed faces a surface on which the connection terminal is formed, covering the electronic component with an insulative material after the mounting, and detaching the support body and the first metal foil.10-01-2009
20090183907Wired circuit board - A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern. The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region. The semiconductive layer is provided in the second region.07-23-2009
20110024175Electronic Apparatus - There is provided an electronic apparatus capable of ESL reduction. The electronic apparatus includes a capacitor and a mounting board. The capacitor includes a multilayer body, an internal electrode, and a terminal electrode. The mounting board has a connection pad formed on its upper surface and has a through conductor formed inside thereof that is connected to the connection pad. The capacitor is mounted on the mounting board by connecting the terminal electrode to the connection pad. The internal electrode has an end portion exposed at an area ranging from an end face to a middle portion of a lateral face in the multilayer body. In a planar view, the through conductor is located immediately below a part of the end portion of the internal electrode exposed at the lateral face of the multilayer body, the part lying furthermost from the end face.02-03-2011
20110024174CAPACITOR MOUNTING METHOD AND PRINTED CIRCUIT BOARD - Provided is a capacitor mounting method for mounting a capacitor in close proximity to an LSI, which includes mounting the capacitor on top of the LSI with solder balls (bumps) placed therebetween, the LSI mounted on top of a printed circuit board with solder balls (bumps) placed therebetween, in a stacked fashion. This enables a decoupling capacitor to be mounted in close proximity to the LSI without affecting power supply or a signal line02-03-2011
20110024173Ball grid array printed circuit board, package structure, and fabricating method thereof - A BGA (ball grid array) printed circuit board is disclosed, which includes a substrate having a dielectric layer, a BGA pad and a solder mask formed on the dielectric layer, and an adhesive glue filled in a gap between the BGA pad and the solder mask. A BGA printed circuit board package structure and a method for fabricating the BGA printed circuit board are also disclosed.02-03-2011
20110031004BOARD, MOUNTING STRUCTURE OF SURFACE MOUNTING COMPONENT, AND ELECTRONIC DEVICE - To solve a problem in which when a surface mounting component to be soldered at a vicinity of an end portion is mounted by soldering, warpage may occurs in a board or the surface mounting component and a distance between the terminal of the board and the terminal of the surface mounting component increases and whereby a connection failure occurs with respect to a connection using the solder. For this purpose, in a mounting structure of the surface mounting component that is configured by connecting the surface mounting component to the board at the vicinity of the end portion by soldering, a concave portion is formed between joint portions for the soldering in a range in which the surface mounting component of the board is mounted. This concave portion is configured so that an influence of deformation due to the warpage of the board or/and the surface mounting component can be reduced by the concave portion.02-10-2011
20110127078MANUFACTURING METHOD OF PLATE-LIKE MEMBER ASSEMBLY AND TRANSPARENT SUBSTRATE-INCLUDING ELECTRONIC MEMBER - A manufacturing method of a plate-like member assembly includes the steps of: preparing a first plate-like member including a projecting region, projecting from one surface of the first plate-like member along a thickness direction thereof, on the one surface; forming a light transmitting film, having a light transmitting property, in a nonoverlapping region, not-overlapping the projecting region, on the one surface of the first plate-like member; arranging a fixing member to cover a border between an overlapping region, overlapping the projecting region, and the nonoverlapping region with the light transmitting film intervening between the fixing member and the first plate-like member; and arranging a second plate-like member in such way that the light transmitting film and the fixing member intervene between the second plate-like member and the first plate-like member.06-02-2011
20120145444ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING SAME - An electronic assembly is provided, which includes a circuit board, in which a solder pad is disposed at a position close to an end edge on at least one surface of the circuit board, and a depression is disposed between the solder pad and the end edge; and, an electronic element, including an insulating body and a plurality of terminals fixed to the insulating body, in which each of the terminals has a protruding portion and a soldering portion respectively corresponding to the depression and the solder pad. A method for manufacturing the electronic assembly is also provided.06-14-2012
20100132992DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE - In a semiconductor module having the structure in which a bump electrode provided on a wiring layer is connected to a device electrode provided on a semiconductor device, connection reliability between the bump electrode and the device electrode is improved. An insulating resin layer is provided between the semiconductor device and the wiring layer. The bump electrode, formed integrally with the wiring layer and projected from the wiring layer toward the insulating resin layer, is electrically connected to the device electrode provided on the semiconductor device. Part of the height of the wiring layer on the end side in a bump connection area is lower than that of the wiring in a wiring area extending toward the side opposite to the end side.06-03-2010
20110083891ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an electronic component-embedded printed circuit board, including: a flexible film; an insulation layer formed on one side of the flexible film; an electronic component mounted on the one side of the flexible film in a face-down manner such that the electronic component is buried in the insulation layer; and a circuit layer including a connecting pattern which is formed on the one side of the flexible film and is connected with a connecting terminal of the electronic component by a connecting member. The electronic component-embedded printed circuit board is advantageous in that the position alignment between the connecting patterns and the connecting terminals is easy and the connection reliability therebetween is high because the connecting patterns formed on a flexible film are directly connected to the connecting terminals of an electronic component using connecting members, and in that the production cost thereof can be reduced because additional rewiring is not required.04-14-2011
20110083892ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is an electronic component-embedded printed circuit board, which includes an insulating base, an insulating layer formed on one surface of the insulating base, an electronic component embedded in the insulating layer so that an active surface of the electronic component having a connection terminal faces the insulating base, a trench formed in the insulating base to expose the connection terminal, and a connection pattern formed and embedded in the trench, and in which the embedded connection pattern is finely formed by an imprinting process and is connected to the connection terminal of the electronic to component, thus obviating a need for an additional redistribution layer and reducing the manufacturing cost. A method of manufacturing such a printed circuit board is also provided.04-14-2011
20100218985INTEGRATED CIRCUIT MOUNTED BOARD, PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT MOUNTED BOARD - An integrated circuit mounted board includes a printed wiring board and an integrated circuit bare chip mounted on the printed wiring board. The printed wiring board includes a metal base, an insulating member made of an insulating material and disposed on the metal base, and a wiring pattern disposed on the insulating member. The wiring pattern includes an electrode part to which the integrated circuit bare chip is electrically coupled. The insulating member includes an under region being opposite to the electrode part. The metal base includes a metal substrate and a metal portion protruding from the metal substrate. The metal portion is buried in the under region of the insulating member.09-02-2010
20090032298SUBSTRATE STRUCTURE AND ELECTRONIC APPARATUS - A substrate structure capable of miniaturizing and thinning a housing of a portable terminal is provided.02-05-2009
20090032296METHOD FOR MANUFACTURING A CONTACT ARRANGEMENT BETWEEN A MICROELECTRONIC COMPONENT AND A CARRIER SUBSTRATE AS WELL AS AN ASSEMBLY UNIT MANUFACTURED BY THIS METHOD - The invention relates to a method for manufacturing a contact arrangement (02-05-2009
20110240355PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD - A printed circuit board unit includes a printed circuit board and an electronic component. The electronic component is electrically connected to a predetermined position on the printed circuit board by means of soldering while being joined to the printed circuit board using an adhesive layer. The adhesive layer, disposed between the printed circuit board and the electronic component, partially includes a multilayer laminated region including a first reinforcement resin layer and a second reinforcement resin layer. The first reinforcement resin layer is disposed on a side of the printed circuit board, whereas the second reinforcement resin layer is disposed on a side of the electronic component. The second reinforcement resin layer has adhesive strength greater than that of the first reinforcement resin layer.10-06-2011
20090321119DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE, MOBILE DEVICE, AND MANUFACTURING METHOD OF DEVICE MOUNTING BOARD - A device mounting board is provided with: a substrate structural unit including a substrate made of a composition containing amorphous silicon, a first adhesive layer provided on one of the main surfaces of the substrate, and a second adhesive layer provided on the other main surface of the substrate; a first wiring layer provided on the main surface of the first adhesive layer on the opposite side from the substrate; a second wiring layer provided on the main surface of the second adhesive layer on the opposite side from the substrate; and a via conductor, which is provided in a via hole that penetrates the substrate, the first adhesive layer, and the second adhesive layer, which electrically connects the first wiring layer and the second wiring layer.12-31-2009
20110083893Retaining member, electric component and electric device - A retaining member includes at least a leg portion having a latch portion, a coupling portion and a spring portion. When the spring portion is displaced, the coupling portion is twisted. Then, the latch portion and the coupling portion are inserted into the opening so that an electric component is retained on a main face of the substrate. In this state, a part of the latch portion is disposed at the periphery of the opening on a rear face of the substrate, a part of the coupling portion is disposed in the opening, and the spring portion is disposed on the main face of the substrate. Therefore, the retaining strength of the electric component to the substrate can be improved, and damage of a side wall of the opening can be decreased.04-14-2011
20090321121CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD - A ceramic multilayer substrate having excellent migration resistance and high bonding strength between a resin sealing material and a ceramic multilayer substrate body, includes a laminated substrate body having lands, and external electrodes, and covered with a siloxane film formed by a PVD process. The thickness of the siloxane film is lower than about 100 nm. After that, external electrodes of a mounting component are electrically connected and firmly hold to the lands of the laminated substrate body via solder. Next, a resin sealing material for sealing the mounting component is formed on the laminated substrate body.12-31-2009
20090218121METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC APPARATUS - A method for manufacturing a printed circuit board. The method includes: preparing a printed wiring board, the printed wiring board comprising through holes and a plurality of electrode pads; coating surfaces of the plurality of electrode pads and surfaces of the through holes on an one side of the printed wiring board with a bonding material; mounting a semiconductor package on the printed wiring board such that a plurality of bumps on a surface of the semiconductor package corresponds to the plurality of electrode pads; bonding the bumps to the electrode pads by heating the printed wiring board on which the semiconductor package is mounted; and filling a space between the semiconductor package and the printed wiring board with a filler material.09-03-2009
20090218120PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND CONNECTOR - According to one embodiment, a printed circuit board includes a printed wiring board and a connector. The connector includes a housing, a lead received inside the housing, an insertion section which is provided in the housing and to which the printed wiring board is inserted, and a rotating mechanism. The rotating mechanism moves the lead to a first position in which the lead is separated from the printed wiring board by abutting the lead and moves the lead to a second position in which the lead is connected to the pad of the printed wiring board via the solder by rotating and separating from the lead when the printed wiring board is inserted into the insertion section.09-03-2009
20100038122ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME - An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip.02-18-2010
20090032295METAL BASE CIRCUIT BOARD, LED, AND LED LIGHT SOURCE UNIT - To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it.02-05-2009
20100071944CHIP CAPACITOR EMBEDDED PWB - A multiple wiring layer interconnection element includes capacitors or other electrical components embedded between a first exposed wiring layer and a second exposed wiring layer of the interconnection element. Internal wiring layers and are provided between exposed surfaces of the respective capacitors, the internal wiring layers being electrically insulated from the capacitors by dielectric layers. The internal wiring layers are isolated from each other by an internal dielectric layer. Conductive vias provide conductive interconnection between the two internal wiring layers. A method of fabricating a multiple wiring layer interconnection element is also provided.03-25-2010
20110100693LOW-RESISTANCE CONDUCTIVE PATTERN STRUCTURES AND METHODS OF FABRICATING THE SAME - A conductive structure includes a contact plug extending through an insulating layer on a substrate, and first and second conductive lines extending alongside one another on the insulating layer. The first conductive line extends on the contact plug. A connecting line on the insulating layer extends between and electrically connects the first and second conductive lines. Related integrated circuit devices and fabrication methods are also discussed.05-05-2011
20110147064BORON NITRIDE AGGLOMERATED POWDER - Novel boron nitride agglomerated powders are provided having controlled density and fracture strength features. In addition methods for producing same are provided. One method calls for providing a feedstock powder including boron nitride agglomerates, and heat treating the feedstock powder to form a heat treated boron nitride agglomerated powder. In one embodiment the feedstock powder has a controlled crystal size. In another, the feedstock powder is derived from a bulk source.06-23-2011
20110147062FEEDTHROUGH FLAT-THROUGH CAPACITOR - A feedthrough flat-through capacitor includes a capacitor having a first and second set of electrode plates, a first feedthrough passageway through the capacitor, a first lead disposed within the first feedthrough passageway and conductively coupled to the first set of electrode plates, a second feedthrough passageway through the capacitor disposed remote form the first feedthrough passageway, and a second lead disposed within the second feedthrough passageway and conductively coupled to the first set of electrode plates. The second set of electrode plates are typically conductively coupled to a ground. An EMI shield may be provided to electromagnetically isolate the first lead from the second lead.06-23-2011
20110100694GROUND TERMINATION WITH DAMPENED RESONANCE - A system of dampening resonance is provided. In an embodiment, ground traces may be coupled to a common or ground plane via dampening elements such as resistors a predetermined distance from a non-dampened coupling. Ground terminals in a connector have with a separated electrical length that allows for a potential to exist between the ground terminal and a common ground. When the ground terminals are coupled to the ground traces, the dampening element, which may be a resistor, helps convert energy traveling over ground terminal into heat, thus reducing or preventing resonance conditions in the connector.05-05-2011
20110100692Circuit Board with Variable Topography Solder Interconnects - Various circuit boards and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes applying a solder mask to a first side of a first circuit board. The first side of the first circuit board includes a first conductor structure and a second conductor structure. A first opening is formed in the solder mask that extends to the first conductor structure. The first opening has a first area. A second opening is formed in the solder mask that extends to the second conductor structure and has a second area larger than the first area.05-05-2011
20110100691Circuit Board and Structure Using the Same - A circuit board includes an insulating layer and a conductive layer formed on the insulating layer. The insulating layer contains a resin with high heat resistance. The conductive layer includes a metal carbide layer bonded to the insulating layer and containing a carbide of a first metal in group IV, V, or VI of the periodic table, and a first metal layer bonded to the metal carbide layer and containing the first metal.05-05-2011
20110067910COMPONENT SECURING SYSTEM AND ASSOCIATED METHOD - A system to secure a component to a circuit board may include a printed circuit board, a surface mounted component, and a lead carried by the surface mounted component. The system may also include a stencil adhered between at least one of the printed circuit board and the surface mounted component, and the lead adjacent the stencil.03-24-2011
20110061920CIRCUIT MODULE - An electronic component includes a component body including a mounting surface facing a circuit substrate, and a plurality of first external electrodes arranged on the mounting surface so as to extend between a first side and a second side of the mounting surface substantially parallel with each other and so as to be within a first region having a width that is substantially equal to half a length of the first side in a direction in which the first side extends. A circuit substrate includes a substrate body, a plurality of second external electrodes, arranged on a main surface of the substrate body, respectively connected to the plurality of the first external electrodes, and support units arranged to protrude from the main surface of the substrate body and such that the electronic component overlaps the support units outside the first region.03-17-2011
20110061919Low temperature co-fired ceramics assembling system and method thereof - A low temperature ceramics substrate, a low temperature ceramics assembling system, and a method thereof in which a fixing member is formed on the bottom of an LTCC substrate, an insertion hole is formed at a coupled portion on a fixing member of the LTCC substrate coupled onto the heat sink, the fixing member is inserted into the insertion hole when the LTCC substrate and the heat sink are coupled to each other to firmly achieve alignment and fixation by the fixing member and a ceramic laminate assembling system includes a ceramic laminate substrate including an electronic component mounted on the bottom thereof and a fixing member is formed at one side thereof; and a heat sink including a sensor holder onto which the electronic component is held and an insertion groove is provided at a portion corresponding to the fixing member.03-17-2011
20110061918BACKBOARD ASSEMBLY AND ELECTRONIC DEVICE HAVING THE SAME - A backboard assembly includes a back plate, an electrically insulative sheet and a connection element. The connection element comprises a plurality of first engaging structures on a first side thereof to engage with the back plate and a plurality of second engaging structures on a second side opposing to the first side to engage with the electrically insulative sheet.03-17-2011
20110048779RESIN SHEET FOR CIRCUIT BOARDS, SHEET FOR CIRCUIT BOARDS AND CIRCUIT BOARD FOR DISPLAYS - A resin sheet for circuit boards (03-03-2011
20120273265PRINTED CIRCUIT BOARD WITH MULTI-LAYER CERAMIC CAPACITOR ARRAY - A printed circuit board (PCB) includes a bank or matrix of multi-layer ceramic capacitors (MLCCs). Each MLCC includes positive and negative electrodes respectively connected to a power layer and a ground layer of the PCB through two positive and two negative vias. A portion of the positive vias and a portion of the negative vias utilized by the same column of MLCCs are arranged in two separated lines along the flowing direction of current streams in the power layer.11-01-2012
20110048777Component-Embedded Printed Circuit Board - A component-embedded printed circuit board includes: a carrier plate having a metalized layer disposed thereon, an electronic component disposed on the metalized layer of the carrier plate, and a metal layer laminated onto the metalized layer having the electronic component disposed thereon by a dielectric film. The carrier plate is then removed to expose the metalized layer. At least one of the metal layer and the metalized layer is patterned to be a circuit layer.03-03-2011
20110048780METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE - A method of processing a cavity of a core substrate is disclosed. The method of processing a cavity of a core substrate in accordance with an embodiment of the present invention can include: forming a first processing area on one surface of a core substrate, the first processing area being demarcated by a circuit pattern; forming a second processing area on the other surface of the core substrate, the second processing area being demarcated by a circuit pattern; and processing a cavity by removing the entire first processing area from the one surface of the core substrate.03-03-2011
20110048781PRINTED CIRCUIT BOARD WITH INTEGRATED THIN FILM BATTERY - The present invention relates to, for example, printed circuit boards having a thin film battery or other electrochemical cell between or within its layer or layers. The present invention also relates to, for example, electrochemical cells within a layer stack of a printed circuit board.03-03-2011
20110048778Circuit board, semiconductor package and method of manufacturing the same - A circuit board includes a board part including a pattern portion on one surface thereof, the pattern portion being electrically connected to a semiconductor chip, and an under-fill layer disposed on the board part and exposing the pattern portion to the outside, the under-fill layer flowing to cover the pattern portion by heat generated in mounting the semiconductor chip.03-03-2011
20090025971Electronic component-embedded board and method of manufacturing the same - A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 01-29-2009
20110017502Z-Directed Components for Printed Circuit Boards - A design for a Z-directed component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Z-directed components include high frequency signal pass throughs, capacitors, diodes, transistors, transmission lines, delay lines. Methods for mounting Z-directed components are also provided.01-27-2011
20110017503Z-Directed Capacitor Components for Printed Circuit Boards - A Z-directed capacitor component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained within the PCB. In one embodiment the Z-directed capacitor component utilizes semi-cylindrical metallic sheets. In another embodiment, stack annular metallic disks are used. The Z-directed capacitor component mounts within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.01-27-2011
20110147065Integrated Circuit with Adjusting Elements and Method for Its Manufacture - An integrated circuit is disclosed with adjusting elements, which in a first manufacturing stage are connected via tracks to terminal pads lying outside the integrated circuit. At least one of the tracks of the integrated circuit lies on a surface of a region, which includes semiconductor material and in a second manufacturing stage is isolated by a pn junction from additional semiconductor material, which is adjacent to the region. Furthermore, a method for manufacturing this type of integrated circuit is also disclosed.06-23-2011
20110147063MULTILAYER BOARD FOR SUPPRESSING UNWANTED ELECTROMAGNETIC WAVES AND NOISE - A multilayer board for suppressing unwanted electromagnetic waves and noise includes: a power plane and a ground plane constituting a power distribution network; an electromagnetic wave suppression structure placed on the power plane or the ground plane; and a decoupling capacitor placed on the power plane or the ground plane, wherein the electromagnetic wave suppression structure and the decoupling capacitor are placed together.06-23-2011
20110147061Circuit Board with Via Trace Connection and Method of Making the Same - Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor trace with a first segment that does not include a via land. A first via is formed on the first segment.06-23-2011
20100065318CIRCUIT BOARD AND SEMICONDUCTOR ELEMENT MOUNTED STRUCTURE USING THE SAME - A circuit board according to an embodiment of the present invention relates to a circuit board 03-18-2010
20090255719WIRING BOARD AND CERAMIC CHIP TO BE EMBEDDED - A wiring board includes a substrate core and a ceramic chip to be embedded therein. The substrate core has a housing opening portion opening at a core main surface. The ceramic chip is accommodated in the housing opening portion so that the core main surface and a chip first main surface face the same way. The ceramic chip includes a plurality of second terminal electrodes comprised of a metallized layer and formed on the chip second main surface so as to protrude therefrom. A projecting portion, disposed on the second main surface side so as to surround a plurality of the second terminal electrodes, is formed on the chip second main surface so as to protrude therefrom.10-15-2009
20090242256ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE - In a dielectric element, the angle θ made by either the top face or the bottom face and the side faces is either 0°<θ<89°, or is 91°<θ<180°, and is an angle other than 89°≦θ≦91°. By this means, the area of contact of the side faces of the dielectric element with a glass epoxy resin substrate and with insulating material is increased, adhesion with the resin substrates is improved, and strength and reliability can be enhanced when buried between the two resin substrates.10-01-2009
20090000811Chip resistor and method for fabricating the same - A chip resistor and method for fabricating the same are disclosed according to the present invention, wherein a thermic welding layer is applied to bond together a substrate and a resistor in face-to-face orientation, and a passivation layer is applied to partially cover the resistor, such that it consequently divides the surface of the resistor into a covered portion and two uncovered portions that serve as electrode zones, thereby eliminating unnecessary current transmission impedance as in prior art, as well as efficiently and stably reducing the temperature coefficient of resistance. The bonding design of the substrate and the resistor of the present invention is capable of overcoming the drawback of the high cost of semiconductor processing as used in the prior art by providing a simple fabrication process that is capable of increasing process yield and decreasing production costs.01-01-2009
20090000812MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a core substrate and a built-up wiring layer formed by alternately layering conductor circuits and insulating resin layers. The built-up wiring layer includes a first surface provided in contact with the core substrate and a second surface opposing the first surface and including a mounting area on which at least one semiconductor device is to be mounted. A first plurality of through-hole conductors is formed in a first portion of the core substrate which corresponds to the mounting area of the second surface, and a second plurality of through-hole conductors formed in a second portion of the core substrate which corresponds to another area of the second surface other than the mounting area. A pitch between the first plurality of through-hole conductors is smaller than a pitch between the second plurality of through-hole conductors. In one aspect, a ratio of pads to through holes directly below a processor core section of the semiconductor device is less that a number of pads to through holes in an area outside the processor core.01-01-2009
20090183905Circuit board configuration - A circuit board configuration and method of packaging electronic component embedded into the circuit board in a manner that supports the electronic component thermally, electrically, and mechanically thereof, comprising a circuit board having a first surface and a circuit trace on the first surface; a recess or slot formed on the first surface defined by at least one sidewall that is oblique to the first surface of the circuit board; two or more plated surfaces on the at least one oblique sidewall and electrically connected to the circuit trace; and an electronic component having two or more electrical contact surfaces mounted to the two or more plated surfaces such that the electronic component is physically mounted to the oblique sidewall and in electrical communication with the circuit trace. The circuit board configuration may further comprise an encapsulant at least one end of the electronic component and a conductive material between the oblique sidewall and the electronic component to seal the electronic component inside the slot.07-23-2009
20090090546SUBSTRATE FOR AC/AC MULTIPLE-PHASE POWER CONVERTER - A substrate includes a plurality of input ends, a plurality of output ends, first and second direct-current power lines, a first region and a second region. An alternating voltage is applied between any two of the input ends. The first region permits mounting of any one of a plurality of kinds of first surface-mount devices that selectively establishes electrical continuity between one of said plurality of input ends and either said first or said second direct-current power line. The second region permits mounting of a second surface-mount device that selectively establishes electrical continuity between one of said plurality of output ends and said first or said second direct-current power line.04-09-2009
20080308311OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND DEVICE FOR OPTICAL COMMUNICATION - A device for optical communication comprising; 12-18-2008
20120241205WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having an accommodation portion, an electronic component having an electrode and accommodated in the accommodation portion of the substrate, a conductive layer having a planar conductive pattern formed over the electrode of the electronic component, and one or more via conductors connecting the planar conductive pattern of the conductive layer and the electrode of the electronic component. The electrode of the electronic component has a portion which faces the planar conductive pattern of the conductive layer and which has a plurality of outer edges facing outward with respect to a surface of the electronic component on which the portion of the electrode is formed, and the planar conductive pattern of the conductive layer has a portion positioned directly over one or more of the outer edges of the electrode of the electronic component.09-27-2012
20080236878Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor - There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth.10-02-2008
20120199387ELECTRONIC APPARATUS - An electronic apparatus includes: a circuit board on which an electronic component is mounted; a first insulation sheet arranged on the circuit board; a second insulation sheet superimposed on the first insulation sheet and bonded to the first insulation sheet; and a lead wire wired between the first insulation sheet and the second insulation sheet. The first insulation sheet and the second insulation sheet are bonded together in a region where the wiring of the lead wire is prohibited.08-09-2012
20080202801Circuit Board Structure and Method for Manufacturing a Circuit Board Structure - The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil (08-28-2008
20110162877COMPOSITE ELECTRONIC PARTS - It is provided a composite electronic part having magnetic material 07-07-2011
20100319973PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR - A package substrate having embedded capacitor is provided. The package substrate includes a first core circuit board, at least one embedded capacitor, a second core circuit board and a dielectric layer. The first core circuit board has at least one metal layer, and the first core circuit board has at least one first conductive through hole connected to the metal layer. At least one embedded capacitor is embedded in the first core circuit board and connected to the metal layer. The second core circuit board has at least one wiring layer, and the second core circuit board has at least one second conductive through hole connected to the wiring layer. The dielectric layer is laminated between the first core circuit board and the second core circuit board.12-23-2010
20110061921WIRING BOARD WITH BUILT-IN CAPACITOR - A wiring board with built-in capacitors includes a core substrate, and a high dielectric sheet including a lower electrode layer, an upper electrode layer and a dielectric layer, the dielectric layer made of a sintered ceramic body and sandwiched between the lower electrode layer and the upper electrode layer, the lower electrode layer and/or the upper electrode layer being partitioned into multiple electrodes such that the high dielectric sheet has multiple capacitors. The lower electrode layer and/or the upper electrode layer is connected to a ground line and the other one of the lower electrode layer and the upper electrode layer is connected to a power line such that the capacitors are electrically connected in parallel.03-17-2011
20110114377STACKED ELECTRONIC DEVICE AND METHOD OF MAKING SUCH AN ELECTRONIC DEVICE - This invention relates to a stacked electronic device composed of stacked electronic components (05-19-2011
20090107714ELECTRONIC COMPONENT MODULE AND CIRCUIT BOARD THEREOF - An electronic component module, including: a circuit board having: an insulating layer; a plurality of conductive layers formed on respective surfaces of the insulating layer; a ground plane comprising one of the conductive layers and covering the greater part of the surface; and wiring formed on another of the surfaces and comprising the conductive layer; and an electronic component mounted on the circuit board and connected by the wiring, wherein a plurality of slits, formed by removing the conductive layer, are provided in the ground plane.04-30-2009
201101326491-D TIRE PATCH APPARATUS AND METHODOLOGY - Disclosed is a tire mountable apparatus and method that includes a substrate defining a longitudinal direction, a top surface and a bottom surface. The substrate has a plurality of conductor terminals arranged in a substantially linear relationship. A first support element is located below the bottom surface of the substrate and a second support element is located above the top surface of the substrate. The plurality of conductor terminals are positioned between the first and second support elements. The substrate may be a piezoelectric device having a piezoelectric layer arranged between first and second conductive layers. The plurality of conductor terminals may be arranged in a substantially linear relationship along a line about 80° to about 100° to the longitudinal direction of the substrate, and the longitudinal direction of the substrate being substantially perpendicular to the direction of rotation of the tire.06-09-2011
20110253437PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board includes signal holes, at least one first securing hole, and at least one second securing hole. The signal holes and the first securing hole is able to secure a first electronic element or the signal holes and the second securing hole is able to secure a second electronic element.10-20-2011
20100181102PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD UNIT - A printed circuit board on which a surface mount electronic device is mounted. The printed circuit board includes a substrate on which land arrangements are disposed in an array. Each land arrangement includes a core portion and drawing portions. The drawings are disposed along diagonal directions relative to the core portions of the array of the land arrangements.07-22-2010
20110168437PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a positive differential signal line including first and second segments, a negative differential signal line including third and fourth segments, first and second connecting elements soldered on opposite surfaces of the PCB. The first segment and the fourth segment are located in a first straight line which has a first permittivity. The third segment and the second segment are located in a second straight line which has a second permittivity different from the first permittivity. The first connecting element is connected between the first segment and the second segment. The second connecting element is connected between the third segment and the fourth segment.07-14-2011
20110132648CHANNEL PERFORMANCE OF ELECTRICAL LINES - A first via and a second via pass through a layer of a multi-layered circuit board. A first set of electrical transmission line segments, each having a first thickness, is aligned at a first area on the layer between the first and second vias. A second set of electrical transmission line segments, each having a second thickness that is greater than the first thickness, are aligned at a second area that is offset to the first area and to the first and second vias. The first set of electrical transmission line segments is connected to the second set of electrical transmission line segments to form an electrical transmission line, which has an average impedance that matches a line impedance of a uniform thickness line.06-09-2011
20120145443CIRCUIT BOARD WITH DOUBLE-SIDED UNIVERSAL CIRCUIT LAYOUT AND LAYOUT METHOD THEREOF - A circuit board with double-sided universal circuit layout for laying out electronic components has a first side with a first circuit layout thereon and an opposing second side with a second circuit layout thereon; hence, the first circuit layout and the second circuit layout are disposed on the opposing sides of the circuit board, respectively. The first circuit layout and the second circuit layout feature electronic circuits having the same function, thereby allowing users to selectively install the electronic components at one of the first circuit layout and the second circuit layout as needed and still have access to the electronic circuits having the same function. A layout method for use with the circuit board with double-sided universal circuit layout is further introduced.06-14-2012
20110094784FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS - According to one embodiment, a plurality of conductive-paste-filling openings are provided in the cover layer to align with the conductive pattern portion, and a plurality of conductive portions are formed by filling conductive paste in the plurality of conductive-paste-filling openings to conductively join the metal layer to the conductive pattern portion.04-28-2011
20110094783PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path.04-28-2011
20110094782PRINTED CIRCUIT BOARD - A printed circuit board includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the signal transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path. A length of a first axis, perpendicular to the signal transmission line, of the void satisfies a following equation:04-28-2011
20100200284SUBSTRATE MANUFACTURING APPARATUS, SUBSTRATE MANUFACTURING METHOD, BALL-MOUNTED SUBSTRATE, AND ELECTRONIC COMPONENT-MOUNTED SUBSTRATE - A substrate manufacturing apparatus manufactures a ball-mounted substrate and has a ball mounting apparatus which includes a ball vacuum chucking apparatus including a vacuum chucking head that carries out a vacuum chucking process to chuck balls at edges of inlets formed in a vacuum chucking surface and which mounts the balls vacuum-chucked by the vacuum chucking head on a substrate, the ball vacuum chucking apparatus further including: a holding vessel that holds the balls; and a vacuum chucking/holding unit that vacuum chucks and holds the balls held in the holding vessel on a front end thereof, and carrying out a supplying process that brings the vacuum chucking/holding unit that holds the balls on the front end thereof and the vacuum chucking surface of the vacuum chucking head relatively close to supply the balls to the vacuum chucking head while air is being drawn through the inlets.08-12-2010
20100282502MULTILAYER PRINTED WIRING BOARD - In a core substrate 11-11-2010
20090308648PRINTED BOARD AND IMAGE FORMATION APPARATUS - A printed board having an input/output terminal that connects with a component in an image formation apparatus through a cable, and a control circuit that controls the component, the printed board which includes a conductive pattern on which a capacitor that suppresses an emission of an electromagnetic wave from the cable is mounted between a grounding surface and a signal line from the input/output terminal, the conductive pattern being formed in the vicinity of the input/output terminal.12-17-2009
20110259630Electronic Component-Embedded Printed Circuit Board and Method Of Manufacturing The Same - Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material.10-27-2011
20110186340METHOD FOR PRODUCING CONDUCTIVE MATERIAL, CONDUCTIVE MATERIAL OBTAINED BY THE METHOD, ELECTRONIC DEVICE CONTAINING THE CONDUCTIVE MATERIAL, AND LIGHT-EMITTING DEVICE - The object of the present invention is to provide a method for producing a conductive material that has a low electric resistivity and that is obtained using an inexpensive and stable conductive material composition. A conductive material having a low electric resistivity can be obtained by a method including the step of heating a conductive material composition that contains at least one of a full-cured or semi-cured thermosetting resin and a thermoplastic resin, as well as silver particles. Such a conductive material is a conductive material that includes fused silver particles, and thermosetting resin fine particles that have an average particle diameter of 0.1 μm to 10 μm both inclusive and are dispersed in the fused silver particles. Further, in such a conductive material is a conductive material that includes fused silver particles, and a thermoplastic resin welded among the fused silver particles.08-04-2011
20100025096CONNECTOR AND ELECTRONIC COMPONENT PROVIDED WITH SAME - A connector is provided that includes: a molded base part having a substrate and elastomers arranged on both sides of the substrate; a plurality of through holes in the molded base part, which pass through the molded base part in a stacked direction of the substrate and the elastomers, and are arranged in parallel at predetermined spacing; and L-shaped contacts arranged via the through holes from one surface side of the molded base part to another surface side, wherein: the elastomers incorporate a plurality of first protruding parts whose top faces are inclined, and second protruding parts that protrude from top faces of the first protruding parts in a dome shape; said contact has dome shaped convex parts whose insides are hollow, and said convex parts are formed at two ends of the contact, and the convex parts are arranged such that they cover the respective second protruding parts. Also provided is an electronic component provided with this connector.02-04-2010
20120145445RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE RESIN MULTILAYER SUBSTRATE - A resin multilayer substrate includes a component-containing layer and a thin resin layer stacked on a surface of the component-containing layer. The resin multilayer substrate further includes a surface electrode located on a surface opposite to the surface of the thin resin layer stacked on the component-containing layer, a first via conductor provided in the component-containing layer, which includes an end reaching one surface of the component-containing layer, and a second via conductor provided in the thin resin layer, which includes a first end electrically connected to the surface electrode and a second end electrically connected to the via conductor. A portion of the thin resin layer in contact with the second via conductor defines a projection projecting into the first via conductor.06-14-2012
20120037411PACKAGING SUBSTRATE HAVING EMBEDDED PASSIVE COMPONENT AND FABRICATION METHOD THEREOF - A packaging substrate includes: a core board with at least a cavity; a dielectric layer unit having upper and lower surfaces and encapsulating the core board and filling the cavity; a plurality of positioning pads embedded in the lower surface of the dielectric layer unit; at least a passive component having upper and lower surfaces with electrode pads disposed thereon and embedded in the dielectric layer unit so as to be received in the cavity of the core board at a position corresponding to the positioning pads; first and second wiring layers disposed on the upper and lower surfaces of the dielectric layer unit and electrically connected to the electrode pads of the upper and lower surfaces of the passive component through conductive vias, respectively. By embedding the passive component in the core board and the dielectric layer unit, the invention effectively reduces the height of the overall structure.02-16-2012
20100025095Device Carrying an Intergrated Circuit/Components and Method of Producing the Same - A method of forming an integrated circuit component on an insulating substrate (02-04-2010
20090173526Electrical Component with a Sensor Element, Method for the Encapsulation of a Sensor Element, and Method for Production of a Plate Arrangement - An electrical component is specified with a sensor element, which is embedded in a plate arrangement. The plate arrangement includes at least three plates and conductor tracks, which are located between them and are conductively connected with the sensor element. At least two of the conductor tracks have exposed areas. Furthermore, a method for the encapsulation of a sensor element and a method for the production of a plate arrangement are specified.07-09-2009
20100319975FILTER, BRANCHING FILTER, COMMUNICATION MODULE, AND COMMUNICATION EQUIPMENT - A filter of the present invention is a filter including a substrate and a filter element mounted on the substrate, wherein the substrate is provided with a plurality of wiring layers including a filter element wiring layer which is formed with wirings and connected with the filter element, an insulating layer interposed between the plural wiring layers and a ground pattern formed in at least a part of a wiring layer under the filter element wiring layer; and the thickness of the insulating layer interposed between the filter element wiring layer and the other wiring layer is smaller than the width of the wiring formed in the filter element wiring layer, and is larger than the thickness of the other wiring layer. By such a configuration, a thin, high-suppression and high-isolation filter can be realized.12-23-2010
20120145442INTERCONNECT STRUCTURE - A microelectronic assembly includes a first surface and a first thin conductive element exposed at the first surface and having a face comprising first and second regions. A first conductive projection having a base connected to and covering the first region of the face extends to an end remote from the base. A first dielectric material layer covers the second region of the first thin element and contacts at least the base of the first conductive projection. The assembly further includes a second substrate having a second face and a second conductive projection extending away from the second face. A first fusible metal mass connects the first projection to the second projection and extends along an edge of the first projection towards the first dielectric material layer.06-14-2012
20110114378MULTILAYER CERAMIC CAPACITOR MOUNTING STRUCTURE AND MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor has an element body formed by alternately laminating a plurality of dielectric layers and a plurality of inner electrodes. On a substrate having a mounting surface provided with at least two lands, the multilayer ceramic capacitor is mounted such that the inner electrodes are parallel to the mounting surface. A multilayer ceramic capacitor mounting structure satisfies T05-19-2011
20120097441ELECTRONIC ELEMENT AND METHOD FOR ASSEMBLING THE SAME TO CIRCUIT BOARD - An electronic element is used for being soldered to a top surface and a bottom surface of a circuit board with solder pastes, and includes: a main body, including an insulating body and multiple terminals fixed to the insulating body, in which each of the terminals has a soldering portion, the soldering portions are arranged in two rows for being soldered respectively to the top surface and the bottom surface of the circuit board, and a distance between the two rows of the soldering portions is greater than or equal to a distance between outermost sides of the solder pastes on the top surface and the bottom surface of the circuit board; and a pressing member, located at an outer side of one row of the soldering portions, movably connected to the main body, and finally fixed to the main body. A method for assembling the electronic element to a circuit board is further provided.04-26-2012
20090084591Cavity capacitor fabrication method and printed circuit board having embedded cavity capacitor - A cavity capacitor fabrication method and a printed circuit board having an embedded cavity capacitor are disclosed. In accordance with an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor includes two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein the cavity capacitor is placed between the two conductive layers, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped portion than the first dielectric layer, and the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode.04-02-2009
20120037413PRINTED WIRING BOARD FABRICATION METHOD, PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE - An object of the invention is to provide a method for fabricating a printed wiring board that can suppress warping of the printed wiring board and can improve the yield of semiconductor chip mounting and enhance the reliability of a semiconductor package. The printed wiring board fabrication method according to the invention is a method for fabricating a printed wiring board having a through-hole in a core layer, wherein the printed wiring board fabrication method includes the step of applying a laser from one side of the core layer to a position where the through-hole is to be formed in the core layer and the step of applying a laser to the same position from the opposite side of the core layer.02-16-2012
20120305303MICROELECTRONIC SUBSTRATE FOR ALTERNATE PACKAGE FUNCTIONALITY - The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.12-06-2012
20120305304ELECTRONIC COMPONENT MODULE - An electronic component module 12-06-2012
20120037414MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multilayer printed wiring board including a layered capacitor section provided on a first interlayer resin insulation layer and a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. A second interlayer resin insulation layer is provided on the first insulation layer and the capacitor section, and a metal thin-film layer is provided over the capacitor section and on the second insulation layer. An outermost interlayer resin insulation layer is provided on the second insulation layer and the metal thin-film layer. A mounting section is provided on the outermost insulation layer and has first and second external terminals to mount a semiconductor element. Multiple via conductors penetrate each insulation layer. The via conductors include first via conductors that electrically connect the first layered electrode to the first external terminals. Second via conductors electrically connect the second layered electrode to the second external terminals.02-16-2012
20100126759STRUCTURE OF MULTI-LAYER PRINTED CIRCUIT BOARD - A structure of a multi-layer printed circuit board includes a power layer, a ground layer, and a dielectric layer. The dielectric layer is located between the power layer and the ground layer. The dielectric layer has a relative permittivity and a relative permeability, wherein the product of the relative permittivity and the relative permeability substantially decreases along with an increase in frequency within a frequency range.05-27-2010
20110315439Multiple Patterning Wiring Board, Wiring Board Wiring Board and Electronic Apparatus - A multiple patterning wiring board includes a base substrate including a plurality of wiring board regions arranged in rows and columns, the wiring board regions each including an electronic component mounting region in a center portion thereof, a dividing groove at borders between wiring board regions in one main face of the base substrate, a lid member bonding region being formed between the electronic component mounting region and the dividing groove in the main face of the base substrate, and the lid member bonding region 12-29-2011
20110315438METHOD FOR PRODUCING LAMINATED BASE MATERIAL, LAMINATED BASE MATERIAL AND PRINTED WIRING BOARD - A method for producing a laminated base material includes applying a liquid composition containing a solvent and a liquid crystal polyester to a substrate; and forming a covering material by removing the solvent. The substrate includes a conductor forming a circuit pattern on an insulating layer. The liquid composition covers the conductor. The polyester includes 30-50 mol % of (1), 25-35 mol % of (2), and 25-35 mol % of (3):12-29-2011
20080236877Power core devices and methods of making thereof - A device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first electrode and a second electrode and wherein said embedded singulated capacitor is positioned on the outer layer of the power core so that at least one Vcc (power) terminal and at least one Vss (ground) terminal of a semiconductor device can be directly connected to at least one first and at least one second electrode, respectively and wherein the first and second electrode of the singulated capacitor is interconnected to the first and second electrode respectively of an external planar capacitor embedded within a printed wiring motherboard.10-02-2008
20120152604MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTI-LAYERED CERAMIC CAPACITOR, METHOD THEREOF, LAND PATTERN OF CIRCUIT BOARD FOR THE SAME, PACKING UNIT FOR MULTI-LAYERED CERAMIC CAPACITOR TAPED HORIZONTALLY AND ALIGNING METHOD THEREOF - The present invention provides a method of mounting a circuit board having thereon a multi-layered ceramic capacitor and a land pattern of a circuit board for the same. The method of mounting a circuit board having thereon a multi-layered ceramic capacitor on which a plurality of dielectric sheet having internal electrodes formed thereon are stacked and the external terminal electrodes connected to the internal electrodes in parallel are formed on both ends thereof includes conductively connecting lands of a circuit board to the external terminal electrodes in such a way that internal electrode layers of the multi-layered ceramic capacitor and the circuit board are arranged in a horizontal direction, wherein a height T06-21-2012
20120006589Electronic Assemblies Without Solder and Methods for their Manufacture - The present invention provides an electronic assembly 01-12-2012
20120205147ELECTRONIC ASSEMBLY - An electronic assembly that includes a circuit board having a substrate in which an open space is defined, and a component having a housing and a plurality of leads, the open space being large enough to receive the housing of the component at least partially.08-16-2012
20120111623PRINTED CIRCUIT BOARD - A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't pass over any split of the ground plane.05-10-2012
20080264683Metal wiring plate - A metal wiring plate includes a soldering portion to which an electronic device is soldered and a wiring portion extending from the soldering portion and configured to electrically connect the electronic device to other device. The wiring portion includes a narrow portion located adjacent to the soldering portion. The width of the narrow portion is less than the width of the soldering portion so that the narrow portion helps prevent melted solder applied to the soldering portion from spreading to areas outside the soldering portion. The narrow portion allows the electronic apparatus to be surely soldered to the soldering portion without using solder resist.10-30-2008
20100300740Ceramic Capacitor and Wiring Board - A ceramic capacitor includes a capacitor body and a metal layer arranged on an outer surface of the capacitor body. The outer surface includes: a first capacitor major surface; a second capacitor major surface opposite to the first capacitor major surface in a thickness direction of the capacitor body; and a capacitor lateral surface between the first and second capacitor major surfaces. The capacitor body includes a first layer section and a second layer section. The first layer section includes a plurality of ceramic dielectric layers and a plurality of internal electrodes, wherein the ceramic dielectric layers and the internal electrodes are layered alternately. The second layer section is exposed at the first capacitor major surface, and includes a corner portion at a boundary between the first capacitor major surface and the capacitor lateral surface. The metal layer covers the corner portion of the second layer section.12-02-2010
20090277678SURFACE MOUNT ADHESIVE, MOUNTING STRUCTURE INCLUDING THE SAME, AND METHOD FOR PRODUCING MOUNTING STRUCTURE - A surface mount adhesive includes an epoxy resin, a curing agent, an accelerator, a first filler, and a second filler. The second filler has a specific gravity 1.1 to 3 times that of the first filler, and the second filler has a hardness higher than that of the first filler. The first filler has a largest particle size of 1 to 100 μm, and the second filler has a largest particle size of 1 to 100 μm, a specific gravity of 1.7 to 4.5, and a revised Mohs hardness of to 12. The weight ratio of the first filler to the second filler is from 1:3 to 3:1, and the surface mount adhesive has a specific gravity of 1.2 to 1.5. When the surface mount adhesive is dispensed, dispensing failures are suppressed, and dispensing stability is improved.11-12-2009
20120055707Use of Aliphatic Hydrocarbons and Paraffins as Solvents for Silver Sinter Pastes - A process is provided for fastening an electronic component to a substrate, the process including the steps of: (i) providing an electronic component and a substrate; (ii) creating a sandwich arrangement having the electronic component, the substrate and a layer arranged in between them, wherein the layer includes a paste containing (a) metal particles having a coating including at least one coating compound selected from the group consisting of fatty acids, fatty acid salts and fatty acid esters, and (b) at least one aliphatic hydrocarbon compound; and (iii) sintering the sandwich arrangement.03-08-2012
20120055706PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a core layer having a first circuit layer formed on an outer surface thereof; and a capacitor layer stacked on the core layer to be electrically connected to the first circuit layer, having an inner insulating layer therebetween, and including a plurality of conductive projection parts formed on the opposite surfaces of an upper electrode layer and a lower electrode layer and a dielectric layer formed between the upper electrode layer and the lower electrode layer.03-08-2012
20120103673MOUNTING STRUCTURE OF ELECTRONIC COMPONENT - A mounting structure of an electronic component includes: a bump electrode included in the electronic component, the bump electrode having an internal resin as a core and a conductive film covering a surface of the internal resin, and elastically deforming so as to follow a shape of at least one corner of a terminal so that the conductive film makes direct conductive contact with at least part of a top surface of the terminal and at least part of a surface along a thickness direction of the terminal; a substrate having the terminal and the electronic component that is mounted on the substrate; and a holding unit provided to the substrate and the electronic component so as to hold a state in which the bump electrode electrically deformed makes conductive contact with the terminal.05-03-2012
20120152602PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a top layer, a memory controller, a gap, and a connector. The memory controller is located on the top layer. A number of first golden fingers are set on the top layer near the gap and electrically connected to the memory controller. A connector includes a first slot to hold the first golden fingers and a second slot to hold a number of second golden fingers of a memory chip. The first slot is electrically connected to the second slot. The memory chip and the PCB are coplanar.06-21-2012
20120205148DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD - Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface.08-16-2012
20120152603PRINTED CIRCUIT BOARD INCLUDING AT LEAST ONE LAYER - A printed circuit board (PCB) for transmitting a signal that includes a first layer, and a second layer disposed on the first layer. The first layer includes a first signal line to transmit the signal, and a first ground line and a second ground line disposed at both sides of the first signal line to be apart from the first signal line by a first distance. The second layer includes a second signal line to transmit the signal, and a third ground line and a fourth ground line disposed at both sides of the second signal line to be apart from the second signal line by a second distance. The third ground line or the fourth ground line is disposed on the first signal line.06-21-2012
20100200285HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIELECTRIC SHEET AND PRODUCTION METHODS THEREOF - A method of producing a capacitor for a printed circuit board includes producing high-dielectric sheets and selecting ones of the high-dielectric sheets, which are substantially free from a defect after the heat process. Each of the high-dielectric sheets is produced by providing a first electrode, forming a first sputter film on the first electrode, forming an intermediate layer on the first sputter film by calcining a sol-gel film, forming a second sputter film on the intermediate layer, and providing a second electrode on the second sputter film. The high-dielectric sheets are subjected to a heat process in which the high-dielectric sheets are subjected to a first temperature at least once and a second temperature higher than the first temperature at least once.08-12-2010
20100096175ADHESIVE FILM, CONNECTING METHOD, AND JOINED STRUCTURE - An adhesive film, containing a first adhesive layer in which conductive particles are dispersed, and a second adhesive layer adhered to the first adhesive layer, wherein the lowest viscosity of the first adhesive layer attained at or below the curing temperature is higher than that of the second adhesive layer attained at or below the curing temperature, where the curing temperature is a temperature at which the adhesive layer starts to cure, wherein the first and second adhesive layers are respectively disposed to a substrate side and an electronic part side, and the adhesive film is configured to join the electronic part and the substrate by heating and pressurizing the substrate and the electronic part with the adhesive layer being therebetween, and wherein the first adhesive layer has a thickness which is less than two times of an average particle diameter of the conductive particles.04-22-2010
20110088936METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY - A method for manufacturing an electronic assembly (04-21-2011
20090133912RESIN COMPOSITION AND HYBRID INTEGRATED CIRCUIT BOARD MAKING USE OF THE SAME - A substrate, a circuit board and a multilayer circuit board are provided which, although being made of an inorganic filler as a crushed product, are capable of providing a highly reliable hybrid integrated circuit because of having excellent adhesion to a metal plate or metal foil and exhibiting a high thermal conductivity.05-28-2009
20090133914METHOD FOR PRODUCING AN INTEGRATED DEVICE AND A DEVICE PRODUCED THEREBY - A method for producing an integrated device. A source substrate is provided, the source substrate carrying one or more components to be attached to a receiver surface having a uneven topography. The source substrate includes a deformable layer on a surface on which the one or more components are carried. The source substrate is aligned such that said one or more components carried thereon are associated with contact areas of the receiver surface. The source substrate and the receiver surface are moved towards each other such that the one or more components are brought into contact with the contact areas wherein the deformable layer is at least partially deformed. The source substrate is removed such that the one or more of the components remain located on the contact areas of the receiver surface.05-28-2009
20090133913VERTICAL TRANSITIONS, PRINTED CIRCUIT BOARDS THEREWITH AND SEMICONDUCTOR PACKAGES WITH THE PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR CHIP - Provided are vertical transitions which have the high electrical performance and the high shielding properties in the wide frequency band in a multilayer PCB, printed circuit boards with the vertical transitions and semiconductor packages with the printed circuit boards and semiconductor chips. In vertical transitions for a multilayer PCB, a wave guiding channel is a conductor which includes at least more than one of signal vias 05-28-2009
20120125676THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD - A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.05-24-2012
20120125674DEVICE FOR SURFACE MOUNTING AND CAPACITOR ELEMENT - There is provided a device for surface mounting that has a substrate and a capacitor element loaded on a loading-side surface of the substrate and is integrally molded including the substrate and the capacitor element using a packaging resin. The substrate includes a first terminal electrode electrically connected to a first electrode of the capacitor element and a second terminal electrode electrically connected to a second electrode of the capacitor element, at least part of a mounting-side surface on an opposite side to the loading-side surface of the substrate is exposed on a mounting surface of the device, and the first terminal electrode and the second terminal electrode are adjacently disposed around an entire circumference of the mounting surface of the device.05-24-2012
20120125675ELECTRONIC COMPONENT - An electronic component that can be mounted with good balance includes a substrate, a plurality of first terminals located on a peripheral portion of one main surface of the substrate, a ground electrode located in a center of the one main surface of the substrate and including openings, and at least two second terminals located on the one main surface of the substrate and within the openings of the ground electrode and that are electrically isolated from the ground electrode. The second terminals are arranged at positions that are point symmetrical about a center of the ground electrode.05-24-2012
20100243306HIGH RATE SELECTIVE POLYMER GROWTH ON A SUBSTRATE - Method and systems provide growth of polymer structures at a high rate in a selective manner. In various embodiments, the method or system can expose the growth site to a polymer source and growing a polymer tube at a rate of at least 80 micrometer per hour at the growth site. The method or system can provide selectivity by providing a growth site on a substrate by patterning a metal, such as copper, that provides a seed site for the polymer. Non-selected sites can be coated with a polymer growth inhibitor, such as polyimide or silicon nitride.09-30-2010
20100288545PRINTED WIRING BOARD AND ELECTRONIC-COMPONENT PACKAGE - A printed wiring board having an insulating core; a plurality of vias having axes parallel to and at equal distance from a reference axis and passing through the core; a first conductive film formed on a front surface of the core from the reference axis to each of the individual vias; a first insulating film stacked on the front surface of the core and covering the first conductive film; a first connecting via having an axis identical to the reference axis and passing through the first stacked film; a second conductive film formed on a back surface of the core from the reference axis to each of the individual vias; a second insulating film stacked on the back surface of the core and covering the second conductive film; and a second connecting via having an axis identical to the reference axis and passing through the second stacked film.11-18-2010
20120160552PTC DEVICE, PROTECTIVE CIRCUIT MODULE INCLUDING THE SAME, AND SECONDARY BATTERY INCLUDING THE PROTECTIVE CIRCUIT MODULE - A Positive Temperature Coefficient (PTC) device, a Protective Circuit Module (PCM) including the PTC device, and a secondary battery including the Protective Circuit Module (PCM) are provided. A support portion is formed at one end of a conductive plate of the PTC device, a conductive layer disposed on the upper portion of the PTC main body is fixed to the Protective Circuit Module (PCM), and the support portion is fixed by a coated adhesive that is melted at a high temperature and then hardens when the high temperature is removed, thereby preventing the PTC device from swaying or twisting.06-28-2012
20100206624Electric Multilayer Component - An electric multilayer component includes a stack of dielectric layers and electrode layers arranged side by side. External contacts have different polarities that are arranged at an outer surface of the stack and are flip-chip contact-connectable. The electrode layers are connected by one end in each case to an external connection having the same polarity.08-19-2010
20100193229BARRIER LAYER TO PREVENT CONDUCTIVE ANODIC FILAMENTS - A through hole is formed in a circuit board (08-05-2010
20100051340DIELECTRIC PASTE HAVING A LOW DIELECTRIC LOSS, METHOD OF MANUFACTURE THEREOF AND AN ARTICLE THAT USES THE SAME - A dielectric paste having low dielectric loss is disclosed. The dielectric paste includes (A) a thermosetting resin; (B) an acid anhydride-based curing agent; (C) high dielectric constant particles; (D) an amine-based catalyst; and (E) a material for forming a salt with the amine-based catalyst (D). In the dielectric paste, the material (E) for forming a salt with the amine-based catalyst (D) is used so that the catalyst may be introduced in the form of a salt thus preventing the catalyst from binding with the high dielectric constant particles, thereby prohibiting the poisoning of the catalyst.03-04-2010
20100051339CIRCUIT BOARD - A circuit board includes a wiring layer, a first electronic component, a second electronic component, and a pad matrix. The first electronic component is mounted on the wiring layer and includes a number of first terminals. The second electronic component is mounted on the wiring layer and includes a number of second terminals corresponding to the first terminals. The pad matrix is formed on the wiring layer. The pad matrix includes a number of pads, each two adjacent pads have one pad electrically connected to a first terminal and the other pad electrically connected to a second terminal.03-04-2010
20120132461PRINTED CIRCUIT BOARD - A printed circuit board includes a top layer and a bottom layer. A power supply and an electronic component are located on the top layer. The power supply is connected to the top layer and the bottom layer through a first via. A number of second vias extend through the printed circuit board and are connected to the top layer and the bottom layer. The distance between each second via and the electronic component is the same.05-31-2012
20120132463PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - Embodiments of the present invention provide a printed wiring board in which solder bumps of a mounted semiconductor chip are less prone to be ruptured. The printed wiring board includes a dielectric layer having a main surface and a connecting pad embedded in the dielectric layer. The connecting pad is shaped like a brimmed hat. That is, the connecting pad includes a plate portion whose diameter is larger than that of a contact portion. The main surface of the contact portion is exposed at the main surface of the dielectric layer. Diameter of the contact portion is substantially the same as diameter of an under bump metal at the semiconductor chip side, when mechanical stress is applied, the stress disperses evenly to both of the connecting pad and the under bump metal, and thus rupture is less prone to occur.05-31-2012
20120132462CIRCUIT BOARD AND MOUNTING STRUCTURE USING THE SAME - A circuit board comprises a substrate; a through hole penetrating the substrate along with a direction of a thickness thereof; and a through hole conductor covering an inner wall of the through hole. The substrate comprises a first fiber layer, a second fiber layer, and a resin layer arranged between the first fiber layer and the second fiber layer. Each of the first fiber layer and the second fiber layer has a plurality of fibers and a resin arranged among the plurality of the fibers. The resin layer contains a resin and doesn't contain a fiber. The inner wall of the through hole, in a cross-section view along with the direction of the thickness of the substrate, comprises a curved depression in the resin layer.05-31-2012
20120211269DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR MODULE, AND MOBILE DEVICE - A device mounting board includes: an insulating resin layer; a wiring layer formed on one of the principal surfaces of the insulating resin layer; a protection layer covering the insulating resin layer and the wiring layer; a protruding electrode electrically connected to the wiring layer, the protruding electrode protruding from the wiring layer toward the insulating resin layer and penetrating through the insulating resin layer; a wiring-layer-side convex portion protruding from the wiring layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer; and a resin-layer-side convex portion protruding from the protection layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer.08-23-2012
20120211268LIGHT AND HEAT RESISTANT CIRCUIT BOARD APPARATUS AND METHOD - A light and heat resistant circuit board apparatus LHRPCB, comprising: at least one thermally conductive material (TCM) layer adapted to serve as a mechanical and thermal substrate for the LHRPCB; at least one layer of electrically isolating material (EIM) configurable on respective TCM layers, the at least one EIM layer being resistant to UV radiation; at least one electrically conducting layer (ECL) layer configurable above the at least one TCM layer and adapted to be patterned and to selectively conduct electrical current; at least one heat and UV radiation resistant bonding layer (HUVRBL) appliable between respective ECL, TCM, and EIM layers; and at least one electronic component mountable upon the at least one ECL layer, wherein the LHRPCB is adapted to be exposed to light and heat for an extended period.08-23-2012
20120168217EMBEDDED CAPACITOR SUBSTRATE MODULE - An embedded capacitor substrate module includes a substrate, a metal substrate and a solid electrolytic capacitor material. The solid electrolytic capacitor material is formed on the metal substrate, so as to form a solid electrolytic capacitor with the substrate. The embedded capacitor substrate module further includes an electrode lead-out region formed by extending the substrate and the metal substrate. The metal substrate serves as a first electrode, and the substrate serves as a second electrode. An insulating material is formed between the substrate and the metal substrate. Therefore, the embedded capacitor substrate module is not only advantageous in having a large capacitance as the conventional solid capacitor, but also capable of being drilled or plated and electrically connected to other circuits after being embedded in a printed circuit board.07-05-2012
201201682160201 LAND PATTERN FOR 1.0 mm AND .08 mm PITCH ARRAYS - A land pattern for 1 mm and 0.8 mm pitch arrays has been disclosed for placing two port devices. The land pattern includes a ball grid array (BGA) of BGA pads each connected to a respective through hole via, and a pair of rectangular conductive pads electrically connected to a an adjacent pair of through hole vias, wherein each rectangular pad extends out from its via towards the other via of the pair along a line connecting the centers of said adjacent pair vias. A solder mask is located on the rectangular pad side and has apertures over each rectangular conductive pad. The land pattern is particularly useful for locating two port devices directly underneath a BGA device while minimizing the distance from a BGA ball to the two port device lead.07-05-2012
20100012364METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD - An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.01-21-2010
20100012363PRINTED CIRCUIT BOARD AND LAYOUT METHOD THEREOF - A printed circuit board coupling includes a first layout layer, a second layout layer, a pair of connecting portions, a first component and a second component. The first layout layer has a pair of first conducting portions which is disposed thereon to couple with a control chip. The second layout layer has a pair of second conducting portions, third conducting portions, and fourth conducting portions all of which are sequentially disposed thereon. The connecting portions are coupled with the first conducting portions and the third conducting portions. In a first coupling mode, an electronic device is coupled with the second conducting portions, and first and second components are coupled with the third and fourth conducting portions. In a second coupling mode, the electronic device is coupled with the fourth conducting portions, and the first and the second components are coupled with the second and third conducting portions.01-21-2010
20090090547MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board 04-09-2009
20120247822CORELESS LAYER LAMINATED CHIP CARRIER HAVING SYSTEM IN PACKAGE STRUCTURE - A substrate for use in a laminated chip carrier (LCC) and a system in package (SiP) device having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can include thermoset and thermoplastic resin.10-04-2012
20090071701LAMINATED STRUCTURE, FORMING METHOD OF THE SAME, WIRING BOARD, MATRIX SUBSTRATE AND ELECTRONIC DISPLAY APPARATUS - A disclosed laminated structure includes a wettability variable layer containing a wettability variable material whose surface energy changes when energy is applied thereto and including at least a high surface energy area having high surface energy and a low surface energy area having low surface energy; and a conductive layer disposed on the high surface energy area. The conductive layer includes a first high surface energy area, a second high surface energy area smaller in width than the first high surface energy area, and a third high surface energy area smaller in width than the second high surface energy area. The first high surface energy area and the second high surface energy area are connected by the third high surface energy area.03-19-2009
20120279772PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a package structure is provided. In the manufacturing method, a metal substrate having a seed layer is provided. A patterned circuit layer is formed on a portion of the seed layer. A first patterned dry film layer is formed on the other portion of the seed layer. A surface treatment layer is electroplated on the patterned circuit layer with use of the first patterned dry film layer as an electroplating mask. The first patterned dry film layer is removed. A chip bonding process is performed to electrically connect a chip to the surface treatment layer. An encapsulant is formed on the metal substrate. The encapsulant encapsulates the chip, the surface treatment layer, and the patterned circuit layer. The metal substrate and the seed layer are removed to expose a bottom surface of the encapsulant and a lower surface of the patterned circuit layer.11-08-2012
20120118623GLASS THICK FILM EMBEDDED PASSIVE MATERIAL - A method for forming an embedded passive device module comprises depositing a first amount of an alkali silicate material, co-depositing an amount of embedded passive device material with the amount of alkali silicate material; and thermally processing the amount of alkali silicate material and the amount of embedded passive device material at a temperature sufficient to cure the amount of alkali silicate material and the amount of embedded passive device material and form a substantially moisture free substrate.05-17-2012
20120118622LAMINATE CAPACITOR STACK INSIDE A PRINTED CIRCUIT BOARD FOR ELECTROMAGNETIC COMPATIBILITY CAPACITANCE - An apparatus comprises a multi-layer printed circuit board having at least three conductor layers, a dielectric material layer between each of the conductor layers, and a laminate capacitor stack arranged transversely through the printed circuit board. The laminate capacitor stack comprises: (a) a plurality of conducting patches including a patch in a plurality of the conductor layers, wherein the plurality of patches are aligned in a stack with the dielectric material filling the space between adjacent patches; (b) a first conducting via interconnecting each patch in a first subset of the plurality of patches, wherein the first subset of the plurality of patches are coupled to one of the conductor layers that is at ground potential; and (c) a second conducting via interconnecting each patch in a second subset of the plurality of patches, wherein the second subset of the plurality of patches are coupled to one of the conductor layers that is at power potential, wherein the patches in the first subset are disposed in an alternating pattern with the patches in the second subset.05-17-2012
20120255767ASSEMBLY STRUCTURE FOR INJECTION MOLDED SUBSTRATE AND FOR MOUNTING COMPONENT - A substrate (10-11-2012
20120261174CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT, ELECTRONIC MEMBER WITH CONDUCTIVE CONNECTING MATERIAL AND ELECTRONIC COMPONENT - Disclosed is a conductive connecting material 10-18-2012
20120267153COUPLING DEVICE, ASSEMBLY HAVING A COUPLING DEVICE, AND METHOD FOR PRODUCING AN ASSEMBLY HAVING A COUPLING DEVICE - The invention relates to a method for a coupling device (10-25-2012
20100326715CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP - A circuit board includes a semiconductor chip having an upper surface and side surfaces connected to the upper surface. A bonding pad is disposed on the upper surface of the semiconductor chip. A bump is disposed on the bonding pad and projects from the bonding pad by a predetermined height. A circuit board body has a recess part, and the semiconductor chip is positioned in the recess part so that the circuit board body covers the upper surface and the side surfaces of the semiconductor chip while exposing an end of the bump. A wiring line is disposed on the circuit board body and part of the wiring line is positioned over the bump. An opening is formed in a portion of the part of the wiring line over the bump to expose the bump. A reinforcing member physically and electrically connects the exposed bump and the wiring line.12-30-2010
20110036623METHOD OF ENCAPSULATING AN ELECTRONIC ARRANGEMENT - The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.02-17-2011
20110214914SYSTEM AND METHOD FOR ATTACHING A SUBSTANTIALLY THREE DIMENSIONAL STRUCTURE TO A SUBSTANTIALLY TWO DIMENSIONAL STRUCTURE - A method and system for transporting a fluid, gas, semi-solid, cryogen, or particulate matter, or combination thereof, between a three-dimensional structure and a substantially two-dimensional structure is disclosed. A system and method for electrically coupling a three-dimensional structure to a substantially two dimensional structure is also disclosed.09-08-2011
20110214913ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURNG METHOD THEREOF - An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, an electro device embedded printed circuit board is manufactured by: adhering an electro device on an upper surface of a supporting body; stacking a pure resin layer and an insulating reinforcing layer on an upper side of the supporting body, wherein the electro device is embedded in the pure resin layer; removing the supporting body; stacking an insulation layer on a lower side of the electro device, a reinforcing material having been impregnated in the insulation layer; and patterning a circuit on each of the reinforcing layer and the insulation layer.09-08-2011
20110220402MULTI-LAYER SEMICONDUCTOR ELEMENT PACKAGE STRUCTURE WITH SURGE PROTECTION FUNCTION AND METHOD FOR MANUFACTURING THE SAME - A multi-layer semiconductor element package structure with surge protection function includes a substrate unit, an insulated unit, a one-way conduction unit and a protection unit. The substrate unit has at least one top substrate, at least one middle substrate and at least one bottom substrate. The insulated unit has at least one first insulated layer filled between the top substrate and the middle substrate and at least one second insulated layer filled between the middle substrate and the bottom substrate. The one-way conduction unit has a plurality of one-way conduction elements electrically disposed between the top substrate and the middle substrate and enclosed by the first insulated layer. The protection unit has at least one protection element with anti surge current or anti surge voltage function electrically disposed between the middle substrate and the bottom substrate and enclosed by the second insulated layer.09-15-2011
20100000772ELECTRONIC PACKAGE HAVING DOWN-SET LEADS AND METHOD - In one embodiment, a leadless package includes down-set conductive leads having base portions. The base portions include stand-offs that attach to electrodes on an electronic chip using, for example, a solder die attach material. An optional encapsulating layer covers portions of the down-set conductive leads and portions of the electronic chip while leaving pad portions of the down-set conductive leads and a surface of the electronic chip exposed. The pad portions and the surface of the electronic chip are oriented to attach to a next level of assembly.01-07-2010
20120298408SUBSTRATE FOR POWER MODULE AND POWER MODULE - A substrate for a power module comprises a substrate main body having a plate-shape, a first surface, which is one surface of the substrate main body and a mounting surface that a semiconductor device is mounted on, and a second surface, which is the other surface of the substrate main body and an insulation layer is formed on, wherein the substrate main body is made of a metal matrix composite plate composed of a metal matrix composite in which metal is filled into a carbonaceous material.11-29-2012
20120298407MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING MULTI-LAYERED CERAMIC CAPACITOR THEREON - Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon. The mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, in which a dielectric layer on which inner electrodes are disposed is stacked and external electrode terminals connecting the inner electrodes in parallel are disposed on both ends thereof, wherein the inner electrodes of the multi-layered ceramic capacitor and the circuit board are disposed so as to be a horizontal direction to connect the external electrode terminals with a land on the circuit board by a conductive material and a ratio of a bonding area A11-29-2012
20090065245CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF - A circuit board structure and a fabrication method thereof are disclosed. The circuit board structure includes a carrying board having a first and an opposite second surface and having at least one through cavity formed therein; a semiconductor chip disposed in the through cavity of the carrying board; an adhesive material filling the gap between the through cavity of the carrying board and the semiconductor chip to fix the semiconductor chip in the through cavity; and a reinforcing layer disposed on the second surface of the carrying board and the inactive surface of the semiconductor chip, thereby increasing the strength of the carrying board as well as the reliability of the circuit board.03-12-2009
20120080223PRINTED CIRCUIT BOARD - There is provided a printed circuit board including an insulating substrate having a guide hole, a solder resist layer coated on a surface of the insulating substrate, and a connection pad arranged on the surface of the insulating substrate and having an outer periphery covered with the solder resist layer and a central portion exposed in an opening formed in the solder resist layer. The solder resist layer has a positioning hole having a diameter smaller than that of the guide hole and formed by photolithography above the guide hole simultaneously with the opening.04-05-2012
20120080222CIRCUIT BOARD INCLUDING EMBEDDED DECOUPLING CAPACITOR AND SEMICONDUCTOR PACKAGE THEREOF - A circuit board including an embedded decoupling capacitor and a semiconductor package thereof are provided. The circuit board may include a core layer including an embedded decoupling capacitor, a first build-up layer at one side of the core layer, and a second build-up layer at the other side of the core layer, wherein the embedded decoupling capacitor includes a first electrode and a second electrode, the first build-up layer includes a first via contacting the first electrode, and the second build-up layer includes a second via contacting the first electrode.04-05-2012
20120080221PRINTED WIRING BOARD WITH BUILT-IN COMPONENT AND ITS MANUFACTURING METHOD - A printed wiring board with components and its manufacturing method is described. An opening is formed from one main surface to another main surface of a core material. A functional element is brought into press contact with the side wall of the opening such that terminals of the functional element are exposed facing the core material's one main surface and the other main surface. A first and second interlayer dielectric layers are formed on the main surface and the other main surface, respectively, each interlayer dielectric layer having conductive bumps connected to conductive layers, with the interlayer dielectric layers filling voids between the opening and the functional element. A first terminal and a second terminal of the functional element are connected to respective first and second conductive bumps, respectively.04-05-2012
20120080220ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE - An electronic device includes a circuit board including a first electrode and a second electrode; and an electronic component including a first terminal and a second terminal, wherein the first electrode includes a first pad portion to which the first terminal is connected and a first protrusion portion disposed in a first direction in parallel with a straight line passing through the first electrode and the second electrode with respect to the first pad portion and being into contact with the first terminal, the second electrode includes a second pad portion to which the second terminal is connected and a second protrusion portion disposed in a second direction opposite to the first direction with respect to the second pad portion and being into contact with the second terminal.04-05-2012
20100224397WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a substrate with an opening section, an electronic component having an electrode and arranged in the opening section, insulative material filled in the gaps between the substrate and the electronic component in the opening section, and a first conductive layer formed on the insulative material and including a first conductive pattern. A via hole is formed in the insulative material. The electrode of the electronic component and the first conductive pattern are connected by means of the via hole. The height of the via hole is set in the range of 5-15 μm and the aspect ratio of the via hole is set in the range of 0.07-0.33.09-09-2010
20100224398MOUNTING STRUCTURE - In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.09-09-2010
20110266039METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRATE STRUCTURE THEREOF - An assembly including a substrate, a metal wiring layer on the substrate, the metal wiring layer having an opening therein, a thermosetting resin layer on at least a portion of the substrate overlapping the opening of the metal wiring layer, and a device on the resin layer, the device positioned over the opening of the metal wiring layer and bonded to the substrate via the resin layer.11-03-2011
20120279773ARRANGEMENT COMPRISING A CARRIER AND A LAYER - The invention relates inter alia to an arrangement comprising a carrier (11-08-2012
20100230150MOTHERBOARD - A motherboard includes a mounting area, a plurality of first mounting holes, and a plurality of second mounting holes. The mounting area is configured to support an electronic component. The plurality of first mounting holes is defined in the motherboard around the mounting area to bound a first area, and configured to mount a first type of fan. The plurality of second mounting holes is defined in the motherboard around the mounting area to bound a second area, and configured to mount a second type of fan. The first and second areas are concentric with the mounting area, and each of the plurality of second mounting holes is located adjacent to a corresponding one of the plurality of first mounting holes.09-16-2010
20100230149Glass Flux Assisted Sintering of Chemical Solution Deposited Thin Dielectric Films - A method of making dense dielectrics layers via chemical solution deposition by adding inorganic glass fluxed material to high dielectric constant compositions, depositing the resultant mixture onto a substrate and annealing the substrate at temperatures between the softening point of the inorganic glass flux and the melting point of the substrate. A method of making a capacitor comprising a dense dielectric layer.09-16-2010
20100230152METHOD OF SOLDERING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT - A method of soldering an electronic component includes; providing solder onto a printed circuit board electrode of a printed circuit board; placing the electronic component over the printed circuit board, the electronic component having a component electrode to be mounted on the printed circuit board electrode with a component-supporting member that melts with heat interposed therebetween; and heating the solder and the component-supporting member. The electronic component is supported on one side thereof by the component-supporting member and on the opposite side thereof directly by the printed circuit board.09-16-2010
20100230151Circuit layout and method and device for producing a circuit pattern on a substrate - A circuit layout having a substrate with at least one electronic component, wherein contacts of the electronic component are electrically connected to contacting regions of a conductor strip. Furthermore, a method for producing a circuit pattern is provided, whereby at least one conductor strip is attached onto at least one surface side of the substrate, the conductor strip being coated with a meltable insulating varnish and whereby the insulating varnish is heated and the conductor strip is pressed onto the substrate. A device is also provided for producing a circuit pattern comprising a conductor strip coil and a cylindrical or conical laying tool, which at least over a part of its length has an interior bore guiding the conductor strip and an annular active area arranged perpendicular to its longitudinal axis and merging in inner and outer radius.09-16-2010
20120325536DISPLAY DEVICE AND METHOD FOR FABRICATING SAME - A display device includes a display panel having a first substrate a second substrate facing the first substrate, and a translucent panel attached, via an adhesive layer, to a surface of the second substrate opposite a surface facing the first substrate. The first substrate includes a terminal region which does not face the second substrate and in which a plurality of terminals are provided. A circuit component is mounted on the terminals in the terminal region. At least part of the circuit component is covered by the adhesive layer extending from between the second substrate and the translucent panel to the terminal region.12-27-2012
20120325537CIRCUIT BOARD, ELECTRONIC APPARATUS, AND NOISE BLOCKING METHOD - A circuit board (12-27-2012
20120325538PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes: a base material of printed boards; a solder pad formed on a pad-forming portion of the base material of printed boards and having a lead-coupling portion, a soldermask-covered portion, and an intermediate portion interposed therebetween; a soldermask having a solder pad-covering portion formed on the soldermask-covered portion of the solder pad and a remainder portion formed on the base material of printed boards; and a solder paste having one portion formed on the lead-coupling portion of the solder pad and attached to a lead of an electronic component, and the other portion formed on the intermediate portion of the solder pad, the solder pad-covering portion of the soldermask being substantially free of solder paste thereabove.12-27-2012
20120318572ENDOSCOPE DEVICE AND CIRCUIT BOARD - An endoscope device includes: a circuit board including a mounting surface; an electronic component including a bottom surface facing the mounting surface and a lateral portion; a first electrode mounted across a corner portion of the bottom surface and the lateral portion; a second electrode adjacent to the first electrode and mounted across the bottom surface and the lateral portion; a third electrode mounted on the mounting surface to face the first electrode, including an edge portion following the lateral portion and located outside of a first area of the mounting surface covered by the electronic component, and having a wider area than that of the first electrode and soldered to the first electrode; and a fourth electrode mounted on the mounting surface to face the second electrode, including an edge portion following the lateral portion and located outside of the first area, and soldered to the second electrode.12-20-2012
20120279771PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME - A package structure comprising a first substrate, a second substrate, an encapsulation layer sandwiched between the first and second substrates, and at least one electronic component mounted on the first substrate and isolated from the second substrate by the encapsulation layer. At least one conducting hole is defined in the encapsulation layer to communicate the at least one electronic component with the second substrate. An inner wall of each of the at least one conducting hole is coated with a first metal layer to electrically connect the at least one electronic component to the second substrate.11-08-2012
20120285735CONNECTING ELEMENT AND METHOD FOR MANUFACTURING A CONNECTING ELEMENT - A connecting element for electrical contacting of an electrical component having at least one electrically conductive line part, embedded at least partially in an injection-molded housing, is provided, the connecting element having at least one stiffening element reinforcing the line part.11-15-2012
20130008703METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD COMPRISING AN ELECTRONIC COMPONENT INTEGRATED THEREIN - In a method for integrating a component (01-10-2013
20100132993WIRING BOARD AND ELECTRONIC COMPONENT DEVICE - A wiring board includes a wiring forming region in which a plurality of wiring layers are stacked while sandwiching insulating layers, an outer periphery region which is arranged around the wiring forming region and in which a reinforcing pattern is formed in the same layer as each of the wiring layers. An area ratio of the reinforcing pattern to the outer periphery region and an area ratio of the wiring layer to the wiring forming region are substantially the same in each of the layers, and the reinforcing patterns exist without a gap in the outer periphery region when the wiring board is viewed in planar perspective.06-03-2010
20100132991ELECTRONIC DEVICE, PRINTED CIRCUIT BOARD, AND ELECTRONIC COMPONENT - According to one embodiment, an electronic device includes a housing, a printed circuit board, an electronic component, a bonding material, and chips. The printed circuit board is housed in the housing. The electronic component includes an electrode on a surface thereof that faces the printed circuit board. The bonding material is applied to at least part of the outer periphery of the electronic component on the printed circuit board to bond the electronic component to the printed circuit board. The chips are arranged at positions on the printed circuit board corresponding to the periphery of the surface of the electronic component to prevent the bonding material from intruding in a gap between the surface of the electronic component and the printed circuit board.06-03-2010
20130014981ELECTROMAGNETIC WAVE PROPAGATION APPARATUS AND ELECTROMAGNETIC WAVE INTERFACEAANM SHINODA; HiroshiAACI KodairaAACO JPAAGP SHINODA; Hiroshi Kodaira JPAANM TERADA; TakahideAACI TokyoAACO JPAAGP TERADA; Takahide Tokyo JPAANM HARA; KazunoriAACI KunitachiAACO JPAAGP HARA; Kazunori Kunitachi JP - An electromagnetic wave propagation apparatus includes: a planar propagation medium including a planar conductor, a first planar dielectric, a planar mesh conductor, and a second planar dielectric being overlaid on each other in order; at least one electromagnetic wave input port provided for the planar propagation medium; a power supply station that supplies the planar propagation medium with an electromagnetic wave as electric power or information through the electromagnetic wave input port; and at least one power receiving apparatus provided for a second planar dielectric of the planar propagation medium and includes an electromagnetic wave interface and a power receiving circuit. A dielectric board is provided with multiple conductor patterns as the electromagnetic wave interface. At least one connection means is provided between the conductor pattern and the power receiving circuit. At least one short-circuit means between the conductor patterns is provided at an end of the conductor pattern.01-17-2013
20110139501ELECTRONIC CHIP AND SUBSTRATE WITH SHAPED CONDUCTOR - An electronic chip including a plurality of conducting pins is provided. The conducting pins are located on an exterior surface of the electronic chip and provides via a conductive adhesive a plurality of electrical connections between the electronic chip and an external circuit. Among the conducting pins, a first conducting pin is adjacent to a second conducting pin. A first void is formed in a first corner of the first conducting pin near the second conducting pin. A flow space is accordingly provided for conducting particles in the conductive adhesive to flow through.06-16-2011
20130020119CIRCUIT MODULE - A circuit module includes a substrate that has a substantially rectangular parallelepiped shape and includes a plurality of inner conductive layers, an electronic component disposed on a first main surface of the substrate, an insulating layer disposed on the first main surface of the substrate so as to cover the electronic component, a shielding layer disposed on a surface of the insulating layer, and a ground electrode connected to the plurality of inner conductive layers. At least two of the inner conductive layers are directly connected to the shielding layer.01-24-2013
20120241206METHOD OF MANUFACTURING CIRCUIT BOARD, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE - A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.09-27-2012
20080223609Electronic device and electronic component mounting method - According to an aspect of an embodiment, an electronic device comprises a bonding material, an electronic component providing a plurality of pads on a bottom surface thereof, and a printed circuit board providing a plurality of pads on a surface thereof, at least one of the pads of the printed circuit board being connected to at least one of the pads of the electronic component by the bonding material so as to connect the printed circuit board with the electronic component electrically, wherein either the electronic component or the printed circuit board provides a dummy pad on which the bonding material is formed, the bonding material on the dummy pad butting against the other of the surfaces of the electronic component or the printed circuit board.09-18-2008
20080223608WIRING SUBSTRATE AND ELECTRONIC DEVICE - A wiring substrate includes a plurality of electrode terminals, to which external connection terminals of an electronic component are coupled, arranged in a row on one principal surface thereof, wherein the electrode terminals each include: a first linear portion; a second linear portion extending from an end of the first linear portion in a direction different from a direction of the first linear portion; and a bent portion that is a part where the first linear portion and the second linear portion are connected.09-18-2008
20080223607WIRING BOARD AND CAPACITOR TO BE BUILT INTO WIRING BOARD - An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an area that overlaps an orthogonal projection of the sub-core portion. The latter incorporates a laminated ceramic capacitor formed by first and second conductor layers with a ceramic (dielectric) layer therebetween. The first layer is connected to first and second side terminals of a first type while the second layer is connected to first and second side terminals of a second type. The housing portion has an inner edge which, in cross section, is of a quadrate shape, and a radius portion is formed at each corner having a dimension of between 0.1 and 2 mm.09-18-2008
20080223606Ceramic Substrate and Method for Manufacturing the Same - A chip-mounted substrate includes a chip electronic component on a ceramic substrate having surface electrodes. The chip electronic component includes a ceramic sintered compact defining an element assembly and terminal electrodes. The surface electrodes of the ceramic substrate are integrated with the corresponding external terminal electrodes by sintering.09-18-2008
20130168147ELECTRONIC DEVICE - Provided is an electronic device having a novel structure that makes it possible to simplify a structure needed for countermeasure against static electricity, while avoiding adverse effect to the function of the electronic device. An electronic device includes: a substrate (07-04-2013
20130168145CAPACITOR AND MULTILAYER CIRCUIT BOARD USING THE SAME - A capacitor includes at least two electrode layers opposite to each other and a dielectric layer positioned between the at least two electrode layers. The at least two electrode layers have opposite polarities. Each electrode layer includes a positive electrode and a negative electrode. The positive electrode includes a plurality of first coupling portions spaced substantially evenly and arranged in parallel. The negative electrode includes a plurality of second coupling portions spaced substantially evenly and arranged in parallel. The positive electrode and the negative electrode of each electrode layer are coplanar, and the plurality of first coupling portions interlace with the plurality of second coupling portions.07-04-2013
20130168146METAL TERMINAL BLOCK ADAPTED FOR SURFACE MOUNTING AND METHOD OF MOUNTING THE SAME - Provided is a metal terminal block adapted for surface mounting, which includes a metal body having a three-dimensional shape, an outer surface of which includes at least one portion appropriate for vacuum pickup. The metal terminal block provided on a reel carrier through taping is picked up through the vacuum pickup on the portion of the outer surface of the metal body and is mounted on a conductive pattern of a circuit board through the surface mounting. A back surface of the metal terminal block is adhered to the conductive pattern through reflow soldering. The metal body has an insertion recess extending from a surface to an opposite surface thereto, or an insertion hole passing through a surface to an opposite surface thereto.07-04-2013
20080217049EMBEDDED CAPACITIVE STACK - A novel method for manufacturing embedded a capacitive stack and a novel capacitive stack apparatus are provided having a capacitive core that serves as a structural substrate on which alternating thin conductive foils and nanopowder-loaded dielectric layers may be added and tested for reliability. This layering and testing allows early fault detection of the thin dielectric layers of the capacitive stack. The capacitive stack may be configured to supply multiple isolated capacitive elements that provide segregated, device-specific decoupling capacitance to one or more electrical components. The capacitive stack may serve as a core substrate on which a plurality of additional signaling layers of a multilayer circuit board may be coupled.09-11-2008
20130175075MANUFACTURING METHOD AND ELECTRONIC MODULE WITH NEW ROUTING POSSIBILITIES - Disclosed is an electronic module with high routing efficiency and other new possibilities in conductor design. The electronic module comprises a wiring layer (07-11-2013
20130112466ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component in which a direction identification mark can be easily formed includes a laminate including a plurality of laminated insulating material layers and a mounting surface parallel or substantially parallel to a z-axis direction. A directional coupler including a main line and a sub-line is included in the laminate. A direction identification mark is provided on an upper surface of the laminate which is parallel or substantially parallel to the mounting surface, and is defined by a via-hole conductor portion, which is obtained by filling a via hole provided in the insulating material layers with a conductor, being exposed from the upper surface.05-09-2013
20130092427PRINTED CIRCUIT BOARD CAPABLE OF LIMITING ELECTROMAGNETIC INTERFERENCE - A printed circuit board (PCB) includes a first wiring layer, a second wring layer, a power layer, a grounded layer, dielectric layers between every two active layers, a capacitor, and two through holes. A first portion of the power layer corresponding to the electromagnetic interference source is isolated from the power layer to form an independent power area. A first through hole connects the independent power area to an end of the capacitor, the second through hole connects a second portion of the power area to the other end of the capacitor. When the interference source produces interference, the interference is conducted to the independent power area and conducted to the second portion of the power area via the through holes and the capacitor.04-18-2013
20130112465PRINTED CIRCUIT BOARDS WITH EMBEDDED ELECTRO-OPTICAL PASSIVE ELEMENT FOR HIGHER BANDWIDTH TRANSMISSION - A printed circuit board (PCB) is provided comprising a plurality of non-conductive layers with conductive or signal layers in between. The PCB includes a first conductive via traversing the plurality of non-conductive and conductive or signal layers as well as a second conductive via traversing the plurality of non-conductive layers and conductive or signal layers, the second conductive via located substantially parallel to the first conductive via. An embedded electro-optical passive element is also provided that extends perpendicular to and between the first conductive via and the second conductive via. The electro-optical passive element embedded is located within a selected layer at a first depth in the printed circuit board, wherein such first depth is selected to reflect an incident electromagnetic wave back into the printed circuit board to enhance or diminish an electrical signal in the first conductive via by creating a positive or negative electromagnetic interference.05-09-2013
20130140071STRUCTURAL BODY AND INTERCONNECT SUBSTRATE - A structural body includes a first conductor having a first opening; a second conductor, having a second opening, which is opposite to at least a portion of the first conductor; a conductor via, passing through the first opening and the second opening, which is insulated from the first conductor and the second conductor; a first interconnect, provided in the inside of the first opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end and which is opposite to the second conductor; and a second interconnect, provided in the inside of the second opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end, and which is opposite to the first conductor.06-06-2013
20130140070SYSTEM FOR CONNECTING ELECTRICAL CABLES TO A PRINTED CIRCUIT BOARD - An electrical communication system includes a printed circuit board (PCB) having first and second ground plates and a plurality of signal vias and a plurality of ground vias extending between and through the first and second ground plates. Each of the plurality of signal vias are electrically connected to a respective conductive trace on a surface of the PCB. Cables connect to the PCB at a right angle, with a connector attached to an opposite side of the PCB. Each cable has two signal wires and a ground wire extending therefrom. The two signal wires define a differential pair. The signal wires are symmetrical with respect to the ground wire. Each of the signal wires electrically connects to a respective one of the plurality of signal vias. The ground wire connects to one of the plurality of ground vias. The cables are offset with respect to one another on the first and second ground plates and within the PCB.06-06-2013
20100276188Method and apparatus for improving power gain and loss for interconect configurations - The present disclosure relates to embedding a power modification component such as a capacitance or a resistance inside of pads that are located to extend over and beyond the vias of the PCB so that a portion of the pad containing the embedded capacitance or resistance is located beyond where the vias or blinds are located. Each of the pads will include an opening that is located over a given one of the vias or blinds to permit that via to conduct through the opening. In this way the capacitance and the resistance will have a closer contact point the electrical component.11-04-2010
20080210460Circuit board structure with capacitors embedded therein and method for fabricating the same - A circuit board structure with capacitors embedded therein and a method for fabricating the same are disclosed. The structure comprises at least two core layers individually comprising a dielectric layer having two opposite surfaces, circuit layers disposed on the outsides of the two opposite surfaces of the dielectric layer, and at least two capacitors embedded respectively on the insides of the two opposite surfaces of the dielectric layer and individually electrically connecting with the circuit layer at the same side; at least one adhesive layer disposed between the core layers to combine the core layers as a core structure; and at least one conductive through hole penetrating the core layers and the adhesive layer, and electrically connecting the circuit layers of the core layers. Accordingly, the present invention can improve the flexibility of circuit layout, and realize parallel connection between the capacitors to provide more capacitance.09-04-2008
20130146348PRINTED CIRCUIT COMPRISING AT LEAST ONE CERAMIC COMPONENT - A printed circuit includes a substrate onto which at least one ceramic component is attached so as to enable the heat produced by the ceramic component to be discharged and to prevent cracks in the ceramic component and in the substrate. To this end, the ceramic component is attached onto the substrate using two connectors made of metal matrix composite material. The two connectors further have incisions so as to enable the mechanical stresses exerted in the substrate to be carried over into the connectors.06-13-2013
20080196932MULTILAYER SUBSTRATE INCLUDING COMPONENTS THEREIN - Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a spot-faced portion. Passive components and an active component are disposed in the through-holes and the spot-faced portion, respectively. These components are connected to conductive patterns formed on wiring layers, with connecting vias therebetween. Contact faces of each component with the connecting vias are controlled so as to be disposed at the same level with the metal layers.08-21-2008
20080196931Printed circuit board having embedded components and method for manufacturing thereof - A printed circuit board having embedded components and a method for the manufacturing of the printed circuit board are disclosed. The printed circuit board includes: an intermediary insulation layer; a first core board, in which a first component having at least one electrode formed on one side is embedded, stacked on one side of the intermediary insulation layer; a first insulation layer stacked on the first core board such that the first component is covered; a second core board, in which a second component having at least one electrode formed on one side is embedded, stacked on the other side of the intermediary insulation layer; a second insulation layer stacked on the second core board such that the second component is covered; and a first via, which penetrates the first core board and the second core board. The use of this printed circuit board allows highly integrated designs.08-21-2008
20080196930Method for Manufacturing a Circuit Board Structure, and a Circuit Board Structure - This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern (08-21-2008
20130146347HIGH ASPECT RATIO STACKED MLCC DESIGN - An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.06-13-2013
20110226516WIRING BOARD - A wiring board includes at least one signal layer, at least one ground layer, at least one power plane, at least one power supply via that electrically conducts wiring over one substrate surface where a semiconductor device chip is mounted, wiring over another substrate surface, and the power plane, and signal wiring for performing signal transmission between a plurality of semiconductor device chips. The power plane is placed to the one substrate surface side than the signal wiring. The power supply via is composed of a large diameter aperture and a small diameter aperture. The large diameter aperture has a relatively large diameter and is formed from the one substrate surface to the power plane, and the small diameter aperture has a relatively small diameter and is formed from the power plane to the other substrate surface.09-22-2011
20100288547Holding Member, Mounting Structure Having The Holding Member Mounted In Electric Circuit Board, and Electronic Part Having the Holding Member - A holding member for connecting an electric part to an electric circuit board. The holding member has a base section, a pair of first leg sections, and a second leg section. The base section has a plate-like shape. The pair of first leg sections includes respective spring sections and hook sections. The second leg section includes a control section. The pair of first leg sections configured to be inserted into a through hole in the electric circuit board.11-18-2010
20100288546Holding Member, Mounting Structure Having The Holding Member Mounted In Electric Circuit Board, and Electronic Part Having the Holding Member - A holding member includes a base section, a pair of leg sections, and inclined sections positioned along tip portions of the pair of leg sections. The base section is plate-like shape. The pair of leg sections extend in approximately equal directions to each other, and are configured to fit into a through hole of an electronic circuit board and contact an inner surface of the through hole. The inclined sections are positioned along respective tip portions of the pair of leg sections and extend in directions approaching each other and facing in opposite directions, while being inclined relative to a width direction of the base section. Furthermore, the inclined sections contact and press each other so that a tip of at least one of the pair of leg sections advances along the axis which is angled relative to the width direction of the base section when the pair of leg sections are pushed into the through hole and contact the inner surface of the through hole.11-18-2010
20120273266INVERTER AND ELECTRONIC DEVICE USING THE INVERTER - An inverter and an electronic apparatus using the inverter are disclosed. The electronic apparatus has a circuit board and an inverter. The circuit board has an opening. The inverter has a wiring frame arranged in the opening. The wiring frame has a wiring portion for wiring coils. The wiring portion has two carrying portions at opposite sides, respectively. Each of the carrying portions has a side portion. A space for accommodating magnet is formed by the wiring portion and the carrying portion and the side portion. A conductive contact is arranged at one side of the side portion and a protrusion is arranged at another side of the side portion. The protrusion is used for being against the surface of the circuit board, and the height of the inverter with respect to the circuit board can thus be adjusted by the protrusion.11-01-2012
20130153277ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS - An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.06-20-2013
20130153278BALL GRID ARRAY PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a ball grid array (BGA) package including: a printed circuit board (PCB) in which a device is mounted via solder balls, wherein the PCB includes a plurality of pad patterns each including the solder balls and having the same shape.06-20-2013
20130153279WIRING BOARD AND MOUNTING STRUCTURE THEREOF - A wiring board according to an embodiment includes an inorganic insulating layer provided with a via-hole which is a penetrating hole, and a via-conductor which is a penetrating conductor disposed inside the via-hole. The inorganic insulating layer includes first inorganic insulating particles connected to each other and second inorganic insulating particles that are larger in particle size than the first inorganic insulating particles and are connected to each other via the first inorganic insulating particles, and also has, at an inner wall of the via-hole V, a protrusion including at least part of the second inorganic insulating particle. The protrusion is covered with the via-conductor.06-20-2013
20110232954Method of Patterning an Electronig of Photonic Material - The present invention provides a method of patterning an electronic or photonic material on a substrate comprising: forming a film of said electronic or photonic material on said substrate; and using an adhesive to selectively remove regions of said electronic or photonic material from said film, thereby leaving on said substrate said patterned electronic or photonic material.09-29-2011
20100006332CIRCUIT BOARD, LAMINATING CIRCUIT BOARD AND ELECTRONIC APPARATUS - It is an object to provide a circuit board, a laminating circuit board and an electronic apparatus which can enhance a shock resistance.01-14-2010
20110290546Printed circuit board having electronic component and method for manufacturing thereof - Disclosed herein are a printed circuit board having an electronic component and a manufacturing method thereof. The printed circuit board having an electronic component may include: an electronic component having a plating electrode pad having a predetermined thickness; an insulating resin layer that exposes a lower surface of the electrode pad, receives the electronic component, and embodies the electronic component so that the center of the base body forming the electronic component is positioned at the center of the insulating resin layer; and circuit layers that include a circuit pattern disposed on the electrode pad, form inter-layer connection, and are disposed on both surfaces of the insulating resin layer, respectively.12-01-2011
20110303451MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a core substrate, a first conductor layer on a first surface of the substrate, a second conductor layer on a second surface of the substrate, a third conductor layer inside the substrate between the first and second conductor layers, a conductive post connecting the third conductor layer with the first and second conductor layers, a first conductor circuit on the first surface of the substrate, a second conductor circuit on the second surface of the substrate, and a through hole formed through the substrate and connecting the first and second conductor circuits. The through hole is not connected to the third conductor layer, the third conductor layer has thickness larger than thicknesses of the first and second conductor layers, each of the first, second and third conductor layers forms one of power supply and ground layers, and the through hole forms a signal line.12-15-2011
20110303450MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSEMBLY, ELECTRONIC DEVICE, AND STRESS RELAXATION MEMBER - Disclosed is a mounting structure for mounting an electronic component on a circuit board. The mounting structure includes an interposer provided between the electronic component and the circuit board; and a plurality of spiral conductors formed in the interposer. The plurality of spiral conductors have one end thereof bonded to corresponding one of external connection terminals of the electronic component and the other end thereof bonded to corresponding one of electrodes of the electronic component.12-15-2011
20110303449PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD - A packaging structure for mounting an electronic component on a printed circuit board is provided, which includes an external connecting terminal of the electronic component connected to an electrode pad of the printed circuit board; a through-hole penetrating through the printed circuit board, the through-hole formed in a periphery of an electronic component mounting area; and a clamping member including a middle portion extending through the through-hole, and a first end portion and a second end portion extending from the middle portion. The first end portion and the second end portion are bent such that the electronic component and the printed circuit board are sandwiched and clamped by the first end portion and the second end portion.12-15-2011
20110308849WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes a first insulating layer formed as an outermost layer on one surface side, and exhibiting a black color or a gray color, a first connection pad formed to expose from the first insulating layer, a second insulating layer formed as an outermost layer on another surface side, and exhibiting a black color or a gray color, and a second connection pad formed to expose from the second insulating layer, wherein a connection hole having a side wall surface formed like a curved surface is formed in the second insulating layer, and the second connection pad is exposed to a bottom part of the connection hole.12-22-2011
20110308848RESIN COMPOSITION FOR WIRING BOARD, RESIN SHEET FOR WIRING BOARD, COMPOSITE BODY, METHOD FOR PRODUCING COMPOSITE BODY, AND SEMICONDUCTOR DEVICE - Disclosed are a composite body, a method for producing the composite body and a semiconductor device, the composite body comprising a resin layer and a fine wiring and/or via hole being formed in the resin layer, having high adhesion and high reliability, and being capable of high frequencies. Also disclosed are a resin composition and a resin sheet, both of which can provide such a composite body.12-22-2011
20120018206SOLID ELECTROLYTIC CAPACITOR - There is provided a capacitor that has excellent transient response characteristics, can be used as a distributed constant type noise filter, and can be used as a composite component having two functions of a capacitor and a distributed constant type noise filter through further reduction of an ESL of a solid electrolytic capacitor with a solid electrolytic capacitor of which capacitance is easily increased.01-26-2012
20120018205METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECTRONIC COMPONENT, AND WIRING BOARD - A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.01-26-2012
20120018204CERAMIC ELECTRONIC COMPONENT AND WIRING BOARD - A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.01-26-2012
20120018203ELECTRONIC MODULE WITH EMBEDDED JUMPER CONDUCTOR - The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.01-26-2012
20120037412Method for producing an electrical feedthrough in a substrate, and substrate having an electrical feedthrough - A method is described for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough. The method has the following operations of forming the electrical feedthrough so that it extends through the substrate from the front side to the back side of the substrate, forming a first closing layer on a front side of the substrate, forming an annular isolation trench in the substrate which encloses the electrical feedthrough, using an etching process starting from the back side of the substrate, the etching process terminating at the first closing layer, and closing off the annular isolation trench in the substrate by forming a second closing layer on the back side of the substrate.02-16-2012
20130199832COMPOSITE BUILD-UP MATERIALS FOR EMBEDDING OF ACTIVE COMPONENTS - Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding active components such as micro chips. The composite build-up materials comprise a carrier layer (08-08-2013
20130199831ELECTROMAGNETIC FIELD ASSISTED SELF-ASSEMBLY WITH FORMATION OF ELECTRICAL CONTACTS - A method and apparatus for self-assembling a part on a substrate are disclosed herein. In some embodiments, a method includes placing a substrate having a first binding site capable of generating a first magnetic field and having a first shaped surface with a first droplet conformably disposed thereon into a first fluid; placing a part having a second binding site capable of generating a second magnetic field and having a second shaped surface with a second droplet conformably disposed on the second shaped surface into the first fluid; and attracting the part towards the first binding site such that an equilibrium is formed between an attractive force and a repulsive force such that the part is free to rotate about the first binding site to minimize the repulsive force when the first and second shaped surfaces rotate into an alignment causing the part to aligned with the first binding site.08-08-2013
20120085573STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A problem to be solved is to suppress deterioration of insulating properties in a stacked structure with a dielectric film formed by powder spraying coating process, and in a method of manufacturing the stacked structure. In a stacked structure according to the present invention, a dielectric layer 04-12-2012
20130206464FORM-LESS ELECTRONIC DEVICE ASSEMBLIES AND METHODS OF OPERATION - Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.08-15-2013
20130206465ELECTRONIC DEVICE, METHOD FOR MANUFACTURING THEREOF, AND ELECTRONIC APPARATUS - An electronic device includes a first member including a reference potential terminal; a second member placed on a first surface of the first member and having conductivity; and a functional element accommodated in a cavity surrounded by the first member and the second member, wherein the second member and the reference potential terminal are electrically connected via a contact portion.08-15-2013

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