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Insulating

Subclass of:

174 - Electricity: conductors and insulators

174680100 - CONDUITS, CABLES OR CONDUCTORS

174250000 - Preformed panel circuit arrangement (e.g., printed circuit)

174256000 - With particular material

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DocumentTitleDate
20130025920PROCESS FOR PRODUCTION OF MICROFIBRILLATED CELLULOSE FIBER DISPERSION - The invention relates to a method for producing a microfibrillated cellulose fiber dispersion containing microfibrillated cellulose fibers, at least one of a resin and a resin precursor, and an organic solvent, and the method comprises a fibrillation step of fibrillating cellulose fibers in a starting material dispersion containing cellulose fibers, at least one of a resin and a resin precursor, and an organic solvent, to obtain microfibrillated cellulose fibers.01-31-2013
20130043067Wire Substrate Structure - [PROBLEM] To provide a circuit board improved in electrical reliability.02-21-2013
20100155119PASSIVE COMPONENT INCORPORATING INTERPOSER - A passive component incorporating interposer includes a double-sided circuit board (06-24-2010
20100096173EPOXY RESIN COMPOSITION, PREPREG, AND LAMINATE AND PRINTED WIRING BOARD - The present invention provides an improved epoxy resin composition enabling better dimensional stability of a laminate by decreasing the coefficient of thermal expansion in its thickness direction of a laminate manufactured using an epoxy resin composition as a material, and by retaining a high level of adhesion in the cured product thereof, enabling better drilling workability of the laminate and suppression of crack development therein during the drilling process, and enabling to decrease impregnation of the plating solution into the laminate associated with those cracks.04-22-2010
20100084172PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME - Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, R04-08-2010
20100084171NOVEL POLYIMIDE PRECURSOR COMPOSITION, USE THEREOF AND PRODUCTION METHOD THEREOF - An object of the present invention is to provide a polyimide precursor composition that can be cured at low temperatures (250° C. or lower), while having a low viscosity even at a high concentration, and a method of producing the same. Another object of the present invention is to provide a polyimide coating film obtained from the polyimide precursor composition and having good physical properties, and a method of producing the same. Furthermore, another object of the present invention is to provide a photosensitive resin composition containing the polyimide precursor composition, and a method of producing the same. These objects can be achieved by the polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and a diamine having a specific structure.04-08-2010
20080257593Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes - A printed circuit board, a method of manufacturing the printed circuit board, and an apparatus for perforating via holes. By use of a method of manufacturing a printed circuit board that includes forming a first circuit pattern, which includes a reference mark and a via land, on one surface of an insulation substrate; stacking a metal layer on the insulation layer; opening a first window in the metal layer in correspondence with the reference mark; and forming a via which electrically connects the via land with the metal layer, by irradiating light towards the other surface of the insulation substrate and identifying the reference mark through the first window, the occurrence of short-circuiting is prevented in forming vias for electrical interconnection between circuit patterns in a printed circuit board, and as the defect rate caused by eccentricity between insulation layers may be reduced, aspects of the invention may contribute to reducing costs.10-23-2008
20100071941DIELECTRIC SPACERS FOR METAL INTERCONNECTS AND METHOD TO FORM THE SAME - A plurality of metal interconnects incorporating dielectric spacers and a method to form such dielectric spacers are described. In one embodiment, the dielectric spacers adjacent to neighboring metal interconnects are discontiguous from one another. In another embodiment, the dielectric spacers may provide a region upon which un-landed vias may effectively land.03-25-2010
20130037313LIQUID COMPOSITION AND METAL-BASED CIRCUIT BOARD - A liquid composition containing a liquid crystalline polyester, a solvent, and a boron nitride having a volume average particle diameter of not less than 10 μm and not more than 80 μm, wherein the amount of the boron nitride is 30 to 90% by volume based on the total amount of the liquid crystalline polyester and the boron nitride.02-14-2013
20120175159RESIN COMPOSITION FOR USE IN RELEASE FILM - By incorporating an epoxy resin and aluminum hydroxide into a resin composition, it is possible to achieve a resin composition for use in a release film, which retains high bond strength after a build-up layer is cured, and which has excellent peel strength after being subjected to heating treatment for releasing.07-12-2012
20100163288MULTILAYERED PRINTED CIRCUIT BOARD - The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.07-01-2010
20090120673Multilayer circuit board and electronic device - A multilayered circuit board which is provided with a low-permittivity interlayer insulating film, and which can significantly improve the performance such as signal transmission characteristics of the multilayered circuit board such as a package and a printed board, because the surface in contact with the interlayer insulating film of the circuit board has no unevenness to eliminate the lowering of production yield and the deterioration of high-frequency signal transmission characteristics; and electronic equipment using the circuit board. The multilayered circuit board comprises, mounted on a substrate, plural wiring layers and plural insulating layers positioned between the plural wiring layers, wherein at least part of the plural insulating layers are composed of a porous insulating layer containing at least any of materials selected from a porous material group consisting of porous material, aerogel, porous silica, porous polymer, hollow silica and hollow polymer, and a non-porous insulating layer formed on at least one surface of the porous insulating layer and not containing the porous material group.05-14-2009
20100116532PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME - A photosensitive resin composition which is effective in avoiding troubles in the step of plating with various metals in printed wiring board production, such as under-film metal deposition and film peeling, and which forms a wiring-protecting film excellent in adhesion, flexibility, insulation reliability, and heat resistance. The photosensitive resin composition comprises (A) a carboxylated polymer, (B) a compound having at least two photopolymerizable unsaturated double bonds, (C) a photopolymerization initiator, and (D) a nitrogen compound represented by a specific feature.05-13-2010
20100101843INSULATING RESIN SHEET LAMINATE AND MULTI-LAYER PRINTED CIRCUIT BOARD INCLUDING INSULATING RESIN SHEET LAMINATE - Disclosed is an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) including an insulating resin layer with a uniform thickness that is formed without repulsion or unevenness in a process of forming the insulating resin layer on a film or a metal foil, and a multi-layer printed circuit board that includes the insulating resin sheet laminate and possesses high insulating reliability. The present invention provides an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) obtained by forming an insulating resin layer made of a resin composition on a film or a metal foil, and the resin composition includes an acrylic surfactant.04-29-2010
20100108367CURABLE RESIN COMPOSITION, COMPOSITE BODY, MOLDED BODY, LAMINATED BODY AND MULTILAYERED CIRCUIT BOARD - A curable resin composition comprising: 100 parts by weight of an alicyclic olefin polymer (A); from 1 to 100 parts by weight of a curing agent (B); from 10 to 50 parts by weight of a salt (C) of a basic nitrogen-containing compound with a phosphoric acid; and from 0.1 to 40 parts by weight of a condensed phosphate ester (D); of which phosphorus element content is not less than 1.5% by weight. The composition can provide a molded body or composite body which excels in a moisture resistance, a flame retardancy, a smoothness of the surface, and an electric insulation property and a cracking resistance, and hardly generates a harmful substance in burning. A multilayered circuit board is obtained by molding the composition into a sheet; laminating the sheet on an inner layer board; curing the laminated sheet to form an electric insulating layer; and forming an electric conducting layer on the electric insulating layer.05-06-2010
20100108368RESIN COMPOSITION FOR FORMING INSULATING LAYER OF PRINTED WIRING BOARD - Disclosed is a halogen-free resin composition for printed wiring board production, which is remarkably reduced in quality deterioration due to moisture absorption of a semi-cured resin film (layer). Also disclosed is a copper film with resin or the like. The resin composition is characterized by containing a component A (one or more resins selected from the group consisting of bisphenol-A epoxy resins, bisphenol-F epoxy resins and bisphenol-AD epoxy resins, which have an epoxy equivalent of not more than 200, while being in a liquid state at 25 DEG C.), a component B (a linear polymer having a crosslinkable functional group), a component C (a crosslinking agent), a component D (an imidazole-based epoxy resin curing agent) and a component E (a phosphorus-containing epoxy resin). The resin composition is also characterized by containing 0.5-3.0% by weight of phosphorus atoms per 100% by weight of the resin composition. In the copper foil with resin, a resin layer is formed by using the resin composition.05-06-2010
20100319971AIRGAP-CONTAINING INTERCONNECT STRUCTURE WITH IMPROVED PATTERNABLE LOW-K MATERIAL AND METHOD OF FABRICATING - A method of fabricating an airgap-containing interconnect structure in which a patternable low-k material replaces the need for utilizing a separate photoresist and a dielectric material is provided. Specifically, a simplified method of fabricating single-damascene and dual-damascene airgap-containing low-k interconnect structures with at least one patternable low-k dielectric and at least one inorganic antireflective coating is provided.12-23-2010
20130081865CIRCUIT BOARD LAMINATE AND METAL-BASED CIRCUIT BOARD - A circuit board laminate includes a metal substrate, an insulation layer disposed on the metal substrate, and a metal foil disposed on the insulation layer. A metal-based circuit board includes a metal substrate, an insulation layer disposed on the metal substrate, and a circuit pattern disposed on the insulation layer. The insulation layer contains a liquid crystal polyester and 50% by volume or more of an inorganic filler. The inorganic filler is made of boron nitride and at least one of aluminum nitride and aluminum oxide. A proportion of boron nitride in the inorganic filler is within a range of 35 to 80% by volume.04-04-2013
20130081864PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD - [Problems] The present invention provides a photosensitive resin composition having good resistance to electroless gold plating and excellent filling property into a through hole, from which a cured product where a defect in the outer appearance of a cured film caused by bumping in a through hole is inhibited can be obtained; a cured film of the photosensitive resin composition; and a printed circuit board comprising the cured film.04-04-2013
20100065315RESIN COMPOSITION, INSULATING SHEET WITH BASE, PREPREG, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - The present invention provides a resin composition which can produce a multilayer printed wiring board not causing peeling and crack in a thermal shock test such as a cooling/heating cycle, and having high heat resistance and low-thermal expansion characteristics, when the resin composition is used for an insulating layer of the multilayer printed wiring board; and also an insulating sheet provided on a base, a prepreg, a multilayer printed wiring board and a semiconductor device using thereof. The resin composition is used for forming an insulating layer of the multilayer printed wiring board, wherein a surface roughness parameter Rvk value of the insulating layer is from 0.1 μm to 0.8 μm, measured after the insulating layer being formed with the resin composition, and subject to roughening treatment.03-18-2010
20120181073ELECTRONIC DEVICE HAVING LIQUID CRYSTAL POLYMER SOLDER MASK AND OUTER SEALING LAYERS, AND ASSOCIATED METHODS - An electronic device includes a substrate with a circuit layer thereon that has a solder pad. There is a liquid crystal polymer (LCP) solder mask on the substrate that has an aperture aligned with the solder pad. There is a fused seam between the substrate and the LCP solder mask. Solder is in the aperture, and a circuit component is electrically coupled to the solder pad via the solder. A first dielectric layer stack having a first plurality of dielectric layers is on the LCP solder mask and has an aperture aligned with the solder pad. There is a first LCP outer sealing layer on the first dielectric layer stack, and a second dielectric layer stack having a second plurality of dielectric layers on the substrate on a side thereof opposite the LCP solder mask. Further, there is a second LCP outer sealing layer on the second dielectric layer stack.07-19-2012
20130048359SUBSTRATE WITH SPRING TERMINAL AND METHOD OF MANUFACTURING THE SAME - A substrate with spring terminals includes a substrate including a connection pad, a spring terminal whose connection portion is connected to the connection pad by a solder layer, and a resin portion formed to cover a side surface of the solder layer, thereby the failure that the spring terminal falls down is prevented.02-28-2013
20130048358WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF - A wiring structure includes: an insulating film formed over a substrate; a plurality of wirings formed on the insulating film; and an inducing layer, which is formed on the insulating film in a region between the plurality of wirings, a constituent atoms of the wirings are diffused in the inducing layer.02-28-2013
20130048357PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD - Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.02-28-2013
20100006328MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board having interlayer resin insulating layers on both sides of a core substrate, respectively, through holes provided to penetrate the core substrate and filled with resin filler, the interlayer resin insulating layers and conductor circuits provided. The resin filler contains an epoxy resin, a curing agent and 10 to 50% of inorganic particles.01-14-2010
20100006327CIRCUIT BOARD STRUCTURE - A circuit board structure including a circuit board main body and an injection molded three-dimensional circuit device encapsulating at least a portion of the circuit board main body is provided. The three-dimensional circuit device includes a molded plastic body having a non-plate type, stereo structure, on which a three-dimensional pattern is also fabricated. The three-dimensional pattern is interconnected with a contact pad on the circuit board main body through a conductive via.01-14-2010
20110000705DISPLAY DEVICE SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, DISPLAY DEVICE, METHOD FOR FORMING MULTI-LAYER WIRING, AND MULTI-LAYER WIRING SUBSTRATE - The present invention provides a display device substrate that enables microfabrication of lines and is capable of reducing faulty connection and enhancing the reliability of display devices including the display device substrate, a method for producing the display device substrate, a display device, a method for forming a multilayer wiring structure, and a multilayer wiring board. The display substrate of the present invention includes an insulating substrate and includes at least one of a terminal area having a connection terminal to be connected to an external connection component and a peripheral circuit region having a peripheral circuit formed thereon, on the insulating substrate. The display device substrate includes an organic insulating film and an inorganic insulating film, and the inorganic insulating film is stacked directly on and above the organic insulating film such that an organic-inorganic film stacked body is formed.01-06-2011
20090038834ALKALI DEVELOPMENT-TYPE SOLDER RESIST, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD PREPARED BY USING THE SAME - An alkali development-type solder resist includes (A) a carboxyl group-containing photosensitive resin obtained by reacting (a) a compound having two or more cyclic ether or thioether groups in the molecule with (b) an unsaturated monocarboxylic acid, reacting the product with (c) a polybasic acid anhydride, reacting the resulting resin with (d) a compound having a cyclic ether group and an ethylenic unsaturated group in the molecule, and reacting the product additionally with (c) a polybasic acid anhydride, (B) an oxime ester-based photopolymerization initiator containing a specific oxime ester group, (C) a compound having two or more ethylenic unsaturated groups in the molecule, and (D) a thermosetting component, wherein the dry film obtained by applying the composition has an absorbance of 0.3 to 1.2 per 25 μm of the film thickness at a wavelength of 350 to 375 nm.02-12-2009
20130087374CONDUCTIVE FILM WITH HIGH TRANSMITTANCE HAVING A NUMBER OF ANTI REFLECTION COATINGS, TOUCH PANEL USING THE SAME AND MANUFACTURING METHOD THEREOF - The present invention relates to a conductive film with high transmittance and having a number of anti reflection (AR) coated films, whereby transmittance of an ITO film can be improved by coating the number of anti reflection (AR) coating having a high refractivity and lower refractivity on the conductive film, and the present invention according to an exemplary embodiment can be advantageously applied to a touch panel of an ITO film/ITO film combination to obtain a clear image due to sufficient transmittance, wherein an exemplary embodiment of the present invention includes a conductive film formed with a transparent electrode pattern, and a number of anti reflection (AR)films formed on at least one surface of the conductive film to prevent optical reflection.04-11-2013
20090114434METHOD OF MANUFACTURING NON-SHRINKAGE CERAMIC SUBSTRATE AND NON-SHRINKAGE CERAMIC SUBSTRATE USING THE SAME - There is provided a method of manufacturing a non-shrinkage ceramic substrate, and a non-shrinkage ceramic substrate using the same. A method of manufacturing a non-shrinkage ceramic substrate by firing a ceramic laminate including an internal electrode circuit pattern according to an aspect of the invention may include: laminating at least one constraining ceramic sheet on each of the upper and lower surfaces of the ceramic laminate to form constraining layers; performing a primary firing process on the ceramic laminate having the constraining layers thereon; polishing the surface of the ceramic laminate from which the constraining layers are removed; forming ceramic paste on the polished surface of the ceramic laminate while exposing connection terminals of the internal electrode circuit pattern to the outside environment through openings in the ceramic paste; forming a surface electrode on the surface of the ceramic paste by patterning so that the surface electrode is electrically connected to the connection terminals; and performing a secondary firing process so that the surface electrode adheres to the ceramic paste.05-07-2009
20130056251WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE INCLUDING WIRING SUBSTRATE - A wiring substrate includes an inorganic substrate including a substrate body formed of an inorganic material, a wiring pattern formed on the substrate body, and an external connection terminal being electrically connected to the wiring pattern, an organic substrate that is formed below the inorganic substrate, the organic substrate including an insulating layer and a wiring layer formed on the insulating layer, and a bonding layer interposed between the inorganic substrate and the organic substrate, the bonding layer including a stress buffer layer and a penetration wiring that penetrates the stress buffer layer. A thermal expansion coefficient of the stress buffer layer is greater than a thermal expansion coefficient of the inorganic substrate and less than a thermal expansion coefficient of the organic substrate. The wiring pattern and the wiring layer are electrically connected by way of the penetration wiring.03-07-2013
20120217048ELECTRONIC MODULES HAVING GROUNDED ELECTROMAGNETIC SHIELDS - In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.08-30-2012
20090095515ELECTRO-DEPOSITED COPPER FOIL, SURFACE-TREATED COPPER FOIL USING THE ELECTRO-DEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE USING THE SURFACE-TREATED COPPER FOIL, AND A METHOD FOR MANUFACTURING THE ELECTRO-DEPOSITED COPPER FOIL - An object of the present invention is to provide an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and extremely large mechanical strength and a method for manufacturing the same. To achieve the object, the electro-deposited copper foil is formed by depositing fine copper crystal grains having a small deviation of grain-diameter that has never been obtained in the art. The electro-deposited copper foil has a low-profile and glossy surface and has extremely large mechanical strength expressed by a tensile strength as received of 70 kgf/mm04-16-2009
20090056993METHOD FOR FORMING CURED FILM - The invention provides a method for forming a cured film, comprising discharging an ink-jet ink, which comprises predetermined compounds, whose viscosity at 25° C. is approximately 150 to approximately 3,000 mPa·s, from an ink-jet head at a discharging temperature of approximately 80 to approximately 150° C., which has a low degree of spread of an ink-jet ink after landing, and which is able to form a highly-fine pattern.03-05-2009
20130062108WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes: a first wiring layer; a first insulating layer formed on the first wiring layer and including a reinforcing material therein, the first insulating layer having a first opening; a contact layer formed on the first insulating layer and having a second opening communicated with the first opening; and a second wiring layer comprising a second via and a second wiring pattern connected to the second via. The second wiring pattern is formed on the contact layer, and the second via is filled in the first and second openings. An adhesion property between the contact layer and the second wiring pattern is higher than that between the first insulating layer and the second wiring pattern, and a thickness of the contact layer is smaller than that of the first insulating layer.03-14-2013
20110011633MULTILAYER CIRCUIT BOARD AND MOTOR DRIVE CIRCUIT BOARD - A multilayer circuit board in which wirings are arranged so that the inductance thereof is reduced. A ground wiring and a power source wiring which are provided in a multilayer circuit board are arranged so that most of the wirings are superposed vertically along a direction of a longer side of the circuit board, and since currents flow in an opposite direction to each other in the portions which are superposed, magnetic fields generated by the currents so flowing are canceled by each other. Similarly, a W-phase wiring, a V-phase wiring and a W-phase wiring are also arranged so that the wirings are partially superposed along their longer side direction vertically, and magnetic fields generated by currents flowing in the portions which are superposed vertically are canceled by one another. By this, the inductance of the wirings can be reduced by increasing a mutual inductance between these wirings.01-20-2011
20090236133Method of Manufacturing a Polymer and Poymer Material - In order to provide a method of manufacturing a polymer containing an extremely small amount of residual unreacted monomer component, and a material using the polymer, megasonic is directly radiated to a polymer containing a residual unreacted monomer under an atmosphere free of oxygen and moisture to thereby perfectly complete polymerization.09-24-2009
20100044087PREPREG, PRINTED WIRING BOARD, MULTILAYER CIRCUIT BOARD, AND PROCESS FOR MANUFACTURING PRINTED WIRING BOARD - The invention relates to a prepreg, obtained by impregnating a base material with an epoxy resin composition containing an epoxy resin(A), a curing agent (B), an accelerator (C), a phenoxy resin (D), and an inorganic filler (E) and semi-hardening the impregnated material, wherein the inorganic filler (E) has an average particle diameter of 3 μm or less. When a circuit with a narrow wire distance is formed on a surface of a insulator substrate composed of such a prepreg by using a method of forming the circuit by plating process, an amount of the plating remaining on the insulator substrate surface at the circuit contour periphery can be reduced. As a result, it leads to stabilization of inter-circuit insulation resistance and increase in a yield during production of printed wiring boards.02-25-2010
20080230261Thermosetting Resin Composition and Use Thereof - A thermosetting resin composition contains a polyimide resin component (A) containing at least one polyimide resin, an amine component (B) containing at least one amine, an epoxy resin component (C) containing at least one epoxy resin, and an imidazole component (D) containing at least one imidazole.09-25-2008
20120111621RESIN COMPOSITION, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - An object of the present invention is to provide a resin composition having excellent impregnation property into a base material and capable of producing a prepreg, metal-clad laminate and printed wiring board excellent in properties such as low warpage, flame resistance, low thermal expansion properties, drill processability and desmear resistance. A first resin composition comprises an epoxy resin, an irregular-shaped first inorganic filler and a second inorganic filler having an average particle diameter of 10 to 100 nm which is different from that of the first inorganic filler. A second resin composition comprises an epoxy resin, silicone rubber particles having an average particle diameter of 1 μm to 10 μm, boehmite particles having an average particle diameter of 0.2 μm to 5 μm, and silica nanoparticles having an average particle diameter of 10 nm to 100 nm.05-10-2012
20120111619CIRCUIT SUBSTRATE AND MANUFACTURING METHOD OF CIRCUIT SUBSTRATE - A circuit substrate includes a substrate having a wiring formation surface formed in a planar shape; a primer resin layer formed on the wiring formation surface of the substrate and having a predetermined adhesive force with respect to the substrate; and a wiring layer formed on the primer resin layer, wherein the wiring layer is formed by removing a portion of the conductive ink, which contacts the wiring formation surface of the substrate coated so as to cover the primer resin layer by a removing unit, in which the adhesive force of a conductive ink with respect to the substrate is smaller than the adhesive force of the primer resin layer with respect to the substrate.05-10-2012
20120111618FLAME RETARDANT RESIN COMPOSITION FOR MULTILAYER WIRING BOARD AND MULTILAYER WIRING BOARD INCLUDING THE SAME - There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.05-10-2012
20110017500PRINTED WIRING BOARD, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE PRINTED WIRING BOARD - A printed wiring board is formed by performing cutting in a rectangular region having sides which are oblique to sides of a rectangular sheet material from the rectangular sheet material formed from glass cloth fibers. In the printed wiring board, at least one corner is cut out in a state in which the one corner extends off a cuttable region of the rectangular sheet material.01-27-2011
20100089627MULTILAYER THREE-DIMENSIONAL CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF - A multilayer three-dimensional circuit structure and a manufacturing method thereof are provided in the present invention. The manufacturing method includes following steps. First, a three-dimensional insulating structure is provided. A first three-dimensional circuit structure is then formed on a surface of the three-dimensional insulating structure. Next, an insulating layer covering the first three-dimensional circuit structure is formed. Thereafter, a second three-dimensional circuit structure is formed on the insulating layer. Subsequently, at least a conductive via penetrating the insulating layer is formed for electrically connecting the second three-dimensional circuit structure and the first three-dimensional circuit structure.04-15-2010
20110005820FULL PERIMETER CHEMICAL STRENGTHENING OF SUBSTRATES - Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.01-13-2011
20100276186PHOTOSENSITIVE INSULATING RESIN COMPOSITION, HARDENING PRODUCT THEREOF, AND CIRCUIT BOARD EQUIPPED THEREWITH - A photosensitive insulating resin composition capable of forming an interlayer insulating film, or planarized film, or surface protective film, or insulating film for high-density mount substrate excelling in properties, such as resolution, adherence, thermal impact, electrical insulation, patterning performance and elongation; a hardening product thereof; and a circuit board equipped with the hardening product. There is provided a positive photosensitive insulating resin composition comprising an alkali-soluble resin; a compound having a quinonediazido group; and crosslinked resin particles of a particulate copolymer whose 20 to 90 mol % constituent is derived from a hydroxylated and/or carboxylated monomer.11-04-2010
20100218984PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD - The present invention is to provide (i) a photosensitive dry film resist which allows water system development and which is excellent in resolution, flame retardancy, adhesiveness, moisture resistance, electric reliability, and preservation stability, (ii) a method for producing the photosensitive dry film resist, and (iii) usage thereof.09-02-2010
20100139961COMPOSITION FOR PRODUCING A BOARD AND PRINTED CIRCUIT BOARD USING THE SAME - A composition, including a liquid crystal polymer or oligomer having a terminal hydroxyl group, and a cross-linking agent including a bismaleimide compound, an epoxy resin or a combination thereof, wherein the liquid crystal polymer or oligomer is represented by Formula 1:06-10-2010
20110024168BIOMASS-DERIVED EPOXY RESIN COMPOSITION - A recyclable epoxy resin composition using a plant biomass in a resin skeleton and a cured material of the epoxy resin composition, and various types of products using them are provided.02-03-2011
20110278053DRY FILM AND MULTILAYER PRINTED WIRING BOARD - A dry film includes a supporting base film and a thin membrane of a thermosetting resin composition. The thin membrane of the thermosetting resin composition is formed on the supporting base film. The thermosetting resin composition includes a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. The solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. The semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10 A ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.11-17-2011
20110061915NOVEL RESIN COMPOSITION AND USE THEREOF - An object of the present invention is to provide: a (a) thermosetting resin composition, a photosensitive resin composition, a resin composition solution, a resin film, and an insulating film, each of which (i) is curable at a low temperature (not more than 200° C.), (ii) has excellent flexibility, electrical insulating reliability, solder heat resistance, and resistance to organic solvent, (iii) causes less warpage of a substrate after curing, and (iv) has excellent adhesiveness to a sealing agent; and a (b) printed wiring board provided with the insulating film mentioned above. The object of the present invention is attainable by using a thermosetting resin composition containing at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) thermosetting resin.03-17-2011
20100065317PREPREG WITH CARRIER AND PROCESS FOR MANUFACTURING SAME, MULTI-LAYERED PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - According to one aspect of the present invention, there is provided a prepreg with a carrier, comprising: a sheet-like base member; a first insulating resin layer provided to cover a surface of the sheet-like base member; a first carrier provided to cover the first insulating resin layer; a second insulating resin layer provided to cover a back surface of the sheet-like base member; and a second carrier provided to cover the second insulating resin layer, wherein the first and the second insulating resin layers have different resin compositions or the first and the second insulating resin layers have different thicknesses, and a front surface and a back surface of the prepreg with the carrier is visually identifiable.03-18-2010
20090205856Carboxylic Acid-Modified Bisphenol Epoxy Di(meth)acrylate - The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.08-20-2009
20090288863GLASS COMPOSITION WITH LOW COEFFICIENT OF THERMAL EXPANSION, GLASS FIBER, INSULATING LAYER OF PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD - The present invention relates to a glass composition having a low thermal expansion coefficient, a glass fiber, an insulating layer of printed circuit board and a printed circuit board. A glass fiber, an insulating layer of printed circuit board and a printed circuit board may be obtained by employing a glass composition including 40 to 60 parts by weight of silicon oxide, 20 to 40 parts by weight of aluminum oxide and 5 to 20 parts by weight of lithium oxide.11-26-2009
20090095514WIRING BOARD, SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THEM - There are provided steps of providing a dielectric layer and a wiring layer on a surface of a support to form an intermediate body, removing the support from the intermediate body to obtain a wiring board, and carrying out a roughening treatment over a surface of the support before the intermediate body forming step.04-16-2009
20110048776THERMOSETTING RESIN COMPOSITIONS AND ARTICLES - The present invention generally relates to a resin composition, a cured resin, a sheet-like cured resin, a laminated body, a prepreg, electronic parts, single and multilayer circuit boards comprising a cyanate ester polymer and condensed phosphate ester, for use in single and multilayer circuit boards that are especially useful in the high-frequency range of above 100 MHz.03-03-2011
20110272186PRINTED CIRCUIT BOARD WITH LOW PROPAGATION SKEW BETWEEN SIGNAL TRACES - A printed circuit board (PCB) is configured to minimize skew between two parallel signal trace portions. The PCB comprises a laminate layer, which includes a fiberglass weave and includes a plastic resin deposited on each face of the fiberglass weave to form a first face and second face of the laminate layer. The fiberglass weave comprises a first set of fiberglass bundles in a first orientation interwoven with a second set of fiberglass bundles in a second orientation. Moreover, the PCB comprises trace a layer that is coupled to the first face of the laminate layer, and includes two or more signal traces. Two parallel trace portions of the two or more signal traces are configured to have a matching orientation and separation distance to a neighboring fiberglass bundle of the fiberglass weave, thereby ensuring that the two parallel trace portions encounter matching dielectric constants from the laminate layer.11-10-2011
20090205855STIFFENER SHEET AND FLEXIBLE PRINTED CIRCUIT BOARD USING THE SAME - A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula:08-20-2009
20090205857PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME - A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and is formed of a linear polyolefin resin formed by hot-pressing a film shaped resin.08-20-2009
20100170708METHOD OF MANUFACTURING CAPACITOR-EMBEDDED LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE - A method of manufacturing a capacitor-embedded low temperature co-fired ceramic substrate. A capacitor part is manufactured by firing a deposition including at least one high dielectric ceramic sheet to form a capacitor part. A plurality of low temperature co-fired green sheets are provided. Each of the low temperature co-fired green sheet has at least one of a conductive pattern and a conductive via hole thereon. A low temperature co-fired ceramic deposition is formed by depositing the low temperature co-fired green sheets to embed the capacitor part in the low temperature co-fired ceramic deposition. The embedded capacitor part is connected either to the conductive pattern or the conductive via hole of an adjacent green sheet. Then the low temperature co-fired ceramic deposition having the capacitor part embedded therein is fired.07-08-2010
20110284277PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board including an insulation layer, a conductive circuit on the insulation layer, an outermost interlayer resin insulation layer formed on the insulation layer and the conductive circuit and having a via-conductor opening connected to the conductive circuit, a land structure including a first land formed on the outermost interlayer resin insulation layer around the via-conductor opening and a second land formed on the outermost interlayer resin insulation layer around the first land, and a via conductor formed in the via-conductor opening through the outermost interlayer resin insulation layer such that the first land of the land structure on the outermost interlayer resin insulation layer is connected to the conductive circuit on the insulation layer. The land structure has a space between the first land and second land of the land structure, and the first land of the land structure is directly connected to the via conductor.11-24-2011
20110278052HALOGEN-FREE FLAME-RETARDANT EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is a halogen-free flame-retardant epoxy resin composition for printed circuit board, which includes (A) a halogen-free epoxy resin; (B) a copolymer of styrene and maleic anhydride used as a first curing agent; (C) poly(1,3-phenylene methylphosphonate) used as a second curing agent; (D) a curing accelerator; and (E) an inorganic filler.11-17-2011
20110290545THROUGH WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A through wiring board provided with through wiring extending through the through hole of the board. The through wiring board comprises a through hole made through the board, through extension wiring provided in the through hole and extending on one side of the through wiring board up to a position at a predetermined distance from the through hole, and a conductive bump formed on the through extension wiring except the through hole position.12-01-2011
20110290544PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD - A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.12-01-2011
20110290543METHOD FOR PRODUCING WIRING BOARD AND WIRING BOARD - The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing board, including coating a surface of a metal substrate, which is made of an aluminium plate, with a composition containing a substance having a polysiloxane structure and inorganic particles having insulating and heat-dissipating properties, curing the composition, then bonding a copper foil to the cured composition, and partially removing the copper foil, thereby forming a wiring layer.12-01-2011
20110005821METHOD FOR MANUFACTURING LAMINATED CIRCUIT BOARD - A method for manufacturing a circuit board featuring conductive patterns, said method comprising the following steps of:01-13-2011
20090283307SILICON NITRIDE SUBSTRATE, SILICON NITRIDE CIRCUIT SUBSTRATE USING THE SAME, AND ITS USE - Provided are a silicon nitride substrate and a silicon nitride circuit board with excellent electrical characteristics, and power control parts utilizing them.11-19-2009
20120097439MODIFIED POLYIMIDE AND METHOD FOR PRODUCING MODIFIED POLYIMIDE - The present invention discloses a method of producing a modified polyimide comprising a polycarbonate, which modified polyimide has excellent electric properties and adhesion as well as excellent heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; and the modified polyimide. Also disclosed are a composition comprising the modified polyimide and used thereof. According to the method in which an isocyanate-terminated oligomer comprising a polycarbonate component having excellent flexibility is allowed to react with a tetracarboxylic dianhydride to synthesize a tetracarboxylic dianhydride oligomer comprising the polycarbonate component and the thus obtained oligomer is then further allowed to react with an aromatic diamine and aromatic tetracarboxylic dianhydride to produce a polyimide block copolymer, by selecting the aromatic diamine from a wide range of selectable aromatic diamines, an excellent modified polyimide satisfying all of the above-described various characteristics can be produced.04-26-2012
20120097438Printed Circuit Board and Method For Fabricating The Same - Disclosed herein is a method for fabricating a printed circuit board, including: stacking a second insulating layer including a reinforcement on an outer surface of a first insulating layer having a post via formed thereon; polishing an upper surface of the second insulating layer to expose an upper side of the post via; stacking a film member on the second insulating layer to cover the post via and compress the second insulating layer; polishing an upper surface of the film member to expose an upper side of the post via; and forming a circuit layer connected to the post via on the upper surface of the film member.04-26-2012
20120097437Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same - A resin composition is provided. The resin composition comprises: 04-26-2012
20110214910WIRING SUBSTRATE WITH CUSTOMIZATION LAYERS - One or more customization layers can be added to a wiring substrate. The customization layers can provide customized electrical connections from electrical contacts of the base wiring substrate to electrical contacts at an outer surface of the customization layers, which can allow the contacts at the outer surface of the customization layers can be in a different pattern than the contacts at the surface of the base wiring substrate. The customization layers can comprise electrically insulating material, electrically conductive via structures through the insulating material, electrically conductive traces, electrically conductive jumpers electrically connecting two traces without contacting a trace disposed between the two traces, and/or other such elements. A jumper can be formed by making a relatively small deposit of electrically insulating material between the two traces to be connected and then making a relatively small deposit of electrically conductive material on parts of the two traces and the insulating material. Via structures can be coupled to traces and an insulating material can be cast around the via structures. Alternatively, via structures can be formed in openings with sloped side walls in an insulating layer.09-08-2011
20120186864WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board and a method for manufacturing the wiring board reinforced by means of a resin is provided. Embodiments of the wiring board allow for reliable attachment of a connection member, like a socket, to a terminal member. For example, a base of terminal pins is put on pin grid array (PGA) terminal pads, and a bonding material paste including solder and an electric insulation material made of a resin is placed on each of the PGA terminal pads. The bonding material paste is then heated to fuse the solder and soften the electric insulation material. Subsequently, the bonding material paste is cooled to solidify the solder and bond each of the bases to a corresponding PGA terminal pad and form an electric insulation surface layer on an exposed surface of each of solder junctions to which the respective bases are bonded.07-26-2012
20090314532THERMOSETTING RESIN COMPOSITION, DRY FILM INCLUDING THERMOSETTING RESIN COMPOSITION, AND MULTILAYER PRINTED WIRING BOARD INCLUDING THERMOSETTING RESIN COMPOSITION - A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.12-24-2009
20090188708PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME - A method of manufacturing a multilayer printed circuit board including preparing a substrate board having a conductor circuit formed over the substrate board, forming an interlayer resin insulating layer on the conductor circuit formed over the substrate board by press laminating on the conductor circuit a film comprising a cycloolefin resin under vacuum or reduced pressure, and forming a via hole connecting to the conductor circuit through the resin insulating layer, the forming of the via hole including plating the via hole to fill up.07-30-2009
20120024580EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.02-02-2012
20090151990MULTILAYER WIRING BOARD AND METHOD OF MAKING THE SAME - A multilayer wiring board includes a core insulating layer with a first conductive wiring, a first insulating layer with a softening temperature lower than the core insulating layer, and a second insulating layer formed on the core insulating layer through the first insulating layer, the second insulating layer with a second conductive wiring electrically connected to the first conductive wiring and a softening temperature higher than the first insulating layer. The first insulating layer is mainly formed of a liquid crystal polymer. The core insulating layer and the second insulating layer are mainly formed of a polyimide resin or a bismaleimide triazine resin. The first conductive wiring and the second conductive wiring are electrically connected through a conductive via formed penetrating through the first insulating layer and the second insulating layer in a thickness direction.06-18-2009
20090145641COMBINING DISCRETE ELECTRONIC ELEMENTS WITH PRINTED ELECTRONIC CIRCUITS - A method of printing electronic circuits uses pattern recognition to detect locations of interconnects on electronic components oriented on a substrate such that the interconnects face away from the substrate, the interconnects having ramps between the interconnects and the substrate, adjusts routing paths as needed based upon a difference between an intended placement and an actual placement of the electronic components, and generates a new image file for printing with adjusted routing paths. A device has at least one electronic component having interconnects, a ramp from a surface of the substrate to the interconnects, wherein the ramp is formed of one of either a polymer or an adhesive, a printed, conductive path on the ramp providing electrical connection to at least one of the interconnects.06-11-2009
20100084173CERAMIC POWDER FOR A GREEN SHEET AND MULTILAYER CERAMIC SUBSTRATE - Provided is a ceramic powder for a green sheet that gives a low-temperature fired ceramic substrate that can be fired at a temperature of 900° C. or lower and has excellent dielectric properties in the higher frequency bands such as microwave and millimeter-wave bands, has a low hygroscopicity, and has minor warping and creasing even in the case of co-firing with a silver-based conductor paste, the ceramic powder for a green sheet including a glass powder and an alumina powder, in which the glass powder contains 35 to 39% by weight of SiO04-08-2010
20100078203LOW INDEX METAMATERIAL - Various aspects of the disclosure provide low index metamaterials. The low index metamaterials may be used to form soft and/or hard electromagnetic (EM) boundaries to facilitate desired EM performance or propagation in applications including feed horns, spatial feed/combiners, isolation barriers between antennas or RF modules, and reduced radar cross-section applications. In one aspect, a low index metamaterial comprises a dielectric layer and a plurality of conductors on a surface of the dielectric layer, embedded in the dielectric layer or both, wherein the low index metamaterial appears as a medium having a dielectric constant less than one with respect to electromagnetic waves at predetermined frequencies and propagating at grazing angles with respect to a surface of the low index metamaterial.04-01-2010
20100122840MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board including a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having a first surface and a second surface on an opposite side of the first surface, a first conductor layer including conductor circuits formed on the first surface of the core structure, and a second conductor layer including conductor circuits formed on the second surface of the core structure. The core structure includes a first via hole and a second via hole, the first via hole and the second via hole sandwich one or more conductor circuits in the core substrate and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and the second conductor layers, and the first via hole and the second via hole are deviated from each other in a vertical direction.05-20-2010
20090277673PCB having electronic components embedded therein and method of manufacturing the same - Provided is a PCB having electronic components embedded therein, the PCB including a core layer having electronic components embedded therein and a resin layer formed thereon and thereunder; internal layer circuits formed on the resin layer and being electrically connected to the electronic components; an insulating layer formed on the internal layer circuits; and external layer circuits formed on the insulating layer and being electrically connected to the internal layer circuits.11-12-2009
20090283309CERAMIC-METAL BONDED BODY, METHOD FOR MANUFACTURING THE BONDED BODY AND SEMI-CONDUCTOR DEVICE USING THE BONDED BODY - Problem is to provide a ceramic-metal composite and a semiconductor device that exhibits high bonding strength, heat cycle resistance, durability, and reliability even if the ceramic-metal composite is used in a power module.11-19-2009
20130098669WIRING SUBSTRATE AND MANUFACTURING METHOD FOR WIRING SUBSTRATE - A wiring substrate includes: a plate-like base material containing carbon fibers; a wiring layer formed on a surface of the base material; a first via including a first through hole penetrating through the base material, a first resin layer formed on an inner wall of the first through hole and including a second through hole, and a first conductive layer formed on an inner wall of the second through hole; and a second via including a third through hole penetrating through the base material and a second conductive layer formed on an inner wall of the third through hole, wherein an inside diameter of the third through hole is greater than an inside diameter of the second through hole.04-25-2013
20090277674Printed circuit board and manufacturing method thereof - A printed circuit board and a manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board can include: forming surface roughness on an insulation layer, coating a chemical compound onto the insulation layer that lowers the surface energy of the insulation layer, and forming a circuit pattern by inkjet printing on the insulation layer coated with the chemical compound. Certain embodiments of the invention can be utilized to improve adhesive strength between the insulation layer and the inkjet-printed circuit patterns, suppress spreading in the inkjet-printed circuit patterns to improve resolution, and reduce manufacturing costs by forming the circuits using inkjet printing.11-12-2009
20090283308Curable Resin Composition and Use Thereof - A curable resin composition comprising an insulating polymer such as an alicyclic olefin polymer, a curing agent, and an inorganic filler, wherein the inorganic filler is silica particles whose surface is bound with 0.1 to 30% by weight, based on the weight of the silica particles, of an alkoxy group-containing silane-modified resin (I) whose weight average molecular weight is 2,000 or more; a shaped material formed by shaping the curable resin composition; and a multilayer printed circuit board obtained by thermally compressing and curing the shaped material on a substrate having a conductor layer on its surface to form an electrically insulating layer.11-19-2009
20090283310MULTI CAP LAYER AND MANUFACTURING METHOD THEREOF - A method of manufacturing a cap layer includes providing a substrate having at least a conductive layer, a base layer and a dielectric layer; forming a tensile stress cap layer on the substrate; forming a patterned hard mask layer o the tensile stress cap layer; and performing an etching process to each the tensile stress cap layer through the patterned metal hard mask layer to form at least an opening in the tensile stress cap layer.11-19-2009
20090294161CORE SUBSTRATE AND PRINTED WIRING BOARD - The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched between the insulating layers containing glass fibers. The insulating layers serve to suppress an increase in the thickness of the core layer resulting from the thermal expansion of the core layer. Thermal stress is suppressed in the core substrate.12-03-2009
20090038833SILICON COMPOUND, ULTRAVIOLET ABSORBENT, METHOD FOR MANUFACTURING MULTILAYER WIRING DEVICE AND MULTILAYER WIRING DEVICE - A layer of a porous insulating film precursor is formed on or over a substrate, a layer of a specific silicon compound is then formed, this silicon compound layer is pre-cured as necessary, and the porous insulating film precursor is exposed to UV through the silicon compound layer or pre-cured layer.02-12-2009
20090266591Prepreg and printed wiring board using thin quartz glass cloth - It is an object of the present invention to provide a high frequency-capable printed wiring board material reduced in the dielectric loss tangent, weight, thickness and cost without compromising the workability, and provide electronic components using the same. The present invention provides a prepreg obtained by using a quartz glass cloth composed of low-density quartz glass fibers as a base material and impregnating the cloth with a thermosetting resin composition having a low dielectric loss tangent, and provides electronic components using a cured product of the prepreg as an insulating layer.10-29-2009
20090166068ELECTRONIC COMPONENT - An electronic component includes: a multilayer ceramic substrate that has a penetration electrode formed therein, and has a passive element provided on the upper face thereof; an insulating film that is provided on the multilayer ceramic substrate, and has an opening above the penetration electrode; a first connecting terminal that is provided on the insulating film so as to cover the opening, and is electrically connected to the penetration electrode; and a second connecting terminal that is provided on a region of the insulating film other than the opening region.07-02-2009
20080283282MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - Through holes 11-20-2008
20130118788POLYIMIDE PRECURSOR COMPOSITION, AND WIRING CIRCUIT BOARD EMPLOYING THE COMPOSITION - A polyimide precursor composition comprises (A), and at least one of (B) and (C), (B) and (C) being present in a proportion of 30-100 parts by weight based on 100 parts by weight of (A): 05-16-2013
20120292086INTERPOSER FILMS USEFUL IN SEMICONDUCTOR PACKAGING APPLICATIONS, AND METHODS RELATING THERETO - An interposer film for IC packaging is disclosed. The interposer film comprises a substrate that supports a plurality of electrically conductive domains. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.11-22-2012
20100139960Printed circuit board having plating pattern buried in via and method of manufacturing the same - Disclosed is a printed circuit board having a plating pattern buried in a via and a method of manufacturing the same. The method of manufacturing the printed circuit board includes forming a negative pattern for forming a plating pattern, thus remarkably reducing the generation of plating thickness deviation in a plating process for forming a circuit pattern, and the printed circuit board has improved electrical signal transmission properties.06-10-2010
20110005818PROJECTED CAPACITIVE TOUCH PANEL AND FABRICATING METHOD THEREOF - A touch panel and a fabricating method thereof are provided. The touch panel includes: a substrate; a first conductive layer configured on the substrate and having a first and a second portions; an insulating layer covering the first portion; and a second conductive layer having a third portion configured on the second portion, and a fourth portion configured on the insulating layer and being separate from the third portion. The fabricating method includes the steps of: providing a first conductive layer; forming an insulating layer partially covering the first conductive layer; and forming a second conductive layer having a first pattern coupled to the first conductive layer and a second pattern insulated from the first pattern on the insulating layer.01-13-2011
20090183904PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME - A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.07-23-2009
20090250253Printed circuit board and manufacturing method thereof - Disclosed are a printed circuit board and a manufacturing method thereof. The method of manufacturing a printed circuit board in accordance with an embodiment of the present invention includes: providing a first resin layer having a first pattern on one surface thereof; forming a conductive bump, which is electrically connected to the first pattern, on one surface of the first resin layer; compressing an insulation layer and the first resin layer such that the conductive bump passes through the insulation layer; laminating a second resin layer, which has a second pattern on a surface thereof facing the insulation layer, on the insulation layer; and forming an opening by etching a part of at least one of the first resin layer and the second resin layer.10-08-2009
20120138349SYSTEM TO IMPROVE CORELESS PACKAGE CONNECTIONS AND ASSOCIATED METHODS - A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent at least some of the connection members and respective ball grid array pads to increase respective connection members' inductance.06-07-2012
20120067633MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board including a core substrate, lower interlayer resin insulating layers formed on the surfaces of the core substrate, respectively, through-hole conductors formed in penetrating holes penetrating through the core substrate and the lower interlayer resin insulating layers, conductor circuits formed on the lower interlayer resin insulating layers, respectively, upper interlayer resin insulating layers formed on the conductor circuits and the lower interlayer resin insulating layers, respectively and via hole conductors formed in the upper interlayer resin insulating layers and positioned on the through-hole conductors, respectively.03-22-2012
20120067632PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a printed wiring board including forming an insulative resin layer containing a resin and an inorganic filler, forming a conductor layer including a conductive material and having a conductor on the insulative resin layer, irradiating a laser beam upon the conductor of the conductor layer such that the conductor is sectioned or a width of the conductor is narrowed, and forming a conductive pattern on the insulative resin layer. The inorganic filler is in an amount of 30 wt. % or more of the insulative resin layer.03-22-2012
20090200071RESIN COMPOSITION, PREPREG, LAMINATE, AND WIRING BOARD - To provide a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, a prepreg, a laminate, and a wiring board.08-13-2009
20110226514ELECTRONIC DEVICE AND POWER CONVERTER - An electronic device includes an electronic component provided with leads. A printed circuit board has a front surface and a back surface and is provided with through holes and a groove hole. The through holes are capable of receiving the leads, respectively. The groove hole is formed so as to cross straight lines that connect the through holes. A first insulating spacer is provided on the groove hole between the leads so as to isolate the leads from each other and is positioned between the electronic component and the front surface of the printed circuit board. A second insulating spacer is inserted through the groove hole from the back surface of the printed circuit board and engages with the first insulating spacer so as to isolate end portions of the leads from each other.09-22-2011
20090084590CIRCUIT BOARD - A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.04-02-2009
20110139499Printed circuit board and manufacturing method of the same - A printed circuit board the includes: an insulation layer; a first circuit pattern including a first electrode pad buried in the insulation layer such that a portion of the first circuit pattern is exposed at a surface of the insulation layer; an inner substrate having the insulation layer stacked therein and having a second circuit pattern including a second electrode pad formed thereon; a conductive post buried in the insulation layer such that one end thereof is connected to the first electrode pad and the other end thereof is connected to the second electrode pad; and a solder resist layer stacked on the insulation layer.06-16-2011
20090229868PRINTED WIRING BOARD WITH REINFORCED INSULATION LAYER AND MANUFACTURING METHOD THEREOF - A printed wiring board is manufactured by a method in which a core substrate having an insulation substrate and a conductive circuit formed on the insulation substrate is provided. An inner insulation layer is formed on the core substrate, and a surface of the inner insulation layer is treated to form a roughened portion on the surface. An outer insulation layer including a reinforcing material is formed on the surface of the inner insulation layer having the roughened portion.09-17-2009
20090229869Wiring board and method of making the same - In a method of making a multilayer wiring board having a substrate and a wiring pattern formed in the substrate, base films are stacked in a predetermined direction to form a stacked film structure. Each base film includes thermoplastic resin. Pressure and heat are applied to the stacked film structure from its both sides in the stacked direction so that the base films are joined together to form the substrate. At least one of the base films is a combined film including a fiber sheet. Both sides of the fiber sheet are covered with the thermoplastic resin in such a manner that air space remains in the fiber sheet.09-17-2009
20090242248Insulating sheet and printed circuit board having the same - A method of manufacturing an insulating sheet can include: providing a reinforcement material on which a thermoplastic resin layer is stacked, stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate, and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate. This method can be used to produce an insulation board that has a coefficient of thermal expansion close to that of the semiconductor chip, and thereby prevent bending or warpage in the printed circuit board using the insulation board. Furthermore, the stress in the connecting material can be reduced, so that cracking or delamination in the connecting material may be avoided, while heat-releasing performance may also be improved.10-01-2009
20100147569COMPONENT-EMBEDDED PRINTED WIRING BOARD - A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.06-17-2010
20100147570CIRCUIT SUBSTRATE AND CIRCUIT SUBSTRATE MANUFACTURING METHOD - A circuit substrate includes protruding terminals and has a structure that ensures an excellent connection with an electronic component, such as an IC. The circuit substrate on which an IC is to be mounted includes terminals that are to be electrically connected to solder bumps located on the IC. The terminals protrude from the mounting surface of a substrate body on which the IC is to be mounted. The sectional area of the top surface of each of the terminals is about 1.2 times the sectional area of each of the terminals on the mounting surface.06-17-2010
20120103670Articles Having A Compositional Gradient And Methods For Their Manufacture - Articles comprising a composition comprising a polymeric binder and at least one carbonaceous filler, wherein the article has a compositional gradient such that the concentration of the filler is increased or decreased in at least one direction in the article. Methods for their preparation and structures comprising the articles are also described.05-03-2012
20100187000METHOD FOR THE PRODUCTION OF A CERAMIC MULTILAYER CIRCUIT ARRANGEMENT, AND MULTILAYER CIRCUIT ARRANGEMENT PRODUCED USING SAID METHOD - A method for producing a ceramic multilayer circuit system, and a corresponding multilayer circuit system are provided. An embodiment of the method includes sequential deposition of a plurality of circuit layers of the multilayer circuit system on a substrate using a powder spray method; pressing of the deposited plurality of circuit layers; and thermal sintering of the pressed plurality of circuit layers. The individual circuit layers have electrically conductive areas made of at least one conductive material and electrically insulating areas made of at least one ceramic material.07-29-2010
20100187001NOVEL POLYIMIDE RESIN AND PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION - A novel polyimide resin is formed by imidizing a diamine component including an amide group-containing siloxane diamine compound represented by the following formula (1) and an acid dianhydride component including an aromatic acid dianhydride such as 3,3′,4,4′-diphenylsulfone tetracarboxylic dianhydride. This novel polyimide resin utilizes a novel polyimide resin into which a reaction group capable of reacting with a crosslinking agent to form a crosslinking point is pre-introduced before imidization. The novel polyimide resin can confer a comparatively low elastic modulus and heat resistance to a dry film or a photosensitive cover film formed from a photosensitive polyimide resin composition containing the novel polyimide resin.07-29-2010
20100193227PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A printed wiring board including a first insulating layer, a second insulating layer formed over the first insulating layer, a capacitor portion including an upper electrode, a lower electrode and a ceramic high dielectric layer formed between the upper electrode and the lower electrode, the capacitor portion sandwiched by the first insulating layer and the second insulating layer, an upper electrode connecting portion passing through the capacitor portion without contact and through the second insulating layer and electrically connected to the upper electrode of the capacitor portion, and a lower electrode connecting portion passing through the second insulating layer and the upper electrode of the capacitor portion without contact and electrically connected to the lower electrode in contact.08-05-2010
20100236820PREPREG HAVING UNIFORM PERMITTIVITY, AND METAL CLAD LAMINATES AND PRINT WIRING BOARD USING THE SAME - A prepreg, and a metal clad laminate and printed wiring board including the prepreg. The prepreg includes a substrate and a liquid crystal polymer resin impregnated into the substrate, and has a surface roughness in a range of 0.1 to 5.0 μm on one or both surfaces thereof.09-23-2010
20100276187MULTILAYER PRINTED WIRING BOARD AND MOUNTING BODY USING THE SAME - A multilayer printed wiring board (11-04-2010
20080314629MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein.12-25-2008
20100212944Silane Coupling Agents for Printed Circuit Boards - The present invention is directed to silane coupling agents for printed circuit boards, such as high-temperature printed circuit boards (PCBs), a process for synthesizing the silane coupling agent, and PCBs with such coupling agents. The silane coupling agent is defined by the following formula:08-26-2010
20100252310COMPOSITE FOR MULTILAYER CIRCUIT BOARD - A crosslinkable and polymerizable composition containing a monomer and a cross-linking agent is applied onto a metal foil to form a coated film of the composition, and heat is applied to the coated film to firstly bulk polymerize the entire coated film of the crosslinkable and polymerizable composition. Then, by applying heat to the coated film from the metal foil side, cooling a surface far from the metal foil as needed, and subjecting a limited region adjacent to the metal foil in the thickness direction of the coated film to a cross-linking reaction, a composite for multilayer circuit board is obtained, in which the metal foil layer, a hard resin layer containing a hard resin obtained by bulk polymerization reaction and cross-linking reaction, and an adhesive resin layer containing an adhesive resin obtained by bulk polymerization reaction are laminated in this order.10-07-2010
20100243305SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.09-30-2010
20090321117A CURABLE EPOXY RESIN COMPOSITION HAVING A MIXED CATALYST SYSTEM AND LAMINATES MADE THEREFROM - A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; and (c) a catalytic amount of a catalyst system comprising a combination of: (i) at least a first catalyst compound comprising at least one nitrogen-containing catalyst compound; and (ii) at least a second catalyst compound comprising at least one phosphorus-containing catalyst compound; wherein at least one or more of the above components (a)-(c) is halogenated or contains halogen; or if none of the above components are halogenated wherein the resin composition includes (d) a halogenated or halogen-containing flame retardant compound that does not contain nitrogen. The stroke cure gel time of the resin composition is maintained from 90 seconds to 600 seconds when measured at 170° C.; and the cured product formed by curing the curable epoxy resin composition contains well-balanced properties. The composition may be used to obtain a prepreg or a metal-coated foil, or a laminate by laminating the above prepreg and/or the above metal-coated foil. The laminate shows a combination of superior glass transition temperature, decomposition temperature, time to delamination at 288° C., adhesion to copper foil, and excellent flame retardancy.12-31-2009
20090229870BLOCK COPOLYMERIZED POLYIMIDE INK COMPOSITION FOR PRINTING - The object is to provide a polyimide ink composition having good printing properties and good continuous printing properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low modulus of elasticity, flexibility, resistance to warping, chemical resistance, adhesiveness with substrates, and plating resistance. This object is accomplished by a polyimide ink composition for printing, comprising a mixed solvent containing an benzoic acid ester solvent and a glyme solvent, and a polyimide soluble in the mixed solvent; wherein the polyimide is obtained by polycondensing a polyimide oligomer with a tetracarboxylic dianhydride component(s) and/or a diamine component(s) having no siloxane bond in molecular skeleton thereof, the polyimide oligomer being prepared by polycondensing a tetracarboxylic dianhydride component(s) and a diamine component(s) having siloxane bonds in molecular skeleton thereof in the presence of a base catalyst(s), or a mixed catalyst including a lactone(s) and/or an acidic compound(s) and a base(s); the content of the diamine component(s) having siloxane bonds based on the total diamine components being 15 to 85% by weight.09-17-2009
20090145642POWER ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, POWER ELEMENT MOUNTING UNIT, METHOD OF MANUFACTURING THE SAME, AND POWER MODULE - A power element mounting substrate including a circuit layer brazed to a surface of a ceramic plate, and a power element soldered to a front surface of the circuit layer, wherein the circuit layer is constituted using an Al alloy with an average purity of more than or equal to 98.0 wt % and less than or equal to 99.9 wt %, Fe concentration of the circuit layer at a side of a surface to be brazed to the ceramic plate is less than 0.1 wt %, and Fe concentration of the circuit layer at a side of the surface opposite to the surface to be brazed is more than or equal to 0.1 wt %.06-11-2009
20090071700WIRING BOARD WITH COLUMNAR CONDUCTOR AND METHOD OF MAKING SAME - A wiring board with a columnar conductor includes a wiring board defined by a multilayer ceramic board, a columnar conductor on an upper surface of the wiring board, and an insulating support portion arranged to support a side of the columnar conductor and having an external shape that expands from a tip of the columnar conductor toward the wiring board.03-19-2009
20090107711PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD - A multilayer printed circuit board has an insulation layer, a first conductor layer provided over a first side of the insulation layer, a second conductor layer provided over a second side of the insulation layer opposite to the first side, and multiple filled vias electrically connecting the first conductor layer and the second conductor layer. The filled vias have upper surfaces, respectively, and each of the upper surfaces is made such that a difference between a lowest point and a highest point of each of the upper surfaces is less than or equal to about 7 μm.04-30-2009
20090107710Differential trace profile for printed circult boards - Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the surface area of the conductors, and therefore enhance the ability of the conductors to carry high-speed signals. In at least some embodiments, a discontinuity also exists between the dielectric constant within the channels and just outside the channels, which is believed to reduce signal loss into the dielectric material.04-30-2009
20100294548EPOXY RESIN COMPOSITION, PREPREG, AND METAL-CLAD LAMINATE AND MULTILAYERED PRINTED WIRING BOARD - The present invention provides an epoxy resin composition exhibiting good workability in drilling, molding, and desmearing as well as good interlayer adhesion strength. This epoxy resin composition comprises an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin is composed of a dicyclopentadiene-based epoxy resin and a novolac-based epoxy resin. The curing agent is a biphenyl-based phenol resin. The inorganic filler is composed of aluminum hydroxide and granular silica having an epoxy-silane treated surface. The epoxy resin composition contains 20 to 50% by weight of the granular silica. The epoxy resin composition contains 2 to 15% by weight, based on total weight of granular silica, of the aluminum hydroxide.11-25-2010
20100300736COMPOSITE MULTI-LAYER SUBSTRATE AND MODULE USING THE SUBSTRATE - A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.12-02-2010
20100294549METHOD FOR MAKING A COMPONENT HAVING AN ELECTRONIC FUNCTION - The disclosure relates to a method for making multi-material three-dimensional components providing a mechanical link between thin layers. To this end, the disclosure provides a method for making a multi-material three-dimensional component that includes at least first and second materials. The method includes making at least two superimposed printed layers along discrete space routes of a printing travel, the printed layers being made by the contactless deposition of localised impacts of printing droplets, and a homogenous printed layer includes at least the first material, with the second material being excluded, while at least one mixed printed layer includes the first material, and at least the second material.11-25-2010
20100307804METHOD FOR CONNECTING A PRECIOUS METAL SURFACE TO A POLYMER - The invention relates to a method for connecting a precious metal surface to a polymer, wherein a layer made of 20% to 40% gold and 80% to 60% silver is deposited on a substrate and the silver is subsequently selectively removed in order to produce a nanoporous gold layer. A fluid polymer is applied to the gold layer and cured.12-09-2010
20110127076ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an electronic component-embedded printed circuit board, including: a base plate having a cavity formed therein in a thickness direction thereof; an electronic component which is disposed in the cavity such that an active surface of the electronic component is flush with one side of the base plate; an insulating material layer which is formed on the other side of the base plate to bury the electronic component; and a first circuit layer which is formed on one side of the base plate and includes connection patterns coming into contact with connecting terminals of the electronic component, and a method of manufacturing the same. The electronic component-embedded printed circuit board is advantageous in that the active surface of an electronic component is disposed such that it is flush with one side of a base plate, so that additional viaholes do not need to be formed, with the result that a laser process requiring high cost can be omitted, thereby simplifying the manufacturing process of a printed circuit board and reducing the manufacturing cost thereof.06-02-2011
20100243304SOLDER RESIST, DRY FILM THEREOF, CURED PRODUCT, AND PRINTED WIRING BOARD - A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.09-30-2010
20110000704Printed Circuit Board and Method of Manufacturing the Same - Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.01-06-2011
20110024167Multilayer Circuit Board - A multilayer circuit board comprising low inductance through-conductors is disclosed. The multilayer circuit board comprises first ceramic substrate means, first layered section means, and second ceramic substrate means that allow insulation layers to be substantially thin, a length of through-conductors to be substantially short, and low relative permittivity of the insulation layers compared to resin insulation layers. Thus, increases in operation frequency of the multilayer circuit board are possible.02-03-2011
20110127077BLOCK COPOLYMERIZED POLYIMIDE INK COMPOSITION FOR PRINTING - The object is to provide a polyimide ink composition having good printing properties and good continuous priming properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low modulus of elasticity, flexibility, resistance to warping, chemical resistance, adhesiveness with substrates, and plating resistance. This object is accomplished by a polyimide ink composition for printing, comprising a mixed solvent containing an benzoic acid ester solvent and a glyme solvent, and a polyimide soluble in the mixed solvent; wherein the polyimide is obtained by polycondensing a polyimide oligomer with a tetracarboxylic dianhydride component(s) and/or a diamine component(s) having no siloxane bond in molecular skeleton thereof, the polyimide oligomer being prepared by polycondensing a tetracarboxylic dianhydride component(s) and a diamine component(s) having siloxane bonds in molecular skeleton thereof in the presence of a base catalyst(s), or a mixed catalyst including a lactone(s) and/or an acidic compound(s) and a base(s); the content of the diamine component(s) having siloxane bonds based on the total diamine components being 15 to 85% by weight.06-02-2011
20110024169SILICON NANOWIRE ARRAYS ON AN ORGANIC CONDUCTOR - In an aspect of the invention, a process to make a nanowire array is provided. In the process, silicon is deposited onto a conductive substrate comprising an organic material and optionally a conductive layer, thus forming a silicon-containing layer. Nanoparticles are deposited on top of the silicon-containing layer. Metal is deposited on top of the nanoparticles and silicon in such a way that the metal is present and touches silicon where etching is desired and is blocked from touching silicon or not present elsewhere. The metallized substrate is contacted with an etchant aqueous solution comprising about 2 to about 49 weight percent HF and an oxidizing agent.02-03-2011
20110024170Circuit Substrate and Structure Using the Same - A circuit substrate comprises a base and conductive layers disposed on lower and upper surfaces of the substrate. The base includes resin layers and the conductive layers overlapping with each other in a plan view. The resin layers include first resin layers and a second resin layer interposed between the first resin layers. The first resin layer has a filler and the second resin layer has no filler or a filler whose amount is 1 volume % or less and smaller than an amount of the filler in the first resin layer.02-03-2011
20110127075INTERLAYER INSULATING FILM, WIRING STRUCTURE, AND METHODS OF MANUFACTURING THE SAME - An insulative coat film comprising one or two or more kinds of oxides having a dielectric constant (k) of 2.5 or smaller and expressed by a general formula of ((CH06-02-2011
20100132989NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF - An object of the present invention is to provide a polyimide precursor composition solution that (i) uses no siloxane diamine, (ii) is curable at low temperature (not more than 250° C.) and (iii) has low viscosity regardless of its high concentration, and a photosensitive resin composition, photosensitive resin film, a thermosetting resin composition, a polyimide insulating film, and a printed wiring board with an insulating film, each of which has good physical properties and is obtained by use of the polyimide precursor composition solution. The foregoing object is attained by using a polyimide precursor composition solution which includes at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) diamino compound and/or isocyanate compound.06-03-2010
20110017501COMPOSITE MATERIAL AND MANUFACTURING METHOD THEREOF - This invention provides a composite material useful for size reduction of electronic components and circuit boards mounted on electronic equipment and exhibiting a low magnetic loss (tan δ), and a manufacturing method thereof. The composite material contains an insulating material and particulates dispersed in this insulating material, the particulates being previously coated with an insulating material having substantially the same composition as that of the coating insulating material. The particulates consist of an organic or inorganic substance and preferably have a flat shape. The insulating material may be an insulating material commonly used in the field of electronic components. The composite material of the invention is preferably manufactured by a manufacturing method in which the particulates are previously coated with an insulating material and dispersed in an insulating material having substantially the same composition as that of the coating insulating material. The composite material of the invention can be applied as a material for circuit boards and/or electronic components to realize further reduction in size and power consumption of information and telecommunication equipment in a frequency band of several hundred MHz to 1 GHz.01-27-2011
20110083888Noise Coupling Reduction and Impedance Discontinuity Control in High-Speed Ceramic Modules - An improved multi-layered ceramic package comprises: a plurality of signal layers, each having one or more signal lines; a plurality of vias, each providing one of a voltage (Vdd) power connection or a ground (Gnd) connection; at least one reference mesh layer adjacent to one or more signal layers; and a plurality of via-connected coplanar-type shield (VCS) lines, with a first VCS line extending on a first side of a first signal line within the plurality of signal layers and a second VCS line extending on a second opposing side of the first signal line. Each of the plurality of VCS lines interconnect with and extend past one or more vias that are located along the directional path in which the VCS lines runs. The placement of the VCS lines relative to the signal lines reduces coupling noise and controls impedance discontinuity in the ceramic package.04-14-2011
20100155121SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The silica film forming material of the present invention comprises a silicone polymer which comprises, as part of its structure, CHx, an Si—O—Si bond, an Si—CH06-24-2010
20110240353METHOD FOR PRODUCING LIQUID-CRYSTALLINE POLYESTER POWDER - The present invention provides a method for producing a liquid-crystalline polyester powder, the method comprising: carrying out melt polycondensation of monomers and/or its acylated monomers to obtain a corresponding polyester having a flow initiation temperature of 240 to 300° C.; spreading and solidifying the polyester so as to be a layer thereof with a thickness of 1 cm or more: crushing the solidified substance to obtain a powder having a volume average particle diameter of 3 to 30 μm; and subjecting the powder to a heat treatment to obtain a powder having a flow initiation temperature higher than the flow initiation temperature of the liquid-crystalline polyester after the melt polycondensation.10-06-2011
20110240354WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD - A wiring board including a substrate having a cavity, an electronic component accommodated in the cavity of the substrate, a first conductive pattern formed on a surface of the substrate and having a frame shape surrounding the opening of the cavity, a second conductive pattern formed on the surface of the substrate and outside the frame shape of the first conductive pattern, and an insulation layer formed on the surface of the substrate and covering the first conductive pattern, the second conductive pattern and the opening of the cavity. The first conductive pattern has a slit extending from the outside of the frame shape to the inside of the frame shape.10-06-2011
20110240352PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD - A printed circuit board includes a printed circuit board body and a resin layer. The printed circuit board body includes a plurality of mounting pads. The resin layer, containing a thermoplastic resin, is formed on the surface of the printed circuit board body. The resin layer includes a plurality of holes disposed to be aligned with the positions of the mounting pads on a one-to-one basis for exposing the mounting pads therethrough. In a method of fabricating the printed circuit board, the resin layer is formed atop the printed circuit board body.10-06-2011
20110240351WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a core insulation layer having a connection conductor formed in a hole of the core layer, and an interlayer insulation layer laminated on one side of the core layer. The conductor of the core layer includes plating filling the hole of the core layer. The interlayer layer has a connection conductor formed in a hole of the interlayer layer. The conductor of the interlayer layer includes plating filling the hole of the interlayer layer. The conductor of the interlayer layer is stacked on the conductor of the core insulation layer. The conductors of the core and interlayer layers have lands formed on the core and interlayer layers and including metal foils and plating on the foils. The foil of the land on the core layer has a thickness which is thicker than a thickness of the foil of the land on the interlayer layer.10-06-2011
20110240350PROVIDING A PLASTIC SUBSTRATE WITH A METALLIC PATTERN - The invention is directed to a method of providing a plastic substrate with a metallic pattern and to a plastic substrate with a metallic pattern obtainable by said method. The method of the invention comprises i) replicating a pattern of recesses and protrusions on a plastic substrate by pressing a stamp having recesses and protrusions against the substrate, thereby providing said plastic substrate with recesses and protrusions; ii) removing said stamp from said substrate; iii)—applying a layer of seed material capable of initiating an electroless or electrochemical metal deposition process onto said plastic substrate in a selective pattern at least in the recesses of said plastic substrate to yield a substrate wherein said seed material remains selectively in the recesses of said substrate; and thereafter iv) using said seed material to initiate a metal deposition process.10-06-2011
20110209909NOISE DAMPENING ENERGY EFFICIENT CIRCUIT BOARD AND METHOD FOR CONSTRUCTING AND USING SAME - A noise dampening energy efficient circuit board includes a carbon material layer for dampening electromagnetic interference between surface mount components and trace patterns of the circuit board. One or more ground plane layers are arranged relative to the carbon material layer to cooperatively dampen and repel noise of varying frequencies. The positioning of the carbon material layer with respect to the ground plane layer enhances the ground plane operation. Glass fiber material layers and other insulating dielectric layers are disposed at particular locations within the noise dampening energy efficient circuit board. The carbon material layer and the ground plane layer dampen electromagnetic noise, thereby permitting energy saving design considerations, increasing energy efficiencies and reducing power consumption. Mounting posts of the surface mount components include insulating sleeves to selectively insulate different layers of the circuit board from surface mount components. Methods for constructing and using the circuit board are also disclosed.09-01-2011
20110209908CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME - The present invention provides a conductor package structure comprising a redistribution layer. An adhesive layer is formed on the redistribution layer. An electronic element is formed on the adhesive layer. Conductors are forming signal connection between the surface of a filling material and the bottom of the filling material, wherein the filling material is filled in the space between the electronic element and the conductors.09-01-2011
20110083889FPC-Based Relay Connector - A bridge connector for interconnecting two connectors mounted on circuit boards together includes a planar substrate that supports a length of flexible printed circuit, the substrate has engagement arms that are chamfered to act as male connector portions and be received within receptacle portions for the board connectors to effect a reliable connection between the two connectors.04-14-2011
20100059262METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE - The invention relates to a method for removing a part of a substantially planar material layer (03-11-2010
20110094781ELECTRONIC DEVICE HAVING A GLASS SUBSTRATE CONTAINING SODIUM AND METHOD OF MANUFACTURING THE SAME - An electronic device comprises a glass substrate (04-28-2011
20100059261REACTIVE MONOMER AND RESIN COMPOSITION CONTAINING SAME - A material for use in flexible printed wiring board having high reliability and allowing for processing fine wiring includes a compound represented by the following general formula (I):03-11-2010
20100059263RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME - The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.03-11-2010
20100065316COMPOSITE WOVEN FABRIC AND PRINTED WIRING BOARD - Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 μm or more and 16 μm or less, and the composite woven fabric has a thickness of 200 μm or less.03-18-2010
20100065314MULTI-LAYER CHIP CARRIER AND PROCESS FOR MAKING - Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers.03-18-2010
20110174526CIRCUIT MODULE - A circuit board includes a recess in a principal surface thereof. An IC chip is mounted in the recess. An insulating resin is filled in the recess. Via-hole conductors are provided in the insulating resin. A ground electrode covers the recess filled with the insulating resin. First ends of the via-hole conductors are in contact with the ground electrode. Second ends of the via-hole conductors are in contact with the IC chip.07-21-2011
20110094778CIRCUIT BOARD AND FABRICATION METHOD THEREOF - A method for fabricating a circuit board is provided. A non-conductive material layer is provided on a core substrate, wherein the non-conductive material layer comprises a dielectric material and catalytic particles. A recessed circuit structure is then formed in the non-conductive material layer with a laser beam. Simultaneously, the catalytic particles in the recessed circuit structure are activated with aid of the laser. A buried conductive structure is then formed in the recessed circuit structure by chemical copper deposition methods.04-28-2011
20110094779CIRCUIT STRUCTURE - A circuit structure including a circuit board, an insulating layer, a conductive via, a platable dielectric layer and a conductive pattern is provided. The insulating layer is disposed on the circuit board and covers a circuit layer of the circuit board. The conductive via passes through the insulating layer and connects the circuit layer and protrudes from a surface of the insulating layer. The platable dielectric layer having a trench pattern is disposed on the surface of the insulating layer wherein the portion of the conductive via protruding from the surface is located in the trench pattern. The material of the platable dielectric layer includes a chemical platable material. The conductive pattern is in the trench pattern and connects the conductive via wherein an interface exists between the conductive pattern and the conductive via and protrudes from the surface of the insulating layer.04-28-2011
20110100689ELECTRONICS COMPONENT EMBEDDED PCB - An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.05-05-2011
20110073358CIRCUIT SUBSTRATE, LAMINATED BOARD AND LAMINATED SHEET - A circuit substrate includes a resin layer; and an inorganic insulating layer including a groove portion penetrating the inorganic insulating layer in a thickness direction thereof. A part of the resin layer is in the groove portion.03-31-2011
20110061914NOVEL POLYIMIDE PRECURSOR COMPOSITION, USE OF THE SAME, AND PRODUCTION METHOD OF THE SAME - An object of the present invention is to provide (i) a polyimide precursor composition which is curable at a low temperature (not more than 250° C.) and which has a low viscosity despite having a high concentration, and a production method thereof, (ii) a polyimide coating film obtained from the polyimide precursor composition and having good properties, and a production method thereof, (iii) a photosensitive resin composition prepared by use of the polyimide precursor composition, and a production method thereof. The object of the present invention can be attained by a polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and an isocyanate compound having a specific structure, or optionally a diamine.03-17-2011
20110061912Printed circuit board and manufacturing method thereof - Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.03-17-2011
20110061911Interposer and method for manufacturing the same - An interposer includes: an insulation plate where a via is formed, the insulation plate including a resin or a ceramic; a first upper redistribution layer electrically connected to the via along a circuit pattern designed on the top surface of the insulation plate; a first upper protection layer laminated to expose a portion of the first upper redistribution layer and protecting the first upper redistribution layer; a second upper redistribution layer electrically connected to the first upper redistribution layer and laminated along a designed circuit pattern designed; a second upper protection layer laminated to expose a portion of the second upper redistribution layer and protecting the second upper redistribution layer; and an under bump metallization (UBM) formed at the exposed portion of the second upper redistribution layer.03-17-2011
20110061913METHOD OF MANUFACTURING MOUNTING STRUCTURE AND MOUNTING STRUCTURE - A method of manufacturing a mounting structure includes: an insulating resin arranging step of forming, on a circuit board, two kinds of insulating resin including first insulating resin cured at first curing temperature and second insulating resin cured at second curing temperature higher than the first curing temperature; a mounting step of aligning the bumps formed on an electronic component such that the bumps are opposed to counter electrodes of the circuit board; and a full-scale pressing step of performing, after the mounting step, full-scale pressing to join the electronic component and the circuit board. The insulating resin is heated to reach the first curing temperature before the full-scale pressing, and the insulating resin is heated to reach the second temperature during the full-scale pressing after the curing of the first insulating resin.03-17-2011
20120118621PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate having a connection pad; a lead pin bonded to the connection pad; and a surface treatment layer formed at the exposed portions of the connection pad and the lead pin.05-17-2012
20110048775PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a substrate having a first surface and a second surface on the opposite side of the first surface and multiple first penetrating holes, a first conductive portion formed on the first surface of the substrate and made of a first plated cover layer, a second conductive portion formed on the second surface of the substrate and made of a second plated cover layer, the second conductive portion being positioned opposite the first conductive portion, and multiple first through-hole conductors made of conductors formed in the multiple first penetrating holes, respectively, the multiple first through-hole conductors connecting the first conductive portion and the second conductive portion. The first conductive portion, the second conductive portion and the first through-hole conductors form a first through-hole connection section which sets up either a power-source through-hole conductor or a ground through-hole conductor.03-03-2011
20110024171MULTILAYER LAMINATED CIRCUIT - A multilayer laminated circuit includes ceramic layers sandwiched between all adjacent layers of a plurality of passive-element conductor layers and a plurality of wiring conductor layers. At least one of the passive-element conductor layers and the wiring conductor layers is connected to an electrode via a via that pierces through the ceramic layers from a principal-surface top side of the multilayer laminated circuit. External electrodes including an electrode, which is to be connected to the via on the principal-surface top side to make an external connection, are formed on the principal-surface top side. An external wiring conductor that connects at least a pair of the external electrodes is formed on the principal-surface top side.02-03-2011
20110147060DIELECTRIC FILM, DIELECTRIC ELEMENT, AND PROCESS FOR PRODUCING THE DIELECTRIC ELEMENT - A monolayer or a multilayer of niobic acid nanosheets is attached to form a dielectric film, and other electrode is arranged on the surface of the dielectric film to construct a dielectric element, and the dielectric element thus provided realizes both high permittivity and good insulating properties even in a nano-region. Also provided is a method of producing the element at low temperatures with no influence of substrate interface deterioration and composition deviation thereof. The method entirely solves the problems of substrate interface deterioration and the accompanying composition deviation and electric incompatibility, and solves the intrinsic problem of “size effect” that the film thickness reduction to a nano-level lowers the specific permittivity and increases the leak current, and the method takes advantage of the peculiar properties and good ability of texture and structure regulation that the niobic acid nanosheet has.06-23-2011
20110147059Substrate for integrated circuit devices including multi-layer glass core and methods of making the same - Disclosed are embodiments of a substrate for an integrated circuit (IC) device. The substrate includes a core comprised of two or more discrete glass layers that have been bonded together. A separate bonding layer may be disposed between adjacent glass layers to couple these layers together. The substrate may also include build-up structures on opposing sides of the multi-layer glass core, or perhaps on one side of the core. Electrically conductive terminals may be formed on both sides of the substrate, and an IC die may be coupled with the terminals on one side of the substrate. The terminals on the opposing side may be coupled with a next-level component, such as a circuit board. One or more conductors extend through the multi-layer glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the core. Other embodiments are described and claimed.06-23-2011
20100243303CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CIRCUIT MEMBER - The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component.09-30-2010
20110042129LOW DIELECTRIC GLASS FIBER - A glass fiber having a low dielectric constant and low dielectric loss tangent consists essentially of by weight, as a glass composition, 52 to 60% of SiO02-24-2011
20090114433MULTI-LAYERED CERAMIC BOARD AND METHOD OF MANUFACTURING THE SAME - There is provided a multi-layered ceramic board and a method of manufacturing the same. A multi-layered ceramic board according to an aspect of the invention may include: an internal layer having a plurality of first dielectric sheets laminated, each of the first dielectric sheets prepared by mixing glass powder with a predetermined amount of alumina powder; and an external layer having at least one second dielectric sheet laminated on the surface of the internal layer, the second dielectric sheet prepared by mixing glass powder with alumina powder in a smaller amount than the first dielectric sheet, wherein via hole conductors and internal electrodes provided in the internal layer are electrically connected to a surface electrode provided on the surface of the external layer, and the internal layer, the external layer, the via hole conductors, the internal layer, and the surface electrode are fired at a predetermined temperature.05-07-2009
20090114432LAMINATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD USING SAME, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, ELECTRICAL COMPONENT, ELECTRONIC COMPONENT, AND ELECTRICAL DEVICE - Disclosed is a laminate comprising, on a support: an insulating resin composition layer configured to produce a reactive active species when provided with energy; and a reactive polymer precursor layer containing a compound configured to react with the insulating resin composition layer and form a polymer compound.05-07-2009
20110253435MULTILAYER THREE-DIMENSIONAL CIRCUIT STRUCTURE - A multilayer three-dimensional circuit structure and a manufacturing method thereof are provided in the present invention. The manufacturing method includes following steps. First, a three-dimensional insulating structure is provided. A first three-dimensional circuit structure is then formed on a surface of the three-dimensional insulating structure. Next, an insulating layer covering the first three-dimensional circuit structure is formed. Thereafter, a second three-dimensional circuit structure is formed on the insulating layer. Subsequently, at least a conductive via penetrating the insulating layer is formed for electrically connecting the second three-dimensional circuit structure and the first three-dimensional circuit structure.10-20-2011
20120199386MULTILAYER PRINTED WIRING BOARD - A printed wiring board including a core substrate having a metal layer, a first resin insulation layer on a surface of the metal layer and a second resin insulation layer on the opposite surface of the metal layer, a first conductive circuit formed on the first layer, a second conductive circuit formed on the second layer, and a through-hole conductor formed in a penetrating hole through the substrate and connecting the first and second circuits. The metal layer has an opening filled with a filler resin, the penetrating hole has a first opening in the first layer, a second opening in the second layer and a third opening in the filler resin, the first opening tapers toward the filler resin, the second opening tapers toward the filler resin, and the third opening is connecting the first and second openings.08-09-2012
20110005819CONDUCTIVE PLATE AND METHOD FOR MAKING THE SAME - A method for making a conductive plate comprises providing a conductive film exhibiting electric anisotropy, and bonding the conductive film to a substrate through an adhesive.01-13-2011
20110253433EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin and diaminodiphenylsulfone mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.10-20-2011
20110108312Shock damping system for a surface mounted vibration sensitive device - The inventive shock damping system for vibration sensitive surface mounted devices consists of an elastomeric material having conductive fiber material disposed between a printed circuit board (PCB) and a surface mounted device. Once disposed between PCB and surface mounted device, the elastomeric material, the PCB and the surface mounted device are compressed together with a component restraining system, to provide a secure electrical connection between one or more interconnect pads conductively attached to surface mounted device and the PCB. The elastomeric material allows signals and current to flow between surface mounted device and PCB without the use of any attached wires or leads while at the same time providing a system for damping any shocks or vibrations that may be transferred to surface mounted device through the PCB or through the protective component restraining system that encloses the device and the elastomeric material.05-12-2011
20110132646FLAME RETARDANT EPOXY RESIN COMPOSITION, PREPREG AND LAMINATE THEREOF - There is provided herein a curable epoxy resin composition comprising at least one brominated epoxy resin, at least one flame retardant curing agent, and at least one curing catalyst.06-09-2011
20110083890EPOXY RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and/or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 μm or more and 5.0 μm or less.04-14-2011
20110253434EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including an amino-triazine-novolac resin and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.10-20-2011
20110083887PHOTO-PATTERNABLE DIELECTRIC MATERIALS CURABLE TO POROUS DIELECTRIC MATERIALS, FORMULATIONS, PRECURSORS AND METHODS OF USE THEREOF - Silsesquioxane polymers that cure to porous silsesquioxane polymers, silsesquioxane polymers that cure to porous silsesquioxane polymers in negative tone photo-patternable dielectric formulations, methods of forming structures using negative tone photo-patternable dielectric formulations containing silsesquioxane polymers that cure to porous silsesquioxane polymers, structures containing porous silsesquioxane polymers and monomers and method of preparing monomers for silsesquioxane polymers that cure to porous silsesquioxane polymers.04-14-2011
20110094780Printed wiring board - In a printed wiring board, a first inner layer wiring line is formed on one surface of a wiring line formation layer, a resin film made of electric insulation resin is formed on an area other than the first inner layer wiring line formed on the wiring line formation layer. The resin film and the first inner layer wiring line have the same plane surface. A second wiring line is formed on the resin film, and the second wiring line is thinner in thickness than the first inner layer wiring line. A limit of error in thickness of the resin film and the first inner layer wiring line is within 10% of the thickness of each of the resin film and the first inner layer wiring line.04-28-2011
20110132647Substrates Having Voltage Switchable Dielectric Materials - Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.06-09-2011
20110186339PRINTED CIRCUIT BOARD WITH CARBON NANOTUBE BUNDLE - A printed circuit board includes a composite layer, a first electrically conductive pattern, and a second electrically conductive pattern. The composite layer includes a polymer matrix and an electrically conductive pin embedded therein. The polymer matrix has a first surface and an opposite second surface. The pin includes a catalyst block and a carbon nanotube bundle grown on the catalyst block. The catalyst block is exposed at the first surface, and the carbon nanotube bundle is exposed at the second surface. The first pattern is formed on the first surface, and includes a first electrical contact, which is electrically coupled to the catalyst block. The second pattern is formed on the second surface, and includes a second electrical contact, which is electrically coupled to the carbon nanotube bundle.08-04-2011
20100025093MULTILAYERED CIRCUIT BOARD AND SEMICONDUCTOR DEVICE - A multilayered circuit board of the present invention has a single-side laminated structure and does not include a core substrate having via-holes formed therethrough and vias for providing electrical connection through the via-holes. The multilayered circuit board includes a plurality of pairs of layers, each pair including a conductor circuit layer and an insulator layer, wherein a glass transition temperature of each insulator layer is 170° C. or higher, a coefficient of thermal expansion at the glass transition temperature or lower of each insulator layer is 35 ppm or less, and a modulus of elasticity of each insulator layer is 5 GPa or more.02-04-2010
20110297431CONNECTION STRUCTURE - A connection structure includes a circuit board and a terminal. The circuit board includes an insulation base member containing thermoplastic resin, and a wiring portion arranged in the insulation base member. The wiring portion has a conductor pattern and an interlayer connector electrically connected to the conductor pattern. The terminal is electrically connected to a part of the wiring portion, and has a first section arranged inside of the insulation base member. The first section of the terminal is tightly contact with the thermoplastic resin of the insulation base member, such that the terminal is connected to the circuit board.12-08-2011
20100155120THERMOSETTING OLIGOMER OR POLYMER, THERMOSETTING RESIN COMPOSITION INCLUDING THE OLIGOMER OR POLYMER, AND PRINTED CIRCUIT BOARD USING THE COMPOSITION - A thermosetting oligomer or thermosetting polymer is provided. The thermosetting oligomer or thermosetting polymer contains repeating units, each of which has at least one thermosetting functional group in the side chain and is represented by Formula 1:06-24-2010
20100065313MULTI-LAYER WIRING BOARD - It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (03-18-2010
20110114376Printed-circuit board and manufacturing method thereof - A method for manufacturing a printed-circuit board including: a capacitive element forming step of embedding a capacitive element in a substrate resin layer inside a substrate that includes a plurality of wiring layers laminated with the substrate resin layer interposed in between, the capacitive element forming step including forming a lower electrode using a conductive layer on one of the plurality of wiring layers, or using one of the plurality of wiring layers; forming a crystalline metal oxide-containing capacitor dielectric film at a temperature at or below a heat-resistant temperature of the substrate resin layer, and at or above room temperature; and forming an upper electrode on an upper surface of the capacitor dielectric film on the side opposite to the lower electrode.05-19-2011
20090173525PRINTED WIRING BOARD AND PRINTED SUBSTRATE UNIT - A printed wiring board includes a main body, a plurality of glass fiber yarns disposed in parallel with each other with a predetermined width, a pair of first wirings disposed in parallel with the glass fiber yarns, a pair of second wirings disposed in parallel with the glass fiber yarns, and a pair of connection wirings for connecting the first and the second wiring while being orthogonal to the glass fiber yarns, wherein the glass fiber yarns are separated at the same space as the width of the glass fiber yarns, and the center line of the first wiring and the second wiring are separated at a space of (space between the center lines of the adjacent glass fiber yarns×½+space between the center lines of the adjacent glass fiber yarns×N (N is an integer of at least 0 (zero)).07-09-2009
20120145441Dielectric layer of printed circuit board, method for preparing the same, and printed circuit board including the same - Disclosed herein are a dielectric layer of a printed circuit board prepared by dispersing short fibers in a dielectric polymer resin; and impregnating the resin having the short fibers dispersed therein in a fabric-shaped material, and a printed circuit board including the same. The dielectric polymer resin is reinforced with the short fibers and is impregnated in the fabric-shaped material, thereby making it possible to prepare the dielectric layer having excellent strength and low coefficient of thermal expansion. Accordingly, the printed circuit board including the dielectric layer may maintain strength and rigidity thereof at the same level as that of strength and rigidity of the printed circuit board according to the related art, even through a thickness thereof becomes thin.06-14-2012
20120067631INSULATING CIRCUIT BOARD, INVERTER DEVICE AND POWER SEMICONDUCTOR DEVICE - An object of the invention is to provide an insulation circuit board with high insulation reliability and a related technology that uses this insulation circuit board. An insulation circuit board (03-22-2012
20090065244THERMOSETTING RESIN COMPOSITIONS AND USES THEREOF - Thermosetting resin compositions are excellent in balance among printability, tack properties, matting properties, electrical insulating properties and adhesion to objects. A thermosetting resin composition includes a thermosetting resin (A) and core-shell multilayer organic fine particles (B).03-12-2009
20120305301CIRCUIT BOARD WITH HEAT SINK AND METHOD OF FABRICATING THE SAME - The invention provides a circuit board with heat sink and a method of fabricating the same. The circuit board according to the invention includes a substrate, a lead layer and a ceramic layer. The lead layer is formed on an upper surface of the substrate, and includes two contact points corresponding to an electronic device. The ceramic layer is formed on the upper surface of the substrate, and particularly formed between such two contact points. The ceramic layer serves as a heat sink for the electronic device.12-06-2012
20120037410THERMOPLASTIC RESIN COMPOSITION, ADHESIVE FILM AND WIRING FILM USING THE SAME - A thermoplastic resin composition including a polyphenylene ether-based polymer having hydroxyl groups in its chemical structure and having 2,6-dimethylphenylene ether as a repeating unit, an isocyanate compound having a plurality of isocyanate groups in its structure; or a reaction product of the polyphenylene ether-based polymer having 2,6-dimethylphenylene ether as a repeating unit and the isocyanate compound having a plurality of isocyanate groups in its structure; and a hydrogenated styrene-based elastomer, and an adhesive film and a wiring film using the same are disclosed.02-16-2012
20110031003CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM - A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.02-10-2011
20110024172MULTILAYER CIRCUIT BOARD, INSULATING SHEET, AND SEMICONDUCTOR PACKAGE USING MULTILAYER CIRCUIT BOARD - Semiconductor chip mounting yield and semiconductor package reliability deteriorate due to warpage of a multilayer circuit board. A multilayer circuit board (02-03-2011
20120152601Package substrate and die spacer layers having a ceramic backbone - A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.06-21-2012
20100155122BIOMASS-DERIVED EPOXY COMPOUND AND MANUFACTURING METHOD THEREOF - There is disclosed a biomass-derived epoxy compound as an epoxidized product of a raw-material biomass-derived compound having a weight-average molecular weight of 300 to 10000. The biomass-derived epoxy compound has a weight-average molecular weight of 600 to 20000 and is soluble in an organic solvent for the preparation of a varnish. The epoxy compound is prepared by dissolving the raw-material biomass-derived compound in an aqueous alkali solution; adding epichlorohydrin to the solution and heating the mixture; and evaporating epichlorohydrin from the heated mixture and precipitating a biomass-derived epoxy compound, in which the aqueous alkali solution has a pH of 13.5 to 11.0. The biomass-derived epoxy compound has both high solubility in organic solvents and satisfactory heat resistance and can be manufactured in a high yield on the basis of the raw material through a less number of processes.06-24-2010
20110315437Printed circuit board with reinforced thermoplastic resin layer - A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.12-29-2011
20120043124ELECTRICAL DEVICE - The present invention relates to an electrical device comprising a substrate, a pair of electrodes arranged on the substrate and a functional layer arranged between the pair of electrodes, said functional layer comprising a functional domain being capable of transforming an external stimulus into an electrical signal or vice versa. The electrical device is characterized in that at least two conductive domains are dispersed in the functional layer. Said at least two conductive domains are separated from each other and are formed in each case by a particle or an agglomerate of particles of a conducting or semiconducting material having a higher electrical conductivity than the material of the functional domain. Each of the conductive domains form an electrically conductive path on the functional domain.02-23-2012
20120043123PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING BOARD - [Subject Matter] To provide a printed wiring board in which no warping occurs even if interlayer insulation layers without core material are laminated on a core substrate.02-23-2012
20080302562PRINTED CIRCUIT BOARD - A circuit is printed on a circuit board material, which does not have a copper foil layer and does have a paper base material is impregnated with a resin, using an electroconductive coating material. The board material preferably is a paper phenol board material, wherein the paper base material is impregnated with phenol resin, on which a resist layer is formed and a circuit is printed on the resist layer using an electroconductive coating material.12-11-2008
20110155433WIRING BOARD CAPABLE OF CONTAINING FUNCTIONAL ELEMENT AND METHOD FOR MANUFACTURING SAME - A wiring board is configured by stacking one or more conductor wiring layers and one or more insulating resin layers and comprising one or more metal vias configured to penetrate the insulating resin layer, wherein the boundary surface between the metal via and the insulating resin layer has a concavo-convex boundary cross-section structure in which the metal via and the insulating resin layer are engaged with each other.06-30-2011
20120111620PHOTOCURABLE RESIN COMPOSITION - Disclosed is a photocurable resin composition which comprises a photopolymerization initiator having two oxime ester groups in the molecule, a resin containing a carboxyl group, and a compound having two or more ethylenically unsaturated groups in the molecule. The composition can achieve high sensitivity, can provide a dried coating film having excellent touch dryness of fingers, can prevent the generation of an out gas during curing or the like, and can achieve all of excellent alignment accuracy, high productivity and high reliability in the formation of a solder resist for a printed wiring board or the like.05-10-2012
20120012374ELECTRICAL FEEDTHROUGH ASSEMBLY - An electrical feedthrough includes a ceramic body and a ribbon via extending through the ceramic body, an interface between the ribbon via and the ceramic body being sealed using partial transient liquid phase bonding. The ribbon via extends out of the ceramic body and makes an electrical connection with an external device.01-19-2012
20120012375Insulating material and printed circuit board having the same - An insulating material formed by impregnating a base material with a liquid composition and curing the liquid composition, the liquid composition being 20 to 50 parts by weight of a PMDA-ODA mixture, the PMDA-ODA mixture including pyromellitic dianhydride (PMDA) and oxydianiline (ODA) mixed in a weight ratio of 40:60 to 60:40; 50 to 80 parts by weight of a triazine derivative; and 300 to 600 parts by weight of an organic solvent. A printed circuit board includes an insulator formed of the above insulating material; a circuit pattern formed on one or either side of the insulator; and a via penetrating the insulator.01-19-2012
20120055704EPOXY RESIN BLEND - Embodiments of the present disclosure set forth a sintered talc powder. The sintered talc powder comprising a first X-ray diffraction peak from about 29° to about 30° and having a first intensity and a second X-ray diffraction peak from about 25° to about 27° and having a second intensity, wherein the first intensity is greater than the second intensity.03-08-2012
20110061910MULTI-LAYER CERAMIC CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRIC DEVICE MODULE USING THE SAME - There is provided a multi-layer ceramic circuit board. The multi-layer ceramic circuit board according to an aspect of the invention may include: a ceramic body having a plurality of ceramic green sheets stacked upon one another and an interlayer circuit having conductive vias and conductive patterns separately provided in the plurality of ceramic green sheets; a bump receiving portion provided in at least one surface ceramic green sheet adjacent to a surface of the plurality of ceramic green sheets, and having side walls inclined upward; and a bonding pad provided on the inclined side walls and a bottom surface of the bump receiving portion, and connected to the interlayer circuit.03-17-2011
20120152600PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board including an interlayer resin insulation layer, a pad formed on the interlayer resin insulation layer and for mounting an electronic component, a solder-resist layer formed on the interlayer resin insulation layer and the pad and having an opening portion over the pad, and a coating layer formed on the pad and exposed through the opening portion of the solder-resist layer. The solder-resist layer has a protruding portion protruding toward the inside of the opening portion in a bottom portion of the opening portion, and the protruding portion of the solder-resist layer has a flat surface in an end portion of the protruding portion.06-21-2012
20090133910PRODUCTION METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD - Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 μm or below.05-28-2009
20090133911RELEASE FILM FOR USE IN MANUFACTURE OF PRINTED CIRCUIT BOARDS - To provide a release film which is used to avoid adherence between a press hot plate and a printed circuit board or a cover lay film at the time of press work effected to printed circuit boards such as printed wiring boards, flexible printed circuit boards and multilayered printed circuit boards and which has a heat resistance, a releasing property, a non-contamination property, a follow up capability relative to the circuit pattern, an excellent workability during processing and a small environmental impact at the time of disposal, the release film has a shear modulus of 5×1005-28-2009
20120125672PHOTOCURABLE RESIN COMPOSITION - Provided is a photocurable resin composition, which has sensitivity equal to or greater than existing compositions, has alkali development properties, and which produces a cured product that does not become brittle with changes in temperature, and which also has excellent reliability in terms of water resistance, electrical insulating properties, PCT resistance, and the like. The photocurable resin composition comprises a carboxyl group-containing resin, a photopolymerization initiator, a vinyl group-containing elastomer, and a styryl group-containing compound.05-24-2012
20120125673LIQUID CRYSTAL POLYESTER COMPOSITION AND ELECTRONIC CIRCUIT BOARD USING THE SAME - To provide a liquid crystal polyester composition which is suited for use as a material for forming a liquid crystal polyester film having excellent thermal conductivity. Also, an excellent electronic circuit board is provided by using an insulating film obtained from the liquid crystal polyester composition. The liquid crystal polyester composition of the present invention is composed of a liquid crystal polyester, a solvent and a thermally conductive filler. The thermally conductive filler is contained in the amount of 50 to 90 volume % based on the total amount of the liquid crystal polyester and the thermally conductive filler, and the thermally conductive filler contains 0 to 20 volume % of a first thermally conductive filler having a volume average particle diameter of 0.1 μm or more and less than 1.0 μm, 5 to 40 volume % of a second thermally conductive filler having a volume average particle diameter of 1.0 μm or more and less than 5.0 μm and 40 to 90 volume % of a third thermally conductive filler having a volume average particle diameter of 5.0 μm or more and 30.0 μm or less.05-24-2012
20120125671Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure - To provide an insulating resin film, which contains: a first adhesive layer, and a second adhesive layer, wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part, wherein the first adhesive layer and the second adhesive layer each contain inorganic filler, wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and wherein a thickness of the first adhesive layer is 50% to 90% of a total thickness of the insulating resin film.05-24-2012
20100288544MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a core substrate, a built-up wiring layer having a first surface in contact with the substrate and a second surface, the second surface including a mounting area for mounting a semiconductor device, the built-up layer including circuits and insulating layers, first through-hole conductors formed in a first portion of the substrate which corresponds to the mounting area, second through-hole conductors formed in a second portion of the substrate which corresponds to an area of the second surface other than the mounting area, third through-hole conductors formed in a processor core area of the first portion of the substrate which corresponds to a processor core section of the device, and pads provided on the second surface. The first conductors have a pitch smaller than a pitch of the second conductors, and the third conductors have a pitch smaller than the pitch of the first conductors.11-18-2010
20100051337CIRCUIT BOARD - A lower sub-board of a circuit board includes a first base layer having an upper surface, and a first wiring pattern provided on the upper surface of the first base layer. An upper sub-board of a circuit board includes a second base layer having a lower surface, and a second wiring pattern provided on the lower surface of the second base layer. A connection layer between lower and upper sub-boards includes an insulating layer having a lower surface and an upper surface, the lower surface of connection layer being situated on the upper surface of the first base layer, the upper surface of connection layer being situated on the lower surface of the second base layer, and a via-conductor passing through the insulating layer and connected to the first and second wiring patterns. This circuit board connects the sub-boards to each other via a via-conductor densely.03-04-2010
20120312589Laser Resin Activation to Provide Selective Via Plating for Via Stub Elimination - An enhanced mechanism for via stub elimination in printed wiring boards (PWBs) and other substrates employs laser resin activation to provide selective via plating. In one embodiment, the resin used in insulator layers of the PWB contains spinel-based non-conductive metal oxide. Preferably, only insulator layers through which vias will pass contain the metal oxide. Those layers are registered and laser irradiated at via formation locations to break down the metal oxide and release metal nuclei. Once these layers are irradiated, all layers of the PWB or subcomposite are laid up and laminated. The resulting composite or subcomposite is subsequently drilled through and subjected to conventional PWB fabrication processes prior to electroless copper plating and subsequent copper electroplating. Because metal nuclei were released only in the via formation locations of the appropriate layers, plating occurs in the via barrels only along those layers and partially plated vias are created without stubs.12-13-2012
20120168215CURABLE RESIN COMPOSITION - Provided is a curable resin composition which exhibits improved developability even in through holes and can suppress the generation of development residue and which can yield a cured product with excellent heat resistance and hardness. A curable resin composition which comprises a carboxyl-containing resin, a photopolymerization initiator, and barium sulfate that has been pretreated with a dispersant having an acid group and/or a dispersant having a block copolymer structure, a graft polymer structure, and/or a star polymer structure.07-05-2012
20100175915Printed circuit board and method of manufacturing the same - The invention relates to a printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The invention makes the printed circuit board slim, and increases reliability and the degree of design freedom.07-15-2010
20100012361CIRCUIT OBFUSCATION - An obfuscated radio frequency circuit may include a metallization layer, and a dielectric layer under the metallization layer. The dielectric layer may be made up of a plurality of dielectric substrates having differing dielectric constants to obfuscate functions of the circuit.01-21-2010
20100270065Resin Composition For Printed Circuit Board and Printed Circuit Board Using The Same - Disclosed is a resin composition for a printed circuit board, which includes a complex epoxy resin including a bisphenol A epoxy resin obtained by dispersing silicone elastomer particles having a core-shell structure in a diglycidyl ether of bisphenol A epoxy resin, a cresol novolac epoxy resin, and a phosphorus-based epoxy resin; a bisphenol A curing agent; a curing accelerator; and an inorganic filler. A printed circuit board using the resin composition is also provided.10-28-2010
20100270064RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is a resin composition for a printed circuit board, composed of a complex epoxy resin including 41˜80 wt % of a naphthalene-modified epoxy resin having an average epoxy resin equivalent of 100˜200 and 20˜59 wt % of a phosphorus-based epoxy resin having an average epoxy resin equivalent of 400˜800, a bisphenol A curing agent used in an equivalent ratio of 0.3˜1.5 with respect to a total epoxy group equivalent of the complex epoxy resin, a curing accelerator used in an amount of 0.1˜1 part by weight based on 100 parts by weight of the complex epoxy resin and an inorganic filler used in an amount of 10˜40 parts by weight based on 100 parts by weight of the complex epoxy resin. A printed circuit board using the resin composition is also provided.10-28-2010
20120247820RESIN COMPOSITION, PREPREG LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD - Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board.10-04-2012
20120247821CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A ceramic substrate for an electronic part inspecting apparatus that can be manufactured in accordance with predetermined specifications, regardless of the number and location of pins required, relatively quickly and inexpensively is provided. In certain embodiments the ceramic substrate is configured to connect to a probe for inspecting an electronic component, and the ceramic substrate comprises a plurality of vias located in a center area of the ceramic substrate that penetrate through the ceramic substrate in its thicknesswise direction, pads located in an outer periphery that surrounds the center area where the vias are located, the pads being configured to connected to the probes, and a conductive layer located only over the front surface of the ceramic substrate and connects the vias to the respective pads. Certain embodiments comprise a greater number of vias than pins. A method of manufacturing the ceramic substrate is also provided.10-04-2012
20120228013DEFECTIVE CONDUCTIVE SURFACE PAD REPAIR FOR MICROELECTRONIC CIRCUIT CARDS - An electrically conductive adhesive (ECA) for repairing electrically conductive pad and trace interconnects and a method of repairing interconnect locations. The method of repairing at least one defect within the area of electrically conductive circuitized substrate traces and pads outside of a pristine center area incorporates an ECA and a forming gas plasma. The ECA contains a mixture of components that allow the adhesive to be adapted to specific requirements. Curing the adhesive results in effective electrical connections being formed between the adhesive and the base pad so that the metallurgies of the conductors and of the ECA are effectively combined to engage and repair the conductor defect.09-13-2012
20130008702PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a penetrating hole penetrating through the core substrate and having a first insulation layer, a second insulation layer and an insulative substrate interposed between the first and second layers, a first circuit formed on a surface of the core, a second circuit formed on opposite surface of the core, and a through-hole conductor formed in the penetrating hole of the core and connecting the first and second circuits. The penetrating hole has first and second opening portions, the first opening portion becomes thinner from the first surface toward the second surface, the second opening portion becomes thinner from the second surface toward the first surface, and the first and second insulation layers are comprised of resin materials easier to be processed by laser than resin material of the insulative substrate under same conditions of the laser.01-10-2013
20110120761EPOXY RESIN COMPOSITIONS - Epoxy resin compositions which comprise an epoxy resin (A), an active ester compound (B), and a triazine-containing cresol novolac resin (C), when cured and roughened, exhibit a roughed surface which has a high adhesion strength to a metal plated conductor, even though the roughness of the roughed surface is small, and provide an insulating layer which has a low coefficient of linear expansion and a low dielectric loss tangent.05-26-2011
20120325534METHOD FOR PRODUCING LIQUID CRYSTAL POLYESTER-IMPREGNATED BASE MATERIAL - Disclosed are a method for producing a liquid crystal polyester-impregnated base material, which includes the following steps of (1) impregnating a sheet-like base material composed of a fiber with a liquid composition containing 15 to 45% by mass of a liquid crystal polyester and 55 to 85% by mass of a solvent (based on 100% by mass in total of the liquid crystal polyester and the solvent); (2) allowing the base material impregnated with the liquid composition to pass through a pair of rolls having a distance which is smaller than the thickness of the base material; and (3) heating the liquid composition-impregnated base material passed through rolls at 140 to 250° C. for 60 to 600 seconds; and a printed circuit board including the liquid crystal polyester-impregnated base material produced by the method as an insulating layer.12-27-2012
20120325533METHOD OF MANUFACTURING MULTILAYER CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD - A method of manufacturing a multilayer circuit board includes forming a prepreg on a surface of a first circuit board including a first region in which a plated-through hole is formed and a second region in which a solid pattern is formed, the prepreg having a first hole reaching the plated-through hole and a second hole reaching the solid pattern, filling the first hole with a conductive paste, and pressing a second circuit board on the prepreg to laminate the first circuit board and the second circuit board to each other after filling the first hole with the conductive paste.12-27-2012
20120267152SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE - A substrate usable for such as DC-DC converters, which has no defects such as openings therein but is more compact and easy to be manufactured and a method of manufacturing the same is provided. First, circuit materials are cut off by pressing and bended to be formed in desired shapes. Next, the circuit materials are joined or placed in predetermined positions to form a circuit conductor 10-25-2012
20110209907LIQUID-REPELLENT FILM FORMER, METHOD FOR FORMING LIQUID-REPELLENT FILM, METHOD FOR FORMING FINE WIRING USING THE SAME, AND SUBSTRATE COMPRISING THE SAME - Disclosed are a liquid-repellent film former, a method for forming a liquid-repellent film, a method for forming fine wiring based on the same, and a printed circuit board including the same. The liquid-repellent film former includes a first coupling agent including a compound represented by the following Chemical Formula 1, a second coupling agent including a compound represented by the following Chemical Formula 2, and an alcohol solvent.09-01-2011
20100224396CERAMIC COMPOSITE MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC COMPOSITE MULTILAYER SUBSTRATE AND ELECTRONIC COMPONENT - A high-reliability ceramic composite multilayer substrate that has excellent flatness and few remaining pores, can be produced at a low cost while simplifying the manufacturing process, and can eliminate layer separation or separation from a mother board. The ceramic composite multilayer substrate includes a laminate containing a first ceramic layer and a second ceramic layer that is disposed so as to contact the first ceramic layer and suppresses firing shrinkage in the plane direction of the first ceramic layer. The laminate includes a resin/ceramic composite layer in which porous ceramic is impregnated with a resin formed on at least one principal surface of the laminate.09-09-2010
20100224395MULTILAYER WIRING BOARD AND ITS MANUFACTURING METHOD - A multilayer wiring board includes a first wiring and a second wiring which are provided on both surfaces of an insulating board, a conductor passing through the insulating board for electrically connecting the first wiring to the second wiring, and an anchoring conductor passing through the insulating board. The anchoring conductor suppresses a distortion in the insulating board along the shearing direction of the insulating board and a deforming of the conductor, thus providing the multilayer wiring board with preferable electrical connection.09-09-2010
20100230148SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT - To provide a substrate for mounting a semiconductor element, in which fine-pitch wiring layers are formed to allow a semiconductor element to be mounted, while heat generated in the semiconductor element will not result in a decrease in reliability. Semiconductor-element mounting substrate sandwiches low-thermal-expansion substrate with upper interlayer resin layer and lower interlayer resin layer, and conductive circuit of organic substrate and first conductive circuit of low-thermal-expansion substrate are connected by via conductor formed in interlayer resin layer. Therefore, low-thermal-expansion substrate for mounting semiconductor element may be connected to organic substrate that is connected to outside substrates, without arranging an organic substrate and resin layers on the lower surface of low-thermal-expansion substrate, where impact from the thermal history of semiconductor element is notable.09-16-2010
20100230147LAYERED ELECTRONIC CIRCUIT DEVICE - Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the electronic connection characteristic. The layered electronic circuit device includes a first circuit substrate (09-16-2010
20120318570BUMP STRUCTURE AND PROCESS OF MANUFACTURING THE SAME - A bump structure comprises a first polymer block, a second polymer block, a first groove, an under bump metallurgy layer and a connection metal layer, wherein the first polymer block and the second polymer block are individual blocks. The first polymer block comprises a first connection slot, and the second polymer block comprises a second connection slot communicated with the first groove and the first connection slot. The under bump metallurgy layer covers the first polymer block and the second polymer block to form a second groove. The connection metal layer covers the under bump metallurgy layer to form a third groove, wherein the under bump metallurgy layer covers a first coverage area of the first polymer block and a second coverage area of the second polymer block and reveals a first exposure area of the first polymer block and a second exposure area of the second polymer block.12-20-2012
20120318571Low Dielectric Loss Thermoset Resin System at High Frequency for Use in Electrical Components - The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.12-20-2012
20120279768Flame Retardant Filler - A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles.11-08-2012
20120279770PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.11-08-2012
20120279769RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME - A resin composition is provided. The resin composition comprises an epoxy resin, a hardener, and a modifier, wherein the modifier is a polymer solution obtainable from the following steps: 11-08-2012
20120090883Method and Apparatus for Improving Substrate Warpage - A package substrate includes conductive layers and a dielectric interposed between the conductive layers. The dielectric includes a stiffening material component and a neat resin doped with a negative coefficient of thermal expansion (CTE) fiber.04-19-2012
20100200283INSULATION PASTE FOR A METAL CORE SUBSTRATE AND ELECTRONIC DEVICE - The insulation paste of the present invention contains (a) a glass powder, and (b) an organic solvent, wherein one or both of alumina (Al08-12-2010
20130008701MULTILAYER PRINTED WIRING BOARD - A multilayered printed circuit board including a substrate, a multilayered structure formed on the substrate and including multiple conductor circuits and multiple interlaminar resin insulating layers, and a stack-via structure having multiple via-holes and formed in the multilayered structure such that the via-holes are piled through the interlaminar resin insulating layers in the multilayered structure. The interlaminar resin insulating layers include an outermost interlaminar resin insulating layer forming an outermost layer of the interlaminar resin insulating layers and having a coefficient of linear expansion which is equal to or smaller than coefficients of linear expansion of the interlaminar resin insulating layers other than the outermost interlaminar resin insulating layer.01-10-2013
20130008700METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND PRINTED WIRING BOARD - On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes preparing a CFRP core, forming a through hole so as to penetrate the CFRP core from the front surface side to the back surface side and include a region in which the component is to be mounted when viewed in a plan view, and embedding a GFRP core having insulating properties within the through hole by filling the through hole with a resin having insulating properties and curing the resin. According to the manufacturing method, the component mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.01-10-2013
20130020117LAMINATED BODY COMPRISING POROUS LAYER AND FUNCTIONAL LAMINATE USING SAME - A layered body which includes a porous layer. The layered body having improved properties, such as adhesion between its substrate and its porous layer by the formation of a crosslinked structure; a functional laminate using the porous layer layered body; and a production processes thereof. The layered body includes a base and the porous layer on at least one surface of the base. The base is a resin film made of at least one resin material of polyimide resins, polyamideimide resins, polyamide resins, and polyetherimide resins, or is a metal foil piece, and the porous layer is made of a composition containing at least one polymer of polyimide resins, polyamideimide resins, polyamide resins, and polyetherimide resins as a main component, and a crosslinking agent. Additionally, the porous layer has fine pores having an average pore diameter of 0.01 to 10 μm, and a porosity of 30 to 85%.01-24-2013
20130020116PRINTED WIRING BOARD - A printed wiring board has a packaging substrate having multiple pads, and a transmission substrate mounted on the multiple pads of the packaging substrate. The packaging substrate has a pad group constituted of pads which mount an electronic component, the multiple pads mounting the transmission substrate includes a first pad positioned in a peripheral portion of the packaging substrate and a second pad positioned between the first pad and the pad group, the second pad is electrically connected to a signal pad of the pads in the pad group, and the transmission substrate includes a horizontal wiring which electrically connects the second pad and the first pad and which transmits a signal between the second pad and the first pad.01-24-2013
20120241204THIN FILM CAPACITOR, MOUNTING SUBSTRATE, AND METHOD OF MANUFACTURING THE MOUNTING SUBSTRATE - A thin film capacitor includes: two electrode layers; a dielectric film interposed between the two electrode layers; an opening that pierces through, together with the dielectric film, in the thickness direction, any one of the two electrode layers or a conductive layer in the same level adjacent to one of the two electrode layers; and a reinforcing member that couples, in the opening, a side surface of the dielectric film to a side surface of the one electrode layer or the conductive layer.09-27-2012
20080223605EMBEDDED CIRCUIT BOARD AND PROCESS THEREOF - An embedded circuit board including a glass fiber layer, two dielectric layers, and two circuit layers is provided. The glass fiber layer has a first surface and a second surface corresponding to the first surface. The dielectric layers are disposed on the first surface and the second surface, respectively. The circuit layers are embedded in the dielectric layers above the first surface and the second surface, respectively. The outer surface of each circuit layer is coplanar with the outer surface of each dielectric layer, and a distance between the circuit layer and the glass fiber layer is greater than or equal to 3 μm. In addition, a process of the embedded circuit board is provided.09-18-2008
20130175074METHOD FOR SURFACE MOUNTING ELECTRONIC COMPONENT, AND SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED THEREON - A method for surface mounting an electronic component includes providing a conductive circuit on a substrate member, forming a thermoplastic resin layer on a front surface of the conductive circuit, providing a surface of an electrode of an electronic component with a metal layer, and bonding the metal layer of the electronic component and the conductive circuit to each other by melting and partially removing a thermoplastic resin by applying a load generated by ultrasonic vibration that vibrates in a direction substantially parallel to a surface of the metal layer, while pressing the metal layer to the thermoplastic resin layer, and then stopping applying the load generated by the ultrasonic vibration, and hardening the thermoplastic resin thus melted by cooling. The metal layer is configured by a thin layer made of a material having a shear strength lower than that of a material constituting the conductive circuit.07-11-2013
20080217048Wired circuit board and producing method thereof - A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer and including a wire and a terminal portion, an insulating cover layer formed on the insulating base layer and having an opening portion to expose the terminal portion, and a metal thin film including a protecting portion interposed between the wire and the insulating cover layer, and an exposed portion formed continuously from the protecting portion on a peripheral end portion of the terminal portion exposed from the opening portion.09-11-2008
20130126221METHOD FOR MANUFACTURING LAYERED CIRCUIT BOARD, LAYERED CIRCUIT BOARD, AND ELECTRONIC DEVICE - There is provided a manufacturing method of a layered circuit board in which a first board and a second board are layered, the manufacturing. The method includes arranging an adhesive resin sheet on the first board so that one face faces the first board, the adhesive resin sheet including a plurality of variant via holes, an opening area on the one face of each of the plurality of variant via holes being larger than an opening area on the other face, filling the variant via holes with conductive paste, arranging the second board on the other face of the adhesive resin sheet after the filling with the conductive paste, and performing heat press treatment to apply pressure to the adhesive resin sheet in a layering direction of the first board and the second board under heat.05-23-2013
20110214909Hydrophobic Silane Coating for Preventing Conductive Anodic Filament (CAF) Growth in Printed Circuit Boards - An enhanced substrate for making a printed circuit board (PCB) includes a hydrophobic silane coating of a silane composition intermixed with a silane coupling agent applied to a glass fiber substrate. The silane coupling agent is applied to the surface of the substrate for coupling the substrate to a varnish coating. Applying the silane coupling agent to the surface of the substrate creates surface silanols, which are implicated in conductive anodic filament (CAF) growth. A silane composition, which reacts with the surface silanols, is applied to the surface of the substrate having the silane coupling agent applied thereto to form the hydrophobic silane coating. The surface presented by the hydrophobic silane coating/substrate is hydrophobic and essentially silanol-free. This surface is then dried, and varnish is applied thereto. Then, the substrate, hydrophobic silane coating and varnish are subjected to curing conditions to define the PCB.09-08-2011
20130146344INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD INCLUDING THE SAME - Disclosed herein is an insulating resin composition for a printed circuit board, including 40 to 70 wt % of a liquid crystal oligomer shown in formula 1, 10 to 30 wt % of an epoxy resin, 10 to 30 wt % of a cyanate-based resin, and 0.1 to 0.5 wt % of a curing catalyst, and a printed circuit board including the same.06-13-2013
20130146345PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a first insulation layer, a first conductive pattern formed on a first surface of the first insulation, a second conductive pattern formed on a second surface of the first insulation on the opposite side with respect to the first surface of the first insulation, a first buildup structure formed on the first surface of the first insulation and the first pattern, the first buildup structure including insulation layers and conductive patterns, and a second buildup structure formed on the second surface of the first insulation and the second pattern, the second buildup structure including insulation layers and conductive patterns. The second pattern and the patterns in the second buildup structure form an inductor, and the first and second patterns are positioned such that the distance between the first and second patterns in the thickness direction of the first insulation is set 100 μm or greater.06-13-2013
20130146346PHOTOSENSITIVE COMPOSITION FOR TRANSPARENT CONDUCTIVE FILM - A photosensitive composition for forming a photosensitive protective film is described which can provide a transparent conductive film including a nanostructure with a high hardness and environmental resistance. The photosensitive composition contains a compound having a dicyclopentadiene skeleton and an epoxy group or oxetanyl group as a first component, a compound including an (meth)acryl group in a molecule as a second component, an alkali-soluble polymer as a third component, and a solvent as a fourth component.06-13-2013
20110220399MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING THE BOARD - A multilayer printed wiring board includes one or more resin layers having via-holes and a core layer having via-holes. The via-holes formed in the one or more resin layers are open in the direction opposite to the direction in which the via-holes formed in the core layer are open. A method for manufacturing a multilayer printed wiring board includes a step of preparing a single- or double-sided copper-clad laminate; a step of forming lands by processing the copper-clad laminate; a step of forming a resin layer on the upper surface of the copper-clad laminate, forming openings for via-holes in the resin layer, and then forming the via-holes; and a step of forming openings for via-holes in the lower surface of the copper-clad laminate and then forming the via-holes.09-15-2011
20130153275PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; circuit patterns formed in a circuit region on the base substrate; dummy patterns formed in a dummy region on the base substrate; and an insulating layer formed above the circuit patterns and the dummy patterns by a slit die coating method.06-20-2013
20130153276CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD - A circuit board includes a core substrate portion, an insulating layer, a second wiring, and a via to be a cured product of a via paste. The via paste has a first latent curing agent and a second latent curing agent, an uncured resin mixture, and a conductive particle. Both a softening temperature of the first latent curing agent and that of the second latent curing agent are equal to or higher than 40° C. and are equal to or lower than 200° C., and a difference between the softening temperature of the first latent curing agent and that of the second latent curing agent is equal to or higher than 10° C. and is equal to or lower than 140° C.06-20-2013
20100314162MICROPOROUS MATERIAL DERIVED FROM RENEWABLE POLYMERS AND ARTICLES PREPARED THEREFROM - The present invention is directed to microporous materials comprising: 12-16-2010
20110232953CIRCUIT BOARD AND STRUCTURE USING THE SAME - According to one embodiment of the invention, a circuit board comprises an insulating layer including a resin material, a plurality of inorganic insulating particles, and a penetrating hole. The circuit board further comprises a penetrating conductor disposed in the penetrating hole. The insulating layer includes a resin insulating portion having the plurality of inorganic insulating particles dispersed in the resin material. The insulating layer further includes an inorganic insulating portion interposed between the resin insulating portion and the penetrating conductor and made of the same material as the plurality of inorganic insulating particles.09-29-2011
20130180769LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and a fibrous base material and wherein the glass substrate layer accounts for from 10 to 70% by volume relative to the entire laminate body. A laminate plate containing at least one cured resin layer of the resin composition and at least one glass substrate layer, wherein the glass substrate layer accounts for from 10 to 70% by volume relative to the entire laminate plate. A printed wiring board having the laminate plate and a wiring provided on the surface thereof. A method for producing the laminate plate, which comprises forming a fiber-containing cured resin layer on the surface of a glass substrate.07-18-2013
20130180770Composite Material, High-frequency Circuit Substrate Made Therefrom and Making Method Thereof - The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and a making method thereof. The composite material comprises: thermosetting mixture including more than one liquid vinyl resin with the molecular weight being less than 10000 containing polar functional groups, and a polyphenylene ether resin with the molecular weight being less than 5000 containing unsaturated double bonds at the molecule terminal; fiberglass cloth; powder filler; flame retardant and cure initiator. The high-frequency circuit substrate made from the composite material comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs; each prepreg is made from the composite material. The composite material of the prevent invention realizes easy manufacturing of the prepregs and high bonding force to the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making the circuit substrate of a high-frequency electronic equipment.07-18-2013
20110284276EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler including manganese oxide; and (D) a curing accelerator.11-24-2011
20130118787EPOXY RESIN COMPOSITION FOR FORMING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD MANUFACTURED THEREFROM, AND METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD - Disclosed herein is an epoxy resin composition including a core-shell structure of microemulsion silica surrounded by surfactant. By using the epoxy resin, surface roughness of a printed circuit board can be formed in an ecofriendly and economic manner. Further, high-reliability microcircuits can be realized by enhancing interface adhesive strength between a resin substrate and a metal layer in a buildup type printed circuit board.05-16-2013
20110303446EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin, diaminodiphenylsulfone, and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.12-15-2011
20110303445Printed Circuit Board With Reduced Dielectric Loss - A printed circuit board (‘PCB’) with reduced dielectric loss, including conductive traces disposed upon layers of dielectric material, the layers of dielectric material including core layers and prepreg layers, one or more of the layers of dielectric material including pockets of air that reduce an overall relative dielectric constant of the PCB.12-15-2011
20110308847Method for high-temperature circuit board assembly - The creation of a circuit board which contains electrical interconnections between the circuit board traces and electronic devices mounted on the circuit board where the circuit board assembly can be operated at temperatures of 600° C. or greater. This invention allows for solder connections to be formed using solder paste or high-temperature.12-22-2011
20120006588EPOXY RESIN COMPOSITION, PREPREG, RESIN-COATED METAL FOIL, RESIN SHEET, LAMINATE AND MULTILAYER BOARD - An epoxy resin composition is provided having the necessary flame retardancy and heat resistance for a laminate or multilayer board, and having superior dielectric properties without exhibiting any decrease in interlayer adhesiveness.01-12-2012
20120018202CIRCUIT DEVICE - In a circuit device of the present invention, the lower surface side of a circuit board is covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.01-26-2012
20120018201CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF, AND CONDUCTIVE FOIL PROVIDED WITH INSULATING LAYER - Provided are a circuit board easy to process by laser and a manufacturing method thereof A circuit board of the present invention includes a substrate, an insulating layer covering an upper surface of the substrate, and a conductive pattern of a predetermined shape formed on an upper surface of the insulating layer. The insulating layer is made of a resin material highly filled with a filler made of silica. Further, a colorant made of an inorganic material is added to the resin material. Accordingly, when a laser is radiated onto the insulating layer in order to perform cutting and removing processing, the insulating layer is removed because the laser is absorbed by the colored resin material.01-26-2012
20130192886THERMOSETTING FILLING RESIN COMPOSITION - Provided is a heat-curable resin filler in which the deterioration in thixotropic properties over time can be prevented and which has excellent shape retaining properties after being filled in hole parts in a printed wiring board and being cured and also has excellent abradability. The heat-curable resin filler comprises an epoxy resin, an epoxy resin curing agent, an inorganic filler and a fatty acid represented by the following general formula: (R08-01-2013
20130192884PRINTED WIRING BOARD - A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup structure formed on surface of the substrate and including an interlayer insulation layer, and a second buildup structure formed on the opposing surface of the substrate and including an interlayer insulation layer. The substrate includes a core material portion including multiple resin layers, a first conductive layer formed on first surface of the core portion and a second conductive layer formed on second surface of the core portion, the core portion has opening through the resin layers and accommodating the component, the insulation layer of the first structure is positioned such that the opening of the core portion is covered on the first surface, and the insulation layer of the second structure is positioned such that the opening of the core portion is covered on the second surface.08-01-2013
20130192885METHOD OF FORMING SOLDER RESIST LAYER AND PRINTED CIRCUIT BOARD COMPRISING SOLDER RESIST LAYER - Provided are a method of forming a solder resist layer on a printed circuit board (PCB) and a PCB comprising the solder resist layer. The method includes: preparing a PCB of which at least one surface has a circuit layer formed thereon, bonding an insulation layer, including a material having a non-photosensitive characteristic, in a half-cured state on the circuit layer, forming a solder resist layer patterned by selectively removing the insulation layer, and curing the insulation layer.08-01-2013
20130192883PRINTED WIRING BOARD - A printed wiring board includes a substrate having an accommodation section having multiple opening portions, multiple electronic components accommodated in the opening portions, respectively, a filler resin provided in the opening portions in the substrate such that the electronic components are secured in the opening portions in the substrate, a resin insulation layer formed over the substrate and the electronic components, a conductive layer formed on the resin insulation layer, and via conductors formed in the resin insulation layer and connecting the conductive layer and the electronic components. The opening portions are connected to each other.08-01-2013
20120024582MULTILAYER WIRING SUBSTRATE - A multilayer wiring substrate includes a laminate structure in which resin insulation layers and conductor layers are alternately laminated. The resin insulation layers include first-type resin insulation layers, and second-type resin insulation layers, each of which contains an inorganic material in a larger amount and is smaller in thermal expansion coefficient as compared with first-type resin insulation layers. On a cross section of the laminate structure taken along a thickness direction thereof, the ratio of a total thickness of the second-type resin insulation layers located in an area A02-02-2012
20120024581PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A plurality of conductor traces are formed on a porous base insulating layer made of porous ePTFE. Each conductor trace has a laminated structure of a seed layer and a conductor layer. A cover insulating layer is formed on the base insulating layer to cover each conductor trace. The ePTFE used as the porous base insulating layer has continuous pores. An average pore size of the ePTFE is not less than 0.05 μm and not more than 1.0 μm.02-02-2012
20130199830RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTURING METHOD FOR WIRING BOARD - By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.08-08-2013
20130199829PRINTED CIRCUIT BOARD WITH CAVITY - A printed circuit board multilayer construction comprising a layer stack composed of plurality of electrically insulating and/or conductive layers arranged one above another and a cavity in the interior of the layer stack, which extends laterally only in a partial region of the areal extent of the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction through an opening provided in the layer stack and is sealed relative to ingress of liquid. Furthermore, the present invention relates to a method suitable for producing a printed circuit board multilayer construction of this type.08-08-2013
20120085572WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a core substrate having an accommodation portion, an electronic component in the accommodation portion having a substrate, a resin layer on a surface of the substrate and an electrode on the resin layer, a first interlayer resin insulation layer on a surface of the core substrate and a surface of the substrate of the component, and a second interlayer resin insulation layer on the opposite surface of the core substrate and a surface of the substrate having the resin layer and electrode. The first insulation layer has resin in the amount greater than the amount of resin in the second insulation layer such that the total amount of resin component including the resin in the first insulation layer is adjusted to be substantially the same as the total amount of resin component including the resin in the second insulation layer and resin in the resin layer.04-12-2012
20120085571MULTI-LAYER MIXED METAL OXIDE ELECTRODE AND METHOD FOR MAKING SAME - A composition and method of manufacture of electrodes having controlled electrochemical activity to allow the electrodes to be designed for a variety of electro-oxidation processes. The electrodes are comprised of a compact coating deposited onto a conductive substrate, the coating being formed as multiple layers of a mixture of one or more platinum group metal oxides and one or more valve metal oxides. The formation of multiple layers allows the concentrations of platinum group metal and valve metal to be varied for each layer as desired for an application. For example, an electrode structure can be manufactured for use as an anode in electroplating processes, such that the oxidation of the organic additives in the electrolyte is markedly inhibited. Another electrode can be manufactured to operate at high anodic potentials in aqueous electrolytes to generate strong oxidants, e.g., hydrogen peroxide or ozone.04-12-2012
20130206463NON-HALOGENATED FLAME RETARDANT FILLER - A non-halogenated flame retardant filler having phosphorous-modified inorganic particles imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. Phosphorous-modified silica particles, for example, may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a non-halogenated flame retardant filler comprised of phosphorous-modified silica particles. In an exemplary method of synthesizing phosphorous-modified silica particles, a vinyl-terminated phosphorous-based monomer (e.g., a phosphorous based flame retardant functionalized to contain a vinyl functional group) is reacted with vinyl functionalized silica particles (i.e., the silica particle surface is functionalized to contain a vinyl functional group). Alternatively, hydrosilated terminated silica particles may be reacted with a vinyl-terminated phosphorous-based monomer to produce phosphorous-modified silica particles.08-15-2013

Patent applications in class Insulating